CN208655684U - A kind of line mini-LED bonder - Google Patents
A kind of line mini-LED bonder Download PDFInfo
- Publication number
- CN208655684U CN208655684U CN201821050656.4U CN201821050656U CN208655684U CN 208655684 U CN208655684 U CN 208655684U CN 201821050656 U CN201821050656 U CN 201821050656U CN 208655684 U CN208655684 U CN 208655684U
- Authority
- CN
- China
- Prior art keywords
- component
- die bond
- led
- led support
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Die Bonding (AREA)
Abstract
The utility model relates to a kind of line mini-LED bonders, including rack, feeding mechanism, die bond unit, connecting mechanism, receiving mechanism, there is feeding mechanism in rack one end, multiple die bond units are provided with by feeding mechanism, a connecting mechanism is both provided between every two die bond unit, it is provided with receiving mechanism by the last one die bond unit, is installed with control system in rack；LED support is transmitted in adjacent die bond unit by feeding mechanism, carries out die bond operation by die bond unit, and LED support is transmitted to next die bond unit by connecting mechanism after the completion of die bond operation, until LED support completes all die bonds, then is received by receiving mechanism.For the LED support that need to consolidate a variety of LED wafers, which reduces the middle swivel link of multiple die bond, improves production efficiency；Meanwhile die bond precision is high, die bond speed is fast；In addition, the feeding mechanism of the bonder is applicable to the charging of a plurality of types of LED supports, so that its is applied widely.
Description
Technical field
The utility model belongs to technical field of automation equipment, and in particular to a kind of line mini-LED bonder.
Background technique
Light emitting diode (Light Emitting Diode, LED) is a kind of to convert electrical energy into shining for luminous energy
Element.The multiple fields such as LED product can be used for illuminating, show, signal designation.With LED display continue to develop and it is perfect,
Flip chip with high-power, light efficiency is high, go out light more evenly the advantages that become the mainstream that this several years LED displays use.
Existing die bond technical process is: by the feeding mechanism by LED support be transmitted to die bond unit designated position it
Afterwards, glue applying mechanism starts to carry out LED support dispensing, then draws the chip on LED crystalline substance ring by die bond mechanism and be carried to LED branch
Designated position is on frame to complete die bond operation.Wherein LED wafer is usually to be concentrated on the brilliant ring film being sticked to by supplier
And expand film.
As display screen LED, every LED lamp includes tri- kinds of colors of R/G/B, that is, is needed in each LED light
Three LED chips are fixed, this needs three machines successively to carry out die bond operation；And the glue applying mechanism round trip of traditional bonder
A glue point can only be put, and flip chip needs multiple glue points, this just needs its round-trip multiple dispensing, and working efficiency is low.In addition,
Single, the applicable narrow range of the feeding mechanism feeding manner of traditional bonder.
In view of the drawbacks described above of the prior art, there is an urgent need to research and develop a kind of novel LED bonder.
Utility model content
The utility model be intended to for flip chip present on multi-colored led display screen in practical die bond it is time-consuming long, effect
The problems such as rate is low, fraction defective is high.Aiming at the shortcomings in the prior art, the technical problem to be solved by the present invention is to provide
A kind of line mini-LED bonder.
In order to solve the above technical problems, the utility model is realized by following scheme: a kind of line mini-LED die bond
Machine, the bonder include rack, further include feeding mechanism, die bond unit, connecting mechanism, receiving mechanism, and described rack one end has
Feeding mechanism is provided with multiple die bond units by the feeding mechanism, is wherein provided with one between every two die bond unit and plugs into
Mechanism is provided with receiving mechanism by the last one described die bond unit, is provided with control system in the rack.
Further, the feeding mechanism includes feeding material component, storing component, Belt Conveying component, the feeding material component
Side is provided with storing component, and for the storing component for storing LED support, it is defeated that the storing component other side is provided with belt
Sending component；LED support described in storing component is transported on the Belt Conveying component by the feeding material component, the Belt Conveying
LED support is delivered to die bond unit adjacent thereto or the feeding material component again by component directly will be in the storing component
The LED support of storage pushes to adjacent die bond unit.
The storing component includes the first driving assembly, is connected with support plate, the support on first driving assembly
It is connected with storing frame on plate, is placed with material-storing box on the storing frame；The storing frame can directly store LED support, or
LED support is stored in material-storing box, then is placed on the storing frame；
The feeding material component includes the second longitudinally disposed driving assembly, and one end is connected with cylinder push component；It is described
Cylinder push component is used to push the LED support in the material-storing box to the die bond unit；Connect on second driving assembly
It is connected to third driving assembly, is connected with Suction cup assembly on the third driving assembly；The Suction cup assembly drives by described second
Dynamic component and the third driving assembly are longitudinal and vertically movable, and the Suction cup assembly draws the LED branch in the storing component
Frame, and LED support is put to the Belt Conveying component, the die bond unit is transmitted to by the Belt Conveying component；
The Belt Conveying component includes pedestal, and feeding mechanism belt component, the charger are connected on the pedestal
The motor for being allowed to move is connected on structure belt component.
