WO2021246092A1 - Component mounting line, inspection device, and inspection method - Google Patents

Component mounting line, inspection device, and inspection method Download PDF

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Publication number
WO2021246092A1
WO2021246092A1 PCT/JP2021/016758 JP2021016758W WO2021246092A1 WO 2021246092 A1 WO2021246092 A1 WO 2021246092A1 JP 2021016758 W JP2021016758 W JP 2021016758W WO 2021246092 A1 WO2021246092 A1 WO 2021246092A1
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WO
WIPO (PCT)
Prior art keywords
component
mounting
mounting position
measurement
unit
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PCT/JP2021/016758
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French (fr)
Japanese (ja)
Inventor
昌弘 谷口
正宏 木原
利彦 永冶
勝彦 赤坂
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN202180038663.0A priority Critical patent/CN115804256A/en
Priority to JP2022528491A priority patent/JPWO2021246092A1/ja
Publication of WO2021246092A1 publication Critical patent/WO2021246092A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to a component mounting line including a component mounting device for mounting a component on a board and an inspection device for inspecting a component mounted on the board, an inspection device constituting this component mounting line, and an inspection method by the inspection device.
  • a parts mounting line equipped with a parts mounting device that picks up parts by a mounting head and mounts them on a board and an inspection device that receives a board carried out from the parts mounting device and inspects the parts mounted on the board is known.
  • the component mounting device measures the position of the component picked up by the mounting head, and mounts the component on the board based on the measured position of the component.
  • the inspection device measures the position where the component is actually mounted as the mounting position based on the image (inspection image) obtained by imaging the component mounted on the board from above, and measures the mounting position and the board on the board. The position deviation from the target mounting position is obtained.
  • Information about the mounting position measured by the inspection device is fed back to the component mounting device and used to correct the operating parameters of the mounting head when the component mounting device mounts the component on the board (for example, the following). Refer to Patent Document 1).
  • the component mounting line of the present disclosure includes a component mounting device for mounting components on a board, and an inspection device that receives the board carried out from the component mounting device and inspects each component mounted on the board by the component mounting device.
  • a component mounting line comprising the above, wherein the inspection device has an image acquisition unit that acquires an image of each component mounted on the substrate, and the image of each component acquired by the image acquisition unit. Based on this, a measurement unit that measures the position of each component on the substrate as the mounting position of the component, and a determination unit that determines whether or not the measurement of the mounting position by the measurement unit is normally performed for each component.
  • a generation unit that generates component recognition information, which is information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit for each component for which the determination is made by the determination unit, is provided.
  • the generation unit generates the first component recognition information as the component recognition information for the component for which the determination unit determines that the measurement of the mounting position has been normally performed, and the determination unit normally measures the mounting position.
  • the second part recognition information is generated as the part recognition information for the parts determined not to be carried out.
  • the inspection device of the present disclosure is an inspection device for inspecting each component mounted on a substrate, and is an image acquisition unit that acquires an image of each component mounted on the substrate, and the image acquisition unit acquired by the image acquisition unit. Based on the image of each component, the measuring unit that measures the position of each component on the substrate as the mounting position of the component, and whether or not the measurement of the mounting position by the measuring unit is normally performed is determined by each of the above.
  • a determination unit for determining a component and a generation for generating component recognition information which is information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit for each component for which the determination is made by the determination unit.
  • the generation unit is provided with a unit, and the generation unit generates first component recognition information as the component recognition information for a component for which the determination unit determines that the measurement of the mounting position has been normally performed, and the determination unit generates the first component recognition information.
  • the second part recognition information is generated as the part recognition information for the parts for which it is determined that the measurement of the mounting position has not been performed normally.
  • the inspection method of the present disclosure is an inspection method for inspecting each component mounted on a substrate, and includes a measurement step of measuring the position of each component mounted on the substrate on the substrate as the mounting position of the component.
  • the generation step includes a generation step of generating component recognition information which is information indicating whether or not the above is normally performed, and the generation step includes parts for which the measurement of the mounting position is normally determined in the determination step. Generates the first component recognition information as the component recognition information, and generates the second component recognition information as the component recognition information for the component determined that the measurement of the mounting position was not normally performed in the determination step. ..
  • FIG. 1 is a block diagram of a component mounting line according to an embodiment of the present disclosure.
  • FIG. 2 is a perspective view of a component mounting device included in the component mounting line according to the embodiment of the present disclosure.
  • FIG. 3 is a block diagram showing a control system of a component mounting line according to an embodiment of the present disclosure.
  • FIG. 4 is a perspective view of an inspection device included in the component mounting line according to the embodiment of the present disclosure.
  • FIG. 5 is a plan view of an example of a substrate inspected by an inspection device included in the component mounting line according to the embodiment of the present disclosure.
  • FIG. 6 is a diagram showing an example of an image obtained by one imaging of an inspection camera included in the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 1 is a block diagram of a component mounting line according to an embodiment of the present disclosure.
  • FIG. 2 is a perspective view of a component mounting device included in the component mounting line according to the embodiment of the present disclosure.
  • FIG. 3
  • FIG. 7 is a diagram illustrating a component misalignment calculated by an inspection device for a component mounting line according to an embodiment of the present disclosure.
  • FIG. 8 is a diagram illustrating a first method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 9A is a diagram illustrating a first method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 9B is a diagram illustrating a first method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10A is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10B-1 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10B-2 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10C-1 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10C-2 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10C-1 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 10C-2 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 11A is a diagram showing parts in an inspection image for explaining a third method of judgment made by a judgment unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 11B is an inspection image in which a component for explaining a third method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure is mounted without tilting. It is a figure which shows the component of.
  • FIG. 11C is a side view of a component corresponding to an inspection image for explaining a third method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 12 is a flowchart showing a flow of inspection work executed by the inspection device of the component mounting line according to the embodiment of the present disclosure.
  • FIG. 13 is a flowchart showing a flow of operation parameter correction processing work executed by the component mounting device of the component mounting line according to the embodiment of the present disclosure.
  • an object of the present disclosure is to provide a component mounting line, an inspection device, and an inspection method capable of improving the reliability of correction of operating parameters in the component mounting device.
  • FIG. 1 shows a configuration diagram of a component mounting line 1 according to an embodiment of the present disclosure.
  • the component mounting line 1 includes a component mounting device 11, an inspection device 12, and a management device 13.
  • the component mounting device 11 receives the board KB from the device on the upstream side (for example, a solder printing device), and mounts the component BH on the board KB.
  • the inspection device 12 is arranged on the downstream side of the component mounting device 11, receives the board KB carried out from the component mounting device 11, and inspects the component BH mounted on the board KB.
  • the management device 13 is connected to the component mounting device 11 and the inspection device 12 in a communicable state, and manages the component mounting device 11 and the inspection device 12.
  • FIG. 2 is a perspective view of the component mounting device 11 included in the component mounting line 1.
  • the component mounting device 11 includes a board transport path 21, a component supply unit 22, a mounting head 23, a head moving mechanism 24, a component camera 25, a mounting device input / output unit 26, and a mounting device control unit 27.
  • the board transport path 21 carries in, positions, and carries out the board KB.
  • the component supply unit 22 is composed of, for example, a tape feeder, and supplies the component BH to a predetermined position.
  • the mounting head 23 includes a nozzle 23N extending downward. The mounting head 23 can raise and lower the nozzle 23N and rotate it around the vertical axis, and can attract the component BH supplied by the component supply unit 22 to the lower end of the nozzle 23N.
  • the head moving mechanism 24 includes an XY table mechanism including a fixed beam 24a and a moving beam 24b that is movable with respect to the fixed beam 24a.
  • the head moving mechanism 24 moves the mounting head 23 in a horizontal plane by combining an operation of moving the moving beam 24b with respect to the fixed beam 24a and an operation of moving the mounting head 23 with respect to the moving beam 24b.
  • the mounting head 23 picks up and picks up the component BH supplied by the component supply unit 22 by moving in a horizontal plane, raising and lowering and rotating the nozzle 23N, and sucking and releasing the component BH by the nozzle 23N.
  • the component BH is mounted on the board KB.
  • the component camera 25 is provided between the substrate transport path 21 and the component supply unit 22 with the imaging field of view facing upward.
  • the component camera 25 takes an image of the component BH from below when the mounting head 23 having the component BH adsorbed on the lower end of the nozzle 23N moves upward.
  • the image of the component BH (image before mounting) obtained by imaging the component camera 25 is used for measuring the position of the component BH (position before mounting), recognizing the component BH, and the like.
  • the mounting device input / output unit 26 is composed of, for example, a touch panel.
  • the mounting device input / output unit 26 accepts the input operation by the operator, and notifies the operator of the work to be performed by the operator, various information, and the like by screen, voice, and the like.
  • FIG. 3 is a block diagram showing a control system of the component mounting line 1.
  • the mounting device control unit 27 includes a mounting device storage unit 31, a mounting control unit 32, a mounting device communication unit 33, and a feedback control unit 34.
  • the feedback control unit 34 includes a mounting position information acquisition unit 41, a component recognition information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information aggregation unit 45.
  • the mounting device storage unit 31 stores data (mounting data) and a mounting program necessary for mounting the component BH on the board KB.
  • the mounting data includes data such as target coordinates that are mounting target positions of the component BH to be mounted on the substrate KB, the type of the component BH to be mounted at the target coordinates, and the mounting direction.
  • each part (part supply unit 22, mounting head 23) of the component mounting device 11 is mounted so that a predetermined type of component BH is mounted at a predetermined position (target coordinates) in a predetermined mounting direction according to the mounting data. , Head movement mechanism 24, component camera 25, etc.).
  • the mounting control unit 32 operates the board transport path 21, the component supply unit 22, the mounting head 23, and the head moving mechanism 24 based on the mounting program.
  • the board transport path 21 carries in and positions the board KB
  • the component supply unit 22 supplies the component BH
  • the head moving mechanism 24 and the mounting head 23 operate in conjunction with each other to repeatedly execute the mounting turn.
  • the component BH is mounted on the board KB one after another.
  • the mounting head 23 executes an operation of picking up the component BH (pickup operation), an operation of recognizing the component BH (recognition operation), and an operation of mounting the component BH (mounting operation) in this order. It is operated like this.
  • the pickup operation the mounting head 23 moves above the component supply unit 22 and attracts the component BH supplied by the component supply unit 22 to the nozzle 23N.
  • the recognition operation the mounting head 23 moves above the component camera 25, and the component camera 25 captures the component BH attracted to the nozzle 23N from below.
  • the mounting head 23 moves above the board KB and mounts the component BH imaged by the component camera 25 at the target coordinates on the board KB.
  • the mounting control unit 32 causes the component camera 25 to image the component BH and acquires an image of the component BH (the above-mentioned pre-mounting image).
  • the mounting control unit 32 measures the position of the component BH based on the acquired pre-mounting image. In the measurement of the position of the component BH, the position of the center of the component BH is obtained by a predetermined method, and the determined position of the center of the component BH is measured as the position of the component BH.
  • the mounting control unit 32 moves the mounting head 23 so that the mounting head 23 is mounted so that the center position of the obtained component BH matches the target coordinates defined as the mounting data.
  • the mounting device communication unit 33 is connected to a state in which communication is possible with both the management device 13 and the inspection device 12. Therefore, the mounting device communication unit 33 can receive the information detected by the inspection device 12 directly as feedback information via the management device 13 or without the management device 13.
  • the feedback control unit 34 performs feedback processing based on the feedback information from the received inspection device 12.
  • the main content of the feedback process is the correction of the operating parameters of the mounting head 23 when the component mounting device 11 mounts the component BH on the board KB.
  • the "operation parameter" is control data for operating the mounting head 23 so that the component BH is mounted at the target coordinates on the board KB.
  • the feedback control unit 34 will be described after the description of the inspection device 12.
  • FIG. 4 is a perspective view of the inspection device 12.
  • the inspection device 12 includes a substrate transport unit 51, an inspection camera 52, a camera moving mechanism 53, an inspection device input / output unit 54, and an inspection device control unit 55.
  • the board transfer unit 51 carries in, positions, and carries out the board KB.
  • the inspection camera 52 directs the imaging field of view downward, and by taking an image in a state of being located above the substrate KB, the component BH mounted on the substrate KB by the component mounting device 11 is imaged from above. That is, in the present embodiment, the inspection camera 52 is an image acquisition unit that acquires an image (inspection image) of each component BH mounted on the substrate KB.
  • the image (inspection image) of the component BH obtained by imaging the inspection camera 52 is used for measuring the position (mounting position) of the component BH on the substrate KB.
  • the camera moving mechanism 53 includes an XY table mechanism including a fixed side beam 53a and a moving side beam 53b that is movable with respect to the fixed side beam 53a, and moves the inspection camera 52 in the horizontal direction.
  • the camera moving mechanism 53 moves the inspection camera 52 in a horizontal plane by combining an operation of moving the moving side beam 53b with respect to the fixed side beam 53a and an operation of moving the inspection camera 52 with respect to the moving side beam 53b. Move it.
  • the inspection device input / output unit 54 is composed of, for example, a touch panel.
  • the inspection device input / output unit 54 accepts input operations by the operator and notifies the operator of the work to be performed and various information by screen, voice, or the like.
  • the inspection device control unit 55 includes an inspection device storage unit 61, an inspection image acquisition control unit 62, a measurement unit 63, a determination unit 64, a determination unit 65, a generation unit 66, and an inspection device communication unit 67. ing.
  • the inspection device storage unit 61 stores an inspection program.
  • the inspection program is to inspect whether each component BH mounted on the board KB by the component mounting device 11 is mounted in a predetermined direction at the target coordinates specified in the mounting data, etc., in order to inspect each part of the inspection device 12 ( This is a control program for operating the board transfer unit 51, the inspection camera 52, the camera moving mechanism 53, etc.).
  • the inspection image acquisition control unit 62 acquires an inspection image for each component BH by capturing all of the plurality of component BHs mounted on the substrate KB with the inspection camera 52. At this time, the inspection image acquisition control unit 62 moves the inspection camera 52 above the board KB positioned by the board transfer unit 51 based on the inspection program stored in the inspection device storage unit 61, and moves the inspection camera 52 to the inspection camera 52. The imaging operation is repeated.
  • the number of component BHs included in the inspection image acquired by the inspection camera 52 in one imaging operation may be one or a plurality, depending on the arrangement state of the components BH on the substrate KB.
  • FIG. 5 is a plan view of an example of a substrate inspected by the inspection device 12.
  • FIG. 5 shows an example of the substrate KB inspected by the inspection apparatus 12, and each of the plurality of alternate long and short dash line regions AR shown in FIG. 5 is a region on the substrate KB obtained by one imaging of the inspection camera 52. Is shown.
  • FIG. 6 is a diagram showing an example of an image (inspection image GZ) obtained by one imaging of the inspection camera 52. In FIG. 6, a plurality of component BHs are included in the inspection image GZ.
  • the measurement unit 63 is based on each of the plurality of images (inspection image GZ) obtained by the imaging of the inspection camera 52, and the position of one or a plurality of component BHs included in each inspection image GZ on the substrate KB (described above). (Mounting position) is measured. In the measurement of the mounting position of the component BH, the measuring unit 63 measures the position of the center ZP (see FIG. 6) of the component BH based on the inspection image GZ acquired by the inspection image acquisition control unit 62.
  • the mounting position of the component BH is calculated from the position of the center ZP of the component BH in the inspection image GZ (the position based on the origin OR of the inspection image GZ) and the position of the origin OR of the inspection image GZ with respect to the substrate KB.
