WO2021065828A1 - Procédé de production d'un film conducteur transparent - Google Patents

Procédé de production d'un film conducteur transparent Download PDF

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Publication number
WO2021065828A1
WO2021065828A1 PCT/JP2020/036698 JP2020036698W WO2021065828A1 WO 2021065828 A1 WO2021065828 A1 WO 2021065828A1 JP 2020036698 W JP2020036698 W JP 2020036698W WO 2021065828 A1 WO2021065828 A1 WO 2021065828A1
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Prior art keywords
transparent conductive
base material
conductive film
conductive layer
coating
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PCT/JP2020/036698
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English (en)
Japanese (ja)
Inventor
純一 長瀬
一平 長原
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日東電工株式会社
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Priority to JP2021551266A priority Critical patent/JPWO2021065828A1/ja
Priority to KR1020227010860A priority patent/KR20220072837A/ko
Priority to CN202080069186.XA priority patent/CN114467156A/zh
Publication of WO2021065828A1 publication Critical patent/WO2021065828A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/30—Drying; Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2252/00—Sheets
    • B05D2252/02—Sheets of indefinite length

Definitions

  • the present invention relates to a method for producing a transparent conductive film.
  • a transparent conductive film obtained by forming a metal oxide layer such as ITO (indium-tin composite oxide) on a transparent resin film is often used as an electrode of the touch sensor.
  • the transparent conductive film provided with this metal oxide layer tends to lose its conductivity due to bending, and has a problem that it is difficult to use in applications requiring flexibility such as a flexible display.
  • a transparent conductive film having high flexibility a transparent conductive film containing metal nanowires is known.
  • Metal nanowires are wire-like conductive substances having a diameter of nanometers.
  • the metal nanowires form a mesh, so that a good electrical conduction path is formed with a small amount of metal nanowires, and an opening is formed in the gap between the meshes. Formed to achieve high light transmittance.
  • the metal nanowires are in the form of wires, they are likely to be arranged in an oriented state, and therefore, there is a problem that conductive anisotropy occurs in the transparent conductive film containing the metal nanowires.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a method for producing a transparent conductive film having a small conductive anisotropy while containing metal nanowires. is there.
  • the method for producing a transparent conductive film of the present invention includes a coating step of applying a composition for forming a transparent conductive layer containing a metal nanowire to the base material while transporting a long base material to form a coating layer.
  • the coating layer is dried to form a transparent conductive layer on the base material, and the average inclination angle ⁇ a on the surface of the base material is 0.5 ° or more.
  • the average spacing Sm of the irregularities on the surface of the base material is 0.4 mm or less.
  • a transparent conductive film is provided.
  • This transparent conductive film includes a base material and a transparent conductive layer arranged on one side of the base material, and the average inclination angle ⁇ a of the surface of the base material is 0.6 ° or more.
  • a composition for forming a transparent conductive layer containing a metal nanowire is applied to the base material while transporting the long base material. It includes a coating step of forming a layer and a drying step of drying the coating layer to form a transparent conductive layer on the substrate. Typically, the coating step and the drying step are performed while feeding out the rolled base material and transporting the base material, and the base material 10 and the base material 10 are arranged on one side as shown in FIG. A long transparent conductive film 100 including the transparent conductive layer 20 is formed. In one embodiment, the transparent conductive film is wound up after the drying step.
  • the composition for forming a transparent conductive layer containing metal nanowires is applied to the substrate while transporting the elongated substrate to form the coating layer.
  • the average inclination angle ⁇ a on the surface of the base material is 0.5 ° or more.
  • the metal nanowires are well dispersed in the coating layer and the orientation of the metal nanowires is disturbed, resulting in conductive anisotropy.
  • a small transparent conductive film can be produced.
  • the surface of the base material is the surface on which the coating layer is planned to be formed.
  • the average inclination angle ⁇ a of the surface of the base material is preferably 0.8 ° or more, more preferably 1 ° or more, still more preferably 1.2 ° or more, and particularly preferably 1.4 ° or more. Is. Within such a range, the effect of the above basic invention becomes more remarkable.
  • the upper limit of the average inclination angle ⁇ a is, for example, 3 ° (preferably 2.5 °, more preferably 2 °). In the present specification, the average inclination angle ⁇ a is defined by the following equation (1).
  • ⁇ a tan -1 ⁇ a ⁇ ⁇ ⁇ (1)
  • ⁇ a is the peak and valley of the adjacent peaks in the reference length L of the roughness curve defined in JIS B 0601 (1994 version) as shown in the following equation (2). It is a value obtained by dividing the total (h1 + h2 + h3 ... + Hn) of the difference (height h) from the lowest point by the reference length L.
