WO2020174674A1 - Method for manufacturing circuit board, circuit board, and method for manufacturing circuit package - Google Patents

Method for manufacturing circuit board, circuit board, and method for manufacturing circuit package Download PDF

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Publication number
WO2020174674A1
WO2020174674A1 PCT/JP2019/007905 JP2019007905W WO2020174674A1 WO 2020174674 A1 WO2020174674 A1 WO 2020174674A1 JP 2019007905 W JP2019007905 W JP 2019007905W WO 2020174674 A1 WO2020174674 A1 WO 2020174674A1
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WIPO (PCT)
Prior art keywords
circuit
circuit board
mold
manufacturing
insulating material
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PCT/JP2019/007905
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French (fr)
Japanese (ja)
Inventor
真司 天沼
戸川　光生
天童　一良
成俊 村杉
Original Assignee
日立化成株式会社
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Priority to PCT/JP2019/007905 priority Critical patent/WO2020174674A1/en
Publication of WO2020174674A1 publication Critical patent/WO2020174674A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present disclosure relates to a method for manufacturing a circuit board, a method for manufacturing a circuit board and a circuit package.
  • a printed circuit board is generally manufactured by attaching a metal foil to the board, etching the metal foil, and processing it into a desired circuit shape.
  • the current capacity of the circuit board can be increased by increasing the cross-sectional area of the circuit (that is, increasing the thickness of the circuit).
  • Patent Document 1 describes a process of manufacturing a circuit by processing a metal plate and disposing the circuit on a metal plate having excellent heat dissipation through an insulating material to manufacture a circuit board.
  • steps such as sealing around the circuit and protecting the end portions of the insulating material, which are necessary for ensuring the insulation reliability of the circuit board.
  • Specific means for providing the above object include the following embodiments.
  • ⁇ 1> A step of pressurizing a laminated body including a metal plate, an insulating material, and a circuit arranged inside the die in this order with the die, and the die with the laminated body being pressed by the die And a step of supplying a sealing material to the mold.
  • ⁇ 2> The method for manufacturing a circuit board according to ⁇ 1>, wherein the sealing material is supplied so as to seal at least the periphery of the circuit and the end portion of the insulating material.
  • the circuit includes a circuit sheet in which the circuit is arranged on a support member and a space between the circuits is filled with a resin, and the metal is arranged so that the circuit faces the insulating material.
  • ⁇ 4> The method for manufacturing a circuit board according to any one of ⁇ 1> to ⁇ 3>, wherein the thickness of the circuit is 350 ⁇ m or more.
  • ⁇ 5> A laminated body including a metal plate, an insulating material, and a circuit in this order, and a sealing portion that seals at least the periphery of the circuit and an end portion of the insulating material, and faces the insulating material of the circuit.
  • a circuit board in which at least a part of the surface opposite to the surface to be exposed is exposed.
  • ⁇ 6> A step of disposing an element on the circuit of the circuit board manufactured by the method of manufacturing a circuit board according to any one of ⁇ 1> to ⁇ 4>, and a sealing material around the element. And a step of sealing with a circuit package.
  • Sealing of the periphery of the element is performed by a method including a step of supplying a sealant for sealing the periphery of the element to the inside of a mold in which the circuit board is arranged, without applying pressure. 6> The method for manufacturing a circuit package described in 6>.
  • sealing the periphery of the element includes a step of depressurizing the inside of the mold after supplying the sealing material to the inside of the mold.
  • a method of manufacturing a circuit board having excellent insulation reliability a circuit board having excellent insulation properties, and a method of manufacturing a circuit package using the circuit board.
  • the present invention is not limited to the following embodiments.
  • the constituent elements including element steps, etc.
  • the term “process” includes not only a process independent of other processes but also the process even if the process is not clearly distinguishable from other processes as long as the purpose of the process is achieved. ..
  • the numerical range indicated by using “to” includes the numerical values before and after “to” as the minimum value and the maximum value, respectively.
  • each component may include a plurality of types of applicable substances.
  • the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition unless otherwise specified. Means quantity.
  • laminate refers to stacking layers, two or more layers may be combined and two or more layers may be removable.
  • a method of manufacturing a circuit board according to the present disclosure includes a step of pressurizing a laminated body including a metal plate, an insulating material and a circuit arranged inside a die in this order with the die, and applying the laminated body with the die. Supplying a sealing material to the mold in a pressed state.
  • the metal plate, the insulating material, and the circuit arranged inside the mold are pressed by the mold to bring the circuit forming the laminated body into close contact with the insulating material.
  • the circuit may be pressed into the insulating material due to pressure, and the insulating material may be deformed (protuberance, depression, etc.), which may cause deterioration of insulation reliability.
  • the encapsulant is supplied in a state where the laminate is pressed by the mold.
  • the step of attaching the insulating material and the metal plate to the circuit and the step of sealing the periphery of the circuit with the sealing material are collectively performed inside the mold. Therefore, compared with the method of manufacturing the circuit board by sealing the periphery of the circuit with the sealing material and then attaching the insulating material and the metal plate to the circuit, the manufacturing process of the circuit board is reduced, and the production efficiency is improved. Can be expected.
  • the type of mold used in the method of the present disclosure is not particularly limited.
  • a transfer molding die, a compression molding die, an injection molding die, or the like can be used.
  • FIG. 1 is a cross-sectional view schematically showing a laminated body including a metal plate, an insulating material, and a circuit in this order
  • FIG. 2 is a sectional view of the laminated body arranged inside the mold under pressure. It is sectional drawing which shows the state which is supplying the sealing material schematically.
  • the laminated body 10 shown in FIG. 1 includes a metal plate 1, an insulating material 2, and a circuit 3 in this order.
  • the voids between the circuits 3 are filled with the resin 4, but the voids may not be filled with the resin 4.
  • the sealing material supplied to the mold may be filled in the voids between the circuits 3.
  • the laminated body 10 is pressed by using the clamp pressure of the mold composed of the upper mold A and the lower mold B.
  • the height d of the inside (cavity) in a state where the upper die A and the lower die B are closed is set to be shorter than the dimension of the laminated body 10 in the laminating direction when pressure is not applied. In this state, by closing the upper mold A and the lower mold B, pressure is applied in the stacking direction of the stacked body 10.
  • the mold is composed of the upper mold A and the lower mold B, but other structures may be used as long as pressure can be applied in the stacking direction of the stacked body 10. Further, in the configuration shown in FIG. 2, the laminated body 10 is directly pressed by the upper mold A and the lower mold B, but another member may be arranged between them to pressurize.
