WO2020118897A1 - 柔性电路板及其制作方法与oled显示装置 - Google Patents

柔性电路板及其制作方法与oled显示装置 Download PDF

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Publication number
WO2020118897A1
WO2020118897A1 PCT/CN2019/075646 CN2019075646W WO2020118897A1 WO 2020118897 A1 WO2020118897 A1 WO 2020118897A1 CN 2019075646 W CN2019075646 W CN 2019075646W WO 2020118897 A1 WO2020118897 A1 WO 2020118897A1
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Prior art keywords
circuit board
substrate
flexible circuit
conductive
layer
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PCT/CN2019/075646
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English (en)
French (fr)
Inventor
熊锐
程江坤
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/609,217 priority Critical patent/US11432404B2/en
Publication of WO2020118897A1 publication Critical patent/WO2020118897A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/165—Material
    • H01L2224/16505—Material outside the bonding interface, e.g. in the bulk of the bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the invention relates to the field of display technology, in particular to a flexible circuit board, a manufacturing method thereof and an OLED display device.
  • Organic Light Emitting Display (Organic Light Emitting Display, OLED) has self-luminous, low driving voltage, high luminous efficiency, short response time, high clarity and contrast, near 180 ° viewing angle, wide operating temperature range, can achieve flexible display and The large area full-color display and many other advantages are recognized by the industry as the most promising display device.
  • OLED can be divided into passive matrix OLED (Passive Matrix) OLED, PMOLED) and Active Matrix OLED (Active Matrix OLED, AMOLED) are two categories, namely direct addressing and thin film transistor (TFT) matrix addressing.
  • AMOLED has pixels arranged in an array, which is an active display type and has high luminous efficacy, and is generally used as a high-definition large-size display device.
  • OLED devices generally include: a substrate, an anode provided on the substrate, a hole injection layer provided on the anode, a hole transport layer provided on the hole injection layer, a light emitting layer provided on the hole transport layer, and a An electron transport layer on the light-emitting layer, an electron injection layer provided on the electron transport layer, and a cathode provided on the electron injection layer.
  • the principle of light emission of OLED devices is that semiconductor materials and organic light-emitting materials are driven by an electric field, and result in light emission through carrier injection and recombination.
  • OLED devices generally use indium tin oxide (ITO) electrodes and metal electrodes as the anode and cathode of the device, respectively, under a certain voltage drive, electrons and holes are injected from the cathode and anode into the electron transport layer and hole transport layer, respectively.
  • ITO indium tin oxide
  • the electrons and holes migrate to the light-emitting layer through the electron-transport layer and the hole-transport layer, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules.
  • the latter emits visible light after radiation relaxation.
  • a flexible substrate made of polyimide (PI) is generally formed on a rigid substrate, and a thin film transistor layer and an OLED layer are formed on the flexible substrate to form an OLED motherboard, and then the OLED motherboard After laser cutting, multiple OLED panels are obtained, and then a flexible circuit board (FPC) is provided and connected to the OLED panel to test the OLED panel.
  • PI polyimide
  • FPC flexible circuit board
  • the flexible circuit board 100 includes a base material 110 and a first lead provided on one side of the base material 110 Layer 120, a circuit board terminal 130 provided on one edge of the substrate 110 and connected to the first conductive layer 120, a first protective layer 140 covering the first conductive layer 120, and a second conductive line provided on the other side of the substrate 110 Layer 150, a second protective layer 160 covering the second wire layer 150.
  • the base substrate 210 of the OLED panel 200 overlaps the base material 110 of the flexible circuit board 100, so that the circuit board terminals 130 and the panel on the base substrate 210 The terminals 220 are connected, and the projection of the portion of the base substrate 210 overlapping the base material 110 away from the center of the base substrate 210 on the flexible circuit board 100 overlaps with the circuit board terminals 130. Due to process limitations, when connecting the flexible circuit board 100 to the OLED panel 200, the connecting jig will bend the flexible circuit board 100 so that the overlapping portion of the base substrate 210 and the flexible circuit board 100 is far from the center of the base substrate 210 The edge is in contact with the circuit board terminal 130.
  • the PI material at the edge of the base substrate 210 of the OLED panel 200 obtained by laser cutting will be severely carbonized to become a conductor, and the edge of the base substrate 210 and the circuit board terminal 130 will be short-circuited.
  • the heat generated burns the flexible circuit board 100 and the OLED panel 200, and the carbonized PI cannot be removed by simple physical cleaning. Adding a new cleaning method will lead to an increase in equipment cost.