  • the roughness curve is a curve obtained by removing a surface waviness component longer than a predetermined wavelength from a cross-sectional curve with a phase difference compensation type high frequency filter.
  • the cross-sectional curve is a contour that appears at the cut end when the target surface is cut on a plane perpendicular to the target surface.
  • ⁇ a (h1 + h2 + h3 ... + hn) / L ... (2)
  • the average spacing Sm of the unevenness on the surface of the base material is preferably 0.4 mm or less, more preferably 0.3 mm or less, further preferably 0.25 mm or less, and particularly preferably 0.2 mm or less. Yes, most preferably 0.15 mm or less.
  • the larger the average spacing Sm of the irregularities the more the orientation of the metal nanowires can be reduced, and a transparent conductive film having a particularly small conductive anisotropy can be produced.
  • the lower limit of the average spacing Sm of the unevenness is, for example, 0.03 mm (preferably 0.04 mm).
  • the definition of the average inclination angle ⁇ a is based on JIS B 0601 (1994 version).
  • the arithmetic mean surface roughness Ra of the surface of the base material is preferably 0.05 ⁇ m to 3 ⁇ m, and more preferably 0.1 ⁇ m to 1.5 ⁇ m. Within such a range, a transparent conductive film having a particularly small conductive anisotropy can be produced.
  • the definition of arithmetic mean surface roughness Ra is based on JIS B 0601 (1994 edition).
  • the thickness of the base material is preferably 20 ⁇ m to 200 ⁇ m, more preferably 30 ⁇ m to 150 ⁇ m.
  • the total light transmittance of the base material is preferably 30% or more, more preferably 35% or more, and further preferably 40% or more.
  • any suitable material can be used as the material constituting the above base material.
  • a polymer base material such as a film or a plastic base material is preferably used. This is because the smoothness of the base material and the wettability to the composition for forming the transparent conductive layer are excellent, and the productivity can be significantly improved by the continuous production by the roll.
  • the material constituting the above base material is typically a polymer film containing a thermoplastic resin as a main component.
  • the thermoplastic resin include polyester resins; cycloolefin resins such as polynorbornene; acrylic resins; polycarbonate resins; cellulose resins and the like. Of these, polyester-based resins, cycloolefin-based resins, and acrylic-based resins are preferable. These resins are excellent in transparency, mechanical strength, thermal stability, moisture shielding property and the like.
  • the above-mentioned thermoplastic resin may be used alone or in combination of two or more kinds. Further, it is also possible to use an optical film such as that used for a polarizing plate, for example, a low retardation base material, a high retardation base material, a retardation plate, a brightness improving film, or the like as a base material.
  • Any appropriate method can be adopted as the method for transporting the base material.
  • transport by a transport roll, transport by a transport belt, a combination thereof, and the like can be mentioned.
  • the transport speed is, for example, 5 m / min to 50 m / min.
  • Metal nanowires are conductive substances that are made of metal, have a needle-like or thread-like shape, and have a diameter of nanometers.
  • the metal nanowires may be linear or curved. If a transparent conductive layer made of metal nanowires is used, the metal nanowires have a mesh shape, so that a good electric conduction path can be formed even with a small amount of metal nanowires, and the transparent material has low electric resistance. A conductive film can be obtained. Further, since the metal nanowires have a mesh shape, an opening can be formed in the gap between the meshes to obtain a transparent conductive film having high light transmittance.
  • the ratio (aspect ratio: L / d) of the thickness d to the length L of the metal nanowire is preferably 100 to 100,000, more preferably 50 to 100,000, and particularly preferably 100 to 100. It is 10,000.
  • the metal nanowires having such a large aspect ratio are used, the metal nanowires can intersect well and a small amount of metal nanowires can exhibit high conductivity. As a result, a transparent conductive film having high light transmittance can be obtained.
  • the "thickness of the metal nanowire” means the diameter of the metal nanowire when it has a circular cross section, and means its minor diameter when it has an elliptical cross section, and is polygonal. In some cases it means the longest diagonal.
  • the thickness and length of the metal nanowires can be confirmed by a scanning electron microscope or a transmission electron microscope.
  • the thickness of the metal nanowires is preferably less than 500 nm, more preferably less than 200 nm, particularly preferably 10 nm to 100 nm, and most preferably 10 nm to 50 nm. Within such a range, a transparent conductive layer having high light transmittance can be formed.
  • the length of the metal nanowires is preferably 1 ⁇ m to 1000 ⁇ m, more preferably 10 ⁇ m to 500 ⁇ m, and particularly preferably 10 ⁇ m to 100 ⁇ m. Within such a range, a transparent conductive film having high conductivity can be obtained. Further, when the length of the metal nanowire is in the above range, the effect obtained by specifying the surface shape of the base material as described above becomes large.
  • any suitable metal can be used as long as it is a conductive metal.
  • the metal constituting the metal nanowire include silver, gold, copper, nickel and the like. Further, a material obtained by plating (for example, gold plating) these metals may be used. Of these, silver, copper or gold is preferable, and silver is more preferable, from the viewpoint of conductivity.