  • the entire upper surface of the laminated body 10 is pressed by the upper mold A, but only a part of the upper surface of the laminated body 10 may be pressed by the upper mold A.
  • the upper die A having a shape in which a space is provided between the laminated body 10 and only the periphery of the upper surface of the laminated body 10 is pressed and the inner side is not pressed may be used.
  • the sealing material 5 is supplied to the mold from the direction indicated by the arrow while the laminated body 10 is being pressed.
  • the supply of the sealing material 5 is performed, for example, by injecting the heating and melting sealing material into the mold using a plunger (not shown) connected to the mold.
  • FIG. 3 is a cross-sectional view schematically showing a configuration of a circuit board obtained by heating and curing the sealing material 5 after supplying the sealing material 5 into the mold shown in FIG.
  • a circuit board 20 shown in FIG. 3 includes a metal plate 1, an insulating material 2, a circuit 3, and a resin 4 filling a space between the circuits 3, and the periphery of the circuit 3 (excluding a mounting surface of an element).
  • the end portion of the insulating material 2 is sealed with the sealing portion 6 which is a cured product of the sealing material 5.
  • the sealing material 5 may be supplied so as to seal the periphery of the circuit 3 and the end of the insulating material 2. preferable.
  • FIG. 4 is a cross-sectional view schematically showing the configuration of a circuit board, which is an embodiment of the circuit board and uses a metal plate having irregularities on the surface.
  • the circuit board 20 shown in FIG. 4 is provided with a groove in a portion of the metal plate 1 corresponding to the periphery of the circuit 3.
  • the sealing portion 6 that seals the periphery of the circuit 3 enters into the groove of the metal plate 1, so that the intrusion of water and the peeling of the edge portion of the insulating material are suppressed, and the insulation reliability is improved. And further improvement in heat dissipation can be expected.
  • undulations are provided on the surface of the metal plate 1 opposite to the surface on which the circuit is arranged. As a result, the surface area of the metal plate 1 is increased, and further improvement in cooling performance can be expected.
  • FIG. 5 is a sectional view schematically showing an example of a circuit package manufactured using the circuit board shown in FIG.
  • the circuit package 30 shown in FIG. 5 includes the element 7 arranged on the circuit 3 of the circuit board 20 shown in FIG. 3 and the sealing portion 8 arranged around the element 7.
  • the circuit package shown in FIG. 5 may further include bonding wires, lead frames, etc. (not shown). Further, the dimensions of the sealing portion 6 that seals the periphery of the circuit 3 and the end of the insulating material 2 and the sealing portion 8 that seals the periphery of the element 7 may be the same as shown in FIG. It may be different.
  • the circuit 3 may be arranged on the insulating material 1 by using a circuit sheet 40 as shown in FIG.
  • the circuit sheet 40 includes the support member 9 and the circuit 3 arranged on the support member 9.
  • the circuit 3 of the circuit sheet 40 is placed in a mold so as to face the insulating material 2 to form a laminated body, and a gap between the circuits 3 is provided by a sealing material supplied while the laminated body is pressurized.
  • the step of filling the voids between the circuits 3 with the resin 4 primary molding
  • the support member 9 may be removed before the circuit package is manufactured using the circuit board.
  • circuit The material of the circuit used in the above method is not particularly limited. Specific examples thereof include copper, silver, chromium copper, tungsten copper, nickel, nickel-plated copper, and aluminum (including alumite-treated aluminum). From the viewpoint of conductivity, it is preferable to contain copper.
  • the thickness of the circuit is not particularly limited, and can be selected according to the application of the circuit board and circuit package. From the viewpoint of increasing the current of the circuit board and the circuit package, the thickness of the circuit is preferably 350 ⁇ m or more, more preferably 400 ⁇ m or more, further preferably 500 ⁇ m or more, more preferably 1000 ⁇ m or more. Is particularly preferable. From the viewpoint of reducing the thickness of the circuit board and the circuit package, the thickness of the circuit may be 5000 ⁇ m or less. When the thickness varies depending on the location of the circuit, the above-mentioned value may be the arithmetic average value of the measurement values obtained at five arbitrarily selected locations.
  • the thickness of the circuit may or may not be constant. When the thickness of the circuit is not constant, the thickness of the circuit means the thickness of the portion where the device is mounted. Further, when a part of the circuit is embedded in the insulating material, the thickness of the embedded part is also included in the thickness of the circuit.
  • the width and length of the circuit on the circuit board and the circuit package are not particularly limited, and may be selected according to the application of the circuit board and the circuit package.
  • the width and length of the circuit may be 350 ⁇ m to 70000 ⁇ m, respectively.
  • the above-mentioned value may be the arithmetic average value of the measurement values obtained at five arbitrarily selected locations.
  • a circuit can be obtained, for example, by processing a metal plate into a desired shape.
  • the processing method is not particularly limited, and it can be performed by a known method such as punching or cutting.
  • the gap between the circuits may be filled with resin to insulate the circuits.
  • the resin include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin and acrylic resin, and curable resin is preferable.
  • the resin used for filling may be one kind or two or more kinds.
  • the insulating material is disposed between the circuit and the metal plate and serves to electrically insulate the circuit and the metal plate.
  • the material of the insulating material is not particularly limited.
  • it may contain a resin.
  • the resin include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin and acrylic resin, and curable resin is preferable.
  • the resin contained in the insulating material may be one kind or two or more kinds.
  • the insulating material preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, and urethane resin, and contains epoxy resin. More preferable.
  • the insulating material may contain components other than resin from the viewpoint of improving thermal conductivity.
  • components other than the resin include inorganic fillers.
  • the inorganic filler may be powdery or fibrous.
  • the thickness of the insulating material is not particularly limited and may be selected according to the application of the circuit board. From the viewpoint of ensuring sufficient insulation, the thicker the insulating material, the better.
  • the thickness of the insulating material is preferably 60 ⁇ m or more, more preferably 90 ⁇ m or more, and further preferably 120 ⁇ m or more.
  • the thickness of the insulating material is preferably 230 ⁇ m or less, more preferably 210 ⁇ m or less, and further preferably 190 ⁇ m or less.
  • the area of the insulating layer (the area when the laminate is observed from the stacking direction) is not particularly limited as long as the circuit and the metal plate can be electrically insulated. From the viewpoint of ensuring good insulation, the area of the insulating layer (the area when the stacked body is observed from the stacking direction) is preferably the same as or larger than the circuit, and is preferably larger than the circuit. More preferable.
