WO2022116509A1 - 一种防止导电辊镀铜的装置及方法 - Google Patents

一种防止导电辊镀铜的装置及方法 Download PDF

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Publication number
WO2022116509A1
WO2022116509A1 PCT/CN2021/099457 CN2021099457W WO2022116509A1 WO 2022116509 A1 WO2022116509 A1 WO 2022116509A1 CN 2021099457 W CN2021099457 W CN 2021099457W WO 2022116509 A1 WO2022116509 A1 WO 2022116509A1
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Prior art keywords
conductive roller
conductive
power supply
auxiliary
output end
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PCT/CN2021/099457
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English (en)
French (fr)
Inventor
臧世伟
刘文卿
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重庆金美新材料科技有限公司
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Application filed by 重庆金美新材料科技有限公司 filed Critical 重庆金美新材料科技有限公司
Priority to JP2022534674A priority Critical patent/JP7324948B2/ja
Priority to EP21899551.2A priority patent/EP4089211A4/en
Priority to US17/752,105 priority patent/US11976378B2/en
Publication of WO2022116509A1 publication Critical patent/WO2022116509A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Definitions

  • the invention relates to the technical field of manufacture of electroplated copper films, in particular to a device and method for preventing copper plating on conductive rollers.
  • the surface of the coating will have a certain plating solution.
  • the coating bypasses the conductive roller for electroplating, when the coating is in contact with the conductive roller, the plating solution will also contact the conductive roller, which will cause the plating
  • the electroplating reaction occurs between the liquid and the conductive roller, so that a large area of copper is deposited on the surface of the conductive roller.
  • These copper deposits will have a relatively large impact on the production of the film. For example, copper particles or copper thorns deposited at a certain point can puncture or scratch the film, affecting the quality of the coated product.
  • the commonly used copper removal method in the industry is a physical method.
  • the conductive roller is sprayed and cleaned by a physical method, or the copper on the surface of the conductive roller is scraped off with a scraper.
  • Chinese Patent Publication No. CN202898572U discloses a device for preventing copper plating of conductive rollers, which cleans the copper powder remaining on the conductive rollers by arranging a spray pipe at the bottom of the conductive rollers, thereby preventing the conductive rollers from being electroplated with copper .
  • the present invention provides a device and method for preventing copper plating on a conductive roller.
  • a device for preventing copper plating of conductive rollers comprising:
  • an electroplating pool which is provided with a plating bath plating solution and an electroplating anode
  • the auxiliary tank is provided with an auxiliary tank plating solution, an auxiliary electrode completely immersed in the auxiliary tank plating solution, and a conductive roller semi-submerged in the auxiliary tank plating solution.
  • the conductive roller of the auxiliary tank plating solution is plated with an anode;
  • the auxiliary tank plating solution is communicated with the plating bath plating solution, the electroplating anode is connected to the positive output end of the first power supply, one end of the conductive roller is connected to the negative output end of the first power supply, and the conductive roller is connected to the negative output end of the first power supply.
  • the other end of the roller is connected to the positive output end of the second power supply, and the auxiliary electrode is connected to the negative output end of the second power supply.
  • the auxiliary groove comprises an upper auxiliary groove with an opening at the lower end, an upper conductive roller is provided at the opening, and the upper conductive roller is sealedly connected to the upper auxiliary groove, and the The upper side of the upper conductive roller is immersed in the upper tank plating solution in the upper auxiliary tank, the lower side is exposed outside the upper auxiliary tank, and the coated product bypasses the lower side of the upper conductive roller.
  • an upper auxiliary electrode is provided in the upper bath plating solution, and the upper auxiliary electrode is located directly above the upper conductive roller.
  • the side of the upper auxiliary tank is provided with an upper liquid inlet and an upper liquid outlet, and the upper tank plating solution and the plating bath plating solution are communicated via the upper liquid inlet and the upper liquid outlet.
  • the present invention according to the above solution is characterized in that the auxiliary tank includes a lower auxiliary tank with an upper end opening, a lower conductive roller is provided at the opening, and the lower side of the lower conductive roller is immersed in the lower auxiliary tank In the lower tank plating solution, the upper side is exposed outside the lower tank plating solution, and the coated product bypasses the upper side of the lower conductive roller.
  • the lower bath plating solution is provided with a lower auxiliary electrode, and the lower auxiliary electrode is located directly below the lower conductive roller.
  • the invention according to the above scheme is characterized in that the end of the auxiliary electrode is connected to an electrode wire, and the electrode wire is connected to the negative output end of the second power supply;
  • the conductive slip ring is connected, the conductive slip ring located at one end of the conductive roller is connected to the negative output end of the first power supply, and the conductive slip ring located at the other end of the conductive roller is connected to the first power supply.
  • the positive output terminals of the two power supplies are connected.
  • a method for preventing the copper plating of the conductive roller, the conductive roller and the electroplating anode are respectively connected to the negative output end and the positive output end of the first power supply, and the conductive roller and the electroplating anode are energized and pass through the plating tank to be plated.
  • the electroplating of the coated product of the liquid is characterized in that it also includes an electrolysis step of the conductive roller: connecting the conductive roller to the positive output end of the second power supply, and cooperates with the auxiliary electrode connected to the negative output end of the second power supply to realize the electrolysis of the conductive roller. Electrolysis, so that the conductive roller avoids copper deposition when electroplating the coated product.
  • the present invention according to the above scheme is characterized in that an auxiliary tank is provided, a part of the conductive roller is immersed in the auxiliary tank plating solution in the auxiliary tank, and the auxiliary electrode in the auxiliary tank and the conductive roller are respectively connected to the first auxiliary tank.
  • the negative output end and the positive output end of the two power sources realize the electrolysis of the conductive roller through the second power source, the auxiliary electrode, and the auxiliary tank plating solution.
  • the present invention according to the above solution is characterized in that one end of the conductive roller is connected to the negative output terminal of the first power supply, and the other end of the conductive roller is connected to the positive output terminal of the second power supply.