Further, the die bond unit includes fixture workbench, two point gluing mechanism, die bond mechanism, moves brilliant ring certainly
Mechanism, wafer search platform, ejector pin mechanism, the first CCD component, the 2nd CCD component, the 3rd CCD component, the fixture work are flat
Platform side is provided with the two point gluing mechanism, and the other side is provided with wafer search platform and ejector pin mechanism, and the wafer search is flat
It is provided with by platform from moving brilliant ring mechanism, is provided with die bond mechanism above the fixture workbench, in the die bond mechanism
It is provided with the first CCD component and the 2nd CCD component, is provided with the 3rd CCD component above the wafer search platform；
The fixture workbench includes fixture workbench pedestal, first straight line electric machine assembly, horizontal slide rail, Zong Xiangyi
Moving platform, longitudinal slide rail, second straight line electric machine assembly, jig platform, jig platform belt component, LED support clamping plate, it is described
It is provided with first straight line electric machine assembly on fixture workbench pedestal, is additionally provided with lateral cunning on the fixture workbench pedestal
Rail is provided with longitudinal mobile platform on the first straight line electric machine assembly, is provided with longitudinal slide rail in the longitudinal mobile platform,
It is additionally provided with second straight line electric machine assembly in the longitudinal mobile platform, it is flat that fixture is provided on the second straight line electric machine assembly
Platform；The jig platform is by the driving of the first straight line electric machine assembly and the second straight line electric machine assembly in the transverse direction
Laterally longitudinal move is carried out on sliding rail and longitudinal slide rail to slide, and has the jig platform for transporting the LED support on the jig platform
The clamping plate of belt component and the fixed LED support；
The first CCD component is used to scan the two dimensional code on LED support, and the LED support is recorded by barcode scanning
Information；
The 2nd CCD component is for assisting the fixture workbench that LED support is moved to designated position；
The two point gluing mechanism includes dispensing pedestal, first motor component, the second electric machine assembly of dispensing, zigzag tread patterns group
Part, the first manipulator of dispensing, the second manipulator of dispensing, lacquer disk(-sc) component, automatic glue adding component, the dispensing pan frontward end are connected with
Lacquer disk(-sc) component is stored up, storage lacquer disk(-sc) component one end is connected with automatic glue adding component；Longitudinal drive is additionally provided on the dispensing pedestal
Dynamic component, there are the second electric machine assembly of dispensing first motor component and dispensing, the longitudinal direction in zigzag tread patterns component two sides respectively
Driving assembly lower end is also connected with the second manipulator of the first manipulator of dispensing and dispensing.
Further, the automatic glue adding component can convey glue to the storage lacquer disk(-sc) component, the storage lacquer disk(-sc) group automatically
Part makes the glue of storage be more evenly distributed by rotary motion；The second manipulator of first manipulator of dispensing and the dispensing
It is moved up and down respectively by the driving of the second electric machine assembly of the dispensing first motor component and the dispensing, by described
The driving of zigzag tread patterns component is moved forward and backward；First manipulator of dispensing and the second manipulator of the dispensing carry out front and back
With move up and down successively from the storage lacquer disk(-sc) component on viscose glue point to LED support designated position, to complete dispensing operation.
Further, described to move brilliant ring mechanism certainly including pressing from both sides brilliant ring assemblies, storage crystalline substance ring assemblies, the folder crystalline substance ring assemblies one
Side is provided with the brilliant ring assemblies of storage, described to store up the brilliant ring being placed on brilliant ring assemblies for bearing wafer；The brilliant ring assemblies of the folder will
It is placed in the brilliant ring stored up on brilliant ring assemblies to clamp, and is moved to designated position.
Further, the wafer search platform includes the first driving assembly of search platform, the second driving group of search platform
Part, brilliant ring automatically correct platform, the first driving assembly of described search platform, are installed on the second driving assembly of described search platform
Brilliant ring automatically corrects platform, and the crystalline substance ring, which automatically corrects, is installed with brilliant ring on platform；
The 3rd CCD component passes through the first driving group of described search platform for assisting the brilliant ring to automatically correct platform
Part and the second driving assembly of described search platform, which drive, is moved to designated position for brilliant ring；The crystalline substance ring automatically corrects platform and passes through
Rotation is to correct the wafer position on brilliant ring.
Further, the ejector pin mechanism includes ejector pin component and the adjustment component for finely tuning thimble position.The top
Needle assemblies are used to jack up the chip of designated position on brilliant ring.
Further, the die bond mechanism includes the die bond pedestal of bottom end, die bond swing arm unit, on the die bond pedestal
Connect die bond swing arm unit；The die bond swing arm unit draws chip from the designated position on brilliant ring, and is transported on LED support
Designated position, complete die bond operation.
Further, the connecting mechanism includes connecting mechanism pedestal, belt component, connecting mechanism motor, described to plug into
It is provided with the belt component of transport LED support on mechanism base, is connected with connecting mechanism motor on the belt component；It is described to connect
It refutes mechanism motor and drives the belt component movement, to drive LED support disposed thereon mobile.
Further, the receiving mechanism includes rewinding storing case assembly and rewinding connecting mechanism component；The rewinding storage
Magazine component is used to receive the LED support for transmitting out from the last one die bond unit, and the rewinding connecting mechanism component receives
It is docked after LED support with machine.
Compared with the existing technology, the beneficial effects of the utility model are:
1. the utility model bonder realizes connection line operation by the way that multiple connecting mechanisms are arranged, and it optimizes die bond
Technique reduces the middle swivel link of multiple die bond, improves production efficiency.
