WO2021001962A1 - Component mounter - Google Patents
Component mounter Download PDFInfo
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- WO2021001962A1 WO2021001962A1 PCT/JP2019/026460 JP2019026460W WO2021001962A1 WO 2021001962 A1 WO2021001962 A1 WO 2021001962A1 JP 2019026460 W JP2019026460 W JP 2019026460W WO 2021001962 A1 WO2021001962 A1 WO 2021001962A1
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- mounting
- cycle
- component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Definitions
- the present invention relates to a component mounting machine.
- the parts mounting machine executes a mounting process for mounting parts on the board.
- a PP cycle pick and place cycle
- a collecting operation for collecting parts and a mounting operation for mounting parts on a substrate is repeatedly executed.
- the component mounting machine skips the component mounting operation related to the sampling error.
- the component mounting machine executes a recovery process for retrying mounting at the previously skipped mounting position in, for example, the next and subsequent PP cycles (see Patent Document 1).
- the mounting position and mounting order in a plurality of PP cycles are preset so as to improve the efficiency and accuracy of the mounting process, for example. Therefore, the timing of executing the recovery process is particularly important because it affects the efficiency of the mounting process and the like.
- various aspects may be applied to the mounting process in order to cope with the production of various substrate products. For example, when the same PP cycle includes the mounting operation of the same type of parts, if any of the mounting operations is skipped, it may affect the subsequent mounting operation of the same type of parts. ..
- An object of the present specification is to provide a component mounting machine capable of improving the efficiency of production of a substrate product by immediately executing the recovery process in an executing PP cycle in which the recovery process is required. To do.
- a plurality of holding members for holding the collected parts, a state recognition unit for executing a process of recognizing the holding state of the parts held by each of the plurality of holding members, a mounting position of the parts, and A control program indicating the mounting order and a control device that repeatedly executes a pick-and-place cycle (hereinafter, “PP cycle”) including a picking operation and a mounting operation of the parts based on the result of the recognition process are provided.
- the plurality of holding members are assigned the picking operation and the mounting operation of the same type of the parts in at least one of the PP cycles executed over a plurality of times, and the control device receives the control device.
- the mounting operation is set as the skip operation and in the same PP cycle as the skip operation.
- a component mounting machine that executes a change process for changing the mounting position of the mounting operation assigned to one of the other holding members that have collected the same type of component to the mounting position of the skip operation.
- the mounting position change processing is executed in the executing PP cycle in which some mounting operations become infeasible and recovery processing is required.
- the recovery process is immediately executed before the next and subsequent PP cycles are executed. Therefore, in a predetermined PP cycle in which a plurality of parts of the same type are mounted, priority is given to mounting the skip operation at the mounting position. In the production of a type of substrate product in which the mounting order for a plurality of mounting positions is affected by the required time, the efficiency of the production can be improved.
- FIG. 1 It is a schematic diagram which shows the structure of the component mounting machine in an embodiment. It is a schematic view which looked at the mounting head which holds a plurality of suction nozzles in an annular shape from above. It is a schematic view which looked at the mounting head which holds a plurality of suction nozzles in a straight line from above. It is a schematic view which looked at the mounting head which holds a plurality of suction nozzles in a matrix form from above. It is a top view which shows the substrate in FIG. 1 enlarged. It is a flowchart which shows the mounting process by a component mounting machine 1. It is explanatory drawing which shows the relationship between the mounting position and the holding member used before and after the execution of the first change process.
- the component mounting machine constitutes a production line for producing board products together with a plurality of types of board-to-board working machines including, for example, other component mounting machines.
- the board-to-board working machine that constitutes the above production line includes a printing machine, an inspection device, a reflow furnace, and the like. Further, the configuration of the production line can be appropriately added or changed according to, for example, the type of substrate product to be produced.
- the production line includes a buffer device, a board supply device, a board reversing device, various inspection devices, a shield mounting device, a mold forming device, an adhesive coating device, and an ultraviolet irradiation device that temporarily hold the transferred board.
- An anti-board working machine such as an apparatus can be appropriately installed.
- the component mounting machine 1 executes a mounting process for mounting components on the substrate 90.
- the component mounting machine 1 includes a board transfer device 10, a component supply device 20, a component transfer device 30, a component camera 41, a board camera 42, and a control device 50.
- the substrate transfer device 10 is composed of a belt conveyor, a positioning device, and the like. The substrate transfer device 10 sequentially conveys the substrate 90 in the transfer direction, and positions the substrate 90 at a predetermined position in the machine.
- the board transfer device 10 carries the board 90 out of the component mounting machine 1 after the mounting process is completed.
- the component supply device 20 supplies components to be mounted on the substrate 90.
- the component supply device 20 includes feeders 22 set in a plurality of slots 21.
- the feeder 22 feeds and moves a carrier tape containing a large number of parts so that the parts can be collected.
- the parts supply device 20 supplies, for example, relatively large parts in a state of being arranged on a tray 25 placed on the pallet 24.
- the storage device 23 of the parts supply device 20 stores a plurality of pallets 24, and pulls out a predetermined pallet 24 according to the mounting process to supply the parts.
- the parts transfer device 30 transfers the parts supplied by the parts supply device 20 to a predetermined mounting position on the board 90 carried into the machine by the board transfer device 10.
- the head drive device 31 of the component transfer device 30 moves the moving table 32 in the horizontal direction (X direction and Y direction) by a linear motion mechanism.
- the mounting head 33 is interchangeably fixed to the moving table 32 by a clamp member (not shown).
- the mounting head 33 rotatably and vertically supports a plurality of suction nozzles 34.
- the suction nozzle 34 is a holding member that holds the collected parts.
- the suction nozzle 34 sucks the parts supplied by the feeder 22 by the supplied negative pressure air.
- a chuck or the like that holds the component by gripping it can be adopted.
- various types can be adopted for the mounting head 33, for example, as shown in FIGS. 2A-2C.
- the mounting head 33 of FIG. 2A has a rotary head 35 rotatably provided around an R axis parallel to the vertical axis (Z axis).
- a plurality of holding members are arranged on the rotary head 35 at equal intervals in the circumferential direction.
- the mounting head 33 holds a plurality of suction nozzles 34 in a straight line or an annular shape, and rotates the rotary head 35 to determine the suction nozzles 34 to one or more elevating positions. Then, the mounting head 33 raises and lowers the suction nozzle 34 by driving the lifting device 36.
- a plurality of holding members are arranged linearly or in a matrix at predetermined positions. The mounting head 33 raises and lowers the suction nozzle 34 by driving an elevating device 36 that can be driven independently.
- the component camera 41 and the substrate camera 42 are digital image pickup devices having an image pickup element such as CMOS.
- the component camera 41 and the substrate camera 42 take an image based on the control signal and send out the image data acquired by the image pickup.
- the component camera 41 is configured to be able to image a component held by the suction nozzle 34 of the mounting head 33 from below.
- the substrate camera 42 is configured so that the substrate 90 can be imaged from above.
- the control device 50 is mainly composed of a CPU, various memories, and a control circuit.
- the control device 50 controls the mounting process of mounting the components on the substrate 90.
- the control device 50 includes a storage device 51.
- the storage device 51 is composed of an optical drive device such as a hard disk device, a flash memory, or the like.
- the storage device 51 stores various data such as a control program Rc used for controlling the mounting process.
- the control program Rc indicates the mounting position and mounting order of the components mounted on the substrate 90 in the mounting process.
- the mounting process includes a collecting operation of collecting the parts supplied by the component supply device 20 by the plurality of suction nozzles 34 and a mounting operation of mounting the collected parts at a predetermined mounting position on the substrate 90.
- a process of repeating a pick-and-place cycle (hereinafter referred to as a “PP cycle”) a plurality of times is included.
- the control device 50 controls the operation of the component transfer device 30 based on the information output from various sensors, the result of image processing, the control program Rc, and the like in the mounting process. As a result, the positions and angles of the plurality of suction nozzles 34 supported by the mounting head 33 are controlled.
- the control device 50 includes a state recognition unit 52.
- the state recognition unit 52 executes a process of recognizing the holding state of the parts held by each of the plurality of holding members (suction nozzles 34). Specifically, the state recognition unit 52 performs image processing on the image data acquired by the imaging of the component camera 41 after the collection operation in the PP cycle and before the mounting operation, and refers to the reference position of the mounting head 33. Recognize the position and angle of each part. In addition to the component camera 41, the state recognition unit 52 captures image data acquired by, for example, a head camera unit integrally provided with the mounting head 33, capturing the components from the side, the lower side, or the upper side. It may be processed.
- the state recognition unit 52 it is possible to determine not only the position and angle of the component with respect to the reference position of the mounting head 33, but also whether or not the component has been normally sampled by the sampling operation. For example, in the control device 50, when a predetermined suction nozzle 34 among a plurality of suction nozzles 34 cannot collect a part (when the part cannot be recognized) or when the collected part is not normal (a part of the part). It is determined that the mounting operation assigned to the predetermined suction nozzle 34 in this PP cycle cannot be performed due to a defect, deformation, or a state in which the part is turned inside out).
- the control device 50 includes a recovery control unit 53.
- the recovery control unit 53 appropriately executes the recovery process corresponding to the error so that the mounting process can be continued.
- the infeasible mounting operation is tried again between the current PP cycle and the next PP cycle, or the mounting operation in which all PP cycles are completed or becomes infeasible.
- the number reaches a predetermined number, it is conceivable to aggregate and try again.
- a mounting process for mounting a plurality of parts of the same type on one board may be executed.
- the mounting process as described above includes, for example, mounting the same type of parts on each of a plurality of unit boards in the multi-chamfered board described later, mounting LED parts and the like side by side in a straight line or a curved line, and the like. Is done.
- the plurality of suction nozzles 34 are assigned the same type of component collecting operation and mounting operation in at least one PP cycle among the PP cycles executed a plurality of times.
- an embodiment of recovery processing applicable when a collection error occurs in a PP cycle in which a plurality of parts having the same part type as described above are tried to be mounted is illustrated.
- the PP cycle to which the above recovery process is applied may include two or more mounting operations of the same type of parts, and may partially include mounting operations of different types of parts.
- a collection error occurs, for example, the collected parts are not normal, countermeasures corresponding to the collection error such as disposal of the parts can be appropriately taken.
- the recovery control unit 53 determines that the mounting operation assigned to the predetermined suction nozzle 34 is infeasible based on the result of the recognition process, the mounting operation is skipped. Further, the recovery control unit 53 sets the mounting position of the mounting operation assigned to one of the other suction nozzles 34 for collecting the same type of parts by the sampling operation in the same PP cycle as the skip operation to the mounting position of the skip operation. Execute the change process to be changed.
- the recovery control unit 53 conventionally tries the mounting operation again in another PP cycle for the skip operation, but utilizes the fact that the PP cycle in which the collection error occurs includes the collection operation of the same type of parts. Execute the recovery process. That is, the recovery control unit 53 gives priority to the mounting operation at a predetermined mounting position among the mounting positions in the current PP cycle in which the collection error has occurred.
- the priority mounting position can be arbitrarily set. For example, the earlier the mounting order specified by the control program Rc, the higher the priority may be set.
- the recovery control unit 53 executes the above-mentioned change processing of the mounting position
- the recovery control unit 53 executes the complementary processing in order to perform the mounting operation for the changed mounting position.
- the complement processing may employ, for example, changing the mounting position of the PP cycle from the next time onward, or executing an additional supplement PP cycle at an appropriate timing. Details of the change process and the complement process in the recovery process will be described in the mounting process by the component mounting machine 1.
- the substrate 90 in the present embodiment is a multi-chamfered substrate composed of a plurality of unit substrates 91 (in this embodiment, 30 unit substrates 91). May be good.
- the substrate 90 which is a multi-chamfered substrate, is mounted with various components 81 by executing a PP cycle for each of a plurality of unit substrates 91, and is subsequently divided into individual substrate products.
- the mounting process includes at least one PP cycle in which a plurality of components 81 of the same type are mounted over a plurality of unit substrates 91.
- the substrate 90 has an identification code 92 and two reference marks 93.
- the identification code 92 indicates an identification code (ID) unique to the substrate 90.
- ID an identification code
- the identification code 92 a bar code, a two-dimensional code, or the like can be applied.
- the identification code 92 employs a barcode configured by arranging a plurality of bars having different line widths and intervals between the lines in parallel.
- the control device 50 reads the ID of the substrate 90 based on the image data acquired by photographing the identification code 92 with the substrate camera 42.
- the control device 50 determines, for example, the type of the substrate 90, the type of the substrate product to be produced, the type of the mounting process to be executed, and the like, based on the data in which the ID of the substrate 90 and various information are associated in advance. Further, the identification code 92 may include information indicating the type of the substrate product produced.
- Each of the two reference marks 93 indicates a reference position of the substrate 90. The control device 50 recognizes the reference mark 93 based on the image data obtained by photographing the reference mark 93 with the substrate camera 42. Then, the control device 50 recognizes the reference position of the substrate 90 positioned by the substrate transfer device 10 based on the position of the recognized reference mark 93.
- one PP cycle means from the start of a series of collecting operations by at least two or more of the plurality of suction nozzles 34 to the end of the series of mounting operations. It shall be an operation.
- the above-mentioned "mounting actual condition” includes, for example, trying to mount as many parts as the number of parts supplied on the current tray 25 on one substrate 90 which is a multi-chamfered substrate. Specifically, for example, when 21 parts are supplied on the tray 25 for 30 unit substrates 91, the control device 50 uses eight suction nozzles 34 to perform PP three times. Execute the cycle. At this time, the control device 50 executes the subsequent collection operation and the mounting operation because the 22nd and subsequent parts are not supplied regardless of whether or not 30 mounting positions are specified in the control program Rc. Is omitted. Further, if a defect such as a component is found during the execution of the mounting process, the component may be mounted only on the unit board 91 which is smaller than the quantity supplied by the tray 25.
- the control device 50 attempts to mount as many parts as the number of parts supplied on the tray 25.
- the control device 50 recognizes the type, remaining number, and position of the parts supplied on the current tray 25.
- the control device 50 can grasp in advance the maximum number of PP cycles to be tried for the substrate 90 to be mounted this time and the maximum number of mounting operations to be tried in each PP cycle.
- the board transfer device 10 of the component mounting machine 1 executes the carry-in process of the board 90 as shown in FIG. 4 (S11).
- the substrate 90 is carried into the machine and is positioned at a predetermined position in the machine.
- the control device 50 executes the PP cycle (S20).
- the control device 50 repeatedly executes a sampling operation of sampling parts using the plurality of suction nozzles 34 (S21).
- the plurality of suction nozzles 34 collect the same type of parts from the tray 25.
- this collection operation (S21), when the complement processing described later is set, the operation is performed according to the mode of the complement processing.
- the state recognition unit 52 executes a process of recognizing the holding state of the parts held by the plurality of suction nozzles 34 (S22). Specifically, the control device 50 moves the mounting head 33 above the component camera 41 and sends an imaging command to the component camera 41. The state recognition unit 52 performs image processing on the image data acquired by the imaging of the component camera 41, and recognizes the posture (position and angle) of the component held by each of the plurality of suction nozzles 34.
