WO2021169205A1 - 灌胶模具、灌胶装置以及灌胶方法 - Google Patents

灌胶模具、灌胶装置以及灌胶方法 Download PDF

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Publication number
WO2021169205A1
WO2021169205A1 PCT/CN2020/111170 CN2020111170W WO2021169205A1 WO 2021169205 A1 WO2021169205 A1 WO 2021169205A1 CN 2020111170 W CN2020111170 W CN 2020111170W WO 2021169205 A1 WO2021169205 A1 WO 2021169205A1
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WIPO (PCT)
Prior art keywords
glue
sliding table
cavity
potting
mold
Prior art date
Application number
PCT/CN2020/111170
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English (en)
French (fr)
Inventor
刘元江
贺子和
Original Assignee
歌尔股份有限公司
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Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021169205A1 publication Critical patent/WO2021169205A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/02—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors

Definitions

  • the invention relates to the technical field of motor manufacturing, in particular to the technical field of glue filling, and in particular to a glue filling mold, a glue filling device and a glue filling method.
  • the linear motor is a common transmission device.
  • the linear motor includes a moving sub-module.
  • the corresponding moving sub-module includes a sliding table and a moving sub-assembly.
  • the moving sub-assembly includes a coil and a silicon steel sheet group.
  • the mover module needs to be filled with glue during the production and assembly process.
  • the existing glue filling method is as follows: the mover assembly is integrally filled with glue, and after the glue is cured, it is fixedly connected with the sliding table through a plurality of fasteners to form the mover module.
  • the glue surface of the mover assembly is in direct contact with the sliding table, and the flatness of the glued surface will affect the assembly accuracy of the sliding table and the mover assembly.
  • the main purpose of the present invention is to provide a glue filling mold, a glue filling device and a glue filling method, aiming to solve the problem of poor assembly accuracy of the movable submodule caused by the existing glue filling process.
  • the present invention provides a glue-pouring mold for pouring glue on a movable sub-module, wherein the movable sub-module includes a sliding table and a movable subassembly fixedly connected to the sliding table,
  • the potting mold includes a mold body, and the mold body is formed with an accommodating cavity with an open end, and the accommodating cavity is used to cooperate with the sliding table so that the mover assembly is accommodated in the accommodating cavity And the sliding table covers the open end to form a glue-filling cavity together with the mold body.
  • the mold body includes a base and a side wall, and the base and the side wall are enclosed to form the accommodating cavity.
  • the side wall includes a plurality of side stop blocks connected to each other, and the plurality of side stop blocks surround the side wall to form the side wall.
  • the side wall has at least two opposite first side walls, each of the first side walls is formed with a stepped surface facing the opening of the accommodating cavity, and the stepped surface is used to interact with the
  • the sliding table extends into the accommodating cavity to fit the bottom surface of the plug-in part; and/or,
  • the side wall has at least two opposite first side walls, and the inner side of the first side wall is provided with protrusions, and the protrusions are used for inserting the sliding table into the accommodating cavity.
  • the side surface of the connecting portion is attached to close the heat dissipation groove provided on the side surface of the plug-in portion.
  • the present invention also provides a glue-pouring device, which includes the glue-pouring mold as described above, and the glue-pouring mold is used for pouring glue on the mover module, wherein the mover module It includes a sliding table and a mover assembly fixedly connected to the sliding table.
  • the glue-filling mold includes a mold body formed with an accommodating cavity with an opening at one end for mating with the sliding table to make the The moving sub-assembly is accommodated in the accommodating cavity, and the mold body and the sliding table jointly constrain to form a glue-filling cavity.
  • the present invention also provides a glue filling method, which includes the following steps:
  • the mover module includes a sliding table and a mover assembly that are fixedly connected to each other;
  • the movable submodule is matched with the accommodating cavity of the mold body, so that the movable subassembly is accommodated in the accommodating cavity, and the sliding table covers the open end to enclose the mold body together Combine to form a potting cavity;
  • the step of providing a moving sub-module, the moving sub-module including a sliding table and a moving sub-assembly fixedly connected to each other includes:
  • a mover assembly includes a silicon steel sheet group and a coil winding arranged on the silicon steel sheet group, and the coil winding includes a winding section wound on the silicon steel sheet set and connected to the winding line section The lead end;
  • a sliding table is provided, the sliding table has an installation side facing the accommodating cavity, the installation side has an installation position for the mover assembly to be installed, a through hole is opened on the sliding table, the through hole An outlet is formed on the installation side of the sliding table, so that the outlet is close to the installation position;
  • the silicon steel sheet group is installed at the installation position, and the lead end is passed through the through hole to form the mover module.
  • the mover module is assembled in the accommodating cavity, and the sliding table is combined with the mold body to form the glue
  • the glue filling cavity is communicated with the through hole.
  • the step of filling the glue filling cavity with glue includes:
  • Glue is injected into the glue filling cavity through the through hole, and the glue is stopped after the glue flows into the through hole.
  • the method further includes:
  • a glue-pouring mold in the technical scheme of the present invention, there is provided a glue-pouring mold.
