WO2020237497A1 - Double-swing-arm die-bonding device for led die bonding and die bonding method therefor - Google Patents

Double-swing-arm die-bonding device for led die bonding and die bonding method therefor Download PDF

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Publication number
WO2020237497A1
WO2020237497A1 PCT/CN2019/088764 CN2019088764W WO2020237497A1 WO 2020237497 A1 WO2020237497 A1 WO 2020237497A1 CN 2019088764 W CN2019088764 W CN 2019088764W WO 2020237497 A1 WO2020237497 A1 WO 2020237497A1
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WO
WIPO (PCT)
Prior art keywords
die
assembly
bonding
crystal
crystal ring
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PCT/CN2019/088764
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French (fr)
Chinese (zh)
Inventor
胡新荣
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深圳新益昌科技股份有限公司
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Priority to PCT/CN2019/088764 priority Critical patent/WO2020237497A1/en
Publication of WO2020237497A1 publication Critical patent/WO2020237497A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Definitions

  • the invention relates to LED processing equipment, in particular to a double-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof.
  • LED Light Emitting Diode
  • LED products can be used in many fields such as lighting, display, and signal indication. With the continuous development of LED technology, the requirements for LED die-bonding speed are getting higher and higher.
  • the existing LED chip bonding process is: because the LED chip is usually glued to the crystal ring film by the supplier, first the ejector mechanism lifts the designated LED chip from the crystal ring film, and then the chip is fixed by the chip bonding mechanism.
  • the crystal swing arm rotates horizontally to directly above the designated LED chip, and then moves up and down to absorb the designated LED chip on the crystal ring film and transport it to the specified position of the dispensed LED bracket.
  • the bonding arm moves up and down to complete the bonding operation . In this way of working, since only one LED chip can be sucked and transported at a time, the work efficiency is low and the die bonding speed is slow.
  • the technical problem to be solved by the present invention is to provide a dual-swing arm die-bonding device for LED die bonding and a die-attaching method thereof, and the purpose of developing the double-swing arm die-bonding device for LED die bonding It reduces LED processing links and improves LED processing efficiency and accuracy.
  • a double-swing arm die-bonding device for LED die bonding the double-swing arm die-bonding device includes:
  • the die-bonding mechanism is provided with two die-bonding pendulum arms, a telescopic drive mechanism that drives the two die-bonding pendulum arms to move toward or in the opposite direction, and is connected and driven to drive the two die-bonding pendulum arms to rotate The rotation drive mechanism;
  • the clamp moving platform is arranged on the adjacent side of the crystal bonding mechanism, and is provided with a first transverse slide rail mechanism, a first longitudinal slide rail mechanism seated on the first transverse slide rail mechanism, and a first longitudinal slide rail mechanism installed on the first transverse slide rail mechanism.
  • a pulley assembly for receiving and conveying the LED bracket at the upper end of the longitudinal slide mechanism, the LED bracket can be conveyed to the clamping part of the two solid crystal swing arms;
  • the mounting frame is vertically fixed on the corner side of the fixture moving platform, the lower surface of the mounting plate at the upper end is provided with a crystal ring moving platform assembly and a thimble assembly, and the crystal ring moving platform assembly is provided with a second transverse slide rail mechanism , A second longitudinal slide rail mechanism arranged on the lower side of the second horizontal slide rail mechanism, a crystal frame mounting plate horizontally arranged on the second longitudinal slide rail mechanism, and a belt mounted on the crystal frame mounting plate A rotating assembly, the belt rotating assembly is provided with a crystal ring placement groove for placing a crystal ring, and the thimble assembly is provided with an LED chip lifting mechanism for lifting the LED chip located on the crystal ring;
  • the lens assembly is arranged on one side of the fixture moving platform, and is provided with a crystal taking lens assembly for cooperating with the crystal ring moving platform assembly to move to a set position and performing chip correction, and for assisting the fixture moving platform to move the LED bracket The die-bonding lens assembly to the set position;
  • the automatic crystal ring mechanism is provided with a material box lifting assembly for lifting the material box and a crystal ring conveying assembly.
  • the material box stores a crystal ring, and the material box lifting assembly raises the material box to a set height.
  • the crystal ring handling component picks up the crystal ring and sends it to the crystal ring placement groove on the crystal ring moving platform assembly.
  • the die-bonding mechanism further includes a die-bonding base fixed on the platen, the top plate of the die-bonding base is provided with a lateral rotation drive mechanism, the rotation drive mechanism and the telescopic drive mechanism There is a rigid connection between the two ends of the telescopic drive mechanism. Both ends of the telescopic drive mechanism are provided with telescopic parts. The outer end of the telescopic part is provided with a connecting block. The connecting block is connected with a die-bonding pendulum arm. The swing arms move toward or opposite to each other to form an open-close loosening or clamping action.
  • the side of the telescopic drive mechanism is also provided with a cross slide rail, and the die-bonding swing arm is driven by the telescopic drive mechanism along the cross slide rail. Telescopic movement, and then the die-bonding swing arm can rotate and telescopically move relative to the die-bonding base in its rotating plane, and the telescopic drive mechanism along with the die-bonding pendulum arm is driven by the rotary drive mechanism and is perpendicular to the horizontal plane. Do a rotating movement in the plane of the
  • the fixture moving platform includes a first base, a first longitudinal slide rail longitudinally arranged on the first base, and a first transverse slide platform transversely provided on the first longitudinal slide rail.
  • the first horizontal sliding table is provided with a first horizontal sliding rail
  • the first horizontal sliding rail is provided with two, which are fixed side by side on the first horizontal sliding table, and the The sliding block forms a first transverse sliding rail mechanism
  • the clamp mounting seat is provided with a pulley assembly
  • the pulley assembly includes a belt and a motor assembly that drives the belt to rotate
  • a support plate connection block is provided on the belt down belt
  • the support plate connection block is connected with a support plate
  • the assembly drives the belt to rotate to drive the pallet to move back and forth.
  • the pallet is used to provide an LED bracket conveying device, which is used to receive and convey the LED bracket, and the pulley assembly passes through the first longitudinal slide rail and the first longitudinal slide rail.
  • the horizontal sliding table moves horizontally and vertically;
  • the first longitudinal slide rail and the first transverse slide table are both driven by motors connected to them.
  • the crystal ring mobile platform assembly includes a second base fixed on the lower end surface of the mounting plate at the upper end of the mounting frame, a second horizontal slide rail disposed transversely on the second base, and a second horizontal slide rail longitudinally disposed on the second horizontal slide rail
  • the first longitudinal slide table is provided with a second longitudinal slide rail
  • the second longitudinal slide rail is provided with a crystal frame mounting plate
  • the crystal frame mounting plate is provided with a belt rotating assembly
  • the belt rotating assembly is provided with a crystal ring placing groove for placing the crystal ring, the crystal ring is fed into the crystal ring placing groove from the automatic crystal ring loading mechanism, and the crystal ring can be performed by the belt rotating assembly Rotate, and can move horizontally and vertically through the second horizontal slide rail and the second longitudinal slide rail;
  • a slider is arranged between the two second transverse slide rails, and the slider is connected to the first motor through the first screw. It forms a second transverse slide mechanism with the second transverse slide, and the first motor drives the screw to rotate to drive the slider and the second longitudinal slide mechanism connected to the lower end of the slider to move;
  • the second longitudinal slide rail mechanism is provided with two second longitudinal slide rails and a slider assembly.
  • the two second longitudinal slide rails are arranged on both sides of the lower end of the first longitudinal slide table.
  • the slider assembly is connected to the second motor through the second screw. ,
  • the second motor drives the second screw to rotate the slider assembly and the crystal frame mounting plate connected with the lower end of the slider assembly to move longitudinally.
  • the thimble assembly includes a thimble and a thimble driving mechanism, the thimble driving mechanism is used to drive the thimble to move up and down, and the thimble is used to push up the wafer at a set position on the crystal ring.
  • the lens assembly includes a lens assembly fixing column, a crystal-taking lens assembly and a die-attach lens assembly.
  • the crystal-taking lens assembly and the die-attach lens assembly are fixed on the upper side of the lens assembly fixing column one by one. Both are equipped with a lens and a camera.
  • the crystal-taking lens assembly is used to coordinate the crystal ring mobile platform assembly to move to a set position and calibrate the wafer, and the die-attach lens assembly is used to coordinate the fixture moving platform to move the LED bracket to the set position.
  • Position, the lens and camera on the crystal lens assembly and the die-attach lens assembly are used for image recognition and storage.
  • the automatic crystal ring loading mechanism includes a magazine lifting assembly and a crystal ring handling assembly
  • the material box lifting assembly includes a third motor, a third screw, a first slider assembly, and a material box.
  • the third motor is installed in the hole of the platen through the motor box.
  • the third screw rod is connected to the first slider assembly, the first slider assembly is horizontally installed with a horizontal plate obliquely upward, the horizontal plate is installed with a material box, and the vertical side plate of the first slider assembly is set in the vertical
  • the vertical slide rail is fixed on the support plate at the upper end of the motor box,
  • the crystal ring conveying assembly is arranged on the adjacent side of the material box lifting assembly, and includes a screw mounting seat, a fourth motor, a fourth screw, a second sliding block assembly, and a crystal ring holding frame.
  • the screw mounting seat is fixed On the platen, a fourth screw is arranged inside, the fourth motor is fixed at one end of the fourth motor, the driving end of the fourth motor is connected to the fourth screw, and the rod of the fourth screw is screwed with crystal
  • the crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding part, the end of the L-shaped bracket is connected to the crystal ring holding part, and the crystal ring holding part is set to hold Cylinder, the clamping part of the clamping cylinder faces the direction of the material box;
  • the cartridge lifting assembly is used to lift the crystal ring stored in the cartridge, the fourth motor drives the fourth screw to rotate to drive the second slider assembly to move, and the second slider assembly drives the crystal ring holding frame to move,
  • the clamping part on the clamping cylinder enters the material box to clamp the crystal ring, and then the crystal ring is transported to the crystal ring placement groove on the crystal ring moving platform assembly through the crystal ring conveying assembly.
  • a method for bonding a dual-swing arm bonding device of an LED bonding machine includes the following steps:
  • Step 1 With the assistance of the die-bonding lens assembly, the system controls the fixture moving platform to move horizontally and vertically, thereby driving the LED bracket on it to move to the die-bonding position;
  • Step 2 With the assistance of the crystal lens assembly, the system control ring moves the platform assembly to move horizontally and longitudinally, thereby driving the crystal ring on it to move to the specified position and correct it;
  • Step 4 The rotary drive mechanism drives one of the die-bonding swing arms to rotate and move directly above the wafer, the ejector pin assembly ejects an LED chip on the die ring, and the driven die-bonding swing arm sucks the ejected wafer and rotates Fix it to the LED bracket at 180°, and at the same time, another die-bonding swing arm rotates at the same angle and moves to just above the chip;
  • Step 5 The ejector pin assembly pushes out another LED chip on the crystal ring, the die-bonding swing arm sucks the chip and then rotates 180° to fix the chip on the LED bracket;
  • Step 6 repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.
  • the present invention is provided with two bonding swing arms for continuous bonding, which improves the bonding efficiency.
  • the invention has a compact structure, saves production space for enterprises, and can adapt to the solid crystal bonding of LED brackets of various sizes without increasing the length of the swing arm. It has multiple functions, better adaptability, and can effectively improve enterprise benefits.
  • FIG. 1 is a schematic diagram of the structure of a dual swing arm die bonding device according to an embodiment of the application.
  • Fig. 2 is an exploded schematic diagram of the dual-swing arm die bonding device according to an embodiment of the application.