  • the position of the origin OR of the inspection image GZ can be obtained from the position of the inspection camera 52 when the inspection image GZ is acquired.
  • the measuring unit 63 compares the position of the center ZP of the component BH with the target coordinates of the component BH stored in the inspection device storage unit 61 for each component BH whose mounting position is measured. Find the position deviation of the component BH from the target coordinates.
  • FIG. 7 is a diagram for explaining the positional deviation of the parts calculated by the inspection device 12.
  • FIG. 7 shows a state in which the position of the center ZP of the target component BH deviates from the target coordinates MZ.
  • the position between the position of the center ZP of the component BH and the position of the target coordinate MZ The difference (DX) in the X-axis direction and the difference (DY) in the Y-axis direction are obtained as the positional deviation (DX, DY) of the component BH.
  • the determination unit 64 makes a quality determination for determining whether or not the mounting state of the component BH is good for each component BH for which the mounting position has been determined by the measuring unit 63. Specifically, the positional deviation of the component BH obtained by the measuring unit 63 is compared with the allowable value determined corresponding to the component BH, and it is determined whether or not the positional deviation is equal to or less than the allowable value. .. Then, when the misalignment of the component BH is equal to or less than the permissible value, it is determined that the mounting state of the component BH is good, and when the misalignment of the component BH exceeds the permissible value, the mounting of the component BH is performed. The condition is determined to be defective.
  • the allowable value data for each component BH is stored in the inspection device storage unit 61.
  • the mounting state of the component BH is good when DX ⁇ RX and DY ⁇ RY. If DX> RX or DY> RY, it is determined that the mounting state of the component BH is defective.
  • a quality determination is made for each of the plurality of component BHs included in the inspection image GZ.
  • the determination unit 65 determines whether or not the measurement of the mounting position by the measuring unit 63 has been normally performed for each component BH whose mounting position has been measured by the measuring unit 63. In this embodiment, this determination is performed by any of the following first, second, and third methods.
  • FIGS. 8 to 9B are diagrams illustrating a first method of determination made by the determination unit 65 of the inspection device 12.
  • the determination unit 65 determines whether or not the entire component BH in the inspection image GZ is located in the measurement area KA set for the component BH, as shown in FIG. It is designed to do.
  • the measurement area KA has a shape and a size corresponding to the component BH, and is set to the target coordinate MZ of the component BH.
  • the determination unit 65 compares the component BH with the measurement area KA, and if the entire component BH is located in the measurement area KA as shown in FIG. 9A, the component BH is about the component BH. It is judged that the measurement of the mounting position of the component BH was performed normally, and when at least a part of the component BH is located outside the measurement area KA as shown in FIG. 9B, the mounting position of the component BH is measured. Judges that it was not carried out normally.
  • FIGS. 10A to 10C-2 are diagrams illustrating a second method of determination made by the determination unit 65 of the inspection device 12.
  • the determination unit 65 performs pattern matching processing between the inspection image GZ and the reference pattern of the component BH, and calculates the matching rate between the region occupied by the component BH in the inspection image GZ and the reference pattern. It has become.
  • This pattern matching process is performed by a known method. For example, when the region BR occupied by the component BH in the inspection image GZ with respect to the reference pattern KP shown in FIG. 10A is a region as shown in FIGS. 10B-1 and 10B-2, the reference pattern KP and the region The matching rate is calculated from the reference pattern KP as shown in FIGS. 10C-1 and 10C-2 obtained by matching the central ZPs of the BR with each other.
  • the determination unit 65 calculates the matching rate, and then compares the calculated matching rate with the matching rate of a predetermined standard.
  • the matching rate is equal to or higher than the standard matching rate, it is determined that the measurement of the mounting position of the component BH has been normally performed.
  • the calculated matching rate is lower than the standard matching rate, it is determined that the measurement of the mounting position of the component has not been performed normally.
  • the standard matching rate is, for example, 80%.
  • 11A to 11C are diagrams for explaining a third method of determination made by the determination unit 65 of the inspection device 12.
  • the determination unit 65 compares the dimension (measurement dimension) obtained by measuring the dimension of the part BH in the inspection image GZ with the reference dimension, and measures the difference between the measurement dimension and the reference dimension. It is designed to be calculated as a difference.
  • the measurement dimension of the component BH in the X-axis direction is X1
  • the measurement dimension in the Y-axis direction is Y1.
  • the reference dimension is a dimension obtained from the design value of the component BH, and is a component in the inspection image GZ (in the figure) when the substrate KB is mounted without tilting or the like as shown in FIG. 11B.
  • the symbol is "BHa").
  • the reference dimension in the X-axis direction is X0
  • the reference dimension in the Y-axis direction is Y0.
  • a dimensional difference occurs between the measured dimension and the reference dimension, for example, as shown in FIG. 11C, a part of the component BH is mounted on the substrate KB in a state of being lifted from the surface of the substrate KB. It is a case like that.
  • the determination unit 65 obtains the measured dimension from the component BH in the inspection image GZ, compares this with the reference dimension, calculates the dimensional difference, and then transfers the calculated dimensional difference to the component BH. Compare with the corresponding standard dimensional difference. Then, when the calculated dimensional difference is equal to or less than the reference dimensional difference, it is determined that the measurement of the mounting position of the component BH has been normally performed. On the other hand, if the calculated dimensional difference exceeds the reference dimensional difference, it is determined that the measurement of the mounting position of the component BH has not been performed normally.
  • the determination unit 65 compares these dimensional differences ( ⁇ X, ⁇ Y) with the reference dimensional differences (DX, DY), and when both ( ⁇ X, ⁇ Y) are equal to or less than the standard dimensional differences ( ⁇ X ⁇ DX and ⁇ Y ⁇ DY). If there is), it is judged that the measurement of the mounting position of the component BH was normally performed.
  • the generation unit 66 generates information (part recognition information) indicating whether or not the measurement of the mounting position is normally performed by the measurement unit 63 for each component BH for which the above determination is made by the determination unit 65. Specifically, the generation unit 66 generates the first component recognition information as the component recognition information for the component BH for which the determination unit 65 determines that the measurement of the mounting position has been normally performed, and the determination unit 65 mounts the component BH. For the parts for which it is determined that the position measurement has not been performed normally, the second part recognition information is generated as the part recognition information.
  • the inspection device communication unit 67 is connected to a state in which communication is possible with both the management device 13 and the component mounting device 11.
  • the inspection device communication unit 67 contains information (mounting position information) regarding the mounting position of each component BH measured by the measuring unit 63, and component recognition information (part recognition information) for each component BH on the board KB generated by the generating unit 66.
  • the first component recognition information or the second component recognition information) is transmitted to the component mounting device 11 directly via the management device 13 or not via the management device 13.
  • the feedback control unit 34 included in the mounting device control unit 27 includes a mounting position information acquisition unit 41, a component recognition information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information aggregation unit 45.
  • the mounting position information acquisition unit 41 describes each component BH on the substrate KB from the inspection device 12 directly from the inspection device communication unit 67 of the inspection device 12 via the management device 13 or directly without the management device 13. Acquire mounting position information.
  • the component recognition information acquisition unit 42 describes each component BH on the substrate KB from the inspection device 12 directly from the inspection device communication unit 67 of the inspection device 12 via the management device 13 or directly without the management device 13. Acquire part recognition information.
  • the confirmation unit 43 confirms whether or not the measurement of the mounting position for each component BH has been normally performed based on the component recognition information for each component BH acquired by the component recognition information acquisition unit 42.
  • each part acquired by the component recognition information acquisition unit 42 is associated with the first component recognition information as the component recognition information, or the second component recognition information is associated with the component recognition information. It is sorted according to whether it is present or not.
  • the correction unit 44 corrects the operation parameters when the component mounting device 11 mounts each component BH on the board KB by using the information (mounting position information) regarding the mounting position acquired by the mounting position information acquisition unit 41. Specifically, the correction unit 44 operates using the mounting position information acquired by the mounting position information acquisition unit 41 for the component BH for which the measurement of the mounting position has been normally confirmed by the confirmation unit 43. Correct the parameters. On the other hand, the correction unit 44 uses the mounting position information acquired by the mounting position information acquisition unit 41 as an operation parameter for the component BH for which the measurement of the mounting position has not been normally performed by the confirmation unit 43. Do not correct.
  • the information totaling unit 45 aggregates information on the mounting accuracy of the component BH using the mounting position information acquired by the mounting position information acquisition unit 41. Specifically, the information aggregation unit 45 uses the mounting position information acquired by the mounting position information acquisition unit 41 for the component BH for which the measurement of the mounting position has been normally confirmed by the confirmation unit 43. Information on the mounting accuracy of the component BH is aggregated. On the other hand, the information totaling unit 45 uses the mounting position information acquired by the mounting position information acquisition unit 41 to BH for the component BH for which the confirmation unit 43 has confirmed that the measurement of the mounting position has not been performed normally. Does not aggregate information about mounting accuracy. As a result, the determination of the mounting accuracy of the component BH is deteriorated due to an accidental mounting defect such as a simple pickup error of the component BH by the mounting head 23 (the mounting accuracy is evaluated low). Is prevented.
  • the component mounting device 11 When the component mounting work of mounting the component BH on the board KB is performed by the component mounting line 1 having such a configuration, the component mounting device 11 first uses the board transport path 21 to be upstream of the device (for example, a solder printing device). The board KB is received from the above and positioned at a predetermined component mounting work position. Then, the component BH supplied by the component supply unit 22 is picked up by the mounting head 23, and the mounting turn of mounting the component BH on the board KB is repeatedly executed. As a result, when all the parts BH to be mounted on the board KB are mounted, the component mounting device 11 carries out the board KB to the inspection device 12 on the downstream side.
  • the board transport path 21 for example, a solder printing device.
  • the inspection device 12 receives the board KB carried out from the component mounting device 11 by the board transfer unit 51, carries it in, and positions it at a predetermined inspection position. Then, the inspection work for each component BH mounted on the board KB is executed.
  • the flowchart shown in FIG. 12 shows an execution procedure (inspection method by the inspection device 12) of this inspection work.
  • the inspection device 12 first carries in and positions the board KB carried out from the component mounting device 11 (step ST1 shown in FIG. 12).
  • the inspection camera 52 is moved by the camera moving mechanism 53 to acquire an image (inspection image GZ) of each component BH on the substrate KB (step ST2, image acquisition step).
  • the inspection device 12 measures the mounting position for each component BH based on the inspection image GZ (measurement step in step ST3). Acquire mounting position information about the component BH (step ST4).
  • the inspection device 12 After acquiring the mounting position information for each component BH, the inspection device 12 determines whether the mounting state of each component BH is good or bad based on the mounting position information for each component BH (step ST5).
  • the component BH which is determined to be in a bad state of being mounted on the board KB by this pass / fail determination, is notified to the operator through the inspection device input / output unit 54. Therefore, the operator takes out the board KB having the component BH determined to be defective in the mounted state when the board KB is carried out from the inspection device 12, and corrects the mounted state of the component BH as necessary. be able to.
  • the inspection device 12 After determining the quality of each component BH mounted on the board KB, the inspection device 12 designates one of the plurality of component BHs whose mounting position information has been acquired in step ST4 (step ST6). Then, it is determined whether or not the mounting position of the designated component BH is normally measured in the measurement step of step ST3 (step ST7, determination step). The inspection device 12 generates (generates) component recognition information, which is information indicating whether or not the mounting position is normally measured in the measurement step of step ST3, for each component BH for which the above determination is made in this determination step. Process).
  • step ST7 For the component BH for which it is determined that the mounting position measurement has been normally performed (Yes (Y) in step ST7), the first component recognition information is generated (step ST8), and the mounting position measurement is normally performed. For the component BH determined not to be performed (No (N) in step ST7), the second component recognition information is generated (step ST9).
  • the inspection device 12 determines whether or not there is a part BH that has not been specified yet (step ST10). ). Then, if there is a component BH that has not been specified yet, the process returns to step ST6 (Y in step ST10), a new component BH that has not been specified is specified, and the processes of steps ST7 to ST9 are performed. .. On the other hand, if there is no part BH that has not been specified yet in step ST10 (N in step ST10), the mounting position information and the part recognition information for each part BH obtained so far are transmitted via the management device 13.
  • step ST11 Or directly to the component mounting device 11 without going through the management device 13 (step ST11). Then, when the inspection device 12 transmits the mounting position information and the component recognition information for all the component BHs to the component mounting device 11, the board KB is carried out to a device on the downstream side (for example, a reflow device) (step ST12). The inspection work for the substrate KB is completed.
  • a device on the downstream side for example, a reflow device
  • the component mounting device 11 mounts the component BH on the board KB carried in from the upstream side and carries it out to the inspection device 12, but before mounting the component BH on the board KB, the component BH is already mounted.
  • the operation parameter correction processing work is performed based on the information.
  • the flowchart shown in FIG. 13 shows an execution procedure of the operation parameter correction processing work.
  • the component mounting device 11 performs the operation parameter correction processing work, first, with respect to the board KB that has received the result of the inspection work from the inspection device 12, one of a plurality of component BHs mounted on the board KB is used. Specify (step ST21 shown in FIG. 13). Then, based on the component recognition information acquired for the designated component BH, it is confirmed whether or not the measurement of the mounting position for the component BH has been normally performed (step ST22).
  • the component mounting device 11 corrects the operating parameters using the mounting position information (Y in step ST22) for the component BH for which it is confirmed that the mounting position was normally measured in step ST22 (step ST23). ), Information on mounting accuracy is aggregated using the mounting position information (step ST24). On the other hand, for the component BH in which it was confirmed that the measurement of the mounting position was not normally performed in step ST22 (N in step ST22), the operation parameter was not corrected (step ST25), and the mounting position information was used. Information on mounting accuracy is not aggregated (step ST26).
  • step ST24 or step ST26 the component mounting device 11 determines whether or not there is a component that has not been specified yet (step ST27). Then, if there is a component BH that has not been specified yet (Y in step ST27), the process returns to step ST21, specifies a new component BH that has not been specified yet, and then performs the processes of steps ST22 to S26. On the other hand, if there is no unspecified component BH in step ST27 (N in step ST27), the operation parameter correction processing work for the substrate KB is terminated. When a new operation parameter is obtained by performing the operation parameter correction processing work, the component mounting device 11 updates the value of the operation parameter up to that point, and uses the updated operation parameter to mount the mounting head 23. It is operated and the component BH is mounted on the board KB.
  • the inspection device 12 acquires the inspection image GZ of each component BH mounted on the substrate KB, and is based on the acquired inspection image GZ of each component BH.
  • the position of each component BH on the board KB is measured as the mounting position of the component BH (measurement step of step ST3), and it is determined whether or not the measurement of the mounting position is normally performed (measurement step). Judgment step of step ST7).
  • the first component recognition information is generated as the component recognition information for the component BH for which the measurement of the mounting position is determined to be normally performed, and the component BH for which the measurement of the mounting position is determined not to be performed normally is generated.
  • the second part recognition information is generated as the part recognition information (the generation step of step ST8 or step ST9).
  • the component mounting device 11 acquires the component recognition information (first component recognition information or the second component recognition information) for each generated component BH, and acquires the component recognition information. Based on the component recognition information for each component BH, it is confirmed whether or not the measurement of the mounting position for each component BH has been normally performed. Then, for the component BH for which it has been confirmed that the measurement of the mounting position has been performed normally, the operation parameters are corrected based on the mounting position information acquired from the inspection device 12, and the mounting position information is aggregated for mounting. For the component BH for which it has been confirmed that the position measurement has not been performed normally, the operation parameters are not corrected and the mounting position information is not aggregated.