  • the present invention according to the above scheme has the beneficial effects that: the present invention adds an electrolysis device for a conductive roller before electroplating, and by adding an auxiliary electrode connected in series with the conductive roller, the plating solution in the auxiliary tank forms a loop, and the conductive roller is used as an electrolytic device.
  • the anode of the conductive roller can realize the electrolysis of the plating solution near the conductive roller under the premise of completing the electroplating, so as to balance the process of electroplating copper and electrolytic copper on the conductive roller, avoid copper residues on the conductive roller, and improve the plating of the coated product.
  • the quality of copper; the overall device structure of the present invention is simple, and only needs a small electrolytic cell to realize the whole function, and does not increase the technological process of the electroplating process, and will not affect the realization of the electroplating process.
  • Fig. 1 is the structural representation of the present invention
  • FIG. 2 is a schematic structural diagram of the upper auxiliary groove and the lower auxiliary groove
  • Fig. 3 is the sectional view of A-A in Fig. 1;
  • Fig. 4 is an enlarged view of part C in Fig. 3;
  • Fig. 5 is the enlarged view of D part in Fig. 3;
  • Fig. 6 is the sectional view of B-B in Fig. 1;
  • Fig. 7 is the enlarged view of E part in Fig. 6;
  • Fig. 8 is an enlarged view of part F in Fig. 6;
  • Fig. 9 is the top view of the present invention.
  • FIG. 10 is a circuit diagram for realizing the present invention.
  • 01-first rectifier 02-second rectifier
  • 200-upper auxiliary tank 201-upper tank plating solution; 210-upper tank body; 211-seal plate; 220-upper conductive roller; 221-upper bearing; 222-upper conductive rod; 223-upper conductive slip ring; 230- Upper auxiliary electrode; 231-upper electrode wire; 241-upper liquid inlet; 242-upper liquid outlet;
  • 300-lower auxiliary tank 301-lower tank plating solution; 310-lower tank body; 320-lower conductive roller; 321-lower bearing; 322-lower conductive rod; 323-lower conductive slip ring; 330-lower auxiliary electrode; 331 -Lower electrode wire; 340-dispensing tube; 341-lower liquid inlet; 342-dispensing hole;
  • a method for preventing copper plating on a conductive roller, the conductive roller and the electroplating anode are respectively connected to the negative output end and the positive output end of the first power supply, the positive output end of the first power supply-electroplating anode-plating solution-conducting roller-first power supply negative electrode
  • the output terminals are connected in sequence to form an electroplating loop. After the conductive roller and the electroplating anode are energized, the coated product flowing through the electroplating bath is electroplated.
  • the conductive roller is connected to the positive output end of the second power supply, and cooperates with the auxiliary electrode connected to the negative output end of the second power supply to realize the electrolysis of the conductive roller, so that the conductive roller can avoid copper deposition when electroplating the coated product.
  • an auxiliary tank is set at the position of the conductive roller, a part of the conductive roller is immersed in the plating solution of the auxiliary tank in the auxiliary tank, and the auxiliary electrode and the conductive roller in the auxiliary tank are connected to the auxiliary tank respectively.
  • the negative output end and the positive output end of the second power supply, the positive output end of the second power supply-conducting roller-auxiliary tank plating solution-auxiliary electrode-the negative output end of the second power supply are sequentially connected to form an electrolysis loop.
  • the electrolysis of the conductive roller is realized through the second power source, the auxiliary electrode and the auxiliary tank plating solution. Due to the different structures of different electroplating equipment, the specific installation positions of the conductive rollers are different, so the auxiliary grooves can be located at different positions of the entire electroplating equipment, and the specific installation positions thereof are not limited here.
  • the auxiliary tank, auxiliary electrode and auxiliary tank plating solution are added, and an electrolysis circuit is added in the auxiliary tank, so that the conductive roller acts as the cathode when electroplating the coated product, and acts as the anode of electrolytic copper when it cooperates with the auxiliary electrode, thereby realizing the electrical conductivity.
  • a device for preventing copper plating on a conductive roller is used to realize the above-mentioned method for placing a conductive roller for copper plating. It includes an electroplating bath 400 and an auxiliary tank located at the front end of the electroplating bath 400 .
  • the electroplating pool 400 is provided with a plating bath plating solution 401 and an electroplating anode, the electroplating anode is connected to the positive output end of the first power supply, one end of the conductive roller is connected to the negative output end of the first power supply, and the electroplating anode and the conductive roller are plated through the plating pool.
  • the liquid 401 interacts with each other to realize the electroplating of the coated product 500 .
  • the auxiliary tank is made of PVC board, and can also be made of other acid and alkali corrosion-resistant materials other than PVC, so as to adapt to the electroplating or electrolysis environment where the plating solution is located.
  • the auxiliary tank is provided with an auxiliary tank plating solution, an auxiliary electrode immersed in the auxiliary tank plating solution, and a conductive roller semi-submerged in the auxiliary tank plating solution.
  • the coated product 500 bypasses the conductive roller that is not immersed in the auxiliary tank plating solution and passes through.
  • Electroplated anode The auxiliary electrode is arranged in parallel with the conductive roller, the other end of the conductive roller is connected to the positive output end of the second power supply, and the auxiliary electrode is connected to the negative output end of the second power supply. Electrolysis of plating baths on rolls and nearby auxiliary tanks.
  • the auxiliary bath plating solution is communicated with the plating bath plating solution 401 .
  • the auxiliary electrode is a copper rod, and a copper rod, a titanium rod, a stainless steel rod, a titanium-clad copper rod, etc. can also be used.
  • the coated product 500 is bypassed by the lower surface of the conductive roller and enters the electroplating pool 400 , and the electroplating in the electroplating pool 400 is The anode is located on the upper side of the coated product 500 .
  • an upper auxiliary groove 200 is provided on the front side of the electroplating bath 400.