2. the dispensing operation for flip chip is that two point gluing mechanism is successively acted by two dispensing machinery hands, effectively mention
High working efficiency.
3. being further provided with automatic glue adding component on the two point gluing mechanism of bonder, artificial plus glue time is saved, again
It improves work efficiency.
4. there are many method transmitted for different types of LED support, the scope of applications for the feeding mechanism
Wider, in addition feeding connecting mechanism can also be docked with machine.
5. the die bond information of its LED support stored by the storage device, and the information can be shared to local area network
Or wide area network reads for other terminating machines and uses, so that subsequent handling can carry out the selection of LED according to the information, this mode is grasped
Make simply, it is convenient for management, working efficiency can be effectively improved.
6. wafer search platform described in the 3rd CCD component assists automatically corrects angle chip devious, to improve
Precision when die bond.
7. the bonder is simple and compact for structure, occupied area is small.
Detailed description of the invention
Fig. 1 is a kind of line mini-LED bonder axonometric drawing of the utility model；
Fig. 2 is a kind of line mini-LED bonder explosive view of the utility model；
Fig. 3 is the feeding mechanism explosive view of the utility model；
Fig. 4 is the feeding mechanism feeding material component axonometric drawing of the utility model；
Fig. 5 is the feeding mechanism storing component axonometric drawing of the utility model；
Fig. 6 is the feeding mechanism Belt Conveying component axonometric drawing of the utility model；
Fig. 7 is the die bond unit explosive view of the utility model；
Fig. 8 is the fixture workbench explosive view of the utility model；
Fig. 9 is the two point gluing mechanism axonometric drawing of the utility model；
Figure 10 takes brilliant ring mechanism axonometric drawing for the utility model automatically；
Figure 11 is the wafer search platform explosive view of the utility model；
Figure 12 is the ejector pin mechanism axonometric drawing of the utility model；
Figure 13 is the die bond mechanism axonometric drawing of the utility model；
Figure 14 is the connecting mechanism axonometric drawing of the utility model；
Figure 15 is the receiving mechanism explosive view of the utility model.
Specific embodiment
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model
It can be easier to be readily appreciated by one skilled in the art with feature, to make the protection scope of the utility model apparent clear
Define；
Attached drawing 1-15 is please referred to, a kind of line mini-LED bonder of the utility model, which includes rack 1,
Further include feeding mechanism 4, die bond unit 2, connecting mechanism 3, receiving mechanism 5, there is a feeding mechanism 4 in described rack one end, it is described into
Multiple die bond units 2 are provided with by material mechanism 4, a connecting mechanism 3 is wherein provided between every two die bond unit 2, last
It is provided with receiving mechanism 5 by a die bond unit 2, is provided with control system in the rack 1.
A kind of optimal technical scheme of the utility model: the feeding mechanism 4 includes feeding material component 4-1, storing component 4-
2, Belt Conveying component 4-3, the feeding material component side are provided with storing component 4-2, and the storing component 4-2 is for storing
LED support, the side storing component 4-2 are provided with Belt Conveying component 4-3；The feeding material component will be described in storing component
LED support is transported on the Belt Conveying component 4-3, and LED support is delivered to adjacent thereto by the Belt Conveying component again
Die bond unit 2 or the feeding material component 4-1 directly the LED support stored in the storing component 4-2 is pushed to it is adjacent
Die bond unit 2；In addition wherein the Belt Conveying component 4-3 can also be docked directly with board, carry out the conveying of LED support；
The storing component includes being connected with support plate on the first driving assembly 4-2-1, the first driving assembly 4-2-1
It is connected with storing frame 4-2-4 on 4-2-2, the support plate 4-2-2, is placed with material-storing box 4-2-3 on the storing frame 4-2-4；
The storing frame 4-2-4 can directly store LED support, or LED support is stored in material-storing box 4-2-3, then is placed on
On the storing frame 4-2-4；
The feeding material component includes the second longitudinally disposed driving assembly 4-1-2, and one end is connected with cylinder push component
4-1-4；The cylinder push component 4-1-4 is used to push the LED support in the material-storing box 4-2-3 to the die bond unit 2；
It is connected with third driving assembly 4-1-1 on the second driving assembly 4-1-2, is connected on the third driving assembly 4-1-1
Suction cup assembly 4-1-3；The Suction cup assembly 4-1-3 passes through the second driving assembly 4-1-2 and the third driving assembly 4-
1-1 is laterally and vertically movable to behind designated position, and the Suction cup assembly 4-1-3 draws the LED branch in the storing component 4-2
Frame, and LED support is put to the Belt Conveying component 4-3, the die bond list is transmitted to by the Belt Conveying component 4-3
Member 2；
The Belt Conveying component 4-3 includes pedestal 4-3-1, and feeding mechanism belt group is connected on the pedestal 4-3-1
The motor 4-3-3 for being allowed to move is connected on part 4-3-2, the feeding mechanism belt component 4-3-2.
