WO2021134405A1 - 导电件 - Google Patents

导电件 Download PDF

Info

Publication number
WO2021134405A1
WO2021134405A1 PCT/CN2019/130337 CN2019130337W WO2021134405A1 WO 2021134405 A1 WO2021134405 A1 WO 2021134405A1 CN 2019130337 W CN2019130337 W CN 2019130337W WO 2021134405 A1 WO2021134405 A1 WO 2021134405A1
Authority
WO
WIPO (PCT)
Prior art keywords
connecting portion
force
reducing hole
conductive element
pad
Prior art date
Application number
PCT/CN2019/130337
Other languages
English (en)
French (fr)
Inventor
肖乐祥
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/130337 priority Critical patent/WO2021134405A1/zh
Publication of WO2021134405A1 publication Critical patent/WO2021134405A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the utility model relates to the field of circuit boards, in particular to a conductive piece used in portable electronic products.
  • the conductive element in the related art includes a circuit layer for conducting electricity, a solder mask layer covering the outer surface of the circuit layer, and a pad connected to the circuit layer and exposed on the solder mask layer.
  • a circuit layer for conducting electricity a solder mask layer covering the outer surface of the circuit layer
  • a pad connected to the circuit layer and exposed on the solder mask layer In practical applications It is often necessary to bend the circuit layer to a certain extent so that the pad can be attached to the surface of the device housing to facilitate electrical connection with external equipment.
  • the thickness of the bending area of the conductive element is too thick, the stress in the bending area is concentrated during the bending process, especially when the bending angle reaches 180°, the conductive element is easy to rebound and lift after bending. Warping greatly reduces the reliability of the conductive parts when they are bent and used.
  • the purpose of the utility model is to provide a conductive element with high bending reliability.
  • the present invention provides a conductive element, which includes a circuit layer for conducting electricity, the circuit layer includes a body, an extension portion provided with a pad, and a connection portion connecting the body and the extension portion
  • the connecting portion is provided with a force-reducing hole passing through it, and the location of the force-reducing hole is the bending area of the connecting portion, and the connecting portion can be bent along the bending area to make the The pad is connected to an external device.
  • the connecting portion includes a first connecting portion and a second connecting portion respectively connected to the body and spaced apart from each other, and the extension portion includes a first extending portion and a second extending portion spaced apart from each other.
  • the first extension portion is connected to the side of the first connecting portion away from the body, and the second extension portion is connected to the side of the second connecting portion away from the body; the force reducing hole penetrates the first The connecting portion and/or the second connecting portion are provided.
  • the force-reducing hole includes a first force-reducing hole provided through the first connecting portion and a second force-reducing hole provided through the second connecting portion, and the first connecting portion may be along the first connecting portion.
  • a position where a force reducing hole is located is bent, and the second connecting portion can be bent along a position where the second force reducing hole is located.
  • the first force reducing holes include two and are arranged at intervals; the second force reducing holes include two and are arranged at intervals.
  • the conductive member includes a solder mask layer coated on the outer surface of the circuit layer, and a side of the extension portion where the pad is exposed is exposed from the solder mask layer to form an electrical signal connection with the outside .
  • the conductive member is a flexible circuit board.
  • the connecting portion is provided with a force-reducing hole penetrating therethrough, and the position of the force-reducing hole is the bending area of the connecting portion, and the connecting portion
  • the pad can be bent along the bending area to connect the pad to an external device; in the above structure, by providing the force reducing hole in the bending area, the bending area of the conductive member can be effectively reduced.
  • the stress prevents the connection part from rebounding or warping after bending, and improves the bending reliability of the conductive member.
  • Figure 1 is a schematic diagram of the structure of the conductive element of the present invention.
  • the present invention provides a conductive element 100, which includes a conductive circuit layer 1, a solder mask layer 2 covering the outer surface of the circuit layer 1, and a circuit layer 1
  • the pads (not marked in the figure).
  • the structure of the conductive member 100 is not limited, and it can be set according to actual conditions.
  • the conductive member 100 is a flexible circuit board.
  • the circuit layer 1 includes a main body 11, a connecting portion (not shown in the figure), and an extension portion (not shown in the figure); the connecting portion 12 connects the main body 11 and the extending portion 12 respectively, so The extension portion is provided with the pad for forming an electrical signal connection with the outside.
  • the connecting portion includes a first connecting portion 12 and a second connecting portion 13 respectively connected to the body 11 and spaced apart from each other.
  • the extending portion includes a first extending portion 14 and a second extending portion 15 spaced apart from each other.
