WO2021033245A1 - Tape guide - Google Patents

Tape guide Download PDF

Info

Publication number
WO2021033245A1
WO2021033245A1 PCT/JP2019/032319 JP2019032319W WO2021033245A1 WO 2021033245 A1 WO2021033245 A1 WO 2021033245A1 JP 2019032319 W JP2019032319 W JP 2019032319W WO 2021033245 A1 WO2021033245 A1 WO 2021033245A1
Authority
WO
WIPO (PCT)
Prior art keywords
tape
component
electronic component
guide
carrier tape
Prior art date
Application number
PCT/JP2019/032319
Other languages
French (fr)
Japanese (ja)
Inventor
広康 大橋
貴幸 水野
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2019/032319 priority Critical patent/WO2021033245A1/en
Priority to JP2021541366A priority patent/JP7273977B2/en
Publication of WO2021033245A1 publication Critical patent/WO2021033245A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • This specification relates to a tape guide.
  • a tape guide incorporated in a parts supply device is known (see, for example, Patent Document 1).
  • the parts supply device supplies the electronic parts to the parts removal position in a state of being stored in the parts storage portion of the carrier tape.
  • the carrier tape has a base tape provided with a component storage portion, and a cover tape that is detachably attached to the base tape to close the opening of the component storage portion of the base tape.
  • the tape guide has a guide main body portion extending along the transport direction of the carrier tape, and a component exposed portion that peels off the cover tape from the base tape to expose the electronic components in the component storage portion. ..
  • the guide main body has an upper wall portion that guides the upper surface of the carrier tape and a side wall portion that guides the side surface of the carrier tape.
  • the component exposed portion has a tongue portion extending in the transport direction.
  • the tongue portion is fixed to the guide main body portion by welding or the like.
  • the tongue portion is arranged so that its tip portion is inserted between the base tape and the cover tape of the carrier tape guided by the guide main body portion.
  • a peeling blade is provided on the tongue.
  • the peeling blade peels the cover tape from the base tape after the tip of the tongue has entered between the base tape and the cover tape.
  • the exposed part is formed by inserting the tongue part between the base tape and the cover tape and the peeling blade partially peeling the cover tape from the base tape while the carrier tape guided by the guide main body is being conveyed. Expose the electronic parts in the parts compartment.
  • the cover tape is peeled off from the base tape and the electronic parts in the parts storage portion are exposed as described above, the electronic parts are not covered with the cover tape until the electronic parts reach the parts removal position. Therefore, if the electronic component protrudes from the opening of the component storage portion (that is, the upper surface of the base tape) or the clearance between the upper end of the electronic component and the opening of the component storage portion is small, the electronic component and the exposed component are peeled off.
  • the back surface of the upper wall of the guide body including the blade is likely to come into contact with the back surface, which may damage the electronic components.
  • the present specification provides a tape guide capable of preventing an electronic component in a component storage portion of a carrier tape from being scratched due to contact with a guide main body portion after the electronic component is exposed. With the goal.
  • a carrier tape having a base tape provided with a component storage portion for storing electronic components and a cover tape provided on the surface of the base tape so as to close the opening of the component storage portion.
  • a guide main body portion that extends along the transport direction and guides the carrier tape, and a component exposed portion that exposes the electronic component in the component storage portion of the carrier tape that is guided by the guide main body portion.
  • the tape guide is provided, and the guide main body portion is formed in an opposed region capable of facing the opening of the component storage portion where the electronic component is exposed by the component exposed portion when the carrier tape is conveyed, and the electronic component is provided.
  • a tape guide having an opposing portion having a lower hardness than the tape guide.
  • a carrier tape having a base tape provided with a component storage portion for storing electronic components and a cover tape provided on the surface of the base tape so as to close the opening of the component storage portion is provided.
  • a guide main body portion that extends along the transport direction and guides the carrier tape, and a component exposed portion that exposes the electronic component in the component storage portion of the carrier tape that is guided by the guide main body portion.
  • the tape guide is provided, and the guide main body portion is made of a resin formed in a facing region that can face the opening of the component storage portion where the electronic component is exposed by the component exposed portion when the carrier tape is conveyed.
  • a tape guide having a facing portion is disclosed.
  • the facing portion formed in the facing region that can face the opening of the component storage portion where the electronic component is exposed when the carrier tape is conveyed in the guide main body portion is a portion having a lower hardness than the electronic component. Yes or made of resin.
  • the electronic parts in the parts storage part of the carrier tape are exposed, when the electronic parts in the parts storage part come into contact with the back surface of the guide main body, the electronic parts and the guide main body are not scratched. , Low hardness or resin guide body side. Therefore, after the electronic component is exposed, when the electronic component protrudes from the opening of the component storage portion or the clearance between the upper end of the electronic component and the opening of the component storage portion is small, the electronic component is connected to the guide main body. It is possible to prevent scratches due to contact.
  • FIG. 6 is a sectional view taken along line IV-IV of the carrier tape shown in FIG.
  • It is a block diagram of the component supply device provided in the component mounting machine of the embodiment. It is an enlarged configuration view of the tape insertion port side of the component supply device of an embodiment. It is a block diagram in the vicinity of the tape guide of the component supply device of an embodiment. It is an overall perspective view of the tape guide of an embodiment. It is an overall side view of the tape guide of an embodiment. It is a top view of the main part of the tape guide of an embodiment.
  • XI-XI sectional view of the tape guide shown in FIG. It is a cross-sectional view of XII-XII of the tape guide shown in FIG. It is a top view of the main part of the tape guide which concerns on one deformation form. It is a XIV-XIV sectional view of the tape guide shown in FIG.
  • the configuration of the component supply device 1 of one embodiment and the component mounting machine 100 incorporating the component supply device 1 will be described.
  • the component mounting machine 100 is a device provided on a board production line to mount an electronic component 2 on a board 3 such as a circuit board to be produced. As shown in FIG. 1, the component mounting machine 100 includes a substrate transfer device 110, a component supply device 1, and a component transfer device 120.
  • the electronic component 2 is a component mounted on the substrate 3, and is, for example, a component such as a capacitor, a transistor, a diode, or a resistor that constitutes an electronic circuit. As shown in FIG. 2, the electronic component 2 has a main body portion 2a and an electrode terminal 2b. The main body 2a of the electronic component 2 is formed so as to cover the internal electrode 2c. The main body 2a is made of ceramic or the like. The electrode terminal 2b of the electronic component 2 is connected to the internal electrode 2c via the base electrode layer 2d and is arranged so as to be exposed to the outside. The electrode terminal 2b is made of Ni, Sn, or the like, and is formed on the outer surface of the main body 2a by, for example, plating.
  • the electronic component 2 may include a minute component such as 0201 size (0.2 mm ⁇ 0.1 mm).
  • the board transfer device 110 is a device that conveys the substrate 3.
  • the substrate transfer device 110 includes a pair of guide rails 111 and 112, a conveyor belt (not shown), and a clamp device (not shown).
  • the pair of guide rails 111 and 112 are arranged in parallel on the base at intervals.
  • the conveyor belt is a belt member on which the substrate 3 can be mounted so that the mounted substrate 3 is conveyed along the extending direction of the guide rails 111 and 112 (hereinafter, referred to as the substrate transport direction Y). It can be rotated.
  • the clamp device is provided so as to position the substrate 3 at a predetermined component mounting position.
  • the substrate 3 is conveyed along the substrate transport direction Y by a conveyor belt while being guided by a pair of guide rails 111 and 112, and is positioned by a clamp device when a predetermined component mounting position is reached.
  • the component supply device 1 is a device that supplies the electronic component 2 to the component take-out position P before mounting it on the substrate 3.
  • the component supply device 1 is an auto-loading feeder that automatically conveys the carrier tape 80 in which the electronic component 2 is housed and supplies the electronic component 2 to the component take-out position P.
  • a slot 130 is provided on the base.
  • the slots 130 are arranged adjacent to the substrate transfer device 110 in a direction orthogonal to the substrate transfer direction Y.
  • a plurality of slots 130 are provided side by side in the substrate transport direction Y.
  • the component supply device 1 is detachably mounted in the slot 130, and a plurality of component supply devices 1 can be mounted side by side in the plurality of slots 130.
  • the carrier tape 80 is a tape member formed in a long shape.
  • the carrier tape 80 has a predetermined width dimension (that is, tape width).
  • the tape width of the carrier tape 80 varies depending on the type of the carrier tape 80 or the size of the electronic component 2 to be accommodated, and is predetermined as a standard.
  • the tape width is, for example, 4 mm, 8 mm, 12 mm, 16 mm, 24 mm, or the like.
  • the carrier tape 80 has a base tape 82 and a cover tape 83, as shown in FIGS. 3 and 4.
  • the base tape 82 is made of a flexible material such as a paper material or a resin.
  • the base tape 82 has a component storage portion (that is, a cavity) 84.
  • the component storage unit 84 is a hole or groove for storing the electronic component 2 to be mounted on the substrate by the component mounting machine 100.
  • the carrier tape 80 may be an embossed tape in which the component storage portion 84 of the base tape 82 projects downward, or may be a paper tape provided with a groove-shaped component storage portion 84 on the surface. ..
  • the parts storage portion 84 is provided substantially in the center of the base tape 82 in the tape width direction.
  • a plurality of component storage portions 84 are provided along the longitudinal direction of the tape, and are arranged in a row at predetermined intervals.
  • the bottom tape 85 that closes the bottom portion of the component storage portion 84 is further provided to prevent the electronic component 2 from falling off. It is adhered to the lower surface of the base tape 82.
  • the bottom tape 85 may be made of a transparent or translucent paper material, a polymer film, or the like.
  • the base tape 82 also has a feed hole 86.
  • the feed hole 86 is a through hole provided for transporting the carrier tape 80 in the longitudinal direction of the tape.
  • the feed hole 86 is an engagement hole for engaging the engagement protrusion of the sprocket described later.
  • the feed hole 86 is formed in a substantially circular or elliptical shape.
  • the feed hole 86 is provided at one end of the base tape 82 in the tape width direction.
  • a plurality of feed holes 86 are provided along the longitudinal direction of the tape, and are arranged in a row at predetermined intervals.
  • the component storage portion 84 and the feed hole 86 are arranged in two rows in the tape width direction and are arranged along the tape longitudinal direction.
  • the cover tape 83 is a tape that is peelably adhered to the surface (upper surface) of the base tape 82.
  • the cover tape 83 is arranged so as to close and cover the component storage portion 84 on the surface of the base tape 82.
  • the cover tape 83 is adhered to the surface of the base tape 82 at both ends in the tape width direction except for the central portion in the tape width direction where the component storage portion 84 is provided.
  • the cover tape 83 has a function of preventing the electronic component 2 stored in the component storage unit 84 from jumping out to the outside.
  • the cover tape 83 is made of a transparent polymer film or the like.
  • the cover tape 83 may have a tape width substantially the same as the tape width of the base tape 82, except for a portion where the feed hole 86 is provided in the base tape 82, for example, as shown in FIG.
  • the tape width may be smaller than the tape width of the base tape 82.
  • the tape width of the cover tape 83 may be different depending on the type of the carrier tape 80, that is, the tape width of the base tape 82.
  • the carrier tape 80 is wound around a reel 90 which is a disk-shaped rotating body.
  • the base is provided with a reel holding portion 140.
  • the reel holding portion 140 is arranged adjacent to the slot 130 in a direction orthogonal to the substrate transport direction Y.
  • a plurality of reel holding portions 140 are provided side by side in the substrate transport direction Y corresponding to the slots 130.
  • the reel 90 is detachably and rotatably held by the reel holding portion 140, and a plurality of reels 90 can be held side by side in a plurality of reel holding portions 140.
  • two reel holding portions 140 may be provided side by side in a direction orthogonal to the substrate transport direction Y.
  • the carrier tape 80 wound around the reel 90 held in the reel holding portion 140 in a state of being mounted in the slot 130 is set in a predetermined direction (hereinafter, referred to as a tape transport direction X). Transport along.
  • the tape transport direction X is a direction orthogonal to the substrate transport direction Y with the component supply device 1 mounted in the slot 130.
  • the component supply device 1 includes a main body case 10, a tape transport path 20, a tape feed section 30, and a tape guide 40.
  • the main body case 10 is formed in a thin and flat box shape by a transparent or opaque plastic plate or a metal plate.
  • the main body case 10 has a tape inserting portion 11 and a tape discharging portion 12.
  • the tape insertion portion 11 is an insertion port for inserting the carrier tape 80.
  • the tape insertion portion 11 is provided at the rear portion of the main body case 10 (that is, a portion opposite to the component take-out position P side in the tape transport direction X).
  • the tape discharge unit 12 is a discharge port for discharging the carrier tape 80 to the outside.
  • the tape ejection portion 12 is provided at the front portion of the main body case 10 (that is, a portion on the component take-out position P side in the tape transport direction X).
  • the tape transport path 20 is provided in the main body case 10.
  • the tape transport path 20 extends from the tape insertion portion 11 to the tape discharge portion 12 along the tape transport direction X.
  • the tape transport path 20 is a transport path through which the carrier tape 80 is transported from the tape insertion section 11 to the tape discharge section 12.
  • the tape transport path 20 supports and guides the lower surface of the carrier tape 80 being transported.
  • the tape transport path 20 is formed so as to have a path width equal to or slightly larger than the dimension in the width direction orthogonal to the longitudinal direction of the carrier tape 80.
  • the tape transport path 20 is inclined so that the position gradually increases from the upstream end to the downstream end in the tape transport direction X.
  • the tape transport path 20 is formed so that the most downstream portion extends horizontally.
  • An inlet pushing member 21 and a downstream pushing member 22 are provided in the main body case 10.
  • the inlet pushing member 21 is arranged in the vicinity of the tape insertion portion 11 above the rear portion (upstream side) of the tape transport path 20.
  • the inlet pushing member 21 has a portion extending parallel to the tape transport path 20.
  • the downstream push member 22 is arranged on the front side (downstream side) of the inlet push member 21 above the tape transport path 20.
  • the inlet push member 21 and the downstream push member 22 are provided so as to be detachable from the tape transport path 20, respectively.
  • the entrance push member 21 is arranged below the rear part of the downstream push member 22, and is attached to the rear part of the downstream push member 22.
  • the inlet pushing member 21 and the downstream pushing member 22 can be separated from each other via a pair of shafts 23.
  • the pair of shafts 23 are separated from each other in the tape transport direction X.
  • a spring 24 is arranged around each shaft 23.
  • the spring 24 is interposed between the inlet pushing member 21 and the downstream pushing member 22, and generates an urging force that urges the inlet pushing member 21 downward with respect to the downstream pushing member 22.
  • the inlet pushing member 21 has a function of pressing the carrier tape 80 inserted into the tape inserting portion 11 toward the upper surface of the tape transport path 20 when the spring 24 is urged downward.
  • the downstream push member 22 is attached to the support members 25-1, 25-2 attached to the main body case 10.
  • the support members 25-1 and 25-2 are separated from each other in the tape transport direction X.
  • the downstream push member 22 and the support members 25-1, 25-2 can be separated from each other via the shafts 26-1, 26-2.
  • a spring 27 is arranged around each of the shafts 26-1 and 26-2.
  • the spring 27 is interposed between the downstream push member 22 and the support members 25-1, 25-2, and urges the downstream push member 22 downward with respect to the support members 25-1, 25-2. Generates an urging force.
  • the downstream push member 22 has a function of pressing the carrier tape 80 toward the tape transport path 20 on the downstream side of the inlet push member 21 when being urged downward by the spring 27.
  • the tape feed unit 30 is a portion for transporting the carrier tape 80 drawn from the reel 90 in the tape transport direction X.
  • the tape feed portion 30 has a rear side sprocket 31, a front side sprocket 32, a rear side motor 33, and a front side motor 34.
  • the rear side sprocket 31 is a rotating body that is rotatably supported on the rear side of the main body case 10.
  • the rear sprocket 31 is located on the upstream side of the tape transport direction X (specifically, on the upstream side to the downstream side of the tape transport direction X in the tape transport path 20) with respect to the tape guide 40 (specifically, the tongue portion 46 described later). It is arranged in the inclined part) where the position gradually rises toward.
  • the rear side sprocket 31 rotates about a horizontal support shaft provided below the tape transport path 20 with respect to the main body case 10.
  • the rear sprocket 31 rotates to feed the carrier tape 80 inserted into the tape insertion portion 11 toward the tape discharge portion 12 side along the tape transport path 20.
  • two rear sprockets 31 may be provided side by side in the tape transport direction X.
  • the front side sprocket 32 is a rotating body rotatably supported on the front side of the main body case 10.
  • the front side sprocket 32 is arranged on the tape transport direction X downstream side (specifically, near the component take-out position P) with respect to the tape guide 40 (specifically, the tongue portion 46 described later).
  • the front side sprocket 32 rotates about a horizontal support shaft provided below the tape transport path 20 with respect to the main body case 10.
  • the front side sprocket 32 rotates and feeds the carrier tape 80 conveyed along the tape conveying path 20 toward the tape discharging portion 12 side and further toward the outside from the tape discharging portion 12.
  • two front-side sprockets 32 may be provided side by side in the tape transport direction X.
  • the rear side sprocket 31 and the front side sprocket 32 each have external teeth protruding outward in the radial direction. A plurality of these external teeth are provided at an angular interval corresponding to the interval of the feed holes 86 of the carrier tape 80.
  • the external teeth When the external teeth are located near the uppermost ends of the sprockets 31 and 32, they project upward through the window hole of the tape transport path 20. The external teeth protruding upward from the tape transport path 20 engage with the feed hole 86 of the carrier tape 80.
  • the rear side sprocket 31 is engaged with the output shaft of the rear side motor 33 via the gear 35.
  • the rear side sprocket 31 decelerates and rotates as the rear side motor 33 is driven to rotate.
  • the rear side motor 33 is intermittently driven so as to rotate by a predetermined angle per drive.
  • the front side sprocket 32 is engaged with the output shaft of the front side motor 34 via the gear 36.
  • the front side sprocket 32 decelerates and rotates with the rotation drive of the front side motor 34.
  • the front side motor 34 is intermittently driven so as to rotate by a predetermined angle per drive.
  • An operation lever 37 is provided in the main body case 10.
  • the operation lever 37 is provided so as to project rearward above the position of the tape insertion portion 11 of the main body case 10.
  • the operating lever 37 is rotatably supported by the rear portion of the main body case 10.
  • the operating lever 37 is rotated in a predetermined direction by the urging force of the spring, and is manually rotated in the opposite direction against the urging force of the spring by the operator.
  • the inlet pushing member 21 comes into contact with the tape transport path 20 by the urging force of the spring, so that the new carrier tape 80 cannot be inserted into the tape inserting portion 11. It is possible.
  • the inlet pushing member 21 rises against the urging force of the spring and separates from the tape transport path 20, so that the tape inserting portion 11 A new carrier tape 80 can be inserted into the carrier tape 80.
  • a baffle plate 38 is pivotally supported at the rear part of the entrance push member 21.
  • the baffle plate 38 has a function of blocking the tape insertion portion 11 by its own weight while the inlet pushing member 21 is being pressed toward the tape transport path 20, making it impossible to insert a new carrier tape 80.
  • the baffle plate 38 is rotated by engaging with the rear portion of the downstream push member 22 when the inlet push member 21 is raised, and opens the tape insertion portion 11 so that a new carrier tape 80 can be inserted.
  • a stopper member 39 is provided adjacent to the inlet push member 21 on the downstream side.
  • the stopper member 39 is rotatably supported by the downstream push member 22.
  • the cam portion of the operating lever 37 37a is separated from the cam follower 39a of the stopper member 39.
  • the stopper member 39 brings the contact portion 39c into contact with the tape transport path 20 and the stop portion 39d from the tape transport path 20 by rotating around the shaft support portion 39b by the urging force of the spring (not shown). It is held in a separated state.
  • the cam portion 37a of the operating lever 37 engages with the cam follower 39a of the stopper member 39.
  • the stopper member 39 is rotated around the shaft support portion 39b against the urging force of the spring (not shown), and the stop portion 39d is brought into contact with the tape transport path 20.
  • the carrier tape 80 is inserted into the tape insertion portion 11 in such a state, the inserted carrier tape 80 is stopped by the tip of the carrier tape 80 coming into contact with the stop portion 39d of the stopper member 39.
  • the carrier tape 80 that lifts the contact portion 39c will be referred to as an old carrier tape 80.
  • a new carrier tape 80 hereinafter referred to as a new carrier tape 80
  • the tip of the new carrier tape 80 is a stopper. It comes into contact with the stop portion 39d of the member 39 and is stopped.
  • a top pushing member 28 is provided in the main body case 10.
  • the upper surface pushing member 28 is arranged above the tape transport path 20 between the rear sprocket 31 and the front sprocket 32.
  • the upper surface pushing member 28 is formed and arranged so as to extend parallel to the tape transport path 20.
  • the upper surface pushing member 28 is pivotally supported by the main body case 10 at its front end.
  • the upper surface pushing member 28 is swingably supported by the main body case 10.
  • the upper surface pushing member 28 is urged downward by an urging member 29 such as a torsion spring.
  • the upper surface pushing member 28 has a function of pressing the upper surface of the carrier tape 80 on the tape transport path 20 by being urged downward by the urging member 29 to prevent the carrier tape 80 from floating.
  • the tape guide 40 is a member that guides the carrier tape 80 transported on the tape transport path 20.
  • the tape guide 40 is arranged on the downstream side of the tape transport path 20 in the transport direction.
  • the tape guide 40 is provided in the main body case 10.
  • the tape guide 40 may be attached to the main body case 10 separately, or may be integrally provided with the main body case 10.
  • the tape guide 40 can press the upper surface of the carrier tape 80 on the tape transport path 20, and also peels off the cover tape 83 from the base tape 82 of the carrier tape 80 to remove the electronic component 2 in the component storage portion 84. It can be exposed. In particular, the tape guide 40 is urged and pressed downward with respect to the main body case 10, and even if the tape thickness of the carrier tape 80 changes, the upper surface of the carrier tape 80 is pressed to lift the carrier tape 80. It is possible to prevent the feed hole 86 from being securely engaged with the sprocket.
