WO2022059554A1 - Surface treatment device - Google Patents

Surface treatment device Download PDF

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Publication number
WO2022059554A1
WO2022059554A1 PCT/JP2021/032786 JP2021032786W WO2022059554A1 WO 2022059554 A1 WO2022059554 A1 WO 2022059554A1 JP 2021032786 W JP2021032786 W JP 2021032786W WO 2022059554 A1 WO2022059554 A1 WO 2022059554A1
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WO
WIPO (PCT)
Prior art keywords
tank
work
treatment
liquid
liquid ejection
Prior art date
Application number
PCT/JP2021/032786
Other languages
French (fr)
Japanese (ja)
Inventor
勝己 石井
Original Assignee
株式会社アルメックステクノロジーズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アルメックステクノロジーズ filed Critical 株式会社アルメックステクノロジーズ
Priority to CN202180054900.2A priority Critical patent/CN116018430A/en
Priority to JP2022550487A priority patent/JP7236783B2/en
Publication of WO2022059554A1 publication Critical patent/WO2022059554A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Definitions

  • the present invention relates to a surface treatment apparatus that applies surface treatment such as plating to a work.
  • the work is arranged along the vertical direction of a nozzle tube vertically installed in the plating liquid toward the work hanging in the plating liquid.
  • the plating solution is sprayed from multiple nozzles.
  • Patent Documents 2 and 3 in a device for plating a workpiece such as a circuit board or a semiconductor wafer, a paddle for stirring a processing liquid is used instead of a nozzle tube.
  • the paddle of Patent Document 2 is a stirring rod
  • the paddle of Patent Document 3 is a rectangular plate having a plurality of vertically elongated holes formed through the paddle, and these paddles are reciprocated in parallel with the main surface of the work. It is disclosed in Patent Documents 4 to 6 that the nozzle of Patent Document 1 is provided in the paddle of Patent Document 2 or 3.
  • Japanese Unexamined Patent Publication No. 2012-046782 (Fig. 5) Japanese Unexamined Patent Publication No. 2006-041172 (Fig. 1-5) Japanese Unexamined Patent Publication No. 2014-185375 (FIGS. 1, 3-4, 6) Japanese Unexamined Patent Publication No. 2004-16129 (Fig. 1-4) Japanese Unexamined Patent Publication No. 56-42776 (Fig. 1-3) Japanese Unexamined Patent Publication No. 10-88397 (Fig. 1-2)
  • Patent Documents 4 to 6 since the nozzle tubes of Patent Document 1 are arranged at intervals in the width direction of the work and the nozzles are arranged at intervals in the vertical direction in each nozzle tube, the plating solution is uniformly discharged to the work. It is difficult to do.
  • the paddle of Patent Document 2 only stirs the plating solution.
  • the processing liquid pumped by the liquid injection pump is ejected from the moving paddle toward the work, but it is patented that the in-plane uniformity of the processing is not improved depending on the position of the nozzle. It is the same as Document 1.
  • a liquid injection pump is required in addition to the drive source.
  • a treatment tank that houses the treatment liquid and With the anode arranged in the processing tank, A jig that hangs and holds the work immersed in the treatment liquid and sets the work as the cathode.
  • the liquid ejection member comprises at least a pair of plate members formed between the anode and the work along the extending direction toward the work and arranged apart from each other in a direction intersecting the extending direction.
  • the present invention relates to a surface treatment apparatus that guides the treatment liquid, which is contained and flows due to the movement of the liquid ejection member, between at least a pair of plate materials and ejects the treatment liquid toward the work.
  • the treatment liquid can be ejected toward the work without using a nozzle tube. That is, the processing liquid flowing in the processing tank due to the movement of the liquid ejection member is guided between at least a pair of plate materials and ejected toward the work. As a result, the treatment liquid collides with the work, so that a fresh treatment liquid having abundant surface treatment components near the anode can be supplied to the work, and the throughput is improved.
  • the treatment liquid can be ejected to the work by at least a pair of plates of the liquid ejection member to be moved, the uniformity of the treatment in the work surface is compared with the one in which the treatment liquid is ejected from a plurality of nozzles of the nozzle tube. Is improved.
  • the moving mechanism moves the liquid ejection member in a reciprocating direction parallel to the work.
  • the liquid ejection member is A first guide body having two surfaces intersecting the reciprocating direction, A second guide body and a third guide body arranged via a gap between the two surfaces of the first guide body and the third guide body, respectively.
  • Including The at least pair of plate materials A first pair of plate materials formed by the first guide body and the second guide body, and A second pair of plate members formed by the first guide body and the third guide body is included.
  • the processing liquid guided along between the first pair of plate members formed by the first and second guide bodies is ejected to the work, and the liquid ejecting member, for example, is restored.
  • a treatment liquid guided along between the second pair of plate members formed by the first and third guide bodies is ejected onto the work.
  • the anode can include a first anode and a second anode arranged on both sides of the work, and the liquid ejection member includes the first anode and the above.
  • the first liquid ejection member arranged between the work and the second liquid ejection member arranged between the second anode and the work can be included, and the moving mechanism can include the first liquid ejection member.
  • a first moving mechanism for moving the liquid ejection member and a second moving mechanism for moving the second liquid ejection member can be included. In this way, both sides of the work can be processed.
  • the first drive source for applying a driving force to the first moving mechanism and the second driving source for applying a driving force to the second moving mechanism are further provided.
  • the first liquid ejection member and the second liquid ejection member may be driven asynchronously.
  • the treatment liquid is ejected toward both sides of the same region of the work.
  • the work has through holes penetrating on both sides, it becomes difficult for the treatment liquid to pass through the through holes.
  • the positions facing the first and second liquid ejection members are always the same with respect to the work when the first and second liquid ejection members are moved synchronously.
  • the work can be made different each time. This makes it easier for the treatment liquid to pass through the through holes.
  • the processing tank is attached to the first tank by the jig holding the work being lowered from above the processing tank and mounted. It may be partitioned into a second tank. In this way, the first liquid ejection member can agitate the treatment liquid in the first tank, the second liquid ejection member can agitate the treatment liquid in the second tank, and the stirring in one tank is the other. The adverse effect on the tank can be eliminated.
  • the treatment tank communicates with the first tank and the second tank on the outside of two side wall portions located at both ends in the reciprocating direction, and the treatment liquid.
  • the treatment tank is connected to the reciprocating direction in a direction parallel to the reciprocating direction, and the first treatment tank and the second treatment tank are partitioned by the first buffer tank.
  • Can include.
  • the jig holds the first work and divides the first treatment tank into the first tank and the second tank, and holds the second work and holds the second treatment tank.
  • a second jig for partitioning the first tank and the second tank can be included.
  • the first buffer tank includes the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second treatment tank.
  • the treatment liquid can be circulated with the second tank.
  • the treatment liquid is circulated between the first tank and the second tank in the first treatment tank on the outside of the first side wall portion located at one end in the reciprocating direction. It can include a buffer tank.
  • the treatment liquid is circulated between the first tank and the second tank in the second treatment tank on the outside of the second side wall portion located at the other end in the reciprocating direction. 3 buffer tanks can be included. In this way, the first work and the second work can be processed at the same time, and at that time, the same actions and effects as those of the embodiment (6) of the present invention can be obtained.
  • first element is described as "connected” or “connected” to the second element, such a description is such that the first element and the second element are directly connected to each other.
  • Including morphology when the first element is described as "moving" with respect to the second element, such a description is relative to the movement of at least one of the first element and the second element with respect to the other. Includes embodiments of various movements.
  • FIG. 1 is a schematic diagram of a surface treatment apparatus, for example, an electrolytic plating apparatus according to the present embodiment.
  • the electroplating apparatus 1 has a flat plate-shaped jig 10 for holding the work W and a surface treatment tank 100A in which the jig 10 is installed.
  • the first main surface (for example, the front surface) WF and the second main surface (for example, the back surface) WB which are in a front-to-back relationship, is a surface to be processed, and in the present embodiment, both are surfaces to be processed. ..
  • the surface treatment tank 100A in which the treatment liquid, for example, the plating liquid 2 is housed has support portions 110 and 120 that detachably support the jig 10 for holding the work W in a vertical state. ..
  • the lower support portion 110 has a slit into which the lower end portion of the jig 10 is inserted.
  • the upper support portion 120 also has a slit into which the side edge portion of the jig 10 is inserted.
  • the jig 10 is lowered from the upper opening of the surface treatment tank 100A and is held in a vertical state by the support portions 110 and 120.
  • the upper support portion 120 has a terminal group (not shown) that comes into contact with the terminal groups 35A, 35B, 45A, 45B described later of the jig 10.
  • the jig 10 is lowered from above and supported by the upper support portion 120, so that the terminal groups 35A, 35B, 45A, 45B of the jig 10 are placed on the rectifier outside the surface treatment tank 100A (shown in the figure).
  • the surface treatment tank 100A is as shown in FIGS. 1 and 2 by the support portions 110 and 120, the jig 10 supported by the support portions 110 and 120, and the work W held by the jig 10. It is divided into a first tank 101 and a second tank 102.
  • the first tank 101 and the second tank 102 do not necessarily have to be liquidtightly sealed.
  • the surface treatment tank 100A has openings 103 and 104 below it, as shown in FIGS. 1 and 2.
  • the opening 103 is formed so as to face the first tank
  • the opening 104 is formed so as to face the second tank 102.
  • the plating liquid 2 adjusted from the upper opening is supplied to the surface treatment tank 100A, and is discharged from the openings 103 and 104.
  • the discharged plating solution 2 is repeatedly supplied to the surface treatment tank 100A after being adjusted by filter treatment, replenishment of each main component, and the like.
  • the plating liquid 2 may be supplied from the openings 103 and 104, and for example, the overflowing plating liquid may be discharged.
  • the surface treatment tank 100A has an anode portion, for example, a first anode box 140 and a second anode box 150, which face the front surface WF and the back surface WB of the work W, respectively.
  • the first anode box 140 holds the first anode 142 facing the front surface WF of the work W
  • the second anode box 150 holds the second anode 152 facing the back surface WB of the work W.
  • at least one rectifier is connected to the first anode 142 and the second anode 152, and the work W is set to the cathode via the jig 10.
  • the surface treatment tank 100A has liquid ejection members 200 (200A and 200B) between the work W and the anodes 142 and 152.
  • the liquid ejection members 200 (200A and 200B) are moved in the reciprocating direction parallel to the main surfaces WF and WB of the work W. Details of the liquid ejection members 200 (200A and 200B) will be described later.
  • Work Work W is, for example, a rectangular circuit board, and is plated with copper, for example, by the electrolytic plating device 1.
  • the circuit board W can have via holes on the front surface WF and / or the back surface WB , and can have through holes penetrating the front surface WF and the back surface WB . In this case, the inner walls of the via hole and the through hole are also plated. Further, the work W may have significantly different plating areas on the front surface WF and the back surface WB .
  • the jig 10 for holding the jig work W will be described with reference to FIG. 4 which is a front view of the jig 10 and FIG. 5 which is a rear view of the jig 10.
  • the work W can be attached to and detached from the jig 10 by, for example, an automatic machine.
  • the jig 10 has a jig body 12 formed of, for example, a flat plate made of an insulating material.
  • the jig body 12 has a rectangular hole 14 having an area slightly larger than the area of the rectangular work W.
  • the work W is arranged in the hole 14.
  • the jig 10 has electrodes 15A to 15D shown in FIG. 4 and electrodes 15E to 15H shown in FIG. 5 along four sides around the rectangular hole 14.
  • the clamper 20 clamps the work W by sandwiching it from the front and back sides.
  • the clamper 20 includes a clamper 21 that clamps the upper edge of the work W, a clamper 22 that clamps the left edge of the work W, and a clamper that clamps the lower edge of the work W. 23 and a clamper 24 for clamping the right edge of the work W can be included.
  • the clamper 21 includes a clamp piece 31 (FIG. 4) that comes into contact with the front surface WF of the work W and a clamp piece 41 (FIG.
  • the clamp piece 31 and the clamp piece 41 are electrically insulated from each other.
  • the clamper 22 includes electrically isolated clamp pieces 32, 42
  • the clamper 23 includes electrically insulated clamp pieces 33, 43
  • the clamper 24 is an electrically isolated clamp piece 34, Including 44.
  • the clamp piece 31 has an electrode 15A
  • the clamp piece 32 has an electrode 15B
  • the clamp piece 33 has an electrode 15C
  • the clamp piece 34 has an electrode 15D
  • the clamp piece 41 has an electrode 15E
  • the clamp piece 42 has an electrode 15H.
  • the clamp piece 43 is electrically connected to the electrode 15G
  • the clamp piece 44 is electrically connected to the electrode 15F.
  • the clamp pieces 31 to 34 and 41 to 44 are insulated from each other, so that different currents can flow from the front and back sides of the work W and from each of the four sides of the front and back sides.
  • conductive patterns 31A, 32A1, 32A2, 33A, 31B, 33B, 34B1, 34B2 electrically connected to the clamper 20 are formed on the jig main body 12 of the insulating material. ..
  • the clamp piece 31L of the clamper 21L in the left region of the plurality of clampers 21 is connected to the conductive pattern 31A via the electrode 15A.
  • the clamp piece 32U of the clamper 22U in the upper region of the plurality of clampers 22 is connected to the conductive pattern 32A1 via the electrode 15B.
  • the clamp piece 32L of the clamper 22L in the lower region of the plurality of clampers 22 is connected to the conductive pattern 32A2 via the electrode 15B.
  • the clamp piece 33L of the clamper 23L in the left region of the plurality of clampers 23 is connected to the conductive pattern 33A via the electrode 15C.
  • These conductive patterns 31A, 32A1, 32A2, 33A are connected to, for example, the terminal group 35A formed on the protruding portion 16A protruding in the width direction at the upper part of the jig main body 12 via, for example, the wiring 36A.
  • the clamp piece 31R of the clamper 21R in the right region of the plurality of clampers 21 is connected to the conductive pattern 31B via the electrode 15A.
  • the clamp piece 34U of the clamper 24U in the upper region of the plurality of clampers 24 is connected to the conductive pattern 34B2 via the electrode 15D.
  • the clamp piece 34L of the clamper 24L in the lower region of the plurality of clampers 24 is connected to the conductive pattern 34B1 via the electrode 15D.