  • the first extending portion 14 is connected to the side of the first connecting portion 12 away from the main body 11, and the second extending portion 15 is connected to the side of the second connecting portion 13 away from the main body 11.
  • the first extension portion 14 and the second extension portion 15 are respectively exposed on the solder mask 2 to form electrical signal connections with external devices; further, in order to better ensure that the circuit board 1 is connected to the outside world Reliability of electrical connection, the pad includes a first pad 31 and a second pad 32 spaced apart from each other, and the first pad 31 is attached to the first extension 14 for attaching the first pad to the first extension 14
  • An extension portion 14 forms an electrical signal connection with the outside
  • the second pad 32 is attached to the second extension portion 15 to form an electrical signal connection between the second extension portion 15 and an external device.
  • first connecting portion 12 and/or the second connecting portion 13 need to be bent, and in this embodiment In the manner, the first connecting portion 12 is bent and folded along the first bending axis X, and the second connecting portion 13 is bent and folded along the second bending axis Y.
  • a force-reducing hole (not shown in the figure) for reducing the bending stress is provided at the bending position, that is, at the first connecting portion 12 and/or the second
  • the connecting portion 13 is provided with the force reducing hole penetrating therethrough, the position of the force reducing hole is used as the bending area of the connecting portion, and the bending axis is located in the bending area.
  • the The connecting portion may be bent along a bending axis in the bending area to connect the pad to an external device. It should be noted that the specific position and number of the force-reducing holes are not limited, and they can be specifically configured according to the bending requirements of the conductive member in practical applications.
  • the force-reducing holes include two groups and are spaced apart from each other. One group of the force-reducing holes The first connecting portion 12 is penetrated, and another group of the force reducing holes is penetrated through the second connecting portion 13.
  • the first connecting portion 12 is provided with a first force-reducing hole 120 penetrating therethrough, the first force-reducing hole 120 is the bending area of the first connecting portion 12, and the second A bending axis X is located within the range of the first force reducing hole 120.
  • the first force reducing hole 120 includes two and is spaced apart from each other along the first bending axis X. The two first The geometric center axis of the force reducing hole 120 coincides with the first bending axis X.
  • the first connecting portion 12 When the first connecting portion 12 needs to be bent, the first connecting portion 12 is bent along the first bending axis X At this time, the first force reducing hole 120 can effectively reduce the stress in the bending area of the first connecting portion 12, and avoid the phenomenon that the body 11 rebounds or warps after being attached; the second The connecting portion 13 is provided with a second force-reducing hole 130 penetrating therethrough.
  • the second force-reducing hole 130 is the bending area of the second connecting portion 13, and the second bending axis Y is located at the Within the scope of the second force-reducing hole 130, the second force-reducing hole 130 includes two and is spaced apart from each other along the second bending axis Y, and the geometric center axis of the two second force-reducing holes 130 It coincides with the second bending axis Y.
  • the second connecting portion 13 needs to be bent, when the second connecting portion 13 is bent along the second bending axis Y, the second force reducing The hole 130 can effectively reduce the stress in the bending area of the second connecting portion 13 and avoid the phenomenon of rebound or warping of the second connecting portion 12 after being attached.
  • the stress in the bending area of the conductive element 100 is effectively reduced, and the bending of the connecting portion is avoided.
  • the phenomenon of rebound or warping occurs later, so that the bending reliability of the conductive member 100 is high.
  • solder mask 2 covers the outer surfaces of the main body 11, the first connecting portion 12 and the second connecting portion 13.
  • the solder mask 2 includes a solder mask body 21, which covers the body 11, the first connection portion 12, and the second connection portion 13, respectively, and the The solder mask main body 21 completely covers the force reducing hole.
  • the solder mask 21 further includes a first portion 22 protruding from the solder mask main body 21 and a second portion 23 protruding from the solder mask main body 21; the first portion 22 is used to cover an end of the first extension portion 14 away from the first pad 21; the second portion 23 is used to cover an end of the second extension portion 15 away from the second pad 22 .
  • the connecting portion is provided with a force-reducing hole penetrating therethrough, and the position of the force-reducing hole is the bending area of the connecting portion, and the connecting portion
  • the pad can be bent along the bending area to connect the pad to an external device; in the above structure, by providing the force reducing hole in the bending area, the bending area of the conductive member can be effectively reduced.
  • the stress prevents the connection part from rebounding or warping after bending, and improves the bending reliability of the conductive member.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种导电件(100)，其包括用于导电的线路层(1)，线路层(1)包括本体(11)、设有焊盘的延伸部以及连接本体(11)与延伸部的连接部；连接部设有贯穿其上的减力孔，减力孔所在的位置为连接部的弯折区域，连接部可沿弯折区域弯折以使焊盘与外部设备连接。因此，本导电件弯折可靠性高。