  • the unreliable data of the inspection result of the component BH is not used as the feedback information, and only the highly reliable data of the inspection result is used as the feedback information to correct the operation parameters.
  • the mounting position information is aggregated. Therefore, according to the component mounting line 1 in the present embodiment, it is possible to improve the reliability of the correction of the operating parameters in the component mounting device 11 and the aggregation result of the mounting position information (information on the mounting accuracy of the component BH).
  • the inspection device 12 when the inspection device 12 measures the mounting position of each component BH mounted on the board KB, it is checked whether the measurement is normally performed. Whether or not it is determined for each component BH is determined, and only for the component BH for which the measurement of the mounting position is determined to be performed normally, the operating parameters of the component mounting device 11 for that component are corrected (the measurement of the mounting position is normally performed). The operating parameters are not corrected for the component BH that is determined not to be implemented). Therefore, the component mounting device 11 can correct the operating parameters based only on the highly reliable data among the inspection results of the inspection device 12.
  • the component mounting line 1 (or the inspection method by the inspection device 12 and the inspection device 12) in the present embodiment, it is possible to improve the reliability of the correction of the operating parameters in the component mounting device 11, and by extension, the component BH. It is possible to produce high-quality substrates with high mounting accuracy.
  • the first, second, and third methods are shown as methods for the determination unit 65 of the inspection device 12 to determine whether or not the measurement of the mounting position by the measurement unit 63 has been normally performed.
  • the determination unit 65 may use another method to determine whether or not the measurement of the mounting position has been normally performed.
  • the inspection device 12 transmits the mounting position information and the component recognition information for each component BH to the component mounting device 11 in step ST11 shown in FIG.
  • the component BH for which the second component recognition information is generated is not subsequently used as feedback information in the component mounting device 11. Therefore, the inspection device 12 may not transmit the mounting position information to the component mounting device 11 in step ST11 for the mounting position information of the component BH for which the second component recognition information was generated in step ST9.
  • each component may be configured by dedicated hardware or may be realized by executing a software program suitable for each component.
  • Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.
  • a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

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Abstract

Provided is a component mounting line comprising a component mounting device for mounting a component onto a substrate, and an inspection device for receiving a substrate unloaded from the component mounting device and inspecting the component that the component mounting device mounted onto the substrate. The inspection device acquires an image of the component mounted on the substrate, measures the position of the component on the substrate on the basis of the acquired image, and determines whether the position measurement has been performed normally. With respect to a component for which the position measurement is determined to have been performed normally, the inspection device generates first component recognition information. With respect to a component for which the position measurement is determined to have not been performed normally, the inspection device generates second component recognition information.

Description

部品装着ライン、検査装置および検査方法Parts mounting line, inspection equipment and inspection method
　本開示は、基板に部品を装着する部品装着装置と基板に装着された部品を検査する検査装置とを備えた部品装着ライン、この部品装着ラインを構成する検査装置および検査装置による検査方法に関する。 The present disclosure relates to a component mounting line including a component mounting device for mounting a component on a board and an inspection device for inspecting a component mounted on the board, an inspection device constituting this component mounting line, and an inspection method by the inspection device.
　従来、装着ヘッドにより部品をピックアップして基板に装着する部品装着装置と、部品装着装置から搬出された基板を受け取り、基板に装着された部品を検査する検査装置とを備えた部品装着ラインが知られている。この部品装着ラインにおいて、部品装着装置は、装着ヘッドによりピックアップした部品の位置を計測し、その計測した部品の位置に基づいて部品を基板に装着するようになっている。また、検査装置は、基板に装着された部品を上方から撮像して得られる画像（検査画像）に基づいて、部品が実際に装着された位置を装着位置として計測し、装着位置と基板上の目標装着位置との間の位置ずれ等を求めるようになっている。検査装置で計測された装着位置に関する情報は部品装着装置にフィードバックされ、部品装着装置が基板に部品を装着する際の装着ヘッドの動作パラメータの補正に利用されるようになっている（例えば、下記の特許文献１参照）。 Conventionally, a parts mounting line equipped with a parts mounting device that picks up parts by a mounting head and mounts them on a board and an inspection device that receives a board carried out from the parts mounting device and inspects the parts mounted on the board is known. Has been done. In this component mounting line, the component mounting device measures the position of the component picked up by the mounting head, and mounts the component on the board based on the measured position of the component. In addition, the inspection device measures the position where the component is actually mounted as the mounting position based on the image (inspection image) obtained by imaging the component mounted on the board from above, and measures the mounting position and the board on the board. The position deviation from the target mounting position is obtained. Information about the mounting position measured by the inspection device is fed back to the component mounting device and used to correct the operating parameters of the mounting head when the component mounting device mounts the component on the board (for example, the following). Refer to Patent Document 1).
特開２０１９－１３４０５１号公報Japanese Unexamined Patent Publication No. 2019-134051
　本開示の部品装着ラインは、基板に部品を装着する部品装着装置と、前記部品装着装置から搬出された前記基板を受け取り、前記部品装着装置により前記基板に装着された各部品を検査する検査装置とを備えた部品装着ラインであって、前記検査装置は、前記基板に装着された前記各部品の画像を取得する画像取得部と、前記画像取得部により取得された前記各部品の前記画像に基づいて、前記各部品の前記基板における位置をその部品の装着位置として計測する計測部と、前記計測部による前記装着位置の計測が正常に実施されたか否かを前記各部品について判断する判断部と、前記判断部により前記判断がなされた前記各部品について前記計測部により前記装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する生成部とを備え、前記生成部は、前記判断部により前記装着位置の計測が正常に実施されたと判断された部品については前記部品認識情報として第１部品認識情報を生成し、前記判断部により前記装着位置の計測が正常に実施されなかったと判断された部品については前記部品認識情報として第２部品認識情報を生成する。 The component mounting line of the present disclosure includes a component mounting device for mounting components on a board, and an inspection device that receives the board carried out from the component mounting device and inspects each component mounted on the board by the component mounting device. A component mounting line comprising the above, wherein the inspection device has an image acquisition unit that acquires an image of each component mounted on the substrate, and the image of each component acquired by the image acquisition unit. Based on this, a measurement unit that measures the position of each component on the substrate as the mounting position of the component, and a determination unit that determines whether or not the measurement of the mounting position by the measurement unit is normally performed for each component. A generation unit that generates component recognition information, which is information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit for each component for which the determination is made by the determination unit, is provided. The generation unit generates the first component recognition information as the component recognition information for the component for which the determination unit determines that the measurement of the mounting position has been normally performed, and the determination unit normally measures the mounting position. The second part recognition information is generated as the part recognition information for the parts determined not to be carried out.
　本開示の検査装置は、基板に装着された各部品を検査する検査装置であって、前記基板に装着された各部品の画像を取得する画像取得部と、前記画像取得部により取得された前記各部品の前記画像に基づいて、前記各部品の前記基板における位置をその部品の装着位置として計測する計測部と、前記計測部による前記装着位置の計測が正常に実施されたか否かを前記各部品について判断する判断部と、前記判断部により前記判断がなされた前記各部品について前記計測部により前記装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する生成部とを備え、前記生成部は、前記判断部により前記装着位置の計測が正常に実施されたと判断された部品については前記部品認識情報として第１部品認識情報を生成し、前記判断部により前記装着位置の計測が正常に実施されなかったと判断された部品については前記部品認識情報として第２部品認識情報を生成する。 The inspection device of the present disclosure is an inspection device for inspecting each component mounted on a substrate, and is an image acquisition unit that acquires an image of each component mounted on the substrate, and the image acquisition unit acquired by the image acquisition unit. Based on the image of each component, the measuring unit that measures the position of each component on the substrate as the mounting position of the component, and whether or not the measurement of the mounting position by the measuring unit is normally performed is determined by each of the above. A determination unit for determining a component and a generation for generating component recognition information which is information indicating whether or not the measurement of the mounting position is normally performed by the measurement unit for each component for which the determination is made by the determination unit. The generation unit is provided with a unit, and the generation unit generates first component recognition information as the component recognition information for a component for which the determination unit determines that the measurement of the mounting position has been normally performed, and the determination unit generates the first component recognition information. The second part recognition information is generated as the part recognition information for the parts for which it is determined that the measurement of the mounting position has not been performed normally.
　本開示の検査方法は、基板に装着された各部品を検査する検査方法であって、前記基板に装着された前記各部品の前記基板における位置をその部品の装着位置として計測する計測工程と、前記計測工程で前記装着位置の計測が正常に実施されたか否かを前記各部品について判断する判断工程と、前記判断工程で前記判断がなされた前記各部品について前記計測工程で前記装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する生成工程とを含み、前記生成工程は、前記判断工程で前記装着位置の計測が正常に実施されたと判断された部品については前記部品認識情報として第１部品認識情報を生成し、前記判断工程で前記装着位置の計測が正常に実施されなかったと判断された部品については前記部品認識情報として第２部品認識情報を生成する。 The inspection method of the present disclosure is an inspection method for inspecting each component mounted on a substrate, and includes a measurement step of measuring the position of each component mounted on the substrate on the substrate as the mounting position of the component. A determination step for determining whether or not the mounting position measurement was normally performed in the measurement step, and a determination step for each component for which the determination was made in the determination step, the mounting position measurement in the measurement step. The generation step includes a generation step of generating component recognition information which is information indicating whether or not the above is normally performed, and the generation step includes parts for which the measurement of the mounting position is normally determined in the determination step. Generates the first component recognition information as the component recognition information, and generates the second component recognition information as the component recognition information for the component determined that the measurement of the mounting position was not normally performed in the determination step. ..
　本開示によれば、部品装着装置における動作パラメータの補正について信頼性を向上させることができる。 According to the present disclosure, it is possible to improve the reliability of the correction of operating parameters in the component mounting device.
図１は、本開示の一実施の形態における部品装着ラインの構成図である。FIG. 1 is a block diagram of a component mounting line according to an embodiment of the present disclosure. 図２は、本開示の一実施の形態における部品装着ラインが備える部品装着装置の斜視図である。FIG. 2 is a perspective view of a component mounting device included in the component mounting line according to the embodiment of the present disclosure. 図３は、本開示の一実施の形態における部品装着ラインの制御系統を示すブロック図である。FIG. 3 is a block diagram showing a control system of a component mounting line according to an embodiment of the present disclosure. 図４は、本開示の一実施の形態における部品装着ラインが備える検査装置の斜視図である。FIG. 4 is a perspective view of an inspection device included in the component mounting line according to the embodiment of the present disclosure. 図５は、本開示の一実施の形態における部品装着ラインが備える検査装置により検査される基板の一例の平面図である。FIG. 5 is a plan view of an example of a substrate inspected by an inspection device included in the component mounting line according to the embodiment of the present disclosure. 図６は、本開示の一実施の形態における部品装着ラインの検査装置が備える検査カメラの１回の撮像によって得られる画像の一例を示す図である。FIG. 6 is a diagram showing an example of an image obtained by one imaging of an inspection camera included in the inspection device of the component mounting line according to the embodiment of the present disclosure. 図７は、本開示の一実施の形態における部品装着ラインの検査装置により算出される部品の位置ずれを説明する図である。FIG. 7 is a diagram illustrating a component misalignment calculated by an inspection device for a component mounting line according to an embodiment of the present disclosure. 図８は、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第１の手法を説明する図である。FIG. 8 is a diagram illustrating a first method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図９Ａは、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第１の手法を説明する図である。FIG. 9A is a diagram illustrating a first method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図９Ｂは、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第１の手法を説明する図である。FIG. 9B is a diagram illustrating a first method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１０Ａは、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第２の手法を説明する図である。FIG. 10A is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１０Ｂ－１は、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第２の手法を説明する図である。FIG. 10B-1 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１０Ｂ－２は、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第２の手法を説明する図である。FIG. 10B-2 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１０Ｃ－１は、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第２の手法を説明する図である。FIG. 10C-1 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１０Ｃ－２は、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第２の手法を説明する図である。FIG. 10C-2 is a diagram illustrating a second method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１１Ａは、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第３の手法を説明するための検査画像の中の部品を示す図である。FIG. 11A is a diagram showing parts in an inspection image for explaining a third method of judgment made by a judgment unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１１Ｂは、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第３の手法を説明するための部品が傾きを生じることなく装着された場合の検査画像の中の部品を示す図である。FIG. 11B is an inspection image in which a component for explaining a third method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure is mounted without tilting. It is a figure which shows the component of. 図１１Ｃは、本開示の一実施の形態における部品装着ラインの検査装置の判断部が行う判断の第３の手法を説明するための検査画像に対応する部品を側方から見た図である。FIG. 11C is a side view of a component corresponding to an inspection image for explaining a third method of determination made by the determination unit of the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１２は、本開示の一実施の形態における部品装着ラインの検査装置が実行する検査作業の流れを示すフローチャートである。FIG. 12 is a flowchart showing a flow of inspection work executed by the inspection device of the component mounting line according to the embodiment of the present disclosure. 図１３は、本開示の一実施の形態における部品装着ラインの部品装着装置が実行する動作パラメータの補正処理作業の流れを示すフローチャートである。FIG. 13 is a flowchart showing a flow of operation parameter correction processing work executed by the component mounting device of the component mounting line according to the embodiment of the present disclosure.
　本開示の実施の形態の説明に先立ち、従来の装置における問題点を簡単に説明する。検査装置によって得られる部品の装着位置の情報の中には信頼性が低いものが含まれている可能性があり、信頼性が低い情報に基づいて動作パラメータの補正を行うと、却って部品の装着精度が低下するおそれがあるという問題点があった。 Prior to the description of the embodiments of the present disclosure, problems in the conventional device will be briefly described. Some of the information on the mounting position of parts obtained by the inspection device may be unreliable, and if the operating parameters are corrected based on the unreliable information, the parts will be mounted instead. There was a problem that the accuracy might decrease.
　そこで本開示は、部品装着装置における動作パラメータの補正について信頼性を向上させることができる部品装着ライン、検査装置および検査方法を提供することを目的とする。 Therefore, an object of the present disclosure is to provide a component mounting line, an inspection device, and an inspection method capable of improving the reliability of correction of operating parameters in the component mounting device.
　以下、図面を参照して本開示の実施の形態について説明する。図１は本開示の一実施の形態における部品装着ライン１の構成図を示している。図１において、部品装着ライン１は、部品装着装置１１、検査装置１２および管理装置１３を備えている。 Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. FIG. 1 shows a configuration diagram of a component mounting line 1 according to an embodiment of the present disclosure. In FIG. 1, the component mounting line 1 includes a component mounting device 11, an inspection device 12, and a management device 13.
　部品装着装置１１は、上流側の装置（例えば半田印刷装置）から基板ＫＢを受け取り、その基板ＫＢに部品ＢＨを装着する。検査装置１２は部品装着装置１１の下流側に配置されており、部品装着装置１１から搬出された基板ＫＢを受け取って、その基板ＫＢに装着された部品ＢＨを検査する。管理装置１３は部品装着装置１１および検査装置１２と通信可能な状態で繋がっており、部品装着装置１１と検査装置１２を管理する。 The component mounting device 11 receives the board KB from the device on the upstream side (for example, a solder printing device), and mounts the component BH on the board KB. The inspection device 12 is arranged on the downstream side of the component mounting device 11, receives the board KB carried out from the component mounting device 11, and inspects the component BH mounted on the board KB. The management device 13 is connected to the component mounting device 11 and the inspection device 12 in a communicable state, and manages the component mounting device 11 and the inspection device 12.
