WO2021190531A1 - Machine-outil composite de tournage et de fraisage multi-axes combinée multi-laser et son procédé d'usinage - Google Patents

Machine-outil composite de tournage et de fraisage multi-axes combinée multi-laser et son procédé d'usinage Download PDF

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Publication number
WO2021190531A1
WO2021190531A1 PCT/CN2021/082564 CN2021082564W WO2021190531A1 WO 2021190531 A1 WO2021190531 A1 WO 2021190531A1 CN 2021082564 W CN2021082564 W CN 2021082564W WO 2021190531 A1 WO2021190531 A1 WO 2021190531A1
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WO
WIPO (PCT)
Prior art keywords
laser
axis
component
processing
machine tool
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PCT/CN2021/082564
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English (en)
Chinese (zh)
Inventor
王成勇
林海生
胡小月
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广东工业大学
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Application filed by 广东工业大学 filed Critical 广东工业大学
Publication of WO2021190531A1 publication Critical patent/WO2021190531A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Definitions

  • the invention belongs to the technical field of laser processing equipment, and specifically relates to a multi-laser combined multi-axis turning-milling compound machine tool and a processing method thereof.
  • Laser processing has the characteristics of non-contact, high energy, flexible processing, small heat-affected zone, and no material selectivity. It has become an important means of replacing traditional difficult-to-process materials at home and abroad.
  • the level of laser processing equipment is the key to restricting the development of advanced laser processing technology.
  • Foreign high-end laser processing machine tool manufacturers such as GF, DMG MORI, C.B.Ferrari, and EWAG mainly use nanosecond or picosecond single lasers for laser milling processing, while domestic Muji machine tools mainly use a single laser for turning processing.
  • the patent 201710958233.6 discloses a combined multifunctional laser processing machine tool, which combines traditional machining and laser processing methods into one machine tool.
  • laser machine tools are mainly suitable for laser cutting, drilling and surface texture processing in the world. There is no laser machine tool that has an overall special system design and meets the requirements of tools for roughing and finishing of complex surface tools, turning and milling combined processing.
  • the present invention provides a multi-laser combined multi-axis turning-milling compound machine tool and its processing method.
  • the present invention combines nanosecond, picosecond and femtosecond lasers to perform rough, semi-precision and finishing of the tool respectively, and through multi-axis motion
  • the platform design realizes turning and milling compound processing, realizes the one-time clamping and forming of complex profile tools, effectively improves the processing efficiency and processing quality, and solves the problem that general laser processing cannot achieve complex profile tool processing.
  • a multi-laser combined multi-axis turning-milling compound machine tool including a frame, is characterized in that a first laser processing area, a second laser processing area, and an X-axis motion component are respectively provided on the frame, and the first laser
  • the processing area includes a first laser processing component and a first movement component.
  • the first laser processing component is mated and connected to the first movement component;
  • the second laser processing area includes a second laser processing component and a second movement component.
  • the laser processing component is matched and connected with the second movement component; the X-axis movement component is located below the first laser processing component and the second laser processing component.
  • the maximum linear movement range of the X-axis motion component is 1500 mm, and the maximum positioning accuracy is 0.1 ⁇ m.
  • the X-axis movement assembly is provided with a central turntable and a knife handle, and the knife handle is clamped in the middle area of the center turntable; the central turntable is provided with a motor.
  • the tool holder is used for clamping tools, and the motor can drive the central turntable to rotate.
  • the motor drives the central turntable to rotate at a high speed along the A-axis and the C-axis;
  • the A-axis is an axis parallel to the X-axis movement assembly, and
  • the C-axis is an axis perpendicular to the X-axis movement assembly.
  • the rotation range of the central turntable along the A axis is -140°-140°
  • the rotation range of the central turntable along the C axis is 0°-360°
  • the highest rotational positioning accuracy is 0.001°.
  • the first movement component includes a Y1 axis movement component and a Z1 axis movement component;
  • the first laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y1-axis movement component and the Z1-axis movement component, respectively, and the maximum linear movement ranges of the first laser processing component on the Y1 and Z1 axes are 500 and respectively. 600mm, the highest positioning accuracy is 0.1 ⁇ m.
  • the first laser processing component includes a nanosecond laser, a nanosecond laser fixing frame, a first processing area galvanometer scanning module, and a first processing area laser head, and the nanosecond laser is arranged on the nanosecond laser fixing frame
  • the nanosecond laser fixing frame is connected with the Y1 axis movement assembly, and the first processing area galvanometer scanning module and the first processing area laser head are respectively connected with the Z1 axis movement assembly.
  • the second motion component includes a Y2-axis motion component and a Z2-axis motion component; the second laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y2-axis motion component and the Z2-axis motion component respectively, so
  • the maximum linear movement ranges of the second laser processing component on the Y2 and Z2 axes are 500 and 600 mm, respectively, and the maximum positioning accuracy is 0.1 ⁇ m.
  • the second laser processing component includes picosecond and femtosecond lasers, picosecond and femtosecond laser fixing frames, second processing area galvanometer scanning module, second processing area laser head, CCD module, and optical path transmission module,
  • the picosecond and femtosecond lasers are arranged on a picosecond and femtosecond laser fixing frame, one side of the picosecond and femtosecond laser is provided with an optical path transmission module, the second processing area galvanometer scanning module, the second processing The area laser heads are respectively connected with the Z2-axis movement assembly, the CCD module is arranged on one side of the picosecond and femtosecond laser fixing frame, and the picosecond and femtosecond laser fixing frame is connected with the Y2-axis movement assembly.
  • the picosecond and femtosecond lasers share a set of optical paths, and the laser light source is switched as required; in particular, the CCD module can perform online monitoring of tool processing accuracy.
  • the frame includes a mineral bed and a mineral column.
  • the laser machine tool is connected with a mute vacuum cleaner and a dust-proof device to realize the removal of waste debris and exhaust gas during processing.
  • a processing method for a multi-laser combined multi-axis turning-milling compound machine tool specifically: the processed tool can be linearly moved to the first processing area through the X-axis motion platform for nanosecond laser roughing, and moved to the second processing area for picoseconds Laser semi-finishing or femtosecond laser finishing; after the A-axis is deflected by 90° to be parallel to the Y-axis, it is fixed, and the C-axis continues to rotate 360° to achieve laser turning processing; through A, C, X, Y1, Z1 or A