Description

导电件 技术领域
本实用新型涉及线路板领域，尤其涉及一种运用于便携式电子产品的导电件。
 背景技术
随着移动互联网时代的到来，智能移动设备的数量不断上升。而在众多移动设备之中，手机无疑是最常见、最便携的移动终端设备。目前，手机的功能极其多样，其中之一便是高品质的音乐功能，因此，用于播放声音的导电件被大量应用到现在的智能移动设备之中。
相关技术的所述导电件包括用于导电的线路层、包覆于所述线路层外表面的防焊层以及连接所述线路层且外露于所述防焊层的焊盘，在实际应用中，经常需要将所述线路层进行一定程度的弯折，使得焊盘能够贴设于器件外壳表面以方便与外部设备电连接。
 技术问题
然而，相关技术中，由于导电件的弯折区域的厚度偏厚，在弯折过程中，该弯折区域的应力集中，尤其弯折角度达到180°时，弯折后导电件易反弹及起翘，大大降低了导电件的弯折使用时的可靠性。
因此，实有必要提供一种新的导电件解决上述技术问题。
 技术解决方案
本实用新型的目的在于提供一种弯折可靠性高的导电件。
为了达到上述目的，本实用新型提供一种导电件，其包括用于导电的线路层，所述线路层包括本体、设有焊盘的延伸部以及连接所述本体与所述延伸部的连接部；所述连接部设有贯穿其上的减力孔，所述减力孔所在的位置为所述连接部的弯折区域，所述连接部可沿所述弯折区域弯折以使所述焊盘与外部设备连接。
优选的，所述连接部包括分别连接于所述本体且相互间隔设置的第一连接部和第二连接部，所述延伸部包括相互间隔设置的第一延伸部和第二延伸部，所述第一延伸部连接于所述第一连接部远离所述本体一侧，所述第二延伸部连接于所述第二连接部远离所述本体一侧；所述减力孔贯穿所述第一连接部和/或所述第二连接部设置。
优选的，所述减力孔包括贯穿所述第一连接部设置的第一减力孔以及贯穿所述第二连接部设置的第二减力孔，所述第一连接部可沿所述第一减力孔所在的位置弯折，所述第二连接部可沿所述第二减力孔所在的位置弯折。
优选的，所述第一减力孔包括两个且相互间隔设置；所述第二减力孔包括两个且相互间隔设置。
优选的，所述导电件包括包覆于所述线路层外表面的防焊层，所述延伸部设置所述焊盘的一侧外露于所述防焊层，用以与外部形成电信号连接。优选的，所述导电件为柔性线路板。
 有益效果
与相关技术相比，本实用新型的导电件中，所述连接部设有贯穿其上的减力孔，所述减力孔所在的位置为所述连接部的弯折区域，所述连接部可沿所述弯折区域弯折以使所述焊盘与外部设备连接；上述结构中，通过在所述弯折区域内设置所述减力孔，能够有效地降低导电件的弯折区域的应力，避免了连接部在弯折后发生反弹或起翘的现象，提高所述导电件的弯折可靠性。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型导电件的结构示意图。
 本发明的实施方式
在此处键入本发明的实施方式描述段落。
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请参阅图1所示，本实用新型提供一种导电件100，其包括用于导电的线路层1、包覆于所述线路层1外表面的防焊层2以及设置于所述线路层1的焊盘（图未标）。
值得一体的是，所述导电件100的结构形式是不限的，其可以根据实际情况进行设置，比如，在本实施方式中，所述导电件100为柔性线路板。
在本实施方式中，所述线路层1包括本体11、连接部（图未标）以及延伸部（图未标）；所述连接部12分别连接所述本体11与所述延伸部12，所述延伸部设有所述焊盘，用以与外界形成电信号连接。
连接部包括分别连接于所述本体11且相互间隔设置的第一连接部12和第二连接部13，所述延伸部包括相互间隔设置的第一延伸部14和第二延伸部15，所述第一延伸部14连接于所述第一连接部12远离所述本体11一侧，所述第二延伸部15连接于所述第二连接部13远离所述本体11一侧。
所述第一延伸部14和所述第二延伸部15分别外露于所述防焊层2，用以与外部设备形成电信号连接；进一步的，为了更好地保证所述线路板1与外界电连接的可靠性，所述焊盘包括相互间隔设置的第一焊盘31和第二焊盘32，所述第一焊盘31贴合于所述第一延伸部14用以将所述第一延伸部14与外界形成电信号连接，所述第二焊盘32贴合于所述第二延伸部15用以将所述第二延伸部15与外部设备形成电信号连接。
在实际应用中，往往需要将导电件贴合于电子元器件的壳体，此时，需要将所述第一连接部12和/或所述第二连接部13进行弯折，而在本实施方式中，所述第一连接部12沿第一弯折轴线X进行弯折折叠，所述第二连接部13沿第二弯折轴线Y进行弯折折叠。
在此，为了保证弯折后的可靠性，在弯折的位置设置用以降低弯折应力的减力孔（图未标），即在所述第一连接部12和/或所述第二连接部13设有贯穿其上的所述减力孔，所述减力孔所在的位置作为所述连接部的弯折区域，折弯轴线位于该弯折区域内，在使用过程中，所述连接部可沿所述弯折区域内的弯折轴线弯折以使所述焊盘与外部设备连接。需要说明的是，所述减力孔的具***置及其数量的设置是不限的，其可以根据导电件在实际应用中的弯折需要而进行具体的设置。比如，在本实施方式中，由于所述第一连接部12和所述第二连接部13均需要弯折，所述减力孔包括两组且相互间隔设置，其中一组所述减力孔贯穿所述第一连接部12设置，另一组所述减力孔贯穿所述第二连接部13设置。
更具体的，所述第一连接部12设有贯穿其上的第一减力孔120，所述第一减力孔120即为所述第一连接部12的弯折区域，而所述第一弯折轴线X位于所述第一减力孔120的范围内，所述第一减力孔120包括两个且分别沿所述第一弯折轴线X相互间隔设置，两个所述第一减力孔120的几何中心轴线与所述第一弯折轴线X重合，当第一连接部12需要弯折时，则沿所述第一弯折轴线X将所述第一连接部12弯折时，所述第一减力孔120能够有效地降低所述第一连接部12的弯折区域的应力，避免了所述本体11在贴合后发生反弹或起翘的现象；所述第二连接部13设有贯穿其上的第二减力孔130，所述第二减力孔130即为所述第二连接部13的弯折区域，而所述第二弯折轴线Y位于所述第二减力孔130的范围内，所述第二减力孔130包括两个且分别沿所述第二弯折轴线Y相互间隔设置，两个所述第二减力孔130的几何中心轴线与所述第二弯折轴线Y重合，当第二连接部13需要弯折时，则沿所述第二弯折轴线Y将所述第二连接部13弯折时，所述第二减力孔130能够有效地降低所述第二连接部13的弯折区域的应力，避免了所述第二连接部12在贴合后发生反弹或起翘的现象。
综上所述，上述结构中，通过所述第一减力孔120和所述第二减力孔130的设置，有效地降低导电件100的弯折区域的应力，避免了连接部在弯折后发生反弹或起翘的现象，从而使得所述导电件100的弯折可靠性高。
在本实施方式中，所述防焊层2包覆于所述本体11、所述第一连接部12和所述第二连接部13的外表面。
具体的，所述防焊层2包括防焊层主体21，所述防焊层主体21分别包覆所述本体11、所述第一连接部12和所述第二连接部13，且所述防焊层主体21完全覆盖所述减力孔。
更进一步的，所述防焊层21还包括由所述防焊层主体21凸出延伸第一部22以及由所述防焊层主体21凸出延伸的第二部23；所述第一部22用以包覆所述第一延伸部14远离所述第一焊盘21的一端；所述第二部23用以包覆所述第二延伸部15远离所述第二焊盘22的一端。
与相关技术相比，本实用新型的导电件中，所述连接部设有贯穿其上的减力孔，所述减力孔所在的位置为所述连接部的弯折区域，所述连接部可沿所述弯折区域弯折以使所述焊盘与外部设备连接；上述结构中，通过在所述弯折区域内设置所述减力孔，能够有效地降低导电件的弯折区域的应力，避免了连接部在弯折后发生反弹或起翘的现象，提高所述导电件的弯折可靠性。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (6)