  • An object of the present invention is to provide a flexible circuit board, which can prevent a short circuit between a circuit board terminal and an OLED panel when the flexible circuit board is connected to an OLED panel, and improve product quality.
  • Another object of the present invention is to provide a method for manufacturing a flexible circuit board, which can prevent a short circuit between a circuit board terminal and an OLED panel when the manufactured flexible circuit board is connected to an OLED panel, thereby improving product quality.
  • Another object of the present invention is to provide an OLED display device, which can prevent a short circuit between a circuit board terminal of a flexible circuit board and an OLED panel, and improve product quality.
  • the present invention first provides a flexible circuit board, including a substrate, a first conductive layer provided on one side of the substrate, a circuit board terminal provided on an edge of the substrate and connected to the first conductive layer, and A first protective layer covering the first wire layer;
  • the thickness of the circuit board terminal is greater than the sum of the thickness of the first wire layer and the first protective layer.
  • the flexible circuit board further includes a second wire layer disposed on the other side of the substrate and a second protective layer covering the second wire layer.
  • the material of the first wire layer and the second wire layer is copper
  • the material of the first protective layer and the second protective layer is PI.
  • the circuit board terminal includes a conductive block provided on one side edge of the substrate and connected to the first conductive layer, and a conductive film provided on the conductive block.
  • the thickness of the conductive block is greater than the sum of the thicknesses of the first wire layer and the first protective layer; the material of the conductive block and the first wire layer is the same.
  • the conductive film is formed on the conductive block using an electroplating process.
  • the invention also provides a method for manufacturing a flexible circuit board, including the following steps:
  • Step S1 providing a substrate
  • Step S2 forming and patterning a first conductive material film on one side of the substrate to form a first wire layer and a terminal pattern connected to the first wire layer and located on the edge of one side of the substrate;
  • Step S3 forming a conductive material pattern on the terminal pattern to form a conductive block connected to the first conductive layer and located on one side edge of the substrate;
  • Step S4 covering the first protective layer on the first conductive layer
  • Step S5 forming a conductive film on the conductive block to form a circuit board terminal including the conductive block and the conductive film.
  • a second conductive material film is formed and patterned on the other side of the base material to form a second wire layer
  • the step S4 also covers the second protective layer on the second wire layer.
  • a first conductive material film is formed on one side of the substrate by means of hot pressing;
  • step S3 a conductive material pattern is formed on the terminal pattern by hot pressing to form a conductive block
  • a conductive film is formed on the conductive block by means of electroplating.
  • the invention also provides an OLED display device, including an OLED panel and a flexible circuit board electrically connected to the OLED panel;
  • the flexible circuit board is the above-mentioned flexible circuit board
  • the OLED panel includes a substrate substrate and panel terminals provided on one edge of the substrate substrate; a side of the substrate substrate provided with panel terminals is opposite to a side of the substrate provided with circuit board terminals; the substrate The substrate and the base material overlap to connect the circuit board terminal and the panel terminal; the projection of the portion of the base substrate and the base material that overlaps the edge away from the center of the base substrate on the flexible circuit board overlaps the first protective layer .
  • the flexible circuit board of the present invention includes a base material, a first wire layer provided on one side of the base material, a circuit board terminal provided on one edge of the base material and connected to the first wire layer, and covering the first The first protective layer of the lead layer, the thickness of the circuit board terminal is greater than the sum of the thicknesses of the first lead layer and the first protective layer, and when the flexible circuit board is connected to the OLED panel, the base substrate is provided with a panel One side of the terminal is opposite to the side of the base material of the flexible circuit board where the circuit board terminal is provided, the base substrate and the base material are overlapped to connect the circuit board terminal and the panel terminal, and the base substrate and the base material are overlapped The projection of the edge partly away from the center of the base substrate on the flexible circuit board overlaps with the first protective layer, which can effectively prevent the edge of the base substrate from contacting with the circuit board terminals and short-circuiting, improving the quality of the product.
  • the manufacturing method of the flexible circuit board of the present invention can prevent the short circuit between the circuit board terminal and the OLED panel when the manufactured flexible circuit board is connected with the OLED panel, and improve the product quality.
  • the OLED display device of the present invention can prevent a short circuit between the circuit board terminal of the flexible circuit board and the OLED panel, and improve product quality.
  • FIG. 1 is a schematic structural diagram of an existing flexible circuit board
  • FIG. 2 is a schematic diagram of connecting the flexible circuit board shown in FIG. 1 with an OLED panel;
  • FIG. 3 is a schematic structural view of the flexible circuit board of the present invention.
