CN112297544A - Preparation method of ceramic shell, ceramic shell and electronic equipment - Google Patents

Preparation method of ceramic shell, ceramic shell and electronic equipment Download PDF

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Publication number
CN112297544A
CN112297544A CN201910666071.8A CN201910666071A CN112297544A CN 112297544 A CN112297544 A CN 112297544A CN 201910666071 A CN201910666071 A CN 201910666071A CN 112297544 A CN112297544 A CN 112297544A
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CN
China
Prior art keywords
ceramic
glass fiber
thickness
ceramic shell
ceramic blank
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Pending
Application number
CN201910666071.8A
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Chinese (zh)
Inventor
李�杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201910666071.8A priority Critical patent/CN112297544A/en
Priority to PCT/CN2020/095317 priority patent/WO2021012827A1/en
Publication of CN112297544A publication Critical patent/CN112297544A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The application relates to a preparation method of a ceramic shell, the ceramic shell and electronic equipment, wherein the preparation method of the ceramic shell comprises the following steps: obtaining a ceramic body; and laminating glass fiber plates on one side of the inner surface of the ceramic blank. The ceramic shell body manufacturing method, the ceramic shell body and the electronic device provided by the embodiment of the application have the advantages that the glass fiber plate can also realize higher tensile strength on the premise of keeping the thickness to be thin enough, so that the glass fiber plate is arranged on the inner surface of the ceramic blank body in a laminated mode, the glass fiber plate can support the ceramic blank body, the arrangement of the glass fiber plate makes up the defect that the thickness of the ceramic blank body is thinner than that of the traditional ceramic blank body and the structural strength is not enough, the ceramic blank body can be made thinner, the weight of the ceramic blank body with the thinner thickness is smaller, and therefore the weight of the ceramic shell body formed by combining the ceramic blank body and the glass fiber plate is also relatively reduced.

Description

Preparation method of ceramic shell, ceramic shell and electronic equipment
Technical Field
The present disclosure relates to the field of electronic devices, and particularly, to a method for manufacturing a ceramic housing, and an electronic device.
Background
In the related art, the structures of the middle frame, the rear cover and the like occupying a large part of the area of the outer surface of the electronic equipment such as a mobile phone, a tablet computer and the like are metal shells, and signals are difficult to pass through the electronic equipment due to the electromagnetic shielding effect of the metal shells. At present, the ceramic shell can reduce the electromagnetic shielding effect caused by the metal shell and meet the pursuit of consumers for the overall appearance texture of electronic equipment such as mobile phones, tablet computers and the like.
However, the ceramic shell is easily damaged when colliding with other objects due to its brittleness, and in order to reduce the damage of the ceramic shell, the ceramic shell is generally thick, and the thick ceramic shell has a large weight, which is not convenient for carrying the electronic device and developing the electronic device to be light and thin.
Disclosure of Invention
The embodiment of the application provides a preparation method of a ceramic shell, the ceramic shell and electronic equipment comprising the ceramic shell, aiming at solving the problems of thicker thickness and larger weight of the ceramic shell.
In one aspect, the present application provides a method for preparing a ceramic shell, comprising the steps of:
obtaining a ceramic body, wherein the ceramic body comprises an inner surface and an outer surface which are arranged oppositely; and
and glass fiber plates are stacked on one side of the inner surface of the ceramic blank.
In one embodiment, the step of stacking and arranging the glass fiber plates on the side of the inner surface of the ceramic blank specifically includes:
and adhering the glass fiber board to the inner surface of the ceramic blank through an adhesive layer.
In one embodiment, the step of bonding the glass fiber board to the inner surface of the ceramic blank through an adhesive layer is specifically as follows:
the glass fiber board with the thickness of 0.1 mm-0.3 mm is adhered to the inner surface of the ceramic blank with the thickness of 0.2 mm-0.3 mm through the adhesive layer with the thickness of 0.03 mm-0.07 mm.
In one embodiment, after the step of bonding the glass fiber board to the inner surface of the ceramic blank by the bonding layer, the method for manufacturing the ceramic shell further comprises the following steps:
baking the ceramic blank and the glass fiber board which are bonded through the bonding layer to solidify the bonding layer; wherein the baking temperature is 60-100 ℃, and the baking time is 8-12 min.
