WO2020252966A1 - Component with electronic element, and production process therefor and camera module therewith - Google Patents

Component with electronic element, and production process therefor and camera module therewith Download PDF

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Publication number
WO2020252966A1
WO2020252966A1 PCT/CN2019/107434 CN2019107434W WO2020252966A1 WO 2020252966 A1 WO2020252966 A1 WO 2020252966A1 CN 2019107434 W CN2019107434 W CN 2019107434W WO 2020252966 A1 WO2020252966 A1 WO 2020252966A1
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WO
WIPO (PCT)
Prior art keywords
component
electronic components
metal circuit
plastic part
metal
Prior art date
Application number
PCT/CN2019/107434
Other languages
French (fr)
Chinese (zh)
Inventor
莫凑全
Original Assignee
苏州昀冢电子科技股份有限公司
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Publication of WO2020252966A1 publication Critical patent/WO2020252966A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • This application relates to the technical field of electronic components, such as components with electronic components and their production processes and camera modules.
  • the assembly of electronic components in the related art takes the assembly of the electronic components of the special-shaped micro-motor in the mobile terminal camera module as an example.
  • the electronic components such as the capacitor element 31' and the Hall element are usually assembled first.
  • 32', Integrated Circuit (IC) components 33', etc. are soldered on the Flexible Printed Circuit (FPC) 2', FPC board 2'provides the circuits required by the electronic components, and then the FPC board 2'is pasted On the plastic component 1', this assembly structure has high assembly complexity and high production cost.
  • FPC Flexible Printed Circuit
  • the related art provides an assembly process for electronic components that can eliminate the FPC board and simplify the process.
  • the assembly process requires two injection molding, involves many process links, and contains a large number of structural parts. It is important for the production of mobile terminal cameras.
  • the special-shaped micromotor components in the module neither the assembly process nor the component structure is the optimal solution, and there is still a lot of room for improvement.
  • This application provides components with electronic components and their production processes and camera modules to avoid the high complexity and high production cost of electronic components in the related art.
  • a component with electronic components includes: a plastic part, the plastic part has a preset structural shape; a metal circuit, the metal circuit is embedded on the plastic part, and the metal circuit and the plastic part One-piece injection molding; and at least one electronic component, and the at least one electronic component is connected to the metal circuit by welding.
  • a production process of a component with electronic components used for producing the component with electronic components according to the above solution, including: forming a metal circuit; performing in-mold injection on the metal circuit to form an in-mold injection semi-finished product ; At least one electronic component is welded to the in-mold injection molding semi-finished product to form the component with electronic components.
  • a camera module includes a lens and a motor configured to drive the lens to move to realize automatic focusing, and the motor contains the components with electronic components described in any one of the above solutions.
  • Figure 1 is a schematic diagram of an assembly structure of electronic components in the related art
  • FIG. 2 is a schematic structural diagram of a component with electronic components provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a formed metal circuit provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of the structure after injection molding of a plastic part on the metal circuit shown in FIG. 3;
  • FIG. 5 is a schematic diagram of the structure after soldering electronic components on the structure shown in FIG. 4;
  • Fig. 6 is a flow chart of a production process of a component with electronic components provided by an embodiment of the present application
  • Fig. 7 is a flowchart of a production process of a component with electronic components provided by an embodiment of the present application.
  • 3-Electronic components 31-capacitance components, 32-Hall components, 33-IC components.
  • This application provides a component with electronic components, its production process, and a camera module.
  • a number of embodiments are provided below to describe in detail the component with electronic components, its production process, and camera module provided in this application.
  • this embodiment provides a component with electronic components.
  • the component with electronic components includes: a plastic part 1, a metal circuit 2 and at least one electronic component 3.
  • the plastic part 1 has a preset structural shape, that is, the plastic part 1 can be molded to have a specific function and a preset structural shape according to the shape or function requirements of the product
  • the plastic part 1 can be the bottom cover (or base) of the special-shaped micro motor in the camera module of the mobile terminal.
  • the plastic part 1 has a preset structural shape and can be combined with other parts (such as the motor body, etc.)
  • the plastic part 1 can also be a functional part used in other occasions;
  • the metal circuit 2 is embedded on the plastic part 1, and the metal circuit 2 and the plastic part 1 are integrally injection molded, that is, the metal circuit 2 is used as an insert and
  • the plastic part 1 is integrally injection-molded, and after the injection molding, the metal circuit 2 is fixed on the plastic part 1 to be integrated with the plastic part 1; at least one electronic component 3 is welded to the metal circuit 2.
  • the metal circuit 2 and the plastic part 1 are integrally injection-molded, and the electronic component 3 is welded to the injection-molded metal circuit 2, thereby eliminating the FPC board, simplifying the production process, reducing the assembly complexity of the electronic component 3, and reducing production cost. It is understandable that the metal circuit 2 is embedded on the plastic part 1 and integrated with the plastic part 1 by injection molding.
  • the plastic part 1 serves as a support carrier for the metal circuit 2 to improve the structural strength of the metal circuit 2 and ensure that the electronic welding on the metal circuit 2
  • the plastic part 1 can be molded into a functional part with a specific function and a preset structural shape according to the shape or functional needs of the product, which simplifies the production
  • the process also reduces the number of structural parts, whether from the assembly process or the component structure, the assembly complexity of the electronic component 3 is greatly reduced, and the production cost is greatly reduced.
  • the metal circuit 2 includes a plurality of branches 21, each branch 21 is partially covered inside the plastic member 1, and each branch 21 includes The first end 211 and the second end 212, the first end 211 of each branch 21 is at least partially exposed on the surface of the plastic part 1 to be welded to the electronic component 3, and the second end of each branch 21 212 extends the plastic part 1.
  • each branch 21 is partially covered inside the plastic part 1 to improve the firmness of the plastic part 1 to the metal circuit 2 and to improve the structural strength of the metal circuit 2 to ensure that the metal circuit 2 and the electronics
  • the robustness of the connection of the component 3 in order to realize the welding connection of the electronic component 3 and the metal circuit 2, the first end 211 of each branch 21 of the metal circuit 2 is designed to be exposed on the surface of the plastic part 1, and the electronic component 3 and the branch 21
  • the first end 211 of each branch 21 is welded and connected; the second end 212 of each branch 21 extends out of the plastic part 1, so that the second end 212 of the branch 21 can be connected to external components.
  • each branch 21 is formed from the inside of the plastic part 1 toward the plastic part 1.
  • the first end 211 of each branch 21 is connected to the bending portion 213, and the arrangement of the bending portion 213 can also enhance the structural strength of the metal circuit 2; in one embodiment,
  • the bending portion 213 includes a first end and a second end that are connected. The second end of the bending portion 213 is bent toward the surface of the plastic part 1 relative to the first end of the bending portion 213.
  • the first end of each branch 21 The end portion 211 is connected to the second end of the bending portion 213.
  • each branch 21 further includes a main body section connected to the first end of the bending portion 213, the main body section is on the same plane as a whole, and the end of the main body section away from the bending portion 213 is each branch.
  • the second end portion 212 of 21, except for the end portion away from the bent portion 213, other parts of the main body section are covered inside the plastic part 1.
