WO2021129093A1 - 显示面板及其制备方法、显示装置 - Google Patents
显示面板及其制备方法、显示装置 Download PDFInfo
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- WO2021129093A1 WO2021129093A1 PCT/CN2020/122800 CN2020122800W WO2021129093A1 WO 2021129093 A1 WO2021129093 A1 WO 2021129093A1 CN 2020122800 W CN2020122800 W CN 2020122800W WO 2021129093 A1 WO2021129093 A1 WO 2021129093A1
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- Prior art keywords
- layer
- display device
- display
- encapsulation
- touch
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims description 77
- 239000002184 metal Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Definitions
- This application relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device.
- the touch screen mainly uses an external touch module, but the external touch module not only increases the thickness and process difficulty of the display, but also integrates the touch chip and the display driver chip on one chip, although it can reduce the entire display
- the thickness of the screen and the difficulty of the process but it will bring about the problem of the display screen's relatively wide frame, which cannot adapt to the development of narrow frame or even full-screen technology. Therefore, the touch display screen in the prior art cannot achieve small thickness, simple process, narrow frame or even full screen at the same time.
- the embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device, which solve the technical problems in the prior art that the touch display screen cannot achieve small thickness, simple process, narrow frame or even full screen at the same time.
- an embodiment of the present application provides a display panel, including: a substrate; a display device layer provided on one side of the substrate; and a package provided on the side of the display device layer away from the substrate And a touch layer disposed on the side of the encapsulation layer away from the display device layer, the display device layer and the touch layer are bonded by a bonding structure; a through hole is provided in the encapsulation layer , The bonding structure is located in the through hole.
- the touch layer includes: a first insulating layer disposed on a side of the packaging layer away from the display device layer; and a first insulating layer disposed on the first insulating layer away from the display device layer.
- the bonding structure includes: a first pin provided on the side of the first metal layer close to the display device layer; and a second pin provided on the side of the display device layer away from the substrate Pin.
- the display panel further includes: a cover layer disposed on a side of the touch layer away from the encapsulation layer.
- the encapsulation layer includes: a first encapsulation layer and a second encapsulation layer arranged on a side of the display device layer away from the substrate and arranged in a direction along the middle of the substrate toward the edge of the substrate. Two encapsulation layers; wherein the second encapsulation layer is arranged around the touch layer.
- the second encapsulation layer is in contact with the surface of the cover layer close to the display screen body.
- the through hole is located in the first packaging layer.
- the first surface of the through hole is in contact with the first encapsulation layer
- the second surface of the through hole is in contact with the second encapsulation layer
- the first surface is in contact with the The second side is the opposite side.
- an embodiment of the present application provides a display device, including: a display panel; a chip integrated with a display driver chip and a touch control chip; and a circuit board, one end of the circuit board is connected to the display Panel bonding, the chip is bonded to the circuit board; the structure of the display panel adopts the structure of the display panel described above.
- an embodiment of the present application provides a method for manufacturing a display panel, including: preparing or preparing a substrate; forming a display device layer on one side of the substrate; Depositing encapsulation glue on one side of the substrate, and there is a gap between two adjacent encapsulation glues; preparing or preparing a touch layer; aligning and bonding the touch layer and the display device layer to form a bonding structure, so The bonding structure is located in the gap; and the packaging glue is cured to form an packaging layer.
- the aligning and bonding the touch layer and the display device layer includes: aligning and bonding the touch layer and the display device layer by ultrasonic waves.
- the touch chip and the display driver chip are integrated on one chip, and the contact position of the touch layer and the display screen body is overlapped with the packaging area of the display screen body, which can reduce the number of display panels.
- the thickness of the display also greatly reduces the width of the frame of the display body, that is, a small thickness and a narrow frame can be achieved at the same time.
- FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
- FIG. 2 is a schematic structural diagram of a display panel provided by another embodiment of this application.
- FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the application.
- FIG. 4 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the application.
- the touch screen cannot simultaneously achieve the technical problems of small thickness, simple process, narrow bezel or even full screen.
- the touch screen mainly uses an external touch module, but the external touch module not only increases the thickness and process difficulty of the display, so the touch chip and the display driver chip are integrated on one chip, although it can reduce the entire display The thickness of the screen and the difficulty of the process, but will bring about the problem of relatively wide frame of the display screen.
- the present application provides a display panel.
- the touch control chip and the display driving chip are integrated on one chip, and the contact position of the touch layer and the display screen body is overlapped with the packaging area of the display screen body, greatly Reduce the frame width of the display body.
- a display panel provided by the present application includes a substrate; a display device layer provided on one side of the substrate; an encapsulation layer provided on a side of the display device layer away from the substrate; and
- the touch layer disposed on the side of the encapsulation layer away from the display device layer, the display device layer and the touch layer are bonded by a bonding structure; wherein a through hole is provided in the encapsulation layer, The bonding structure is located in the through hole.
- FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
- the display panel includes a substrate 1, a display device layer disposed on the side of the substrate 1, an encapsulation layer 3 disposed on the side of the display device layer 2 away from the substrate 1, and an encapsulation layer 3 disposed away from the display device layer.
- the display device layer 2 and the touch control layer 4 are bonded through the bonding structure 5.
- a through hole 31 is provided in the packaging layer, and the bonding structure 5 is located in the through hole 31.
- the touch chip and the display driver chip are integrated on one chip, and the contact position of the touch layer 4 with the display body is overlapped with the packaging area of the display body, which can reduce the display
- the thickness of the panel also greatly reduces the frame width of the display body, that is, a small thickness and a narrow frame can be achieved at the same time.
- the bonding structure 5 is arranged in the through hole of the packaging layer, and there is no need to reserve bonding space at the edge of the display screen body, thereby reducing the width of the display screen body frame.
- the display device layer 2 includes a multilayer structure of an anode layer, a light-emitting layer, and a cathode layer that are sequentially stacked along the display light-emitting direction.
- the light-emitting layer includes a plurality of sub-pixels for displaying light emission, and two adjacent sub-pixels are separated from each other by a pixel interval area (a pixel interval area, that is, a defining layer of a pixel).
- the display device layer 2 is divided into a display area and a non-display area surrounding the display area, and all sub-pixels are located in the display area. Since the encapsulation area is an area that needs to encapsulate all the display area of the display body.
- the contact position of the touch layer 4 and the display screen body coincides with the packaging area of the display screen body, indicating that the projection of the touch layer 4 on the substrate 1 covers the display area.
- the substrate 1, the touch layer 4, and the encapsulation layer 3 cooperate with each other, so that the display area of the display device layer 2 is completely sealed to prevent water and oxygen from invading the sub-pixels. Since the touch layer 4 not only plays a touch function, but also cooperates with the encapsulation layer 3 to act as a part of the encapsulation structure, blocking water and oxygen from entering the display area from the cover plate, which is similar to the encapsulation structure and touch control in the display panel in the prior art. Compared with the structure, the thickness is reduced. Thus, a small thickness and a narrow bezel can be achieved at the same time.
- each sub-pixel may be, for example, a hole injection layer (HIL), a hole transport layer (HTL), an organic material light emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) that are sequentially stacked. Active electrons in the cathode layer and holes generated in the anode layer are recombined in the light-emitting layer to excite the organic light-emitting material in the organic material light-emitting layer to emit light.
- HIL hole injection layer
- HTL hole transport layer
- EML organic material light emitting layer
- ETL electron transport layer
- EIL electron injection layer
- the encapsulation layer 3 includes a first encapsulation layer 32 and a second encapsulation layer 33 that are sequentially arranged along the direction in which the middle of the substrate points to the edge of the substrate.
- the first packaging layer 32 is arranged on the surface of the display device layer 2 away from the substrate 1.
- the second encapsulation layer 33 is also disposed on the surface of the display device layer 2 away from the substrate 1, and the second encapsulation layer 33 is disposed around the touch layer 4, wherein the through holes 31 are disposed in the first encapsulation layer 32, and the structure is bonded. 5 is provided in the through hole 31.
- the encapsulation layer 3 in the embodiment of the present application includes a second encapsulation layer 33, and the second encapsulation layer 33 is disposed around the touch layer 4.
- the second encapsulation layer 33 arranged around the touch layer 4 can prevent water and oxygen in the external environment from invading into the touch layer 4, reduce the probability of the electrodes in the touch layer 4 being corroded by water and oxygen, and reduce the touch layer 4 The probability of damage to the electrodes in the battery improves the life of the display panel. For the display panel in FIG.
- the first encapsulation layer 32 is in contact with the display device layer 2 and the touch layer 4 at the same time, the first encapsulation layer 31 is provided with a through hole, and the through hole 31 is provided with a bonding structure 5, and a bonding structure 5
- the display device layer 2 and the touch control layer 4 are electrically connected.
- the second encapsulation layer is in contact with the sides of the display device layer 2, the cover 6 and the touch layer 4.
- the touch layer 4 blocks the water and oxygen entering the display area from the direction of the cover 6, and the encapsulation layer 3 and the non-display area block the access from the side
- the water and oxygen in the display area make the water and oxygen around the display area unable to invade.
- the encapsulation layer 3 is arranged around the touch layer 4, which reduces the probability of the electrodes in the touch layer 4 being corroded by water and oxygen.
- the touch control layer 4 includes: a first insulating layer 41 disposed on the side of the first encapsulation layer 32 away from the display device layer 2; and a first insulating layer 41 disposed on the side of the first insulating layer 41 away from the display device layer 2.
