WO2020199238A1 - 一种液晶移相器、液晶天线及液晶移相器的制作方法 - Google Patents
一种液晶移相器、液晶天线及液晶移相器的制作方法 Download PDFInfo
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- WO2020199238A1 WO2020199238A1 PCT/CN2019/082162 CN2019082162W WO2020199238A1 WO 2020199238 A1 WO2020199238 A1 WO 2020199238A1 CN 2019082162 W CN2019082162 W CN 2019082162W WO 2020199238 A1 WO2020199238 A1 WO 2020199238A1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
- H01Q3/36—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/184—Strip line phase-shifters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Definitions
- the invention relates to the technical field of wireless communication, and in particular to a method for manufacturing a liquid crystal phase shifter, a liquid crystal antenna and a liquid crystal phase shifter.
- Antennas as the core equipment for sending and receiving communication information, have become a key factor affecting the performance indicators of information networks and user application effects.
- the liquid crystal phase shifter is a key component of the liquid crystal antenna. How to design and manufacture the liquid crystal phase shifter and the liquid crystal antenna suitable for the frequency spectrum above the ultra-high frequency band is a problem to be solved by those skilled in the art.
- the present invention provides a method for manufacturing a liquid crystal phase shifter, a liquid crystal antenna and a liquid crystal phase shifter.
- the present invention provides a liquid crystal phase shifter, comprising a first substrate and a second substrate arranged oppositely, and a liquid crystal layer located between the first substrate and the second substrate; a first substrate facing the second substrate A first metal film layer is provided on the side; a second metal film layer is provided on the side of the second substrate facing the first substrate, and the first metal film layer and the second metal film layer are both patterned metal film layers;
- the first substrate and the second substrate are PCB plates.
- a light-transmitting first carrier layer is provided between the first metal film layer and the first substrate, and a light-transmitting second carrier layer is provided between the second metal film layer and the second substrate.
- a first adhesive layer is provided between the first carrier layer and the first substrate, and a second adhesive layer is provided between the second carrier layer and the second substrate.
- the PCB board is a PTFE high frequency board.
- the first metal film layer and the second metal film layer are copper layers.
- the thickness of the metal film layer of the first metal film layer and the second metal film layer is not less than 2.0 ⁇ m.
- the first carrier layer and the second carrier layer are PI layers.
- the first carrier layer and the first metal film layer are integrated copper-clad PI substrates, and the second carrier layer and the second metal film layer are integrated copper-clad PI substrates.
- the present invention also provides a liquid crystal antenna including the liquid crystal phase shifter as described above, and the liquid crystal antenna further includes an antenna radiation unit.
- the present invention also provides a method for manufacturing a liquid crystal phase shifter for manufacturing the liquid crystal phase shifter as described above, and the manufacturing method includes the following steps:
- S1 Provide a first substrate of a PCB sheet, the first substrate has a first metal film layer, the first metal film layer has a first alignment mark, the first substrate has a first through hole, the first alignment The position of the target corresponds to the position of the first through hole;
- S2 Provide a second substrate of the PCB sheet, the second substrate has a second metal film layer, the second metal film layer has a second alignment mark, the second substrate has a second through hole, and the second alignment mark The position corresponds to the position of the second through hole;
- a CCD lens is used to align the first substrate and the second substrate.
- the first alignment mark is a metal alignment mark, and the first alignment mark is obtained by exposing and etching a first metal film layer;
- the second alignment mark is a metal alignment mark, The second alignment mark is obtained by exposing and etching the second metal film layer;
- a first carrier layer with high light transmission is provided between the first metal film layer and the first substrate, and the first carrier
- the layer is used as a support layer for the first alignment mark, a high light-transmitting second carrier layer is arranged between the second metal film layer and the second substrate, and the second carrier layer is used as a support layer for the second alignment mark .
- the manufacturing method of step S1 includes the following steps:
- a first substrate is provided, a first adhesive layer is provided on the first substrate, a first through hole is formed in the first substrate, and a first opening is formed in the first adhesive layer, the first through hole and the first opening
- the first metal film layer is located on the side of the first carrier layer away from the first substrate;
- step S2 includes the following steps:
- a second substrate is provided, a second adhesive layer is provided on the second substrate, a second through hole is made in the second substrate, and a second opening is made in the second adhesive layer, the second through hole and the second opening
- the second metal film layer is located on the side of the second carrier layer away from the second substrate;
- the second metal film layer is patterned to obtain a patterned second metal film layer including the second alignment mark.
- the size of the first through hole completely covers the first alignment mark; the size of the second through hole completely covers the second alignment mark.
- step S3 when the first substrate and the second substrate are aligned and bonded, a large substrate is used; after step S3, it also includes a step of hot pressing into a box to make a plurality of empty boxes, and then pass The small piece cutting process obtains a single-grain empty cell of the liquid crystal phase shifter according to claim 1.
- the first alignment mark, the second alignment mark, the first through hole, and the second through hole are set on the edge of the large substrate during the production of the large plate, and when the small piece is cut, the first The alignment mark, the second alignment mark, the first through hole, and the second through hole are cut off.
- the present invention has the following beneficial effects:
- the present application further provides alignment marks on the first metal film layer and the second metal film layer, respectively, and sets through holes corresponding to the alignment marks on the first substrate and the second substrate. The light-grabbing mark aligns the two pieces.
- the alignment mark is a metal alignment mark obtained by exposure and etching of the corresponding metal film layer; the size of the metal alignment mark is smaller than the size of the through hole, and the metal film layer and the corresponding substrate A light-transmitting carrier layer is arranged in between, so that the metal alignment mark obtained by exposure and etching can be supported, and the light-transmitting carrier layer will not affect the alignment and bonding of the light-transmitting mark.
- FIG. 1 is a schematic structural diagram of a liquid crystal phase shifter provided by Embodiment 1 of the present invention
- FIG. 2 is a schematic diagram of a structure of the first substrate, the first metal film layer, and the first carrier layer when the liquid crystal phase shifter provided in the first embodiment of the present invention is aligned and bonded;
- FIG. 3 is a schematic diagram of a structure of the first substrate, the first metal film layer, the first carrier layer and the first adhesive layer when the liquid crystal phase shifter provided in the first embodiment of the present invention is aligned and bonded;
- FIG. 4 is a schematic diagram of another structure of the first substrate, the first metal film layer, the first carrier layer, and the first adhesive layer when the liquid crystal phase shifter provided in the first embodiment of the present invention is aligned and bonded;
- FIG. 5 is a schematic diagram of the first substrate structure of a large substrate when the liquid crystal phase shifter provided in the first embodiment of the present invention is aligned and bonded;
- FIG. 6 is a flowchart of a manufacturing method of a liquid crystal phase shifter provided by the third embodiment of the present invention.
- FIG. 7 is a flowchart of step S1 in a method for manufacturing a liquid crystal phase shifter according to the third embodiment of the present invention.
- the liquid crystal phase shifter includes a first substrate 11 and a second substrate 12 disposed opposite to each other, and also includes a liquid crystal layer 50 located between the first substrate 11 and the second substrate 12.
- sealant 40 between the first substrate 11 and the second substrate 12, and the sealant 40 is located at the edges of the first substrate 11 and the second substrate 12 and is used to seal the liquid crystal layer 50.
- supports containing plastic balls and epoxy sealant 40 are distributed in the liquid crystal layer 50.
- a first conductive layer is provided on the first substrate 11 and a second conductive layer is provided on the second substrate 12.
- a first metal film layer 21 is provided on the side of the first substrate 11 facing the second substrate 12, and a second metal film layer 22 is provided on the side of the second substrate 12 facing the first substrate 11.
- Both the first metal film layer 21 and the second metal film layer 22 are patterned metal film layers.
- the first substrate 11 and the second substrate 12 are made of materials with better stability and insulation effect and extremely low dielectric loss.
- the first substrate 11 and the second substrate 12 can be glass substrates, fused silica, ABS, ceramic substrates and Ceramic thermoset polymer composites.
- the first substrate 11 and the second substrate 12 are preferably PCB plates.
