WO2022127726A1 - Structure d'encapsulation de capteur et dispositif électronique - Google Patents

Structure d'encapsulation de capteur et dispositif électronique Download PDF

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Publication number
WO2022127726A1
WO2022127726A1 PCT/CN2021/137365 CN2021137365W WO2022127726A1 WO 2022127726 A1 WO2022127726 A1 WO 2022127726A1 CN 2021137365 W CN2021137365 W CN 2021137365W WO 2022127726 A1 WO2022127726 A1 WO 2022127726A1
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WO
WIPO (PCT)
Prior art keywords
chip
hole
board
carrier board
electronic device
Prior art date
Application number
PCT/CN2021/137365
Other languages
English (en)
Chinese (zh)
Inventor
罗雷
杨望来
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022127726A1 publication Critical patent/WO2022127726A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

Definitions

  • the present application belongs to the technical field of sensors, and in particular relates to a sensor packaging structure and electronic equipment.
  • sensors are configured in the device to realize the function of the electronic device.
  • the chip is arranged on the carrier board, the upper cover forms a groove structure and is buckled outside the chip, and the groove structure is filled with transparent resin.
  • the present application aims to provide a sensor packaging structure, which at least solves one of the problems of complex structure, large volume and excessive space occupation of the existing sensor packaging structure.
  • an embodiment of the present application provides a sensor package structure, the sensor package structure includes a carrier board, a first chip, a second chip, and a packaging material;
  • the first chip and the second chip are both disposed on the carrier board, and both the first chip and the second chip are electrically connected to the carrier board;
  • the carrier board is provided with a first through hole and a second through hole, the active area of the first chip is opposite to the first through hole, and the active area of the second chip is opposite to the second through hole. hole opposite;
  • the packaging material wraps the first chip and the second chip.
  • an embodiment of the present application provides an electronic device, which includes the sensor package structure as described above.
  • the first chip and the second chip are optically isolated by the packaging material, so that the first chip interacts with the outside world through the first through hole, and the second chip interacts with the outside world through the second through hole, so as to realize
  • the function of the sensor does not require an upper cover and does not need to be filled with transparent resin, the structure of the sensor packaging structure is simpler, the volume of the sensor packaging structure is reduced, and the space occupied by the sensor is reduced.
  • FIG. 1 is one of the structural schematic diagrams of an embodiment of a sensor package structure according to the present application
  • FIG. 2 is a second structural schematic diagram of an embodiment of a sensor packaging structure according to the present application.
  • FIG. 3 is a schematic structural diagram of a carrier according to an embodiment of the present application.
  • FIG. 4 is one of partial schematic views of an embodiment of an electronic device according to the present application.
  • Fig. 5 is the second partial schematic diagram of the embodiment of the electronic device according to the present application.
  • FIG. 6 is a third partial schematic diagram of an embodiment of an electronic device according to the present application.
  • 10-carrier board 101-first through hole, 102-second through hole, 103-pad, 11-first chip, 12-second chip, 13-package material, 14-first bump, 15- 2nd bump, 2-translucent material, 3-mainboard, 33-third through hole, 34-fourth through hole, 4-shell, 5-flexible circuit board, 51-fifth through-hole, 52-th Six through holes.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the sensor packaging structure process in the related art is complicated, and the space between the upper cover and the carrier board needs to be filled with transparent resin, then drilled, and then filled with silver glue to fix the upper cover on the carrier board.
  • the sensor package structure in the related art has a large volume and takes up too much space. When it is installed in an electronic device, enough space needs to be reserved, which occupies the internal space of the electronic device. The volume of the sensor package structure is large, and the thickness of the electronic device cannot be further reduced.
  • the existing sensor package structure is complex in structure, large in volume, and takes up too much space.
  • the sensor package structure according to the embodiment of the present application solves at least one of the above-mentioned problems in the related art.
  • the sensor package structure includes a carrier board 10 , a first chip 11 , a second chip 12 and a packaging material 13 .
  • the first chip 11 and the second chip 12 are both disposed on the carrier board 10 , and both the first chip 11 and the second chip 12 are electrically connected to the carrier board 13 .
  • the carrier board 10 is provided with a first through hole 101 and a second through hole 102 .
  • the active area of the first chip 11 is opposite to the first through hole 101
  • the active area of the second chip 12 is opposite to the first through hole 101 .
  • the packaging material 13 wraps the first chip 11 and the second chip 12 .
  • the encapsulation material 13 forms optical isolation for the part other than the active area of the first chip 11
  • the encapsulation material 13 forms optical isolation for the part outside the active area of the second chip 12 , and at the same time, the first chip 11 and the second chip 12 are formed.
  • the packaging material 13 forms optical isolation between the first chip 11 and the second chip 12 , so that the active area of the first chip 11 can only interact with the outside through the first channel 101 .
  • the active area of the first chip 11 is the functional area of the first chip 11 , and the functional area of the first chip 11 communicates with the outside through the first channel 101 .