　図２は、部品装着ライン１が備える部品装着装置１１の斜視図である。図１および図２において、部品装着装置１１は、基板搬送路２１、部品供給部２２、装着ヘッド２３、ヘッド移動機構２４、部品カメラ２５、装着装置入出力部２６および装着装置制御部２７を備えている。基板搬送路２１は基板ＫＢの搬入、位置決めおよび搬出を行う。部品供給部２２は例えばテープフィーダから成り、所定の位置に部品ＢＨを供給する。装着ヘッド２３は下方に延びて設けられたノズル２３Ｎを備えている。装着ヘッド２３はノズル２３Ｎを昇降および上下軸まわりに回転させることができるとともに、ノズル２３Ｎの下端に部品供給部２２が供給する部品ＢＨを吸着させることができる。 FIG. 2 is a perspective view of the component mounting device 11 included in the component mounting line 1. In FIGS. 1 and 2, the component mounting device 11 includes a board transport path 21, a component supply unit 22, a mounting head 23, a head moving mechanism 24, a component camera 25, a mounting device input / output unit 26, and a mounting device control unit 27. ing. The board transport path 21 carries in, positions, and carries out the board KB. The component supply unit 22 is composed of, for example, a tape feeder, and supplies the component BH to a predetermined position. The mounting head 23 includes a nozzle 23N extending downward. The mounting head 23 can raise and lower the nozzle 23N and rotate it around the vertical axis, and can attract the component BH supplied by the component supply unit 22 to the lower end of the nozzle 23N.
　ヘッド移動機構２４は、固定ビーム２４ａと、固定ビーム２４ａに対して移動自在な移動ビーム２４ｂとを備えたＸＹテーブル機構から成る。ヘッド移動機構２４は、固定ビーム２４ａに対して移動ビーム２４ｂを移動させる動作と、移動ビーム２４ｂに対して装着ヘッド２３を移動させる動作とを組み合わせることによって、装着ヘッド２３を水平面内で移動させる。装着ヘッド２３は水平面内での移動動作、ノズル２３Ｎの昇降および回転動作、ノズル２３Ｎによる部品ＢＨの吸着およびその解除動作を行うことで、部品供給部２２が供給する部品ＢＨのピックアップと、ピックアップした部品ＢＨの基板ＫＢへの装着を行う。 The head moving mechanism 24 includes an XY table mechanism including a fixed beam 24a and a moving beam 24b that is movable with respect to the fixed beam 24a. The head moving mechanism 24 moves the mounting head 23 in a horizontal plane by combining an operation of moving the moving beam 24b with respect to the fixed beam 24a and an operation of moving the mounting head 23 with respect to the moving beam 24b. The mounting head 23 picks up and picks up the component BH supplied by the component supply unit 22 by moving in a horizontal plane, raising and lowering and rotating the nozzle 23N, and sucking and releasing the component BH by the nozzle 23N. The component BH is mounted on the board KB.
　図１および図２において、部品カメラ２５は撮像視野を上方へ向けた状態で、基板搬送路２１と部品供給部２２との間に設けられている。部品カメラ２５は、ノズル２３Ｎの下端に部品ＢＨを吸着させた装着ヘッド２３が上方に移動してきたときに、その部品ＢＨを下方から撮像する。部品カメラ２５の撮像によって得られた部品ＢＨの画像（装着前画像）は、その部品ＢＨの位置（装着前位置）の計測およびその部品ＢＨの認識等に用いられる。 In FIGS. 1 and 2, the component camera 25 is provided between the substrate transport path 21 and the component supply unit 22 with the imaging field of view facing upward. The component camera 25 takes an image of the component BH from below when the mounting head 23 having the component BH adsorbed on the lower end of the nozzle 23N moves upward. The image of the component BH (image before mounting) obtained by imaging the component camera 25 is used for measuring the position of the component BH (position before mounting), recognizing the component BH, and the like.
　装着装置入出力部２６は例えばタッチパネルから成る。装着装置入出力部２６は作業者による入力操作を受け入れるとともに、作業者が行うべき作業や種々の情報等を画面や音声等で作業者に報知する。 The mounting device input / output unit 26 is composed of, for example, a touch panel. The mounting device input / output unit 26 accepts the input operation by the operator, and notifies the operator of the work to be performed by the operator, various information, and the like by screen, voice, and the like.
　図３は、部品装着ライン１の制御系統を示すブロック図である。装着装置制御部２７は、図３に示すように、装着装置記憶部３１、装着制御部３２、装着装置通信部３３およびフィードバック制御部３４を備えている。フィードバック制御部３４は、装着位置情報取得部４１、部品認識情報取得部４２、確認部４３、補正部４４および情報集計部４５を備えている。 FIG. 3 is a block diagram showing a control system of the component mounting line 1. As shown in FIG. 3, the mounting device control unit 27 includes a mounting device storage unit 31, a mounting control unit 32, a mounting device communication unit 33, and a feedback control unit 34. The feedback control unit 34 includes a mounting position information acquisition unit 41, a component recognition information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information aggregation unit 45.
　装着装置記憶部３１には、基板ＫＢに部品ＢＨを装着するために必要なデータ（装着データ）と装着プログラムが記憶されている。装着データには、装着しようとする部品ＢＨの基板ＫＢへの装着目標位置である目標座標、その目標座標に装着される部品ＢＨの種類、装着方向等のデータが含まれている。装着プログラムは、装着データに従って所定の位置（目標座標）に所定の種類の部品ＢＨが所定の装着方向で装着されるようにするために部品装着装置１１の各部（部品供給部２２、装着ヘッド２３、ヘッド移動機構２４、部品カメラ２５等）を動作させる制御プログラムである。 The mounting device storage unit 31 stores data (mounting data) and a mounting program necessary for mounting the component BH on the board KB. The mounting data includes data such as target coordinates that are mounting target positions of the component BH to be mounted on the substrate KB, the type of the component BH to be mounted at the target coordinates, and the mounting direction. In the mounting program, each part (part supply unit 22, mounting head 23) of the component mounting device 11 is mounted so that a predetermined type of component BH is mounted at a predetermined position (target coordinates) in a predetermined mounting direction according to the mounting data. , Head movement mechanism 24, component camera 25, etc.).
　装着制御部３２は装着プログラムに基づいて、基板搬送路２１、部品供給部２２、装着ヘッド２３およびヘッド移動機構２４を作動させる。これにより基板搬送路２１は基板ＫＢの搬入および位置決めを行い、部品供給部２２は部品ＢＨを供給し、ヘッド移動機構２４と装着ヘッド２３は連動して作動して装着ターンを繰り返し実行する。これにより基板ＫＢに部品ＢＨが次々と装着されていく。 The mounting control unit 32 operates the board transport path 21, the component supply unit 22, the mounting head 23, and the head moving mechanism 24 based on the mounting program. As a result, the board transport path 21 carries in and positions the board KB, the component supply unit 22 supplies the component BH, and the head moving mechanism 24 and the mounting head 23 operate in conjunction with each other to repeatedly execute the mounting turn. As a result, the component BH is mounted on the board KB one after another.
　１回の装着ターンにおいて、装着ヘッド２３は、部品ＢＨをピックアップする動作（ピックアップ動作）、部品ＢＨを認識させる動作（認識動作）、部品ＢＨを装着する動作（装着動作）をこの順序で実行するように作動される。ピックアップ動作では、装着ヘッド２３は部品供給部２２の上方に移動して部品供給部２２が供給する部品ＢＨをノズル２３Ｎに吸着させる。認識動作では、装着ヘッド２３は部品カメラ２５の上方に移動して、ノズル２３Ｎに吸着させた部品ＢＨを部品カメラ２５が下方から撮像する。装着動作では、装着ヘッド２３は基板ＫＢの上方に移動して、部品カメラ２５に撮像させた部品ＢＨを基板ＫＢ上の目標座標に装着する。 In one mounting turn, the mounting head 23 executes an operation of picking up the component BH (pickup operation), an operation of recognizing the component BH (recognition operation), and an operation of mounting the component BH (mounting operation) in this order. It is operated like this. In the pickup operation, the mounting head 23 moves above the component supply unit 22 and attracts the component BH supplied by the component supply unit 22 to the nozzle 23N. In the recognition operation, the mounting head 23 moves above the component camera 25, and the component camera 25 captures the component BH attracted to the nozzle 23N from below. In the mounting operation, the mounting head 23 moves above the board KB and mounts the component BH imaged by the component camera 25 at the target coordinates on the board KB.
　装着制御部３２は、上記の装着ヘッド２３の認識動作において、部品カメラ２５に部品ＢＨを撮像させてその部品ＢＨの画像（前述した装着前画像）を取得する。装着制御部３２は、取得した装着前画像に基づいて、部品ＢＨの位置を計測する。この部品ＢＨの位置の計測は、所定の方法により部品ＢＨの中心の位置を求め、その求めた部品ＢＨの中心の位置を部品ＢＨの位置として計測する。装着制御部３２は、求めた部品ＢＨの中心位置が、装着データとして規定されている目標座標に一致するように部品ＢＨが装着されるように、装着ヘッド２３を移動させる。 In the recognition operation of the mounting head 23, the mounting control unit 32 causes the component camera 25 to image the component BH and acquires an image of the component BH (the above-mentioned pre-mounting image). The mounting control unit 32 measures the position of the component BH based on the acquired pre-mounting image. In the measurement of the position of the component BH, the position of the center of the component BH is obtained by a predetermined method, and the determined position of the center of the component BH is measured as the position of the component BH. The mounting control unit 32 moves the mounting head 23 so that the mounting head 23 is mounted so that the center position of the obtained component BH matches the target coordinates defined as the mounting data.
　装着装置通信部３３は、管理装置１３および検査装置１２の双方と通信可能な状態に繋がっている。このため装着装置通信部３３は、検査装置１２により検出される情報を、管理装置１３を介して、または管理装置１３を介さず直接的に、フィードバック情報として受信することができる。 The mounting device communication unit 33 is connected to a state in which communication is possible with both the management device 13 and the inspection device 12. Therefore, the mounting device communication unit 33 can receive the information detected by the inspection device 12 directly as feedback information via the management device 13 or without the management device 13.
　フィードバック制御部３４は、受信した検査装置１２からのフィードバック情報に基づいてフィードバック処理を行う。フィードバック処理の主な内容は、部品装着装置１１が基板ＫＢに部品ＢＨを装着する際の装着ヘッド２３の動作パラメータの補正である。ここで「動作パラメータ」とは、基板ＫＢ上の目標座標に部品ＢＨが装着されるように装着ヘッド２３を動作させるための制御データである。フィードバック制御部３４については、検査装置１２の説明の後に説明する。 The feedback control unit 34 performs feedback processing based on the feedback information from the received inspection device 12. The main content of the feedback process is the correction of the operating parameters of the mounting head 23 when the component mounting device 11 mounts the component BH on the board KB. Here, the "operation parameter" is control data for operating the mounting head 23 so that the component BH is mounted at the target coordinates on the board KB. The feedback control unit 34 will be described after the description of the inspection device 12.
　図４は、検査装置１２の斜視図である。図１および図４において、検査装置１２は、基板搬送部５１、検査カメラ５２、カメラ移動機構５３、検査装置入出力部５４および検査装置制御部５５を備えている。基板搬送部５１は基板ＫＢの搬入、位置決めおよび搬出を行う。検査カメラ５２は撮像視野を下方に向けており、基板ＫＢの上方に位置した状態で撮像することによって、部品装着装置１１によって基板ＫＢに装着された部品ＢＨを上方から撮像する。すなわち本実施の形態において、検査カメラ５２は、基板ＫＢに装着された各部品ＢＨの画像（検査画像）を取得する画像取得部となっている。 FIG. 4 is a perspective view of the inspection device 12. In FIGS. 1 and 4, the inspection device 12 includes a substrate transport unit 51, an inspection camera 52, a camera moving mechanism 53, an inspection device input / output unit 54, and an inspection device control unit 55. The board transfer unit 51 carries in, positions, and carries out the board KB. The inspection camera 52 directs the imaging field of view downward, and by taking an image in a state of being located above the substrate KB, the component BH mounted on the substrate KB by the component mounting device 11 is imaged from above. That is, in the present embodiment, the inspection camera 52 is an image acquisition unit that acquires an image (inspection image) of each component BH mounted on the substrate KB.
　検査カメラ５２の撮像によって得られた部品ＢＨの画像（検査画像）は、その部品ＢＨの基板ＫＢにおける位置（装着位置）の計測等に用いられる。カメラ移動機構５３は固定側ビーム５３ａと固定側ビーム５３ａに対して移動自在な移動側ビーム５３ｂとを備えたＸＹテーブル機構から成り、検査カメラ５２を水平方向に移動させる。カメラ移動機構５３は、固定側ビーム５３ａに対して移動側ビーム５３ｂを移動させる動作と、移動側ビーム５３ｂに対して検査カメラ５２を移動させる動作とを組み合わせることによって、検査カメラ５２を水平面内で移動させる。 The image (inspection image) of the component BH obtained by imaging the inspection camera 52 is used for measuring the position (mounting position) of the component BH on the substrate KB. The camera moving mechanism 53 includes an XY table mechanism including a fixed side beam 53a and a moving side beam 53b that is movable with respect to the fixed side beam 53a, and moves the inspection camera 52 in the horizontal direction. The camera moving mechanism 53 moves the inspection camera 52 in a horizontal plane by combining an operation of moving the moving side beam 53b with respect to the fixed side beam 53a and an operation of moving the inspection camera 52 with respect to the moving side beam 53b. Move it.
　検査装置入出力部５４は例えばタッチパネルから成る。検査装置入出力部５４は作業者による入力操作を受け入れるとともに、作業者が行うべき作業や種々の情報を画面や音声等で報知する。 The inspection device input / output unit 54 is composed of, for example, a touch panel. The inspection device input / output unit 54 accepts input operations by the operator and notifies the operator of the work to be performed and various information by screen, voice, or the like.
　検査装置制御部５５は、図３に示すように、検査装置記憶部６１、検査画像取得制御部６２、計測部６３、判定部６４、判断部６５、生成部６６および検査装置通信部６７を備えている。検査装置記憶部６１には、装着装置記憶部３１に記憶されている前述の装着データのほか、検査プログラムが記憶されている。検査プログラムは、部品装着装置１１によって基板ＫＢに装着された各部品ＢＨが、装着データに規定された目標座標に所定の方向で装着されているかどうか等を検査するために検査装置１２の各部（基板搬送部５１、検査カメラ５２およびカメラ移動機構５３等）を動作させる制御プログラムである。 As shown in FIG. 3, the inspection device control unit 55 includes an inspection device storage unit 61, an inspection image acquisition control unit 62, a measurement unit 63, a determination unit 64, a determination unit 65, a generation unit 66, and an inspection device communication unit 67. ing. In addition to the above-mentioned mounting data stored in the mounting device storage unit 31, the inspection device storage unit 61 stores an inspection program. The inspection program is to inspect whether each component BH mounted on the board KB by the component mounting device 11 is mounted in a predetermined direction at the target coordinates specified in the mounting data, etc., in order to inspect each part of the inspection device 12 ( This is a control program for operating the board transfer unit 51, the inspection camera 52, the camera moving mechanism 53, etc.).