A kind of optimal technical scheme of the utility model: the die bond unit 2 includes fixture workbench 2-1, two point glue
Mechanism 2-2, die bond mechanism 2-3, move brilliant ring mechanism 2-4, wafer search platform 2-5, ejector pin mechanism 2-6, the first CCD component certainly
2-7, the 2nd CCD component 2-8, the 3rd CCD component 2-9, the side fixture workbench 2-1 are provided with the two point gluing mechanism
2-2, the other side are provided with wafer search platform 2-5 and ejector pin mechanism 2-6, are provided with by the wafer search platform and move crystalline substance certainly
It is provided with die bond mechanism 2-3 above ring mechanism 2-4, the fixture workbench 2-1, is provided on the die bond mechanism 2-3
The 3rd CCD component 2-9 is provided with above first CCD component 2-7 and the 2nd CCD component 2-8, the wafer search platform 2-5；
The fixture workbench 2-1 includes fixture workbench pedestal 2-1-1, first straight line electric machine assembly 2-1-2, cross
To sliding rail 2-1-3, longitudinal mobile platform 2-1-4, longitudinal slide rail 2-1-5, second straight line electric machine assembly 2-1-6, jig platform 2-
1-7, jig platform belt component 2-1-8, LED support clamping plate 2-1-9, the fixture workbench pedestal 2-1-1 on be arranged
There is first straight line electric machine assembly 2-1-2, is additionally provided with horizontal slide rail 2-1-3 on the fixture workbench pedestal 2-1-1, it is described
It is provided with longitudinal mobile platform 2-1-4 on first straight line electric machine assembly 2-1-2, is provided on the longitudinal mobile platform 2-1-4
Second straight line electric machine assembly 2-1-6 is additionally provided on longitudinal slide rail 2-1-5, the longitudinal mobile platform 2-1-4, described second is straight
Jig platform 2-1-7 is provided on line electric machine assembly 2-1-6；The jig platform 2-1-7 passes through the first straight line motor group
The driving of part 2-1-2 and the second straight line electric machine assembly 2-1-6 carry out laterally vertical in the horizontal slide rail and longitudinal slide rail
It is slided to moving, there is the jig platform belt component 2-1-8 for transporting the LED support and fixed institute on the jig platform 2-1-7
State the clamping plate 2-1-9 of LED support；
The first CCD component 2-7 is used to scan the two dimensional code on LED support, and the LED support is recorded by barcode scanning
Information；
The 2nd CCD component 2-8 is for assisting the fixture workbench 2-1 that LED support is moved to designated position；
The two point gluing mechanism 2-3 includes dispensing pedestal 2-3-1, first motor component 2-3-2, the second electric machine assembly of dispensing
2-3-3, zigzag tread patterns component 2-3-4, the first manipulator of dispensing 2-3-5, the second manipulator of dispensing 2-3-6, lacquer disk(-sc) component 2-3-
7, automatic glue adding component 2-3-8, the front end dispensing pedestal 2-3-1 are connected with storage lacquer disk(-sc) component 2-3-7, the storage lacquer disk(-sc) component
The one end 2-3-7 is connected with automatic glue adding component 2-3-8；Zigzag tread patterns component 2-3- is additionally provided on the dispensing pedestal 2-3-1
4, there are dispensing first motor component 2-3-2 and the second electric machine assembly of dispensing 2-3-3 in zigzag tread patterns component two sides respectively, described
The lower end zigzag tread patterns component 2-3-4 is also connected with dispensing the first manipulator 2-3-5 and the second manipulator of dispensing 2-3-6.
A kind of optimal technical scheme of the utility model: the automatic glue adding component 2-3-8 can convey glue to institute automatically
Storage lacquer disk(-sc) component 2-3-7, the storage lacquer disk(-sc) component 2-3-7 are stated by rotary motion, the glue of storage is made to be more evenly distributed；It is described
Dispensing the first manipulator 2-3-5 and the second manipulator of dispensing 2-3-6 pass through the dispensing first motor component 2-3-2 respectively
Driving with the second electric machine assembly of dispensing 2-3-3 moves up and down, and passes through the driving of the zigzag tread patterns component 2-3-4
It is moved forward and backward；Dispensing the first manipulator 2-3-5 and dispensing the second manipulator 2-3-6 carries out front and back and up and down fortune
It is dynamic successively from the storage lacquer disk(-sc) component 2-3-7 on viscose glue point to LED support designated position, to complete dispensing operation.
A kind of optimal technical scheme of the utility model: described to move brilliant ring mechanism 2-4 certainly including pressing from both sides brilliant ring assemblies 2-4-
1, brilliant ring assemblies 2-4-2 is stored up, the folder crystalline substance side ring assemblies 2-4-1 is provided with the brilliant ring assemblies 2-4-2 of storage, the brilliant ring assemblies of the storage
The brilliant ring for bearing wafer is placed on 2-4-2；The folder crystalline substance ring assemblies 2-4-1 will be placed in the brilliant ring assemblies 2-4- of the storage
Brilliant ring on 2 is clamped, and is moved to designated position.
A kind of optimal technical scheme of the utility model: the wafer search platform 2-5 includes that search platform first drives
Component 2-5-1, the second driving assembly of search platform 2-5-2, brilliant ring automatically correct platform 2-5-3, and described search platform first drives
Described search platform the second driving assembly 2-5-2, the second driving assembly of described search platform 2- are installed on dynamic component 2-5-1
It is installed with brilliant ring on 5-2 and automatically corrects platform 2-5-3, the crystalline substance ring, which automatically corrects, is installed with brilliant ring on platform 2-5-3；
The 3rd CCD component 2-9 passes through described search platform for assisting the brilliant ring to automatically correct platform 2-5-3
Brilliant ring is moved to designated position by one driving assembly 2-5-1 and described search platform the second driving assembly 2-5-2 driving；The crystalline substance
Ring automatically corrects platform 2-5-3 and corrects by rotating the wafer position on brilliant ring.