  • FIG. 3 is a schematic diagram of the structure of the clamp platform of the dual swing arm die bonding device according to an embodiment of the application.
  • FIG. 4 is a schematic diagram of the structure of the crystal ring moving platform of the dual swing arm crystal bonding device according to an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a lens assembly of a dual-swing arm die bonding device according to an embodiment of the application.
  • FIG. 6 is a schematic diagram of the structure of the thimble assembly of the dual swing arm die bonding device according to an embodiment of the application.
  • FIG. 7 is a schematic diagram of the structure of the double swing arm die bonding mechanism of the double swing arm die bonding device according to an embodiment of the application.
  • FIG. 8 is a schematic diagram of the structure of the automatic crystal loading ring of the dual swing arm crystal bonding device according to an embodiment of the application.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, unless otherwise clearly specified and limited. For example, they can be fixed or detachable. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of the two components, which can be a wireless connection or a wired connection connection.
  • Connected or integrally connected it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of the two components, which can be a wireless connection or a wired connection connection.
  • the specific meaning of the above-mentioned terms in the present invention can be understood in specific situations.
  • Example 1 The specific structure of the present invention is as follows:
  • a dual-swing arm die-bonding device for LED die bonding of the present invention includes:
  • the die-bonding mechanism 6 is provided with two die-bonding pendulum arms 6-4, a telescopic drive mechanism 6-3 that drives the two die-bonding pendulum arms 6-4 to move toward or in the opposite direction, and connects and drives the telescopic drive mechanism 6-3
  • the rotation driving mechanism 6-2 that drives the two die-bonding swing arms 6-4 to rotate;
  • the fixture moving platform 2 is arranged on the adjacent side of the crystal bonding mechanism 6, and is provided with a first lateral slide mechanism, a first longitudinal slide mechanism seated on the first lateral slide mechanism, and a The pulley assembly 2-6 at the upper end of the first longitudinal slide mechanism for receiving and conveying the LED bracket, the LED bracket can be conveyed to the clamping part of the two die-bonding swing arms 6-4;
  • the mounting frame is vertically fixed on the corner side of the fixture moving platform 2.
  • the crystal ring moving platform assembly 3 and the thimble assembly 5 are arranged on the lower bottom surface of the mounting plate at the upper end.
  • the crystal ring moving platform assembly 3 is provided with a second A horizontal slide mechanism, a second longitudinal slide mechanism arranged on the lower side of the second horizontal slide mechanism, a crystal frame mounting plate 3-5 horizontally arranged on the second longitudinal slide mechanism, and
  • the belt rotating assembly 3-6 on the crystal frame mounting plate 3-5, the belt rotating assembly 3-6 is provided with a crystal ring placement groove for placing the crystal ring, and the thimble assembly 5 is provided with a place for lifting
  • the lens assembly 4 is arranged on one side of the fixture moving platform 2, and is provided with a crystal taking lens assembly 4-1 for cooperating with the crystal ring moving platform assembly 3 to move to a set position and performing wafer correction, and an assisting fixture
  • the moving platform 2 moves the LED bracket to the fixed crystal lens assembly 4-2 of the set position;
  • the automatic crystal ring mechanism 7 is provided with a material box lifting assembly 7-1 for lifting the material box and a crystal ring conveying assembly 7-2.
  • the crystal ring is stored in the material box, and the material box lifting assembly 7-1
  • the material box is raised to a set height so that the crystal ring handling assembly 7-2 picks up the crystal ring and sends it to the crystal ring placement groove on the crystal ring moving platform assembly 3.
  • the die bonding mechanism 6 further includes a die bonding base 6-1 fixed on the platen 1, and the top plate of the die bonding base 6-1 is provided with
  • the horizontal rotary drive mechanism 6-2, the rotary drive mechanism 6-2 and the telescopic drive mechanism 6-3 are rigidly connected, both ends of the telescopic drive mechanism 6-3 are provided with telescopic parts, and the outer ends of the telescopic parts are provided
  • Connecting block the connecting block is connected with the die-bonding swing arm 6-4, the two die-bonding swing arms 6-4 are in a straight line and the two die-bonding swing arms 6-4 move towards or opposite to each other, forming a tension-closed loosening or clamping
  • the side of the telescopic drive mechanism 6-3 is also provided with a cross slide 6-5, and the die bond arm 6-4 is driven by the telescopic drive mechanism 6-3 along the cross slide 6-5.
  • the die-bonding swing arm 6-4 can rotate and telescope relative to the die-bonding base 6-1 in its rotating plane, and the telescopic drive mechanism 6-3 follows the die-bonding swing arm 6-4. Together, they are driven by the rotary drive mechanism 6-2 to make a rotary motion along a plane perpendicular to the horizontal plane.
  • the fixture moving platform 2 includes a first base 2-1, a first longitudinal slide rail 2-2 longitudinally arranged on the first base 2-1, and a first longitudinal slide rail 2-2 arranged transversely on the first base 2-1.
  • the first horizontal sliding table 2-3 on the first longitudinal sliding rail 2-2, the first longitudinal sliding rail 2-2 is provided with two, which are fixed side by side on the first base 2-1, and
  • a first longitudinal slide rail mechanism is formed with the slider provided at the lower end of the first horizontal slide table 2-3, and a clamp mounting seat 2-5 is provided on the first horizontal slide rail 2-4;
  • the first horizontal sliding table 2-3 is provided with a first horizontal sliding rail 2-4, the first horizontal sliding rail 2-4 is provided with two, which are fixed side by side on the first horizontal sliding table 2- 3, it forms a first transverse slide rail mechanism with the slider provided at the bottom of the fixture mounting seat 2-5;
  • the clamp mounting seat 2-5 is provided with a pulley assembly 2-6
  • the pulley assembly 2-6 includes a belt 2-7 and a motor assembly that drives the belt to rotate
  • the belt 2-7 is provided with a support plate on the lower belt Connecting block
  • the connecting block of the pallet is connected with a pallet
  • the motor assembly drives the belt to rotate to drive the pallet to move back and forth
  • the pallet is used to be provided with an LED bracket conveying device
  • the LED bracket conveying device is used to receive and convey the LED A bracket
  • the pulley assembly 2-6 is moved horizontally and vertically through the first longitudinal slide rail 2-2 and the first horizontal slide table 2-3;
  • the first longitudinal slide rail 2-2 and the first transverse slide table 2-3 are both driven by motors connected to them.
  • the crystal ring mobile platform assembly 3 includes a second base 3-1 fixed on the lower end surface of the upper end mounting plate of the mounting frame, and a second base 3-1 transversely arranged on the second base 3-1.
  • Two transverse slide rails 3-2, a first longitudinal slide table 3-3 longitudinally arranged on the second transverse slide rail 3-2, the first longitudinal slide table 3-3 is provided with a second longitudinal slide rail 3- 4.
  • the second longitudinal slide rail 3-4 is provided with a crystal frame mounting plate 3-5, the crystal frame mounting plate 3-5 is provided with a belt rotating assembly 3-6, and the belt rotating assembly 3-6
  • the crystal ring is provided with a crystal ring placement groove for placing the crystal ring, the crystal ring is fed into the crystal ring placement groove from the automatic crystal ring mechanism 7, and the crystal ring can be rotated by the belt rotating assembly 3-6, And can move horizontally and longitudinally through the second horizontal slide rail 3-2 and the second longitudinal slide rail 3-4;
  • the first motor is connected through the first screw, which forms a second horizontal slide mechanism with the second horizontal slide 3-2.
  • the first motor drives the screw to rotate and drives the slide and the second longitudinal slide mechanism connected to the lower end of the slide to move ;
  • the second longitudinal slide rail mechanism is provided with two second longitudinal slide rails 3-4 and a slider assembly.
  • the two second longitudinal slide rails 3-4 are provided on both sides of the lower end of the first longitudinal slide table 3-3.
  • the assembly is connected to a second motor through a second screw, and the second motor drives the second screw to rotate and drive the slider assembly and the crystal frame mounting plate 3-5 connected to the lower end of the slider assembly to move longitudinally.
  • the thimble assembly 5 includes a thimble 5-1 and a thimble driving mechanism 5-2, the thimble driving mechanism 5-2 is used to drive the thimble 5-1 to move up and down, and the thimble 5 -1 is used to lift up the wafer at the set position on the crystal ring.
  • the lens assembly 4 includes a lens assembly fixing post, a crystal-taking lens assembly 4-1 and a die-attach lens assembly 4-2, the crystal-taking lens assembly 4-1 and a die-attach lens
  • the assembly 4-2 is fixed on the upper side of the lens assembly fixing column one by one, and a lens and a camera are arranged on it.
  • the crystal taking lens assembly 4-1 is used to cooperate with the crystal ring moving platform assembly 3 to move to a set position
  • the die-bonding lens assembly 4-2 is used to cooperate with the fixture moving platform 2 to move the LED bracket to the set position, the lens on the die-taking lens assembly 4-1 and the die-bonding lens assembly 4-2 And the camera for image recognition and storage.
  • the automatic crystal ring loading mechanism 7 includes a cartridge lifting assembly 7-1 and a crystal ring handling assembly 7-2;
  • the material box lifting assembly 7-1 includes a third motor, a third screw, a first slider assembly, and a material box.
  • the third motor is installed in the hole of the platen through the motor box, and its driving end faces upward and is connected
  • There is a third screw that faces upwards the third screw is connected to the first slider assembly, the first slider assembly is horizontally installed with a horizontal plate obliquely upward, the horizontal plate is installed with a material box, and the vertical side plate of the first slider assembly Set on the vertical slide rail, the vertical slide rail is fixed on the support plate at the upper end of the motor box,
  • the crystal ring transport assembly 7-2 is arranged on the adjacent side of the magazine lifting assembly 7-1, and includes a screw mounting seat, a fourth motor, a fourth screw, a second slider assembly, and a crystal ring holding frame,
  • the screw mounting seat is fixed on the platen, and a fourth screw is arranged in it.
  • One end of the screw is fixed to the fourth motor.
  • the driving end of the fourth motor is connected to the fourth screw.
  • a crystal ring holding frame is screwed on the rod body.
  • the crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding part. The end of the L-shaped bracket is connected to the crystal ring holding part.
  • the clamping part is provided with a clamping cylinder, and the clamping part of the clamping cylinder faces the direction of the cartridge;
  • the cartridge lifting assembly 7-1 is used to lift the crystal ring stored in the cartridge, the fourth motor drives the fourth screw to rotate and then drives the second slider assembly to move, and the second slider assembly drives the crystal ring to clamp
  • the rack moves, the clamping part on the clamping cylinder enters the magazine to clamp the crystal ring, and then the crystal ring is transported to the crystal ring placement groove on the crystal ring moving platform assembly 3 through the crystal ring transport assembly 7-2 Inside.
  • Embodiment 2 A method for bonding a double-swing arm bonding device of an LED bonding machine of the present invention, the method includes the following steps:
  • Step 1 With the assistance of the die-bonding lens assembly 4-2, the system controls the fixture moving platform 2 to move horizontally and vertically to drive the LED bracket on it to move to the die-attach position;
  • Step 2 With the assistance of the crystal lens assembly 4-1, the system control ring mobile platform assembly 3 performs horizontal and vertical movement, thereby driving the crystal ring located on it to move to the specified position and correct it;
  • Step 4 The rotary drive mechanism 6-2 drives one of the die-bonding swing arms 6-4 to rotate and move to the top of the wafer, the ejector pin assembly 5 ejects an LED chip on the die ring, and the driven die-bonding swing arm 6 -4 Take the ejected chip and rotate it 180° to fix it on the LED bracket. At the same time, another die-bonding swing arm 6-4 rotates the same angle and moves to the top of the chip;
  • Step 5 The ejector pin assembly 5 ejects another LED chip on the crystal ring, the die-bonding swing arm 6-4 sucks the chip and then rotates 180° to fix the chip on the LED bracket;
  • Step 6 repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.
