WO2021097904A1 - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
WO2021097904A1
WO2021097904A1 PCT/CN2019/122356 CN2019122356W WO2021097904A1 WO 2021097904 A1 WO2021097904 A1 WO 2021097904A1 CN 2019122356 W CN2019122356 W CN 2019122356W WO 2021097904 A1 WO2021097904 A1 WO 2021097904A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
display device
printed circuit
heat dissipation
driving chip
Prior art date
Application number
PCT/CN2019/122356
Other languages
English (en)
French (fr)
Inventor
傅晓立
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US16/625,373 priority Critical patent/US11191194B2/en
Publication of WO2021097904A1 publication Critical patent/WO2021097904A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technology, and in particular to a display device.
  • the existing flat display devices mainly include liquid crystal display devices (Liquid Crystal Display, LCD) and organic light emitting diode display device (Organic Light Emitting Display, OLED).
  • LCD Liquid Crystal Display
  • OLED Organic Light Emitting Display
  • the liquid crystal display device usually includes a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates, and control the liquid crystal by applying a voltage between the two glass substrates. The molecules change direction and refract the light from the backlight module to produce a picture.
  • the light-emitting principle of OLED display devices is that semiconductor materials and organic light-emitting materials are driven by an electric field to cause light emission through carrier injection and recombination.
  • the OLED display surface usually uses ITO pixel electrodes and metal electrodes as the anode and cathode of the device, respectively.
  • ITO pixel electrodes and metal electrodes as the anode and cathode of the device, respectively.
  • electrons and holes are injected from the cathode and anode to the electron transport layer and hole transport layer, respectively. Holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer respectively, and meet in the light-emitting layer to form excitons and excite light-emitting molecules, the latter emit visible light after radiative relaxation.
  • the existing display device includes a printed circuit board 100 (Printed Circuit Board, PCB), a chip on film 200 (Chip On Film, COF), and a data drive chip 300 (Source IC) arranged on the chip carrier film. ), the display panel 400 (Panel), the input end and the output end of the chip carrying film are respectively connected to the printed circuit board 100 and the display panel 400. Further, the data driving chip 300 often has a problem of excessive temperature during the working process.
  • a heat dissipation sticker is usually added to the chip carrier film for improvement, but the heat dissipation capacity of the heat dissipation sticker is limited, and in many cases it is not possible. It is ensured that the temperature of the data driving chip 300 is reduced and maintained at a normal chip operating temperature, and the increase of heat dissipation stickers will lead to an increase in the production cost of the product.
  • the purpose of the present invention is to provide a display device that can improve the heat dissipation effect of the chip, reduce the production cost, and simplify the production process.
  • the present invention provides a display device including: a display panel, a flexible circuit board, a printed circuit board, and a data driving chip, the printed circuit board is connected to the display panel through the flexible circuit board;
  • the data driving chip is bound to the front side of the printed circuit board, and the area on the back side of the printed circuit board opposite to the driving chip is provided with an exposed copper area.
  • the horizontal projection area of the data driving chip on the printed circuit board is smaller than the area of the exposed copper area.
  • An auxiliary heat dissipation layer is also provided on the surface of the exposed copper area away from the data driving chip.
  • the material of the auxiliary heat dissipation layer is graphene.
  • the auxiliary heat dissipation layer includes a plurality of heat dissipation bars arranged at intervals.
  • the display device also includes at least one heat conductor, at least one via hole is provided on the printed circuit board, and each via hole is provided with a heat conductor, one end of the heat conductor is in contact with the exposed copper area, and One end is in contact with the data drive chip.
  • the material of the heat conductor is copper.
  • the material of the heat conductor is graphene.
  • the data driving chip includes at least one blanking pin, and each blanking pin is in contact with a heat conductor.
  • the thermal conductor fills the via hole.
  • the present invention provides a display device.
  • the display device includes: a display panel, a flexible circuit board, a printed circuit board, and a data drive chip, the printed circuit board is connected to the display panel through the flexible circuit board; the data drive chip is bound to the printed circuit On the front of the board, the area on the back of the printed circuit board opposite to the driving chip is provided with a copper exposed area, which can improve the heat dissipation effect of the chip, reduce the production cost, and improve the working stability of the product.
  • FIG. 1 is a schematic diagram of a conventional display device
  • FIG. 2 is a schematic diagram of the display device of the present invention.
  • FIG. 3 is a schematic diagram of the back side of the printed circuit board of the display device of the present invention.
  • Fig. 4 is a cross-sectional view at A-A in Fig. 2.