  • the clamp piece 33R of the clamper 23R in the right region of the plurality of clampers 23 is connected to the conductive pattern 33B via the electrode 15C.
  • These conductive patterns 31B, 33B, 34B1, 34B2 are connected to, for example, the terminal group 35B formed on the protruding portion 16B protruding in the width direction at the upper part of the jig main body 12 via, for example, the wiring 36B.
  • the surface WF of the rectangular work W can be independently controlled by a maximum of four divisions in the vertical and horizontal directions.
  • the clamp piece 41R of the clamper 21R in the right region (left region when viewed from the front surface) among the plurality of clampers 21 has a conductive pattern 41A. It is connected via the electrode 15E.
  • the clamp piece 42U of the clamper 22U in the upper region of the plurality of clampers 22 is connected to the conductive pattern 42A1 via the electrode 15H.
  • the clamp piece 42L of the clamper 22L in the lower region of the plurality of clampers 22 is connected to the conductive pattern 42A2 via the electrode 15H.
  • the clamp piece 43R of the clamper 23R in the right region (left region when viewed from the surface) of the plurality of clampers 23 is connected to the conductive pattern 43A via the electrode 15G.
  • These conductive patterns 41A, 42A1, 42A2, 43A are connected to the terminal group 45A formed on the protruding portion 16A of the jig main body 12 via, for example, wiring 37A.
  • the clamp piece 41L of the clamper 21L in the left region of the plurality of clampers 21 is connected to the conductive pattern 41B via the electrode 15E.
  • the clamp piece 44U of the clamper 24U in the upper region of the plurality of clampers 24 is connected to the conductive pattern 44B1 via the electrode 15F.
  • the clamp piece 44L of the clamper 24L in the lower region of the plurality of clampers 24 is connected to the conductive pattern 44B2 via the electrode 15F.
  • the clamp piece 43 of the clamper 23 in the left region of the plurality of clampers 23 is connected to the conductive pattern 43B via the electrode 15G.
  • These conductive patterns 41B, 43B, 44B1, 44B2 are connected to the terminal group 45B formed on the protruding portion 16B of the jig main body 12 via, for example, the wiring 37B. In this way, even on the back surface WB of the rectangular work W, the current can be independently controlled by dividing it into four parts up, down, left, and right.
  • the conductive patterns 41A, 41B, 42A1, 42A2, 43A, 43B, 44B1, 44B2 formed on the front and back surfaces of the jig 10 can be prevented from adhering to the plating by insulating coating.
  • the electrodes 15A to 15D shown in FIG. 4 and the electrodes 15E to 15H shown in FIG. 5 are arranged near the peripheral edge of the work W, and have an abnormality in the plating thickness due to the electric field concentration generated on the peripheral edge of the work W, so-called dock bone. It can function as a dummy electrode to eliminate.
  • variable position-adjustable insulators 17A-17D see Japanese Patent Application No. 2019-15827 by the applicant of the present application.
  • the clamper may be one that can hold the work W by covering a slight gap formed around the work W in the holes 14 of the jig 10. In this way, the jig 10 and the work W, and the support portions 110 and 120 of the surface treatment tank 100A, make the inside of the surface treatment tank 100A almost completely into the first tank 101 and the second tank 102 located on the front and back of the work W. Can be partitioned into.
  • a plurality of rectifiers are provided as shown in FIGS. 6 (A) to 6 ( C ) in order to independently set at least the current flowing through the front surface WF and the back surface WB of the work W. Is preferable.
  • FIG. 6A two rectifiers 300A and 300B are provided, the rectifier 300A is electrically connected to the clamp pieces 31 to 34 in contact with the front surface WF of the work W, and the rectifier 300B is the back surface WB of the work W. It is electrically connected to the clamp pieces 41 to 44 that come into contact with the clamp pieces 41 to 44.
  • the current flowing through the front surface WF and the back surface WB of the work W can be set independently.
  • the work W can adjust the current according to the plating area and the plating location even if the plating areas on the front surface WF and the back surface WB are significantly different.
  • the contact points through which the two rectifiers 300A and 300B are electrically connected to the first anode 142 and the second anode 152 are arranged at the centers of the first anode 142 and the second anode 152, for example.
  • the rectifier 310A is electrically connected to the clamp pieces 31, 32U, 34U in contact with the upper region of the surface WF of the work W
  • the rectifier 310B is the work.
  • the rectifier 310C is electrically connected to the clamp pieces 41, 42U, 44U in contact with the upper region of the back surface WB of the work W.
  • the rectifier 310D is electrically connected to the clamp pieces 43, 42L, 44L that come into contact with the lower region of the back surface WB of the work W.
  • the contacts in which the four rectifiers 310A to 310D are electrically connected to the first anode 142 and the second anode 152 are the upper region of the first anode 142, the lower region of the first anode 142, and the first.
  • the two anodes 152 are arranged so as to correspond to a total of four regions, the upper region of the anode 152 and the lower region of the second anode 152.
  • the rectifier 320A is electrically connected to the clamp pieces 31L and 32U in contact with the upper left region of the surface WF of the work W
  • the rectifier 320B is the work W.
  • the rectifier 320C is electrically connected to the clamp pieces 31R and 34U which are in contact with the upper left region of the surface WF of the work W
  • the rectifier 320C is electrically connected to the clamp pieces 32L and 33L which are in contact with the lower left region of the surface WF.
  • the rectifier 320E is electrically connected to the clamp pieces 41L, 44U in contact with the upper left region of the back surface WB of the work W.
  • the rectifier 320F is electrically connected to the clamp pieces 43L, 44L that come into contact with the lower left region of the back surface WB of the work W
  • the rectifier 320G is connected to the clamp pieces 41R, 42U that come into contact with the upper right region of the back surface WB of the work W.
  • the rectifier 320H is electrically connected to the clamp pieces 42L and 43R that come into contact with the lower right region of the back surface WB of the work W.
  • each of the front surface WF and the back surface WB of the work W independently controls the current flowing in the four regions of the upper left region, the lower left region, the upper right region and the lower right region of the work W, that is, the total of eight regions on the front and back. It becomes possible to do.
  • the contacts to which the eight rectifiers 320A to 320H are electrically connected to the first anode 142 and the second anode 152 are the upper left region, the lower left region, the upper right region and the right of the first anode 142.
  • the lower region, the upper left region of the second anode 152, the upper region of the first anode 142, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152 Arranged correspondingly. However, the front and back may be divided into more than 8 divisions in total.
  • the liquid ejection member 200 is provided between the first liquid ejection member 200A arranged between the front surface WF of the work W and the first anode 142, and between the back surface WB of the work W and the second anode 152.
  • the second liquid ejection member 200B to be arranged can be included.
  • the first liquid ejection member 200A is moved in the reciprocating direction parallel to the surface WF of the work W by the first reciprocating moving mechanism 270 (first moving mechanism) A.
  • the second liquid ejection member 200B is moved in the reciprocating direction parallel to the back surface WB of the work W by the second reciprocating moving mechanism (second moving mechanism) 270B.
  • the first and second reciprocating movement mechanisms 270A and 270B can utilize various rotary motion-reciprocating linear motion conversion mechanisms such as a slider / crank mechanism and an eccentric cam, and detailed description thereof will be omitted here.
  • one liquid ejection member 200A and 200B are provided for each of the front surface WF and the back surface WB of the work W. It is preferable that the liquid ejection members 200A and 200B are reciprocated with a movement stroke longer than the width of the work W. By doing so, the liquid ejection members 200A and 200B will not be folded back at the position where they overlap with the end portion in the width direction of the work W. Therefore, the time during which the liquid ejection member 200 is the shadow of the electric field between the cathode and the anode does not differ between both ends of the work W and positions other than both ends.
  • a plurality of liquid ejection members may be provided on each surface of the front surface WF and the back surface WB of the work W.
  • the liquid ejection member 200 (200A and 200B) has a first guide body 210 having two surfaces intersecting, for example, orthogonal to each other in the reciprocating direction, and a first guide body, for example, on both sides of the first guide body 210. It includes two sides of the body 210 and a second guide body 220 and a third guide body 230, which are arranged via a gap, respectively.
  • Each of the two adjacent guide bodies of the first to third guide bodies 210 to 230 is formed between the anodes 142 and 152 and the work W along the extending direction toward the work W, and is extended thereof.
  • Each pair of plates are arranged apart from each other in a direction intersecting the direction. As shown in FIG.
  • the first passage 201 is formed between the first pair of plate members formed by the first guide body 210 and the second guide body 220.
  • a second passage 202 is formed between the second pair of plate members formed by the first guide body 210 and the third guide body 230.
  • the first guide body 210 is formed, for example, longer than the second guide body 220 and the third guide body 230, and both ends thereof protrude from the corresponding ends of the second guide body 220 and the third guide body 230. .. Further, the end portion of the first guide body 210 facing the work W has, for example, a tapered shape.
  • the end portion of the first guide body 210 on the side close to the anode boxes 140 and 150 is fixed to the base end portion 240 extending in parallel with the work W, for example.
  • the second guide body 220 and the third guide body 230 can further have a fourth guide body 250 extending, for example, parallel to the proximal end portion 240.
  • a third passage 203 is formed between the fourth guide body 250 extending from the second guide body 220 and the base end portion 240.
  • the third passage 203 communicates with the first passage 201 and guides the processing liquid to the first passage 201.
  • a fourth passage 204 is formed between the fourth guide body 250 extending from the third guide body 230 and the base end portion 240.
  • the fourth passage 204 communicates with the second passage 202 and guides the processing liquid to the second passage 202.
  • the first guide body 210, the second guide body 220, and the third guide body 230 are connected to each other by a flat plate spacer 260 at a constant interval. As shown in FIG. 2, a plurality of spacers 260 may be provided at intervals in the height direction.
  • the first liquid ejection member 200A is connected to, for example, the first reciprocating moving mechanism 270A to which a driving force is applied by, for example, the first driving source 280A, so that the base end portion 240 thereof is connected to the reciprocating directions A and B in FIG. Will be moved to.
  • the reciprocating direction of FIG. 2 is obtained by connecting the base end portion 240 of the second liquid ejection member 200B to, for example, the second reciprocating moving mechanism 270B to which a driving force is applied by the second driving source 280B. Moved to A and B.
  • the second liquid ejection member 200B Similar to the first liquid ejection member 200A, the second liquid ejection member 200B also ejects the plating liquid toward the work W through the first passage 201 when moving in the forward movement direction A, and moves in the return direction B.
  • the plating solution is ejected toward the work W through the second passage 202. It is not always necessary to provide both the first passage 201 and the second passage 202.
  • the third passage 203 and the fourth passage 204 guide the processing liquid to a common passage between at least a pair of plate members.
  • the processing liquid may be formed by other guide bodies such as tilted or curved.
  • the treatment liquid 2 collides with the work W, the treatment liquid in the vicinity of the main surfaces WF and WB of the work W is agitated to prevent the treatment liquid from staying, and the treatment liquid is located near the anode boxes 140 and 150.
  • a fresh treatment liquid 2 rich in plating components can be supplied to the work W. Thereby, the plating process is promoted.
  • the liquid ejection member 200 (200A and 200B) can uniformly eject the treatment liquid 2 toward the work W in the vertical direction of FIG. 2, except for the spacer 260. Since the spacer 260 can be formed in the shape of a thin plate, the in-plane uniformity of the processing of the work W is not impaired.
  • the first drive source 280A and the second drive source 280B can be driven asynchronously.
  • the treatment liquid 2 is ejected toward both sides in the same region of the work W.
  • the work W has through holes penetrating on both sides, it becomes difficult for the treatment liquid 2 to pass through the through holes.
  • the positions facing the first and second liquid ejection members are always the same when the first and second liquid ejection members are moved synchronously. However, it can be made different each time by moving the first and second liquid ejection members asynchronously.
  • the liquid ejection members 200A and 200B may be moved at different speeds between the first drive source 280A and the second drive source 280B, respectively. Then, the pressure of the treatment liquid 2 acting on the work W differs between the front and back surfaces WF and WB. This pressure difference can be used to facilitate the passage of the treatment liquid through the through holes.
  • the first drive source 280A and the second drive source 280B may be driven in synchronization, or the first and second drive sources 280A and 280B may be the same drive source.
  • the surface treatment tank 100A is divided into a first tank 101 and a second tank 102 by the jig 10 holding the work W being lowered from above and mounted.
  • the first and second liquid ejection members 200A and 200B are reciprocated, the liquid flow blocked and repelled by the second and third guide bodies 220 and 230 becomes a stirring flow that agitates the entire tank. ..
  • the first liquid ejection member 200A can agitate the processing liquid in the first tank 101
  • the second liquid ejection member 200B can agitate the treatment liquid in the second tank 102, and moreover, in one of the tanks.
  • the adverse effect of stirring on the other side can be eliminated.
  • the surface treatment tank 100A can have buffer tanks 107 and 108 outside the two side wall portions 105 and 106 located at both ends in the reciprocating directions A and B.
  • the opening 105A formed in the side wall portion 105 allows the first tank 101 and the buffer tank 107 to communicate with each other.
  • the opening 105B formed in the side wall portion 105 allows the second tank 102 and the buffer tank 107 to communicate with each other.
  • the opening 106A formed in the side wall portion 106 communicates the first tank 101 and the buffer tank 108.
  • the opening 106B formed in the side wall portion 106 communicates the second tank 102 and the buffer tank 108.
  • the treatment liquid that has been pushed to each of both ends of the treatment tank 100A by the liquid ejection members 200 (200A and 200B) can be released to the buffer tanks 107 and 108.
  • the influence of the reflected wave of the processing liquid generated at both ends of the processing tank 100A can be reduced.
  • FIG. 7 is a plan view of the surface treatment apparatus according to the second embodiment of the present invention.
  • the treatment tank 100B can include a first treatment tank 100B1 and a second treatment tank 100B2 which are connected in a direction parallel to the reciprocating direction and are partitioned by the first buffer tank 109.
  • the jig holds the first jig 10A that holds the first work W1 and divides the first treatment tank 100B1 into the first tank 101 and the second tank 102, and the second treatment tank that holds the second work W2.
  • a second jig 10B for partitioning 100B2 into a first tank 101 and a second tank 102 can be included.
