CN210778672U - Horizontal rotation double-swing-arm die bonder - Google Patents
Horizontal rotation double-swing-arm die bonder Download PDFInfo
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- CN210778672U CN210778672U CN201922194056.6U CN201922194056U CN210778672U CN 210778672 U CN210778672 U CN 210778672U CN 201922194056 U CN201922194056 U CN 201922194056U CN 210778672 U CN210778672 U CN 210778672U
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Abstract
The utility model discloses a solid brilliant machine of horizontal rotation double swing arm, should solid brilliant machine include the platen, respectively the side adorn in the feeding and receiving agencies and solid brilliant mechanism, respectively the side adorn of the platen left and right sides in brilliant ring mechanism and anchor clamps moving platform, brilliant ring moving platform mechanism and set up in the voice coil loudspeaker voice coil thimble mechanism of brilliant ring moving platform mechanism below in the automation of both sides around the platen. Through setting up two solid brilliant swing arms of horizontal rotation and carrying out the absorption brilliant and solid brilliant to solid brilliant speed has been accelerated, work efficiency can be improved greatly. Meanwhile, the voice coil thimble mechanism is provided with a left fine adjustment mechanism and a right fine adjustment mechanism, so that the thimble is accurately positioned, and the die bonding precision is obviously improved. The utility model discloses solid brilliant device need not to increase the solid brilliant of swing arm length with regard to the LED support of adaptable various sizes, a tractor serves several purposes, and adaptability is better to its simple structure is compact, easily assembles, and is with low costs, can effectively improve the performance of enterprises.
Description
Technical Field
The utility model relates to an automatic technical field, specific saying so relates to a solid brilliant machine of horizontal rotation double swing arm.
Background
A Light Emitting Diode (LED) is a light emitting element that can convert electrical energy into light energy. The LED product can be used in a plurality of fields such as illumination, display, signal indication and the like. With the continuous development of LED technology, the requirements on the LED die bonding speed and precision are higher and higher. Most of the traditional die bonder adopts a single swing arm to bond the die. The working mode can only absorb and convey one LED wafer at a time, so that the working efficiency is low and the die bonding speed is low. For die bonding of a large-size LED support, the length and the weight of the swing arm are increased to meet die bonding requirements in a traditional die bonding mode, inertia of the swing arm in the movement process is increased due to the increase of the length and the weight of the swing arm, and accordingly speed and precision are reduced. In view of the above drawbacks and market demands in the prior art, there is a need to develop a novel horizontal rotation double-swing-arm die bonder.
SUMMERY OF THE UTILITY MODEL
To the deficiency among the prior art, the to-be-solved technical problem of the utility model lies in providing a solid brilliant machine of horizontal rotation double swing arm. The double-swing-arm die bonder is designed to remarkably improve the production efficiency, greatly improve the die bonding accuracy and reduce the enterprise cost.
In order to solve the technical problem, the utility model discloses a following scheme realizes: the utility model discloses a solid brilliant machine of horizontal rotation double swing arm, this solid brilliant machine includes the platen and installs on the platen:
the feeding and receiving mechanism is arranged on the left side of the upper plate surface of the bedplate, and is provided with a lifting device, a first material box driven by the lifting device to do lifting motion, and a push rod mechanism which is arranged on one side of the first material box and can push an LED bracket in the first material box into a clamp moving platform;
the fixture moving platform is arranged on a discharging station of the feeding and receiving mechanism, and is provided with a moving platform for bearing the LED bracket and a first driving assembly for driving the moving platform to move from the discharging station of the feeding and receiving mechanism to a die bonding station of a die bonding mechanism;
the die bonding mechanism is arranged at the die bonding station, is arranged on the right side of the plate surface of the bedplate and is used for die bonding of the LED bracket;
the LED crystal ring moving platform mechanism is arranged on the adjacent side of the die bonding mechanism, and is provided with an LED crystal ring for bearing an LED wafer, an LED crystal ring rotating assembly for driving the LED crystal ring to rotate so as to correct the LED wafer and a second driving assembly for driving the LED crystal ring rotating assembly to a die bonding station;
the voice coil thimble assembly mechanism is arranged below the LED crystal ring moving platform mechanism;
the automatic LED crystal ring feeding mechanism is arranged on the front side of the upper plate surface of the bedplate and is provided with a second material box for loading an LED crystal ring and a third driving assembly for driving the second material box to move from a crystal ring feeding station to a crystal fixing station.