  • the present invention provides a dual-swing arm die-bonding device for an LED die-bonding machine.
  • two die-bonding swing arms are provided for continuous die bonding, thereby speeding up the die-attaching speed. , Can greatly improve work efficiency.
  • the die-bonding device of the present invention can adapt to the die-attachment of LED brackets of various sizes without increasing the length of the swing arm. It has multiple functions, better adaptability, simple and compact structure, easy assembly, low cost, and can effectively improve the enterprise benefit.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
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Abstract

Disclosed are a double-swing-arm die-bonding device for LED die bonding and a die bonding method therefor. The die-bonding device comprises a table board and a double-swing-arm die-bonding mechanism disposed on the table board; a wafer ring moving platform is disposed above the double-swing-arm die-bonding mechanism, and a clamp moving platform is disposed below the double-swing-arm die-bonding mechanism; an automatic wafer ring feeding mechanism is disposed on one side of the clamp moving platform, and a lens assembly is disposed on the other side of the clamp moving platform; and an ejector pin assembly is further disposed above the wafer ring moving platform. The lens assembly is used for assisting the wafer ring moving platform and a clamp to move to a designated position; the ejector pin assembly is used for ejecting an LED wafer on the wafer ring moving platform; the double-swing-arm die-bonding mechanism drives two die-bonding arms to rotate within a plane perpendicular to the horizontal plane, and sucks ejected wafers then to fix the ejected wafers to an LED support; and the automatic wafer ring feeding mechanism is used for feeding or recovering a wafer ring. Compared with a conventional die bonding mode, the die-bonding device is used for performing continuous die bonding by disposing the two die-bonding swing arms to rotate, and therefore, the die bonding speed is increased, and the application range is wide.

Description

一种LED固晶的双摆臂固晶装置及其固晶方法Double-swing arm crystal bonding device for LED crystal bonding and crystal bonding method thereof 技术领域Technical field
本发明涉及LED加工设备，具体的说是涉及一种LED固晶的双摆臂固晶装置及其固晶方法。The invention relates to LED processing equipment, in particular to a double-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof.
背景技术Background technique
发光二极管(Light Emitting Diode，LED)是一种能将电能转换为光能的可发光元件。LED产品可用于照明、显示、信号指示等多个领域。随着LED技术的不断发展，对LED固晶速度要求也越来越高。Light Emitting Diode (LED) is a light emitting element that can convert electrical energy into light energy. LED products can be used in many fields such as lighting, display, and signal indication. With the continuous development of LED technology, the requirements for LED die-bonding speed are getting higher and higher.
目前现有的LED固晶过程是：由于LED晶片通常是由供应厂商集中粘在晶环薄膜上，因此首先是顶针机构将指定LED晶片从晶环薄膜上顶起，然后通过固晶机构的固晶摆臂水平旋转到指定LED晶片正上方再上下运动吸取晶环薄膜上的指定LED晶片并将其搬运至已点胶的LED支架指定位置，所述固晶摆臂再上下运动完成固晶作业。这种工作方式，由于一次只能吸取、搬运一个LED晶片，从而工作效率低、固晶速度慢。并且对于大尺寸的LED支架的固晶，传统固晶方式往往需要增加摆臂的长度及重量来满足固晶需求，摆臂长度及重量的增加会使其运动过程中的惯性量增加，进而带来速度及精度的下降。At present, the existing LED chip bonding process is: because the LED chip is usually glued to the crystal ring film by the supplier, first the ejector mechanism lifts the designated LED chip from the crystal ring film, and then the chip is fixed by the chip bonding mechanism. The crystal swing arm rotates horizontally to directly above the designated LED chip, and then moves up and down to absorb the designated LED chip on the crystal ring film and transport it to the specified position of the dispensed LED bracket. The bonding arm moves up and down to complete the bonding operation . In this way of working, since only one LED chip can be sucked and transported at a time, the work efficiency is low and the die bonding speed is slow. And for the die bonding of large-size LED stents, traditional die bonding methods often need to increase the length and weight of the swing arm to meet the needs of die bonding. The increase in the length and weight of the swing arm will increase the amount of inertia during movement, which will lead to Coming speed and accuracy drop.
鉴于现有技术的上述缺陷和市场需求，迫切需要研发一种新型的LED固晶装置。In view of the above-mentioned shortcomings of the prior art and market demand, there is an urgent need to develop a new type of LED die bonding device.
发明内容Summary of the invention
针对现有技术中的不足，本发明要解决的技术问题在于提供了一种LED固晶的双摆臂固晶装置及其固晶方法，研发该LED固晶的双摆臂固晶装置的目的是减少LED加工环节、提高LED加工效率及精度。In view of the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a dual-swing arm die-bonding device for LED die bonding and a die-attaching method thereof, and the purpose of developing the double-swing arm die-bonding device for LED die bonding It reduces LED processing links and improves LED processing efficiency and accuracy.
为解决上述技术问题，本发明通过以下方案来实现：一种LED固晶的双摆臂固晶装置，该双摆臂固晶装置包括：In order to solve the above-mentioned technical problems, the present invention is realized by the following scheme: a double-swing arm die-bonding device for LED die bonding, the double-swing arm die-bonding device includes:
台板；Platen;
还包括设置在所述台板上的：It also includes:
固晶机构，设置有两条固晶摆臂、驱动所述两条固晶摆臂相向或反向运动的伸缩驱动机构以及连接并驱动所述伸缩驱动机构带动所述两条固晶摆臂旋转的旋转驱动机构；The die-bonding mechanism is provided with two die-bonding pendulum arms, a telescopic drive mechanism that drives the two die-bonding pendulum arms to move toward or in the opposite direction, and is connected and driven to drive the two die-bonding pendulum arms to rotate The rotation drive mechanism;
夹具移动平台，设置在所述固晶机构的邻侧，其上设置有第一横向滑轨机构、座于所述第一横向滑轨机构上的第一纵向滑轨机构以及安装在所述第一纵向滑轨机构上端的用于LED支架的接收和输送的皮带轮组件，所述LED支架能够被输送至所述两个固晶摆臂的夹持部；The clamp moving platform is arranged on the adjacent side of the crystal bonding mechanism, and is provided with a first transverse slide rail mechanism, a first longitudinal slide rail mechanism seated on the first transverse slide rail mechanism, and a first longitudinal slide rail mechanism installed on the first transverse slide rail mechanism. A pulley assembly for receiving and conveying the LED bracket at the upper end of the longitudinal slide mechanism, the LED bracket can be conveyed to the clamping part of the two solid crystal swing arms;
安装架，竖置固定在所述夹具移动平台角部侧，其上端的安装板下底面设置有晶环移动平台组件和顶针组件，所述晶环移动平台组件上设置有第二横向滑轨机构、设置在所述第二 横向滑轨机构下侧的第二纵向滑轨机构、水平设置在所述第二纵向滑轨机构上的晶框安装板以及安装在所述晶框安装板上的皮带旋转组件，所述皮带旋转组件上设置有用于放置晶环的晶环置放槽，所述顶针组件设置有用于顶起位于所述晶环上的LED晶片的LED晶片顶起机构；The mounting frame is vertically fixed on the corner side of the fixture moving platform, the lower surface of the mounting plate at the upper end is provided with a crystal ring moving platform assembly and a thimble assembly, and the crystal ring moving platform assembly is provided with a second transverse slide rail mechanism , A second longitudinal slide rail mechanism arranged on the lower side of the second horizontal slide rail mechanism, a crystal frame mounting plate horizontally arranged on the second longitudinal slide rail mechanism, and a belt mounted on the crystal frame mounting plate A rotating assembly, the belt rotating assembly is provided with a crystal ring placement groove for placing a crystal ring, and the thimble assembly is provided with an LED chip lifting mechanism for lifting the LED chip located on the crystal ring;
镜头组件，设置在所述夹具移动平台的一侧，其上设置有用于配合晶环移动平台组件移动到设定位置并进行晶片校正的取晶镜头组件以及用于协助夹具移动平台将LED支架移动到设定位置的固晶镜头组件；The lens assembly is arranged on one side of the fixture moving platform, and is provided with a crystal taking lens assembly for cooperating with the crystal ring moving platform assembly to move to a set position and performing chip correction, and for assisting the fixture moving platform to move the LED bracket The die-bonding lens assembly to the set position;
自动上晶环机构，设置有用于升降料盒的料盒升降组件以及晶环搬运组件，所述料盒内储存有晶环，所述料盒升降组件将所述料盒升至设定高度使所述晶环搬运组件将晶环拾取并送至所述晶环移动平台组件上的晶环置放槽内。The automatic crystal ring mechanism is provided with a material box lifting assembly for lifting the material box and a crystal ring conveying assembly. The material box stores a crystal ring, and the material box lifting assembly raises the material box to a set height. The crystal ring handling component picks up the crystal ring and sends it to the crystal ring placement groove on the crystal ring moving platform assembly.
进一步的，所述固晶机构还包括固定在所述台板上的固晶底座，所述固晶底座的顶部板板面上设置有横向的旋转驱动机构，所述旋转驱动机构与伸缩驱动机构间为刚性连接，所述伸缩驱动机构两端均设置有伸缩部，伸缩部外端设置连接块，连接块连接有固晶摆臂，两个固晶摆臂处于一条直线上且两个固晶摆臂相向或相反运动，形成张合式松开或夹紧动作，所述伸缩驱动机构的侧部还设置有交叉滑轨，所述固晶摆臂在伸缩驱动机构的驱动下沿交叉滑轨进行伸缩运动，进而所述固晶摆臂相对于固晶底座在其旋转面内可进行旋转和伸缩运动，所述伸缩驱动机构随固晶摆臂一起在旋转驱动机构的驱动下沿与水平面相互垂直的平面内做旋转运动。Further, the die-bonding mechanism further includes a die-bonding base fixed on the platen, the top plate of the die-bonding base is provided with a lateral rotation drive mechanism, the rotation drive mechanism and the telescopic drive mechanism There is a rigid connection between the two ends of the telescopic drive mechanism. Both ends of the telescopic drive mechanism are provided with telescopic parts. The outer end of the telescopic part is provided with a connecting block. The connecting block is connected with a die-bonding pendulum arm. The swing arms move toward or opposite to each other to form an open-close loosening or clamping action. The side of the telescopic drive mechanism is also provided with a cross slide rail, and the die-bonding swing arm is driven by the telescopic drive mechanism along the cross slide rail. Telescopic movement, and then the die-bonding swing arm can rotate and telescopically move relative to the die-bonding base in its rotating plane, and the telescopic drive mechanism along with the die-bonding pendulum arm is driven by the rotary drive mechanism and is perpendicular to the horizontal plane. Do a rotating movement in the plane of the
进一步的，所述夹具移动平台包括第一底座、纵向设置于所述第一底座上的第一纵向滑轨、横向设置于所述第一纵向滑轨上的第一横向滑台，所述第一纵向滑轨设置有两个，其并排固定在所述第一底座上，其与设置在所述第一横向滑台下端的滑块形成第一纵向滑轨机构，所述第一横向滑轨上设置有夹具安装座；Further, the fixture moving platform includes a first base, a first longitudinal slide rail longitudinally arranged on the first base, and a first transverse slide platform transversely provided on the first longitudinal slide rail. There are two longitudinal sliding rails, which are fixed side by side on the first base, and the sliding block provided at the lower end of the first horizontal sliding table forms a first longitudinal sliding rail mechanism, the first horizontal sliding rail Fixture mounting seat is provided on it;
所述第一横向滑台上设置有第一横向滑轨，所述第一横向滑轨设置有两个，其并排固定在所述第一横向滑台上，其与设置在夹具安装座底部的滑块形成第一横向滑轨机构；The first horizontal sliding table is provided with a first horizontal sliding rail, the first horizontal sliding rail is provided with two, which are fixed side by side on the first horizontal sliding table, and the The sliding block forms a first transverse sliding rail mechanism;
所述夹具安装座上设置有皮带轮组件，所述皮带轮组件包括皮带及驱动皮带转动的电机组件，所述皮带下行皮带上设置有托板连接块，托板连接块连接有托板，所述电机组件驱动皮带转动进而带动托板往返移动，托板上用于设置有LED支架输送装置，LED支架输送装置用于接收和输送所述LED支架，所述皮带轮组件通过第一纵向滑轨和第一横向滑台进行横向、纵向移动；The clamp mounting seat is provided with a pulley assembly, the pulley assembly includes a belt and a motor assembly that drives the belt to rotate, a support plate connection block is provided on the belt down belt, the support plate connection block is connected with a support plate, and the motor The assembly drives the belt to rotate to drive the pallet to move back and forth. The pallet is used to provide an LED bracket conveying device, which is used to receive and convey the LED bracket, and the pulley assembly passes through the first longitudinal slide rail and the first longitudinal slide rail. The horizontal sliding table moves horizontally and vertically;
所述第一纵向滑轨和第一横向滑台均由与其各自连接的电机驱动。The first longitudinal slide rail and the first transverse slide table are both driven by motors connected to them.