  • the first buffer tank 109 is the first tank 101 of the first treatment tank 100B1, the first tank 101 of the second treatment tank 100B2, the second tank 102 of the first treatment tank 100B1, and the second treatment tank.
  • the first to fourth openings 109A1, 109A2, 109B1 and 109B2 that communicate with the second tank 102 of 100B2 can be included.
  • the treatment liquid is circulated between the first tank 101 and the second tank 102 in the first treatment tank 100B1 on the outside of the first side wall portion 105 provided at one end in the reciprocating direction.
  • 2 Buffer tank 107 can be included.
  • the second treatment tank 100B2 has a third treatment liquid flowing between the first tank 101 and the second tank 102 in the second treatment tank 100B2 on the outside of the second side wall portion 106 provided at the other end in the reciprocating direction.
  • the buffer tank 108 can be included.
  • a central wall may be provided instead of the first buffer 109 tank.
  • the central wall has a first opening communicating with the first tank 101 of the first treatment tank 100B1 and the first tank 101 of the second treatment tank 100B2, and the second tank 102 of the first treatment tank 100B1.
  • the second opening for communicating with the second tank 102 of the second treatment tank 100B2 can be provided.
  • the first tank 101 and the second tank 102 cannot be communicated with each other.
  • the first jig 10A and the second jig 10B may be integrally configured. Further, the two first liquid ejection members 200A may be driven by the same drive source, and the other two second liquid ejection members 200B may be driven by the same drive source. Further, the surface treatment tank can be configured by connecting the first to Nth (N is an integer of 2 or more) treatment tanks in a broad sense. When N ⁇ 3, (N-1) partition walls are provided in parallel with the side wall portions located at both ends in the reciprocating direction.

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Abstract

A surface treatment device has treatment tanks (100A, 100B) in which a treatment liquid is stored, positive electrodes (142, 152) positioned in the treatment tanks, a jig (10) for hanging and retaining a workpiece (W) and setting the workpiece on a negative electrode, a liquid jetting member (200) positioned between the positive electrode and the workpiece, and movement mechanisms (270A, 270B) for moving the liquid jetting member relative to the workpiece. The liquid jetting member includes at least a pair of plates (210, 220, 230) formed along the extension direction toward the workpiece between the positive electrode and the workpiece and positioned apart from each other in a direction intersecting with the extension direction, and the treatment liquid flowing due to the movement of the liquid jetting member is guided between the at least a pair of plates and jetted toward the workpiece.

Description

表面処理装置Surface treatment equipment
　本発明は、ワークにメッキなどの表面処理を施す表面処理装置に関する。 The present invention relates to a surface treatment apparatus that applies surface treatment such as plating to a work.
　回路基板等のワークをメッキする装置では、特許文献１に示すように、メッキ液中に垂下されたワークに向けて、メッキ液中にて縦設されたノズル管の縦方向に沿って配列された複数のノズルよりメッキ液を噴射させている。 In a device for plating a work such as a circuit board, as shown in Patent Document 1, the work is arranged along the vertical direction of a nozzle tube vertically installed in the plating liquid toward the work hanging in the plating liquid. The plating solution is sprayed from multiple nozzles.
　回路基板や半導体ウエハ等のワークをメッキする装置では、特許文献２及び３に示すように、ノズル管に代えて、処理液を攪拌するパドルを用いている。特許文献２のパドルは攪拌棒であり、特許文献３のパドルは複数の縦長孔が貫通形成された矩形板であり、これらパドルはワークの主面と平行に往復移動される。特許文献1のノズルを特許文献２または３のパドルに設けることは、特許文献４～６に開示されている。 As shown in Patent Documents 2 and 3, in a device for plating a workpiece such as a circuit board or a semiconductor wafer, a paddle for stirring a processing liquid is used instead of a nozzle tube. The paddle of Patent Document 2 is a stirring rod, and the paddle of Patent Document 3 is a rectangular plate having a plurality of vertically elongated holes formed through the paddle, and these paddles are reciprocated in parallel with the main surface of the work. It is disclosed in Patent Documents 4 to 6 that the nozzle of Patent Document 1 is provided in the paddle of Patent Document 2 or 3.
特開２０１２－０４６７８２号公報（図５）Japanese Unexamined Patent Publication No. 2012-046782 (Fig. 5) 特開２００６―０４１１７２号公報（図１－５）Japanese Unexamined Patent Publication No. 2006-041172 (Fig. 1-5) 特開２０１４－１８５３７５号公報（図１、３－４、６）Japanese Unexamined Patent Publication No. 2014-185375 (FIGS. 1, 3-4, 6) 特開２００４－１６１２９号公報（図１－４）Japanese Unexamined Patent Publication No. 2004-16129 (Fig. 1-4) 特開昭５６－４２９７６号公報（図１－３）Japanese Unexamined Patent Publication No. 56-42776 (Fig. 1-3) 特開平１０－８８３９７号公報（図１－２）Japanese Unexamined Patent Publication No. 10-88397 (Fig. 1-2)
　しかし、特許文献１のノズル管はワークの幅方向で間隔をあけて配置され、しかも、各ノズル管には縦方向で間隔をあけてノズルが配置されるので、ワークに均一にメッキ液を吐出することが困難である。一方、特許文献２のパドルはメッキ液を撹拌するだけである。特許文献４～６では、液噴射ポンプで圧送される処理液が、移動するパドルからワークに向けて噴出されるが、ノズルの位置に依存して処理の面内均一性が改善されないことは特許文献１と同様である。しかも、特許文献４～６ではパドルを移動するため駆動源に加え液噴射ポンプも必要となる。 However, since the nozzle tubes of Patent Document 1 are arranged at intervals in the width direction of the work and the nozzles are arranged at intervals in the vertical direction in each nozzle tube, the plating solution is uniformly discharged to the work. It is difficult to do. On the other hand, the paddle of Patent Document 2 only stirs the plating solution. In Patent Documents 4 to 6, the processing liquid pumped by the liquid injection pump is ejected from the moving paddle toward the work, but it is patented that the in-plane uniformity of the processing is not improved depending on the position of the nozzle. It is the same as Document 1. Moreover, in Patent Documents 4 to 6, since the paddle is moved, a liquid injection pump is required in addition to the drive source.
　本発明は、液噴射ポンプを要することなく、ワークに向けて噴出される処理液の面内不均一性を低減して、ワークの表面処理の面内均一性を高め、しかもスループットを高めることができる表面処理装置を提供することを目的とする。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to reduce the in-plane non-uniformity of the treatment liquid ejected toward the work, improve the in-plane uniformity of the surface treatment of the work, and increase the throughput without requiring a liquid injection pump. It is an object of the present invention to provide a surface treatment apparatus capable of capable.
　（１）本発明の一態様は、
　処理液が収容される処理槽と、
　前記処理槽内に配置される陽極と、
　前記処理液に浸漬されるワークを垂下させて保持し、かつ、前記ワークを陰極に設定する治具と、
　前記陽極と前記ワークとの間で前記処理液中に配置される液噴出部材と、
　前記液噴出部材を、前記ワークに対して移動させる移動機構と、
を有し、
　前記液噴出部材は、前記陽極と前記ワークとの間で前記ワークに向かう延在方向に沿って形成され、かつ、前記延在方向と交差する方向で離間して配置される少なくとも一対の板材を含み、前記液噴出部材の移動により流動する前記処理液を、前記少なくとも一対の板材間で案内して前記ワークに向けて噴出させる表面処理装置に関する。 (1) One aspect of the present invention is
A treatment tank that houses the treatment liquid and
With the anode arranged in the processing tank,
A jig that hangs and holds the work immersed in the treatment liquid and sets the work as the cathode.
A liquid ejection member arranged in the processing liquid between the anode and the work, and
A moving mechanism for moving the liquid ejection member with respect to the work,
Have,
The liquid ejection member comprises at least a pair of plate members formed between the anode and the work along the extending direction toward the work and arranged apart from each other in a direction intersecting the extending direction. The present invention relates to a surface treatment apparatus that guides the treatment liquid, which is contained and flows due to the movement of the liquid ejection member, between at least a pair of plate materials and ejects the treatment liquid toward the work.
　本発明の一態様によれば、処理液中に垂下されるワークに対して液噴出部材を移動することで、ノズル管を用いずに、ワークに向けて処理液を噴射することができる。つまり、液噴出部材の移動により処理槽内で流動する処理液を、少なくとも一対の板材間で案内して前記ワークに向けて噴出させる。それにより、処理液がワークと衝突することで、陽極付近にある表面処理成分が豊富なフレッシュな処理液をワークに供給することができ、スループットが向上する。また、移動される液噴出部材の少なくとも一対の板材間により処理液をワークに噴出できるので、ノズル管の複数のノズルから処理液を噴出させるものと比較して、ワーク面内の処理の均一性が向上する。 According to one aspect of the present invention, by moving the liquid ejection member with respect to the work hanging in the treatment liquid, the treatment liquid can be ejected toward the work without using a nozzle tube. That is, the processing liquid flowing in the processing tank due to the movement of the liquid ejection member is guided between at least a pair of plate materials and ejected toward the work. As a result, the treatment liquid collides with the work, so that a fresh treatment liquid having abundant surface treatment components near the anode can be supplied to the work, and the throughput is improved. Further, since the treatment liquid can be ejected to the work by at least a pair of plates of the liquid ejection member to be moved, the uniformity of the treatment in the work surface is compared with the one in which the treatment liquid is ejected from a plurality of nozzles of the nozzle tube. Is improved.
　（２）本発明の一態様（１）では、
　前記移動機構は、前記ワークと平行な往復方向に前記液噴出部材を移動させ、
　前記液噴出部材は、
　前記往復方向と交差する二面を有する第１ガイド体と、
　前記第１ガイド体の前記二面とそれぞれ間隙を介して配置される第２ガイド体及び第３ガイド体と、
を含み、
　前記少なくとも一対の板材は、
　前記第１ガイド体と前記第２ガイド体とで形成される第１の一対の板材と、
　前記第１ガイド体と前記第３ガイド体とで形成される第２の一対の板材と、を含み、
　前記液噴出部材が前記往復方向のうちの往動方向に移動する時に、前記第１ガイド体で堰き止められる処理液を、前記第１の一対の板材間に沿って案内して、前記ワークに向けて噴出させ、
　前記液噴出部材が前記往復方向のうちの復動方向に移動する時に、前記第１ガイド体で堰き止められる処理液を、前記第２の一対の板材間に沿って案内して、前記ワークに向けて噴出させる表面処理装置に関する。 (2) In one aspect (1) of the present invention,
The moving mechanism moves the liquid ejection member in a reciprocating direction parallel to the work.
The liquid ejection member is
A first guide body having two surfaces intersecting the reciprocating direction,
A second guide body and a third guide body arranged via a gap between the two surfaces of the first guide body and the third guide body, respectively.
Including
The at least pair of plate materials
A first pair of plate materials formed by the first guide body and the second guide body, and
A second pair of plate members formed by the first guide body and the third guide body is included.
When the liquid ejection member moves in the forward movement direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along the pair of the first plate members to the work. Squirt towards
When the liquid ejection member moves in the return direction of the reciprocating direction, the treatment liquid dampened by the first guide body is guided along between the second pair of plate members to the work. It relates to a surface treatment device that ejects toward.
　こうすると、液噴出部材の例えば往動時には第１、第２ガイド体で形成される第１の一対の板材間に沿って案内される処理液がワークに噴出され、液噴出部材の例えば復動時には第１、第３ガイド体で形成される第２の一対の板材間に沿って案内される処理液がワークに噴出される。 Then, for example, when the liquid ejecting member moves forward, the processing liquid guided along between the first pair of plate members formed by the first and second guide bodies is ejected to the work, and the liquid ejecting member, for example, is restored. Occasionally, a treatment liquid guided along between the second pair of plate members formed by the first and third guide bodies is ejected onto the work.
　（３）本発明の一態様（２）では、前記陽極は、前記ワークの両側に配置される第１陽極及び第２陽極を含むことができ、前記液噴出部材は、前記第１陽極と前記ワークとの間に配置される第１液噴出部材と、前記第２陽極と前記ワークとの間に配置される第２液噴出部材と、を含むことができ、前記移動機構は、前記第１液噴出部材を移動する第１移動機構と、前記第２液噴出部材を移動する第２移動機構と、を含むことができる。こうして、ワークの両面を処理することができる。 (3) In one aspect (2) of the present invention, the anode can include a first anode and a second anode arranged on both sides of the work, and the liquid ejection member includes the first anode and the above. The first liquid ejection member arranged between the work and the second liquid ejection member arranged between the second anode and the work can be included, and the moving mechanism can include the first liquid ejection member. A first moving mechanism for moving the liquid ejection member and a second moving mechanism for moving the second liquid ejection member can be included. In this way, both sides of the work can be processed.
　（４）本発明の一態様（３）では、前記第１移動機構に駆動力を付与する第１駆動源と、前記第２移動機構に駆動力を付与する第２駆動源とをさらに有し、前記第１液噴出部材と前記第２液噴出部材とは非同期で駆動されても良い。第１、第２液噴出部材がワークを挟んで正対すると、ワークの同一領域にてその両面に向けて処理液が噴出されることになる。ワークが両面に貫通するスルーホールを有する場合、処理液がスルーホールを通り抜け難くなる。第１、第２液噴出部材の一往復移動中において第１、第２液噴出部材が正対する位置は、第１、第２液噴出部材を同期して移動させるとワークに対して常に同じになるが、第１、第２液噴出部材を非同期で移動させることでワークに対して毎回異ならせることができる。これにより、処理液がスルーホールを通り抜け易くなる。 (4) In one aspect (3) of the present invention, the first drive source for applying a driving force to the first moving mechanism and the second driving source for applying a driving force to the second moving mechanism are further provided. The first liquid ejection member and the second liquid ejection member may be driven asynchronously. When the first and second liquid ejection members face each other with the work sandwiched between them, the treatment liquid is ejected toward both sides of the same region of the work. When the work has through holes penetrating on both sides, it becomes difficult for the treatment liquid to pass through the through holes. During one reciprocating movement of the first and second liquid ejection members, the positions facing the first and second liquid ejection members are always the same with respect to the work when the first and second liquid ejection members are moved synchronously. However, by moving the first and second liquid ejection members asynchronously, the work can be made different each time. This makes it easier for the treatment liquid to pass through the through holes.
