WO2022091927A1 - Procédé de détection de déplacement de position, dispositif de détection de déplacement de position, dispositif de positionnement et dispositif d'inspection - Google Patents

Procédé de détection de déplacement de position, dispositif de détection de déplacement de position, dispositif de positionnement et dispositif d'inspection Download PDF

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Publication number
WO2022091927A1
WO2022091927A1 PCT/JP2021/038898 JP2021038898W WO2022091927A1 WO 2022091927 A1 WO2022091927 A1 WO 2022091927A1 JP 2021038898 W JP2021038898 W JP 2021038898W WO 2022091927 A1 WO2022091927 A1 WO 2022091927A1
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WIPO (PCT)
Prior art keywords
work
stage
image
rotation center
inspection
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PCT/JP2021/038898
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English (en)
Japanese (ja)
Inventor
努 作山
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株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2022091927A1 publication Critical patent/WO2022091927A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined

Definitions

  • the present invention relates to a misalignment detection technique for accurately detecting the misalignment amount of a work placed on a stage, a work alignment technique based on the misalignment amount, and a work inspection device.
  • An inspection technique for inspecting a work having a three-dimensional shape such as an industrial part for defects such as scratches has been proposed.
  • This inspection device irradiates the work placed on the stage with light to illuminate the work, and also captures the work with a camera to acquire an image of the work. Then, the inspection of the work is executed based on the image.
  • a wafer (board) on which a plurality of semiconductor chips are formed is taken as an example of a work.
  • a defect-free wafer is placed on the stage as a reference work, and then a part of an image (image area including feature points) obtained by imaging the reference work is designated as a reference image. Then, when the wafer to be detected for misalignment is placed on the stage as the work to be inspected, the stage is moved to the position corresponding to the reference image and the work to be inspected is imaged to acquire the inspection image. .. After acquiring the inspection images, the amount of misalignment of the work to be inspected with respect to the reference work is obtained based on those images.
  • the height position of the feature point and the height position of the stage surface are almost the same, and the feature point of the work rotates around the rotation center of the stage. It is assumed.
  • the feature points of the work may be separated from the stage surface by a non-negligible degree in the height direction, and if the above-mentioned conventional technique is applied as it is, the detection accuracy of the amount of misalignment may decrease. there were.
  • the optical axis of the camera does not match the normal of the stage surface due to a mounting error of the camera, the following problems occur.
  • the present invention has been made in view of the above problems, and even if the work has a three-dimensional shape, a position shift detection technique capable of accurately detecting the amount of position shift of the work placed on the stage, the position thereof. It is an object of the present invention to provide an alignment device capable of accurately aligning a work using a deviation detection technique and an inspection device capable of inspecting a work with high accuracy.
  • the first aspect of the present invention is a misalignment detection method, in which a reference work is imaged from above the stage with a camera after the reference work has positioned the stage placed on the stage surface at a reference position.
  • a second aspect of the present invention is a misalignment detection device for a stage having a stage surface, a stage correction mechanism for moving the stage in parallel with the stage surface to correct the position of the stage, and a stage surface.
  • a mounting unit having a rotation mechanism that rotates the stage around a vertical rotation axis, a camera that captures the reference work and the work to be inspected mounted on the stage surface from above the stage, and the stage is positioned at the reference position.
  • the camera captures the first reference image including the characteristic part of the reference work acquired by the camera taking an image of the reference work placed on the stage surface in the mounted state, and the inspected work placed on the stage surface.
  • a storage unit that stores the first inspection image including the characteristic part of the work to be inspected, and a rotation center acquisition unit that obtains the rotation center coordinates of the characteristic part that is displaced by the rotation of the stage by the rotation mechanism.
  • a first reference image, a first inspection image, and a position deviation calculation unit for obtaining the amount of position deviation of the work to be inspected with respect to the reference work based on the coordinates of the center of rotation.
  • the third aspect of the present invention is a positioning device, in which the work to be inspected is placed on the stage surface based on the misalignment detecting device and the misalignment amount obtained by the misalignment calculation unit. It is characterized in that it is provided with an alignment portion for positioning and aligning the workpiece to be inspected.
  • the fourth aspect of the present invention is an inspection device, which is an inspection device, and the work to be inspected is based on an image for inspection obtained by imaging the alignment device and the work to be inspected aligned by the alignment device. It is characterized by having a work inspection unit for inspecting.