A kind of optimal technical scheme of the utility model: the ejector pin mechanism 2-6 includes ejector pin component 2-6-1 and is used for micro-
Adjust the adjustment component 2-6-2 of thimble position；When described search platform the first driving assembly 2-5-1 and described search platform second drive
When dynamic component 2-5-2 drives brilliant ring to be moved to designated position, the ejector pin component 2-6-1 is for jacking up designated position on brilliant ring
Chip.
A kind of optimal technical scheme of the utility model: the die bond mechanism 2-2 include bottom end die bond pedestal 2-2-1,
Die bond swing arm unit 2-2-2 connects die bond swing arm unit 2-2-2 on the die bond pedestal 2-2-1；The die bond swing arm unit
2-2-2 draws chip from the designated position on brilliant ring, and is transported to the designated position on LED support, completes die bond operation.
A kind of optimal technical scheme of the utility model: the connecting mechanism 3 includes connecting mechanism pedestal 3-1, belt group
The belt component 3-2 of transport LED support, institute are provided on part 3-2, connecting mechanism motor 3-3, the connecting mechanism pedestal 3-1
It states and is connected with connecting mechanism motor 3-3 on belt component 3-2；The connecting mechanism motor 3-3 drives the belt component 3-2 fortune
It is dynamic, to drive LED support disposed thereon mobile.
A kind of optimal technical scheme of the utility model: the receiving mechanism 5 includes rewinding storing case assembly 5-1 and rewinding
Connecting mechanism component 5-2；The rewinding storing case assembly 5-1 is used to receive the LED come out from the transmission of the last one die bond unit 2
Bracket, the rewinding connecting mechanism component 5-2 are docked after receiving LED support with machine.
A kind of working principle of line mini-LED bonder is illustrated below:
1, LED support is transmitted on the fixture workbench 2-1 and by the clamping plate 2-1-9 by the feeding mechanism 4
It is fixed.
2, the LED support on the fixture workbench 2-1 passes through the first straight line electric machine assembly 2-1-2 and described
Two linear motor assembly 2-1-6 laterally move and longitudinally move to designated position, and the first CCD component 2-7 carries out barcode scanning
Operation.
3, the first straight line electric machine assembly 2-1-2 and second straight line electric machine assembly 2-1-6 drives the fixture work
The LED support made on platform 2-1 is moved to designated position by horizontal and vertical, carries out figure with the 2nd CCD component 2-6
As contraposition.
4, after the completion of the 2nd CCD component 2-8 contraposition, the dispensing first in the two point gluing mechanism 2-3 is mechanical
Hand 2-3-5 and the dispensing the second manipulator 2-3-6 pass through the first motor component 2-3-2 and second electric machine assembly
The driving of 2-3-3 moves up and down, and is moved forward and backward by zigzag tread patterns component 2-3-4 driving.Make the dispensing
First manipulator 2-3-5 and the second manipulator of dispensing 2-3-6 is successively stained with glue from the storage lacquer disk(-sc) 2-3-7, and by glue
Complete dispensing operation in point to the designated position of LED support.
5, described search platform the first driving assembly 2-5-1 and the second driving assembly of described search platform 2-5-2 pass through drive
It is dynamic, so that brilliant ring is automatically corrected the brilliant ring on platform 2-5-3 and is moved to designated position；The 3rd CCD component 2-9 is for assisting institute
It states brilliant ring and automatically corrects platform 2-5-3 and brilliant ring is moved to designated position；The crystalline substance ring automatically corrects platform 2-5-3 and passes through rotation
Position correction is carried out to the chip carried on brilliant ring, and is jacked up the fixed chip of the brilliant fourth finger by the ejector pin mechanism 2-6.
6, the die bond swing arm unit 2-2-2 in the die bond mechanism 2-2 is by rotating horizontally and moving up and down, from putting
It sets and draws chip in the brilliant ring automatically corrected on platform 2-5-3 in the brilliant ring and be carried to positioned at the fixture workbench 2-
The designated position of LED support on 1, to complete die bond operation.
7,3,4,5,6 steps are repeated, the die bond of all LED on LED support is completed, the work to this die bond unit 2 is completed
Afterwards, LED support is transmitted to the connecting mechanism 4 by the fixture workbench 2-1, is transmitted to again by the connecting mechanism 4
Next die bond unit 2 carries out die bond, so alternately reciprocal, until die bond LED needed in LED support is completed die bond.
8, finally, after needed die bond LED completes die bond in LED support, by die bond unit 2 described in the last one
LED support is transmitted to the receiving mechanism 5 by the fixture workbench 2-1.Processing mode that there are two types of the receiving mechanisms 5,
It is stored first is that LED support is transmitted to 5-1 in the storing case assembly by the fixture workbench 2-1；Second is that the folder
LED support is transmitted to the rewinding connecting mechanism 5-2 by tool workbench 2-1, the rewinding connecting mechanism 5-2 with next
Machine docks and carries out the transmission of LED support.