- the recovery control unit 53 determines whether or not it is necessary to execute the recovery process based on the result of the recognition process (S22) (S23). Specifically, the recovery control unit 53 determines from the result of the recognition process (S22) whether or not each of the one or more suction nozzles 34 that have tried to suck the parts among the plurality of suction nozzles 34 properly holds the parts. judge. Specifically, the recovery control unit 53 holds the parts in an inverted state when the predetermined suction nozzle 34 does not collect the parts, or when the collected parts are tilted with respect to the vertical axis. In some cases, it is determined that the mounting operation by the predetermined suction nozzle 34 is infeasible.
- the recovery control unit 53 determines that the mounting operation assigned to the predetermined suction nozzle 34 cannot be executed and it is necessary to execute the recovery process (S23: Yes)
- the recovery control unit 53 sets the mounting operation as the skip operation (S24). ).
- the recovery control unit 53 performs the respective suctions.
- the mounting operation at the mounting positions P12 and P15 assigned to the nozzle 34 is defined as a skip operation.
- the recovery control unit 53 executes a change process related to the mounting operation in the same PP cycle (S25).
- the above-mentioned change process sets the mounting position of the mounting operation assigned to one of the other suction nozzles 34 from which the same type of parts are collected when at least one of the plurality of mounting operations in the PP cycle is a skip operation. It is a process of changing to the mounting position of the skip operation.
- the recovery control unit 53 immediately executes the recovery process in the PP cycle in which the collection error occurs, for example.
- the first change process is scheduled to execute the mounting positions (P13, P14, P16, ...) Of the mounting operation scheduled to be executed after the skip operation in the same PP cycle immediately before each. Change to the mounting position of the mounting operation of the same type of parts.
- the numerical values in ⁇ in the figure indicate the numbers of the suction nozzles 34 from the first to the eighth, and it is assumed that the mounting operation is executed in the order from the top to the bottom in the figure (in FIG. 6). the same).
- the first change process is repeated for the skip operation included in the same PP cycle.
- the mounting position (P16-P18) of the mounting operation scheduled to be executed after the second and subsequent skip operations is the mounting scheduled to be executed two or more times before. It is changed to the mounting position (P14-P16) of the operation.
- the first change process as described above is a type in which the parts are preferentially mounted at the mounting position in which the mounting order is earlier specified by the control program Rc.
- the second change process is the mounting position (P17, P17,) of the mounting operation of the same type of component that is scheduled to be executed last among the mounting operations scheduled to be executed after the skip operation in the same PP cycle.
- P18) and the change process for changing the mounting order to the mounting position (P12, P15) and the mounting order of the skip operation are executed.
- the above-mentioned "last execution schedule" corresponds to the execution schedule of the mounting operation for two times from the end as described above.
- the second change process as described above is a type in which parts are mounted with priority given to maintaining the mounting order specified by the control program Rc.
- the first change process and the second change process when the unit board 91 on which the component is mounted is continuous based on the control program Rc, the unit on which the component is mounted even if the skip operation occurs.
- the substrate 91 can be made continuous.
- the first change process can maintain the order of the suction nozzles 34 used for the mounting operation in the same PP cycle. Therefore, the first change process is particularly useful when applied to a configuration in which a plurality of suction nozzles 34 are sequentially indexed to an elevating position, such as a mounting head 33 having a rotary head 35 (see FIG. 2A).
- the second change process can minimize the number of changes in the mounting position.
- the mounting operation of each suction nozzle 34 specified by the optimized control program Rc can be maintained as much as possible. Therefore, the second change process is applied to a configuration in which a plurality of suction nozzles 34 can be independently moved up and down, such as a mounting head 33 (see FIG. 2B) in which a plurality of suction nozzles 34 are linearly arranged. Especially useful.
- both the mounting position and the mounting order are changed, but for example, only the mounting position may be changed and the mounting order may not be changed. That is, the recovery control unit 53 uses the first, third, fourth, and sixth suction nozzles 34, which are not related to the skip operation, to perform the mounting operation at the mounting position (P11, P13, P14, P16). Do it first. Then, the recovery control unit 53 uses the seventh and eighth suction nozzles 34 to perform the mounting operation at the mounting positions (P12, P15) to be changed later.
- the recovery control unit 53 may select and execute a change process that shortens the required time of the PP cycle to which the first change process and the second change process are applied, respectively. According to such a configuration, it is possible to suppress a decrease in production efficiency due to execution of recovery processing (mounting position change processing).
- the recovery control unit 53 when the change process is executed, the recovery control unit 53 was scheduled to be executed in this PP cycle, but the mounting position where the parts were not mounted due to the change in the mounting position (in the above example). Regarding the mounting positions P17 and P18), it is set that complementary processing is required later. Subsequently, the control device 50 mounts the component using the plurality of suction nozzles 34 after the change process (S25) is executed or when it is determined that the recovery process does not need to be executed (S23: No). The mounting operation is repeatedly executed (S26). In this mounting operation (S26), when the complement processing described later is set, the operation is performed according to the mode of the complement processing.
- the recovery control unit 53 determines whether or not it is necessary to set the complementary process (S27). Specifically, the recovery control unit 53 determines that it is necessary to set the complementary process when the change process (S25) is executed in the current mounting process (S27: Yes).
- the complementary process is a process of mounting a component at a mounting position where the component was not mounted due to a change in the mounting position in the previous PP cycle.
- the mode of the complement process to be executed in the subsequent PP cycle is set. For the above complementary processing, for example, the following two types of modes can be adopted.
- the mounting position change process (S25) when executed in a predetermined PP cycle, a component mounting operation of the same type as the skip operation is performed in the PP cycle scheduled to be executed thereafter.
- the mounting position of is changed to the mounting position of the mounting operation of the same type of parts scheduled to be executed immediately before each.
- two skip operations occur in the Nth PP cycle, and the mounting positions P17 and P18 are complemented by changing the mounting position.
- the part type A is specified to be mounted at the mounting positions P17 and P18.
- the mounting position (mounting position P22-P26 in FIG. 7) of the component mounting operation of the same type (part type A) as the skip operation is set to the same type scheduled to be executed immediately before each. It is changed to the mounting position (mounting positions P17, P18, P22-P24 in FIG. 7) of the mounting operation of the parts of. Further, when the complement processing is executed, the recovery control unit 53 is scheduled to be executed in the N + 1th PP cycle of this time, but the mounting position where the parts are not mounted due to the change of the mounting position (the above). Regarding the mounting positions P25 and P26) in the example of the above, it is set that complementary processing is required later.
- the mounting position and mounting order of the mounting operation of parts of different types (part types B and C) from the skip operation are not changed.
- the mounting positions for the same type (part type A) are changed in the same manner as described above.
- the recovery control unit 53 may add a collection operation and a mounting operation (mounting operation to the mounting positions Pe-1 and Pe in FIG. 7) according to the number of skip operations in the final PP cycle. If the remaining number of parts on the tray 25 is 0, the collecting operation and the mounting operation may be omitted.
- the second complementary process is included in the predetermined PP cycle before the PP cycle scheduled to be executed thereafter when the mounting position change process (S25) is executed in the predetermined PP cycle.
- the number of parts to be skipped is collected, and the mounting operation to the mounting position that has not been mounted due to the change of the mounting position is executed. Specifically, it is assumed that two skip operations occur in the Nth PP cycle, and the mounting positions P17 and P18 are complemented by changing the mounting position.
- the number of parts to be picked up (the part type A is to be picked up) and the mounting position are changed, which is the number of skipping operations included in the Nth PP cycle.
- the PP cycle after the N + 1th time becomes the mounting operation instructed by the control program Rc unless a new skip operation occurs.
- the first complement processing it is possible to complement without adding a new PP cycle, and the order of the suction nozzles 34 used for the mounting operation in the PP cycle after the PP cycle in which the skip operation occurs. Can be maintained. Therefore, when the mounting head 33 has the rotary head 35, a decrease in production efficiency can be particularly suppressed.
- the second complement processing it is possible to prevent the influence of the change processing and the complement processing on the PP cycle after the PP cycle in which the skip operation occurs. Thereby, for example, control based on the optimized control program Rc can be maintained.
- the recovery control unit 53 may switch various modes of the first complement processing and the second complement processing from the viewpoint of production efficiency and quality and appropriately select them.
- one or more PP cycles scheduled to be executed after the predetermined PP cycle in which the mounting position change process is executed are designated as the scheduled PP cycle group Gc (see FIGS. 7 and 8).
- the recovery control unit 53 selects and executes a complement process that shortens the required time of the scheduled PP cycle group Gc when the first complement process and the second complement process are separately applied to the scheduled PP cycle group Gc. ..
- the recovery control unit 53 may switch various modes again when the skip operation occurs again after starting the complement processing. For example, when the number of skip operations generated in one mounting process is less than or equal to a predetermined value, the first complementary process that can be complemented without adding a new PP cycle is selected, and as the number of subsequent skip operations increases. The second complementary process that adds a new PP cycle may be selected.
- the recovery control unit 53 sets the complement processing as described above (S28), the setting contents of the complement processing are reflected in the collection operation (S21) and the mounting operation (S26) in the subsequent PP cycle.
- the first complementary process is selected
- the mounting position in the subsequent PP cycle is appropriately changed
- the second complementary process for example, an additional PP is added before the next PP cycle to be executed.
- the cycle is inserted.
- the holding state recognition process (S22), the necessity determination of the recovery process (S23), and the necessity determination of the further complementary process (S27) are executed in the same manner as in the normal PP cycle.
- the control device 50 determines whether or not all the PP cycles have been completed based on the control program Rc and the actual mounting condition (S12). If all the PP cycles have not been completed (S12: No), the control device 50 repeatedly executes the PP cycles (S20). When all the PP cycles are completed (S12: Yes), the control device 50 executes the unloading process of the substrate 90 (S13). In the unloading process of the substrate 90, the substrate transport device 10 unclamps the positioned substrate 90 and unloads the substrate 90 out of the component mounting machine 1.
- the mounting position change process (S25) is executed in the executing PP cycle in which a part of the mounting operation becomes infeasible and recovery processing is required.
- the recovery process is immediately executed before the next and subsequent PP cycles are executed. Therefore, in a predetermined PP cycle in which a plurality of parts of the same type are mounted, priority is given to mounting the skip operation at the mounting position. In the production of a type of substrate product in which the mounting order for a plurality of mounting positions is affected by the required time, the efficiency of the production can be improved.
- a production process using a multi-chamfered substrate including a mounting process by the component mounting machine 1 will be described with reference to FIGS. 3 and 9. Specifically, in the production line, as shown in FIG. 9, first, solder is printed on the upper surface of the substrate 90 by a printing machine (S11). Next, the mounting process is executed by one or more component mounting machines 1 (S12). As a result, a large number of components are mounted on the upper surface of the substrate 90. In the above mounting process (S12), a recovery process can be executed as needed.
- the parts may be mounted only on a part of the plurality of unit boards 91.
- the substrate 90 is subjected to a marking process (S13) after the mounting process (S12) is executed.
- the marking process makes the unit substrate 91 visible, for example, by applying ink to the unit substrate 91 on which no component is mounted.
- the marking process if the area occupied by the plurality of unit boards 91 on which the components are mounted and the area occupied by the plurality of unit boards 91 on which the components are not mounted can be classified in the board 90 which is a multi-chamfered board. , A division line 95 for dividing each region may be attached as shown in FIG. As a result, the marking process visually classifies the unit board 91 on which the component is mounted and the unit board 91 on which the component is not mounted. The marking process is executed by a function provided in the component mounting machine 1 or another board-to-board working machine.
- the substrate 90 is subjected to a reflow process by the reflow furnace (S14).
- the substrate 90 is in a state where the solder is melted by heating and soldered.
- the substrate 90 is subjected to a molding process of coating the surface with a resin material (S15).
- the above-mentioned molding process is, for example, a process in which a substrate 90 is housed inside a mold and filled with a melted resin to form a mold.
- the substrate 90 which is a multi-chamfered substrate, is subjected to a division process (S16).
- the plurality of unit substrates 91 are made into individual substrate products.
- the unit board 91 on which the parts are not mounted and which is marked by the marking process (S13) and the unit board 91 on which the parts are normally mounted and can be a board product are sorted.
- the recovery process as described above is appropriately executed, so that the control program Rc is applied to the substrate 90.
- Parts are mounted without skipping part of the mounting sequence commanded by. In this way, a plurality of components are continuously arranged on the substrate 90, and the unit substrate 91 that cannot be commercialized is prevented from being discontinuously generated.
- a division line 95 can be attached so as to be roughly divided into an area in which the unit substrate 91 that can be commercialized is continuous and an area in which the unit substrate 91 that cannot be commercialized is continuously generated in the marking process. Therefore, the marking process is simplified and the productivity can be improved. Since the unit substrate 91 that can be commercialized and the unit substrate 91 that cannot be commercialized are roughly classified, the division process (S16) and the subsequent sorting process can be simplified.
- the number of parts mounted on the unit board 91 is smaller than that of the surrounding unit boards 91. If such a unit substrate 91 that cannot be commercialized exists discontinuously, the resin material applied to the surface of the substrate 90 in the molding process (S15) becomes not uniform, which causes a factor of lowering the coating quality. On the other hand, when the unit substrate 91 that can be commercialized and the unit substrate 91 that cannot be commercialized are roughly classified according to the above configuration, the resin material is suitably applied to a plurality of unit substrates 91 that can be continuously commercialized. The quality of the molding process can be improved.
- the component mounting machine 1 is configured to include one mounting head 33.
- the component mounting machine 1 may be configured to include a plurality of mounting heads 33 that can operate independently of each other.
- the component mounting machine 101 includes a first mounting head 137 and a second mounting head 138 that move one or more suction nozzles 34 in the horizontal direction independently of each other.
- the first mounting head 137 and the second mounting head 138 are configured so that their movable ranges overlap each other in the component mounting machine 1, and the mounting operation can be executed on one board 90.
- the first mounting head 137 supports a part (for example, 4 out of 8) of the plurality of suction nozzles 34 used in the mounting process.
- the second mounting head 138 supports the remaining part (for example, 4 out of 8) of the plurality of suction nozzles 34.
- the first mounting head 137 is used for the component sampling process and in the holding state of the component during the period in which the component mounting operation on the substrate 90 using the second mounting head 138 is executed.
- Recognition processing is executed.
- the second mounting head 138 moves from above the substrate 90 to above the component supply device 20 in order to sample the component after the mounting operation for the sampled component is completed.
- one PP cycle is a second mounting that is executed in parallel with the mounting operation using the first mounting head 137 after the collection operation using the first mounting head 137 is started. It is assumed that it is an operation until the collection operation and the mounting operation using the head 138 are completed.
- the control device 50 sets the mounting operation related to the collection error as a skip operation.
- the control device 50 implements the operation.
- the recovery process using another suction nozzle 34 may be executed in the same PP cycle.
- control device 50 is set to collect the parts related to the above collection error using the second mounting head 138 in parallel with the mounting operation using the first mounting head 137. Then, the recovery process using the second mounting head 138 may be executed in the same PP cycle. At this time, a change process for changing the mounting position related to the mounting operation using the second mounting head 138 is executed, and further, a complementary process is appropriately executed in the subsequent PP cycle.