- the PCB board used as the substrate of the liquid crystal phase shifter can be FR4 (epoxy glass fiber) board, PTFE (polytetrafluoroethylene) board, PPS (polyphenylene sulfide), PS (polystyrene), PPO (polyphenylene Ether board) and other boards, but the PCB board is preferably a high-frequency board, and PTFE high-frequency board is better.
- PTFE high-frequency boards have lower dielectric constant and dielectric loss. The smaller the dielectric loss, the performance of liquid crystal phase shifters and liquid crystal antennas in ultra-high frequency applications can be further improved.
- the first metal film layer 21 and the second metal film layer 22 are made of metal materials with high conductivity and magnetic permeability, and metals such as aluminum, copper, silver, gold, cadmium, chromium, molybdenum, niobium, nickel, and iron can be used.
- metals such as aluminum, copper, silver, gold, cadmium, chromium, molybdenum, niobium, nickel, and iron can be used.
- metals such as aluminum, copper, silver, gold, cadmium, chromium, molybdenum, niobium, nickel, and iron can be used.
- metals such as aluminum, copper, silver, gold, cadmium, chromium, molybdenum, niobium, nickel, and iron can be used.
- silver, copper, gold, aluminum and alloys thereof are silver, copper, gold, aluminum and alloys thereof.
- the metal material of the metal film layer is preferably a copper material.
- Both the first metal film layer 21 and the second metal film layer 22 are copper layers.
- the metal material and the thickness of the metal film are related to the conductor loss, and the skin effect is the manifestation of the conductor loss. Because alternating current has a skin effect, the skin effect indirectly increases the resistance of the conductor, and its energy and heat loss also increase. In the high frequency band such as microwave, the skin effect is very obvious. Different metal materials have different skin depths.
- Skin effect When there is an alternating current or alternating electromagnetic field in a conductor, the current distribution inside the conductor is uneven, and the current is concentrated on the outer skin part of the conductor. The closer to the surface of the conductor, the greater the current density, and the current inside the conductor is actually very small. As a result, the resistance of the conductor increases and its power loss also increases. This phenomenon is the skin effect (skin effect).
- the skin depth ⁇ is given by:
- ⁇ represents the magnetic permeability of the metal material
- ⁇ is the conductivity of the conductor
- f represents the frequency of the signal carried by the liquid crystal antenna.
- the metal films required for liquid crystal phase shifters require high conductivity and magnetic permeability, silver, copper, gold, aluminum and their alloys are generally selected, so the skin effect required by liquid crystal phase shifters and liquid crystal antennas is generally required
- the metal film thickness of the first metal film layer 21 and the second metal film layer 22 are 3 to 5 times the skin depth ⁇ .
- the thickness of the metal film layer must reach a ⁇ m-level thick film to ensure the performance of the liquid crystal antenna.
- the thickness of the metal film layers of the first metal film layer 21 and the second metal film layer 22 are not less than 2.0 ⁇ m.
- the alignment and attaching mechanism needs to perform light-transmitting marking from the back of the two substrates (that is, the side of the substrate away from the corresponding metal film layer). Since the PCB board does not transmit light, it is not conducive to the use of the transparent marking method to align the two substrates, resulting in inaccurate alignment, unable to meet the antenna design requirements, and greatly reducing the antenna performance. If you use manual blind paste, the accuracy of the fit cannot be guaranteed. In order to solve this problem, in the manufacturing process of the liquid crystal phase shifter, when the first substrate and the second substrate are aligned and bonded, the first metal film layer 21 has a first alignment mark 212.
- the second metal film layer 22 has a second alignment mark, a first through hole 111 is provided on the first substrate 11 corresponding to the first alignment mark 212, and a first through hole 111 is provided on the second substrate 12 corresponding to the second alignment mark. Two through holes.
- the alignment mark can be a circular mark.
- the alignment mark may also be a mark line included in two directions perpendicular to each other, for example, the alignment mark may be a cross mark, or two lines at an angle of 90 degrees.
- the present application solves the problem by arranging alignment marks on the first metal film layer 21 and the second metal film layer 22 respectively, and providing through holes corresponding to the alignment marks on the first substrate 11 and the second substrate 12, respectively.
- the alignment bonding mechanism can align the two substrates through the light-transmitting marking mark, which is beneficial to the implementation of the process of bonding the two substrates into the box.
- a CCD lens can be used to align and bond the first substrate 11 and the second substrate 12.
- the CCD lens captures the mark from the first substrate 11 on the back of the first metal film layer 21 through light, through the first through hole 111 on the first substrate 11, the CCD lens can see the first Alignment mark 212.
- the size of the first through hole 111 completely covers the first alignment mark 212: assuming a virtual plane, the plane is, for example, the plane where the first substrate 11 is located, and the projection of the first through hole 111 on the plane can be completely Cover the projection of the first alignment mark 212 on the plane.
- the size of the second through hole completely covers the second alignment mark.
- the first counterpoint 212 and the second counterpoint are described below:
- the first alignment mark 212 may be disposed on a side of the first metal film layer 21 close to the first substrate 11 so as to be easily visible through the first through hole 111.
- through holes are made to be used as alignment marks, or only partially transparent areas are used as alignment marks, or made by laser making alignment marks.
- the second alignment mark can be provided on the side of the second metal film layer 22 close to the second substrate 12 so that it can be seen through the second through hole.
- the alignment mark is a metal alignment mark obtained by exposure and etching of the corresponding metal film layer.
- the first alignment mark 212 is obtained by exposing and etching the first metal film layer 21
- the second alignment mark is obtained by exposing and etching the second metal film layer 22
- the first alignment mark 212 is a metal alignment mark. It can be understood that the first alignment mark 212 corresponds to the position of the second alignment mark.
- the first substrate 11 as an example, as shown in FIG. 2, there is a transparent first carrier layer 71 between the first metal film layer 21 and the first substrate 11.
- the size of the metal alignment mark is generally smaller than the size of the through hole.
- the metal alignment mark obtained by exposure and etching can be supported, and the transparent carrier layer will not Affects the translucent marking and alignment.
- the first carrier layer 71 and the second carrier layer may be a PI (polyimide) layer, a PET (polyterephthalate) layer, or a PE (polyethylene) layer, all of which have good light transmittance.
- PI polyimide
- PET polyterephthalate
- PE polyethylene
- an integrated copper-clad PI substrate can be selected, that is, the PI substrate layer is laminated with a copper foil layer, and the copper-clad PI substrate can replace the first carrier layer 71 and the first metal film layer 21 , And the first carrier layer 71 and the first metal film layer 21 are integrated.
- the copper-clad PI substrate can be attached to the corresponding substrate through an adhesive layer. As shown in FIG. 3, there is a first adhesive layer 61 between the first carrier layer 71 and the first substrate 11, and the first carrier layer 71 and the first substrate 11 are bonded by the first adhesive layer 61. Similarly, there is a second glue layer between the second carrier layer and the second substrate 12.
- a carrier layer such as a PI layer may be attached to the substrate first, and then a metal film layer is fabricated or disposed on the carrier layer.
- the copper-clad PI substrate is generally an existing sheet, it can be purchased directly, compared to first attaching a carrier layer such as a PI layer to the substrate and then attaching it to the carrier.
- the solution of fabricating or arranging the metal film layer on the layer has the advantages of cost and time saving.
- the first adhesive layer 61 and the second adhesive layer may be opaque adhesives commonly used for PCB boards, or may also be light-transmitting optical adhesives.
- the first adhesive layer 61 and the second adhesive layer are opaque adhesive layers, as shown in FIG. 4, the first adhesive layer 61 is provided with a first opening 611 at a position corresponding to the first alignment mark 212.
- the second adhesive layer is provided with a second opening at a position corresponding to the second alignment mark.
- the first opening 611 and the second opening are arranged so that the first adhesive layer 61 and the second adhesive layer do not hinder the alignment and bonding of the transparent marking mark.
- the size of the first opening 611 completely covers the first alignment mark 212: assuming a virtual plane, the plane is for example the plane where the first substrate 11 is located, and the projection of the first opening 611 on this plane can completely cover the first The projection of the alignment mark 212 on the plane.
- the size of the second opening completely covers the second alignment mark.
- the first opening 611 is not smaller than the first through hole 111 on the first substrate 11, and the second opening is not smaller than the second through hole on the second substrate 12.