　（５）本発明の一態様（３）または（４）では、前記処理槽は、前記ワークを保持した前記治具が前記処理槽の上方から降下されて装着されることで、第１槽と第２槽とに区画されても良い。こうして、第１液噴出部材は第１槽内の処理液を撹拌し、第２液噴出部材は第２槽内の処理液を撹拌することができ、しかも、一方の槽での撹拌が他方の槽に与える悪影響を排除できる。 (5) In one aspect (3) or (4) of the present invention, the processing tank is attached to the first tank by the jig holding the work being lowered from above the processing tank and mounted. It may be partitioned into a second tank. In this way, the first liquid ejection member can agitate the treatment liquid in the first tank, the second liquid ejection member can agitate the treatment liquid in the second tank, and the stirring in one tank is the other. The adverse effect on the tank can be eliminated.
　（６）本発明の一態様（５）では、前記処理槽は、前記往復方向で両端に位置する２つの側壁部の外側に、前記第１槽及び前記第２槽に連通して前記処理液を収容するバッファ槽をそれぞれ含むことができる。こうすると、第１液噴出部材及び第２液噴出部材によって処理槽の両端に押し寄せられた処理液をバッファ槽に逃がすことができる。こうして、処理槽の両端にて発生する処理液の反射波の影響を低減できる。また、バッファ槽を介して、第１槽と第２槽との間での処理液の流通を確保することもできる。 (6) In one aspect (5) of the present invention, the treatment tank communicates with the first tank and the second tank on the outside of two side wall portions located at both ends in the reciprocating direction, and the treatment liquid. Can each include a buffer tank for accommodating. By doing so, the processing liquid that has been pushed to both ends of the processing tank by the first liquid ejection member and the second liquid ejection member can be released to the buffer tank. In this way, the influence of the reflected wave of the treatment liquid generated at both ends of the treatment tank can be reduced. Further, it is also possible to secure the flow of the treatment liquid between the first tank and the second tank via the buffer tank.
　（７）本発明の一態様（５）では、前記処理槽は、前記往復方向と平行な方向で連結され、かつ、第１バッファ槽により区画される第１処理槽と第２処理槽とを含むことができる。前記治具は、第１ワークを保持して前記第１処理槽を前記第１槽と前記第２槽とに区画する第１治具と、第２ワークを保持して前記第２処理槽を前記第１槽と前記第２槽とに区画する第２治具と、を含むことができる。前記第１バッファ槽は、前記第１処理槽の前記第１槽と、前記第２処理槽の前記第１槽と、前記第１処理槽の前記第２槽と、前記第２処理槽の前記第２槽との間で前記処理液を流通させることができる。前記第１処理槽は、前記往復方向の一端に位置する第１側壁部の外側に、前記第１処理槽中の前記第１槽及び前記第２槽の間で前記処理液を流通させる第２バッファ槽を含むことができる。前記第２処理槽は、前記往復方向の他端に位置する第２側壁部の外側に、前記第２処理槽中の前記第１槽及び前記第２槽の間で前記処理液を流通させる第３バッファ槽を含むことができる。こうして、第１ワーク及び第２ワークを同時に処理することができ、その際に、本発明の一実施形態（６）と同様の作用・効果を奏することができる。 (7) In one aspect (5) of the present invention, the treatment tank is connected to the reciprocating direction in a direction parallel to the reciprocating direction, and the first treatment tank and the second treatment tank are partitioned by the first buffer tank. Can include. The jig holds the first work and divides the first treatment tank into the first tank and the second tank, and holds the second work and holds the second treatment tank. A second jig for partitioning the first tank and the second tank can be included. The first buffer tank includes the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second treatment tank. The treatment liquid can be circulated with the second tank. In the first treatment tank, the treatment liquid is circulated between the first tank and the second tank in the first treatment tank on the outside of the first side wall portion located at one end in the reciprocating direction. It can include a buffer tank. In the second treatment tank, the treatment liquid is circulated between the first tank and the second tank in the second treatment tank on the outside of the second side wall portion located at the other end in the reciprocating direction. 3 buffer tanks can be included. In this way, the first work and the second work can be processed at the same time, and at that time, the same actions and effects as those of the embodiment (6) of the present invention can be obtained.
本発明の第１実施形態に係る表面処理装置の平面図である。It is a top view of the surface treatment apparatus which concerns on 1st Embodiment of this invention. 表面処理装置の断面図である。It is sectional drawing of the surface treatment apparatus. 液噴出部材の構造及び動作を説明するための図である。It is a figure for demonstrating the structure and operation of the liquid ejection member. 治具の正面図である。It is a front view of a jig. 治具の背面図である。It is a rear view of a jig. 図６（Ａ）～図６（Ｃ）は、それぞれは整流器とクランパーとの関係を示す図である。6 (A) to 6 (C) are diagrams showing the relationship between the rectifier and the clamper, respectively. 本発明の第２実施形態に係る表面処理装置の平面図である。It is a top view of the surface treatment apparatus which concerns on 2nd Embodiment of this invention.
　以下の開示において、提示された主題の異なる特徴を実施するための多くの異なる実施形態や実施例を提供する。もちろんこれらは単なる例であり、限定的であることを意図するものではない。さらに、本開示では、様々な例において参照番号および／または文字を反復している場合がある。このように反復するのは、簡潔明瞭にするためであり、それ自体が様々な実施形態および／または説明されている構成との間に関係があることを必要とするものではない。さらに、第１の要素が第２の要素に「接続されている」または「連結されている」と記述するとき、そのような記述は、第１の要素と第２の要素とが互いに直接的に接続または連結されている実施形態を含むとともに、第１の要素と第２の要素とが、その間に介在する１以上の他の要素を有して互いに間接的に接続または連結されている実施形態も含む。また、第１の要素が第２の要素に対して「移動する」と記述するとき、そのような記述は、第１の要素及び第２の要素の少なくとも一方が他方に対して移動する相対的な移動の実施形態を含む。 The following disclosures provide many different embodiments and examples for implementing the different features of the presented subject matter. Of course, these are just examples and are not intended to be limited. In addition, the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for brevity and clarity and does not itself require a connection to the various embodiments and / or the configurations described. Further, when the first element is described as "connected" or "connected" to the second element, such a description is such that the first element and the second element are directly connected to each other. An embodiment in which the first element and the second element are indirectly connected or connected to each other with one or more other elements intervening between them, including embodiments connected or connected to. Including morphology. Also, when the first element is described as "moving" with respect to the second element, such a description is relative to the movement of at least one of the first element and the second element with respect to the other. Includes embodiments of various movements.
　１．第１実施形態
　図１は、本実施形態に係る表面処理装置例えば電解メッキ装置の概略図である。電解メッキ装置１は、ワークＷを保持する平板状の治具１０と、この治具１０が設置される表面処理槽１００Ａと、を有する。ワークＷは、表裏の関係にある第１主面（例えば表面）ＷＦ及び第２主面（例えば裏面）ＷＢの少なくとも一方を被処理面とし、本実施形態では双方を被処理面としている。 1. 1. 1st Embodiment FIG. 1 is a schematic diagram of a surface treatment apparatus, for example, an electrolytic plating apparatus according to the present embodiment. The electroplating apparatus 1 has a flat plate-shaped jig 10 for holding the work W and a surface treatment tank 100A in which the jig 10 is installed. In the work W, at least one of the first main surface (for example, the front surface) WF and the second main surface (for example, the back surface) WB , which are in a front-to-back relationship, is a surface to be processed, and in the present embodiment, both are surfaces to be processed. ..
　１．１．表面処理槽
　図１及び図２において、処理液例えばメッキ液２が収容される表面処理槽１００Ａは、ワークＷを垂直状態で保持する治具１０を着脱自在に支持する支持部１１０、１２０を有する。下部支持部１１０は、治具１０の下端部が挿入されるスリットを有する。上部支持部１２０も、治具１０の側縁部が挿入されるスリットを有する。治具１０は、表面処理槽１００Ａの上部開口から降下されて、支持部１１０、１２０により垂直状態で保持される。上部支持部１２０は、治具１０の後述する端子群３５Ａ，３５Ｂ，４５Ａ，４５Ｂと接触する端子群（図示せず）を有する。それにより、治具１０が上方より降下されて上部支持部１２０に支持されることで、治具１０の端子群３５Ａ，３５Ｂ，４５Ａ，４５Ｂを、表面処理槽１００Ａの外部にある整流器（図示せず）に接続することができる。ここで、支持部１１０、１２０と、その支持部１１０、１２０に支持される治具１０と、治具１０に保持されるワークＷとにより、表面処理槽１００Ａが図１及び図２に示すように第１槽１０１及び第２槽１０２に区画される。なお、第１槽１０１及び第２槽１０２は、必ずしも液密にシールされる必要はない。表面処理槽１００Ａは、その下部に、図１及び図２に示すように、開口１０３、１０４を有する。開口１０３は第１槽に臨んで形成され、開口１０４は第２槽１０２に臨んで形成される。表面処理槽１００Ａには、例えば上部開口から調整されたメッキ液２が供給され、開口１０３、１０４から排出される。排出されたメッキ液２は、フィルター処理、各主成分の補充等により調整された後に表面処理槽１００Ａに繰り返し供給される。なお、メッキ液２は、開口１０３、１０４から供給され、例えばオーバーフローしたメッキ液を排出しても良い。 1.1. Surface treatment tank In FIGS. 1 and 2, the surface treatment tank 100A in which the treatment liquid, for example, the plating liquid 2 is housed, has support portions 110 and 120 that detachably support the jig 10 for holding the work W in a vertical state. .. The lower support portion 110 has a slit into which the lower end portion of the jig 10 is inserted. The upper support portion 120 also has a slit into which the side edge portion of the jig 10 is inserted. The jig 10 is lowered from the upper opening of the surface treatment tank 100A and is held in a vertical state by the support portions 110 and 120. The upper support portion 120 has a terminal group (not shown) that comes into contact with the terminal groups 35A, 35B, 45A, 45B described later of the jig 10. As a result, the jig 10 is lowered from above and supported by the upper support portion 120, so that the terminal groups 35A, 35B, 45A, 45B of the jig 10 are placed on the rectifier outside the surface treatment tank 100A (shown in the figure). Can be connected to. Here, the surface treatment tank 100A is as shown in FIGS. 1 and 2 by the support portions 110 and 120, the jig 10 supported by the support portions 110 and 120, and the work W held by the jig 10. It is divided into a first tank 101 and a second tank 102. The first tank 101 and the second tank 102 do not necessarily have to be liquidtightly sealed. The surface treatment tank 100A has openings 103 and 104 below it, as shown in FIGS. 1 and 2. The opening 103 is formed so as to face the first tank, and the opening 104 is formed so as to face the second tank 102. For example, the plating liquid 2 adjusted from the upper opening is supplied to the surface treatment tank 100A, and is discharged from the openings 103 and 104. The discharged plating solution 2 is repeatedly supplied to the surface treatment tank 100A after being adjusted by filter treatment, replenishment of each main component, and the like. The plating liquid 2 may be supplied from the openings 103 and 104, and for example, the overflowing plating liquid may be discharged.
　表面処理槽１００Ａは、図１及び図２に示すように、ワークＷの表面ＷＦ及び裏面ＷＢとそれぞれ対向する陽極部例えば第１陽極ボックス１４０及び第２陽極ボックス１５０を有する。第１陽極ボックス１４０はワークＷの表面ＷＦと対向する第１陽極１４２を保持し、第２陽極ボックス１５０はワークＷの裏面ＷＢと対向する第２陽極１５２を保持する。電解メッキを実施するために、少なくとも一つの整流器は、第１陽極１４２及び第２陽極１５２に接続され、かつ、治具１０を介してワークＷを陰極に設定する。 As shown in FIGS. 1 and 2, the surface treatment tank 100A has an anode portion, for example, a first anode box 140 and a second anode box 150, which face the front surface WF and the back surface WB of the work W, respectively. The first anode box 140 holds the first anode 142 facing the front surface WF of the work W, and the second anode box 150 holds the second anode 152 facing the back surface WB of the work W. To perform electroplating, at least one rectifier is connected to the first anode 142 and the second anode 152, and the work W is set to the cathode via the jig 10.
　表面処理槽１００Ａは、図１及び図２に示すように、ワークＷと陽極１４２，１５２との間に液噴出部材２００（２００Ａ及び２００Ｂ）を有する。液噴出部材２００（２００Ａ及び２００Ｂ）は、ワークＷの主面ＷＦ，ＷＢと平行な往復方向に移動される。液噴出部材２００（２００Ａ及び２００Ｂ）の詳細については後述する。 As shown in FIGS. 1 and 2, the surface treatment tank 100A has liquid ejection members 200 (200A and 200B) between the work W and the anodes 142 and 152. The liquid ejection members 200 (200A and 200B) are moved in the reciprocating direction parallel to the main surfaces WF and WB of the work W. Details of the liquid ejection members 200 (200A and 200B) will be described later.
　１．２．ワーク
　ワークＷは例えば矩形の回路基板であり、電解メッキ装置１により例えば銅メッキされる。ただし、メッキの種類は問わない。回路基板Ｗは、表面ＷＦ及び／又は裏面ＷＢにビアホールを有することができ、表面ＷＦ及び裏面ＷＢに貫通するスルーホールを有することができる。この場合、ビアホール及びスルーホールの内壁もメッキされる。また、ワークＷは、表面ＷＦ及び裏面ＷＢでの各メッキ面積が大きく異なっても良い。 1.2. Work Work W is, for example, a rectangular circuit board, and is plated with copper, for example, by the electrolytic plating device 1. However, the type of plating does not matter. The circuit board W can have via holes on the front surface WF and / or the back surface WB , and can have through holes penetrating the front surface WF and the back surface WB . In this case, the inner walls of the via hole and the through hole are also plated. Further, the work W may have significantly different plating areas on the front surface WF and the back surface WB .
