WO2021098014A1 - 一种主动降噪声学单元及发声单体 - Google Patents

一种主动降噪声学单元及发声单体 Download PDF

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Publication number
WO2021098014A1
WO2021098014A1 PCT/CN2019/129566 CN2019129566W WO2021098014A1 WO 2021098014 A1 WO2021098014 A1 WO 2021098014A1 CN 2019129566 W CN2019129566 W CN 2019129566W WO 2021098014 A1 WO2021098014 A1 WO 2021098014A1
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Prior art keywords
sound
noise reduction
active noise
housing
reduction unit
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PCT/CN2019/129566
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English (en)
French (fr)
Inventor
赵胜刚
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歌尔股份有限公司
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Priority to US17/778,245 priority Critical patent/US20230020424A1/en
Publication of WO2021098014A1 publication Critical patent/WO2021098014A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
    • G10K11/1781—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase characterised by the analysis of input or output signals, e.g. frequency range, modes, transfer functions
    • G10K11/17821—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase characterised by the analysis of input or output signals, e.g. frequency range, modes, transfer functions characterised by the analysis of the input signals only
    • G10K11/17823—Reference signals, e.g. ambient acoustic environment
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
    • G10K11/1785—Methods, e.g. algorithms; Devices
    • G10K11/17857—Geometric disposition, e.g. placement of microphones
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
    • G10K11/1787—General system configurations
    • G10K11/17879—General system configurations using both a reference signal and an error signal
    • G10K11/17881—General system configurations using both a reference signal and an error signal the reference signal being an acoustic signal, e.g. recorded with a microphone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083—Reduction of ambient noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K2210/00—Details of active noise control [ANC] covered by G10K11/178 but not provided for in any of its subgroups
    • G10K2210/10—Applications
    • G10K2210/108—Communication systems, e.g. where useful sound is kept and noise is cancelled
    • G10K2210/1081—Earphones, e.g. for telephones, ear protectors or headsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2207/00—Details of diaphragms or cones for electromechanical transducers or their suspension covered by H04R7/00 but not provided for in H04R7/00 or in H04R2307/00
    • H04R2207/021—Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/01—Hearing devices using active noise cancellation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion, and more specifically, to an active noise reduction unit and a sounding monomer.
  • earphones have been widely used in people’s daily life and work.
  • earphones are also widely used in noise isolation to keep users in a relatively quiet environment.
  • the noise isolation effect and ability of low frequency noise are limited.
  • the application of noise-reducing headphones is becoming more and more extensive.
  • Noise-canceling headphones can not only reduce environmental noise and protect users' hearing, but also allow users to listen to high-quality music and enhance the enjoyment experience.
  • noise-canceling headphones are becoming more and more popular among consumers.
  • more and more earphones integrate the function of active noise reduction.
  • Active noise reduction earphones can effectively reduce the impact of environmental noise on people's work, study and life, improve the living and working environment, and improve the quality of life.
  • Dual wireless headphones have developed rapidly, with more and more users, and more and more comprehensive functions.
  • the combination of dual wireless and active noise reduction is the trend of industry development.
  • Dual wireless headphones are easy to wear, and their size needs to be small.
  • the internal space is relatively tight, and active noise reduction requires additional feedback microphones for noise reduction.
  • the feedback microphone needs to be sealed, which will occupy a relatively large space; and the feedback microphone needs to occupy the front cavity space, which will make the front cavity larger or make the sound hole smaller, thereby affecting the acoustic effect.
  • An object of the present invention is to provide a new technical solution for an active noise reduction unit and a sounding monomer.
  • an active noise reduction unit is provided, and the active noise reduction unit includes:
  • a substrate the substrate is arranged in a housing, and the substrate isolates the housing into a first accommodating cavity and a second accommodating cavity;
  • the second accommodating cavity is in communication with the first accommodating cavity, a feedback microphone is arranged in the second accommodating cavity, and the feedback microphone is configured to pick up noise signals;
  • a moving iron horn is arranged in the first accommodating cavity, and the moving iron horn can vibrate and sound according to a noise signal.
  • the moving iron horn includes a voice coil, a magnet, an iron sheet, a diaphragm, and a connecting rod; the two magnets are arranged oppositely with a gap between the two magnets, and the iron sheet passes through the voice coil Then, it is inserted into the gap between the two magnets, one end of the connecting rod is fixed to the iron sheet, and the other end is fixed to the diaphragm.
