WO2022116260A1 - Dispositif aa rapide pour caméra - Google Patents

Dispositif aa rapide pour caméra Download PDF

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Publication number
WO2022116260A1
WO2022116260A1 PCT/CN2020/136051 CN2020136051W WO2022116260A1 WO 2022116260 A1 WO2022116260 A1 WO 2022116260A1 CN 2020136051 W CN2020136051 W CN 2020136051W WO 2022116260 A1 WO2022116260 A1 WO 2022116260A1
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WO
WIPO (PCT)
Prior art keywords
module
chip
lens
station
image
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PCT/CN2020/136051
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English (en)
Chinese (zh)
Inventor
杜慧林
曹葵康
蔡雄飞
孔晨晖
赵宁波
谷孝东
Original Assignee
苏州天准科技股份有限公司
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Publication of WO2022116260A1 publication Critical patent/WO2022116260A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing

Definitions

  • the invention relates to the field of camera assembly, in particular to a camera fast AA device.
  • Semiconductors are widely used in mobile phones, automobiles, sensors and other fields. As a core component of mobile phones and computers, semiconductors are increasingly technologically enhanced, social demands are gradually increasing, semiconductors tend to be miniaturized, and the number of manufacturing is huge.
  • Optical active alignment equipment that is, an Active Alignment Machine (AA) process
  • AA Active Alignment Machine
  • the AA process can adjust all six degrees of freedom of the camera to realize the alignment function, and is a commonly used adjustment process in the prior art.
  • the existing AA process basically starts with AA lens and chip, then the chip exits the AA area, starts to draw glue, and then returns to the AA area for UV curing after drawing the glue, and finally the finished module exits the AA area.
  • the whole process is serial, and the dispensing and AA share the chip transmission module.
  • the dispensing module is idle; when the dispensing module is running, the AA is idle; the equipment efficiency is limited and difficult to improve.
  • each chip needs to be energized and imaged, and the chip transfer module needs to be equipped with a movable energized fixture.
  • the fixture requires high stability and high cost. Due to the idle space, the fixture will affect the AA and AA. The accuracy of the curing of the dispensing module.
  • the present invention provides a camera rapid AA device, which improves assembly efficiency by fixing a reference chip at the AA station.
  • the present invention adopts the following technical solutions:
  • a hollow turntable transmission module includes a transmission table hollowed out in the middle, and a plurality of operation stations are arranged on the transmission table; a plurality of the operation stations are rotated around the transmission table; the The transfer table is used to transfer the chips to be loaded;
  • An image dispensing module the image dispensing module is arranged on the periphery of the transfer table, and when the operation station moves to the image dispensing module, the image dispensing module is located in the operation
  • the chips to be mounted on the station are dispensed;
  • a parallel module is arranged on the periphery of the transfer platform; the parallel module includes an AA station on which a reference chip is fixedly installed, and the reference chip and the lens to be mounted are located in the same position.
  • the AA station performs the AA action to obtain the current attitude data of the to-be-installed lens; the AA action is used to indicate that the reference chip and the to-be-installed lens are actively aligned;
  • a chip attitude measurement module is installed in the hollow of the transfer table, and the chip attitude measurement module is used to obtain the attitude data of the reference chip and the chip to be installed;
  • the attitude data of the lens, the attitude data of the reference chip and the chip to be installed are calculated to obtain the target attitude data of the lens to be installed;
  • the assembly module is located at the end of the parallel module and adjacent to the image dispensing module; the assembly module includes a curing module, when the operation station moves to When the module is assembled, the parallel module moves the lens to be mounted to a target position corresponding to the target attitude data and is cured by the curing module to obtain finished materials.
  • the parallel module further includes a first linear slide, a second linear slide, a first six-axis module and a second six-axis module;
  • the AA station is located on the first linear slide
  • the first six-axis module and the second six-axis module move on the first and second linear slides respectively;
  • the assembly module is located at One end of the first linear sliding table or the second linear sliding table, and the other end of the first linear sliding table or the second linear sliding table is provided with a lens loading module for loading the lens to be installed; the The first six-axis module and the second six-axis module alternately clamp the lens to be mounted from the lens loading module and transfer it to the AA station.
  • the transfer table further comprises a base with a circular structure, and the base extends outward to form a plurality of the operating stations.
  • the chip feeding module is arranged adjacent to the image dispensing module; when the operation station moves to the chip feeding module, the chip to be loaded It is transferred from the chip feeding module to the operating station under the action of the pick-and-place module.
