WO2021012827A1 - Preparation method for ceramic shell, ceramic shell and electronic device - Google Patents

Preparation method for ceramic shell, ceramic shell and electronic device Download PDF

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Publication number
WO2021012827A1
WO2021012827A1 PCT/CN2020/095317 CN2020095317W WO2021012827A1 WO 2021012827 A1 WO2021012827 A1 WO 2021012827A1 CN 2020095317 W CN2020095317 W CN 2020095317W WO 2021012827 A1 WO2021012827 A1 WO 2021012827A1
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WO
WIPO (PCT)
Prior art keywords
ceramic
glass fiber
fiber board
main body
adhesive layer
Prior art date
Application number
PCT/CN2020/095317
Other languages
French (fr)
Chinese (zh)
Inventor
李�杰
Original Assignee
Oppo广东移动通信有限公司
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Publication date
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Publication of WO2021012827A1 publication Critical patent/WO2021012827A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Definitions

  • the invention relates to the technical field of electronic equipment, in particular to a method for preparing a ceramic casing, a ceramic casing and an electronic device.
  • structures such as the middle frame and the back cover occupying a larger area of the outer surface of electronic devices such as mobile phones and tablet computers are metal shells. Due to the electromagnetic shielding effect of the metal shells, it is difficult for signals to pass through the electronic devices. At present, the use of a ceramic shell can not only reduce the electromagnetic shielding effect brought by the metal shell, but also meet consumers' pursuit of the overall appearance and texture of electronic devices such as mobile phones and tablet computers.
  • ceramic shells are easily damaged when they collide with other objects due to their brittleness.
  • ceramic shells are generally thicker. Thicker ceramic shells have greater weight and are inconvenient. The carrying of electronic equipment and the development of thinner and lighter electronic equipment.
  • a method for preparing a ceramic shell includes the following steps:
  • the ceramic body including an inner surface and an outer surface disposed opposite to each other;
  • a glass fiber board is arranged on the side of the inner surface of the ceramic body, so that the glass fiber board and the ceramic body are laminated.
  • a ceramic shell including:
  • the ceramic body includes an inner surface and an outer surface arranged opposite to each other;
  • the glass fiber board is arranged on the inner surface of the ceramic green body, and the glass fiber board and the ceramic green body are laminated and arranged.
  • An electronic device includes the above-mentioned ceramic casing.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a ceramic housing provided by an embodiment
  • FIG. 3 is a schematic flow diagram of the steps of a method for preparing a ceramic housing provided by an embodiment
  • Fig. 4 is a schematic flow chart of the steps of a method for preparing a ceramic housing provided by an embodiment.
  • a mobile phone is taken as an example to describe the electronic device 10.
  • the electronic device 10 includes a housing 100 and a display screen 300.
  • the housing 100 is connected to the display screen 300 and enclosed to form a receiving space, which is used to house electronic components of the electronic device 10, such as a circuit board, a memory, a battery, a camera module, a fingerprint module, etc.
  • the electronic device 10 may also be a tablet computer, a wearable device, etc., which is not limited herein.
  • the housing 100 may have a structure of functional holes for assembling components that realize specific functions, or for peripheral components that realize specific components to form a detachable connection with the electronic device 10, or as a signal input such as sound.
  • the function hole can be used to install a volume control key to realize functions such as adjusting the volume of the audio information of the electronic device 10, or to install a SIM card, or to install a power button, or to provide external data.
  • the display screen 300 may adopt an LCD (Liquid Crystal Display) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor) screen or an IPS (In-Plane Switching) screen. ) Screen or SLCD (Splice Liquid Crystal Display) screen.
  • the display screen 300 may adopt an OLED (Organic Light-Emitting Diode, organic electro-laser display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode). Polar body) screen or Super AMOLED (Super Active Matrix Organic Light Emitting Diode) screen or Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus) screen, not here Repeat it again.
  • the housing 100 is a ceramic housing 1000.
  • the ceramic housing 1000 can not only reduce the electromagnetic shielding effect brought about by the traditional metal housing, but also meet consumers' pursuit of the overall appearance and texture of the electronic device 10.
  • part of the structure of the housing 100 is made of ceramic materials, while other structures are still made of other materials (such as metal, but not limited to this).
  • the housing 100 includes a middle frame and The back cover, the middle frame may be a ceramic middle frame, or the back cover may be a ceramic back cover.
  • the ceramic housing 1000 includes a ceramic body 110 and a glass fiber board 120.
  • the ceramic body 110 includes an inner surface 111 and an outer surface 112 disposed opposite to each other, and the glass fiber board 120 is stacked on the inner surface 111 of the ceramic body 110.
  • the ceramic body 110 can be prepared by debinding, sintering, and grinding of a ceramic green body, and the ceramic green body can be prepared from a ceramic slurry through processes such as dry pressing, casting, and injection molding, and the ceramic slurry can be prepared from ceramic raw materials.
  • the powder and the binder are mixed, and the ceramic raw material powder can be selected from one or more of alumina powder, zirconia powder, and zirconium nitride powder.
  • the binder may be selected from one or more of paraffin wax, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyformaldehyde.
  • the glass fiber board 120 can be formed by hot pressing several glass fiber cloths, and the resulting glass fiber board 120 has higher tensile strength under the premise of a thinner thickness.
  • the metal plate or alloy plate is attached to the inner surface of the ceramic body. Since the metal plate and the alloy plate have an electromagnetic shielding effect, it is not conducive to signal transmission between the inside of the electronic device and the outside world.
  • the plastic material is molded to the inner surface of the ceramic body and a plastic layer is formed to bond with the inner surface of the ceramic body. Since the area of the molded plastic layer is the same as the area of the inner surface of the ceramic body, The molding area of the plastic material is relatively large, and the thickness of the molded plastic layer is at least 0.5 mm to ensure complete molding, which increases the overall thickness of the ceramic shell obtained by combining the plastic layer and the ceramic body.
  • the glass fiber board 120 can achieve high tensile strength while keeping the thickness sufficiently light and thin, the glass fiber board 120 is laminated and arranged on the inner surface 111 of the ceramic body 110
  • the glass fiber board 120 can support the ceramic body 110.
  • the arrangement of the glass fiber board 120 makes up for the defect that the thickness of the ceramic body 110 of the present invention is thinner than that of the traditional ceramic body, resulting in insufficient structural strength.
  • the ceramic body 110 can be made thinner, and the weight of the ceramic body 110 with a thinner thickness is smaller, so that the weight of the ceramic shell 1000 formed by the combination of the ceramic body 110 and the glass fiber board 120 is relatively reduced.
  • the ceramic body 110 includes a main body portion 110a and side portions bent and extended from the edge of the main body portion 110a 110b, the main body 110a and the side 110b form a receiving groove 1101, and the receiving groove 1101 is used for accommodating the electronic components of the electronic device 10, and the glass fiber board 120 is laminated on the main body 110a and the side 110b.
  • the fiberglass board 120 includes a main body 120a and a bending portion 120b connected to the edge of the main body 120a.