  • any appropriate method can be adopted as the method for producing the metal nanowires.
  • Examples thereof include a method of reducing silver nitrate in a solution, a method of applying an applied voltage or a current to the surface of the precursor from the tip of the probe, pulling out a metal nanowire at the tip of the probe, and continuously forming the metal nanowire. ..
  • silver nanowires can be synthesized by liquid-phase reducing a silver salt such as silver nitrate in the presence of a polyol such as ethylene glycol and polyvinylpyrrolidone. Uniform size silver nanowires are available, for example, from Xia, Y. et al. etal. , Chem. Mater. (2002), 14, 4736-4745, Xia, Y. et al. etal. , Nano letters (2003) 3 (7), 955-960, can be mass-produced according to the method described.
  • composition for forming a transparent conductive layer contains metal nanowires.
  • metal nanowires are dispersed in any suitable solvent to prepare a composition for forming a transparent conductive layer.
  • the solvent include water, alcohol solvents, ketone solvents, ether solvents, hydrocarbon solvents, aromatic solvents and the like.
  • the composition for forming a transparent conductive layer may further contain additives such as a resin (binder resin), a conductive material other than metal nanowires (for example, conductive particles), and a leveling agent.
  • the composition for forming a transparent conductive layer includes a plasticizer, a heat stabilizer, a light stabilizer, a lubricant, an antioxidant, an ultraviolet absorber, a flame retardant, a colorant, an antistatic agent, a compatibilizer, a cross-linking agent, and an increase. It may contain additives such as thickeners, inorganic particles, surfactants, and dispersants.
  • the viscosity of the composition for forming the transparent conductive layer is preferably 5 mP ⁇ s / 25 ° C. to 300 mP ⁇ s / 25 ° C., more preferably 10 mP ⁇ s / 25 ° C. to 100 mP ⁇ s / 25 ° C. Within such a range, the effect obtained by specifying the surface shape of the base material as described above becomes large.
  • the viscosity of the composition for forming a transparent conductive layer can be measured with a rheometer (for example, MCR302 manufactured by Anton Pearl Co., Ltd.).
  • the dispersion concentration of the metal nanowires in the composition for forming the transparent conductive layer is preferably 0.01% by weight to 5% by weight. Within such a range, the effect of the present invention becomes remarkable.
  • any appropriate method can be adopted as the method for applying the composition for forming the transparent conductive layer.
  • the coating method include spray coating, bar coating, roll coating, die coating, inkjet coating, screen coating, dip coating, letterpress printing method, intaglio printing method, gravure printing method and the like.
  • the basis weight of the coating layer is preferably 0.3 g / m 2 to 30 g / m 2 , and more preferably 1.6 g / m 2 to 16 g / m 2 . Within such a range, the effect obtained by specifying the surface shape of the base material as described above becomes large.
  • the film thickness of the coating layer is preferably 1 ⁇ m to 50 ⁇ m, and more preferably 2 ⁇ m to 40 ⁇ m.
  • the coating layer is dried to form a transparent conductive layer on the base material.
  • any appropriate drying method for example, natural drying, blast drying, heat drying
  • the drying temperature is typically 80 ° C. to 150 ° C.
  • the drying time is typically 1 to 20 minutes.
  • any appropriate treatment may be performed.
  • a composition for forming a transparent conductive layer containing a binder resin it may be cured by irradiation with ultraviolet rays or the like.
  • FIG. 1 is a schematic cross-sectional view of a transparent conductive film according to one embodiment of the present invention.
  • the transparent conductive film 100 includes a base material 10 and a transparent conductive layer 20 arranged on one side of the base material 10.
  • the surface resistance value of the transparent conductive film is preferably 0.1 ⁇ / ⁇ to 1000 ⁇ / ⁇ , more preferably 0.5 ⁇ / ⁇ to 300 ⁇ / ⁇ , and particularly preferably 1 ⁇ / ⁇ to 200 ⁇ / ⁇ . is there.
  • the ratio (TD / MD) of the surface resistance value in TD (direction orthogonal to MD) to the surface resistance value in MD (conveyance direction) of the transparent conductive film is preferably 0.7 to 1.5, and more. It is preferably 0.8 to 1.2, and more preferably 0.9 to 1.1.
  • the surface resistance value can be measured by "Automatic resistivity measurement system MCP-S620 type / MCP-S521 type" manufactured by Mitsubishi Chemical Analytech.
  • the haze value of the transparent conductive film is preferably 20% or less, more preferably 10% or less, and further preferably 0.1% to 5%.
  • the total light transmittance of the transparent conductive film is preferably 30% or more, more preferably 35% or more, and particularly preferably 40% or more.
  • the average inclination angle ⁇ a of the surface of the base material is 0.6 ° or more, preferably 0.8 ° or more, more preferably 1 ° or more, still more preferably 1.2 ° or more. Particularly preferably, it is 1.4 ° or more. Within such a range, the effect of the above basic invention becomes more remarkable.
  • the upper limit of the average inclination angle ⁇ a is, for example, 3 ° (preferably 2.5 °, more preferably 2 °).
  • the average inclination angle ⁇ a on the surface of the base material is measured before the formation of the transparent conductive layer.
  • the average spacing Sm of the unevenness on the surface of the base material is preferably 0.4 mm or less, more preferably 0.3 mm or less, further preferably 0.25 mm or less, and particularly preferably 0.2 mm or less. Yes, most preferably 0.15 mm or less.