  • the metal circuit 2 includes a plurality of branches 21, and the surface of the plastic part 1 is formed with a limiting groove for accommodating the plurality of branches 21, and the plurality of branches 21 are accommodated and fixed in the limiting groove, each Each branch 21 includes a first end and a second end. The first end 211 of each branch 21 is connected to the electronic component 3 by welding, and the second end 212 of each branch 21 protrudes from the plastic part 1.
  • the metal circuit 2 is fixed by the limit groove formed on the surface of the plastic part 1, which can also ensure the firm fixation of the metal circuit 2, thereby ensuring the firmness of the connection between the metal circuit 2 and the electronic component 3;
  • the design does not need to bend the branch 21 in order to realize that the first end 211 of each branch 21 is exposed, so that the forming of the metal circuit 2 is more convenient.
  • the number of electronic components 3 may be multiple, and the multiple electronic components 3 may include at least one of a capacitive element 31, a Hall element 32, and an integrated circuit (IC) element 33 ;
  • the wiring structure of the metal circuit 2 can be reasonably designed and adjusted according to the location of the electronic component 3.
  • the number of electronic components 3 can also be one, and the types of electronic components 3 are not limited to the above list.
  • the metal circuit 2 includes a metal substrate and a protective layer covering the surface of the metal substrate.
  • the metal substrate is stamped and formed from a sheet.
  • the metal base material can be made from a metal alloy (such as alloy, copper, stainless steel, etc.) sheet with a thickness of 0.05 mm to 0.2 mm (such as 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, etc.) through a precision stamping die It is formed by stamping, the stamping forming method is simple, and the production efficiency is high; in addition to stamping forming, other methods such as wire cutting can also be used to process metal substrates.
  • the protective layer may include an anti-oxidation layer and a soldering assistance layer.
  • the anti-oxidation layer covers the surface of the metal substrate, and the soldering assistance layer covers the outside of the anti-oxidation layer; for example, the anti-oxidation layer may be a nickel layer to avoid metal lines 2
  • the metal substrate is oxidized; the soldering layer can be a gold layer, a tin layer, or a combination of a gold layer and a tin layer, which is beneficial to improve the welding quality of the electronic component 3 and the metal circuit 2.
  • the electronic component 3 and the metal circuit 2 are welded and connected through the Surface Mounting Technology (SMT) process.
  • SMT Surface Mounting Technology
  • the electronic component 3 is welded by the SMT process, which can reduce the technical difficulty of the electronic component 3 welding process , Welding electronic components 3 can be positioned through high-precision molds to avoid poor positioning in traditional processes.
  • This embodiment provides a production process of a component with electronic components, as shown in FIG. 6, including steps S11 to S13.
  • step S11 the metal circuit 2 is formed.
  • step S12 in-mold injection is performed on the metal circuit 2 to form an in-mold injection molding semi-finished product.
  • step S13 at least one electronic component 3 is welded to the in-mold injection molding semi-finished product through the SMT process to form a component with electronic components.
  • the production process of the parts with electronic components provided in the above embodiments is to form the metal circuit 2 and perform in-mold injection on the metal circuit 2, and the electronic components 3 are directly welded to the semi-finished product of the in-mold injection molding, thereby eliminating the FPC board and Through one injection molding and one SMT process welding, the entire production of parts with electronic components is completed, which reduces the process of pasting FPC boards on plastic parts, which simplifies the assembly process of electronic components 3 and reduces production costs; and adopts SMT
  • the process of welding the electronic component 3 reduces the technical difficulty of the welding process of the electronic component 3, and the welding of the electronic component 3 can be positioned by a high-precision mold, avoiding the poor positioning of the traditional process.
  • This embodiment provides a production process of a component with electronic components, as shown in FIG. 7, including step S21 to step S25.
  • step S21 the sheet material is stamped into a plurality of interconnected metal base materials of a predetermined shape, and packaged in a reel.
  • step S22 surface treatment is performed on the stamped and formed metal substrate to form a plurality of interconnected metal lines 2 and reel packaging is performed.
  • step S23 in-mold injection is performed on the metal circuit 2 to form an in-mold injection semi-finished product, and the reel packaging is performed.
  • step S24 at least one electronic component 3 is welded to the in-mold injection molding semi-finished product through an SMT process to form a component with electronic components.
  • step S25 the component with electronic components is cut from the sheet to form a single component with electronic components.
  • the traditional soldering of electronic components on the FPC board usually adopts the spot soldering process.
  • the electronic components are soldered to the FPC board by spot welding. Therefore, it is necessary to repeat the positioning of each FPC, but the accuracy of the repeated positioning of the FPC is relatively high. It is required that the accuracy of each positioning cannot be fully guaranteed in actual production; at the same time, due to the poor strength of the FPC board itself, the current assembly process produces parts with electronic components, the overall defect rate is high, and welding after positioning one by one causes production Low efficiency and poor mass production.
  • step S21 by stamping the sheet into a plurality of interconnected metal substrates of preset shapes, continuous production or mass production can be realized in each subsequent step, which is beneficial to improve production efficiency;
  • the sheet can be stamped into a shape that meets the customer’s functional needs and quantified molding through a precision stamping die; the metal base material is packaged in a reel, and when processing in the next step, it can be driven by an automatic traction device or a feeding device Rotation of the disc is conducive to automatic feeding.
  • the metal base material can be made from a metal alloy (such as alloy, copper, stainless steel, etc.) sheet with a thickness of 0.05mm ⁇ 0.2mm (such as 0.05mm, 0.1mm, 0.15mm, 02mm, etc.) through a precision stamping die. Simple and high production efficiency; in addition to stamping and forming, metal substrates can also be processed by wire cutting and other methods
  • step S22 it may include: plating an anti-oxidation layer on the surface of the metal substrate; plating a soldering flux layer outside the anti-oxidation layer to form a plurality of interconnected metal lines 2 and perform reel packaging to form a plurality of mutual Connect the metal circuit 2 and carry out reel packaging.
  • the anti-oxidation layer can be formed by nickel plating to avoid oxidation of the metal substrate; the anti-oxidation layer can be plated with gold or tin to form a soldering layer, or both gold and tin can be plated to achieve better soldering. effect.
  • the formation of the anti-oxidation layer level soldering layer is not limited to the above limitation.
  • the injection temperature can be 250°C to 390°C, for example, 250°C, 270°C, 290°C, 310°C, 330°C, 350°C, 370°C, 390°C, etc. can be selected;
  • the time can be from 5s to 15s, for example, 5s, 7s, 9s, 11s, 13s, 15s, etc. can be selected.
  • the plastic part 1 can be partially covered with the metal circuit 2, for example, the metal circuit 2 is partly covered inside the plastic part 1, or the metal circuit 2 is accommodated and fixed in the limiting groove formed on the surface of the plastic part 1. In order to ensure the firmness of the connection between the metal circuit 2 and the plastic part 1.
  • the soldering temperature may be 150°C to 350°C, for example, 150°C, 190°C, 210°C, 250°C, 280°C, 310°C, or 350°C.
  • the electronic component 3 is welded by the SMT process, so that the welding process of the electronic component 3 reduces the technical difficulty.
  • the welding electronic component 3 can be positioned through a high-precision mold to avoid the poor positioning of the traditional process.