In one embodiment, the ceramic blank includes a main body portion and a side portion extending from an edge of the main body portion, and in the step of disposing the glass fiber plate on one side of the inner surface of the ceramic blank, the glass fiber plate is laminated on the main body portion and the side portion.
In another aspect, the present application provides a ceramic shell comprising:
the ceramic body comprises an inner surface and an outer surface which are arranged oppositely; and
and the glass fiber plate is arranged on the inner surface of the ceramic blank in a laminated manner.
In one embodiment, the ceramic shell comprises a bonding layer, and the bonding layer is arranged between the inner surface of the ceramic blank and the glass fiber board.
In one embodiment, the thickness of the ceramic blank is 0.2-0.3 mm, the thickness of the glass fiber plate is 0.1-0.3 mm, and the thickness of the bonding layer is 0.03-0.07 mm.
In one embodiment, the ceramic body comprises a main body part and side edge parts bent and extended from the edges of the main body part, and the glass fiber plates are arranged on the main body part and the side edge parts in a laminated manner.
In yet another aspect, the present application provides an electronic device including the ceramic case described above.
The utility model provides a ceramic housing's preparation method, ceramic housing and electronic equipment, because the glass fiber board can also realize higher tensile strength under the prerequisite that keeps thickness enough frivolous, so with glass fiber board range upon range of setting in ceramic body's internal surface, glass fiber board can play the supporting role to ceramic body, the setting of glass fiber board has compensatied the ceramic body thickness of this application relatively tradition ceramic body thickness thinner and make the defect that structural strength is not enough, the ceramic body of this application can be done thinner, the ceramic body's that thickness is thinner weight is littleer, thereby the ceramic housing's that ceramic body and the combination of glass fiber board formed weight also reduces relatively.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a ceramic case according to an embodiment;
FIG. 3 is a schematic flow chart illustrating steps of a method for manufacturing a ceramic shell according to an exemplary embodiment;
fig. 4 is a schematic flow chart illustrating steps of a method for manufacturing a ceramic case according to an embodiment.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Referring to fig. 1, in an embodiment, an electronic device 10 is described by taking a mobile phone as an example, and the electronic device 10 includes a housing 100 and a display 300. The housing 100 is connected to the display screen 300 and encloses a receiving space for receiving electronic components of the electronic device 10, such as a circuit board, a memory, a battery, a camera module, a fingerprint module, and the like. It is understood that in other embodiments, the electronic device 10 may also be a tablet computer, a wearable device, etc., and is not limited thereto.
In one embodiment, the housing 100 may be provided with a functional hole structure for assembling components for implementing specific functions, or for providing a detachable connection between peripheral components for implementing specific components and the electronic device 10, or for providing a channel for inputting and outputting signals such as sound. For example, the functional hole may be used to install a volume control key to implement functions such as adjusting the volume playing size of audio information of the electronic device 10, or to install a SIM card, or to install a power key, or to install a channel for input and output of an external data cable connector, or to install a channel for input and output of an external headphone cable connector, or to install a channel for lighting of a camera of the electronic device 10. It should be noted that, the specific operation steps, parameters, etc. for machining by the numerically controlled lathe can be flexibly selected by those skilled in the art according to the actual situation.
In some embodiments, the Display screen 300 may employ an LCD (Liquid Crystal Display) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor) screen or an IPS (In-Plane Switching) screen or an SLCD (split Liquid Crystal Display) screen. In other embodiments, the display panel 300 may adopt an OLED (Organic Light-Emitting display) panel for displaying information, and the OLED panel may be an AMOLED (Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light-Emitting Diode) screen, which will not be described herein again.
In one embodiment, the housing 100 is a ceramic housing 1000, and the ceramic housing 1000 not only can reduce the electromagnetic shielding effect caused by the conventional metal housing, but also can satisfy the pursuit of the consumer for the overall appearance and texture of the hand electronic device 10. In other embodiments, some of the structures of the housing 100 are made of ceramic materials, while other structures are made of other materials (such as, but not limited to, metals), for example, in one embodiment, the housing 100 includes a middle frame and a rear cover, and the middle frame may be a ceramic middle frame or the rear cover may be a ceramic rear cover.