  • the finished product blanking module is arranged adjacent to the assembly module; when the operation station moves to the finished product blanking module, the finished material is Under the action of the pick-and-unload module, it is moved from the operation station to the finished product unloading module.
  • the pick-and-place module includes a manipulator, and the manipulator is installed between the chip loading module and the finished product unloading module.
  • the chip attitude measurement module includes a support, a scanning slide, a 3D profile measurement module and an image measurement module; the support is fixedly installed in the hollow of the transfer table, and the scanning slide is connected to the The support is slidably connected; the 3D profile measurement module and the image measurement module are fixedly installed on the scanning slide.
  • the 3D profile measurement module and the image measurement module are located above the to-be-installed chip and the reference chip.
  • the image dispensing module includes an image positioning module and a dispensing module; when the operation station moves to the image dispensing module, the image positioning module locates the chip to be mounted after positioning The glue is dispensed using the glue dispensing module.
  • the lens loading module includes a lens tray to be installed and a lens waste tray, and the first six-axis module or the second six-axis module clamps the lens to be installed from the lens tray to be installed and Transfer to the AA station; when the AA station is judged to be unqualified for the lens to be installed after AA, the first six-axis module or the second six-axis module will clamp the unqualified lens to be installed and into the lens waste tray.
  • the camera fast AA device disclosed by the invention adopts a hollow turntable transfer module to realize the transfer of the chip to be loaded from the material to the finished material, and the chip attitude measurement module is installed in the hollow part of the transfer table, so as to improve the utilization rate of equipment space, Improve the compactness of the overall equipment;
  • the reference chip is fixedly arranged in the AA station, so that the lens to be installed performs AA action with the reference chip in the AA station, and the position and attitude data of the lens to be installed are obtained; the chip attitude measurement module respectively obtains the chip to be installed on the assembly module and The position and attitude data of the reference chip on the AA station is calculated according to the position and attitude data of the lens to be installed, the reference chip and the attitude data of the chip to be installed.
  • the chip to be installed with good glue is cured in the assembly module and the lens to be installed to obtain the finished material, without the need to energize and AA action on the chip to be installed on the assembly module; the assembly module does not need to be energized, and the lens and chip are in the process of curing There is no occlusion in the middle, which improves the curing effect;
  • the dispensing station and the AA process are executed in parallel to improve the efficiency of assembly; in addition, the reference chip is always fixed on the AA station, which simplifies the design of the fixture mechanism and circuit and reduces the assembly cost.
  • FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention.
  • FIG. 2a is a schematic XY plane diagram of a chip attitude measurement module according to an embodiment of the present invention
  • 2b is a YZ plane schematic diagram of a chip attitude measurement module according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of another state of the embodiment of the present invention.
  • 4a is a schematic diagram of the position state of the reference chip and the lens to be mounted in the AA station according to the embodiment of the present invention before the AA action;
  • 4b is a schematic diagram of the positional state of the reference chip and the lens to be mounted after the AA action in the AA station according to the embodiment of the present invention
  • FIG. 4c is a schematic diagram of the positional state of the chip to be mounted and the lens to be mounted in the assembly module according to the embodiment of the present invention.
  • a camera fast AA device includes a hollow turntable transmission module 10, an image dispensing module 20, a parallel module 30, a chip attitude measurement module 40 and an assembly Module 50.
  • the hollow turntable transfer module 10 includes a transfer table 110 hollowed out in the middle.
  • the transfer table 110 is provided with a number of operation stations 111 , and the plurality of operation stations 111 rotate around the transfer table 110 . , the rotation of the transfer table 110 is used to transfer the chips 1 to be loaded, and the chips 1 to be loaded to different operation stations.
  • the image dispensing module 20 is disposed on the periphery of the transfer table 110 .
  • the image dispensing module 20 dispenses the chips 1 to be mounted on the operation station 111 .
  • the parallel module 30 is disposed on the periphery of the transfer table 110 .
  • the parallel module 30 includes an AA station 310 , and a reference chip 2 is fixedly installed on the AA station 310 .
  • the action is to actively align the reference chip 2 with the lens 3 to be installed, and obtain the attitude data of the lens 3 to be installed currently.
  • AA station 310 can be used for imaging with relay lens and chart; it can also be used with collimator for imaging.