- the first through holes 111, the second through holes, and the first and second holes 611 and the second holes are preferably made before the carrier layer is attached to prevent damage to the carrier layer or the metal film layer when the through holes or the holes are made.
- the manufacturing method of the liquid crystal phase shifter also includes the steps of hot pressing into a box, cutting small pieces, filling and sealing, and binding. It should be noted that the arrangement of the first alignment mark 212, the second alignment mark, the first through hole 111, and the second through hole described above, and the arrangement of the first opening 611 and the second opening are In order to facilitate the positioning and bonding of the two substrates of the liquid crystal phase shifter, the positioning and bonding mechanism can perform light-transmitting marking from the back of the substrate to achieve precise positioning of the first substrate and the second substrate.
- the first alignment mark 212, the second alignment mark, the first through hole 111, and the second through hole are generally arranged at the edge of the liquid crystal phase shifter product.
- the second alignment mark, the first through hole 111, and the second through hole are generally cut off.
- the liquid crystal phase shifter further includes a first alignment layer 31 and a second alignment layer 32 respectively arranged on both sides of the liquid crystal layer 50.
- the first alignment layer 31 is prepared on the first substrate 11 on which the patterned metal film layer is formed
- the second alignment layer 32 is prepared on the second substrate 12 on which the patterned metal film layer is formed.
- the alignment layer is used to define the initial deflection angle of the crystal molecules of the liquid crystal layer 50.
- the metal pattern 211 on the patterned second metal film layer 22 includes a phase shifter electrode, the phase shifter electrode is a planar transmission line, and the planar transmission line is used to transmit microwave signals.
- the planar transmission line is preferably a microstrip line.
- the shape of the microstrip line may be serpentine or spiral, and the shape of the microstrip line is not limited, as long as it can realize the transmission of microwave signals.
- the metal pattern 211 on the patterned first metal film layer 21 includes a ground electrode, and the liquid crystal phase shifter also includes a bias line.
- the bias line may be provided on the second metal film layer 22 of the second substrate 12.
- the liquid crystal molecules are arranged in a preset direction under the action of the first alignment layer and the second alignment layer.
- the electric field drives the deflection of the direction of the liquid crystal molecules in the liquid crystal layer 50.
- the microwave signal is transmitted between the microstrip line and the ground electrode.
- the phase will be changed due to the deflection of the liquid crystal molecules, thereby realizing the phase shift function of the microwave signal.
- the deflection angle of the liquid crystal in the liquid crystal layer 50 can be controlled, and the phase adjusted in the phase shifting process can be controlled.
- the effective dielectric constant of the liquid crystal is changed by controlling the voltage applied to the liquid crystal layer 50, thereby controlling the phase adjusted during the phase shift.
- a two-dimensional pattern is formed by specially designed liquid crystal antenna units with different electrostatic capacitances. The electromagnetic waves received or emitted from the antenna are given a phase difference corresponding to the electrostatic capacitance of each antenna element, and the two-dimensional pattern formed by the antenna elements with different electrostatic capacitances has strong directivity in a specific direction (beam scanning), thereby realizing antenna reception Or the mutual conversion function between emitted electromagnetic waves and radio frequency signals (voltage signals).
- the present invention has the following beneficial effects:
- the PCB board is a PTFE high-frequency board.
- the PTFE high-frequency board has a lower dielectric constant and dielectric loss. The smaller the dielectric loss, the application of liquid crystal phase shifters and liquid crystal antennas in ultra-high frequency bands can be further improved. Performance.
- the present application further provides alignment marks on the first metal film layer and the second metal film layer, respectively, and sets through holes corresponding to the alignment marks on the first substrate and the second substrate.
- the light-grabbing mark aligns the two pieces; in order to simplify the process and process, the alignment mark is a metal alignment mark obtained by exposure and etching of the corresponding metal film layer; the size of the metal alignment mark is smaller than the size of the through hole.
- a light-transmitting carrier layer is arranged between the metal film layer and the corresponding substrate, so that the metal alignment mark obtained by exposure and etching can be supported, and the light-transmitting carrier layer will not affect the alignment and bonding of the light-transmitting mark.
- This specific embodiment provides a liquid crystal antenna, which includes the liquid crystal phase shifter described in the first embodiment.
- the liquid crystal antenna also includes an antenna radiating unit, which is used for radiating microwave signals to realize the feeding and feeding of microwave signals.
- an antenna radiation unit is provided on the side of the first substrate 11 away from the second substrate 12.
- the antenna radiation unit is made of highly conductive materials.
- the antenna radiation unit can be a rectangular, circular, or square patch, and it can be cut corners, or it can be attached to the liquid crystal phase shifter by patch technology.
- a more preferred solution is that the antenna radiation unit is a patterned third metal film layer disposed on the side of the first substrate 11 away from the second substrate 12.
- This specific embodiment provides a method for manufacturing the liquid crystal phase shifter as described in the first embodiment. As shown in FIG. 6, the manufacturing method of the liquid crystal phase shifter includes the following steps:
- the first metal film layer 21 has a first alignment mark 212, and the first substrate 11 has a first through hole 111, and the position of the first alignment mark 212 corresponds to the position of the first through hole 111;
- S2 Provide a second substrate 12 of a PCB sheet, the second substrate 12 has a second metal film layer 22, the second metal film layer 22 has a second alignment mark, and the second substrate 12 has a second through hole.
- the position of the second alignment mark corresponds to the position of the second through hole;
- the alignment bonding mechanism respectively penetrates the first through hole 111 and the second through hole, and uses the first alignment mark 212 and the second alignment mark to align the first substrate 11 and the second substrate 12 .
- step S1 and step S2 can be adjusted.
- step S3 the liquid crystal panel is aligned and bonded to the commonly used CCD light transmission alignment to implement precise bonding: a CCD lens is used, and the CCD lens passes through the first through hole 111 and the second through hole respectively, and uses the The pair of positioning marks 212 and the second positioning mark align the first substrate 11 and the second substrate 12 in advance, and move slowly to a bonded state after the alignment.
- the first alignment mark 212 may be disposed on a side of the first metal film layer 21 close to the first substrate 11 so as to be easily visible through the first through hole 111.
- through holes are made to be used as alignment marks, or only partially transparent areas are used as alignment marks, or made by laser making alignment marks.
- the second alignment mark can be provided on the side of the second metal film layer 22 close to the second substrate 12 so that it can be seen through the second through hole.
- the alignment mark is a metal alignment mark obtained by exposure and etching of the corresponding metal film layer.
- the first alignment mark 212 is obtained by exposing and etching the first metal film layer 21
- the second alignment mark is obtained by exposing and etching the second metal film layer 22, and the first alignment mark 212
- Both the second alignment mark and the second alignment mark are metal alignment marks.
- the size of the metal alignment mark is generally smaller than the size of the through hole to facilitate light-transmitting marking through the through hole. After exposure and etching, the metal around the metal alignment mark is etched away, so that the metal alignment mark has no support.
- a light-transmitting first carrier layer 71 is provided between the first metal film layer 21 and the first substrate 11, and a light-transmitting second carrier layer is provided between the second metal film layer 22 and the second substrate 12.
- Floor By providing a transparent carrier layer between the metal film layer and the corresponding substrate, the metal alignment mark obtained by exposure and etching can be supported, and the transparent carrier layer will not affect the alignment and bonding of the transparent marking mark.
- the first carrier layer 71 and the second carrier layer may be a PI layer, a PET layer, or a PE layer, all of which have good light transmission. But it is more preferable that the first carrier layer 71 and the second carrier layer are PI layers. PI has the advantages of better light transmission and high temperature resistance, and can withstand high temperature baking in the subsequent manufacturing process of the alignment layer. grilled.
- a copper clad PI substrate can be used as the metal film layer and carrier layer.
- the copper clad PI substrate that is, the PI substrate layer is laminated with a copper foil layer.
- the copper clad PI substrate can be glued The layer is attached to the corresponding substrate. Specifically, there is a first adhesive layer 61 between the first carrier layer 71 and the first substrate 11 and a second adhesive layer between the second carrier layer and the second substrate 12.
- a carrier layer such as a PI layer may be attached to the substrate first, and then a metal film layer is fabricated or disposed on the carrier layer.