  • one side of the housing is provided with a sound outlet at a position close to the diaphragm.
  • the feedback microphone includes a capacitive acoustic-electric conversion component and a signal processing element, and the capacitive acoustic-electric conversion component is electrically connected to the signal processing element and both are disposed on a substrate.
  • a sound hole is opened on the substrate at a position corresponding to the capacitive acoustic-electric conversion component, and the sound hole is communicated with the first accommodating cavity.
  • the capacitive acoustic-electric conversion component is a MEMS
  • the signal processing element is an ASIC chip.
  • the MEMS is formed with a diaphragm and a back plate, and the sound hole communicates with a back cavity in the MEMS.
  • the substrate is a PCB board.
  • the housing includes a first housing and a second housing.
  • the first housing and the base plate are enclosed to form a first accommodating cavity, and the second housing and the base plate are enclosed to form a second housing.
  • Set the cavity; the substrate and the first shell are integrally formed, and the substrate and the second shell are welded or bonded together.
  • a sound-producing monomer includes a housing and the active noise reduction unit as described above arranged in the housing; the housing is provided with mutually communicating sound cavities and A sound outlet tube, one end of the sound outlet tube away from the sound cavity is provided with a sound outlet; the active noise reduction unit is located in the sound outlet tube, and the sound outlet of the active noise reduction unit is set toward the sound outlet; or The active noise reduction unit is located in the acoustic cavity, the sound outlet of the active noise reduction unit is arranged toward the sound outlet, and the side of the active noise reduction unit where the sound outlet is arranged is located at the junction of the sound cavity and the sound tube Place.
  • the present invention provides an active noise reduction unit, the substrate is a common element, and the substrate isolates the housing into a first accommodating cavity and a second accommodating cavity, wherein the first accommodating cavity is used to carry the moving iron horn ,
  • the second accommodating cavity is used to carry the feedback microphone, that is, the moving iron speaker and the feedback microphone are assembled and integrated into an acoustic unit, which not only can effectively reduce the size, but also the active noise reduction unit is assembled into a single unit.
  • the functions of the moving iron speaker and the feedback microphone can be tested uniformly, which can effectively save the test time and improve the consistency of the test.
  • Fig. 1 is a schematic cross-sectional structure diagram of an active noise reduction unit of the present invention
  • Figure 2 is a schematic diagram of the first structure of a vocal monomer of the present invention.
  • Fig. 3 is a schematic diagram of the second structure of a vocal monomer of the present invention.
  • an active noise reduction unit includes a casing and a substrate 11, the substrate 11 is arranged in the casing, and the substrate 11
  • the housing is isolated into a first accommodating cavity 14 and a second accommodating cavity 16; the second accommodating cavity 16 communicates with the first accommodating cavity 14, and the second accommodating cavity 16 is provided with a feedback microphone
  • the feedback microphone is configured to pick up a noise signal; a moving iron horn is provided in the first accommodating cavity 14, and the moving iron horn can vibrate and sound according to the noise signal.
  • the active noise reduction unit provided by the embodiment of the present invention can play the role of active noise reduction.
  • the principle of using the active noise reduction unit to perform active noise reduction is: the surrounding noise signal is picked up by the feedback microphone, and the noise signal undergoes noise reduction. After reverse processing, the circuit outputs a signal with the same amplitude and opposite phase to the moving iron horn, and the reverse noise signal output by the moving iron horn cancels and neutralizes the noise signal directly entering the user's ears, thereby achieving the purpose of reducing noise.
  • the moving iron horn can be used to listen to the sound, and it can also produce anti-phase noise in active noise reduction.
  • the substrate 11 is a common element, and the substrate 11 separates the housing into a first accommodating cavity 14 and a second accommodating cavity 16, wherein the first accommodating cavity 14 is used for For carrying the moving iron horn, the second accommodating cavity 16 is used to carry the feedback microphone, that is, the moving iron horn and the feedback microphone are assembled and integrated into an acoustic unit, which not only can effectively reduce the size, but also assemble the active noise reduction unit into After the monomer is tested, the functions of the moving iron speaker and the feedback microphone can be tested uniformly, which can effectively save the test time, improve the consistency of the test, and provide convenience for subsequent ANC debugging.
  • the housing includes a first housing 12 and a second housing 13.