  • step S2 of the method for manufacturing a flexible circuit board of the present invention
  • step S3 is a schematic diagram of step S3 of the method for manufacturing a flexible circuit board of the present invention.
  • step S4 of the method for manufacturing a flexible circuit board of the present invention
  • FIG. 8 is a schematic structural diagram of an OLED display device of the present invention.
  • the present invention provides a flexible circuit board, including a substrate 10 , Set on the substrate 10 First conductor layer on one side 20 , Set on the substrate 10 One side edge and the first wire layer 20 Connected circuit board terminals 30 And cover the first wire layer 20 The first protective layer 40 .
  • the circuit board terminal 30 Is thicker than the first wire layer 20 With the first protective layer 40 The sum of the thickness.
  • the circuit board terminal 30 Including base material 10 One side edge and the first wire layer 20 Connected conductive blocks 31 And located on the conductive block 31 Conductive film 32 .
  • the conductive block 31 Is thicker than the first wire layer 20 With the first protective layer 40 The sum of the thickness.
  • the conductive block 31 Compatible with the first wire layer 20 Made with the same materials.
  • the conductive film 32 Can be formed on conductive block by electroplating process 31 on.
  • the flexible circuit board further includes a base material 10 Second conductor layer on the other side 50 And cover the second wire layer 50 Second protective layer 60 .
  • the first wire layer 20 And the second conductor layer 50 The material can be copper or other low-resistance wire materials.
  • the first protective layer 40 And the second protective layer 60 The material is PI .
  • the flexible circuit board of the present invention is used to electrically connect to OLED panel 1 To transmit test signals to it, said OLED panel 1 Including substrate 101 And on the base substrate 101 Panel terminal on one edge 102 .
  • the base substrate 101 With panel terminals 102 Side with substrate 10 With circuit board terminals 30 The opposite side.
  • the base substrate 101 With substrate 10 Overlapping, making the circuit board terminals 30 With panel terminals 102 To connect the flexible circuit board and OLED panel 1 Electrical connection.
  • the base substrate 101 With substrate 10 The overlapping part is far away from the base substrate 101 The projection of the center edge on the flexible circuit board and the first protective layer 40 overlapping.
  • the base substrate 101 Including rigid substrate and flexible substrate (not shown), panel terminals 102 Set on a flexible substrate, OLED panel 1 Made by laser cutting process, making the base substrate 101 The flexible substrate material at the edges is carbonized.
  • the flexible circuit board of the present invention is provided for OLED panel 1 Of the board terminals contacting the board terminals 30
  • the thickness is greater than that with the circuit board terminals 30 Connected first conductor layer 20 And cover the first wire layer 40
  • the thickness of the 40 The size of the design is such that the flexible circuit board is OLED panel 1 When electrically connected, the base substrate 101 With substrate 10
  • the overlapping part is far away from the base substrate 101
  • the projection of the center edge on the flexible circuit board and the first protective layer 40 After the overlap, so that the flexible circuit board is deformed by the connection fixture, the base substrate 101 With substrate 10
  • the overlapping part is far away from the base substrate 101
  • the edge of the center will not be connected with the board terminal 30 Contact, but with the first protective layer 40 Contact and circuit board terminals 30 With panel terminals 102
  • the connection effect will not be affected by the deformation of the flexible circuit board, even if the base substrate 101
  • the flexible substrate material at the edge conducts electricity due to carbonization, due to the base substrate 101 The edge
  • the present invention also provides the above-mentioned method for manufacturing a flexible circuit board, including the following steps:
  • step S1 See the picture 5 , Provide substrate 10 .
  • step S2 See the picture 5 , In the substrate 10 Forming a first conductive material film on one side and patterning to form a first wire layer 20 And the first conductor layer 20 Connected and located on the substrate 10 Terminal pattern on one edge 39 .
  • the steps S2 In the base material by hot pressing 10 The first conductive material film is formed on one side.
  • steps S2 Still on the substrate 10 Forming a second conductive material film on the other side and patterning to form a second wire layer 50 .
  • step S3 See the picture 6 , In the terminal pattern 39
  • the conductive material pattern is formed on the first conductive layer 20 Connected and located on the substrate 10 Conductive block on one edge 31 .
  • steps S3 In the terminal pattern by hot pressing 39 Conducting conductive material patterns to form conductive blocks 31 .
  • step S4 See the picture 7 , On the first wire layer 20 Cover the first protective layer 40 .
  • step S5 See the picture 8 , In the conductive block 31 Make conductive film on 32 To form a conductive block 31 And conductive film 32 Circuit board terminals 30 .
  • the electroplating method is used in the conductive block 31 Make conductive film on 32 .