　１．３．治具
　ワークＷを保持する治具１０を、治具１０の正面図である図４と、治具１０の背面図である図５を用いて説明する。治具１０へのワークＷの着脱は、例えば自動機により行うことができる。治具１０は、例えば絶縁材から成る平板で形成される治具本体１２を有する。治具本体１２は、矩形ワークＷの面積よりもわずかに大きい面積の矩形の穴１４を有する。ワークＷは、穴１４に配置される。治具１０は、矩形の穴１４の周囲４辺に沿って、図４に示す電極１５Ａ～１５Ｄ及び図５に示す電極１５Ｅ～１５Ｈを有する。これら電極１５Ａ～１５Ｈは互いに絶縁される。各電極１５Ａ～１５Ｈには、複数のクランパー２０が保持される。クランパー２０は、ワークＷをその表裏から挟んでクランプする。クランパー２０は、図４及び図５に示すように、ワークＷの上縁部をクランプするクランパー２１と、ワークＷの左側縁部をクランプするクランパー２２と、ワークＷの下縁部をクランプするクランパー２３と、ワークＷの右側縁部をクランプするクランパー２４とを含むことができる。ここで、クランパー２１は、ワークＷの表面ＷＦと接触するクランプ片３１（図４）と、ワークＷの裏面ＷＢと接触するクランプ片４１（図５）とを含む。本実施形態では、クランプ片３１とクランプ片４１とは電気的に絶縁される。同様に、クランパー２２は電気的に絶縁されたクランプ片３２、４２を含み、クランパー２３は電気的に絶縁されたクランプ片３３、４３を含み、クランパー２４は電気的に絶縁されたクランプ片３４、４４を含む。また、クランプ片３１は電極１５Ａと、クランプ片３２は電極１５Ｂと、クランプ片３３は電極１５Ｃと、クランプ片３４は電極１５Ｄと、クランプ片４１は電極１５Ｅと、クランプ片４２は電極１５Ｈと、クランプ片４３は電極１５Ｇと、クランプ片４４は電極１５Ｆと、それぞれ導通している。こうして、クランプ片３１～３４及び４１～４４は互いに絶縁されることにより、ワークＷの表裏で異なり、かつ、表裏の各々４辺から異なる電流を流すことができる。 1.3. The jig 10 for holding the jig work W will be described with reference to FIG. 4 which is a front view of the jig 10 and FIG. 5 which is a rear view of the jig 10. The work W can be attached to and detached from the jig 10 by, for example, an automatic machine. The jig 10 has a jig body 12 formed of, for example, a flat plate made of an insulating material. The jig body 12 has a rectangular hole 14 having an area slightly larger than the area of the rectangular work W. The work W is arranged in the hole 14. The jig 10 has electrodes 15A to 15D shown in FIG. 4 and electrodes 15E to 15H shown in FIG. 5 along four sides around the rectangular hole 14. These electrodes 15A to 15H are insulated from each other. A plurality of clampers 20 are held in each of the electrodes 15A to 15H. The clamper 20 clamps the work W by sandwiching it from the front and back sides. As shown in FIGS. 4 and 5, the clamper 20 includes a clamper 21 that clamps the upper edge of the work W, a clamper 22 that clamps the left edge of the work W, and a clamper that clamps the lower edge of the work W. 23 and a clamper 24 for clamping the right edge of the work W can be included. Here, the clamper 21 includes a clamp piece 31 (FIG. 4) that comes into contact with the front surface WF of the work W and a clamp piece 41 (FIG. 5) that comes into contact with the back surface WB of the work W. In the present embodiment, the clamp piece 31 and the clamp piece 41 are electrically insulated from each other. Similarly, the clamper 22 includes electrically isolated clamp pieces 32, 42, the clamper 23 includes electrically insulated clamp pieces 33, 43, and the clamper 24 is an electrically isolated clamp piece 34, Including 44. Further, the clamp piece 31 has an electrode 15A, the clamp piece 32 has an electrode 15B, the clamp piece 33 has an electrode 15C, the clamp piece 34 has an electrode 15D, the clamp piece 41 has an electrode 15E, and the clamp piece 42 has an electrode 15H. The clamp piece 43 is electrically connected to the electrode 15G, and the clamp piece 44 is electrically connected to the electrode 15F. In this way, the clamp pieces 31 to 34 and 41 to 44 are insulated from each other, so that different currents can flow from the front and back sides of the work W and from each of the four sides of the front and back sides.
　絶縁材の治具本体１２には、図４及び図５に示すように、クランパー２０と電気的に接続される導電パターン３１Ａ，３２Ａ１，３２Ａ２，３３Ａ，３１Ｂ，３３Ｂ，３４Ｂ１，３４Ｂ２が形成される。治具本体１２の表面の左領域では、図４に示すように、複数のクランパー２１のうち左領域にあるクランパー２１Ｌのクランプ片３１Ｌは、電極１５Ａを介して導電パターン３１Ａと接続される。複数のクランパー２２のうち上領域にあるクランパー２２Ｕのクランプ片３２Ｕは、電極１５Ｂを介して導電パターン３２Ａ１と接続される。複数のクランパー２２のうち下領域にあるクランパー２２Ｌのクランプ片３２Ｌは、電極１５Ｂを介して導電パターン３２Ａ２と接続される。複数のクランパー２３のうち左領域にあるクランパー２３Ｌのクランプ片３３Ｌは、電極１５Ｃを介して導電パターン３３Ａと接続される。これらの導電パターン３１Ａ，３２Ａ１，３２Ａ２，３３Ａは、例えば治具本体１２の上部にて幅方向に突出する突出部１６Ａに形成された端子群３５Ａと、例えば配線３６Ａを介して接続される。 As shown in FIGS. 4 and 5, conductive patterns 31A, 32A1, 32A2, 33A, 31B, 33B, 34B1, 34B2 electrically connected to the clamper 20 are formed on the jig main body 12 of the insulating material. .. In the left region of the surface of the jig body 12, as shown in FIG. 4, the clamp piece 31L of the clamper 21L in the left region of the plurality of clampers 21 is connected to the conductive pattern 31A via the electrode 15A. The clamp piece 32U of the clamper 22U in the upper region of the plurality of clampers 22 is connected to the conductive pattern 32A1 via the electrode 15B. The clamp piece 32L of the clamper 22L in the lower region of the plurality of clampers 22 is connected to the conductive pattern 32A2 via the electrode 15B. The clamp piece 33L of the clamper 23L in the left region of the plurality of clampers 23 is connected to the conductive pattern 33A via the electrode 15C. These conductive patterns 31A, 32A1, 32A2, 33A are connected to, for example, the terminal group 35A formed on the protruding portion 16A protruding in the width direction at the upper part of the jig main body 12 via, for example, the wiring 36A.
　治具本体１２の表面の右領域では、図４に示すように、複数のクランパー２１のうち右領域にあるクランパー２１Ｒのクランプ片３１Ｒは、電極１５Ａを介して導電パターン３１Ｂと接続される。複数のクランパー２４のうち上領域にあるクランパー２４Ｕのクランプ片３４Ｕは、電極１５Ｄを介して導電パターン３４Ｂ２と接続される。複数のクランパー２４のうち下領域にあるクランパー２４Ｌのクランプ片３４Ｌは、電極１５Ｄを介して導電パターン３４Ｂ１と接続される。複数のクランパー２３のうち右領域にあるクランパー２３Ｒのクランプ片３３Ｒは、電極１５Ｃを介して導電パターン３３Ｂと接続される。これらの導電パターン３１Ｂ，３３Ｂ，３４Ｂ１，３４Ｂ２は、例えば治具本体１２の上部にて幅方向に突出する突出部１６Ｂに形成された端子群３５Ｂと、例えば配線３６Ｂを介して接続される。こうして、矩形ワークＷの表面ＷＦでは、上下左右の最大４分割で独立して電流制御することができる。 In the right region of the surface of the jig body 12, as shown in FIG. 4, the clamp piece 31R of the clamper 21R in the right region of the plurality of clampers 21 is connected to the conductive pattern 31B via the electrode 15A. The clamp piece 34U of the clamper 24U in the upper region of the plurality of clampers 24 is connected to the conductive pattern 34B2 via the electrode 15D. The clamp piece 34L of the clamper 24L in the lower region of the plurality of clampers 24 is connected to the conductive pattern 34B1 via the electrode 15D. The clamp piece 33R of the clamper 23R in the right region of the plurality of clampers 23 is connected to the conductive pattern 33B via the electrode 15C. These conductive patterns 31B, 33B, 34B1, 34B2 are connected to, for example, the terminal group 35B formed on the protruding portion 16B protruding in the width direction at the upper part of the jig main body 12 via, for example, the wiring 36B. In this way, the surface WF of the rectangular work W can be independently controlled by a maximum of four divisions in the vertical and horizontal directions.
　一方、治具本体１２の裏面の右領域では、図５に示すように、複数のクランパー２１のうち右領域（表面から見て左領域）にあるクランパー２１Ｒのクランプ片４１Ｒは、導電パターン４１Ａと電極１５Ｅを介して接続される。複数のクランパー２２のうち上領域にあるクランパー２２Ｕのクランプ片４２Ｕは、導電パターン４２Ａ１と電極１５Ｈを介して接続される。複数のクランパー２２のうち下領域にあるクランパー２２Ｌのクランプ片４２Ｌは、導電パターン４２Ａ２と電極１５Ｈを介して接続される。複数のクランパー２３のうち右領域（表面から見て左領域）にあるクランパー２３Ｒのクランプ片４３Ｒは、導電パターン４３Ａと電極１５Ｇを介して接続される。これらの導電パターン４１Ａ，４２Ａ１，４２Ａ２，４３Ａは、治具本体１２の突出部１６Ａに形成された端子群４５Ａと、例えば配線３７Ａを介して接続される。 On the other hand, in the right region on the back surface of the jig body 12, as shown in FIG. 5, the clamp piece 41R of the clamper 21R in the right region (left region when viewed from the front surface) among the plurality of clampers 21 has a conductive pattern 41A. It is connected via the electrode 15E. The clamp piece 42U of the clamper 22U in the upper region of the plurality of clampers 22 is connected to the conductive pattern 42A1 via the electrode 15H. The clamp piece 42L of the clamper 22L in the lower region of the plurality of clampers 22 is connected to the conductive pattern 42A2 via the electrode 15H. The clamp piece 43R of the clamper 23R in the right region (left region when viewed from the surface) of the plurality of clampers 23 is connected to the conductive pattern 43A via the electrode 15G. These conductive patterns 41A, 42A1, 42A2, 43A are connected to the terminal group 45A formed on the protruding portion 16A of the jig main body 12 via, for example, wiring 37A.
　治具本体１２の裏面の左領域では、図５に示すように、複数のクランパー２１のうち左領域にあるクランパー２１Ｌのクランプ片４１Ｌは、電極１５Ｅを介して導電パターン４１Ｂと接続される。複数のクランパー２４のうち上領域にあるクランパー２４Ｕのクランプ片４４Ｕは、電極１５Ｆを介して導電パターン４４Ｂ１と接続される。複数のクランパー２４のうち下領域にあるクランパー２４Ｌのクランプ片４４Ｌは、電極１５Ｆを介して導電パターン４４Ｂ２と接続される。複数のクランパー２３のうち左領域にあるクランパー２３のクランプ片４３は、電極１５Ｇを介して導電パターン４３Ｂと接続される。これらの導電パターン４１Ｂ，４３Ｂ，４４Ｂ１，４４Ｂ２は、治具本体１２の突出部１６Ｂに形成された端子群４５Ｂと、例えば配線３７Ｂを介して接続される。こうして、矩形ワークＷの裏面ＷＢでも、上下左右の最大４分割で独立して電流制御することができる。 In the left region on the back surface of the jig body 12, as shown in FIG. 5, the clamp piece 41L of the clamper 21L in the left region of the plurality of clampers 21 is connected to the conductive pattern 41B via the electrode 15E. The clamp piece 44U of the clamper 24U in the upper region of the plurality of clampers 24 is connected to the conductive pattern 44B1 via the electrode 15F. The clamp piece 44L of the clamper 24L in the lower region of the plurality of clampers 24 is connected to the conductive pattern 44B2 via the electrode 15F. The clamp piece 43 of the clamper 23 in the left region of the plurality of clampers 23 is connected to the conductive pattern 43B via the electrode 15G. These conductive patterns 41B, 43B, 44B1, 44B2 are connected to the terminal group 45B formed on the protruding portion 16B of the jig main body 12 via, for example, the wiring 37B. In this way, even on the back surface WB of the rectangular work W, the current can be independently controlled by dividing it into four parts up, down, left, and right.
　治具１０の表裏面に形成される導電パターン４１Ａ，４１Ｂ，４２Ａ１，４２Ａ２，４３Ａ，４３Ｂ，４４Ｂ１，４４Ｂ２は、絶縁コーティングされることで、メッキが付着することを防止することができる。また、図４に示す電極１５Ａ～１５Ｄ及び図５に示す電極１５Ｅ～１５Ｈは、ワークＷの周縁付近に配置され、ワークＷの周縁で発生する電界集中に起因するメッキ厚の異常いわゆるドックボーンを解消するダミー電極として機能させることができる。図４に示す電極１５Ａ～１５Ｄ及び図５に示す電極１５Ｅ～１５Ｈは、メッキが付着することを防止するためと、電極露出量を調整するために、隣り合う２つのクランパー間の領域にて電極露出部分を可変とする位置調整可能な絶縁体１７Ａ～１７Ｄで覆うことができる（本願出願人による特願２０１９－１５８２７号参照）。 The conductive patterns 41A, 41B, 42A1, 42A2, 43A, 43B, 44B1, 44B2 formed on the front and back surfaces of the jig 10 can be prevented from adhering to the plating by insulating coating. Further, the electrodes 15A to 15D shown in FIG. 4 and the electrodes 15E to 15H shown in FIG. 5 are arranged near the peripheral edge of the work W, and have an abnormality in the plating thickness due to the electric field concentration generated on the peripheral edge of the work W, so-called dock bone. It can function as a dummy electrode to eliminate. The electrodes 15A to 15D shown in FIG. 4 and the electrodes 15E to 15H shown in FIG. 5 are electrodes in a region between two adjacent clampers in order to prevent plating from adhering and to adjust the amount of electrode exposure. The exposed portion can be covered with variable position-adjustable insulators 17A-17D (see Japanese Patent Application No. 2019-15827 by the applicant of the present application).