进一步的，所述晶环移动平台组件包括固定在安装架上端安装板下端面的第二底座、横向设置于所述第二底座上的第二横向滑轨、纵向设置于第二横向滑轨上的第一纵向滑台，所 述第一纵向滑台上设置有第二纵向滑轨，所述第二纵向滑轨上设置有晶框安装板，所述晶框安装板上设置有皮带旋转组件，所述皮带旋转组件上设置有用于放置晶环的晶环置放槽，晶环从所述自动上晶环机构送入所述晶环置放槽，所述晶环可利用皮带旋转组件进行旋转，并可以通过第二横向滑轨和第二纵向滑轨进行横向、纵向移动；Further, the crystal ring mobile platform assembly includes a second base fixed on the lower end surface of the mounting plate at the upper end of the mounting frame, a second horizontal slide rail disposed transversely on the second base, and a second horizontal slide rail longitudinally disposed on the second horizontal slide rail The first longitudinal slide table is provided with a second longitudinal slide rail, the second longitudinal slide rail is provided with a crystal frame mounting plate, and the crystal frame mounting plate is provided with a belt rotating assembly , The belt rotating assembly is provided with a crystal ring placing groove for placing the crystal ring, the crystal ring is fed into the crystal ring placing groove from the automatic crystal ring loading mechanism, and the crystal ring can be performed by the belt rotating assembly Rotate, and can move horizontally and vertically through the second horizontal slide rail and the second longitudinal slide rail;
所述第二横向滑轨设置有两个，其设置在所述第二底座下端面两侧，两个第二横向滑轨之间设置有滑块，滑块通过第一螺杆连接第一电机，其与第二横向滑轨形成第二横向滑轨机构，第一电机驱动螺杆旋转带动滑块及与滑块下端连接的第二纵向滑轨机构移动；There are two second transverse slide rails, which are arranged on both sides of the lower end surface of the second base. A slider is arranged between the two second transverse slide rails, and the slider is connected to the first motor through the first screw. It forms a second transverse slide mechanism with the second transverse slide, and the first motor drives the screw to rotate to drive the slider and the second longitudinal slide mechanism connected to the lower end of the slider to move;
第二纵向滑轨机构设置有两个第二纵向滑轨及滑块组件，两个第二纵向滑轨设置在第一纵向滑台的下端两侧，滑块组件通过第二螺杆连接第二电机，第二电机驱动第二螺杆旋转驱动滑块组件及与滑块组件下端连接的晶框安装板进行纵向移动。The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails and a slider assembly. The two second longitudinal slide rails are arranged on both sides of the lower end of the first longitudinal slide table. The slider assembly is connected to the second motor through the second screw. , The second motor drives the second screw to rotate the slider assembly and the crystal frame mounting plate connected with the lower end of the slider assembly to move longitudinally.
进一步的，所述顶针组件包括顶针和顶针驱动机构，所述顶针驱动机构用于驱动顶针上下移动，所述顶针用于顶起位于所述晶环上设定位置的晶片。Further, the thimble assembly includes a thimble and a thimble driving mechanism, the thimble driving mechanism is used to drive the thimble to move up and down, and the thimble is used to push up the wafer at a set position on the crystal ring.
进一步的，所述镜头组件包括镜头组件固定柱、取晶镜头组件和固晶镜头组件，所述取晶镜头组件和固晶镜头组件一上一下固定在所述镜头组件固定柱侧面上部，其上均设置有镜头和相机，所述取晶镜头组件用于配合晶环移动平台组件移动到设定位置并进行晶片的校正，固晶镜头组件用于配合夹具移动平台，将LED支架移动到设定位置，所述取晶镜头组件和固晶镜头组件上的镜头和相机来进行图像的识别及存储。Further, the lens assembly includes a lens assembly fixing column, a crystal-taking lens assembly and a die-attach lens assembly. The crystal-taking lens assembly and the die-attach lens assembly are fixed on the upper side of the lens assembly fixing column one by one. Both are equipped with a lens and a camera. The crystal-taking lens assembly is used to coordinate the crystal ring mobile platform assembly to move to a set position and calibrate the wafer, and the die-attach lens assembly is used to coordinate the fixture moving platform to move the LED bracket to the set position. Position, the lens and camera on the crystal lens assembly and the die-attach lens assembly are used for image recognition and storage.
进一步的，所述自动上晶环机构包括料盒升降组件、晶环搬运组件；Further, the automatic crystal ring loading mechanism includes a magazine lifting assembly and a crystal ring handling assembly;
所述料盒升降组件包括第三电机、第三螺杆、第一滑块组件以及料盒，所述第三电机通过电机盒安装在台板的孔内，其驱动端朝上并连接有朝上的第三螺杆，所述第三螺杆连接第一滑块组件，第一滑块组件斜向上水平安装有水平板，水平板安装有料盒，所述第一滑块组件的竖侧板设置在竖向滑轨上，竖向滑轨固定在电机盒上端的支撑板上，The material box lifting assembly includes a third motor, a third screw, a first slider assembly, and a material box. The third motor is installed in the hole of the platen through the motor box. The third screw rod is connected to the first slider assembly, the first slider assembly is horizontally installed with a horizontal plate obliquely upward, the horizontal plate is installed with a material box, and the vertical side plate of the first slider assembly is set in the vertical The vertical slide rail is fixed on the support plate at the upper end of the motor box,
所述晶环搬运组件设置在所述料盒升降组件邻侧，其包括有螺杆安装座、第四电机、第四螺杆、第二滑块组件以及晶环夹持架，所述螺杆安装座固定在台板上，其内设置有第四螺杆，其一侧端固定所述第四电机，所述第四电机驱动端连接所述第四螺杆，所述第四螺杆的杆体上螺接有晶环夹持架，所述晶环夹持架包括L型支架杆及晶环夹持部，所述L型支架的末端连接所述晶环夹持部，所述晶环夹持部设置夹持气缸，夹持气缸的夹持部朝向料盒的方向；The crystal ring conveying assembly is arranged on the adjacent side of the material box lifting assembly, and includes a screw mounting seat, a fourth motor, a fourth screw, a second sliding block assembly, and a crystal ring holding frame. The screw mounting seat is fixed On the platen, a fourth screw is arranged inside, the fourth motor is fixed at one end of the fourth motor, the driving end of the fourth motor is connected to the fourth screw, and the rod of the fourth screw is screwed with crystal A ring holding frame, the crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding part, the end of the L-shaped bracket is connected to the crystal ring holding part, and the crystal ring holding part is set to hold Cylinder, the clamping part of the clamping cylinder faces the direction of the material box;
所述料盒升降组件用于升降储存在料盒中的晶环，所述第四电机驱动第四螺杆旋转进而带动第二滑块组件移动，第二滑块组件带动晶环夹持架移动，夹持气缸上的夹持部进入料盒将晶环夹取，然后晶环通过所述晶环搬运组件运送至所述晶环移动平台组件上的晶环置放槽 内。The cartridge lifting assembly is used to lift the crystal ring stored in the cartridge, the fourth motor drives the fourth screw to rotate to drive the second slider assembly to move, and the second slider assembly drives the crystal ring holding frame to move, The clamping part on the clamping cylinder enters the material box to clamp the crystal ring, and then the crystal ring is transported to the crystal ring placement groove on the crystal ring moving platform assembly through the crystal ring conveying assembly.
一种LED固晶机的双摆臂固晶装置的固晶方法，该方法包括以下步骤：A method for bonding a dual-swing arm bonding device of an LED bonding machine, the method includes the following steps:
步骤一，在固晶镜头组件的协助下，***控制夹具移动平台做横向、纵向运动，从而带动其上的LED支架移动到固晶位；Step 1. With the assistance of the die-bonding lens assembly, the system controls the fixture moving platform to move horizontally and vertically, thereby driving the LED bracket on it to move to the die-bonding position;
步骤二，在取晶镜头组件的协助下，***控制环移动平台组件做横向、纵向运动，从而带动位于其上的晶环运动指定位置并校正；Step 2: With the assistance of the crystal lens assembly, the system control ring moves the platform assembly to move horizontally and longitudinally, thereby driving the crystal ring on it to move to the specified position and correct it;
步骤四，旋转驱动机构驱动其中一个固晶摆臂旋转移动到晶片正上方，所述顶针组件将晶环上的一个LED晶片顶出，被驱动的固晶摆臂吸取被顶出的晶片后旋转180°将其固到LED支架上，与此同时另一个固晶摆臂旋转相同角度后移动到晶片正上方；Step 4: The rotary drive mechanism drives one of the die-bonding swing arms to rotate and move directly above the wafer, the ejector pin assembly ejects an LED chip on the die ring, and the driven die-bonding swing arm sucks the ejected wafer and rotates Fix it to the LED bracket at 180°, and at the same time, another die-bonding swing arm rotates at the same angle and moves to just above the chip;
步骤五，所述顶针组件将晶环上的另一个LED晶片顶出，该固晶摆臂吸取该晶片后转180°将该晶片固到LED支架上；Step 5: The ejector pin assembly pushes out another LED chip on the crystal ring, the die-bonding swing arm sucks the chip and then rotates 180° to fix the chip on the LED bracket;
步骤六，重复步骤四、步骤五完成整个LED支架的固晶。Step 6, repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.
相对于现有技术，本发明的有益效果是：Compared with the prior art, the beneficial effects of the present invention are:
1、与传统固晶方式相比，本发明设置有两个固晶摆臂进行连续固晶，提高了固晶效率。1. Compared with the traditional bonding method, the present invention is provided with two bonding swing arms for continuous bonding, which improves the bonding efficiency.
2、本发明结构紧凑，为企业节省了生产场地，无需增加摆臂长度就可适应各种尺寸的LED支架的固晶，一机多用，适应性更好，同时可有效提高企业效益。2. The invention has a compact structure, saves production space for enterprises, and can adapt to the solid crystal bonding of LED brackets of various sizes without increasing the length of the swing arm. It has multiple functions, better adaptability, and can effectively improve enterprise benefits.