  • the flexible circuit board manufactured by the method for manufacturing a flexible circuit board of the present invention is provided for use with OLED panel 1 Of the board terminals contacting the board terminals 30
  • the thickness is greater than that with the circuit board terminals 30 Connected first conductor layer 20 And cover the first wire layer 40
  • the thickness of the 40 The size of the design is such that the flexible circuit board is OLED panel 1 When electrically connected, the base substrate 101 With substrate 10
  • the overlapping part is far away from the base substrate 101
  • the projection of the center edge on the flexible circuit board and the first protective layer 40 After the overlap, so that the flexible circuit board is deformed by the connection fixture, the base substrate 101 With substrate 10
  • the overlapping part is far away from the base substrate 101
  • the edge of the center will not be connected with the board terminal 30 Contact, but with the first protective layer 40 Contact and circuit board terminals 30 With panel terminals 102
  • the connection effect will not be affected by the deformation of the flexible circuit board, even if the base substrate 101
  • the flexible substrate material at the edge conducts electricity
  • the present invention also provides a OLED Display device, including OLED panel 1 And with OLED panel 1 Electrically connected flexible circuit board.
  • the flexible circuit board is the above-mentioned flexible circuit board, and the structure of the flexible circuit board will not be described repeatedly here.
  • Said OLED panel 1 Including substrate 101 And on the base substrate 101 Panel terminal on one edge 102 .
  • the base substrate 101 With panel terminals 102 Side with substrate 10 With circuit board terminals 30 The opposite side.
  • Said OLED panel 1 Made by laser cutting process, making the base substrate 101 The flexible substrate material at the edges is carbonized.
  • the base substrate 101 With substrate 10 Overlapping, making the circuit board terminals 30 With panel terminals 102 connection.
  • the base substrate 101 With substrate 10 The overlapping part is far away from the base substrate 101 The projection of the center edge on the flexible circuit board and the first protective layer 40 overlapping.
  • the base substrate 101 Including the terminal area on the edge 1011 , Panel terminal 102 Set in the terminal area 1011 .
  • Substrate 101 In the terminal area 1011 The thickness is less than the base substrate 101 In the terminal area 1011 The thickness of the outside area.
  • the base substrate 101 With substrate 10 The overlapping part is located in the terminal area 1011 .
  • the present invention OLED
  • the flexible circuit board in the display device is provided for OLED panel 1 Of the board terminals contacting the board terminals 30
  • the thickness is greater than that with the circuit board terminals 30 Connected first conductor layer 20 And cover the first wire layer 40
  • the thickness of the 40 The size is designed so that the base substrate 101 With substrate 10 The overlapping part is far away from the base substrate 101 The projection of the center edge on the flexible circuit board and the first protective layer 40 After the overlap, so that the flexible circuit board is deformed by the connection fixture, the base substrate 101 With substrate 10 The overlapping part is far away from the base substrate 101
  • the edge of the center will not be connected with the board terminal 30 Contact, but with the first protective layer 40 Contact and circuit board terminals 30 With panel terminals 102
  • the connection effect will not be affected by the deformation of the flexible circuit board, even if the base substrate 101
  • the flexible substrate material at the edge conducts electricity due to carbonization, due to the base substrate 101 The edge will not touch the circuit board terminals 30 Contact and thus the base substrate
  • the flexible circuit board of the present invention includes a base material, a first wire layer provided on one side of the base material, a circuit board terminal provided on one edge of the base material and connected to the first wire layer, and covering the first wire
  • the first protective layer of the layer, the thickness of the circuit board terminal is greater than the sum of the thickness of the first wire layer and the first protective layer.
  • the side of the base substrate provided with the panel terminals is opposite to the side of the base material of the flexible circuit board provided with the circuit board terminals, and the base substrate and the base material are overlapped to overlap the circuit board terminals and the panel Terminal connection, the projection of the edge of the base substrate and the base material away from the center of the base substrate on the flexible circuit board overlaps with the first protective layer, which can effectively prevent the edge of the base substrate from contacting the circuit board terminals and shorting.
  • the manufacturing method of the flexible circuit board of the present invention can prevent the flexible circuit board OLED When the panel is connected, the circuit board terminals are OLED A short circuit occurs between the panels, improving product quality.
  • the invention OLED The display device can prevent the circuit board terminals of the flexible circuit board from OLED A short circuit occurs between the panels, improving product quality.