  • the present invention provides a display device, including: a display panel 1, a flexible circuit board 4, a printed circuit board 2 and a data drive chip (Source IC) 3, the printed circuit board 2 through the The flexible circuit board 4 is connected to the display panel 1;
  • the data driving chip 3 is bound to the front surface of the printed circuit board 2, and an exposed copper area 21 is provided on the back surface of the printed circuit board 2 opposite to the driving chip 3.
  • the present invention adopts the chip on board (COB) technology to bind the data drive chip 3 directly on the printed circuit board 2, and in On the back of the printed circuit board 2, the exposed copper design is added at the position corresponding to the data driving chip 3 (that is, the exposed copper area 21 is formed), and the heat dissipation efficiency of the exposed copper area 21 is significantly improved compared to the heat sink in the prior art. It can ensure the heat dissipation effect of the chip, and effectively solve the problem of excessively high chip temperature caused by poor heat dissipation in the prior art.
  • COB chip on board
  • the exposed copper area 21 is used for heat dissipation, there is no need to add an additional heat sink, which saves the cost of the heat sink.
  • the flexible circuit board 4 no longer has the data driving chip 3, Therefore, the size of the flexible circuit board 4 can be made shorter than in the prior art, and the cost of the corresponding flexible circuit board 4 is also lower.
  • the data drive chip 3 and the printed circuit board 2 are both rigid structures.
  • the "hard binding hard” technology is used, while the flexible circuit board 4 is a flexible structure. It is the “hard-tie-soft” technology. Compared with the “hard-tie-soft” technology, the “hard-tie-hard” technology is more mature, the process is simpler, the yield rate is high, and the production efficiency is higher.
  • the area of the horizontal projection of the data driving chip 3 on the printed circuit board 2 is smaller than the area of the exposed copper area 21, that is, It is said that the exposed copper area 21 completely covers the data drive chip 3, the area of the exposed copper area 21 is larger, so the heat dissipation area is also larger, which can improve the heat dissipation effect of the data drive chip 3 and better guarantee the work of the data drive chip 3 stability.
  • an auxiliary heat dissipation layer 5 is further provided on the surface of the exposed copper area 21 away from the data driving chip 3.
  • the auxiliary heat dissipation layer 5 is made of materials with better thermal conductivity than copper.
  • the auxiliary heat dissipation layer 5 is used to assist heat dissipation, which can enhance the heat dissipation capacity, reduce heat accumulation, improve the heat dissipation effect, and improve the operational stability and reliability of the data drive chip 3, and extend Service life.
  • the material of the auxiliary heat dissipation layer 5 is graphene.
  • the auxiliary heat dissipation layer 5 may also be other materials with better thermal conductivity than copper.
  • the auxiliary heat dissipation layer 5 includes a plurality of heat dissipation bars 51 arranged at intervals, and the auxiliary heat dissipation layer 5 is formed by arranging a plurality of heat dissipation bars 51 arranged at intervals to realize distributed heat dissipation. Compared with the entire surface coverage, the uniformity of heat dissipation can be improved.
  • the display device further includes at least one heat conductor 6, and corresponding to the heat conductor 6, the printed circuit board 2 is provided with at least One via 7; each via 7 is provided with a thermal conductor 6, one end of the thermal conductor 6 is in contact with the exposed copper area 21, and the other end is in contact with the data drive chip 3.
  • the heat conductor 6 to transfer heat between the data drive chip 3 and the exposed copper area 21
  • the heat conduction efficiency can be improved, and the heat dissipation effect can be further improved.
  • the material of the thermal conductor 6 can be the same as the conductive material of the printed circuit board, that is, the material of the thermal conductor 6 is copper, or it can be set to a material with better thermal conductivity than copper, for example Graphene.
  • the data driving chip 3 usually includes a plurality of pins (Pin). When it is specifically applied to a display device, not all of the plurality of pins have signal connections. In some embodiments of the present invention, there are usually some pins 31 that are not connected to the signal. These pins that are not connected to the signal are dummy pins 31. In some embodiments of the present invention, the data driving chip 3 It includes at least one blanking pin 31, each blanking pin 31 is in contact with a thermal conductor 6, and the thermal conductor 6 is in direct contact with the blanking pin 31, which can further improve the heat transfer efficiency and optimize the heat dissipation effect .
  • the heat conductor 6 fills the via hole 7 to ensure the heat transfer effect.
  • the display panel 1 is an OLED display panel or a liquid crystal display panel.
  • the present invention provides a display device.