- step S1 includes the following steps:
- a first substrate 11 is provided, a first adhesive layer 61 is provided on the first substrate 11, a first through hole 111 is formed in the first substrate 11, and a first opening 611 is formed in the first adhesive layer 61.
- the position of the first through hole 111 corresponds to the position of the first opening 611;
- S13 Perform a patterning process on the first metal film layer 21 to obtain a patterned first metal film layer 21 including a first alignment mark 212.
- step S11 the first through hole 111 and the first opening 611 can be manufactured at the same time or sequentially.
- the first metal film layer 21 and the first carrier layer 71 can be taken as a whole, and the first carrier layer 71 is bonded to the first adhesive layer 61.
- a copper clad PI substrate is directly used to make the copper clad
- the foil PI substrate is bonded to the first adhesive layer 61.
- a separate first carrier layer 71 can be attached to the first adhesive layer 61 with the first opening 611 first, and then the first metal film layer 21 can be fabricated or disposed on the first carrier layer 71.
- step S2 includes the following steps:
- S23 Perform a patterning process on the second metal film layer 22 to obtain a patterned second metal film layer 22 including a second alignment mark.
- step S21 the second through hole and the second opening may be manufactured at the same time or sequentially.
- the second metal film layer 22 and the second carrier layer can be taken as a whole, and the second carrier layer is bonded to the second adhesive layer.
- the copper clad PI substrate is directly used to make the copper clad PI base The material is bonded to the second adhesive layer.
- a separate second carrier layer can be attached to the second adhesive layer with second openings first; then, the second metal film layer 22 can be fabricated or disposed on the second carrier layer.
- the method for manufacturing the liquid crystal phase shifter further includes the specific details of the first metal film layer 21 and the second metal film layer 22.
- the patterning processing method of the metal film layer is known to those skilled in the art, and can be obtained through the processes of glue coating, pre-curing, exposure, development, etching, and film release.
- the orientation layer can be made by the PI rubbing process in the prior art to form orientation grooves on the surface.
- an APR board can be used to transfer the pre-dropped orientation liquid to the corresponding substrate with a metal pattern, and baking at a high temperature to make a full reaction while volatilizing the solvent, and finally a solid orientation film layer is formed.
- the oriented film is polished with flannel or cotton cloth in one direction to form the final arrangement of the liquid crystal molecules in parallel according to the preset rubbing direction, which will not be repeated here.
- the manufacturing method of the liquid crystal phase shifter further includes the steps of hot pressing into a box, cutting small pieces, filling and sealing, and binding.
- the manufacturing method of the liquid crystal phase shifter further includes the steps of hot pressing into a box, cutting small pieces, filling and sealing, and binding.
- the pre-laminated substrate is cured by a high-pressure and high-temperature process, and a certain box thickness interval will be formed. After fully curing, a plurality of voids with high bonding strength and high mechanical strength are finally formed. Box (CELL). Then, through the small piece cutting process, multiple single-grain liquid crystal phase shifter empty cells can be obtained.
- the positioning and bonding mechanism can perform light-transmitting marking from the back of the substrate to achieve precise positioning of the first substrate and the second substrate.
- the first alignment mark 212, the second alignment mark, the first through hole 111, and the second through hole are generally arranged at the edge of the liquid crystal phase shifter product.