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Abstract

本发明提供一种柔性电路板及其制作方法与OLED显示装置。本发明的柔性电路板包括基材、设于基材一侧的第一导线层、设于基材一侧边缘且与第一导线层连接的电路板端子及覆盖第一导线层的第一保护层，所述电路板端子的厚度大于第一导线层与第一保护层的厚度之和，在将该柔性电路板与OLED面板进行连接时，将衬底基板设有面板端子的一侧与柔性电路板的基材设有电路板端子的一侧相对，使衬底基板与基材相交叠将所述电路板端子与面板端子连接，衬底基板与基材交叠的部分远离衬底基板中心的边缘在柔性电路板上的投影与第一保护层重叠，能够有效防止衬底基板的边缘与电路板端子接触而短路，提升产品的品质。

Description

柔性电路板及其制作方法与OLED显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性电路板及其制作方法与OLED显示装置。
 背景技术
有机发光二极管显示装置（Organic Light Emitting Display，OLED）具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展潜力的显示装置。
OLED按照驱动方式可以分为无源矩阵型OLED（Passive Matrix OLED，PMOLED）和有源矩阵型OLED（Active Matrix OLED，AMOLED）两大类，即直接寻址和薄膜晶体管（TFT）矩阵寻址两类。其中，AMOLED具有呈阵列式排布的像素，属于主动显示类型，发光效能高，通常用作高清晰度的大尺寸显示装置。
OLED器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层及设于电子注入层上的阴极。OLED器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED器件通常采用氧化铟锡（ITO）电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
现有技术一般在刚性衬底上形成材料为聚酰亚胺（PI）的柔性衬底，并在柔性衬底上制作薄膜晶体管层及OLED层，从而形成OLED母板，而后对OLED母板进行激光切割，得到多个OLED面板，之后提供柔性电路板（FPC）并将其与OLED面板连接，以对OLED面板进行测试。请参阅图1，为现有的一种用于与OLED面板连接对其进行测试的柔性电路板的结构示意图，该柔性电路板100包括基材110、设于基材110一侧的第一导线层120、设于基材110一侧边缘且与第一导线层120连接的电路板端子130、覆盖第一导线层120的第一保护层140、设于基材110另一侧的第二导线层150、覆盖第二导线层150的第二保护层160。
请参阅图2，将柔性电路板100与OLED面板200连接时，OLED面板200的衬底基板210与柔性电路板100的基材110相交叠，使电路板端子130与衬底基板210上的面板端子220连接，且衬底基板210与基材110交叠的部分远离衬底基板210中心的边缘在柔性电路板100上的投影与电路板端子130重叠。由于制程所限，将柔性电路板100与OLED面板200连接时，连接治具会将柔性电路板100压弯，使得衬底基板210与柔性电路板100交叠的部分远离衬底基板210中心的边缘与电路板端子130接触，利用激光切割得到的OLED面板200的衬底基板210边缘处的PI材料会发生严重碳化而成为导体，衬底基板210的边缘与电路板端子130接触会发生短路，产生热量烧伤柔性电路板100及OLED面板200，碳化的PI无法通过简单的物理清洗去除，添加新的清洗方式则会导致设备成本的上升。
 技术问题
本发明的目的在于提供一种柔性电路板，能够防止在将柔性电路板与OLED面板连接时电路板端子与OLED面板间发生短路，提升产品质量。
本发明的另一目的在于提供一种柔性电路板的制作方法，能够防止在将制得的柔性电路板与OLED面板连接时电路板端子与OLED面板间发生短路，提升产品质量。
本发明的又一目的在于提供一种OLED显示装置，能够防止柔性电路板的电路板端子与OLED面板间发生短路，提升产品质量。
 技术解决方案
为实现上述目的，本发明首先提供一种柔性电路板，包括基材、设于基材一侧的第一导线层、设于基材一侧边缘且与第一导线层连接的电路板端子及覆盖第一导线层的第一保护层；
所述电路板端子的厚度大于第一导线层与第一保护层的厚度之和。
所述柔性电路板还包括设于基材另一侧的第二导线层及覆盖第二导线层的第二保护层。
所述第一导线层及第二导线层的材料为铜；
所述第一保护层及第二保护层的材料为PI。