  • the glue-pouring mold includes a mold body formed with a accommodating cavity with an opening at one end. Then combine the potting mold and the movable sub-mold so that the movable sub-assembly is contained in the accommodating cavity and the sliding table covers the open end to form a potting cavity together with the mold body. At this time, the glue is poured into Glue filling in the cavity allows the sliding table and the mover assembly to be glued together, so that the sliding table and the glue filling surface are connected as a whole, and the glue filling surface will not interfere with the assembly accuracy.
  • FIG. 1 is an assembly diagram of an embodiment of a glue injection mold and a movable sub-module provided by the present invention
  • Fig. 2 is a schematic diagram of the structure of the glue injection mold in Fig. 1 after removing the front side stopper and the left side stopper;
  • Figure 3 is a top view of Figure 1;
  • Figure 4 is a cross-sectional view of A-A in Figure 3;
  • Figure 5 is a sectional view of B-B in Figure 3;
  • FIG. 6 is a schematic flowchart of an embodiment of the glue filling method provided by the present invention.
  • FIG. 7 is a schematic flowchart of another embodiment of the glue filling method provided by the present invention.
  • FIG. 8 is a schematic flowchart of another embodiment of the glue filling method provided by the present invention.
  • Label name Label name 100 Pouring mold 10 Mold body 1 Base 2 Sidewall twenty one Step surface twenty two Raised 201 Front stop 202 Rear stop 203 Left stop 204 Right stop 3 Sliding table 31 Socket 32 Heat sink 4 Mover assembly 41 Silicon steel sheet group 42 Coil winding 420 Lead end 5 Through hole 6 Glue cavity 7 Screw hole 8 Screw To To To
  • the directional indication is only used to explain that it is in a specific posture (as shown in the drawings). If the specific posture changes, the relative positional relationship, movement, etc. of the components below will also change the directional indication accordingly.
  • the mover module needs to be filled with glue during the production and assembly process.
  • the existing glue filling method is as follows: the mover assembly is integrally filled with glue, and after the glue is cured, it is fixedly connected with the sliding table through a plurality of fasteners to form the mover module.
  • the glue surface of the mover assembly is in direct contact with the sliding table, and the flatness of the glued surface will affect the assembly accuracy of the sliding table and the mover assembly.
  • the present invention provides a potting mold 100 for potting the movable submodule.
  • Figures 1 to 5 show an embodiment of the glue potting mold 100 provided by the present invention.
  • the mover module includes a sliding table 3 and a mover assembly 4, the sliding table 3 and the mover assembly 4 are fixedly connected;
  • the glue injection mold 100 includes a mold body 10, and a mold body 10 An accommodating cavity with an opening at one end is formed. The accommodating cavity is used to cooperate with the sliding table 3.
  • the movable sub-module is located in the accommodating cavity, and the sliding table 3 is covered and accommodated The open end of the cavity, so that the sliding table 3 and the mold body 10 are jointly enclosed to form a glue-pouring cavity 6.
  • the glue is injected into the glue filling cavity 6 so that the glue can wrap the mover assembly 4 and fill the connection gap between the sliding table 3 and the mover assembly 4.
  • this solution uses the method of first assembling the sliding table 3 and the mover assembly 4 to form the mover module, and then the glue injection mold 100 and the mover mold are combined to form the glue cavity 6, and then the glue is poured into the glue cavity 6. , So that the sliding table 3 and the mover assembly 4 can be glued together. In this way, the sliding table 3 and the glued surface can be connected as a whole, and the flatness of the glued surface will not interfere with the assembly accuracy, and thus the opposite movement can be realized. Control of sub-module assembly accuracy.
  • the glue-pouring cavity 6 limits the area that needs to be glued
  • the precision of the formed glue layer can be controlled by controlling the shape of the glue-pouring cavity 6 and the accuracy of the cavity wall, thereby subtracting the subsequent grinding of the existing glue. The process simplifies the process and reduces the cost.
  • the shape of the accommodating cavity and the glue filling cavity 6 is not limited, and the cross section can be rectangular, circular, polygonal, etc., which can be adapted according to the shape of the mover assembly 4 or the shape of the glue layer to be formed.
  • this embodiment takes a accommodating cavity with a rectangular cross-sectional shape as an example for description.
  • the mold body 10 of this embodiment includes a base 1 and a side wall 2.
  • the side wall 2 is arranged around the periphery of the base 1, so that the base 1 and the side wall 2 can be enclosed to form an accommodating cavity.
  • the sliding table 3 of the present embodiment is fixedly connected with the moving subassembly 4, and the sliding table 3 has an insertion portion 31 for installing the moving subassembly 4, and the insertion portion 31 protrudes from the lower side of the sliding table 3 and is provided.
  • the accommodating cavity is used to cooperate with the insertion part 31 of the sliding table 3.
  • the glue-filling cavity 6 is enclosed, and the movable subassembly 4 is accommodated in the accommodating cavity.
  • This clamping method makes the connection between the side wall 2 and the sliding table 3 closer. Glue or use fasteners such as screws 8 to securely connect the side wall 2 and the sliding table 3 to seal the joint between the two to prevent the glue in the glue cavity 6 from leaking from the joint during glue filling.
  • the side wall 2 and the base 1 can be integrally formed, or as shown in FIG.
  • the base 1 is fixedly connected to form an accommodating cavity.