  • the main body 120a is stacked on the main body 110a correspondingly, and the bending portion 120b is stacked on the side portion 110b correspondingly.
  • the glass fiber board 120 can not only provide strong support to the main body 110a of the ceramic housing 1000, but also provide strong support to the side 110b of the ceramic housing 1000.
  • the ceramic housing 1000 can resist both frontal and side impacts. It is improved so that the ceramic shell 1000 will not crack or chip at the corners.
  • the ceramic body 110 and the glass fiber board 120 may be a flat plate.
  • the ceramic housing 1000 includes an adhesive layer 130, which is provided between the inner surface 111 of the ceramic body 110 and the glass fiber board 120, that is, the glass fiber
  • the board 120 is bonded to the inner surface 111 of the ceramic body 110 through the bonding layer 130 to enhance the composite strength of the ceramic body 110 and the glass fiber board 120.
  • the adhesive layer 130 is formed by the deposition of adhesive glue, and the adhesive glue can be a-cyanoacrylate instant adhesive, anaerobic glue, acrylic structural glue, ethyl acrylate adhesive, epoxy acrylate glue and other acrylates.
  • Glue can also use hot melt adhesive tape, rubber pellets, rubber powder, EVA hot melt adhesive, rubber hot melt adhesive, polypropylene, polyester, polyamide, polyurethane hot melt adhesive, styrene hot melt adhesive, new hot melt Hot melt adhesives such as glue, polyethylene and ethylene copolymer hot melt adhesives.
  • the adhesive glue may also be an adhesive such as solid polymer glue, solution polymer glue, emulsion polymer glue, monomer polymer glue, etc. The material of the adhesive glue is not limited here.
  • the thickness of the ceramic body 110 is 0.2 mm to 0.3 mm
  • the thickness of the glass fiber board 120 is 0.1 mm to 0.3 mm
  • the thickness of the adhesive layer 130 is 0.03 mm to 0.07 mm.
  • the thickness of the ceramic body 110 is 0.25 mm
  • the thickness of the glass fiber board 120 is 0.2 mm
  • the thickness of the bonding layer 130 is 0.05 mm, that is, the thickness of the final ceramic shell 1000 is 0.5 mm
  • the weight of the ceramic shell 1000 with a thickness of 0.5mm is approximately 23.02g-23.1g, and the roller drop test is approximately maintained at 85-90 laps.
  • the weight of a traditional ceramic shell (pure ceramic) with a thickness of 0.45mm is roughly 31.87g ⁇ 31.94g, and the roller drop test is roughly maintained at 85 ⁇ 90 circles. It can be seen that under the premise that the thickness of the ceramic housing 1000 of the present invention is substantially the same as or close to that of the traditional ceramic housing, the ceramic housing 1000 of the present invention has the same structural strength as the traditional ceramic housing and has a smaller weight.
  • a method for preparing the ceramic housing 10 please refer to FIG. 3 and FIG. 4, including the following steps:
  • the ceramic body 110 is obtained.
  • the ceramic body 110 includes an inner surface 111 and an outer surface 112 disposed opposite to each other.
  • the ceramic green body 110 can be made by debinding, sintering, and grinding a ceramic green body, and the ceramic green body can be made by a process such as dry pressing, casting, and injection molding of a ceramic slurry.
  • the material can be formed by mixing ceramic raw material powder and a binder.
  • the ceramic raw material powder can be selected from one or more of alumina powder, zirconia powder, and zirconium nitride powder.
  • the binder may be selected from one or more of paraffin wax, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyoxymethylene.
  • a glass fiber board 120 is laminated on the side where the inner surface 111 of the ceramic body 110 is located.
  • the glass fiber board 120 can be formed by hot pressing several glass fiber cloths, and the resulting glass fiber board 120 has higher tensile strength under the premise of a thinner thickness.
  • the step of stacking the fiberglass board 120 on the side where the inner surface 111 of the ceramic body 110 is located is specifically: bonding the fiberglass board 120 to the inner surface of the ceramic body 110 through an adhesive layer 130 111.
  • a glass fiber board 120 with a thickness of 0.1 mm to 0.3 mm can be bonded to the inner surface 111 of a ceramic body 110 with a thickness of 0.2 mm to 0.3 mm through an adhesive layer 130 with a thickness of 0.03 mm to 0.07 mm.
  • stacking the glass fiber board 120 on the side where the inner surface 111 of the ceramic body 110 is located includes the following steps:
  • Step S104a spray adhesive glue on the inner surface 111 of the ceramic body 110.
  • the ceramic body 110 can be fixed by a jig, so that the inner surface 111 of the ceramic body 110 faces upward relative to the outer surface 112, and then the adhesive is evenly sprayed on the inner surface 111 of the ceramic body 110 with a spray gun to form an adhesive ⁇ 130 ⁇ Connected layer 130.
  • step S104b the glass fiber board 120 is bonded to the adhesive layer 130.
  • the glass fiber board 120 can also be fixed by a jig first, and the adhesive glue can be evenly sprayed on a surface of the glass fiber board 120 with a spray gun to form the bonding layer 130, and then the ceramic body 110 is adhered to the adhesive layer 130.
  • the viscosity of the adhesive can be controlled between 500cc and 800cc, and the air pressure of the spray gun is between 0.6MPa and 0.8MPa.
  • the bonding pressure is controlled to be 1.8kgf to 2.2kgf, for example, the bonding pressure is controlled to be 2kgf, and Hold the pressure for at least 2s.
  • the purpose of the pressure is to make the glass fiber board 120 fully bond and fix the ceramic body 110 through the adhesive layer 130. After the pressure is completed, the ceramic body 110 and the glass fiber board 120 are overflowed. Clean up the glue.
  • the adhesive glue can be a-cyanoacrylate instant adhesive, anaerobic glue, acrylic structural glue, ethyl acrylate adhesive, epoxy acrylate Adhesives and other acrylic adhesives, hot melt adhesive strips, rubber particles, rubber powder, EVA hot melt adhesive, rubber hot melt adhesive, polypropylene, polyester, polyamide, polyurethane hot melt adhesive, styrene hot melt adhesive , New hot melt adhesives, hot melt adhesives such as polyethylene and ethylene copolymer hot melt adhesives.
  • the adhesive glue may also be an adhesive such as solid polymer glue, solution polymer glue, emulsion polymer glue, monomer polymer glue, etc. The material of the adhesive glue is not limited here.
  • the ceramic body 110 includes a main body 110a and a side portion 120b bent and extended from the edge of the main body 110a.
  • a glass fiber board 120 is provided on the side of the inner surface 111 of the ceramic body 110 In the step, the glass fiber board 120 is laminated on the main body 110a and the side edges 120b. In this way, the glass fiber board 120 can not only provide strong support to the main body 110a of the ceramic housing 1000, but also provide strong support to the side 110b of the ceramic housing 1000.
  • the ceramic housing 1000 can resist both frontal and side impacts. It is improved, so that the ceramic casing 1000 will not crack or chip at the corners.
  • step S106 the ceramic body 110 and the glass fiber board 120 bonded by the bonding layer 130 are baked to cure the bonding layer 130.