  • the average spacing Sm of the unevenness on the surface of the base material is measured before the formation of the transparent conductive layer.
  • the arithmetic mean surface roughness Ra of the surface of the base material is preferably 0.05 ⁇ m to 3 ⁇ m, and more preferably 0.1 ⁇ m to 1.5 ⁇ m.
  • the arithmetic mean surface roughness Ra of the surface of the base material is measured before the formation of the transparent conductive layer.
  • Basis weight of the transparent conductive layer is preferably 0.001g / m 2 ⁇ 0.09g / m 2, more preferably 0.005g / m 2 ⁇ 0.05g / m 2.
  • the content ratio of the metal nanowires in the transparent conductive layer is preferably 0.1 parts by weight to 50 parts by weight, more preferably 0.1 parts by weight or more, based on 100 parts by weight of the binder resin constituting the transparent conductive layer. It is 30 parts by weight. Within such a range, a transparent conductive film having excellent conductivity and light transmittance can be obtained.
  • the evaluation method in the examples is as follows.
  • the thickness was measured by using a scanning electron microscope "S-4800” manufactured by Hitachi High-Technologies Corporation after embedding it in epoxy resin and cutting it with an ultramicro tome to form a cross section.
  • the surface resistance value of the transparent conductive film (surface resistance value of MD and TD) is measured by the eddy current method using a non-contact surface resistance meter manufactured by Napson Corporation, trade name "EC-80". Measured by. The measurement temperature was 23 ° C.
  • PET film manufactured by Toray Co., Ltd., trade name “U40”, thickness: 23 ⁇ m
  • acrylic monomer manufactured by Osaka Organic Chemical Industry Co., Ltd., trade name "Viscoat # 300", solid content 56% by weight
  • 100 parts by weight 100 parts by weight
  • particles A coating containing 30 parts by weight of Sekisui Kasei Co., Ltd., trade name "Techpolymer SSX-105"
  • an initiator BASF Co., Ltd., trade name "Irgacure 127”
  • butyl acetate 35 parts by weight of butyl acetate
  • the composition for forming a transparent conductive layer prepared in Production Example 1 is applied onto the base material A peeled off from the PET film using a bar coater (manufactured by Daiichi Rika Co., Ltd., product name "Bar Coater No. 16"). Then, it was dried in a blower dryer at 120 ° C. for 2 minutes to form a transparent conductive layer, and a transparent conductive film provided with a base material and a transparent conductive layer was obtained.
  • the average inclination angle ⁇ a of the surface of the base material A on which the transparent conductive layer was formed was 1.5 °, and the average spacing Sm of the irregularities was 0.05 mm.
  • the obtained transparent conductive film was subjected to the above evaluation (2). The results are shown in Table 1.
  • Example 2 Instead of 30 parts by weight of particles (manufactured by Sekisui Plastics, trade name "Techpolymer SSX-105"), 5 parts by weight of particles (manufactured by Soken Kagaku Co., Ltd., trade name "SX-350H”) are used, and a coating liquid is used.
  • Substrate B (thickness: 20 ⁇ m) was formed in the same manner as in Example 1 except that 0.2 parts by weight of a thixo agent (manufactured by Kunimine Kogyo Co., Ltd., trade name “SAN) was added to the mixture.
  • a transparent conductive layer was formed by the same method as in 1, and a transparent conductive film provided with the base material and the transparent conductive layer was obtained.
  • the average inclination angle ⁇ a of the surface of the base material D on which the transparent conductive layer was formed was 0. It was 9.9 °, and the average spacing Sm of the unevenness was 0.15 mm.
  • the obtained transparent conductive film was subjected to the above evaluation (2). The results are shown in Table 1.
  • Example 3 Substrate C (thickness: 20 ⁇ m) was formed in the same manner as in Example 2 except that the amount of particles (manufactured by Soken Kagaku Co., Ltd., trade name “SX-350H”) was 10 parts by weight. Then, a transparent conductive layer was formed by the same method as in Example 1 to obtain a transparent conductive film provided with a base material and a transparent conductive layer. The average inclination angle ⁇ a of the surface of the base material C on which the transparent conductive layer was formed was 1.5 °, and the average spacing Sm of the irregularities was 0.12 mm. The obtained transparent conductive film was subjected to the above evaluation (2). The results are shown in Table 1.
  • the average inclination angle ⁇ a of the surface of the base material D on which the transparent conductive layer was formed was 0.3 °, and the average spacing Sm of the irregularities was 0.19 mm.
  • the obtained transparent conductive film was subjected to the above evaluation (2). The results are shown in Table 1.
  • the composition for forming a transparent conductive layer prepared in Production Example 1 is applied onto the base material C peeled off from the PET film using a bar coater (manufactured by Daiichi Rika Co., Ltd., product name "Bar Coater No. 16"). Then, it was dried in a blower dryer at 120 ° C. for 2 minutes to form a transparent conductive layer, and a transparent conductive film provided with a base material and a transparent conductive layer was obtained.
  • the average inclination angle ⁇ a of the surface of the base material C on which the transparent conductive layer was formed was 0.1 °, and the average spacing Sm of the irregularities was 0.27 mm.
  • the surface resistance value of MD was 41 ⁇ and the surface resistance value of TD was 62 ⁇ .
  • Base material 20 Transparent conductive layer 100 Transparent conductive film