  • the side wall 2 can be implemented in various forms.
  • the side wall 2 can be in the form of a frame with open ends, or it can be formed by assembling a plurality of stoppers.
  • the side wall 2 of this embodiment includes a plurality of side stop blocks connected to each other, and the plurality of side stop blocks enclose the side wall 2.
  • the side wall 2 includes a front side stopper 201, a rear side stopper 202, a left side stopper 203, and a right side stopper 203.
  • the accommodating cavity in the shape of a rectangular parallelepiped can be connected to the sliding table 3 one by one during assembly, so that the connection between the side stop and the sliding table 3 is better, and the sealing of the joint of the glue cavity 6 is also better.
  • the side wall 2 has at least two opposite first side walls, and each first side wall is formed with a step surface 21 facing the opening of the accommodating cavity, and the step surface 21 is used to connect with the insertion portion 31
  • the side surface of the inserting portion 31 is adhered to the first side wall, and the bottom surface of the inserting portion 31 is adhered to the step surface 21, which improves the glue cavity 6
  • the sealing effect at the joints avoids leaking glue.
  • the side surface of the insertion portion 31 of this embodiment has a recessed area, and the recessed area is provided with a heat dissipation groove 32.
  • the inner surface of the first side wall of this embodiment is provided with a protrusion 22 , The protrusion 22 is used to fit the side surface of the insertion portion 31 to close the heat dissipation groove 32 opened on the side surface of the insertion portion 31.
  • the protrusion 22 When assembling the sliding table 3 and the mold body 10, the protrusion 22 just abuts the recessed area, and The recessed area fits so as to close the notch of the heat dissipation groove 32, thereby preventing the glue from entering the heat dissipation groove 32 to block the heat dissipation groove 32.
  • the protrusion 22 and the step surface 21 can also be provided on the first side wall at the same time.
  • the sealing effect of the glue filling cavity 6 is ensured, and on the other hand, the glue entering into the heat dissipation groove 32 is avoided.
  • the present invention also provides a glue-pouring device, which includes the aforementioned glue-pouring mold 100, and any glue-pouring device with the aforementioned glue-pouring mold 100 belongs to the glue-pouring device of the present invention.
  • the specific structure of the glue injection mold 100 refers to the above-mentioned embodiment. Since the glue injection mold 100 in the glue injection device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the technical solutions brought by the above-mentioned embodiments. The beneficial effects will not be repeated here.
  • the glue filling device may also include equipment for filling glue, such as a glue filling machine, and equipment for curing glue, such as an oven.
  • a glue filling method including the following steps can be used. 6 to 8 are embodiments of the glue filling method provided by the present invention.
  • the glue potting method includes the following steps:
  • Step S10 Provide the glue filling device as described above.
  • Step S20 providing a moving sub-module, which includes a sliding table 3 and a moving sub-assembly 4 fixedly connected to each other.
  • the mover module is preformed first. Specifically, the sliding table 3 and the mover assembly 4 are fixedly connected.
  • the connection method can be connected by fasteners, such as screws 8.
  • Step S30 Match the mover module with the accommodating cavity of the mold body 10, so that the mover assembly 4 is accommodated in the accommodating cavity, and the sliding table 3 covers the open end A glue-pouring cavity 6 is formed by enclosing the mold body 10 together.
  • the mover module is assembled with the mold body 10.
  • the mover assembly 4 should be located in the accommodating cavity. 3 and the mold body 10 are restricted to form a glue-filling cavity 6.
  • the sliding table 3 and the mold body 10 can be fixedly connected with glue or fasteners. In order to avoid glue leakage during glue filling, the connection should be as tight as possible and the joints should be sealed as much as possible.
  • a plurality of screw holes 7 are provided on the upper side of the sliding table 3 and the side surface of the inserting portion 31, and at the same time, a mounting hole corresponding to the screw hole 7 is provided at the corresponding position of the side wall 2 of the mold body 10.
  • the mold body 10 can be assembled first, and then assembled with the mover module, or it can be spliced piece by piece.
  • the main body 10 is described as an example.
  • the front stop 201, the rear stop 202, the left stop 203 and the right stop 203 can be attached and fixedly connected to the insertion part 31 of the sliding table 3 one by one, and then the base 1 and The front stop 201, the rear stop 202, the left stop 203, and the right stop 203 are fixedly connected.
  • Step S40 filling the glue filling cavity 6 with glue.
  • the glue is injected into the glue filling cavity 6 so that the glue fills the glue filling cavity 6.
  • the glue not only completely wraps the mover assembly 4, but also fills the gap between the mover assembly 4 and the sliding table 3.
  • the glue filling of the mover module can be completed, and since the glue enters the gap between the mover assembly 4 and the sliding table 3 when it is in a flowing state, after it is solidified, the glue layer , The mover assembly 4 and the sliding table 3 will become a whole, and the flatness of the glue-filled surface will not interfere with the assembly accuracy, so as to realize the control of the assembly accuracy of the mover module.
  • the glue-pouring cavity 6 limits the area that needs to be glued
  • the precision of the formed glue layer can be controlled by controlling the shape of the glue-pouring cavity 6 and the accuracy of the cavity wall, thereby subtracting the subsequent grinding of the existing glue. The process simplifies the process and reduces the cost.