  • the baking temperature is 60°C ⁇ 100°C, and the baking time is 8min ⁇ 12min. In an embodiment, the baking temperature is controlled to 80°C, and the baking time is 10 minutes.

Abstract

Provided is a preparation method for a ceramic shell (1000), including the following steps: obtaining a ceramic body (110), the ceramic body (110) including an inner surface (111) and an outer surface (112) arranged opposite to each other; and laminating a glass fiber board (120) on the side where the inner surface (111) of the ceramic body (110) is located.

Description

陶瓷壳体的制备方法、陶瓷壳体及电子设备Preparation method of ceramic shell, ceramic shell and electronic equipment 技术领域Technical field
本发明涉及电子设备技术领域，特别是涉及一种陶瓷壳体的制备方法、陶瓷壳体及电子设备。The invention relates to the technical field of electronic equipment, in particular to a method for preparing a ceramic casing, a ceramic casing and an electronic device.
背景技术Background technique
相关技术中，占据手机、平板电脑等电子设备外表面较大部分面积的中框、后盖等结构为金属壳体，由于金属壳体的电磁屏蔽效应，使得信号难以通过电子设备。目前，使用陶瓷壳体不仅可以减小由金属壳体带来的电磁屏蔽效应，还能满足消费者对手机、平板电脑等电子设备整体外观质感的追求。In the related art, structures such as the middle frame and the back cover occupying a larger area of the outer surface of electronic devices such as mobile phones and tablet computers are metal shells. Due to the electromagnetic shielding effect of the metal shells, it is difficult for signals to pass through the electronic devices. At present, the use of a ceramic shell can not only reduce the electromagnetic shielding effect brought by the metal shell, but also meet consumers' pursuit of the overall appearance and texture of electronic devices such as mobile phones and tablet computers.
然而，陶瓷壳体因其脆性较大而易与其它物体碰撞时被损坏，为了减少陶瓷壳体的损坏，陶瓷壳体普遍较厚，厚度较厚的陶瓷壳体具有较大的重量，不便于电子设备的携带以及电子设备轻薄化的发展。However, ceramic shells are easily damaged when they collide with other objects due to their brittleness. In order to reduce the damage of ceramic shells, ceramic shells are generally thicker. Thicker ceramic shells have greater weight and are inconvenient. The carrying of electronic equipment and the development of thinner and lighter electronic equipment.
发明内容Summary of the invention
基于此，有必要提供一种陶瓷壳体的制备方法、陶瓷壳体及包括该陶瓷壳体的电子设备。Based on this, it is necessary to provide a method for preparing a ceramic housing, a ceramic housing, and an electronic device including the ceramic housing.
一种陶瓷壳体的制备方法，包括以下步骤：A method for preparing a ceramic shell includes the following steps:
获取陶瓷坯体，所述陶瓷坯体包括相背设置的内表面和外表面；以及Obtaining a ceramic body, the ceramic body including an inner surface and an outer surface disposed opposite to each other; and
在所述陶瓷坯体的内表面所在一侧设置玻纤板，以使所述玻纤板与所述陶瓷坯体层叠设置。A glass fiber board is arranged on the side of the inner surface of the ceramic body, so that the glass fiber board and the ceramic body are laminated.
一种陶瓷壳体，包括：A ceramic shell, including:
陶瓷坯体，包括相背设置的内表面和外表面；以及The ceramic body includes an inner surface and an outer surface arranged opposite to each other; and
玻纤板，设置于所述陶瓷坯体的内表面，且所述玻纤板与所述陶瓷坯体层叠设置。The glass fiber board is arranged on the inner surface of the ceramic green body, and the glass fiber board and the ceramic green body are laminated and arranged.
一种电子设备，包括上述的陶瓷壳体。An electronic device includes the above-mentioned ceramic casing.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.
图1为本发明一实施例提供的电子设备的结构示意图；FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention;
图2为一实施例提供的陶瓷壳体的结构示意图；FIG. 2 is a schematic structural diagram of a ceramic housing provided by an embodiment;
图3为一实施例提供的陶瓷壳体的制备方法的步骤流程示意图；FIG. 3 is a schematic flow diagram of the steps of a method for preparing a ceramic housing provided by an embodiment;
图4为一实施例提供的陶瓷壳体的制备方法的步骤流程示意图。Fig. 4 is a schematic flow chart of the steps of a method for preparing a ceramic housing provided by an embodiment.
具体实施方式Detailed ways
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The drawings show preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.
参考图1所示，在一实施例中以手机为例对电子设备10进行说明，所述电子设备10包括壳体100和显示屏300。壳体100与显示屏300相连，并围合形成收容空间，收容空间用于收容电子设备10的电子元器件，例如电路板、存储器、电池、摄像头模组、指纹模组等等。可以理解，在其它实施例中，电子设备10也可以为平板电脑、可穿戴设备等，在此不作限定。Referring to FIG. 1, in one embodiment, a mobile phone is taken as an example to describe the electronic device 10. The electronic device 10 includes a housing 100 and a display screen 300. The housing 100 is connected to the display screen 300 and enclosed to form a receiving space, which is used to house electronic components of the electronic device 10, such as a circuit board, a memory, a battery, a camera module, a fingerprint module, etc. It can be understood that in other embodiments, the electronic device 10 may also be a tablet computer, a wearable device, etc., which is not limited herein.
在一实施例中，壳体100可以开设功能孔的结构，以用于装配实现特定功能的元件，或者供实现特定元件的外设元件与电子设备10形成可拆卸连接，或者作为声音等信号输入输出的通道。例如，功能孔可以用于安装音量控制键，以实现对电子设备10的音频信息的音量播放大小的调节等功能，或者用于安装SIM卡，或者用于安装电源按键，或者用于供外界数据线接头输入输出的通道，或者用于供外界耳机线接头输入输出的通道，或者用于供电子设备10摄像头采光的通道。需要说明的是，数控车床 加工的具体操作步骤、参数等本领域技术人员均可以根据实际情况灵活选择。In an embodiment, the housing 100 may have a structure of functional holes for assembling components that realize specific functions, or for peripheral components that realize specific components to form a detachable connection with the electronic device 10, or as a signal input such as sound. The output channel. For example, the function hole can be used to install a volume control key to realize functions such as adjusting the volume of the audio information of the electronic device 10, or to install a SIM card, or to install a power button, or to provide external data. The input and output channel of the line connector, or the channel used for the input and output of the external headphone line connector, or the channel used for the lighting of the camera of the electronic device 10. It should be noted that the specific operation steps and parameters of CNC lathe processing can be flexibly selected by those skilled in the art according to actual conditions.