　検査画像取得制御部６２は、基板ＫＢに装着された複数の部品ＢＨを全て検査カメラ５２によって撮像させることで、各部品ＢＨについての検査画像を取得する。このとき検査画像取得制御部６２は、検査装置記憶部６１に記憶された検査プログラムに基づいて、基板搬送部５１によって位置決めされた基板ＫＢの上方で検査カメラ５２を移動させながら、検査カメラ５２に撮像動作を繰り返し行わせる。検査カメラ５２が１回の撮像動作で取得する検査画像に含まれる部品ＢＨは、基板ＫＢ上の部品ＢＨの配置状態によって、１個ずつである場合もあれば、複数個の場合もある。 The inspection image acquisition control unit 62 acquires an inspection image for each component BH by capturing all of the plurality of component BHs mounted on the substrate KB with the inspection camera 52. At this time, the inspection image acquisition control unit 62 moves the inspection camera 52 above the board KB positioned by the board transfer unit 51 based on the inspection program stored in the inspection device storage unit 61, and moves the inspection camera 52 to the inspection camera 52. The imaging operation is repeated. The number of component BHs included in the inspection image acquired by the inspection camera 52 in one imaging operation may be one or a plurality, depending on the arrangement state of the components BH on the substrate KB.
　図５は、検査装置１２により検査される基板の一例の平面図である。図５は検査装置１２により検査される基板ＫＢの一例を示しており、図５中に示す複数の一点鎖線領域ＡＲの各々は、検査カメラ５２の１回の撮像で得られる基板ＫＢ上の領域を示している。図６は、検査カメラ５２の１回の撮像によって得られる画像（検査画像ＧＺ）の一例を示す図である。図６では、検査画像ＧＺ内に複数の部品ＢＨが含まれている。 FIG. 5 is a plan view of an example of a substrate inspected by the inspection device 12. FIG. 5 shows an example of the substrate KB inspected by the inspection apparatus 12, and each of the plurality of alternate long and short dash line regions AR shown in FIG. 5 is a region on the substrate KB obtained by one imaging of the inspection camera 52. Is shown. FIG. 6 is a diagram showing an example of an image (inspection image GZ) obtained by one imaging of the inspection camera 52. In FIG. 6, a plurality of component BHs are included in the inspection image GZ.
　計測部６３は、検査カメラ５２の撮像によって得られた複数の画像（検査画像ＧＺ）それぞれに基づいて、各検査画像ＧＺに含まれる１個または複数個の部品ＢＨそれぞれの基板ＫＢにおける位置（前述した装着位置）を計測する。部品ＢＨの装着位置の計測では、計測部６３は、検査画像取得制御部６２によって取得された検査画像ＧＺに基づいて、部品ＢＨの中心ＺＰ（図６参照）の位置を計測する。 The measurement unit 63 is based on each of the plurality of images (inspection image GZ) obtained by the imaging of the inspection camera 52, and the position of one or a plurality of component BHs included in each inspection image GZ on the substrate KB (described above). (Mounting position) is measured. In the measurement of the mounting position of the component BH, the measuring unit 63 measures the position of the center ZP (see FIG. 6) of the component BH based on the inspection image GZ acquired by the inspection image acquisition control unit 62.
　部品ＢＨの装着位置は、その部品ＢＨの中心ＺＰの検査画像ＧＺ内における位置（検査画像ＧＺの原点ＯＲを基準とした位置）と、その検査画像ＧＺの原点ＯＲの基板ＫＢに対する位置から算出される。検査画像ＧＺの原点ＯＲの位置は、検査画像ＧＺを取得したときの検査カメラ５２の位置から求めることができる。 The mounting position of the component BH is calculated from the position of the center ZP of the component BH in the inspection image GZ (the position based on the origin OR of the inspection image GZ) and the position of the origin OR of the inspection image GZ with respect to the substrate KB. To. The position of the origin OR of the inspection image GZ can be obtained from the position of the inspection camera 52 when the inspection image GZ is acquired.
　また計測部６３は、装着位置を計測した各部品ＢＨについて、その部品ＢＨの中心ＺＰの位置と、検査装置記憶部６１に記憶されているその部品ＢＨの目標座標とを比較することによって、その部品ＢＨの目標座標からの位置ずれを求める。図７は、検査装置１２により算出される部品の位置ずれを説明する図である。図７は、対象としている部品ＢＨの中心ＺＰの位置が目標座標ＭＺからずれている状態を示している。図７において、基板ＫＢ上の目標座標が基板ＫＢの面内で直交するＸ軸およびＹ軸の座標で表されるとすると、部品ＢＨの中心ＺＰの位置と目標座標ＭＺの位置との間のＸ軸方向の差分（ＤＸ）とＹ軸方向の差分（ＤＹ）が、部品ＢＨの位置ずれ（ＤＸ，ＤＹ）として求められる。 Further, the measuring unit 63 compares the position of the center ZP of the component BH with the target coordinates of the component BH stored in the inspection device storage unit 61 for each component BH whose mounting position is measured. Find the position deviation of the component BH from the target coordinates. FIG. 7 is a diagram for explaining the positional deviation of the parts calculated by the inspection device 12. FIG. 7 shows a state in which the position of the center ZP of the target component BH deviates from the target coordinates MZ. In FIG. 7, assuming that the target coordinates on the substrate KB are represented by the coordinates of the X-axis and the Y-axis orthogonal to each other in the plane of the substrate KB, the position between the position of the center ZP of the component BH and the position of the target coordinate MZ The difference (DX) in the X-axis direction and the difference (DY) in the Y-axis direction are obtained as the positional deviation (DX, DY) of the component BH.
　判定部６４は、計測部６３で装着位置が求められた各部品ＢＨについて、その部品ＢＨの装着状態が良好であるか否かを判定する良否判定を行う。具体的には、計測部６３で求められた部品ＢＨの位置ずれを、その部品ＢＨに対応して定められている許容値と比較し、位置ずれが許容値以下であるか否かを判定する。そして、部品ＢＨの位置ずれが許容値以下である場合にはその部品ＢＨの装着状態は良好であると判定し、部品ＢＨの位置ずれが許容値を超えている場合にはその部品ＢＨの装着状態は不良であると判定する。なお、各部品ＢＨについての許容値のデータは検査装置記憶部６１に記憶されている。 The determination unit 64 makes a quality determination for determining whether or not the mounting state of the component BH is good for each component BH for which the mounting position has been determined by the measuring unit 63. Specifically, the positional deviation of the component BH obtained by the measuring unit 63 is compared with the allowable value determined corresponding to the component BH, and it is determined whether or not the positional deviation is equal to or less than the allowable value. .. Then, when the misalignment of the component BH is equal to or less than the permissible value, it is determined that the mounting state of the component BH is good, and when the misalignment of the component BH exceeds the permissible value, the mounting of the component BH is performed. The condition is determined to be defective. The allowable value data for each component BH is stored in the inspection device storage unit 61.
　図７の例の場合、位置ずれの許容値がＸ軸方向についてＲＸ、Ｙ軸方向についてＲＹであるとすると、ＤＸ≦ＲＸかつＤＹ≦ＲＹである場合には部品ＢＨの装着状態は良好であると判定し、ＤＸ＞ＲＸまたはＤＹ＞ＲＹである場合には、部品ＢＨの装着状態は不良であると判定する。図６に示すように、検査画像ＧＺに複数の部品ＢＨが含まれている場合には、その検査画像ＧＺに含まれている複数の部品ＢＨのそれぞれに対して良否判定を行う。 In the case of the example of FIG. 7, assuming that the allowable value of the positional deviation is RX in the X-axis direction and RY in the Y-axis direction, the mounting state of the component BH is good when DX ≦ RX and DY ≦ RY. If DX> RX or DY> RY, it is determined that the mounting state of the component BH is defective. As shown in FIG. 6, when a plurality of component BHs are included in the inspection image GZ, a quality determination is made for each of the plurality of component BHs included in the inspection image GZ.
　判断部６５は、計測部６３で装着位置が計測された各部品ＢＨについて、計測部６３による装着位置の計測が正常に実施されたか否かを判断する。この判断は、本実施の形態では、次に示す第１、第２および第３のいずれかの手法によって実行される。 The determination unit 65 determines whether or not the measurement of the mounting position by the measuring unit 63 has been normally performed for each component BH whose mounting position has been measured by the measuring unit 63. In this embodiment, this determination is performed by any of the following first, second, and third methods.
　図８～図９Ｂは、検査装置１２の判断部６５が行う判断の第１の手法を説明する図である。判断部６５は、第１の手法では、図８に示すように、検査画像ＧＺの中の部品ＢＨの全体がその部品ＢＨに対して設定された計測エリアＫＡ内に位置するか否かを判断するようになっている。計測エリアＫＡは部品ＢＨに対応した形状と大きさを有しており、部品ＢＨの目標座標ＭＺに設定される。 8 to 9B are diagrams illustrating a first method of determination made by the determination unit 65 of the inspection device 12. In the first method, the determination unit 65 determines whether or not the entire component BH in the inspection image GZ is located in the measurement area KA set for the component BH, as shown in FIG. It is designed to do. The measurement area KA has a shape and a size corresponding to the component BH, and is set to the target coordinate MZ of the component BH.
　第１の手法において、判断部６５は、部品ＢＨと計測エリアＫＡとを比較し、図９Ａに示すように部品ＢＨの全体が計測エリアＫＡ内に位置していた場合には、その部品ＢＨについての装着位置の計測は正常に実施されたと判断し、図９Ｂに示すように部品ＢＨの少なくとも一部が計測エリアＫＡの外側に位置していた場合には、その部品ＢＨについての装着位置の計測は正常に実施されなかったと判断する。 In the first method, the determination unit 65 compares the component BH with the measurement area KA, and if the entire component BH is located in the measurement area KA as shown in FIG. 9A, the component BH is about the component BH. It is judged that the measurement of the mounting position of the component BH was performed normally, and when at least a part of the component BH is located outside the measurement area KA as shown in FIG. 9B, the mounting position of the component BH is measured. Judges that it was not carried out normally.
　図１０Ａ～図１０Ｃ－２は、検査装置１２の判断部６５が行う判断の第２の手法を説明する図である。判断部６５は、第２の手法では、検査画像ＧＺと部品ＢＨの基準パターンとの間でパターンマッチング処理を行い、検査画像ＧＺにおける部品ＢＨが占める領域と基準パターンとのマッチング率を算出するようになっている。なお、このパターンマッチング処理は、公知の手法によって行われる。例えば、図１０Ａに示す基準パターンＫＰに対して検査画像ＧＺ内で部品ＢＨが占める領域ＢＲが図１０Ｂ－１，図１０Ｂ－２に示すような領域であった場合には、基準パターンＫＰと領域ＢＲの中心ＺＰ同士を一致させて得られる図１０Ｃ－１，図１０Ｃ－２に示すような基準パターンＫＰから、マッチング率を算出する。 10A to 10C-2 are diagrams illustrating a second method of determination made by the determination unit 65 of the inspection device 12. In the second method, the determination unit 65 performs pattern matching processing between the inspection image GZ and the reference pattern of the component BH, and calculates the matching rate between the region occupied by the component BH in the inspection image GZ and the reference pattern. It has become. This pattern matching process is performed by a known method. For example, when the region BR occupied by the component BH in the inspection image GZ with respect to the reference pattern KP shown in FIG. 10A is a region as shown in FIGS. 10B-1 and 10B-2, the reference pattern KP and the region The matching rate is calculated from the reference pattern KP as shown in FIGS. 10C-1 and 10C-2 obtained by matching the central ZPs of the BR with each other.
　第２の手法において、判断部６５は、マッチング率を算出したら、その算出したマッチング率を予め定められた基準のマッチング率と比較する。そして、マッチング率が基準のマッチング率以上であった場合には、その部品ＢＨについての装着位置の計測は正常に実施されたものと判断する。一方、算出したマッチング率が基準のマッチング率を下回っていた場合には、その部品についての装着位置の計測は正常に実施されなかったと判断する。基準のマッチング率は、例えば、８０％である。 In the second method, the determination unit 65 calculates the matching rate, and then compares the calculated matching rate with the matching rate of a predetermined standard. When the matching rate is equal to or higher than the standard matching rate, it is determined that the measurement of the mounting position of the component BH has been normally performed. On the other hand, if the calculated matching rate is lower than the standard matching rate, it is determined that the measurement of the mounting position of the component has not been performed normally. The standard matching rate is, for example, 80%.
　図１１Ａ～図１１Ｃは、検査装置１２の判断部６５が行う判断の第３の手法を説明するための図である。判断部６５は、第３の手法では、検査画像ＧＺの中の部品ＢＨの寸法を測定して得られる寸法（測定寸法）を基準の寸法と比較し、測定寸法と基準寸法との差分を寸法差として求めるようになっている。例えば、図１１Ａの例であれば、部品ＢＨのＸ軸方向の測定寸法はＸ１であり、Ｙ軸方向の測定寸法はＹ１となる。 11A to 11C are diagrams for explaining a third method of determination made by the determination unit 65 of the inspection device 12. In the third method, the determination unit 65 compares the dimension (measurement dimension) obtained by measuring the dimension of the part BH in the inspection image GZ with the reference dimension, and measures the difference between the measurement dimension and the reference dimension. It is designed to be calculated as a difference. For example, in the example of FIG. 11A, the measurement dimension of the component BH in the X-axis direction is X1, and the measurement dimension in the Y-axis direction is Y1.
　一方、基準寸法は、部品ＢＨの設計値から求められる寸法であり、図１１Ｂのように、基板ＫＢに対して傾き等を生じることなく装着された場合の検査画像ＧＺの中の部品（図中、符号を「ＢＨａ」とする）の寸法と一致する。図１１Ｂの例では、Ｘ軸方向の基準寸法はＸ０、Ｙ軸方向の基準寸法はＹ０となる。同じ部品ＢＨについて測定寸法と基準寸法との間で寸法差が生じるのは、例えば、図１１Ｃに示すように、部品ＢＨの一部が基板ＫＢの表面から浮き上がった状態で基板ＫＢに装着されているような場合である。 On the other hand, the reference dimension is a dimension obtained from the design value of the component BH, and is a component in the inspection image GZ (in the figure) when the substrate KB is mounted without tilting or the like as shown in FIG. 11B. , The symbol is "BHa"). In the example of FIG. 11B, the reference dimension in the X-axis direction is X0, and the reference dimension in the Y-axis direction is Y0. For the same component BH, a dimensional difference occurs between the measured dimension and the reference dimension, for example, as shown in FIG. 11C, a part of the component BH is mounted on the substrate KB in a state of being lifted from the surface of the substrate KB. It is a case like that.
　第３の手法において、判断部６５は、検査画像ＧＺの中の部品ＢＨから測定寸法を求め、これを基準寸法と比較してその寸法差を算出したら、その算出した寸法差をその部品ＢＨに対応して定められた基準寸法差と比較する。そして、算出した寸法差が基準寸法差以下であった場合には、その部品ＢＨについての装着位置の計測は正常に実施されたと判断する。一方、算出した寸法差が基準寸法差を上回っていた場合には、その部品ＢＨについての装着位置の計測は正常に実施されなかったと判断する。 In the third method, the determination unit 65 obtains the measured dimension from the component BH in the inspection image GZ, compares this with the reference dimension, calculates the dimensional difference, and then transfers the calculated dimensional difference to the component BH. Compare with the corresponding standard dimensional difference. Then, when the calculated dimensional difference is equal to or less than the reference dimensional difference, it is determined that the measurement of the mounting position of the component BH has been normally performed. On the other hand, if the calculated dimensional difference exceeds the reference dimensional difference, it is determined that the measurement of the mounting position of the component BH has not been performed normally.