  • the metal plate plays a role of dissipating heat generated in the circuit to the outside.
  • the material of the metal plate is not particularly limited.
  • copper, silver, chrome copper, tungsten copper, nickel, nickel-plated copper, aluminum (including alumite-treated aluminum) and the like can be mentioned. From the viewpoint of heat dissipation, copper and aluminum are preferable.
  • the thickness of the metal plate is not particularly limited, and may be, for example, 300 ⁇ m to 100000 ⁇ m. When the thickness differs depending on the location of the metal plate, the arithmetic mean value of the measurement values obtained at five arbitrarily selected locations may be used as the above value.
  • the shape of the metal plate is not particularly limited.
  • the surface may or may not have irregularities.
  • the metal plate having irregularities on its surface include a metal plate having a groove in a portion corresponding to the periphery of the circuit, a metal plate having an undulation on the side opposite to the side where the circuit is arranged, and the like.
  • the surface area of the metal plate is increased, and further improvement in cooling performance can be expected.
  • the metal plate may have unevenness on only one surface or may have unevenness on both surfaces.
  • the encapsulant plays a role of improving insulation reliability of the circuit board and the circuit package and protecting the circuit board and the circuit package from moisture and the like.
  • the material of the sealing material is not particularly limited as long as it can be used for transfer molding. Examples thereof include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, and acrylic resin, and curable resin is preferable.
  • the resin contained in the encapsulant may be one type or two or more types.
  • the encapsulant preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, and urethane resin, and more preferably contains epoxy resin.
  • the encapsulant may contain components other than resin from the viewpoint of improving thermal conductivity.
  • components other than the resin include inorganic fillers.
  • the inorganic filler may be powdery or fibrous.
  • the sealing material before curing has a fluidity of 5 cm or more, preferably 10 cm or more, in a spiral flow test according to JIS K 7154-1:2002. Is preferred. From the viewpoint of suppressing the generation of unfilled portions and the entrapment of voids, the fluidity is preferably 200 cm or less, and more preferably 100 cm or less.
  • the glass transition temperature of the cured encapsulant is preferably 50° C. or higher, and more preferably 100° C. or higher. From the viewpoint of adhesion reliability, the glass transition temperature of the cured encapsulant is preferably 450° C. or lower, and more preferably 300° C. or lower. In the present disclosure, the glass transition temperature of the encapsulant after curing is a value measured by a thermomechanical analysis method according to JIS K7197:1991.
  • the coefficient of linear expansion (CTE) of the cured sealing material is preferably selected in consideration of the adhesiveness between the sealing material and the adjacent member.
  • the linear expansion coefficient of the cured sealing material is preferably selected to be a value close to the linear expansion coefficient of the adjacent member. For example, it is preferably 5 ppm to 50 ppm, more preferably 5 ppm to 30 ppm or less.
  • the linear expansion coefficient of the cured encapsulant is a value measured by a thermal linear expansion coefficient test according to JIS K 7197:2012.
  • the circuit board of the present disclosure includes a laminated body including a metal plate, an insulating material, and a circuit in this order, and a sealing portion that seals at least the periphery of the circuit and an end portion of the insulating material.
  • circuit board having the above configuration since the periphery of the circuit and the end of the insulating material are sealed by the sealing portion, the occurrence of moisture intrusion and peeling at the end of the insulating material is suppressed, and insulation reliability is improved. Excellent heat dissipation and heat dissipation.
  • the circuit board having the above configuration can be manufactured by, for example, the method for manufacturing a circuit board described above.
  • the details and preferable aspects of the circuit board are the same as the details and preferable aspects of the circuit board manufactured by the method for manufacturing the circuit board described above.
  • the circuit board having the above structure at least a part of the surface of the circuit opposite to the surface facing the insulating material is exposed.
  • “exposed” means a state in which the relevant portion of the circuit is not sealed with a sealing material (that is, not in a circuit package state).
  • a circuit package is manufactured by disposing an element in an exposed portion of the circuit and sealing the element with a sealing material.
  • the circuit package can be manufactured by, for example, the method described in the circuit package manufacturing method described later.
  • the circuit package manufacturing method includes a step of disposing an element on the circuit of the circuit board manufactured by the circuit board manufacturing method described above, and sealing the periphery of the element with a sealing material. And a process.
  • the method of sealing the periphery of the element arranged on the circuit with a sealing material is not particularly limited.
  • methods for using a solid encapsulating material such as powder include casting method, extrusion molding method, compression molding method, transfer molding method, and insert molding method.
  • methods of using the liquid sealing material include a casting method, a coating method, a printing method and an embedding method.
  • the sealing of the periphery of the element is performed by a method including a step of supplying the sealing material to the inside of the mold in which the circuit board is arranged without applying pressure.
  • a method including a step of supplying the sealing material to the inside of the mold in which the circuit board is arranged without applying pressure.
  • the sealing step can be performed with simple equipment.
  • the generation of voids in the encapsulant can be suppressed more effectively, which is excellent in reliability.
  • the non-pressurizing molding method can be used even when the encapsulant is supplied to the inside of the mold and then pressure is applied. Shall be included.
  • the method of supplying the sealing material to the inside of the mold without applying pressure is not particularly limited. For example, it may be performed by supplying a sealing material to the inside of the unsealed mold.
  • the sealing material supplied to the inside of the mold may be solid or liquid.
  • the method for carrying out the pressurizing step is not particularly limited. For example, it may be a method of opening the opening of a mold whose inside is depressurized to atmospheric pressure.
  • the depressurizing step is preferably performed before the step (melting step) of melting the sealing material supplied into the mold, and the pressurizing step is performed after the melting step. It is preferable to carry out.
  • the material of the encapsulant is not particularly limited and can be selected according to the desired characteristics, molding method, etc. Examples thereof include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, and acrylic resin, and curable resin is preferable.
  • the resin contained in the encapsulant may be one type or two or more types.
  • the encapsulant preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, and urethane resin, and contains epoxy resin. Is more preferable.
  • the encapsulant may contain components other than resin from the viewpoint of improving thermal conductivity.
  • components other than the resin include inorganic fillers.
  • the inorganic filler may be powdery or fibrous.
  • the encapsulant may have the same physical properties as the encapsulant used in the method of manufacturing the circuit board.