  • the glue potting method includes the following steps:
  • Step S10 Provide the glue filling device as described above.
  • Step S20 providing a moving sub-module, which includes a sliding table 3 and a moving sub-assembly 4 fixedly connected to each other.
  • Step S30 Match the mover module with the accommodating cavity of the mold body 10, so that the mover assembly 4 is accommodated in the accommodating cavity, and the sliding table 3 covers the open end A glue-pouring cavity 6 is formed by enclosing the mold body 10 together.
  • Step S40 filling the glue filling cavity 6 with glue.
  • Step S50 curing the glue liquid, so that the glue liquid is solidified on the surface of the sliding table 3 and the movable subassembly 4 to form a potting glue layer.
  • Step S60 separating the sliding table 3 and the mold body 10.
  • the glue filling cavity 6 is filled with glue
  • the glue needs to be cured. There are many curing methods, you can use an oven for baking, or you can first perform UV irradiation and then bake and cure. After the glue is solidified and cooled, the sliding table 3 and the mold body 10 are separated to obtain the mover module with successful glue filling.
  • the sliding table 3 and the mover assembly 4 are first assembled into the mover module, and then the glue potting mold 100 and the mover mold are combined to form the glue cavity 6, and then the glue is injected into the glue cavity 6.
  • the glue not only completely wraps the mover assembly 4, but also fills the gap between the mover assembly 4 and the sliding table 3. After the glue solidifies, the opposite movement can be completed.
  • the flatness of the glued surface will not interfere with the assembly accuracy, so as to realize the control of the assembly accuracy of the mover module.
  • the glue-pouring cavity 6 limits the area that needs to be glued, the precision of the formed glue layer can be controlled by controlling the shape of the glue-pouring cavity 6 and the accuracy of the cavity wall, thereby subtracting the subsequent grinding of the existing glue. The process simplifies the process and reduces the cost.
  • step S20 when step S20 is implemented, the following steps may be adopted:
  • Step S21 Provide a mover assembly 4, the mover assembly 4 includes a silicon steel sheet group 41 and a coil winding 42 wound on the silicon steel sheet group 41, and the coil winding 42 includes a silicon steel sheet group 41 that is wound around the silicon steel sheet group 41.
  • Step S22 Provide a sliding table 3, the sliding table 3 has an installation side facing the accommodating cavity, the installation side has an installation position for the moving subassembly 4, and a through hole is opened on the sliding table 3 5.
  • the through hole 5 forms an outlet on the installation side of the sliding table 3 so that the outlet is close to the installation position;
  • Step S23 Mount the silicon steel sheet group 41 at the mounting position, and pass the lead end 420 through the through hole 5 to form the mover module.
  • a through hole 5 is opened on the sliding table 3, the through hole 5 penetrates the sliding table 3, and after it penetrates the sliding table 3, the exit formed on the installation side of the sliding table 3 is close to the installation position, and in the moving submodule
  • the through hole 5 communicates with the glue filling cavity 6 to form a glue filling port of the glue filling cavity 6.
  • the silicon steel sheet group 41 is fixedly installed at the installation position of the sliding table 3, and at the same time, the lead end 420 of the coil winding 42 is passed through the through hole 5, thereby completing the assembly of the moving submodule.
  • the through hole 5 can be used not only as a potting port, but also as a through port for the lead end 420, realizing one hole for multiple purposes.
  • step S40 when step S40 is performed, the following steps can be used to perform operations:
  • Step S41 Inject the glue into the glue filling cavity 6 through the through hole 5, and stop the glue filling after the glue flows into the through hole 5.
  • glue is injected into the glue filling cavity 6 through the through hole 5, and when the glue liquid diffuses into the through hole 5, it means that the glue filling cavity 6 has been completely filled, so that the glue filling can be stopped. Since the aperture of the through hole 5 is small, only a small amount of glue is injected during the glue filling, and a large increase in the through hole 5 can be shown, so that it is easier to control the glue filling amount.