- Figure 5 shows a schematic diagram of the first substrate 11 of the large substrate.
- the large substrate includes a plurality of independent units, and the first through hole 111 is located at the edge of the large substrate.
- FIG. 5 only shows that there are 4 independent units, and each unit includes a separate sealant 40, but the number is not limited to this.
- the first alignment mark 212, the second alignment mark, the first through hole 111, and the second through hole are cut off and are not present in the liquid crystal phase shifter product.
- the present invention has the following beneficial effects:
- the present invention provides a method for mass-manufacturing liquid crystal phase shifters using a PCB board as a substrate combined with a liquid crystal panel manufacturing method.
- the dielectric constant and dielectric loss of the PCB board are lower than that of the glass substrate commonly used for liquid crystal panels. The smaller the loss, the better the performance of the liquid crystal phase shifter in ultra-high frequency applications;
- the present invention further solves the problem that the original opaque PCB board cannot use the light-transmitting alignment bonding mechanism of the liquid crystal panel to accurately bond the two substrates.
- the position mark, and the first substrate and the second substrate are respectively provided with through holes corresponding to the position of the position mark. After the improvement, the two sheets can be aligned and bonded by the light-transmitting mark.
- the alignment mark is a metal alignment mark obtained by exposure and etching of the corresponding metal film; the size of the metal alignment mark is smaller than the size of the through hole, and a light-transmitting mark is provided between the metal film layer and the corresponding substrate.
- the carrier layer enables the metal alignment mark obtained by exposure and etching to be supported, and the light-transmitting carrier layer will not affect the alignment and bonding of the light-transmitting mark.
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Abstract
一种液晶移相器、液晶天线及液晶移相器的制作方法。液晶移相器包括相对设置的第一基板(11)和第二基板(12)以及位于第一基板(11)和第二基板(12)之间的液晶层(50);在第一基板(11)朝向第二基板(12)一侧设置有第一金属膜层(21);在第二基板(12)朝向第一基板(11)一侧设置有第二金属膜层(22),第一金属膜层(21)和第二金属膜层(22)均为图案化金属膜层;第一基板(11)和第二基板(12)为PCB板材。液晶天线包括液晶移相器。在超高频无线通信中,基板材料的介电常数和介电损耗值越大,介质损耗越大,信号越差,使用PCB板材作为液晶天线的基板,PCB板材的介电常数和介电损耗比液晶面板常用的玻璃基板更低,介质损耗越小,有利于提升液晶天线在超高频段应用的性能。
Description
本发明涉及无线通信技术领域,具体地,涉及一种液晶移相器、液晶天线及液晶移相器的制作方法。
信息网络的发展日新月异,在各个领域都正在或将会产生重大变革,其中热点技术就有5G和卫星移动互联网通信技术。
天线作为通信信息发送和接收的核心设备,已经成为影响信息网络性能指标和用户应用效果的关键因素。
当前,因为高低频段(厘米波以下,如频率≤10GHz)的无线电磁波频谱资源相当紧张,因此,只能开发利用超高频段以上(厘米波至太赫兹,10GHz以上)的频谱。
液晶移相器作为液晶天线的关键部件,如何设计制作适合于超高频段以上频谱的液晶移相器和液晶天线是本领域技术人员所要解决的问题。
发明概述
问题的解决方案
为了解决上述问题,本发明提供了一种液晶移相器、液晶天线及液晶移相器的制作方法。
本发明提供了一种液晶移相器,包括相对设置的第一基板和第二基板以及位于所述第一基板和第二基板之间的液晶层;在第一基板朝向所述第二基板一侧设置有第一金属膜层;在第二基板朝向所述第一基板一侧设置有第二金属膜层,所述第一金属膜层和第二金属膜层均为图案化金属膜层;所述第一基板和第二基板为PCB板材。
优选的,所述第一金属膜层和第一基板之间具有透光的第一载体层,所述第二 金属膜层和第二基板之间具有透光的第二载体层。
优选的,所述第一载体层和第一基板之间具有第一胶层,所述第二载体层和第二基板之间具有第二胶层。
优选的,所述PCB板材为PTFE高频板。
优选的,所述第一金属膜层和第二金属膜层为铜层。
优选的,所述第一金属膜层和第二金属膜层的金属膜层厚度均不小于2.0μm。
优选的,所述第一载体层和第二载体层为PI层。
优选的,所述第一载体层和第一金属膜层为一体化的覆铜箔PI基材,所述第二载体层和第二金属膜层为一体化的覆铜箔PI基材。
本发明还提供了一种液晶天线,包括如上所述的液晶移相器,所述液晶天线还包括天线辐射单元。
本发明还提供了一种液晶移相器的制作方法,用于制作如如上所述的液晶移相器,所述制作方法包括以下步骤:
S1:提供PCB板材的第一基板,第一基板上具有第一金属膜层,第一金属膜层上具有第一对位标,第一基板上具有第一通孔,所述第一对位标的位置与第一通孔的位置相对应;
S2:提供PCB板材的第二基板,第二基板上具有第二金属膜层,第二金属膜层上具有第二对位标,第二基板具有第二通孔,所述第二对位标的位置与第二通孔的位置相对应;
S3:分别透过第一通孔和第二通孔,利用第一对位标和第二对位标,对第一基板和第二基板进行对位贴合。
优选的,在步骤S3中,利用CCD镜头,对第一基板和第二基板进行对位贴合。
优选的,所述第一对位标为金属对位标,所述第一对位标是通过对第一金属膜层进行曝光蚀刻而得到;所述第二对位标为金属对位标,所述第二对位标是通过对第二金属膜层进行曝光蚀刻而得到;在所述第一金属膜层和第一基板之间设置高透光的第一载体层,所述第一载体层用作第一对位标的支撑层,在所述第二金属膜层和第二基板之间设置高透光的第二载体层,所述第二载体层用作第二对位标的支撑层。
优选的,所述步骤S1的制作方法包括以下步骤:
提供第一基板,在所述第一基板上设置第一胶层,在第一基板制作第一通孔,在第一胶层制作第一开孔,所述第一通孔和第一开孔的位置相对应;
将第一载体层贴合在具有第一开孔的第一胶层;第一金属膜层位于第一载体层背离第一基板的一面上;
对第一金属膜层进行图案化处理,得到包括第一对位标的图案化第一金属膜层;
所述步骤S2的制作方法包括以下步骤:
提供第二基板,在所述第二基板上设置第二胶层,在第二基板制作第二通孔,在第二胶层制作第二开孔,所述第二通孔和第二开孔的位置相对应;
将第二载体层贴合在具有第二开孔的第二胶层;第二金属膜层位于第二载体层背离第二基板的一面上;
对第二金属膜层进行图案化处理,得到包括第二对位标的图案化第二金属膜层。