  • a laminate including a metal plate, an insulating material, and a circuit arranged inside a mold in this order, and an element arranged on the circuit is formed in the mold.
  • a method of manufacturing a circuit package comprising: a step of applying pressure; and a step of supplying a sealing material to the mold in a state where the laminate is pressed by the mold.
  • the sealing of the periphery of the circuit forming the laminated body and the end of the insulating material and the sealing of the periphery of the element arranged on the circuit are collectively performed. Do it. Therefore, the productivity of the circuit package is superior to that of the method of the first embodiment.
  • each material used in the above-described method for manufacturing a circuit board can be used, and also refer to preferred embodiments thereof. You can

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

This method for manufacturing a circuit board comprises: a step for pressurizing using a mold a laminate that includes a metal plate, an insulating material, and a circuit placed inside the mold in this order; and a step for supplying a sealing material to the mold in a state with the laminate pressurized by the mold.

Description

回路基板の製造方法、回路基板及び回路パッケージの製造方法Method of manufacturing circuit board, method of manufacturing circuit board and circuit package
　本開示は、回路基板の製造方法、回路基板及び回路パッケージの製造方法に関する。 The present disclosure relates to a method for manufacturing a circuit board, a method for manufacturing a circuit board and a circuit package.
　電子機器の小型化及び高機能化の進展に伴い、電子部品を基板上に高密度実装することが可能な回路基板としてプリント基板が広く用いられている。プリント基板は一般に、基板に金属箔を貼り付け、これをエッチングして所望の回路形状に加工することで製造されている。 With the progress of miniaturization and higher functionality of electronic devices, printed circuit boards are widely used as circuit boards that enable high-density mounting of electronic components on the board. A printed circuit board is generally manufactured by attaching a metal foil to the board, etching the metal foil, and processing it into a desired circuit shape.
　一方、電子機器の使用環境の多様化に伴い、回路基板の電流容量の増大（大電流化）が求められている。回路基板の電流容量は、回路の断面積を大きくする（すなわち、回路の厚みを厚くする）ことで増大させることができる。 On the other hand, with the diversification of the usage environment of electronic devices, it is required to increase the current capacity of circuit boards (higher current). The current capacity of the circuit board can be increased by increasing the cross-sectional area of the circuit (that is, increasing the thickness of the circuit).
　大電流化に対応した回路基板を製造する方法として、金属箔をエッチングする方法に代えて、金属板の打ち抜き加工等により形成した回路を用いる方法が提案されている（例えば、特許文献１参照）。 As a method of manufacturing a circuit board compatible with a large current, a method of using a circuit formed by punching a metal plate instead of a method of etching a metal foil has been proposed (for example, see Patent Document 1). ..
特開平２－１３７３９２号公報JP-A-2-137392
　特許文献１には、金属板を加工して回路を作製し、この回路を、絶縁材を介して放熱性に優れる金属板の上に配置して回路基板を製造する工程が記載されている。しかしながら、回路基板の絶縁信頼性の確保のために必要となる回路の周囲の封止、絶縁材の端部の保護等の工程については具体的な記載はない。 Patent Document 1 describes a process of manufacturing a circuit by processing a metal plate and disposing the circuit on a metal plate having excellent heat dissipation through an insulating material to manufacture a circuit board. However, there is no specific description about steps such as sealing around the circuit and protecting the end portions of the insulating material, which are necessary for ensuring the insulation reliability of the circuit board.
　上記事情に鑑み、本開示の一態様は、絶縁信頼性に優れる回路基板の製造方法、絶縁性に優れる回路基板、及びこの回路基板を用いる回路パッケージの製造方法を提供することを課題とする。 In view of the above circumstances, it is an object of one embodiment of the present disclosure to provide a method of manufacturing a circuit board having excellent insulation reliability, a circuit board having excellent insulation properties, and a method of manufacturing a circuit package using the circuit board.
　上記課題を提供するための具体的な手段には、以下の実施態様が含まれる。
＜１＞　金型の内部に配置された金属板、絶縁材及び回路をこの順に含む積層体を前記金型で加圧する工程と、前記金型で前記積層体が加圧された状態で前記金型に封止材を供給する工程と、を備える回路基板の製造方法。
＜２＞　前記封止材は、前記回路の周囲及び前記絶縁材の端部を少なくとも封止するように供給される、＜１＞に記載の回路基板の製造方法。
＜３＞　前記回路は、支持部材上に前記回路が配置され、前記回路の間の空隙が樹脂で充填された状態の回路シートを用いて、前記回路が前記絶縁材に対向するように前記金型内に配置される、＜１＞又は＜２＞に記載の回路基板の製造方法。
＜４＞　前記回路の厚さは３５０μｍ以上である、＜１＞～＜３＞のいずれか１項に記載の回路基板の製造方法。
＜５＞　金属板、絶縁材及び回路をこの順に含む積層体と、前記回路の周囲及び前記絶縁材の端部を少なくとも封止する封止部と、を備え、前記回路の前記絶縁材に対向する面と逆側の面の少なくとも一部が露出している、回路基板。
＜６＞　＜１＞～＜４＞のいずれか１項に記載の回路基板の製造方法により製造される回路基板の前記回路の上に素子を配置する工程と、前記素子の周囲を封止材で封止する工程と、を備える回路パッケージの製造方法。
＜７＞　前記素子の周囲の封止は、前記回路基板を配置した型の内部に前記素子の周囲を封止するための封止材を非加圧で供給する工程を含む方法によって行う、＜６＞に記載の回路パッケージの製造方法。
＜８＞　前記素子の周囲の封止は、前記封止材を前記型の内部に供給した後、前記型の内部を減圧する工程を含む、＜７＞に記載の回路パッケージの製造方法。
＜９＞　金型の内部に配置された金属板、絶縁材及び回路をこの順に含み、かつ前記回路の上に素子が配置された積層体を前記金型で加圧する工程と、前記金型で前記積層体が加圧された状態で前記金型に封止材を供給する工程と、を備える回路パッケージの製造方法。 Specific means for providing the above object include the following embodiments.
<1> A step of pressurizing a laminated body including a metal plate, an insulating material, and a circuit arranged inside the die in this order with the die, and the die with the laminated body being pressed by the die And a step of supplying a sealing material to the mold.
<2> The method for manufacturing a circuit board according to <1>, wherein the sealing material is supplied so as to seal at least the periphery of the circuit and the end portion of the insulating material.
<3> The circuit includes a circuit sheet in which the circuit is arranged on a support member and a space between the circuits is filled with a resin, and the metal is arranged so that the circuit faces the insulating material. The method for manufacturing a circuit board according to <1> or <2>, which is arranged in a mold.
<4> The method for manufacturing a circuit board according to any one of <1> to <3>, wherein the thickness of the circuit is 350 μm or more.
<5> A laminated body including a metal plate, an insulating material, and a circuit in this order, and a sealing portion that seals at least the periphery of the circuit and an end portion of the insulating material, and faces the insulating material of the circuit. A circuit board in which at least a part of the surface opposite to the surface to be exposed is exposed.
<6> A step of disposing an element on the circuit of the circuit board manufactured by the method of manufacturing a circuit board according to any one of <1> to <4>, and a sealing material around the element. And a step of sealing with a circuit package.
<7> Sealing of the periphery of the element is performed by a method including a step of supplying a sealant for sealing the periphery of the element to the inside of a mold in which the circuit board is arranged, without applying pressure. 6> The method for manufacturing a circuit package described in 6>.
<8> The method of manufacturing a circuit package according to <7>, wherein sealing the periphery of the element includes a step of depressurizing the inside of the mold after supplying the sealing material to the inside of the mold.
<9> A step of pressurizing, with the mold, a laminated body that includes a metal plate, an insulating material, and a circuit arranged inside the mold in this order, and an element is arranged on the circuit. A step of supplying a sealing material to the mold in a state where the laminated body is pressed, and a method for manufacturing a circuit package.
　本開示の一態様によれば、絶縁信頼性に優れる回路基板の製造方法、絶縁性に優れる回路基板、及びこの回路基板を用いる回路パッケージの製造方法を提供が提供される。 According to one aspect of the present disclosure, there are provided a method of manufacturing a circuit board having excellent insulation reliability, a circuit board having excellent insulation properties, and a method of manufacturing a circuit package using the circuit board.
回路基板の製造方法で使用する積層体の構成を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the laminated body used with the manufacturing method of a circuit board. 金型に配置した積層体を加圧した状態で、金型に封止材を供給している状態を概略的に示す断面図である。It is sectional drawing which shows schematically the state which is supplying the sealing material to a metal mold in the state which pressed the laminated body arrange|positioned at the metal mold. 回路基板の製造方法で製造される回路基板の構成を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the circuit board manufactured with the manufacturing method of a circuit board. 表面に凹凸を有する金属板を用いた回路基板の構成を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the circuit board using the metal plate which has unevenness on the surface. 回路基板を用いて製造される回路パッケージの構成を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the circuit package manufactured using a circuit board. 回路基板の製造方法で使用する回路シートの構成を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the circuit sheet used in the manufacturing method of a circuit board.
　以下、本発明を実施するための形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。
　以下の実施形態において、その構成要素（要素ステップ等も含む）は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明を制限するものではない。
　本開示において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
　本開示において「～」を用いて示された数値範囲には、「～」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
　本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
　本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
　本開示において「積層」との語は、層を積み重ねることを示し、二以上の層が結合されていてもよく、二以上の層が着脱可能であってもよい。 Hereinafter, modes for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments.
In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless otherwise specified. The same applies to the numerical values and the range thereof, and does not limit the present invention.
In the present disclosure, the term “process” includes not only a process independent of other processes but also the process even if the process is not clearly distinguishable from other processes as long as the purpose of the process is achieved. ..
In the present disclosure, the numerical range indicated by using “to” includes the numerical values before and after “to” as the minimum value and the maximum value, respectively.
In the numerical ranges described stepwise in the present disclosure, the upper limit or the lower limit described in one numerical range may be replaced with the upper limit or the lower limit of the numerical range described in other stages. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may include a plurality of types of applicable substances. When multiple types of substances corresponding to each component are present in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, the term “laminate” refers to stacking layers, two or more layers may be combined and two or more layers may be removable.
＜回路基板の製造方法＞
　本開示の回路基板の製造方法は、金型の内部に配置された金属板、絶縁材及び回路をこの順に含む積層体を前記金型で加圧する工程と、前記金型で前記積層体が加圧された状態で前記金型に封止材を供給する工程と、を備える。 <Circuit board manufacturing method>
A method of manufacturing a circuit board according to the present disclosure includes a step of pressurizing a laminated body including a metal plate, an insulating material and a circuit arranged inside a die in this order with the die, and applying the laminated body with the die. Supplying a sealing material to the mold in a pressed state.
　上記方法では、金型の内部に配置された金属板、絶縁材、及び回路を金型で加圧することで、積層体を構成する回路と絶縁材とを密着させる。このとき、回路が絶縁材と接する部分では、加圧により回路が絶縁材に押し込まれて絶縁材の変形（***、陥没等）が発生し、絶縁信頼性を損なう原因となるおそれがある。上記方法では、金型で積層体が加圧された状態で封止材を供給する。このとき、回路が絶縁材と接する部分にも封止材が供給されるため、回路が押し込まれて生じた絶縁材の変形が封止材に押されてもとの状態に戻ったり、絶縁材の変形により生じた凹凸に封止材が入り込んだりする結果、絶縁信頼性に優れる回路基板が得られると考えられる。 In the above method, the metal plate, the insulating material, and the circuit arranged inside the mold are pressed by the mold to bring the circuit forming the laminated body into close contact with the insulating material. At this time, in the portion where the circuit is in contact with the insulating material, the circuit may be pressed into the insulating material due to pressure, and the insulating material may be deformed (protuberance, depression, etc.), which may cause deterioration of insulation reliability. In the above method, the encapsulant is supplied in a state where the laminate is pressed by the mold. At this time, since the sealing material is also supplied to the portion where the circuit is in contact with the insulating material, the deformation of the insulating material caused by the pressing of the circuit returns to the original state when the sealing material presses the insulating material. It is considered that as a result of the sealing material entering the irregularities caused by the deformation of the circuit board, a circuit board having excellent insulation reliability can be obtained.
　さらに上記方法では、回路に絶縁材及び金属板を貼り付ける工程と、回路の周囲を封止材で封止する工程とを、金型の内部で一括して行う。このため、回路の周囲を封止材で封止した後に絶縁材及び金属板を回路に貼り付けて回路基板を作製する方法に比べて回路基板の製造工程が低減し、生産効率が向上する効果が期待できる。 Furthermore, in the above method, the step of attaching the insulating material and the metal plate to the circuit and the step of sealing the periphery of the circuit with the sealing material are collectively performed inside the mold. Therefore, compared with the method of manufacturing the circuit board by sealing the periphery of the circuit with the sealing material and then attaching the insulating material and the metal plate to the circuit, the manufacturing process of the circuit board is reduced, and the production efficiency is improved. Can be expected.