  • the chip attitude measurement module 40 is installed in the hollow of the transfer table 110, and the chip attitude measurement module 40 is used to obtain the attitude data of the reference chip 2 and the chip 1 to be installed, according to the attitude data of the lens 3 to be installed, the reference chip 2 and the to-be-installed chip 1.
  • the attitude data of the mounted chip 1 is calculated to obtain the target attitude data of the lens 3 to be mounted.
  • the assembly module 50 is located at the end of the parallel module 30 , the assembly module 50 and the image dispensing module 20 are distributed around the hollow turntable transmission module 10 , and the assembly module 50 is arranged adjacent to the image dispensing module 20 .
  • the assembly module 50 includes a curing module.
  • the parallel module 30 moves the lens 3 to be mounted to a target position corresponding to the target attitude data and uses the curing module to cure to obtain a finished product materials.
  • the transfer device of the chip 1 to be loaded is set as a hollow turntable structure, and the chip attitude measurement module 40 is installed in the hollow of the transfer table 110 of the hollow turntable structure, which improves the space utilization rate of the equipment and improves the overall equipment.
  • the ready-to-install chip 1 is cured in the assembly module 50 and the to-be-installed lens 3 to obtain finished materials, without the need to energize and AA action on the to-be-installed chip 1 on the assembly module 50; the assembly module 50 does not need to be powered on, the lens and the chip There is no blocking during the curing process, which improves the curing effect; the image dispensing module 20 and the AA action process of the AA station 310 are executed in parallel to improve the assembly efficiency.
  • the reference chip 2 is always fixed on the AA station 310, which simplifies the fixture The mechanism and circuit design reduces the assembly cost.
  • the parallel module 30 further includes a first linear slide 320, a second linear slide 340, a first six-axis module 330 and a second six-axis module 350; the AA station 310 between the first linear slide 320 and the second linear slide 340 ; the first six-axis module 330 and the second six-axis module 350 are respectively on the first linear slide 320 and the second linear slide 340 Movement; the assembly module 50 is located at one end of the first linear slide 320 or the second linear slide 340, and the other end of the first linear slide 320 or the second linear slide 340 is provided with a lens for loading the lens 3 to be mounted.
  • the to-be-installed lens 3 needs to be inspected before the to-be-installed lens 3 is assembled with the to-be-installed chip 1 to detect whether the to-be-installed lens 3 is a qualified product.
  • the six-axis module installed on the linear slide clamps and transmits the lens to be installed to the AA station 310, so that the lens to be installed 3 and the reference chip 2 perform AA action, and the lens to be installed 3 can be known after the AA action.
  • the six-axis module when the lens is qualified, the six-axis module will pick up the qualified lens and transfer it to the assembly module 50; when the lens is unqualified, the six-axis module will grasp and transfer the unqualified lens into the lens waste tray 920 of the lens loading module 90 .
  • the first six-axis module 330 and the second six-axis module 350 alternately clamp and transmit the lens 3 to be mounted, thereby improving the assembly efficiency of the camera.
  • the lens loading module 90 includes a lens tray 910 to be installed and a lens waste tray 920 , and the first six-axis module 330 or the second six-axis module 350 clamps the to-be-installed lens 3 from the to-be-installed lens tray 910 And send it to the AA station 310; when the AA station 310 determines that the lens to be installed after AA is unqualified, the first six-axis module 330 or the second six-axis module 350 will clamp and transmit the unqualified lens to be installed. into the lens waste tray 920.
  • the specific workflow of the parallel module 30 is as follows:
  • the second six-axis module 350 moves to the lens feeding module 90 to take the lens, while the first six-axis module 330 moves to the assembly module 50 to assemble the chip 1 to be mounted.
  • the turntable rotates to switch the next chip to be loaded to the assembly module 50 .
  • the second six-axis module 350 moves to the AA station 310, the lens 3 to be installed and the reference chip 2 perform AA action, and the first six-axis module 330 moves to the lens loading module 90 to pick up the waiting Install lens 3.
  • the second six-axis module 350 is moved to the assembly module 50 to be assembled with the chip 1 to be mounted, while the first six-axis module 330 is moved to the AA station 310, and the lens 3 to be mounted and the reference chip 2 are assembled. AA action.
  • the first six-axis module 330 or the second six-axis module 350 clamps the unqualified lens and transfers it to the lens waste tray 920 and re-clamps a new lens. , continue to repeat the first step, the second step and the third step.