In one embodiment, referring to fig. 2, a ceramic housing 1000 includes a ceramic body 110 and a glass fiber plate 120. The ceramic body 110 includes an inner surface 111 and an outer surface 112 opposite to each other, and the glass fiber sheet 120 is stacked on the inner surface 111 of the ceramic body 110. The ceramic green body 110 may be prepared by de-gumming, sintering and grinding a ceramic green body, the ceramic green body may be prepared by dry pressing, tape casting, injection molding and other processes from a ceramic slurry, the ceramic slurry may be prepared by mixing a ceramic raw material powder and a binder, and the ceramic raw material powder may be one or more selected from alumina powder, zirconia powder and zirconium nitride powder. The binder may be one or more selected from paraffin, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyformaldehyde. The glass fiber plate 120 may be formed by hot pressing a plurality of glass fiber cloths, and the obtained glass fiber plate 120 has a high tensile strength on the premise of a small thickness.
In the traditional ceramic shell, a metal plate or an alloy plate is attached to the inner surface of a ceramic blank, and the metal plate and the alloy plate have an electromagnetic shielding effect, so that signal transmission between the inside of electronic equipment and the outside is not facilitated. Or, the plastic material is molded to the inner surface of the ceramic blank to form the plastic layer to be bonded with the inner surface of the ceramic blank, and the molded plastic layer has the same area as the inner surface of the ceramic blank and a larger molding area, so that complete molding can be ensured only when the thickness of the molded plastic layer is at least 0.5mm, and the overall thickness of the ceramic shell obtained by compounding the plastic layer and the ceramic blank is increased.
In the ceramic shell 1000 of the present application, because the glass fiber plate 120 can also realize higher tensile strength on the premise of keeping the thickness to be thin enough, the glass fiber plate 120 is stacked on the inner surface 111 of the ceramic blank 110, the glass fiber plate 120 can support the ceramic blank 110, and the arrangement of the glass fiber plate 120 makes up for the defect that the thickness of the ceramic blank 110 is thinner than that of the conventional ceramic blank, which makes the structural strength insufficient, the ceramic blank 110 of the present application can be thinner, the weight of the ceramic blank 110 with thinner thickness is smaller, so that the weight of the ceramic shell 1000 formed by combining the ceramic blank 110 and the glass fiber plate 120 is also relatively reduced.
In an embodiment, as shown in fig. 2, taking the ceramic case 1000 as an example of a ceramic rear cover, the ceramic blank 110 includes a main body portion 110a and a side portion 110b bent and extended from an edge of the main body portion 110a, the main body portion 110a and the side portion 110b form a receiving slot 1101, the receiving slot 1101 is used for receiving electronic components of the electronic device 10, and the glass fiber plates 120 are stacked on the main body portion 110a and the side portion 110 b. It is understood that the glass fiber panel 120 includes a body 120a and a bent portion 120b connected to an edge of the body 120a, the body 120a is stacked on the body portion 110a, and the bent portion 120b is stacked on the side portion 110 b. Thus, the glass fiber plate 120 can provide strength support for the main body portion 110a of the ceramic case 1000 and also for the side edge portion 110b of the ceramic case 1000, and the capability of the ceramic case 1000 to resist front and side impacts can be improved, so that the ceramic case 1000 does not have corner cracking or chipping. In other embodiments, the ceramic body 110 and the glass fiber sheet 120 may be one flat sheet.
In an embodiment, as shown in fig. 2, the ceramic casing 1000 includes the adhesive layer 130, and the adhesive layer 130 is disposed between the inner surface 111 of the ceramic blank 110 and the glass fiber plate 120, that is, the glass fiber plate 120 is adhered to the inner surface 111 of the ceramic blank 110 through the adhesive layer 130, so as to enhance the composite strength of the ceramic blank 110 and the glass fiber plate 120. The adhesive layer 130 is formed by depositing an adhesive, which may be an acrylate adhesive such as an a-cyanoacrylate adhesive, an anaerobic adhesive, an acrylic structural adhesive, an ethyl acrylate adhesive, an epoxy acrylate adhesive, or a hot-melt adhesive tape, a colloidal particle, a colloidal powder, an EVA hot-melt adhesive, a rubber hot-melt adhesive, a polypropylene hot-melt adhesive, a polyester hot-melt adhesive, a polyamide hot-melt adhesive, a styrene hot-melt adhesive, a novel hot-melt adhesive, a polyethylene and ethylene copolymer hot-melt adhesive. In other embodiments, the adhesive may also be solid polymer adhesive, solution polymer adhesive, emulsion polymer adhesive, monomer polymer adhesive, and the like, and the material of the adhesive is not limited herein.