  • the first housing 12 and the substrate 11 enclose a first housing cavity 14, and the second housing 13 It is enclosed with the base plate 11 to form a second accommodating cavity 16; the base plate 11 and the first housing 12 are integrally formed, and the base plate 11 and the second housing 13 are welded or bonded together. That is, the substrate 11 and the first housing 12 are an integral structure, and the second housing 13 is fixed to the substrate 11 by welding or bonding. In this way, the sealing effect between the moving iron speaker and the feedback microphone is very good.
  • the moving iron horn includes a voice coil 151, a magnet 152, an iron sheet 153, a diaphragm 154, and a connecting rod 155; two magnets 152 are arranged oppositely with a gap between the two magnets 152, so The iron sheet 153 passes through the voice coil 151 and is inserted into the gap between the two magnets 152. One end of the connecting rod is fixed to the iron sheet 153 and the other end is fixed to the diaphragm 154.
  • the working principle of the moving iron horn is: when the voice coil 151 is energized, a magnetic field is generated to magnetize the iron sheet 153.
  • the magnetic field of the iron sheet 153 changes, and the magnetic field of the iron sheet 153 and the magnetic field of the magnet 152 interact with each other.
  • the effect causes the iron sheet 153 to vibrate, and the vibration is transmitted to the diaphragm 154 through the connecting rod 155, so that the diaphragm 154 vibrates and emits sound.
  • a sound outlet 156 is opened on one side of the first housing 12 at a position close to the diaphragm 154. The sound generated by the vibration of the diaphragm 154 is transmitted through the sound outlet 156.
  • the feedback microphone includes a capacitive acoustic-electric conversion component 171 and a signal processing element 172.
  • the capacitive acoustic-electric conversion component 171 is electrically connected to the signal processing element 172 and both are disposed on the substrate 11.
  • the capacitive acoustic-electric conversion component 171 and the signal processing element 172 can be fixed on the substrate 11 by bonding or mounting.
  • the capacitive acoustic-electric conversion component 171 and the signal processing element 172 can also be used by those skilled in the art.
  • the electrical connection is formed with the substrate 11 in a well-known manner, which is not described here.
  • a sound hole 173 is opened on the substrate 11 at a position corresponding to the capacitive acoustic-electric conversion component 171, and the sound hole 173 is in communication with the first accommodating cavity 14.
  • the external noise airflow enters the capacitive acoustic-electric conversion component 171 through the sound hole 173 and emits a sound signal, and the acoustic signal is converted into an electrical signal by the capacitive acoustic-electric conversion component 171 and then transmitted to the signal processing element 172 for processing.
  • the signal processed by the signal processing element 172 is reversely processed by the noise reduction circuit and then outputs a signal with the same amplitude and opposite phase to the moving iron horn.
  • the capacitive acoustic-electric conversion component 171 is a MEMS
  • the signal processing element 172 is an ASIC chip.
  • the MEMS is formed with a diaphragm and a back plate through a micro-based electrical system technology, and the sound hole 173 is in communication with a back cavity in the MEMS.
  • the airflow of external noise enters the back cavity of the MEMS through the sound hole 173. After the airflow enters, it triggers the vibration of the diaphragm set on the MEMS, causing the capacitance value between the diaphragm and the back plate to change. In this case, a changing current is generated to complete the conversion of a sound signal to an electrical signal, and the electrical signal is transmitted to the ASIC chip for processing.
  • the substrate 11 is a PCB board.
  • the substrate 11 may be a PCB board with a laminated structure, and the PCB board with the laminated structure is sequentially arranged from the inside of the second accommodating cavity 16 as a first PCB copper layer, a PCB substrate layer, and a second PCB copper layer.
  • the substrate 11 may also be a PCB board with other structures.
  • the second housing 13 is made of metal.
  • the second casing 13 may be a copper casing in the middle, and the inner and outer surface layers of the copper casing are plated with gold.
  • the second housing 13 made in this way has an excellent electromagnetic shielding effect, and prevents the capacitive acoustic-electric conversion component 171 and the signal processing element 172 inside it from being electromagnetically interfered by the outside.
  • a solder resist layer may be provided between the capacitive acoustic-electric conversion component 171 and the signal processing element 172 and the substrate 11.
  • the solder resist layer is an ink layer.
  • the solder resist layer may also be an insulating resin material.
  • a sound-producing monomer may be a Bluetooth headset; as shown in FIG. 2 and FIG. 3, it includes a housing 2 and a housing 2 as described above.
