WO2020252966A1 - Composant doté d'un élément électronique, procédé de production correspondant et module de caméra associé - Google Patents

Composant doté d'un élément électronique, procédé de production correspondant et module de caméra associé Download PDF

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Publication number
WO2020252966A1
WO2020252966A1 PCT/CN2019/107434 CN2019107434W WO2020252966A1 WO 2020252966 A1 WO2020252966 A1 WO 2020252966A1 CN 2019107434 W CN2019107434 W CN 2019107434W WO 2020252966 A1 WO2020252966 A1 WO 2020252966A1
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WO
WIPO (PCT)
Prior art keywords
component
electronic components
metal circuit
plastic part
metal
Prior art date
Application number
PCT/CN2019/107434
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English (en)
Chinese (zh)
Inventor
莫凑全
Original Assignee
苏州昀冢电子科技股份有限公司
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Publication of WO2020252966A1 publication Critical patent/WO2020252966A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • This application relates to the technical field of electronic components, such as components with electronic components and their production processes and camera modules.
  • the assembly of electronic components in the related art takes the assembly of the electronic components of the special-shaped micro-motor in the mobile terminal camera module as an example.
  • the electronic components such as the capacitor element 31' and the Hall element are usually assembled first.
  • 32', Integrated Circuit (IC) components 33', etc. are soldered on the Flexible Printed Circuit (FPC) 2', FPC board 2'provides the circuits required by the electronic components, and then the FPC board 2'is pasted On the plastic component 1', this assembly structure has high assembly complexity and high production cost.
  • FPC Flexible Printed Circuit
  • the related art provides an assembly process for electronic components that can eliminate the FPC board and simplify the process.
  • the assembly process requires two injection molding, involves many process links, and contains a large number of structural parts. It is important for the production of mobile terminal cameras.
  • the special-shaped micromotor components in the module neither the assembly process nor the component structure is the optimal solution, and there is still a lot of room for improvement.
  • This application provides components with electronic components and their production processes and camera modules to avoid the high complexity and high production cost of electronic components in the related art.
  • a component with electronic components includes: a plastic part, the plastic part has a preset structural shape; a metal circuit, the metal circuit is embedded on the plastic part, and the metal circuit and the plastic part One-piece injection molding; and at least one electronic component, and the at least one electronic component is connected to the metal circuit by welding.
  • a production process of a component with electronic components used for producing the component with electronic components according to the above solution, including: forming a metal circuit; performing in-mold injection on the metal circuit to form an in-mold injection semi-finished product ; At least one electronic component is welded to the in-mold injection molding semi-finished product to form the component with electronic components.
  • a camera module includes a lens and a motor configured to drive the lens to move to realize automatic focusing, and the motor contains the components with electronic components described in any one of the above solutions.
  • Figure 1 is a schematic diagram of an assembly structure of electronic components in the related art
  • FIG. 2 is a schematic structural diagram of a component with electronic components provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a formed metal circuit provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of the structure after injection molding of a plastic part on the metal circuit shown in FIG. 3;
  • FIG. 5 is a schematic diagram of the structure after soldering electronic components on the structure shown in FIG. 4;
  • Fig. 6 is a flow chart of a production process of a component with electronic components provided by an embodiment of the present application
  • Fig. 7 is a flowchart of a production process of a component with electronic components provided by an embodiment of the present application.
  • 3-Electronic components 31-capacitance components, 32-Hall components, 33-IC components.
  • This application provides a component with electronic components, its production process, and a camera module.
  • a number of embodiments are provided below to describe in detail the component with electronic components, its production process, and camera module provided in this application.
  • this embodiment provides a component with electronic components.
  • the component with electronic components includes: a plastic part 1, a metal circuit 2 and at least one electronic component 3.
  • the plastic part 1 has a preset structural shape, that is, the plastic part 1 can be molded to have a specific function and a preset structural shape according to the shape or function requirements of the product
  • the plastic part 1 can be the bottom cover (or base) of the special-shaped micro motor in the camera module of the mobile terminal.
  • the plastic part 1 has a preset structural shape and can be combined with other parts (such as the motor body, etc.)
  • the plastic part 1 can also be a functional part used in other occasions;
  • the metal circuit 2 is embedded on the plastic part 1, and the metal circuit 2 and the plastic part 1 are integrally injection molded, that is, the metal circuit 2 is used as an insert and
  • the plastic part 1 is integrally injection-molded, and after the injection molding, the metal circuit 2 is fixed on the plastic part 1 to be integrated with the plastic part 1; at least one electronic component 3 is welded to the metal circuit 2.
  • the metal circuit 2 and the plastic part 1 are integrally injection-molded, and the electronic component 3 is welded to the injection-molded metal circuit 2, thereby eliminating the FPC board, simplifying the production process, reducing the assembly complexity of the electronic component 3, and reducing production cost. It is understandable that the metal circuit 2 is embedded on the plastic part 1 and integrated with the plastic part 1 by injection molding.