  • the upper auxiliary groove 200 includes an upper groove body 210, the lower end of the upper groove body 210 is open, and the upper conductive roller 220 is provided in the the opening.
  • the bottom of the upper tank body 210 is in the shape of a trapezoid.
  • the upper side of the upper conductive roller 220 is immersed in the upper tank plating solution 201 in the upper auxiliary tank 200 , the lower side is exposed outside the upper auxiliary tank 200 , and the coated product 500 bypasses the lower side of the upper conductive roller 220 .
  • an upper electroplating anode 410 is provided in the electroplating bath 400 , and the coated product 500 is passed through the lower side of the upper electroplating anode 410 .
  • the part located inside the upper auxiliary groove 200 is larger than the part located outside the upper auxiliary groove 200, which will not affect the contact between the upper conductive roller 220 and the coated product 500, and at the same time can fully The contact area between the upper conductive roller 220 and the plating solution in the auxiliary tank is increased.
  • the upper conductive roller 220 is sealedly connected with the upper auxiliary groove 200 .
  • a sealing plate 211 is provided at the opening, and the upper conductive roller 220 is sealedly connected to the upper auxiliary groove 200 through the sealing plate 211 .
  • the sealing plate 211 is a Hypalon seal to ensure that serious leakage does not occur at the opening.
  • the upper tank plating solution 201 is provided with an upper auxiliary electrode 230, and the upper auxiliary electrode 230 is located directly above the upper conductive roller 220, which can ensure more uniform current distribution in the upper auxiliary tank 200, and ensure the balance of the electroplating process and the electrolysis process.
  • the liquid level of the upper bath plating solution 201 is higher than the lower surface of the upper auxiliary electrode 230
  • the liquid level of the plating bath plating solution 401 is higher than the lower surface of the upper electroplating anode 410 .
  • the upper auxiliary electrode 230 is completely submerged in the upper bath plating solution 201, so that when the upper auxiliary electrode 230 is used as the negative electrode of electrolytic copper, the current transfer is more uniform, and the current distribution in the upper bath plating solution 201 is more uniform. .
  • the end of the upper auxiliary electrode 230 is connected to the upper electrode wire 231, and the upper electrode wire 231 is connected to the negative output end of the second power supply; the end of the upper conductive roller 220 is connected to the upper conductive slip ring 223 through the upper conductive rod 222, located on the upper The upper conductive slip ring 223 at one end of the conductive roller 220 is connected to the negative output end of the first power supply, and the upper conductive slip ring 223 at the other end of the upper conductive roller 220 is connected to the positive output end of the second power supply.
  • An upper liquid inlet 241 and an upper liquid outlet 242 are provided on the side of the upper auxiliary tank 200 .
  • the upper liquid outlet 242 and the upper liquid inlet 241 are located at both ends of the upper tank body 210 to ensure that the plating solution of the upper auxiliary tank 200 can be fully reacted before flowing out.
  • the height of the upper liquid outlet 242 is higher than the height of the upper liquid inlet 241 , which can also promote the equilibrium reaction of the plating solution in the upper auxiliary tank 200 .
  • the coated product 500 bypasses the upper surface of the conductive roller and enters the electroplating pool 400 , and the electroplating pool 400
  • the inner plating anode is located on the underside of the coating.
  • a lower auxiliary tank 300 is provided on the front side of the electroplating bath 400.
  • the lower auxiliary tank 300 includes a lower tank body 310, the upper end of the lower tank body 310 is open, and the lower conductive roller 320 is provided in the the opening.
  • the lower side of the lower conductive roller 320 is immersed in the lower tank plating solution 301 in the lower auxiliary tank 300 , the upper side is exposed outside the lower tank plating solution 301 , and the coated product 500 bypasses the upper side of the lower conductive roller 320 .
  • a lower electroplating anode 420 is arranged in the electroplating pool 400 , the bottom electroplating anode 420 is immersed in the plating bath plating solution 401 , and the coated product 500 passes through the upper side of the lower electroplating anode 420 .
  • a lower auxiliary electrode 330 in the lower tank plating solution 301, and the lower auxiliary electrode 330 is located directly below the lower conductive roller 320, which can ensure that the current distribution in the lower auxiliary tank 300 is more uniform, and ensures the balance of the electroplating process and the electrolysis process.
  • the end of the lower auxiliary electrode 330 is connected to the lower electrode wire 331, and the lower electrode wire 331 is connected to the negative output end of the second power supply; the end of the lower conductive roller 320 is connected to the lower conductive slip ring 323 through the lower conductive rod 322, located at The lower conductive slip ring 323 at one end of the conductive roller 320 is connected to the negative output end of the first power supply, and the lower conductive slip ring 323 at the other end of the lower conductive roller 320 is connected to the positive output end of the second power supply.
  • one end of the liquid separation hole 342 is communicated with the lower liquid inlet 341 provided on the tank body.
  • the upper end opening of the lower auxiliary groove 300 communicates with each other.
  • the concentration at the lower liquid inlet 341 is large and the distance from the liquid inlet
  • the concentration of the port 341 is small, so the lower auxiliary tank 300 is provided with a liquid distribution pipe 340, and several liquid distribution holes 342 are evenly arranged on the liquid distribution pipe 340.
  • Port 341 communicates.
  • one end of the liquid separation hole 342 is communicated with the lower liquid inlet 341 provided on the lower tank body 310, and the lower tank body 310 is further provided with a lower liquid outlet (not shown in the figure, the same below). ), the plating bath plating solution 401 and the lower tank plating solution 301 are communicated by the lower liquid inlet port 341, the liquid distribution pipe 340 and the lower liquid outlet port.
  • the auxiliary tank and the electroplating tank 400 of the present invention are both fixed above the main tank 100, and the main tank 100 is provided with a main tank plating solution 101, an auxiliary tank plating solution and The plating bath plating solution 401 is all communicated with the main bath plating solution 101 .