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  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
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Abstract

本发明公开一种灌胶模具、灌胶装置以及灌胶方法，涉及电机制造技术领域。所述灌胶模具用于对动子模组进行灌胶，其中，所述动子模组包括滑台以及与所述滑台固定连接的动子组件，所述灌胶模具包括模具本体，所述模具本体形成有一端开口的容置腔，所述容置腔用以与所述滑台配合，以使所述动子组件容置于所述容置腔，且所述滑台盖合所述开口端以与所述模具本体共同围合形成一灌胶腔。本发明提供的技术方案，旨在解决现有灌胶工艺导致的动子模组装配精度较差的问题。

Description

灌胶模具、灌胶装置以及灌胶方法 技术领域
本发明涉及电机制造技术领域，特别涉及灌胶技术领域，具体涉及一种灌胶模具、灌胶装置以及灌胶方法。
背景技术
直线电机是一种常见的传动装置，直线电机包括动子模组，相应的动子模组包括滑台和动子组件，动子组件包括线圈和硅钢片组。动子模组在生产装配过程中需要灌胶。现有的灌胶方法是：对动子组件进行整体灌胶，待胶体固化后，再将其与滑台通过多个紧固件固定连接以形成动子模组。由于在装配滑台和动子组件时，与滑台直接接触的是动子组件的灌胶面，灌胶面的平整度会影响到滑台和动子组件的装配精度。
发明内容
本发明的主要目的是提出一种灌胶模具、灌胶装置以及灌胶方法，旨在解决现有灌胶工艺导致的动子模组装配精度较差的问题。
为实现上述目的，本发明提出的一种灌胶模具，用于对动子模组进行灌胶，其中，所述动子模组包括滑台以及与所述滑台固定连接的动子组件，所述灌胶模具包括模具本体，所述模具本体形成有一端开口的容置腔，所述容置腔用以与所述滑台配合，以使所述动子组件容置于所述容置腔，且所述滑台盖合所述开口端以与所述模具本体共同围合形成一灌胶腔。
可选地，所述模具本体包括底座和侧壁，所述底座和所述侧壁围合形成所述容置腔。
可选地，所述侧壁包括多个相互连接的侧挡块，多个所述侧挡块围合形成所述侧壁。
可选地，所述侧壁至少具有两个相对的第一侧壁，每一所述第一侧壁形成有朝向所述容置腔的开口的台阶面，所述台阶面用于与所述滑台伸入至所述容置腔内的插接部的底面贴合；和/或，
所述侧壁至少具有两个相对的第一侧壁，所述第一侧壁的内侧面设有凸起，所述凸起用于与所述滑台伸入至所述容置腔内的插接部的侧面贴合，以封闭所述插接部侧面开设的散热槽。
此外，本发明还提出一种灌胶装置，所述灌胶装置包括如上所述的灌胶模具，所述灌胶模具用于对动子模组进行灌胶，其中，所述动子模组包括滑台以及与所述滑台固定连接的动子组件，所述灌胶模具包括模具本体，所述模具本体形成有一端开口的容置腔，用于与所述滑台配合，以使所述动子组件容置于所述容置腔，且所述模具本体与所述滑台共同限制形成一灌胶腔。
此外，本发明还提出一种灌胶方法，所述灌胶方法包括如下步骤：
提供如上所述的灌胶装置；
提供动子模组，所述动子模组包括相互固定连接的滑台和动子组件；
将所述动子模组与模具本体的容置腔配合，使所述动子组件容置于所述容置腔，且所述滑台盖合所述开口端以与所述模具本体共同围合形成一灌胶腔；
向所述灌胶腔内填充胶液。
可选地，所述提供动子模组，所述动子模组包括相互固定连接的滑台和动子组件的步骤包括：
提供动子组件，所述动子组件包括硅钢片组和绕设于所述硅钢片组的线圈绕组，所述线圈绕组包括绕设于所述硅钢片组的绕线段和连接于所述绕线段的引线端；
提供滑台，所述滑台具有朝向所述容置腔的安装侧，所述安装侧具有一供所述动子组件安装的安装位置，在所述滑台上开设通孔，所述通孔在所述滑台的安装侧形成出口，使所述出口靠近所述安装位置；
将所述硅钢片组安装于所述安装位置，并将所述引线端穿过所述通孔，以成型所述动子模组。
可选地，组装所述动子模组与所述模具本体，使所述动子组件容置于所述容置腔中，所述滑台与所述模具本体合模而形成所述灌胶腔的步骤中，所述灌胶腔与所述通孔相连通。
可选地，向所述灌胶腔内填充胶液的步骤包括：
通过所述通孔向所述灌胶腔内注入胶液，待所述胶液漫入所述通孔后，停止灌胶。
可选地，向所述灌胶腔内填充胶液的步骤之后，还包括：
对所述胶液进行固化处理，以使所述胶液在所述滑台以及所述动子组件表面固化形成灌封胶层；
分离所述滑台与所述模具本体。
本发明的技术方案中，提供了一种灌胶模具，该灌胶模具包括模具本体，模具本体形成有一端开口的容置腔，通过先组装滑台和动子组件以成型动子模组，再将灌胶模具与动子模组合模，以使动子组件容置于容置腔且滑台盖合开口端以与模具本体共同围合形成一灌胶腔，此时，再向灌胶腔中灌胶，可以让滑台和动子组件一起灌胶，从而使滑台与灌胶面连结成一个整体，灌胶面不会干扰到装配精度。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明提供的灌胶模具的一实施例与动子模组的装配示意图；