  • the plastic part 1 serves as a support carrier for the metal circuit 2 to improve the structural strength of the metal circuit 2 and ensure that the electronic welding on the metal circuit 2
  • the plastic part 1 can be molded into a functional part with a specific function and a preset structural shape according to the shape or functional needs of the product, which simplifies the production
  • the process also reduces the number of structural parts, whether from the assembly process or the component structure, the assembly complexity of the electronic component 3 is greatly reduced, and the production cost is greatly reduced.
  • the metal circuit 2 includes a plurality of branches 21, each branch 21 is partially covered inside the plastic member 1, and each branch 21 includes The first end 211 and the second end 212, the first end 211 of each branch 21 is at least partially exposed on the surface of the plastic part 1 to be welded to the electronic component 3, and the second end of each branch 21 212 extends the plastic part 1.
  • each branch 21 is partially covered inside the plastic part 1 to improve the firmness of the plastic part 1 to the metal circuit 2 and to improve the structural strength of the metal circuit 2 to ensure that the metal circuit 2 and the electronics
  • the robustness of the connection of the component 3 in order to realize the welding connection of the electronic component 3 and the metal circuit 2, the first end 211 of each branch 21 of the metal circuit 2 is designed to be exposed on the surface of the plastic part 1, and the electronic component 3 and the branch 21
  • the first end 211 of each branch 21 is welded and connected; the second end 212 of each branch 21 extends out of the plastic part 1, so that the second end 212 of the branch 21 can be connected to external components.
  • each branch 21 is formed from the inside of the plastic part 1 toward the plastic part 1.
  • the first end 211 of each branch 21 is connected to the bending portion 213, and the arrangement of the bending portion 213 can also enhance the structural strength of the metal circuit 2; in one embodiment,
  • the bending portion 213 includes a first end and a second end that are connected. The second end of the bending portion 213 is bent toward the surface of the plastic part 1 relative to the first end of the bending portion 213.
  • the first end of each branch 21 The end portion 211 is connected to the second end of the bending portion 213.
  • each branch 21 further includes a main body section connected to the first end of the bending portion 213, the main body section is on the same plane as a whole, and the end of the main body section away from the bending portion 213 is each branch.
  • the second end portion 212 of 21, except for the end portion away from the bent portion 213, other parts of the main body section are covered inside the plastic part 1.
  • the metal circuit 2 includes a plurality of branches 21, and the surface of the plastic part 1 is formed with a limiting groove for accommodating the plurality of branches 21, and the plurality of branches 21 are accommodated and fixed in the limiting groove, each Each branch 21 includes a first end and a second end. The first end 211 of each branch 21 is connected to the electronic component 3 by welding, and the second end 212 of each branch 21 protrudes from the plastic part 1.
  • the metal circuit 2 is fixed by the limit groove formed on the surface of the plastic part 1, which can also ensure the firm fixation of the metal circuit 2, thereby ensuring the firmness of the connection between the metal circuit 2 and the electronic component 3;
  • the design does not need to bend the branch 21 in order to realize that the first end 211 of each branch 21 is exposed, so that the forming of the metal circuit 2 is more convenient.
  • the number of electronic components 3 may be multiple, and the multiple electronic components 3 may include at least one of a capacitive element 31, a Hall element 32, and an integrated circuit (IC) element 33 ;
  • the wiring structure of the metal circuit 2 can be reasonably designed and adjusted according to the location of the electronic component 3.
  • the number of electronic components 3 can also be one, and the types of electronic components 3 are not limited to the above list.
  • the metal circuit 2 includes a metal substrate and a protective layer covering the surface of the metal substrate.
  • the metal substrate is stamped and formed from a sheet.
  • the metal base material can be made from a metal alloy (such as alloy, copper, stainless steel, etc.) sheet with a thickness of 0.05 mm to 0.2 mm (such as 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, etc.) through a precision stamping die It is formed by stamping, the stamping forming method is simple, and the production efficiency is high; in addition to stamping forming, other methods such as wire cutting can also be used to process metal substrates.
  • the protective layer may include an anti-oxidation layer and a soldering assistance layer.
  • the anti-oxidation layer covers the surface of the metal substrate, and the soldering assistance layer covers the outside of the anti-oxidation layer; for example, the anti-oxidation layer may be a nickel layer to avoid metal lines 2
  • the metal substrate is oxidized; the soldering layer can be a gold layer, a tin layer, or a combination of a gold layer and a tin layer, which is beneficial to improve the welding quality of the electronic component 3 and the metal circuit 2.
  • the electronic component 3 and the metal circuit 2 are welded and connected through the Surface Mounting Technology (SMT) process.