- the bonding structure 5 includes: a first pin 51 arranged on the side of the first metal layer 42 close to the display device layer 2; and a second pin 52 arranged on the side of the display device layer 2 away from the substrate 1.
- the electrical connection between the first pin 51 and the second pin 52 realizes the electrical connection between the touch layer 4 and the display device layer 2, and realizes display control and touch control through the electrical connection between the display device layer 2 and the chip. .
- first pin 51 and the first metal layer 42 may be integrally prepared.
- One-piece molding preparation saves process steps and improves electrical connection reliability.
- the touch chip and the display driver chip are integrated on one chip, and the contact position of the touch layer and the display body is overlapped with the packaging area of the display body, which can reduce the display panel
- the thickness of the display also greatly reduces the width of the frame of the display body, that is, a small thickness and a narrow frame can be achieved at the same time.
- the through hole 31 is provided in the first encapsulation layer 32. And the first side of the through hole 31 is in contact with the first encapsulation layer 32, the second side of the through hole 31 is in contact with the second encapsulation layer 33, the first side and the second side are opposite sides, and the bonding structure 5 is arranged in the through hole 31 Inside. That is, there is a gap between the first package 32 and the second package layer 33, and the gap serves as the through hole 31.
- the bonding structure 5 is disposed between the first encapsulation layer 32 and the second encapsulation layer 33.
- the first encapsulation layer 32 and the second encapsulation layer 33 are directly deposited separately, and there is a gap between the first encapsulation layer 32 and the second encapsulation layer 33, which reduces the process complexity .
- the display panel further includes: a cover layer 6 disposed on the side of the touch layer 4 away from the encapsulation layer 3.
- the packaging layer 3 includes a first packaging layer 32 and a second packaging layer 33.
- the first packaging layer 32 is arranged on the surface of the display device layer 2 away from the substrate 1.
- the second encapsulation layer 33 is also disposed on the surface of the display device layer 2 away from the substrate 1, and the second encapsulation layer 33 is disposed around the touch layer 4, and the second encapsulation layer 33 and the cover layer 6 are close to the touch layer 4
- the second encapsulation layer 33 of the encapsulation layer in the embodiment of the present application is in contact with a surface of the cover layer 6 close to the touch layer 4, which can further protect the water and oxygen in the external environment from intruding into the touch layer 4. The probability of damage to the electrodes in the touch layer 4 is reduced.
- the difference between the thickness of the second encapsulation layer 33 and the thickness of the first encapsulation layer 32 is greater than or equal to the thickness of the touch layer 4.
- FIG. 3 is a schematic structural diagram of a display device provided by an embodiment of the application.
- the display device includes a display panel; a chip 8 integrated with a display driver chip and a touch chip; and a circuit board 7 , One end of the circuit board 7 is bonded to the display panel, and the chip 8 is bonded to the circuit board 7.
- the structure of the display panel adopts the structure of the display panel described above.
- the driving display chip and the touch control chip are integrated on the same chip, and the contact position of the touch layer and the display body is overlapped with the packaging area of the display body, thereby reducing the entire display
- the thickness of the device also greatly reduces the frame width of the display screen.
- FIG. 4 shows a manufacturing method of the display panel provided by an embodiment of the application. As shown in FIG. 4, the manufacturing method of the display panel includes:
- Step S101 preparing or preparing a substrate
- Step S102 forming a display device layer on one side of the substrate
- Step S103 deposit packaging glue on the side of the display device layer away from the substrate, and there is a gap between two adjacent packaging glues;
- Step S104 preparing or preparing a touch layer
- Step S105 aligning and bonding the touch layer and the display device layer to form a bonding structure, and the bonding structure is located in the gap;
- Step S106 curing the encapsulation glue to form an encapsulation layer.
- the touch chip and the actual driving chip are integrated on one chip, and the contact position of the touch layer and the display body is overlapped with the packaging area of the display body, which reduces the entire display panel.
- the thickness of the display also greatly reduces the frame width of the display body.
- the alignment and bonding of the touch layer and the display device layer includes: using ultrasonic waves to align and bond the touch layer and the display device layer.
- the embodiment of the application adopts the ultrasonic technology to award the touch layer and the display device layer to bond, which avoids the impact on the packaging layer when other bonding technologies are used.