优选的,所述第一通孔的大小完全覆盖第一对位标;所述第二通孔的大小完全覆盖第二对位标。
优选的,在步骤S3对第一基板和第二基板进行对位贴合时,采用的是大片基板制作;在步骤S3之后,还包括热压成盒步骤以制成多个空盒,之后通过小片裁切工艺得到单粒的如权利要求1所述的液晶移相器空盒。
优选的,所述第一对位标、第二对位标、第一通孔、和第二通孔在大板制作时设置在大片基板的边缘位置,在小片裁切时,所述第一对位标、第二对位标、第一通孔、和第二通孔被裁切掉。
发明的有益效果
与现有技术相比,本发明具有如下有益效果:
1.在超高频无线通信中,基板材料的介电常数和介电损耗值越大,介质损耗越大,信号越差。本申请使用PCB板材作为液晶天线的基板,PCB板材的介电常数和介电损耗比液晶面板常用的玻璃基板更低,介质损耗越小,有利于提 升液晶天线在超高频段应用的性能。
2.进一步的,由于PCB板材不透光,不利于使用透光抓标方法对两片基板进行对位贴合,导致无法精确对位,无法满足天线的设计要求,进而大幅降低天线性能。本申请进一步在第一金属膜层和第二金属膜层上分别设置对位标,并在第一基板和第二基板上分别设置与对位标位置相对应的通孔,改进后可以利用透光抓标对两片进行对位贴合。
3.更进一步的,为了简化流程和工艺,对位标是相应金属膜层通过曝光蚀刻而得到的金属对位标;金属对位标的尺寸小于通孔的尺寸,通过在金属膜层和相应基板之间设置透光的载体层,使曝光蚀刻得到的金属对位标能够得到支撑,同时透光的载体层不会影响到透光抓标对位贴合。
对附图的简要说明
图1为本发明实施例一所提供的一种液晶移相器的结构示意图;
图2为本发明实施例一所提供的液晶移相器在对位贴合时第一基板、第一金属膜层、第一载体层的一种结构示意图;
图3为本发明实施例一所提供的液晶移相器在对位贴合时第一基板、第一金属膜层、第一载体层和第一胶层的一种结构示意图;
图4为本发明实施例一所提供的液晶移相器在对位贴合时第一基板、第一金属膜层、第一载体层和第一胶层的另一种结构示意图;
图5为本发明实施例一所提供的液晶移相器在对位贴合时大片基板的第一基板结构示意图;
图6为本发明实施例三所提供的一种液晶移相器的制作方法的流程图;
图7为本发明实施例三所提供的一种液晶移相器制作方法中步骤S1的流程图。
附图标记:
11-第一基板、21-第一金属膜层、31-第一取向层、12-第二基板、22-第二金属膜层、32-第二取向层、111-第一通孔、211-金属图案、212-第一对位标、40-框胶、50-液晶层、61-第一胶层、611-第一开孔、71-第一载体层。
发明实施例
为了使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明作进一步地详细描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
下面结合附图和实施例,对本发明作进一步说明:
实施例一:
如图1所示,为本发明实施例一,本具体实施例提供了一种液晶移相器。液晶移相器包括相对设置的第一基板11和第二基板12,还包括位于第一基板11和第二基板12之间的液晶层50。
第一基板11和第二基板12之间还具有框胶40,框胶40位于第一基板11和第二基板12的边缘,其用于密封液晶层50。优选的,液晶层50中分布有含塑胶球和环氧框胶40的支撑物。
在第一基板11设置有第一导电层,在第二基板12设置有第二导电层。
在第一基板11朝向所述第二基板12一侧设置有第一金属膜层21,在第二基板12朝向所述第一基板11一侧设置有第二金属膜层22。
第一金属膜层21和第二金属膜层22均是图案化的金属膜层。
第一基板11和第二基板12,选用稳定性和绝缘效果较佳同时介电损耗极低的材料,第一基板11和第二基板12可以是玻璃基板、熔融石英、ABS、陶瓷基材和陶瓷热固聚合物复合材料。在本实施例中,第一基板11和第二基板12优选为PCB板材。
在超高频无线通信中,基板材料的介电常数和介电损耗值越大,介质损耗越大,信号越差。本申请使用PCB板材作为液晶移相器的基板,PCB板材的介电常数和介电损耗比液晶面板常用的玻璃基板更低,介质损耗越小,有利于提升液晶移相器及液晶天线在超高频段应用的性能。
用作液晶移相器基板的PCB板材可以是FR4(环氧树脂玻纤)板、PTFE(聚四氟乙烯)板、PPS(聚苯硫醚)、PS(聚苯乙烯)、PPO(聚苯醚板)等板材,但PCB板材优选为高频板,选用PTFE高频板更佳。在PCB板材中,PTFE高频板具有更 低的介电常数和介电损耗,介质损耗越小,可以进一步提升液晶移相器及液晶天线在超高频段应用的性能。
第一金属膜层21和第二金属膜层22选用具有高导电性和磁导率的金属材料,可以采用铝、铜、银、金、镉、铬、钼、铌、镍、铁等金属,优选为银、铜、金、铝及其合金。
无线通信的损耗越低其性能就越好,即***损耗(含导体损耗)也是越低性能越好,由于液晶移相器所需要的金属材料要求高的电导率和磁导率,一般选用银、铜、金、铝及其合金。
在金属材料银、铜、金、铝及其合金中,银和金的电导率佳,但是成本贵。作为性价比最好的方案,金属膜层的金属材料优选为铜材料。第一金属膜层21和第二金属膜层22均为铜层。
已知金属材料及金属膜层厚度与导体损耗都有关系,趋肤效应就是导体损耗的体现。由于交流电具有趋肤效应,趋肤效应间接使导体的电阻增大,其能量热损耗也随之增大。在微波等高频段的波段中,趋肤效应非常明显。不同的金属材料具有不同的趋肤深度。
趋肤效应:当导体中有交流电或交变电磁场时,导体内部的电流分布不均匀,电流集中在导体的外表皮肤部分,越靠近导体表面,电流密度越大,导线内部实际上电流很小。结果使导体的电阻增加,使它的损耗功率也增加。这一现象就是趋肤效应(skin effect)。
趋肤深度δ由下式给出:
δ=(1/πfμσ)
1/2,
其中,μ表示金属材料的磁导率,σ是导体的电导率,f表示液晶天线所承载信号的频率。
由于液晶移相器所需要的金属材料要求高的电导率和磁导率,一般选用银、铜、金、铝及其合金,因此液晶移相器和液晶天线所要求的趋肤效应,一般需要相应第一金属膜层21和第二金属膜层22的金属膜层厚度分别为趋肤深度δ的3倍到5倍之间。金属膜层的厚度要达到μm级的厚膜,才能保较好地证保证液晶天线的性能。
当第一金属膜层21和第二金属膜层22均为铜层时,第一金属膜层21和第二金属膜层22的金属膜层厚度均不小于2.0μm。
在对两片基板进行对位贴合时,由于对位贴合机构需要从两片基板的背面(即基板上背离相应金属膜层的一面)进行透光抓标。由于PCB板材不透光,不利于使用透光抓标方法对两片基板进行对位贴合,导致无法精确对位,无法满足天线的设计要求,进而大幅降低天线性能。若用手动进行盲贴,贴合的精度无法保证。为了解决该问题,在液晶移相器的制作工艺中,在对第一基板和第二基板进行对位贴合时,在第一金属膜层21具有第一对位标212,在所述第二金属膜层22具有第二对位标,在第一基板11上对应第一对位标212处设置有第一通孔111,在第二基板12上对应第二对位标处设置有第二通孔。
对位标可以是圆形标记。或者,对位标还可以是包括在彼此垂直的两个方向上的标线,例如对位标可以是十字标、或者是呈90度夹角的两条线。
本申请通过在第一金属膜层21和第二金属膜层22上分别设置对位标,并在第一基板11和第二基板12上分别设置与对位标位置相对应的通孔,解决了透光的问题,使对位贴合机构可以通过透光抓标对两片基板对位贴合,进而利于实施两片基板贴合成盒的工艺过程。
在对位贴合时,可以利用CCD镜头,对第一基板11和第二基板12进行对位贴合。以第一基板11为例,CCD镜头从第一金属膜层21背面的第一基板11处透光抓标,透过第一基板11上的第一通孔111,CCD镜头可以看到第一对位标212。
优选的,第一通孔111的大小完全覆盖第一对位标212:假设有一个虚拟的平面,该平面例如为第一基板11所在的平面,第一通孔111在该平面的投影可以完全覆盖第一对位标212在该平面的投影。同样,第二通孔的大小完全覆盖第二对位标。
以下对第一对位标212和第二对位标进行说明:
第一对位标212可以设置在第一金属膜层21靠近第一基板11的一面上,便于透过第一通孔111就可以看到。例如制作过孔用作对位标,或者只做局部透明区域做对位标,或者通过激光制作对位标等方法制成。同样,第二对位标可以设置在第二金属膜层22靠近第二基板12的一面上,便于透过第二通孔就可以看到。
但更加优选的是,为了简化流程和工艺,对位标是相应金属膜层通过曝光蚀刻而得到的金属对位标。具体的,第一对位标212是通过对第一金属膜层21进行曝光蚀刻而得到,第二对位标是通过对第二金属膜层22进行曝光蚀刻而得到,第一对位标212和第二对位标为金属对位标。可以理解的是,所述第一对位标212与第二对位标的位置相对应。
更进一步的,以第一基板11为例,如图2所示,在第一金属膜层21和第一基板11之间具有透光的第一载体层71。金属对位标的尺寸一般小于通孔的尺寸,通过在金属膜层和相应基板之间设置透光的载体层,使曝光蚀刻得到的金属对位标能够得到支撑,同时透光的载体层不会影响到透光抓标对位贴合。同样的,在第二金属膜层22和第二基板12之间具有透光的第二载体层。
第一载体层71和第二载体层可以是PI(聚酰亚胺)层、PET(聚对苯二甲酸类材料)层、或者PE(聚乙烯)层,它们都具有良好的透光性。但更加优选的是,第一载体层71和第二载体层为PI层,PI兼具更好的透光性和耐高温性佳等优点。