  • SMT Surface Mounting Technology
  • the electronic component 3 is welded by the SMT process, which can reduce the technical difficulty of the electronic component 3 welding process , Welding electronic components 3 can be positioned through high-precision molds to avoid poor positioning in traditional processes.
  • This embodiment provides a production process of a component with electronic components, as shown in FIG. 6, including steps S11 to S13.
  • step S11 the metal circuit 2 is formed.
  • step S12 in-mold injection is performed on the metal circuit 2 to form an in-mold injection molding semi-finished product.
  • step S13 at least one electronic component 3 is welded to the in-mold injection molding semi-finished product through the SMT process to form a component with electronic components.
  • the production process of the parts with electronic components provided in the above embodiments is to form the metal circuit 2 and perform in-mold injection on the metal circuit 2, and the electronic components 3 are directly welded to the semi-finished product of the in-mold injection molding, thereby eliminating the FPC board and Through one injection molding and one SMT process welding, the entire production of parts with electronic components is completed, which reduces the process of pasting FPC boards on plastic parts, which simplifies the assembly process of electronic components 3 and reduces production costs; and adopts SMT
  • the process of welding the electronic component 3 reduces the technical difficulty of the welding process of the electronic component 3, and the welding of the electronic component 3 can be positioned by a high-precision mold, avoiding the poor positioning of the traditional process.
  • This embodiment provides a production process of a component with electronic components, as shown in FIG. 7, including step S21 to step S25.
  • step S21 the sheet material is stamped into a plurality of interconnected metal base materials of a predetermined shape, and packaged in a reel.
  • step S22 surface treatment is performed on the stamped and formed metal substrate to form a plurality of interconnected metal lines 2 and reel packaging is performed.
  • step S23 in-mold injection is performed on the metal circuit 2 to form an in-mold injection semi-finished product, and the reel packaging is performed.
  • step S24 at least one electronic component 3 is welded to the in-mold injection molding semi-finished product through an SMT process to form a component with electronic components.
  • step S25 the component with electronic components is cut from the sheet to form a single component with electronic components.
  • the traditional soldering of electronic components on the FPC board usually adopts the spot soldering process.
  • the electronic components are soldered to the FPC board by spot welding. Therefore, it is necessary to repeat the positioning of each FPC, but the accuracy of the repeated positioning of the FPC is relatively high. It is required that the accuracy of each positioning cannot be fully guaranteed in actual production; at the same time, due to the poor strength of the FPC board itself, the current assembly process produces parts with electronic components, the overall defect rate is high, and welding after positioning one by one causes production Low efficiency and poor mass production.
  • step S21 by stamping the sheet into a plurality of interconnected metal substrates of preset shapes, continuous production or mass production can be realized in each subsequent step, which is beneficial to improve production efficiency;
  • the sheet can be stamped into a shape that meets the customer’s functional needs and quantified molding through a precision stamping die; the metal base material is packaged in a reel, and when processing in the next step, it can be driven by an automatic traction device or a feeding device Rotation of the disc is conducive to automatic feeding.
  • the metal base material can be made from a metal alloy (such as alloy, copper, stainless steel, etc.) sheet with a thickness of 0.05mm ⁇ 0.2mm (such as 0.05mm, 0.1mm, 0.15mm, 02mm, etc.) through a precision stamping die. Simple and high production efficiency; in addition to stamping and forming, metal substrates can also be processed by wire cutting and other methods
  • step S22 it may include: plating an anti-oxidation layer on the surface of the metal substrate; plating a soldering flux layer outside the anti-oxidation layer to form a plurality of interconnected metal lines 2 and perform reel packaging to form a plurality of mutual Connect the metal circuit 2 and carry out reel packaging.
  • the anti-oxidation layer can be formed by nickel plating to avoid oxidation of the metal substrate; the anti-oxidation layer can be plated with gold or tin to form a soldering layer, or both gold and tin can be plated to achieve better soldering. effect.
  • the formation of the anti-oxidation layer level soldering layer is not limited to the above limitation.
  • the injection temperature can be 250°C to 390°C, for example, 250°C, 270°C, 290°C, 310°C, 330°C, 350°C, 370°C, 390°C, etc. can be selected;
  • the time can be from 5s to 15s, for example, 5s, 7s, 9s, 11s, 13s, 15s, etc. can be selected.
  • the plastic part 1 can be partially covered with the metal circuit 2, for example, the metal circuit 2 is partly covered inside the plastic part 1, or the metal circuit 2 is accommodated and fixed in the limiting groove formed on the surface of the plastic part 1. In order to ensure the firmness of the connection between the metal circuit 2 and the plastic part 1.
  • the soldering temperature may be 150°C to 350°C, for example, 150°C, 190°C, 210°C, 250°C, 280°C, 310°C, or 350°C.