  • a backup leaf spring 50 and a support leaf spring 51 are provided in the main body case 10, respectively.
  • the backup leaf spring 50 and the support leaf spring 51 are arranged on the downstream side of the tape transport path 20 in the transport direction.
  • the backup leaf spring 50 extends in the tape transport direction X along the tape transport path 20, and is fixed to the main body case 10 at one end with a screw or the like.
  • the backup leaf spring 50 supports the lower surface of the carrier tape 80 (specifically, the base tape 82; including the base tape 82 from which the cover tape 83 has been peeled off) on the tape transport path 20.
  • the backup leaf spring 50 generates an urging force that urges the carrier tape 80 on the tape transport path 20 upward and presses the upper surface of the carrier tape 80 against the upper wall portion 42 described later of the tape guide 40.
  • the tape transport path 20 is provided with a groove in which the component storage portion 84 projecting downward in the embossed carrier tape 80 can be engaged. This groove is formed in a size corresponding to the embossed carrier tape 80 in which the component storage portion 84 is maximized.
  • the support leaf spring 51 is arranged below the groove.
  • One or more support leaf springs 51 (three in the figure) are provided. Each support leaf spring 51 extends in the tape transport direction X along the tape transport path 20, and is fixed to the main body case 10 at one end with a screw or the like.
  • the support leaf spring 51 supports the lower surface of the lower wall of the component storage portion 84 of the carrier tape 80 when the carrier tape 80 on the tape transport path 20 is an embossed carrier tape.
  • the support leaf spring 51 generates a force for suppressing the lower wall of the component storage portion 84 of the carrier tape 80 on the tape transport path 20 from being lowered by its own weight.
  • the tape guide 40 has a guide main body 41 as shown in FIGS. 8, 9, 10, 11, and 12.
  • the guide main body 41 extends along the tape transport direction X and guides the carrier tape 80 on the tape transport path 20.
  • the guide main body 41 is formed in a U-shaped cross section.
  • the guide main body portion 41 has an upper wall portion 42 and a pair of side wall portions 43.
  • the upper wall portion 42 is a portion that is arranged above the tape transport path 20 and faces the upper surface of the carrier tape 80.
  • the upper wall portion 42 has a function of restricting the upward movement of the carrier tape 80 to prevent the carrier tape 80 from floating.
  • Each of the pair of side wall portions 43 extends downward from the widthwise end portion of the upper wall portion 42, and is a portion facing the side surface of the carrier tape 80.
  • the tape guide 40 has a component exposed portion 45.
  • the component exposure portion 45 exposes the electronic component 2 in the component storage portion 84 of the base tape 82 of the carrier tape 80. Specifically, the component exposed portion 45 peels the cover tape 83 from the base tape 82 immediately before the component take-out position P in which the electronic component 2 is taken out by suction or gripping by the component transfer device 120, whereby the electronic component 2 is exposed. To expose.
  • the component exposed portion 45 is integrally provided with the guide main body portion 41.
  • the component exposed portion 45 has a tongue portion 46.
  • the tongue portion 46 is a portion inserted between the base tape 82 and the cover tape 83 during the transportation of the carrier tape 80.
  • An opening 42a is provided in the upper wall portion 42 of the guide main body portion 41.
  • the opening 42a is formed by cutting out a part of the upper wall portion 42.
  • the tongue portion 46 is arranged so as to be exposed to the outside through the opening 42a.
  • the tongue portion 46 is formed so as to extend along the tape transport direction X and is formed in the shape of a horizontal plate.
  • the tongue portion 46 is fixed to the edge of the opening 42a of the guide main body 41 by welding or the like at the downstream end of the tape transport direction X.
  • the tongue portion 46 has a cantilever structure and is integrally attached to the guide main body portion 41, and is provided on the guide main body portion 41.
  • the tongue portion 46 is arranged with the tip portion 46a facing the upstream side in the transport direction of the carrier tape 80.
  • the tongue portion 46 has a predetermined length from the fixed portion fixed to the guide main body portion 41 to the tip portion 46a.
  • the tongue portion 46 has a predetermined width in the tape width direction of the carrier tape 80. This predetermined width is set to be smaller than the tape width of the carrier tape 80.
  • the tongue portion 46 is provided with one end side in the tape width direction (specifically, a feed hole 86) of both ends in the tape width direction in which the cover tape 83 is adhered to the base tape 82 in the width direction of the carrier tape 80. It is arranged so as to be biased to the side opposite to the side where it was struck.
  • the tip 46a of the tongue 46 is located on the other end side in the tape width direction (specifically, the side where the feed hole 86 is provided) on the upstream side in the transport direction, and is located in the other tape width direction. It is formed so as to be inclined from the end side toward the end side in the width direction of one of the above tapes and gradually located on the downstream side in the transport direction.
  • the tongue portion 46 is arranged so that the tip end portion of the tip portion 46a is located directly above the component storage portion 84 of the base tape 82.
  • the back surface (that is, the lower surface) of the tongue portion 46 is formed in a substantially horizontal plane, and in particular, the entire surface thereof is formed so as to face the upper surface of the peripheral region including the component storage portion 84 of the base tape 82. ing.
  • the back surface of the tongue portion 46 has a function of restricting the upward movement of the base tape 82 of the carrier tape 80 to prevent the carrier tape 80 from rising.
  • the base tape 82 of the carrier tape 80 is urged upward by the backup leaf spring 50 so that its upper surface is in contact with the back surface of the tongue portion 46, and is pressed against the back surface of the tongue portion 46.
  • the guide main body 41 has a facing portion 41a.
  • the facing portion 41a is a portion formed in a facing region S (shown by cross-hatching in FIG. 8) that can face the opening of the component storage portion 84 in which the electronic component 2 is exposed by the component exposed portion 45 when the carrier tape 80 is conveyed. Is.
  • the facing portion 41a is formed on the tongue portion 46 of the component exposed portion 45 of the guide main body portion 41.
  • the facing region S is a region in which the electronic component 2 in the component storage portion 84 passes below when the carrier tape 80 is conveyed, and the cover tape 83 is peeled off from the base tape 82 in the tongue portion 46 to expose the electronic component 2.
  • the facing portion 41a has a function of preventing the electronic component 2 from popping out from the component storage portion 84 in which the electronic component 2 is exposed by the component exposed portion 45.
  • the facing portion 41a extends linearly along the tape transport direction X over the entire facing region S of the tongue portion 46.
  • the facing portion 41a has a width equal to or larger than the width of the component storage portion 84 in the tape width direction.
  • the facing portion 41a is formed of a material having a hardness lower than that of the electronic component 2, and specifically, the facing portion 41a is made of a material of a ceramic main body portion 2a of the electronic component 2 and a metal electrode terminal 2b. It is made of a material with low hardness.
  • the material of the facing portion 41a is, for example, a resin such as polyamide or polyacetal.
  • the facing portion 41a is formed by adhering, caulking, fixing, or coating the material made of the material to the facing region S on the back surface of the tongue portion 46.
  • the facing portion 41a may be formed by attaching a resin to the back surface of the metal tongue portion 46 body by adhesion or caulking as described above.
  • the tip of the tip portion 46a of the tongue portion 46 is included in the facing portion 41a.
  • the guide main body 41 also has a metal portion 41b.
  • the metal portion 41b is a portion of the guide main body portion 41 and thus the tongue portion 46 made of metal (for example, stainless steel).
  • the metal portion 41b is a region different from the region where the facing portion 41a is formed (in the present embodiment, the facing region S in the tongue portion 46) (in the present embodiment, a non-facing region different from the facing region S in the tongue portion 46). T; shown by single hatching in FIG. 8).
  • the tongue portion 46 is configured such that the opposing portion 41a is exposed in the entire facing region S and the metal portion 41b is exposed in the non-opposing region T.
  • the peeling blade 47 of the tongue portion 46 is included in the metal portion 41b.
  • the tape guide 40 is provided with a folded portion 49.
  • the folded-back portion 49 is a portion where one end in the tape width direction of the cover tape 83 is peeled off from the base tape 82, and then the end portion in the tape width direction on the peeling side of the cover tape 83 is raised and folded back.
  • the folded-back portion 49 is arranged on the downstream side in the transport direction from the tongue portion 46, and the tip is arranged so as to be located on the tape transport direction X upstream side from the component take-out position P.
  • the folded-back portion 49 is formed in a plate shape, and is formed so that the width increases from the tape transport direction X upstream side to the tape transport direction X downstream side.
  • the folded-back portion 49 is formed and arranged so as to close a part of the opening 42a.
  • the base tape 82 and the cover tape 83 are adhered to each other at the other end in the tape width direction. It is discharged from the main body case 10 to the outside in the same state.
  • the component transfer device 120 is a device for transferring the electronic component 2 supplied to the component take-out position P from the carrier tape 80 toward the substrate 3 positioned at a predetermined component mounting position. As shown in FIG. 1, the component transfer device 120 includes a first slider 121, a second slider 122, and a mounting head 123.
  • the first slider 121 is supported by the base via the guide rails 124 and 125.
  • the guide rails 124 and 125 extend in the tape transport direction X orthogonal to the board transport direction Y by the board transport device 110, and are arranged above the board transport device 110.
  • the first slider 121 is moved along the guide rails 124 and 125 in the tape transport direction X by driving the first servomotor.
  • the second slider 122 is movably attached to the first slider 121 in the substrate transport direction Y.
  • the second slider 122 is moved in the substrate transport direction Y by driving a second servomotor (not shown) fixed to the first slider 121.
  • a mounting head 123 is attached to the second slider 122.
  • the mounting head 123 detachably holds a suction nozzle (not shown) capable of sucking the electronic component 2 or a gripping chuck (not shown) capable of gripping the electronic component 2.
  • the mounting head 123 may be capable of holding a plurality of suction nozzles and gripping chucks.
  • the mounting head 123 can move its position in the vertical direction Z orthogonal to both the tape transport direction X and the substrate transport direction Y.
  • the suction nozzle of the mounting head 123 takes out the electronic component 2 supplied to the component extraction position P by the component supply device 1 from the component storage portion 84 of the carrier tape 80 by using negative pressure or the like, and removes the extracted electronic component 2. By releasing the negative pressure or the like, it is mounted on the substrate 3 positioned at a predetermined component mounting position.
  • the tip of the carrier tape 80 can be inserted to a position where it comes into contact with the stop portion 39d of the stopper member 39.
  • the operating lever 37 is rotated by the urging force of the spring to return to the original position.
  • the inlet pushing member 21 is lowered toward the tape transport path 20 by the urging force of the spring 24, so that the carrier tape 80 is pressed toward the tape transport path 20 and the baffle plate 38 is self-weighted. Closes the tape insertion portion 11.
  • the contact portion 39c of the stopper member 39 comes into contact with the tape transport path 20, and the stop portion 39d is separated from the tape transport path 20.
  • the insertion of the carrier tape 80 into the tape insertion portion 11 is detected, the presence of the carrier tape 80 on the tape transport path 20 is detected, and the operation lever 37 is pressed.
  • the rear motor 33 is driven to rotate the rear sprocket 31.
  • the rear sprocket 31 is outside the carrier tape 80 in a state where the tip side of the carrier tape 80 is allowed to be transported from the stop portion 39d to the tape transport direction X downstream side due to the separation of the stop portion 39d from the tape transport path 20. Since the teeth and the feed hole 86 of the carrier tape 80 rotate in an engaged state, the carrier tape 80 is conveyed to the tape discharge portion 12 side by the rotation of the rear sprocket 31.
  • the tip of the carrier tape 80 When the carrier tape 80 is conveyed by the rotation of the rear sprocket 31, the tip of the carrier tape 80 is pushed from between the guide portion formed at the rear end of the upper surface pushing member 28 and the tape conveying path 20. Enter below 28. Therefore, the tip end side of the carrier tape 80 is conveyed toward the front sprocket 32 side in a state where the upper surface pushing member 28 suppresses the lifting from the tape conveying path 20. Then, when it is detected by the sensor that the tip of the carrier tape 80 has reached the tape transport direction X upstream side of the front side sprocket 32, the rear side motor 33 and the front side motor 34 are driven to drive the rear part. The side sprocket 31 and the front side sprocket 32 rotate intermittently.
  • the carrier tape 80 is conveyed to the tape discharge portion 12 side by the rotation of the front side sprocket 32. Then, during the transfer, the tape transport direction X tip of the carrier tape 80 reaches the tongue portion 46 of the component exposed portion 45 of the tape guide 40 on the tape transport path 20, and the base tape 82 at the tip of the carrier tape 80 in the transport direction. The tip portion 46a of the tongue portion 46 enters between the cover tape 83 and the cover tape 83.
  • the electronic component 2 in the component storage unit 84 is supplied to the component take-out position P.
  • the electronic component 2 supplied to the component take-out position P is attracted or gripped by the component transfer device 120 included in the component mounting machine 100 each time the rotation is stopped during the intermittent rotation of the rear sprocket 31 and the front sprocket 32. It is taken out from the component storage unit 84 and transferred to the substrate 3 on the substrate production line.
  • the carrier tape 80 is moved upward by the backup leaf spring 50 after the cover tape 83 is peeled off from the base tape 82 and the electronic component 2 in the component storage portion 84 is exposed during the transfer on the tape transport path 20.
  • the upper surface of the base tape 82 is conveyed along the tape conveying direction X in a state of being pressed against the back surface of the tongue portion 46.
  • the electronic component 2 is not covered with the cover tape 83 until the component removal position P is reached.
  • a facing portion 41a that prevents the electronic component 2 from popping out from the component storage portion 84 is provided in the facing region S of the tongue portion 46 that can face the opening of the component storage portion 84 of the carrier tape 80.
  • the facing portion 41a is formed of a material (specifically, a resin) having a hardness lower than that of the electronic component 2.
  • the electronic component 2 in the component storage portion 84 of the carrier tape 80 is exposed, when the electronic component 2 in the component storage portion 84 comes into contact with the back surface of the tongue portion 46, the electronic component 2 and the tongue portion Of the 46, the one that is scratched is the tongue portion 46, which has a low hardness. Therefore, after the electronic component 2 is exposed and until it reaches the component take-out position P, the electronic component 2 protrudes from the opening of the component storage portion 84, or the upper end of the electronic component 2 and the opening of the component storage portion 84. When the clearance is small, it is possible to prevent the electronic component 2 from being scratched due to contact with the tongue portion 46. Therefore, it is possible to prevent the electronic component 2 taken out from the carrier tape 80 by the component mounting machine 100 from becoming a defective product.
  • the back surface of the tongue portion 46 is formed in a substantially horizontal plane so that the entire surface surface of the tongue portion 46 faces the upper surface of the peripheral region including the component storage portion 84 of the base tape 82.
  • substantially the entire back surface of the tongue portion 46 abuts on the upper surface of the base tape 82 that is urged upward by the backup leaf spring 50 to support the base tape 82, so that the back surface of the tongue portion 46 is
  • the area where the upper surface of the base tape 82 is supported by the back surface of the tongue portion 46 is larger than the configuration in which a tunnel-shaped groove or a step is formed on the back surface of the electronic component 2 in the component storage portion 84 so as not to come into contact with the electronic component 2. It can be secured to the maximum.
  • the leading edge of the tip portion 46a of the tongue portion 46 is included in the facing portion 41a and is formed of resin, and the peeling blade 47 of the tip portion 46a is included in the metal portion 41b and is made of metal. It is formed.
  • the tip is formed of resin, and a portion (that is, a peeling blade 47) that is inserted into the bonding portion between the base tape 82 and the cover tape 83 to peel off the cover tape 83 from the base tape 82 is formed of metal.
  • the tip of the tip 46a of the tongue portion 46 that first enters between the base tape 82 and the cover tape 83 is located directly above the component storage portion 84 of the base tape 82. Therefore, according to the above configuration, unlike the configuration in which the tip end portion 46a of the tongue portion 46 is formed of metal, the electronic component 2 in the component storage portion 84 is attached to the lower surface of the cover tape 83.
  • the electronic component 2 can be peeled off from the lower surface of the cover tape 83 at the resin portion of the tongue portion 46, whereby the electronic component 2 can be reliably prevented from being scratched. Further, the durability of the peeling blade 47 can be improved as compared with the structure in which the peeling blade 47 for peeling the adhesive portion between the base tape 82 and the cover tape 83 is formed of resin.
  • the facing region S formed on the back surface of the tongue portion 46 of the guide main body portion 41 is a component storage portion in which the electronic component 2 is exposed by the component exposed portion 45 when the carrier tape 80 is conveyed. It is a region that can face the opening of 84 and extends along the tape transport direction X from the exposure start position on the tongue portion 46 to the component take-out position P. Then, the resin facing portion 41a, which has a lower hardness than the electronic component 2, extends linearly along the tape transport direction X over the entire facing region S.
  • the present disclosure is not limited to this, and the facing portion 41a may be formed in a part of the facing region S.
  • the electronic component 2 comes into contact with the tip portion 46a of the tongue portion 46 and damages the electronic component 2.
  • a resin facing portion 41a having a hardness lower than that of the electronic component 2 may be formed only in the facing region S of the tip portion 46a of the tongue portion 46.
  • the electronic component 2 comes into contact with the back surface of the tongue portion 46 during the transfer of the carrier tape 80 after the tongue portion 46 starts to enter between the base tape 82 and the cover tape 83 of the carrier tape 80.
  • the facing portion 41a is formed in the facing region S excluding the tip portion 46a of the tongue portion 46, and the facing portion 41a is not formed in the facing region S of the tip portion 46a. It may be a thing.
  • the tongue portion 46 of the guide main body portion 41 has the tip portion 46a most on the other end side in the tape width direction (specifically, the side where the feed hole 86 is provided). It is formed so as to be located on the upstream side of the tape transport direction X and gradually located on the downstream side of the tape transport direction X from the other end side in the tape width direction to the one end side in the tape width direction described above.
  • the tip of the tip portion 46a is located directly above the component storage portion 84 of the base tape 82, and is provided on the resin facing portion 41a having a hardness lower than that of the electronic component 2.
  • the tongue portion 46 of the guide main body portion 41 has a tip portion 46a on the other end side in the tape width direction (specifically). Is inclined from the side where the feed hole 86 is provided) toward the central portion in the tape width direction and is gradually located on the upstream side in the transport direction, and from the central portion side in the tape width direction to the one end portion in the tape width direction described above. It may be formed so as to be inclined toward the side and gradually located on the downstream side in the transport direction.
  • the leading edge of the tip portion 46a is located slightly offset in the tape width direction with respect to directly above the component storage portion 84 of the base tape 82, and the metal portion 41b (specifically, the tape from the facing portion 41a). It may be provided at a location offset in the width direction).
  • a part of the tongue portion 46 of the guide main body portion 41 (specifically, a portion different from the metal portion 41b including the peeling blade 47) has a hardness higher than that of the electronic component 2.
  • a low resin facing portion 41a is formed.
  • the present disclosure is not limited to this, and it is also possible to form a resin facing portion 41a having a hardness lower than that of the electronic component 2 on the entire tongue portion 46 (particularly, the entire lower surface). Good.
  • the back surface of the tongue portion 46 of the guide main body portion 41 is substantially horizontal so that the entire surface of the tongue portion 46 faces the upper surface of the peripheral region including the component storage portion 84 of the base tape 82. Is formed in.
  • the present disclosure is not limited to this, so that the back surface of the tongue portion 46 does not come into contact with the electronic component 2 in the component storage portion 84 of the carrier tape 80, particularly with respect to the facing portion 41a. It may have a tunnel-shaped groove or a step.
  • the distance between the back surface of the portion where the groove or step of the tongue portion 46 is formed and the upper surface of the carrier tape 80 (specifically, the base tape 82) becomes relatively large. Therefore, the possibility that the electronic component 2 in the component storage portion 84 comes into contact with the back surface of the tongue portion 46 can be suppressed to a low level.
  • the facing portion 41a is formed of a material (specifically, a resin) having a hardness lower than that of the electronic component 2. Therefore, the posture of the electronic component 2 changes in the space between the back surface of the portion where the groove or step of the tongue portion 46 is formed and the bottom surface of the component storage portion 84, and the electronic component 2 is placed on the back surface of the tongue portion 46. Even if the component 2 comes into contact with the electronic component 2, it is possible to prevent the electronic component 2 from being scratched.
  • the spring 50 or the like is provided with a magnet or the like that generates a magnetic force that attracts and holds the electronic component 2 on the bottom surface side in the component storage portion 84.
  • the cover tape 83 is adhered to the base tape 82, and the electronic component 2 in the component storage portion 84 is covered with the cover tape 83, and then the release blade 47 of the component exposed portion 45 is used as the base.
  • the electronic component 2 is exposed by being inserted into the bonding portion between the tape 82 and the cover tape 83 and the cover tape 83 being partially peeled off from the base tape 82.
  • the present disclosure is not limited to this, and in exposing the electronic component 2 in the component storage portion 84, the cover tape 83 is taped with a cutter without peeling the cover tape 83 from the base tape 82. It may be applied to a configuration in which a double door is opened by being divided into two in the width direction.
  • the component supply device 1 is an auto-loading feeder that automatically conveys the carrier tape 80 containing the electronic component 2 from the tape insertion portion 11 to the tape discharge portion 12 of the main body case 10. is there.
  • the present disclosure is not limited to this, and the component supply device 1 may be a cassette type tape feeder covered with a cassette case.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