In conclusion a kind of line mini-LED bonder provided by the invention optimizes die bond technique, precision is improved；
The middle swivel link for reducing multiple die bond, greatly improves production efficiency and reduces fraction defective；Meanwhile compact-sized,
Take up an area smaller.
Above description is merely a prefered embodiment of the utility model, is not intended to limit the patent model of the utility model
Enclose, equivalent structure or equivalent flow shift made by using the description of the utility model and the drawings, or directly or
It connects and is used in other relevant technical fields, be also included in the patent protection scope of the utility model.
Claims (10)
1. a kind of line mini-LED bonder, which includes rack (1), it is characterised in that: further includes feeding mechanism
(4), there are feeding mechanism (4), the charger in die bond unit (2), connecting mechanism (3), receiving mechanism (5), described rack one end
Multiple die bond units (2) are provided with by structure (4), a connecting mechanism (3) are wherein provided between every two die bond unit (2), most
It is provided with receiving mechanism (5) by die bond unit (2) described in the latter, is provided with control system in the rack (1)；
The die bond unit (2) includes fixture workbench (2-1), die bond mechanism (2-2), two point gluing mechanism (2-3), moves certainly
Brilliant ring mechanism (2-4), wafer search platform (2-5), ejector pin mechanism (2-6), the first CCD component (2-7), the 2nd CCD component (2-
8), the 3rd CCD component (2-9), fixture workbench (2-1) side are provided with the two point gluing mechanism (2-3), the other side
It is provided with wafer search platform (2-5) and ejector pin mechanism (2-6), is provided with by the wafer search platform and moves brilliant ring mechanism certainly
(2-4) is provided with die bond mechanism (2-2) above the fixture workbench (2-1), is arranged on the die bond mechanism (2-2)
There are the first CCD component (2-7) and the 2nd CCD component (2-8), is provided with the 3rd CCD group above the wafer search platform (2-5)
Part (2-9).
2. a kind of line mini-LED bonder according to claim 1, which is characterized in that feeding mechanism (4) packet
Feeding material component (4-1), storing component (4-2), Belt Conveying component (4-3) are included, the feeding material component side is provided with storing group
Part (4-2), for the storing component (4-2) for storing LED support, it is defeated that storing component (4-2) other side is provided with belt
Sending component (4-3)；LED support described in storing component is transported on the Belt Conveying component (4-3) by the feeding material component, institute
It states Belt Conveying component and LED support is delivered to die bond unit (2) or the feeding material component (4-1) adjacent thereto directly again
It connects and the LED support stored in the storing component (4-2) is pushed into adjacent die bond unit (2)；In addition the wherein belt
Conveying assembly (4-3) can also be docked directly with board, carry out the conveying of LED support；
The storing component 4-2 includes the first driving assembly (4-2-1), is connected with branch on first driving assembly (4-2-1)
Fagging (4-2-2) is connected with storing frame (4-2-4) on the support plate (4-2-2), is placed on the storing frame (4-2-4)
Material-storing box (4-2-3)；The storing frame (4-2-4) can directly store LED support, or LED support is stored in material-storing box (4-
In 2-3), then it is placed on the storing frame (4-2-4)；
The feeding material component includes longitudinally disposed the second driving assembly (4-1-2), and one end is connected with cylinder push component (4-
1-4)；Cylinder push component (4-1-4) is used to push the LED support in the material-storing box (4-2-3) to the die bond list
First (2)；It is connected with third driving assembly (4-1-1) on second driving assembly (4-1-2), the third driving assembly (4-
Suction cup assembly (4-1-3) is connected on 1-1)；The Suction cup assembly (4-1-3) by second driving assembly (4-1-2) and
The third driving assembly (4-1-1) is longitudinal and vertically movable, and the Suction cup assembly (4-1-3) draws the storing component (4-
2) LED support in, and LED support is put to the Belt Conveying component (4-3), by the Belt Conveying component (4-3)
It is transmitted to the die bond unit (2)；
The Belt Conveying component (4-3) includes pedestal (4-3-1), is connected with feeding mechanism belt on the pedestal (4-3-1)
Component (4-3-2) is connected with the motor (4-3-3) for being allowed to move on the feeding mechanism belt component (4-3-2).
3. a kind of line mini-LED bonder according to claim 1, which is characterized in that the fixture workbench
(2-1) includes fixture workbench pedestal (2-1-1), first straight line electric machine assembly (2-1-2), horizontal slide rail (2-1-3), longitudinal direction
Mobile platform (2-1-4), longitudinal slide rail (2-1-5), second straight line electric machine assembly (2-1-6), jig platform (2-1-7), fixture
The clamping plate (2-1-9) of platform belt component (2-1-8), LED support is provided on the fixture workbench pedestal (2-1-1)
First straight line electric machine assembly (2-1-2) is additionally provided with horizontal slide rail (2-1-3) on the fixture workbench pedestal (2-1-1),
It is provided with longitudinal mobile platform (2-1-4) on the first straight line electric machine assembly (2-1-2), the longitudinal mobile platform (2-1-
4) it is provided on longitudinal slide rail (2-1-5), is additionally provided with second straight line electric machine assembly on the longitudinal mobile platform (2-1-4)
(2-1-6) is provided with jig platform (2-1-7) on the second straight line electric machine assembly (2-1-6)；Jig platform (the 2-1-
7) by the driving of the first straight line electric machine assembly (2-1-2) and the second straight line electric machine assembly (2-1-6) in the cross
Laterally longitudinal move is carried out on sliding rail and longitudinal slide rail to slide, and has the transport LED support on the jig platform (2-1-7)
The clamping plate (2-1-9) of jig platform belt component (2-1-8) and the fixed LED support；
The first CCD component (2-7) is used to scan the two dimensional code on LED support, and the LED support is recorded by barcode scanning
Information；
The 2nd CCD component (2-8) is for assisting the fixture workbench (2-1) that LED support is moved to designated position.