- the embodiments exemplified in the embodiment can be applied to the above-mentioned change processing and complement processing.
- the mounting order instructed by the control program Rc is prioritized by the mounting position first.
- various matters may be prioritized.
- the substrate 90 is a multi-chamfered substrate as in the embodiment
- the unit substrate 91 that can be commercialized is located on the upstream side or the downstream side of the substrate 90 in the transport direction, or in the front side or the rear side region of the component mounting machine 1.
- the mounting position may be changed so that continuity is prioritized.
- the production processing of the substrate product includes marking processing and molding processing.
- the marking process is executed in a device installed between the plurality of component mounting machines 1, and may also be executed in the machine of the component mounting machine 1.
- the marking process and the molding process may not be included in the production process of the substrate product.
- the substrate 90 used for producing the substrate product is a multi-chamfered substrate composed of a plurality of unit substrates 91.
- the substrate 90 may be a general-purpose substrate other than the multi-chamfered substrate.
- the mounting process for executing the recovery process as illustrated in the embodiment is performed. Can be applied. In such a configuration, the same effect as that of the embodiment is obtained.
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Abstract
When a mounting operation assigned to a predetermined holding member is determined to be inexecutable on the basis of the result of a recognition process, a control device of this component mounter sets the mounting operation as a skip operation and executes a change process for changing the mounting position of the mounting action assigned to another holding member that has picked the same type of component according to a picking operation in the same PP cycle as the skip operation, into a mounting position of the skip operation.
Description
本発明は、部品装着機に関するものである。
The present invention relates to a component mounting machine.
部品装着機は、基板に部品を装着する装着処理を実行する。上記の装着処理において、部品を採取する採取動作と部品を基板に装着する装着動作とが含まれるPPサイクル(ピックアンドプレースサイクル)が繰り返し実行される。所定のPPサイクルにおいて採取エラーが発生した場合には、部品装着機は、採取エラーに係る部品の装着動作をスキップする。そして、部品装着機は、例えば次回以降のPPサイクルにおいて、先にスキップした装着位置への装着を再試行するリカバリ処理を実行する(特許文献1を参照)。
The parts mounting machine executes a mounting process for mounting parts on the board. In the above mounting process, a PP cycle (pick and place cycle) including a collecting operation for collecting parts and a mounting operation for mounting parts on a substrate is repeatedly executed. When a sampling error occurs in a predetermined PP cycle, the component mounting machine skips the component mounting operation related to the sampling error. Then, the component mounting machine executes a recovery process for retrying mounting at the previously skipped mounting position in, for example, the next and subsequent PP cycles (see Patent Document 1).
ところで、複数のPPサイクルにおける装着位置と装着順序は、例えば装着処理の効率化や高精度化が図られるように予め設定されている。そのため、リカバリ処理を実行するタイミングは、装着処理の効率等に影響するため特に重要である。また、装着処理には、種々の基板製品の生産に対応するために種々の態様が適用され得る。例えば、同一のPPサイクルに同一種類の部品の装着動作が含まれている場合には、その何れかの装着動作がスキップされると、以降の同一種類の部品の装着動作に影響することがある。
By the way, the mounting position and mounting order in a plurality of PP cycles are preset so as to improve the efficiency and accuracy of the mounting process, for example. Therefore, the timing of executing the recovery process is particularly important because it affects the efficiency of the mounting process and the like. In addition, various aspects may be applied to the mounting process in order to cope with the production of various substrate products. For example, when the same PP cycle includes the mounting operation of the same type of parts, if any of the mounting operations is skipped, it may affect the subsequent mounting operation of the same type of parts. ..
本明細書は、リカバリ処理が必要となった実行中のPPサイクルにおいて、即時にリカバリ処理を実行することにより基板製品の生産の効率化を図ることができる部品装着機を提供することを目的とする。
An object of the present specification is to provide a component mounting machine capable of improving the efficiency of production of a substrate product by immediately executing the recovery process in an executing PP cycle in which the recovery process is required. To do.
本明細書は、採取した部品を保持する複数の保持部材と、複数の前記保持部材のそれぞれに保持された前記部品の保持状態の認識処理を実行する状態認識部と、前記部品の装着位置および装着順序を示す制御プログラム、並びに前記認識処理の結果に基づいて、前記部品の採取動作および装着動作が含まれるピックアンドプレースサイクル(以下、「PPサイクル」)を繰り返し実行する制御装置と、を備え、複数の前記保持部材には、複数回に亘り実行される前記PPサイクルのうち少なくとも1回の前記PPサイクルにおいて同一種類の前記部品の採取動作および装着動作がそれぞれ割り当てられ、前記制御装置は、前記認識処理の結果に基づいて所定の前記保持部材に割り当てられた装着動作が実行不能であると判定した場合に、当該装着動作をスキップ動作とするとともに、前記スキップ動作と同一の前記PPサイクルにおける採取動作により同一種類の前記部品を採取した他の前記保持部材の一つに割り当てられた装着動作の前記装着位置を前記スキップ動作の前記装着位置に変更する変更処理を実行する、部品装着機を開示する。
In the present specification, a plurality of holding members for holding the collected parts, a state recognition unit for executing a process of recognizing the holding state of the parts held by each of the plurality of holding members, a mounting position of the parts, and A control program indicating the mounting order and a control device that repeatedly executes a pick-and-place cycle (hereinafter, “PP cycle”) including a picking operation and a mounting operation of the parts based on the result of the recognition process are provided. The plurality of holding members are assigned the picking operation and the mounting operation of the same type of the parts in at least one of the PP cycles executed over a plurality of times, and the control device receives the control device. When it is determined that the mounting operation assigned to the predetermined holding member is infeasible based on the result of the recognition process, the mounting operation is set as the skip operation and in the same PP cycle as the skip operation. A component mounting machine that executes a change process for changing the mounting position of the mounting operation assigned to one of the other holding members that have collected the same type of component to the mounting position of the skip operation. Disclose.
このような構成によると、一部の装着動作が実行不能となってリカバリ処理が必要となった実行中のPPサイクルにおいて、装着位置の変更処理が実行される。これにより、次回以降のPPサイクルが実行される前に、即時にリカバリ処理が実行される。よって、同一種類の部品を複数装着する所定のPPサイクルにおいて、スキップ動作の装着位置への装着が優先される。複数の装着位置に対する装着順序が所要時間により影響する種類の基板製品の生産においては、当該生産の効率化を図ることができる。
According to such a configuration, the mounting position change processing is executed in the executing PP cycle in which some mounting operations become infeasible and recovery processing is required. As a result, the recovery process is immediately executed before the next and subsequent PP cycles are executed. Therefore, in a predetermined PP cycle in which a plurality of parts of the same type are mounted, priority is given to mounting the skip operation at the mounting position. In the production of a type of substrate product in which the mounting order for a plurality of mounting positions is affected by the required time, the efficiency of the production can be improved.
1.部品装着機の概要
以下、部品装着機を具体化した実施形態について図面を参照して説明する。部品装着機は、例えば他の部品装着機を含む複数種類の対基板作業機とともに、基板製品を生産する生産ラインを構成する。上記の生産ラインを構成する対基板作業機には、印刷機や検査装置、リフロー炉などが含まれる。さらに、生産ラインには、例えば生産する基板製品の種別などに応じて、その構成を適宜追加、変更され得る。具体的には、生産ラインには、搬送される基板を一時的に保持するバッファ装置や基板供給装置や基板反転装置、各種検査装置、シールド装着装置、モールド形成装置、接着剤塗布装置、紫外線照射装置などの対基板作業機が適宜設置され得る。 1. 1. Outline of the component mounting machine Hereinafter, an embodiment in which the component mounting machine is embodied will be described with reference to the drawings. The component mounting machine constitutes a production line for producing board products together with a plurality of types of board-to-board working machines including, for example, other component mounting machines. The board-to-board working machine that constitutes the above production line includes a printing machine, an inspection device, a reflow furnace, and the like. Further, the configuration of the production line can be appropriately added or changed according to, for example, the type of substrate product to be produced. Specifically, the production line includes a buffer device, a board supply device, a board reversing device, various inspection devices, a shield mounting device, a mold forming device, an adhesive coating device, and an ultraviolet irradiation device that temporarily hold the transferred board. An anti-board working machine such as an apparatus can be appropriately installed.
以下、部品装着機を具体化した実施形態について図面を参照して説明する。部品装着機は、例えば他の部品装着機を含む複数種類の対基板作業機とともに、基板製品を生産する生産ラインを構成する。上記の生産ラインを構成する対基板作業機には、印刷機や検査装置、リフロー炉などが含まれる。さらに、生産ラインには、例えば生産する基板製品の種別などに応じて、その構成を適宜追加、変更され得る。具体的には、生産ラインには、搬送される基板を一時的に保持するバッファ装置や基板供給装置や基板反転装置、各種検査装置、シールド装着装置、モールド形成装置、接着剤塗布装置、紫外線照射装置などの対基板作業機が適宜設置され得る。 1. 1. Outline of the component mounting machine Hereinafter, an embodiment in which the component mounting machine is embodied will be described with reference to the drawings. The component mounting machine constitutes a production line for producing board products together with a plurality of types of board-to-board working machines including, for example, other component mounting machines. The board-to-board working machine that constitutes the above production line includes a printing machine, an inspection device, a reflow furnace, and the like. Further, the configuration of the production line can be appropriately added or changed according to, for example, the type of substrate product to be produced. Specifically, the production line includes a buffer device, a board supply device, a board reversing device, various inspection devices, a shield mounting device, a mold forming device, an adhesive coating device, and an ultraviolet irradiation device that temporarily hold the transferred board. An anti-board working machine such as an apparatus can be appropriately installed.
2.部品装着機1の構成
部品装着機1は、基板90に部品を装着する装着処理を実行する。部品装着機1は、図1に示すように、基板搬送装置10、部品供給装置20、部品移載装置30、部品カメラ41、基板カメラ42、および制御装置50を備える。基板搬送装置10は、ベルトコンベアおよび位置決め装置などにより構成される。基板搬送装置10は、基板90を搬送方向へと順次搬送するとともに、基板90を機内の所定位置に位置決めする。基板搬送装置10は、装着処理が終了した後に、基板90を部品装着機1の機外に搬出する。 2. 2. Configuration ofComponent Mounting Machine 1 The component mounting machine 1 executes a mounting process for mounting components on the substrate 90. As shown in FIG. 1, the component mounting machine 1 includes a board transfer device 10, a component supply device 20, a component transfer device 30, a component camera 41, a board camera 42, and a control device 50. The substrate transfer device 10 is composed of a belt conveyor, a positioning device, and the like. The substrate transfer device 10 sequentially conveys the substrate 90 in the transfer direction, and positions the substrate 90 at a predetermined position in the machine. The board transfer device 10 carries the board 90 out of the component mounting machine 1 after the mounting process is completed.
部品装着機1は、基板90に部品を装着する装着処理を実行する。部品装着機1は、図1に示すように、基板搬送装置10、部品供給装置20、部品移載装置30、部品カメラ41、基板カメラ42、および制御装置50を備える。基板搬送装置10は、ベルトコンベアおよび位置決め装置などにより構成される。基板搬送装置10は、基板90を搬送方向へと順次搬送するとともに、基板90を機内の所定位置に位置決めする。基板搬送装置10は、装着処理が終了した後に、基板90を部品装着機1の機外に搬出する。 2. 2. Configuration of
部品供給装置20は、基板90に装着される部品を供給する。部品供給装置20は、複数のスロット21にセットされたフィーダ22を備える。フィーダ22は、多数の部品が収納されたキャリアテープを送り移動させて、部品を採取可能に供給する。また、部品供給装置20は、例えば比較的大型の部品を、パレット24に載置されたトレイ25上に並べた状態で供給する。部品供給装置20の収納装置23は、複数のパレット24を収納し、装着処理に応じて所定のパレット24を引き出して部品を供給する。
The component supply device 20 supplies components to be mounted on the substrate 90. The component supply device 20 includes feeders 22 set in a plurality of slots 21. The feeder 22 feeds and moves a carrier tape containing a large number of parts so that the parts can be collected. Further, the parts supply device 20 supplies, for example, relatively large parts in a state of being arranged on a tray 25 placed on the pallet 24. The storage device 23 of the parts supply device 20 stores a plurality of pallets 24, and pulls out a predetermined pallet 24 according to the mounting process to supply the parts.
部品移載装置30は、部品供給装置20により供給された部品を、基板搬送装置10により機内に搬入された基板90上の所定の装着位置まで移載する。部品移載装置30のヘッド駆動装置31は、直動機構により移動台32を水平方向(X方向およびY方向)に移動させる。移動台32には、図示しないクランプ部材により装着ヘッド33が交換可能に固定されている。装着ヘッド33は、回転可能に且つ昇降可能に複数の吸着ノズル34を支持する。
The parts transfer device 30 transfers the parts supplied by the parts supply device 20 to a predetermined mounting position on the board 90 carried into the machine by the board transfer device 10. The head drive device 31 of the component transfer device 30 moves the moving table 32 in the horizontal direction (X direction and Y direction) by a linear motion mechanism. The mounting head 33 is interchangeably fixed to the moving table 32 by a clamp member (not shown). The mounting head 33 rotatably and vertically supports a plurality of suction nozzles 34.
吸着ノズル34は、採取した部品を保持する保持部材である。吸着ノズル34は、供給される負圧エアにより、フィーダ22により供給される部品を吸着する。保持部材としては、部品を把持することにより保持するチャックなどが採用され得る。ここで、上記の装着ヘッド33には、例えば図2A-図2Cに示すように、種々のタイプが採用され得る。図2Aの装着ヘッド33は、鉛直軸(Z軸)に平行なR軸周りに回転可能に設けられたロータリヘッド35を有する。ロータリヘッド35には、複数の保持部材(本実施形態において8本の吸着ノズル34)が周方向に等間隔で配置される。
The suction nozzle 34 is a holding member that holds the collected parts. The suction nozzle 34 sucks the parts supplied by the feeder 22 by the supplied negative pressure air. As the holding member, a chuck or the like that holds the component by gripping it can be adopted. Here, various types can be adopted for the mounting head 33, for example, as shown in FIGS. 2A-2C. The mounting head 33 of FIG. 2A has a rotary head 35 rotatably provided around an R axis parallel to the vertical axis (Z axis). A plurality of holding members (eight suction nozzles 34 in this embodiment) are arranged on the rotary head 35 at equal intervals in the circumferential direction.
装着ヘッド33は、複数の吸着ノズル34を直線状または円環状に保持し、ロータリヘッド35を回転して吸着ノズル34を1以上の昇降位置に割り出す。そして、装着ヘッド33は、昇降装置36の駆動により吸着ノズル34を昇降させる。図2Bおよび図2Cの装着ヘッド3は、所定位置に複数の保持部材(本実施形態において8本の吸着ノズル34)を直線状に、またはマトリックス状に配列される。装着ヘッド33は、独立して駆動可能な昇降装置36の駆動により吸着ノズル34を昇降させる。
The mounting head 33 holds a plurality of suction nozzles 34 in a straight line or an annular shape, and rotates the rotary head 35 to determine the suction nozzles 34 to one or more elevating positions. Then, the mounting head 33 raises and lowers the suction nozzle 34 by driving the lifting device 36. In the mounting head 3 of FIGS. 2B and 2C, a plurality of holding members (eight suction nozzles 34 in this embodiment) are arranged linearly or in a matrix at predetermined positions. The mounting head 33 raises and lowers the suction nozzle 34 by driving an elevating device 36 that can be driven independently.