  • the active noise reduction unit 1; the housing 2 is provided with a sound cavity 21 and a sound tube 22 that communicate with each other.
  • the sound tube 22 has a sound outlet at one end away from the sound cavity 21; as shown in FIG.
  • the active noise reduction unit 1 is located in the sound tube 22, and the sound outlet 156 of the active noise reduction unit 1 is set toward the sound outlet; or as shown in FIG.
  • the active noise reduction unit 1 is located in the sound cavity In 21, the sound outlet 156 of the active noise reduction unit 1 is set toward the sound outlet, and the side of the active noise reduction unit 1 where the sound outlet 156 is provided is located at the junction of the sound cavity 21 and the sound tube 22 .
  • the feedback microphone and the speaker are two independent components.
  • the active noise reduction unit can be assembled into the vocal unit to save sound.
  • the space in the single unit is more suitable for small earphones with tight space.
  • the active noise reduction unit is arranged in the sound tube 22 or the active noise reduction unit is arranged in the sound cavity 21, it is convenient to seal, and the sound area of the moving iron horn is not sacrificed at all, so Will not affect the high frequency response of the moving iron horn.
  • the steps of the method or algorithm described in combination with the embodiments disclosed in this document can be directly implemented by hardware, a software module executed by a processor, or a combination of the two.
  • the software module can be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or all areas in the technical field. Any other known storage media.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)

Abstract

一种主动降噪声学单元（1）及发声单体，主动降噪声学单元（1）包括壳体及基板（11），基板（11）设置在壳体内，基板（11）将壳体隔离为第一容置腔（14）与第二容置腔（16）；第二容置腔（16）与第一容置腔（14）相连通，第二容置腔（16）内设置有反馈麦克风，反馈麦克风被配置为用于拾取噪声信号；第一容置腔（14）内设置有动铁喇叭，动铁喇叭能够根据噪声信号振动发声。

Description

一种主动降噪声学单元及发声单体
本申请要求于2019年11月22日提交中国专利局、申请号为201911159350.1、发明名称为“一种主动降噪声学单元及发声单体”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电声转换技术领域，更具体地，涉及一种主动降噪声学单元及发声单体。
