WO2021120840A1 - 一种x-光高吸收率探测***及图像成像方法 - Google Patents

一种x-光高吸收率探测***及图像成像方法 Download PDF

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WO2021120840A1
WO2021120840A1 PCT/CN2020/123190 CN2020123190W WO2021120840A1 WO 2021120840 A1 WO2021120840 A1 WO 2021120840A1 CN 2020123190 W CN2020123190 W CN 2020123190W WO 2021120840 A1 WO2021120840 A1 WO 2021120840A1
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light sensor
visible light
image
ray
detection system
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PCT/CN2020/123190
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English (en)
French (fr)
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徐永
刘建强
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江苏康众数字医疗科技股份有限公司
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Priority to US17/786,995 priority Critical patent/US12038543B2/en
Publication of WO2021120840A1 publication Critical patent/WO2021120840A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20186—Position of the photodiode with respect to the incoming radiation, e.g. in the front of, below or sideways the scintillator
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/043—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2012—Measuring radiation intensity with scintillation detectors using stimulable phosphors, e.g. stimulable phosphor sheets
    • G01T1/2016—Erasing of stimulable sheets, e.g. with light, heat or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20184—Detector read-out circuitry, e.g. for clearing of traps, compensating for traps or compensating for direct hits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20187—Position of the scintillator with respect to the photodiode, e.g. photodiode surrounding the crystal, the crystal surrounding the photodiode, shape or size of the scintillator
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling

Definitions

  • the invention relates to the imaging field of X-ray detectors, in particular to an X-ray high absorptance detection system and an image imaging method.
  • the absorption efficiency of X-ray in the imaging system of the X-ray flat panel detection system plays a decisive role in the quality of imaging. Whether it is possible to obtain images that meet the application requirements and quality at low doses is to judge X-ray imaging
  • the basis of the system technology is also the direction that has been studied recently in the field of X-ray imaging.
  • the existing X-ray flat panel detection system has low sensitivity and low X-ray absorption rate.
  • the present invention provides an X-ray high absorptance detection system and an image imaging method to achieve high-efficiency X-ray absorption.
  • the technical solution is as follows:
  • the present invention provides an X-ray high absorptance detection system, which includes a light source, a fluorescent layer, a first visible light sensor arranged on the upper surface of the fluorescent layer, a second visible light sensor arranged on the lower surface of the fluorescent layer, and A first image acquisition device connected to the first visible light sensor, a second image acquisition device connected to the second visible light sensor, and a processor electrically connected to both the first image acquisition device and the second image acquisition device,
  • the light source is used to emit X-rays in the direction of the fluorescent layer.
  • the X-rays pass through the first visible light sensor and reach the fluorescent layer.
  • the fluorescent layer includes an X-ray-to-visible-light material. -Generating a first visible photon moving to the first visible light sensor and a second visible photon moving to the second visible light sensor under photon excitation;
  • the first image acquisition device is used for obtaining a first image signal based on the first visible photon signal collected by the first visible light sensor; the second image acquisition device is used for obtaining a second visible light based on the second visible light sensor collected by the second visible light sensor The sub-signal obtains the second image signal; the processor is used to add the first image signal and the second image signal to obtain the X-ray image signal.
  • the X-ray to visible light conversion material is CsI, PbF 2 crystal, NaBi(WO 4 ) 2 crystal, NaI:Tl crystal or CsI:Tl crystal.
  • the side of the fluorescent layer is provided with an encapsulation layer, the upper part of the encapsulation layer is against the lower surface of the first visible light sensor, and the lower part of the encapsulation layer is against the upper surface of the second visible light sensor, so
  • the encapsulation layer includes X fluorescence encapsulation material.
  • the material of the packaging material is aluminum film and hot melt adhesive.
  • the X-ray high absorptance detection system further includes a display component connected to the processor.
  • the processor includes an addition operation module and a data conversion module, and the addition operation module is used for the first image signal and the second image signal to perform the addition operation of the photosensitive charges to obtain the X-ray image, and output the X-ray image.
  • the electrical signal of the optical image; the data conversion module is used to convert the electrical signal into a data format that can be displayed by the display component.