  • step S25 a plurality of interconnected components with electronic components are cut to form a single component with electronic components, so as to facilitate the assembly of the components with electronic components to corresponding products.
  • this step S25 includes, but is not limited to, cutting off the sheet connected to the second end of each branch of the metal circuit.
  • the cutting machine used in this step can cut multiple interconnected components with electronic components into a single component with electronic components at the same time, so as to improve work efficiency.
  • This embodiment provides a camera module, which includes a lens and a motor configured to drive the lens to move to achieve autofocus, and the motor contains the components with electronic components according to any of the above embodiments.
  • electronic devices with camera functions such as mobile terminals (such as mobile phones, notebooks, tablet computers, etc.), monitors, drones, etc.
  • the camera module includes a lens and
  • the motor is set to drive the lens to move to achieve autofocus.
  • the motor usually includes parts with electronic components (the part with electronic components on the motor is usually called the motor base, or the bottom cover of the motor, or the rear of the motor Cover, etc.), the component with electronic components on the motor can be the component with electronic components in any of the above embodiments, that is, the component with electronic components in any of the above embodiments can be applied to any of the above Functional electronic equipment in the camera module.
  • the camera module of the mobile terminal includes a lens and a special-shaped micromotor configured to drive the lens to move to achieve autofocus.
  • the special-shaped micromotor includes a motor main body and a motor bottom cover. (It can also be called a motor base, or a motor back cover, etc.).
  • the motor bottom cover is a component with electronic components.
  • the motor bottom cover includes: a plastic bottom cover (that is, the plastic part in the above embodiment), a metal circuit, and At least one electronic component, the plastic bottom cover is molded into a preset structural shape as required, the metal circuit is embedded on the plastic bottom cover, and the metal circuit and the plastic bottom cover are integrally injection molded, and at least one electronic component is welded and connected to the metal circuit.
  • the production process of the motor bottom cover is as follows: first form a metal circuit of a preset shape according to the needs, then use the metal circuit as an insert to form a plastic bottom cover with a metal circuit through an in-mold injection process, and then weld at least one electronic component On the metal circuit, the motor bottom cover with electronic components is formed.
  • the components with electronic components and the production process and camera module of the above-mentioned embodiments of the present application can reduce the technical difficulty of the soldering process of electronic components, and the soldering electronic components can be positioned through high-precision molds, avoiding traditional process positioning Bad situation; it can simplify the assembly process of the mobile terminal camera special-shaped micro motor factory and reduce the production cost; it can improve the process efficiency of welding electronic components and improve the component process yield.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Disclosed are a component with an electronic element (3), and a production process therefor and a camera module therewith. The component with an electronic element (3) comprises a plastic member (1), a metal circuit (2) and at least one electronic element (3), wherein the plastic member (1) is of a preset structural shape, the metal circuit (2) is embedded in the plastic member (1), the metal circuit (2) and the plastic member (1) are integrally formed by means of injection molding, and the at least one electronic element (3) is connected to the metal circuit (2) by means of welding.

Description

带有电子元件的部件及其生产工艺和摄像头模组Parts with electronic components and their production process and camera module
本申请要求在2019年6月18日提交中国专利局、申请号为201910527339.X的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 201910527339.X on June 18, 2019, and the entire content of the application is incorporated into this application by reference.
技术领域Technical field
本申请涉及电子元件技术领域，例如带有电子元件的部件及其生产工艺和摄像头模组。This application relates to the technical field of electronic components, such as components with electronic components and their production processes and camera modules.
背景技术Background technique
目前，相关技术中的电子元件的组装，以移动终端摄像头模组中异形微型马达的电子元件的组装为例，如图1所示，通常是先将电子元件如电容元件31’、霍尔元件32’、集成电路(Integrated Circuit，IC)元件33’等焊接在柔性电路板(Flexible Printed Circuit，FPC)2’上，FPC板2’提供电子元件所需的线路，再将FPC板2’粘贴在塑胶部件1’上，这种组装结构，组装复杂性高，生产成本高。At present, the assembly of electronic components in the related art takes the assembly of the electronic components of the special-shaped micro-motor in the mobile terminal camera module as an example. As shown in FIG. 1, the electronic components such as the capacitor element 31' and the Hall element are usually assembled first. 32', Integrated Circuit (IC) components 33', etc. are soldered on the Flexible Printed Circuit (FPC) 2', FPC board 2'provides the circuits required by the electronic components, and then the FPC board 2'is pasted On the plastic component 1', this assembly structure has high assembly complexity and high production cost.
相关技术中给出了一种能够取消FPC板、简化工艺的电子元件的组装工艺，但是该组装工艺需要两次注塑成型，涉及的工艺环节多，包含的结构件数量多，对于生产移动终端摄像头模组中的异形微型马达部件来说，不管是从组装工艺上还是从部件结构上均不是最优的方案，仍存在很大的改进空间。The related art provides an assembly process for electronic components that can eliminate the FPC board and simplify the process. However, the assembly process requires two injection molding, involves many process links, and contains a large number of structural parts. It is important for the production of mobile terminal cameras. For the special-shaped micromotor components in the module, neither the assembly process nor the component structure is the optimal solution, and there is still a lot of room for improvement.
发明内容Summary of the invention
本申请提供带有电子元件的部件及其生产工艺和摄像头模组，以避免相关技术中电子元件的组装复杂性高、生产成本高的情况。This application provides components with electronic components and their production processes and camera modules to avoid the high complexity and high production cost of electronic components in the related art.
本申请采用以下技术方案：This application adopts the following technical solutions:
一种带有电子元件的部件，包括：塑胶件，所述塑胶件具有预设的结构形状；金属线路，所述金属线路嵌于所述塑胶件上，且所述金属线路与所述塑胶件一体注塑成型；及至少一个电子元件，所述至少一个电子元件与所述金属线路焊接连接。A component with electronic components includes: a plastic part, the plastic part has a preset structural shape; a metal circuit, the metal circuit is embedded on the plastic part, and the metal circuit and the plastic part One-piece injection molding; and at least one electronic component, and the at least one electronic component is connected to the metal circuit by welding.
一种带有电子元件的部件的生产工艺，用于生产根据以上述方案所述的带有电子元件的部件，包括：成型金属线路；对所述金属线路进行模内注塑，形成模内注塑半成品；将至少一个电子元件焊接到所述模内注塑半成品上，形成 所述带有电子元件的部件。A production process of a component with electronic components, used for producing the component with electronic components according to the above solution, including: forming a metal circuit; performing in-mold injection on the metal circuit to form an in-mold injection semi-finished product ; At least one electronic component is welded to the in-mold injection molding semi-finished product to form the component with electronic components.
一种摄像头模组，所述摄像头模组包括镜头及设置为驱动所述镜头移动以实现自动对焦的马达，所述马达内含有以上任一个方案所述的带有电子元件的部件。A camera module includes a lens and a motor configured to drive the lens to move to realize automatic focusing, and the motor contains the components with electronic components described in any one of the above solutions.