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Abstract

L'invention concerne un procédé de production d'un film conducteur transparent qui comprend un nanofil métallique et qui présente une faible anisotropie conductrice. Le procédé de production d'un film conducteur transparent selon la présente invention comprend : une étape de revêtement pour former une couche de revêtement par revêtement d'un long substrat avec une composition pour former une couche conductrice transparente contenant un nanofil métallique tout en transportant le substrat ; et une étape de séchage pour sécher la couche de revêtement et former une couche conductrice transparente sur le substrat, l'angle d'inclinaison moyen θa de la surface du substrat étant d'au moins 0,5°.
PCT/JP2020/036698 2019-10-02 2020-09-28 Procédé de production d'un film conducteur transparent WO2021065828A1 (fr)

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JP2021551266A JPWO2021065828A1 (fr) 2019-10-02 2020-09-28
KR1020227010860A KR20220072837A (ko) 2019-10-02 2020-09-28 투명 도전성 필름의 제조 방법
CN202080069186.XA CN114467156A (zh) 2019-10-02 2020-09-28 透明导电性膜的制造方法

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JP2019182283 2019-10-02
JP2019-182283 2019-10-02

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095546A1 (fr) * 2009-02-17 2010-08-26 コニカミノルタホールディングス株式会社 Film conducteur transparent et électrode transparente
JP2014075416A (ja) * 2012-10-03 2014-04-24 Tokyo Institute Of Technology 薄膜太陽電池およびその製造方法

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KR101333012B1 (ko) 2005-08-12 2013-12-02 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체
US9776209B2 (en) 2012-02-16 2017-10-03 Okura Industrial Co., Ltd. Transparent electrically conductive substrate and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095546A1 (fr) * 2009-02-17 2010-08-26 コニカミノルタホールディングス株式会社 Film conducteur transparent et électrode transparente
JP2014075416A (ja) * 2012-10-03 2014-04-24 Tokyo Institute Of Technology 薄膜太陽電池およびその製造方法

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