  • the active area of the second chip 12 is the functional area of the second chip 12 , and the functional area of the second chip 12 communicates with the outside through the second channel 102 .
  • the packaging material 13 forms packaging and optical isolation for the first chip 11 and the second chip 12 , which avoids the interference of external light on the first chip 11 and the second chip 12 , and also avoids the space between the first chip 11 and the second chip 12 . interfere with each other.
  • the first chip 11 and the second chip 12 are packaged on the carrier board 10 through the packaging material 13 , and can communicate with the outside through the first through holes 101 and the second through holes 102 provided on the carrier board 10 .
  • the structure of the sensor packaging structure is simpler, the thickness dimension is reduced, the volume of the sensor packaging structure is reduced, and the sensor packaging structure is reduced. The space occupied by the structure.
  • the internal space of the electronic device occupied by the sensor packaging structure can be reduced.
  • Using the sensor package structure can reduce the volume of the electronic device and optimize the size of the electronic device.
  • the structure of the sensor package structure is simpler than that of the existing sensor package structure, and it is easier to package the first chip 11 and the second chip 12 on the carrier board 10.
  • the processing technology of the sensor package structure is simplified.
  • the first chip 11 is a light emitting chip, such as a light emitting diode (Light Emitting Diode, LED).
  • the active area of the first chip 11 is the functional area of the light emitting diode, and the functional area is used for emitting light.
  • the second chip 12 is a light receiving chip, such as a photodiode (PD), and the active area of the second chip 12 is a functional area of the photodiode, and the functional area is used for receiving light.
  • the sensor package structure is the package structure of the proximity sensor. The first chip 11 emits light, and the second chip 12 receives the reflected light, so that the distance between the object and the proximity sensor can be obtained.
  • the encapsulation material 13 includes black resin or blue resin.
  • the packaging material 13 forms optical isolation between the first chip 11 and the second chip 12 to ensure that the first chip 11 interacts with the outside through the first through hole 101 , and the second chip 12 interacts with the outside through the second through hole 102 .
  • Black resin or blue resin can effectively form optical isolation, and it is more convenient to package the first chip 11 and the second chip 12 on the carrier board 10 .
  • the light emitting chip can emit light of different colors according to different components, and the black resin can effectively form optical isolation for the light.
  • the black resin can effectively form optical isolation for the light.
  • blue resin can be used for encapsulation.
  • any non-transparent resin capable of forming optical isolation may be set.
  • the first through holes 101 and the second through holes 102 are filled with a light-transmitting material 2 .
  • the light-transmitting material 2 in the first through hole 101 and the second through hole 102 can allow light to pass through.
  • the light-transmitting material 2 forms protection in the first through hole 101 and the second through hole 102 to prevent foreign matter from entering the first through hole 101 or the second through hole 102 and causing interference to the first chip 11 and the second chip 12 .
  • the light-transmitting material 2 includes glass or transparent resin.
  • Both glass and transparent resin have excellent light-transmitting properties, light can pass through the light-transmitting material 2, and can form an effective package in the first through hole 101 and the second through hole 102, so that the first chip 11 and the second chip can be effectively packaged. 12 forms an effective protection.
  • the first chip 11 is provided with first bumps 14 , and the first chip 11 is electrically connected to the carrier board 10 through the first bumps 14 .
  • the second chip 12 has second bumps 15 , and the second chip 12 is electrically connected to the carrier board 10 through the second bumps 15 .
  • the first chip 11 is electrically connected to the carrier board 10 through the first bumps 14 , so that the carrier board 10 ensures that the first chip 11 can complete the function of emitting light.
  • the second chip 12 is electrically connected to the carrier board 10 through the second bumps 15 , so that the carrier board 10 ensures that the second chip 12 can complete the function of receiving light.
  • the first chip 11 is provided with two first bumps 14 , and the two first bumps 14 form an electrical connection between the active area of the first chip 11 and the carrier board 10 .
  • the second chip 12 is provided with two second bumps 15 , and the two second bumps 15 form an electrical connection between the active area of the second chip 15 and the carrier board 10 .
  • an electronic device is provided, and the electronic device includes the sensor package structure described in any one of the above embodiments.
  • the sensor package structure has a smaller volume and occupies less internal space of the electronic device, so that the volume of the electronic device can be further reduced.
  • the size of the sensor package structure in the thickness direction of the stacking of the carrier board 10 and the packaging material 13 is smaller, which can further reduce the thickness of the electronic device in the thickness direction and make the electronic device lighter and thinner.
  • the electronic device further includes a housing 4 and a main board 3 , the housing 4 forms a accommodating cavity, and the main board 3 and the sensor packaging structure are arranged in the in the receiving cavity.
  • the carrier board 10 is disposed on the main board 3, and the main board 3 is electrically connected to the carrier board 10.
  • the main board 3 is provided with a third through hole 33 and a fourth through hole 34, and the third through hole 33 is provided on the main board 3.
  • the hole 33 is opposite to the first through hole 101
  • the fourth through hole 34 is opposite to the second through hole 102 .