  • first visible light sensor and the second visible light sensor are both sheet-like structures; the first visible light sensor matches the shape of the upper surface of the fluorescent layer, and the second visible light sensor matches the shape of the lower surface of the fluorescent layer. match.
  • the present invention also provides an image imaging method of the X-ray high absorptance detection system, which includes the following steps:
  • step S4 Perform an image addition operation on the first image signal and the second image signal in step S3 by using a processor to synthesize an X-ray image signal.
  • the first light sensor is a first visible light sensor
  • the second light sensor is a second visible light sensor
  • the first visible light sensor is arranged on the upper surface of the fluorescent layer
  • the second The visible light sensor is arranged on the lower surface of the fluorescent layer, and the X-ray reaches the fluorescent layer after passing through the first visible light sensor.
  • the first image signal includes the number of photosensitive charges at each pixel position
  • the second image signal includes the number of photosensitive charges at each pixel position
  • the image addition operation includes an addition operation of the number of photosensitive charges
  • the image imaging method of the X-ray high absorptance detection system is executed by the X-ray high absorptance detection system.
  • the X-ray high absorptance detection system provided by the present invention can increase the absorption of X-rays, increase the sensitivity of the detection system, and at the same time increase the quantum detection efficiency of the detection system, thereby reducing the clinical X-ray dosage;
  • the image imaging method of the X-ray high absorptance detection system provided by the present invention can obtain the X-ray image signal for diagnosis through addition operation, and realize the high-efficiency absorption of X-ray.
  • Fig. 1 is a schematic structural diagram of an X-ray high absorptance detection system provided by an embodiment of the present invention
  • Fig. 2 is a schematic flowchart of an image imaging method of an X-ray high absorptance detection system provided by an embodiment of the present invention.
  • the reference signs include: 1-light source, 2-fluorescent layer, 3-first visible light sensor, 4-second visible light sensor, 5-first image acquisition device, 6-second image acquisition device, 7-processor , 8-encapsulation layer.
  • the present invention provides an X-ray high absorptance detection system, see FIG. 1, which includes a light source 1, a fluorescent layer 2, a first visible light sensor 3 arranged on the upper surface of the fluorescent layer 2, and a first visible light sensor 3 arranged on the fluorescent layer 2.
  • the second visible light sensor 4 on the lower surface, the first image acquisition device 5 connected to the first visible light sensor 3, the second image acquisition device 6 connected to the second visible light sensor 4, and the first image acquisition device
  • the device 5 and the second image acquisition device 6 are both electrically connected to the processor 7.
  • the light source 1 is used to emit X-rays in the direction of the fluorescent layer 2, and the X-rays pass through the first visible light sensor 3.
  • the fluorescent layer 2 includes X-ray to visible light material
  • the X-ray to visible light material is CsI (cesium iodide) or other scintillators (such as PbF 2 crystal, NaBi (WO 4 ) 2 crystal, NaI :Tl crystal or CsI:Tl crystal)
  • scintillator is a kind of material that can emit light after absorbing high-energy particles or rays.
  • X-ray to visible light materials can be directly purchased on the market.
  • the X-ray to visible light materials are available in X-
  • the first visible photon moving to the first visible light sensor 3 and the second visible photon moving to the second visible light sensor 4 are generated under photon excitation.
  • the moving directions of the first visible photon and the second visible photon are shown in FIG. 1 In the direction indicated by the arrow in the middle fluorescent layer 2, the first visible photons are absorbed by the first visible light sensor 3, and the second visible photons are absorbed by the second visible light sensor 4, so that all visible photons are absorbed, which greatly improves X-rays.
  • the absorption efficiency is the absorption efficiency.
  • the first image acquisition device 5 is used to obtain a first image signal based on the first visible photon signal collected by the first visible light sensor 3, and the second image acquisition device 6 is used to acquire a first image signal based on the second visible light sensor 4
  • the second visible photon signal obtained from the second image signal is used to obtain the second image signal, and the processor 7 is used to add the first image signal and the second image signal to obtain the X-ray image signal for diagnosis.
  • the X-ray high absorptance detection system further includes a display component connected to the processor 7.
  • the processor 7 includes an addition operation module and a data conversion module.