部品カメラ41、および基板カメラ42は、CMOSなどの撮像素子を有するデジタル式の撮像装置である。部品カメラ41、および基板カメラ42は、制御信号に基づいて撮像を行い、当該撮像により取得した画像データを送出する。部品カメラ41は、装着ヘッド33の吸着ノズル34に保持された部品を下方から撮像可能に構成される。基板カメラ42は、基板90を上方から撮像可能に構成される。
The component camera 41 and the substrate camera 42 are digital image pickup devices having an image pickup element such as CMOS. The component camera 41 and the substrate camera 42 take an image based on the control signal and send out the image data acquired by the image pickup. The component camera 41 is configured to be able to image a component held by the suction nozzle 34 of the mounting head 33 from below. The substrate camera 42 is configured so that the substrate 90 can be imaged from above.
制御装置50は、主として、CPUや各種メモリ、制御回路により構成される。制御装置50は、基板90に部品を装着する装着処理を制御する。制御装置50は、記憶装置51を備える。記憶装置51は、ハードディスク装置などの光学ドライブ装置、またはフラッシュメモリなどにより構成される。記憶装置51には、装着処理の制御に用いられる制御プログラムRcなどの各種データが記憶される。制御プログラムRcは、装着処理において基板90に装着される部品の装着位置および装着順序を示す。
The control device 50 is mainly composed of a CPU, various memories, and a control circuit. The control device 50 controls the mounting process of mounting the components on the substrate 90. The control device 50 includes a storage device 51. The storage device 51 is composed of an optical drive device such as a hard disk device, a flash memory, or the like. The storage device 51 stores various data such as a control program Rc used for controlling the mounting process. The control program Rc indicates the mounting position and mounting order of the components mounted on the substrate 90 in the mounting process.
ここで、装着処理には、部品供給装置20により供給された部品を複数の吸着ノズル34により採取する採取動作と、採取した部品を基板90における所定の装着位置に装着する装着動作とが含まれるピックアンドプレースサイクル(以下、「PPサイクル」と称する)を複数回に亘って繰り返す処理が含まれる。制御装置50は、装着処理において、各種センサから出力される情報や画像処理の結果、制御プログラムRcなどに基づき、部品移載装置30の動作を制御する。これにより、装着ヘッド33に支持された複数の吸着ノズル34の位置および角度が制御される。
Here, the mounting process includes a collecting operation of collecting the parts supplied by the component supply device 20 by the plurality of suction nozzles 34 and a mounting operation of mounting the collected parts at a predetermined mounting position on the substrate 90. A process of repeating a pick-and-place cycle (hereinafter referred to as a “PP cycle”) a plurality of times is included. The control device 50 controls the operation of the component transfer device 30 based on the information output from various sensors, the result of image processing, the control program Rc, and the like in the mounting process. As a result, the positions and angles of the plurality of suction nozzles 34 supported by the mounting head 33 are controlled.
制御装置50は、状態認識部52を備える。状態認識部52は、複数の保持部材(吸着ノズル34)のそれぞれに保持された部品の保持状態の認識処理を実行する。具体的には、状態認識部52は、PPサイクルにおける採取動作の後であり且つ装着動作の前に、部品カメラ41の撮像により取得された画像データを画像処理し、装着ヘッド33の基準位置に対する各部品の位置および角度を認識する。なお、状態認識部52は、部品カメラ41の他に、例えば装着ヘッド33に一体的に設けられるヘッドカメラユニットなどが部品を側方、下方、または上方から撮像して取得された画像データを画像処理するようにしてもよい。
The control device 50 includes a state recognition unit 52. The state recognition unit 52 executes a process of recognizing the holding state of the parts held by each of the plurality of holding members (suction nozzles 34). Specifically, the state recognition unit 52 performs image processing on the image data acquired by the imaging of the component camera 41 after the collection operation in the PP cycle and before the mounting operation, and refers to the reference position of the mounting head 33. Recognize the position and angle of each part. In addition to the component camera 41, the state recognition unit 52 captures image data acquired by, for example, a head camera unit integrally provided with the mounting head 33, capturing the components from the side, the lower side, or the upper side. It may be processed.
状態認識部52による認識処理の結果によると、装着ヘッド33の基準位置に対する部品の位置および角度の他に、採取動作により部品が正常に採取されたか否かも判定することができる。例えば、制御装置50は、複数の吸着ノズル34のうち所定の吸着ノズル34が部品を採取できなかった場合(部品を認識できなかった場合)や、採取した部品が正常でない場合(部品の一部の欠損、変形、または部品が裏返しの状態の場合)などに、今回のPPサイクルにおいて所定の吸着ノズル34に割り当てられた装着動作が実行不能であると判定する。
According to the result of the recognition process by the state recognition unit 52, it is possible to determine not only the position and angle of the component with respect to the reference position of the mounting head 33, but also whether or not the component has been normally sampled by the sampling operation. For example, in the control device 50, when a predetermined suction nozzle 34 among a plurality of suction nozzles 34 cannot collect a part (when the part cannot be recognized) or when the collected part is not normal (a part of the part). It is determined that the mounting operation assigned to the predetermined suction nozzle 34 in this PP cycle cannot be performed due to a defect, deformation, or a state in which the part is turned inside out).
制御装置50は、リカバリ制御部53を備える。リカバリ制御部53は、装着処理の実行中に種々のエラーが発生した場合に、装着処理を継続できるようにエラーに対応したリカバリ処理を適宜実行する。上記のリカバリ処理には、実行不能となった装着動作を、今回のPPサイクルと次回のPPサイクルとの間に再度試行したり、全てのPPサイクルが終了するか実行不能となった装着動作の数が所定数に達したところで集約して再度試行したりすることが考えられる。
The control device 50 includes a recovery control unit 53. When various errors occur during the execution of the mounting process, the recovery control unit 53 appropriately executes the recovery process corresponding to the error so that the mounting process can be continued. In the above recovery process, the infeasible mounting operation is tried again between the current PP cycle and the next PP cycle, or the mounting operation in which all PP cycles are completed or becomes infeasible. When the number reaches a predetermined number, it is conceivable to aggregate and try again.
ここで、基板製品の種類によっては、一枚の基板に同一種類の部品を複数装着する装着処理が実行されることがある。上記のような装着処理には、例えば後述する多面取り基板における複数の単位基板のそれぞれに同一種類の部品を装着する場合や、LED部品などを直線状や曲線状に並べて装着する場合などが含まれる。このような装着処理において、複数の吸着ノズル34には、複数回に亘り実行されるPPサイクルのうち少なくとも1回のPPサイクルにおいて同一種類の部品の採取動作および装着動作がそれぞれ割り当てられる。
Here, depending on the type of board product, a mounting process for mounting a plurality of parts of the same type on one board may be executed. The mounting process as described above includes, for example, mounting the same type of parts on each of a plurality of unit boards in the multi-chamfered board described later, mounting LED parts and the like side by side in a straight line or a curved line, and the like. Is done. In such a mounting process, the plurality of suction nozzles 34 are assigned the same type of component collecting operation and mounting operation in at least one PP cycle among the PP cycles executed a plurality of times.
本実施形態では、上記のような部品種が同一である複数の部品の装着動作を試行するPPサイクルにおいて採取エラーが発生した場合に適用可能なリカバリ処理の態様を例示する。なお、上記のリカバリ処理が適用されるPPサイクルには、同一種類の部品の装着動作が2以上含まれていればよく、一部に異なる種類の部品の装着動作が含まれていてもよい。また、例えば採取した部品が正常でないなどの採取エラーが発生した場合には、当該部品の廃棄といった採取エラーに対応した対処が適宜実行され得る。
In this embodiment, an embodiment of recovery processing applicable when a collection error occurs in a PP cycle in which a plurality of parts having the same part type as described above are tried to be mounted is illustrated. The PP cycle to which the above recovery process is applied may include two or more mounting operations of the same type of parts, and may partially include mounting operations of different types of parts. Further, when a collection error occurs, for example, the collected parts are not normal, countermeasures corresponding to the collection error such as disposal of the parts can be appropriately taken.
本実施形態において、リカバリ制御部53は、認識処理の結果に基づいて所定の吸着ノズル34に割り当てられた装着動作が実行不能であると判定した場合に、当該装着動作をスキップ動作とする。さらに、リカバリ制御部53は、スキップ動作と同一のPPサイクルにおける採取動作により同一種類の部品を採取した他の吸着ノズル34の一つに割り当てられた装着動作の装着位置をスキップ動作の装着位置に変更する変更処理を実行する。
In the present embodiment, when the recovery control unit 53 determines that the mounting operation assigned to the predetermined suction nozzle 34 is infeasible based on the result of the recognition process, the mounting operation is skipped. Further, the recovery control unit 53 sets the mounting position of the mounting operation assigned to one of the other suction nozzles 34 for collecting the same type of parts by the sampling operation in the same PP cycle as the skip operation to the mounting position of the skip operation. Execute the change process to be changed.
つまり、リカバリ制御部53は、従来ではスキップ動作について別のPPサイクルにおいて再度の装着動作を試行するところ、採取エラーが発生したPPサイクルに同一種類の部品の採取動作が含まれていることを利用したリカバリ処理を実行する。即ち、リカバリ制御部53は、採取エラーが発生した今回のPPサイクルにおける装着位置のうち所定の装着位置への装着動作を優先する。なお、優先される装着位置は、任意に設定することが可能であり、例えば制御プログラムRcにより指定される装着順序が早いものほど優先度が高くなるように設定してもよい。
That is, the recovery control unit 53 conventionally tries the mounting operation again in another PP cycle for the skip operation, but utilizes the fact that the PP cycle in which the collection error occurs includes the collection operation of the same type of parts. Execute the recovery process. That is, the recovery control unit 53 gives priority to the mounting operation at a predetermined mounting position among the mounting positions in the current PP cycle in which the collection error has occurred. The priority mounting position can be arbitrarily set. For example, the earlier the mounting order specified by the control program Rc, the higher the priority may be set.
さらに、リカバリ制御部53は、上記のような装着位置の変更処理を実行した場合に、変更された装着位置に対する装着動作を行うべく補完処理を実行する。補完処理は、例えば次回以降のPPサイクルの装着位置を変更したり、追加の補完PPサイクルを適宜のタイミングで実行したりする態様を採用し得る。リカバリ処理における変更処理および補完処理の詳細については、部品装着機1による装着処理において説明する。
Further, when the recovery control unit 53 executes the above-mentioned change processing of the mounting position, the recovery control unit 53 executes the complementary processing in order to perform the mounting operation for the changed mounting position. The complement processing may employ, for example, changing the mounting position of the PP cycle from the next time onward, or executing an additional supplement PP cycle at an appropriate timing. Details of the change process and the complement process in the recovery process will be described in the mounting process by the component mounting machine 1.
3.多面取り基板の構成
ここで、本実施形態における基板90は、図3に示すように、複数の単位基板91(本実施形態においては、30枚の単位基板91)により構成される多面取り基板としてもよい。多面取り基板である基板90は、複数の単位基板91ごとにPPサイクルの実行により種々の部品81を装着され、その後に分割されて個々の基板製品となる。本実施形態において、装着処理には、同一種類の複数の部品81を複数の単位基板91に亘って装着するPPサイクルが少なくとも1回含まれるものとする。 3. 3. Configuration of Multi-Chamfered Substrate Here, as shown in FIG. 3, thesubstrate 90 in the present embodiment is a multi-chamfered substrate composed of a plurality of unit substrates 91 (in this embodiment, 30 unit substrates 91). May be good. The substrate 90, which is a multi-chamfered substrate, is mounted with various components 81 by executing a PP cycle for each of a plurality of unit substrates 91, and is subsequently divided into individual substrate products. In the present embodiment, the mounting process includes at least one PP cycle in which a plurality of components 81 of the same type are mounted over a plurality of unit substrates 91.
ここで、本実施形態における基板90は、図3に示すように、複数の単位基板91(本実施形態においては、30枚の単位基板91)により構成される多面取り基板としてもよい。多面取り基板である基板90は、複数の単位基板91ごとにPPサイクルの実行により種々の部品81を装着され、その後に分割されて個々の基板製品となる。本実施形態において、装着処理には、同一種類の複数の部品81を複数の単位基板91に亘って装着するPPサイクルが少なくとも1回含まれるものとする。 3. 3. Configuration of Multi-Chamfered Substrate Here, as shown in FIG. 3, the
また、基板90は、図3に示すように、識別コード92および2つの基準マーク93を有する。識別コード92は、基板90に固有の識別符号(ID)を示す。識別コード92としては、バーコードや二次元コードなどを適用し得る。本実施形態において、識別コード92には、線幅および線同士の間隔が異なる複数の棒線を平行に配置して構成されるバーコードが採用されている。制御装置50は、基板カメラ42により識別コード92を撮像して取得された画像データに基づいて、基板90のIDを読み取る。
Further, as shown in FIG. 3, the substrate 90 has an identification code 92 and two reference marks 93. The identification code 92 indicates an identification code (ID) unique to the substrate 90. As the identification code 92, a bar code, a two-dimensional code, or the like can be applied. In the present embodiment, the identification code 92 employs a barcode configured by arranging a plurality of bars having different line widths and intervals between the lines in parallel. The control device 50 reads the ID of the substrate 90 based on the image data acquired by photographing the identification code 92 with the substrate camera 42.
制御装置50は、例えば基板90のIDと各種情報とが予め関連付けられたデータに基づいて、基板90の種別や生産する基板製品の種別、実行する装着処理の種別などを決定する。また、識別コード92が生産する基板製品の種別を示す情報を含むようにしてもよよ。2つの基準マーク93のそれぞれは、基板90の基準位置を示す。制御装置50は、基板カメラ42により基準マーク93を撮像して取得された画像データに基づいて基準マーク93を認識する。そして、制御装置50は、認識された基準マーク93の位置に基づいて、基板搬送装置10により位置決めされた基板90の基準位置を認識する。
The control device 50 determines, for example, the type of the substrate 90, the type of the substrate product to be produced, the type of the mounting process to be executed, and the like, based on the data in which the ID of the substrate 90 and various information are associated in advance. Further, the identification code 92 may include information indicating the type of the substrate product produced. Each of the two reference marks 93 indicates a reference position of the substrate 90. The control device 50 recognizes the reference mark 93 based on the image data obtained by photographing the reference mark 93 with the substrate camera 42. Then, the control device 50 recognizes the reference position of the substrate 90 positioned by the substrate transfer device 10 based on the position of the recognized reference mark 93.