　本開示の方法で使用する金型の種類は、特に制限されない。例えば、トランスファー成形用の金型、圧縮成形用の金型、射出成形用の金型等を使用することができる。 The type of mold used in the method of the present disclosure is not particularly limited. For example, a transfer molding die, a compression molding die, an injection molding die, or the like can be used.
　以下、図面を参照しながら本開示の方法を説明する。図面に示す構成は例示にすぎず、本開示の構成はこれに限定されるものではない。また、各図における部材の大きさは概念的なものであり、部材間の大きさの相対的な関係はこれに限定されない。 Hereinafter, the method of the present disclosure will be described with reference to the drawings. The configurations illustrated in the drawings are merely examples, and the configurations of the present disclosure are not limited thereto. Further, the size of the members in each drawing is conceptual, and the relative size relationship between the members is not limited to this.
　図１は金属板、絶縁材、及び回路をこの順に含む積層体を概略的に示す断面図であり、図２は金型の内部に配置された積層体が加圧された状態で金型に封止材を供給している状態を概略的に示す断面図である。 FIG. 1 is a cross-sectional view schematically showing a laminated body including a metal plate, an insulating material, and a circuit in this order, and FIG. 2 is a sectional view of the laminated body arranged inside the mold under pressure. It is sectional drawing which shows the state which is supplying the sealing material schematically.
　図１に示す積層体１０は、金属板１と、絶縁材２と、回路３と、をこの順に含む。図１に示す積層体１０は、回路３の間の空隙が樹脂４で充填されているが、樹脂４で充填されていなくてもよい。回路３の間の空隙が樹脂４で充填されていない場合、金型に供給される封止材を回路３の間の空隙に充填してもよい。 The laminated body 10 shown in FIG. 1 includes a metal plate 1, an insulating material 2, and a circuit 3 in this order. In the laminated body 10 shown in FIG. 1, the voids between the circuits 3 are filled with the resin 4, but the voids may not be filled with the resin 4. When the voids between the circuits 3 are not filled with the resin 4, the sealing material supplied to the mold may be filled in the voids between the circuits 3.
　積層体１０は、図２に示すように、上金型Ａと下金型Ｂとから構成される金型のクランプ圧を利用して加圧される。図２に示す構成では、上金型Ａと下金型Ｂが閉じた状態での内部（キャビティ）の高さｄを加圧していないときの積層体１０の積層方向の寸法よりも短く設定した状態で、上金型Ａと下金型Ｂとを閉じることで、積層体１０の積層方向に圧力が付与される。 As shown in FIG. 2, the laminated body 10 is pressed by using the clamp pressure of the mold composed of the upper mold A and the lower mold B. In the configuration shown in FIG. 2, the height d of the inside (cavity) in a state where the upper die A and the lower die B are closed is set to be shorter than the dimension of the laminated body 10 in the laminating direction when pressure is not applied. In this state, by closing the upper mold A and the lower mold B, pressure is applied in the stacking direction of the stacked body 10.
　図２に示す構成では、金型は上金型Ａと下金型Ｂとから構成されているが、積層体１０の積層方向に圧力を付与できるのであればその他の構成であってもよい。また、図２に示す構成では、上金型Ａと下金型Ｂとで積層体１０を直接加圧しているが、別の部材を間に配置して加圧してもよい。 In the configuration shown in FIG. 2, the mold is composed of the upper mold A and the lower mold B, but other structures may be used as long as pressure can be applied in the stacking direction of the stacked body 10. Further, in the configuration shown in FIG. 2, the laminated body 10 is directly pressed by the upper mold A and the lower mold B, but another member may be arranged between them to pressurize.
　図２に示す構成では、積層体１０の上面の全体が上金型Ａで加圧されているが、積層体１０の上面の一部のみが上金型Ａで加圧されてもよい。例えば、積層体１０の上面の周囲のみが加圧され、内側は加圧されないように積層体１０との間に空間が設けられた形状の上金型Ａを用いてもよい。 In the configuration shown in FIG. 2, the entire upper surface of the laminated body 10 is pressed by the upper mold A, but only a part of the upper surface of the laminated body 10 may be pressed by the upper mold A. For example, the upper die A having a shape in which a space is provided between the laminated body 10 and only the periphery of the upper surface of the laminated body 10 is pressed and the inner side is not pressed may be used.
　図２に示す構成では、積層体１０が加圧された状態で金型に封止材５を矢印で示す方向から供給する。封止材５の供給は、例えば、金型に接続されたプランジャー（図示せず）を用いて加熱溶融した封止材を金型の内部に注入することで行われる。 In the configuration shown in FIG. 2, the sealing material 5 is supplied to the mold from the direction indicated by the arrow while the laminated body 10 is being pressed. The supply of the sealing material 5 is performed, for example, by injecting the heating and melting sealing material into the mold using a plunger (not shown) connected to the mold.
　図３は、図２に示す金型の内部に封止材５を供給した後、封止材５を加熱硬化して得られる回路基板の構成を概略的に示す断面図である。図３に示す回路基板２０は、金属板１と、絶縁材２と、回路３と、回路３の間の空隙を充填する樹脂４とを含み、回路３の周囲（素子の搭載面を除く）と絶縁材２の端部が封止材５の硬化物である封止部６で封止されている。絶縁材２の端部における水分の侵入、剥離等の発生を抑制する観点からは、封止材５の供給は、回路３の周囲及び絶縁材２の端部を封止するように行うことが好ましい。 FIG. 3 is a cross-sectional view schematically showing a configuration of a circuit board obtained by heating and curing the sealing material 5 after supplying the sealing material 5 into the mold shown in FIG. A circuit board 20 shown in FIG. 3 includes a metal plate 1, an insulating material 2, a circuit 3, and a resin 4 filling a space between the circuits 3, and the periphery of the circuit 3 (excluding a mounting surface of an element). The end portion of the insulating material 2 is sealed with the sealing portion 6 which is a cured product of the sealing material 5. From the viewpoint of suppressing the occurrence of moisture intrusion, peeling, and the like at the end of the insulating material 2, the sealing material 5 may be supplied so as to seal the periphery of the circuit 3 and the end of the insulating material 2. preferable.