  • the reference work and the work to be inspected placed on the stage surface of the stage are imaged by the camera from above.
  • the first reference image and the first inspection image are acquired, but in addition to this, the rotation center coordinates of the characteristic portion of the reference work that is displaced as the stage is rotated around the rotation axis perpendicular to the stage surface are obtained. Desired.
  • the amount of misalignment is detected in consideration of not only the first reference image and the first inspection image but also the coordinates of the center of rotation.
  • the work since the amount of misalignment of the work to be inspected with respect to the reference work is detected based on the first reference image, the first inspection image, and the coordinates of the center of rotation, the work has a three-dimensional shape. Even so, the amount of misalignment of the work placed on the stage can be accurately detected.
  • the plurality of components of each aspect of the present invention described above are not all essential, and may be used to solve some or all of the above-mentioned problems, or part or all of the effects described herein.
  • the technical features included in the above-mentioned aspect of the present invention it is also possible to combine some or all with some or all of the technical features contained in the other aspects of the invention described above to form an independent form of the invention.
  • FIG. 1 is a diagram showing an overall configuration of an inspection device equipped with the first embodiment of the position shift detection device according to the present invention.
  • FIG. 2 is a view of the cover member provided in the inspection device as viewed from above.
  • 3 and 4 are diagrams schematically showing the mounting state of the camera and the light emitting element with respect to the cover member.
  • the inspection device 1 includes a mounting unit 2 that positions the work W while mounting the work W having a flat plate shape or a three-dimensional shape, an imaging unit 3 that captures an image of the work W mounted on the mounting unit 2. It includes a control unit 4 that controls each unit of the mounting unit 2 and the image pickup unit 3 and inspects the work W based on the image of the work W acquired by the image pickup unit 3.
  • the XYZ right-angled coordinate axes are shown in FIG. That is, the horizontal direction X parallel to the stage surface 21a on which the work W is placed, the horizontal direction Y parallel to the stage surface 21a and orthogonal to the horizontal direction X, and the vertical direction Z are shown. Then, the work W is three-dimensionally moved in the robot coordinate system indicated by the XYZ right-angled coordinate axes.
  • the mounting unit 2 has an XY stage.
  • the XY stage is composed of a stage 21 and an XY correction mechanism 22 that corrects the position of the stage 21 in the XY plane by moving the stage 21 in the XY direction.
  • the stage 21 has a stage surface (XY plane) 21a on which the work W is placed.
  • the surface normal of the stage surface 21a extends in the vertical direction Z.
  • the XY correction mechanism 22 moves the stage 21 in the X direction and the Y direction in response to an operation command from the drive control unit 44 of the control unit 4. Therefore, as will be described in detail later, the stage 21 moves in the X direction and the Y direction according to the horizontal displacement amount (X movement amount and Y movement amount) of the work W placed on the stage surface 21a. Will be moved. As a result, the alignment of the work W in the horizontal direction is executed.
  • the stage drive mechanism 23 includes a Z-axis drive mechanism 231 that moves the XY stage up and down in the Z direction, an XY-axis drive mechanism 232 that moves the XY stage in the X and Y directions, and a rotation axis AXr that faces the Z direction. It has an R-axis drive mechanism 233 that rotates in the R direction around (see FIGS. 2 to 4).
  • the work W placed on the stage surface 21a is positioned in the Z direction by operating the Z-axis drive mechanism 231 in response to an operation command from the drive control unit 44 of the control unit 4.
  • a position for performing work imaging below the cover member 31 of the imaging unit 3 and a cover.
  • the XY stage is moved to and from the work delivery position (not shown) away from the member 31.
  • the R-axis drive mechanism 233 in response to the above operation command, the work W mounted on the XY correction mechanism 22, the stage 21, and the stage surface 21a is integrally rotated around the rotation axis AXr. ..
  • the stage 21 is combined with the XY correction mechanism 22 according to the amount of misalignment (rotation amount) of the work placed on the stage surface 21a in the rotation direction R of the rotation axis AXr. It is rotated in the R direction. As a result, the alignment of the work W in the R direction is executed.
  • the work W aligned so as to eliminate the positional deviation (X movement amount and Y movement amount) in the XY direction and the positional deviation (rotation amount) in the R direction is the cover member 31 and the image pickup device 32. And the image pickup unit 3 having the illumination device 33.