4.部品装着機1による装着処理
部品装着機1による装着処理について図4-図10を参照して説明する。なお、ここでは、基板90が多面取り基板である装着処理を例示する。さらに、本実施形態の部品装着機1の構成において、1回のPPサイクルとは、複数の吸着ノズル34の少なくとも2以上による一連の採取動作が開始されてから一連の装着動作が終了するまでの動作であるものとする。 4. Mounting process by thecomponent mounting machine 1 The mounting process by the component mounting machine 1 will be described with reference to FIGS. 4 to 10. Here, a mounting process in which the substrate 90 is a multi-chamfered substrate will be illustrated. Further, in the configuration of the component mounting machine 1 of the present embodiment, one PP cycle means from the start of a series of collecting operations by at least two or more of the plurality of suction nozzles 34 to the end of the series of mounting operations. It shall be an operation.
部品装着機1による装着処理について図4-図10を参照して説明する。なお、ここでは、基板90が多面取り基板である装着処理を例示する。さらに、本実施形態の部品装着機1の構成において、1回のPPサイクルとは、複数の吸着ノズル34の少なくとも2以上による一連の採取動作が開始されてから一連の装着動作が終了するまでの動作であるものとする。 4. Mounting process by the
多面取り基板を対象とした装着処理には、制御プログラムRcにより指定される全ての装着位置への部品の装着を要求されるものと、装着実態に応じて必要数量または生産可能な数量だけ装着するものがある。具体的には、多面取り基板である1枚の基板90の全ての単位基板91に対して部品を装着するのではなく、必要数量または生産可能な数量に応じた単位基板91にのみ部品を装着することがある。これにより、上記のような装着処理の実行後には、部品を装着されなかった単位基板91が発生する。部品を装着されなかった単位基板91は、基板90の分割の後に廃棄などされる。
In the mounting process for multi-chamfered boards, parts are required to be mounted at all mounting positions specified by the control program Rc, and only the required quantity or the quantity that can be produced is mounted according to the actual mounting condition. There is something. Specifically, instead of mounting the components on all the unit boards 91 of one board 90, which is a multi-chamfered board, the components are mounted only on the unit boards 91 according to the required quantity or the quantity that can be produced. I have something to do. As a result, after the execution of the mounting process as described above, the unit board 91 in which the parts are not mounted is generated. The unit board 91 on which no component is mounted is discarded after the board 90 is divided.
上記の「装着実態」には、例えば多面取り基板である1枚の基板90に対して現在のトレイ25上に供給された部品の数量だけ装着を試行することが含まれる。具体的には、例えば30枚の単位基板91に対してトレイ25上に21個の部品が供給されている場合には、制御装置50は、8個の吸着ノズル34を用いて3回のPPサイクルを実行する。このとき、制御装置50は、制御プログラムRcに30箇所の装着位置が指定されているか否かに関わらず、22個目以降の部品が供給されていないことから以降の採取動作および装着動作の実行を省略する。また、装着処理の実行中に部品の不良などが発見されると、トレイ25による供給数量よりも少量の単位基板91にのみ部品が装着される状態になり得る。
The above-mentioned "mounting actual condition" includes, for example, trying to mount as many parts as the number of parts supplied on the current tray 25 on one substrate 90 which is a multi-chamfered substrate. Specifically, for example, when 21 parts are supplied on the tray 25 for 30 unit substrates 91, the control device 50 uses eight suction nozzles 34 to perform PP three times. Execute the cycle. At this time, the control device 50 executes the subsequent collection operation and the mounting operation because the 22nd and subsequent parts are not supplied regardless of whether or not 30 mounting positions are specified in the control program Rc. Is omitted. Further, if a defect such as a component is found during the execution of the mounting process, the component may be mounted only on the unit board 91 which is smaller than the quantity supplied by the tray 25.
以下では、上記のような装着実態に応じて部品を装着する装着処理を例示する。つまり、制御装置50は、トレイ25上に供給された部品の数量だけ装着を試行する。なお、制御装置50は、現在のトレイ25上に供給された部品の種別、残数、および位置を認識している。これにより、制御装置50は、今回の装着処理の対象となる基板90に対して試行するPPサイクルの最大数や、それぞれのPPサイクルにおいて試行する装着動作の最大数を予め把握することができる。
In the following, the mounting process for mounting parts according to the actual mounting conditions as described above will be illustrated. That is, the control device 50 attempts to mount as many parts as the number of parts supplied on the tray 25. The control device 50 recognizes the type, remaining number, and position of the parts supplied on the current tray 25. As a result, the control device 50 can grasp in advance the maximum number of PP cycles to be tried for the substrate 90 to be mounted this time and the maximum number of mounting operations to be tried in each PP cycle.
先ず、部品装着機1の基板搬送装置10は、図4に示すように、基板90の搬入処理を実行する(S11)。これにより、機内に基板90が搬入されるとともに、機内の所定位置に位置決めされる。次に、制御装置50は、PPサイクルを実行する(S20)。PPサイクルにおいて、制御装置50は、複数の吸着ノズル34を用いて部品を採取する採取動作を繰り返し実行する(S21)。ここでは、複数の単位基板91のそれぞれに同一種類の部品を装着するために、複数の吸着ノズル34が同一種類の部品をトレイ25から採取する。なお、この採取動作(S21)では、後述する補完処理の設定がなされている場合には、当該補完処理の態様に準じた動作を行う。
First, the board transfer device 10 of the component mounting machine 1 executes the carry-in process of the board 90 as shown in FIG. 4 (S11). As a result, the substrate 90 is carried into the machine and is positioned at a predetermined position in the machine. Next, the control device 50 executes the PP cycle (S20). In the PP cycle, the control device 50 repeatedly executes a sampling operation of sampling parts using the plurality of suction nozzles 34 (S21). Here, in order to mount the same type of parts on each of the plurality of unit substrates 91, the plurality of suction nozzles 34 collect the same type of parts from the tray 25. In this collection operation (S21), when the complement processing described later is set, the operation is performed according to the mode of the complement processing.
続いて、状態認識部52は、複数の吸着ノズル34にそれぞれ保持された部品の保持状態の認識処理を実行する(S22)。詳細には、制御装置50は、装着ヘッド33を部品カメラ41の上方に移動させ、部品カメラ41に撮像指令を送出する。状態認識部52は、部品カメラ41の撮像により取得された画像データを画像処理して、複数の吸着ノズル34のそれぞれに保持された部品の姿勢(位置および角度)を認識する。
Subsequently, the state recognition unit 52 executes a process of recognizing the holding state of the parts held by the plurality of suction nozzles 34 (S22). Specifically, the control device 50 moves the mounting head 33 above the component camera 41 and sends an imaging command to the component camera 41. The state recognition unit 52 performs image processing on the image data acquired by the imaging of the component camera 41, and recognizes the posture (position and angle) of the component held by each of the plurality of suction nozzles 34.
リカバリ制御部53は、認識処理(S22)の結果に基づいて、リカバリ処理の実行が必要か否かを判定する(S23)。詳細には、リカバリ制御部53は、複数の吸着ノズル34のうち部品の吸着を試行した1以上の吸着ノズル34のそれぞれが部品を適正に保持しているかを、認識処理(S22)の結果から判定する。具体的には、リカバリ制御部53は、所定の吸着ノズル34が部品を採取していない場合、採取した部品が鉛直軸に対して傾斜している場合、部品が裏返した状態で保持されている場合などに、当該所定の吸着ノズル34による装着動作が実行不能であると判定する。
The recovery control unit 53 determines whether or not it is necessary to execute the recovery process based on the result of the recognition process (S22) (S23). Specifically, the recovery control unit 53 determines from the result of the recognition process (S22) whether or not each of the one or more suction nozzles 34 that have tried to suck the parts among the plurality of suction nozzles 34 properly holds the parts. judge. Specifically, the recovery control unit 53 holds the parts in an inverted state when the predetermined suction nozzle 34 does not collect the parts, or when the collected parts are tilted with respect to the vertical axis. In some cases, it is determined that the mounting operation by the predetermined suction nozzle 34 is infeasible.
リカバリ制御部53は、所定の吸着ノズル34に割り当てられた装着動作が実行不能であり、リカバリ処理の実行が必要と判定した場合に(S23:Yes)、当該装着動作をスキップ動作とする(S24)。詳細には、例えば、図5に示すように、8個の吸着ノズル34のうち第二および第五の吸着ノズル34による装着動作が実行不能である場合に、リカバリ制御部53は、それぞれの吸着ノズル34に割り当てられた装着位置P12,P15への装着動作をスキップ動作とする。
When the recovery control unit 53 determines that the mounting operation assigned to the predetermined suction nozzle 34 cannot be executed and it is necessary to execute the recovery process (S23: Yes), the recovery control unit 53 sets the mounting operation as the skip operation (S24). ). Specifically, for example, as shown in FIG. 5, when the mounting operation by the second and fifth suction nozzles 34 out of the eight suction nozzles 34 is infeasible, the recovery control unit 53 performs the respective suctions. The mounting operation at the mounting positions P12 and P15 assigned to the nozzle 34 is defined as a skip operation.
続いて、リカバリ制御部53は、同一のPPサイクルにおける装着動作に関する変更処理を実行する(S25)。上記の変更処理は、PPサイクルにおける複数の装着動作の少なくとも一つがスキップ動作とされた場合に、同一種類の部品を採取した他の吸着ノズル34の一つに割り当てられた装着動作の装着位置をスキップ動作の装着位置に変更する処理である。これにより、リカバリ制御部53は、例えば採取エラーが発生したPPサイクルにおいて即時にリカバリ処理を実行する。
Subsequently, the recovery control unit 53 executes a change process related to the mounting operation in the same PP cycle (S25). The above-mentioned change process sets the mounting position of the mounting operation assigned to one of the other suction nozzles 34 from which the same type of parts are collected when at least one of the plurality of mounting operations in the PP cycle is a skip operation. It is a process of changing to the mounting position of the skip operation. As a result, the recovery control unit 53 immediately executes the recovery process in the PP cycle in which the collection error occurs, for example.
上記の変更処理には、例えば下記の2種類の態様が採用され得る。第一変更処理は、図5に示すように、同一のPPサイクルにおいてスキップ動作よりも後に実行予定である装着動作の装着位置(P13,P14,P16,・・)を、それぞれの直前に実行予定である同一種類の部品の装着動作の装着位置にそれぞれ変更する。ここで、図中の○内の数値は、第一から第八までの吸着ノズル34の番号を示し、同図の上から下に向かう順番で装着動作が実行されるものとする(図6において同じ)。
For the above change process, for example, the following two types of modes can be adopted. As shown in FIG. 5, the first change process is scheduled to execute the mounting positions (P13, P14, P16, ...) Of the mounting operation scheduled to be executed after the skip operation in the same PP cycle immediately before each. Change to the mounting position of the mounting operation of the same type of parts. Here, the numerical values in ○ in the figure indicate the numbers of the suction nozzles 34 from the first to the eighth, and it is assumed that the mounting operation is executed in the order from the top to the bottom in the figure (in FIG. 6). the same).
また、第一変更処理は、同一のPPサイクルに含まれるスキップ動作の分だけ繰り返される。結果として、2以上のスキップ動作が含まれる場合には、2回目以降のスキップ動作よりも後に実行予定である装着動作の装着位置(P16-P18)は、2以上前に実行予定であった装着動作の装着位置(P14-P16)にそれぞれ変更される。上記のような第一変更処理は、制御プログラムRcにより指定される装着順序が早い装着位置に優先的に部品が装着されるようにするタイプである。
Also, the first change process is repeated for the skip operation included in the same PP cycle. As a result, when two or more skip operations are included, the mounting position (P16-P18) of the mounting operation scheduled to be executed after the second and subsequent skip operations is the mounting scheduled to be executed two or more times before. It is changed to the mounting position (P14-P16) of the operation. The first change process as described above is a type in which the parts are preferentially mounted at the mounting position in which the mounting order is earlier specified by the control program Rc.
第二変更処理は、図6に示すように、同一のPPサイクルにおいてスキップ動作よりも後に実行予定である装着動作のうち最後に実行予定である同一種類の部品の装着動作の装着位置(P17,P18)および装着順序をスキップ動作の装着位置(P12,P15)および装着順序に変更する変更処理を実行する。なお、同一のPPサイクルに2以上のスキップ動作が含まれる場合に、上記の「最後に実行予定」は、上記のように末尾から2回分の装着動作の実行予定に相当する。上記のような第二変更処理は、制御プログラムRcにより指定される装着順序が維持されることを優先して部品が装着されるようにするタイプである。
As shown in FIG. 6, the second change process is the mounting position (P17, P17,) of the mounting operation of the same type of component that is scheduled to be executed last among the mounting operations scheduled to be executed after the skip operation in the same PP cycle. P18) and the change process for changing the mounting order to the mounting position (P12, P15) and the mounting order of the skip operation are executed. When two or more skip operations are included in the same PP cycle, the above-mentioned "last execution schedule" corresponds to the execution schedule of the mounting operation for two times from the end as described above. The second change process as described above is a type in which parts are mounted with priority given to maintaining the mounting order specified by the control program Rc.
ここで、第一変更処理および第二変更処理によると、制御プログラムRcに基づいて部品を装着される単位基板91が連続である場合には、スキップ動作が発生したとしても部品を装着される単位基板91を連続させることができる。また、第一変更処理は、同一のPPサイクルにおいて装着動作に用いられる吸着ノズル34の順序を維持することができる。よって、第一変更処理は、ロータリヘッド35を有する装着ヘッド33(図2Aを参照)のように複数の吸着ノズル34を昇降位置に順次割り出す構成に適用されると特に有用である。
Here, according to the first change process and the second change process, when the unit board 91 on which the component is mounted is continuous based on the control program Rc, the unit on which the component is mounted even if the skip operation occurs. The substrate 91 can be made continuous. In addition, the first change process can maintain the order of the suction nozzles 34 used for the mounting operation in the same PP cycle. Therefore, the first change process is particularly useful when applied to a configuration in which a plurality of suction nozzles 34 are sequentially indexed to an elevating position, such as a mounting head 33 having a rotary head 35 (see FIG. 2A).
また、第二変更処理は、装着位置の変更数を最小にすることができる。これにより、例えば最適化された制御プログラムRcによって指定されるそれぞれの吸着ノズル34ごとの装着動作をなるべく維持させることができる。よって、第二変更処理は、複数の吸着ノズル34を直線状に配列された装着ヘッド33(図2Bを参照)のように複数の吸着ノズル34を独立して昇降可能な構成に適用されると特に有用である。
In addition, the second change process can minimize the number of changes in the mounting position. Thereby, for example, the mounting operation of each suction nozzle 34 specified by the optimized control program Rc can be maintained as much as possible. Therefore, the second change process is applied to a configuration in which a plurality of suction nozzles 34 can be independently moved up and down, such as a mounting head 33 (see FIG. 2B) in which a plurality of suction nozzles 34 are linearly arranged. Especially useful.
なお、第二変更処理では、装着位置および装着順序の両方を変更する構成としたが、例えば装着位置のみ変更し、装着順序については変更しない態様を採用してもよい。つまり、リカバリ制御部53は、スキップ動作と関係のない第一、第三、第四、および第六の吸着ノズル34を用いて、装着位置(P11,P13,P14,P16)への装着動作を先に行う。そして、リカバリ制御部53は、第七および第八の吸着ノズル34を用いて、変更対象である装着位置(P12,P15)への装着動作を後から行う。
In the second change process, both the mounting position and the mounting order are changed, but for example, only the mounting position may be changed and the mounting order may not be changed. That is, the recovery control unit 53 uses the first, third, fourth, and sixth suction nozzles 34, which are not related to the skip operation, to perform the mounting operation at the mounting position (P11, P13, P14, P16). Do it first. Then, the recovery control unit 53 uses the seventh and eighth suction nozzles 34 to perform the mounting operation at the mounting positions (P12, P15) to be changed later.