　図４は、回路基板の一実施態様であり、表面に凹凸を有する金属板を用いた回路基板の構成を概略的に示す断面図である。図４に示す回路基板２０は、金属板１の回路３の周囲に相当する部分に溝が設けられている。これにより、回路３の周囲を封止する封止部６が金属板１の溝にも入り込んだ状態になり、絶縁材の端部における水分の侵入、剥離等の発生が抑制され、絶縁信頼性及び放熱性にさらなる向上が期待できる。また、金属板１の回路が配置される面と逆側の面に起伏が設けられている。これにより、金属板１の表面積が増大して冷却性能のさらなる向上が期待できる。 FIG. 4 is a cross-sectional view schematically showing the configuration of a circuit board, which is an embodiment of the circuit board and uses a metal plate having irregularities on the surface. The circuit board 20 shown in FIG. 4 is provided with a groove in a portion of the metal plate 1 corresponding to the periphery of the circuit 3. As a result, the sealing portion 6 that seals the periphery of the circuit 3 enters into the groove of the metal plate 1, so that the intrusion of water and the peeling of the edge portion of the insulating material are suppressed, and the insulation reliability is improved. And further improvement in heat dissipation can be expected. Further, undulations are provided on the surface of the metal plate 1 opposite to the surface on which the circuit is arranged. As a result, the surface area of the metal plate 1 is increased, and further improvement in cooling performance can be expected.
　図５は、図３に示す回路基板を用いて製造される回路パッケージの一例を概略的に示す断面図である。図５に示す回路パッケージ３０は、図３に示す回路基板２０の回路３の上に配置された素子７と、素子７の周囲に配置される封止部８と、を備えている。図５に示す回路パッケージは、ボンディングワイヤ、リードフレーム等（図示せず）をさらに備えてもよい。また、回路３の周囲と絶縁材２の端部を封止する封止部６と、素子７の周囲を封止する封止部８の寸法は、図５に示すように等しくてもよく、異なっていてもよい。 FIG. 5 is a sectional view schematically showing an example of a circuit package manufactured using the circuit board shown in FIG. The circuit package 30 shown in FIG. 5 includes the element 7 arranged on the circuit 3 of the circuit board 20 shown in FIG. 3 and the sealing portion 8 arranged around the element 7. The circuit package shown in FIG. 5 may further include bonding wires, lead frames, etc. (not shown). Further, the dimensions of the sealing portion 6 that seals the periphery of the circuit 3 and the end of the insulating material 2 and the sealing portion 8 that seals the periphery of the element 7 may be the same as shown in FIG. It may be different.
　本開示の方法において、絶縁材１上への回路３の配置は、図６に示すような回路シート４０を用いて行ってもよい。回路シート４０は、支持部材９と、支持部材９の上に配置される回路３と、を備える。回路シート４０の回路３が絶縁材２に対向するように金型内に配置して積層体の状態にし、積層体が加圧された状態で供給される封止材によって回路３の間の空隙を充填する。回路シート４０を用いる方法によれば、回路３の間の空隙を樹脂４で充填する工程（一次モールド）を省略でき、回路基板の生産効率のさらなる向上が期待できる。支持部材９は、回路基板を用いて回路パッケージを作製する前に除去してもよい。 In the method of the present disclosure, the circuit 3 may be arranged on the insulating material 1 by using a circuit sheet 40 as shown in FIG. The circuit sheet 40 includes the support member 9 and the circuit 3 arranged on the support member 9. The circuit 3 of the circuit sheet 40 is placed in a mold so as to face the insulating material 2 to form a laminated body, and a gap between the circuits 3 is provided by a sealing material supplied while the laminated body is pressurized. To fill. According to the method using the circuit sheet 40, the step of filling the voids between the circuits 3 with the resin 4 (primary molding) can be omitted, and further improvement in the production efficiency of the circuit board can be expected. The support member 9 may be removed before the circuit package is manufactured using the circuit board.
（回路）
　上記方法で使用する回路の材質は、特に限定されない。具体的には、銅、銀、クロム銅、タングステン銅、ニッケル、ニッケルメッキ銅、アルミニウム（アルマイト処理したアルミニウムを含む）等が挙げられる。導電性の観点からは、銅を含むことが好ましい。 (circuit)
The material of the circuit used in the above method is not particularly limited. Specific examples thereof include copper, silver, chromium copper, tungsten copper, nickel, nickel-plated copper, and aluminum (including alumite-treated aluminum). From the viewpoint of conductivity, it is preferable to contain copper.
　回路の厚さは特に制限されず、回路基板及び回路パッケージの用途等に応じて選択できる。回路基板及び回路パッケージの大電流化の観点からは、回路の厚さは３５０μｍ以上であることが好ましく、４００μｍ以上であることがより好ましく、５００μｍ以上であることがさらに好ましく、１０００μｍ以上であることが特に好ましい。回路基板及び回路パッケージの薄型化の観点からは、回路の厚さは５０００μｍ以下であってよい。回路の場所によって厚さが異なる場合は、任意に選択した５箇所で得られた測定値の算術平均値を上記の値としてもよい。回路の厚さは一定であっても一定でなくてもよい。回路の厚さが一定でない場合、上記回路の厚さは、素子が搭載される部分の厚さを意味する。また、絶縁材に回路の一部が埋め込まれている場合は、埋め込まれている部分の厚さも回路の厚さに含まれる。 The thickness of the circuit is not particularly limited, and can be selected according to the application of the circuit board and circuit package. From the viewpoint of increasing the current of the circuit board and the circuit package, the thickness of the circuit is preferably 350 μm or more, more preferably 400 μm or more, further preferably 500 μm or more, more preferably 1000 μm or more. Is particularly preferable. From the viewpoint of reducing the thickness of the circuit board and the circuit package, the thickness of the circuit may be 5000 μm or less. When the thickness varies depending on the location of the circuit, the above-mentioned value may be the arithmetic average value of the measurement values obtained at five arbitrarily selected locations. The thickness of the circuit may or may not be constant. When the thickness of the circuit is not constant, the thickness of the circuit means the thickness of the portion where the device is mounted. Further, when a part of the circuit is embedded in the insulating material, the thickness of the embedded part is also included in the thickness of the circuit.