  • the display device includes: a display panel, a flexible circuit board, a printed circuit board, and a data drive chip, the printed circuit board is connected to the display panel through the flexible circuit board; the data drive chip is bound to the printed circuit On the front of the board, the area on the back of the printed circuit board opposite to the driving chip is provided with a copper exposed area, which can improve the heat dissipation effect of the chip, reduce the production cost, and improve the working stability of the product.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示装置，包括：显示面板（1）、柔性电路板（4）、印刷电路板（2）及数据驱动芯片（3），印刷电路板（2）通过柔性电路板（4）连接显示面板（1）；数据驱动芯片（3）绑定于印刷电路板（2）的正面，印刷电路板（2）的背面与数据驱动芯片（3）相对的区域设有露铜区，能够提升芯片散热效果，降低生产成本，提升产品的工作稳定性。

Description

显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种显示装置。
 背景技术
随着显示技术的发展，平板显示装置因具有高画质、省电、机身薄及应用范围广等 优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等 各种消费性电子产品，成为显示装置中的主流。现有的平面显示装置主要包括液晶显示装置（Liquid Crystal Display，LCD）及有机发光二极管显示装置（Organic Light Emitting Display，OLED）。
其中，液晶显示装置通常包括液晶显示面板及背光模组（backlight module），液晶显示面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，通过两片玻璃基板之间施加电压来控制液晶分子改变方向，将背光模组的光线折射出来产生画面。
而OLED显示装置的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED显示面通常采用ITO像素电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
无论是液晶显示装置还是OLED显示装置均需要通过外部电路进行驱动。如图1所示，现有的显示装置包括印刷电路板100（Printed Circuit Board，PCB）、芯片承载薄膜200（Chip On Film，COF）、设置在芯片承载薄膜上的数据驱动芯片300（Source IC）、显示面板400（Panel），芯片承载薄膜的输入端及输出端分别连接印刷电路板100及显示面板400。进一步地，数据驱动芯片300在工作过程中经常会有温度过高的问题，为了解决该问题，通常在芯片承载薄膜上增加散热贴进行改善，但是散热贴的散热能力有限，很多情形下并不能保证将数据驱动芯片300的温度降低并保持在正常的芯片工作温度，并且增加散热贴会导致产品的生产成本的增加。
 技术问题
本发明的目的在于提供一种显示装置，能够提升芯片散热效果，降低生产成本，简化生产工艺。
 技术解决方案
为实现上述目的，本发明提供一种显示装置，包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；
所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区。
所述数据驱动芯片在所述印刷电路板上的水平投影的面积小于所述露铜区的面积。
所述露铜区远离所述数据驱动芯片的一侧表面上还设有辅助散热层。
所述辅助散热层的材料为石墨烯。
所述辅助散热层包括间隔排列的多个散热条。
所述显示装置还包括至少一个导热体，所述印刷电路板上设有至少一个过孔，每一个过孔内均设有一个导热体，所述导热体一端与所述露铜区接触，另一端与数据驱动芯片接触。
所述导热体的材料为铜。
所述导热体的材料为石墨烯。
所述数据驱动芯片包括至少一个置空引脚，每一个置空引脚均与一个导热体接触。
所述导热体填满所述过孔。
 有益效果
本发明的有益效果：本发明提供一种显示装置。所述显示装置包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区，能够提升芯片散热效果，降低生产成本，提升产品的工作稳定性。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的显示装置的示意图；
图2为本发明的显示装置的示意图；
图3为本发明的显示装置的印刷电路板的背面的示意图；