在一些实施例中，显示屏300可以采用LCD(Liquid Crystal Display，液晶显示)屏用于显示信息，LCD屏可以为TFT(Thin Film Transistor，薄膜晶体管)屏幕或IPS(In-Plane Switching，平面转换)屏幕或SLCD(Splice Liquid Crystal Display，拼接专用液晶显示)屏幕。在另一些实施例中，显示屏300可以采用OLED(Organic Light-Emitting Diode，有机电激光显示)屏用于显示信息，OLED屏可以为AMOLED(Active Matrix Organic Light Emitting Diode，有源矩阵有机发光二极体)屏幕或Super AMOLED(Super Active Matrix Organic Light Emitting Diode，超级主动驱动式有机发光二极体)屏幕或Super AMOLED Plus(Super Active Matrix Organic Light Emitting Diode Plus，魔丽屏)屏幕，此处不再赘述。In some embodiments, the display screen 300 may adopt an LCD (Liquid Crystal Display) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor) screen or an IPS (In-Plane Switching) screen. ) Screen or SLCD (Splice Liquid Crystal Display) screen. In other embodiments, the display screen 300 may adopt an OLED (Organic Light-Emitting Diode, organic electro-laser display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode). Polar body) screen or Super AMOLED (Super Active Matrix Organic Light Emitting Diode) screen or Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus) screen, not here Repeat it again.
在一实施例中，壳体100为陶瓷壳体1000，陶瓷壳体1000不仅可以减小传统金属壳体带来的电磁屏蔽效应，而且还能满足消费者对手电子设备10整体外观质感的追求。在其它实施例中，壳体100的部分结构采用陶瓷材料制备，而其它结构仍采用其它材料(例如金属，但不限于此)制备，例如，在一实施例中，壳体100包括中框和后盖，中框可以为陶瓷中框，或者后盖为陶瓷后盖。In one embodiment, the housing 100 is a ceramic housing 1000. The ceramic housing 1000 can not only reduce the electromagnetic shielding effect brought about by the traditional metal housing, but also meet consumers' pursuit of the overall appearance and texture of the electronic device 10. In other embodiments, part of the structure of the housing 100 is made of ceramic materials, while other structures are still made of other materials (such as metal, but not limited to this). For example, in one embodiment, the housing 100 includes a middle frame and The back cover, the middle frame may be a ceramic middle frame, or the back cover may be a ceramic back cover.
在一实施例中，参考图2所示，陶瓷壳体1000包括陶瓷坯体110和玻纤板120。陶瓷坯体110包括相背设置的内表面111和外表面112，玻纤板120层叠设置于陶瓷坯体110的内表面111。其中，陶瓷坯体110可由陶瓷生坯经排胶、烧结、研磨而制得，而陶瓷生胚可由陶瓷浆料通过干压、流延、注塑成型等工艺制得，而陶瓷浆料可由陶瓷原料粉末和粘结剂混合而成，陶瓷原料粉末可以选自氧化铝粉末、氧化锆粉末、氮化锆粉末中的一种或多种。粘结剂可以选自石蜡、聚乙二醇、硬脂酸、邻苯二甲酸二辛脂、聚乙烯、聚丙烯、聚甲基丙烯酸甲酯、聚甲醛中的一种或多种。玻纤板120可由数个玻璃纤维布热压而成，由此得到的玻纤板120在厚度较薄的前提下还具有较高的抗拉伸强度。In one embodiment, as shown in FIG. 2, the ceramic housing 1000 includes a ceramic body 110 and a glass fiber board 120. The ceramic body 110 includes an inner surface 111 and an outer surface 112 disposed opposite to each other, and the glass fiber board 120 is stacked on the inner surface 111 of the ceramic body 110. Among them, the ceramic body 110 can be prepared by debinding, sintering, and grinding of a ceramic green body, and the ceramic green body can be prepared from a ceramic slurry through processes such as dry pressing, casting, and injection molding, and the ceramic slurry can be prepared from ceramic raw materials. The powder and the binder are mixed, and the ceramic raw material powder can be selected from one or more of alumina powder, zirconia powder, and zirconium nitride powder. The binder may be selected from one or more of paraffin wax, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyformaldehyde. The glass fiber board 120 can be formed by hot pressing several glass fiber cloths, and the resulting glass fiber board 120 has higher tensile strength under the premise of a thinner thickness.
在传统的陶瓷壳体中，将金属板或者合金板与陶瓷坯体的内表面进行贴合，由于金属板和合金板具有电磁屏蔽效应，不利于电子设备内部与外界的信号传输。又或者，将塑胶材质成型至陶瓷坯体的内表面并形成塑胶层，以与陶瓷坯体的内表面进行粘合，由于成型后的塑胶层的面积与陶瓷坯体的内表面的面积相同，塑胶材质的成型面积较大，成型后的塑胶层的厚度至少为0.5mm才能保证完全成型，增大了塑胶层与陶瓷坯体复合所得到的的陶瓷壳体的整体厚度。In the traditional ceramic shell, the metal plate or alloy plate is attached to the inner surface of the ceramic body. Since the metal plate and the alloy plate have an electromagnetic shielding effect, it is not conducive to signal transmission between the inside of the electronic device and the outside world. Or, the plastic material is molded to the inner surface of the ceramic body and a plastic layer is formed to bond with the inner surface of the ceramic body. Since the area of the molded plastic layer is the same as the area of the inner surface of the ceramic body, The molding area of the plastic material is relatively large, and the thickness of the molded plastic layer is at least 0.5 mm to ensure complete molding, which increases the overall thickness of the ceramic shell obtained by combining the plastic layer and the ceramic body.
在本发明的陶瓷壳体1000中，由于玻纤板120在保持厚度足够轻薄的前提下还能够实现较高的拉伸强度，故将玻纤板120层叠设置于陶瓷坯体110的内表面111，玻纤板120能够对陶瓷坯体110起到支撑作用，玻纤板120的设置弥补了本发明的陶瓷坯体110厚度相对传统陶瓷坯体厚度较薄而使结构强度不足的缺陷，本发明的陶瓷坯体110能够做的更薄，厚度更薄的陶瓷坯体110的重量更小，从而陶瓷坯体110与玻纤板120组合形成的陶瓷壳体1000的重量也相对减小。In the ceramic casing 1000 of the present invention, since the glass fiber board 120 can achieve high tensile strength while keeping the thickness sufficiently light and thin, the glass fiber board 120 is laminated and arranged on the inner surface 111 of the ceramic body 110 The glass fiber board 120 can support the ceramic body 110. The arrangement of the glass fiber board 120 makes up for the defect that the thickness of the ceramic body 110 of the present invention is thinner than that of the traditional ceramic body, resulting in insufficient structural strength. The ceramic body 110 can be made thinner, and the weight of the ceramic body 110 with a thinner thickness is smaller, so that the weight of the ceramic shell 1000 formed by the combination of the ceramic body 110 and the glass fiber board 120 is relatively reduced.