In one embodiment, the thickness of the ceramic body 110 is 0.2mm to 0.3mm, the thickness of the glass fiber plate 120 is 0.1mm to 0.3mm, and the thickness of the adhesive layer 130 is 0.03mm to 0.07 mm. In one embodiment, the thickness of the ceramic body 110 is 0.25mm, the thickness of the glass fiber plate 120 is 0.2mm, and the thickness of the adhesive layer 130 is 0.05mm, that is, the thickness of the finally obtained ceramic shell 1000 is 0.5mm, and after multiple measurements, the weight of the ceramic shell 1000 with the thickness of 0.5mm is approximately 23.02g to 23.1g, and the roller drop test is approximately maintained at 85 circles to 90 circles. And the weight of the traditional ceramic shell (pure ceramic) with the thickness of 0.45mm is approximately 31.87 g-31.94 g, and the roller drop test is approximately kept at 85-90 circles. Therefore, on the premise that the ceramic shell 1000 of the present application has substantially the same or close thickness as the conventional ceramic shell, the ceramic shell 1000 of the present application has the same structural strength as the conventional ceramic shell and has a smaller weight.
In another aspect of the present application, a method for manufacturing a ceramic housing 10 is also provided, please refer to fig. 3 and 4, which includes the following steps:
step S102, a ceramic body 110 is obtained. The ceramic body 110 includes an inner surface 111 and an outer surface 112 that are oppositely disposed. In one embodiment, the ceramic green body 110 may be prepared by de-gumming, sintering and grinding a ceramic green body, and the ceramic green body may be prepared by dry pressing, tape casting, injection molding and the like from a ceramic slurry, and the ceramic slurry may be prepared by mixing a ceramic raw material powder and a binder, and the ceramic raw material powder may be one or more selected from alumina powder, zirconia powder and zirconium nitride powder. The binder may be one or more selected from paraffin, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyformaldehyde.
In step S104, the glass fiber plates 120 are stacked on the inner surface 111 side of the ceramic body 110. The glass fiber plate 120 may be formed by hot pressing a plurality of glass fiber cloths, and the obtained glass fiber plate 120 has a high tensile strength on the premise of a small thickness.
In an embodiment, the step of stacking the glass fiber plates 120 on the side where the inner surface 111 of the ceramic blank 110 is located includes: the glass fiber sheet 120 is bonded to the inner surface 111 of the ceramic body 110 by the bonding layer 130. For example, the glass fiber sheet 120 having a thickness of 0.1mm to 0.3mm may be adhered to the inner surface 111 of the ceramic body 110 having a thickness of 0.2mm to 0.3mm through the adhesive layer 130 having a thickness of 0.03mm to 0.07 mm.
In one embodiment, the stacking of the glass fiber plates 120 on the side of the inner surface 111 of the ceramic body 110 comprises the following steps:
step S104 a: the adhesive glue is sprayed on the inner surface 111 of the ceramic body 110. For example, the ceramic body 110 may be fixed by a jig so that the inner surface 111 of the ceramic body 110 faces upward relative to the outer surface 112, and then the adhesive is uniformly sprayed on the inner surface 111 of the ceramic body 110 by a spray gun to form the adhesive layer 130.
In step S104b, the glass fiber sheet 120 is bonded to the adhesive layer 130. It is understood that in other embodiments, the glass fiber plate 120 may be fixed by a jig, the adhesive is uniformly sprayed on one surface of the glass fiber plate 120 by a spray gun to form the adhesive layer 130, and then the ceramic blank 110 is adhered to the adhesive layer 130. Wherein, the viscosity of the bonding glue can be controlled between 500cc and 800cc, and the air pressure of the spray gun is between 0.6MPa and 0.8 MPa.
In one embodiment, when the glass fiber plate 120 is bonded to the inner surface 111 of the ceramic body 110 through the bonding layer 130, the bonding pressure is controlled to be 1.8kgf to 2.2kgf, for example, the bonding pressure is controlled to be 2kgf, and the pressure is maintained for at least 2s, wherein the purpose of maintaining the pressure is to sufficiently bond and fix the glass fiber plate 120 to the ceramic body 110 through the bonding layer 130, and after the pressure maintaining is finished, the flash at the joint of the ceramic body 110 and the glass fiber plate 120 is cleaned.