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Abstract
Description
Claims (11)
- 一种显示面板,其中,包括:基板;设置在所述基板一侧的显示器件层;设置在所述显示器件层远离所述基板一侧的封装层;以及设置在所述封装层远离所述显示器件层一侧的触控层,所述显示器件层与所述触控层通过邦定结构实现邦定;所述封装层设置有通孔,所述邦定结构位于所述通孔内。
- 根据权利要求1所述的显示面板,其中,所述触控层包括:设置在所述封装层远离所述显示器件层一侧的第一绝缘层;设置在所述第一绝缘层远离所述显示器件层一侧的第一金属层;设置在所述第一金属层远离所述第一绝缘层一侧的第二绝缘层;以及设置在所述第二绝缘层远离所述第一金属层一侧的第二金属层;其中,所述邦定结构包括:设置在所述第一金属层靠近所述显示器件层一侧的第一引脚;以及设置在显示器件层远离所述基板一侧的第二引脚。
- 根据权利要求1所述的显示面板,其中,进一步包括:设置在所述触控层远离所述封装层一侧的盖板层。
- 根据权利要求3所述的显示面板,其中,所述封装层包括:设置在所述显示器件层远离所述基板的一侧且沿所述基板中部指向所述基板边缘的方向依次排列的第一封装层以及第二封装层;其中所述第二封装层设置在所述触控层的周围。
- 根据权利要求4所述的显示装置,其中,所述第二封装层与所述盖板层靠近所述显示屏体的表面接触。
- 根据权利要求4所述的显示装置,其中,所述通孔位于所述第一封装层中。
- 根据权利要求4所述的显示装置,其中,所述通孔的第一面与所述第一封装层接触,所述通孔的第二面与所述第二封装层接触,所述第一面与所述第二面为对立面。
- 根据权利要求7所述的显示装置,所述第二封装层的厚度与所述第一封装层的厚度之差大于或等于所述触控层的厚度。
- 一种显示装置,其中,包括:显示面板;芯片,集成有显示驱动芯片以及触控芯片;以及线路板,所述线路板的一端与所述显示面板邦定,所述芯片邦定于所述线路板;所述显示面板的结构采用如权利要求1-7中任一权利要求所述的显示面板的结构。
- 一种显示面板的制备方法,其中,包括:准备或者制备一基板;在所述基板的一侧形成显示器件层;在所述显示器件层远离所述基板一侧沉积封装胶,相邻两处封装胶之间存在间隙;准备或者制备一触控层;将所述触控层与所述显示器件层对位邦定,形成邦定结构,所述邦定结构位于所述间隙内;以及对所述封装胶进行固化形成封装层。
- 根据权利要求9所述的制备方法,其中,所述将所述触控层与所述显示器件层对位邦定包括:采用超声波将所述触控层与所述显示器件层对位邦定。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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EP20905236.4A EP4009310A4 (en) | 2019-12-24 | 2020-10-22 | DISPLAY PANEL AND METHOD OF MANUFACTURE THEREOF, AND DISPLAY DEVICE |
JP2022511397A JP7292499B2 (ja) | 2019-12-24 | 2020-10-22 | 表示パネル及びその製造方法、並びに表示装置 |
KR1020227005155A KR20220027261A (ko) | 2019-12-24 | 2020-10-22 | 디스플레이 패널, 그 제조방법 및 디스플레이 장치 |
US17/545,462 US11825681B2 (en) | 2019-12-24 | 2021-12-08 | Display panel and display device |
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CN201911350603.3A CN111128022B (zh) | 2019-12-24 | 2019-12-24 | 一种显示面板及其制备方法、显示装置 |
CN201911350603.3 | 2019-12-24 |
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US17/545,462 Continuation US11825681B2 (en) | 2019-12-24 | 2021-12-08 | Display panel and display device |
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WO2021129093A1 true WO2021129093A1 (zh) | 2021-07-01 |
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PCT/CN2020/122800 WO2021129093A1 (zh) | 2019-12-24 | 2020-10-22 | 显示面板及其制备方法、显示装置 |
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US (1) | US11825681B2 (zh) |
EP (1) | EP4009310A4 (zh) |
JP (1) | JP7292499B2 (zh) |
KR (1) | KR20220027261A (zh) |
CN (1) | CN111128022B (zh) |
WO (1) | WO2021129093A1 (zh) |
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CN210836905U (zh) * | 2019-12-23 | 2020-06-23 | 霸州市云谷电子科技有限公司 | 一种柔性显示面板和曲面显示屏 |
CN111128022B (zh) * | 2019-12-24 | 2021-04-23 | 云谷(固安)科技有限公司 | 一种显示面板及其制备方法、显示装置 |
CN113410413B (zh) * | 2021-06-18 | 2024-04-19 | 北京京东方技术开发有限公司 | 柔性拼接模组、显示装置及其制备方法 |
CN114203746A (zh) * | 2021-12-02 | 2022-03-18 | Tcl华星光电技术有限公司 | 显示面板、显示面板的制备方法以及显示装置 |
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EP4009310A4 (en) | 2022-10-19 |
EP4009310A1 (en) | 2022-06-08 |
KR20220027261A (ko) | 2022-03-07 |
US11825681B2 (en) | 2023-11-21 |
CN111128022B (zh) | 2021-04-23 |
JP7292499B2 (ja) | 2023-06-16 |
CN111128022A (zh) | 2020-05-08 |
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