  • the side wall of the main tank 100 is provided with a first main tank vertical plate 110, a second main tank vertical plate 120 and a third main tank vertical plate 130, and the first main tank vertical plate 110 is located on the second main tank vertical plate On the inner side of 120 , the second main tank vertical plate 120 is located on the inner side of the third main tank vertical plate 130 .
  • the end of the conductive roller is sleeved on the first main groove vertical plate 110 through a bearing, the end of the conductive roller is connected to the conductive slip ring through a conductive rod, and the inner end of the conductive rod passes through the second main groove vertical plate 120 and the conductive roller. connection, its outer end passes through the third main groove vertical plate 130 and is connected to the conductive slip ring, the conductive slip ring located at one end of the conductive roller is connected to the negative output end of the first power supply, and the other end The conductive slip ring is connected to the positive output end of the second power supply.
  • the ends on both sides of the upper conductive roller 220 are sleeved on the upper side of the first main groove vertical plate 110 through the upper bearing 221, and the inner end of the upper conductive rod 222 passes through the second main groove vertical plate 120 and is connected to the upper conductive
  • the roller 220 is connected, and its outer end passes through the third main groove vertical plate 130 and is connected to the upper conductive slip ring 223.
  • the upper conductive slip ring 223 located at one end of the upper conductive roller 220 is connected to the negative output end of the first power supply, and the other is connected to the upper conductive slip ring 223.
  • the upper conductive slip ring 223 at one end is connected to the positive output end of the second power supply.
  • Both ends of the lower conductive roller 320 are sleeved on the first main groove vertical plate 110 through the lower bearing 321 and are located on the lower side of the upper conductive roller 220 , and the inner end of the lower conductive rod 322 passes through the second main groove vertical plate 120 It is then connected to the lower conductive roller 320, and its outer end passes through the third main groove vertical plate 130 and is connected to the lower conductive slip ring 323.
  • the lower conductive slip ring 323 located at one end of the lower conductive roller 320 is connected to the negative output end of the first power supply connected, and the lower conductive slip ring 323 at the other end is connected to the positive output end of the second power supply.
  • the main tank 100 in the present invention not only provides an intermediate channel for the circulation of the plating solution between the auxiliary tank and the main tank 100 , but also supports the auxiliary tank and the main tank 100 .
  • the plating solution 301 of the lower tank can directly overflow from the upper edge of the lower auxiliary tank 300 and flow into the main tank 100, and through the extremely thin liquid pipeline, the lower tank can be realized.
  • the tank plating solution 301, the main tank plating solution 101, and the plating bath plating solution 401 are connected.
  • the positive output terminal V1+ of the first power supply is connected to the electroplating anode, and the negative output terminal V1- of the first power supply is connected to one end of the conductive rollers (the upper conductive roller 220 and the lower conductive roller 320).
  • the positive output terminal V1+ of the first power supply, the electroplating anode, the plating solution of the plating tank, the conductive roller, and the negative output terminal V1- of the first power supply are connected in sequence to form a complete current loop, thereby realizing the process of electroplating copper on the surface of the coated product.
  • the positive output terminal V2+ of the second power supply is connected to the other end of the conductive rollers (the upper conductive roller 220 and the lower conductive roller 320), and the negative output terminal V2- of the second power supply is connected to the auxiliary electrode.
  • the positive output terminal V2+ of the second power supply, the conductive roller, the auxiliary tank plating solution, the auxiliary electrode, and the negative output terminal V2- of the second power supply are connected in turn to form a complete current loop, thereby realizing the conductive roller (the upper conductive roller 220 and the lower conductive roller).
  • the conductive rollers act as the cathode in the process of cooperating with the electroplating anode to realize the copper plating of the coated product, and act as the anode in the process of cooperating with the auxiliary electrode to electrolytic copper, and then
  • the balance between electroplating copper and electrolytic copper on the surface of the conductive rollers is ensured, so as to realize that there is no copper residue on the conductive rollers (upper conductive roller 220 and lower conductive roller 320 ) .
  • the first power source includes a first rectifier 01 connected to the three-phase power source
  • the second power source includes a second rectifier 02 connected to the three-phase power source.
  • Electric protector for circuit protection In other embodiments, the first power supply and the second power supply can also be implemented by using a pulse power supply.
  • the invention adopts the electrolytic method to electrolyze the conductive roller, avoids copper deposition on the conductive roller in the process of electroplating the coated product, solves the problem that the traditional physical copper removal method cannot consider the influence of the plating solution, and the present invention can effectively solve the copper residue
  • the problem is to improve the electroplating quality of the coated product; the invention adds an electrolytic circuit in the auxiliary tank through the installation of the auxiliary tank and the auxiliary electrode, so that the conductive roller acts as a cathode when electroplating the coated product, and acts as an electrolytic copper when it is matched with the auxiliary electrode.
  • the anode realizes the balance between electroplated copper and electrolytic copper on the conductive roller.
  • an electrolysis device of the conductive roller is added before electroplating.