背景技术
随着科技的进步和人们生活水平的不断提高，电子产品越来越普及，消费者对电子产品的要求越来越高。目前，耳机在人们的日常生活和工作中已经得到了广泛应用，耳机除了用来欣赏音乐、具有娱乐的功能之外，也被广泛地应用于噪声隔离，使用户保持相对安静的环境，但是耳机对低频噪声的隔噪效果和能力是有局限性的。目前，生活中处处存在着噪声，为了使人们能够在安静的环境中享受音乐而不被外界的噪声干扰，降噪耳机的应用越来越广泛。降噪耳机不仅能够降低环境噪音、保护用户的听力，而且可以让用户聆听到高品质的音乐，提升享乐体验，因此，降噪耳机越来越受到广大消费者的青睐。现如今，越来越多的耳机集成了主动降噪的功能，主动降噪耳机可以有效地降低环境噪声对人们工作、学习以及生活的影响，改善生活与工作环境，提高生活品质。
近年来，双无线耳机发展迅速，使用者也越来越多，功能也越来越全面，双无线加主动降噪的结合是行业发展的趋势。双无线耳机佩戴方便，其尺寸需要做小，但由于耳机内部需要排布电池、PCB、天线、传感器等 器件，因此内部空间比较紧促，并且主动降噪需要额外的反馈麦克风来做降噪，反馈麦克风需要密封，这样就会占用比较大的空间；而且反馈麦克风需要占据前腔空间，会使前腔变得很大或使出声孔变小，从而影响声学效果。
有鉴于此，需要提供一种新的技术方案以解决上述技术问题。
发明内容
本发明的一个目的是提供一种主动降噪声学单元及发声单体的新技术方案。
根据本发明的第一方面，提供了一种主动降噪声学单元，该主动降噪声学单元包括：
壳体；
基板，所述基板设置在壳体内，所述基板将壳体隔离为第一容置腔与第二容置腔；
所述第二容置腔与第一容置腔相连通，所述第二容置腔内设置有反馈麦克风，所述反馈麦克风被配置为用于拾取噪声信号；
所述第一容置腔内设置有动铁喇叭，所述动铁喇叭能够根据噪声信号振动发声。
可选地，所述动铁喇叭包括音圈、磁铁、铁片、振膜及连接棒；所述磁铁相对设置两块且两块磁铁之间具有间隙，所述铁片穿过所述音圈后***到两块所述磁铁之间的间隙处，所述连接棒的一端固定于所述铁片、另一端固定于所述振膜。
可选地，所述壳体的一个侧部在靠近所述振膜的位置处开设有出音口。
可选地，所述反馈麦克风包括电容式声电转换部件及信号处理元件， 所述电容式声电转换部件与信号处理元件电连接且两者均设置在基板上。
可选地，所述基板上与所述电容式声电转换部件相对应的位置处开设有声孔，所述声孔与第一容置腔相连通。
可选地，所述电容式声电转换部件为MEMS，所述信号处理元件为ASIC芯片。
可选地，所述MEMS成型有振膜和背极板，所述声孔与MEMS内的背腔连通。
可选地，所述基板为PCB板。
可选地，所述壳体包括第一壳体及第二壳体，所述第一壳体与基板围合构成第一容置腔，所述第二壳体与基板围合构成第二容置腔；所述基板与第一壳体一体成型，所述基板与第二壳体焊接或粘接在一起。
根据本发明的另一方面，提供了一种发声单体，所述发声单体包括外壳及设置在外壳内的如上所述的主动降噪声学单元；所述外壳内部设置有相互连通的声腔及出声管，所述出声管远离声腔的一端开设有出声口；所述主动降噪声学单元位于出声管内，所述主动降噪声学单元的出音口朝向出声口设置；或者所述主动降噪声学单元位于声腔内，所述主动降噪声学单元的出音口朝向出声口设置，且所述主动降噪声学单元设置出音口的侧面位于声腔与出声管的交界位置处。
本发明提供的一种主动降噪声学单元，其基板为一个共用的元件，基板将壳体隔离为第一容置腔及第二容置腔，其中第一容置腔用于承载动铁喇叭，第二容置腔用于承载反馈麦克风，亦即将动铁喇叭与反馈麦克风组装整合为一个声学单元，不仅能够有效减小尺寸，并且将该主动降噪声学单元组装到单体后在对单体进行测试时，可以统一测试动铁喇叭与反馈麦克风的功能，这样可以有效节省测试时间，提高测试的一致性。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一部分附图，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1所示为本发明一种主动降噪声学单元的剖视结构示意图；
图2为本发明一种发声单体的第一种结构示意图；
图3为本发明一种发声单体的第二种结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参考图1所示，根据本发明的一个实施例，提供了一种主动降噪声学单元，该主动降噪声学单元包括壳体及基板11，所述基板11设置在壳体内，所述基板11将壳体隔离为第一容置腔14与第二容置腔16；所述第二容置腔16与第一容置腔14相连通，所述第二容置腔16内设置有反馈麦克风，所述反馈麦克风被配置为用于拾取噪声信号；所述第一容置腔14内设置有动铁喇叭，所述动铁喇叭能够根据噪声信号振动发声。