　なお、クランパーは、治具１０の穴１４のうちワークＷの周囲に形成されるわずかな隙間を覆ってワークＷを保持することができるものであっても良い。こうして、治具１０及びワークＷと、表面処理槽１００Ａの支持部１１０、１２０とにより、表面処理槽１００Ａ内をワークＷの表裏に位置する第１槽１０１と第２槽１０２とに、ほぼ完全に仕切ることができる。 The clamper may be one that can hold the work W by covering a slight gap formed around the work W in the holes 14 of the jig 10. In this way, the jig 10 and the work W, and the support portions 110 and 120 of the surface treatment tank 100A, make the inside of the surface treatment tank 100A almost completely into the first tank 101 and the second tank 102 located on the front and back of the work W. Can be partitioned into.
　１．４．整流器
　本実施形態では、少なくともワークＷの表面ＷＦ及び裏面ＷＢに流れる電流を独立して設定するために、図６（Ａ）～図６（Ｃ）に示すように、複数の整流器を設けることが好ましい。図６（Ａ）では、２つの整流器３００Ａ、３００Ｂが設けられ、整流器３００ＡはワークＷの表面ＷＦと接触するクランプ片３１～３４と電気的に接続され、整流器３００ＢはワークＷの裏面ＷＢと接触するクランプ片４１～４４と電気的に接続される。２つの整流器３００Ａ、３００Ｂを独立して制御することで、ワークＷの表面ＷＦ及び裏面ＷＢに流れる電流を独立して設定することができる。こうして、ワークＷは、表面ＷＦ及び裏面ＷＢでの各メッキ面積が大きく異なっても、メッキ面積やメッキ箇所に応じて電流を調整することができる。なお、この場合には、２つの整流器３００Ａ、３００Ｂが第１陽極１４２及び第２陽極１５２に電気的に接続される接点は、例えば、第１陽極１４２及び第２陽極１５２の各中心に配置される。 1.4. Rectifier In this embodiment, a plurality of rectifiers are provided as shown in FIGS. 6 (A) to 6 ( C ) in order to independently set at least the current flowing through the front surface WF and the back surface WB of the work W. Is preferable. In FIG. 6A, two rectifiers 300A and 300B are provided, the rectifier 300A is electrically connected to the clamp pieces 31 to 34 in contact with the front surface WF of the work W, and the rectifier 300B is the back surface WB of the work W. It is electrically connected to the clamp pieces 41 to 44 that come into contact with the clamp pieces 41 to 44. By independently controlling the two rectifiers 300A and 300B, the current flowing through the front surface WF and the back surface WB of the work W can be set independently. In this way, the work W can adjust the current according to the plating area and the plating location even if the plating areas on the front surface WF and the back surface WB are significantly different. In this case, the contact points through which the two rectifiers 300A and 300B are electrically connected to the first anode 142 and the second anode 152 are arranged at the centers of the first anode 142 and the second anode 152, for example. To.
　図６（Ｂ）では、４つの整流器３１０Ａ～３１０Ｄが設けられ、整流器３１０ＡはワークＷの表面ＷＦの上領域と接触するクランプ片３１，３２Ｕ，３４Ｕと電気的に接続され、整流器３１０ＢはワークＷの表面ＷＦの下領域と接触するクランプ片３３，３２Ｌ，３４Ｌと電気的に接続され、整流器３１０ＣはワークＷの裏面ＷＢの上領域と接触するクランプ片４１，４２Ｕ，４４Ｕと電気的に接続され、整流器３１０ＤはワークＷの裏面ＷＢの下領域と接触するクランプ片４３，４２Ｌ，４４Ｌと電気的に接続される。こうすると、ワークＷの表面ＷＦ及び裏面ＷＢの各々で、ワークＷの上領域及び下領域の２領域、つまり表裏で計４領域に流れる電流を独立して制御することが可能となる。なお、この場合には、４つの整流器３１０Ａ～３１０Ｄが第１陽極１４２及び第２陽極１５２に電気的に接続される接点は、第１陽極１４２の上領域、第１陽極１４２の下領域、第２陽極１５２の上領域及び第２陽極１５２の下領域の計４領域に対応して配置される。 In FIG. 6B, four rectifiers 310A to 310D are provided, the rectifier 310A is electrically connected to the clamp pieces 31, 32U, 34U in contact with the upper region of the surface WF of the work W, and the rectifier 310B is the work. Electrically connected to the clamp pieces 33, 32L, 34L in contact with the lower region of the front surface WF of W, the rectifier 310C is electrically connected to the clamp pieces 41, 42U, 44U in contact with the upper region of the back surface WB of the work W. The rectifier 310D is electrically connected to the clamp pieces 43, 42L, 44L that come into contact with the lower region of the back surface WB of the work W. By doing so, it becomes possible to independently control the current flowing in the two regions of the upper region and the lower region of the work W, that is, the total of four regions on the front and back sides, on each of the front surface WF and the back surface WB of the work W. In this case, the contacts in which the four rectifiers 310A to 310D are electrically connected to the first anode 142 and the second anode 152 are the upper region of the first anode 142, the lower region of the first anode 142, and the first. The two anodes 152 are arranged so as to correspond to a total of four regions, the upper region of the anode 152 and the lower region of the second anode 152.
　図６（Ｃ）では、８つの整流器３２０Ａ～３２０Ｈが設けられ、整流器３２０ＡはワークＷの表面ＷＦの左上領域と接触するクランプ片３１Ｌ，３２Ｕと電気的に接続され、整流器３２０ＢはワークＷの表面ＷＦの左下領域と接触するクランプ片３２Ｌ，３３Ｌと電気的に接続され、整流器３２０ＣはワークＷの表面ＷＦの右上領域と接触するクランプ片３１Ｒ，３４Ｕと電気的に接続され、整流器３２０ＤはワークＷの表面ＷＦの右下領域と接触するクランプ片３３Ｒ，３４Ｌと電気的に接続され、整流器３２０ＥはワークＷの裏面ＷＢの左上領域と接触するクランプ片４１Ｌ，４４Ｕと電気的に接続され、整流器３２０ＦはワークＷの裏面ＷＢの左下領域と接触するクランプ片４３Ｌ，４４Ｌと電気的に接続され、整流器３２０ＧはワークＷの裏面ＷＢの右上領域と接触するクランプ片４１Ｒ，４２Ｕと電気的に接続され、整流器３２０ＨはワークＷの裏面ＷＢの右下領域と接触するクランプ片４２Ｌ，４３Ｒと電気的に接続される。こうすると、ワークＷの表面ＷＦ及び裏面ＷＢの各々で、ワークＷの左上領域、左下領域、右上領域及び右下領域の４領域、つまり表裏で計８領域に流れる電流を独立して制御することが可能となる。なお、この場合には、８つの整流器３２０Ａ～３２０Ｈが第１陽極１４２及び第２陽極１５２に対して電気的に接続される接点は、第１陽極１４２の左上領域、左下領域、右上領域及び右下領域と、第２陽極１５２の左上領域、第１陽極１４２の上領域、第１陽極１４２の下領域、第２陽極１５２の上領域及び第２陽極１５２の下領域と、の計８領域に対応して配置される。ただし、表裏で計８分割を超えて分割しても良い。 In FIG. 6C, eight rectifiers 320A to 320H are provided, the rectifier 320A is electrically connected to the clamp pieces 31L and 32U in contact with the upper left region of the surface WF of the work W, and the rectifier 320B is the work W. The rectifier 320C is electrically connected to the clamp pieces 31R and 34U which are in contact with the upper left region of the surface WF of the work W, and the rectifier 320C is electrically connected to the clamp pieces 32L and 33L which are in contact with the lower left region of the surface WF. Is electrically connected to the clamp pieces 33R, 34L in contact with the lower right region of the front surface WF of the work W, and the rectifier 320E is electrically connected to the clamp pieces 41L, 44U in contact with the upper left region of the back surface WB of the work W. Connected, the rectifier 320F is electrically connected to the clamp pieces 43L, 44L that come into contact with the lower left region of the back surface WB of the work W, and the rectifier 320G is connected to the clamp pieces 41R, 42U that come into contact with the upper right region of the back surface WB of the work W. The rectifier 320H is electrically connected to the clamp pieces 42L and 43R that come into contact with the lower right region of the back surface WB of the work W. By doing so, each of the front surface WF and the back surface WB of the work W independently controls the current flowing in the four regions of the upper left region, the lower left region, the upper right region and the lower right region of the work W, that is, the total of eight regions on the front and back. It becomes possible to do. In this case, the contacts to which the eight rectifiers 320A to 320H are electrically connected to the first anode 142 and the second anode 152 are the upper left region, the lower left region, the upper right region and the right of the first anode 142. In a total of eight regions, the lower region, the upper left region of the second anode 152, the upper region of the first anode 142, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152. Arranged correspondingly. However, the front and back may be divided into more than 8 divisions in total.
　１．５．液噴出部材
　液噴出部材２００は、ワークＷの表面ＷＦと第１陽極１４２との間に配置される第１液噴出部材２００Ａと、ワークＷの裏面ＷＢと第２陽極１５２との間に配置される第２液噴出部材２００Ｂと、を含むことができる。第１液噴出部材２００Ａは、第１往復移動機構２７０（第１移動機構）Ａにより、ワークＷの表面ＷＦと平行な往復方向に移動される。第２液噴出部材２００Ｂは、第２往復移動機構（第２移動機構）２７０Ｂにより、ワークＷの裏面ＷＢと平行な往復方向に移動される。第１、第２往復移動機構２７０Ａ、２７０Ｂは、スライダ・クランク機構、偏心カム等の各種の回転運動－往復直線運動変換機構を利用することができ、ここでは詳細な説明は省略する。 1.5. Liquid ejection member The liquid ejection member 200 is provided between the first liquid ejection member 200A arranged between the front surface WF of the work W and the first anode 142, and between the back surface WB of the work W and the second anode 152. The second liquid ejection member 200B to be arranged can be included. The first liquid ejection member 200A is moved in the reciprocating direction parallel to the surface WF of the work W by the first reciprocating moving mechanism 270 (first moving mechanism) A. The second liquid ejection member 200B is moved in the reciprocating direction parallel to the back surface WB of the work W by the second reciprocating moving mechanism (second moving mechanism) 270B. The first and second reciprocating movement mechanisms 270A and 270B can utilize various rotary motion-reciprocating linear motion conversion mechanisms such as a slider / crank mechanism and an eccentric cam, and detailed description thereof will be omitted here.
　本実施形態では、ワークＷの表面ＷＦ及び裏面ＷＢに対して各一つの液噴出部材２００Ａ、２００Ｂを設けている。液噴出部材２００Ａ、２００Ｂは、ワークＷの幅よりも長い移動ストロークで往復移動されることが好ましい。こうすると、ワークＷの幅方向の端部と重なった位置で液噴出部材２００Ａ、２００Ｂが折り返すことがなくなる。よって、液噴出部材２００が陰極―陽極間での電界の影となる時間が、ワークＷの両端と両端以外の位置とで異なることがなくなる。ワークＷの表面ＷＦ及び裏面ＷＢの各面に対して、複数の液噴出部材を設けても良い。こうすると、各一つの液噴出部材の移動ストロークは短くできる。ただし、陽極１４２，１５２に対して液噴出部材２００が電界の影となる時間が、ワークＷの領域（例えば両端と中央）によって異なる点で不利となる。 In the present embodiment, one liquid ejection member 200A and 200B are provided for each of the front surface WF and the back surface WB of the work W. It is preferable that the liquid ejection members 200A and 200B are reciprocated with a movement stroke longer than the width of the work W. By doing so, the liquid ejection members 200A and 200B will not be folded back at the position where they overlap with the end portion in the width direction of the work W. Therefore, the time during which the liquid ejection member 200 is the shadow of the electric field between the cathode and the anode does not differ between both ends of the work W and positions other than both ends. A plurality of liquid ejection members may be provided on each surface of the front surface WF and the back surface WB of the work W. By doing so, the moving stroke of each liquid ejection member can be shortened. However, it is disadvantageous in that the time when the liquid ejection member 200 is in the shadow of the electric field with respect to the anodes 142 and 152 differs depending on the region of the work W (for example, both ends and the center).
　液噴出部材２００（２００Ａ及び２００Ｂ）は、図３に示すように、往復方向と交差例えば直交する二面を有する第１ガイド体２１０と、第１ガイド体２１０の例えば両側にて、第１ガイド体２１０の二面と間隙を介してそれぞれ配置される第２ガイド体２２０及び第３ガイド体２３０と、を含む。第１～第３ガイド体２１０～２３０のうち隣り合う各２つのガイド体は、陽極１４２，１５２とワークＷとの間でワークＷに向かう延在方向に沿って形成され、かつ、その延在方向と交差する方向で離間して配置される各一対の板材を構成する。図２に示すように、ワークＷの少なくとも垂直長さに亘って伸びる高さを有する。第１ガイド体２１０と第２ガイド体２２０とで形成される第1の一対の板材間に、第１通路２０１が形成される。第１ガイド体２１０と第３ガイド体２３０とで形成される第２の一対の板材間に、第２通路２０２が形成される。第１ガイド体２１０は、第２ガイド体２２０及び第３ガイド体２３０よりも例えば長く形成され、その両端部が第２ガイド体２２０及び第３ガイド体２３０の対応する端部よりも突出している。また、第１ガイド体２１０のワークＷと対向する端部は例えば先細り形状となっている。第１ガイド体２１０は、陽極ボックス１４０、１５０に近い側の端部が、ワークＷと例えば平行に延びる基端部２４０に固定される。第２ガイド体２２０及び第３ガイド体２３０は、基端部２４０と例えば平行に延びる第４ガイド体２５０をさらに有することができる。第２ガイド体２２０から延びる第４ガイド体２５０と基端部２４０との間に第３通路２０３が形成される。第３通路２０３は、第１通路２０１と連通され、第１通路２０１へ処理液を導く。同様に、第３ガイド体２３０から延びる第４ガイド体２５０と基端部２４０との間に第４通路２０４が形成される。第４通路２０４は、第２通路２０２と連通され、第２通路２０２へ処理液を導く。第１ガイド体２１０と、第２ガイド体２２０及び第３ガイド体２３０とは、平板のスペーサー２６０により一定の間隔を保って連結される。このスペーサー２６０は、図２に示すように、高さ方向で間隔をあけて複数設けることができる。 As shown in FIG. 3, the liquid ejection member 200 (200A and 200B) has a first guide body 210 having two surfaces intersecting, for example, orthogonal to each other in the reciprocating direction, and a first guide body, for example, on both sides of the first guide body 210. It includes two sides of the body 210 and a second guide body 220 and a third guide body 230, which are arranged via a gap, respectively. Each of the two adjacent guide bodies of the first to third guide bodies 210 to 230 is formed between the anodes 142 and 152 and the work W along the extending direction toward the work W, and is extended thereof. Each pair of plates are arranged apart from each other in a direction intersecting the direction. As shown in FIG. 2, it has a height extending over at least the vertical length of the work W. The first passage 201 is formed between the first pair of plate members formed by the first guide body 210 and the second guide body 220. A second passage 202 is formed between the second pair of plate members formed by the first guide body 210 and the third guide body 230. The first guide body 210 is formed, for example, longer than the second guide body 220 and the third guide body 230, and both ends thereof protrude from the corresponding ends of the second guide body 220 and the third guide body 230. .. Further, the end portion of the first guide body 210 facing the work W has, for example, a tapered shape. The end portion of the first guide body 210 on the side close to the anode boxes 140 and 150 is fixed to the base end portion 240 extending in parallel with the work W, for example. The second guide body 220 and the third guide body 230 can further have a fourth guide body 250 extending, for example, parallel to the proximal end portion 240. A third passage 203 is formed between the fourth guide body 250 extending from the second guide body 220 and the base end portion 240. The third passage 203 communicates with the first passage 201 and guides the processing liquid to the first passage 201. Similarly, a fourth passage 204 is formed between the fourth guide body 250 extending from the third guide body 230 and the base end portion 240. The fourth passage 204 communicates with the second passage 202 and guides the processing liquid to the second passage 202. The first guide body 210, the second guide body 220, and the third guide body 230 are connected to each other by a flat plate spacer 260 at a constant interval. As shown in FIG. 2, a plurality of spacers 260 may be provided at intervals in the height direction.