In order to prevent an electronic component from being damaged due to contact with a guide body portion after the electronic component is exposed, this tape guide is provided with: a guide body portion extending in a transfer direction along which a carrier tape is transferred and guiding the carrier tape, the carrier tape including a base tape and a cover tape, the base tape having a component storing portion for storing an electronic component, the cover tape being provided on a surface of the base tape so as to close an opening of the component storing portion; and a component exposing portion which exposes the electronic component in the component storing portion of the carrier tape being guided by the guide body portion. The guide body portion is formed in an opposing region that can be opposite the opening of the component storing portion from which the electronic component is exposed by the component exposing portion during the transfer of the carrier tape, wherein the guide body portion has an opposing portion with a low hardness compared to the electronic component.

Description

テープガイドTape guide
　本明細書は、テープガイドに関する。 This specification relates to a tape guide.
　従来、部品供給装置に組み入れられるテープガイドが知られている（例えば、特許文献１参照）。部品供給装置は、電子部品をキャリアテープの部品収納部に収納した状態で部品取出位置に供給する。キャリアテープは、部品収納部が設けられたベーステープと、そのベーステープに剥離可能に貼付されてそのベーステープの部品収納部の開口を閉塞するカバーテープと、を有している。 Conventionally, a tape guide incorporated in a parts supply device is known (see, for example, Patent Document 1). The parts supply device supplies the electronic parts to the parts removal position in a state of being stored in the parts storage portion of the carrier tape. The carrier tape has a base tape provided with a component storage portion, and a cover tape that is detachably attached to the base tape to close the opening of the component storage portion of the base tape.
　上記のテープガイドは、キャリアテープの搬送方向に沿って延在するガイド本体部と、ベーステープからカバーテープを剥離して部品収納部内の電子部品を露出させる部品露出部と、を有している。ガイド本体部は、キャリアテープの上面をガイドする上壁部と、キャリアテープの側面をガイドする側壁部と、を有している。部品露出部は、搬送方向に延びる舌部を有している。舌部は、ガイド本体部に溶接などで固定されている。舌部は、その先端部が、ガイド本体部にガイドされるキャリアテープのベーステープとカバーテープとの間に挿入されるように配置されている。舌部には、剥離刃が設けられている。剥離刃は、舌部の先端部がベーステープとカバーテープとの間に進入した後、ベーステープからカバーテープを剥離する。部品露出部は、ガイド本体部にガイドされるキャリアテープの搬送中、舌部がベーステープとカバーテープとの間に挿入されて剥離刃がベーステープからカバーテープを部分的に剥離することで、部品収納部内の電子部品を露出させる。 The tape guide has a guide main body portion extending along the transport direction of the carrier tape, and a component exposed portion that peels off the cover tape from the base tape to expose the electronic components in the component storage portion. .. The guide main body has an upper wall portion that guides the upper surface of the carrier tape and a side wall portion that guides the side surface of the carrier tape. The component exposed portion has a tongue portion extending in the transport direction. The tongue portion is fixed to the guide main body portion by welding or the like. The tongue portion is arranged so that its tip portion is inserted between the base tape and the cover tape of the carrier tape guided by the guide main body portion. A peeling blade is provided on the tongue. The peeling blade peels the cover tape from the base tape after the tip of the tongue has entered between the base tape and the cover tape. The exposed part is formed by inserting the tongue part between the base tape and the cover tape and the peeling blade partially peeling the cover tape from the base tape while the carrier tape guided by the guide main body is being conveyed. Expose the electronic parts in the parts compartment.
特開２００７－２８０９７９号公報JP-A-2007-280979
　ところで、上記の如くベーステープからカバーテープが剥離して部品収納部内の電子部品が露出すると、その後、電子部品が部品取出位置に達するまで、電子部品がカバーテープで覆われなくなる。このため、この電子部品が部品収納部の開口（すなわちベーステープの上面）から飛び出ている或いはこの電子部品の上端と部品収納部の開口とのクリアランスが小さいと、電子部品と部品露出部の剥離刃を含むガイド本体部の上壁部の裏面とが接触し易くなり、電子部品に傷が付くおそれがある。 By the way, when the cover tape is peeled off from the base tape and the electronic parts in the parts storage portion are exposed as described above, the electronic parts are not covered with the cover tape until the electronic parts reach the parts removal position. Therefore, if the electronic component protrudes from the opening of the component storage portion (that is, the upper surface of the base tape) or the clearance between the upper end of the electronic component and the opening of the component storage portion is small, the electronic component and the exposed component are peeled off. The back surface of the upper wall of the guide body including the blade is likely to come into contact with the back surface, which may damage the electronic components.
　本明細書は、キャリアテープの部品収納部内の電子部品が露出した後、その電子部品にガイド本体部との接触に起因して傷が付くのを防止することが可能なテープガイドを提供することを目的とする。 The present specification provides a tape guide capable of preventing an electronic component in a component storage portion of a carrier tape from being scratched due to contact with a guide main body portion after the electronic component is exposed. With the goal.
　本明細書は、電子部品を収納する部品収納部が設けられたベーステープと、前記ベーステープの表面に前記部品収納部の開口を閉塞するように設けられたカバーテープと、を有するキャリアテープが搬送される搬送方向に沿って延び、前記キャリアテープをガイドするガイド本体部と、前記ガイド本体部にガイドされる前記キャリアテープの前記部品収納部内の前記電子部品を露出させる部品露出部と、を備えるテープガイドであって、前記ガイド本体部は、前記キャリアテープの搬送時に前記部品露出部により前記電子部品が露出する前記部品収納部の前記開口に対向し得る対向領域に形成され、前記電子部品に比して硬度の低い対向部を有する、テープガイドを開示する。 In the present specification, a carrier tape having a base tape provided with a component storage portion for storing electronic components and a cover tape provided on the surface of the base tape so as to close the opening of the component storage portion is provided. A guide main body portion that extends along the transport direction and guides the carrier tape, and a component exposed portion that exposes the electronic component in the component storage portion of the carrier tape that is guided by the guide main body portion. The tape guide is provided, and the guide main body portion is formed in an opposed region capable of facing the opening of the component storage portion where the electronic component is exposed by the component exposed portion when the carrier tape is conveyed, and the electronic component is provided. Disclosed is a tape guide having an opposing portion having a lower hardness than the tape guide.
　本明細書は、電子部品を収納する部品収納部が設けられたベーステープと、前記ベーステープの表面に前記部品収納部の開口を閉塞するように設けられたカバーテープと、を有するキャリアテープが搬送される搬送方向に沿って延び、前記キャリアテープをガイドするガイド本体部と、前記ガイド本体部にガイドされる前記キャリアテープの前記部品収納部内の前記電子部品を露出させる部品露出部と、を備えるテープガイドであって、前記ガイド本体部は、前記キャリアテープの搬送時に前記部品露出部により前記電子部品が露出する前記部品収納部の前記開口に対向し得る対向領域に形成された樹脂製の対向部を有する、テープガイドを開示する。 In the present specification, a carrier tape having a base tape provided with a component storage portion for storing electronic components and a cover tape provided on the surface of the base tape so as to close the opening of the component storage portion is provided. A guide main body portion that extends along the transport direction and guides the carrier tape, and a component exposed portion that exposes the electronic component in the component storage portion of the carrier tape that is guided by the guide main body portion. The tape guide is provided, and the guide main body portion is made of a resin formed in a facing region that can face the opening of the component storage portion where the electronic component is exposed by the component exposed portion when the carrier tape is conveyed. A tape guide having a facing portion is disclosed.
　本開示によれば、ガイド本体部におけるキャリアテープの搬送時に電子部品が露出する部品収納部の開口に対向し得る対向領域に形成された対向部が、電子部品に比して硬度が低い部位であり又は樹脂製である。この構成においては、キャリアテープの部品収納部内の電子部品が露出した後、その部品収納部内の電子部品がガイド本体部の裏面に接触したとき、電子部品及びガイド本体部のうち傷が付くのは、硬度の低い又は樹脂製のガイド本体部側である。従って、電子部品の露出後、その電子部品が部品収納部の開口から飛び出ている或いはその電子部品の上端と部品収納部の開口とのクリアランスが小さいときに、その電子部品にガイド本体部との接触に起因して傷が付くのを防止することができる。 According to the present disclosure, the facing portion formed in the facing region that can face the opening of the component storage portion where the electronic component is exposed when the carrier tape is conveyed in the guide main body portion is a portion having a lower hardness than the electronic component. Yes or made of resin. In this configuration, after the electronic parts in the parts storage part of the carrier tape are exposed, when the electronic parts in the parts storage part come into contact with the back surface of the guide main body, the electronic parts and the guide main body are not scratched. , Low hardness or resin guide body side. Therefore, after the electronic component is exposed, when the electronic component protrudes from the opening of the component storage portion or the clearance between the upper end of the electronic component and the opening of the component storage portion is small, the electronic component is connected to the guide main body. It is possible to prevent scratches due to contact.
一実施形態に係る部品装着機の全体構成図である。It is an overall block diagram of the component mounting machine which concerns on one Embodiment. 実施形態のキャリアテープに収納される電子部品の断面図である。It is sectional drawing of the electronic component housed in the carrier tape of embodiment. 実施形態のキャリアテープの上面図である。It is a top view of the carrier tape of an embodiment. 図３に示すキャリアテープのIV－IV断面図である。FIG. 6 is a sectional view taken along line IV-IV of the carrier tape shown in FIG. 実施形態の部品装着機が備える部品供給装置の構成図である。It is a block diagram of the component supply device provided in the component mounting machine of the embodiment. 実施形態の部品供給装置のテープ挿入口側の拡大構成図である。It is an enlarged configuration view of the tape insertion port side of the component supply device of an embodiment. 実施形態の部品供給装置のテープガイド近傍の構成図である。It is a block diagram in the vicinity of the tape guide of the component supply device of an embodiment. 実施形態のテープガイドの全体斜視図である。It is an overall perspective view of the tape guide of an embodiment. 実施形態のテープガイドの全体側面図である。It is an overall side view of the tape guide of an embodiment. 実施形態のテープガイドの要部上面図である。It is a top view of the main part of the tape guide of an embodiment. 図１０に示すテープガイドのXI－XI断面図である。It is XI-XI sectional view of the tape guide shown in FIG. 図１０に示すテープガイドのXII－XII断面図である。It is a cross-sectional view of XII-XII of the tape guide shown in FIG. 一変形形態に係るテープガイドの要部上面図である。It is a top view of the main part of the tape guide which concerns on one deformation form. 図１３に示すテープガイドのXIV－XIV断面図である。It is a XIV-XIV sectional view of the tape guide shown in FIG.
　１．テープガイドを含む部品供給装置及びその部品供給装置を含む部品装着機の構成
　一実施形態の部品供給装置１及びその部品供給装置１が組み込まれた部品装着機１００の構成について説明する。部品装着機１００は、基板生産ライン上に設けられて、生産対象である回路基板などの基板３に電子部品２を装着する装置である。部品装着機１００は、図１に示す如く、基板搬送装置１１０と、部品供給装置１と、部品移載装置１２０と、を備えている。 1. 1. Configuration of a component supply device including a tape guide and a component mounting machine including the component supply device The configuration of the component supply device 1 of one embodiment and the component mounting machine 100 incorporating the component supply device 1 will be described. The component mounting machine 100 is a device provided on a board production line to mount an electronic component 2 on a board 3 such as a circuit board to be produced. As shown in FIG. 1, the component mounting machine 100 includes a substrate transfer device 110, a component supply device 1, and a component transfer device 120.
　電子部品２は、基板３上に搭載される部品であって、例えば電子回路を構成するコンデンサやトランジスタ，ダイオード，抵抗などの部品である。電子部品２は、図２に示す如く、本体部２ａと、電極端子２ｂと、を有している。電子部品２の本体部２ａは、内部電極２ｃを覆うように形成されている。本体部２ａは、セラミックなどにより構成されている。電子部品２の電極端子２ｂは、内部電極２ｃに下地電極層２ｄを介して接続されていると共に、外部に露出するように配置されている。電極端子２ｂは、ＮｉやＳｎなどにより構成されており、例えばメッキ処理により本体部２ａの外面に形成されている。尚、電子部品２は、例えば０２０１サイズ（０．２ｍｍ×０．１ｍｍ）などの微小部品を含んでよい。 The electronic component 2 is a component mounted on the substrate 3, and is, for example, a component such as a capacitor, a transistor, a diode, or a resistor that constitutes an electronic circuit. As shown in FIG. 2, the electronic component 2 has a main body portion 2a and an electrode terminal 2b. The main body 2a of the electronic component 2 is formed so as to cover the internal electrode 2c. The main body 2a is made of ceramic or the like. The electrode terminal 2b of the electronic component 2 is connected to the internal electrode 2c via the base electrode layer 2d and is arranged so as to be exposed to the outside. The electrode terminal 2b is made of Ni, Sn, or the like, and is formed on the outer surface of the main body 2a by, for example, plating. The electronic component 2 may include a minute component such as 0201 size (0.2 mm × 0.1 mm).
　基板搬送装置１１０は、基板３を搬送する装置である。基板搬送装置１１０は、図１に示す如く、一対のガイドレール１１１，１１２と、コンベアベルト（図示せず）と、クランプ装置（図示せず）と、を有している。一対のガイドレール１１１，１１２は、基台上に互いに間隔を空けて平行に配置されている。コンベアベルトは、基板３を載置可能なベルト部材であって、載置した基板３がガイドレール１１１，１１２の延びる方向（以下、基板搬送方向Ｙと称す。）に沿って搬送されるように輪転可能である。クランプ装置は、基板３を所定の部品装着位置に位置決めするように設けられている。基板３は、一対のガイドレール１１１，１１２により案内されつつコンベアベルトにより基板搬送方向Ｙに沿って搬送され、所定の部品装着位置に達した際にクランプ装置によって位置決めされる。 The board transfer device 110 is a device that conveys the substrate 3. As shown in FIG. 1, the substrate transfer device 110 includes a pair of guide rails 111 and 112, a conveyor belt (not shown), and a clamp device (not shown). The pair of guide rails 111 and 112 are arranged in parallel on the base at intervals. The conveyor belt is a belt member on which the substrate 3 can be mounted so that the mounted substrate 3 is conveyed along the extending direction of the guide rails 111 and 112 (hereinafter, referred to as the substrate transport direction Y). It can be rotated. The clamp device is provided so as to position the substrate 3 at a predetermined component mounting position. The substrate 3 is conveyed along the substrate transport direction Y by a conveyor belt while being guided by a pair of guide rails 111 and 112, and is positioned by a clamp device when a predetermined component mounting position is reached.
　部品供給装置１は、電子部品２を基板３への装着前に部品取出位置Ｐまで供給する装置である。部品供給装置１は、電子部品２が収納されているキャリアテープ８０を自動的に搬送して、その電子部品２を部品取出位置Ｐまで供給するオートローディングフィーダである。基台には、スロット１３０が設けられている。スロット１３０は、基板搬送装置１１０に対して基板搬送方向Ｙに直交する方向に隣接して配置されている。スロット１３０は、基板搬送方向Ｙに並んで複数設けられている。部品供給装置１は、スロット１３０に着脱可能に装着され、複数のスロット１３０に並んで複数装着されることが可能である。 The component supply device 1 is a device that supplies the electronic component 2 to the component take-out position P before mounting it on the substrate 3. The component supply device 1 is an auto-loading feeder that automatically conveys the carrier tape 80 in which the electronic component 2 is housed and supplies the electronic component 2 to the component take-out position P. A slot 130 is provided on the base. The slots 130 are arranged adjacent to the substrate transfer device 110 in a direction orthogonal to the substrate transfer direction Y. A plurality of slots 130 are provided side by side in the substrate transport direction Y. The component supply device 1 is detachably mounted in the slot 130, and a plurality of component supply devices 1 can be mounted side by side in the plurality of slots 130.
　キャリアテープ８０は、長尺状に形成されたテープ部材である。キャリアテープ８０は、所定の幅寸法（すなわちテープ幅）を有している。一般的には、キャリアテープ８０のテープ幅は、キャリアテープ８０の種類或いは収容する電子部品２の大きさに応じて異なり、予め規格として定められている。このテープ幅は、例えば、４ｍｍや８ｍｍ，１２ｍｍ，１６ｍｍ，２４ｍｍ幅などである。 The carrier tape 80 is a tape member formed in a long shape. The carrier tape 80 has a predetermined width dimension (that is, tape width). Generally, the tape width of the carrier tape 80 varies depending on the type of the carrier tape 80 or the size of the electronic component 2 to be accommodated, and is predetermined as a standard. The tape width is, for example, 4 mm, 8 mm, 12 mm, 16 mm, 24 mm, or the like.
　キャリアテープ８０は、図３及び図４に示す如く、ベーステープ８２と、カバーテープ８３と、を有している。ベーステープ８２は、紙材や樹脂等の柔軟な材料により構成されている。ベーステープ８２は、部品収納部（すなわち、キャビティ）８４を有している。部品収納部８４は、部品装着機１００で基板に装着する電子部品２を収納する孔又は溝である。尚、キャリアテープ８０は、ベーステープ８２の部品収納部８４が下方に突出したエンボス型のテープであってもよいし、表面に溝状の部品収納部８４が設けられた紙テープであってもよい。 The carrier tape 80 has a base tape 82 and a cover tape 83, as shown in FIGS. 3 and 4. The base tape 82 is made of a flexible material such as a paper material or a resin. The base tape 82 has a component storage portion (that is, a cavity) 84. The component storage unit 84 is a hole or groove for storing the electronic component 2 to be mounted on the substrate by the component mounting machine 100. The carrier tape 80 may be an embossed tape in which the component storage portion 84 of the base tape 82 projects downward, or may be a paper tape provided with a groove-shaped component storage portion 84 on the surface. ..
　部品収納部８４は、ベーステープ８２のテープ幅方向の略中央に設けられている。部品収納部８４は、テープ長手方向に沿って複数設けられており、所定間隔で一列に並んで配置されている。尚、図４に示す如く、部品収納部８４がベーステープ８２を貫通する孔であるときは、電子部品２の脱落を防止するため、更に、その部品収納部８４の底部を塞ぐボトムテープ８５がベーステープ８２の下面に接着される。このボトムテープ８５は、透明又は半透明の紙材や高分子フィルムなどにより構成されればよい。 The parts storage portion 84 is provided substantially in the center of the base tape 82 in the tape width direction. A plurality of component storage portions 84 are provided along the longitudinal direction of the tape, and are arranged in a row at predetermined intervals. As shown in FIG. 4, when the component storage portion 84 is a hole penetrating the base tape 82, the bottom tape 85 that closes the bottom portion of the component storage portion 84 is further provided to prevent the electronic component 2 from falling off. It is adhered to the lower surface of the base tape 82. The bottom tape 85 may be made of a transparent or translucent paper material, a polymer film, or the like.
　ベーステープ８２は、また、送り孔８６を有している。送り孔８６は、キャリアテープ８０をテープ長手方向に搬送するために設けられた貫通孔である。送り孔８６は、後述のスプロケットの係合突起を係合させる係合孔である。送り孔８６は、略円形或いは楕円形に形成されている。送り孔８６は、ベーステープ８２のテープ幅方向の一端部に設けられている。送り孔８６は、テープ長手方向に沿って複数設けられており、所定間隔で一列に並んで配置されている。部品収納部８４及び送り孔８６は、テープ幅方向に二列に並んで、それぞれテープ長手方向に沿って配置されている。 The base tape 82 also has a feed hole 86. The feed hole 86 is a through hole provided for transporting the carrier tape 80 in the longitudinal direction of the tape. The feed hole 86 is an engagement hole for engaging the engagement protrusion of the sprocket described later. The feed hole 86 is formed in a substantially circular or elliptical shape. The feed hole 86 is provided at one end of the base tape 82 in the tape width direction. A plurality of feed holes 86 are provided along the longitudinal direction of the tape, and are arranged in a row at predetermined intervals. The component storage portion 84 and the feed hole 86 are arranged in two rows in the tape width direction and are arranged along the tape longitudinal direction.
　カバーテープ８３は、ベーステープ８２の表面（上面）に剥離可能に接着されるテープである。カバーテープ８３は、ベーステープ８２の表面に部品収納部８４を閉塞して覆うように配置される。カバーテープ８３は、ベーステープ８２の表面に対して部品収納部８４が設けられたテープ幅方向中央部を除いたテープ幅方向両端部それぞれに接着される。カバーテープ８３は、部品収納部８４に収納される電子部品２の外部への飛び出しを防止する機能を有している。カバーテープ８３は、透明な高分子フィルムなどにより構成されている。 The cover tape 83 is a tape that is peelably adhered to the surface (upper surface) of the base tape 82. The cover tape 83 is arranged so as to close and cover the component storage portion 84 on the surface of the base tape 82. The cover tape 83 is adhered to the surface of the base tape 82 at both ends in the tape width direction except for the central portion in the tape width direction where the component storage portion 84 is provided. The cover tape 83 has a function of preventing the electronic component 2 stored in the component storage unit 84 from jumping out to the outside. The cover tape 83 is made of a transparent polymer film or the like.
　尚、カバーテープ８３は、ベーステープ８２のテープ幅と略同じテープ幅を有していてもよいし、例えば図４に示す如く、ベーステープ８２に対して送り孔８６が設けられた部分を除いた部分に接着されるものとし、ベーステープ８２のテープ幅よりも小さいテープ幅を有していてもよい。また、カバーテープ８３のテープ幅は、キャリアテープ８０の種類すなわちベーステープ８２のテープ幅に応じて異なっていてよい。 The cover tape 83 may have a tape width substantially the same as the tape width of the base tape 82, except for a portion where the feed hole 86 is provided in the base tape 82, for example, as shown in FIG. The tape width may be smaller than the tape width of the base tape 82. Further, the tape width of the cover tape 83 may be different depending on the type of the carrier tape 80, that is, the tape width of the base tape 82.
　キャリアテープ８０は、円盤状の回転体であるリール９０に巻回されている。基台には、リール保持部１４０が設けられている。リール保持部１４０は、スロット１３０に対して基板搬送方向Ｙに直交する方向に隣接して配置されている。リール保持部１４０は、スロット１３０に対応して、基板搬送方向Ｙに並んで複数設けられている。リール９０は、リール保持部１４０に着脱可能かつ回転可能に保持され、複数のリール保持部１４０に並んで複数保持されることが可能である。尚、リール保持部１４０は、図１に示す如く、基板搬送方向Ｙに直交する方向に２つ並んで設けられていてもよい。 The carrier tape 80 is wound around a reel 90 which is a disk-shaped rotating body. The base is provided with a reel holding portion 140. The reel holding portion 140 is arranged adjacent to the slot 130 in a direction orthogonal to the substrate transport direction Y. A plurality of reel holding portions 140 are provided side by side in the substrate transport direction Y corresponding to the slots 130. The reel 90 is detachably and rotatably held by the reel holding portion 140, and a plurality of reels 90 can be held side by side in a plurality of reel holding portions 140. As shown in FIG. 1, two reel holding portions 140 may be provided side by side in a direction orthogonal to the substrate transport direction Y.