在一实施例中，请继续参考图2所示，以陶瓷壳体1000为陶瓷后盖为例，陶瓷坯体110包括主体部110a以及由主体部110a的边缘弯折延伸而出的侧边部110b，主体部110a与侧边部110b形成收容槽1101，收容槽1101用于收容电子设备10的电子元器件，玻纤板120层叠设置于主体部110a和侧边部110b。可以理解，玻纤板120包括本体120a以及与本体120a的边缘连接的弯折部120b，本体120a对应层叠设置于主体部110a，弯折部120b对应层叠设置于侧边部110b。如此，玻纤板120不仅能够对陶瓷壳体1000的主体部110a提供强度支撑，还能够对陶瓷壳体1000的侧边部110b提供强度支撑，陶瓷壳体1000抵抗正面和侧面冲击的能力皆能够得到提高，从而陶瓷壳体1000不会出现边角开裂或崩缺的情况。在其它实施例中，陶瓷坯体110和玻纤板120可以为一块平板。In one embodiment, please continue to refer to FIG. 2. Taking the ceramic housing 1000 as a ceramic back cover as an example, the ceramic body 110 includes a main body portion 110a and side portions bent and extended from the edge of the main body portion 110a 110b, the main body 110a and the side 110b form a receiving groove 1101, and the receiving groove 1101 is used for accommodating the electronic components of the electronic device 10, and the glass fiber board 120 is laminated on the main body 110a and the side 110b. It can be understood that the fiberglass board 120 includes a main body 120a and a bending portion 120b connected to the edge of the main body 120a. The main body 120a is stacked on the main body 110a correspondingly, and the bending portion 120b is stacked on the side portion 110b correspondingly. In this way, the glass fiber board 120 can not only provide strong support to the main body 110a of the ceramic housing 1000, but also provide strong support to the side 110b of the ceramic housing 1000. The ceramic housing 1000 can resist both frontal and side impacts. It is improved so that the ceramic shell 1000 will not crack or chip at the corners. In other embodiments, the ceramic body 110 and the glass fiber board 120 may be a flat plate.
在一实施例中，请继续参考图2所示，陶瓷壳体1000包括粘接层130，粘接层130设于陶瓷坯体110的内表面111与玻纤板120之间，也即玻纤板120通过粘接层130粘接于陶瓷坯体110的内表面111，以增强陶瓷坯体110与玻纤板120的复合强度。其中，粘接层130由粘接胶沉积形成，粘接胶可以采用a-氰基丙烯酸酯瞬干胶、厌氧胶、丙烯酸结构胶、乙基丙烯酸酯胶粘剂、环氧丙烯酸酯胶等丙烯酸酯胶，也可以采用热熔胶条、胶粒、胶粉、EVA热熔胶、橡胶热熔胶、聚丙烯、聚酯、聚酰胺、聚胺酯热熔胶、苯乙烯类热熔胶、新型热熔胶、聚乙烯及乙烯共聚物热熔胶等热熔胶。在其他实施例中，粘接胶还可以采用固体高分子胶、溶液高分子胶、乳液高分子胶、单体高分子胶等粘胶剂，对于粘接胶的材质， 在此不作限定。In one embodiment, please continue to refer to FIG. 2, the ceramic housing 1000 includes an adhesive layer 130, which is provided between the inner surface 111 of the ceramic body 110 and the glass fiber board 120, that is, the glass fiber The board 120 is bonded to the inner surface 111 of the ceramic body 110 through the bonding layer 130 to enhance the composite strength of the ceramic body 110 and the glass fiber board 120. Wherein, the adhesive layer 130 is formed by the deposition of adhesive glue, and the adhesive glue can be a-cyanoacrylate instant adhesive, anaerobic glue, acrylic structural glue, ethyl acrylate adhesive, epoxy acrylate glue and other acrylates. Glue, can also use hot melt adhesive tape, rubber pellets, rubber powder, EVA hot melt adhesive, rubber hot melt adhesive, polypropylene, polyester, polyamide, polyurethane hot melt adhesive, styrene hot melt adhesive, new hot melt Hot melt adhesives such as glue, polyethylene and ethylene copolymer hot melt adhesives. In other embodiments, the adhesive glue may also be an adhesive such as solid polymer glue, solution polymer glue, emulsion polymer glue, monomer polymer glue, etc. The material of the adhesive glue is not limited here.
在一实施例中，陶瓷坯体110的厚度为0.2mm～0.3mm，玻纤板120的厚度为0.1mm～0.3mm，粘接层130的厚度为0.03mm～0.07mm。在一实施例中，陶瓷坯体110的厚度为0.25mm，玻纤板120的厚度为0.2mm，粘接层130的厚度为0.05mm，也即最终得到的陶瓷壳体1000的厚度为0.5mm，经过多次测量，厚度为0.5mm的陶瓷壳体1000的重量大致为23.02g～23.1g，滚筒跌落试验大致保持在85圈～90圈。而传统厚度为0.45mm的陶瓷壳体(纯陶瓷)的重量大致为31.87g～31.94g，滚筒跌落试验大致保持在85圈～90圈。由此可知，在本发明的陶瓷壳体1000与传统陶瓷壳体厚度基本相同或接近的前提下，本发明陶瓷壳体1000具有与传统陶瓷壳体相同的结构强度，并具有更小的重量。In an embodiment, the thickness of the ceramic body 110 is 0.2 mm to 0.3 mm, the thickness of the glass fiber board 120 is 0.1 mm to 0.3 mm, and the thickness of the adhesive layer 130 is 0.03 mm to 0.07 mm. In one embodiment, the thickness of the ceramic body 110 is 0.25 mm, the thickness of the glass fiber board 120 is 0.2 mm, and the thickness of the bonding layer 130 is 0.05 mm, that is, the thickness of the final ceramic shell 1000 is 0.5 mm After many measurements, the weight of the ceramic shell 1000 with a thickness of 0.5mm is approximately 23.02g-23.1g, and the roller drop test is approximately maintained at 85-90 laps. The weight of a traditional ceramic shell (pure ceramic) with a thickness of 0.45mm is roughly 31.87g～31.94g, and the roller drop test is roughly maintained at 85～90 circles. It can be seen that under the premise that the thickness of the ceramic housing 1000 of the present invention is substantially the same as or close to that of the traditional ceramic housing, the ceramic housing 1000 of the present invention has the same structural strength as the traditional ceramic housing and has a smaller weight.
本发明的另一方面，还提供了一种陶瓷壳体10的制备方法，请参考图3和图4所示，包括以下步骤：In another aspect of the present invention, there is also provided a method for preparing the ceramic housing 10, please refer to FIG. 3 and FIG. 4, including the following steps:
步骤S102，获取陶瓷坯体110。陶瓷坯体110包括相背设置的内表面111和外表面112。在一实施例中，陶瓷坯体110可由陶瓷生坯经排胶、烧结、研磨而制得，而陶瓷生胚可由陶瓷浆料通过干压、流延、注塑成型等工艺制得，而陶瓷浆料可由陶瓷原料粉末和粘结剂混合而成，陶瓷原料粉末可以选自氧化铝粉末、氧化锆粉末、氮化锆粉末中的一种或多种。粘结剂可以选自石蜡、聚乙二醇、硬脂酸、邻苯二甲酸二辛脂、聚乙烯、聚丙烯、聚甲基丙烯酸甲酯、聚甲醛中的一种或多种。In step S102, the ceramic body 110 is obtained. The ceramic body 110 includes an inner surface 111 and an outer surface 112 disposed opposite to each other. In one embodiment, the ceramic green body 110 can be made by debinding, sintering, and grinding a ceramic green body, and the ceramic green body can be made by a process such as dry pressing, casting, and injection molding of a ceramic slurry. The material can be formed by mixing ceramic raw material powder and a binder. The ceramic raw material powder can be selected from one or more of alumina powder, zirconia powder, and zirconium nitride powder. The binder may be selected from one or more of paraffin wax, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyoxymethylene.