图2为图1中灌胶模具去除前侧挡块和左侧挡块后的结构示意图；
图3为图1的俯视图；
图4为图3中A-A剖视图；
图5为图3中B-B剖视图；
图6为本发明提供的灌胶方法的一实施例的流程示意图；
图7为本发明提供的灌胶方法的另一实施例的流程示意图；
图8为本发明提供的灌胶方法的又一实施例的流程示意图。
附图标号说明：
标号 名称 标号 名称
100 灌胶模具 10 模具本体
1 底座 2 侧壁
21 台阶面 22 凸起
201 前侧挡块 202 后侧挡块
203 左侧挡块 204 右侧挡块
3 滑台 31 插接部
32 散热槽 4 动子组件
41 硅钢片组 42 线圈绕组
420 引线端 5 通孔
6 灌胶腔 7 螺孔
8 螺钉    
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义，包括三个并列的方案，以“A和/或B”为例，包括A方案、或B方案、或A和B同 时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
动子模组在生产装配过程中需要灌胶。现有的灌胶方法是：对动子组件进行整体灌胶，待胶体固化后，再将其与滑台通过多个紧固件固定连接以形成动子模组。由于在装配滑台和动子组件时，与滑台直接接触的是动子组件的灌胶面，灌胶面的平整度会影响到滑台和动子组件的装配精度。
鉴于此，本发明提供一种灌胶模具100，用于对动子模组进行灌胶。图1至图5为本发明提供的灌胶模具100一实施例。
请参阅图1和图4，本实施例中，动子模组包括滑台3和动子组件4，滑台3和动子组件4固定连接；灌胶模具100包括模具本体10，模具本体10形成有一端开口的容置腔，容置腔用以与滑台3配合，当模具本体10与动子模组合模时，动子模组位于容置腔内，且滑台3盖合容置腔的开口端，从而使滑台3与模具本体10共同围合形成一个灌胶腔6。向灌胶腔6内注入胶液，即可使胶液包裹动子组件4并填充滑台3与动子组件4之间的连接间隙。
由于本方案采用先组装滑台3和动子组件4以成型动子模组，再将灌胶模具100与动子模组合模形成灌胶腔6，然后向灌胶腔6中灌胶的方式，从而可以让滑台3和动子组件4一起灌胶，如此，滑台3与灌胶面可以连结成一个整体，灌胶面的平整度将不会干扰到装配精度，进而得以实现对动子模组装配精度的控制。此外，由于灌胶腔6限制了需要灌胶的区域，通过控制灌胶腔6的形状以及腔壁的精度即可控制成型的胶层的精度，从而减去了现有灌胶后续的磨削过程，简化了工艺，减少了成本。
需要说明的是，容置腔和灌胶腔6的形状不做限制，其横截面可以是矩形，圆形，多边形等，具体可根据动子组件4的形状或者需要形成胶层的形状进行适应性调整，为便于理解，本实施例以横截面形状为矩形的容置腔为例进行说明。
参阅图1和图2，本实施例模具本体10包括底座1和侧壁2，侧壁2围绕底座1的周缘设置，从而使得底座1和侧壁2可以围合形成容置腔。
具体地，本实施例滑台3与动子组件4固定连接，滑台3具有用于安装 动子组件4的插接部31，插接部31突出于滑台3的下侧面设置。容置腔用于与滑台3的插接部31配合，如图4中所示，插接部31伸入容置腔中，并与侧壁2抵接，从而使得侧壁2、底座1与插接部31共同围成上述灌胶腔6，动子组件4容置于容置腔中，这种合模方式使得侧壁2与滑台3的连接更加紧密，具体实施时，可以采用粘胶或者使用紧固件如螺钉8等将侧壁2与滑台3固定连接，以密封二者的接缝处，避免灌胶时，灌胶腔6中的胶液从接缝处漏出。
其中，侧壁2和底座1可以一体成型设置，也可以如图1中所示，呈分体设置，在使用时，再使用粘胶或者使用紧固件如螺钉8等，将侧壁2和底座1固定连接以形成容置腔。
同样地，侧壁2的实现形式也可以有多种，侧壁2可以呈两端开口的围框形式，也可以由多个挡块组装形成。如图1和图2所示，本实施例侧壁2包括多个相互连接的侧挡块，多个侧挡块围合形成侧壁2。具体地，本实施例中，侧壁2包括前侧挡块201、后侧挡块202、左侧挡块203和右侧挡块203，这四个侧挡块围绕底座1的四周设置，从而形成长方体形状的容置腔，组装时，可以逐个与滑台3进行连接，使得侧挡块与滑台3的连接贴合度更好，灌胶腔6接缝处的密闭性也更佳。
参阅图3和图4，侧壁2至少具有两个相对的第一侧壁，每一第一侧壁形成有朝向容置腔的开口的台阶面21，台阶面21用于与插接部31的底面贴合，当将模具本体10与滑台3进行组装时，插接部31的侧面与第一侧壁贴合，插接部31的底面与台阶面21贴合，提升了灌胶腔6接缝处的密闭效果，避免漏胶。
为便于动子组件4散热，本实施例插接部31的侧面具有一凹陷区，该凹陷区开设有散热槽32，参阅图4，本实施例第一侧壁的内侧面设有凸起22，凸起22用于与插接部31的侧面贴合，以封闭插接部31侧面开设的散热槽32，组装滑台3和模具本体10时，凸起22恰好抵接凹陷区，且与凹陷区贴合，从而将散热槽32的槽口封闭，进而避免了胶液进入散热槽32中而堵塞散热槽32。