Further, the lifting device includes:
the material feeding and receiving motor mounting seat is laterally fixed on the bedplate, one side of the upper end of the material feeding and receiving motor mounting seat is mounted on the screw rod seat plate, and one side of the screw rod seat plate is provided with a slide rail;
the feeding and receiving motor is fixed on the feeding and receiving motor mounting seat, the driving end of the feeding and receiving motor is upwards connected with a screw rod, the screw rod is arranged on a screw rod seat plate and is in threaded connection with a lifting block, and the lifting block is connected to the sliding rail in a sliding manner;
the supporting plate is connected with the lifting block through a lifting support rod, and the lifting block is driven by the screw rod to drive the supporting plate to do lifting motion.
Furthermore, a first material box used for storing the LED support is fixed on the upper end plate surface of the supporting plate, the push rod mechanism is fixed on one side of the first material box through the support, the push rod portion of the push rod mechanism is driven by a driving portion to move transversely, and the push rod portion of the push rod mechanism can stretch into the first material box so that the LED support can be pushed to a clamp moving platform.
Further, the clamp moving platform, the first driving assembly thereon, comprises:
a first transverse drive assembly mounted on the platen;
the first longitudinal driving component is longitudinally arranged and is driven by the first transverse driving component to transversely move;
a belt conveyor assembly driven by the first longitudinal drive assembly to move longitudinally; the belt conveying assembly utilizes the first transverse driving assembly and the first longitudinal driving assembly to move transversely and longitudinally, so that the LED support on the moving platform is driven to move to the die bonding station.
Further, the die bonding mechanism comprises a welding upright post, a horizontal double-swing-arm assembly, a die taking lens assembly and a die bonding lens assembly, wherein the horizontal double-swing-arm assembly is fixed in the middle of the welding upright post, and the die taking lens assembly and the die bonding lens assembly are respectively fixed on two sides of the welding upright post.
Furthermore, the horizontal double-swing-arm assembly comprises a mounting seat, a rotary driving motor, a first voice coil driving mechanism, a second voice coil driving mechanism, a first swing arm and a second swing arm; the driving end of the rotary driving motor is vertically fixed on the mounting seat, the first voice coil driving mechanism and the second voice coil driving mechanism are back-to-back fixed on two sides of the mounting seat, and the first voice coil driving mechanism and the second voice coil driving mechanism are respectively connected with the first swing arm and the second swing arm; the first voice coil driving mechanism drives the first swing arm to move up and down, the second voice coil driving mechanism drives the second swing arm to move up and down, the first swing arm and the second swing arm independently move up and down without interference, and the die bonding efficiency is obviously improved.
Further, the second driving assembly on the LED crystal ring moving platform mechanism comprises a second transverse driving assembly transversely arranged, a second longitudinal driving assembly longitudinally arranged and an LED crystal ring adapter plate, the second transverse driving assembly is longitudinally provided with the second longitudinal driving assembly, the second longitudinal driving assembly is provided with the LED crystal ring adapter plate, the LED crystal ring adapter plate is provided with an LED crystal ring rotating assembly, the LED crystal ring rotating assembly is provided with an LED crystal ring for bearing an LED wafer, and the LED crystal ring rotating assembly utilizes the second transverse driving assembly and the second longitudinal driving assembly to transversely and longitudinally move so as to drive the LED crystal ring positioned on the LED crystal ring rotating assembly to move to a designated position, and then the LED crystal ring rotating assembly drives the LED crystal ring to rotate to correct the wafer.
Furthermore, voice coil loudspeaker voice coil thimble subassembly mechanism includes thimble subassembly, voice coil loudspeaker voice coil upper and lower drive assembly, horizontal fine setting subassembly, vertical fine setting subassembly and adjustable seat, voice coil loudspeaker voice coil upper and lower drive assembly drives thimble subassembly up-and-down motion, horizontal fine setting subassembly and vertical fine setting subassembly drive adjustable seat respectively and carry out vertical lateral shifting to drive thimble subassembly and carry out XY direction's fine setting removal.