步骤S104，在陶瓷坯体110的内表面111所在一侧层叠设置玻纤板120。其中，玻纤板120可由数个玻璃纤维布热压而成，由此得到的玻纤板120在厚度较薄的前提下还具有较高的抗拉伸强度。In step S104, a glass fiber board 120 is laminated on the side where the inner surface 111 of the ceramic body 110 is located. The glass fiber board 120 can be formed by hot pressing several glass fiber cloths, and the resulting glass fiber board 120 has higher tensile strength under the premise of a thinner thickness.
在一实施例中，在陶瓷坯体110的内表面111所在一侧层叠设置玻纤板120的步骤，具体为：将玻纤板120通过粘接层130粘接于陶瓷坯体110的内表面111。例如，可将厚度为0.1mm～0.3mm的玻纤板120通过厚度为0.03mm～0.07mm的粘接层130粘接于厚度为0.2mm～0.3mm的陶瓷坯体110的内表面111。In one embodiment, the step of stacking the fiberglass board 120 on the side where the inner surface 111 of the ceramic body 110 is located is specifically: bonding the fiberglass board 120 to the inner surface of the ceramic body 110 through an adhesive layer 130 111. For example, a glass fiber board 120 with a thickness of 0.1 mm to 0.3 mm can be bonded to the inner surface 111 of a ceramic body 110 with a thickness of 0.2 mm to 0.3 mm through an adhesive layer 130 with a thickness of 0.03 mm to 0.07 mm.
在一实施例中，在陶瓷坯体110的内表面111所在一侧层叠设置玻纤板120包括如下步骤：In an embodiment, stacking the glass fiber board 120 on the side where the inner surface 111 of the ceramic body 110 is located includes the following steps:
步骤S104a：将粘接胶喷涂于陶瓷坯体110的内表面111。例如，可先通过治具固定陶瓷坯体110，使陶瓷坯体110的内表面111相对外表面112朝上，再利用喷枪将粘接胶均匀喷涂在陶瓷坯体110的内表面111并形成粘接层130。Step S104a: spray adhesive glue on the inner surface 111 of the ceramic body 110. For example, the ceramic body 110 can be fixed by a jig, so that the inner surface 111 of the ceramic body 110 faces upward relative to the outer surface 112, and then the adhesive is evenly sprayed on the inner surface 111 of the ceramic body 110 with a spray gun to form an adhesive接层130。 Connected layer 130.
步骤S104b，将玻纤板120粘接于粘接层130。可以理解，在其它实施例中，也可以先通过治具固定玻纤板120，利用喷枪将粘接胶均匀喷涂在玻纤板120的一表面上并形成粘接层130，再将陶瓷坯体110粘接于粘接层130。其中，粘接胶的粘度可控制在500cc～800cc，喷枪气压为0.6MPa～0.8MPa。In step S104b, the glass fiber board 120 is bonded to the adhesive layer 130. It can be understood that, in other embodiments, the glass fiber board 120 can also be fixed by a jig first, and the adhesive glue can be evenly sprayed on a surface of the glass fiber board 120 with a spray gun to form the bonding layer 130, and then the ceramic body 110 is adhered to the adhesive layer 130. Among them, the viscosity of the adhesive can be controlled between 500cc and 800cc, and the air pressure of the spray gun is between 0.6MPa and 0.8MPa.
在一实施例中，在将玻纤板120通过粘接层130与陶瓷坯体110的内表面111粘接时，控制粘接压力为1.8kgf～2.2kgf，例如控制粘接压力为2kgf，并保压至少2s，保压的目的是为了使玻纤板120通过粘接层130与陶瓷坯体110充分粘接固定，保压结束后再将陶瓷坯体110与玻纤板120结合处的溢胶清理干净。In one embodiment, when the glass fiber board 120 is bonded to the inner surface 111 of the ceramic body 110 through the bonding layer 130, the bonding pressure is controlled to be 1.8kgf to 2.2kgf, for example, the bonding pressure is controlled to be 2kgf, and Hold the pressure for at least 2s. The purpose of the pressure is to make the glass fiber board 120 fully bond and fix the ceramic body 110 through the adhesive layer 130. After the pressure is completed, the ceramic body 110 and the glass fiber board 120 are overflowed. Clean up the glue.
需要说明的是，上述粘接层130由粘接胶沉积形成，粘接胶可以采用a-氰基丙烯酸酯瞬干胶、厌氧胶、丙烯酸结构胶、乙基丙烯酸酯胶粘剂、环氧丙烯酸酯胶等丙烯酸酯胶，也可以采用热熔胶条、胶粒、胶粉、EVA热熔胶、橡胶热熔胶、聚丙烯、聚酯、聚酰胺、聚胺酯热熔胶、苯乙烯类热熔胶、新型热熔胶、聚乙烯及乙烯共聚物热熔胶等热熔胶。在其他实施例中，粘接胶还可以采用固体高分子胶、溶液高分子胶、乳液高分子胶、单体高分子胶等粘胶剂，对于粘接胶的材质，在此不作限定。It should be noted that the above-mentioned adhesive layer 130 is formed by the deposition of adhesive glue, and the adhesive glue can be a-cyanoacrylate instant adhesive, anaerobic glue, acrylic structural glue, ethyl acrylate adhesive, epoxy acrylate Adhesives and other acrylic adhesives, hot melt adhesive strips, rubber particles, rubber powder, EVA hot melt adhesive, rubber hot melt adhesive, polypropylene, polyester, polyamide, polyurethane hot melt adhesive, styrene hot melt adhesive , New hot melt adhesives, hot melt adhesives such as polyethylene and ethylene copolymer hot melt adhesives. In other embodiments, the adhesive glue may also be an adhesive such as solid polymer glue, solution polymer glue, emulsion polymer glue, monomer polymer glue, etc. The material of the adhesive glue is not limited here.
在一实施例中，陶瓷坯体110包括主体部110a以及由主体部110a的边缘弯折延伸而出的侧边部120b，在陶瓷坯体110的内表面111所在一侧设置玻纤板120的步骤中，使玻纤板120层叠于主体部110a和侧边部120b。如此，玻纤板120不仅能够对陶瓷壳体1000的主体部110a提供强度支撑，还能够对陶瓷壳体1000的侧边部110b提供强度支撑，陶瓷壳体1000抵抗正面和侧面冲击的能力皆能够得到提高，从而陶瓷壳体1000不会出现边角开裂或崩缺的情况。In one embodiment, the ceramic body 110 includes a main body 110a and a side portion 120b bent and extended from the edge of the main body 110a. A glass fiber board 120 is provided on the side of the inner surface 111 of the ceramic body 110 In the step, the glass fiber board 120 is laminated on the main body 110a and the side edges 120b. In this way, the glass fiber board 120 can not only provide strong support to the main body 110a of the ceramic housing 1000, but also provide strong support to the side 110b of the ceramic housing 1000. The ceramic housing 1000 can resist both frontal and side impacts. It is improved, so that the ceramic casing 1000 will not crack or chip at the corners.