　図１１Ａ及び図１１Ｂの例では、寸法差は、Ｘ軸方向の寸法差ΔＸがΔＸ＝Ｘ０－Ｘ１、Ｙ軸方向の寸法差ΔＹがΔＹ＝Ｙ０－Ｙ１となる。判断部６５は、これら寸法差（ΔＸ，ΔＹ）を基準寸法差（ＤＸ，ＤＹ）と比較し、（ΔＸ，ΔＹ）がともに基準寸法差以下であった場合（ΔＸ≦ＤＸかつΔＹ≦ＤＹであった場合）には、その部品ＢＨについての装着位置の計測は正常に実施されたと判断する。一方、（ΔＸ，ΔＹ）の少なくとも一方が基準寸法差（ＤＸ，ＤＹ）を上回っていた場合（ΔＸ＞ＤＸまたはΔＹ＞ＤＹの場合）には、その部品ＢＨについての装着位置の計測は正常に実施されなかったと判断する。 In the examples of FIGS. 11A and 11B, the dimensional difference is ΔX = X0-X1 for the dimensional difference ΔX in the X-axis direction and ΔY = Y0-Y1 for the dimensional difference ΔY in the Y-axis direction. The determination unit 65 compares these dimensional differences (ΔX, ΔY) with the reference dimensional differences (DX, DY), and when both (ΔX, ΔY) are equal to or less than the standard dimensional differences (ΔX ≦ DX and ΔY ≦ DY). If there is), it is judged that the measurement of the mounting position of the component BH was normally performed. On the other hand, when at least one of (ΔX, ΔY) exceeds the reference dimensional difference (DX, DY) (when ΔX> DX or ΔY> DY), the measurement of the mounting position of the component BH is normal. Judge that it was not implemented.
　生成部６６は、判断部６５により上記の判断がなされた各部品ＢＨについて、計測部６３により装着位置の計測が正常に実施されたか否かを示す情報（部品認識情報）を生成する。具体的には、生成部６６は、判断部６５により装着位置の計測が正常に実施されたと判断された部品ＢＨについては、部品認識情報として第１部品認識情報を生成し、判断部６５により装着位置の計測が正常に実施されなかったと判断された部品については、部品認識情報として、第２部品認識情報を生成する。 The generation unit 66 generates information (part recognition information) indicating whether or not the measurement of the mounting position is normally performed by the measurement unit 63 for each component BH for which the above determination is made by the determination unit 65. Specifically, the generation unit 66 generates the first component recognition information as the component recognition information for the component BH for which the determination unit 65 determines that the measurement of the mounting position has been normally performed, and the determination unit 65 mounts the component BH. For the parts for which it is determined that the position measurement has not been performed normally, the second part recognition information is generated as the part recognition information.
　検査装置通信部６７は、管理装置１３および部品装着装置１１の双方と通信可能な状態に繋がっている。検査装置通信部６７は、計測部６３で計測された各部品ＢＨについての装着位置に関する情報（装着位置情報）と、生成部６６で生成された基板ＫＢ上の各部品ＢＨについての部品認識情報（第１部品認識情報または第２部品認識情報）を、管理装置１３を介して、または管理装置１３を介さず直接的に、部品装着装置１１に送信する。 The inspection device communication unit 67 is connected to a state in which communication is possible with both the management device 13 and the component mounting device 11. The inspection device communication unit 67 contains information (mounting position information) regarding the mounting position of each component BH measured by the measuring unit 63, and component recognition information (part recognition information) for each component BH on the board KB generated by the generating unit 66. The first component recognition information or the second component recognition information) is transmitted to the component mounting device 11 directly via the management device 13 or not via the management device 13.
　次に、装着装置制御部２７が備えるフィードバック制御部３４について説明する。フィードバック制御部３４は、前述したように、装着位置情報取得部４１、部品認識情報取得部４２、確認部４３、補正部４４および情報集計部４５を備えている。 Next, the feedback control unit 34 included in the mounting device control unit 27 will be described. As described above, the feedback control unit 34 includes a mounting position information acquisition unit 41, a component recognition information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information aggregation unit 45.
　装着位置情報取得部４１は、検査装置１２の検査装置通信部６７から管理装置１３を介して、または管理装置１３を介さず直接的に、検査装置１２から、基板ＫＢ上の各部品ＢＨについての装着位置情報を取得する。部品認識情報取得部４２は、検査装置１２の検査装置通信部６７から管理装置１３を介して、または管理装置１３を介さず直接的に、検査装置１２から、基板ＫＢ上の各部品ＢＨについての部品認識情報を取得する。 The mounting position information acquisition unit 41 describes each component BH on the substrate KB from the inspection device 12 directly from the inspection device communication unit 67 of the inspection device 12 via the management device 13 or directly without the management device 13. Acquire mounting position information. The component recognition information acquisition unit 42 describes each component BH on the substrate KB from the inspection device 12 directly from the inspection device communication unit 67 of the inspection device 12 via the management device 13 or directly without the management device 13. Acquire part recognition information.
　確認部４３は、部品認識情報取得部４２により取得された各部品ＢＨについての部品認識情報に基づいて、各部品ＢＨについての装着位置の計測が正常に実施されたかを否かを確認する。これにより部品認識情報取得部４２により取得された各部品は、部品認識情報として第１部品認識情報が紐づけされているものであるか、部品認識情報として第２部品認識情報が紐づけされているものであるかに選り分けられる。 The confirmation unit 43 confirms whether or not the measurement of the mounting position for each component BH has been normally performed based on the component recognition information for each component BH acquired by the component recognition information acquisition unit 42. As a result, each part acquired by the component recognition information acquisition unit 42 is associated with the first component recognition information as the component recognition information, or the second component recognition information is associated with the component recognition information. It is sorted according to whether it is present or not.
　補正部４４は、装着位置情報取得部４１により取得された装着位置に関する情報（装着位置情報）を用いて部品装着装置１１が基板ＫＢに各部品ＢＨを装着する際の動作パラメータを補正する。詳細には、補正部４４は、確認部４３により装着位置の計測が正常に実施されたことが確認された部品ＢＨについては、装着位置情報取得部４１により取得された装着位置情報を用いて動作パラメータを補正する。一方、補正部４４は、確認部４３により装着位置の計測が正常に実施されなかったことが確認された部品ＢＨについては、装着位置情報取得部４１により取得された装着位置情報を用いて動作パラメータを補正しない。 The correction unit 44 corrects the operation parameters when the component mounting device 11 mounts each component BH on the board KB by using the information (mounting position information) regarding the mounting position acquired by the mounting position information acquisition unit 41. Specifically, the correction unit 44 operates using the mounting position information acquired by the mounting position information acquisition unit 41 for the component BH for which the measurement of the mounting position has been normally confirmed by the confirmation unit 43. Correct the parameters. On the other hand, the correction unit 44 uses the mounting position information acquired by the mounting position information acquisition unit 41 as an operation parameter for the component BH for which the measurement of the mounting position has not been normally performed by the confirmation unit 43. Do not correct.
　情報集計部４５は、装着位置情報取得部４１により取得された装着位置情報を用いて、部品ＢＨの装着精度に関する情報を集計する。具体的には、情報集計部４５は、確認部４３により装着位置の計測が正常に実施されたことが確認された部品ＢＨについては、装着位置情報取得部４１により取得された装着位置情報を用いて部品ＢＨの装着精度に関する情報を集計する。一方、情報集計部４５は、確認部４３により装着位置の計測が正常に実施されなかったことが確認された部品ＢＨについては、装着位置情報取得部４１により取得された装着位置情報を用いてＢＨの装着精度に関する情報を集計しない。これにより、部品ＢＨの装着精度の判定が、装着ヘッド２３による単純な部品ＢＨのピックアップミスなど、偶発的に発生した装着不良が原因によって低下してしまう（装着精度が低く評価されてしまう）事態が防止される。 The information totaling unit 45 aggregates information on the mounting accuracy of the component BH using the mounting position information acquired by the mounting position information acquisition unit 41. Specifically, the information aggregation unit 45 uses the mounting position information acquired by the mounting position information acquisition unit 41 for the component BH for which the measurement of the mounting position has been normally confirmed by the confirmation unit 43. Information on the mounting accuracy of the component BH is aggregated. On the other hand, the information totaling unit 45 uses the mounting position information acquired by the mounting position information acquisition unit 41 to BH for the component BH for which the confirmation unit 43 has confirmed that the measurement of the mounting position has not been performed normally. Does not aggregate information about mounting accuracy. As a result, the determination of the mounting accuracy of the component BH is deteriorated due to an accidental mounting defect such as a simple pickup error of the component BH by the mounting head 23 (the mounting accuracy is evaluated low). Is prevented.
　このような構成の部品装着ライン１により、基板ＫＢに部品ＢＨを装着する部品装着作業を行う場合には、部品装着装置１１は先ず、基板搬送路２１によって上流側の装置（例えば半田印刷装置）から基板ＫＢを受け取って所定の部品装着作業位置に位置決めする。そして、部品供給部２２が供給する部品ＢＨを装着ヘッド２３によりピックアップして基板ＫＢに装着する装着ターンを繰り返し実行する。これにより基板ＫＢに装着すべき部品ＢＨを全て装着したら、部品装着装置１１は、その基板ＫＢを下流側の検査装置１２に搬出する。 When the component mounting work of mounting the component BH on the board KB is performed by the component mounting line 1 having such a configuration, the component mounting device 11 first uses the board transport path 21 to be upstream of the device (for example, a solder printing device). The board KB is received from the above and positioned at a predetermined component mounting work position. Then, the component BH supplied by the component supply unit 22 is picked up by the mounting head 23, and the mounting turn of mounting the component BH on the board KB is repeatedly executed. As a result, when all the parts BH to be mounted on the board KB are mounted, the component mounting device 11 carries out the board KB to the inspection device 12 on the downstream side.
　検査装置１２は、部品装着装置１１から搬出された基板ＫＢを基板搬送部５１によって受け取って搬入し、所定の検査位置に位置決めする。そして、基板ＫＢに装着された各部品ＢＨについての検査作業を実行する。 The inspection device 12 receives the board KB carried out from the component mounting device 11 by the board transfer unit 51, carries it in, and positions it at a predetermined inspection position. Then, the inspection work for each component BH mounted on the board KB is executed.
　図１２に示すフローチャートは、この検査作業の実行手順（検査装置１２による検査方法）を示している。検査装置１２は、検査作業を行う場合には先ず、部品装着装置１１から搬出された基板ＫＢを搬入して位置決めする（図１２に示すステップＳＴ１）。基板ＫＢを位置決めしたら、カメラ移動機構５３により検査カメラ５２を移動させることによって、基板ＫＢ上の各部品ＢＨについての画像（検査画像ＧＺ）を取得する（ステップＳＴ２。画像取得工程）。検査装置１２は、基板ＫＢ上の各部品ＢＨについての検査画像ＧＺを取得したら、それらの検査画像ＧＺに基づいて各部品ＢＨについての装着位置を計測することによって（ステップＳＴ３の計測工程）、各部品ＢＨについての装着位置情報を取得する（ステップＳＴ４）。 The flowchart shown in FIG. 12 shows an execution procedure (inspection method by the inspection device 12) of this inspection work. When performing inspection work, the inspection device 12 first carries in and positions the board KB carried out from the component mounting device 11 (step ST1 shown in FIG. 12). After positioning the substrate KB, the inspection camera 52 is moved by the camera moving mechanism 53 to acquire an image (inspection image GZ) of each component BH on the substrate KB (step ST2, image acquisition step). After the inspection device 12 acquires the inspection image GZ for each component BH on the substrate KB, the inspection device 12 measures the mounting position for each component BH based on the inspection image GZ (measurement step in step ST3). Acquire mounting position information about the component BH (step ST4).
　検査装置１２は、各部品ＢＨについての装着位置情報を取得したら、その各部品ＢＨについての装着位置情報に基づいて、各部品ＢＨについての装着状態の良否判定を行う（ステップＳＴ５）。この良否判定で基板ＫＢに対する装着状態が不良であると判定された部品ＢＨについては、検査装置入出力部５４を通じて作業者に報知がなされる。このため作業者は、装着状態が不良と判定された部品ＢＨを有する基板ＫＢを、その基板ＫＢが検査装置１２から搬出されたところで抜き取り、必要に応じて部品ＢＨの装着状態の修正等を行うことができる。 After acquiring the mounting position information for each component BH, the inspection device 12 determines whether the mounting state of each component BH is good or bad based on the mounting position information for each component BH (step ST5). The component BH, which is determined to be in a bad state of being mounted on the board KB by this pass / fail determination, is notified to the operator through the inspection device input / output unit 54. Therefore, the operator takes out the board KB having the component BH determined to be defective in the mounted state when the board KB is carried out from the inspection device 12, and corrects the mounted state of the component BH as necessary. be able to.
　検査装置１２は、基板ＫＢに装着された各部品ＢＨについての良否判定を行ったら、ステップＳＴ４で装着位置情報を取得した複数の部品ＢＨのうちのひとつを指定する（ステップＳＴ６）。そして、その指定した部品ＢＨについて、ステップＳＴ３の計測工程で装着位置の計測が正常に実施されたか否かを判断する（ステップＳＴ７。判断工程）。検査装置１２は、この判断工程で上記判断がなされた各部品ＢＨについて、ステップＳＴ３の計測工程で装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する（生成工程）。詳細には、装着位置の計測が正常に実施されたと判断した部品ＢＨについては（ステップＳＴ７でＹｅｓ（Ｙ））第１部品認識情報を生成し（ステップＳＴ８）、装着位置の計測が正常に実施されなかったと判断した部品ＢＨについては（ステップＳＴ７でＮｏ（Ｎ））第２部品認識情報を生成する（ステップＳＴ９）。 After determining the quality of each component BH mounted on the board KB, the inspection device 12 designates one of the plurality of component BHs whose mounting position information has been acquired in step ST4 (step ST6). Then, it is determined whether or not the mounting position of the designated component BH is normally measured in the measurement step of step ST3 (step ST7, determination step). The inspection device 12 generates (generates) component recognition information, which is information indicating whether or not the mounting position is normally measured in the measurement step of step ST3, for each component BH for which the above determination is made in this determination step. Process). Specifically, for the component BH for which it is determined that the mounting position measurement has been normally performed (Yes (Y) in step ST7), the first component recognition information is generated (step ST8), and the mounting position measurement is normally performed. For the component BH determined not to be performed (No (N) in step ST7), the second component recognition information is generated (step ST9).