附图说明Description of the drawings
图1为本申请实施例的双摆臂固晶装置的结构示意图。FIG. 1 is a schematic diagram of the structure of a dual swing arm die bonding device according to an embodiment of the application.
图2为本申请实施例的双摆臂固晶装置的***示意图。Fig. 2 is an exploded schematic diagram of the dual-swing arm die bonding device according to an embodiment of the application.
图3为本申请实施例的双摆臂固晶装置的夹具平台结构示意图。FIG. 3 is a schematic diagram of the structure of the clamp platform of the dual swing arm die bonding device according to an embodiment of the application.
图4为本申请实施例的双摆臂固晶装置的晶环移动平台的结构示意图。4 is a schematic diagram of the structure of the crystal ring moving platform of the dual swing arm crystal bonding device according to an embodiment of the application.
图5为本申请实施例的双摆臂固晶装置的镜头组件的结构示意图。FIG. 5 is a schematic structural diagram of a lens assembly of a dual-swing arm die bonding device according to an embodiment of the application.
图6为本申请实施例的双摆臂固晶装置的顶针组件的结构示意图。FIG. 6 is a schematic diagram of the structure of the thimble assembly of the dual swing arm die bonding device according to an embodiment of the application.
图7为本申请实施例的双摆臂固晶装置的双摆臂固晶机构的结构示意图。FIG. 7 is a schematic diagram of the structure of the double swing arm die bonding mechanism of the double swing arm die bonding device according to an embodiment of the application.
图8为本申请实施例的双摆臂固晶装置的自动上晶环的结构示意图。FIG. 8 is a schematic diagram of the structure of the automatic crystal loading ring of the dual swing arm crystal bonding device according to an embodiment of the application.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，使本发明的优点和特征能更易于被本领域技术人员理解，从而对本发明的保护范围做出更为清楚明确的界定。显然，本发明所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and thus the protection scope of the present invention Make a clearer definition. Obviously, the described embodiments of the present invention are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
在本发明的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the pointed device or element must have a specific orientation or a specific orientation. The structure and operation cannot therefore be understood as a limitation of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，还可以是两个元件内部的连通，可以是无线连接，也可以是有线连接。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise clearly specified and limited. For example, they can be fixed or detachable. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of the two components, which can be a wireless connection or a wired connection connection. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present invention can be understood in specific situations.
此外，下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as there is no conflict between them.
实施例1，本发明的具体结构如下：Example 1. The specific structure of the present invention is as follows:
请参照附图1-8，本发明的一种LED固晶的双摆臂固晶装置，该双摆臂固晶装置包括：Please refer to Figures 1-8, a dual-swing arm die-bonding device for LED die bonding of the present invention, the double-swing arm die-bonding device includes:
台板1；Platen 1;
还包括设置在所述台板1上的：It also includes those set on the platen 1:
固晶机构6，设置有两条固晶摆臂6-4、驱动所述两条固晶摆臂6-4相向或反向运动的伸缩驱动机构6-3以及连接并驱动所述伸缩驱动机构6-3带动所述两条固晶摆臂6-4旋转的旋转驱动机构6-2；The die-bonding mechanism 6 is provided with two die-bonding pendulum arms 6-4, a telescopic drive mechanism 6-3 that drives the two die-bonding pendulum arms 6-4 to move toward or in the opposite direction, and connects and drives the telescopic drive mechanism 6-3 The rotation driving mechanism 6-2 that drives the two die-bonding swing arms 6-4 to rotate;
夹具移动平台2，设置在所述固晶机构6的邻侧，其上设置有第一横向滑轨机构、座于所述第一横向滑轨机构上的第一纵向滑轨机构以及安装在所述第一纵向滑轨机构上端的用于LED支架的接收和输送的皮带轮组件2-6，所述LED支架能够被输送至所述两个固晶摆臂6-4的夹持部；The fixture moving platform 2 is arranged on the adjacent side of the crystal bonding mechanism 6, and is provided with a first lateral slide mechanism, a first longitudinal slide mechanism seated on the first lateral slide mechanism, and a The pulley assembly 2-6 at the upper end of the first longitudinal slide mechanism for receiving and conveying the LED bracket, the LED bracket can be conveyed to the clamping part of the two die-bonding swing arms 6-4;
安装架，竖置固定在所述夹具移动平台2角部侧，其上端的安装板下底面设置有晶环移动平台组件3和顶针组件5，所述晶环移动平台组件3上设置有第二横向滑轨机构、设置在所述第二横向滑轨机构下侧的第二纵向滑轨机构、水平设置在所述第二纵向滑轨机构上的晶框安装板3-5以及安装在所述晶框安装板3-5上的皮带旋转组件3-6，所述皮带旋转组件3-6上设置有用于放置晶环的晶环置放槽，所述顶针组件5设置有用于顶起位于所述晶环上的LED晶片的LED晶片顶起机构；The mounting frame is vertically fixed on the corner side of the fixture moving platform 2. The crystal ring moving platform assembly 3 and the thimble assembly 5 are arranged on the lower bottom surface of the mounting plate at the upper end. The crystal ring moving platform assembly 3 is provided with a second A horizontal slide mechanism, a second longitudinal slide mechanism arranged on the lower side of the second horizontal slide mechanism, a crystal frame mounting plate 3-5 horizontally arranged on the second longitudinal slide mechanism, and The belt rotating assembly 3-6 on the crystal frame mounting plate 3-5, the belt rotating assembly 3-6 is provided with a crystal ring placement groove for placing the crystal ring, and the thimble assembly 5 is provided with a place for lifting The LED chip jacking mechanism of the LED chip on the crystal ring;
镜头组件4，设置在所述夹具移动平台2的一侧，其上设置有用于配合晶环移动平台组件3移动到设定位置并进行晶片校正的取晶镜头组件4-1以及用于协助夹具移动平台2将LED 支架移动到设定位置的固晶镜头组件4-2；The lens assembly 4 is arranged on one side of the fixture moving platform 2, and is provided with a crystal taking lens assembly 4-1 for cooperating with the crystal ring moving platform assembly 3 to move to a set position and performing wafer correction, and an assisting fixture The moving platform 2 moves the LED bracket to the fixed crystal lens assembly 4-2 of the set position;
自动上晶环机构7，设置有用于升降料盒的料盒升降组件7-1以及晶环搬运组件7-2，所述料盒内储存有晶环，所述料盒升降组件7-1将所述料盒升至设定高度使所述晶环搬运组件7-2将晶环拾取并送至所述晶环移动平台组件3上的晶环置放槽内。The automatic crystal ring mechanism 7 is provided with a material box lifting assembly 7-1 for lifting the material box and a crystal ring conveying assembly 7-2. The crystal ring is stored in the material box, and the material box lifting assembly 7-1 The material box is raised to a set height so that the crystal ring handling assembly 7-2 picks up the crystal ring and sends it to the crystal ring placement groove on the crystal ring moving platform assembly 3.
本实施例的一种优选技术方案：所述固晶机构6还包括固定在所述台板1上的固晶底座6-1，所述固晶底座6-1的顶部板板面上设置有横向的旋转驱动机构6-2，所述旋转驱动机构6-2与伸缩驱动机构6-3间为刚性连接，所述伸缩驱动机构6-3两端均设置有伸缩部，伸缩部外端设置连接块，连接块连接有固晶摆臂6-4，两个固晶摆臂6-4处于一条直线上且两个固晶摆臂6-4相向或相反运动，形成张合式松开或夹紧动作，所述伸缩驱动机构6-3的侧部还设置有交叉滑轨6-5，所述固晶摆臂6-4在伸缩驱动机构6-3的驱动下沿交叉滑轨6-5进行伸缩运动，进而所述固晶摆臂6-4相对于固晶底座6-1在其旋转面内可进行旋转和伸缩运动，所述伸缩驱动机构6-3随固晶摆臂6-4一起在旋转驱动机构6-2的驱动下沿与水平面相互垂直的平面内做旋转运动。A preferred technical solution of this embodiment: The die bonding mechanism 6 further includes a die bonding base 6-1 fixed on the platen 1, and the top plate of the die bonding base 6-1 is provided with The horizontal rotary drive mechanism 6-2, the rotary drive mechanism 6-2 and the telescopic drive mechanism 6-3 are rigidly connected, both ends of the telescopic drive mechanism 6-3 are provided with telescopic parts, and the outer ends of the telescopic parts are provided Connecting block, the connecting block is connected with the die-bonding swing arm 6-4, the two die-bonding swing arms 6-4 are in a straight line and the two die-bonding swing arms 6-4 move towards or opposite to each other, forming a tension-closed loosening or clamping For tightening action, the side of the telescopic drive mechanism 6-3 is also provided with a cross slide 6-5, and the die bond arm 6-4 is driven by the telescopic drive mechanism 6-3 along the cross slide 6-5. Perform telescopic movement, and then the die-bonding swing arm 6-4 can rotate and telescope relative to the die-bonding base 6-1 in its rotating plane, and the telescopic drive mechanism 6-3 follows the die-bonding swing arm 6-4. Together, they are driven by the rotary drive mechanism 6-2 to make a rotary motion along a plane perpendicular to the horizontal plane.
本实施例的一种优选技术方案：所述夹具移动平台2包括第一底座2-1、纵向设置于所述第一底座2-1上的第一纵向滑轨2-2、横向设置于所述第一纵向滑轨2-2上的第一横向滑台2-3，所述第一纵向滑轨2-2设置有两个，其并排固定在所述第一底座2-1上，其与设置在所述第一横向滑台2-3下端的滑块形成第一纵向滑轨机构，所述第一横向滑轨2-4上设置有夹具安装座2-5；A preferred technical solution of this embodiment: The fixture moving platform 2 includes a first base 2-1, a first longitudinal slide rail 2-2 longitudinally arranged on the first base 2-1, and a first longitudinal slide rail 2-2 arranged transversely on the first base 2-1. The first horizontal sliding table 2-3 on the first longitudinal sliding rail 2-2, the first longitudinal sliding rail 2-2 is provided with two, which are fixed side by side on the first base 2-1, and A first longitudinal slide rail mechanism is formed with the slider provided at the lower end of the first horizontal slide table 2-3, and a clamp mounting seat 2-5 is provided on the first horizontal slide rail 2-4;
所述第一横向滑台2-3上设置有第一横向滑轨2-4，所述第一横向滑轨2-4设置有两个，其并排固定在所述第一横向滑台2-3上，其与设置在夹具安装座2-5底部的滑块形成第一横向滑轨机构；The first horizontal sliding table 2-3 is provided with a first horizontal sliding rail 2-4, the first horizontal sliding rail 2-4 is provided with two, which are fixed side by side on the first horizontal sliding table 2- 3, it forms a first transverse slide rail mechanism with the slider provided at the bottom of the fixture mounting seat 2-5;
所述夹具安装座2-5上设置有皮带轮组件2-6，所述皮带轮组件2-6包括皮带2-7及驱动皮带转动的电机组件，所述皮带2-7下行皮带上设置有托板连接块，托板连接块连接有托板，所述电机组件驱动皮带转动进而带动托板往返移动，托板上用于设置有LED支架输送装置，LED支架输送装置用于接收和输送所述LED支架，所述皮带轮组件2-6通过第一纵向滑轨2-2和第一横向滑台2-3进行横向、纵向移动；The clamp mounting seat 2-5 is provided with a pulley assembly 2-6, the pulley assembly 2-6 includes a belt 2-7 and a motor assembly that drives the belt to rotate, and the belt 2-7 is provided with a support plate on the lower belt Connecting block, the connecting block of the pallet is connected with a pallet, the motor assembly drives the belt to rotate to drive the pallet to move back and forth, the pallet is used to be provided with an LED bracket conveying device, and the LED bracket conveying device is used to receive and convey the LED A bracket, the pulley assembly 2-6 is moved horizontally and vertically through the first longitudinal slide rail 2-2 and the first horizontal slide table 2-3;
所述第一纵向滑轨2-2和第一横向滑台2-3均由与其各自连接的电机驱动。The first longitudinal slide rail 2-2 and the first transverse slide table 2-3 are both driven by motors connected to them.