  • the sensor package structure is disposed on the main board 3, and the first channel 101 and the third channel 33 form a light-emitting channel of the first chip 11, so that the first chip 11 can emit light along the light-emitting channel.
  • the second channel 102 and the fourth channel 34 form a receiving channel of the second chip 12 so that the second chip 12 can receive light through the receiving channel.
  • the sensor package structure occupies a smaller thickness dimension, which can make the thickness dimension of the electronic device smaller.
  • the arrangement of the third through hole 33 and the fourth through hole 34 on the main board 3 enables the main board 3 to be located between the sensor package structure and the housing 4 without affecting the functions of the first chip 11 and the second chip 12 in the sensor package structure .
  • One surface of the housing 4 is opposite to the third through hole 33 and the fourth through hole 34 , and the first chip 11 and the second chip 12 in the sensor package structure face this surface and interact with the outside.
  • the surface is the back surface or the display surface of the electronic device.
  • the main board 3 is located between the sensor package structure and the surface, which can effectively reduce the distance between the surface and the main board 3 .
  • the distance between the casing 4 and the main board 3 can be reduced, and the thickness of the electronic device can be reduced.
  • the carrier board 10 is provided with at least one pad 103 , and the main board 3 is electrically connected to the carrier board 10 through the at least one pad 103 .
  • At least one is one or more, and the number of the pads 103 is set according to the actual requirement of electrical connection.
  • the pads 103 on the carrier board 10 are used for electrical connection with the main board 3 , so that the first chip 11 and the second chip 12 can interact with the main board 3 , so that the first chip 11 and the second chip 12 can be controlled by the main board 3 .
  • the main board 3 is provided with connection parts corresponding to the pads 103 .
  • Each pad 103 is electrically connected to the corresponding connection portion.
  • the electronic device further includes a casing 4 and a flexible circuit board 5 , the casing 4 forms a accommodating cavity, and the flexible circuit board 5 and the sensor packaging structure are disposed in the inside the receiving cavity.
  • the flexible circuit board 5 is attached to the casing 4 , the carrier board 10 is disposed on the flexible circuit board 5 , the carrier board 10 is electrically connected to the flexible circuit board 5 , and the flexible circuit board 5 is provided with a fifth through hole 51 and a sixth through hole 52 , the fifth through hole 51 is opposite to the first through hole 101 , and the sixth through hole 52 is opposite to the second through hole 102 .
  • the flexible circuit board 5 and the casing 4 are attached to the display surface side of the electronic device, or the flexible circuit board 5 and the casing 4 are attached to the back side of the electronic device.
  • the carrier board 10 is disposed on the flexible circuit board 5 , and the first through holes 101 are opposite to the fifth through holes 51 , and the second through holes 102 are opposite to the sixth through holes 52 .
  • the first through hole 101 and the fifth through hole 51 form a light emitting channel of the first chip 11 , and the first chip 11 emits light to the outside through the light emitting channel.
  • the second through hole 102 and the sixth channel 52 form a receiving channel of the second chip 12 , and the second chip 12 receives external light through the receiving channel.
  • the carrier board 10 is electrically connected to the flexible circuit board 5, and the flexible circuit board 5 provides a path for the electrical connection between the first chip 11 and the second chip 12 and the main board of the electronic device.
  • the structure of the flexible circuit board 5 is light and thin, and the stacking thickness of the sensor package structure and the flexible circuit board 5 laminated on the casing 4 is smaller, so that the assembly between the structures is more compact. Further reduce the thickness dimension of electronic devices.
  • the main board 3 and the sensor packaging structure in the electronic device avoid each other, and the main board 3 and the carrier board 10 in the sensor packaging structure are electrically connected through the flexible circuit board 5 .
  • At least one pad 103 is provided on the carrier board 10 , and the flexible circuit board 5 is electrically connected to the carrier board 10 through the at least one pad 103 .
  • the flexible circuit board 5 is used to form an electrical connection between the carrier board 10 and the main board 3 in the electronic device, and the thickness of the flexible circuit board 5 is smaller and thinner, which reduces the thickness occupied by the sensor packaging structure. For example, the touch sensor package structure and the main board 3 are avoided from each other, thereby further reducing the thickness of the electronic device and making the electronic device lighter and thinner.
  • the electronic device may be any electronic device suitable for including a sensor package structure, such as a mobile phone, a notebook computer, a tablet computer, or a wearable device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une structure d'encapsulation de capteur et un dispositif électronique. La structure d'encapsulation de capteur comprend une plaque de support, une première puce, une seconde puce et un matériau d'encapsulation, la première puce et la seconde puce étant toutes deux disposées sur la carte de support, et la première puce et la seconde puce étant toutes deux électriquement connectées à la plaque de support ; la plaque de support comporte un premier trou traversant et un second trou traversant, une zone active de la première puce fait face au premier trou traversant, et une zone active de la seconde puce fait face au second trou traversant ; et le matériau d'encapsulation est enroulé autour de la première puce et de la seconde puce.
PCT/CN2021/137365 2020-12-18 2021-12-13 Structure d'encapsulation de capteur et dispositif électronique WO2022127726A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011515217.8 2020-12-18
CN202011515217.8A CN112652611A (zh) 2020-12-18 2020-12-18 传感器封装结构及电子设备