上記のように変更処理(S25)は、装着ヘッド33の機械構成や1回のPPサイクルにおける装着位置に応じて、何れの態様を適用するかによって生産効率が変動し得る。そこで、リカバリ制御部53は、第一変更処理および第二変更処理をそれぞれ適用したPPサイクルの所要時間が短くなる変更処理を選択して実行してもよい。このような構成によると、リカバリ処理(装着位置の変更処理)の実行に伴う生産効率の低下を抑制できる。
As described above, in the change process (S25), the production efficiency may vary depending on which mode is applied according to the mechanical configuration of the mounting head 33 and the mounting position in one PP cycle. Therefore, the recovery control unit 53 may select and execute a change process that shortens the required time of the PP cycle to which the first change process and the second change process are applied, respectively. According to such a configuration, it is possible to suppress a decrease in production efficiency due to execution of recovery processing (mounting position change processing).
ここで、リカバリ制御部53は、変更処理を実行した場合には、今回のPPサイクルにおいて実行予定であったが、装着位置の変更に伴って部品を装着されなかった装着位置(上記の例における装着位置P17,P18)について、後に補完処理が必要であると設定する。続いて、制御装置50は、変更処理(S25)が実行された後に、またはリカバリ処理の実行が不要と判定された場合に(S23:No)、複数の吸着ノズル34を用いて部品を装着する装着動作を繰り返し実行する(S26)。なお、この装着動作(S26)では、後述する補完処理の設定がなされている場合には、当該補完処理の態様に準じた動作を行う。
Here, when the change process is executed, the recovery control unit 53 was scheduled to be executed in this PP cycle, but the mounting position where the parts were not mounted due to the change in the mounting position (in the above example). Regarding the mounting positions P17 and P18), it is set that complementary processing is required later. Subsequently, the control device 50 mounts the component using the plurality of suction nozzles 34 after the change process (S25) is executed or when it is determined that the recovery process does not need to be executed (S23: No). The mounting operation is repeatedly executed (S26). In this mounting operation (S26), when the complement processing described later is set, the operation is performed according to the mode of the complement processing.
続いて、リカバリ制御部53は、補完処理の設定が必要であるか否かを判定する(S27)。詳細には、リカバリ制御部53は、今回の装着処理において変更処理(S25)が実行された場合には、補完処理の設定が必要であると判定する(S27:Yes)。補完処理とは、以前のPPサイクルにおいて装着位置の変更に伴って部品を装着されなかった装着位置に部品を装着する処理である。補完処理の設定(S28)では、以降のPPサイクルにおいて実行する補完処理の態様を設定する。上記の補完処理には、例えば下記の2種類の態様が採用され得る。
Subsequently, the recovery control unit 53 determines whether or not it is necessary to set the complementary process (S27). Specifically, the recovery control unit 53 determines that it is necessary to set the complementary process when the change process (S25) is executed in the current mounting process (S27: Yes). The complementary process is a process of mounting a component at a mounting position where the component was not mounted due to a change in the mounting position in the previous PP cycle. In the setting of the complement process (S28), the mode of the complement process to be executed in the subsequent PP cycle is set. For the above complementary processing, for example, the following two types of modes can be adopted.
第一補完処理は、図7に示すように、所定のPPサイクルにおいて装着位置の変更処理(S25)を実行した場合に、以降に実行予定のPPサイクルにおいてスキップ動作と同一種類の部品の装着動作の装着位置を、それぞれの直前に実行予定である同一種類の部品の装着動作の装着位置にそれぞれ変更する。具体的には、第N回のPPサイクルにおいて2つのスキップ動作が発生し、装着位置の変更によって装着位置P17,P18が補完対象となったとする。なお、装着位置P17,P18には、部品種Aを装着することが指定されているものとする。
As shown in FIG. 7, in the first complementary process, when the mounting position change process (S25) is executed in a predetermined PP cycle, a component mounting operation of the same type as the skip operation is performed in the PP cycle scheduled to be executed thereafter. The mounting position of is changed to the mounting position of the mounting operation of the same type of parts scheduled to be executed immediately before each. Specifically, it is assumed that two skip operations occur in the Nth PP cycle, and the mounting positions P17 and P18 are complemented by changing the mounting position. It is assumed that the part type A is specified to be mounted at the mounting positions P17 and P18.
この場合に、第N+1回のPPサイクルにおいてスキップ動作と同一種類(部品種A)の部品の装着動作の装着位置(図7の装着位置P22-P26)を、それぞれ直前に実行予定である同一種類の部品の装着動作の装着位置(図7の装着位置P17,P18,P22-P24)に変更する。さらに、リカバリ制御部53は、補完処理を実行した場合には、今回の第N+1回のPPサイクルにおいて実行予定であったが、装着位置の変更に伴って部品を装着されなかった装着位置(上記の例における装着位置P25,P26)について、後に補完処理が必要であると設定する。
In this case, in the N + 1th PP cycle, the mounting position (mounting position P22-P26 in FIG. 7) of the component mounting operation of the same type (part type A) as the skip operation is set to the same type scheduled to be executed immediately before each. It is changed to the mounting position (mounting positions P17, P18, P22-P24 in FIG. 7) of the mounting operation of the parts of. Further, when the complement processing is executed, the recovery control unit 53 is scheduled to be executed in the N + 1th PP cycle of this time, but the mounting position where the parts are not mounted due to the change of the mounting position (the above). Regarding the mounting positions P25 and P26) in the example of the above, it is set that complementary processing is required later.
なお、第N+1回のPPサイクルにおいてスキップ動作と異なる種類(部品種B,C)の部品の装着動作の装着位置および装着順序は変更されない。第N+2回以降のPPサイクルでは、上記と同様に同一種類(部品種A)に関する装着位置がそれぞれ変更される。また、リカバリ制御部53は、最終のPPサイクルにおいて、スキップ動作の数に応じた採取動作および装着動作(図7の装着位置Pe-1,Peへの装着動作)を追加してもよいし、トレイ25上の部品の残数が0であれば当該採取動作および装着動作を省略してもよい。
In the N + 1th PP cycle, the mounting position and mounting order of the mounting operation of parts of different types (part types B and C) from the skip operation are not changed. In the N + 2nd and subsequent PP cycles, the mounting positions for the same type (part type A) are changed in the same manner as described above. Further, the recovery control unit 53 may add a collection operation and a mounting operation (mounting operation to the mounting positions Pe-1 and Pe in FIG. 7) according to the number of skip operations in the final PP cycle. If the remaining number of parts on the tray 25 is 0, the collecting operation and the mounting operation may be omitted.
第二補完処理は、図8に示すように、所定のPPサイクルにおいて装着位置の変更処理(S25)を実行した場合に、以降に実行予定のPPサイクルの前に、所定のPPサイクルに含まれたスキップ動作の数の部品の採取動作および装着位置の変更に伴って未装着となった装着位置への装着動作を実行する。具体的には、第N回のPPサイクルにおいて2つのスキップ動作が発生し、装着位置の変更によって装着位置P17,P18が補完対象となったとする。
As shown in FIG. 8, the second complementary process is included in the predetermined PP cycle before the PP cycle scheduled to be executed thereafter when the mounting position change process (S25) is executed in the predetermined PP cycle. The number of parts to be skipped is collected, and the mounting operation to the mounting position that has not been mounted due to the change of the mounting position is executed. Specifically, it is assumed that two skip operations occur in the Nth PP cycle, and the mounting positions P17 and P18 are complemented by changing the mounting position.
この場合に、実行予定の第N+1回のPPサイクルの前に、第N回のPPサイクルに含まれたスキップ動作の数の部品の採取動作(部品種Aの採取動作)、および装着位置の変更に伴って未装着となった装着位置P17,P18への装着動作を実行する。これにより、第N+1回以降のPPサイクルは、新たなスキップ動作が発生しない限りは、制御プログラムRcにより指示された装着動作となる。
In this case, before the N + 1th PP cycle to be executed, the number of parts to be picked up (the part type A is to be picked up) and the mounting position are changed, which is the number of skipping operations included in the Nth PP cycle. The mounting operation to the mounting positions P17 and P18, which have not been mounted in accordance with the above, is executed. As a result, the PP cycle after the N + 1th time becomes the mounting operation instructed by the control program Rc unless a new skip operation occurs.
ここで、第一補完処理によると、新たなPPサイクルを追加することなく補完することが可能であり、またスキップ動作が発生したPPサイクル以降のPPサイクルにおいて装着動作に用いられる吸着ノズル34の順序を維持することができる。よって、装着ヘッド33がロータリヘッド35を有する構成の場合に、生産効率の低下を特に抑制することができる。また、第二補完処理によると、スキップ動作が発生したPPサイクル以降のPPサイクルに対する変更処理および補完処理の影響を防止できる。これにより、これにより、例えば最適化された制御プログラムRcに基づく制御を維持させることができる。
Here, according to the first complement processing, it is possible to complement without adding a new PP cycle, and the order of the suction nozzles 34 used for the mounting operation in the PP cycle after the PP cycle in which the skip operation occurs. Can be maintained. Therefore, when the mounting head 33 has the rotary head 35, a decrease in production efficiency can be particularly suppressed. Further, according to the second complement processing, it is possible to prevent the influence of the change processing and the complement processing on the PP cycle after the PP cycle in which the skip operation occurs. Thereby, for example, control based on the optimized control program Rc can be maintained.
ここで、装着ヘッド33の機械構成や複数のPPサイクルにおける吸着ノズル34の位置に応じて何れの態様を設定するかによって、生産効率などが変動し得る。そこで、リカバリ制御部53は、第一補完処理や第二補完処理の各種態様を生産効率や品質の観点から切り換えて適宜選択してもよい。ここで、装着位置の変更処理が実行された所定のPPサイクルより後に実行予定の1以上のPPサイクルを予定PPサイクル群Gcとする(図7および図8を参照)。次に、リカバリ制御部53は、第一補完処理および第二補完処理を予定PPサイクル群Gcに別個に適用した場合の予定PPサイクル群Gcの所要時間が短くなる補完処理を選択して実行する。
Here, the production efficiency and the like may vary depending on which mode is set according to the mechanical configuration of the mounting head 33 and the position of the suction nozzle 34 in a plurality of PP cycles. Therefore, the recovery control unit 53 may switch various modes of the first complement processing and the second complement processing from the viewpoint of production efficiency and quality and appropriately select them. Here, one or more PP cycles scheduled to be executed after the predetermined PP cycle in which the mounting position change process is executed are designated as the scheduled PP cycle group Gc (see FIGS. 7 and 8). Next, the recovery control unit 53 selects and executes a complement process that shortens the required time of the scheduled PP cycle group Gc when the first complement process and the second complement process are separately applied to the scheduled PP cycle group Gc. ..
このような構成によると、リカバリ処理(装着位置の変更処理)の補完処理の実行に伴う生産効率の低下を抑制できる。また、リカバリ制御部53は、補完処理を開始した後に再度のスキップ動作が発生した場合には、改めて各種態様を切り換えてもよい。例えば、1回の装着処理におけるスキップ動作の発生数が所定値以下の場合には、新たなPPサイクルを追加することなく補完可能な第一補完処理を選択し、後のスキップ動作の増加に伴い新たなPPサイクルを追加する第二補完処理を選択するようにしてもよい。
According to such a configuration, it is possible to suppress a decrease in production efficiency due to execution of complementary processing of recovery processing (mounting position change processing). Further, the recovery control unit 53 may switch various modes again when the skip operation occurs again after starting the complement processing. For example, when the number of skip operations generated in one mounting process is less than or equal to a predetermined value, the first complementary process that can be complemented without adding a new PP cycle is selected, and as the number of subsequent skip operations increases. The second complementary process that adds a new PP cycle may be selected.
上記のようにリカバリ制御部53が補完処理を設定すると(S28)、以降のPPサイクルにおける採取動作(S21)や装着動作(S26)に補完処理の設定内容が反映される。具体的には、例えば第一補完処理が選択されると以降のPPサイクルにおける装着位置が適宜変更され、例えば第二補完処理が選択されると実行予定の次のPPサイクルの前に追加のPPサイクルが挿入される。なお、追加のPPサイクルでも通常のPPサイクルと同様に保持状態の認識処理(S22)やリカバリ処理の要否判定(S23)、さらなる補完処理の要否判定(S27)が実行される。
When the recovery control unit 53 sets the complement processing as described above (S28), the setting contents of the complement processing are reflected in the collection operation (S21) and the mounting operation (S26) in the subsequent PP cycle. Specifically, for example, when the first complementary process is selected, the mounting position in the subsequent PP cycle is appropriately changed, and when the second complementary process is selected, for example, an additional PP is added before the next PP cycle to be executed. The cycle is inserted. In the additional PP cycle, the holding state recognition process (S22), the necessity determination of the recovery process (S23), and the necessity determination of the further complementary process (S27) are executed in the same manner as in the normal PP cycle.
制御装置50は、制御プログラムRcおよび装着実態に基づいて、全てのPPサイクルが終了したか否かを判定する(S12)。全てのPPサイクルが終了していない場合には(S12:No)、制御装置50は、PPサイクル(S20)を繰り返し実行する。全てのPPサイクルが終了した場合に(S12:Yes)、制御装置50は、基板90の搬出処理を実行する(S13)。基板90の搬出処理において、基板搬送装置10は、位置決めされていた基板90をアンクランプするとともに、部品装着機1の機外に基板90を搬出する。
The control device 50 determines whether or not all the PP cycles have been completed based on the control program Rc and the actual mounting condition (S12). If all the PP cycles have not been completed (S12: No), the control device 50 repeatedly executes the PP cycles (S20). When all the PP cycles are completed (S12: Yes), the control device 50 executes the unloading process of the substrate 90 (S13). In the unloading process of the substrate 90, the substrate transport device 10 unclamps the positioned substrate 90 and unloads the substrate 90 out of the component mounting machine 1.
上記のような装着処理によると、一部の装着動作が実行不能となってリカバリ処理が必要となった実行中のPPサイクルにおいて、装着位置の変更処理(S25)が実行される。これにより、次回以降のPPサイクルが実行される前に、即時にリカバリ処理が実行される。よって、同一種類の部品を複数装着する所定のPPサイクルにおいて、スキップ動作の装着位置への装着が優先される。複数の装着位置に対する装着順序が所要時間により影響する種類の基板製品の生産においては、当該生産の効率化を図ることができる。
According to the mounting process as described above, the mounting position change process (S25) is executed in the executing PP cycle in which a part of the mounting operation becomes infeasible and recovery processing is required. As a result, the recovery process is immediately executed before the next and subsequent PP cycles are executed. Therefore, in a predetermined PP cycle in which a plurality of parts of the same type are mounted, priority is given to mounting the skip operation at the mounting position. In the production of a type of substrate product in which the mounting order for a plurality of mounting positions is affected by the required time, the efficiency of the production can be improved.