本实施例的一种优选技术方案：所述晶环移动平台组件3包括固定在安装架上端安装板下端面的第二底座3-1、横向设置于所述第二底座3-1上的第二横向滑轨3-2、纵向设置于第二横向滑轨3-2上的第一纵向滑台3-3，所述第一纵向滑台3-3上设置有第二纵向滑轨3-4，所述第二纵向滑轨3-4上设置有晶框安装板3-5，所述晶框安装板3-5上设置有皮带旋转组 件3-6，所述皮带旋转组件3-6上设置有用于放置晶环的晶环置放槽，晶环从所述自动上晶环机构7送入所述晶环置放槽，所述晶环可利用皮带旋转组件3-6进行旋转，并可以通过第二横向滑轨3-2和第二纵向滑轨3-4进行横向、纵向移动；A preferred technical solution of this embodiment: the crystal ring mobile platform assembly 3 includes a second base 3-1 fixed on the lower end surface of the upper end mounting plate of the mounting frame, and a second base 3-1 transversely arranged on the second base 3-1. Two transverse slide rails 3-2, a first longitudinal slide table 3-3 longitudinally arranged on the second transverse slide rail 3-2, the first longitudinal slide table 3-3 is provided with a second longitudinal slide rail 3- 4. The second longitudinal slide rail 3-4 is provided with a crystal frame mounting plate 3-5, the crystal frame mounting plate 3-5 is provided with a belt rotating assembly 3-6, and the belt rotating assembly 3-6 The crystal ring is provided with a crystal ring placement groove for placing the crystal ring, the crystal ring is fed into the crystal ring placement groove from the automatic crystal ring mechanism 7, and the crystal ring can be rotated by the belt rotating assembly 3-6, And can move horizontally and longitudinally through the second horizontal slide rail 3-2 and the second longitudinal slide rail 3-4;
所述第二横向滑轨3-2设置有两个，其设置在所述第二底座3-1下端面两侧，两个第二横向滑轨3-2之间设置有滑块，滑块通过第一螺杆连接第一电机，其与第二横向滑轨3-2形成第二横向滑轨机构，第一电机驱动螺杆旋转带动滑块及与滑块下端连接的第二纵向滑轨机构移动；There are two second horizontal sliding rails 3-2, which are arranged on both sides of the lower end surface of the second base 3-1, and sliding blocks are arranged between the two second horizontal sliding rails 3-2. The first motor is connected through the first screw, which forms a second horizontal slide mechanism with the second horizontal slide 3-2. The first motor drives the screw to rotate and drives the slide and the second longitudinal slide mechanism connected to the lower end of the slide to move ；
第二纵向滑轨机构设置有两个第二纵向滑轨3-4及滑块组件，两个第二纵向滑轨3-4设置在第一纵向滑台3-3的下端两侧，滑块组件通过第二螺杆连接第二电机，第二电机驱动第二螺杆旋转驱动滑块组件及与滑块组件下端连接的晶框安装板3-5进行纵向移动。The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails 3-4 and a slider assembly. The two second longitudinal slide rails 3-4 are provided on both sides of the lower end of the first longitudinal slide table 3-3. The assembly is connected to a second motor through a second screw, and the second motor drives the second screw to rotate and drive the slider assembly and the crystal frame mounting plate 3-5 connected to the lower end of the slider assembly to move longitudinally.
本实施例的一种优选技术方案：所述顶针组件5包括顶针5-1和顶针驱动机构5-2，所述顶针驱动机构5-2用于驱动顶针5-1上下移动，所述顶针5-1用于顶起位于所述晶环上设定位置的晶片。A preferred technical solution of this embodiment: the thimble assembly 5 includes a thimble 5-1 and a thimble driving mechanism 5-2, the thimble driving mechanism 5-2 is used to drive the thimble 5-1 to move up and down, and the thimble 5 -1 is used to lift up the wafer at the set position on the crystal ring.
本实施例的一种优选技术方案：所述镜头组件4包括镜头组件固定柱、取晶镜头组件4-1和固晶镜头组件4-2，所述取晶镜头组件4-1和固晶镜头组件4-2一上一下固定在所述镜头组件固定柱侧面上部，其上均设置有镜头和相机，所述取晶镜头组件4-1用于配合晶环移动平台组件3移动到设定位置并进行晶片的校正，固晶镜头组件4-2用于配合夹具移动平台2，将LED支架移动到设定位置，所述取晶镜头组件4-1和固晶镜头组件4-2上的镜头和相机来进行图像的识别及存储。A preferred technical solution of this embodiment: the lens assembly 4 includes a lens assembly fixing post, a crystal-taking lens assembly 4-1 and a die-attach lens assembly 4-2, the crystal-taking lens assembly 4-1 and a die-attach lens The assembly 4-2 is fixed on the upper side of the lens assembly fixing column one by one, and a lens and a camera are arranged on it. The crystal taking lens assembly 4-1 is used to cooperate with the crystal ring moving platform assembly 3 to move to a set position And to calibrate the chip, the die-bonding lens assembly 4-2 is used to cooperate with the fixture moving platform 2 to move the LED bracket to the set position, the lens on the die-taking lens assembly 4-1 and the die-bonding lens assembly 4-2 And the camera for image recognition and storage.
本实施例的一种优选技术方案：所述自动上晶环机构7包括料盒升降组件7-1、晶环搬运组件7-2；A preferred technical solution of this embodiment: the automatic crystal ring loading mechanism 7 includes a cartridge lifting assembly 7-1 and a crystal ring handling assembly 7-2;
所述料盒升降组件7-1包括第三电机、第三螺杆、第一滑块组件以及料盒，所述第三电机通过电机盒安装在台板的孔内，其驱动端朝上并连接有朝上的第三螺杆，所述第三螺杆连接第一滑块组件，第一滑块组件斜向上水平安装有水平板，水平板安装有料盒，所述第一滑块组件的竖侧板设置在竖向滑轨上，竖向滑轨固定在电机盒上端的支撑板上，The material box lifting assembly 7-1 includes a third motor, a third screw, a first slider assembly, and a material box. The third motor is installed in the hole of the platen through the motor box, and its driving end faces upward and is connected There is a third screw that faces upwards, the third screw is connected to the first slider assembly, the first slider assembly is horizontally installed with a horizontal plate obliquely upward, the horizontal plate is installed with a material box, and the vertical side plate of the first slider assembly Set on the vertical slide rail, the vertical slide rail is fixed on the support plate at the upper end of the motor box,
所述晶环搬运组件7-2设置在所述料盒升降组件7-1邻侧，其包括有螺杆安装座、第四电机、第四螺杆、第二滑块组件以及晶环夹持架，所述螺杆安装座固定在台板上，其内设置有第四螺杆，其一侧端固定所述第四电机，所述第四电机驱动端连接所述第四螺杆，所述第四螺杆的杆体上螺接有晶环夹持架，所述晶环夹持架包括L型支架杆及晶环夹持部，所述L型支架的末端连接所述晶环夹持部，所述晶环夹持部设置夹持气缸，夹持气缸的夹持部朝向料盒的方向；The crystal ring transport assembly 7-2 is arranged on the adjacent side of the magazine lifting assembly 7-1, and includes a screw mounting seat, a fourth motor, a fourth screw, a second slider assembly, and a crystal ring holding frame, The screw mounting seat is fixed on the platen, and a fourth screw is arranged in it. One end of the screw is fixed to the fourth motor. The driving end of the fourth motor is connected to the fourth screw. A crystal ring holding frame is screwed on the rod body. The crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding part. The end of the L-shaped bracket is connected to the crystal ring holding part. The clamping part is provided with a clamping cylinder, and the clamping part of the clamping cylinder faces the direction of the cartridge;
所述料盒升降组件7-1用于升降储存在料盒中的晶环，所述第四电机驱动第四螺杆旋转进而带动第二滑块组件移动，第二滑块组件带动晶环夹持架移动，夹持气缸上的夹持部进入料盒将晶环夹取，然后晶环通过所述晶环搬运组件7-2运送至所述晶环移动平台组件3上的晶环置放槽内。The cartridge lifting assembly 7-1 is used to lift the crystal ring stored in the cartridge, the fourth motor drives the fourth screw to rotate and then drives the second slider assembly to move, and the second slider assembly drives the crystal ring to clamp The rack moves, the clamping part on the clamping cylinder enters the magazine to clamp the crystal ring, and then the crystal ring is transported to the crystal ring placement groove on the crystal ring moving platform assembly 3 through the crystal ring transport assembly 7-2 Inside.
实施例2：本发明的一种LED固晶机的双摆臂固晶装置的固晶方法，该方法包括以下步骤：Embodiment 2: A method for bonding a double-swing arm bonding device of an LED bonding machine of the present invention, the method includes the following steps:
步骤一，在固晶镜头组件4-2的协助下，***控制夹具移动平台2做横向、纵向运动，从而带动其上的LED支架移动到固晶位；Step 1: With the assistance of the die-bonding lens assembly 4-2, the system controls the fixture moving platform 2 to move horizontally and vertically to drive the LED bracket on it to move to the die-attach position;
步骤二，在取晶镜头组件4-1的协助下，***控制环移动平台组件3做横向、纵向运动，从而带动位于其上的晶环运动指定位置并校正；Step 2: With the assistance of the crystal lens assembly 4-1, the system control ring mobile platform assembly 3 performs horizontal and vertical movement, thereby driving the crystal ring located on it to move to the specified position and correct it;
步骤四，旋转驱动机构6-2驱动其中一个固晶摆臂6-4旋转移动到晶片正上方，所述顶针组件5将晶环上的一个LED晶片顶出，被驱动的固晶摆臂6-4吸取被顶出的晶片后旋转180°将其固到LED支架上，与此同时另一个固晶摆臂6-4旋转相同角度后移动到晶片正上方；Step 4: The rotary drive mechanism 6-2 drives one of the die-bonding swing arms 6-4 to rotate and move to the top of the wafer, the ejector pin assembly 5 ejects an LED chip on the die ring, and the driven die-bonding swing arm 6 -4 Take the ejected chip and rotate it 180° to fix it on the LED bracket. At the same time, another die-bonding swing arm 6-4 rotates the same angle and moves to the top of the chip;
步骤五，所述顶针组件5将晶环上的另一个LED晶片顶出，该固晶摆臂6-4吸取该晶片后转180°将该晶片固到LED支架上；Step 5: The ejector pin assembly 5 ejects another LED chip on the crystal ring, the die-bonding swing arm 6-4 sucks the chip and then rotates 180° to fix the chip on the LED bracket;
步骤六，重复步骤四、步骤五完成整个LED支架的固晶。Step 6, repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.
综上所述，本发明提供的一种LED固晶机的双摆臂固晶装置，与传统固晶方式相比，通过设置两个固晶摆臂连续进行固晶，从而加快了固晶速度，可大大提高工作效率。同时，本发明固晶装置无需增加摆臂长度就可适应各种尺寸的LED支架的固晶，一机多用，适应性更好，并且其结构简单紧凑，易于装配，成本低，可有效提高企业效益。In summary, the present invention provides a dual-swing arm die-bonding device for an LED die-bonding machine. Compared with the traditional die-bonding method, two die-bonding swing arms are provided for continuous die bonding, thereby speeding up the die-attaching speed. , Can greatly improve work efficiency. At the same time, the die-bonding device of the present invention can adapt to the die-attachment of LED brackets of various sizes without increasing the length of the swing arm. It has multiple functions, better adaptability, simple and compact structure, easy assembly, low cost, and can effectively improve the enterprise benefit.