所述电路板端子包括设于基材一侧边缘且与第一导线层连接的导电块及设于导电块上的导电膜。
所述导电块的厚度大于第一导线层与第一保护层的厚度之和；所述导电块与第一导线层的材料相同。
所述导电膜采用电镀工艺形成在导电块上。
本发明还提供一种柔性电路板的制作方法，包括如下步骤：
步骤S1、提供基材；
步骤S2、在基材的一侧形成第一导电材料膜并进行图案化，形成第一导线层及与第一导线层连接且位于基材一侧边缘的端子图案；
步骤S3、在端子图案上制作导电材料图案，形成与第一导线层连接且位于基材一侧边缘的导电块；
步骤S4、在第一导线层上覆盖第一保护层；
步骤S5、在导电块上制作导电膜，形成包括导电块及导电膜的电路板端子。
所述步骤S2还在基材的另一侧形成第二导电材料膜并进行图案化，形成第二导线层；
所述步骤S4还在第二导线层上覆盖第二保护层。
所述步骤S2中采用热压的方式在基材的一侧形成第一导电材料膜；
所述步骤S3中采用热压的方式在端子图案上制作导电材料图案以形成导电块；
所述步骤S5中采用电镀的方式在导电块上制作导电膜。
本发明还提供一种OLED显示装置，包括OLED面板及与OLED面板电性连接的柔性电路板；
所述柔性电路板为上述的柔性电路板；
所述OLED面板包括衬底基板及设于衬底基板一侧边缘的面板端子；所述衬底基板设有面板端子的一侧与基材设有电路板端子的一侧相对；所述衬底基板与基材相交叠，使所述电路板端子与面板端子连接；所述衬底基板与基材交叠的部分远离衬底基板中心的边缘在柔性电路板上的投影与第一保护层重叠。
 有益效果
本发明的有益效果：本发明的柔性电路板包括基材、设于基材一侧的第一导线层、设于基材一侧边缘且与第一导线层连接的电路板端子及覆盖第一导线层的第一保护层，所述电路板端子的厚度大于第一导线层与第一保护层的厚度之和，在将该柔性电路板与OLED面板进行连接时，将衬底基板设有面板端子的一侧与柔性电路板的基材设有电路板端子的一侧相对，使衬底基板与基材相交叠将所述电路板端子与面板端子连接，衬底基板与基材交叠的部分远离衬底基板中心的边缘在柔性电路板上的投影与第一保护层重叠，能够有效防止衬底基板的边缘与电路板端子接触而短路，提升产品的品质。本发明的柔性电路板的制作方法能够防止在将制得的柔性电路板与OLED面板连接时电路板端子与OLED面板间发生短路，提升产品质量。本发明的OLED显示装置能够防止柔性电路板的电路板端子与OLED面板间发生短路，提升产品质量。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的一种柔性电路板的结构示意图；
图2为将图1所示的柔性电路板与OLED面板连接的示意图；
图3为本发明的柔性电路板的结构示意图；
图4为本发明的柔性电路板的制作方法的流程图；
图5为本发明的柔性电路板的制作方法的步骤S2的示意图；
图6为本发明的柔性电路板的制作方法的步骤S3的示意图；
图7为本发明的柔性电路板的制作方法的步骤S4的示意图；
图8为本发明的OLED显示装置的结构示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图 3 ，本发明提供一种柔性电路板，包括基材 10 、设于基材 10 一侧的第一导线层 20 、设于基材 10 一侧边缘且与第一导线层 20 连接的电路板端子 30 及覆盖第一导线层 20 的第一保护层 40 。所述电路板端子 30 的厚度大于第一导线层 20 与第一保护层 40 的厚度之和。
具体地，所述电路板端子 30 包括设于基材 10 一侧边缘且与第一导线层 20 连接的导电块 31 及设于导电块 31 上的导电膜 32 。所述导电块 31 的厚度大于第一导线层 20 与第一保护层 40 的厚度之和。
进一步地，所述导电块 31 可与第一导线层 20 采用相同的材料制作。
具体地，所述导电膜 32 可采用电镀工艺形成在导电块 31 上。
具体地，所述的柔性电路板还包括设于基材 10 另一侧的第二导线层 50 及覆盖第二导线层 50 的第二保护层 60 。
具体地，所述第一导线层 20 及第二导线层 50 的材料可为铜或其他低电阻的导线材料。
具体地，所述第一保护层 40 及第二保护层 60 的材料为 PI 。
具体地，请结合图 8 ，本发明的柔性电路板用于电性连接至 OLED 面板 1 以向其传输测试信号，所述 OLED 面板 1 包括衬底基板 101 及设于衬底基板 101 一侧边缘的面板端子 102 。所述衬底基板 101 设有面板端子 102 的一侧与基材 10 设有电路板端子 30 的一侧相对。所述衬底基板 101 与基材 10 相交叠，使所述电路板端子 30 与面板端子 102 连接从而将柔性电路板及 OLED 面板 1 电性连接。所述衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘在柔性电路板上的投影与第一保护层 40 重叠。该衬底基板 101 包括依次设置的刚性基板及柔性基板（未图示），面板端子 102 设置在柔性基板上， OLED 面板 1 通过激光切割制程制作，使得衬底基板 101 边缘的柔性基板材料产生碳化。