附图说明Description of the drawings
图1是相关技术中电子元件的组装结构示意图；Figure 1 is a schematic diagram of an assembly structure of electronic components in the related art;
图2是本申请一实施例提供的带有电子元件的部件的结构示意图；2 is a schematic structural diagram of a component with electronic components provided by an embodiment of the present application;
图3是本申请一实施例提供的成型的金属线路的结构示意图；FIG. 3 is a schematic structural diagram of a formed metal circuit provided by an embodiment of the present application;
图4是在图3所示金属线路上注塑成型塑胶件后的结构示意图；4 is a schematic diagram of the structure after injection molding of a plastic part on the metal circuit shown in FIG. 3;
图5是在图4所示的结构上焊接电子元件后的结构示意图；5 is a schematic diagram of the structure after soldering electronic components on the structure shown in FIG. 4;
图6是本申请一实施例提供的带有电子元件的部件的生产工艺的流程图；Fig. 6 is a flow chart of a production process of a component with electronic components provided by an embodiment of the present application;
图7是本申请一实施例提供的带有电子元件的部件的生产工艺的流程图。Fig. 7 is a flowchart of a production process of a component with electronic components provided by an embodiment of the present application.
其中，图1中每个附图标记与部件名称之间的对应关系为：Among them, the corresponding relationship between each reference sign and component name in Figure 1 is:
1’-塑胶部件，2’-FPC板，31’-电容元件，32’-霍尔元件，33’-IC元件；1’-plastic component, 2’-FPC board, 31’-capacitance element, 32’-Hall element, 33’-IC element;
图2至图5中每个附图标记与部件名称之间的对应关系为：The correspondence between each reference sign and component name in Figures 2 to 5 is:
1-塑胶件；1- Plastic parts;
2-金属线路，21-支路，211-第一端部，212-第二端部，213-折弯部；2-Metal line, 21-branch, 211-first end, 212-second end, 213-bending part;
3-电子元件，31-电容元件，32-霍尔元件，33-IC元件。3-Electronic components, 31-capacitance components, 32-Hall components, 33-IC components.
具体实施方式Detailed ways
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“连通”“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的含义。In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral Connection; it can be directly connected or indirectly connected through an intermediary. For those of ordinary skill in the art, the meaning of the above-mentioned terms in this application can be understood according to specific circumstances.
本申请提供了一种带有电子元件的部件及其生产工艺和摄像头模组，下面给出多个实施例对本申请提供的带有电子元件的部件及其生产工艺和摄像头模组进行详细描述。This application provides a component with electronic components, its production process, and a camera module. A number of embodiments are provided below to describe in detail the component with electronic components, its production process, and camera module provided in this application.
如图2至图5所示，本实施例提供一种带有电子元件的部件，该带有电子元件的部件包括：塑胶件1、金属线路2和至少一个电子元件3。As shown in FIGS. 2 to 5, this embodiment provides a component with electronic components. The component with electronic components includes: a plastic part 1, a metal circuit 2 and at least one electronic component 3.
在一实施例中，如图2所示，塑胶件1具有预设的结构形状，也即可以根 据产品的外形或功能需要，将塑胶件1成型为具有特定功能、且具有预设的结构形状的功能部件，例如塑胶件1可以为移动终端摄像头模组中异形微型马达的底盖(或基座)，该塑胶件1具有预设的结构形状，且能够与其它部件(如马达主体等)进行连接装配，当然塑胶件1也可以是应用于其它场合的功能件；金属线路2嵌于塑胶件1上，且金属线路2与塑胶件1一体注塑成型，也即金属线路2作为嵌件与塑胶件1一体注塑成型，且注塑成型后金属线路2固定在塑胶件1上，与塑胶件1形成为一体；至少一个电子元件3与金属线路2焊接连接。In one embodiment, as shown in FIG. 2, the plastic part 1 has a preset structural shape, that is, the plastic part 1 can be molded to have a specific function and a preset structural shape according to the shape or function requirements of the product For example, the plastic part 1 can be the bottom cover (or base) of the special-shaped micro motor in the camera module of the mobile terminal. The plastic part 1 has a preset structural shape and can be combined with other parts (such as the motor body, etc.) For connection and assembly, of course, the plastic part 1 can also be a functional part used in other occasions; the metal circuit 2 is embedded on the plastic part 1, and the metal circuit 2 and the plastic part 1 are integrally injection molded, that is, the metal circuit 2 is used as an insert and The plastic part 1 is integrally injection-molded, and after the injection molding, the metal circuit 2 is fixed on the plastic part 1 to be integrated with the plastic part 1; at least one electronic component 3 is welded to the metal circuit 2.
上述实施例中，金属线路2与塑胶件1一体注塑成型，电子元件3焊接于注塑成型后的金属线路2上，从而取消FPC板，简化生产工艺，降低电子元件3组装的复杂性，降低生产成本。可以理解的是，金属线路2嵌于塑胶件1上且与塑胶件1一体注塑成型，塑胶件1作为金属线路2的支撑载体，提高金属线路2的结构强度，确保在金属线路2上焊接电子元件3时的可操作性、以及焊接完成后金属线路2与电子元件3连接的牢固性；并且通过一次注塑而成的塑胶件1，具有预设的结构形状，既作为金属线路2的支撑载体，又作为产品的功能件如摄像头马达的底盖，也即可以根据产品的外形或功能需要，将塑胶件1成型为具有特定功能、且具有预设的结构形状的功能部件，这样既简化生产工艺，又减少结构件的数量，不管从组装工艺上还是从部件结构上，都使得电子元件3的组装复杂性大大降低，生产成本大大降低。In the above embodiment, the metal circuit 2 and the plastic part 1 are integrally injection-molded, and the electronic component 3 is welded to the injection-molded metal circuit 2, thereby eliminating the FPC board, simplifying the production process, reducing the assembly complexity of the electronic component 3, and reducing production cost. It is understandable that the metal circuit 2 is embedded on the plastic part 1 and integrated with the plastic part 1 by injection molding. The plastic part 1 serves as a support carrier for the metal circuit 2 to improve the structural strength of the metal circuit 2 and ensure that the electronic welding on the metal circuit 2 The operability of the component 3 and the firmness of the connection between the metal circuit 2 and the electronic component 3 after the soldering is completed; and the plastic part 1 formed by one-shot injection has a preset structural shape and serves as a support carrier for the metal circuit 2 , And as a functional part of the product, such as the bottom cover of the camera motor, the plastic part 1 can be molded into a functional part with a specific function and a preset structural shape according to the shape or functional needs of the product, which simplifies the production The process also reduces the number of structural parts, whether from the assembly process or the component structure, the assembly complexity of the electronic component 3 is greatly reduced, and the production cost is greatly reduced.