以上所述仅为本发明的优选实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。The above are only the preferred embodiments of the present invention, and do not limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the description and drawings of the present invention, or directly or indirectly applied to other related The technical field is also included in the scope of patent protection of the present invention.

Claims (8)

  1. 一种LED固晶的双摆臂固晶装置，该双摆臂固晶装置包括：A dual-swing-arm die-bonding device for LED die bonding, which includes:
    台板(1)；Table (1);
    其特征在于，还包括设置在所述台板(1)上的：It is characterized in that, it also includes: set on the platen (1):
    固晶机构(6)，设置有两条固晶摆臂(6-4)、驱动所述两条固晶摆臂(6-4)相向或反向运动的伸缩驱动机构(6-3)以及连接并驱动所述伸缩驱动机构(6-3)带动所述两条固晶摆臂(6-4)旋转的旋转驱动机构(6-2)；The die-bonding mechanism (6) is provided with two die-bonding swing arms (6-4), a telescopic drive mechanism (6-3) that drives the two die-bonding swing arms (6-4) to move toward or in the opposite direction, and A rotary drive mechanism (6-2) that connects and drives the telescopic drive mechanism (6-3) to drive the two die-bonding swing arms (6-4) to rotate;
    夹具移动平台(2)，设置在所述固晶机构(6)的邻侧，其上设置有第一横向滑轨机构、座于所述第一横向滑轨机构上的第一纵向滑轨机构以及安装在所述第一纵向滑轨机构上端的用于LED支架的接收和输送的皮带轮组件(2-6)，所述LED支架能够被输送至所述两个固晶摆臂(6-4)的夹持部；The fixture moving platform (2) is arranged on the adjacent side of the crystal bonding mechanism (6), and is provided with a first lateral slide mechanism and a first longitudinal slide mechanism seated on the first lateral slide mechanism And a pulley assembly (2-6) installed at the upper end of the first longitudinal slide rail mechanism for receiving and conveying the LED bracket, and the LED bracket can be conveyed to the two solid crystal swing arms (6-4) ) Of the clamping part;
    安装架，竖置固定在所述夹具移动平台(2)角部侧，其上端的安装板下底面设置有晶环移动平台组件(3)和顶针组件(5)，所述晶环移动平台组件(3)上设置有第二横向滑轨机构、设置在所述第二横向滑轨机构下侧的第二纵向滑轨机构、水平设置在所述第二纵向滑轨机构上的晶框安装板(3-5)以及安装在所述晶框安装板(3-5)上的皮带旋转组件(3-6)，所述皮带旋转组件(3-6)上设置有用于放置晶环的晶环置放槽，所述顶针组件(5)设置有用于顶起位于所述晶环上的LED晶片的LED晶片顶起机构；The mounting frame is vertically fixed on the corner side of the fixture moving platform (2), and the crystal ring moving platform assembly (3) and the thimble assembly (5) are arranged on the lower bottom surface of the mounting plate at the upper end. The crystal ring moving platform assembly (3) A second lateral slide mechanism, a second longitudinal slide mechanism arranged on the lower side of the second lateral slide mechanism, and a crystal frame mounting plate horizontally arranged on the second longitudinal slide mechanism (3-5) and a belt rotating assembly (3-6) installed on the crystal frame mounting plate (3-5), the belt rotating assembly (3-6) is provided with a crystal ring for placing a crystal ring A placement groove, the thimble assembly (5) is provided with an LED chip jacking mechanism for jacking up the LED chip on the crystal ring;
    镜头组件(4)，设置在所述夹具移动平台(2)的一侧，其上设置有用于配合晶环移动平台组件(3)移动到设定位置并进行晶片校正的取晶镜头组件(4-1)以及用于协助夹具移动平台(2)将LED支架移动到设定位置的固晶镜头组件(4-2)；The lens assembly (4) is arranged on one side of the fixture moving platform (2), on which is arranged a crystal taking lens assembly (4) used to cooperate with the crystal ring moving platform assembly (3) to move to a set position and perform wafer correction -1) And the die-bonding lens assembly (4-2) used to assist the fixture moving platform (2) to move the LED bracket to the set position;
    自动上晶环机构(7)，设置有用于升降料盒的料盒升降组件(7-1)以及晶环搬运组件(7-2)，所述料盒内储存有晶环，所述料盒升降组件(7-1)将所述料盒升至设定高度使所述晶环搬运组件(7-2)将晶环拾取并送至所述晶环移动平台组件(3)上的晶环置放槽内。The automatic crystal ring mechanism (7) is provided with a material box lifting assembly (7-1) and a crystal ring handling assembly (7-2) for lifting the material box, the crystal ring is stored in the material box, and the material box The lifting assembly (7-1) raises the material box to a set height so that the crystal ring handling assembly (7-2) picks up the crystal ring and sends it to the crystal ring on the crystal ring mobile platform assembly (3) Place in the tank.
  2. 根据权利要求1所述的一种LED固晶的双摆臂固晶装置，其特征在于：所述固晶机构(6)还包括固定在所述台板(1)上的固晶底座(6-1)，所述固晶底座(6-1)的顶部板板面上设置有横向的旋转驱动机构(6-2)，所述旋转驱动机构(6-2)与伸缩驱动机构(6-3)间为刚性连接，所述伸缩驱动机构(6-3)两端均设置有伸缩部，伸缩部外端设置连接块，连接块连接有固晶摆臂(6-4)，两个固晶摆臂(6-4)处于一条直线上且两个固晶摆臂(6-4)相向或相反运动，形成张合式松开或夹紧动作，所述伸缩驱动机构(6-3)的侧部还设置有交叉滑轨(6-5)，所述固晶摆臂(6-4)在伸缩驱动机构(6-3)的驱动下沿交叉滑轨(6-5)进行伸缩运动，进而所述固晶摆臂(6-4)相对于固晶底座(6-1)在其旋转面内可进行旋转和伸缩运动，所述伸缩驱动机构(6-3)随固晶摆臂(6-4)一起在旋转驱动机构(6-2)的驱动下 沿与水平面相互垂直的平面内做旋转运动。The dual-swing arm die-bonding device for LED die bonding according to claim 1, wherein the die-bonding mechanism (6) further comprises a die-bonding base (6) fixed on the platen (1). -1), the top plate surface of the die-bonding base (6-1) is provided with a lateral rotary drive mechanism (6-2), the rotary drive mechanism (6-2) and the telescopic drive mechanism (6- 3) There is a rigid connection between the two ends of the telescopic drive mechanism (6-3) are provided with telescopic parts, the outer end of the telescopic part is provided with a connecting block, the connecting block is connected with a solid crystal swing arm (6-4), two fixed The crystal pendulum arm (6-4) is in a straight line and the two die-bonding pendulum arms (6-4) move towards or opposite to each other to form an open-close loosening or clamping action. The telescopic drive mechanism (6-3) The side part is also provided with a cross slide rail (6-5), and the die-bonding swing arm (6-4) is driven by a telescopic drive mechanism (6-3) to move along the cross slide rail (6-5). Furthermore, the die-bonding swing arm (6-4) can rotate and telescopically move relative to the die-bonding base (6-1) in its rotating plane, and the telescopic drive mechanism (6-3) follows the die-bonding swing arm (6-1). 6-4) Rotate together in a plane perpendicular to the horizontal plane under the drive of the rotary drive mechanism (6-2).
  3. 根据权利要求1所述的一种LED固晶的双摆臂固晶装置，其特征在于：所述夹具移动平台(2)包括第一底座(2-1)、纵向设置于所述第一底座(2-1)上的第一纵向滑轨(2-2)、横向设置于所述第一纵向滑轨(2-2)上的第一横向滑台(2-3)，所述第一纵向滑轨(2-2)设置有两个，其并排固定在所述第一底座(2-1)上，其与设置在所述第一横向滑台(2-3)下端的滑块形成第一纵向滑轨机构，所述第一横向滑轨(2-4)上设置有夹具安装座(2-5)；The dual-swing arm die-bonding device for LED die-bonding according to claim 1, characterized in that: the fixture moving platform (2) comprises a first base (2-1), which is longitudinally arranged on the first base (2-1) the first longitudinal slide rail (2-2), the first transverse slide table (2-3) transversely arranged on the first longitudinal slide rail (2-2), the first There are two longitudinal slide rails (2-2), which are fixed side by side on the first base (2-1), and form a sliding block provided at the lower end of the first horizontal slide table (2-3) The first longitudinal slide rail mechanism, wherein a clamp mounting seat (2-5) is provided on the first transverse slide rail (2-4);
    所述第一横向滑台(2-3)上设置有第一横向滑轨(2-4)，所述第一横向滑轨(2-4)设置有两个，其并排固定在所述第一横向滑台(2-3)上，其与设置在夹具安装座(2-5)底部的滑块形成第一横向滑轨机构；The first lateral sliding table (2-3) is provided with a first lateral sliding rail (2-4), and the first lateral sliding rail (2-4) is provided with two, which are fixed side by side on the On a horizontal sliding table (2-3), it forms a first horizontal sliding rail mechanism with the sliding block provided at the bottom of the fixture mounting seat (2-5);
    所述夹具安装座(2-5)上设置有皮带轮组件(2-6)，所述皮带轮组件(2-6)包括皮带(2-7)及驱动皮带转动的电机组件，所述皮带(2-7)下行皮带上设置有托板连接块，托板连接块连接有托板，所述电机组件驱动皮带转动进而带动托板往返移动，托板上用于设置有LED支架输送装置，LED支架输送装置用于接收和输送所述LED支架，所述皮带轮组件(2-6)通过第一纵向滑轨(2-2)和第一横向滑台(2-3)进行横向、纵向移动；The clamp mounting seat (2-5) is provided with a pulley assembly (2-6), the pulley assembly (2-6) includes a belt (2-7) and a motor assembly that drives the belt to rotate, the belt (2-6) -7) A pallet connecting block is provided on the down belt, and the pallet connecting block is connected with a pallet. The motor assembly drives the belt to rotate and then drives the pallet to move back and forth. The pallet is used to provide an LED bracket conveying device, an LED bracket The conveying device is used for receiving and conveying the LED bracket, and the pulley assembly (2-6) moves horizontally and vertically through the first longitudinal slide rail (2-2) and the first horizontal slide table (2-3);
    所述第一纵向滑轨(2-2)和第一横向滑台(2-3)均由与其各自连接的电机驱动。The first longitudinal slide rail (2-2) and the first transverse slide table (2-3) are both driven by motors respectively connected to them.