  • the addition operation module is used for the first image signal and the second image signal to perform the addition operation of the photosensitive charges to obtain an X-ray image, and output the X-ray image
  • the electrical signal; the data conversion module is used to convert the electrical signal into a data format that the display component can display.
  • An encapsulation layer 8 is provided on the side of the fluorescent layer 2, and the encapsulation layer 8 is arranged between the first visible light sensor 3 and the second visible light sensor 4, and the encapsulation layer 8 is used to cover the fluorescent layer.
  • the upper part of the packaging layer 8 is against the lower surface of the first visible light sensor 3, and the lower part of the packaging layer 8 is against the upper surface of the second visible light sensor 4.
  • the packaging layer 8 includes X fluorescent packaging materials, which are made of aluminum film and hot melt glue, and the packaging materials can be directly purchased on the market. Specifically, the aluminum film of the packaging layer 8 is packaged by hot melt adhesive and installed between the first visible light sensor 3 and the second visible light sensor 4 to form the side of the X-ray high absorptance detection system. wall.
  • the first visible light sensor 3 and the second visible light sensor 4 are both sheet-like structures.
  • the shape and size of the first visible light sensor 3 and the second visible light sensor 4 are the same;
  • the shape of the upper surface of the layer 2 matches, and the shape of the second visible light sensor 4 matches the shape of the lower surface of the fluorescent layer 2.
  • the encapsulation layer 8 has an inwardly recessed structure relative to the first visible light sensor 3 and the second visible light sensor 4.
  • the main working principle of the X-ray high absorptance detection system provided by the present invention is as follows: X-rays are projected through the first visible light sensor 3 and then reach the fluorescent layer 2, and the X-ray-to-visible material is excited by X-photons to generate visible photons. , Part of the photons moving downward is absorbed by the second visible light sensor 4, and the other part of the photons moving upward is absorbed by the first visible light sensor 3. By controlling the shortest path of the visible photons moving upward, the visible photons moving upward are reduced to be reflected and absorbed.
  • the absorption efficiency of this part of the visible photons moving upward can be improved, so as to greatly improve the absorption efficiency of X-rays.
  • the first visible light sensor 3 and the second visible light sensor 4 both absorb visible photons
  • the first image acquisition device 5 and the second image acquisition device 6 both acquire and image at the same time
  • the image acquired by the first image acquisition device 5 is collected by the processor.
  • the first image signal and the second image signal collected by the second image acquisition device 6 are combined into one image by image processing, which can improve DQE (quantum detection efficiency), thereby increasing the absorption efficiency of X-rays and reducing the use of clinical X-rays dose.
  • DQE quantitative detection efficiency
  • the X-ray high absorption rate detection system provided by the present invention can improve the X-ray conversion absorption efficiency.
  • this technology can reduce the dose of X-rays and obtain images of the same quality, which is equivalent to Under the condition of X-ray dose, the DQE (quantum conversion efficiency) of the X-ray detector can be improved, and images suitable for clinical use can be obtained at low doses of X-rays.
  • the present invention also provides an image imaging method of the X-ray high absorptance detection system. See FIG. 2, which includes the following steps:
  • the first light sensor is used to collect the first photon signal
  • the second light sensor is used to collect the second photon signal.
  • the first light sensor is a first visible light sensor
  • the second light sensor is a second visible light sensor.
  • the first visible light sensor is arranged on the upper surface of the fluorescent layer
  • the second visible light sensor is arranged on the lower surface of the fluorescent layer, and the X-ray reaches the fluorescent layer after passing through the first visible light sensor;
  • the first image signal includes the light-sensitive image of each pixel position.
  • the number of charges includes the number of photosensitive charges at each pixel position
  • the image addition operation includes the addition of the number of photosensitive charges, that is, the number of photosensitive charges at each pixel position in the first image signal and the second image signal.
  • the sum of the photosensitive charges at the corresponding pixel positions is added to obtain the sum of the photosensitive charges at the corresponding pixel positions, and the X-ray image signal for diagnosis is obtained according to the sum of the photosensitive charges at the corresponding pixel positions.
  • the image imaging method of the X-ray high absorptance detection system provided by the present invention is executed by the X-ray high absorptance detection system.