在一实施例中，如图3、图4和图5所示，金属线路2包括多个支路21，每个支路21被部分包覆于塑胶件1的内部，每个支路21包括第一端部211和第二端部212，每个支路21的第一端部211至少部分外露于塑胶件1的表面以与电子元件3焊接连接，每个支路21的第二端部212伸出塑胶件1。该实施例中，每个支路21被部分包覆于塑胶件1的内部，以提高塑胶件1对金属线路2固定的牢固性，并提高金属线路2的结构强度，确保金属线路2与电子元件3连接的牢固性；为了实现电子元件3与金属线路2焊接连接，设计金属线路2的每个支路21的第一端部211外露于塑胶件1的表面，电子元件3与支路21的第一端部211焊接连接；每个支路21的第二端部212伸出塑胶件1，以便于支路21的第二端部212与外部部件进行接线。In an embodiment, as shown in FIGS. 3, 4, and 5, the metal circuit 2 includes a plurality of branches 21, each branch 21 is partially covered inside the plastic member 1, and each branch 21 includes The first end 211 and the second end 212, the first end 211 of each branch 21 is at least partially exposed on the surface of the plastic part 1 to be welded to the electronic component 3, and the second end of each branch 21 212 extends the plastic part 1. In this embodiment, each branch 21 is partially covered inside the plastic part 1 to improve the firmness of the plastic part 1 to the metal circuit 2 and to improve the structural strength of the metal circuit 2 to ensure that the metal circuit 2 and the electronics The robustness of the connection of the component 3; in order to realize the welding connection of the electronic component 3 and the metal circuit 2, the first end 211 of each branch 21 of the metal circuit 2 is designed to be exposed on the surface of the plastic part 1, and the electronic component 3 and the branch 21 The first end 211 of each branch 21 is welded and connected; the second end 212 of each branch 21 extends out of the plastic part 1, so that the second end 212 of the branch 21 can be connected to external components.
如图3和图4所示，为了实现每个支路21的第一端部211至少部分外露于塑胶件1的表面，每个支路21上成型有由塑胶件1的内部向塑胶件1的表面折 弯的折弯部213，每个支路21的第一端部211与折弯部213连接，折弯部213的设置还能够增强金属线路2的结构强度；在一实施例中，折弯部213包括相连的第一端和第二端，折弯部213的第二端相对于折弯部213的第一端向塑胶件1的表面折弯，每个支路21的第一端部211与折弯部213的第二端连接。在一实施例中，每个支路21还包括与折弯部213的第一端连接的主体段，主体段整体处于同一平面上，主体段远离折弯部213的一端部为每个支路21的第二端部212，主体段除远离折弯部213的一端部以外，其它部位均被包覆于塑胶件1的内部。As shown in FIGS. 3 and 4, in order to realize that the first end 211 of each branch 21 is at least partially exposed on the surface of the plastic part 1, each branch 21 is formed from the inside of the plastic part 1 toward the plastic part 1. The first end 211 of each branch 21 is connected to the bending portion 213, and the arrangement of the bending portion 213 can also enhance the structural strength of the metal circuit 2; in one embodiment, The bending portion 213 includes a first end and a second end that are connected. The second end of the bending portion 213 is bent toward the surface of the plastic part 1 relative to the first end of the bending portion 213. The first end of each branch 21 The end portion 211 is connected to the second end of the bending portion 213. In an embodiment, each branch 21 further includes a main body section connected to the first end of the bending portion 213, the main body section is on the same plane as a whole, and the end of the main body section away from the bending portion 213 is each branch. The second end portion 212 of 21, except for the end portion away from the bent portion 213, other parts of the main body section are covered inside the plastic part 1.
在一实施例中，金属线路2包括多个支路21，塑胶件1的表面成型有用于容纳多个支路21的限位槽，多个支路21容纳并固定于限位槽内，每个支路21包括第一端部和第二端部，每个支路21的第一端部211与电子元件3焊接连接，每个支路21的第二端部212伸出塑胶件1。该实施例中，利用成型于塑胶件1表面的限位槽对金属线路2进行固定，同样能够确保对金属线路2的牢固固定，从而确保金属线路2与电子元件3连接的牢固性；并且这样设计无需为了实现每个支路21的第一端部211外露而对支路21进行折弯处理，从而使得金属线路2的成型更加方便。In one embodiment, the metal circuit 2 includes a plurality of branches 21, and the surface of the plastic part 1 is formed with a limiting groove for accommodating the plurality of branches 21, and the plurality of branches 21 are accommodated and fixed in the limiting groove, each Each branch 21 includes a first end and a second end. The first end 211 of each branch 21 is connected to the electronic component 3 by welding, and the second end 212 of each branch 21 protrudes from the plastic part 1. In this embodiment, the metal circuit 2 is fixed by the limit groove formed on the surface of the plastic part 1, which can also ensure the firm fixation of the metal circuit 2, thereby ensuring the firmness of the connection between the metal circuit 2 and the electronic component 3; The design does not need to bend the branch 21 in order to realize that the first end 211 of each branch 21 is exposed, so that the forming of the metal circuit 2 is more convenient.
如图2和图5所示，电子元件3的数量可以为多个，多个电子元件3可以包括电容元件31、霍尔元件32和集成电路(Integrated Circuit，IC)元件33中的至少一种；金属线路2的布线结构可以根据电子元件3的设置位置进行合理设计与调整。当然，电子元件3的数量也可以为一个，电子元件3的种类也不限于上述列举。As shown in FIGS. 2 and 5, the number of electronic components 3 may be multiple, and the multiple electronic components 3 may include at least one of a capacitive element 31, a Hall element 32, and an integrated circuit (IC) element 33 ; The wiring structure of the metal circuit 2 can be reasonably designed and adjusted according to the location of the electronic component 3. Of course, the number of electronic components 3 can also be one, and the types of electronic components 3 are not limited to the above list.
如图3所示，金属线路2包括金属基材及覆盖于金属基材表面的防护层，金属基材由片材冲压成型。在一实施例中，金属基材可以由0.05mm～0.2mm(如0.05mm、0.1mm、0.15mm、0.2mm等)厚的金属合金(如合金、铜、不锈钢等)片材通过精密冲压模具冲压而成，冲压成型方式简单，生产效率高；除了冲压成型以外，也可以采用线切割等其他方式加工金属基材。防护层可以包括抗氧化层和助焊层，抗氧化层覆盖于金属基材的表面，助焊层覆盖于抗氧化层的外部；示例性的，抗氧化层可以为镍层，避免金属线路2的金属基材被氧化；助焊层可以为金层、锡层或者金层和锡层的结合，有利于提高电子元件3和金属线路2的焊接质量。As shown in FIG. 3, the metal circuit 2 includes a metal substrate and a protective layer covering the surface of the metal substrate. The metal substrate is stamped and formed from a sheet. In an embodiment, the metal base material can be made from a metal alloy (such as alloy, copper, stainless steel, etc.) sheet with a thickness of 0.05 mm to 0.2 mm (such as 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, etc.) through a precision stamping die It is formed by stamping, the stamping forming method is simple, and the production efficiency is high; in addition to stamping forming, other methods such as wire cutting can also be used to process metal substrates. The protective layer may include an anti-oxidation layer and a soldering assistance layer. The anti-oxidation layer covers the surface of the metal substrate, and the soldering assistance layer covers the outside of the anti-oxidation layer; for example, the anti-oxidation layer may be a nickel layer to avoid metal lines 2 The metal substrate is oxidized; the soldering layer can be a gold layer, a tin layer, or a combination of a gold layer and a tin layer, which is beneficial to improve the welding quality of the electronic component 3 and the metal circuit 2.