  4. 根据权利要求1所述的一种LED固晶的双摆臂固晶装置，其特征在于：所述晶环移动平台组件(3)包括固定在安装架上端安装板下端面的第二底座(3-1)、横向设置于所述第二底座(3-1)上的第二横向滑轨(3-2)、纵向设置于第二横向滑轨(3-2)上的第一纵向滑台(3-3)，所述第一纵向滑台(3-3)上设置有第二纵向滑轨(3-4)，所述第二纵向滑轨(3-4)上设置有晶框安装板(3-5)，所述晶框安装板(3-5)上设置有皮带旋转组件(3-6)，所述皮带旋转组件(3-6)上设置有用于放置晶环的晶环置放槽，晶环从所述自动上晶环机构(7)送入所述晶环置放槽，所述晶环可利用皮带旋转组件(3-6)进行旋转，并可以通过第二横向滑轨(3-2)和第二纵向滑轨(3-4)进行横向、纵向移动；The dual-swing arm die-bonding device for LED die-bonding according to claim 1, characterized in that: the crystal ring mobile platform assembly (3) comprises a second base (3) fixed on the lower end of the upper end of the mounting frame. -1), the second horizontal slide rail (3-2) horizontally arranged on the second base (3-1), the first longitudinal slide table vertically arranged on the second horizontal slide rail (3-2) (3-3), the first longitudinal slide (3-3) is provided with a second longitudinal slide (3-4), and the second longitudinal slide (3-4) is provided with a crystal frame mounting Plate (3-5), the crystal frame mounting plate (3-5) is provided with a belt rotating assembly (3-6), and the belt rotating assembly (3-6) is provided with a crystal ring for placing a crystal ring The crystal ring is fed into the crystal ring placing groove from the automatic crystal ring mechanism (7). The crystal ring can be rotated by the belt rotating assembly (3-6) and can pass through the second transverse direction. The slide rail (3-2) and the second longitudinal slide rail (3-4) move horizontally and longitudinally;
    所述第二横向滑轨(3-2)设置有两个，其设置在所述第二底座(3-1)下端面两侧，两个第二横向滑轨(3-2)之间设置有滑块，滑块通过第一螺杆连接第一电机，其与第二横向滑轨(3-2)形成第二横向滑轨机构，第一电机驱动螺杆旋转带动滑块及与滑块下端连接的第二纵向滑轨机构移动；There are two second transverse slide rails (3-2), which are arranged on both sides of the lower end surface of the second base (3-1), and are arranged between the two second transverse slide rails (3-2) There is a sliding block, the sliding block is connected to the first motor through the first screw rod, and the second horizontal sliding rail (3-2) forms a second horizontal sliding rail mechanism. The first motor drives the screw rod to rotate and drives the sliding block and is connected with the lower end of the sliding block The second longitudinal slide rail mechanism moves;
    第二纵向滑轨机构设置有两个第二纵向滑轨(3-4)及滑块组件，两个第二纵向滑轨(3-4)设置在第一纵向滑台(3-3)的下端两侧，滑块组件通过第二螺杆连接第二电机，第二电机驱动第二螺杆旋转驱动滑块组件及与滑块组件下端连接的晶框安装板(3-5)进行纵向移动。The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails (3-4) and a slider assembly, and the two second longitudinal slide rails (3-4) are provided on the first longitudinal slide table (3-3). On both sides of the lower end, the slider assembly is connected to a second motor through a second screw, and the second motor drives the second screw to rotate and drive the slider assembly and the crystal frame mounting plate (3-5) connected to the lower end of the slider assembly to move longitudinally.
  5. 根据权利要求1所述的一种LED固晶的双摆臂固晶装置，其特征在于：所述顶针组件 (5)包括顶针(5-1)和顶针驱动机构(5-2)，所述顶针驱动机构(5-2)用于驱动顶针(5-1)上下移动，所述顶针(5-1)用于顶起位于所述晶环上设定位置的晶片。The dual-swing arm die-bonding device for LED die-attaching according to claim 1, wherein the thimble assembly (5) comprises a thimble (5-1) and a thimble drive mechanism (5-2), and the The thimble driving mechanism (5-2) is used to drive the thimble (5-1) to move up and down, and the thimble (5-1) is used to push up the wafer at a set position on the crystal ring.
  6. 根据权利要求1所述的一种LED固晶的双摆臂固晶装置，其特征在于：所述镜头组件(4)包括镜头组件固定柱、取晶镜头组件(4-1)和固晶镜头组件(4-2)，所述取晶镜头组件(4-1)和固晶镜头组件(4-2)一上一下固定在所述镜头组件固定柱侧面上部，其上均设置有镜头和相机，所述取晶镜头组件(4-1)用于配合晶环移动平台组件(3)移动到设定位置并进行晶片的校正，固晶镜头组件(4-2)用于配合夹具移动平台(2)，将LED支架移动到设定位置，所述取晶镜头组件(4-1)和固晶镜头组件(4-2)上的镜头和相机来进行图像的识别及存储。The dual-swing arm die bonding device for LED die bonding according to claim 1, characterized in that: the lens assembly (4) comprises a lens assembly fixing column, a crystal taking lens assembly (4-1) and a die bonding lens The assembly (4-2), the crystal-taking lens assembly (4-1) and the die-bonding lens assembly (4-2) are fixed on the upper side of the lens assembly fixing column one by one, and a lens and a camera are arranged on them , The crystal taking lens assembly (4-1) is used to cooperate with the crystal ring moving platform assembly (3) to move to a set position and to calibrate the wafer, and the die attach lens assembly (4-2) is used to cooperate with the fixture moving platform ( 2) The LED bracket is moved to the set position, and the lens and camera on the crystal lens assembly (4-1) and the die-bonded lens assembly (4-2) are used for image recognition and storage.
  7. 根据权利要求1所述的一种LED固晶的双摆臂固晶装置，其特征在于：所述自动上晶环机构(7)包括料盒升降组件(7-1)、晶环搬运组件(7-2)；The dual-swing arm die-attachment device for LED die-attachment according to claim 1, characterized in that: the automatic die-up ring mechanism (7) comprises a magazine lifting assembly (7-1) and a die-ring transport assembly ( 7-2);
    所述料盒升降组件(7-1)包括第三电机、第三螺杆、第一滑块组件以及料盒，所述第三电机通过电机盒安装在台板的孔内，其驱动端朝上并连接有朝上的第三螺杆，所述第三螺杆连接第一滑块组件，第一滑块组件斜向上水平安装有水平板，水平板安装有料盒，所述第一滑块组件的竖侧板设置在竖向滑轨上，竖向滑轨固定在电机盒上端的支撑板上，The material box lifting assembly (7-1) includes a third motor, a third screw, a first sliding block assembly and a material box. The third motor is installed in the hole of the platen through the motor box, and its driving end faces upward. And connected with a third upward screw, the third screw is connected to the first slider assembly, the first slider assembly is installed with a horizontal plate obliquely upwards, the horizontal plate is installed with a material box, the vertical of the first slider assembly The side plate is arranged on the vertical slide rail, and the vertical slide rail is fixed on the support plate at the upper end of the motor box,
    所述晶环搬运组件(7-2)设置在所述料盒升降组件(7-1)邻侧，其包括有螺杆安装座、第四电机、第四螺杆、第二滑块组件以及晶环夹持架，所述螺杆安装座固定在台板上，其内设置有第四螺杆，其一侧端固定所述第四电机，所述第四电机驱动端连接所述第四螺杆，所述第四螺杆的杆体上螺接有晶环夹持架，所述晶环夹持架包括L型支架杆及晶环夹持部，所述L型支架的末端连接所述晶环夹持部，所述晶环夹持部设置夹持气缸，夹持气缸的夹持部朝向料盒的方向；The crystal ring handling assembly (7-2) is arranged on the adjacent side of the magazine lifting assembly (7-1), which includes a screw mounting seat, a fourth motor, a fourth screw, a second slider assembly and a crystal ring For the clamping frame, the screw mounting seat is fixed on the platen, and a fourth screw is arranged in it. One end of the screw is fixed to the fourth motor. The driving end of the fourth motor is connected to the fourth screw. A crystal ring holding frame is screwed on the rod body of the fourth screw rod. The crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding part. The end of the L-shaped bracket is connected to the crystal ring holding part, The crystal ring clamping portion is provided with a clamping cylinder, and the clamping portion of the clamping cylinder faces the direction of the material box;
    所述料盒升降组件(7-1)用于升降储存在料盒中的晶环，所述第四电机驱动第四螺杆旋转进而带动第二滑块组件移动，第二滑块组件带动晶环夹持架移动，夹持气缸上的夹持部进入料盒将晶环夹取，然后晶环通过所述晶环搬运组件(7-2)运送至所述晶环移动平台组件(3)上的晶环置放槽内。The material box lifting assembly (7-1) is used to lift the crystal ring stored in the material box, the fourth motor drives the fourth screw to rotate to drive the second slider assembly to move, and the second slider assembly drives the crystal ring The clamping frame moves, the clamping part on the clamping cylinder enters the material box to clamp the crystal ring, and then the crystal ring is transported to the crystal ring moving platform assembly (3) through the crystal ring handling assembly (7-2) The crystal ring is placed in the groove.
  8. 一种以权利要求1-7任意一项所述的LED固晶机的双摆臂固晶装置的固晶方法，其特征在于，该方法包括以下步骤：A method for bonding a dual-swing arm bonding device of an LED bonding machine according to any one of claims 1-7, wherein the method comprises the following steps:
    步骤一，在固晶镜头组件(4-2)的协助下，***控制夹具移动平台(2)做横向、纵向运动，从而带动其上的LED支架移动到固晶位；Step 1: With the assistance of the die-bonding lens assembly (4-2), the system controls the fixture moving platform (2) to move horizontally and longitudinally to drive the LED bracket on it to move to the die-attach position;
    步骤二，在取晶镜头组件(4-1)的协助下，***控制环移动平台组件(3)做横向、纵向运动，从而带动位于其上的晶环运动指定位置并校正；Step 2: With the assistance of the crystal lens assembly (4-1), the system control ring mobile platform assembly (3) performs horizontal and vertical movement, thereby driving the crystal ring located on it to move and correct the specified position;
    步骤四，旋转驱动机构(6-2)驱动其中一个固晶摆臂(6-4)旋转移动到晶片正上方，所述顶针组件(5)将晶环上的一个LED晶片顶出，被驱动的固晶摆臂(6-4)吸取被顶出的晶片后旋转180°将其固到LED支架上，与此同时另一个固晶摆臂(6-4)旋转相同角度后移动到晶片正上方；Step 4: The rotary drive mechanism (6-2) drives one of the die-bonding swing arms (6-4) to rotate and move directly above the wafer, and the thimble assembly (5) pushes out an LED wafer on the wafer ring and is driven The die-bonding arm (6-4) sucks the ejected chip and rotates it 180° to fix it on the LED bracket. At the same time, the other die-bonding arm (6-4) rotates the same angle and moves to the front of the chip. Above
    步骤五，所述顶针组件(5)将晶环上的另一个LED晶片顶出，该固晶摆臂(6-4)吸取该晶片后转180°将该晶片固到LED支架上；Step 5: The ejector pin assembly (5) ejects another LED chip on the crystal ring, the die-bonding swing arm (6-4) sucks the chip and then rotates 180° to fix the chip on the LED support;
    步骤六，重复步骤四、步骤五完成整个LED支架的固晶。Step 6, repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.
PCT/CN2019/088764 2019-05-28 2019-05-28 Double-swing-arm die-bonding device for led die bonding and die bonding method therefor WO2020237497A1 (en)

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CN208655684U (en) * 2018-07-02 2019-03-26 中山市新益昌自动化设备有限公司 A kind of line mini-LED bonder
CN109786311A (en) * 2019-01-28 2019-05-21 深圳市新益昌自动化设备有限公司 A kind of mini-LED high speed bonder and die-bonding method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000241674A (en) * 1999-02-22 2000-09-08 Japan Aviation Electronics Industry Ltd Optical fiber aligning and fixing device
CN202651079U (en) * 2012-06-01 2013-01-02 先进光电器材（深圳）有限公司 Double-swing arm type direct-drive die bonder
CN208655684U (en) * 2018-07-02 2019-03-26 中山市新益昌自动化设备有限公司 A kind of line mini-LED bonder
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