Further, voice coil loudspeaker voice coil upper and lower drive assembly includes the stator and stretches out and draws back and set up in the stator and make linear motion along the axial of stator, the active cell with thimble assembly links to each other, can produce the electromagnetic field between stator and the active cell, and under the effect of electromagnetic field, the active cell can be linear motion and stretch out or retract in the stator for the stator to the drive thimble assembly carries out up-and-down motion, with the wafer ejecting.
Further, the automatic LED crystal ring feeding mechanism is provided with a material box lifting assembly and an LED crystal ring carrying assembly, the material box lifting assembly is used for lifting a material box, the LED crystal ring is stored in the second material box, and the material box lifting assembly lifts the second material box to a set height to enable the LED crystal ring carrying assembly to pick up the LED crystal ring and send the LED crystal ring to the LED crystal ring placing groove on the LED crystal ring moving platform mechanism.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses the solid brilliant swing arm that is provided with two horizontal rotations carries out solid brilliant in succession to solid brilliant speed has been accelerated, work efficiency can be improved greatly.
2. The voice coil thimble assembly mechanism is provided with the left and right fine adjustment mechanisms, so that the thimble assembly is accurately positioned, and the die bonding precision is obviously improved.
3. The utility model discloses solid brilliant device need not to increase the solid brilliant of the LED support of swing arm length just adaptable various sizes, a tractor serves several purposes, and adaptability is better.
4. The utility model discloses a solid brilliant machine of horizontal rotation double swing arm simple structure is compact, easily assembles, and is with low costs, can effectively improve the performance of enterprises.
Drawings
Fig. 1 is a schematic structural view of the horizontal rotation double-swing-arm die bonder.
Fig. 2 is an explosion diagram of the horizontal rotation double-swing-arm die bonder.
Fig. 3 is the schematic structural view of the material feeding and receiving mechanism of the present invention.
Fig. 4 is a schematic structural view of the clamp moving platform of the present invention.
Fig. 5 is a schematic structural view of the die bonding mechanism of the present invention.
Fig. 6 is a schematic structural diagram of the horizontal double-swing arm assembly of the present invention.
Fig. 7 is a schematic structural diagram of the LED crystal ring moving platform mechanism of the present invention.
Fig. 8 is a schematic structural view of the voice coil thimble assembly mechanism of the present invention.
Fig. 9 is a schematic structural view of the automatic LED feeding ring mechanism of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
referring to fig. 1-9, the present invention provides a die bonder with horizontal rotation and double swing arms, which comprises a platen 1, and a die bonder installed on the platen 1:
the feeding and receiving mechanism 2 is arranged on the left side of the upper plate surface of the bedplate 1, and is provided with a lifting device, a first material box 25 driven by the lifting device to do lifting motion, and a push rod mechanism 26 which is arranged on one side of the first material box 25 and can push the LED bracket in the first material box 25 into a clamp moving platform 3;
the fixture moving platform 3 is arranged at the discharging station of the feeding and receiving mechanism 2, and is provided with a moving platform for bearing the LED bracket and a first driving assembly for driving the moving platform to move from the discharging station of the feeding and receiving mechanism 2 to a die bonding station of a die bonding mechanism 4;
the die bonding mechanism 4 is arranged at the die bonding station, is arranged on the right side of the plate surface of the bedplate 1 and is used for die bonding of the LED bracket;
the LED crystal ring moving platform mechanism 5 is arranged at the adjacent side of the die bonding mechanism 4, and is provided with an LED crystal ring 55 for bearing an LED wafer, an LED crystal ring rotating assembly 54 for driving the LED crystal ring 55 to rotate so as to correct the LED wafer, and a second driving assembly for driving the LED crystal ring rotating assembly 54 to a die bonding station;
the voice coil thimble assembly mechanism 6 is arranged below the LED crystal ring moving platform mechanism 5;
the automatic LED crystal ring feeding mechanism 7 is arranged on the front side of the upper plate surface of the bedplate 1, and is provided with a second material box 73 for loading an LED crystal ring and a third driving assembly for driving the second material box 73 to move from a crystal ring feeding station to a crystal fixing station.