  • the linkage control between, C, X, Y2, and Z2 can realize laser milling processing, and finally realize laser turning-milling combined processing.
  • the main innovations of the present invention are:
  • the laser machine tool combines nanosecond, picosecond and femtosecond lasers to perform rough, semi-precision and finishing of the tool respectively;
  • the present invention provides a multi-laser combined multi-axis turning-milling compound machine tool, which combines nanosecond, picosecond and femtosecond lasers to perform rough, semi-finish and finishing of cutters respectively, and realizes turning and milling compound processing through the design of a multi-axis motion platform, which realizes complexity It can effectively improve the processing efficiency and processing quality. It solves the problems of low processing efficiency and poor quality caused by the general laser processing that cannot be realized by the general laser processing, and the low processing efficiency and poor quality caused by multiple clamping. The level of tool manufacturing is of great significance.
  • Figure 1 is a schematic diagram of the structure of the present invention
  • a multi-laser combined multi-axis turning-milling compound machine tool includes a frame 1, wherein the frame is provided with a first laser processing area 100, a second laser processing area 200, and an X-axis motion component 11, respectively.
  • the first laser processing area includes a first laser processing component 102 and a first moving component 101, and the first laser processing component is mated and connected with the first moving component;
  • the second laser processing area includes a second laser processing component 202 and a second laser processing component.
  • the movement component 201, the second laser processing component and the second movement component are matedly connected;
  • the X-axis movement component is located below the first laser processing component and the second laser processing component.
  • the maximum linear movement range of the X-axis motion component is 1500 mm, and the maximum positioning accuracy is 0.1 ⁇ m.
  • a central turntable and a knife handle are provided on the X-axis movement assembly, and the knife handle is clamped in the middle area of the center turntable; a motor is provided in the center turntable.
  • the tool holder is used for clamping tools, and the motor can drive the central turntable to rotate.
  • the motor drives the central turntable to rotate at a high speed along the A-axis and the C-axis;
  • the A-axis is an axis parallel to the X-axis movement assembly, and
  • the C-axis is an axis perpendicular to the X-axis movement assembly.
  • the rotation range of the central turntable along the A axis is -140°-140°
  • the rotation range of the central turntable along the C axis is 0°-360°
  • the highest rotational positioning accuracy is 0.001°.
  • the first movement component includes a Y1 axis movement component 2 and a Z1 axis movement component 3;
  • the first laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y1-axis movement component and the Z1-axis movement component, respectively, and the maximum linear movement ranges of the first laser processing component on the Y1 and Z1 axes are 500 and respectively. 600mm, the highest positioning accuracy is 0.1 ⁇ m.
  • the first laser processing assembly includes a nanosecond laser 5, a nanosecond laser fixing frame 4, a first processing area galvanometer scanning module 15, and a first processing area laser head 16, and the nanosecond laser is set at the nanosecond On the laser fixing frame, the nanosecond laser fixing frame is connected to the Y1 axis movement component, and the first processing area galvanometer scanning module and the first processing area laser are connected to the Z1 axis movement component.
  • the second movement component includes a Y2-axis movement component 13 and a Z2-axis movement component 14;
  • the second laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y2-axis movement component and the Z2-axis movement component, respectively, and the maximum linear movement ranges of the second laser processing component on the Y2 and Z2 axes are 500 and respectively. 600mm, the highest positioning accuracy is 0.1 ⁇ m.
  • the second laser processing component includes picosecond and femtosecond laser 6, picosecond and femtosecond laser fixing frame 7, second processing area galvanometer scanning module 9, second processing area laser head 12, and CCD module 10.
  • Optical path transmission module 8 the picosecond and femtosecond lasers are set on the picosecond and femtosecond laser fixing frame, the picosecond and femtosecond lasers are provided with an optical path transmission module on one side, and the second processing area galvanometer
  • the scanning module and the laser head 12 of the second processing area are connected with the Z2-axis movement assembly, the CCD module is arranged on one side of the picosecond and femtosecond laser fixing frame, and the picosecond and femtosecond laser fixing frame is moved with the Y2 axis Component connection.
  • the picosecond and femtosecond lasers share a set of optical paths, and the laser light source is switched as required; in particular, the CCD module can perform online monitoring of tool processing accuracy.
  • the frame includes a mineral bed (not marked) and a mineral column (not marked).
  • the laser machine tool is connected with a silent vacuum cleaner (not marked) and a dustproof device (not marked) to realize the removal of waste and exhaust gas during processing.
  • a processing method for a multi-laser combined multi-axis turning-milling compound machine tool specifically: the processed tool can be linearly moved to the first processing area through the X-axis motion platform for nanosecond laser roughing, and moved to the second processing area for picoseconds Laser semi-finishing or femtosecond laser finishing; after the A-axis is deflected by 90° and parallel to the Y-axis, it is fixed, and the C-axis continues to rotate 360° to achieve laser turning processing; through A, C, X, Y1, Z1 or A, The linkage control between C, X, Y2, and Z2 can realize laser milling processing, and finally realize laser turning-milling combined processing.
  • the present invention provides a multi-laser combined multi-axis turning-milling compound machine tool, which combines nanosecond, picosecond and femtosecond lasers to perform rough, semi-finish and finishing of cutters respectively, and realizes turning and milling compound processing through the design of a multi-axis motion platform, which realizes complexity It can effectively improve the processing efficiency and processing quality. It solves the problems of low processing efficiency and poor quality caused by the general laser processing that cannot be realized by the general laser processing, and the low processing efficiency and poor quality caused by multiple clamping. The level of tool manufacturing is of great significance.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne une machine-outil composite de tournage et de fraisage multi-axes combinée multi-laser et son procédé d'usinage. La machine-outil composite de tournage et de fraisage multi-axes combinée multi-laser comprend une crémaillère (1), une première zone d'usinage au laser (100), une seconde zone d'usinage au laser (200) et un ensemble de déplacement d'axe X (11) étant respectivement disposés sur la crémaillère (1), et la première zone d'usinage au laser (100) comprenant un premier ensemble d'usinage au laser (102) et un premier ensemble de déplacement (101) ; la seconde zone d'usinage au laser (200) comprenant un second ensemble d'usinage au laser (202) et un second ensemble de déplacement (201) ; et l'ensemble de déplacement d'axe X (11) étant situé au-dessous du premier ensemble d'usinage au laser (102) et du second ensemble d'usinage au laser (202).
PCT/CN2021/082564 2020-03-25 2021-03-24 Machine-outil composite de tournage et de fraisage multi-axes combinée multi-laser et son procédé d'usinage WO2021190531A1 (fr)