　部品供給装置１は、スロット１３０に装着された状態で、リール保持部１４０に保持されているリール９０に巻回されているキャリアテープ８０を所定方向（以下、テープ搬送方向Ｘと称す。）に沿って搬送する。このテープ搬送方向Ｘは、部品供給装置１がスロット１３０に装着された状態で基板搬送方向Ｙに直交する方向である。部品供給装置１は、図５に示す如く、本体ケース１０と、テープ搬送路２０と、テープ送り部３０と、テープガイド４０と、を備えている。 In the component supply device 1, the carrier tape 80 wound around the reel 90 held in the reel holding portion 140 in a state of being mounted in the slot 130 is set in a predetermined direction (hereinafter, referred to as a tape transport direction X). Transport along. The tape transport direction X is a direction orthogonal to the substrate transport direction Y with the component supply device 1 mounted in the slot 130. As shown in FIG. 5, the component supply device 1 includes a main body case 10, a tape transport path 20, a tape feed section 30, and a tape guide 40.
　本体ケース１０は、透明又は不透明のプラスチック板又は金属板により薄肉かつ扁平な箱形に形成されている。本体ケース１０は、テープ挿入部１１と、テープ排出部１２と、を有している。テープ挿入部１１は、キャリアテープ８０を挿入するための挿入口である。テープ挿入部１１は、本体ケース１０の後部（すなわち、テープ搬送方向Ｘにおける部品取出位置Ｐ側とは反対側の部位）に設けられている。テープ排出部１２は、キャリアテープ８０を外部に排出するための排出口である。テープ排出部１２は、本体ケース１０の前部（すなわち、テープ搬送方向Ｘにおける部品取出位置Ｐ側の部位）に設けられている。 The main body case 10 is formed in a thin and flat box shape by a transparent or opaque plastic plate or a metal plate. The main body case 10 has a tape inserting portion 11 and a tape discharging portion 12. The tape insertion portion 11 is an insertion port for inserting the carrier tape 80. The tape insertion portion 11 is provided at the rear portion of the main body case 10 (that is, a portion opposite to the component take-out position P side in the tape transport direction X). The tape discharge unit 12 is a discharge port for discharging the carrier tape 80 to the outside. The tape ejection portion 12 is provided at the front portion of the main body case 10 (that is, a portion on the component take-out position P side in the tape transport direction X).
　テープ搬送路２０は、本体ケース１０内に設けられている。テープ搬送路２０は、テープ挿入部１１からテープ排出部１２にかけてテープ搬送方向Ｘに沿って延びている。テープ搬送路２０は、テープ挿入部１１からテープ排出部１２にかけてキャリアテープ８０が搬送される搬送路である。テープ搬送路２０は、搬送中のキャリアテープ８０の下面を支えて案内する。テープ搬送路２０は、キャリアテープ８０の長手方向に直交する幅方向の寸法と同じ或いはその寸法に比して僅かに大きな路幅を有するように形成されている。テープ搬送路２０は、テープ搬送方向Ｘの上流端から下流端にかけて位置が徐々に高くなるように傾斜している。テープ搬送路２０は、最下流部が水平に延びるように形成されている。 The tape transport path 20 is provided in the main body case 10. The tape transport path 20 extends from the tape insertion portion 11 to the tape discharge portion 12 along the tape transport direction X. The tape transport path 20 is a transport path through which the carrier tape 80 is transported from the tape insertion section 11 to the tape discharge section 12. The tape transport path 20 supports and guides the lower surface of the carrier tape 80 being transported. The tape transport path 20 is formed so as to have a path width equal to or slightly larger than the dimension in the width direction orthogonal to the longitudinal direction of the carrier tape 80. The tape transport path 20 is inclined so that the position gradually increases from the upstream end to the downstream end in the tape transport direction X. The tape transport path 20 is formed so that the most downstream portion extends horizontally.
　本体ケース１０内には、入口押部材２１と、下流側押部材２２と、が設けられている。入口押部材２１は、テープ搬送路２０の後部（上流側）の上方においてテープ挿入部１１に近接して配置されている。入口押部材２１は、テープ搬送路２０に対して平行に延びる部位を有している。下流側押部材２２は、テープ搬送路２０の上方において入口押部材２１に対する前側（下流側）に配置されている。入口押部材２１及び下流側押部材２２はそれぞれ、テープ搬送路２０に対して離接可能に設けられている。 An inlet pushing member 21 and a downstream pushing member 22 are provided in the main body case 10. The inlet pushing member 21 is arranged in the vicinity of the tape insertion portion 11 above the rear portion (upstream side) of the tape transport path 20. The inlet pushing member 21 has a portion extending parallel to the tape transport path 20. The downstream push member 22 is arranged on the front side (downstream side) of the inlet push member 21 above the tape transport path 20. The inlet push member 21 and the downstream push member 22 are provided so as to be detachable from the tape transport path 20, respectively.
　入口押部材２１は、下流側押部材２２の後部に対して下方に配置されており、下流側押部材２２の後部に取り付けられている。入口押部材２１と下流側押部材２２とは、一対のシャフト２３を介して離接可能である。一対のシャフト２３は、互いにテープ搬送方向Ｘに離間している。各シャフト２３の周囲には、スプリング２４が配置されている。スプリング２４は、入口押部材２１と下流側押部材２２との間に介在しており、下流側押部材２２に対して入口押部材２１を下方に付勢する付勢力を発生する。入口押部材２１は、スプリング２４により下方に付勢されているときに、テープ挿入部１１に挿入されるキャリアテープ８０をテープ搬送路２０の上面に向けて押さえる機能を有している。 The entrance push member 21 is arranged below the rear part of the downstream push member 22, and is attached to the rear part of the downstream push member 22. The inlet pushing member 21 and the downstream pushing member 22 can be separated from each other via a pair of shafts 23. The pair of shafts 23 are separated from each other in the tape transport direction X. A spring 24 is arranged around each shaft 23. The spring 24 is interposed between the inlet pushing member 21 and the downstream pushing member 22, and generates an urging force that urges the inlet pushing member 21 downward with respect to the downstream pushing member 22. The inlet pushing member 21 has a function of pressing the carrier tape 80 inserted into the tape inserting portion 11 toward the upper surface of the tape transport path 20 when the spring 24 is urged downward.
　下流側押部材２２は、本体ケース１０に取り付けられた支持部材２５－１，２５－２に取り付けられている。支持部材２５－１，２５－２は、互いにテープ搬送方向Ｘに離間している。下流側押部材２２と支持部材２５－１，２５－２とは、シャフト２６－１，２６－２を介して離接可能である。各シャフト２６－１，２６－２の周囲には、スプリング２７が配置されている。スプリング２７は、下流側押部材２２と支持部材２５－１，２５－２との間に介在しており、支持部材２５－１，２５－２に対して下流側押部材２２を下方に付勢する付勢力を発生する。下流側押部材２２は、スプリング２７により下方に付勢されているときに、入口押部材２１の下流側においてキャリアテープ８０をテープ搬送路２０に向けて押さえる機能を有している。 The downstream push member 22 is attached to the support members 25-1, 25-2 attached to the main body case 10. The support members 25-1 and 25-2 are separated from each other in the tape transport direction X. The downstream push member 22 and the support members 25-1, 25-2 can be separated from each other via the shafts 26-1, 26-2. A spring 27 is arranged around each of the shafts 26-1 and 26-2. The spring 27 is interposed between the downstream push member 22 and the support members 25-1, 25-2, and urges the downstream push member 22 downward with respect to the support members 25-1, 25-2. Generates an urging force. The downstream push member 22 has a function of pressing the carrier tape 80 toward the tape transport path 20 on the downstream side of the inlet push member 21 when being urged downward by the spring 27.
　テープ送り部３０は、リール９０から引き出されたキャリアテープ８０をテープ搬送方向Ｘに搬送する部位である。テープ送り部３０は、後部側スプロケット３１と、前部側スプロケット３２と、後部側モータ３３と、前部側モータ３４と、を有している。 The tape feed unit 30 is a portion for transporting the carrier tape 80 drawn from the reel 90 in the tape transport direction X. The tape feed portion 30 has a rear side sprocket 31, a front side sprocket 32, a rear side motor 33, and a front side motor 34.
　後部側スプロケット３１は、本体ケース１０の後部側に回転可能に支持される回転体である。後部側スプロケット３１は、テープガイド４０（具体的には、後述の舌部４６）よりもテープ搬送方向Ｘ上流側（具体的には、テープ搬送路２０におけるテープ搬送方向Ｘの上流側から下流側にかけて位置が徐々に高くなる傾斜部分）に配置されている。後部側スプロケット３１は、本体ケース１０に対してテープ搬送路２０の下方に設けられた水平な支持軸を中心にして回転する。後部側スプロケット３１は、回転により、テープ挿入部１１に挿入されたキャリアテープ８０をテープ搬送路２０に沿ってテープ排出部１２側へ向けて送る。尚、後部側スプロケット３１は、図５に示す如く、テープ搬送方向Ｘに並んで二つ設けられていてもよい。 The rear side sprocket 31 is a rotating body that is rotatably supported on the rear side of the main body case 10. The rear sprocket 31 is located on the upstream side of the tape transport direction X (specifically, on the upstream side to the downstream side of the tape transport direction X in the tape transport path 20) with respect to the tape guide 40 (specifically, the tongue portion 46 described later). It is arranged in the inclined part) where the position gradually rises toward. The rear side sprocket 31 rotates about a horizontal support shaft provided below the tape transport path 20 with respect to the main body case 10. The rear sprocket 31 rotates to feed the carrier tape 80 inserted into the tape insertion portion 11 toward the tape discharge portion 12 side along the tape transport path 20. As shown in FIG. 5, two rear sprockets 31 may be provided side by side in the tape transport direction X.
　前部側スプロケット３２は、本体ケース１０の前部側に回転可能に支持される回転体である。前部側スプロケット３２は、テープガイド４０（具体的には、後述の舌部４６）よりもテープ搬送方向Ｘ下流側（具体的には、部品取出位置Ｐ近傍）に配置されている。前部側スプロケット３２は、本体ケース１０に対してテープ搬送路２０の下方に設けられた水平な支持軸を中心にして回転する。前部側スプロケット３２は、回転により、テープ搬送路２０に沿って搬送されているキャリアテープ８０をテープ排出部１２側へ向けて更にはテープ排出部１２から外部へ向けて送る。尚、前部側スプロケット３２は、図５に示す如く、テープ搬送方向Ｘに並んで二つ設けられていてもよい。 The front side sprocket 32 is a rotating body rotatably supported on the front side of the main body case 10. The front side sprocket 32 is arranged on the tape transport direction X downstream side (specifically, near the component take-out position P) with respect to the tape guide 40 (specifically, the tongue portion 46 described later). The front side sprocket 32 rotates about a horizontal support shaft provided below the tape transport path 20 with respect to the main body case 10. The front side sprocket 32 rotates and feeds the carrier tape 80 conveyed along the tape conveying path 20 toward the tape discharging portion 12 side and further toward the outside from the tape discharging portion 12. As shown in FIG. 5, two front-side sprockets 32 may be provided side by side in the tape transport direction X.
　後部側スプロケット３１及び前部側スプロケット３２はそれぞれ、径方向外側に向けて突出する外歯を有している。この外歯は、キャリアテープ８０の送り孔８６の間隔に対応した角度間隔で複数設けられている。この外歯は、スプロケット３１，３２の最上端付近に位置したときに、テープ搬送路２０の窓孔を通して上方へ突出する。テープ搬送路２０から上方へ突出した外歯は、キャリアテープ８０の送り孔８６に係合する。 The rear side sprocket 31 and the front side sprocket 32 each have external teeth protruding outward in the radial direction. A plurality of these external teeth are provided at an angular interval corresponding to the interval of the feed holes 86 of the carrier tape 80. When the external teeth are located near the uppermost ends of the sprockets 31 and 32, they project upward through the window hole of the tape transport path 20. The external teeth protruding upward from the tape transport path 20 engage with the feed hole 86 of the carrier tape 80.
　後部側スプロケット３１は、ギア３５を介して後部側モータ３３の出力軸に係合している。後部側スプロケット３１は、後部側モータ３３の回転駆動に伴って減速回転する。後部側モータ３３は、一駆動当たり所定角度だけ回転するように間欠駆動される。後部側スプロケット３１の回転が後部側モータ３３の間欠駆動により、その外歯がテープ搬送路２０上のキャリアテープ８０の送り孔８６に係合した状態で行われると、そのキャリアテープ８０がテープ搬送路２０に沿ってテープ搬送方向Ｘへピッチ送りされて搬送される。 The rear side sprocket 31 is engaged with the output shaft of the rear side motor 33 via the gear 35. The rear side sprocket 31 decelerates and rotates as the rear side motor 33 is driven to rotate. The rear side motor 33 is intermittently driven so as to rotate by a predetermined angle per drive. When the rotation of the rear sprocket 31 is performed by the intermittent drive of the rear motor 33 with its outer teeth engaged with the feed holes 86 of the carrier tape 80 on the tape transport path 20, the carrier tape 80 transports the tape. The pitch is fed in the tape transport direction X along the path 20 and transported.
　前部側スプロケット３２は、ギア３６を介して前部側モータ３４の出力軸に係合している。前部側スプロケット３２は、前部側モータ３４の回転駆動に伴って減速回転する。前部側モータ３４は、一駆動当たり所定角度だけ回転するように間欠駆動される。前部側スプロケット３２の回転が前部側モータ３４の間欠駆動により、その外歯がテープ搬送路２０上のキャリアテープ８０の送り孔８６に係合した状態で行われると、そのキャリアテープ８０がテープ搬送路２０に沿ってテープ搬送方向Ｘへピッチ送りされて搬送される。 The front side sprocket 32 is engaged with the output shaft of the front side motor 34 via the gear 36. The front side sprocket 32 decelerates and rotates with the rotation drive of the front side motor 34. The front side motor 34 is intermittently driven so as to rotate by a predetermined angle per drive. When the rotation of the front side sprocket 32 is performed by the intermittent drive of the front side motor 34 with its outer teeth engaged with the feed hole 86 of the carrier tape 80 on the tape transport path 20, the carrier tape 80 is released. The pitch is fed in the tape transport direction X along the tape transport path 20 and transported.
　本体ケース１０内には、操作レバー３７が設けられている。操作レバー３７は、本体ケース１０のテープ挿入部１１の位置よりも上方において後方に突出するように設けられている。操作レバー３７は、回動可能に本体ケース１０の後部に支持されている。操作レバー３７は、スプリングの付勢力により所定回りに回動されると共に、作業者の手動によりスプリングの付勢力に抗して反対回りに回動操作される。 An operation lever 37 is provided in the main body case 10. The operation lever 37 is provided so as to project rearward above the position of the tape insertion portion 11 of the main body case 10. The operating lever 37 is rotatably supported by the rear portion of the main body case 10. The operating lever 37 is rotated in a predetermined direction by the urging force of the spring, and is manually rotated in the opposite direction against the urging force of the spring by the operator.
　操作レバー３７が作業者により回動操作されていない時は、入口押部材２１がスプリングの付勢力によりテープ搬送路２０に当接することで、テープ挿入部１１に新たなキャリアテープ８０の挿入は不可能である。一方、操作レバー３７が作業者により回動操作されて上方に持ち上げられると、入口押部材２１がスプリングの付勢力に抗して上昇してテープ搬送路２０から離間することで、テープ挿入部１１への新たなキャリアテープ８０の挿入が可能となる。 When the operating lever 37 is not rotated by the operator, the inlet pushing member 21 comes into contact with the tape transport path 20 by the urging force of the spring, so that the new carrier tape 80 cannot be inserted into the tape inserting portion 11. It is possible. On the other hand, when the operating lever 37 is rotated and lifted upward by the operator, the inlet pushing member 21 rises against the urging force of the spring and separates from the tape transport path 20, so that the tape inserting portion 11 A new carrier tape 80 can be inserted into the carrier tape 80.
　入口押部材２１の後部には、図６に示す如く、邪魔板３８が枢支されている。邪魔板３８は、入口押部材２１がテープ搬送路２０に向けて押圧されている状態において自重によりテープ挿入部１１を閉塞して新たなキャリアテープ８０の挿入を不可能にする機能を有している。邪魔板３８は、入口押部材２１の上昇時に下流側押部材２２の後部に係合して回動され、テープ挿入部１１を新たなキャリアテープ８０を挿入できるように開放する。 As shown in FIG. 6, a baffle plate 38 is pivotally supported at the rear part of the entrance push member 21. The baffle plate 38 has a function of blocking the tape insertion portion 11 by its own weight while the inlet pushing member 21 is being pressed toward the tape transport path 20, making it impossible to insert a new carrier tape 80. There is. The baffle plate 38 is rotated by engaging with the rear portion of the downstream push member 22 when the inlet push member 21 is raised, and opens the tape insertion portion 11 so that a new carrier tape 80 can be inserted.
　入口押部材２１の下流側には、ストッパ部材３９が隣接して設けられている。ストッパ部材３９は、下流側押部材２２に回動可能に支持されている。操作レバー３７がスプリングの付勢力により所定回りに回動され、入口押部材２１がテープ搬送路２０に当接する位置に保持されている状態（図６に示す状態）では、操作レバー３７のカム部３７ａがストッパ部材３９のカムフォロア３９ａから離間する。この場合、ストッパ部材３９は、図略のスプリングの付勢力により軸支部３９ｂを中心にした回動により、当接部３９ｃをテープ搬送路２０に当接させかつ停止部３９ｄをテープ搬送路２０から離間させた状態に保持されている。 A stopper member 39 is provided adjacent to the inlet push member 21 on the downstream side. The stopper member 39 is rotatably supported by the downstream push member 22. In a state where the operating lever 37 is rotated in a predetermined direction by the urging force of the spring and the inlet pushing member 21 is held at a position where it abuts on the tape transport path 20 (the state shown in FIG. 6), the cam portion of the operating lever 37 37a is separated from the cam follower 39a of the stopper member 39. In this case, the stopper member 39 brings the contact portion 39c into contact with the tape transport path 20 and the stop portion 39d from the tape transport path 20 by rotating around the shaft support portion 39b by the urging force of the spring (not shown). It is held in a separated state.
　一方、操作レバー３７がスプリングの付勢力に抗して回動操作されると、操作レバー３７のカム部３７ａがストッパ部材３９のカムフォロア３９ａに係合する。この場合、ストッパ部材３９は、図略のスプリングの付勢力に抗して軸支部３９ｂを中心にして回動され、停止部３９ｄをテープ搬送路２０に当接させる。かかる状態でキャリアテープ８０がテープ挿入部１１に挿入されると、その挿入されたキャリアテープ８０は、その先端がストッパ部材３９の停止部３９ｄに当接することで挿入停止される。 On the other hand, when the operating lever 37 is rotated against the urging force of the spring, the cam portion 37a of the operating lever 37 engages with the cam follower 39a of the stopper member 39. In this case, the stopper member 39 is rotated around the shaft support portion 39b against the urging force of the spring (not shown), and the stop portion 39d is brought into contact with the tape transport path 20. When the carrier tape 80 is inserted into the tape insertion portion 11 in such a state, the inserted carrier tape 80 is stopped by the tip of the carrier tape 80 coming into contact with the stop portion 39d of the stopper member 39.
　キャリアテープ８０がテープ搬送路２０とストッパ部材３９の当接部３９ｃとの間を通過した後は、そのキャリアテープ８０によって当接部３９ｃが持ち上げられ、ストッパ部材３９の停止部３９ｄがテープ搬送路２０に当接する。以下、この当接部３９ｃを持ち上げているキャリアテープ８０を旧キャリアテープ８０と称す。かかる状態で新たなキャリアテープ８０（以下、新キャリアテープ８０と称す。）がテープ挿入部１１に挿入され、旧キャリアテープ８０の上に重ねられると、その新キャリアテープ８０は、その先端がストッパ部材３９の停止部３９ｄに当接して停止される。これにより、旧キャリアテープ８０がテープ搬送路２０上に搬送されている際は、新キャリアテープ８０の下流側への搬送が阻止され、新キャリアテープ８０がその位置で待機される。 After the carrier tape 80 passes between the tape transport path 20 and the contact portion 39c of the stopper member 39, the contact portion 39c is lifted by the carrier tape 80, and the stop portion 39d of the stopper member 39 becomes the tape transport path. Contact 20. Hereinafter, the carrier tape 80 that lifts the contact portion 39c will be referred to as an old carrier tape 80. In this state, when a new carrier tape 80 (hereinafter referred to as a new carrier tape 80) is inserted into the tape insertion portion 11 and superposed on the old carrier tape 80, the tip of the new carrier tape 80 is a stopper. It comes into contact with the stop portion 39d of the member 39 and is stopped. As a result, when the old carrier tape 80 is transported on the tape transport path 20, the transport of the new carrier tape 80 to the downstream side is prevented, and the new carrier tape 80 stands by at that position.
　本体ケース１０内には、上面押部材２８が設けられている。上面押部材２８は、後部側スプロケット３１と前部側スプロケット３２との間におけるテープ搬送路２０の上方に配置されている。上面押部材２８は、テープ搬送路２０に対して平行に延びるように形成配置されている。上面押部材２８は、その前端部にて本体ケース１０に軸支されている。上面押部材２８は、本体ケース１０に揺動可能に支持されている。上面押部材２８は、トーションスプリングなどの付勢部材２９により下方に付勢される。上面押部材２８は、付勢部材２９により下方に付勢されることでテープ搬送路２０上のキャリアテープ８０の上面を押さえてそのキャリアテープ８０の浮上を防止する機能を有している。 A top pushing member 28 is provided in the main body case 10. The upper surface pushing member 28 is arranged above the tape transport path 20 between the rear sprocket 31 and the front sprocket 32. The upper surface pushing member 28 is formed and arranged so as to extend parallel to the tape transport path 20. The upper surface pushing member 28 is pivotally supported by the main body case 10 at its front end. The upper surface pushing member 28 is swingably supported by the main body case 10. The upper surface pushing member 28 is urged downward by an urging member 29 such as a torsion spring. The upper surface pushing member 28 has a function of pressing the upper surface of the carrier tape 80 on the tape transport path 20 by being urged downward by the urging member 29 to prevent the carrier tape 80 from floating.
　テープガイド４０は、テープ搬送路２０上で搬送されるキャリアテープ８０をガイドする部材である。テープガイド４０は、テープ搬送路２０の搬送方向下流側に配置されている。テープガイド４０は、本体ケース１０内に設けられている。尚、テープガイド４０は、本体ケース１０に別体で取り付けられたものであってもよいし、また、本体ケース１０に一体で設けられたものであってもよい。 The tape guide 40 is a member that guides the carrier tape 80 transported on the tape transport path 20. The tape guide 40 is arranged on the downstream side of the tape transport path 20 in the transport direction. The tape guide 40 is provided in the main body case 10. The tape guide 40 may be attached to the main body case 10 separately, or may be integrally provided with the main body case 10.
　テープガイド４０は、テープ搬送路２０上のキャリアテープ８０の上面を押さえることが可能であると共に、キャリアテープ８０のベーステープ８２からカバーテープ８３を剥離して部品収納部８４内の電子部品２を露出させることが可能である。特に、テープガイド４０は、本体ケース１０に対して下方に付勢され押圧されており、キャリアテープ８０のテープ厚が変わってもそのキャリアテープ８０の上面を押さえることで、そのキャリアテープ８０の浮き上がりを防止して送り孔８６をスプロケットに確実に係合させることが可能である。 The tape guide 40 can press the upper surface of the carrier tape 80 on the tape transport path 20, and also peels off the cover tape 83 from the base tape 82 of the carrier tape 80 to remove the electronic component 2 in the component storage portion 84. It can be exposed. In particular, the tape guide 40 is urged and pressed downward with respect to the main body case 10, and even if the tape thickness of the carrier tape 80 changes, the upper surface of the carrier tape 80 is pressed to lift the carrier tape 80. It is possible to prevent the feed hole 86 from being securely engaged with the sprocket.
　本体ケース１０内には、図７に示す如く、バックアップ板バネ５０及びサポート板バネ５１がそれぞれ設けられている。バックアップ板バネ５０及びサポート板バネ５１は、テープ搬送路２０の搬送方向下流側に配置されている。バックアップ板バネ５０は、テープ搬送路２０に沿ってテープ搬送方向Ｘに延びており、一端で本体ケース１０にネジなどで固定されている。バックアップ板バネ５０は、テープ搬送路２０上のキャリアテープ８０（具体的には、ベーステープ８２；尚、カバーテープ８３が剥離したベーステープ８２を含む。）の下面を支持する。バックアップ板バネ５０は、テープ搬送路２０上のキャリアテープ８０を上方へ付勢してそのキャリアテープ８０の上面をテープガイド４０の後述の上壁部４２に押し付ける付勢力を発生する。 As shown in FIG. 7, a backup leaf spring 50 and a support leaf spring 51 are provided in the main body case 10, respectively. The backup leaf spring 50 and the support leaf spring 51 are arranged on the downstream side of the tape transport path 20 in the transport direction. The backup leaf spring 50 extends in the tape transport direction X along the tape transport path 20, and is fixed to the main body case 10 at one end with a screw or the like. The backup leaf spring 50 supports the lower surface of the carrier tape 80 (specifically, the base tape 82; including the base tape 82 from which the cover tape 83 has been peeled off) on the tape transport path 20. The backup leaf spring 50 generates an urging force that urges the carrier tape 80 on the tape transport path 20 upward and presses the upper surface of the carrier tape 80 against the upper wall portion 42 described later of the tape guide 40.