需要说明的是，本发明的柔性电路板设置用于与 OLED 面板 1 的面板端子接触的电路板端子 30 的厚度大于与电路板端子 30 连接的第一导线层 20 及覆盖第一导线层 40 的厚度之和，并且通过对第一导线层 40 的尺寸进行设计，使得将柔性电路板与 OLED 面板 1 电性连接时，衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘在柔性电路板上的投影与第一保护层 40 重叠，从而柔性电路板受连接治具的作用发生形变后，衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘不会与电路板端子 30 接触，而是与第一保护层 40 接触，并且电路板端子 30 与面板端子 102 的连接效果不会受柔性电路板的形变的影响，即使衬底基板 101 边缘的柔性基板材料因碳化而导电，由于衬底基板 101 边缘不会与电路板端子 30 接触，从而衬底基板 101 不会与电路板端子 30 产生短路，提升了产品的质量。
请参阅图 4 ，本发明还提供上述的柔性电路板的制作方法，包括如下步骤：
步骤 S1 、请参阅图 5 ，提供基材 10 。
步骤 S2 、请参阅图 5 ，在基材 10 的一侧形成第一导电材料膜并进行图案化，形成第一导线层 20 及与第一导线层 20 连接且位于基材 10 一侧边缘的端子图案 39 。
具体地，所述步骤 S2 中采用热压的方式在基材 10 的一侧形成第一导电材料膜。
具体地，所述步骤 S2 还在基材 10 的另一侧形成第二导电材料膜并进行图案化，形成第二导线层 50 。
步骤 S3 、请参阅图 6 ，在端子图案 39 上制作导电材料图案，形成与第一导线层 20 连接且位于基材 10 一侧边缘的导电块 31 。
具体地，所述步骤 S3 中采用热压的方式在端子图案 39 上制作导电材料图案以形成导电块 31 。
步骤 S4 、请参阅图 7 ，在第一导线层 20 上覆盖第一保护层 40 。
具体地，所述步骤 S4 还在第二导线层 50 上覆盖第二保护层 60 。
步骤 S5 、请参阅图 8 ，在导电块 31 上制作导电膜 32 ，形成包括导电块 31 及导电膜 32 的电路板端子 30 。
具体地，所述步骤 S5 中采用电镀的方式在导电块 31 上制作导电膜 32 。
需要说明的是，本发明的柔性电路板的制作方法制得的柔性电路板设置用于与 OLED 面板 1 的面板端子接触的电路板端子 30 的厚度大于与电路板端子 30 连接的第一导线层 20 及覆盖第一导线层 40 的厚度之和，并且通过对第一导线层 40 的尺寸进行设计，使得将柔性电路板与 OLED 面板 1 电性连接时，衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘在柔性电路板上的投影与第一保护层 40 重叠，从而柔性电路板受连接治具的作用发生形变后，衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘不会与电路板端子 30 接触，而是与第一保护层 40 接触，并且电路板端子 30 与面板端子 102 的连接效果不会受柔性电路板的形变的影响，即使衬底基板 101 边缘的柔性基板材料因碳化而导电，由于衬底基板 101 边缘不会与电路板端子 30 接触，从而衬底基板 101 不会与电路板端子 30 产生短路，提升了产品的质量。
基于同一发明构思，请参阅图 8 ，本发明还提供一种 OLED 显示装置，包括 OLED 面板 1 及与 OLED 面板 1 电性连接的柔性电路板。
所述柔性电路板为上述的柔性电路板，在此不再对柔性电路板的结构进行重复性描述。
所述 OLED 面板 1 包括衬底基板 101 及设于衬底基板 101 一侧边缘的面板端子 102 。所述衬底基板 101 设有面板端子 102 的一侧与基材 10 设有电路板端子 30 的一侧相对。所述 OLED 面板 1 通过激光切割制程制作，使得衬底基板 101 边缘的柔性基板材料产生碳化。所述衬底基板 101 与基材 10 相交叠，使所述电路板端子 30 与面板端子 102 连接。所述衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘在柔性电路板上的投影与第一保护层 40 重叠。