步骤S106，烘烤通过粘接层130粘接的陶瓷坯体110和玻纤板120，以固化粘接层130。其中，烘烤温度为60℃～100℃，烘烤时间为8min～12min。在一实施例中，控制烘烤温度为80℃，烘烤时间为10min。In step S106, the ceramic body 110 and the glass fiber board 120 bonded by the bonding layer 130 are baked to cure the bonding layer 130. Among them, the baking temperature is 60℃～100℃, and the baking time is 8min～12min. In an embodiment, the baking temperature is controlled to 80°C, and the baking time is 10 minutes.
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several embodiments of the present invention, and the descriptions are more specific and detailed, but they should not be understood as limiting the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (20)

  1. 一种陶瓷壳体的制备方法，包括以下步骤：A method for preparing a ceramic shell includes the following steps:
    获取陶瓷坯体，所述陶瓷坯体包括相背设置的内表面和外表面；以及Obtaining a ceramic body, the ceramic body including an inner surface and an outer surface disposed opposite to each other; and
    在所述陶瓷坯体的内表面所在一侧设置玻纤板，以使所述玻纤板与所述陶瓷坯体层叠设置。A glass fiber board is arranged on the side of the inner surface of the ceramic body, so that the glass fiber board and the ceramic body are laminated.
  2. 根据权利要求1所述的陶瓷壳体的制备方法，其特征在于，所述在所述陶瓷坯体的内表面所在一侧设置玻纤板的步骤，具体为：The manufacturing method of the ceramic shell according to claim 1, wherein the step of arranging a glass fiber board on the side where the inner surface of the ceramic body is located is specifically:
    将所述玻纤板通过粘接层粘接于所述陶瓷坯体的内表面。The glass fiber board is bonded to the inner surface of the ceramic body through an adhesive layer.
  3. 根据权利要求2所述的陶瓷壳体的制备方法，其特征在于，所述将所述玻纤板通过粘接层粘接于所述陶瓷坯体的内表面的步骤，具体为：The method for preparing a ceramic casing according to claim 2, wherein the step of bonding the glass fiber board to the inner surface of the ceramic body through an adhesive layer is specifically:
    将厚度为0.1mm～0.3mm的玻纤板通过厚度为0.03mm～0.07mm的粘接层粘接于厚度为0.2mm～0.3mm的陶瓷坯体的内表面。A glass fiber board with a thickness of 0.1 mm to 0.3 mm is bonded to the inner surface of a ceramic body with a thickness of 0.2 mm to 0.3 mm through an adhesive layer with a thickness of 0.03 mm to 0.07 mm.
  4. 根据权利要求2所述的陶瓷壳体的制备方法，其特征在于，所述将所述玻纤板通过粘接层粘接于所述陶瓷坯体的内表面，包括如下步骤：The method for preparing a ceramic shell according to claim 2, wherein the bonding the glass fiber board to the inner surface of the ceramic body through an adhesive layer comprises the following steps:
    将粘接胶喷涂于所述陶瓷坯体的内表面以形成所述粘接层；Spraying adhesive glue on the inner surface of the ceramic body to form the adhesive layer;
    将玻纤板粘接于所述粘接层背向所述陶瓷坯体的一侧。The glass fiber board is bonded to the side of the bonding layer facing away from the ceramic body.
  5. 根据权利要求2所述的陶瓷壳体的制备方法，其特征在于，所述将所述玻纤板通过粘接层粘接于所述陶瓷坯体的内表面，包括如下步骤：The method for preparing a ceramic shell according to claim 2, wherein the bonding the glass fiber board to the inner surface of the ceramic body through an adhesive layer comprises the following steps:
    将粘接胶喷涂于玻纤板以形成所述粘接层；Spraying adhesive glue on the glass fiber board to form the adhesive layer;
    将陶瓷坯体粘接于所述粘接层背向所述玻纤板的一侧。The ceramic body is bonded to the side of the adhesive layer facing away from the glass fiber board.
  6. 根据权利要求2所述的陶瓷壳体的制备方法，其特征在于，在将所述玻纤板通过粘接层粘接于所述陶瓷坯体的内表面的步骤中，控制粘接压力为1.8kg～2.2kgf，并控制保压时间为至少2s。The method for preparing a ceramic casing according to claim 2, wherein in the step of bonding the glass fiber board to the inner surface of the ceramic body through an adhesive layer, the bonding pressure is controlled to be 1.8 kg～2.2kgf, and control the pressure holding time to at least 2s.
  7. 根据权利要求2所述的陶瓷壳体的制备方法，其特征在于，在所述将所述玻纤板通过粘接层粘接于所述陶瓷坯体的内表面的步骤之后，所述陶瓷壳体的制备方法还包括如下步骤：The method for preparing a ceramic shell according to claim 2, wherein after the step of bonding the glass fiber board to the inner surface of the ceramic body through an adhesive layer, the ceramic shell The preparation method of the body also includes the following steps:
    烘烤通过粘接层粘接的所述陶瓷坯体和所述玻纤板，以固化所述粘接层；其中，烘烤温度为60℃～100℃，烘烤时间为8min～12min。The ceramic body and the glass fiber board bonded through the adhesive layer are baked to cure the adhesive layer; wherein the baking temperature is 60°C to 100°C, and the baking time is 8 minutes to 12 minutes.
  8. 根据权利要求1所述的陶瓷壳体的制备方法，其特征在于，所述获取陶瓷坯体，包括如下步骤：The method for preparing a ceramic shell according to claim 1, wherein said obtaining the ceramic body comprises the following steps:
    获取陶瓷原料粉末和粘结剂，将陶瓷原料粉末和粘结剂混合形成陶瓷浆料；Obtain ceramic raw material powder and binder, and mix the ceramic raw material powder and binder to form a ceramic slurry;
    将陶瓷浆料通过干压、流延、注塑成型等工艺制备得到陶瓷生坯；The ceramic slurry is prepared by dry pressing, casting, injection molding and other processes to obtain a ceramic green body;
    将陶瓷生坯经排胶、烧结和研磨制备得到陶瓷坯体。The ceramic green body is prepared by debinding, sintering and grinding.
  9. 根据权利要求1所述的陶瓷壳体的制备方法，其特征在于，所述玻纤板由多个玻璃纤维布热压而成。The method for preparing a ceramic shell according to claim 1, wherein the glass fiber board is formed by hot pressing a plurality of glass fiber cloths.