为了提高焊接效率，并保证焊接质量，电子元件3与金属线路2通过表面 组装技术(Surface Mounting Technology，SMT)工艺焊接连接，采用SMT工艺焊接电子元件3，能够使电子元件3焊接工艺降低技术难度，焊接电子元件3可以通过高精度模具定位，避免传统工艺定位不好的情况。In order to improve the welding efficiency and ensure the welding quality, the electronic component 3 and the metal circuit 2 are welded and connected through the Surface Mounting Technology (SMT) process. The electronic component 3 is welded by the SMT process, which can reduce the technical difficulty of the electronic component 3 welding process , Welding electronic components 3 can be positioned through high-precision molds to avoid poor positioning in traditional processes.
本实施例提供了一种带有电子元件的部件的生产工艺，如图6所示，包括步骤S11至步骤S13。This embodiment provides a production process of a component with electronic components, as shown in FIG. 6, including steps S11 to S13.
在步骤S11中，成型金属线路2。In step S11, the metal circuit 2 is formed.
在步骤S12中，对金属线路2进行模内注塑，形成模内注塑半成品。In step S12, in-mold injection is performed on the metal circuit 2 to form an in-mold injection molding semi-finished product.
在步骤S13中，将至少一个电子元件3通过SMT工艺焊接到模内注塑半成品上，形成带有电子元件的部件。In step S13, at least one electronic component 3 is welded to the in-mold injection molding semi-finished product through the SMT process to form a component with electronic components.
上述实施例提供的带有电子元件的部件的生产工艺，通过成型金属线路2，并对金属线路2进行模内注塑，将电子元件3直接焊接到模内注塑半成品上，从而取消FPC板，并通过一次注塑成型加一次SMT工艺焊接，完成整个带有电子元件的部件的生产，减少了在塑胶部件上粘贴FPC板的工序，使得电子元件3的组装工艺更加简化，生产成本降低；并且采用SMT工艺焊接电子元件3，使电子元件3焊接工艺降低技术难度，焊接电子元件3可以通过高精度模具定位，避免传统工艺定位不好的情况。The production process of the parts with electronic components provided in the above embodiments is to form the metal circuit 2 and perform in-mold injection on the metal circuit 2, and the electronic components 3 are directly welded to the semi-finished product of the in-mold injection molding, thereby eliminating the FPC board and Through one injection molding and one SMT process welding, the entire production of parts with electronic components is completed, which reduces the process of pasting FPC boards on plastic parts, which simplifies the assembly process of electronic components 3 and reduces production costs; and adopts SMT The process of welding the electronic component 3 reduces the technical difficulty of the welding process of the electronic component 3, and the welding of the electronic component 3 can be positioned by a high-precision mold, avoiding the poor positioning of the traditional process.
本实施例提供了一种带有电子元件的部件的生产工艺，如图7所示，包括步骤S21至步骤S25。This embodiment provides a production process of a component with electronic components, as shown in FIG. 7, including step S21 to step S25.
在步骤S21中，将片材冲压成型为多个相互连接的预设形状的金属基材，并进行卷盘包装。In step S21, the sheet material is stamped into a plurality of interconnected metal base materials of a predetermined shape, and packaged in a reel.
在步骤S22中，对冲压成型后的金属基材进行表面处理，形成多个相互连接的金属线路2，并进行卷盘包装。In step S22, surface treatment is performed on the stamped and formed metal substrate to form a plurality of interconnected metal lines 2 and reel packaging is performed.
在步骤S23中，对金属线路2进行模内注塑，形成模内注塑半成品，并进行卷盘包装。In step S23, in-mold injection is performed on the metal circuit 2 to form an in-mold injection semi-finished product, and the reel packaging is performed.
在步骤S24中，将至少一个电子元件3通过SMT工艺焊接到模内注塑半成品上，形成带有电子元件的部件。In step S24, at least one electronic component 3 is welded to the in-mold injection molding semi-finished product through an SMT process to form a component with electronic components.
在步骤S25中，将带有电子元件的部件从片材上裁切下来，形成单个带有电子元件的部件。In step S25, the component with electronic components is cut from the sheet to form a single component with electronic components.
目前传统的电子元件在FPC板上的焊接通常采用点锡焊接工艺，电子元件通过点焊焊接到FPC板上，因此需要对每个FPC进行重复定位，但是对FPC重复定位的精度具有较高的要求，在实际生产中无法完全保证每次定位的精度； 同时由于FPC板自身的强度差，导致目前的组装工艺生产的带有电子元件的部件，整体不良率高，并且逐个定位后焊接造成生产效率低，量产性不好。At present, the traditional soldering of electronic components on the FPC board usually adopts the spot soldering process. The electronic components are soldered to the FPC board by spot welding. Therefore, it is necessary to repeat the positioning of each FPC, but the accuracy of the repeated positioning of the FPC is relatively high. It is required that the accuracy of each positioning cannot be fully guaranteed in actual production; at the same time, due to the poor strength of the FPC board itself, the current assembly process produces parts with electronic components, the overall defect rate is high, and welding after positioning one by one causes production Low efficiency and poor mass production.
在步骤S21中，通过将片材冲压成型为多个相互连接的预设形状的金属基材，能够在后续的各个步骤中实现连续生产或批量生产，有利于提高生产效率；在一实施例中，可以将片材通过精密冲压模具冲压成满足客户功能需要及成型量化的形状；对金属基材进行卷盘包装，在接下来的步骤中进行加工时，能够通过自动牵引装置或送料装置驱动卷盘转动，有利于实现自动送料。金属基材可以由0.05mm～0.2mm(如0.05mm、0.1mm、0.15mm、02mm等)厚的金属合金(如合金、铜、不锈钢等)片材通过精密冲压模具冲压而成，冲压成型方式简单，生产效率高；除了冲压成型以外，也可以采用线切割等其他方式加工金属基材In step S21, by stamping the sheet into a plurality of interconnected metal substrates of preset shapes, continuous production or mass production can be realized in each subsequent step, which is beneficial to improve production efficiency; in one embodiment , The sheet can be stamped into a shape that meets the customer’s functional needs and quantified molding through a precision stamping die; the metal base material is packaged in a reel, and when processing in the next step, it can be driven by an automatic traction device or a feeding device Rotation of the disc is conducive to automatic feeding. The metal base material can be made from a metal alloy (such as alloy, copper, stainless steel, etc.) sheet with a thickness of 0.05mm～0.2mm (such as 0.05mm, 0.1mm, 0.15mm, 02mm, etc.) through a precision stamping die. Simple and high production efficiency; in addition to stamping and forming, metal substrates can also be processed by wire cutting and other methods
在步骤S22中，可以包括：在金属基材表面镀覆抗氧化层；在抗氧化层外镀覆助焊层，从而形成多个相互连接的金属线路2，并进行卷盘包装形成多个相互连接的金属线路2，并进行卷盘包装。在一实施例中，可以通过镀镍形成抗氧化层，避免金属基材被氧化；在抗氧化层外镀金或镀锡形成助焊层，也可以既镀金也镀锡，实现较好的助焊效果。当然，抗氧化层级助焊层的形成均不限于上述限定。In step S22, it may include: plating an anti-oxidation layer on the surface of the metal substrate; plating a soldering flux layer outside the anti-oxidation layer to form a plurality of interconnected metal lines 2 and perform reel packaging to form a plurality of mutual Connect the metal circuit 2 and carry out reel packaging. In one embodiment, the anti-oxidation layer can be formed by nickel plating to avoid oxidation of the metal substrate; the anti-oxidation layer can be plated with gold or tin to form a soldering layer, or both gold and tin can be plated to achieve better soldering. effect. Of course, the formation of the anti-oxidation layer level soldering layer is not limited to the above limitation.