  • the first six-axis module 330 and the second six-axis module 350 need to be The same AA station 310 is shared, so the first six-axis module 330 and the second six-axis module 350 need to perform an evasive movement during the process of transferring the lens 3 to be mounted to prevent collision.
  • the second six-axis module 350 can only perform the reclaiming operation of the lens to be installed, and cannot enter the AA station 310 to perform the AA action;
  • the six-axis module 330 moves toward the assembly module 50 after completing the AA action, the second six-axis module 350 can move to the AA station 310 and perform the AA action.
  • a chip feeding module 70 is further included, and the chip feeding module 70 is disposed adjacent to the image dispensing module 20 ; when the operation station 111 moves When reaching the chip loading module 70 , the chips 1 to be loaded are transferred from the chip loading module 70 to the operation station 111 under the action of the pick-and-place module.
  • the transfer table 110 further includes a base with a circular structure, and the base extends outward to form a plurality of operating stations 111 .
  • the transfer table 110 includes four operation stations 111, and the four operation stations 111 are respectively used to place the chip 1 to be loaded, the chip that has been glued, the assembled chip and the finished material.
  • the station is a cycle, that is, after the finished material is moved out of the transfer table 110 , when the vacant operation station 111 rotates to the chip feeding module 70 , the pick-and-unload module removes the chips to be loaded from the chip feeding module 70 .
  • the vacant operating station 111 when the chip 1 to be mounted is transferred to the image dispensing module 20, the chip 1 to be mounted is dispensed, and the dispensed chip is transferred to the assembly module 50 for assembly.
  • the pick-and-place module moves the finished material into the finished product unloading module 60, so that the finished material is moved out of the transfer table 110, and the cycle is repeated.
  • the operation station 111 protrudes from the base of the transfer table 110 .
  • the operation station 111 moves to the image dispensing module 20 , the assembly module 50 or other positions, it is convenient to operate, thereby improving the assembly efficiency.
  • the pick-and-place module includes a manipulator 80 , and the manipulator 80 is installed between the chip loading module 70 and the finished product unloading module 60 .
  • the manipulator 80 is used to pick up the chips to be loaded from the chip loading module 70 and place them in the operating station 111 ; the manipulator 80 is also used to pick up and place the finished materials from the operating station 111 of the transfer table 110 . in the finished product blanking module 60 .
  • the circular structure of the transfer table 110 enables the chip loading module 70 and the finished product unloading module 60 to share the same robot 80, which not only reduces the cost of the entire equipment, but also improves the assembly efficiency.
  • the chip attitude measurement module 40 includes a support 420, a scanning slide 410, a 3D profile measurement module 430 and an image measurement module 440; the support 420 is fixed
  • the scanning slide 410 is slidably connected to the support 420 , and the 3D contour measuring module 430 and the image measuring module 440 are fixedly installed on the scanning slide 410 .
  • the scanning slide 410 is a linear scanning slide, and the scanning slide 410 drives the image measuring module 440 to move to the chip to be mounted to measure the XY position of the cmos surface, as shown in FIG. 2a in the coordinate system, Get 2D measurement data.
  • the scanning slide 410 drives the 3D profile measurement module 430 to move to the chip to be mounted to perform scanning measurement with its cmos surface to obtain 3D measurement data.
  • the obtained 2D measurement data and 3D measurement data are fused to obtain the six-dimensional attitude data of the cmos surface of the chip 1 to be mounted.
  • it is also necessary to measure the six-dimensional attitude data of the reference chip 2.
  • the measurement method is the same as that of the chip to be mounted.
  • the scanning slide 410 is slidably connected to the support 420, and the scanning slide 410 is relative to the support
  • the seat 420 moves toward the reference chip 2 to measure the six-dimensional posture of the reference chip 2 .
  • the 3D profile measurement module 430 can choose a laser 3D sensor, with a single-axis linear module to achieve surface measurement; a line 3D mechanism light sensor can also be used to directly measure the entire chip surface; a point laser or a point spectral displacement sensor can also be used. Equipped with XY double-axis linear module to measure multiple points on the chip plane and calculate the surface shape.
  • the 3D profile measurement module 430 and the image measurement module 440 are located directly above the chip to be mounted 1 and the reference chip 2, and the space above the chip to be mounted 1 and the reference chip 2 is more flexible, reducing the complexity of the device.