5.多面取り基板を用いた生産処理
部品装着機1による装着処理を含む多面取り基板を用いた生産処理について図3および図9を参照して説明する。具体的には、生産ラインにおいて、図9に示すように、先ず印刷機により基板90の上面にはんだが印刷される(S11)。次に、1以上の部品装着機1により装着処理を実行される(S12)。これにより、基板90の上面には多数の部品が装着される。なお、上記の装着処理(S12)では、必要に応じてリカバリ処理が実行され得る。 5. Production processing using a multi-chamfered substrate A production process using a multi-chamfered substrate including a mounting process by thecomponent mounting machine 1 will be described with reference to FIGS. 3 and 9. Specifically, in the production line, as shown in FIG. 9, first, solder is printed on the upper surface of the substrate 90 by a printing machine (S11). Next, the mounting process is executed by one or more component mounting machines 1 (S12). As a result, a large number of components are mounted on the upper surface of the substrate 90. In the above mounting process (S12), a recovery process can be executed as needed.
部品装着機1による装着処理を含む多面取り基板を用いた生産処理について図3および図9を参照して説明する。具体的には、生産ラインにおいて、図9に示すように、先ず印刷機により基板90の上面にはんだが印刷される(S11)。次に、1以上の部品装着機1により装着処理を実行される(S12)。これにより、基板90の上面には多数の部品が装着される。なお、上記の装着処理(S12)では、必要に応じてリカバリ処理が実行され得る。 5. Production processing using a multi-chamfered substrate A production process using a multi-chamfered substrate including a mounting process by the
ここで、所定の装着実態に基づいて装着処理が実行されると、複数の単位基板91のうち一部にのみ部品が装着されることがある。このような場合に、基板90は、装着処理(S12)の実行後に、マーキング処理を実行される(S13)。マーキング処理は、例えば部品が未装着の単位基板91にインクを塗布することにより、当該単位基板91を視認可能にするものである。これにより、部品装着機1より下流側において別の部品装着機1による装着処理や、検査装置による検査処理が部品未装着の単位基板91に対して実行されることを防止できる。
Here, if the mounting process is executed based on the predetermined mounting actual condition, the parts may be mounted only on a part of the plurality of unit boards 91. In such a case, the substrate 90 is subjected to a marking process (S13) after the mounting process (S12) is executed. The marking process makes the unit substrate 91 visible, for example, by applying ink to the unit substrate 91 on which no component is mounted. As a result, it is possible to prevent the mounting process by another component mounting machine 1 and the inspection process by the inspection device from being executed on the unit board 91 on which the component is not mounted on the downstream side of the component mounting machine 1.
また、マーキング処理は、多面取り基板である基板90において部品が装着された複数の単位基板91が占める領域と、部品が未装着である複数の単位基板91が占める領域とが区分可能であれば、図3に示すように各領域を区分する区分ライン95を付してもよい。これにより、マーキング処理は、部品を装着された単位基板91と、部品が未装着の単位基板91とを視認可能に区分する。なお、マーキング処理は、部品装着機1または他の対基板作業機が備える機能により実行される。
Further, in the marking process, if the area occupied by the plurality of unit boards 91 on which the components are mounted and the area occupied by the plurality of unit boards 91 on which the components are not mounted can be classified in the board 90 which is a multi-chamfered board. , A division line 95 for dividing each region may be attached as shown in FIG. As a result, the marking process visually classifies the unit board 91 on which the component is mounted and the unit board 91 on which the component is not mounted. The marking process is executed by a function provided in the component mounting machine 1 or another board-to-board working machine.
続いて、基板90は、リフロー炉によりリフロー処理を実行される(S14)。これにより、基板90は、加熱によりはんだを溶融されてはんだ付けされた状態とされる。そして、基板90は、装着処理(S12)、マーキング処理(S13)、およびリフロー処理(S14)の実行後に、表面を樹脂材料によりコーティングするモールド処理を実行され(S15)。上記のモールド処理は、例えばモールド型の内部に基板90に収容し、溶解した樹脂を充填することによりモールド成形する処理である。
Subsequently, the substrate 90 is subjected to a reflow process by the reflow furnace (S14). As a result, the substrate 90 is in a state where the solder is melted by heating and soldered. Then, after executing the mounting process (S12), the marking process (S13), and the reflow process (S14), the substrate 90 is subjected to a molding process of coating the surface with a resin material (S15). The above-mentioned molding process is, for example, a process in which a substrate 90 is housed inside a mold and filled with a melted resin to form a mold.
最後に、多面取り基板である基板90は、分割処理を実行される(S16)。これにより、複数の単位基板91が個々の基板製品とされる。なお、分割処理では、マーキング処理(S13)によりマークを付された部品未装着の単位基板91と、部品が正常に装着されて基板製品となり得る単位基板91とを仕分けされる。
Finally, the substrate 90, which is a multi-chamfered substrate, is subjected to a division process (S16). As a result, the plurality of unit substrates 91 are made into individual substrate products. In the division process, the unit board 91 on which the parts are not mounted and which is marked by the marking process (S13) and the unit board 91 on which the parts are normally mounted and can be a board product are sorted.
上記のような生産処理の装着処理(S12)において、例えば採取エラーの発生によりスキップ動作が発生した場合に、上記のようなリカバリ処理が適宜実行されることにより、基板90には、制御プログラムRcにより指令される装着順序の一部がスキップされることなく部品が装着される。このように基板90において複数の部品が連続的に配置され、製品化できない単位基板91が不連続で発生することが防止される。
In the mounting process (S12) of the production process as described above, for example, when a skip operation occurs due to the occurrence of a collection error, the recovery process as described above is appropriately executed, so that the control program Rc is applied to the substrate 90. Parts are mounted without skipping part of the mounting sequence commanded by. In this way, a plurality of components are continuously arranged on the substrate 90, and the unit substrate 91 that cannot be commercialized is prevented from being discontinuously generated.
これにより、マーキング処理では製品化可能な単位基板91が連続する領域と、製品化できない単位基板91が連続で発生する領域とに大別するように、例えば区分ライン95を付すことができる。よって、マーキング処理が簡易となり、生産性を向上できる。製品化可能な単位基板91と製品化できない単位基板91が大別されるため、分割処理(S16)およびその後の仕分け処理の簡易化を図ることができる。
As a result, for example, a division line 95 can be attached so as to be roughly divided into an area in which the unit substrate 91 that can be commercialized is continuous and an area in which the unit substrate 91 that cannot be commercialized is continuously generated in the marking process. Therefore, the marking process is simplified and the productivity can be improved. Since the unit substrate 91 that can be commercialized and the unit substrate 91 that cannot be commercialized are roughly classified, the division process (S16) and the subsequent sorting process can be simplified.
ところで、スキップ動作の発生により部品を装着されなかった単位基板91に対してリカバリ処理が実行されないと、当該単位基板91には周囲の単位基板91よりも装着されている部品数が少なくなる。このような製品化できない単位基板91が不連続で存在すると、モールド処理(S15)において基板90の表面に塗布された樹脂材料が均一とならず、コーティングの品質を低下させる要因となる。これに対して、上記のような構成によって製品化可能な単位基板91と製品化できない単位基板91が大別されると、連続する製品化可能な複数の単位基板91に樹脂材料を好適に塗布することが可能となり、モールド処理の品質を向上できる。
By the way, if the recovery process is not executed for the unit board 91 to which the parts are not mounted due to the occurrence of the skip operation, the number of parts mounted on the unit board 91 is smaller than that of the surrounding unit boards 91. If such a unit substrate 91 that cannot be commercialized exists discontinuously, the resin material applied to the surface of the substrate 90 in the molding process (S15) becomes not uniform, which causes a factor of lowering the coating quality. On the other hand, when the unit substrate 91 that can be commercialized and the unit substrate 91 that cannot be commercialized are roughly classified according to the above configuration, the resin material is suitably applied to a plurality of unit substrates 91 that can be continuously commercialized. The quality of the molding process can be improved.
6.実施形態の変形態様
6-1.部品装着機1の構成
実施形態において、部品装着機1は、1つの装着ヘッド33を備える構成とした。これに対して、部品装着機1は、互いに独立して動作可能な複数の装着ヘッド33を備える構成としてもよい。具体的には、図10に示すように、部品装着機101は、互いに独立して1以上の吸着ノズル34を水平方向にそれぞれ移動させる第一装着ヘッド137および第二装着ヘッド138を備える。 6. Modifications of the Embodiment 6-1. Configuration ofcomponent mounting machine 1 In the embodiment, the component mounting machine 1 is configured to include one mounting head 33. On the other hand, the component mounting machine 1 may be configured to include a plurality of mounting heads 33 that can operate independently of each other. Specifically, as shown in FIG. 10, the component mounting machine 101 includes a first mounting head 137 and a second mounting head 138 that move one or more suction nozzles 34 in the horizontal direction independently of each other.
6-1.部品装着機1の構成
実施形態において、部品装着機1は、1つの装着ヘッド33を備える構成とした。これに対して、部品装着機1は、互いに独立して動作可能な複数の装着ヘッド33を備える構成としてもよい。具体的には、図10に示すように、部品装着機101は、互いに独立して1以上の吸着ノズル34を水平方向にそれぞれ移動させる第一装着ヘッド137および第二装着ヘッド138を備える。 6. Modifications of the Embodiment 6-1. Configuration of
第一装着ヘッド137および第二装着ヘッド138は、部品装着機1の機内において互いの可動範囲が重複するように構成され、1枚の基板90に対して装着動作を実行することができる。第一装着ヘッド137は、装着処理に用いられる複数の吸着ノズル34のうち一部(例えば、8本中4本)を支持する。第二装着ヘッド138は、複数の吸着ノズル34のうち残りの一部(例えば、8本中4本)を支持する。
The first mounting head 137 and the second mounting head 138 are configured so that their movable ranges overlap each other in the component mounting machine 1, and the mounting operation can be executed on one board 90. The first mounting head 137 supports a part (for example, 4 out of 8) of the plurality of suction nozzles 34 used in the mounting process. The second mounting head 138 supports the remaining part (for example, 4 out of 8) of the plurality of suction nozzles 34.
そして、装着処理において、第一装着ヘッド137は、例えば第二装着ヘッド138を用いた基板90に対する部品の装着動作が実行されている期間において、部品の採取処理に用いられるとともに部品の保持状態の認識処理を実行される。そして、第二装着ヘッド138は、採取した部品についての装着動作を終了した後に、部品を採取するために基板90の上方から部品供給装置20の上方へと移動する。
Then, in the mounting process, the first mounting head 137 is used for the component sampling process and in the holding state of the component during the period in which the component mounting operation on the substrate 90 using the second mounting head 138 is executed. Recognition processing is executed. Then, the second mounting head 138 moves from above the substrate 90 to above the component supply device 20 in order to sample the component after the mounting operation for the sampled component is completed.
このように複数の装着ヘッド(第一装着ヘッド137、第二装着ヘッド138)を用いた装着処理では、例えば第一装着ヘッド137と第二装着ヘッド138が交互の部品の採取動作と装着動作とを繰り返す。従って、本実施形態において、1回のPPサイクルとは、第一装着ヘッド137を用いた採取動作が開始されてから第一装着ヘッド137を用いた装着動作に並行して実行される第二装着ヘッド138を用いた採取動作および装着動作が終了するまでの動作であるものとする。
In the mounting process using a plurality of mounting heads (first mounting head 137, second mounting head 138), for example, the first mounting head 137 and the second mounting head 138 alternately perform a component collection operation and a mounting operation. repeat. Therefore, in the present embodiment, one PP cycle is a second mounting that is executed in parallel with the mounting operation using the first mounting head 137 after the collection operation using the first mounting head 137 is started. It is assumed that it is an operation until the collection operation and the mounting operation using the head 138 are completed.
上記のような構成による装着処理において、例えば第一装着ヘッド137を用いた採取動作を行った後に、部品の保持状態の認識処理で採取エラーが発生したとする。このような場合において、制御装置50は、採取エラーに係る装着動作をスキップ動作とする。このとき、第一装着ヘッド137が複数の吸着ノズル34を支持し、且つ採取エラーに係る部品と同一種類の部品を他の吸着ノズル34が採取している場合には、制御装置50は、実施形態にて例示したように同一のPPサイクルで他の吸着ノズル34を用いたリカバリ処理を実行してもよい。
In the mounting process with the above configuration, for example, it is assumed that a sampling error occurs in the component holding state recognition process after performing the sampling operation using the first mounting head 137. In such a case, the control device 50 sets the mounting operation related to the collection error as a skip operation. At this time, when the first mounting head 137 supports a plurality of suction nozzles 34 and another suction nozzle 34 collects a part of the same type as the part related to the collection error, the control device 50 implements the operation. As illustrated in the embodiment, the recovery process using another suction nozzle 34 may be executed in the same PP cycle.
さらに、上記のような状況において、制御装置50は、第一装着ヘッド137を用いた装着動作に並行して、第二装着ヘッド138を用いて上記の採取エラーに係る部品を採取するように設定し、同一のPPサイクルにおいて第二装着ヘッド138を用いたリカバリ処理を実行してもよい。このとき、第二装着ヘッド138を用いた装着動作に係る装着位置を変更する変更処理が実行され、さらに以降のPPサイクルにおいて補完処理が適宜実行される。上記の変更処理および補完処理には、実施形態にて例示した態様を適用することができる。
Further, in the above situation, the control device 50 is set to collect the parts related to the above collection error using the second mounting head 138 in parallel with the mounting operation using the first mounting head 137. Then, the recovery process using the second mounting head 138 may be executed in the same PP cycle. At this time, a change process for changing the mounting position related to the mounting operation using the second mounting head 138 is executed, and further, a complementary process is appropriately executed in the subsequent PP cycle. The embodiments exemplified in the embodiment can be applied to the above-mentioned change processing and complement processing.
6-2.リカバリ処理について
実施形態において、装着位置の変更処理では制御プログラムRcにより指令される装着順序が先の装着位置が優先するものとした。これに対して、装着位置の変更処理は、種々の事項を優先するようにしてもよい。例えば、基板90が実施形態と同様に多面取り基板である場合に、製品化可能な単位基板91が基板90の搬送方向の上流側や下流側、部品装着機1の前側や後側の領域で連続となることが優先されるように、装着位置を変更してもよい。 6-2. Recovery processing In the embodiment, in the mounting position change processing, the mounting order instructed by the control program Rc is prioritized by the mounting position first. On the other hand, in the process of changing the mounting position, various matters may be prioritized. For example, when thesubstrate 90 is a multi-chamfered substrate as in the embodiment, the unit substrate 91 that can be commercialized is located on the upstream side or the downstream side of the substrate 90 in the transport direction, or in the front side or the rear side region of the component mounting machine 1. The mounting position may be changed so that continuity is prioritized.