  • the plating solution in the auxiliary tank forms a loop, and the conductive roller is used as the anode of electrolysis, so that the conductive roller is used to complete the electroplating. It can realize the electrolysis of the plating solution near the conductive roller, make the process of electroplating copper and electrolytic copper on the conductive roller balance, avoid copper residues on the conductive roller, improve the quality of copper plating on the coated product, and only need a smaller electrolytic cell The whole function can be realized without increasing the technological process of the electroplating process, so the present invention has practicability.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

本发明公开了电镀铜膜的制造技术领域中的一种防止导电辊镀铜的装置及方法，导电辊和电镀阳极分别接入第一电源的负极输出端和正极输出端，导电辊和电镀阳极通电后对流经镀池镀液的镀膜产品进行电镀，将导电辊接入第二电源的正极输出端，并配合接入第二电源负极输出端的辅助电极，实现对导电辊的电解，使得导电辊在对镀膜产品进行电镀时避免产生铜沉积。本发明在导电辊在完成电镀的作用前提下，能够实现导电辊附近镀液的电解，使得导电辊上电镀铜与电解铜过程的平衡，避免导电辊上出现铜残留，进而提高镀膜产品镀铜的质量，并且本发明不会增加电镀过程的工艺工序，不会影响电镀过程的实现。

Description

一种防止导电辊镀铜的装置及方法 技术领域
本发明涉及电镀铜膜的制造技术领域，具体的说，是涉及一种防止导电辊镀铜的装置及方法。
背景技术
在铜膜电镀的过程中，镀膜的表面会带有一定的镀液，当镀膜绕过导电辊进行电镀的过程中，镀膜与导电辊接触时，镀液也会与导电辊接触，进而造成镀液与导电辊发生电镀反应，使得导电辊表面沉积大面积铜，这些积铜会对薄膜的生产造成比较大的影响。例如，在某点沉积的铜颗粒或铜刺会将薄膜刺破或者划伤，影响镀膜的产品质量。
为了解决这一问题，业内常用的除铜方式为物理方式，采用物理的方法对导电辊进行喷淋、清洗，或者采用刮刀将导电辊表面的铜刮除。例如，中国专利公开号CN202898572U的专利公开了一种防止导电辊镀铜的装置，其通过在导电辊底部设置喷淋管，对残留在导电辊上的铜粉进行清洗，进而防止导电辊电镀铜。
但是现有的这些物理方式仅能除掉已经在导电辊表面形成的沉积铜，一来无法彻底清除在导电辊表面的铜颗粒残留，无法满足非金属镀膜铜的要求，二来还会影响镀液的有效成分，进而影响镀膜镀铜的效果，并且这样的除铜方式需要在镀膜镀铜的过程中额外增加除铜的操作步骤，使得设备实现过程更加繁琐。
上述缺陷，值得改进。
发明内容
为了克服现有的技术的不足，本发明提供一种防止导电辊镀铜的装置及方法。
本发明技术方案如下所述：
一种防止导电辊镀铜的装置，其特征在于，包括：
电镀池，所述电镀池内设有镀池镀液和电镀阳极；
辅助槽，所述辅助槽内设有辅助槽镀液、完全浸没在所述辅助槽镀液中的辅助电极、半浸没于所述辅助槽镀液中的导电辊，镀膜产品绕过未浸没于所述辅助槽镀液的所述导电辊并经过电镀阳极；
所述辅助槽镀液与所述镀池镀液连通，所述电镀阳极接入第一电源的正极输出端，所述导电辊的一端接入所述第一电源的负极输出端，所述导电辊的另一端接入第二电源的正极输出端，所述辅助电极接入所述第二电源的负极输出端。
根据上述方案的本发明，其特征在于，所述辅助槽包括下端开口的上辅助槽，所述开口处设有上导电辊，且所述上导电辊与所述上辅助槽密封连接，所述上导电辊的上侧浸没于所述上辅助槽内的上槽镀液内，其下侧裸露于所述上辅助槽外，所述镀膜产品绕过所述上导电辊的下侧。
进一步的，所述上槽镀液内设有上辅助电极，且所述上辅助电极位于所述上导电辊的正上方。
进一步的，所述上辅助槽的侧面设有上进液口和上出液口，所述上槽镀液和所述镀池镀液之间经由所述上进液口和所述上出液口连通。
根据上述方案的本发明，其特征在于，所述辅助槽包括上端开口的下辅助槽，所述开口处设有下导电辊，且所述下导电辊的下侧浸没于所述下辅助槽内的下槽镀液中，其上侧裸露于所述下槽镀液外，所述镀膜产品绕过所述下导电辊的上侧。
进一步的，所述下槽镀液内设有下辅助电极，且所述下辅助电极位于所述下导电辊的正下方。
根据上述方案的本发明，其特征在于，所述辅助电极的端部与电极电线连接，所述电 极电线与所述第二电源的负极输出端连接；所述导电辊的端部通过导电棒与导电滑环连接，位于所述导电辊一侧端部的所述导电滑环与所述第一电源的负极输出端连接，位于所述导电辊另一端部的所述导电滑环与所述第二电源的正极输出端连接。
另一方面，一种防止导电辊镀铜的方法，导电辊和电镀阳极分别接入第一电源的负极输出端和正极输出端，所述导电辊和所述电镀阳极通电后对流经镀池镀液的镀膜产品进行电镀，其特征在于，还包括导电辊的电解步骤：将导电辊接入第二电源的正极输出端，并配合接入第二电源负极输出端的辅助电极，实现对导电辊的电解，使得所述导电辊在对镀膜产品进行电镀时避免产生铜沉积。