A preferred technical solution of this embodiment: the lifting device comprises:
the material feeding and receiving motor mounting seat 21 is laterally fixed on the bedplate 1, one side of the upper end of the material feeding and receiving motor mounting seat is mounted on a screw rod seat plate, and one side of the screw rod seat plate is provided with a slide rail;
the feeding and receiving motor 22 is fixed on the feeding and receiving motor mounting seat 21, the driving end of the feeding and receiving motor is upwards connected with a screw rod 23, the screw rod 23 is arranged on a screw rod seat plate and is in threaded connection with a lifting block, and the lifting block is connected to a sliding rail in a sliding manner;
and the supporting plate 24 is connected with the lifting block through a lifting support rod, and the lifting block is driven by the screw rod 23 to drive the supporting plate 24 to do lifting motion.
A preferred technical solution of this embodiment: the upper end plate surface of the supporting plate 24 is fixedly provided with a first material box 25 used for storing the LED support, the push rod mechanism 26 is fixed on one side of the first material box 25 through the support, a push rod part of the push rod mechanism is driven by a driving part to move transversely, and the push rod part of the push rod mechanism can extend into the first material box 25 so that the LED support can be pushed into a clamp moving platform 3.
A preferred technical solution of this embodiment: the jig moving platform 3, the first driving assembly thereon, includes:
a first transverse drive assembly 31 mounted on the platen 1;
a first longitudinal driving component 32 which is arranged longitudinally and is driven by the first transverse driving component 31 to move transversely;
a belt conveyor assembly 33 driven by the first longitudinal drive assembly 32 for longitudinal movement; the belt conveying assembly 33 utilizes the first transverse driving assembly 31 and the first longitudinal driving assembly 32 to perform transverse and longitudinal movement, so as to drive the LED support on the moving platform to move to the die bonding station.
A preferred technical solution of this embodiment: the die bonding mechanism 4 comprises a welding upright column 41, a horizontal double-swing arm assembly 44, a die taking lens assembly 42 and a die bonding lens assembly 43, wherein the horizontal double-swing arm assembly 44 is fixed in the middle of the welding upright column 41, and the die taking lens assembly 42 and the die bonding lens assembly 43 are respectively fixed on two sides of the welding upright column 41.
A preferred technical solution of this embodiment: the horizontal double-swing arm assembly 44 comprises a mounting seat 441, a rotary driving motor 442, a first voice coil driving mechanism 443, a second voice coil driving mechanism 444, a first swing arm 445 and a second swing arm 446; the driving end of the rotary driving motor 442 is vertically fixed to the mounting seat 441, the first voice coil driving mechanism 443 and the second voice coil driving mechanism 444 are oppositely fixed to two sides of the mounting seat 441, and the first voice coil driving mechanism 443 and the second voice coil driving mechanism 444 are respectively connected to the first swing arm 445 and the second swing arm 446; the first voice coil driving mechanism 443 drives the first swing arm 445 to move up and down, the second voice coil driving mechanism 444 drives the second swing arm 446 to move up and down, the first swing arm 445 and the second swing arm 446 independently move up and down without interfering with each other, and the die bonding efficiency is obviously improved.
A preferred technical solution of this embodiment: the LED crystal ring moving platform mechanism 5 is characterized in that a second driving assembly on the LED crystal ring moving platform mechanism 5 comprises a second transverse driving assembly 51 transversely arranged, a second longitudinal driving assembly 52 longitudinally arranged, and an LED crystal ring adapter plate 53, the second transverse driving assembly 51 is longitudinally provided with the second longitudinal driving assembly 52, the second longitudinal driving assembly 52 is provided with the LED crystal ring adapter plate 53, the LED crystal ring adapter plate 53 is provided with an LED crystal ring rotating assembly 54, the LED crystal ring rotating assembly 54 is provided with an LED crystal ring 55 for bearing an LED wafer, the LED crystal ring rotating assembly 54 performs transverse and longitudinal movement by using the second transverse driving assembly 51 and the second longitudinal driving assembly 52, so as to drive the LED crystal ring 55 positioned thereon to move to a designated position, and then the LED crystal ring rotating assembly 54 drives the LED crystal ring 55 to rotate to correct the wafer.