実施形態において、装着位置の変更処理では制御プログラムRcにより指令される装着順序が先の装着位置が優先するものとした。これに対して、装着位置の変更処理は、種々の事項を優先するようにしてもよい。例えば、基板90が実施形態と同様に多面取り基板である場合に、製品化可能な単位基板91が基板90の搬送方向の上流側や下流側、部品装着機1の前側や後側の領域で連続となることが優先されるように、装着位置を変更してもよい。 6-2. Recovery processing In the embodiment, in the mounting position change processing, the mounting order instructed by the control program Rc is prioritized by the mounting position first. On the other hand, in the process of changing the mounting position, various matters may be prioritized. For example, when the
6-3.その他
実施形態において、基板製品の生産処理ではマーキング処理やモールド処理が含まれるものとした。マーキング処理は、複数の部品装着機1の間に設置される装置において実行される他、部品装着機1の機内において実行されることもある。また、マーキング処理やモールド処理は、基板製品の生産処理に含まれないこともある。 6-3. In other embodiments, the production processing of the substrate product includes marking processing and molding processing. The marking process is executed in a device installed between the plurality ofcomponent mounting machines 1, and may also be executed in the machine of the component mounting machine 1. In addition, the marking process and the molding process may not be included in the production process of the substrate product.
実施形態において、基板製品の生産処理ではマーキング処理やモールド処理が含まれるものとした。マーキング処理は、複数の部品装着機1の間に設置される装置において実行される他、部品装着機1の機内において実行されることもある。また、マーキング処理やモールド処理は、基板製品の生産処理に含まれないこともある。 6-3. In other embodiments, the production processing of the substrate product includes marking processing and molding processing. The marking process is executed in a device installed between the plurality of
実施形態において、基板製品の生産に用いられる基板90は、複数の単位基板91により構成される多面取り基板であるものとした。これに対して、基板90は、多面取り基板以外の汎用的な基板であってもよい。このような構成において、複数回に亘ってPPサイクルが実行され、且つ同一のPPサイクルにおいて同一種類の部品が複数装着される場合には、実施形態において例示したようにリカバリ処理を実行する装着処理を適用することができる。このような構成において実施形態と同様の効果を奏する。
In the embodiment, the substrate 90 used for producing the substrate product is a multi-chamfered substrate composed of a plurality of unit substrates 91. On the other hand, the substrate 90 may be a general-purpose substrate other than the multi-chamfered substrate. In such a configuration, when the PP cycle is executed a plurality of times and a plurality of parts of the same type are mounted in the same PP cycle, the mounting process for executing the recovery process as illustrated in the embodiment is performed. Can be applied. In such a configuration, the same effect as that of the embodiment is obtained.
1:部品装着機、 30:部品移載装置、 33:装着ヘッド、 137:第一装着ヘッド、 138:第二装着ヘッド、 34:吸着ノズル、 50:制御装置、 51:記憶装置、 52:状態認識部、 53:リカバリ制御部、 81:部品、 90:基板(多面取り基板)、 91:単位基板、 92:識別コード、 93:基準マーク、 95:区分ライン、 Rc:制御プログラム、 Gc:予定PPサイクル群
1: Parts mounting machine, 30: Parts transfer device, 33: Mounting head, 137: First mounting head, 138: Second mounting head, 34: Suction nozzle, 50: Control device, 51: Storage device, 52: Status Recognition unit, 53: Recovery control unit, 81: Parts, 90: Board (multi-chamfered board), 91: Unit board, 92: Identification code, 93: Reference mark, 95: Classification line, Rc: Control program, Gc: Schedule PP cycle group
Claims (13)
- 採取した部品を保持する複数の保持部材と、
複数の前記保持部材のそれぞれに保持された前記部品の保持状態の認識処理を実行する状態認識部と、
前記部品の装着位置および装着順序を示す制御プログラム、並びに前記認識処理の結果に基づいて、前記部品の採取動作および装着動作が含まれるピックアンドプレースサイクル(以下、「PPサイクル」)を繰り返し実行する制御装置と、を備え、
複数の前記保持部材には、複数回に亘り実行される前記PPサイクルのうち少なくとも1回の前記PPサイクルにおいて同一種類の前記部品の採取動作および装着動作がそれぞれ割り当てられ、
前記制御装置は、前記認識処理の結果に基づいて所定の前記保持部材に割り当てられた装着動作が実行不能であると判定した場合に、当該装着動作をスキップ動作とするとともに、前記スキップ動作と同一の前記PPサイクルにおける採取動作により同一種類の前記部品を採取した他の前記保持部材の一つに割り当てられた装着動作の前記装着位置を前記スキップ動作の前記装着位置に変更する変更処理を実行する、部品装着機。 Multiple holding members that hold the collected parts,
A state recognition unit that executes a process of recognizing the holding state of the parts held by each of the plurality of holding members, and
Based on the control program indicating the mounting position and mounting order of the parts and the result of the recognition process, the pick-and-place cycle (hereinafter, “PP cycle”) including the picking operation and the mounting operation of the parts is repeatedly executed. Equipped with a control device,
The plurality of holding members are assigned the collecting operation and the mounting operation of the same type of parts in at least one of the PP cycles executed over a plurality of times.
When the control device determines that the mounting operation assigned to the predetermined holding member is infeasible based on the result of the recognition process, the control device sets the mounting operation as a skip operation and is the same as the skip operation. The change process of changing the mounting position of the mounting operation assigned to one of the other holding members from which the parts of the same type were sampled by the collecting operation in the PP cycle to the mounting position of the skip operation is executed. , Parts mounting machine. - 前記制御装置は、前記PPサイクルにおいて実行予定である複数回に亘る装着動作のうち装着順序が先の装着動作の前記装着位置に優先して前記部品が装着されるように前記装着位置の前記変更処理を実行する、請求項1に記載の部品装着機。 The control device changes the mounting position so that the component is mounted so that the mounting order takes precedence over the mounting position of the earlier mounting operation among the plurality of mounting operations scheduled to be executed in the PP cycle. The component mounting machine according to claim 1, which executes the process.
- 前記制御装置は、同一の前記PPサイクルにおいて前記スキップ動作よりも後に実行予定である装着動作の前記装着位置を、それぞれの直前に実行予定である同一種類の前記部品の装着動作の前記装着位置にそれぞれ変更する前記変更処理を実行する、請求項2に記載の部品装着機。 The control device sets the mounting position of the mounting operation scheduled to be executed after the skip operation in the same PP cycle to the mounting position of the mounting operation of the same type of component scheduled to be executed immediately before each. The component mounting machine according to claim 2, wherein the change process for each change is executed.
- 前記制御装置は、同一の前記PPサイクルにおいて前記スキップ動作よりも後に実行予定である装着動作のうち最後に実行予定である同一種類の前記部品の装着動作の前記装着位置および前記装着順序を前記スキップ動作の前記装着位置および前記装着順序に変更する前記変更処理を実行する、請求項2に記載の部品装着機。 The control device skips the mounting position and the mounting order of the mounting operation of the same type of component that is scheduled to be executed last among the mounting operations scheduled to be executed after the skip operation in the same PP cycle. The component mounting machine according to claim 2, wherein the change process for changing the mounting position and the mounting order of the operation is executed.
- 同一の前記PPサイクルにおいて前記スキップ動作よりも後に実行予定である装着動作の前記装着位置を、それぞれの直前に実行予定である同一種類の前記部品の装着動作の前記装着位置にそれぞれ変更する前記変更処理を第一変更処理とし、
同一の前記PPサイクルにおいて前記スキップ動作よりも後に実行予定である装着動作のうち最後に実行予定である同一種類の前記部品の装着動作の前記装着位置および前記装着順序を前記スキップ動作の前記装着位置および前記装着順序に変更する前記変更処理を第二変更処理とし、
前記制御装置は、前記第一変更処理および前記第二変更処理を前記PPサイクルに別個に適用した場合のそれぞれの前記PPサイクルの所要時間が短くなる前記変更処理を選択して実行する、請求項2に記載の部品装着機。 The change in which the mounting position of the mounting operation scheduled to be executed after the skip operation in the same PP cycle is changed to the mounting position of the mounting operation of the same type of component scheduled to be executed immediately before each. The process is the first change process
In the same PP cycle, among the mounting operations scheduled to be executed after the skip operation, the mounting position and the mounting order of the mounting operation of the same type of the component scheduled to be executed last are set to the mounting position of the skip operation. And the change process of changing to the mounting order is set as the second change process.
A claim that the control device selects and executes the change process that shortens the time required for each of the PP cycles when the first change process and the second change process are applied separately to the PP cycle. The parts mounting machine according to 2. - 前記制御装置は、所定の前記PPサイクルにおいて前記装着位置の前記変更処理を実行した場合に、以降に実行予定の前記PPサイクルにおいて前記スキップ動作と同一種類の前記部品の装着動作の前記装着位置を、それぞれの直前に実行予定である同一種類の前記部品の装着動作の前記装着位置にそれぞれ変更する補完処理を実行する、請求項1-5の何れか一項に記載の部品装着機。 When the control device executes the change process of the mounting position in the predetermined PP cycle, the control device performs the mounting position of the component mounting operation of the same type as the skip operation in the PP cycle scheduled to be executed thereafter. The component mounting machine according to any one of claims 1-5, which executes complementary processing for changing the mounting operation of the same type of component to the mounting position, which is scheduled to be executed immediately before each.
- 前記制御装置は、所定の前記PPサイクルにおいて前記装着位置の前記変更処理を実行した場合に、以降に実行予定の前記PPサイクルの前に、所定の前記PPサイクルに含まれたスキップ動作の数の前記部品の採取動作および前記装着位置の変更に伴って未装着となった前記装着位置への装着動作を含む補完処理を実行する、請求項1-5の何れか一項に記載の部品装着機。 When the control device executes the change processing of the mounting position in the predetermined PP cycle, the number of skip operations included in the predetermined PP cycle before the PP cycle scheduled to be executed thereafter. The component mounting machine according to any one of claims 1-5, which executes a complementary process including a mounting operation to the mounting position that has not been mounted due to the collecting operation of the component and the change of the mounting position. ..
- 前記装着位置の前記変更処理が実行された所定の前記PPサイクルの以降に実行予定の前記PPサイクルにおいて前記スキップ動作と同一種類の前記部品の装着動作の前記装着位置を、それぞれの直前に実行予定である同一種類の前記部品の装着動作の前記装着位置にそれぞれ変更する補完処理を第一補完処理とし、
前記装着位置の前記変更処理が実行された所定の前記PPサイクルの以降に実行予定の前記PPサイクルの前に、所定の前記PPサイクルに含まれたスキップ動作の数の前記部品の採取動作および前記装着位置の変更に伴って未装着となった前記装着位置への装着動作を含む補完処理を第二補完処理とし、
前記装着位置の前記変更処理が実行された所定の前記PPサイクルより後に実行予定の1以上の前記PPサイクルを予定PPサイクル群とし、
前記制御装置は、前記第一補完処理および前記第二補完処理を前記予定PPサイクル群に別個に適用した場合の前記予定PPサイクル群の所要時間が短くなる前記補完処理を選択して実行する、請求項1-5の何れか一項に記載の部品装着機。 In the PP cycle scheduled to be executed after the predetermined PP cycle in which the change processing of the mounting position is executed, the mounting position of the component mounting operation of the same type as the skip operation is scheduled to be executed immediately before each. The complementary process of changing the mounting operation of the same type of component to the mounting position is defined as the first complementary process.
Before the PP cycle scheduled to be executed after the predetermined PP cycle in which the change processing of the mounting position is executed, the number of skip operations included in the predetermined PP cycle and the collection operation of the component and the said. Complementary processing including the mounting operation to the mounting position that has not been mounted due to the change of the mounting position is defined as the second complementary process.
One or more of the PP cycles scheduled to be executed after the predetermined PP cycle in which the change processing of the mounting position is executed is defined as a scheduled PP cycle group.
The control device selects and executes the complementary process in which the time required for the scheduled PP cycle group is shortened when the first complementary process and the second complementary process are separately applied to the scheduled PP cycle group. The component mounting machine according to any one of claims 1-5. - 前記部品を装着される基板は、複数の単位基板により構成され、複数の前記単位基板ごとに前記PPサイクルの実行により同一種類の前記部品を装着された後に分割される多面取り基板である、請求項1-8の何れか一項に記載の部品装着機。 The substrate on which the component is mounted is a multi-chamfered substrate which is composed of a plurality of unit substrates and is divided after mounting the same type of component on each of the plurality of unit substrates by executing the PP cycle. Item 5. The component mounting machine according to any one of Items 1-8.
- 前記制御装置は、複数の前記単位基板のうち一部の前記単位基板に前記部品を装着するように複数回に亘る前記PPサイクルを繰り返す装着処理を実行し、
前記多面取り基板は、前記装着処理の実行後に、前記部品を装着された前記単位基板と前記部品が未装着の前記単位基板とを視認可能に区分するマーキング処理を実行された後に分割される、請求項9に記載の部品装着機。 The control device executes a mounting process of repeating the PP cycle a plurality of times so as to mount the component on a part of the unit boards among the plurality of unit boards.
After executing the mounting process, the multi-chamfered board is divided after executing a marking process for visually separating the unit board on which the component is mounted and the unit board on which the component is not mounted. The component mounting machine according to claim 9. - 前記制御装置は、複数の前記単位基板のうち一部の前記単位基板に前記部品を装着するように複数回に亘る前記PPサイクルを繰り返す装着処理を実行し、
前記多面取り基板は、前記装着処理の実行後に、表面を樹脂材料によりコーティングするモールド処理を実行された後に分割される、請求項9または10に記載の部品装着機。 The control device executes a mounting process of repeating the PP cycle a plurality of times so as to mount the component on a part of the unit boards among the plurality of unit boards.
The component mounting machine according to claim 9 or 10, wherein the multi-chamfered substrate is divided after performing a molding process of coating the surface with a resin material after executing the mounting process. - 前記部品装着機は、複数の前記保持部材をそれぞれ支持し、複数の前記保持部材を一体的に水平方向に移動させる装着ヘッドをさらに備え、
1回の前記PPサイクルとは、複数の前記保持部材の少なくとも2以上による一連の採取動作が開始されてから一連の装着動作が終了するまでの動作である、請求項1-11の何れか一項に記載の部品装着機。 The component mounting machine further includes a mounting head that supports each of the plurality of holding members and integrally moves the plurality of holding members in the horizontal direction.
One of the PP cycles is any one of claims 1-11, which is an operation from the start of a series of collection operations by at least two or more of the plurality of holding members to the end of a series of mounting operations. Parts mounting machine described in the section. - 前記部品装着機は、複数の前記保持部材の一部をそれぞれ支持し、互いに独立して前記保持部材を水平方向に移動させる第一装着ヘッドおよび第二装着ヘッドをさらに備え、
1回の前記PPサイクルとは、前記第一装着ヘッドを用いた採取動作が開始されてから第一装着ヘッドを用いた装着動作に並行して実行される前記第二装着ヘッドを用いた採取動作および装着動作が終了するまでの動作である、請求項1-11の何れか一項に記載の部品装着機。 The component mounting machine further includes a first mounting head and a second mounting head that support a part of the plurality of holding members and move the holding members in the horizontal direction independently of each other.
The one PP cycle is a collection operation using the second mounting head, which is executed in parallel with the mounting operation using the first mounting head after the collection operation using the first mounting head is started. The component mounting machine according to any one of claims 1-11, which is an operation until the mounting operation is completed.
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