4. a kind of line mini-LED bonder according to claim 3, which is characterized in that the two point gluing mechanism (2-
It 3) include dispensing pedestal (2-3-1), first motor component (2-3-2), the second electric machine assembly of dispensing (2-3-3), zigzag tread patterns group
Part (2-3-4), the second manipulator of dispensing (2-3-6), lacquer disk(-sc) component (2-3-7), adds the first manipulator of dispensing (2-3-5) automatically
Glue component (2-3-8), dispensing pedestal (2-3-1) front end are connected with storage lacquer disk(-sc) component (2-3-7), the storage lacquer disk(-sc) component
The one end (2-3-7) is connected with automatic glue adding component (2-3-8)；Zigzag tread patterns group is additionally provided on the dispensing pedestal (2-3-1)
There are the second electric machine assembly of dispensing first motor component (2-3-2) and dispensing in part (2-3-4), zigzag tread patterns component two sides respectively
(2-3-3), zigzag tread patterns component (2-3-4) lower end are also connected with the second machine of the first manipulator of dispensing (2-3-5) and dispensing
Tool hand (2-3-6)；
The automatic glue adding component (2-3-8) can convey glue to the storage lacquer disk(-sc) component (2-3-7), the storage lacquer disk(-sc) group automatically
Part (2-3-7) makes the glue of storage be more evenly distributed by rotary motion；First manipulator of dispensing (2-3-5) and described
The second manipulator of dispensing (2-3-6) passes through the dispensing first motor component (2-3-2) and the dispensing the second motor group respectively
The driving of part (2-3-3) moves up and down, and is moved forward and backward by the driving of the zigzag tread patterns component (2-3-4)；Institute
It states the first manipulator of dispensing (2-3-5) and the second manipulator of the dispensing (2-3-6) carries out front and back and moves up and down successively from institute
It states in storage lacquer disk(-sc) component (2-3-7) on viscose glue point to LED support designated position, to complete dispensing operation.
5. a kind of line mini-LED bonder according to claim 3, which is characterized in that described to move brilliant ring mechanism certainly
(2-4) includes pressing from both sides brilliant ring assemblies (2-4-1), storing up brilliant ring assemblies (2-4-2), and the brilliant side ring assemblies (2-4-1) of the folder is provided with
Brilliant ring assemblies (2-4-2) are stored up, it is described to store up the brilliant ring being placed on brilliant ring assemblies (2-4-2) for bearing wafer；The brilliant ring of the folder
Component (2-4-1) will be placed in the brilliant ring stored up on crystalline substance ring assemblies (2-4-2) and clamp, and be moved to designated position.
6. a kind of line mini-LED bonder according to claim 3, which is characterized in that the wafer search platform
(2-5) includes that the first driving assembly of search platform (2-5-1), the second driving assembly of search platform (2-5-2), brilliant ring automatically correct
Platform (2-5-3) is installed with the second driving assembly of described search platform on the first driving assembly of described search platform (2-5-1)
(2-5-2) is installed with brilliant ring on the second driving assembly of described search platform (2-5-2) and automatically corrects platform (2-5-3), the crystalline substance
Ring automatically corrects and is installed with brilliant ring on platform (2-5-3)；
The 3rd CCD component (2-9) is used to assist the wafer search platform (2-5) that the chip movement on brilliant ring is driven to go forward side by side
Row correction.
7. a kind of line mini-LED bonder according to claim 3, which is characterized in that the ejector pin mechanism (2-6)
Adjustment component (2-6-2) including ejector pin component (2-6-1) and for finely tuning thimble position；The ejector pin component (2-6-1) is used
In the chip for jacking up designated position on brilliant ring.
8. a kind of line mini-LED bonder according to claim 3, which is characterized in that the die bond mechanism (2-2)
Die bond pedestal (2-2-1), die bond swing arm unit (2-2-2) including bottom end, connect die bond on the die bond pedestal (2-2-1)
Swing arm unit (2-2-2)；The die bond swing arm unit (2-2-2) draws chip from the designated position on brilliant ring, and is transported to LED
Die bond operation is completed in designated position on bracket.
9. a kind of line mini-LED bonder according to claim 1, which is characterized in that connecting mechanism (3) packet
Connecting mechanism pedestal (3-1), belt component (3-2), connecting mechanism motor (3-3) are included, is set on the connecting mechanism pedestal (3-1)
It is equipped with the belt component (3-2) of transport LED support, is connected with connecting mechanism motor (3-3) on the belt component (3-2)；Institute
It states connecting mechanism motor (3-3) and drives belt component (3-2) movement, to drive LED support disposed thereon mobile.