　テープ搬送路２０には、エンボス型のキャリアテープ８０における下方に突出する部品収納部８４が係合可能な溝が設けられている。この溝は、部品収納部８４が最大となるエンボス型のキャリアテープ８０に対応した大きさに形成されている。サポート板バネ５１は、上記の溝の下方に配設されている。サポート板バネ５１は、一つ以上（図においては、三つ）設けられている。各サポート板バネ５１は、テープ搬送路２０に沿ってテープ搬送方向Ｘに延びており、一端で本体ケース１０にネジなどで固定されている。サポート板バネ５１は、テープ搬送路２０上のキャリアテープ８０がエンボス型のキャリアテープである場合に、そのキャリアテープ８０の部品収納部８４の下壁の下面を支持する。サポート板バネ５１は、テープ搬送路２０上のキャリアテープ８０の部品収納部８４の下壁が自重で下がるのを抑える力を発生する。 The tape transport path 20 is provided with a groove in which the component storage portion 84 projecting downward in the embossed carrier tape 80 can be engaged. This groove is formed in a size corresponding to the embossed carrier tape 80 in which the component storage portion 84 is maximized. The support leaf spring 51 is arranged below the groove. One or more support leaf springs 51 (three in the figure) are provided. Each support leaf spring 51 extends in the tape transport direction X along the tape transport path 20, and is fixed to the main body case 10 at one end with a screw or the like. The support leaf spring 51 supports the lower surface of the lower wall of the component storage portion 84 of the carrier tape 80 when the carrier tape 80 on the tape transport path 20 is an embossed carrier tape. The support leaf spring 51 generates a force for suppressing the lower wall of the component storage portion 84 of the carrier tape 80 on the tape transport path 20 from being lowered by its own weight.
　テープガイド４０は、図８、図９、図１０、図１１、及び図１２に示す如く、ガイド本体部４１を有している。ガイド本体部４１は、テープ搬送方向Ｘに沿って延びており、テープ搬送路２０上のキャリアテープ８０をガイドする。ガイド本体部４１は、断面Ｕ字状に形成されている。ガイド本体部４１は、上壁部４２と、一対の側壁部４３と、を有している。上壁部４２は、テープ搬送路２０の上方に配置され、キャリアテープ８０の上面に対向する部位である。上壁部４２は、キャリアテープ８０の上方への移動を規制してキャリアテープ８０の浮き上がりを防止する機能を有している。一対の側壁部４３はそれぞれ、上壁部４２の幅方向端部から下方へ延びており、キャリアテープ８０の側面に対向する部位である。 The tape guide 40 has a guide main body 41 as shown in FIGS. 8, 9, 10, 11, and 12. The guide main body 41 extends along the tape transport direction X and guides the carrier tape 80 on the tape transport path 20. The guide main body 41 is formed in a U-shaped cross section. The guide main body portion 41 has an upper wall portion 42 and a pair of side wall portions 43. The upper wall portion 42 is a portion that is arranged above the tape transport path 20 and faces the upper surface of the carrier tape 80. The upper wall portion 42 has a function of restricting the upward movement of the carrier tape 80 to prevent the carrier tape 80 from floating. Each of the pair of side wall portions 43 extends downward from the widthwise end portion of the upper wall portion 42, and is a portion facing the side surface of the carrier tape 80.
　テープガイド４０は、部品露出部４５を有している。部品露出部４５は、キャリアテープ８０のベーステープ８２の部品収納部８４内の電子部品２を露出させる。具体的には、部品露出部４５は、電子部品２が部品移載装置１２０による吸着や把持により取り出される部品取出位置Ｐの直前でベーステープ８２からカバーテープ８３を剥離することで、電子部品２を露出させる。部品露出部４５は、ガイド本体部４１に一体に設けられている。 The tape guide 40 has a component exposed portion 45. The component exposure portion 45 exposes the electronic component 2 in the component storage portion 84 of the base tape 82 of the carrier tape 80. Specifically, the component exposed portion 45 peels the cover tape 83 from the base tape 82 immediately before the component take-out position P in which the electronic component 2 is taken out by suction or gripping by the component transfer device 120, whereby the electronic component 2 is exposed. To expose. The component exposed portion 45 is integrally provided with the guide main body portion 41.
　部品露出部４５は、舌部４６を有している。舌部４６は、キャリアテープ８０の搬送中にベーステープ８２とカバーテープ８３との間に挿入される部位である。ガイド本体部４１の上壁部４２には、開口部４２ａが設けられている。開口部４２ａは、上壁部４２の一部が切り欠かれることにより形成されている。舌部４６は、開口部４２ａを介して外部に露出するように配置されている。 The component exposed portion 45 has a tongue portion 46. The tongue portion 46 is a portion inserted between the base tape 82 and the cover tape 83 during the transportation of the carrier tape 80. An opening 42a is provided in the upper wall portion 42 of the guide main body portion 41. The opening 42a is formed by cutting out a part of the upper wall portion 42. The tongue portion 46 is arranged so as to be exposed to the outside through the opening 42a.
　舌部４６は、テープ搬送方向Ｘに沿って延びるように形成されていると共に、水平板状に形成されている。舌部４６は、テープ搬送方向Ｘの下流側端部でガイド本体部４１の開口部４２ａの縁部に溶接などで固定されている。舌部４６は、片持ち構造でガイド本体部４１に一体的に取り付けられ、ガイド本体部４１に設けられている。舌部４６は、先端部４６ａをキャリアテープ８０の搬送方向上流側に向けた状態で配置されている。舌部４６は、ガイド本体部４１に固定される固定部から先端部４６ａにかけて所定長さを有している。 The tongue portion 46 is formed so as to extend along the tape transport direction X and is formed in the shape of a horizontal plate. The tongue portion 46 is fixed to the edge of the opening 42a of the guide main body 41 by welding or the like at the downstream end of the tape transport direction X. The tongue portion 46 has a cantilever structure and is integrally attached to the guide main body portion 41, and is provided on the guide main body portion 41. The tongue portion 46 is arranged with the tip portion 46a facing the upstream side in the transport direction of the carrier tape 80. The tongue portion 46 has a predetermined length from the fixed portion fixed to the guide main body portion 41 to the tip portion 46a.
　舌部４６は、キャリアテープ８０のテープ幅方向において所定幅を有している。この所定幅は、キャリアテープ８０のテープ幅よりも小さくなるように設定されている。舌部４６は、キャリアテープ８０の幅方向においてベーステープ８２にカバーテープ８３が接着されているテープ幅方向両端部のうち一方のテープ幅方向端部側（具体的には、送り孔８６が設けられた側とは反対側）に偏るように配置されている。 The tongue portion 46 has a predetermined width in the tape width direction of the carrier tape 80. This predetermined width is set to be smaller than the tape width of the carrier tape 80. The tongue portion 46 is provided with one end side in the tape width direction (specifically, a feed hole 86) of both ends in the tape width direction in which the cover tape 83 is adhered to the base tape 82 in the width direction of the carrier tape 80. It is arranged so as to be biased to the side opposite to the side where it was struck.
　舌部４６は、先端部４６ａが、他方のテープ幅方向端部側（具体的には、送り孔８６が設けられた側）にて最も搬送方向上流側に位置し、その他方のテープ幅方向端部側から上記した一方のテープ幅方向端部側にかけて傾斜して徐々に搬送方向下流側に位置するように形成されている。舌部４６は、先端部４６ａの最先端がベーステープ８２の部品収納部８４の真上に位置するように配置されている。 The tip 46a of the tongue 46 is located on the other end side in the tape width direction (specifically, the side where the feed hole 86 is provided) on the upstream side in the transport direction, and is located in the other tape width direction. It is formed so as to be inclined from the end side toward the end side in the width direction of one of the above tapes and gradually located on the downstream side in the transport direction. The tongue portion 46 is arranged so that the tip end portion of the tip portion 46a is located directly above the component storage portion 84 of the base tape 82.
　舌部４６の裏面（すなわち下面）は、略水平平面に形成されており、特に、その面全体がベーステープ８２の部品収納部８４を含む周辺領域の上面に対向して当接するように形成されている。舌部４６の裏面は、キャリアテープ８０のベーステープ８２の上方への移動を規制してキャリアテープ８０の浮き上がりを防止する機能を有している。キャリアテープ８０のベーステープ８２は、バックアップ板バネ５０によりその上面が舌部４６の裏面に接するように上方へ付勢され、舌部４６の裏面に押し付けられる。 The back surface (that is, the lower surface) of the tongue portion 46 is formed in a substantially horizontal plane, and in particular, the entire surface thereof is formed so as to face the upper surface of the peripheral region including the component storage portion 84 of the base tape 82. ing. The back surface of the tongue portion 46 has a function of restricting the upward movement of the base tape 82 of the carrier tape 80 to prevent the carrier tape 80 from rising. The base tape 82 of the carrier tape 80 is urged upward by the backup leaf spring 50 so that its upper surface is in contact with the back surface of the tongue portion 46, and is pressed against the back surface of the tongue portion 46.
　部品露出部４５は、また、剥離刃４７を有している。剥離刃４７は、ベーステープ８２とカバーテープ８３との接着箇所に挿入される刃部である。剥離刃４７は、部品取出位置Ｐに対してテープ搬送方向Ｘ上流側に配置されており、テープ搬送方向Ｘ上流側に向けて鋭角に突出している。剥離刃４７は、ベーステープ８２からカバーテープ８３を部分的に剥離する部位であって、部品取出位置Ｐでベーステープ８２の部品収納部８４内の電子部品２を露出させる。剥離刃４７は、舌部４６の先端部４６ａの上記一方のテープ幅方向端部側に設けられている。 The component exposed portion 45 also has a peeling blade 47. The peeling blade 47 is a blade portion inserted into the bonding portion between the base tape 82 and the cover tape 83. The peeling blade 47 is arranged on the upstream side of the tape transport direction X with respect to the component take-out position P, and projects at an acute angle toward the tape transport direction X upstream side. The release blade 47 is a portion for partially peeling the cover tape 83 from the base tape 82, and exposes the electronic component 2 in the component storage portion 84 of the base tape 82 at the component take-out position P. The peeling blade 47 is provided on the one end side of the tip portion 46a of the tongue portion 46 in the tape width direction.
　ガイド本体部４１は、対向部４１ａを有している。対向部４１ａは、キャリアテープ８０の搬送時に部品露出部４５により電子部品２が露出した部品収納部８４の開口に対向し得る対向領域Ｓ（図８においてクロスハッチングで示す。）に形成された部位である。対向部４１ａは、ガイド本体部４１の部品露出部４５の舌部４６に形成されている。対向領域Ｓは、キャリアテープ８０の搬送時に部品収納部８４内の電子部品２が下方を通過する領域であって、舌部４６におけるベーステープ８２からカバーテープ８３が剥離されて電子部品２の露出が開始される露出開始位置から部品収納部８４内で露出した電子部品２が取り出される部品取出位置Ｐまでのテープ搬送方向Ｘに沿って延在している。対向部４１ａは、部品露出部４５により電子部品２が露出した部品収納部８４から電子部品２が飛び出すのを防止する機能を有している。 The guide main body 41 has a facing portion 41a. The facing portion 41a is a portion formed in a facing region S (shown by cross-hatching in FIG. 8) that can face the opening of the component storage portion 84 in which the electronic component 2 is exposed by the component exposed portion 45 when the carrier tape 80 is conveyed. Is. The facing portion 41a is formed on the tongue portion 46 of the component exposed portion 45 of the guide main body portion 41. The facing region S is a region in which the electronic component 2 in the component storage portion 84 passes below when the carrier tape 80 is conveyed, and the cover tape 83 is peeled off from the base tape 82 in the tongue portion 46 to expose the electronic component 2. It extends along the tape transport direction X from the exposure start position where is started to the component take-out position P where the exposed electronic component 2 is taken out in the component storage portion 84. The facing portion 41a has a function of preventing the electronic component 2 from popping out from the component storage portion 84 in which the electronic component 2 is exposed by the component exposed portion 45.
　対向部４１ａは、舌部４６の対向領域Ｓ全域に亘ってテープ搬送方向Ｘに沿って直線状に延びている。対向部４１ａは、テープ幅方向において部品収納部８４の幅以上の幅を有している。対向部４１ａは、電子部品２に比して硬度の低い材料により形成されており、具体的には、電子部品２のセラミック製の本体部２ａ及び金属製の電極端子２ｂの材料に比して硬度の低い材料により形成されている。対向部４１ａの材料は、例えばポリアミドやポリアセタールなどの樹脂である。対向部４１ａは、その材料からなる素材が舌部４６の裏面の対向領域Ｓに接着され或いはカシメ固定され或いはコーティングされることにより形成されている。尚、対向部４１ａは、金属製の舌部４６本体の裏面に樹脂が上記の如く接着やカシメなどで取り付けられることにより形成されるものであればよい。舌部４６の先端部４６ａの最先端は、対向部４１ａに含まれている。 The facing portion 41a extends linearly along the tape transport direction X over the entire facing region S of the tongue portion 46. The facing portion 41a has a width equal to or larger than the width of the component storage portion 84 in the tape width direction. The facing portion 41a is formed of a material having a hardness lower than that of the electronic component 2, and specifically, the facing portion 41a is made of a material of a ceramic main body portion 2a of the electronic component 2 and a metal electrode terminal 2b. It is made of a material with low hardness. The material of the facing portion 41a is, for example, a resin such as polyamide or polyacetal. The facing portion 41a is formed by adhering, caulking, fixing, or coating the material made of the material to the facing region S on the back surface of the tongue portion 46. The facing portion 41a may be formed by attaching a resin to the back surface of the metal tongue portion 46 body by adhesion or caulking as described above. The tip of the tip portion 46a of the tongue portion 46 is included in the facing portion 41a.
　ガイド本体部４１は、また、金属部４１ｂを有している。金属部４１ｂは、ガイド本体部４１ひいては舌部４６において金属（例えばステンレスなど）からなる部位のことである。金属部４１ｂは、対向部４１ａが形成された領域（本実施形態では、舌部４６における対向領域Ｓ）とは異なる領域（本実施形態では、舌部４６における対向領域Ｓとは異なる非対向領域Ｔ；図８においてシングルハッチングで示す。）に形成されている。舌部４６は、対向領域Ｓ全域において対向部４１ａが表出すると共に、非対向領域Ｔにおいて金属部４１ｂが表出するように構成されている。舌部４６の剥離刃４７は、金属部４１ｂに含まれている。 The guide main body 41 also has a metal portion 41b. The metal portion 41b is a portion of the guide main body portion 41 and thus the tongue portion 46 made of metal (for example, stainless steel). The metal portion 41b is a region different from the region where the facing portion 41a is formed (in the present embodiment, the facing region S in the tongue portion 46) (in the present embodiment, a non-facing region different from the facing region S in the tongue portion 46). T; shown by single hatching in FIG. 8). The tongue portion 46 is configured such that the opposing portion 41a is exposed in the entire facing region S and the metal portion 41b is exposed in the non-opposing region T. The peeling blade 47 of the tongue portion 46 is included in the metal portion 41b.
　テープガイド４０は、折返部４９を備えている。折返部４９は、ベーステープ８２からカバーテープ８３の一方のテープ幅方向端部が剥離された後、そのカバーテープ８３の剥離側のテープ幅方向端部を立ち上げて折り返す部位である。折返部４９は、舌部４６よりも搬送方向下流側に配置されていると共に、先端が部品取出位置Ｐよりもテープ搬送方向Ｘ上流側に位置するように配置されている。折返部４９は、板状に形成されており、テープ搬送方向Ｘ上流側からテープ搬送方向Ｘ下流側にかけて幅が大きくなるように形成されている。折返部４９は、開口部４２ａの一部を塞ぐように形成配置されている。 The tape guide 40 is provided with a folded portion 49. The folded-back portion 49 is a portion where one end in the tape width direction of the cover tape 83 is peeled off from the base tape 82, and then the end portion in the tape width direction on the peeling side of the cover tape 83 is raised and folded back. The folded-back portion 49 is arranged on the downstream side in the transport direction from the tongue portion 46, and the tip is arranged so as to be located on the tape transport direction X upstream side from the component take-out position P. The folded-back portion 49 is formed in a plate shape, and is formed so that the width increases from the tape transport direction X upstream side to the tape transport direction X downstream side. The folded-back portion 49 is formed and arranged so as to close a part of the opening 42a.
　キャリアテープ８０は、後述の部品移載装置１２０を用いて部品取出位置Ｐでベーステープ８２から電子部品２が取り出された後、ベーステープ８２とカバーテープ８３とがテープ幅方向他端部で接着した状態のまま本体ケース１０から外部へ排出される。 In the carrier tape 80, after the electronic component 2 is taken out from the base tape 82 at the component take-out position P by using the component transfer device 120 described later, the base tape 82 and the cover tape 83 are adhered to each other at the other end in the tape width direction. It is discharged from the main body case 10 to the outside in the same state.
　部品移載装置１２０は、部品取出位置Ｐまで供給された電子部品２を、キャリアテープ８０から所定の部品装着位置に位置決めされている基板３に向けて移載する装置である。部品移載装置１２０は、図１に示す如く、第一スライダ１２１と、第二スライダ１２２と、装着ヘッド１２３と、を有している。 The component transfer device 120 is a device for transferring the electronic component 2 supplied to the component take-out position P from the carrier tape 80 toward the substrate 3 positioned at a predetermined component mounting position. As shown in FIG. 1, the component transfer device 120 includes a first slider 121, a second slider 122, and a mounting head 123.
　第一スライダ１２１は、ガイドレール１２４，１２５を介して基台に支持されている。ガイドレール１２４，１２５は、基板搬送装置１１０による基板搬送方向Ｙに直交するテープ搬送方向Ｘに延びており、基板搬送装置１１０の上方に配設されている。第一スライダ１２１は、第一サーボモータの駆動によりガイドレール１２４，１２５に沿ってテープ搬送方向Ｘに向けて移動される。第二スライダ１２２は、第一スライダ１２１に対して基板搬送方向Ｙに向けて移動可能に取り付けられている。第二スライダ１２２は、第一スライダ１２１に固定された第二サーボモータ（図示せず）の駆動により基板搬送方向Ｙに向けて移動される。 The first slider 121 is supported by the base via the guide rails 124 and 125. The guide rails 124 and 125 extend in the tape transport direction X orthogonal to the board transport direction Y by the board transport device 110, and are arranged above the board transport device 110. The first slider 121 is moved along the guide rails 124 and 125 in the tape transport direction X by driving the first servomotor. The second slider 122 is movably attached to the first slider 121 in the substrate transport direction Y. The second slider 122 is moved in the substrate transport direction Y by driving a second servomotor (not shown) fixed to the first slider 121.
　第二スライダ１２２には、装着ヘッド１２３が取り付けられている。装着ヘッド１２３は、電子部品２を吸着可能な吸着ノズル（図示せず）又は把持可能な把持チャック（図示せず）を着脱可能に保持している。尚、装着ヘッド１２３は、複数の吸着ノズルや把持チャックを保持可能であってよい。装着ヘッド１２３は、テープ搬送方向Ｘ及び基板搬送方向Ｙの双方に直交する上下方向Ｚに位置移動可能である。装着ヘッド１２３の吸着ノズルは、部品供給装置１によって部品取出位置Ｐに供給された電子部品２を負圧などを用いてキャリアテープ８０の部品収納部８４から取り出すと共に、その取り出した電子部品２をその負圧解除などにより、所定の部品装着位置に位置決めされている基板３に装着する。 A mounting head 123 is attached to the second slider 122. The mounting head 123 detachably holds a suction nozzle (not shown) capable of sucking the electronic component 2 or a gripping chuck (not shown) capable of gripping the electronic component 2. The mounting head 123 may be capable of holding a plurality of suction nozzles and gripping chucks. The mounting head 123 can move its position in the vertical direction Z orthogonal to both the tape transport direction X and the substrate transport direction Y. The suction nozzle of the mounting head 123 takes out the electronic component 2 supplied to the component extraction position P by the component supply device 1 from the component storage portion 84 of the carrier tape 80 by using negative pressure or the like, and removes the extracted electronic component 2. By releasing the negative pressure or the like, it is mounted on the substrate 3 positioned at a predetermined component mounting position.
　２．部品供給装置の動作
　部品供給装置１において、操作レバー３７がスプリングの付勢力により所定回りに回動されている状態では、入口押部材２１がテープ搬送路２０に当接していると共に、邪魔板３８が自重により回動されてテープ挿入部１１を閉塞している。かかる状態から操作レバー３７が作業者の手動によりスプリングの付勢力に抗して反対回りに回動されて上方に持ち上げられると、入口押部材２１がテープ搬送路２０から離間すると共に、邪魔板３８が下流側押部材２２により回動されてテープ挿入部１１をキャリアテープ８０を挿入可能に開放する。この状態では、作業者によりキャリアテープ８０が部品供給装置１のテープ挿入部１１に挿入可能である。 2. 2. Operation of the parts supply device In the parts supply device 1, when the operation lever 37 is rotated in a predetermined direction by the urging force of the spring, the inlet pushing member 21 is in contact with the tape transport path 20 and the baffle plate 38 is in contact with the tape transport path 20. Is rotated by its own weight to close the tape insertion portion 11. From this state, when the operating lever 37 is manually rotated in the opposite direction against the urging force of the spring and lifted upward, the inlet pushing member 21 is separated from the tape transport path 20 and the baffle plate 38 is separated. Is rotated by the downstream push member 22 to open the tape insertion portion 11 so that the carrier tape 80 can be inserted. In this state, the carrier tape 80 can be inserted into the tape insertion portion 11 of the component supply device 1 by the operator.
　キャリアテープ８０がテープ挿入部１１に挿入されると、そのキャリアテープ８０の先端は、ストッパ部材３９の停止部３９ｄに当接する位置まで挿入することができる。キャリアテープ８０が停止部３９ｄに当接する位置まで挿入された状態で操作レバー３７の持ち上げ操作が解除されると、その操作レバー３７がスプリングの付勢力により回動されて原位置に復帰する。この原点復帰状態では、入口押部材２１がスプリング２４の付勢力によりテープ搬送路２０に向けて下降されることで、キャリアテープ８０がテープ搬送路２０に向けて押さえられると共に、邪魔板３８が自重によりテープ挿入部１１を閉塞する。また同時に、ストッパ部材３９の当接部３９ｃがテープ搬送路２０に当接すると共に、その停止部３９ｄがテープ搬送路２０から離間する。 When the carrier tape 80 is inserted into the tape insertion portion 11, the tip of the carrier tape 80 can be inserted to a position where it comes into contact with the stop portion 39d of the stopper member 39. When the lifting operation of the operating lever 37 is released with the carrier tape 80 inserted to a position where it comes into contact with the stop portion 39d, the operating lever 37 is rotated by the urging force of the spring to return to the original position. In this home origin return state, the inlet pushing member 21 is lowered toward the tape transport path 20 by the urging force of the spring 24, so that the carrier tape 80 is pressed toward the tape transport path 20 and the baffle plate 38 is self-weighted. Closes the tape insertion portion 11. At the same time, the contact portion 39c of the stopper member 39 comes into contact with the tape transport path 20, and the stop portion 39d is separated from the tape transport path 20.
　部品供給装置１に搭載される各種センサを用いて、テープ挿入部１１へのキャリアテープ８０の挿入が検出され、テープ搬送路２０上でのキャリアテープ８０の存在が検出され、かつ操作レバー３７が原位置に復帰していることが検出されると、後部側モータ３３が駆動されて、後部側スプロケット３１が回転する。この場合、停止部３９ｄのテープ搬送路２０からの離間によりキャリアテープ８０の先端側が停止部３９ｄからテープ搬送方向Ｘ下流側へ搬送されるのが許容された状態で、後部側スプロケット３１がその外歯とキャリアテープ８０の送り孔８６とが係合した状態で回転するので、そのキャリアテープ８０が後部側スプロケット３１の回転によりテープ排出部１２側へ搬送される。 Using various sensors mounted on the component supply device 1, the insertion of the carrier tape 80 into the tape insertion portion 11 is detected, the presence of the carrier tape 80 on the tape transport path 20 is detected, and the operation lever 37 is pressed. When it is detected that the vehicle has returned to the original position, the rear motor 33 is driven to rotate the rear sprocket 31. In this case, the rear sprocket 31 is outside the carrier tape 80 in a state where the tip side of the carrier tape 80 is allowed to be transported from the stop portion 39d to the tape transport direction X downstream side due to the separation of the stop portion 39d from the tape transport path 20. Since the teeth and the feed hole 86 of the carrier tape 80 rotate in an engaged state, the carrier tape 80 is conveyed to the tape discharge portion 12 side by the rotation of the rear sprocket 31.