  • the image imaging method of the X-ray high absorptance detection system provided by the present invention can obtain X-ray image signals for diagnosis through addition, which can increase the absorption rate of X-rays and reduce the use dose of X-rays.

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Abstract

一种X-光高吸收率探测***及图像成像方法，探测***包括光源（1）、荧光层（2）、第一可见光传感器（3）、第二可见光传感器（4）、第一图像采集装置（5）、第二图像采集装置（6）及处理器（7），光源（1）向荧光层（2）方向发出X光，X光转可见光材料在X光子激发下产生向第一可见光传感器（3）移动的第一可见光子及向第二可见光传感器（4）移动的第二可见光子；第一图像采集装置（5）用于基于第一可见光传感器（3）采集的第一可见光子信号得到第一图像信号，第二图像采集装置（6）基于第二可见光传感器（4）采集的第二可见光子信号得到第二图像信号；处理器（7）对两种图像信号进行加法运算得到X光图像信号，探测***提高X-光的吸收，提高探测***的灵敏度和DQE，进而降低X-射线的使用剂量。

Description

一种X-光高吸收率探测***及图像成像方法
优先权声明
本申请要求于2019年12月19日提交中国专利局、申请号为2019113157193的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及X-射线探测器成像领域，尤其涉及一种X-光高吸收率探测***及图像成像方法。
背景技术
现有技术中，X-射线平板探测***成像***中X-光的吸收效率对成像的质量起着决定性作用，是否能在低剂量下还能取得符合应用需求质量的图像是判断X-光成像***技术的基础，也是最近在X-光成像领域一直被研究的方向。现有X-射线平板探测***，灵敏度不高，X-射线的吸收率低。
发明内容
为了解决现有技术中存在的问题，本发明提供一种X-光高吸收率探测***及图像成像方法，以实现X光高效率的吸收，所述技术方案如下：
本发明提供一种X-光高吸收率探测***，其包括光源、荧光层、设置在所述荧光层上表面的第一可见光传感器、设置在所述荧光层下表面的第二可见光传感器、与所述第一可见光传感器连接的第一图像采集装置、与所述第二可见光传感器连接的第二图像采集装置及与所述第一图像采集装置和第二图像采集装置均电连接的处理器，所述光源用于向荧光层方向发出X光，所述X光穿过所述第一可见光传感器后到达荧光层，所述荧光层包括X光转可见光材料，所述X光转可见光材料在X-光子激发下产生向所述第一可见光传感器移动的第一可见光子以及向所述第二可见光传感器移动的第二可见光子；
所述第一图像采集装置用于基于所述第一可见光传感器采集的第一可见光子信号得到第一图像信号；所述第二图像采集装置用于基于所述第二可见光传感器采集的第二可见光子信号得到第二图像信号；所述处理器用于对第一图像 信号和第二图像信号进行加法运算，得到X光图像信号。
进一步地，所述X光转可见光材料为CsI、PbF 2晶体、NaBi(WO 4) 2晶体、NaI:Tl晶体或CsI:Tl晶体。
进一步地，所述荧光层的侧边设置有封装层，所述封装层的上部与所述第一可见光传感器的下表面相抵，所述封装层的下部与第二可见光传感器的上表面相抵，所述封装层包括X荧光的封装材料组成。
进一步地，所述封装材料的材质为铝薄膜和热熔胶。
进一步地，所述X-光高吸收率探测***还包括与处理器连接的显示组件。
进一步地，所述处理器包括加法运算模块和数据转换模块，所述加法运算模块用于第一图像信号与第二图像信号进行感光电荷数的加法运算，得到X光图像，并输出所述X光图像的电信号；所述数据转换模块用于将电信号转换为显示组件能够显示的数据格式。
进一步地，所述第一可见光传感器和第二可见光传感器均为片状结构；所述第一可见光传感器与荧光层的上表面形状相匹配，所述第二可见光传感器与荧光层的下表面形状相匹配。
本发明还提供一种X-光高吸收率探测***的图像成像方法，其包括如下步骤：
S1、利用光源向荧光层方向发出X光，所述荧光层的X光转可见光材料在X-光子激发下产生向上移动的第一光子以及向下移动的第二光子；
S2、利用第一光传感器采集第一光子信号，利用第二光传感器采集第二光子信号；
S3、利用第一图像采集装置基于第一光传感器采集的第一光子信号得到第一图像信号；利用第二图像采集装置基于第二光传感器采集的第二光子信号得到第二图像信号；
S4、利用处理器对步骤S3中的所述第一图像信号与所述第二图像信号进行图像加法运算，合成得到X光图像信号。
进一步地，在步骤S1中，所述第一光传感器为第一可见光传感器，所述第二光传感器为第二可见光传感器；所述第一可见光传感器设置在荧光层的上表面，所述第二可见光传感器设置在荧光层的下表面，所述X光穿过所述第一可见光传感器后到达荧光层。
进一步地，所述第一图像信号包括各个像素位置的感光电荷数，所述第二 图像信号包括各个像素位置的感光电荷数，所述图像加法运算包括感光电荷数的加法运算。
进一步地，所述的X-光高吸收率探测***的图像成像方法由所述的X-光高吸收率探测***执行。
本发明提供的技术方案带来的有益效果如下：
a.本发明提供的X-光高吸收率探测***，可提高X-光的吸收，提高探测***的灵敏度，同时可以提高探测***的量子探测效率，进而降低临床X-射线的使用剂量；
b.本发明提供的所述的X-光高吸收率探测***的图像成像方法，通过加法运算可得到用于诊断的X光图像信号，实现X光高效率的吸收。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本发明实施例提供的X-光高吸收率探测***的结构示意图；
图2是本发明实施例提供的X-光高吸收率探测***的图像成像方法的流程示意图。
其中，附图标记包括：1-光源，2-荧光层，3-第一可见光传感器，4-第二可见光传感器，5-第一图像采集装置，6-第二图像采集装置，7-处理器，8-封装层。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分的实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
本发明提供一种X-光高吸收率探测***，参见图1，其包括光源1、荧光层2、设置在所述荧光层2上表面的第一可见光传感器3、设置在所述荧光层2下 表面的第二可见光传感器4、与所述第一可见光传感器3连接的第一图像采集装置5、与所述第二可见光传感器4连接的第二图像采集装置6及与所述第一图像采集装置5和第二图像采集装置6均电连接的处理器7。
本发明提供X-光高吸收率探测***输出X光图像的具体实施方式如下：所述光源1用于向荧光层2方向发出X光，所述X光穿过所述第一可见光传感器3后到达荧光层2，所述荧光层2包括X光转可见光材料，所述X光转可见光材料为CsI(碘化铯)或其他闪烁体(如PbF 2晶体、NaBi(WO 4) 2晶体、NaI:Tl晶体或CsI:Tl晶体)，闪烁体是一类吸收高能粒子或射线后能够发光的材料，X光转可见光材料是能够在市场上直接采购的，所述X光转可见光材料在X-光子激发下产生向所述第一可见光传感器3移动的第一可见光子以及向所述第二可见光传感器4移动的第二可见光子，所述第一可见光子和第二可见光子移动方向参见图1中荧光层2中箭头所指方向，所述第一可见光子被第一可见光传感器3吸收，所述第二可见光子被第二可见光传感器4吸收，使得可见光子均被吸收，大大提高X-光的吸收效率。
所述第一图像采集装置5用于基于所述第一可见光传感器3采集的第一可见光子信号得到第一图像信号，所述第二图像采集装置6用于基于所述第二可见光传感器4采集的第二可见光子信号得到第二图像信号，所述处理器7用于对第一图像信号和第二图像信号进行加法运算，得到用于诊断的X光图像信号。
进一步地，所述X-光高吸收率探测***还包括与处理器7连接的显示组件。所述处理器7包括加法运算模块和数据转换模块，所述加法运算模块用于第一图像信号与第二图像信号进行感光电荷数的加法运算，得到X光图像，并输出所述X光图像的电信号；所述数据转换模块用于将电信号转换为显示组件能够显示的数据格式。
所述荧光层2的侧边设置有封装层8，且所述封装层8设置在第一可见光传感器3和第二可见光传感器4之间，所述封装层8用于包覆荧光层，所述封装层8的上部与所述第一可见光传感器3的下表面相抵，所述封装层8的下部与第二可见光传感器4的上表面相抵。所述封装层8包括X荧光的封装材料，所述封装材料的材质为铝薄膜和热熔胶，封装材料是能够在市场上直接采购的。具体地，所述封装层8的铝薄膜通过热熔胶实现封装并安装在所述第一可见光传感器3和第二可见光传感器4之间，以形成所述X-光高吸收率探测***的侧壁。
所述第一可见光传感器3和第二可见光传感器4均为片状结构，优选地，所述第一可见光传感器3和第二可见光传感器4的形状和大小相同；所述第一可见光传感器3与荧光层2的上表面形状相匹配，所述第二可见光传感器4与荧光层2的下表面形状相匹配。所述封装层8相对于所述第一可见光传感器3和第二可见光传感器4呈向内凹进结构。
本发明提供的X-光高吸收率探测***的主要工作原理如下：X光投射过所述第一可见光传感器3后到达荧光层2，X光转可见光材料受X-光子的激发，产生可见光子，一部分光子向下移动被第二可见光传感器4吸收，另外一部分光子向上移动被第一可见光传感器3吸收，通过对向上移动的可见光子进行最短路径的控制，减少向上移动的可见光子被反射再吸收，而直接被第一可见光传感器3吸收，可以提高这部分向上移动的可见光子的吸收效率，以极大提高X-光的吸收效率。所述第一可见光传感器3和第二可见光传感器4均吸收可见光子，所述第一图像采集装置5和第二图像采集装置6均同时采集成像，经过处理器对第一图像采集装置5采集的第一图像信号和第二图像采集装置6采集的第二图像信号进行图像处理合并成一张图像，可以提高DQE(量子探测效率)，进而提高X-光的吸收效率，降低临床X-射线的使用剂量。
本发明提供的X-光高吸收率探测***可以提高X-光转换吸收效率，在实际使用中利用此技术可以降低X射线的使用剂量并可以得到相同的质量的图像，也就等同于在相同X射线剂量条件下，可以提高X-光探测器的DQE(量子转换效率)，在X射线低剂量下即可得到符合临床使用的图像。
本发明还提供一种X-光高吸收率探测***的图像成像方法，参见图2，其包括如下步骤：
S1、利用光源向荧光层方向发出X光，所述荧光层的X光转可见光材料在X-光子激发下产生向上移动的第一光子以及向下移动的第二光子；
S2、利用第一光传感器采集第一光子信号，利用第二光传感器采集第二光子信号，优选地，所述第一光传感器为第一可见光传感器，所述第二光传感器为第二可见光传感器；所述第一可见光传感器设置在荧光层的上表面，所述第二可见光传感器设置在荧光层的下表面，所述X光穿过所述第一可见光传感器后到达荧光层；
S3、利用第一图像采集装置基于第一光传感器采集的第一光子信号得到第一图像信号，利用第二图像采集装置基于第二光传感器采集的第二光子信号得 到第二图像信号；
S4、利用处理器对步骤S3中的所述第一图像信号与所述第二图像信号进行图像加法运算，合成得到X光图像信号，具体地，所述第一图像信号包括各个像素位置的感光电荷数，所述第二图像信号包括各个像素位置的感光电荷数，所述图像加法运算包括感光电荷数的加法运算，即将第一图像信号中每个像素位置的感光电荷数与第二图像信号中对应像素位置的感光电荷数进行加法运算得到对应像素位置的感光电荷数的和值，根据所述对应像素位置的感光电荷数的和值得到用于诊断的X光图像信号。
本发明提供的所述的X-光高吸收率探测***的图像成像方法由所述的X-光高吸收率探测***执行。
本发明提供的所述的X-光高吸收率探测***的图像成像方法，通过加法运算可得到用于诊断的X光图像信号，可提高X-光的吸收率，降低X射线的使用剂量。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (11)