　検査装置１２は、生成工程（ステップＳＴ８またはステップＳＴ９）で部品認識情報（第１部品情報または第２部品情報）を生成したら、まだ指定していない部品ＢＨがあるかどうかを判断する（ステップＳＴ１０）。そして、まだ指定していない部品ＢＨがある場合には、（ステップＳＴ１０でＹ）ステップＳＴ６に戻り、まだ指定していない新たに部品ＢＨを指定したうえで、ステップＳＴ７～ステップＳＴ９の処理を行う。一方、ステップＳＴ１０において、まだ指定していない部品ＢＨがなかった場合には（ステップＳＴ１０でＮ）、これまでに求めた各部品ＢＨについての装着位置情報と部品認識情報を、管理装置１３を介して、または管理装置１３を介さず直接的に、部品装着装置１１に送信する（ステップＳＴ１１）。そして、検査装置１２は、すべての部品ＢＨについての装着位置情報と部品認識情報を部品装着装置１１に送信したら、基板ＫＢを下流側の装置（例えばリフロー装置）に搬出して（ステップＳＴ１２）、その基板ＫＢについての検査作業を終了する。 After the part recognition information (first part information or second part information) is generated in the generation step (step ST8 or step ST9), the inspection device 12 determines whether or not there is a part BH that has not been specified yet (step ST10). ). Then, if there is a component BH that has not been specified yet, the process returns to step ST6 (Y in step ST10), a new component BH that has not been specified is specified, and the processes of steps ST7 to ST9 are performed. .. On the other hand, if there is no part BH that has not been specified yet in step ST10 (N in step ST10), the mounting position information and the part recognition information for each part BH obtained so far are transmitted via the management device 13. Or directly to the component mounting device 11 without going through the management device 13 (step ST11). Then, when the inspection device 12 transmits the mounting position information and the component recognition information for all the component BHs to the component mounting device 11, the board KB is carried out to a device on the downstream side (for example, a reflow device) (step ST12). The inspection work for the substrate KB is completed.
　部品装着装置１１は、前述したように、上流側から搬入した基板ＫＢに部品ＢＨを装着して検査装置１２に搬出するが、基板ＫＢに部品ＢＨを装着する前に、既に部品ＢＨを装着して検査装置１２に搬出した基板ＫＢについての検査作業の結果の情報（装着位置情報および部品認識情報）を受け取っている場合には、それらの情報に基づいて、動作パラメータの補正処理作業を行う。 As described above, the component mounting device 11 mounts the component BH on the board KB carried in from the upstream side and carries it out to the inspection device 12, but before mounting the component BH on the board KB, the component BH is already mounted. When the information (mounting position information and component recognition information) of the inspection work result of the board KB carried out to the inspection device 12 is received, the operation parameter correction processing work is performed based on the information.
　図１３に示すフローチャートは、動作パラメータの補正処理作業の実行手順を示している。部品装着装置１１は、動作パラメータの補正処理作業を行う場合には先ず、検査装置１２から検査作業の結果を受け取った基板ＫＢについて、その基板ＫＢに装着された複数の部品ＢＨのうちのひとつを指定する（図１３に示すステップＳＴ２１）。そして、その指定した部品ＢＨについて取得している部品認識情報に基づいて、その部品ＢＨについての装着位置の計測が正常に実施されたかを否かを確認する（ステップＳＴ２２）。 The flowchart shown in FIG. 13 shows an execution procedure of the operation parameter correction processing work. When the component mounting device 11 performs the operation parameter correction processing work, first, with respect to the board KB that has received the result of the inspection work from the inspection device 12, one of a plurality of component BHs mounted on the board KB is used. Specify (step ST21 shown in FIG. 13). Then, based on the component recognition information acquired for the designated component BH, it is confirmed whether or not the measurement of the mounting position for the component BH has been normally performed (step ST22).
　部品装着装置１１は、ステップＳＴ２２において、装着位置の計測が正常に実施されたことが確認された部品ＢＨについては（ステップＳＴ２２でＹ）装着位置情報を用いて動作パラメータを補正するとともに（ステップＳＴ２３）、その装着位置情報を用いて装着精度に関する情報を集計する（ステップＳＴ２４）。一方、ステップＳＴ２２において、装着位置の計測が正常に実施されなかったことが確認された部品ＢＨについては（ステップＳＴ２２でＮ）動作パラメータを補正せず（ステップＳＴ２５）、その装着位置情報を用いた装着精度に関する情報の集計も行わない（ステップＳＴ２６）。 The component mounting device 11 corrects the operating parameters using the mounting position information (Y in step ST22) for the component BH for which it is confirmed that the mounting position was normally measured in step ST22 (step ST23). ), Information on mounting accuracy is aggregated using the mounting position information (step ST24). On the other hand, for the component BH in which it was confirmed that the measurement of the mounting position was not normally performed in step ST22 (N in step ST22), the operation parameter was not corrected (step ST25), and the mounting position information was used. Information on mounting accuracy is not aggregated (step ST26).
　部品装着装置１１は、ステップＳＴ２４またはステップＳＴ２６が終了したら、まだ指定しない部品があるかどうかを判断する（ステップＳＴ２７）。そして、まだ指定していない部品ＢＨがある場合には（ステップＳＴ２７でＹ）、ステップＳＴ２１に戻ってまだ指定していない新たに部品ＢＨを指定したうえでステップＳＴ２２～ステップＳ２６の処理を行う。一方、ステップＳＴ２７において、まだ指定していない部品ＢＨがなかった場合には（ステップＳＴ２７でＮ）、その基板ＫＢについての動作パラメータの補正処理作業を終了する。部品装着装置１１は、動作パラメータの補正処理作業を行うことによって新たな動作パラメータを求めた場合には、それまでの動作パラメータの値を更新し、その更新した動作パラメータを用いて装着ヘッド２３を動作させ、基板ＫＢへの部品ＢＨの装着を行う。 When step ST24 or step ST26 is completed, the component mounting device 11 determines whether or not there is a component that has not been specified yet (step ST27). Then, if there is a component BH that has not been specified yet (Y in step ST27), the process returns to step ST21, specifies a new component BH that has not been specified yet, and then performs the processes of steps ST22 to S26. On the other hand, if there is no unspecified component BH in step ST27 (N in step ST27), the operation parameter correction processing work for the substrate KB is terminated. When a new operation parameter is obtained by performing the operation parameter correction processing work, the component mounting device 11 updates the value of the operation parameter up to that point, and uses the updated operation parameter to mount the mounting head 23. It is operated and the component BH is mounted on the board KB.
　このように、本実施の形態における部品装着ライン１において、検査装置１２は、基板ＫＢに装着された各部品ＢＨの検査画像ＧＺを取得し、その取得した各部品ＢＨの検査画像ＧＺに基づいて、各部品ＢＨの基板ＫＢにおける位置をその部品ＢＨの装着位置として計測するとともに（ステップＳＴ３の計測工程）、その装着位置の計測が正常に実施されたか否かを判断するようになっている（ステップＳＴ７の判断工程）。そして、装着位置の計測が正常に実施されたと判断された部品ＢＨについては部品認識情報として第１部品認識情報を生成し、装着位置の計測が正常に実施されなかったと判断された部品ＢＨについては部品認識情報として第２部品認識情報を生成するようになっている（ステップＳＴ８またはステップＳＴ９の生成工程）。 As described above, in the component mounting line 1 in the present embodiment, the inspection device 12 acquires the inspection image GZ of each component BH mounted on the substrate KB, and is based on the acquired inspection image GZ of each component BH. , The position of each component BH on the board KB is measured as the mounting position of the component BH (measurement step of step ST3), and it is determined whether or not the measurement of the mounting position is normally performed (measurement step). Judgment step of step ST7). Then, the first component recognition information is generated as the component recognition information for the component BH for which the measurement of the mounting position is determined to be normally performed, and the component BH for which the measurement of the mounting position is determined not to be performed normally is generated. The second part recognition information is generated as the part recognition information (the generation step of step ST8 or step ST9).
　また、本実施の形態における部品装着ライン１において、部品装着装置１１は、生成された各部品ＢＨについての部品認識情報（第１部品認識情報または第２部品認識情報）を取得し、その取得した各部品ＢＨについての部品認識情報に基づいて、各部品ＢＨについての装着位置の計測が正常に実施されたかを否かを確認するようになっている。そして、装着位置の計測が正常に実施されたことが確認された部品ＢＨについては、検査装置１２より取得された装着位置情報に基づいて動作パラメータを補正するとともに装着位置情報の集計を行い、装着位置の計測が正常に実施されなかったことが確認された部品ＢＨについては動作パラメータを補正せず、装着位置情報の集計も行わないようになっている。 Further, in the component mounting line 1 in the present embodiment, the component mounting device 11 acquires the component recognition information (first component recognition information or the second component recognition information) for each generated component BH, and acquires the component recognition information. Based on the component recognition information for each component BH, it is confirmed whether or not the measurement of the mounting position for each component BH has been normally performed. Then, for the component BH for which it has been confirmed that the measurement of the mounting position has been performed normally, the operation parameters are corrected based on the mounting position information acquired from the inspection device 12, and the mounting position information is aggregated for mounting. For the component BH for which it has been confirmed that the position measurement has not been performed normally, the operation parameters are not corrected and the mounting position information is not aggregated.
　すなわち、本実施の形態における部品装着ライン１では、部品ＢＨの検査結果の信頼性の低いデータはフィードバック情報として使用せず、検査結果の信頼性の高いデータのみをフィードバック情報として動作パラメータの補正および装着位置情報の集計を行うようになっている。このため本実施の形態における部品装着ライン１によれば、部品装着装置１１における動作パラメータの補正および装着位置情報の集計結果（部品ＢＨの装着精度に関する情報）について信頼性を向上させることができる。 That is, in the component mounting line 1 in the present embodiment, the unreliable data of the inspection result of the component BH is not used as the feedback information, and only the highly reliable data of the inspection result is used as the feedback information to correct the operation parameters. The mounting position information is aggregated. Therefore, according to the component mounting line 1 in the present embodiment, it is possible to improve the reliability of the correction of the operating parameters in the component mounting device 11 and the aggregation result of the mounting position information (information on the mounting accuracy of the component BH).
　以上説明したように、本実施の形態における部品装着ライン１では、検査装置１２が基板ＫＢに装着された各部品ＢＨの装着位置についての計測を行った際、その計測が正常に実施されたかを否かを各部品ＢＨについて判断し、装着位置の計測が正常に実施されたと判断された部品ＢＨについてのみ、その部品についての部品装着装置１１における動作パラメータを補正する（装着位置の計測が正常に実施されなかったと判断された部品ＢＨについては動作パラメータを補正しない）ようになっている。このため部品装着装置１１では、検査装置１２における検査結果のうち信頼性の高いデータのみに基づいて動作パラメータの補正を行うことができる。このため本実施の形態における部品装着ライン１（または検査装置１２、検査装置１２による検査方法）によれば、部品装着装置１１における動作パラメータの補正について信頼性を向上させることができ、ひいては部品ＢＨの装着精度の高い高品質の基板生産を行うことが可能となる。 As described above, in the component mounting line 1 in the present embodiment, when the inspection device 12 measures the mounting position of each component BH mounted on the board KB, it is checked whether the measurement is normally performed. Whether or not it is determined for each component BH is determined, and only for the component BH for which the measurement of the mounting position is determined to be performed normally, the operating parameters of the component mounting device 11 for that component are corrected (the measurement of the mounting position is normally performed). The operating parameters are not corrected for the component BH that is determined not to be implemented). Therefore, the component mounting device 11 can correct the operating parameters based only on the highly reliable data among the inspection results of the inspection device 12. Therefore, according to the component mounting line 1 (or the inspection method by the inspection device 12 and the inspection device 12) in the present embodiment, it is possible to improve the reliability of the correction of the operating parameters in the component mounting device 11, and by extension, the component BH. It is possible to produce high-quality substrates with high mounting accuracy.
　これまで本開示の実施の形態について説明してきたが、本開示は上述したものに限定されず、種々の変形等が可能である。例えば、上述の実施の形態では、検査装置１２の判断部６５が計測部６３による装着位置の計測が正常に実施されたか否かを判断する手法として第１、第２および第３の手法を示したが、判断部６５はその他の手法を用いて装着位置の計測が正常に実施されたか否かを判断するようにしてもよい。 Although the embodiments of the present disclosure have been described so far, the present disclosure is not limited to the above-mentioned ones, and various modifications and the like are possible. For example, in the above-described embodiment, the first, second, and third methods are shown as methods for the determination unit 65 of the inspection device 12 to determine whether or not the measurement of the mounting position by the measurement unit 63 has been normally performed. However, the determination unit 65 may use another method to determine whether or not the measurement of the mounting position has been normally performed.
　また、上述の実施の形態では、検査装置１２は、図１２に示すステップＳＴ１１において、各部品ＢＨについての装着位置情報と部品認識情報を、部品装着装置１１に送信するようになっていたが、第２部品認識情報が生成された部品ＢＨについては、その後、部品装着装置１１において、フィードバック情報として使用されることはない。このため検査装置１２は、ステップＳＴ９において第２部品認識情報が生成された部品ＢＨの装着位置情報については、ステップＳＴ１１において、装着位置情報を部品装着装置１１に送信しないようにすることもできる。 Further, in the above-described embodiment, the inspection device 12 transmits the mounting position information and the component recognition information for each component BH to the component mounting device 11 in step ST11 shown in FIG. The component BH for which the second component recognition information is generated is not subsequently used as feedback information in the component mounting device 11. Therefore, the inspection device 12 may not transmit the mounting position information to the component mounting device 11 in step ST11 for the mounting position information of the component BH for which the second component recognition information was generated in step ST9.
　なお、上記実施の形態において、各構成要素は、専用のハードウェアで構成されるか、各構成要素に適したソフトウェアプログラムを実行することによって実現されてもよい。各構成要素は、ＣＰＵ（Central Processing Unit）またはプロセッサなどのプログラム実行部が、ハードディスクまたは半導体メモリなどの記録媒体に記録されたソフトウェアプログラムを読み出して実行することによって実現されてもよい。 In the above embodiment, each component may be configured by dedicated hardware or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.
　部品装着装置における動作パラメータの補正について信頼性を向上させることができる部品装着ライン、検査装置および検査方法を提供する。 Provide parts mounting lines, inspection devices and inspection methods that can improve the reliability of correction of operating parameters in component mounting devices.
　１　部品装着ライン
　１１　部品装着装置
　１２　検査装置
　１３　管理装置
　４１　装着位置情報取得部
　４２　部品認識情報取得部
　４３　確認部
　４４　補正部
　４５　情報集計部
　５２　検査カメラ（画像取得部）
　６３　計測部
　６５　判断部
　６６　生成部
　ＧＺ　検査画像（画像）
　ＫＡ　計測エリア
　ＫＰ　基準パターン
　ＢＨ　部品
　ＫＢ　基板 1 Parts mounting line 11 Parts mounting device 12 Inspection device 13 Management device 41 Mounting position information acquisition unit 42 Parts recognition information acquisition unit 43 Confirmation unit 44 Correction unit 45 Information aggregation unit 52 Inspection camera (image acquisition unit)
63 Measurement unit 65 Judgment unit 66 Generation unit GZ inspection image (image)
KA measurement area KP reference pattern BH parts KB board

Claims (19)

  1. 　基板に部品を装着する部品装着装置と、前記部品装着装置から搬出された前記基板を受け取り、前記部品装着装置により前記基板に装着された各部品を検査する検査装置とを備えた部品装着ラインであって、
    　前記検査装置は、
    　前記基板に装着された前記各部品の画像を取得する画像取得部と、
    　前記画像取得部により取得された前記各部品の画像に基づいて、前記各部品の前記基板における位置をその部品の装着位置として計測する計測部と、
    　前記各部品について前記計測部による前記装着位置の計測が正常に実施されたか否かを前記各部品について判断する判断部と、
    　前記判断部により前記判断がなされた前記各部品について前記計測部により前記装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する生成部とを備え、
    　前記生成部は、前記判断部により前記装着位置の計測が正常に実施されたと判断された部品については前記部品認識情報として第１部品認識情報を生成し、前記判断部により前記装着位置の計測が正常に実施されなかったと判断された部品については前記部品認識情報として第２部品認識情報を生成する、部品装着ライン。     A component mounting line equipped with a component mounting device for mounting components on a board and an inspection device for receiving the board carried out from the component mounting device and inspecting each component mounted on the board by the component mounting device. There,
    The inspection device is
    An image acquisition unit that acquires an image of each component mounted on the substrate, and an image acquisition unit.
    Based on the image of each component acquired by the image acquisition unit, a measurement unit that measures the position of each component on the substrate as the mounting position of the component, and a measurement unit.
    A judgment unit for determining whether or not the measurement of the mounting position of each component was normally performed by the measurement unit, and a determination unit for determining whether or not the measurement of the mounting position was normally performed for each component.
    Each component for which the determination has been made is provided with a generation unit that generates component recognition information, which is information indicating whether or not the measurement of the mounting position has been normally performed by the measurement unit.
    The generation unit generates first component recognition information as the component recognition information for a component for which the determination unit determines that the measurement of the mounting position has been normally performed, and the determination unit measures the mounting position. A component mounting line that generates a second component recognition information as the component recognition information for a component that is determined not to be normally implemented.
  2. 　前記部品装着装置は、前記計測部により計測された前記各部品についての前記装着位置に関する情報である装着位置情報を取得する装着位置情報取得部と、前記生成部により生成された前記各部品についての前記部品認識情報を取得する部品認識情報取得部と、前記部品認識情報取得部により取得された前記各部品についての前記部品認識情報に基づいて、前記各部品について前記装着位置の計測が正常に実施されたかを否かを確認する確認部と、を有する請求項１に記載の部品装着ライン。 The component mounting device has a mounting position information acquisition unit that acquires mounting position information that is information about the mounting position of each component measured by the measuring unit, and each component generated by the generation unit. Based on the component recognition information acquisition unit that acquires the component recognition information and the component recognition information for each component acquired by the component recognition information acquisition unit, the mounting position of each component is normally measured. The component mounting line according to claim 1, further comprising a confirmation unit for confirming whether or not the product has been used.
  3. 　前記部品装着装置は、前記装着位置情報取得部により取得された前記装着位置情報を用いて前記部品装着装置が基板に各部品を装着する際の前記各部品についての動作パラメータを補正する補正部を有し、前記補正部は、前記確認部により前記装着位置の計測が正常に実施されたことが確認された部品については前記装着位置情報取得部により取得された前記装着位置情報を用いて前記動作パラメータを補正し、前記確認部により前記装着位置の計測が正常に実施されなかったことが確認された部品については前記装着位置情報取得部により取得された前記装着位置情報を用いて前記動作パラメータを補正しない、請求項２に記載の部品装着ライン。 The component mounting device includes a correction unit that corrects operation parameters for each component when the component mounting device mounts each component on a substrate by using the mounting position information acquired by the mounting position information acquisition unit. For parts for which it has been confirmed by the confirmation unit that the measurement of the mounting position has been normally performed, the correction unit uses the mounting position information acquired by the mounting position information acquisition unit to perform the operation. For the parts that have been confirmed by the confirmation unit that the measurement of the mounting position has not been performed normally by correcting the parameters, the operating parameters are set using the mounting position information acquired by the mounting position information acquisition unit. The component mounting line according to claim 2, which is not amended.
  4. 　前記部品装着装置は、前記装着位置情報取得部により取得された前記装着位置情報を集計する情報集計部を有し、前記情報集計部は、前記確認部により前記装着位置の計測が正常に実施されたことが確認された部品については前記装着位置情報取得部により取得された前記装着位置情報を用いて前記装着位置情報を集計し、前記確認部により前記装着位置の計測が正常に実施されなかったことが確認された部品については前記装着位置情報取得部により取得された前記装着位置情報を用いて前記装着位置情報を集計しない、請求項２に記載の部品装着ライン。 The component mounting device has an information totaling unit that aggregates the mounting position information acquired by the mounting position information acquisition unit, and the information totaling unit normally measures the mounting position by the confirmation unit. For the parts that were confirmed to be, the mounting position information was aggregated using the mounting position information acquired by the mounting position information acquisition unit, and the measurement of the mounting position was not normally performed by the confirmation unit. The component mounting line according to claim 2, wherein the mounting position information is not aggregated using the mounting position information acquired by the mounting position information acquisition unit for the component confirmed to be.
  5. 　前記判断部は、前記画像取得部により取得された前記画像の中の部品の全体がその部品に対して設定された計測エリア内に位置するか否かを判断し、その部品の少なくとも一部が前記計測エリアの外側に位置していた場合には、その部品についての前記装着位置の計測は正常に実施されなかったと判断する、請求項１～４のいずれかに記載の部品装着ライン。 The determination unit determines whether or not the entire component in the image acquired by the image acquisition unit is located within the measurement area set for the component, and at least a part of the component is determined. The component mounting line according to any one of claims 1 to 4, wherein when the component is located outside the measurement area, it is determined that the measurement of the mounting position of the component has not been performed normally.
  6. 　前記判断部は、前記画像取得部により取得された前記画像と部品の基準パターンとの間でパターンマッチング処理を行い、前記画像における前記部品が占める領域と前記基準パターンとのマッチング率を算出し、算出した前記マッチング率が基準のマッチング率を下回っていた場合には、その部品についての前記装着位置の計測は正常に実施されなかったと判断する、請求項１～４のいずれかに記載の部品装着ライン。 The determination unit performs pattern matching processing between the image acquired by the image acquisition unit and the reference pattern of the component, and calculates the matching rate between the area occupied by the component in the image and the reference pattern. The component mounting according to any one of claims 1 to 4, wherein when the calculated matching rate is lower than the standard matching rate, it is determined that the measurement of the mounting position of the component has not been performed normally. line.
  7. 　前記判断部は、前記画像取得部により取得された前記画像の中の部品の寸法と基準寸法との差である寸法差が基準の寸法差を上回っていた場合には、その部品についての前記装着位置の計測は正常に実施されなかったと判断する、請求項１～４のいずれかに記載の部品装着ライン。 When the dimensional difference, which is the difference between the dimensions of the parts in the image acquired by the image acquisition unit and the reference dimensions, exceeds the reference dimensional differences, the determination unit attaches the parts to the parts. The component mounting line according to any one of claims 1 to 4, wherein it is determined that the position measurement has not been performed normally.
  8. 　前記検査装置は、前記部品装着装置および前記検査装置を管理する管理装置を介して、または前記管理装置を介さず直接的に、前記各部品についての前記装着位置情報および前記部品認識情報を前記部品装着装置に送信する、請求項１～７のいずれかに記載の部品装着ライン。 The inspection device obtains the mounting position information and the component recognition information for each component directly via the component mounting device and the management device that manages the inspection device, or without the management device. The component mounting line according to any one of claims 1 to 7, which is transmitted to the mounting device.
  9. 　前記検査装置は、前記生成部で前記第２部品識別情報が生成された部品については、前記装着位置情報および前記部品認識情報を前記部品装着装置に送信しない、請求項１～７のいずれかに記載の部品装着ライン。 The inspection device does not transmit the mounting position information and the component recognition information to the component mounting device for the component for which the second component identification information is generated by the generation unit, according to any one of claims 1 to 7. The listed parts mounting line.
  10. 　前記検査装置は、前記生成部で前記第１部品識別情報が生成された部品については、前記部品装着装置および前記検査装置を管理する管理装置を介して、または前記管理装置を介さず直接的に、前記各部品についての前記装着位置情報および前記部品認識情報を前記部品装着装置に送信する、請求項９に記載の部品装着ライン。 For the parts for which the first part identification information is generated by the generation unit, the inspection device directly passes through the component mounting device and the management device that manages the inspection device, or does not go through the management device. The component mounting line according to claim 9, wherein the mounting position information and the component recognition information for each component are transmitted to the component mounting device.
  11. 　基板に装着された各部品を検査する検査装置であって、
    　前記基板に装着された各部品の画像を取得する画像取得部と、
    　前記画像取得部により取得された前記各部品の画像に基づいて、前記各部品の前記基板における位置をその部品の装着位置として計測する計測部と、
    　前記計測部による前記装着位置の計測が正常に実施されたか否かを前記各部品について判断する判断部と、
    　前記判断部により前記判断がなされた前記各部品について前記計測部により前記装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する生成部とを備え、
    　前記生成部は、前記判断部により前記装着位置の計測が正常に実施されたと判断された部品については前記部品認識情報として第１部品認識情報を生成し、前記判断部により前記装着位置の計測が正常に実施されなかったと判断された部品については前記部品認識情報として第２部品認識情報を生成する、検査装置。     It is an inspection device that inspects each part mounted on the board.
    An image acquisition unit that acquires an image of each component mounted on the substrate, and an image acquisition unit.
    Based on the image of each component acquired by the image acquisition unit, a measurement unit that measures the position of each component on the substrate as the mounting position of the component, and a measurement unit.
    A judgment unit for determining whether or not the measurement of the mounting position was normally performed by the measurement unit, and a judgment unit for determining whether or not the measurement of the mounting position was normally performed.
    Each component for which the determination has been made is provided with a generation unit that generates component recognition information, which is information indicating whether or not the measurement of the mounting position has been normally performed by the measurement unit.
    The generation unit generates first component recognition information as the component recognition information for a component for which the determination unit determines that the measurement of the mounting position has been normally performed, and the determination unit measures the mounting position. An inspection device that generates a second part recognition information as the part recognition information for a part determined to have not been normally carried out.
  12. 　前記判断部は、前記画像取得部により取得された前記画像の中の部品の全体がその部品に対して設定された計測エリア内に位置するか否かを判断し、その部品の少なくとも一部が前記計測エリアの外側に位置していた場合には、その部品についての前記装着位置の計測は正常に実施されなかったと判断する、請求項１１に記載の検査装置。 The determination unit determines whether or not the entire component in the image acquired by the image acquisition unit is located within the measurement area set for the component, and at least a part of the component is determined. The inspection device according to claim 11, wherein when the image is located outside the measurement area, it is determined that the measurement of the mounting position of the component has not been performed normally.
  13. 　前記判断部は、前記画像取得部により取得された前記画像と部品の基準パターンとの間でパターンマッチング処理を行い、前記画像における前記部品が占める領域と前記基準パターンとのマッチング率を算出し、算出した前記マッチング率が基準のマッチング率を下回っていた場合には、その部品についての前記装着位置の計測は正常に実施されなかったと判断する、請求項１１に記載の検査装置。 The determination unit performs pattern matching processing between the image acquired by the image acquisition unit and the reference pattern of the component, and calculates the matching rate between the area occupied by the component in the image and the reference pattern. The inspection device according to claim 11, wherein when the calculated matching rate is lower than the standard matching rate, it is determined that the measurement of the mounting position of the component has not been performed normally.
  14. 　前記判断部は、前記画像取得部により取得された前記画像の中の部品の寸法と基準寸法との差である寸法差が基準の寸法差を上回っていた場合には、その部品についての前記装着位置の計測は正常に実施されなかったと判断する、請求項１１に記載の検査装置。 When the dimensional difference, which is the difference between the dimensions of the parts in the image acquired by the image acquisition unit and the reference dimensions, exceeds the reference dimensional difference, the determination unit attaches the parts to the parts. The inspection device according to claim 11, wherein it is determined that the position measurement has not been performed normally.
  15. 　前記部品装着装置および前記検査装置を管理する管理装置を介して、または前記管理装置を介さず直接的に、前記各部品についての前記装着位置情報および前記部品認識情報を前記部品装着装置に送信する、請求項１１～１４のいずれかに記載の検査装置。 The mounting position information and the component recognition information for each component are transmitted to the component mounting device via the component mounting device and the management device that manages the inspection device, or directly without the management device. , The inspection device according to any one of claims 11 to 14.
  16. 　前記生成部で前記第２部品識別情報が生成された部品については、前記装着位置情報および前記部品認識情報を前記部品装着装置に送信しない、請求項１１～１５のいずれかに記載の検査装置。 The inspection device according to any one of claims 11 to 15, wherein the component for which the second component identification information is generated by the generation unit does not transmit the mounting position information and the component recognition information to the component mounting device.
  17. 　前記生成部で前記第１部品識別情報が生成された部品については、前記部品装着装置および前記検査装置を管理する前記管理装置を介して、または前記管理装置を介さず直接的に、前記各部品についての前記装着位置情報および前記部品認識情報を前記部品装着装置に送信する、請求項１６に記載の検査装置。 For the parts for which the first part identification information is generated by the generation unit, the parts are directly via the management device that manages the component mounting device and the inspection device, or directly without the management device. 16. The inspection device according to claim 16, wherein the mounting position information and the component recognition information are transmitted to the component mounting device.
  18. 　基板に装着された各部品を検査する検査方法であって、
    　前記基板に装着された前記各部品の前記基板における位置をその部品の装着位置として計測する計測工程と、
    　前記計測工程で前記装着位置の計測が正常に実施されたか否かを前記各部品について判断する判断工程と、
    　前記判断工程で前記判断がなされた前記各部品について前記計測工程で前記装着位置の計測が正常に実施されたか否かを示す情報である部品認識情報を生成する生成工程とを含み、
    　前記生成工程は、前記判断工程で前記装着位置の計測が正常に実施されたと判断された部品については前記部品認識情報として第１部品認識情報を生成し、前記判断工程で前記装着位置の計測が正常に実施されなかったと判断された部品については前記部品認識情報として第２部品認識情報を生成する、
    　検査方法。     It is an inspection method that inspects each part mounted on the board.
    A measurement step of measuring the position of each component mounted on the board on the board as the mounting position of the component, and a measurement process.
    A determination step for determining whether or not the mounting position was normally measured in the measurement process for each component, and a determination step.
    Including a generation step of generating component recognition information which is information indicating whether or not the measurement of the mounting position was normally performed in the measurement step for each component for which the determination was made in the determination step.
    In the generation step, the first component recognition information is generated as the component recognition information for the component for which the measurement of the mounting position is normally performed in the determination step, and the measurement of the mounting position is performed in the determination step. The second part recognition information is generated as the part recognition information for the parts determined to have not been carried out normally.
    Inspection method.
  19. 　前記基板に装着された前記各部品の画像を取得する画像取得工程を含み、前記計測工程は、前記画像取得工程で取得した前記各部品の画像に基づいて前記各部品についての前記装着位置を計測する、請求項１８に記載の検査方法。 The measurement step includes an image acquisition step of acquiring an image of each component mounted on the substrate, and the measurement step measures the mounting position of each component based on the image of each component acquired in the image acquisition step. The inspection method according to claim 18.
PCT/JP2021/016758 2020-06-05 2021-04-27 Component mounting line, inspection device, and inspection method WO2021246092A1 (en)

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Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2018037501A (en) * 2016-08-31 2018-03-08 パナソニックＩｐマネジメント株式会社 Component mounting system and data feedback method in component mounting system
WO2019130537A1 (en) * 2017-12-28 2019-07-04 株式会社Ｆｕｊｉ Tracing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018037501A (en) * 2016-08-31 2018-03-08 パナソニックＩｐマネジメント株式会社 Component mounting system and data feedback method in component mounting system
WO2019130537A1 (en) * 2017-12-28 2019-07-04 株式会社Ｆｕｊｉ Tracing device

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