　後部側スプロケット３１の回転によるキャリアテープ８０の搬送が進行すると、そのキャリアテープ８０の先端が、上面押部材２８の後端部に形成された案内部とテープ搬送路２０との間から上面押部材２８の下方に進入する。このため、キャリアテープ８０の先端側は、上面押部材２８によってテープ搬送路２０からの浮き上がりが抑制された状態で前部側スプロケット３２側に向けて搬送される。そして、キャリアテープ８０の先端が前部側スプロケット３２のテープ搬送方向Ｘ上流側に到達したことがセンサを用いて検出されると、後部側モータ３３及び前部側モータ３４が駆動されて、後部側スプロケット３１及び前部側スプロケット３２が間欠的に回転する。 When the carrier tape 80 is conveyed by the rotation of the rear sprocket 31, the tip of the carrier tape 80 is pushed from between the guide portion formed at the rear end of the upper surface pushing member 28 and the tape conveying path 20. Enter below 28. Therefore, the tip end side of the carrier tape 80 is conveyed toward the front sprocket 32 side in a state where the upper surface pushing member 28 suppresses the lifting from the tape conveying path 20. Then, when it is detected by the sensor that the tip of the carrier tape 80 has reached the tape transport direction X upstream side of the front side sprocket 32, the rear side motor 33 and the front side motor 34 are driven to drive the rear part. The side sprocket 31 and the front side sprocket 32 rotate intermittently.
　この状態でキャリアテープ８０の送り孔８６に前部側スプロケット３２の外歯が係合すると、そのキャリアテープ８０が前部側スプロケット３２の回転によってテープ排出部１２側に搬送される。そして、その搬送中、テープ搬送路２０上でキャリアテープ８０のテープ搬送方向Ｘ先端がテープガイド４０の部品露出部４５の舌部４６に達して、キャリアテープ８０の搬送方向先端のベーステープ８２とカバーテープ８３との間に舌部４６の先端部４６ａが進入する。 In this state, when the external teeth of the front side sprocket 32 engage with the feed hole 86 of the carrier tape 80, the carrier tape 80 is conveyed to the tape discharge portion 12 side by the rotation of the front side sprocket 32. Then, during the transfer, the tape transport direction X tip of the carrier tape 80 reaches the tongue portion 46 of the component exposed portion 45 of the tape guide 40 on the tape transport path 20, and the base tape 82 at the tip of the carrier tape 80 in the transport direction. The tip portion 46a of the tongue portion 46 enters between the cover tape 83 and the cover tape 83.
　上記の如く舌部４６の先端部４６ａがキャリアテープ８０の搬送方向先端のベーステープ８２とカバーテープ８３との間に進入した後、更に前部側スプロケット３２の回転が継続すると、部品露出部４５の剥離刃４７が、ベーステープ８２とカバーテープ８３との接着箇所に挿入されて、ベーステープ８２からカバーテープ８３を部分的に剥離する。そして、前部側スプロケット３２の回転により、キャリアテープ８０は、ベーステープ８２からカバーテープ８３が剥離されて部品収納部８４内の電子部品２が露出した状態でテープ搬送方向Ｘに沿って搬送される。 When the tip 46a of the tongue 46 enters between the base tape 82 and the cover tape 83 at the tip of the carrier tape 80 in the transport direction and the front sprocket 32 continues to rotate as described above, the component exposed portion 45 The peeling blade 47 of the above is inserted into the bonding portion between the base tape 82 and the cover tape 83, and the cover tape 83 is partially peeled from the base tape 82. Then, due to the rotation of the front side sprocket 32, the carrier tape 80 is conveyed along the tape conveying direction X in a state where the cover tape 83 is peeled off from the base tape 82 and the electronic component 2 in the component accommodating portion 84 is exposed. To.
　上記の如くキャリアテープ８０の搬送が行われると、部品収納部８４内の電子部品２が部品取出位置Ｐに供給される。部品取出位置Ｐに供給された電子部品２は、後部側スプロケット３１及び前部側スプロケット３２の間欠的な回転中における回転停止ごとに、部品装着機１００が備える部品移載装置１２０により吸着又は把持されて部品収納部８４から取り出され、基板生産ライン上の基板３に移載される。 When the carrier tape 80 is conveyed as described above, the electronic component 2 in the component storage unit 84 is supplied to the component take-out position P. The electronic component 2 supplied to the component take-out position P is attracted or gripped by the component transfer device 120 included in the component mounting machine 100 each time the rotation is stopped during the intermittent rotation of the rear sprocket 31 and the front sprocket 32. It is taken out from the component storage unit 84 and transferred to the substrate 3 on the substrate production line.
　３．テープガイドの効果
　キャリアテープ８０は、テープ搬送路２０上での搬送中、ベーステープ８２からカバーテープ８３が剥離されて部品収納部８４内の電子部品２が露出した後、バックアップ板バネ５０により上方へ付勢されることで、ベーステープ８２の上面が舌部４６の裏面に押し付けられた状態でテープ搬送方向Ｘに沿って搬送される。電子部品２は、露出後、部品取出位置Ｐに達するまで、カバーテープ８３で覆われなくなる。舌部４６におけるキャリアテープ８０の部品収納部８４の開口に対向し得る対向領域Ｓには、部品収納部８４から電子部品２が飛び出すのを防止する対向部４１ａが設けられている。対向部４１ａは、電子部品２に比して硬度の低い材料（具体的には、樹脂）により形成されている。 3. 3. Effect of Tape Guide The carrier tape 80 is moved upward by the backup leaf spring 50 after the cover tape 83 is peeled off from the base tape 82 and the electronic component 2 in the component storage portion 84 is exposed during the transfer on the tape transport path 20. By being urged to, the upper surface of the base tape 82 is conveyed along the tape conveying direction X in a state of being pressed against the back surface of the tongue portion 46. After exposure, the electronic component 2 is not covered with the cover tape 83 until the component removal position P is reached. In the facing region S of the tongue portion 46 that can face the opening of the component storage portion 84 of the carrier tape 80, a facing portion 41a that prevents the electronic component 2 from popping out from the component storage portion 84 is provided. The facing portion 41a is formed of a material (specifically, a resin) having a hardness lower than that of the electronic component 2.
　この構成においては、キャリアテープ８０の部品収納部８４内の電子部品２が露出した後、その部品収納部８４内の電子部品２が舌部４６の裏面に接触したとき、電子部品２及び舌部４６のうち傷が付くのは、硬度の低い舌部４６側である。従って、電子部品２の露出後、部品取出位置Ｐへの到達までの間、その電子部品２が部品収納部８４の開口から飛び出ている或いはその電子部品２の上端と部品収納部８４の開口とのクリアランスが小さいときに、その電子部品２に舌部４６との接触に起因して傷が付くのを防止することができる。このため、部品装着機１００によりキャリアテープ８０から取り出される電子部品２が不良品となるのを回避することができる。 In this configuration, after the electronic component 2 in the component storage portion 84 of the carrier tape 80 is exposed, when the electronic component 2 in the component storage portion 84 comes into contact with the back surface of the tongue portion 46, the electronic component 2 and the tongue portion Of the 46, the one that is scratched is the tongue portion 46, which has a low hardness. Therefore, after the electronic component 2 is exposed and until it reaches the component take-out position P, the electronic component 2 protrudes from the opening of the component storage portion 84, or the upper end of the electronic component 2 and the opening of the component storage portion 84. When the clearance is small, it is possible to prevent the electronic component 2 from being scratched due to contact with the tongue portion 46. Therefore, it is possible to prevent the electronic component 2 taken out from the carrier tape 80 by the component mounting machine 100 from becoming a defective product.
　また、舌部４６の裏面は、その面全体がベーステープ８２における部品収納部８４を含む周辺領域の上面に対向して当接するように略水平平面に形成されている。この構成においては、舌部４６の裏面の略全域が、バックアップ板バネ５０により上方へ付勢されるベーステープ８２の上面に当接してそのベーステープ８２を支持するので、舌部４６の裏面が部品収納部８４内の電子部品２に接触しないようにその裏面にトンネル状の溝或いは段差が形成される構成に比して、ベーステープ８２の上面が舌部４６の裏面に支持される面積を最大限確保することができる。このため、キャリアテープ８０の搬送時、振動などに起因してベーステープ８２の部品収納部８４内で露出した電子部品２の姿勢が乱れ易くなるのを防止することができ、部品取出位置Ｐでの電子部品２の取り出しを安定化させることができる。 Further, the back surface of the tongue portion 46 is formed in a substantially horizontal plane so that the entire surface surface of the tongue portion 46 faces the upper surface of the peripheral region including the component storage portion 84 of the base tape 82. In this configuration, substantially the entire back surface of the tongue portion 46 abuts on the upper surface of the base tape 82 that is urged upward by the backup leaf spring 50 to support the base tape 82, so that the back surface of the tongue portion 46 is The area where the upper surface of the base tape 82 is supported by the back surface of the tongue portion 46 is larger than the configuration in which a tunnel-shaped groove or a step is formed on the back surface of the electronic component 2 in the component storage portion 84 so as not to come into contact with the electronic component 2. It can be secured to the maximum. Therefore, it is possible to prevent the posture of the electronic component 2 exposed in the component storage portion 84 of the base tape 82 from being easily disturbed due to vibration or the like during transportation of the carrier tape 80, and at the component take-out position P. It is possible to stabilize the take-out of the electronic component 2 of the above.
　また、舌部４６の先端部４６ａの最先端は、対向部４１ａに含まれて樹脂により形成されていると共に、その先端部４６ａの剥離刃４７は、金属部４１ｂに含まれており、金属により形成されている。この構成においては、舌部４６のうちキャリアテープ８０のベーステープ８２とカバーテープ８３との間に最初に進入してベーステープ８２からカバーテープ８３を起こし上げする部位（すなわち、先端部４６ａの最先端）が樹脂により形成されると共に、ベーステープ８２とカバーテープ８３との接着箇所に挿入してベーステープ８２からカバーテープ８３を剥離する部位（すなわち、剥離刃４７）が金属により形成される。 Further, the leading edge of the tip portion 46a of the tongue portion 46 is included in the facing portion 41a and is formed of resin, and the peeling blade 47 of the tip portion 46a is included in the metal portion 41b and is made of metal. It is formed. In this configuration, the portion of the tongue 46 that first enters between the base tape 82 and the cover tape 83 of the carrier tape 80 and raises the cover tape 83 from the base tape 82 (that is, the most tip portion 46a). The tip) is formed of resin, and a portion (that is, a peeling blade 47) that is inserted into the bonding portion between the base tape 82 and the cover tape 83 to peel off the cover tape 83 from the base tape 82 is formed of metal.
　ベーステープ８２とカバーテープ８３との間に最初に進入する舌部４６の先端部４６ａの最先端は、ベーステープ８２の部品収納部８４の真上に位置している。このため、上記の構成によれば、この舌部４６の先端部４６ａの最先端が金属により形成される構成とは異なり、カバーテープ８３の下面に部品収納部８４内の電子部品２が貼り付いている場合などにその電子部品２を舌部４６の樹脂部分でカバーテープ８３の下面から剥がすことができ、これにより、その電子部品２に傷が付くのを確実に防止することができる。また、ベーステープ８２とカバーテープ８３との接着箇所を剥離する剥離刃４７が樹脂により形成される構成に比べて、剥離刃４７の耐久性を向上させることができる。 The tip of the tip 46a of the tongue portion 46 that first enters between the base tape 82 and the cover tape 83 is located directly above the component storage portion 84 of the base tape 82. Therefore, according to the above configuration, unlike the configuration in which the tip end portion 46a of the tongue portion 46 is formed of metal, the electronic component 2 in the component storage portion 84 is attached to the lower surface of the cover tape 83. The electronic component 2 can be peeled off from the lower surface of the cover tape 83 at the resin portion of the tongue portion 46, whereby the electronic component 2 can be reliably prevented from being scratched. Further, the durability of the peeling blade 47 can be improved as compared with the structure in which the peeling blade 47 for peeling the adhesive portion between the base tape 82 and the cover tape 83 is formed of resin.
　４．変形形態
　ところで、上記の実施形態においては、ガイド本体部４１の舌部４６の裏面に形成される対向領域Ｓが、キャリアテープ８０の搬送時に部品露出部４５により電子部品２が露出する部品収納部８４の開口に対向し得る領域であって、舌部４６における露出開始位置から部品取出位置Ｐまでのテープ搬送方向Ｘに沿って延びる領域である。そして、電子部品２に比して硬度の低い樹脂製の対向部４１ａが、その対向領域Ｓ全域に亘ってテープ搬送方向Ｘに沿って直線状に延びている。しかし、本開示は、これに限定されるものではなく、対向部４１ａが、その対向領域Ｓのうち一部に形成されるものであってよい。 4. Deformed form In the above embodiment, the facing region S formed on the back surface of the tongue portion 46 of the guide main body portion 41 is a component storage portion in which the electronic component 2 is exposed by the component exposed portion 45 when the carrier tape 80 is conveyed. It is a region that can face the opening of 84 and extends along the tape transport direction X from the exposure start position on the tongue portion 46 to the component take-out position P. Then, the resin facing portion 41a, which has a lower hardness than the electronic component 2, extends linearly along the tape transport direction X over the entire facing region S. However, the present disclosure is not limited to this, and the facing portion 41a may be formed in a part of the facing region S.
　例えば、舌部４６がキャリアテープ８０のベーステープ８２とカバーテープ８３との間への進入を開始する際にその舌部４６の先端部４６ａに電子部品２が接触してその電子部品２を損傷させるのを防止するため、舌部４６の先端部４６ａの対向領域Ｓにのみ、電子部品２に比して硬度の低い樹脂製の対向部４１ａが形成されるものであってもよい。また、舌部４６がキャリアテープ８０のベーステープ８２とカバーテープ８３との間への進入を開始した後のキャリアテープ８０の搬送中にその舌部４６の裏面に電子部品２が接触してその電子部品２を損傷させるのを防止するため、舌部４６の先端部４６ａを除く対向領域Ｓに対向部４１ａが形成されるものとし、その先端部４６ａの対向領域Ｓに対向部４１ａが形成されないものであってもよい。 For example, when the tongue portion 46 starts to enter between the base tape 82 and the cover tape 83 of the carrier tape 80, the electronic component 2 comes into contact with the tip portion 46a of the tongue portion 46 and damages the electronic component 2. In order to prevent this from occurring, a resin facing portion 41a having a hardness lower than that of the electronic component 2 may be formed only in the facing region S of the tip portion 46a of the tongue portion 46. Further, the electronic component 2 comes into contact with the back surface of the tongue portion 46 during the transfer of the carrier tape 80 after the tongue portion 46 starts to enter between the base tape 82 and the cover tape 83 of the carrier tape 80. In order to prevent the electronic component 2 from being damaged, the facing portion 41a is formed in the facing region S excluding the tip portion 46a of the tongue portion 46, and the facing portion 41a is not formed in the facing region S of the tip portion 46a. It may be a thing.
　また、上記の実施形態においては、ガイド本体部４１の舌部４６は、先端部４６ａが、他方のテープ幅方向端部側（具体的には、送り孔８６が設けられた側）にて最もテープ搬送方向Ｘ上流側に位置し、その他方のテープ幅方向端部側から上記した一方のテープ幅方向端部側にかけて徐々にテープ搬送方向Ｘ下流側に位置するように形成されている。そして、その先端部４６ａの最先端が、ベーステープ８２の部品収納部８４の真上に位置しており、電子部品２に比して硬度の低い樹脂製の対向部４１ａに設けられている。 Further, in the above embodiment, the tongue portion 46 of the guide main body portion 41 has the tip portion 46a most on the other end side in the tape width direction (specifically, the side where the feed hole 86 is provided). It is formed so as to be located on the upstream side of the tape transport direction X and gradually located on the downstream side of the tape transport direction X from the other end side in the tape width direction to the one end side in the tape width direction described above. The tip of the tip portion 46a is located directly above the component storage portion 84 of the base tape 82, and is provided on the resin facing portion 41a having a hardness lower than that of the electronic component 2.
　しかし、本開示は、これに限定されるものではなく、図１３及び図１４に示す如く、ガイド本体部４１の舌部４６は、先端部４６ａが、他方のテープ幅方向端部側（具体的には、送り孔８６が設けられた側）からテープ幅方向中央部側にかけて傾斜して徐々に搬送方向上流側に位置し、そのテープ幅方向中央部側から上記した一方のテープ幅方向端部側にかけて傾斜して徐々に搬送方向下流側に位置するように形成されていてよい。そして、先端部４６ａの最先端が、ベーステープ８２の部品収納部８４の真上に対して僅かにテープ幅方向にオフセットして位置し、金属部４１ｂ（具体的には、対向部４１ａからテープ幅方向にオフセットした箇所）に設けられることとしてもよい。 However, the present disclosure is not limited to this, and as shown in FIGS. 13 and 14, the tongue portion 46 of the guide main body portion 41 has a tip portion 46a on the other end side in the tape width direction (specifically). Is inclined from the side where the feed hole 86 is provided) toward the central portion in the tape width direction and is gradually located on the upstream side in the transport direction, and from the central portion side in the tape width direction to the one end portion in the tape width direction described above. It may be formed so as to be inclined toward the side and gradually located on the downstream side in the transport direction. The leading edge of the tip portion 46a is located slightly offset in the tape width direction with respect to directly above the component storage portion 84 of the base tape 82, and the metal portion 41b (specifically, the tape from the facing portion 41a). It may be provided at a location offset in the width direction).
　また、上記の実施形態においては、ガイド本体部４１の舌部４６の一部（具体的には、剥離刃４７を含む金属部４１ｂとは異なる部分）に、電子部品２に比して硬度の低い樹脂製の対向部４１ａが形成されている。しかし、本開示は、これに限定されるものではなく、その舌部４６の全体（特に、下面全体）に電子部品２に比して硬度の低い樹脂製の対向部４１ａを形成することとしてもよい。 Further, in the above embodiment, a part of the tongue portion 46 of the guide main body portion 41 (specifically, a portion different from the metal portion 41b including the peeling blade 47) has a hardness higher than that of the electronic component 2. A low resin facing portion 41a is formed. However, the present disclosure is not limited to this, and it is also possible to form a resin facing portion 41a having a hardness lower than that of the electronic component 2 on the entire tongue portion 46 (particularly, the entire lower surface). Good.
　また、上記の実施形態においては、ガイド本体部４１の舌部４６の裏面が、その面全体がベーステープ８２における部品収納部８４を含む周辺領域の上面に対向して当接するように略水平平面に形成されている。しかし、本開示は、これに限定されるものではなく、その舌部４６の裏面が、特に対向部４１ａについて、キャリアテープ８０の部品収納部８４内の電子部品２との接触が生じないようにトンネル状の溝或いは段差を有することとしてもよい。 Further, in the above embodiment, the back surface of the tongue portion 46 of the guide main body portion 41 is substantially horizontal so that the entire surface of the tongue portion 46 faces the upper surface of the peripheral region including the component storage portion 84 of the base tape 82. Is formed in. However, the present disclosure is not limited to this, so that the back surface of the tongue portion 46 does not come into contact with the electronic component 2 in the component storage portion 84 of the carrier tape 80, particularly with respect to the facing portion 41a. It may have a tunnel-shaped groove or a step.
　この変形形態によれば、舌部４６の溝或いは段差が形成された箇所の裏面とキャリアテープ８０（具体的には、ベーステープ８２）の上面との距離が比較的大きくなる。このため、その舌部４６の裏面に部品収納部８４内の電子部品２が接触する可能性を低く抑えることができる。また、対向部４１ａは、電子部品２に比して硬度の低い材料（具体的には、樹脂）により形成されている。このため、舌部４６の溝或いは段差が形成された箇所の裏面と部品収納部８４の底面との間の空間内で電子部品２の姿勢が変化して、その舌部４６の裏面にその電子部品２が接触したとしても、その電子部品２に傷が付くのを防止することができる。 According to this modified form, the distance between the back surface of the portion where the groove or step of the tongue portion 46 is formed and the upper surface of the carrier tape 80 (specifically, the base tape 82) becomes relatively large. Therefore, the possibility that the electronic component 2 in the component storage portion 84 comes into contact with the back surface of the tongue portion 46 can be suppressed to a low level. Further, the facing portion 41a is formed of a material (specifically, a resin) having a hardness lower than that of the electronic component 2. Therefore, the posture of the electronic component 2 changes in the space between the back surface of the portion where the groove or step of the tongue portion 46 is formed and the bottom surface of the component storage portion 84, and the electronic component 2 is placed on the back surface of the tongue portion 46. Even if the component 2 comes into contact with the electronic component 2, it is possible to prevent the electronic component 2 from being scratched.
　また、上記の実施形態及び上記の変形形態においては、舌部４６の裏面と部品収納部８４の底面との間の空間内で電子部品２の姿勢が変化するのを抑えるため、例えば、バックアップ板バネ５０などに、電子部品２を部品収納部８４内の底面側に吸着保持させる磁力を発生する磁石などを設けることとするのが好適である。 Further, in the above-described embodiment and the above-described modified form, in order to suppress the posture of the electronic component 2 from changing in the space between the back surface of the tongue portion 46 and the bottom surface of the component storage portion 84, for example, a backup plate. It is preferable that the spring 50 or the like is provided with a magnet or the like that generates a magnetic force that attracts and holds the electronic component 2 on the bottom surface side in the component storage portion 84.
　また、上記の実施形態においては、ベーステープ８２にカバーテープ８３が接着されて部品収納部８４内の電子部品２がカバーテープ８３で覆われた状態から、部品露出部４５の剥離刃４７がベーステープ８２とカバーテープ８３との接着箇所に挿入されてカバーテープ８３がベーステープ８２から部分的に剥離されることで、その電子部品２が露出することとしている。しかし、本開示は、これに限定されるものではなく、部品収納部８４内の電子部品２を露出させるうえで、カバーテープ８３をベーステープ８２から剥離することなく、カバーテープ８３がカッタでテープ幅方向に二分割されることで観音開きする構成に適用することとしてもよい。 Further, in the above embodiment, the cover tape 83 is adhered to the base tape 82, and the electronic component 2 in the component storage portion 84 is covered with the cover tape 83, and then the release blade 47 of the component exposed portion 45 is used as the base. The electronic component 2 is exposed by being inserted into the bonding portion between the tape 82 and the cover tape 83 and the cover tape 83 being partially peeled off from the base tape 82. However, the present disclosure is not limited to this, and in exposing the electronic component 2 in the component storage portion 84, the cover tape 83 is taped with a cutter without peeling the cover tape 83 from the base tape 82. It may be applied to a configuration in which a double door is opened by being divided into two in the width direction.
　更に、上記の実施形態においては、部品供給装置１が、電子部品２が収納されているキャリアテープ８０を本体ケース１０のテープ挿入部１１からテープ排出部１２まで自動的に搬送するオートローディングフィーダである。しかし、本開示は、これに限定されるものではなく、部品供給装置１が、カセットケースに覆われたカセット式テープフィーダであってもよい。 Further, in the above embodiment, the component supply device 1 is an auto-loading feeder that automatically conveys the carrier tape 80 containing the electronic component 2 from the tape insertion portion 11 to the tape discharge portion 12 of the main body case 10. is there. However, the present disclosure is not limited to this, and the component supply device 1 may be a cassette type tape feeder covered with a cassette case.
　尚、本開示は、上述した実施形態や変形形態に限定されるものではなく、発明の趣旨を逸脱しない範囲で種々の変更を施すことが可能である。 Note that the present disclosure is not limited to the above-described embodiments and modifications, and various modifications can be made without departing from the spirit of the invention.
　１：部品供給装置、２：電子部品、２ａ：本体部、２ｂ：電極端子、１０：本体ケース、２０：テープ搬送路、４０：テープガイド、４１：ガイド本体部、４１ａ：対向部、４１ｂ：金属部、４２：上壁部、４３：側壁部、４５：部品露出部、４６：舌部、４６ａ：先端部、４７：剥離刃、８０：キャリアテープ、８２：ベーステープ、８３：カバーテープ、８４：部品収納部、８６：送り孔、１００：部品装着機、Ｐ：部品取出位置。 1: Parts supply device, 2: Electronic parts, 2a: Main body, 2b: Electrode terminals, 10: Main body case, 20: Tape transport path, 40: Tape guide, 41: Guide main body, 41a: Opposing part, 41b: Metal part, 42: Upper wall part, 43: Side wall part, 45: Exposed part, 46: Tongue part, 46a: Tip part, 47: Peeling blade, 80: Carrier tape, 82: Base tape, 83: Cover tape, 84: Parts storage, 86: Feed hole, 100: Parts mounting machine, P: Parts removal position.