根据上述方案的本发明，其特征在于，设置辅助槽，并将导电辊的一部分浸入所述辅助槽内的辅助槽镀液中，分别将辅助槽内的辅助电极和所述导电辊接入第二电源的负极输出端和正极输出端，通过所述第二电源、所述辅助电极、所述辅助槽镀液实现所述导电辊的电解。
根据上述方案的本发明，其特征在于，所述导电辊的一端接入所述第一电源的负极输出端，其另一端接入所述第二电源的正极输出端。
根据上述方案的本发明，其有益效果在于：本发明在电镀前增加导电辊的电解装置，通过增加与导电辊串联的辅助电极，使得辅助槽内的镀液形成回路，并使得导电辊作为电解的阳极，使得导电辊在完成电镀的作用前提下，能够实现导电辊附近镀液的电解，使得导电辊上电镀铜与电解铜过程的平衡，避免导电辊上出现铜残留，进而提高镀膜产品镀铜的质量；本发明整体装置结构简单，仅需要较小的电解池就可以实现整个功能，且不会增加电镀过程的工艺工序，不会影响电镀过程的实现。
附图说明
图1为本发明的结构示意图；
图2为上辅助槽和下辅助槽处的结构示意图；
图3为图1中A-A的剖视图；
图4为图3中C部分的放大图；
图5为图3中D部分的放大图；
图6为图1中B-B的剖视图；
图7为图6中E部分的放大图；
图8为图6中F部分的放大图；
图9为本发明的俯视图；
图10为本发明的实现电路图。
在图中，01-第一整流机；02-第二整流机；
100-主体槽；101-主槽镀液；110-第一主槽立板；120-第二主槽立板；130-第三主槽立板；
200-上辅助槽；201-上槽镀液；210-上槽体；211-密封板；220-上导电辊；221-上轴承；222-上导电棒；223-上导电滑环；230-上辅助电极；231-上电极电线；241-上进液口；242-上出液口；
300-下辅助槽；301-下槽镀液；310-下槽体；320-下导电辊；321-下轴承；322-下导电棒；323-下导电滑环；330-下辅助电极；331-下电极电线；340-分液管；341-下进液口；342-分液孔；
400-电镀池；401-镀池镀液；410-上电镀阳极；420-下电镀阳极；
500-镀膜产品。
具体实施方式
下面结合附图以及实施方式对本发明进行进一步的描述：
一种防止导电辊镀铜的方法，导电辊和电镀阳极分别接入第一电源的负极输出端和正极输出端，第一电源正极输出端-电镀阳极-镀液-导电辊-第一电源负极输出端之间依次连接，形成电镀的回路。导电辊和电镀阳极通电后对流经电镀池的镀膜产品进行电镀。
随着电镀的进行，导电辊表面沉积较多的铜颗粒，为了避免导电辊受到其附近镀液的影响而产生铜沉积，在导电辊与电镀阳极配合实现电镀的过程中，还对导电辊进行同步电解。即，将导电辊接入第二电源的正极输出端，并配合接入第二电源负极输出端的辅助电极，实现对导电辊的电解，使得导电辊在对镀膜产品进行电镀时避免产生铜沉积。
为了实现导电辊附近镀液的电解，在导电辊的位置处设置辅助槽，并将导电辊的一部分浸入辅助槽内的辅助槽镀液中，分别将辅助槽内的辅助电极和导电辊接入第二电源的负极输出端和正极输出端，第二电源的正极输出端-导电辊-辅助槽镀液-辅助电极-第二电源的负极输出端之间依次连接，形成电解的回路。通过第二电源、辅助电极、辅助槽镀液实现导电辊的电解。由于不同的电镀设备结构不同，导电辊的具体设置位置不同，因此辅助槽可位于整个电镀设备的不同位置，此处不对其具体安装位置做限定。
本发明通过增加辅助槽、辅助电极及辅助槽镀液，在辅助槽内增加电解回路，使得导电辊在对镀膜产品电镀时充当阴极，在与辅助电极配合时充当电解铜的阳极，实现了导电辊上电镀铜与电解铜的平衡。为了实现导电辊同时接入第一电源和第二电源，本发明中，导电辊的一端接入第一电源的负极输出端，其另一端接入第二电源的正极输出端。
如图1至图9所示，一种防止导电辊镀铜的装置，用于实现上述放置导电辊镀铜的方法。其包括电镀池400和设于电镀池400前端的辅助槽。电镀池400内设有镀池镀液401和电镀阳极，电镀阳极接入第一电源的正极输出端，导电辊的一端接入第一电源的负极输出端，电镀阳极和导电辊通过镀池镀液401相互作用，实现对镀膜产品500的电镀。优选的，辅助槽由PVC板制成，还可以由除PVC外的其他耐酸碱腐蚀性材料制成，以适应镀液所在的电镀或电解的环境。
辅助槽内设有辅助槽镀液、浸没在辅助槽镀液中的辅助电极、半浸没于辅助槽镀液中的导电辊，镀膜产品500绕过未浸没于辅助槽镀液的导电辊并经过电镀阳极。辅助电极与导电辊平行设置，导电辊的另一端接入第二电源的正极输出端，辅助电极接入第二电源的负极输出端，导电辊和辅助电极通过辅助槽镀液相互作用，实现导电辊及附近辅助槽镀液的电解。为了保证导电辊和电镀阳极能相互作用，并实现电镀过程，辅助槽镀液与镀池镀液401连通。
优选的，辅助电极为铜棒，还可以采用铜棒、钛棒、不锈钢棒、钛包铜棒等。
如图1至图5、图9所示，在实现对镀膜产品500上表面电镀的过程中，镀膜产品500经由导电辊的下表面绕过，并进入电镀池400，且电镀池400内的电镀阳极位于镀膜产品500的上侧。
对于此种连接形式的导电辊，在电镀池400的前侧设置上辅助槽200，具体的：上辅助槽200包括上槽体210，上槽体210的下端开口，且上导电辊220设于该开口处。优选的，上槽体210的底部呈梯台形。
上导电辊220的上侧浸没于上辅助槽200内的上槽镀液201内，其下侧裸露于上辅助槽200外，镀膜产品500绕过上导电辊220的下侧。与上导电辊220相配合的，电镀池400内设有上电镀阳极410，镀膜产品500经由上电镀阳极410的下侧穿出。优选的，在上导电辊220的横截面中，位于上辅助槽200内的部分大于位于上辅助槽200外的部分，既不会影响上导电辊220与镀膜产品500的接触，同时又能充分增加上导电辊220与辅助槽镀液的接触面积。