  • the electronic component 3 is welded by the SMT process, so that the welding process of the electronic component 3 reduces the technical difficulty.
  • the welding electronic component 3 can be positioned through a high-precision mold to avoid the poor positioning of the traditional process.
  • step S25 a plurality of interconnected components with electronic components are cut to form a single component with electronic components, so as to facilitate the assembly of the components with electronic components to corresponding products.
  • this step S25 includes, but is not limited to, cutting off the sheet connected to the second end of each branch of the metal circuit.
  • the cutting machine used in this step can cut multiple interconnected components with electronic components into a single component with electronic components at the same time, so as to improve work efficiency.
  • This embodiment provides a camera module, which includes a lens and a motor configured to drive the lens to move to achieve autofocus, and the motor contains the components with electronic components according to any of the above embodiments.
  • electronic devices with camera functions such as mobile terminals (such as mobile phones, notebooks, tablet computers, etc.), monitors, drones, etc.
  • the camera module includes a lens and
  • the motor is set to drive the lens to move to achieve autofocus.
  • the motor usually includes parts with electronic components (the part with electronic components on the motor is usually called the motor base, or the bottom cover of the motor, or the rear of the motor Cover, etc.), the component with electronic components on the motor can be the component with electronic components in any of the above embodiments, that is, the component with electronic components in any of the above embodiments can be applied to any of the above Functional electronic equipment in the camera module.
  • the camera module of the mobile terminal includes a lens and a special-shaped micromotor configured to drive the lens to move to achieve autofocus.
  • the special-shaped micromotor includes a motor main body and a motor bottom cover. (It can also be called a motor base, or a motor back cover, etc.).
  • the motor bottom cover is a component with electronic components.
  • the motor bottom cover includes: a plastic bottom cover (that is, the plastic part in the above embodiment), a metal circuit, and At least one electronic component, the plastic bottom cover is molded into a preset structural shape as required, the metal circuit is embedded on the plastic bottom cover, and the metal circuit and the plastic bottom cover are integrally injection molded, and at least one electronic component is welded and connected to the metal circuit.
  • the production process of the motor bottom cover is as follows: first form a metal circuit of a preset shape according to the needs, then use the metal circuit as an insert to form a plastic bottom cover with a metal circuit through an in-mold injection process, and then weld at least one electronic component On the metal circuit, the motor bottom cover with electronic components is formed.
  • the components with electronic components and the production process and camera module of the above-mentioned embodiments of the present application can reduce the technical difficulty of the soldering process of electronic components, and the soldering electronic components can be positioned through high-precision molds, avoiding traditional process positioning Bad situation; it can simplify the assembly process of the mobile terminal camera special-shaped micro motor factory and reduce the production cost; it can improve the process efficiency of welding electronic components and improve the component process yield.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un composant doté d'un élément électronique (3), un procédé de production correspondant et un module de caméra associé. Le composant doté d'un élément électronique (3) comprend un élément en plastique (1), un circuit métallique (2) et au moins un élément électronique (3), l'élément en plastique (1) est d'une forme structurale prédéfinie, le circuit métallique (2) est intégré à l'élément en plastique (1), le circuit métallique (2) et l'élément en plastique (1) sont formés d'un seul tenant au moyen d'un moulage par injection, et ledit élément électronique (3) est relié au circuit métallique (2) par soudage.
PCT/CN2019/107434 2019-06-18 2019-09-24 Composant doté d'un élément électronique, procédé de production correspondant et module de caméra associé WO2020252966A1 (fr)

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Application Number Priority Date Filing Date Title
CN201910527339.X 2019-06-18
CN201910527339.XA CN110177429A (zh) 2019-06-18 2019-06-18 一种带有电子元件的部件及其生产工艺和摄像头模组

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WO2020252966A1 true WO2020252966A1 (fr) 2020-12-24

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CN110177429A (zh) * 2019-06-18 2019-08-27 苏州昀冢电子科技有限公司 一种带有电子元件的部件及其生产工艺和摄像头模组
CN112060467A (zh) * 2020-09-11 2020-12-11 富加宜连接器（东莞）有限公司 一种新型金属线路框的加工方法
CN112702841B (zh) * 2020-12-16 2022-01-14 苏州昀冢电子科技股份有限公司 一种焊接有电子元件的基座及其音圈马达
CN112702842B (zh) * 2020-12-16 2022-04-29 苏州昀冢电子科技股份有限公司 一种具有金属电路的基座及音圈马达和制造方法
CN112737272B (zh) * 2020-12-16 2022-05-17 苏州昀冢电子科技股份有限公司 一种焊接有电子元件的基座及其生产工艺和音圈马达
CN112738995B (zh) * 2020-12-23 2022-04-29 苏州昀冢电子科技股份有限公司 一种具有金属电路的基座及其生产工艺和音圈马达

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