10. a kind of line mini-LED bonder according to claim 1, which is characterized in that receiving mechanism (5) packet
Include rewinding storing case assembly (5-1) and rewinding connecting mechanism component (5-2)；The rewinding storing case assembly (5-1) is used to receive
The LED support come out from the transmission of the last one die bond unit (2), after the rewinding connecting mechanism component (5-2) receives LED support
It is docked with machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821050656.4U CN208655684U (en) | 2018-07-02 | 2018-07-02 | A kind of line mini-LED bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821050656.4U CN208655684U (en) | 2018-07-02 | 2018-07-02 | A kind of line mini-LED bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208655684U true CN208655684U (en) | 2019-03-26 |
Family
ID=65783407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821050656.4U Active CN208655684U (en) | 2018-07-02 | 2018-07-02 | A kind of line mini-LED bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208655684U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111069902A (en) * | 2019-12-31 | 2020-04-28 | 东莞市沃德精密机械有限公司 | Automatic man-machine combination assembling line for mainboard controller |
| CN111389658A (en) * | 2020-03-19 | 2020-07-10 | 深圳新益昌科技股份有限公司 | Double-gluing device and die bonder |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN111584698A (en) * | 2020-05-21 | 2020-08-25 | 中山市新益昌自动化设备有限公司 | Die bonder |
| WO2020237497A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Double-swing-arm die-bonding device for led die bonding and die bonding method therefor |
| CN112436084A (en) * | 2020-11-29 | 2021-03-02 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
| CN112718395A (en) * | 2020-12-29 | 2021-04-30 | 深圳宝创电子设备有限公司 | HP-X3 full-automatic lens chip mounter |
| TWI753440B (en) * | 2019-05-28 | 2022-01-21 | 大陸商深圳新益昌科技股份有限公司 | A dual-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof |
| CN114650666A (en) * | 2022-05-18 | 2022-06-21 | 武汉昱升光电股份有限公司 | Full-automatic die bonding device and method |
-
2018
- 2018-07-02 CN CN201821050656.4U patent/CN208655684U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020237497A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Double-swing-arm die-bonding device for led die bonding and die bonding method therefor |
| TWI753440B (en) * | 2019-05-28 | 2022-01-21 | 大陸商深圳新益昌科技股份有限公司 | A dual-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof |
| CN111069902A (en) * | 2019-12-31 | 2020-04-28 | 东莞市沃德精密机械有限公司 | Automatic man-machine combination assembling line for mainboard controller |
| CN111389658A (en) * | 2020-03-19 | 2020-07-10 | 深圳新益昌科技股份有限公司 | Double-gluing device and die bonder |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN111430285B (en) * | 2020-04-01 | 2020-11-13 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN111584698A (en) * | 2020-05-21 | 2020-08-25 | 中山市新益昌自动化设备有限公司 | Die bonder |
| CN112436084A (en) * | 2020-11-29 | 2021-03-02 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
| CN112718395A (en) * | 2020-12-29 | 2021-04-30 | 深圳宝创电子设备有限公司 | HP-X3 full-automatic lens chip mounter |
| CN112718395B (en) * | 2020-12-29 | 2021-10-26 | 深圳宝创电子设备有限公司 | HP-X3 full-automatic lens chip mounter |
| CN114650666A (en) * | 2022-05-18 | 2022-06-21 | 武汉昱升光电股份有限公司 | Full-automatic die bonding device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208655684U (en) | A kind of line mini-LED bonder | |
| CN107369639B (en) | Wire LED die bonder | |
| CN104528089B (en) | Battery labeling machine and automatic labeling method thereof | |
| CN108615804B (en) | Mini-LED full-automatic die bonder and die bonding method thereof | |
| CN100459035C (en) | Laser marker for fully automatic IC material bar | |
| CN109786311B (en) | Mini-LED high-speed die bonder and die bonding method | |
| CN208103189U (en) | Voice coil motor automatic detection device | |
| CN110213906A (en) | A kind of chip shooter machine | |
| CN208303255U (en) | A kind of product testing assembly line | |
| CN111482374A (en) | Silicon wafer detection sorting machine and sorting method thereof | |
| CN206921798U (en) | A kind of line LED bonders | |
| CN208368542U (en) | The full-automatic bonder of mini-LED | |
| CN109451206A (en) | A kind of automatic AA assembling equipment of dual camera and its assemble method | |
| CN112499109A (en) | Automatic label removing assembly line based on bobbin | |
| CN206074992U (en) | A kind of full-automatic integral exposes production line | |
| CN109132578A (en) | Recycle stock conveyer system | |
| CN206447190U (en) | Camera production line | |
| CN212310119U (en) | Silicon wafer detection sorting machine | |
| CN209009665U (en) | Recycle stock conveyer system | |
| CN207852637U (en) | A kind of whole line automation charging ＆ discharging machine of monocrystalline making herbs into wool | |
| CN207068814U (en) | A kind of diode automatic packaging device | |
| CN109290765A (en) | A kind of camera automatic assembling machine | |
| CN206623419U (en) | A kind of middle material-saving frame feeding device of through-flow fan blade | |
| CN108942144A (en) | A kind of electromagnetic valve component assembly method | |
| CN210531356U (en) | Hot press with compact layout |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |