WO2021238490A1 - 显示基板和显示装置 - Google Patents
显示基板和显示装置 Download PDFInfo
- Publication number
- WO2021238490A1 WO2021238490A1 PCT/CN2021/087545 CN2021087545W WO2021238490A1 WO 2021238490 A1 WO2021238490 A1 WO 2021238490A1 CN 2021087545 W CN2021087545 W CN 2021087545W WO 2021238490 A1 WO2021238490 A1 WO 2021238490A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- display area
- display
- sub
- layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 190
- 239000003990 capacitor Substances 0.000 claims description 26
- 239000010409 thin film Substances 0.000 claims description 21
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 239000010408 film Substances 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 221
- 238000003384 imaging method Methods 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 230000004044 response Effects 0.000 description 12
- 239000010936 titanium Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000004313 glare Effects 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 101100069049 Caenorhabditis elegans goa-1 gene Proteins 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- -1 region Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0439—Pixel structures
- G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0804—Sub-multiplexed active matrix panel, i.e. wherein one active driving circuit is used at pixel level for multiple image producing elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0809—Several active elements per pixel in active matrix panels
- G09G2300/0819—Several active elements per pixel in active matrix panels used for counteracting undesired variations, e.g. feedback or autozeroing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0809—Several active elements per pixel in active matrix panels
- G09G2300/0842—Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2340/00—Aspects of display data processing
- G09G2340/04—Changes in size, position or resolution of an image
- G09G2340/0407—Resolution change, inclusive of the use of different resolutions for different screen areas
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2360/00—Aspects of the architecture of display systems
- G09G2360/14—Detecting light within display terminals, e.g. using a single or a plurality of photosensors
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
- G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3266—Details of drivers for scan electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
Definitions
- the embodiment of the present disclosure relates to a display substrate and a display device.
- the industry has proposed a solution called "under-screen camera” that combines a camera and a display panel into a display device.
- the display device includes a display panel and a camera located below the display panel.
- the area of the display device with the under-screen camera can emit light and display like other areas, and has a camera function at the same time.
- At least one embodiment of the present disclosure provides a display substrate having a first side for display and a second side opposite to the first side, the display substrate including a display area, wherein the display area Comprising a first display area and a second display area at least partially surrounding the first display area, the first display area allowing light from the first side to be at least partially transmitted to the second side; the first The display area includes a plurality of first sub-pixels arranged in an array, each of the first sub-pixels includes a first light-emitting device, the second display area includes a plurality of first pixel circuits, and the plurality of first pixel circuits are respectively connected to The plurality of first light-emitting devices of the plurality of first sub-pixels are electrically connected to respectively drive the plurality of first light-emitting devices; wherein, the display area further includes a first light-shielding layer, which is perpendicular to the display substrate In the direction of the board surface, the first light shielding layer at least partially overlaps the second display area,
- the display substrate provided by at least one embodiment of the present disclosure further includes a power line and a reset voltage line, wherein the first light shielding layer is electrically connected to the power line or the reset voltage line.
- each of the plurality of first pixel circuits includes a first thin film transistor, and the first thin film transistor includes a first active layer, a first gate, and The first source and drain electrodes; the first light-shielding layer and the first source and drain electrodes are arranged in the same layer.
- the second display area includes a first sub-area at least partially surrounding the first display area and a second sub-area at least partially surrounding the first sub-area ,
- the first light-shielding layer is arranged in the first sub-region, and the plurality of first pixel circuits are arranged in the second sub-region.
- the display substrate provided by at least one embodiment of the present disclosure further includes a plurality of signal lines respectively electrically connected to the plurality of first pixel circuits, the plurality of signal lines extend through the first sub-region, and the first
- the pixel circuit also includes a first storage capacitor.
- the first storage capacitor includes a first capacitor plate and a second capacitor plate.
- the first capacitor plate and the first gate are arranged in the same layer.
- the signal line is arranged in the same layer as the first capacitor plate or the second capacitor plate.
- the display substrate provided by at least one embodiment of the present disclosure further includes a base substrate and a second light-shielding layer, wherein the plurality of first sub-pixels are disposed on the base substrate, and the second light-shielding layer is disposed on the base substrate.
- the first light-shielding layer and the second light-shielding layer are arranged in the same layer.
- the first light-shielding layer and the second light-shielding layer are integrated film layers continuously arranged, and the integrated film layer has The opening is opened so that in a direction perpendicular to the surface of the display substrate, the first light shielding layer does not overlap with the first display area.
- the display substrate provided by at least one embodiment of the present disclosure further includes a base substrate and a heat dissipation layer, wherein the plurality of first sub-pixels are disposed on the first side of the base substrate, and the heat dissipation layer is disposed on the base substrate.
- the first side and the second side are opposite; the first light shielding layer and the heat dissipation layer are provided in the same layer.
- the first light-shielding layer and the heat dissipation layer are an integrated film layer continuously arranged, and the integrated film layer has an opening in the first display area, So that in a direction perpendicular to the surface of the display substrate, the first light shielding layer does not overlap with the first display area.
- the second display area further includes a plurality of second sub-pixels, and each second sub-pixel includes a second light-emitting device and is electrically connected to the second light-emitting device.
- the second pixel circuit is configured to drive the second light-emitting device, in the second display area, the plurality of second pixel circuits are arranged in a first array, and the plurality The first pixel circuit is arranged in the gap of the first array, and is arranged integrally with the plurality of second pixel circuits into a second array.
- the first pixel circuit includes a first thin film transistor, and the first thin film transistor includes a first active layer, a first gate, and a first source and drain electrode
- the first light-emitting device includes a first electrode, a second electrode, and a first light-emitting layer between the first electrode and the second electrode.
- the first source and drain electrodes are electrically connected;
- the second pixel circuit includes a second thin film transistor, and the second thin film transistor includes a second active layer, a second gate, and a second source and drain electrode.
- the light-emitting device includes a first electrode, a second electrode, and a second light-emitting layer between the first electrode and the second electrode.
- the source and drain electrodes are electrically connected; in the plane where the display substrate is located, the shortest distance between the first via hole and the light-emitting area of the first light-emitting layer is smaller than the light emission between the second via hole and the second light-emitting layer The shortest distance of the area.
- the orthographic projection of the first via hole in the plane of the display substrate and the light-emitting area of the first light-emitting layer in the plane of the display substrate overlap at least partially.
- the display area includes a third display area that at least partially surrounds the second display area, and the third display area includes a plurality of third sub-elements arranged in an array. Pixel, wherein the arrangement density of the plurality of third sub-pixels in the third display area is greater than the arrangement density of the plurality of first sub-pixels in the first display area, and is also greater than the arrangement density of the second sub-pixels in the first display area. The arrangement density of the plurality of second sub-pixels in the display area.
- the arrangement density of the plurality of first sub-pixels in the first display area is equal to that of the plurality of second sub-pixels in the second display area. Arrangement density.
- the display substrate provided by at least one embodiment of the present disclosure further includes a first scan driving circuit and a second scan driving circuit respectively located on opposite sides of the display area, wherein the first scan driving circuit and the second scan driving circuit
- the circuits collectively provide electrical signals for a plurality of third sub-pixels in the third display area;
- the first scan driving circuit is also a first scan driving circuit located on the side of the first display area close to the first scan driving circuit
- the plurality of second sub-pixels and the plurality of first pixel circuits in the second display area provide electrical signals
- the second scan driving circuit is also a second scan driving circuit located on the side of the first display area close to the second scan driving circuit.
- the plurality of second sub-pixels and the plurality of first pixel circuits in the second display area provide electrical signals.
- At least one embodiment of the present disclosure provides a display device including any one of the above-mentioned display substrates and a sensor, wherein the sensor is disposed on a second side of the display substrate, and the sensor is configured as Receive light from the first side.
- the senor in a direction perpendicular to the surface of the display substrate, the sensor at least partially overlaps the first display area of the display substrate.
- Fig. 1A is a schematic plan view of a display substrate
- Fig. 1B is a partial enlarged schematic diagram of a display substrate
- FIG. 2 is a schematic cross-sectional view of the display substrate in FIG. 1B along the line A-A;
- FIG. 3 is a schematic plan view of a display substrate provided by at least one embodiment of the present disclosure.
- FIG. 4A is a partial enlarged schematic diagram of a display substrate provided by at least one embodiment of the present disclosure.
- 4B is a schematic diagram of an arrangement of sub-pixels in a first display area and a second display area in a display substrate provided by at least one embodiment of the present disclosure
- FIG. 5 is a schematic plan view of a display substrate provided by at least one embodiment of the present disclosure.
- FIG. 6 is a schematic cross-sectional view of the display substrate in FIG. 5 along the line C-C;
- FIG. 7 is a schematic plan view of a first display area and a part of a second display area in a display substrate provided by at least one embodiment of the present disclosure
- FIG. 8 is another schematic plan view of the first display area and a part of the second display area in the display substrate provided by at least one embodiment of the present disclosure
- FIG. 9 is a schematic cross-sectional view of the display substrate in FIG. 3 along the line B-B;
- Fig. 10 is another schematic cross-sectional view of the display substrate in Fig. 3 along the line B-B;
- FIG. 11 is a schematic plan view of a first light-shielding layer in a display substrate provided by at least one embodiment of the present disclosure
- Fig. 12 is another schematic cross-sectional view of the display substrate in Fig. 3 along the line B-B;
- FIG. 13 is a schematic cross-sectional view of a second display area in a display substrate provided by at least one embodiment of the present disclosure
- FIG. 14 is a schematic diagram of an arrangement of seed pixels in a first display area in a display substrate provided by at least one embodiment of the present disclosure
- 15 is a schematic diagram of an arrangement of seed pixels in a second display area in a display substrate provided by at least one embodiment of the present disclosure
- 16 is a schematic plan view of a display substrate provided by at least one embodiment of the present disclosure.
- FIG. 17 is a pixel circuit diagram of a display substrate provided by at least one embodiment of the present disclosure.
- 18A is a schematic cross-sectional view of a display device provided by at least one embodiment of the present disclosure.
- 18B is a schematic cross-sectional view of another display device provided by at least one embodiment of the present disclosure.
- 19A and 19B are respectively a point spread function simulation diagram of a point light source imaging when the display device has no first light shielding layer and when there is a first light shielding layer;
- 20A and 20B are two modulation transfer function diagrams of point light source imaging when the display device has no first light shielding layer and when there is a first light shielding layer;
- 21A and 21B are real glare photos of the point light source imaging when the display device does not have the first light-shielding layer and has the first light-shielding layer, respectively.
- the display panel in order to allow more light to enter the camera located below the display panel, the display panel can be designed to have a high pixel density area and a low pixel density area, and the camera is set to allow More light penetrates below the low pixel density area.
- FIG. 1A shows a schematic plan view of a display substrate
- FIG. 1B is a partial enlarged schematic view of the display substrate shown in FIG. 1A
- FIG. 2 shows a schematic cross-sectional view of the display substrate in FIG. 1B along the line A-A.
- the display area of the display substrate includes a light-transmitting display area 1, a peripheral display area 2 and a main body display area 3 arranged side by side.
- the main display area 3 is the main display area and has a higher resolution (PPI, Pixel Per Inch), that is, the main display area 3 is arranged with a higher density of sub-pixels for display.
- Each sub-pixel includes a light-emitting device and a pixel circuit that drives the light-emitting device.
- the light-transmitting display area 1 may allow light incident from the display side of the display substrate to pass through the display substrate to reach the back side of the display substrate, so as to be used for normal operation of components such as sensors (such as image sensors) disposed on the back side of the display substrate.
- the light-transmitting display area 1 and the peripheral display area 2 also include a plurality of sub-pixels for display.
- the pixel circuit of the sub-pixel includes metal traces, metal electrodes, and active layers, it is usually at least partially opaque, or its light permeability cannot meet the requirements of the light-transmitting display area 1.
- the pixel circuits of the sub-pixels in the light-transmitting display area 1 can be arranged in the peripheral display area 2, such as the peripheral The gray box in the display area 2 is shown, so it occupies a part of the space of the peripheral display area 2.
- the remaining space of the peripheral display area 2 is used to set the sub-pixels of the peripheral display area 2 itself, for example, each white box in the peripheral display area 2 represents a sub-pixel.
- each white box in the peripheral display area 2 represents a sub-pixel.
- the sub-pixels of the peripheral display area 2 (white boxes in FIG. 1B) and the pixel circuits of the sub-pixels in the light-transmitting display area 1 (gray boxes in FIG. 1B) are all in the peripheral display area 2.
- the light-emitting device 4 of a sub-pixel in the light-transmitting display area 1 includes an anode 4A, a cathode 4C, and a light-emitting layer 4B between the anode 4A and the cathode 4C.
- the anode 4A is connected to the peripheral display through a wire 6.
- the pixel circuit 5 in the area 2 and thus the light-emitting device 4 is controlled and driven by the pixel circuit 5.
- the pixel circuit 5 includes one or more thin film transistors, capacitors and other structures. In the plane of the display substrate, there are certain gaps between the layers of these structures, that is, many narrow gaps are formed.
- the light on the display side of the display substrate It may enter the peripheral display area 2 obliquely through the light-transmitting display area 1, and enter the sensor (such as an image sensor) provided on the back side of the display substrate through the slit in the peripheral display area 2, which is equivalent to that the light has passed through the aperture ratio.
- a low grating therefore, will produce a strong diffraction phenomenon, leading to aggravation of the glare phenomenon of the sensor during imaging, and a decrease in resolution, thereby affecting the normal function of the sensor.
- At least one embodiment of the present disclosure provides a display substrate and a display device.
- the display substrate has a first side for display and a second side opposite to the first side.
- the display substrate includes a display area, and the display area includes a first display. Area and a second display area at least partially surrounding the first display area, the first display area allows light from the first side to be at least partially transmitted to the second side;
- the first display area includes a plurality of first sub-pixels arranged in an array, Each first sub-pixel includes a first light-emitting device, and the second display area includes a plurality of first pixel circuits, and the plurality of first pixel circuits are respectively electrically connected to the plurality of first light-emitting devices of the plurality of first sub-pixels to respectively Drive a plurality of first light-emitting devices;
- the display area further includes a first light-shielding layer, in a direction perpendicular to the surface of the display substrate, the first light-shielding layer and the
- the first light-shielding layer can block the light entering the second display area, so as to prevent the light from entering the sensor provided on the second side of the display substrate through the second display area, thereby improving the performance of the sensor. Sensing effect.
- FIG. 3 shows a schematic plan view of the display substrate.
- the display substrate has a first side for display (ie, a display side) and a second side (ie, a non-display side, also called a back side) opposite to the first side.
- the display substrate includes a display area including a first display area 10 and a second display area 20 at least partially surrounding the first display area 10.
- the first display area 10 allows light from the first side to be at least partially transmitted to the second display area.
- Side that is, the first display area 10 is a transparent display area. Light can pass from the display side of the display substrate to the non-display side through the transparent display area.
- the light transmitted from the first display area 10 to the non-display side is used for sensing work, such as imaging.
- FIG. 4A shows a schematic diagram of the arrangement of sub-pixels in the display area.
- the first display area 10 includes a plurality of first sub-pixels P1 arranged in an array, each first sub-pixel P1 includes a first light-emitting device EM1, and the plurality of first light-emitting devices EM1 are arranged in an array;
- the second display area 20 includes a plurality of first pixel circuits D1, and the plurality of first pixel circuits D1 are respectively electrically connected to the plurality of first light-emitting devices EM1 of the plurality of first sub-pixels P1 to drive the plurality of first light-emitting devices EM1 respectively .
- the pixel circuits of the plurality of first sub-pixels P1 in the first display area 10 are arranged in the second display area 20, thereby avoiding too many structures or opaque structures in the first display area 10. Ensuring the light transmittance of the first display area 10 is beneficial to transmit more light for being sensed by the sensor and improve the sensing quality.
- the second display area 20 further includes a plurality of second sub-pixels P2, and each second sub-pixel P2 includes a second light-emitting device EM2 and a second pixel circuit D2 electrically connected to the second light-emitting device EM2. D2 is configured to drive the second light emitting device EM2.
- the plurality of second pixel circuits D2 are arranged in a first array, and the plurality of first pixel circuits D1 are arranged in the gaps of the first array and are arranged integrally with the plurality of second pixel circuits D2
- the first array is a sub-array of the second array.
- a plurality of first light-emitting devices EM1 and a plurality of second sub-pixels P2 are arranged uniformly in the first display area 10 and the second display area 20, respectively, so that the first The display area 10 and the second display area 20 emit light and display uniformly as a whole.
- FIG. 4B shows a specific schematic diagram of the arrangement of sub-pixels in the first display area and the second display area.
- the left side of the arc-shaped dashed line is the second display area 20
- the right side of the arc-shaped dashed line is the first display area 10.
- the second pixel circuits D2 of the plurality of second sub-pixels P2 are arranged in a first array
- the plurality of first pixel circuits D1 are arranged in the gaps of the first array, for example, arranged in a dashed circle frame.
- the second pixel circuits D2 are arranged in a second array as a whole, whereby the first light-emitting devices EM1 of the plurality of sub-pixels P1 and the plurality of second sub-pixels P2 (ie, the plurality of second light-emitting devices EM1)
- the devices EM2) are arranged uniformly in the first display area 10 and the second display area 20, respectively.
- the display area further includes a first light-shielding layer.
- the first light-shielding layer and the second display area 20 at least partially overlap, and the first light-shielding layer does not overlap with the first display area 10 .
- the first light shielding layer can shield the light that enters the second display area 20 and passes through the slits between the various traces, electrodes or active layers in the second display area 20, so as to prevent the light from passing through the second display area 20. It reaches the second side of the display substrate, so that the sensing quality of the sensor can be improved, for example, the shooting quality of the under-screen camera can be improved.
- FIG. 5 shows a schematic plan view of a display substrate provided by at least one embodiment of the present disclosure
- FIG. 6 shows a schematic cross-sectional view of the display substrate along the line C-C.
- each of the plurality of first pixel circuits includes a first thin film transistor 12, and the first thin film transistor 12 includes a first active layer 121, a first gate 122, and a first source and drain electrode.
- Structures such as 123 and 124; for example, the first light-shielding layer S1 can be provided in the same layer as the first source and drain electrodes 123 and 124, thereby simplifying the manufacturing process of the display substrate.
- “same-layer arrangement” means that two functional layers or structural layers are formed in the same layer and with the same material in the hierarchical structure of the display substrate.
- the two The functional layer or the structure layer can be formed of the same material layer, and the required pattern and structure can be formed through the same patterning process.
- the second display area 20 includes a first sub-area 20A at least partially surrounding the first display area 10 and a second sub-area 20A at least partially surrounding the first sub-area 20A.
- the area 20B that is, the second sub-area 20B is farther away from the first display area 10 than the first sub-area 20A.
- the first light-shielding layer S1 is disposed in the first sub-region 20A, and a plurality of first pixel circuits are disposed in the second sub-region 20B.
- the first light shielding layer S1 at least partially covers the first sub-region 20A.
- the first light shielding layer S1 completely covers the first sub-region 20A, thereby completely shielding light entering the second sub-region 20B.
- the display substrate further includes a plurality of signal lines L, which extend in the vertical direction in the figure in the display area, in order to avoid crossing the first display area 10 in the extension direction.
- the multiple signal lines L are bent and extend through the first sub-region 20A, thereby bypassing the first display area 10, in the first sub-region 20A, the multiple signal lines L extend parallel to each other, for example, with slits therebetween .
- the multiple signal lines L may also extend in the horizontal direction in the figure in the display area. In order to avoid crossing the first display area 10 in the extension direction, the multiple signal lines L are bent and extend through the first sub-region.
- the first pixel circuit further includes a first storage capacitor 13.
- the first storage capacitor 13 includes a first capacitor plate 131 and a second capacitor plate 132, and the first capacitor plate 131 and the first gate 122 They are arranged in the same layer, and multiple signal lines L are arranged in the same layer as the first capacitor plate 131 or the second capacitor plate 132.
- the plurality of signal lines L may be data lines, scan lines (for example, gate lines, reset lines, light-emitting control lines, etc.), power supply voltage lines, and the like.
- the orthographic projection of the first light-shielding layer S1 on the plane of the display substrate completely covers the multiple signal lines L routed in the first sub-region 20A on the plane of the display substrate.
- the first display area 10 may be a suitable shape such as a circle, a rectangle, a racetrack, etc., and a circle is shown as an example in the figure.
- the size D of the first display area 10 may be 3 mm-4 mm, such as 3.2 mm, 3.4 mm, 3.6 mm, etc., so as to transmit enough light, for example, for imaging.
- the size of the first display area 10 may be a diameter of a circle, a diagonal of a square or a rectangle, or the like.
- the width A of the first sub-region 20A that is, the arrangement width of the first light-shielding layer S1 may be 0.1 mm-0.3 mm, such as 0.1 mm or 0.2 mm, etc., so as to achieve a certain light-shielding effect without affecting the display area. normal display.
- the display substrate further includes a power line and a reset voltage line (detailed later), and the first light shielding layer S1 is electrically connected to the power line or the reset voltage line.
- a certain direct current signal can be input to the first light shielding layer S1 to avoid the first light shielding layer S1 from appearing in a floating state, thereby avoiding the influence on the signal transmission on the display substrate.
- the first light-shielding layer S1 may also be disposed on other positions of the display substrate.
- FIG. 9 is a schematic cross-sectional view of the display substrate in FIG. 3 along the line B-B.
- the display substrate further includes a base substrate 14 and a second light-shielding layer S2.
- a plurality of first sub-pixels are arranged on the base substrate 14, and the second light-shielding layer S2 is arranged on the plurality of first pixel circuits and the liner. Between the base substrates 14, at least part of the circuit structures of the plurality of first pixel circuits or at least part of the circuit structures of the plurality of second pixel circuits is blocked.
- the second light shielding layer S2 at least shields the active layer 121 of the first thin film transistor 12 to prevent light from entering the active layer 121 from the second side of the display substrate to affect the normal operation of the first thin film transistor 12.
- the second light-shielding layer S2 is covered with an insulating layer 14A to be spaced apart from the plurality of first pixel circuits; for another example, the second light-shielding layer S2 at least shields the gaps between different electrodes of the first pixel circuit or the second pixel circuit. Slits, or slits between electrodes and signal lines (e.g., gate lines, data lines, power lines), etc.
- the first light-shielding layer S1 and the second light-shielding layer S2 are provided in the same layer.
- the first light shielding layer S1 is disposed in the first sub-region 20A as in the above-mentioned embodiment, so as to shield one or more slits between the plurality of signal lines L.
- a blocking B here means that the orthographic projection of B on the plane where the display substrate is located is in the orthographic projection of A on the plane where the display substrate is located.
- the first light-shielding layer S1 and the second light-shielding layer S2 may be arranged at intervals, or, in some embodiments, as shown in FIG. 10, the first light-shielding layer S1 and the second light-shielding layer S2 are continuous
- the integrated film layer is provided, and the integrated film layer has an opening in the first display area 10 so that the first light shielding layer S1 and the first display area 10 do not overlap in the direction perpendicular to the surface of the display substrate.
- the integrated film layer of the first light-shielding layer S1 and the second light-shielding layer S2 can completely cover the display area except the first display area 10 to fully achieve the light-shielding effect.
- the first light-shielding layer S1 and the second light-shielding layer S2 can be made of metal materials or alloy materials with good light-shielding properties, such as copper (Cu), aluminum (Al), and titanium (Ti).
- the display substrate further includes a base substrate 14 and a heat dissipation layer SCF, and a plurality of first sub-pixels are arranged on the first side of the base substrate 14 (shown in the figure as The upper side of the base substrate 14), the heat dissipation layer SCF is disposed on the second side of the base substrate 14 (shown as the lower side of the base substrate 14 in the figure), and the first side and the second side are opposite.
- the first light shielding layer S1 and the heat dissipation layer SCF are provided in the same layer.
- the first light shielding layer S1 is disposed in the first sub-region 20A as in the above-mentioned embodiment, so as to shield one or more slits between the plurality of signal lines L.
- the first light-shielding layer S1 and the heat dissipation layer SCF may be arranged at intervals, or, referring to FIG. 11 and FIG. 12, the first light-shielding layer S1 and the heat dissipation layer SCF may be a continuous integrated film layer.
- a display area 10 has an opening so that in a direction perpendicular to the surface of the display substrate, the first light shielding layer S1 does not overlap with the first display area 10.
- the first light-shielding layer S1 and the heat dissipation layer SCF may be metal layers such as copper foil to have good light-shielding effect and heat dissipation effect at the same time.
- a copper foil with a certain shape and size (such as the shape and size shown in FIG. 11) can be formed by cutting, and then attached to the second side of the base substrate 14 to simultaneously Realize good shading effect and heat dissipation effect.
- the first light-shielding layer S1 and the second light-shielding layer S2 are arranged as a continuous integrated film layer or the first light-shielding layer S1 and the heat dissipation layer SCF are arranged as a continuous integrated film.
- the chemical film layer can achieve the technical effect of completely shielding the second display area 20, thereby achieving a more sufficient light shielding effect, and improving the working quality of the under-screen sensor, for example, improving the photographing effect of the under-screen camera.
- different first light shielding layers S1 may be used at the same time, for example, any two or more of the first light shielding layers S1 shown in FIG. 6, FIG. 9, FIG. 10, and FIG. 12 may be used. Use at the same time to further improve the shading effect.
- the first light shielding layer S1 shown in FIGS. 10 and 11 may be used at the same time, or the first light shielding layer S1 shown in FIGS. 6 and 11 may be used at the same time, or the first light shielding layer S1 shown in FIGS. 6 and 11 may be used at the same time.
- the first light-shielding layer S1, or the first light-shielding layer S1 shown in FIG. 9 and FIG. 11, etc. are used at the same time, that is, the display substrate has two or more first light-shielding layers S1 at the same time to further improve the light-shielding effect.
- the first pixel circuit includes a first thin film transistor 12, and the first thin film transistor 12 includes a first active layer 121 and a first gate.
- the first light-emitting device 11 includes a first electrode 111, a second electrode 113, and a first light-emitting layer 112 between the first electrode 111 and the second electrode 113, and the first light-emitting device
- the first electrode 111 of 11 is electrically connected to the first source/drain electrode 124 through the first via hole V1.
- the first electrode 111 of the first light emitting device 11 is first electrically connected to the transparent connection electrode 15 through the first via hole V1, and then electrically connected to the first source/drain electrode 124 through the transparent connection electrode 15.
- the transparent connecting electrode 15 may be made of a transparent conductive material, such as a transparent metal oxide, such as indium tin oxide (ITO), etc., to have good light transmittance.
- a transparent metal oxide such as indium tin oxide (ITO), etc.
- ITO indium tin oxide
- the transparent connecting electrode 15 has better light transmittance than the first electrode 111. Therefore, the transparent connecting electrode 15 is used to electrically connect the first electrode 111 and the first source/drain electrode 124 to further increase the light transmittance of the first display area 10. sex.
- the second pixel circuit includes a second thin film transistor 22, the second thin film transistor 22 includes a second active layer 221, a second gate 222, and second source and drain electrodes 223 and 224, and the second light emitting device 21 It includes a first electrode 211, a second electrode 213, and a second light-emitting layer 212 between the first electrode 211 and the second electrode 213.
- the first electrode 211 of the second light-emitting device 21 is drained from the second source through the second via hole V2. Pole 223 is electrically connected.
- the display substrate further includes a first gate insulating layer 141, a second gate insulating layer 142, an interlayer insulating layer 143, a first planarization layer 144, a second planarization layer 145, and a pixel defining layer.
- the structure of the layer 146 and the encapsulation layer 147, etc., the embodiment of the present disclosure does not specifically limit other structures of the display substrate.
- the above-mentioned active layers may use amorphous silicon layers, polysilicon layers or metal oxide semiconductor materials.
- the polysilicon may be high temperature polysilicon or low temperature polysilicon
- the oxide semiconductor may be indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), zinc oxide (ZnO), gallium zinc oxide (GZO), or the like.
- Each gate can be made of copper (Cu), aluminum (Al), titanium (Ti) or other metal materials or alloy materials, for example, formed into a single-layer metal layer structure or a multi-layer metal layer structure, such as multiple layers of titanium/aluminum/titanium Metal layer structure.
- Each of the drain electrodes can be made of copper (Cu), aluminum (Al), titanium (Ti) and other metal materials or alloy materials, for example, formed into a single-layer metal layer structure or a multi-layer metal layer structure, such as titanium/aluminum/titanium, etc. Layer metal layer structure.
- the material of the first electrode of each light-emitting device may be a transparent metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), gallium zinc oxide (GZO), and the material of the second electrode may be lithium (Li) , Aluminum (Al), Magnesium (Mg), Silver (Ag) and other metal materials.
- ITO indium tin oxide
- IZO indium zinc oxide
- GZO gallium zinc oxide
- the material of the second electrode may be lithium (Li) , Aluminum (Al), Magnesium (Mg), Silver (Ag) and other metal materials.
- the base substrate 14 may be a rigid base substrate such as glass, quartz, or a flexible base substrate such as polyimide.
- the first gate insulating layer 141, the second gate insulating layer 142, and the interlayer insulating layer 143 may be silicon oxide, nitrogen, etc.
- Inorganic insulating materials such as silicon or silicon oxynitride, the first planarization layer 144, the second planarization layer 145, and the pixel defining layer 146 can be made of organic insulating materials such as polyimide or resin.
- the encapsulation layer 147 may include a stack of a plurality of organic encapsulation layers and inorganic encapsulation layers.
- the embodiments of the present disclosure do not specifically limit the material and structure of each functional layer of the display substrate.
- each light-emitting layer may be an organic light-emitting layer or a quantum dot light-emitting layer, etc.
- the display substrate may be realized as an organic light-emitting diode (OLED) display substrate or a quantum dot light-emitting diode (QLED) display substrate, etc.
- OLED organic light-emitting diode
- QLED quantum dot light-emitting diode
- the type of display substrate is not specifically limited.
- the first via hole V1 and the light-emitting area of the first light-emitting layer 112 (that is, the first light-emitting layer 112 is directly opposite to the first
- the shortest distance between the electrode 111 and the second electrode 113) is smaller than the second via hole V2 and the light-emitting area of the second light-emitting layer 212 (that is, the second light-emitting layer 212 is directly opposite to the first electrode 211 and the second electrode 211).
- the area between the electrodes 213) is the shortest distance.
- FIG. 14 shows a schematic plan view of the light-emitting area and the first electrode via of the light-emitting device of four sub-pixels in the first display area 10, and the four sub-pixels constitute one pixel unit in the first display area 10.
- the four sub-pixels include one red sub-pixel R, one blue sub-pixel B, and two green sub-pixels G.
- FIG. 15 shows a schematic plan view of the light-emitting area and the first electrode via of the light-emitting device of four sub-pixels in the second display area 20, and the four sub-pixels constitute one pixel unit in the second display area 00.
- the four sub-pixels include one red sub-pixel R, one blue sub-pixel B, and two green sub-pixels G.
- the shortest distance between the first via hole V1 and the light-emitting area R1 of the first light-emitting layer 112 is smaller than the light-emitting area of the second via hole V2 and the second light-emitting layer 212
- the shortest distance d of R2 is smaller than the light-emitting area of the second via hole V2 and the second light-emitting layer 212
- the orthographic projection of the first via hole V1 in the plane of the display substrate and the orthographic projection of the light-emitting area R1 of the first light-emitting layer 112 in the plane of the display substrate At least partially overlapped. At this time, the shortest distance between the first via hole V1 and the light-emitting region R1 of the first light-emitting layer 112 is zero. As shown in FIGS.
- the orthographic projection of the second via hole V2 in the plane of the display substrate and the orthographic projection of the light-emitting area R2 of the second light-emitting layer 212 in the plane of the display substrate do not overlap, and the second via hole
- the shortest distance between V2 and the light-emitting region R2 of the first light-emitting layer 112 is d, and d is greater than zero.
- the distance between the first via hole V1 and the light-emitting area R1 of the first light-emitting layer 112 is closer, which can prevent the extension of the first electrode 111 from being too long and affecting the first display area 10. Transparency.
- the display area further includes a third display area 30 at least partially surrounding the second display area 20, and the third display area 30 includes a plurality of third display areas arranged in an array.
- Sub-pixel P3 the arrangement density of the plurality of third sub-pixels P3 in the third display area 30 is greater than the arrangement density of the plurality of first sub-pixels P1 in the first display area 10, and is also greater than the arrangement density of the plurality of second sub-pixels P1 in the second display area 20.
- the arrangement density of the sub-pixels P2 is such that the third display area 30 has a higher resolution than the first display area 10 and the second display area 20.
- the area occupied by the third display area 30 is larger than the areas occupied by the first display area 10 and the second display area 20, and the third display area 30 is implemented as the main display area of the display substrate.
- the arrangement density of the plurality of first sub-pixels P1 in the first display area 10 is equal to the arrangement density of the plurality of second sub-pixels P2 in the second display area 20.
- the arrangement density of the plurality of third sub-pixels P3 in the third display area 30 is twice the arrangement density of the plurality of first sub-pixels P1 in the first display area 10.
- each third sub-pixel P3 in the third display area 30 includes a third pixel circuit and a third light-emitting device.
- the specific structures of the third pixel circuit and the third light-emitting device are similar to those of the second pixel circuit and the second light-emitting device.
- the mechanism is similar, please refer to Figure 13 for details, which will not be repeated here.
- the display substrate further includes a first scan drive circuit (Gate on Array) GOA1 and a second scan drive circuit GOA2 located on opposite sides of the display area, and the first scan drive circuit GOA1 and the second scan driving circuit GOA2 jointly provide electrical signals for a plurality of third sub-pixels in the third display area 30, that is, in the third display area 30, the GOA driving circuit adopts a double-side driving method, and the third display area 30
- the scan driving circuits on the left and right sides are connected to each other.
- the first scan driving circuit GOA1 also provides electrical signals for the plurality of second sub-pixels and the plurality of first pixel circuits in the second display area 20 located on the side of the first display area 10 close to the first scan driving circuit GOA1.
- electrical signals are provided for a plurality of second sub-pixels and a plurality of first pixel circuits in the second display area 20 on the left side of the dotted line in FIG.
- the second scan driving circuit GOA2 is also located near the second display area 10
- the plurality of second sub-pixels and the plurality of first pixel circuits in the second display area 20 on the side of the scan driving circuit GOA2 provide electrical signals, for example, for the plurality of second sub-pixels in the second display area 20 on the right side of the dotted line in FIG.
- the two sub-pixels and the plurality of first pixel circuits provide electrical signals. That is, for the first display area 10 and the second display area 20, the GOA driving circuit adopts a unilateral driving method, and the two sides of the first display area 10 and the second display area 20 are used for the first display area 10 and the second display area 20.
- the scan driving circuits that provide electrical signals in the display area 20 are not connected to each other.
- the display substrate further includes a power line and a reset voltage line
- the first light shielding layer S1 is electrically connected to the power line or the reset voltage line to prevent the first light shielding layer S1 from being suspended.
- the driving circuit of the display substrate and the connection relationship between the power supply line and the reset voltage line will be exemplarily introduced with reference to the accompanying drawings.
- the first pixel circuit, the second pixel circuit, and the third pixel circuit in the display substrate may use 2T1C, 7T1C and other pixel driving circuits.
- FIG. 17 shows a circuit diagram of a 7T1C pixel circuit.
- the pixel circuit includes a driving transistor T1, a data writing transistor T2, a compensation transistor T3, a storage capacitor C, a first light-emission control transistor T4, a second light-emission control transistor T5, a first reset transistor T6, and a second Reset transistor T7.
- the driving transistor T1 includes a control terminal, a first terminal, and a second terminal, which are configured to control the driving current flowing through the light emitting device EM, and the control terminal of the driving transistor T1 is connected to the first node N1, and the first terminal of the driving transistor T1 The terminal is connected to the second node N2, and the second terminal of the driving transistor T1 is connected to the third node N3.
- the data writing transistor T2 includes a control terminal, a first terminal, and a second terminal.
- the control terminal is configured to receive the first scan signal Ga1, the first terminal is configured to receive the data signal, and the second terminal is connected to the first terminal of the driving transistor T1.
- the terminal (the second node N2) is connected and configured to write the data signal to the first terminal of the driving transistor T1 in response to the first scan signal Ga1.
- the first terminal of the data writing transistor T2 is connected to the data line to receive the data signal, and the control terminal is connected to the scan line to receive the first scan signal Ga1.
- the data writing transistor T2 can be turned on in response to the first scan signal Ga1, so that the data signal can be written to the first end (the second node N2) of the driving transistor T1, and the data signal can be stored In the storage capacitor C, a driving current for driving the light-emitting device EM to emit light can be generated according to the data signal during, for example, the light-emitting phase.
- the compensation transistor T3 includes a control terminal, a first terminal, and a second terminal.
- the control terminal is configured to receive the second scan signal Ga2.
- the first terminal and the second terminal are electrically connected to the control terminal and the second terminal of the driving transistor T1.
- the compensation circuit is configured to perform threshold compensation in response to the second scan signal.
- the storage capacitor C is electrically connected to the control terminal of the driving transistor T1 and the first voltage terminal VDD, and is configured to store the data signal written by the data writing transistor T2.
- the compensation transistor T3 can be turned on in response to the second scan signal Ga2, so that the data signal written by the data writing transistor T2 can be stored in the storage capacitor C.
- the compensation transistor T3 can electrically connect the control terminal and the second terminal of the driving transistor T1, so that the information related to the threshold voltage of the driving transistor T1 can be correspondingly stored in the storage circuit.
- the stored data signal and the threshold voltage can be used to control the driving transistor T1 during the light-emitting phase, so that the output of the driving transistor T1 is compensated.
- the first light-emitting control transistor T4 is connected to the first terminal (the second node N2) of the driving transistor T1 and the first voltage terminal VDD, and is configured to turn the first power source of the first voltage terminal VDD in response to the first light-emitting control signal.
- the voltage is applied to the first terminal of the driving transistor T1.
- the first light emission control transistor T4 is connected to the first light emission control terminal Em1, the first voltage terminal VDD, and the second node N2.
- the second light emitting control transistor T5 and the second light emitting control terminal Em2 the first terminal of the light emitting device EM, and the second terminal of the driving transistor T1 are connected, and are configured to respond to the second light emitting control signal so that the driving current can be applied to Light-emitting device EM.
- the second light-emission control transistor T5 is turned on in response to the second light-emission control signal provided by the second light-emission control terminal Em2, so that the driving transistor T1 can apply a driving current to the light-emitting device EM through the second light-emission control transistor T5
- the second light-emitting control transistor T5 is turned off in response to the second light-emitting control signal, so as to avoid current flowing through the light-emitting device EM to cause it to emit light, which can improve the contrast of the corresponding display device.
- the second light-emission control transistor T5 can also be turned on in response to the second light-emission control signal, so that the reset circuit can be combined to perform a reset operation on the driving transistor T1 and the light-emitting device EM.
- the second light emission control signal Em2 can be the same as or different from the first light emission control signal Em1, for example, the two can be connected to the same or different signal output terminals.
- the first reset transistor T6 is configured to apply the first reset voltage Vini1 to the first node N1 in response to the first reset signal Rst1
- the second reset transistor T7 is configured to apply the second reset voltage Vini2 in response to the second reset signal Rst2.
- the fourth node N4 Applied to the fourth node N4.
- the first reset transistor T6 and the second reset transistor T7 can be turned on in response to the reset signal, so that the reset voltage can be applied to the first end of the light emitting device EM and the first node N1, so that the driving transistor can be T1, the compensation transistor T3, and the light-emitting device EM perform a reset operation to eliminate the influence of the previous light-emitting stage.
- the light emitting device EM includes a first terminal and a second terminal, the first terminal of the light emitting device EM is configured to receive a driving current from the second terminal of the driving transistor T1, and the second terminal of the light emitting device EM is configured to be connected to the second voltage terminal VSS. connect.
- the first end of the light emitting device EM may be connected to the third node N3.
- the first node N1, the second node N2, the third node N3, and the fourth node N4 do not necessarily represent actual components, but rather represent the junction of related circuit connections in the circuit diagram.
- the symbol Vd can represent both the data signal terminal and the level of the data signal.
- Ga1 and Ga2 can represent the first scan signal, the second scan signal, or the first scan signal terminal and the second scan signal.
- Terminal, Rst can represent both the reset control terminal and the reset signal
- the symbol Vinit can represent both the reset voltage terminal and the reset voltage
- the symbol VDD can represent both the first voltage terminal and the first power supply voltage
- the symbol VSS can either It means that the second voltage terminal can also indicate the second power supply voltage.
- the second voltage terminal can be grounded, that is, VSS can be 0V.
- the first light shielding layer S1 may be electrically connected to a power line that transmits the first power supply voltage VDD or the second power supply voltage VSS, or is electrically connected to a reset voltage line that transmits the reset voltage Vini1 or Vini2.
- the first light-shielding layer S1 when the first light-shielding layer S1 is arranged in the same layer as the power line or the reset voltage line, the first light-shielding layer S1 can be directly electrically connected to the power line or the reset voltage line through the connecting wire, or when the first light-shielding layer S1 When it is arranged in a different layer from the power line or the reset voltage line, the first light shielding layer S1 may be electrically connected to the power line or the reset voltage line through a via hole.
- a via can be directly formed between the first light-shielding layer S1 and the power line or the reset voltage line. So that the first light shielding layer S1 is electrically connected to the power line or the reset voltage line through the via hole.
- the light-shielding layer S1 may be extended to a position overlapping with the power line or the reset voltage line, and then A via is formed between the two, and an electrical connection is made; or, the power line or the reset voltage line is extended to a position overlapping the first light shielding layer S1, and then a via is formed between the two, and the electrical connection is made .
- the power line or the reset voltage line may also be introduced into a position overlapping with the first light shielding layer S1 by using a connecting wire, and then a via is formed between the connecting wire and the first light shielding layer S1 and electrically connected.
- the first light shielding layer S1 can be electrically connected to the power line or the reset voltage line in any suitable manner.
- the embodiment of the present disclosure electrically connects the first light shielding layer S1 to the power line or the reset voltage line.
- the method is not specifically limited. Therefore, the first light-shielding layer S1 can be transmitted with a certain power supply voltage or reset voltage, which can prevent the first light-shielding layer S1 from appearing in a floating state and affecting the signal transmission on the display substrate.
- the first light-shielding layer can effectively block at least part of the light entering the second display area, so as to prevent the light from entering the under-screen sensor, such as a camera, through the second display area. Thereby improving the sensing effect, such as improving the shooting quality of the camera under the screen.
- the first light shielding layer can be input with a certain electrical signal, so as not to affect the normal operation of the driving circuit in the display substrate.
- the first light-shielding layer can be arranged in the same layer as some existing functional layers in the display substrate, so that the same material can be used in the preparation process to be formed through the same process, which can also simplify the preparation process of the display substrate. That is, without increasing the difficulty of preparing the display substrate, the working fluid quality of the under-screen sensor of the display substrate, such as a camera, is improved, and the narrow frame design of the display substrate is also realized.
- the display device includes any of the above-mentioned display substrates (shown in FIG. 18A as the display substrate in FIG. 6 as an example) and a sensor 19.
- the sensor 19 is provided on the second side (non-display side) of the display substrate, and the sensor is configured to receive light from the first side (display side).
- the sensor 19 may be any type of sensor such as a camera or an infrared sensor.
- FIG. 18B shows a schematic cross-sectional view of another display device provided by at least one embodiment of the present disclosure.
- the first light-shielding layer S1 and the heat dissipation layer SCF in the display device are arranged in the same layer, for example, the arrangement of the first light-shielding layer S1 in the display substrate shown in FIG. 12 is adopted.
- the first electrode 111 of the first light emitting device is directly electrically connected to the first source and drain 124 through the via hole exposing the source and drain 124, thereby saving transparency.
- the connection electrode 15 and the second planarization layer 145 simplify the film structure of the display substrate.
- the sensor 19 in a direction perpendicular to the surface of the display substrate, the sensor 19 at least partially overlaps the first display area 10 of the display substrate, so that the light from the first side can be fully received and based on the light working. Since the display substrate has a first light-shielding layer that shields the second display area, the sensor 19 only receives light transmitted through the first display area, which can prevent the light-transmissive second display area from reaching the sensor 19 and affecting the sensor 19 Therefore, the sensor 19 of the display device has a higher working quality. For example, when the sensor 19 is a camera, the camera has a higher photographing quality.
- the display device provided by at least one embodiment of the present disclosure may be any product or component with display function, such as a display substrate, a display panel, an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
- a display substrate such as a liquid crystal display (LCD)
- a display panel such as a liquid crystal display (LCD)
- an electronic paper such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
- the embodiment of the present disclosure does not limit this.
- FIG. 19A and FIG. 19B respectively show the point spread function simulation diagram of the point light source imaging when the display device has no first light shielding layer and the first light shielding layer.
- the energy distribution state on the imaging surface that is, the dispersion distribution of energy in various directions (embodied in XY coordinates) such as up, down, left, and right, which can intuitively characterize the glare of the point light source.
- Figure 19A when the first light-shielding layer is not provided in the second display area, under the oblique field angle, the light passes through the second display area, which is similar to passing through a grating with a small aperture ratio.
- the center of the point light source imaging is The peak energy is only 10.5, and point light source glare is serious.
- FIG. 19B after the first light-shielding layer is provided in the second display area, light can only pass through the first display area under the oblique field angle, and the central energy peak of the point light source imaging is greater than 11, and the point light source glare phenomenon is significantly improved.
- 20A and 20B show the modulation transfer function (Moduation Transfer Function) diagram of the point light source imaged on the meridian and arcuate surfaces when the display device has no first light-shielding layer and a first light-shielding layer, the abscissa values in the figure Represents the spatial frequency (that is, the spatial line pair per millimeter, the unit is lp/mm), and the ordinate is the MTF value, which is used to characterize the resolution under different spatial frequencies. At the same spatial frequency, the higher the MTF value, the higher the imaging resolution.
- Moduation Transfer Function Moduation Transfer Function
- the F0 curve is the modulation transfer function curve of the point light source imaging when the display device does not have the first light shielding layer
- the F1 curve is the modulation transfer function curve of the point light source imaging after the display device is provided with the first light shielding layer. It can be seen that under the same spatial frequency, the MTF value of the F1 curve is higher than the MTF value of the F0 curve, that is, after the first light shielding layer is provided, the resolution of the point light source imaging of the display device is significantly improved.
- FIG. 21A shows a real glare photo taken by a point light source when the display device has no first light shielding layer
- Figure 21B shows a real glare photo taken by a point light source after the display device is provided with the first light shielding layer. Comparing FIGS. 21A and 21B, it can be seen that after the first light shielding layer is provided, the glare phenomenon of the point light source imaging of the display device is significantly improved.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Sustainable Development (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (17)
- 一种显示基板,具有用于显示的第一侧和与所述第一侧相对的第二侧,所述显示基板包括显示区域,其中,所述显示区域包括第一显示区域以及至少部分围绕所述第一显示区域的第二显示区域,所述第一显示区域允许来自所述第一侧的光至少部分透射至所述第二侧;所述第一显示区域包括阵列排布的多个第一子像素,每个第一子像素包括第一发光器件,所述第二显示区域包括多个第一像素电路,所述多个第一像素电路分别与所述多个第一子像素的多个第一发光器件电连接,以分别驱动所述多个第一发光器件;其中,所述显示区域还包括第一遮光层,在垂直于所述显示基板的板面的方向上,所述第一遮光层与所述第二显示区域至少部分重叠,所述第一遮光层与所述第一显示区域不重叠。
- 根据权利要求1所述的显示基板,还包括电源线和复位电压线,其中,所述第一遮光层与所述电源线或者所述复位电压线电连接。
- 根据权利要求1或2所述的显示基板,其中,所述多个第一像素电路中的每个包括第一薄膜晶体管,所述第一薄膜晶体管包括第一有源层、第一栅极和第一源漏电极;所述第一遮光层与所述第一源漏电极同层设置。
- 根据权利要求3所述的显示基板,其中,所述第二显示区域包括至少部分围绕所述第一显示区域的第一子区以及至少部分围绕所述第一子区的第二子区,所述第一遮光层设置在所述第一子区中,所述多个第一像素电路设置在所述第二子区中。
- 根据权利要求4所述的显示基板,还包括分别电连接所述多个第一像素电路的多条信号线,所述多条信号线延伸经过所述第一子区,所述第一像素电路还包括第一存储电容,所述第一存储电容包括第一电容极板和第二电容极板,所述第一电容极板与所述第一栅极同层设置,所述多条信号线与所述第一电容极板或者所述第二电容极板同层设置。
- 根据权利要求1或2所述的显示基板,还包括衬底基板和第二遮光层,其中,所述多个第一子像素设置在所述衬底基板上,所述第二遮光层设置在所述多个第一像素电路与所述衬底基板之间,以遮挡至少部分所述多个第一像素电路的电路结构;所述第一遮光层与所述第二遮光层同层设置。
- 根据权利要求6所述的显示基板,其中,所述第一遮光层与所述第二遮光层为连续设置的一体化膜层,所述一体化膜层在所述第一显示区域具有开口,以使得在垂直于所述显示基板的板面的方向上,所述第一遮光层与所述第一显示区域不重叠。
- 根据权利要求1或2所述的显示基板,还包括衬底基板和散热层,其中,所述多 个第一子像素设置在所述衬底基板的第一侧,所述散热层设置在所述衬底基板的第二侧,所述第一侧和所述第二侧相对;所述第一遮光层与所述散热层同层设置。
- 根据权利要求8所述的显示基板,其中,所述第一遮光层与所述散热层为连续设置的一体化膜层,所述一体化膜层在所述第一显示区域具有开口,以使得在垂直于所述显示基板的板面的方向上,所述第一遮光层与所述第一显示区域不重叠。
- 根据权利要求1-9任一所述的显示基板,其中,所述第二显示区域还包括多个第二子像素,每个第二子像素包括第二发光器件以及与所述第二发光器件电连接的第二像素电路,所述第二像素电路配置为驱动所述第二发光器件,在所述第二显示区域中,所述多个第二像素电路呈第一阵列排布,所述多个第一像素电路设置在所述第一阵列的间隙中,并与所述多个第二像素电路整体排布为第二阵列。
- 根据权利要求10所述的显示基板,其中,所述第一像素电路包括第一薄膜晶体管,所述第一薄膜晶体管包括第一有源层、第一栅极和第一源漏电极,所述第一发光器件包括第一电极、第二电极以及所述第一电极和所述第二电极之间的第一发光层,所述第一发光器件的第一电极通过第一过孔与所述第一源漏电极电连接;所述第二像素电路包括第二薄膜晶体管,所述第二薄膜晶体管包括第二有源层、第二栅极和第二源漏电极,所述第二发光器件包括第一电极、第二电极以及所述第一电极和所述第二电极之间的第二发光层,所述第二发光器件的第一电极通过第二过孔与所述第二源漏电极电连接;在所述显示基板所在平面内,所述第一过孔与所述第一发光层的发光区域的最短距离小于所述第二过孔与所述第二发光层的发光区域的最短距离。
- 根据权利要求11所述的显示基板,其中,所述第一过孔在所述显示基板所在平面内的正投影与所述第一发光层的发光区域在所述显示基板所在平面内的正投影至少部分重叠。
- 根据权利要求1-12任一所述的显示基板,其中,所述显示区域包括至少部分围绕所述第二显示区域的第三显示区域,所述第三显示区域包括阵列排布的多个第三子像素,其中,所述第三显示区域中所述多个第三子像素的排布密度大于所述第一显示区域中所述多个第一子像素的排布密度,也大于所述第二显示区域中所述多个第二子像素的排布密度。
- 根据权利要求13所述的显示基板,其中,所述第一显示区域中所述多个第一子像素的排布密度等于所述第二显示区域中所述多个第二子像素的排布密度。
- 根据权利要求13或14所述的显示基板,还包括分别位于所述显示区域相对两侧的第一扫描驱动电路和第二扫描驱动电路,其中,所述第一扫描驱动电路和第二扫描驱动电路共同为在所述第三显示区域中的多个第三子像素提供电信号;所述第一扫描驱动电路还为位于所述第一显示区域靠近所述第一扫描驱动电路一侧的第二显示区域中的多个第二子像素和多个第一像素电路提供电信号,所述第二扫描驱动电路还为位于所述第一显示区域靠近所述第二扫描驱动电路一侧的第二显示区域中的多个第二子像素和多个第一像素电路提供电信号。
- 一种显示装置,包括:权利要求1-15任一所述的显示基板,以及传感器,其中,所述传感器设置于所述显示基板的第二侧,且所述传感器配置为接收来自所述第一侧的光。
- 根据权利要求16所述的显示装置,其中,在垂直于所述显示基板的板面的方向上,所述传感器与所述显示基板的第一显示区域至少部分重叠。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/626,149 US20220352285A1 (en) | 2020-05-29 | 2021-04-15 | Display substrate and display device |
US17/857,257 US20220344432A1 (en) | 2020-05-29 | 2022-07-05 | Display substrate and display apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010479765.3A CN113745273A (zh) | 2020-05-29 | 2020-05-29 | 显示基板和显示装置 |
CN202010479765.3 | 2020-05-29 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/626,149 A-371-Of-International US20220352285A1 (en) | 2020-05-29 | 2021-04-15 | Display substrate and display device |
US17/857,257 Continuation US20220344432A1 (en) | 2020-05-29 | 2022-07-05 | Display substrate and display apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021238490A1 true WO2021238490A1 (zh) | 2021-12-02 |
Family
ID=78725155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2021/087545 WO2021238490A1 (zh) | 2020-05-29 | 2021-04-15 | 显示基板和显示装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20220352285A1 (zh) |
CN (2) | CN113745273A (zh) |
WO (1) | WO2021238490A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114708798A (zh) * | 2022-03-31 | 2022-07-05 | 武汉华星光电半导体显示技术有限公司 | 显示面板和显示装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110634930B (zh) * | 2019-09-27 | 2022-02-25 | 京东方科技集团股份有限公司 | 显示面板和显示装置 |
KR20220001967A (ko) * | 2020-06-30 | 2022-01-06 | 엘지디스플레이 주식회사 | 표시 장치 |
CN112258439A (zh) * | 2020-10-28 | 2021-01-22 | 云谷(固安)科技有限公司 | 一种显示装置及运动物体的图像合成方法 |
CN114464757B (zh) * | 2022-02-09 | 2024-03-26 | 武汉天马微电子有限公司 | 一种显示面板和显示装置 |
WO2023206218A1 (zh) * | 2022-04-28 | 2023-11-02 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190172885A1 (en) * | 2017-12-06 | 2019-06-06 | Samsung Display Co., Ltd. | Organic light emitting display device and method of manufacturing the same |
CN110520919A (zh) * | 2019-06-28 | 2019-11-29 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
CN110660835A (zh) * | 2019-09-30 | 2020-01-07 | 武汉天马微电子有限公司 | 有机发光显示面板及有机发光显示装置 |
CN110767729A (zh) * | 2019-10-31 | 2020-02-07 | Oppo广东移动通信有限公司 | 显示装置及电子设备 |
CN111180494A (zh) * | 2020-01-03 | 2020-05-19 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156035A (ja) * | 2004-11-26 | 2006-06-15 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
JP4828557B2 (ja) * | 2008-03-04 | 2011-11-30 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
KR102497541B1 (ko) * | 2015-11-18 | 2023-02-10 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6854625B2 (ja) * | 2016-11-04 | 2021-04-07 | 株式会社ジャパンディスプレイ | 表示装置 |
WO2019062236A1 (zh) * | 2017-09-30 | 2019-04-04 | 昆山国显光电有限公司 | 显示屏、显示屏驱动方法及其显示装置 |
KR102532307B1 (ko) * | 2017-11-02 | 2023-05-15 | 삼성디스플레이 주식회사 | 표시장치 |
CN110070801B (zh) * | 2019-04-30 | 2023-04-18 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
CN110061014B (zh) * | 2019-04-30 | 2021-06-08 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
CN110504289B (zh) * | 2019-08-27 | 2022-08-16 | 武汉天马微电子有限公司 | 一种显示面板和显示装置 |
CN111129100B (zh) * | 2019-12-31 | 2022-06-24 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
CN114864651A (zh) * | 2019-12-31 | 2022-08-05 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
-
2020
- 2020-05-29 CN CN202010479765.3A patent/CN113745273A/zh active Pending
- 2020-05-29 CN CN202210219570.4A patent/CN114582949A/zh active Pending
-
2021
- 2021-04-15 US US17/626,149 patent/US20220352285A1/en active Pending
- 2021-04-15 WO PCT/CN2021/087545 patent/WO2021238490A1/zh active Application Filing
-
2022
- 2022-07-05 US US17/857,257 patent/US20220344432A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190172885A1 (en) * | 2017-12-06 | 2019-06-06 | Samsung Display Co., Ltd. | Organic light emitting display device and method of manufacturing the same |
CN110520919A (zh) * | 2019-06-28 | 2019-11-29 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
CN110660835A (zh) * | 2019-09-30 | 2020-01-07 | 武汉天马微电子有限公司 | 有机发光显示面板及有机发光显示装置 |
CN110767729A (zh) * | 2019-10-31 | 2020-02-07 | Oppo广东移动通信有限公司 | 显示装置及电子设备 |
CN111180494A (zh) * | 2020-01-03 | 2020-05-19 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114708798A (zh) * | 2022-03-31 | 2022-07-05 | 武汉华星光电半导体显示技术有限公司 | 显示面板和显示装置 |
CN114708798B (zh) * | 2022-03-31 | 2023-06-06 | 武汉华星光电半导体显示技术有限公司 | 显示面板和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN113745273A (zh) | 2021-12-03 |
CN114582949A (zh) | 2022-06-03 |
US20220352285A1 (en) | 2022-11-03 |
US20220344432A1 (en) | 2022-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021238490A1 (zh) | 显示基板和显示装置 | |
US11980071B2 (en) | Display substrate and display device | |
WO2020258861A1 (zh) | 显示基板、显示面板及显示装置 | |
US10985231B2 (en) | Display device | |
WO2022037287A1 (zh) | 显示基板和显示装置 | |
US11968873B2 (en) | Display substrate and display device | |
WO2021139444A1 (zh) | 显示面板及显示装置 | |
US20220352292A1 (en) | Display substrate and display device | |
WO2020173060A1 (zh) | 显示基板、显示面板及显示装置 | |
JP7453254B2 (ja) | 表示基板及び表示装置 | |
WO2021143366A1 (zh) | 显示面板及显示装置 | |
WO2021134985A1 (zh) | 显示面板以及显示装置 | |
US11804176B2 (en) | Display substrate and display device | |
KR20200118266A (ko) | 표시 장치 및 이의 제조 방법 | |
WO2020233286A1 (zh) | 显示基板、显示面板及显示装置 | |
US11895879B2 (en) | Display substrate and preparation method thereof, and display apparatus | |
US20230012412A1 (en) | Display substrate and method of manufacturing the same, and display device | |
WO2022052226A1 (zh) | 一种显示面板及显示装置 | |
US20230337494A1 (en) | Display panel and display apparatus | |
TWI692665B (zh) | 顯示裝置 | |
WO2021226785A1 (zh) | 显示面板和显示装置 | |
WO2023230805A1 (zh) | 显示基板以及显示装置 | |
WO2023230811A9 (zh) | 显示基板以及显示装置 | |
WO2023231802A1 (zh) | 触控结构、触控显示面板以及显示装置 | |
WO2023165016A1 (zh) | 显示面板及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21814206 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21814206 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 26.06.2023) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21814206 Country of ref document: EP Kind code of ref document: A1 |