  1. 一种导电件，其包括用于导电的线路层，所述线路层包括本体、设有焊盘的延伸部以及连接所述本体与所述延伸部的连接部，其特征在于，所述连接部设有贯穿其上的减力孔，所述减力孔所在的位置为所述连接部的弯折区域，所述连接部可沿所述弯折区域弯折以使所述焊盘与外部设备连接。
  2. 根据权利要求1所述的导电件，其特征在于，所述连接部包括分别连接于所述本体且相互间隔设置的第一连接部和第二连接部，所述延伸部包括相互间隔设置的第一延伸部和第二延伸部，所述第一延伸部连接于所述第一连接部远离所述本体一侧，所述第二延伸部连接于所述第二连接部远离所述本体一侧；所述减力孔贯穿所述第一连接部和/或所述第二连接部设置。
  3. 根据权利要求2所述的导电件，其特征在于，所述减力孔包括贯穿所述第一连接部设置的第一减力孔以及贯穿所述第二连接部设置的第二减力孔，所述第一连接部沿所述第一减力孔所在的位置弯折，所述第二连接部沿所述第二减力孔所在的位置弯折。
  4. 根据权利要求3所述的导电件，其特征在于，所述第一减力孔包括两个且相互间隔设置；所述第二减力孔包括两个且相互间隔设置。
  5. 根据权利要求1所述的导电件，其特征在于，所述导电件包括包覆于所述线路层外表面的防焊层，所述延伸部设置所述焊盘的一侧外露于所述防焊层，用以与外部形成电信号连接。
  6. 根据权利要求1-5任一项所述的导电件，其特征在于，所述导电件为柔性线路板。
PCT/CN2019/130337 2019-12-31 2019-12-31 导电件 WO2021134405A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/130337 WO2021134405A1 (zh) 2019-12-31 2019-12-31 导电件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/130337 WO2021134405A1 (zh) 2019-12-31 2019-12-31 导电件

Publications (1)

Publication Number Publication Date
WO2021134405A1 true WO2021134405A1 (zh) 2021-07-08

Family

ID=76685845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/130337 WO2021134405A1 (zh) 2019-12-31 2019-12-31 导电件

Country Status (1)

Country Link
WO (1) WO2021134405A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356568A (ja) * 2003-05-30 2004-12-16 Optrex Corp フレキシブル回路基板
CN2817292Y (zh) * 2005-07-25 2006-09-13 胜华科技股份有限公司 软性印刷电路板
CN204887669U (zh) * 2015-05-26 2015-12-16 深圳市信义隆通讯技术有限公司 柔性电路板
CN105430895A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 移动终端、柔性电路板及其制造方法
CN109257871A (zh) * 2015-12-29 2019-01-22 广东欧珀移动通信有限公司 柔性线路板及移动终端

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356568A (ja) * 2003-05-30 2004-12-16 Optrex Corp フレキシブル回路基板
CN2817292Y (zh) * 2005-07-25 2006-09-13 胜华科技股份有限公司 软性印刷电路板
CN204887669U (zh) * 2015-05-26 2015-12-16 深圳市信义隆通讯技术有限公司 柔性电路板
CN105430895A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 移动终端、柔性电路板及其制造方法
CN109257871A (zh) * 2015-12-29 2019-01-22 广东欧珀移动通信有限公司 柔性线路板及移动终端

Similar Documents

Publication Publication Date Title
TW202036996A (zh) 導電端子
CN210379235U (zh) 电池和穿戴式电子设备
TW201601602A (zh) 軟性電路板的溢膠導流結構
CN201585196U (zh) 柔性印刷电路板及采用该印刷电路板的连接构造
WO2021134405A1 (zh) 导电件
CN105491789A (zh) 柔性印刷电路板
US9510462B2 (en) Method for fabricating circuit board structure
CN211744842U (zh) 导电件
CN107113962B (zh) 电子控制装置
TWM614553U (zh) 連接器總成及其線端連接器與板端連接器
TW201436582A (zh) 揚聲器及具有該揚聲器的電子裝置
CN210202167U (zh) 一种柔性线路板接地结构
CN111244644B (zh) 一种弹片及电子设备
TWM586888U (zh) 電連接器
CN2932725Y (zh) 电连接器
TWI797049B (zh) 軟性電路基板之線路結構
CN103957657B (zh) 柔性线路板及具有所述柔性线路板的光模块
CN114078943B (zh) 显示模组及显示装置
CN217037543U (zh) 一种过孔多层柔性线路板
US20240098895A1 (en) Bond pad connector for securing an electronic component thereon
WO2021134402A1 (zh) 导电连接件
CN209693144U (zh) 一种抗弯折的柔性电路板
JP2017121039A (ja) アンテナ組立体
TWI389606B (zh) 具有接地結構之電路板
CN204466034U (zh) 布线基材

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19958180

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19958180

Country of ref document: EP

Kind code of ref document: A1