作为优选实施例，还可以在第一侧壁上同时设置凸起22和台阶面21，一方面确保了灌胶腔6的密封效果，另一方面也避免了散热槽32进胶。
此外，本发明还提出一种灌胶装置，所述灌胶装置包括如上所述的灌胶 模具100，只要具有如上所述的灌胶模具100的灌胶装置均属于本发明所述的灌胶装置，灌胶模具100的具体结构参照上述实施例，由于本灌胶装置中的灌胶模具100采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。除灌胶模具100外，本灌胶装置还可以包括用于灌胶的设备，例如灌胶机，以及用于固化胶液的设备，例如烘箱等。
在采用如上所述的灌胶模具100或者灌胶装置进行灌胶时，可以采用包括如下步骤的灌胶方法。图6至图8为本发明提供的灌胶方法的实施例。
参阅图6，在本发明灌胶方法的一实施例中，该灌胶方法包括以下步骤：
步骤S10、提供如上所述的灌胶装置。
步骤S20、提供动子模组，所述动子模组包括相互固定连接的滑台3和动子组件4。
本实施例中，先预成型动子模组。具体地，将滑台3和动子组件4固定连接。其连接方式可以是采用紧固件进行连接，例如螺钉8。
步骤S30、将所述动子模组与所述模具本体10的容置腔配合，使所述动子组件4容置于所述容置腔，且所述滑台3盖合所述开口端以与所述模具本体10共同围合形成灌胶腔6。
本实施例中，将动子模组与模具本体10组装，组装后，动子组件4应位于容置腔中，滑台3与模具本体10的侧壁2的上端固定连接，从而使滑台3与模具本体10限制形成了灌胶腔6。具体实施时，可以使用粘胶或者使用紧固件将滑台3与模具本体10固定连接，且为了避免灌胶时漏胶，在连接时，应尽可能确保连接紧密且接缝处密封，本实施例中，在滑台3的上侧和插接部31的侧面都开设了多个螺孔7，同时在模具本体10的侧壁2的对应位置处开设了与螺孔7对应的安装孔，通过采用多个穿过安装孔的螺钉8将模具本体10与滑台3固定，从而可以确保二者连接紧密，且灌胶腔6的密封效果较好。
需要说明的是，对于不是一体成型结构的模具本体10，可以先组装模具本体10后，再将其与动子模组组装，也可以逐块拼接，以图1和图2所示结构的模具本体10为例进行说明。组装时，可以先将前侧挡块201、后侧挡块202、左侧挡块203和右侧挡块203一一与滑台3的插接部31贴合并固定连接，然后将 底座1与前侧挡块201、后侧挡块202、左侧挡块203和右侧挡块203固定连接。
步骤S40、向所述灌胶腔6内填充胶液。
本实施例中，向灌胶腔6内注入胶液以使得胶液充满灌胶腔6，此时，胶液不仅完全包裹动子组件4，而且填充了动子组件4与滑台3之间的间隙，待胶液固化后，即可完成对动子模组的灌胶，且由于胶液在流动状态时进入动子组件4与滑台3之间的间隙，待其固化后，胶层、动子组件4以及滑台3会成为一个整体，灌胶面的平整度将不会干扰到装配精度，进而得以实现对动子模组装配精度的控制。此外，由于灌胶腔6限制了需要灌胶的区域，通过控制灌胶腔6的形状以及腔壁的精度即可控制成型的胶层的精度，从而减去了现有灌胶后续的磨削过程，简化了工艺，减少了成本。
参阅图7，在本发明灌胶方法的另一实施例中，该灌胶方法包括以下步骤：
步骤S10、提供如上所述的灌胶装置。
步骤S20、提供动子模组，所述动子模组包括相互固定连接的滑台3和动子组件4。
步骤S30、将所述动子模组与所述模具本体10的容置腔配合，使所述动子组件4容置于所述容置腔，且所述滑台3盖合所述开口端以与所述模具本体10共同围合形成灌胶腔6。
步骤S40、向所述灌胶腔6内填充胶液。
步骤S50、对所述胶液进行固化处理，以使所述胶液在所述滑台3以及所述动子组件4表面固化形成灌封胶层。
步骤S60、分离所述滑台3与所述模具本体10。
灌胶腔6内被胶液填充充实后，需要对胶液进行固化处理。固化处理方式有多种，可以使用烘箱进行烘烤，也可以先进行UV照射后再进行烘烤固化。待胶液固化并冷却后，分离滑台3和模具本体10，即可获得灌胶成功的动子模组。
进一步地，为了确保灌胶质量，还可以在灌胶后进行静置或者消泡处理，使得灌胶腔6内的胶液密度均匀、充实，且无气泡，待气泡消除后再进行固化。
本实施例中，先将滑台3和动子组件4组装成动子模组，再将灌胶模具100与动子模组合模形成灌胶腔6，然后向灌胶腔6内注入胶液以使得胶液充满灌胶腔6，此时，胶液不仅完全包裹动子组件4，而且填充了动子组件4与滑台3 之间的间隙，待胶液固化后，即可完成对动子模组的灌胶，且由于胶液在流动状态时进入动子组件4与滑台3之间的间隙，待其固化后，胶层、动子组件4以及滑台3会成为一个整体，灌胶面的平整度将不会干扰到装配精度，进而得以实现对动子模组装配精度的控制。此外，由于灌胶腔6限制了需要灌胶的区域，通过控制灌胶腔6的形状以及腔壁的精度即可控制成型的胶层的精度，从而减去了现有灌胶后续的磨削过程，简化了工艺，减少了成本。