A preferred technical solution of this embodiment: the voice coil thimble assembly mechanism 6 comprises a thimble assembly 61, a voice coil up-and-down driving assembly 62, a transverse fine adjustment assembly 63, a longitudinal fine adjustment assembly 64 and an adjustable seat 65, wherein the voice coil up-and-down driving assembly 62 drives the thimble assembly 61 to move up and down, and the transverse fine adjustment assembly 63 and the longitudinal fine adjustment assembly 64 respectively drive the adjustable seat 65 to move longitudinally and transversely so as to drive the thimble assembly 61 to perform fine adjustment movement in the XY direction.
A preferred technical solution of this embodiment: the voice coil up-and-down driving assembly 62 comprises a stator and a rotor, the stator is telescopically arranged in the stator and linearly moves along the axial direction of the stator, the rotor is connected with the ejector pin assembly 61, an electromagnetic field can be generated between the stator and the rotor, and under the action of the electromagnetic field, the rotor linearly moves relative to the stator and extends out of or retracts into the stator so as to drive the ejector pin assembly 61 to move up and down and eject the wafer.
A preferred technical solution of this embodiment: the automatic LED crystal ring feeding mechanism 7 is provided with a material box lifting assembly 72 for lifting a material box and an LED crystal ring carrying assembly 71, the second material box 73 stores LED crystal rings, and the material box lifting assembly 72 lifts the second material box 73 to a set height to enable the LED crystal ring carrying assembly 71 to pick up the LED crystal rings and send the LED crystal rings to an LED crystal ring placing groove on the LED crystal ring moving platform mechanism 5.
Example 2:
the utility model discloses a solid brilliant machine of horizontal rotation double swing arm's theory of operation as follows:
firstly, the feeding and receiving mechanism conveys the LED support in the first material box to a clamp moving platform, or directly conveys the LED support of the previous process to the clamp moving platform through a connecting table;
secondly, fixing the LED support by the fixture moving platform, and controlling the fixture moving platform to transversely and longitudinally move by the system under the assistance of the die bonding lens assembly so as to drive the LED support on the fixture moving platform to move to a die bonding position;
thirdly, with the help of the crystal lens taking assembly, the rotary driving mechanism drives the first swing arm to rotate and move right above the wafer, the voice coil thimble assembly mechanism is subjected to left-right fine adjustment and moves to the right center of the wafer to eject an LED wafer on the wafer ring, the driven first swing arm absorbs the ejected wafer and then horizontally rotates 180 degrees to fix the wafer on the LED bracket, and meanwhile, the second swing arm rotates the same angle and then moves right above the wafer;
step four, the voice coil thimble assembly mechanism ejects out another LED wafer on the wafer ring, and the second swing arm absorbs the wafer and then rotates 180 degrees to fix the wafer on the LED bracket;
step five, repeating the step three and the step four to finish the die bonding of the whole LED bracket;
and finally, receiving by the material feeding and receiving mechanism or conveying to the next procedure by the material receiving and connecting table.