为了避免漏液，上导电辊220与上辅助槽200密封连接。本实施例中的开口处设有密封板211，上导电辊220通过密封板211与上辅助槽200密封连接。优选的，密封板211为海帕龙密封件，确保开口位置不会出现严重渗漏。
上槽镀液201内设有上辅助电极230，且上辅助电极230位于上导电辊220的正上方， 可以保证上辅助槽200内电流分布更加均匀，保证电镀过程和电解过程的均衡。为了保证正常的电镀过程和电解过程，上槽镀液201的液面高于上辅助电极230的下表面，镀池镀液401的液面高于上电镀阳极410的下表面。在本实施例中，上辅助电极230完全淹没于上槽镀液201内，可以使得上辅助电极230作为作为电解铜的负极时，电流传递更加均匀，上槽镀液201内的电流分布更加均匀。
上辅助电极230的端部与上电极电线231连接，上电极电线231与第二电源的负极输出端连接；上导电辊220的端部通过上导电棒222与上导电滑环223连接，位于上导电辊220一侧端部的上导电滑环223与第一电源的负极输出端连接，位于上导电辊220另一端部的上导电滑环223与第二电源的正极输出端连接。
上辅助槽200的侧面设有上进液口241和上出液口242，上槽镀液201和镀池镀液401之间经由上进液口241和上出液口242连通。优选的，上出液口242和上进液口241位于上槽体210的两端，保证上辅助槽200镀液能够充分反应后再流出。再优选的，上出液口242的高度高于上进液口241的高度，同样能够促进上辅助槽200镀液的均衡反应。
如图1、图2、图6至图9所示，在实现对镀膜产品500下表面电镀的过程中，镀膜产品500经由导电辊的上表面绕过，并进入电镀池400，且电镀池400内的电镀阳极位于镀膜的下侧。
对于此种连接形式的导电辊，在电镀池400的前侧设置下辅助槽300，具体的：下辅助槽300包括下槽体310，下槽体310的上端开口，且下导电辊320设于该开口处。
下导电辊320的下侧浸没于下辅助槽300内的下槽镀液301中，其上侧裸露于下槽镀液301外，镀膜产品500绕过下导电辊320的上侧。与下导电辊320相配合的，电镀池400内设有下电镀阳极420，下电镀阳极420浸没于镀池镀液401内，镀膜产品500经由下电镀阳极420的上侧穿出。下槽镀液301内设有下辅助电极330，且下辅助电极330位于下导电辊320的正下方，可以保证下辅助槽300内电流分布更加均匀，保证电镀过程和电解过程 的均衡。
下辅助电极330的端部与下电极电线331连接，下电极电线331与第二电源的负极输出端连接；下导电辊320的端部通过下导电棒322与下导电滑环323连接，位于下导电辊320一侧端部的下导电滑环323与第一电源的负极输出端连接，位于下导电辊320另一端部的下导电滑环323与第二电源的正极输出端连接。
在一个具体实施例中，分液孔342的一端与槽体上设置的下进液口341连通，镀池镀液401和下槽镀液301之间由下进液口341、分液管340以及下辅助槽300的上端开口连通。在该实施例中，由于下槽镀液301由上端的开口处溢出，为了实现下辅助槽300内下槽镀液301的浓度一致性，避免在下进液口341处的浓度大，距离进液口341的位置浓度小，因此在下辅助槽300内设有分液管340，分液管340上均匀设有若干分液孔342，分液管340与下辅助槽300侧壁上的下进液口341连通。
在另一个具体实施例中，分液孔342的一端与下槽体310上设置的下进液口341连通，下槽体310上还设有下出液口(图中未示出，下同)，镀池镀液401和下槽镀液301之间由下进液口341、分液管340以及下出液口连通。
如图1、图3、图6、图9所示，本发明的辅助槽和电镀池400均固定在主体槽100的上方，主体槽100内设有主槽镀液101，辅助槽镀液和镀池镀液401均与主槽镀液101连通。优选的，主体槽100的侧壁设有第一主槽立板110、第二主槽立板120以及第三主槽立板130，且第一主槽立板110位于第二主槽立板120的内侧，第二主槽立板120位于第三主槽立板130的内侧。
导电辊的端部通过轴承套在第一主槽立板110上，导电辊的端部通过导电棒与导电滑环连接，导电棒的内侧端部穿过第二主槽立板120与导电辊连接，其外侧端部穿过第三主槽立板130后与导电滑环连接，位于导电辊一侧端部的导电滑环与第一电源的负极输出端连接，其另一侧端部的导电滑环与第二电源的正极输出端连接。
具体的：上导电辊220的两侧端部通过上轴承221套在第一主槽立板110的上侧，上导电棒222的内侧端部穿过第二主槽立板120后与上导电辊220连接，其外侧端部穿过第三主槽立板130后与上导电滑环223连接，位于上导电辊220一端的上导电滑环223与第一电源的负极输出端连接，其另一侧端部的上导电滑环223与第二电源的正极输出端连接。下导电辊320的两侧端部通过下轴承321套在第一主槽立板110上并位于上导电辊220的下侧，下导电棒322的内侧端部穿过第二主槽立板120后与下导电辊320连接，其外侧端部穿过第三主槽立板130后与下导电滑环323连接，位于下导电辊320一端的下导电滑环323与第一电源的负极输出端连接，其另一侧端部的下导电滑环323与第二电源的正极输出端连接。
本发明中的主体槽100不仅为辅助槽和主体槽100之间的镀液提供流通的中间通道，同时还可以实现对辅助槽与主体槽100的支撑。另外，下辅助槽300未设置下出液口时，其下槽镀液301可以直接由下辅助槽300的上边缘溢出并流到主体槽100内，并且通过极细的液体流水线，实现了下槽镀液301、主槽镀液101、镀池镀液401的连通。
如图10所示，本发明的实现过程中：