参阅图8，在本发明灌胶方法的又一实施例中，步骤S20在实施时，可以采用如下步骤进行操作：
步骤S21、提供动子组件4，所述动子组件4包括硅钢片组41和绕设于所述硅钢片组41的线圈绕组42，所述线圈绕组42包括绕设于所述硅钢片组41的绕线段和连接于所述绕线段的引线端420；
步骤S22、提供滑台3，所述滑台3具有朝向所述容置腔的安装侧，所述安装侧具有一供动子组件4安装的安装位置，在所述滑台3上开设通孔5，所述通孔5在所述滑台3的安装侧形成出口，使所述出口靠近所述安装位置；
步骤S23、将所述硅钢片组41安装于所述安装位置，并将所述引线端420穿过所述通孔5，以成型所述动子模组。
本实施例中，在滑台3上开设通孔5，通孔5贯穿滑台3，且其贯穿滑台3后在滑台3的安装侧所形成的出口靠近安装位置，在动子模组与模具本体10合模时，该通孔5与灌胶腔6连通，从而构成灌胶腔6的灌胶口。然后，将硅钢片组41固定安装在滑台3的安装位置，同时将线圈绕组42的引线端420穿过通孔5，从而完成对动子模组的组装。这样一来，通孔5不仅可以作为灌胶口使用，还可以作为引线端420的穿出口使用，实现了一孔多用。
基于此，在进行步骤S40时，可以采用如下步骤进行操作：
步骤S41、通过所述通孔5向所述灌胶腔6内注入胶液，待所述胶液漫入所述通孔5后，停止灌胶。
本实施例通过通孔5向灌胶腔6内注胶，当胶液漫入通孔5后，即说明灌胶腔6已被完全填充，从而可以停止灌胶。由于通孔5的孔径较小，在灌胶时，只需注入少量的胶液，就能在通孔5中呈现出较大的上升幅度，从而更易于把控灌胶量。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围， 凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

  1. 一种灌胶模具，用于对动子模组进行灌胶，其特征在于，所述动子模组包括滑台以及与所述滑台固定连接的动子组件，所述灌胶模具包括模具本体，所述模具本体形成有一端开口的容置腔，所述容置腔用以与所述滑台配合，以使所述动子组件容置于所述容置腔，且所述滑台盖合所述开口端以与所述模具本体共同围合形成一灌胶腔。
  2. 如权利要求1所述的灌胶模具，其特征在于，所述模具本体包括底座和侧壁，所述底座和所述侧壁围合形成所述容置腔。
  3. 如权利要求2所述的灌胶模具，其特征在于，所述侧壁包括多个相互连接的侧挡块，多个所述侧挡块围合形成所述侧壁。
  4. 如权利要求2所述的灌胶模具，其特征在于，所述侧壁至少具有两个相对的第一侧壁，每一所述第一侧壁形成有朝向所述容置腔的开口的台阶面，所述台阶面用于与所述滑台伸入至所述容置腔内的插接部的底面贴合；和/或，所述侧壁至少具有两个相对的第一侧壁，所述第一侧壁的内侧面设有凸起，所述凸起用于与所述滑台伸入至所述容置腔内的插接部的侧面贴合，以封闭所述插接部侧面开设的散热槽。
  5. 一种灌胶装置，其特征在于，所述灌胶装置包括如权利要求1至4任意一项所述的灌胶模具。
  6. 一种灌胶方法，其特征在于，包括如下步骤：
    提供如权利要求5所述的灌胶装置；
    提供动子模组，所述动子模组包括相互固定连接的滑台和动子组件；
    将所述动子模组与模具本体的容置腔配合，使所述动子组件容置于所述容置腔，且所述滑台盖合所述开口端以与所述模具本体共同围合形成一灌胶腔；
    向所述灌胶腔内填充胶液。
  7. 如权利要求6所述的灌胶方法，其特征在于，所述提供动子模组，所述动子模组包括相互固定连接的滑台和动子组件的步骤包括：
    提供动子组件，所述动子组件包括硅钢片组和绕设于所述硅钢片组的线圈绕组，所述线圈绕组包括绕设于所述硅钢片组的绕线段和连接于所述绕线段的引线端；
    提供滑台，所述滑台具有朝向所述容置腔的安装侧，所述安装侧具有一供所述动子组件安装的安装位置，在所述滑台上开设通孔，所述通孔在所述滑台的安装侧形成出口，使所述出口靠近所述安装位置；
    将所述硅钢片组安装于所述安装位置，并将所述引线端穿过所述通孔，以成型所述动子模组。
  8. 如权利要求7所述的灌胶方法，其特征在于，组装所述动子模组与所述模具本体，使所述动子组件容置于所述容置腔中，所述滑台与所述模具本体合模而形成所述灌胶腔的步骤中，所述灌胶腔与所述通孔相连通。
  9. 如权利要求8所述的灌胶方法，其特征在于，向所述灌胶腔内填充胶液的步骤包括：
    通过所述通孔向所述灌胶腔内注入胶液，待所述胶液漫入所述通孔后，停止灌胶。
  10. 如权利要求6所述的灌胶方法，其特征在于，向所述灌胶腔内填充胶液的步骤之后，还包括：
    对所述胶液进行固化处理，以使所述胶液在所述滑台以及所述动子组件表面固化形成灌封胶层；
    分离所述滑台与所述模具本体。
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