在步骤S23中，模内注塑成型时，注塑温度可以为250℃～390℃，例如可以选择250℃、270℃、290℃、310℃、330℃、350℃、370℃、390℃等；注塑时间可以为5s～15s，例如可以选择5s、7s、9s、11s、13s、15s等。模内注塑时，可以使得塑胶件1部分包覆金属线路2，例如金属线路2被部分包覆在塑胶件1的内部，或者金属线路2容纳并被固定于塑胶件1表面成型的限位槽内，从而确保金属线路2与塑胶件1连接的牢固性。In step S23, during in-mold injection molding, the injection temperature can be 250°C to 390°C, for example, 250°C, 270°C, 290°C, 310°C, 330°C, 350°C, 370°C, 390°C, etc. can be selected; The time can be from 5s to 15s, for example, 5s, 7s, 9s, 11s, 13s, 15s, etc. can be selected. During in-mold injection molding, the plastic part 1 can be partially covered with the metal circuit 2, for example, the metal circuit 2 is partly covered inside the plastic part 1, or the metal circuit 2 is accommodated and fixed in the limiting groove formed on the surface of the plastic part 1. In order to ensure the firmness of the connection between the metal circuit 2 and the plastic part 1.
在步骤S24中，采用SMT工艺焊接电子元件3时，焊接温度可以为150℃～350℃，例如可以为150℃、190℃、210℃、250℃、280℃、310℃、350℃。采用SMT工艺焊接电子元件3，使电子元件3焊接工艺降低技术难度，焊接电子元件3可以通过高精度模具定位，避免传统工艺定位不好的情况。In step S24, when the electronic component 3 is soldered using the SMT process, the soldering temperature may be 150°C to 350°C, for example, 150°C, 190°C, 210°C, 250°C, 280°C, 310°C, or 350°C. The electronic component 3 is welded by the SMT process, so that the welding process of the electronic component 3 reduces the technical difficulty. The welding electronic component 3 can be positioned through a high-precision mold to avoid the poor positioning of the traditional process.
在步骤S25中，对多个相互连接的带有电子元件的部件进行裁切，形成单个带有电子元件的部件，以方便将带有电子元件的部件装配到相应的产品上，在一实施例中，在该步骤S25中包括但不限于将连接于金属线路的每一支路的第二端部的片材裁切掉。本步骤采用的裁切机可以实现一次将多个相互连接的 带有电子元件的部件同时裁切成单个带有电子元件的部件，以提高作业效率。In step S25, a plurality of interconnected components with electronic components are cut to form a single component with electronic components, so as to facilitate the assembly of the components with electronic components to corresponding products. In one embodiment In this step S25 includes, but is not limited to, cutting off the sheet connected to the second end of each branch of the metal circuit. The cutting machine used in this step can cut multiple interconnected components with electronic components into a single component with electronic components at the same time, so as to improve work efficiency.
本实施例提供了一种摄像头模组，包括镜头及设置为驱动镜头移动以实现自动对焦的马达，所述马达内含有根据上述任一实施例的带有电子元件的部件。This embodiment provides a camera module, which includes a lens and a motor configured to drive the lens to move to achieve autofocus, and the motor contains the components with electronic components according to any of the above embodiments.
在一实施例中，具有摄像功能的电子设备如移动终端(如手机、笔记本、平板电脑等)、以及监视器、无人机等，其上都安装有摄像头模组，摄像头模组包括镜头及设置为驱动镜头移动以实现自动对焦的马达，马达上通常都包括带有电子元件的部件(在马达上该带有电子元件的部件通常被称为马达基座、或马达底盖、或马达后盖等)，马达上的带有电子元件的部件可以为上述任意一个实施例的带有电子元件的部件，也即上述任意一个实施例的带有电子元件的部件可以应用到上述任一个具有摄像功能的电子设备的摄像头模组中。In one embodiment, electronic devices with camera functions such as mobile terminals (such as mobile phones, notebooks, tablet computers, etc.), monitors, drones, etc., are equipped with a camera module, and the camera module includes a lens and The motor is set to drive the lens to move to achieve autofocus. The motor usually includes parts with electronic components (the part with electronic components on the motor is usually called the motor base, or the bottom cover of the motor, or the rear of the motor Cover, etc.), the component with electronic components on the motor can be the component with electronic components in any of the above embodiments, that is, the component with electronic components in any of the above embodiments can be applied to any of the above Functional electronic equipment in the camera module.
以一种移动终端的摄像头模组为例进行说明，该移动终端的摄像头模组包括：镜头及设置为驱动镜头移动以实现自动对焦的异形微型马达，该异形微型马达包括马达主体及马达底盖(也可称为马达基座、或马达后盖等)，该马达底盖为带有电子元件的部件，马达底盖包括：塑胶底盖(即上述实施例中的塑胶件)、金属线路和至少一个电子元件，塑胶底盖根据需要成型为预设的结构形状，金属线路嵌于塑胶底盖上，且金属线路与塑胶底盖一体注塑成型，至少一个电子元件焊接连接于金属线路。该马达底盖的生产工艺为：先根据需要成型预设形状的金属线路，然后将金属线路作为嵌件通过模内注塑工艺注塑成带有金属线路的塑胶底盖，再将至少一个电子元件焊接到金属线路上，形成带有电子元件的马达底盖。Take a camera module of a mobile terminal as an example for description. The camera module of the mobile terminal includes a lens and a special-shaped micromotor configured to drive the lens to move to achieve autofocus. The special-shaped micromotor includes a motor main body and a motor bottom cover. (It can also be called a motor base, or a motor back cover, etc.). The motor bottom cover is a component with electronic components. The motor bottom cover includes: a plastic bottom cover (that is, the plastic part in the above embodiment), a metal circuit, and At least one electronic component, the plastic bottom cover is molded into a preset structural shape as required, the metal circuit is embedded on the plastic bottom cover, and the metal circuit and the plastic bottom cover are integrally injection molded, and at least one electronic component is welded and connected to the metal circuit. The production process of the motor bottom cover is as follows: first form a metal circuit of a preset shape according to the needs, then use the metal circuit as an insert to form a plastic bottom cover with a metal circuit through an in-mold injection process, and then weld at least one electronic component On the metal circuit, the motor bottom cover with electronic components is formed.
综上所述，本申请上述实施例的带有电子元件的部件及其生产工艺和摄像头模组，能够使电子元件焊接工艺降低技术难度，焊接电子元件可通过高精度模具定位，避免传统工艺定位不好的情况；能够简化移动终端摄像头异形微型马达厂组装工艺，降低生产成本；能够提高焊接电子元件的制程效率，提升组件制程良率。In summary, the components with electronic components and the production process and camera module of the above-mentioned embodiments of the present application can reduce the technical difficulty of the soldering process of electronic components, and the soldering electronic components can be positioned through high-precision molds, avoiding traditional process positioning Bad situation; it can simplify the assembly process of the mobile terminal camera special-shaped micro motor factory and reduce the production cost; it can improve the process efficiency of welding electronic components and improve the component process yield.