　第１液噴出部材２００Ａは、例えばその基端部２４０が、例えば第１駆動源２８０Ａによって駆動力が付与される第１往復移動機構２７０Ａに連結されることで、図２の往復方向Ａ、Ｂに移動される。同様に、第２液噴出部材２００Ｂは、例えばその基端部２４０が、例えば第２駆動源２８０Ｂによって駆動力が付与される第２往復移動機構２７０Ｂに連結されることで、図２の往復方向Ａ、Ｂに移動される。液噴出部材２００（２００Ａ及び２００Ｂ）が図２の往復方向Ａ、Ｂのうちの図３の往動方向Ａに移動する時に、第１ガイド体２１０で堰き止められるメッキ液を、第１ガイド体２１０と第２ガイド体２２０とで形成される第1の一対の板材間の第１通路２０１に沿って案内して、ワークＷに向けて噴出させる。液噴出部材２００Ａが往復方向Ａ、Ｂのうちの復動方向Ｂに移動する時に、第１ガイド体２１０で堰き止められるメッキ液を、第１ガイド体２１０と第３ガイド体２３０とで形成される第２の一対の板材間の第２通路２０２に沿って案内して、ワークＷに向けて噴出させる。第２液噴出部材２００Ｂも、第１液噴出部材２００Ａと同様に、往動方向Ａに移動する時に第１通路２０１を介してメッキ液をワークＷに向けて噴出させ、復動方向Ｂに移動する時に第２通路２０２を介してメッキ液をワークＷに向けて噴出させる。なお、第１通路２０１及び第２通路２０２の双方を必ずしも設ける必要はない。液噴出部材２００（２００Ａ及び２００Ｂ）の往復方向Ａ、Ｂの移動のいずれの場合でも、少なくとも一対の板材間の共通通路に処理液を案内するように、第３通路２０３及び第４通路２０４が、例えば傾斜または湾曲する等の他のガイド体によって形成されてもよい。 The first liquid ejection member 200A is connected to, for example, the first reciprocating moving mechanism 270A to which a driving force is applied by, for example, the first driving source 280A, so that the base end portion 240 thereof is connected to the reciprocating directions A and B in FIG. Will be moved to. Similarly, the reciprocating direction of FIG. 2 is obtained by connecting the base end portion 240 of the second liquid ejection member 200B to, for example, the second reciprocating moving mechanism 270B to which a driving force is applied by the second driving source 280B. Moved to A and B. When the liquid ejection members 200 (200A and 200B) move in the reciprocating direction A and B of FIG. 2 in the forward movement direction A of FIG. It is guided along the first passage 201 between the first pair of plate members formed by the 210 and the second guide body 220, and is ejected toward the work W. When the liquid ejection member 200A moves in the return direction B of the reciprocating directions A and B, the plating liquid blocked by the first guide body 210 is formed by the first guide body 210 and the third guide body 230. It is guided along the second passage 202 between the second pair of plate members and ejected toward the work W. Similar to the first liquid ejection member 200A, the second liquid ejection member 200B also ejects the plating liquid toward the work W through the first passage 201 when moving in the forward movement direction A, and moves in the return direction B. At that time, the plating solution is ejected toward the work W through the second passage 202. It is not always necessary to provide both the first passage 201 and the second passage 202. In any of the reciprocating directions A and B of the liquid ejection members 200 (200A and 200B), the third passage 203 and the fourth passage 204 guide the processing liquid to a common passage between at least a pair of plate members. , For example, may be formed by other guide bodies such as tilted or curved.
　こうして、処理液２がワークＷと衝突することで、ワークＷの主面ＷＦ、ＷＢ近傍の処理液を攪拌して処理液の滞留を防止し、しかも、陽極ボックス１４０、１５０付近にあるメッキ成分が豊富なフレッシュな処理液２をワークＷに供給することができる。それにより、メッキ処理が促進される。また、液噴出部材２００（２００Ａ及び２００Ｂ）は、図２の縦方向において、スペーサー２６０を除いて均一に処理液２をワークＷに向けて噴出することができる。スペーサー２６０は薄板状に形成できるので、ワークＷの処理の面内均一性を損なうことはない。 In this way, when the treatment liquid 2 collides with the work W, the treatment liquid in the vicinity of the main surfaces WF and WB of the work W is agitated to prevent the treatment liquid from staying, and the treatment liquid is located near the anode boxes 140 and 150. A fresh treatment liquid 2 rich in plating components can be supplied to the work W. Thereby, the plating process is promoted. Further, the liquid ejection member 200 (200A and 200B) can uniformly eject the treatment liquid 2 toward the work W in the vertical direction of FIG. 2, except for the spacer 260. Since the spacer 260 can be formed in the shape of a thin plate, the in-plane uniformity of the processing of the work W is not impaired.
　ここで、第１駆動源２８０Ａと第２駆動源２８０Ｂとは非同期で駆動することができる。第１、第２液噴出部材２００Ａ、２００ＢがワークＷを挟んで正対すると、ワークＷの同一領域にてその両面に向けて処理液２が噴出されることになる。ワークＷが両面に貫通するスルーホールを有する場合、処理液２がスルーホールを通り抜け難くなる。第１、第２液噴出部材２００Ａ、２００Ｂの一往復移動中において第１、第２液噴出部材が正対する位置は、第１、第２液噴出部材を同期して移動させると常に同じになるが、第１、第２液噴出部材を非同期で移動させることで毎回異ならせることができる。それにより、ワークＷに形成されるスルーホールの位置に拘わらず、スルーホール内へのメッキを確実に実施することができる。また、第１駆動源２８０Ａと第２駆動源２８０Ｂとは、それぞれ速度を異ならせて液噴出部材２００Ａ、２００Ｂを移動させても良い。こうすると、ワークＷに作用する処理液２の圧力が表裏面ＷＦ、ＷＢで異なる。この圧力差を利用して、スルーホールに処理液を通過させ易くすることができる。この場合、第１駆動源２８０Ａと第２駆動源２８０Ｂとを同期して駆動しても良いし、第１、第２駆動源２８０Ａ、２８０Ｂを同一駆動源としても良い。 Here, the first drive source 280A and the second drive source 280B can be driven asynchronously. When the first and second liquid ejection members 200A and 200B face each other with the work W interposed therebetween, the treatment liquid 2 is ejected toward both sides in the same region of the work W. When the work W has through holes penetrating on both sides, it becomes difficult for the treatment liquid 2 to pass through the through holes. During one reciprocating movement of the first and second liquid ejection members 200A and 200B, the positions facing the first and second liquid ejection members are always the same when the first and second liquid ejection members are moved synchronously. However, it can be made different each time by moving the first and second liquid ejection members asynchronously. As a result, plating into the through hole can be reliably performed regardless of the position of the through hole formed in the work W. Further, the liquid ejection members 200A and 200B may be moved at different speeds between the first drive source 280A and the second drive source 280B, respectively. Then, the pressure of the treatment liquid 2 acting on the work W differs between the front and back surfaces WF and WB. This pressure difference can be used to facilitate the passage of the treatment liquid through the through holes. In this case, the first drive source 280A and the second drive source 280B may be driven in synchronization, or the first and second drive sources 280A and 280B may be the same drive source.
　また、表面処理槽１００Ａは、ワークＷを保持した治具１０が上方から降下されて装着されることで、第１槽１０１と第２槽１０２とに区画される。ここで、第１、第２液噴出部材２００Ａ、２００Ｂを往復移動させると、第２、第３ガイド体２２０、２３０で堰き止められて反発する液流が槽内全体を攪拌する攪拌流となる。この際、第１液噴出部材２００Ａは第１槽１０１内の処理液を撹拌し、第２液噴出部材２００Ｂは第２槽１０２内の処理液を撹拌することができ、しかも、一方の槽での撹拌が他方に与える悪影響を排除できる。 Further, the surface treatment tank 100A is divided into a first tank 101 and a second tank 102 by the jig 10 holding the work W being lowered from above and mounted. Here, when the first and second liquid ejection members 200A and 200B are reciprocated, the liquid flow blocked and repelled by the second and third guide bodies 220 and 230 becomes a stirring flow that agitates the entire tank. .. At this time, the first liquid ejection member 200A can agitate the processing liquid in the first tank 101, and the second liquid ejection member 200B can agitate the treatment liquid in the second tank 102, and moreover, in one of the tanks. The adverse effect of stirring on the other side can be eliminated.
　また、表面処理槽１００Ａは、往復方向Ａ、Ｂで両端に位置する２つの側壁部１０５、１０６の外側に、バッファ槽１０７、１０８を有することができる。側壁部１０５に形成された開口１０５Ａは、第１槽１０１とバッファ槽１０７とを連通させる。側壁部１０５に形成された開口１０５Ｂは、第２槽１０２とバッファ槽１０７とを連通させる。側壁部１０６に形成された開口１０６Ａは、第１槽１０１とバッファ槽１０８とを連通させる。側壁部１０６に形成された開口１０６Ｂは、第２槽１０２とバッファ槽１０８とを連通させる。こうすると、液噴出部材２００（２００Ａ及び２００Ｂ）によって処理槽１００Ａの両端の各々に押し寄せられた処理液をバッファ槽１０７、１０８に逃がすことができる。こうして、処理槽１００Ａの両端にて発生する処理液の反射波の影響を低減できる。また、バッファ槽１０７、１０８を介して、第１槽１０１と第２槽１０２との間での処理液の流通を確保することもできる。 Further, the surface treatment tank 100A can have buffer tanks 107 and 108 outside the two side wall portions 105 and 106 located at both ends in the reciprocating directions A and B. The opening 105A formed in the side wall portion 105 allows the first tank 101 and the buffer tank 107 to communicate with each other. The opening 105B formed in the side wall portion 105 allows the second tank 102 and the buffer tank 107 to communicate with each other. The opening 106A formed in the side wall portion 106 communicates the first tank 101 and the buffer tank 108. The opening 106B formed in the side wall portion 106 communicates the second tank 102 and the buffer tank 108. By doing so, the treatment liquid that has been pushed to each of both ends of the treatment tank 100A by the liquid ejection members 200 (200A and 200B) can be released to the buffer tanks 107 and 108. In this way, the influence of the reflected wave of the processing liquid generated at both ends of the processing tank 100A can be reduced. Further, it is also possible to secure the flow of the treatment liquid between the first tank 101 and the second tank 102 via the buffer tanks 107 and 108.