In summary, the two horizontally rotating die bonding swing arms are arranged to continuously perform die bonding, so that the die bonding speed is increased, and the working efficiency can be greatly improved. Meanwhile, the voice coil thimble assembly mechanism is provided with the left and right fine adjustment mechanisms, so that the thimble assembly is accurately positioned, and the die bonding precision is obviously improved. The die bonding device can adapt to die bonding of LED supports of various sizes without increasing the length of the swing arm, has multiple purposes, is better in adaptability, simple and compact in structure, easy to assemble and low in cost, and can effectively improve enterprise benefits.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (10)
1. The utility model provides a solid brilliant machine of horizontal rotation double pendulum arm, this solid brilliant machine includes platen (1), its characterized in that still includes and installs on platen (1):
the feeding and receiving mechanism (2) is arranged on the left side of the upper plate surface of the bedplate (1), and is provided with a lifting device, a first material box (25) driven by the lifting device to do lifting motion, and a push rod mechanism (26) which is arranged on one side of the first material box (25) and can push the LED bracket in the first material box (25) into a clamp moving platform (3);
the fixture moving platform (3) is arranged at the discharging station of the feeding and receiving mechanism (2), and is provided with a moving platform for bearing the LED support and a first driving assembly for driving the moving platform to move from the discharging station of the feeding and receiving mechanism (2) to the die bonding station of a die bonding mechanism (4);
the die bonding mechanism (4) is arranged at the die bonding station, is arranged on the right side of the plate surface of the bedplate (1), and is used for die bonding of the LED bracket;
the LED crystal ring moving platform mechanism (5) is arranged on the adjacent side of the die bonding mechanism (4), and is provided with an LED crystal ring (55) for bearing an LED wafer, an LED crystal ring rotating assembly (54) for driving the LED crystal ring (55) to rotate so as to correct the LED wafer, and a second driving assembly for driving the LED crystal ring rotating assembly (54) to a die bonding station;
the voice coil thimble mechanism (6) is arranged below the LED crystal ring moving platform mechanism (5);
the automatic LED crystal ring feeding mechanism (7) is arranged on the front side of the upper plate surface of the bedplate (1), and is provided with a second material box (73) for loading an LED crystal ring and a third driving assembly for driving the second material box (73) to move from a crystal ring feeding station to a crystal fixing station.
2. The die bonder with horizontally rotating double swing arms as claimed in claim 1, wherein the lifting device comprises:
the material feeding and receiving motor mounting seat (21) is laterally fixed on the bedplate (1), one side of the upper end of the material feeding and receiving motor mounting seat is mounted on the screw rod seat plate, and one side of the screw rod seat plate is provided with a slide rail;
the feeding and receiving motor (22) is fixed on the feeding and receiving motor mounting seat (21), the driving end of the feeding and receiving motor mounting seat is upwards connected with a screw rod (23), the screw rod (23) is arranged on a screw rod seat plate and is in threaded connection with a lifting block, and the lifting block is in sliding connection with a sliding rail;
the supporting plate (24) is connected with the lifting block through a lifting support rod, and the lifting block is driven by the screw rod (23) to drive the supporting plate (24) to do lifting motion.
3. The die bonder with the horizontal rotating double swing arms as claimed in claim 2, wherein a first magazine (25) for storing LED supports is fixed on the upper end plate surface of the supporting plate (24), the push rod mechanism (26) is fixed on one side of the first magazine (25) through a support, a push rod portion of the push rod mechanism is driven by a driving portion to move transversely, and the push rod portion of the push rod mechanism can extend into the first magazine (25) so that the LED supports can be pushed onto a clamp moving platform (3).
4. The die bonder with horizontal rotation and double swing arms as claimed in claim 1, wherein the clamp moving platform (3) and the first driving assembly thereon comprise:
a first transverse drive assembly (31) mounted on the platen (1);
a first longitudinal driving component (32) which is arranged longitudinally and is driven by the first transverse driving component (31) to move transversely;
a belt conveyor assembly (33) driven for longitudinal movement by said first longitudinal drive assembly (32); the belt conveying assembly (33) utilizes the first transverse driving assembly (31) and the first longitudinal driving assembly (32) to move transversely and longitudinally, so that the LED support on the moving platform is driven to move to the die bonding station.
5. The die bonder with the horizontal rotating double swing arms as claimed in claim 1, wherein the die bonder mechanism (4) comprises a welding column (41), a horizontal double swing arm assembly (44), a die-taking lens assembly (42) and a die-bonding lens assembly (43), the horizontal double swing arm assembly (44) is fixed in the middle of the welding column (41), and the die-taking lens assembly (42) and the die-bonding lens assembly (43) are respectively fixed on two sides of the welding column (41).