本发明实施例提供的主动降噪声学单元能够起到主动降噪的作用，利用该主动降噪声学单元进行主动降噪的原理为：通过反馈麦克风拾取周围的噪声信号，该噪声信号经过降噪电路反向处理后输出一个幅度相同、相位相反的信号至动铁喇叭，由动铁喇叭输出的反相噪声信号与直接进入 使用者耳朵的噪声信号相抵消中和，从而达到降低噪声的目的。动铁喇叭可以用于听声音，也可以在主动降噪中产生反相噪声。在现有技术中具有主动降噪功能的声学单元中，反馈麦克风与喇叭是两个完全独立的单元，这样设置占用空间较大，安装不便。本发明实施例提供的主动降噪声学单元，其基板11为一个共用的元件，基板11将壳体隔离为第一容置腔14及第二容置腔16，其中第一容置14腔用于承载动铁喇叭，第二容置腔16用于承载反馈麦克风，亦即将动铁喇叭与反馈麦克风组装整合为一个声学单元，不仅能够有效减小尺寸，并且将该主动降噪声学单元组装到单体后在对单体进行测试时，可以统一测试动铁喇叭与反馈麦克风的功能，这样可以有效节省测试时间，提高测试的一致性，为后续ANC调试提供便利。
在一个实施例中，所述壳体包括第一壳体12及第二壳体13，所述第一壳体12与基板11围合构成第一容置腔14，所述第二壳体13与基板11围合构成第二容置腔16；所述基板11与第一壳体12一体成型，所述基板11与第二壳体13焊接或粘接在一起。即基板11与第一壳体12是一个整体结构，而第二壳体13通过焊接或粘接的方式与基板11固定在一起。这样设置动铁喇叭与反馈麦克风之间的密封效果很好。
在一个实施例中，所述动铁喇叭包括音圈151、磁铁152、铁片153、振膜154及连接棒155；所述磁铁152相对设置两块且两块磁铁152之间具有间隙，所述铁片153穿过所述音圈151后***到两块所述磁铁152之间的间隙处，所述连接棒的一端固定于所述铁片153、另一端固定于所述振膜154。该动铁喇叭的工作原理为：当音圈151通电后产生磁场将铁片153磁化，随着电信号的变化，铁片153的磁场随着变化，铁片153的磁场与磁铁152的磁场相互作用，使铁片153发生振动，该振动通过连接棒155传递给振膜154，使得振膜154振动发出声音。
在一个实施例中，所述第一壳体12的一个侧部在靠近所述振膜154 的位置处开设有出音口156。振膜154震动发出的声音经由出音口156传递出去。
在一个实施例中，所述反馈麦克风包括电容式声电转换部件171及信号处理元件172，所述电容式声电转换部件171与信号处理元件172电连接且两者均设置在基板11上。例如，电容式声电转换部件171及信号处理元件172可通过粘接或贴装等方式固定在基板11上，当然，电容式声电转换部件171及信号处理元件172也可采用本领域技术人员熟知的方式与基板11形成电连接，在此不做过多说明。
在一个实施例中，所述基板11上与所述电容式声电转换部件171相对应的位置处开设有声孔173，所述声孔173与第一容置腔14相连通。外界的噪声气流经由声孔173进入到电容式声电转换部件171后发出声音信号，并且该声音信号通过电容式声电转换部件171转换为电信号后传输给信号处理元件172进行处理。经过信号处理元件172处理过的信号再经降噪电路反向处理后输出一个幅度相同、相位相反的信号至动铁喇叭。
在一个实施例中，所述电容式声电转换部件171为MEMS，所述信号处理元件172为ASIC芯片。在一个实施例中，所述MEMS通过微基电***技术成型有振膜和背极板，所述声孔173与MEMS内的背腔连通。具体地，外界的噪声气流经由声孔173进入到MEMS的背腔中，气流进入后触动MEMS上设置的振膜振动，使得振膜与背极板间的电容值发生变化，在电压不变的情况下，产生变化的电流，完成声音信号到电信号的转换，该电信号传输给ASIC芯片进行处理。
在一个实施例中，所述基板11为PCB板。例如，基板11可以为层叠结构的PCB板，所述层叠结构的PCB板从第二容置腔16内侧向外依次设置为第一PCB敷铜层、PCB基材层及第二PCB敷铜层。当然，根据具体需要，基板11还可以为其他结构的PCB板。
在一个实施例中，所述第二壳体13为金属材质。具体地，例如，第二壳体13可以是中间为铜制壳体且铜制壳体的内外表层进行镀金处理。如此制成的第二壳体13具有优秀的电磁屏蔽效果，防止其内部的电容式声电转换部件171及信号处理元件172受到外界的电磁干扰。
在一个实施例中，所述电容式声电转换部件171及信号处理元件172与基板11之间可以设置有阻焊层。具体地，所述阻焊层为油墨层，当然，所述阻焊层还可以是绝缘的树脂材料。当第二壳体13通过焊接的方式与基板11固定在一起时，阻焊层的设置能够防止电容式声电转换部件171及信号处理元件172与焊锡发声导通的现象。