Claims (9)

  1. 　電子部品を収納する部品収納部が設けられたベーステープと、前記ベーステープの表面に前記部品収納部の開口を閉塞するように設けられたカバーテープと、を有するキャリアテープが搬送される搬送方向に沿って延び、前記キャリアテープをガイドするガイド本体部と、
    　前記ガイド本体部にガイドされる前記キャリアテープの前記部品収納部内の前記電子部品を露出させる部品露出部と、
    　を備えるテープガイドであって、
    　前記ガイド本体部は、前記キャリアテープの搬送時に前記部品露出部により前記電子部品が露出する前記部品収納部の前記開口に対向し得る対向領域に形成され、前記電子部品に比して硬度の低い対向部を有する、テープガイド。     A transport direction in which a carrier tape having a base tape provided with a component storage portion for storing electronic components and a cover tape provided on the surface of the base tape so as to close the opening of the component storage portion is transported. A guide body that extends along and guides the carrier tape,
    A component exposed portion that exposes the electronic component in the component storage portion of the carrier tape guided by the guide main body portion, and a component exposed portion.
    It is a tape guide equipped with
    The guide main body is formed in an opposed region that can face the opening of the component storage portion where the electronic component is exposed by the component exposed portion when the carrier tape is conveyed, and has a lower hardness than the electronic component. A tape guide with facing parts.
  2. 　電子部品を収納する部品収納部が設けられたベーステープと、前記ベーステープの表面に前記部品収納部の開口を閉塞するように設けられたカバーテープと、を有するキャリアテープが搬送される搬送方向に沿って延び、前記キャリアテープをガイドするガイド本体部と、
    　前記ガイド本体部にガイドされる前記キャリアテープの前記部品収納部内の前記電子部品を露出させる部品露出部と、
    　を備えるテープガイドであって、
    　前記ガイド本体部は、前記キャリアテープの搬送時に前記部品露出部により前記電子部品が露出する前記部品収納部の前記開口に対向し得る対向領域に形成された樹脂製の対向部を有する、テープガイド。     A transport direction in which a carrier tape having a base tape provided with a component storage portion for storing electronic components and a cover tape provided on the surface of the base tape so as to close the opening of the component storage portion is transported. A guide body that extends along and guides the carrier tape,
    A component exposed portion that exposes the electronic component in the component storage portion of the carrier tape guided by the guide main body portion, and a component exposed portion.
    It is a tape guide equipped with
    The guide main body has a resin facing portion formed in a facing region that can face the opening of the component housing portion where the electronic component is exposed by the component exposed portion when the carrier tape is conveyed. ..
  3. 　前記対向部は、前記部品露出部により前記電子部品が露出した前記部品収納部から前記電子部品が飛び出すのを防止するための部位である、請求項１又は２に記載されたテープガイド。 The tape guide according to claim 1 or 2, wherein the facing portion is a portion for preventing the electronic component from popping out from the component storage portion where the electronic component is exposed by the component exposed portion.
  4. 　前記対向部は、前記電子部品の本体部又は電極端子の材料に比して硬度の低い材料により形成されている、請求項１乃至３の何れか一項に記載されたテープガイド。 The tape guide according to any one of claims 1 to 3, wherein the facing portion is formed of a material having a hardness lower than that of the main body portion of the electronic component or the electrode terminal.
  5. 　前記対向領域は、前記ガイド本体部における前記電子部品の露出が開始される露出開始位置から前記部品収納部内で露出した前記電子部品が取り出される部品取出位置までの前記搬送方向に沿って延在する領域である、請求項１乃至４の何れか一項に記載されたテープガイド。 The facing region extends along the transport direction from the exposure start position where the electronic component is exposed in the guide main body portion to the component take-out position where the exposed electronic component is taken out in the component storage portion. The tape guide according to any one of claims 1 to 4, which is an area.
  6. 　前記対向部は、前記対向領域のうちの一部に形成されている、請求項５に記載されたテープガイド。 The tape guide according to claim 5, wherein the facing portion is formed in a part of the facing region.
  7. 　前記ガイド本体部は、前記対向部が形成された領域とは異なる領域に形成された金属製の金属部を有する、請求項１乃至６の何れか一項に記載されたテープガイド。 The tape guide according to any one of claims 1 to 6, wherein the guide main body portion has a metal portion made of metal formed in a region different from the region where the facing portion is formed.
  8. 　前記部品露出部は、前記ガイド本体部に設けられ、前記キャリアテープの搬送中に前記ベーステープと前記カバーテープとの間に挿入される舌部を有し、
    　前記舌部の最先端は、前記対向部に設けられている、請求項１乃至７の何れか一項に記載されたテープガイド。     The component exposed portion has a tongue portion provided on the guide main body portion and inserted between the base tape and the cover tape during transportation of the carrier tape.
    The tape guide according to any one of claims 1 to 7, wherein the tip of the tongue portion is provided on the facing portion.
  9. 　前記部品露出部は、前記ガイド本体部に設けられ、前記キャリアテープの搬送中に前記ベーステープと前記カバーテープとの間に挿入される舌部を有し、
    　前記舌部の最先端は、前記金属部における、前記対向部からテープ幅方向にオフセットした箇所に設けられている、請求項７に記載されたテープガイド。     The component exposed portion has a tongue portion provided on the guide main body portion and inserted between the base tape and the cover tape during transportation of the carrier tape.
    The tape guide according to claim 7, wherein the leading edge of the tongue portion is provided at a position offset in the tape width direction from the facing portion in the metal portion.
PCT/JP2019/032319 2019-08-19 2019-08-19 Tape guide WO2021033245A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/032319 WO2021033245A1 (en) 2019-08-19 2019-08-19 Tape guide
JP2021541366A JP7273977B2 (en) 2019-08-19 2019-08-19 tape guide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/032319 WO2021033245A1 (en) 2019-08-19 2019-08-19 Tape guide