It should be noted that the adhesive layer 130 is formed by depositing an adhesive, and the adhesive may be an acrylate adhesive such as an a-cyanoacrylate adhesive, an anaerobic adhesive, an acrylic structural adhesive, an ethyl acrylate adhesive, and an epoxy acrylate adhesive, or a hot-melt adhesive such as a hot-melt adhesive tape, a colloidal particle, a glue powder, an EVA hot-melt adhesive, a rubber hot-melt adhesive, a polypropylene, a polyester, a polyamide, a polyurethane hot-melt adhesive, a styrene hot-melt adhesive, a novel hot-melt adhesive, a polyethylene and ethylene copolymer hot-melt adhesive. In other embodiments, the adhesive may also be solid polymer adhesive, solution polymer adhesive, emulsion polymer adhesive, monomer polymer adhesive, and the like, and the material of the adhesive is not limited herein.
In an embodiment, the ceramic blank 110 includes a main body 110a and a side portion 120b extending from an edge of the main body 110a, and in the step of disposing the glass fiber sheet 120 on the side of the inner surface 111 of the ceramic blank 110, the glass fiber sheet 120 is stacked on the main body 110a and the side portion 120 b. Thus, the glass fiber plate 120 can provide strength support for the main body portion 110a of the ceramic case 1000 and also for the side edge portion 110b of the ceramic case 1000, and the capability of the ceramic case 1000 to resist front and side impacts can be improved, so that the ceramic case 1000 does not have corner cracking or chipping.
Step S106, baking the ceramic body 110 and the glass fiber plate 120 bonded by the bonding layer 130 to cure the bonding layer 130. Wherein the baking temperature is 60-100 ℃, and the baking time is 8-12 min. In one embodiment, the baking temperature is controlled to be 80 ℃ and the baking time is 10 min.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The preparation method of the ceramic shell is characterized by comprising the following steps of:
obtaining a ceramic body, wherein the ceramic body comprises an inner surface and an outer surface which are arranged oppositely; and
and glass fiber plates are stacked on one side of the inner surface of the ceramic blank.
2. The method for preparing the ceramic shell according to claim 1, wherein the step of laminating a glass fiber plate on the side of the inner surface of the ceramic body comprises:
and adhering the glass fiber board to the inner surface of the ceramic blank through an adhesive layer.
3. The method for preparing the ceramic shell according to claim 2, wherein the step of bonding the glass fiber plate to the inner surface of the ceramic blank through the bonding layer comprises:
the glass fiber board with the thickness of 0.1 mm-0.3 mm is adhered to the inner surface of the ceramic blank with the thickness of 0.2 mm-0.3 mm through the adhesive layer with the thickness of 0.03 mm-0.07 mm.
4. The method of manufacturing a ceramic case according to claim 2, wherein after the step of bonding the glass fiber sheet to the inner surface of the ceramic body by an adhesive layer, the method further comprises the steps of:
baking the ceramic blank and the glass fiber board which are bonded through the bonding layer to solidify the bonding layer; wherein the baking temperature is 60-100 ℃, and the baking time is 8-12 min.
5. The method according to any one of claims 1 to 4, wherein the ceramic body includes a main body portion and side portions extending from edges of the main body portion, and the step of providing the glass fiber sheet on the inner surface side of the ceramic body includes laminating the glass fiber sheet on the main body portion and the side portions.
6. A ceramic shell, comprising:
the ceramic body comprises an inner surface and an outer surface which are arranged oppositely; and
and the glass fiber plate is arranged on the inner surface of the ceramic blank in a laminated manner.
7. The ceramic shell of claim 6, comprising a bonding layer disposed between an inner surface of the ceramic body and the glass fiber sheet.
8. The ceramic shell according to claim 7, wherein the ceramic blank has a thickness of 0.2mm to 0.3mm, the glass fiber plate has a thickness of 0.1mm to 0.3mm, and the adhesive layer has a thickness of 0.03mm to 0.07 mm.
9. The ceramic shell according to any one of claims 6 to 8, wherein the ceramic blank includes a main body portion and side portions extending from edges of the main body portion by bending, and the glass fiber plates are stacked on the main body portion and the side portions.
10. An electronic device characterized by comprising the ceramic case according to any one of claims 6 to 9.
CN201910666071.8A 2019-07-23 2019-07-23 Preparation method of ceramic shell, ceramic shell and electronic equipment Pending CN112297544A (en)

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