  • the image measurement module 440 measures the reference chip to obtain plane coordinates (X1, Y1); measures the chip to be installed to obtain plane coordinates (X2, Y2);
  • the 3D profile measuring instrument 430 measures the reference chip to obtain the plane height Z1 angle (Tx1, Ty1); measures the chip 1 to be mounted to obtain the plane height Z2 angle (Tx2, Ty2);
  • the parallel module 30 picks up the lens 3 to be installed, and performs AA action with the reference chip 2 to obtain the optimal position and angle of the lens 3 to be installed: (X3, Y3, Z3, Tx3, Ty3);
  • the image dispensing module 20 includes an image positioning module 210 and a dispensing module 220.
  • the image positioning module 210 treats the After the chip 1 is installed and positioned, the glue dispensing operation is performed using the glue dispensing module 220 .
  • the operation station 111 on the transfer table 110 stops moving when it rotates to the image dispensing module 20.
  • the image dispensing module 20 dispenses the chips 1 to be mounted on the operation station 111.
  • the group 210 needs to dispense glue on the chip 1 to be loaded, and then uses the glue dispensing module 220 to dispense glue after obtaining the dispensing position of the chip 1 to be loaded.
  • the workflow of the camera fast AA device includes the following steps:
  • the first step is to place a fixed reference chip 2 in the AA station 310, and turn it on to light up, that is, the cmos chip is energized for imaging;
  • the manipulator 80 clamps the chip 1 to be loaded from the chip feeding module 70 and moves it to the operation station 111 on the transfer table 110 of the hollow turntable;
  • the hollow turntable rotates to transmit the chip 1 to be loaded to the image dispensing module 20, and the image dispensing module 20 performs a dispensing operation for the chip 1 to be loaded;
  • the hollow turntable rotates to transfer the dispensed chip 1 to be mounted to the assembly module 50, where the chip to be mounted 1 and the lens to be mounted 3 are assembled at the assembly module 50;
  • the chip attitude measurement module 40 simultaneously scans the attitude data of the reference chip 2 and the chip 1 to be mounted, and calculates the relative plane height and angle of the two;
  • the parallel module 30 clamps the lens 3 to be mounted and transmits it to the AA station 310, and calculates the relative position of the lens 3 to be mounted and the reference chip 2;
  • the relative positions of the lens to be installed and the chip to be installed are obtained, so as to obtain the target position of the lens to be installed;
  • the target position is obtained according to the seventh step, the parallel module moves the lens to be installed to the target position, and the UV curing lamp 510 is lit and cured;
  • the hollow turntable rotates so that the finished material is transferred to the finished product unloading module 60 , and the manipulator 80 moves the finished material to the finished product tray on the finished product unloading module 60 .

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
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Abstract

La présente invention concerne un dispositif AA rapide pour une caméra. Selon le dispositif, un module de transfert de disque rotatif creux est utilisé pour mettre en œuvre le transfert d'une puce à assembler de l'alimentation à la formation de produit fini ; un module de mesure d'attitude de puce est monté au niveau d'une position évidée d'une table de transfert pour améliorer le taux d'utilisation d'espace du dispositif et la compacité du dispositif global ; des données d'attitude cible d'une lentille à assembler sur un module d'assemblage sont calculées en fonction des données d'attitude de position acquises de la lentille à assembler et des données d'attitude acquises d'une puce de référence et de la puce à assembler, de sorte qu'après avoir été distribuée, la puce à assembler est durcie, dans le module d'assemblage, avec la lentille à assembler pour obtenir un produit fini, et une électrification et une action AA ne doivent pas être réalisées sur la puce à assembler sur le module d'assemblage ; puisque le module d'assemblage n'a pas besoin d'être électrifié, la lentille et la puce ne sont pas protégées pendant le processus de durcissement, de telle sorte que l'effet de durcissement est amélioré ; la distribution de la station et un processus AA sont exécutés simultanément, de telle sorte que l'efficacité de l'assemblage est améliorée ; de plus, la puce de référence est toujours fixée sur une station AA, de telle sorte qu'un mécanisme de gabarit et une conception d'itinéraire sont simplifiés, et le coût d'assemblage est réduit.
PCT/CN2020/136051 2020-12-03 2020-12-14 Dispositif aa rapide pour caméra WO2022116260A1 (fr)

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CN202011395044.0A CN112576586B (zh) 2020-12-03 2020-12-03 摄像头快速aa装置
CN202011395044.0 2020-12-03

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CN117641082A (zh) * 2023-11-25 2024-03-01 东莞市吉硕自动化设备有限公司 车载摄像头aa自动调芯设备
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