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WO2022127726A1 true WO2022127726A1 (fr) 2022-06-23

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WO (1) WO2022127726A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112652611A (zh) * 2020-12-18 2021-04-13 维沃移动通信有限公司 传感器封装结构及电子设备

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US6396116B1 (en) * 2000-02-25 2002-05-28 Agilent Technologies, Inc. Integrated circuit packaging for optical sensor devices
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CN112652611A (zh) * 2020-12-18 2021-04-13 维沃移动通信有限公司 传感器封装结构及电子设备

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Publication number Priority date Publication date Assignee Title
US6396116B1 (en) * 2000-02-25 2002-05-28 Agilent Technologies, Inc. Integrated circuit packaging for optical sensor devices
US20020001428A1 (en) * 2000-06-28 2002-01-03 Karl Schroedinger Optomodule and connection configuration
TWM473609U (zh) * 2013-02-26 2014-03-01 Standard Technology Service Inc 立體電路封裝結構
CN108140689A (zh) * 2015-12-10 2018-06-08 京瓷株式会社 传感器用基板以及传感器装置
CN105470213A (zh) * 2015-12-25 2016-04-06 华天科技（西安）有限公司 一次封装成型的光距离传感器封装结构及其制造方法
CN110299442A (zh) * 2018-12-13 2019-10-01 广州硅芯电子科技有限公司 Led显示模块及其制造方法
CN110189647A (zh) * 2019-06-19 2019-08-30 深圳市科彤科技有限公司 基于cob封装结构的显示屏及其封装方法
CN112652611A (zh) * 2020-12-18 2021-04-13 维沃移动通信有限公司 传感器封装结构及电子设备

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