具体地，所述衬底基板 101 包括设于边缘的端子区 1011 ，面板端子 102 设置在端子区 1011 。衬底基板 101 在端子区 1011 的厚度小于衬底基板 101 在端子区 1011 以外区域的厚度。所述衬底基板 101 与基材 10 交叠的部分位于端子区 1011 。
需要说明的是，本发明的 OLED 显示装置中柔性电路板设置用于与 OLED 面板 1 的面板端子接触的电路板端子 30 的厚度大于与电路板端子 30 连接的第一导线层 20 及覆盖第一导线层 40 的厚度之和，并且通过对第一导线层 40 的尺寸进行设计，使得衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘在柔性电路板上的投影与第一保护层 40 重叠，从而柔性电路板受连接治具的作用发生形变后，衬底基板 101 与基材 10 交叠的部分远离衬底基板 101 中心的边缘不会与电路板端子 30 接触，而是与第一保护层 40 接触，并且电路板端子 30 与面板端子 102 的连接效果不会受柔性电路板的形变的影响，即使衬底基板 101 边缘的柔性基板材料因碳化而导电，由于衬底基板 101 边缘不会与电路板端子 30 接触，从而衬底基板 101 不会与电路板端子 30 产生短路，提升了产品的质量。
综上所述，本发明的柔性电路板包括基材、设于基材一侧的第一导线层、设于基材一侧边缘且与第一导线层连接的电路板端子及覆盖第一导线层的第一保护层，所述电路板端子的厚度大于第一导线层与第一保护层的厚度之和，在将该柔性电路板与 OLED 面板进行连接时，将衬底基板设有面板端子的一侧与柔性电路板的基材设有电路板端子的一侧相对，使衬底基板与基材相交叠将所述电路板端子与面板端子连接，衬底基板与基材交叠的部分远离衬底基板中心的边缘在柔性电路板上的投影与第一保护层重叠，能够有效防止衬底基板的边缘与电路板端子接触而短路，提升产品的品质。本发明的柔性电路板的制作方法能够防止在将制得的柔性电路板与 OLED 面板连接时电路板端子与 OLED 面板间发生短路，提升产品质量。本发明的 OLED 显示装置能够防止柔性电路板的电路板端子与 OLED 面板间发生短路，提升产品质量。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种柔性电路板，包括基材、设于基材一侧的第一导线层、设于基材一侧边缘且与第一导线层连接的电路板端子及覆盖第一导线层的第一保护层；
    所述电路板端子的厚度大于第一导线层与第一保护层的厚度之和。
  2. 如权利要求1所述的柔性电路板，还包括设于基材另一侧的第二导线层及覆盖第二导线层的第二保护层。
  3. 如权利要求2所述的柔性电路板，其中，所述第一导线层及第二导线层的材料为铜；
    所述第一保护层及第二保护层的材料为PI。
  4. 如权利要求1所述的柔性电路板，其中，所述电路板端子包括设于基材一侧边缘且与第一导线层连接的导电块及设于导电块上的导电膜。
  5. 如权利要求4所述的柔性电路板，其中，所述导电块的厚度大于第一导线层与第一保护层的厚度之和；所述导电块与第一导线层的材料相同。
  6. 如权利要求4所述的柔性电路板，其中，所述导电膜采用电镀工艺形成在导电块上。
  7. 一种柔性电路板的制作方法，包括如下步骤：
    步骤S1、提供基材；
    步骤S2、在基材的一侧形成第一导电材料膜并进行图案化，形成第一导线层及与第一导线层连接且位于基材一侧边缘的端子图案；
    步骤S3、在端子图案上制作导电材料图案，形成与第一导线层连接且位于基材一侧边缘的导电块；
    步骤S4、在第一导线层上覆盖第一保护层；
    步骤S5、在导电块上制作导电膜，形成包括导电块及导电膜的电路板端子。
  8. 如权利要求7所述的柔性电路板的制作方法，其中，所述步骤S2还在基材的另一侧形成第二导电材料膜并进行图案化，形成第二导线层；
    所述步骤S4还在第二导线层上覆盖第二保护层。
  9. 如权利要求7所述的柔性电路板的制作方法，其中，所述步骤S2中采用热压的方式在基材的一侧形成第一导电材料膜；
    所述步骤S3中采用热压的方式在端子图案上制作导电材料图案以形成导电块；
    所述步骤S5中采用电镀的方式在导电块上制作导电膜。
  10. 一种OLED显示装置，包括OLED面板及与OLED面板电性连接的柔性电路板；
    所述柔性电路板为如权利要求1所述的柔性电路板；
    所述OLED面板包括衬底基板及设于衬底基板一侧边缘的面板端子；所述衬底基板设有面板端子的一侧与基材设有电路板端子的一侧相对；所述衬底基板与基材相交叠，使所述电路板端子与面板端子连接；所述衬底基板与基材交叠的部分远离衬底基板中心的边缘在柔性电路板上的投影与第一保护层重叠。
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