6. The die bonder of claim 5, wherein the horizontal double-swing arm assembly (44) comprises a mounting base (441), a rotary driving motor (442), a first voice coil driving mechanism (443), a second voice coil driving mechanism (444), a first swing arm (445), and a second swing arm (446); the driving end of the rotary driving motor (442) is vertically fixed on the mounting seat (441), the first voice coil driving mechanism (443) and the second voice coil driving mechanism (444) are fixed on two sides of the mounting seat (441) in a back-to-back manner, and the first voice coil driving mechanism (443) and the second voice coil driving mechanism (444) are respectively connected with the first swing arm (445) and the second swing arm (446); the first voice coil driving mechanism (443) drives the first swing arm (445) to move up and down, the second voice coil driving mechanism (444) drives the second swing arm (446) to move up and down, the first swing arm (445) and the second swing arm (446) independently move up and down without interference, and the die bonding efficiency is obviously improved.
7. The die bonder with the horizontal rotating double swing arms as claimed in claim 5, wherein the LED die ring moving platform mechanism (5) has a second driving assembly comprising a second horizontal driving assembly (51), a second longitudinal driving assembly (52) and an LED die ring adapter plate (53), the second horizontal driving assembly (51) has the second longitudinal driving assembly (52), the second longitudinal driving assembly (52) has the LED die ring adapter plate (53), the LED die ring adapter plate (53) has the LED die ring rotating assembly (54), the LED die ring rotating assembly (54) has the LED die ring (55) for carrying the LED die, and the LED die ring rotating assembly (54) performs the horizontal and longitudinal movement by using the second horizontal driving assembly (51) and the second longitudinal driving assembly (52), thereby driving the LED crystal ring (55) on the LED crystal ring to move to a designated position, and then the LED crystal ring rotating assembly (54) drives the LED crystal ring (55) to rotate to correct the wafer.
8. The die bonder with the horizontal rotating double swing arms as claimed in claim 1, wherein the voice coil thimble mechanism (6) comprises a thimble assembly (61), a voice coil up-and-down driving assembly (62), a horizontal fine tuning assembly (63), a longitudinal fine tuning assembly (64), and an adjustable seat (65), the voice coil up-and-down driving assembly (62) drives the thimble assembly (61) to move up and down, the horizontal fine tuning assembly (63) and the longitudinal fine tuning assembly (64) respectively drive the adjustable seat (65) to move longitudinally and transversely, so as to drive the thimble assembly (61) to perform fine tuning movement in the XY direction.
9. The die bonder with the horizontal rotation and the double swing arms as claimed in claim 8, wherein the voice coil up-down driving assembly (62) comprises a stator and a plunger telescopically arranged in the stator and linearly moving along the axial direction of the stator, the mover is connected with the ejector pin assembly (61), an electromagnetic field is generated between the stator and the mover, and under the action of the electromagnetic field, the mover linearly moves relative to the stator to extend out of or retract into the stator so as to drive the ejector pin assembly (61) to move up and down and eject the wafer.
10. The die bonder with the horizontal rotation and the double swing arms as claimed in claim 1, wherein the automatic LED die ring feeding mechanism (7) is provided with a magazine lifting assembly (72) and an LED die ring carrying assembly (71) for lifting the magazine, the second magazine (73) stores LED die rings, and the magazine lifting assembly (72) lifts the second magazine (73) to a set height to enable the LED die ring carrying assembly (71) to pick up and send the LED die rings to the LED die ring placing grooves on the LED die ring moving platform mechanism (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922194056.6U CN210778672U (en) | 2019-12-09 | 2019-12-09 | Horizontal rotation double-swing-arm die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922194056.6U CN210778672U (en) | 2019-12-09 | 2019-12-09 | Horizontal rotation double-swing-arm die bonder |
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| Publication Number | Publication Date |
|---|---|
| CN210778672U true CN210778672U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922194056.6U Active CN210778672U (en) | 2019-12-09 | 2019-12-09 | Horizontal rotation double-swing-arm die bonder |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899133A (en) * | 2022-04-25 | 2022-08-12 | 深圳新益昌科技股份有限公司 | Crystal supply device |
-
2019
- 2019-12-09 CN CN201922194056.6U patent/CN210778672U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899133A (en) * | 2022-04-25 | 2022-08-12 | 深圳新益昌科技股份有限公司 | Crystal supply device |
| CN114899133B (en) * | 2022-04-25 | 2023-04-25 | 深圳新益昌科技股份有限公司 | Crystal supply device |
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