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Application Number Priority Date Filing Date Title
CN202010219037.9 2020-03-25
CN202010219037.9A CN111408844A (zh) 2020-03-25 2020-03-25 一种多激光组合多轴车铣复合机床及其加工方法

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Cited By (1)

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CN116060785A (zh) * 2023-01-20 2023-05-05 中航西安飞机工业集团股份有限公司 一种飞机蒙皮化铣精确刻型装置

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CN111375901B (zh) * 2020-03-25 2021-10-15 广东工业大学 一种激光车铣复合加工刀具的方法
CN111408844A (zh) * 2020-03-25 2020-07-14 广东工业大学 一种多激光组合多轴车铣复合机床及其加工方法
CN112207427A (zh) * 2020-10-28 2021-01-12 汇专科技集团股份有限公司 一种激光车削加工机床
CN112207430A (zh) * 2020-10-28 2021-01-12 汇专科技集团股份有限公司 一种五轴激光铣削加工机床
CN113927186B (zh) * 2021-11-05 2022-07-05 深圳市超越激光智能装备股份有限公司 高精度智能化uv激光钻孔机
CN114682918A (zh) * 2022-05-17 2022-07-01 南京航空航天大学 一种表面微织构皮秒激光加工装置及方法

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CN111408844A (zh) * 2020-03-25 2020-07-14 广东工业大学 一种多激光组合多轴车铣复合机床及其加工方法
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