  1. 一种X-光高吸收率探测***，其特征在于，包括光源(1)、荧光层(2)、设置在所述荧光层(2)上表面的第一可见光传感器(3)、设置在所述荧光层(2)下表面的第二可见光传感器(4)、与所述第一可见光传感器(3)连接的第一图像采集装置(5)、与所述第二可见光传感器(4)连接的第二图像采集装置(6)及与所述第一图像采集装置(5)和第二图像采集装置(6)均电连接的处理器(7)，
    所述光源(1)用于向荧光层(2)方向发出X光，所述X光穿过所述第一可见光传感器(3)后到达荧光层(2)，所述荧光层(2)包括X光转可见光材料，所述X光转可见光材料在X-光子激发下产生向所述第一可见光传感器(3)移动的第一可见光子以及向所述第二可见光传感器(4)移动的第二可见光子；
    所述第一图像采集装置(5)用于基于所述第一可见光传感器(3)采集的第一可见光子信号得到第一图像信号；
    所述第二图像采集装置(6)用于基于所述第二可见光传感器(4)采集的第二可见光子信号得到第二图像信号；
    所述处理器(7)用于对第一图像信号和第二图像信号进行加法运算，得到X光图像信号。
  2. 根据权利要求1所述的X-光高吸收率探测***，其特征在于，所述X光转可见光材料为CsI、PbF 2晶体、NaBi(WO 4) 2晶体、NaI:Tl晶体或CsI:Tl晶体。
  3. 根据权利要求1所述的X-光高吸收率探测***，其特征在于，所述荧光层(2)的侧边设置有封装层(8)，所述封装层(8)的上部与所述第一可见光传感器(3)的下表面相抵，所述封装层(8)的下部与第二可见光传感器(4)的上表面相抵，所述封装层(8)包括X荧光的封装材料组成。
  4. 根据权利要求3所述的X-光高吸收率探测***，其特征在于，所述封装材料的材质为铝薄膜和热熔胶。
  5. 根据权利要求1所述的X-光高吸收率探测***，其特征在于，所述X- 光高吸收率探测***还包括与处理器(7)连接的显示组件。
  6. 根据权利要求5所述的X-光高吸收率探测***，其特征在于，所述处理器(7)包括加法运算模块和数据转换模块，
    所述加法运算模块用于第一图像信号与第二图像信号进行感光电荷数的加法运算，得到X光图像，并输出所述X光图像的电信号；
    所述数据转换模块用于将电信号转换为显示组件能够显示的数据格式。
  7. 根据权利要求1所述的X-光高吸收率探测***，其特征在于，所述第一可见光传感器(3)和第二可见光传感器(4)均为片状结构；所述第一可见光传感器(3)与荧光层(2)的上表面形状相匹配，所述第二可见光传感器(4)与荧光层(2)的下表面形状相匹配。
  8. 一种X-光高吸收率探测***的图像成像方法，其特征在于，包括如下步骤：
    S1、利用光源向荧光层方向发出X光，所述荧光层的X光转可见光材料在X-光子激发下产生向上移动的第一光子以及向下移动的第二光子；
    S2、利用第一光传感器采集第一光子信号，利用第二光传感器采集第二光子信号；
    S3、利用第一图像采集装置基于第一光传感器采集的第一光子信号得到第一图像信号；利用第二图像采集装置基于第二光传感器采集的第二光子信号得到第二图像信号；
    S4、利用处理器对步骤S3中的所述第一图像信号与所述第二图像信号进行图像加法运算，合成得到X光图像信号。
  9. 根据权利要求8所述的X-光高吸收率探测***的图像成像方法，其特征在于，在步骤S1中，所述第一光传感器为第一可见光传感器，所述第二光传感器为第二可见光传感器；所述第一可见光传感器设置在荧光层的上表面，所述第二可见光传感器设置在荧光层的下表面，所述X光穿过所述第一可见光传感器后到达荧光层。
  10. 根据权利要求8所述的X-光高吸收率探测***的图像成像方法，其特征在于，所述第一图像信号包括各个像素位置的感光电荷数，所述第二图像信号包括各个像素位置的感光电荷数，所述图像加法运算包括感光电荷数的加法运算。
  11. 根据权利要求8所述的X-光高吸收率探测***的图像成像方法，其特征在于，由权利要求1-7中任意一项所述的X-光高吸收率探测***执行。
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