第一电源的正极输出端V1+连接电镀阳极，其负极输出端V1-连接导电辊(上导电辊220和下导电辊320)的一端。第一电源的正极输出端V1+、电镀阳极、镀池镀液、导电辊、第一电源的负极输出端V1-依次连接形成完整的电流回路，进而实现在镀膜产品表面电镀铜的过程。
第二电源的正极输出端V2+连接导电辊(上导电辊220和下导电辊320)的另一端，其负极输出端V2-连接辅助电极。第二电源的正极输出端V2+、导电辊、辅助槽镀液、辅助电极、第二电源的负极输出端V2-依次连接形成完整的电流回路，进而实现导电辊(上导电辊220和下导电辊320)表面铜的电解过程。
又由于电镀过程的电流远大于电解过程的电流，因此，导电辊(上导电辊220和下导 电辊320)接入第二电源上并不影响其与第一电源连通并实现电镀铜的过程。
通过该电路连接实现了：导电辊(上导电辊220和下导电辊320)在与电镀阳极配合实现镀膜产品镀铜的过程中充当阴极，在与辅助电极配合电解铜的过程中充当阳极，进而在实现镀铜的前提下，保证导电辊(上导电辊220和下导电辊320)表面电镀铜与电解铜的平衡，从而实现导电辊(上导电辊220和下导电辊320)上无铜残留。
本实施例中，第一电源包括与三相电源连接的第一整流机01，第二电源包括了与三相电源连接的第二整流机02，分别在两个整流机所在的之路上设置断电保护器进行电路保护。在其他实施例中，第一电源和第二电源还可以采用脉冲电源来实现。
本发明采用电解的方式对导电辊进行电解处理，避免导电辊在对镀膜产品电镀的过程中产生铜沉积，解决了传统物理除铜方式无法考虑镀液影响的问题，本发明可以有效解决铜残留的问题，提高镀膜产品的电镀质量；本发明通过辅助槽和辅助电极的安装，在辅助槽内增加电解回路，使得导电辊在电镀镀膜产品时充当阴极，在与辅助电极配合时充当电解铜的阳极，实现了导电辊上电镀铜与电解铜的平衡。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。
上面结合附图对本发明专利进行了示例性的描述，显然本发明专利的实现并不受上述方式的限制，只要采用了本发明专利的方法构思和技术方案进行的各种改进，或未经改进将本发明专利的构思和技术方案直接应用于其它场合的，均在本发明的保护范围内。
本发明在电镀前增加导电辊的电解装置，通过增加与导电辊串联的辅助电极，使得辅助槽内的镀液形成回路，并使得导电辊作为电解的阳极，使得导电辊在完成电镀的作用前提下，能够实现导电辊附近镀液的电解，使得导电辊上电镀铜与电解铜过程的平衡，避免导电辊上出现铜残留，提高了镀膜产品镀铜的质量，且仅需要较小的电解池就可以实现整个功能，不会增加电镀过程的工艺工序，故本发明具有实用性。

Claims (10)

  1. 一种防止导电辊镀铜的装置，其特征在于，包括：
    电镀池，所述电镀池内设有镀池镀液和电镀阳极；
    辅助槽，所述辅助槽内设有辅助槽镀液、完全浸没在所述辅助槽镀液中的辅助电极、半浸没于所述辅助槽镀液中的导电辊，镀膜产品绕过未浸没于所述辅助槽镀液的所述导电辊并经过电镀阳极；
    所述辅助槽镀液与所述镀池镀液连通，所述电镀阳极接入第一电源的正极输出端，所述导电辊的一端接入所述第一电源的负极输出端，所述导电辊的另一端接入第二电源的正极输出端，所述辅助电极接入所述第二电源的负极输出端。
  2. 根据权利要求1所述的防止导电辊镀铜的装置，其特征在于，所述辅助槽包括下端开口的上辅助槽，所述开口处设有上导电辊，且所述上导电辊与所述上辅助槽密封连接，所述上导电辊的上侧浸没于所述上辅助槽内的上槽镀液内，其下侧裸露于所述上辅助槽外，所述镀膜产品绕过所述上导电辊的下侧。
  3. 根据权利要求2所述的防止导电辊镀铜的装置，其特征在于，所述上槽镀液内设有上辅助电极，且所述上辅助电极位于所述上导电辊的正上方。
  4. 根据权利要求2所述的防止导电辊镀铜的装置，其特征在于，所述上辅助槽的侧面设有上进液口和上出液口，所述上槽镀液和所述镀池镀液之间经由所述上进液口和所述上出液口连通。
  5. 根据权利要求1所述的防止导电辊镀铜的装置，其特征在于，所述辅助槽包括上端开口的下辅助槽，所述开口处设有下导电辊，且所述下导电辊的下侧浸没于所述下辅助槽内的下槽镀液中，其上侧裸露于所述下槽镀液外，所述镀膜产品绕过所述下导电辊的上侧。
  6. 根据权利要求5所述的防止导电辊镀铜的装置，其特征在于，所述下槽镀液内设有下辅助电极，且所述下辅助电极位于所述下导电辊的正下方。
  7. 根据权利要求1所述的防止导电辊镀铜的装置，其特征在于，所述辅助电极的端部 与电极电线连接，所述电极电线与所述第二电源的负极输出端连接；所述导电辊的端部通过导电棒与导电滑环连接，位于所述导电辊一侧端部的所述导电滑环与所述第一电源的负极输出端连接，位于所述导电辊另一端部的所述导电滑环与所述第二电源的正极输出端连接。
  8. 一种防止导电辊镀铜的方法，导电辊和电镀阳极分别接入第一电源的负极输出端和正极输出端，所述导电辊和所述电镀阳极通电后对流经镀池镀液的镀膜产品进行电镀，其特征在于，还包括导电辊的电解步骤：将导电辊接入第二电源的正极输出端，并配合接入第二电源负极输出端的辅助电极，实现对导电辊的电解，使得所述导电辊在对镀膜产品进行电镀时避免产生铜沉积。
  9. 根据权利要求8所述的防止导电辊镀铜的方法，其特征在于，设置辅助槽，并将导电辊的一部分浸入所述辅助槽内的辅助槽镀液中，分别将辅助槽内的辅助电极和所述导电辊接入第二电源的负极输出端和正极输出端，通过所述第二电源、所述辅助电极、所述辅助槽镀液实现所述导电辊的电解。
  10. 根据权利要求8所述的防止导电辊镀铜的方法，其特征在于，所述导电辊的一端接入所述第一电源的负极输出端，其另一端接入所述第二电源的正极输出端。
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