在实际应用中,可以选用一体化的覆铜箔PI基材,即PI基材层上层叠覆有铜箔层,覆铜箔PI基材可以代替第一载体层71和第一金属膜层21,并使第一载体层71和第一金属膜层21一体化。覆铜箔PI基材可以通过胶层与相应基板进行贴附。如图3所示,在第一载体层71和第一基板11之间具有第一胶层61,第一载体层71和第一基板11通过第一胶层61贴合。同样的,在第二载体层和第二基板12之间具有第二胶层。或者,在其它的实施例中,也可以先将载体层如PI层贴附在基板上,再在载体层上制作或者设置金属膜层。但与使用覆铜箔PI基材的方案相比较,由于覆铜箔PI基材一般为现有的板材,可以直接采购,相对于先将载体层如PI层贴附在基板上,再在载体层上制作或者设置金属膜层的方案具有成本和更加节约时间的优势。
第一胶层61和第二胶层可以是PCB板材常用的不透明胶,或者也可以是透光的光学胶。
当第一胶层61和第二胶层为不透明胶层时,如图4所示,所述第一胶层61对应第一对位标212的位置设置有第一开孔611,所述第二胶层对应第二对位标的位置设置有第二开孔。第一开孔611和第二开孔的设置使第一胶层61和第二胶层并 不妨碍透光抓标对位贴合。
第一开孔611的大小完全覆盖第一对位标212:假设有一个虚拟的平面,该平面例如为第一基板11所在的平面,第一开孔611在该平面的投影可以完全覆盖第一对位标212在该平面的投影。同样,第二开孔的大小完全覆盖第二对位标。优选地,第一开孔611不小于第一基板11上第一通孔111,第二开孔不小于第二基板12上第二通孔。
第一通孔111、第二通孔、以及第一开孔611、第二开孔的制作优选在贴合载体层之前,以防止通孔或者开孔制作时损伤载体层或者金属膜层。
在对位贴合时,第一基板和第二基板一般为大片基板。在对位贴合步骤之后,液晶移相器的制作方法还包括热压成盒、小片裁切、灌液封口、绑定等步骤。需要说明的是,以上所述的第一对位标212、第二对位标、第一通孔111、第二通孔的设置,以及第一开孔611、第二开孔的设置,是为了在液晶移相器的两片基板对位贴合时,方便对位贴合机构分从基板的背面进行透光抓标,以实现第一基板和第二基板的精准对位。
因此第一对位标212、第二对位标、第一通孔111、和第二通孔一般设置在液晶移相器产品的边缘位置,在后续的小片裁切时,第一对位标212、第二对位标、第一通孔111、和第二通孔一般都被裁切掉了。
液晶移相器还包括分别设置在所述液晶层50两侧的第一取向层31和第二取向层32。在形成有图案化金属膜层的第一基板11上制备第一取向层31,在形成有图案化金属膜层的第二基板12上制备第二取向层32。取向层用于对液晶层50的晶分子的初始偏转角度进行限定。
在一个具体的实施例中,图案化的第二金属膜层22上金属图案211包括移相器电极,移相器电极为平面传输线,平面传输线用于传输微波信号。平面传输线优选为微带线。微带线的形状可以为蛇形或者螺旋形,对于微带线的形状不作限定,能够实现微波信号的传输即可。图案化的第一金属膜层21上金属图案211包括接地电极,液晶移相器还包括偏置线。在一个实施例中,偏置线可以设置在第二基板12的第二金属膜层22。通过偏置线在微带线和接地电极之间施加电压,可以改变液晶的有效介电常数,因此改变微波信号的相位。
当微带线和接地电极之间不施加电场时,液晶分子在第一配向层和第二配向层的作用下沿预设方向排布。当微带线和接地电极之间施加电场时,电场驱动液晶层50中的液晶分子方向的偏转。
微波信号在微带线和接地电极之间传输,在微波信号的传输过程中,会由于液晶分子的偏转而改变相位,从而实现微波信号的移相功能。通过控制微带线和接地电极上的电压,可以控制液晶层50中液晶的偏转角度,进而可以对移相过程中所调整的相位进行控制。
利用液晶材料的介电各向特性和低功耗特性,通过控制施加于液晶层50的电压来改变液晶的有效介电常数,进而控制移相过程中所调整的相位。通过特殊设计的静电电容不同的液晶天线单元形成二维图形。从天线接收或发射的电磁波被赋予与各天线单元的静电电容相应的相位差,依据静电电容不同的天线单元形成的二维图形在特定方向上具有强指向性(波束扫描),从而实现天线接收或发射的电磁波和射频信号(电压信号)之间的相互转换功能。
与现有技术相比,本发明具有如下有益效果:
1.在超高频无线通信中,基板材料的介电常数和介电损耗值越大,介质损耗越大,信号越差。本申请使用PCB板材作为液晶移相器的基板,PCB板材的介电常数和介电损耗比液晶面板常用的玻璃基板更低,介质损耗越小,有利于提升液晶天线在超高频段应用的性能。
2.进一步的,PCB板材中为PTFE高频板,PTFE高频板具有更低的介电常数和介电损耗,介质损耗越小,可以进一步提升液晶移相器及液晶天线在超高频段应用的性能。
3.由于PCB板材不透光,不利于使用透光抓标方法对两片基板进行对位贴合,导致无法精确对位,无法满足液晶移相器的设计要求,进而大幅降低液晶天线性能。本申请进一步在第一金属膜层和第二金属膜层上分别设置对位标,并在第一基板和第二基板上分别设置与对位标位置相对应的通孔,改进后可以利用透光抓标对两片进行对位贴合;为了简化流程和工艺,对位标是相应金属膜层通过曝光蚀刻而得到的金属对位标;金属对位标的尺寸小于通孔的尺寸,通过在金属膜层和相应基板之间设置透光的载体层,使曝光蚀刻得到的金属对位标 能够得到支撑,同时透光的载体层不会影响到透光抓标对位贴合。
实施例二:
本具体实施例提供了一种液晶天线,该液晶天线包括实施例一中所述的液晶移相器。液晶天线还包括有天线辐射单元,天线辐射单元用于辐射微波信号,实现微波信号的馈入和馈出。
在本实施例中,在第一基板11远离所述第二基板12的一侧设置有天线辐射单元。天线辐射单元由高导电性材料制成。天线辐射单元可以是矩形、圆形、或方形的贴片,并可以切角,亦可以由贴片工艺贴附在液晶移相器。或者,更优选的方案为,天线辐射单元为设置在第一基板11远离所述第二基板12的一侧的图案化的第三金属膜层。
实施例三:
本具体实施例提供了如实施例一中所述的液晶移相器的制作方法。如图6所示,该液晶移相器的制作方法包括以下步骤:
SI:提供PCB板材的第一基板11,第一基板11上具有第一金属膜层21,
第一金属膜层21上具有第一对位标212,第一基板11上具有第一通孔111,所述第一对位标212的位置与第一通孔111的位置相对应;
S2:提供PCB板材的第二基板12,第二基板12上具有第二金属膜层22,第二金属膜层22上具有第二对位标,第二基板12具有第二通孔,所述第二对位标的位置与第二通孔的位置相对应;
S3:对位贴合机构分别透过第一通孔111和第二通孔,利用第一对位标212和第二对位标,对第一基板11和第二基板12进行对位贴合。
需要说明的是,步骤S1和步骤S2的先后顺序可以进行调整。
具体的,在步骤S3中,利用液晶面板对位贴合常用的CCD透光对位以实施精准贴合:使用CCD镜头,CCD镜头分别透过第一通孔111和第二通孔,利用第一对位标212和第二对位标,对第一基板11和第二基板12进行预先对位,对位后缓慢移动至贴合的状态。
第一对位标212和第二对位标的制作工艺说明:
第一对位标212可以设置在第一金属膜层21靠近第一基板11的一面上,便于透过第一通孔111就可以看到。例如制作过孔用作对位标,或者只做局部透明区域做对位标,或者通过激光制作对位标等方法制成。同样,第二对位标可以设置在第二金属膜层22靠近第二基板12的一面上,便于透过第二通孔就可以看到。
但更加优选的是,为了简化流程和工艺,对位标是相应金属膜层通过曝光蚀刻而得到的金属对位标。具体的,第一对位标212是通过对第一金属膜层21进行曝光蚀刻而得到,第二对位标是通过对第二金属膜层22进行曝光蚀刻而得到,第一对位标212和第二对位标均为金属对位标。
金属对位标的尺寸一般小于通孔的尺寸,以便于透过通孔进行透光抓标。在曝光蚀刻后,金属对位标周边的金属被蚀刻掉,使金属对位标不具有支撑。作为改进的方案,在第一金属膜层21和第一基板11之间具有透光的第一载体层71,在第二金属膜层22和第二基板12之间具有透光的第二载体层。通过在金属膜层和相应基板之间设置透光的载体层,使曝光蚀刻得到的金属对位标能够得到支撑,同时透光的载体层不会影响到透光抓标对位贴合。
第一载体层71和第二载体层可以是PI层、PET层、或者PE层,它们都具有良好的透光的。但更加优选的是,第一载体层71和第二载体层为PI层,PI兼具更好的透光的和耐高温性佳等优点,在后续的定向层制作工艺中能够耐受高温烘烤。
在实际应用中,可以选用覆铜箔PI基材来作为金属膜层和载体层,覆铜箔PI基材即PI基材层上层叠覆有铜箔层,覆铜箔PI基材可以通过胶层与相应基板进行贴附。具体的,在第一载体层71和第一基板11之间具有第一胶层61,在第二载体层和第二基板12之间具有第二胶层。
或者,在其它的实施例中,也可以先将载体层如PI层贴附在基板上,再在载体层上制作或者设置金属膜层。
因此,进一步的,如图7所示,步骤S1的制作方法包括如下步骤:
S11:提供第一基板11,在所述第一基板11上设置第一胶层61,在第一基板11制作第一通孔111,在第一胶层61制作第一开孔611,所述第一通孔111和第一开 孔611的位置相对应;
S12:将第一载体层71贴合在具有第一开孔611的第一胶层61;第一金属膜层21位于第一载体层71背离第一基板11的一面上;
S13:对第一金属膜层21进行图案化处理,得到包括第一对位标212的图案化第一金属膜层21。
需要说明的是,在步骤S11中,第一通孔111和第一开孔611可以同时制作,也可以先后制作。
在步骤S12中,第一金属膜层21和第一载体层71可以作为一个整体,第一载体层71与第一胶层61进行贴合,例如直接采用覆铜箔PI基材,使覆铜箔PI基材与第一胶层61进行贴合。或者还可以先将单独的第一载体层71贴合在具有第一开孔611的第一胶层61后,再在第一载体层71上制作或者设置第一金属膜层21。
同样的,步骤S2的制作方法包括如下步骤:
S21:提供第二基板12,在所述第二基板12上设置第二胶层,在第二基板12制作第二通孔,在第二胶层制作第二开孔,所述第二通孔和第二开孔的位置相对应;
S22:将第二载体层贴合在具有第二开孔的第二胶层;第二金属膜层22位于第二载体层背离第二基板12的一面上;
S23:对第二金属膜层22进行图案化处理,得到包括第二对位标的图案化第二金属膜层22。
需要说明的是,在步骤S21中,第二通孔和第二开孔可以同时制作,也可以先后制作。
在步骤S22中,第二金属膜层22和第二载体层可以作为一个整体,第二载体层与第二胶层进行贴合,例如直接采用覆铜箔PI基材,使覆铜箔PI基材与第二胶层进行贴合。或者还可以先将单独的第二载体层贴合在具有第二开孔的第二胶层后;再在第二载体层上制作或者设置第二金属膜层22。
需要说明的是,在步骤S3对第一基板11和第二基板12进行对位贴合之前,液晶移相器的制作方法还包括对第一金属膜层21和第二金属膜层22的具体图案化处理工艺,以及在对金属膜层进行图案化后,还包括定向层和框胶40制作工艺步 骤。
对金属膜层的图案化处理工艺方法,已为本领域技术人员所已知,可以通过涂胶、预固化、曝光、显影、刻蚀、脱膜的工艺得到。
取向层可采用现有技术中的PI摩擦工艺制成,以便在表面上形成定向凹槽。例如可以利用APR板就预设滴入的定向液体转印至对应的具有金属图案的基板上面,通过高温烘烤使得充分反应,同时将溶剂挥发掉,最后形成固态的定向膜层。在定向膜上用绒布或棉布向一个方向打磨,形成最终将液晶分子按照预设定的摩擦方向平行排列,在此不再赘述。
框胶40制作工艺步骤为本领域技术人员所知晓,在此不再赘述。
在步骤S3之后,液晶移相器的制作方法还包括,热压成盒、小片裁切、灌液封口、绑定等步骤。
在对位贴合时,第一基板11和第二基板12一般为大片基板,在步骤S3对第一基板11和第二基板12进行对位贴合时,采用的是大板制作。在步骤S3对位贴合之后,液晶移相器的制作方法还包括热压成盒、小片裁切、灌液封口、绑定等步骤。
通过热压成盒,将预贴合好的基板用高压高温的工艺进行固化,就会形成一定的盒厚间隔,经充分固化后,最终形成粘接牢固程度高,机械强度高的多个空盒(CELL)。之后再通过小片裁切工艺,可以得到多个单粒的液晶移相器空盒。
需要说明的是,以上所述的第一对位标212、第二对位标、第一通孔111、第二通孔的设置,以及第一开孔611、第二开孔的设置,是为了在液晶移相器的两片基板对位贴合时,方便对位贴合机构分从基板的背面进行透光抓标,以实现第一基板和第二基板的精准对位。
因此第一对位标212、第二对位标、第一通孔111、和第二通孔一般设置在液晶移相器产品的边缘位置,图5所示为大片基板的第一基板11示意图,该大片基板上包括多个独立的单元,第一通孔111位于大片基板边缘位置。图5中仅示意出了具有4个独立的单元,每个单元包括单独的框胶40,但数量并不限于此。在后续的小片裁切时,第一对位标212、第二对位标、第一通孔111、和第二通孔被 裁切掉了,不存在于液晶移相器产品中。
与现有技术相比,本发明具有如下有益效果:
本发明提供了一种利用PCB板材作为基板并结合液晶面板的制作方法来批量制造的液晶移相器的方法,PCB板材的介电常数和介电损耗比液晶面板常用的玻璃基板更低,介质损耗越小,有利于提升液晶移相器在超高频段应用的性能;
本发明还进一步解决了原先不透明PCB板材无法利用液晶面板的透光对位贴合机构对两片基板实施精准贴合的问题,通过在第一金属膜层和第二金属膜层上分别设置对位标,并在第一基板和第二基板上分别设置与对位标位置相对应的通孔,在改进后便可以利用透光抓标对两片进行对位贴合。
为了简化流程和工艺,对位标是相应金属膜层通过曝光蚀刻而得到的金属对位标;金属对位标的尺寸小于通孔的尺寸,通过在金属膜层和相应基板之间设置透光的载体层,使曝光蚀刻得到的金属对位标能够得到支撑,同时透光的载体层不会影响到透光抓标对位贴合。
最后需要说明的是,以上实施例仅用以说明本发明实施例的技术方案而非对其进行限制,尽管参照较佳实施例对本发明实施例进行了详细的说明,本领域的普通技术人员应当理解依然可以对本发明实施例的技术方案进行修改或者等同替换,而这些修改或者等同替换亦不能使修改后的技术方案脱离本发明实施例技术方案的范围。
Claims (16)
- 一种液晶移相器,包括相对设置的第一基板和第二基板以及位于所述第一基板和第二基板之间的液晶层;其特征在于,在第一基板朝向所述第二基板一侧设置有第一金属膜层;在第二基板朝向所述第一基板一侧设置有第二金属膜层,所述第一金属膜层和第二金属膜层均为图案化金属膜层;所述第一基板和第二基板为PCB板材。
- 如权利要求1所述的液晶移相器,其特征在于,所述第一金属膜层和第一基板之间具有透光的第一载体层,所述第二金属膜层和第二基板之间具有透光的第二载体层。
- 如权利要求2所述的液晶移相器,其特征在于,所述第一载体层和第一基板之间具有第一胶层,所述第二载体层和第二基板之间具有第二胶层。
- 如权利要求1所述的液晶移相器,其特征在于,所述PCB板材为PTFE高频板。
- 如权利要求1所述的液晶移相器,其特征在于,所述第一金属膜层和第二金属膜层为铜层。
- 如权利要求5所述的液晶移相器,其特征在于,所述第一金属膜层和第二金属膜层的金属膜层厚度均不小于2.0μm。
- 如权利要求2所述的液晶移相器,其特征在于,所述第一载体层和第二载体层为PI层。
- 如权利要求7所述的液晶移相器,其特征在于,所述第一载体层和第一金属膜层为一体化的覆铜箔PI基材,所述第二载体层和第二金属膜层为一体化的覆铜箔PI基材。
- 一种液晶天线,包括如权利要求1-8中任一项所述的液晶移相器,所述液晶天线还包括天线辐射单元。
- 一种液晶移相器的制作方法,其特征在于,用于制作如权利要求1-8中任一项所述的液晶移相器,所述制作方法包括以下步骤:S1:提供PCB板材的第一基板,第一基板上具有第一金属膜层,第一金属膜层上具有第一对位标,第一基板上具有第一通孔,所述第一对位标的位置与第一通孔的位置相对应;S2:提供PCB板材的第二基板,第二基板上具有第二金属膜层,第二金属膜层上具有第二对位标,第二基板具有第二通孔,所述第二对位标的位置与第二通孔的位置相对应;S3:分别透过第一通孔和第二通孔,利用第一对位标和第二对位标,对第一基板和第二基板进行对位贴合。
- 根据权利要求10所述的液晶移相器的制作方法,其特征在于,在步骤S3中,利用CCD镜头,对第一基板和第二基板进行对位贴合。
- 根据权利要求10所述的液晶移相器的制作方法,其特征在于,所述第一对位标为金属对位标,所述第一对位标是通过对第一金属膜层进行曝光蚀刻而得到;所述第二对位标为金属对位标,所述第二对位标是通过对第二金属膜层进行曝光蚀刻而得到;在所述第一金属膜层和第一基板之间设置高透光的第一载体层,所述第一载体层用作第一对位标的支撑层,在所述第二金属膜层和第二基板之间设置高透光的第二载体层,所述第二载体层用作第二对位标的支撑层。
- 根据权利要求12所述的液晶移相器的制作方法,其特征在于,所述步骤S1的制作方法包括以下步骤:提供第一基板,在所述第一基板上设置第一胶层,在第一基板制作第一通孔,在第一胶层制作第一开孔,所述第一通孔和第一开孔的位置相对应;将第一载体层贴合在具有第一开孔的第一胶层;第一金属膜层位于第一载体层背离第一基板的一面上;对第一金属膜层进行图案化处理,得到包括第一对位标的图案化第一金属膜层;所述步骤S2的制作方法包括以下步骤:提供第二基板,在所述第二基板上设置第二胶层,在第二基板制作第二通孔,在第二胶层制作第二开孔,所述第二通孔和第二开孔的位置相对应;将第二载体层贴合在具有第二开孔的第二胶层;第二金属膜层位于第二载体层背离第二基板的一面上;对第二金属膜层进行图案化处理,得到包括第二对位标的图案化第二金属膜层。
- 根据权利要求13所述的液晶移相器的制作方法,其特征在于,所述第一通孔的大小完全覆盖第一对位标;所述第二通孔的大小完全覆盖第二对位标。
- 根据权利要求10所述的液晶移相器的制作方法,其特征在于,在步骤S3对第一基板和第二基板进行对位贴合时,采用的是大片基板制作;在步骤S3之后,还包括热压成盒步骤以制成多个空盒,之后通过小片裁切工艺得到单粒的如权利要求1所述的液晶移相器空盒。
- 根据权利要求15所述的液晶移相器的制作方法,其特征在于,所述第一对位标、第二对位标、第一通孔、和第二通孔在大板制作时设置在大片基板的边缘位置,在小片裁切时,所述第一对位标、第二对位标、第一通孔、和第二通孔被裁切掉。
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EP3745527A1 (en) | 2020-12-02 |
JP6992184B2 (ja) | 2022-01-13 |
CN110034358A (zh) | 2019-07-19 |
CN110034358B (zh) | 2024-02-23 |
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KR20200117984A (ko) | 2020-10-14 |
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TW202043890A (zh) | 2020-12-01 |
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US11398677B2 (en) | 2022-07-26 |
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