  • the cover member 31 has a concave inner peripheral surface 31a (see FIGS. 3 and 4). Then, the cover member 31 was aligned at the imaging position with the central axis (not shown) of the cover member 31 substantially aligned with the rotation axis AXr of the R-axis drive mechanism 233 and the inner peripheral surface 31a facing downward. It is fixedly arranged vertically above the work W. That is, the inner peripheral surface 31a of the cover member 31 faces the work W in the reference state, and is a dome that covers the work W from above.
  • the cover member 31 is provided with seven through holes 31U, 31La, 31Ca, 31Ra, 31Lb, 31Cb, 31Rb penetrating the inner peripheral surface 31a and the outer peripheral surface 31b of the cover member 31.
  • the through hole 31U is provided at an upper position of the XY correction mechanism 22.
  • the through holes 31U are arranged slightly offset in the (+ X) direction from the rotation axis AXr.
  • the through hole 31Ca is provided in the diagonal 45 ° direction when viewed from the XY correction mechanism 22, and the through hole 31Cb is XY.
  • through holes 31La and 31Lb are provided at positions rotated clockwise by about 75 ° from the through holes 31Ca and 31Cb with the XY correction mechanism 22 as the center, respectively.
  • through holes 31Ra and 31Rb are provided at positions rotated counterclockwise by about 75 ° from the through holes 31Ca and 31Cb, respectively.
  • the image pickup device 32 is composed of seven cameras CU, CLa, CCa, CRa, CLb, CCb, and CRb. Of these, the camera CU is arranged in the through hole 31U so that the work W positioned at the imaging position can be imaged from above.
  • the camera CU is used not only for the inspection of the work W but also for the detection of the amount of misalignment described in detail later, and corresponds to an example of the "camera" of the present invention.
  • Other cameras CLa, CCa, CRa, CLb, CCb, CRb are used for inspection.
  • the camera CCa is arranged in the through hole 31Ca so that the work W on the stage 21 can be imaged from the imaging direction (hereinafter referred to as "center oblique direction") of 45 ° with respect to the XY plane in the X direction.
  • the camera CLa is rotated 75 ° clockwise from the X direction, and the work W on the stage 21 can be imaged from the imaging direction of 45 ° with respect to the XY plane (hereinafter referred to as "diagonal left direction") in the through hole 31La. It is arranged.
  • the camera CRa can image the work W on the stage 21 in a direction rotated 75 ° counterclockwise from the X direction and from an imaging direction of 45 ° with respect to the XY plane (hereinafter referred to as “right diagonal direction”). It is arranged in.
  • the camera CCb is arranged in the through hole 31Cb so that the work W on the stage 21 can be imaged from the lateral direction parallel to the X direction (hereinafter referred to as “center lateral direction”).
  • the camera CLb is arranged in the through hole 31Lb so that the work W on the stage 21 can be imaged from the lateral direction (hereinafter referred to as “left lateral direction”) rotated by 75 ° clockwise from the X direction.
  • the camera CRb is arranged in the through hole 31Rb so that the work W on the stage 21 can be imaged from the lateral direction (hereinafter referred to as “right lateral direction”) rotated by 75 ° counterclockwise from the X direction.
  • a plurality of triangular or trapezoidal printed circuit boards are spread on the inner peripheral surface 31a of the cover member 31.
  • the inner peripheral surface 31a has six arrangement regions (only AC + and AC- are shown in FIG. 3, only AL + and AL- are shown in FIG. 4, and the remaining two are not shown). It is divided into.
  • the arrangement area AC + one or a plurality of printed circuit boards are spread.
  • the printed circuit board is provided with through holes of the same size (not shown) facing the through holes 31U, 31Ca, and 31Cb. Further, except for these through holes, the printed circuit board is provided with a plurality of through holes.
  • the light emitting surface of the light emitting element 331 is directed toward the aligned work W.
  • the lead of the light emitting element 331 is inserted into the through hole and mounted on the land of the printed circuit board.
  • a plurality of light emitting elements 331 are dispersedly arranged in the arrangement region AC + of the inner peripheral surface 31a, and each light emitting element 331 emits light in response to a lighting command from the lighting control unit 45 of the control unit 4.
  • the work W is irradiated with illumination light from various illumination directions from the (+ X) direction side.
  • one or a plurality of printed circuit boards are spread in the arrangement area AC-. Also in the arrangement region AC- on the inner peripheral surface 31a, a plurality of light emitting elements 331 are dispersedly arranged. Then, each light emitting element 331 emits light in response to a lighting command from the lighting control unit 45 of the control unit 4, so that the work W is irradiated with illumination light from various lighting directions from the (—X) direction side.
  • each light emitting element 331 emits light in response to a lighting command from the lighting control unit 45 of the control unit 4, so that the work W is variously lit. Illumination light is emitted from the illumination direction of.
  • the light emitting element 331 an LED or the like can be used.
  • the control unit 4 has an arithmetic processing unit 41, an image processing unit 42, a storage unit 43, a drive control unit 44, and a lighting control unit 45.
  • the storage unit 43 is composed of a storage medium such as a hard disk drive, and not only the images captured by each camera CU, CLa, CCa, CRa, CLb, CCb, CRb at the time of inspection, but also the amount of misalignment described in detail later.
  • a reference image or an inspection image captured by the camera CU is stored in order to detect.
  • the camera CU functions not only for inspection but also for detecting misalignment, and corresponds to an example of the "camera" of the present invention. Therefore, in order to distinguish from the cameras CLa, CCa, CRa, CLb, CCb, and CRb that function only for inspection, the camera CU is appropriately referred to as an "upper camera CU".
  • the image processing unit 42 reads out the image data acquired by the image pickup device 32 from the storage unit 43, and creates an image for template matching, a reference image, an inspection image, a work inspection image, and the like. Further, the drive control unit 44 drives the XY correction mechanism 22, the stage drive mechanism 23, and the like, so that the work W positions the stage 21 mounted on the stage surface 21a at a desired position. Further, the lighting control unit 45 switches between lighting and extinguishing of the light emitting element 331 to control the lighting of the work W.
  • the arithmetic processing unit 41 appropriately reads out the program stored in the storage unit 43 in advance and expands it into the RAM. Then, according to the expanded program, the arithmetic processing unit 41 acquires a reference image acquisition process for acquiring a reference image, a rotation center acquisition process for acquiring rotation center coordinates, and an inspection image, as described in detail below.
  • An inspection image acquisition process, a position deviation calculation process for calculating the amount of misalignment, an alignment process for performing alignment based on the amount of misalignment, and a work inspection process for inspecting the aligned work W are executed. do.
  • the arithmetic processing unit 41 functions as a rotation center acquisition unit 411, a position deviation calculation unit 412, an alignment unit 413, and a work inspection unit 414.
  • FIG. 5 is a flowchart showing the preparatory work performed prior to the work inspection by the inspection device.
  • FIGS. 6A to 6E are diagrams schematically showing the steps executed in the preparatory work, and these drawings show the preparatory work for inspecting the work W having a three-dimensional shape.
  • step S11 calibration of the upper camera CU is executed (step S11). More specifically, when a plate (not shown) provided with a known pattern is placed on the stage surface 21a of the stage 21 by a transfer robot or an operator (not shown), the stage drive mechanism 23 sets the stage 21. It is moved to a position directly below the image pickup unit 3.
  • This position corresponds to an example of the "reference position" of the present invention, and is referred to as coordinates (0, 0, 0) in the robot coordinate system in the present specification.
  • the XY correction mechanism 22 is located at a preset origin.
  • the unit of the robot coordinate system in the X direction, the Y direction, and the Z direction is mm.
  • the light emitting element 331 temporarily lights up to illuminate the plate, and the upper camera CU takes an image of the illuminated plate to acquire a pattern image. Then, the arithmetic processing unit 41 calibrates the upper camera CU based on the pattern image, and the internal parameters (lens distortion coefficient, focal length, number of image sensor elements (pixels), etc.) and external parameters of the upper camera CU are performed. (Relative position with respect to stage 21 and the like) is obtained and stored in the storage unit 43.
  • the stage drive mechanism 23 moves the stage 21 to a work delivery position (not shown) horizontally separated from the position directly below the image pickup unit 3. Then, a reference work W (hereinafter referred to as “reference work Wr”) is placed on the stage surface 21a of the stage 21 in place of the calibration plate at the work delivery position by a transfer robot or an operator (not shown). To. In this way, the reference work Wr is carried in (step S12).
  • the reference work Wr is a work that has been separately inspected and has no defects, and is manufactured as designed.
  • the work W to be inspected which will be described later, is referred to as "work Wt to be inspected" in order to distinguish it from the reference work Wr.
  • the stage 21 on which the reference work Wr is placed on the stage surface 21a is moved to a reference position and positioned as shown in the right drawing of FIG. 6A (step S13). Further, in this positioning step, the rotation amount R (unit: deg) of the stage 21 by the R-axis drive mechanism 233 is zero.
  • the posture of the reference work Wr at this time is referred to as a "reference work posture" in the present specification.
  • the light emitting element 331 is temporarily turned on to illuminate the reference work Wr, and the illuminated upper camera CU images the reference work Wr from above.
  • a reference image (ImgRef) as shown in the left drawing of the figure is acquired.
  • “Image X” and “Image Y” in the same drawing indicate the X coordinate and the Y coordinate in the camera coordinate system, respectively, and their units are It is a pixel.
  • an image of a characteristic portion of the work W that is, a protrusion portion Wp protruding in the horizontal direction in the present embodiment is reflected.
  • the image region corresponding to the protrusion portion Wp is set as the feature region Wc, and this is created as a template matching model. Further, the position of the center of gravity of the feature region Wc is set at the feature point CP (step S15). Needless to say, in order to set the template matching model, the image area other than this may be set as the feature area Wc, or the position other than the center of gravity may be set as the feature point CP.
  • the arithmetic processing unit 41 moves the stage 21 in multiple stages in the horizontal direction parallel to the stage surface 21a by a predetermined number of times while maintaining the rotation amount R at zero, and moves each stage.
  • the amount of displacement of the reference image associated with the above is calculated (steps S16 to S19). That is, while the reference work Wr is placed on the stage surface 21a, the stage 21 is moved from the reference position (0, 0, 0) in the robot coordinate system to the position (1, 0, 0, as shown in the right drawing of FIG. 6B, for example. It is horizontally moved to 0) (step S16). Then, after the movement is completed, the upper camera CU takes an image of the reference work Wr moved by 1 mm in the X direction from above.
  • a reference image (ImgObj_1_0) as shown in the left drawing of the same figure is acquired (step S17).
  • the arithmetic processing unit 41 performs template matching between the feature area Wc (FIG. 6A) of the reference image (ImgRef) and the feature area Wc (FIG. 6B) of the reference image (ImgObj_1_0) to perform template matching on the reference image (FIG. 6B) in the camera coordinate system.
  • the displacement direction and displacement amount of ImgObj_1_0) are calculated (step S18). More specifically, as shown in FIG.
  • the arithmetic processing unit 41 is in the ImageX direction based on the feature point CP (ImgRef) of the reference image (ImgRef) and the feature point CP (ImgObj_1_0) of the reference image (ImgObj_1_0). In, the number of pixels in which the reference image (ImgObj_1_0) is moved with respect to the reference image (ImgRef) and the number of pixels in which the reference image (ImgObj_1_0) is moved with respect to the reference image (ImgRef) in the ImageY direction are counted.
  • stage movement step S16
  • acquisition of the reference image step S17
  • displacement calculation of the reference image step S18
  • step S18 are predetermined by the arithmetic processing unit 41 in step S19. Repeat until it is determined that the number of times has been reached.
  • the predetermined number of times is set to "7" in consideration of the error of template matching, the resolution of the upper camera CU, and the like, and the reference position (0, 0, 0) is used.
  • the displacement is calculated every time the device is moved to the seven positions, but the predetermined number of times is not limited to this and is arbitrary.
  • the amount of stage movement per time is also arbitrary.
  • a conventionally known calculation method can be used, and in this embodiment, the calculation method described in Japanese Patent Application Laid-Open No. 2010-135642 is used.
  • the stage 21 is returned to the reference position and positioned while the reference work Wr is placed on the stage surface 21a as shown in the right drawing of FIG. 6D. Further, the stage 21 is integrally rotated with the XY correction mechanism 22 by the R-axis drive mechanism 233 around the rotation axis AXr by a predetermined angle R1 (for example, several deg) (step S21). Following this, the light emitting element 331 lights up to illuminate the reference work Wr, and the upper camera CU images the reference work Wr from above. As a result, for example, a reference image (ImgRef_R1) as shown in the left drawing of the figure is acquired (step S22).
  • a reference image ImgRef_R1
  • the arithmetic processing unit 41 temporarily sets the rotation center (Row_C, Col_C) of the image in the camera coordinate system to a predetermined value stored in the storage unit 43 in advance (step S23). Then, the arithmetic processing unit 41 rotates the reference image (ImgRef_R1) around the rotation center (Row_C, Col_C) by an angle ( ⁇ R1) in the camera coordinate system. As a result, as shown in FIG. 6E, a reference image (ImgRef_R2) is created (step S24).
  • the reference image (ImgRef) and the reference image (ImgRef_R2) also match.
  • the reference image (ImgRef_R2) is displaced from the reference image (ImgRef) due to the mismatch of the rotation centers.
  • the arithmetic processing unit 41 verifies the degree of agreement between the reference image (ImgRef) and the reference image (ImgRef_R2) by executing steps S25 to S27. That is, the arithmetic processing unit 41 performs template matching between the feature region Wc (FIG. 6A) of the reference image (ImgRef) and the feature region Wc (FIG. 6E) of the reference image (ImgRef_R2) to refer to the reference in the camera coordinate system. The displacement amount of the image (ImgRef_R2) is calculated (step S25).
  • the amount of deviation of the reference image (ImgRef_R2) in the ImageX direction and the ImageY direction is obtained by the number of pixels, respectively.
  • the internal parameters of the upper camera CU, and the external parameters updated in step S20 the arithmetic processing unit 41 obtains the X coordinate Xw and the Y coordinate Yw in the world coordinate system.
  • the X-coordinate Xw and the Y-coordinate Yw thus obtained indicate the positions of the reference work Wr returned to the original positions by rotating forward and reverse by the rotation amount R1 around the rotation axis AXr in the XY plane. ..
  • the arithmetic processing unit 41 calculates an error from the reference position of the reference work Wr due to the work rotation from the X coordinate Xw and the Y coordinate Yw (step S26). The arithmetic processing unit 41 determines whether or not the error thus obtained is equal to or less than a value allowed in the work inspection described later (step S27).
  • step S27 While it is determined in step S27 that the error exceeds the permissible value, the arithmetic processing unit 41 returns to step S24 after changing the rotation center (Row_C, Col_C) (step S28), and returns to a series of steps (step S24). ⁇ S27) is repeated. On the other hand, if it is determined in step S27 that the error is equal to or less than the allowable value, the arithmetic processing unit 41 sets the rotation center (Row_C, Col_C) at that time as the true rotation center (Row_True, Col_True) of the reference work Wr (step). S29). This completes the preparatory work, which is an example of the "rotation center acquisition process" of the present invention.
  • the stage 21 and the XY correction mechanism 22 are integrally moved to the work delivery position, and the illustration is shown.
  • the reference work Wr is carried out from the stage surface 21a by a transfer robot, an operator, or the like.
  • FIG. 7 is a flowchart showing a work inspection by the inspection device.
  • 8A to 8E are diagrams schematically showing the steps executed in the work inspection.
  • the work Wt to be inspected is carried onto the stage surface 21a of the stage 21 located at the work delivery position by a transfer robot or an operator (not shown) (step S31).
  • the stage 21 is integrally moved to the XY correction mechanism 22 by the stage drive mechanism 23 and moves directly under the image pickup unit 3, and is used as a reference.
  • step S32 Positioned at the position.
  • the arithmetic processing unit 41 obtains the amount of misalignment of the work to be inspected Wt with respect to the reference work Wr by controlling each part of the device according to the above program, and further, the work to be inspected is based on the amount of misalignment. Align Wt.
  • the amount of misalignment the work rotation amount of the work Wt to be inspected with respect to the reference work Wr having the rotation center coordinates obtained by the preparatory work as the rotation center and the reference in the direction parallel to the stage surface 21a.
  • the work movement amount of the work Wt to be inspected with respect to the work Wr is obtained independently of each other.
  • the light emitting element 331 lights up to illuminate the work Wt to be inspected, and the upper camera CU images the work Wt to be inspected from above.
  • an inspection image (ImgTarget) as shown in the left drawing of the figure is acquired (inspection image acquisition step: step S33).
  • the arithmetic processing unit 41 executes template matching between the feature area Wc of the reference image (ImgRef) and the feature area Wc of the inspection image (ImgTarget), thereby performing the inspection image (ImgTarget) in the camera coordinate system. ) Is calculated with respect to the reference image (ImgRef) (step S34).
  • step S35 the arithmetic processing unit 41 rotates the inspection image (ImgTarget) in the camera coordinate system by an angle ( ⁇ R3) around the rotation center (Row_True, Col_True) obtained in advance in the preparatory work.
  • ⁇ R3 the rotation center
  • FIG. 8C an inspection image
  • the arithmetic processing unit 41 performs template matching between the feature area Wc of the reference image (ImgRef) and the feature area Wc of the inspection image (ImgTarget_R4) in the camera coordinate system.
  • the displacement amount of the inspection image (ImgTarget_R4) with respect to the reference image (ImgRef) is calculated (step S36). That is, the displacement amount of the inspection image (ImgTarget_R4) in the ImageX direction and the ImageY direction can be obtained by the number of pixels, respectively.
  • the arithmetic processing unit 41 converts the displacement amount (number of pixels) into the movement amount of the work Wt to be inspected in the robot coordinate system (step S37). As a result, the amount of X movement in the X-axis direction and the amount of Y movement in the Y-axis direction are calculated as the amount of misalignment.
  • the correction amount is calculated based on them, and the stage 21 is moved according to the correction amount. More specifically, the R-axis drive mechanism 233 integrally rotates the stage 21 and the XY correction mechanism 22 by the amount of rotation (-R3), and the XY correction mechanism 22 rotates the stage 21 in the X-axis direction and the Y-axis direction. Move only (-X movement amount) and (-Y movement amount), respectively. As a result, the work Wt to be inspected placed on the stage surface 21a of the stage 21 takes a reference work posture at the reference position, and the alignment of the work Wt to be inspected is completed (step S38).
  • the light emitting element 331 lights up to illuminate the work Wt to be inspected, and the work Wt to be inspected is imaged by the image pickup unit 3 to acquire an image for work inspection.
  • the work inspection unit 414 of the arithmetic processing unit 41 inspects the work to be inspected Wt based on the image (step S39).
  • the stage 21 and the XY correction mechanism 22 are integrally moved to the work delivery position, and the work Wt to be inspected is carried out from the stage surface 21a by a transfer robot or an operator (not shown) (step S40). ..
  • the amount of misalignment is detected in consideration of not only the reference image (ImgRef) and the inspection image (ImgTarget) but also the rotation center (Row_True, Col_True). Therefore, even when the work W has a three-dimensional shape, the amount of misalignment of the work Wt to be inspected with respect to the reference work Wr can be detected with high accuracy. Further, since the stage 21 is moved according to the amount of the misalignment, the alignment accuracy of the work Wt to be inspected with respect to the reference work Wr can be improved. Further, since the inspection is performed on the work Wt to be inspected thus aligned, the inspection accuracy can be improved.
  • the protrusion portion Wp of the work W corresponds to an example of the "characteristic portion” of the present invention.
  • Step S14 corresponds to an example of the "reference image acquisition step” of the present invention.
  • Step S17 corresponds to an example of the "step (a)” of the present invention
  • steps S18 and S20 correspond to an example of the “step (b)” of the present invention
  • steps S21 and S22 correspond to the "step (c)” of the present invention. )
  • step S24 corresponds to an example of the“ step (d) ”of the present invention.
  • Steps S25 to S29 correspond to an example of the "step (e)" of the present invention
  • step S26 corresponds to an example of the “steps (e-1), (e-2)" of the present invention
  • step S29 corresponds to the present invention. It corresponds to an example of the “step (e-3)" of the invention.
  • the reference images (ImgRef), (ImgObj_X_Y), (ImgRef_R1), and (ImgRef_R2) are the “first reference image”, “second reference image”, “third reference image”, and “fourth reference image” of the present invention, respectively. It corresponds to an example of.
  • the inspection image (ImgTarget) and (ImgTarget_R4) correspond to an example of the "first inspection image” and the "second inspection image” of the present invention, respectively.
  • the rotation amount R3 corresponds to an example of the "work rotation amount” of the present invention
  • the X movement amount and the Y movement amount correspond to an example of the "work movement amount” of the present invention.
  • the center of rotation (Row_C, Col_C) corresponds to an example of the "temporary center of rotation coordinates" of the present invention, and is changed in multiple steps until it is determined as "YES" in step S27.
  • the reference work Wr returned to the original position by being rotated forward and reverse by the rotation amount R1 around the rotation axis AXr corresponds to the "reference work corresponding to the fourth reference image" of the present invention.
  • the XY correction mechanism 22 and the R-axis drive mechanism 233 correspond to an example of the "stage correction mechanism” and the “rotation mechanism” of the present invention.
  • the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.
  • the upper camera CU is provided above the stage 21, and the angle formed by the imaging direction and the stage surface 21a is approximately 90 °, but the angle is not limited to this.
  • the above angle becomes small and the imaging direction becomes slanted, it is necessary to correct the reference image and the inspection image in consideration of it.
  • the correction amount increases as the angle becomes smaller, and the detection accuracy of the misalignment amount tends to decrease. Therefore, in order to obtain sufficient detection accuracy, it is desirable to set the angle to 60 ° or more and 90 ° or less.
  • the upper camera CU functioning for inspection is used for detecting misalignment by imaging the work W (reference work Wr, inspected work Wt) mounted on the stage surface 21a of the stage 21 from above.
  • a dedicated camera for detecting misalignment may be provided separately.
  • another inspection camera for example, the cameras CLa, CCa, and CRa may be used as a camera for detecting misalignment by adjusting the imaging direction to 60 ° or more and 90 ° or less.
  • the present invention is applied to the alignment device that captures and aligns the work Wt to be inspected by seven cameras and the inspection device 1 that inspects the work Wt to be inspected.
  • the application of the present invention is not limited to this, and the present invention is also applied to an alignment device and an inspection device for inspecting a work Wt to be inspected by using 1 to 6 cameras or 8 or more cameras. can do.
  • the present invention can be applied to all the misalignment detection techniques for accurately detecting the misalignment amount of the work placed on the stage, all the alignment techniques for aligning the workpieces based on the misalignment amount, and all the inspection devices. can.

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Abstract

La présente invention capture une image depuis le dessus, à l'aide d'un appareil de prise de vues, d'une pièce de référence et d'une pièce d'inspection qui sont placées sur une surface de platine d'une platine, afin de détecter la quantité de déplacement de position de la pièce d'inspection par rapport à la pièce de référence. De cette manière, une première image de référence et une première image d'inspection sont obtenues et, de plus, les coordonnées du centre de rotation peuvent être trouvées pour un site caractéristique de la pièce de référence qui se déplace à mesure que la platine est mise en rotation autour d'un axe de rotation perpendiculaire à la surface de la platine. De plus, la quantité de déplacement de position est détectée en prenant en compte non seulement la première image de référence et la première image d'inspection, mais également les coordonnées du centre de rotation. Il en résulte qu'une technologie de détection de déplacement de position est obtenue, qui est susceptible de détecter avec précision la quantité de déplacement de position de la pièce placée sur la platine, même si la pièce a une forme tridimensionnelle et cette technologie de déplacement de position peut être utilisée pour positionner avec précision la pièce.
PCT/JP2021/038898 2020-10-29 2021-10-21 Procédé de détection de déplacement de position, dispositif de détection de déplacement de position, dispositif de positionnement et dispositif d'inspection WO2022091927A1 (fr)

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JP2020181610A JP2022072260A (ja) 2020-10-29 2020-10-29 位置ずれ検出方法、位置ずれ検出装置、位置合せ装置および検査装置
JP2020-181610 2020-10-29

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145402A (ja) * 1984-12-20 1986-07-03 Toshiba Corp 撮像装置
JP2011117914A (ja) * 2009-12-07 2011-06-16 Cognex Corp オブジェクト制御システム、オブジェクト制御方法、プログラム、及び回転中心位置特定装置
JP2012047463A (ja) * 2010-08-24 2012-03-08 Dainippon Screen Mfg Co Ltd 位置ずれ量検出方法および該位置ずれ量検出方法を用いた外観検査方法
JP2019045399A (ja) * 2017-09-05 2019-03-22 富士通株式会社 検査方法、検査プログラム及び検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145402A (ja) * 1984-12-20 1986-07-03 Toshiba Corp 撮像装置
JP2011117914A (ja) * 2009-12-07 2011-06-16 Cognex Corp オブジェクト制御システム、オブジェクト制御方法、プログラム、及び回転中心位置特定装置
JP2012047463A (ja) * 2010-08-24 2012-03-08 Dainippon Screen Mfg Co Ltd 位置ずれ量検出方法および該位置ずれ量検出方法を用いた外観検査方法
JP2019045399A (ja) * 2017-09-05 2019-03-22 富士通株式会社 検査方法、検査プログラム及び検査装置

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