　２．第２実施形態
　図７は、本発明の第２実施形態に係る表面処理装置の平面図である。図７では、処理槽１００Ｂは、往復方向と平行な方向で連結され、かつ、第１バッファ槽１０９により区画される第１処理槽１００Ｂ１と第２処理槽１００Ｂ２とを含むことができる。治具は、第１ワークＷ１を保持して第１処理槽１００Ｂ１を第１槽１０１と第２槽１０２とに区画する第１治具１０Ａと、第２ワークＷ２を保持して第２処理槽１００Ｂ２を第１槽１０１と第２槽１０２とに区画する第２治具１０Ｂと、を含むことができる。その場合、第１バッファ槽１０９は、第１処理槽１００Ｂ１の第１槽１０１と、第２処理槽１００Ｂ２の第１槽１０１と、第１処理槽１００Ｂ１の第２槽１０２と、第２処理槽１００Ｂ２の第２槽１０２とを互いに連通させる第１～第４開口１０９Ａ１、１０９Ａ２、１０９Ｂ１、１０９Ｂ２を含むことができる。また、第１処理槽１００Ｂ１は、往復方向の一端に設けられる第１側壁部１０５の外側に、第１処理槽１００Ｂ１中の第１槽１０１及び第２槽１０２の間で処理液を流通させる第２バッファ槽１０７を含むことができる。第２処理槽１００Ｂ２は、往復方向の他端に設けられる第２側壁部１０６の外側に、第２処理槽１００Ｂ２中の第１槽１０１及び第２槽１０２の間で処理液を流通させる第３バッファ槽１０８を含むことができる。こうして、第１ワークＷ１及び第２ワークＷ２を同時に処理することができ、図１の処理槽１００Ａと同様の作用・効果を奏することができる。なお、第１バッファ１０９槽に代えて、中央壁を設けても良い。この場合、中央壁は、第１処理槽１００Ｂ１の第１槽１０１と、第２処理槽１００Ｂ２の第１槽１０１と、に連通する第１開口と、第１処理槽１００Ｂ１の第２槽１０２と、第２処理槽１００Ｂ２の第２槽１０２とを連通させる第２開口とを有することができる。ただし、この場合には、第１槽１０１と第２槽１０２とを連通させることはできない。 2. 2. Second Embodiment FIG. 7 is a plan view of the surface treatment apparatus according to the second embodiment of the present invention. In FIG. 7, the treatment tank 100B can include a first treatment tank 100B1 and a second treatment tank 100B2 which are connected in a direction parallel to the reciprocating direction and are partitioned by the first buffer tank 109. The jig holds the first jig 10A that holds the first work W1 and divides the first treatment tank 100B1 into the first tank 101 and the second tank 102, and the second treatment tank that holds the second work W2. A second jig 10B for partitioning 100B2 into a first tank 101 and a second tank 102 can be included. In that case, the first buffer tank 109 is the first tank 101 of the first treatment tank 100B1, the first tank 101 of the second treatment tank 100B2, the second tank 102 of the first treatment tank 100B1, and the second treatment tank. The first to fourth openings 109A1, 109A2, 109B1 and 109B2 that communicate with the second tank 102 of 100B2 can be included. Further, in the first treatment tank 100B1, the treatment liquid is circulated between the first tank 101 and the second tank 102 in the first treatment tank 100B1 on the outside of the first side wall portion 105 provided at one end in the reciprocating direction. 2 Buffer tank 107 can be included. The second treatment tank 100B2 has a third treatment liquid flowing between the first tank 101 and the second tank 102 in the second treatment tank 100B2 on the outside of the second side wall portion 106 provided at the other end in the reciprocating direction. The buffer tank 108 can be included. In this way, the first work W1 and the second work W2 can be processed at the same time, and the same actions and effects as those of the processing tank 100A of FIG. 1 can be obtained. A central wall may be provided instead of the first buffer 109 tank. In this case, the central wall has a first opening communicating with the first tank 101 of the first treatment tank 100B1 and the first tank 101 of the second treatment tank 100B2, and the second tank 102 of the first treatment tank 100B1. , The second opening for communicating with the second tank 102 of the second treatment tank 100B2 can be provided. However, in this case, the first tank 101 and the second tank 102 cannot be communicated with each other.
　なお、第２実施形態では、第１治具１０Ａと第２治具１０Ｂとを一体的に構成しても良い。また、２つの第１液噴出部材２００Ａを同一駆動源で駆動し、他の２つの第２液噴出部材２００Ｂを同一駆動源で駆動しても良い。また、表面処理槽は、広義には第１～第Ｎ（Ｎは２以上の整数）処理槽を連結して構成することができる。Ｎ≧３の場合には、往復方向での両端に位置する側壁部と平行して（Ｎ－１）個の隔壁が設けられる。 In the second embodiment, the first jig 10A and the second jig 10B may be integrally configured. Further, the two first liquid ejection members 200A may be driven by the same drive source, and the other two second liquid ejection members 200B may be driven by the same drive source. Further, the surface treatment tank can be configured by connecting the first to Nth (N is an integer of 2 or more) treatment tanks in a broad sense. When N ≧ 3, (N-1) partition walls are provided in parallel with the side wall portions located at both ends in the reciprocating direction.
　１…表面処理装置、２…処理液、１０、１０Ａ、１０Ｂ…治具、１２…本体プレート、１３Ａ…下部、１３Ｂ…第１側部、１３Ｃ…第２側部、１４…矩形開口、１６Ａ，１６Ｂ…突出片、２１，４１…第１クランパー、２２，４２…第２クランパー、２３，４３…第３クランパー、２４，４４…第４クランパー、３１Ａ～３４Ｂ２、４１Ａ～４４Ｂ２…導電パターン、３５Ａ，３５Ｂ，４５Ａ，４５Ｂ…端子群、３６Ａ～３７Ｂ…配線、１００Ａ、１００Ｂ…表面処理槽、１０１…第１槽、１０２…第２槽、１０３、１０４…開口、１０５、１０６…側壁部、１０５Ａ、１０５Ｂ、１０６Ａ、１０６Ｂ…開口、１０７、１０８、１０９…バッファ槽、１０９Ａ、１０９Ｂ…第１、第２開口、１１０…下部支持部、１２０…上部支持部、１４２…第１陽極、１５２…第２陽極、２００（２００Ａ，２００Ｂ）…液噴出部材、２０１～２０４…第１～第４通路、２１０…第１ガイド体、２２０…第２ガイド体、２３０…第３ガイド体、２４０…基部、２５０…第４ガイド体、２６０…スペーサー、２７０Ａ、２７０Ｂ…移動機構、２７０Ａ…第１移動機構、２７０Ｂ…第２移動機構、Ｗ…ワーク、ＷＦ…第１主面、ＷＢ…第２主面 1 ... Surface treatment device, 2 ... Treatment liquid, 10, 10A, 10B ... Jig, 12 ... Main body plate, 13A ... Lower part, 13B ... First side part, 13C ... Second side part, 14 ... Rectangular opening, 16A, 16B ... Projection piece 21,41 ... 1st clamper, 22,42 ... 2nd clamper, 23,43 ... 3rd clamper, 24,44 ... 4th clamper, 31A-34B2, 41A-44B2 ... Conductive pattern, 35A, 35B, 45A, 45B ... Terminal group, 36A-37B ... Wiring, 100A, 100B ... Surface treatment tank, 101 ... First tank, 102 ... Second tank, 103, 104 ... Opening, 105, 106 ... Side wall, 105A, 105B, 106A, 106B ... Opening, 107, 108, 109 ... Buffer tank, 109A, 109B ... First, second opening, 110 ... Lower support, 120 ... Upper support, 142 ... First anode, 152 ... Second Anode, 200 (200A, 200B) ... Liquid ejection member, 201-204 ... 1st to 4th passages, 210 ... 1st guide body, 220 ... 2nd guide body, 230 ... 3rd guide body, 240 ... base, 250 ... 4th guide body, 260 ... Spacer, 270A, 270B ... Moving mechanism, 270A ... 1st moving mechanism, 270B ... 2nd moving mechanism, W ... Work, WF ... 1st main surface, WB ... 2nd main surface

Claims (7)

  1. 　処理液が収容される処理槽と、
    　前記処理槽内に配置される陽極と、
    　前記処理液に浸漬されるワークを垂下させて保持し、かつ、前記ワークを陰極に設定する治具と、
    　前記陽極と前記ワークとの間で前記処理液中に配置される液噴出部材と、
    　前記液噴出部材を、前記ワークに対して移動させる移動機構と、
    を有し、
    　前記液噴出部材は、前記陽極と前記ワークとの間で前記ワークに向かう延在方向に沿って形成され、かつ、前記延在方向と交差する方向で離間して配置される少なくとも一対の板材を含み、前記液噴出部材の移動により流動する前記処理液を、前記少なくとも一対の板材間で案内して前記ワークに向けて噴出させることを特徴とする表面処理装置。     A treatment tank that houses the treatment liquid and
    With the anode arranged in the processing tank,
    A jig that hangs and holds the work immersed in the treatment liquid and sets the work as the cathode.
    A liquid ejection member arranged in the processing liquid between the anode and the work, and
    A moving mechanism for moving the liquid ejection member with respect to the work,
    Have,
    The liquid ejection member is formed of at least a pair of plate members formed between the anode and the work along the extending direction toward the work and arranged apart from each other in a direction intersecting the extending direction. A surface treatment apparatus comprising and guiding the treatment liquid, which flows due to the movement of the liquid ejection member, between at least a pair of plate materials and ejecting the treatment liquid toward the work.
  2. 　請求項１において、
    　前記移動機構は、前記ワークと平行な往復方向に前記液噴出部材を移動させ、
    　前記液噴出部材は、
    　前記往復方向と交差する二面を有する第１ガイド体と、
    　前記第１ガイド体の前記二面とそれぞれ間隙を介して配置される第２ガイド体及び第３ガイド体と、
    を含み、
    　前記少なくとも一対の板材は、
    　前記第１ガイド体と前記第２ガイド体とで形成される第１の一対の板材と、
    　前記第１ガイド体と前記第３ガイド体とで形成される第２の一対の板材と、
    を含み、
    　前記液噴出部材が前記往復方向のうちの往動方向に移動する時に、前記第１ガイド体で堰き止められる処理液を、前記第１の一対の板材間に沿って案内して、前記ワークに向けて噴出させ、
    　前記液噴出部材が前記往復方向のうちの復動方向に移動する時に、前記第１ガイド体で堰き止められる処理液を、前記第２の一対の板材間に沿って案内して、前記ワークに向けて噴出させる特徴とする表面処理装置。     In claim 1,
    The moving mechanism moves the liquid ejection member in a reciprocating direction parallel to the work.
    The liquid ejection member is
    A first guide body having two surfaces intersecting the reciprocating direction,
    A second guide body and a third guide body arranged via a gap between the two surfaces of the first guide body and the third guide body, respectively.
    Including
    The at least pair of plate materials
    A first pair of plate materials formed by the first guide body and the second guide body, and
    A second pair of plate materials formed by the first guide body and the third guide body, and
    Including
    When the liquid ejection member moves in the forward movement direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along the pair of the first plate members to the work. Squirt towards
    When the liquid ejection member moves in the return direction of the reciprocating direction, the treatment liquid dampened by the first guide body is guided along between the second pair of plate members to the work. A surface treatment device that is characterized by being ejected toward.
  3. 　請求項２において、
    　前記陽極は、前記ワークの両側に配置される第１陽極及び第２陽極を含み、
    　前記液噴出部材は、前記第１陽極と前記ワークとの間に配置される第１液噴出部材と、前記第２陽極と前記ワークとの間に配置される第２液噴出部材と、を含み、
    　前記移動機構は、前記第１液噴出部材を移動する第１移動機構と、前記第２液噴出部材を移動する第２移動機構と、を含むことを特徴とする表面処理装置。     In claim 2,
    The anode includes a first anode and a second anode arranged on both sides of the work.
    The liquid ejection member includes a first liquid ejection member arranged between the first anode and the work, and a second liquid ejection member arranged between the second anode and the work. ,
    The moving mechanism is a surface treatment device including a first moving mechanism for moving the first liquid ejection member and a second moving mechanism for moving the second liquid ejecting member.
  4. 　請求項３において、
    　前記第１移動機構に駆動力を付与する第１駆動源と、前記第２移動機構に駆動力を付与する第２駆動源とをさらに有し、前記第１液噴出部材と前記第２液噴出部材とは非同期で駆動されることを特徴とする表面処理装置。     In claim 3,
    It further has a first drive source for applying a driving force to the first moving mechanism and a second driving source for applying a driving force to the second moving mechanism, and the first liquid ejection member and the second liquid ejection member. A surface treatment device characterized in that it is driven asynchronously with a member.
  5. 　請求項３または４において、
    　前記処理槽は、前記ワークを保持した前記治具が前記処理槽の上方から降下されて装着されることで、第１槽と第２槽とに区画されることを特徴とする表面処理装置。     In claim 3 or 4,
    The treatment tank is a surface treatment apparatus characterized in that the jig holding the work is lowered from above the treatment tank and mounted, so that the jig is divided into a first tank and a second tank.
  6. 　請求項５において、
    　前記処理槽は、前記往復方向で両端に位置する２つの側壁部の外側に、前記第１槽及び前記第２槽に連通して前記処理液を収容するバッファ槽をそれぞれ含むことを特徴とする表面処理装置。     In claim 5,
    The treatment tank is characterized by including, on the outside of two side wall portions located at both ends in the reciprocating direction, a buffer tank that communicates with the first tank and the second tank and stores the treatment liquid. Surface treatment equipment.
  7. 　請求項５において、
    　前記処理槽は、前記往復方向と平行な方向で連結され、かつ、第１バッファ槽により区画される第１処理槽と第２処理槽とを含み、
    　前記治具は、第１ワークを保持して前記第１処理槽を前記第１槽と前記第２槽とに区画する第１治具と、第２ワークを保持して前記第２処理槽を前記第１槽と前記第２槽とに区画する第２治具と、を含み、
    　前記第１バッファ槽は、前記第１処理槽の前記第１槽と、前記第２処理槽の前記第１槽と、前記第１処理槽の前記第２槽と、前記第２処理槽の前記第２槽との間で前記処理液を流通させ、
    　前記第１処理槽は、前記往復方向の一端に位置する第１側壁部の外側に、前記第１処理槽中の前記第１槽及び前記第２槽の間で前記処理液を流通させる第２バッファ槽を含み、
    　前記第２処理槽は、前記往復方向の他端に位置する第２側壁部の外側に、前記第２処理槽中の前記第１槽及び前記第２槽の間で前記処理液を流通させる第３バッファ槽を含むことを特徴とする表面処理装置。     In claim 5,
    The treatment tank includes a first treatment tank and a second treatment tank which are connected in a direction parallel to the reciprocating direction and are partitioned by a first buffer tank.
    The jig holds the first work and divides the first treatment tank into the first tank and the second tank, and holds the second work and holds the second treatment tank. A second jig for partitioning the first tank and the second tank is included.
    The first buffer tank is the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second treatment tank. The treatment liquid is circulated between the second tank and the treatment liquid.
    In the first treatment tank, the treatment liquid is circulated between the first tank and the second tank in the first treatment tank on the outside of the first side wall portion located at one end in the reciprocating direction. Including buffer tank
    In the second treatment tank, the treatment liquid is circulated between the first tank and the second tank in the second treatment tank on the outside of the second side wall portion located at the other end in the reciprocating direction. A surface treatment apparatus comprising 3 buffer tanks.
PCT/JP2021/032786 2020-09-16 2021-09-07 Surface treatment device WO2022059554A1 (en)

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JP2005008911A (en) * 2003-06-16 2005-01-13 Ebara Corp Stirring method of plating solution and plating apparatus
JP2018127649A (en) * 2017-02-06 2018-08-16 株式会社荏原製作所 A paddle, a plating apparatus with the paddle and plating method
JP2019183223A (en) * 2018-04-10 2019-10-24 上村工業株式会社 Surface treatment apparatus, surface treatment method, and paddle

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