图4为图2中A-A处的剖面图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2及图3，本发明提供一种显示装置，包括：显示面板1、柔性电路板4、印刷电路板2及数据驱动芯片（Source IC）3，所述印刷电路板2通过所述柔性电路板4连接所述显示面板1；
所述数据驱动芯片3绑定于所述印刷电路板2的正面，所述印刷电路板2的背面与所述驱动芯片3相对的区域设有露铜区21。
需要说明的是，相比于现有的COF技术，本发明采用印刷电路板上绑定芯片（Chip on Board，COB）技术，将数据驱动芯片3直接绑定在印刷电路板2上，并且在印刷电路板2的背面，与数据驱动芯片3相对应的位置增加露铜设计（即形成露铜区21），露铜区21的散热效率相比于现有技术中的散热片有明显提升，能够保证芯片的散热效果，有效解决现有技术中散热差导致芯片温度过高的问题。
与此同时，由于采用的露铜区21进行散热，因此也就不需要额外增加散热片，省下了散热片的成本，与此同时，由于柔性电路板4上不再具有数据驱动芯片3，因而柔性电路板4的尺寸也就可以做的比现有技术更短，相应的柔性电路板4的成本也更低。
更进一步地，数据驱动芯片3及印刷电路板2均是硬质结构，在绑定时，采用的是“硬绑硬”技术，而柔性电路板4是柔性结构，在绑定时，采用的是“硬绑软”技术，相比于“硬绑软”技术，“硬绑硬”技术更加成熟，工艺也更加简单，良率高，生产效率也更高。
进一步地，如图3所示，为了在本发明的一些实施例中，所述数据驱动芯片3在所述印刷电路板2上的水平投影的面积小于所述露铜区21的面积，也就是说露铜区21完全覆盖所述数据驱动芯片3，露铜区21的面积较大，从而散热面积也更大，可以提升数据驱动芯片3的散热效果，更好的保障数据驱动芯片3的工作稳定性。
可选地，如图3及图4所示，在本发明的一些实施例中，所述露铜区21远离所述数据驱动芯片3的一侧表面上还设有辅助散热层5，所述辅助散热层5采用导热性能比铜更优的材料制作，利用辅助散热层5辅助散热，可以增强散热能力，减少热量积聚，提升散热效果，提升数据驱动芯片3的运行稳定性和可靠性，延长使用寿命。
优选地，所述辅助散热层5的材料为石墨烯，当然所述辅助散热层5还可以为其他导热性能比铜更优的材料。
具体地，如图3及图4所示，所述辅助散热层5包括间隔排列的多个散热条51，通过设置多个间隔排列的散热条51组成所述辅助散热层5，实现分散散热，相比整面覆盖，能够提升散热的均匀性。
进一步地，如图3及图4所示，在本发明的一些实施例中，所述显示装置还包括至少一个导热体6，对应所述导热体6，所述印刷电路板2上设有至少一个过孔7；每一个过孔7内均设有一个导热体6，所述导热体6一端与所述露铜区21接触，另一端与数据驱动芯片3接触。
需要说明的是，通过设置所述导热体6，在所述数据驱动芯片3以及露铜区21之间进行热量传递，能够提升导热效率，进一步地提升散热效果。
可选地，所述导热体6的材料可以选择与所述印刷电路板的导电材料相同，即所述导热体6的材料为铜，也可以设置为比铜的导热性能更好的材料，例如石墨烯。
值得一提的是，如图2及图4所示，所述数据驱动芯片3通常包括多个引脚（Pin），具体应用到显示装置中时，所述多个引脚并非均有信号接入，通常均会有一些没有接入信号引脚31，该些没有接入信号引脚即为置空引脚（Dummy Pin）31，在本发明的一些实施例中，所述数据驱动芯片3包括至少一个置空引脚31，每一个置空引脚31均与一个导热体6接触，将导热体6与所述置空引脚31直接接触，能够进一步地提升热传递效率，优化散热效果。
可选地，在本发明的一些实施例中，所述导热体6会填满所述过孔7，以保证热传递效果。
具体地，所述显示面板1为OLED显示面板或液晶显示面板。
综上所述，本发明提供一种显示装置。所述显示装置包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区，能够提升芯片散热效果，降低生产成本，提升产品的工作稳定性。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种显示装置，包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；
    所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述数据驱动芯片相对的区域设有露铜区。
  2. 如权利要求1所述的显示装置，其中，所述数据驱动芯片在所述印刷电路板上的水平投影的面积小于所述露铜区的面积。
  3. 如权利要求1所述的显示装置，其中，所述露铜区远离所述数据驱动芯片的一侧表面上还设有辅助散热层。
  4. 如权利要求3所述的显示装置，其中，所述辅助散热层的材料为石墨烯。
  5. 如权利要求3所述的显示装置，其中，所述辅助散热层包括间隔排列的多个散热条。
  6. 如权利要求1所述的显示装置，还包括至少一个导热体，所述印刷电路板上设有至少一个过孔，每一个过孔内均设有一个导热体，所述导热体一端与所述露铜区接触，另一端与数据驱动芯片接触。
  7. 如权利要求6所述的显示装置，其中，所述导热体的材料为铜。
  8. 如权利要求6所述的显示装置，其中，所述导热体的材料为石墨烯。
  9. 如权利要求6所述的显示装置，其中，所述数据驱动芯片包括至少一个置空引脚，每一个置空引脚均与一个导热体接触。
  10. 如权利要求6所述的显示装置，其中，所述导热体填满所述过孔。
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