根据本发明的另一个实施例，提供了一种发声单体，所述发声单体可以是蓝牙耳机；参考图2及图3所示，其包括外壳2及设置在外壳2内的如上所述的主动降噪声学单元1；所述外壳2内部设置有相互连通的声腔21及出声管22，所述出声管22远离声腔21的一端开设有出声口；如图2所示，所述主动降噪声学单元1位于出声管22内，所述主动降噪声学单元1的出音口156朝向出声口设置；或者如图3所示，所述主动降噪声学单元1位于声腔21内，所述主动降噪声学单元1的出音口156朝向出声口设置，且所述主动降噪声学单元1设置出音口156的侧面位于声腔21与出声管22的交界位置处。
现有技术中，反馈麦克风与喇叭是两个独立的元件，其中反馈麦克风在发声单体内的设置主要有三种形式，第一种是将反馈麦克风设置到发声单体的前声腔中，这样设置时喇叭需要适当后移；第二种是将反馈麦克风设置到出声管中，这样会牺牲喇叭的出声面积，导致喇叭的高频频响变差；第三种是将反馈麦克风设置到后声腔中，并通过进声管道连同前声腔，这样设置需要支架来固定喇叭和反馈麦克风，对反馈麦克风的密封性要求 比较高。
在本发明实施例中提供的发声单体中，由于动铁喇叭与反馈麦克风组装整合为一个整体的主动降噪声学单元，因此在将该主动降噪声学单元组装到发声单体中能够节省发声单体中的空间，更加适用于空间紧促的小耳机。并且无论是将该主动降噪声学单元设置在出声管22内，或者将该主动降噪声学单元设置在声腔21内，均方便密封，并且完全不会牺牲动铁喇叭的出声面积，因此不会影响动铁喇叭的高频频响。
本说明书中各个实施例采用并列或者递进的方式描述，每个实施例重点说明的都是与其它实施例的不同之处，各个实施例之间相同或相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处可参见方法部分说明。
本领域普通技术人员还可以理解，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
结合本文中所公开的实施例描述的方法或算法的步骤可以直接用硬件、处理器执行的软件模块，或者二者的结合来实施。软件模块可以置于随机存储器(RAM)、内存、只读存储器(ROM)、电可编程ROM、电可擦除可编程ROM、寄存器、硬盘、可移动磁盘、CD-ROM、或技术领域内所公知的任意其它形式的存储介质中。
还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。

Claims (10)

  1. 一种主动降噪声学单元，其特征在于，包括：
    壳体；
    基板，所述基板设置在壳体内，所述基板将壳体隔离为第一容置腔与第二容置腔；
    所述第二容置腔与第一容置腔相连通，所述第二容置腔内设置有反馈麦克风，所述反馈麦克风被配置为用于拾取噪声信号；
    所述第一容置腔内设置有动铁喇叭，所述动铁喇叭能够根据噪声信号振动发声。
  2. 根据权利要求1所述的主动降噪声学单元，其特征在于，所述动铁喇叭包括音圈、磁铁、铁片、振膜及连接棒；所述磁铁相对设置两块且两块磁铁之间具有间隙，所述铁片穿过所述音圈后***到两块所述磁铁之间的间隙处，所述连接棒的一端固定于所述铁片、另一端固定于所述振膜。
  3. 根据权利要求2所述的主动降噪声学单元，其特征在于，所述壳体的一个侧部在靠近所述振膜的位置处开设有出音口。
  4. 根据权利要求1所述的主动降噪声学单元，其特征在于，所述反馈麦克风包括电容式声电转换部件及信号处理元件，所述电容式声电转换部件与信号处理元件电连接且两者均设置在基板上。
  5. 根据权利要求4所述的主动降噪声学单元，其特征在于，所述基板上与所述电容式声电转换部件相对应的位置处开设有声孔，所述声孔与第一容置腔相连通。
  6. 根据权利要求5所述的主动降噪声学单元，其特征在于，所述电容式声电转换部件为MEMS，所述信号处理元件为ASIC芯片。
  7. 根据权利要求6所述的主动降噪声学单元，其特征在于，所述MEMS 成型有振膜和背极板，所述声孔与MEMS内的背腔连通。
  8. 根据权利要求1所述的主动降噪声学单元，其特征在于，所述基板为PCB板。
  9. 根据权利要求1所述的主动降噪声学单元，其特征在于，所述壳体包括第一壳体及第二壳体，所述第一壳体与基板围合构成第一容置腔，所述第二壳体与基板围合构成第二容置腔；所述基板与第一壳体一体成型，所述基板与第二壳体焊接或粘接在一起。
  10. 一种发声单体，其特征在于，所述发声单体包括外壳及设置在外壳内的如权利要求1-9中任一项所述的主动降噪声学单元；所述外壳内部设置有相互连通的声腔及出声管，所述出声管远离声腔的一端开设有出声口；所述主动降噪声学单元位于出声管内，且所述主动降噪声学单元的出音口朝向出声口设置；或者所述主动降噪声学单元位于声腔内，所述主动降噪声学单元的出音口朝向出声口设置，且所述主动降噪声学单元设置有出音口的侧面位于声腔与出声管的交界位置处。
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