  10. 根据权利要求1至9中任意一项所述的陶瓷壳体的制备方法，其特征在于，所述陶瓷坯体包括主体部以及由所述主体部的边缘弯折延伸而出的侧边部，所述玻纤板包括本体以及与所述本体的边缘连接的弯折部，所述在所述陶瓷坯体的内表面所在一侧设置玻纤板的步骤中，使所述本体对应层叠设置于所述主体部，并使所述弯折部对应层叠设置于所述侧边部。The method for preparing a ceramic shell according to any one of claims 1 to 9, wherein the ceramic body comprises a main body and a side portion bent and extended from the edge of the main body, The glass fiber board includes a main body and a bending part connected to the edge of the main body. In the step of arranging the glass fiber board on the side of the inner surface of the ceramic body, the main body is laminated and arranged on The main body part and the bending part are correspondingly stacked on the side part.
  11. 根据权利要求10所述的陶瓷壳体的制备方法，其特征在于，在所述陶瓷坯体的内表面所在一侧设置玻纤板的步骤中，使所述弯折部远离所述本体的一侧端面与所述侧边部远离所述主体部的一侧端面平齐。The method of manufacturing a ceramic shell according to claim 10, wherein in the step of arranging a glass fiber board on the side of the inner surface of the ceramic body, the bending part is kept away from a part of the body. The side end surface is flush with the side end surface of the side portion away from the main body portion.
  12. 一种陶瓷壳体，包括：A ceramic shell, including:
    陶瓷坯体，包括相背设置的内表面和外表面；以及The ceramic body includes an inner surface and an outer surface arranged opposite to each other; and
    玻纤板，设置于所述陶瓷坯体的内表面，且所述玻纤板与所述陶瓷坯体层叠设置。The glass fiber board is arranged on the inner surface of the ceramic green body, and the glass fiber board and the ceramic green body are laminated and arranged.
  13. 根据权利要求12所述的陶瓷壳体，其特征在于，所述陶瓷壳体包括粘接层，所述粘接层设于所述陶瓷坯体的内表面与所述玻纤板之间。The ceramic casing according to claim 12, wherein the ceramic casing comprises an adhesive layer, and the adhesive layer is provided between the inner surface of the ceramic body and the glass fiber board.
  14. 根据权利要求13所述的陶瓷壳体，其特征在于，所述陶瓷坯体的厚度为0.2mm～0.3mm，所述玻纤板的厚度为0.1mm～0.3mm，所述粘接层的厚度为0.03mm～0.07mm。The ceramic casing according to claim 13, wherein the thickness of the ceramic body is 0.2 mm to 0.3 mm, the thickness of the glass fiber board is 0.1 mm to 0.3 mm, and the thickness of the adhesive layer It is 0.03mm～0.07mm.
  15. 根据权利要求12至14中任意一项所述的陶瓷壳体，其特征在于，所述陶瓷坯体包括主体部以及由所述主体部的边缘弯折延伸而出的侧边部，所述玻纤板层叠设置于所述主体部和所述侧边部。The ceramic casing according to any one of claims 12 to 14, wherein the ceramic body comprises a main body and a side portion bent and extended from the edge of the main body, and the glass The fiberboard is stacked on the main body part and the side edge part.
  16. 根据权利要求15所述的陶瓷壳体，其特征在于，所述侧边部与所述主体部围合形成收容槽，所述玻纤板收容于所述收容槽内。15. The ceramic casing of claim 15, wherein the side portion and the main body are enclosed to form a receiving groove, and the fiberglass board is received in the receiving groove.
  17. 根据权利要求15所述的陶瓷壳体，其特征在于，所述玻纤板包括本体以及与所述本体的边缘连接的弯折部，所述本体层叠于所述主体部，所述弯折部层叠于所述侧边部；所述弯折部远离所述本体的一侧端面与所述侧边部远离所述主体部的一侧端面平齐。The ceramic casing according to claim 15, wherein the glass fiber board comprises a main body and a bending part connected to an edge of the main body, the main body is laminated on the main body part, and the bending part Laminated on the side part; the end surface of the bent part away from the main body is flush with the end surface of the side part away from the main body.
  18. 一种电子设备，包括权利要求12至17中任意一项所述的陶瓷壳体。An electronic device, comprising the ceramic casing according to any one of claims 12 to 17.
  19. 根据权利要求18所述的电子设备，其特征在于，所述电子设备的中框为所述陶瓷壳体。The electronic device according to claim 18, wherein the middle frame of the electronic device is the ceramic casing.
  20. 根据权利要求18所述的电子设备，其特征在于，所述电子设备的后盖为所述陶瓷壳体。The electronic device according to claim 18, wherein the back cover of the electronic device is the ceramic casing.
PCT/CN2020/095317 2019-07-23 2020-06-10 Preparation method for ceramic shell, ceramic shell and electronic device WO2021012827A1 (en)

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Publication number Priority date Publication date Assignee Title
CN117201647A (en) * 2022-05-30 2023-12-08 荣耀终端有限公司 5D ceramic shell structure and 5D ceramic processing technique
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389268A (en) * 1980-08-06 1983-06-21 Tokyo Shibaura Denki Kabushiki Kaisha Production of laminate for receiving chemical plating
JPH0369355A (en) * 1989-08-10 1991-03-25 Jiyanisu Kogyo Kk Sheet-shaped material forming intermediate layer of ceramic decorative panel and manufacture thereof
CN105308144A (en) * 2013-01-29 2016-02-03 赢创德固赛有限公司 Fibre-composite-hybrid components
CN106079688A (en) * 2016-06-02 2016-11-09 廊坊市高瓷新材料科技有限公司 Reinforced structure and its preparation method
CN205767810U (en) * 2016-06-02 2016-12-07 廊坊市高瓷新材料科技有限公司 reinforced structure
CN106986631A (en) * 2017-04-01 2017-07-28 广东百工新材料科技有限公司 A kind of ceramic mobile phone shell and preparation method thereof
CN108437574A (en) * 2018-04-27 2018-08-24 广东新秀新材料股份有限公司 Shock resistance case material, preparation method, the preparation method of digital product shell and digital product shell

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108099324B (en) * 2017-12-29 2020-11-24 新奥石墨烯技术有限公司 Mobile terminal backboard, preparation method thereof and mobile terminal

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389268A (en) * 1980-08-06 1983-06-21 Tokyo Shibaura Denki Kabushiki Kaisha Production of laminate for receiving chemical plating
JPH0369355A (en) * 1989-08-10 1991-03-25 Jiyanisu Kogyo Kk Sheet-shaped material forming intermediate layer of ceramic decorative panel and manufacture thereof
CN105308144A (en) * 2013-01-29 2016-02-03 赢创德固赛有限公司 Fibre-composite-hybrid components
CN106079688A (en) * 2016-06-02 2016-11-09 廊坊市高瓷新材料科技有限公司 Reinforced structure and its preparation method
CN205767810U (en) * 2016-06-02 2016-12-07 廊坊市高瓷新材料科技有限公司 reinforced structure
CN106986631A (en) * 2017-04-01 2017-07-28 广东百工新材料科技有限公司 A kind of ceramic mobile phone shell and preparation method thereof
CN108437574A (en) * 2018-04-27 2018-08-24 广东新秀新材料股份有限公司 Shock resistance case material, preparation method, the preparation method of digital product shell and digital product shell

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