Claims (12)

  1. 一种带有电子元件的部件，包括：A component with electronic components, including:
    塑胶件(1)，所述塑胶件具有预设的结构形状；Plastic part (1), said plastic part having a preset structural shape;
    金属线路(2)，所述金属线路嵌于所述塑胶件(1)上，且所述金属线路(2)与所述塑胶件(1)一体注塑成型；及A metal circuit (2), the metal circuit is embedded on the plastic part (1), and the metal circuit (2) and the plastic part (1) are integrally injection molded; and
    至少一个电子元件(3)，所述至少一个电子元件与所述金属线路焊接连接(2)。At least one electronic component (3), and the at least one electronic component is soldered to the metal circuit (2).
  2. 根据权利要求1所述的带有电子元件的部件，其中，The component with electronic components according to claim 1, wherein:
    所述金属线路(2)包括多个支路(21)，每个所述支路(21)被部分包覆于所述塑胶件(1)的内部，每个所述支路(21)包括第一端部(211)和第二端部(212)，每个所述支路(21)的第一端部(211)至少部分外露于所述塑胶件(1)的表面以与所述电子元件(3)焊接连接，每个所述支路(21)的第二端部(212)伸出所述塑胶件(1)。The metal circuit (2) includes a plurality of branches (21), each of the branches (21) is partially covered in the plastic part (1), and each of the branches (21) includes The first end (211) and the second end (212), the first end (211) of each branch (21) is at least partially exposed on the surface of the plastic part (1) to interact with the The electronic components (3) are welded and connected, and the second end (212) of each branch (21) protrudes from the plastic part (1).
  3. 根据权利要求2所述的带有电子元件的部件，其中，The component with electronic components according to claim 2, wherein:
    每个所述支路(21)上成型有由所述塑胶件(1)的内部向所述塑胶件(1)的表面折弯的折弯部(213)，每个所述支路(21)的第一端部(211)与所述折弯部(213)连接。Each branch (21) is formed with a bending portion (213) that is bent from the inside of the plastic part (1) to the surface of the plastic part (1), and each branch (21) The first end (211) of) is connected to the bending portion (213).
  4. 根据权利要求1所述的带有电子元件的部件，其中，The component with electronic components according to claim 1, wherein:
    所述金属线路(2)包括多个支路(21)，所述塑胶件(1)的表面成型有用于容纳多个所述支路(21)的限位槽，多个所述支路(21)被容纳并固定于所述限位槽内，每个所述支路(21)包括第一端部(211)和第二端部(212)，每个所述支路(21)的第一端部(211)与所述电子元件(3)焊接连接，每个所述支路(21)的第二端部(212)伸出所述塑胶件(1)。The metal circuit (2) includes a plurality of branches (21), and the surface of the plastic part (1) is formed with a limiting groove for accommodating the plurality of branches (21), and the plurality of branches ( 21) is accommodated and fixed in the limiting groove, each branch (21) includes a first end (211) and a second end (212), each branch (21) The first end (211) is welded and connected to the electronic component (3), and the second end (212) of each branch (21) extends out of the plastic part (1).
  5. 根据权利要求1所述的带有电子元件的部件，其中，The component with electronic components according to claim 1, wherein:
    所述电子元件(3)的数量为多个，多个所述电子元件(3)包括电容元件(31)、霍尔元件(32)和集成电路IC元件(33)中的至少一种。The number of the electronic components (3) is multiple, and the multiple electronic components (3) include at least one of a capacitive element (31), a Hall element (32), and an integrated circuit IC element (33).
  6. 根据权利要求1至5中任一项所述的带有电子元件的部件，其中，The component with electronic components according to any one of claims 1 to 5, wherein:
    所述金属线路(2)包括金属基材及覆盖于所述金属基材表面的防护层，所述金属基材由片材冲压成型。The metal circuit (2) includes a metal substrate and a protective layer covering the surface of the metal substrate, and the metal substrate is stamped and formed from a sheet.
  7. 根据权利要求1至5中任一项所述的带有电子元件的部件，其中，The component with electronic components according to any one of claims 1 to 5, wherein:
    所述电子元件(3)通过表面组装技术SMT，与所述金属线路(2)焊接连接。The electronic component (3) is welded and connected with the metal circuit (2) through the surface assembly technology SMT.
  8. 一种带有电子元件的部件的生产工艺，用于生产根据权利要求1至7中任一项所述的带有电子元件的部件，包括：A production process for a component with electronic components, used for producing the component with electronic components according to any one of claims 1 to 7, comprising:
    成型金属线路(2)；Formed metal circuit (2);
    对所述金属线路(2)进行模内注塑，形成模内注塑半成品；In-mold injection molding of the metal circuit (2) to form an in-mold injection molding semi-finished product;
    将至少一个电子元件(3)焊接到所述模内注塑半成品上，形成所述带有电子元件的部件。At least one electronic component (3) is welded to the in-mold injection molding semi-finished product to form the component with the electronic component.
  9. 根据权利要求8所述的生产工艺，其中，成型所述金属线路(2)时，包括：The production process according to claim 8, wherein the forming of the metal circuit (2) includes:
    将片材冲压成型为多个相互连接的预设形状的金属基材；Stamping and forming the sheet into a plurality of interconnected metal substrates of preset shapes;
    对冲压成型后的所述金属基材进行表面处理，形成多个相互连接的所述金属线路(2)。Surface treatment is performed on the metal substrate after stamping and forming to form a plurality of interconnected metal circuits (2).
  10. 根据权利要求9所述的的生产工艺，其中，The production process according to claim 9, wherein:
    在将所述片材冲压成型为多个相互连接的预设形状的所述金属基材后、在对冲压成型后的所述金属基材进行表面处理之后、以及在对所述金属线路(2)进行模内注塑形成模内注塑半成品后，均进行卷盘包装。After the sheet is stamped into a plurality of interconnected predetermined shapes of the metal substrate, after the stamped and formed metal substrate is subjected to surface treatment, and after the metal circuit (2 ) After in-mold injection molding is performed to form in-mold injection molding semi-finished products, they are all packaged in reel.
  11. 根据权利要求9所述的生产工艺，其中，The production process according to claim 9, wherein:
    将至少一个所述电子元件(3)通过SMT工艺焊接到所述模内注塑半成品上；Welding at least one of the electronic components (3) to the semi-finished product of the in-mold injection molding through the SMT process;
    在将至少一个所述电子元件(3)焊接到所述模内注塑半成品上后，将所述带有所述电子元件的部件从所述片材上裁切下来。After at least one of the electronic components (3) is welded to the semi-finished product of in-mold injection molding, the parts with the electronic components are cut out from the sheet.
  12. 一种摄像头模组，所述摄像头模组包括镜头及设置为驱动所述镜头移动以实现自动对焦的马达，所述马达内含有根据权利要求1至7中任一项所述的带有电子元件的部件。A camera module, the camera module comprising a lens and a motor configured to drive the lens to move to achieve automatic focusing, the motor containing the electronic component according to any one of claims 1 to 7 Parts.
PCT/CN2019/107434 2019-06-18 2019-09-24 Component with electronic element, and production process therefor and camera module therewith WO2020252966A1 (en)

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