Publications (1)

Publication Number Publication Date
WO2021033245A1 true WO2021033245A1 (en) 2021-02-25

Family

ID=74660615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/032319 WO2021033245A1 (en) 2019-08-19 2019-08-19 Tape guide

Country Status (2)

Country Link
JP (1) JP7273977B2 (en)
WO (1) WO2021033245A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002533943A (en) * 1998-12-22 2002-10-08 マイデータ オートメーション アクチボラグ Parts machine tape guides and magazines
JP2003188578A (en) * 2001-12-18 2003-07-04 Matsushita Electric Ind Co Ltd Tape feeder
JP2007280979A (en) * 2006-04-03 2007-10-25 Urawa Denken Kk Cover tape stripper and tape feeder using the same
WO2018189785A1 (en) * 2017-04-10 2018-10-18 ヤマハ発動機株式会社 Tape ejection guide structure, component supply device and component mounting machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002533943A (en) * 1998-12-22 2002-10-08 マイデータ オートメーション アクチボラグ Parts machine tape guides and magazines
JP2003188578A (en) * 2001-12-18 2003-07-04 Matsushita Electric Ind Co Ltd Tape feeder
JP2007280979A (en) * 2006-04-03 2007-10-25 Urawa Denken Kk Cover tape stripper and tape feeder using the same
WO2018189785A1 (en) * 2017-04-10 2018-10-18 ヤマハ発動機株式会社 Tape ejection guide structure, component supply device and component mounting machine

Also Published As

Publication number Publication date
JPWO2021033245A1 (en) 2021-02-25
JP7273977B2 (en) 2023-05-15

Similar Documents

Publication Publication Date Title
JP6445676B2 (en) feeder
JP6561113B2 (en) feeder
WO2015181958A1 (en) Feeder
WO2016203627A1 (en) Feeder
JPWO2016098235A1 (en) feeder
JP6553643B2 (en) feeder
JP6748695B2 (en) feeder
WO2021033245A1 (en) Tape guide
JP7254141B2 (en) Feeder and tape guide
JP2018041892A (en) feeder
JP7030138B2 (en) feeder
JP6694358B2 (en) Interference presence / absence detection device and interference presence / absence detection method
JP6799973B2 (en) feeder
JP2022090125A (en) feeder
JP7246485B2 (en) TAPE GUIDE, COMPONENTS SUPPLY DEVICE, AND TAPE GUIDE USAGE
JP6745340B2 (en) feeder
JP6448544B2 (en) feeder
KR20110091147A (en) Carrier tape guide of tape feeder for chip mounter
JP7261326B2 (en) Tape guide and parts feeder
JP7225448B2 (en) tape feeder
JP6475313B2 (en) feeder
JP2019149586A (en) Component mounting device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19941788

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021541366

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19941788

Country of ref document: EP

Kind code of ref document: A1