　回路基板及び回路パッケージにおける回路の幅及び長さは特に制限されず、回路基板及び回路パッケージの用途等に応じて選択してよい。例えば、回路の幅及び長さはそれぞれ３５０μｍ～７００００μｍであってもよい。回路の場所によって幅又は長さが異なる場合は、任意に選択した５箇所で得られた測定値の算術平均値を上記の値としてもよい。 The width and length of the circuit on the circuit board and the circuit package are not particularly limited, and may be selected according to the application of the circuit board and the circuit package. For example, the width and length of the circuit may be 350 μm to 70000 μm, respectively. When the width or length differs depending on the location of the circuit, the above-mentioned value may be the arithmetic average value of the measurement values obtained at five arbitrarily selected locations.
　回路は、例えば、金属板を所望の形状に加工することで得られる。加工の方法は特に制限されず、打抜き、切削等の公知の方法によって行うことができる。 A circuit can be obtained, for example, by processing a metal plate into a desired shape. The processing method is not particularly limited, and it can be performed by a known method such as punching or cutting.
　必要に応じ、回路の間の空隙は、回路間を絶縁するために樹脂で充填されてもよい。樹脂としては、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂、アクリル樹脂等の樹脂が挙げられ、硬化性樹脂が好ましい。充填に用いる樹脂は、１種であっても２種以上であってもよい。 -If necessary, the gap between the circuits may be filled with resin to insulate the circuits. Examples of the resin include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin and acrylic resin, and curable resin is preferable. The resin used for filling may be one kind or two or more kinds.
（絶縁材）
　絶縁材は、回路と金属板との間に配置されて回路と金属板とを電気的に絶縁する役割を果たす。絶縁材の材質は、特に制限されない。例えば、樹脂を含むものであってもよい。樹脂としては、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂、アクリル樹脂等の樹脂が挙げられ、硬化性樹脂が好ましい。絶縁材に含まれる樹脂は、１種であっても２種以上であってもよい。 (Insulating material)
The insulating material is disposed between the circuit and the metal plate and serves to electrically insulate the circuit and the metal plate. The material of the insulating material is not particularly limited. For example, it may contain a resin. Examples of the resin include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin and acrylic resin, and curable resin is preferable. The resin contained in the insulating material may be one kind or two or more kinds.
　電気絶縁性及び隣接する部材に対する接着性の観点からは、絶縁材は、エポキシ樹脂、シリコーン樹脂、及びウレタン樹脂からなる群より選択される少なくとも１種を含むことが好ましく、エポキシ樹脂を含むことがより好ましい。 From the viewpoint of electrical insulation and adhesion to adjacent members, the insulating material preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, and urethane resin, and contains epoxy resin. More preferable.
　絶縁材は、熱伝導性向上の観点から、樹脂以外の成分を含んでもよい。樹脂以外の成分としては、無機フィラーが挙げられる。無機フィラーは粉末状であっても繊維状であってもよい。 The insulating material may contain components other than resin from the viewpoint of improving thermal conductivity. Examples of components other than the resin include inorganic fillers. The inorganic filler may be powdery or fibrous.
　絶縁材の厚さは特に制限されず、回路基板の用途等に応じて選択してよい。充分な絶縁性を確保する観点からは、絶縁材の厚さは厚いほど好ましい。例えば、絶縁材の厚さは６０μｍ以上であることが好ましく、９０μｍ以上であることがより好ましく、１２０μｍ以上であることがさらに好ましい。 The thickness of the insulating material is not particularly limited and may be selected according to the application of the circuit board. From the viewpoint of ensuring sufficient insulation, the thicker the insulating material, the better. For example, the thickness of the insulating material is preferably 60 μm or more, more preferably 90 μm or more, and further preferably 120 μm or more.
　充分な放熱性を確保する観点からは、絶縁材の厚さは小さいほど好ましい。例えば、絶縁材の厚さは２３０μｍ以下であることが好ましく、２１０μｍ以下であることがより好ましく、１９０μｍ以下であることがさらに好ましい。 From the viewpoint of ensuring sufficient heat dissipation, the smaller the thickness of the insulating material, the better. For example, the thickness of the insulating material is preferably 230 μm or less, more preferably 210 μm or less, and further preferably 190 μm or less.
　絶縁層の面積（積層体を積層方向から観察したときの面積）は、回路と金属板とを電気的に絶縁できるのであれば特に制限されない。良好な絶縁性を確保する観点からは、絶縁層の面積（積層体を積層方向から観察したときの面積）は、回路と同じであるか回路よりも大きいことが好ましく、回路よりも大きいことがより好ましい。 The area of the insulating layer (the area when the laminate is observed from the stacking direction) is not particularly limited as long as the circuit and the metal plate can be electrically insulated. From the viewpoint of ensuring good insulation, the area of the insulating layer (the area when the stacked body is observed from the stacking direction) is preferably the same as or larger than the circuit, and is preferably larger than the circuit. More preferable.
（金属板）
　金属板は、回路で発生した熱を外部に放散させる役割を果たす。金属板の材質は、特に制限されない。例えば、銅、銀、クロム銅、タングステン銅、ニッケル、ニッケルメッキ銅、アルミニウム（アルマイト処理したアルミニウムを含む）等が挙げられる。放熱性の観点からは、銅及びアルミニウムが好ましい。 (Metal plate)
The metal plate plays a role of dissipating heat generated in the circuit to the outside. The material of the metal plate is not particularly limited. For example, copper, silver, chrome copper, tungsten copper, nickel, nickel-plated copper, aluminum (including alumite-treated aluminum) and the like can be mentioned. From the viewpoint of heat dissipation, copper and aluminum are preferable.
　金属板の厚さは特に制限されず、例えば、３００μｍ～１０００００μｍであってもよい。金属板の場所によって厚さが異なる場合は、任意に選択した５箇所で得られた測定値の算術平均値を上記の値としてもよい。 The thickness of the metal plate is not particularly limited, and may be, for example, 300 μm to 100000 μm. When the thickness differs depending on the location of the metal plate, the arithmetic mean value of the measurement values obtained at five arbitrarily selected locations may be used as the above value.
　金属板の形状は、特に制限されない。例えば、表面に凹凸を有していても、凹凸を有していなくてもよい。表面に凹凸を有する金属板の例としては、回路の周囲に相当する部分に溝を設けた金属板、回路が配置される側と逆側の面に起伏を設けた金属板等が挙げられる。回路の周囲に相当する部分に溝を設けた金属板を用いることで、回路の周囲を封止する封止部が金属板の溝にも入り込んだ状態になり、絶縁材の端部における水分の侵入、剥離等の発生が抑制され、絶縁信頼性及び放熱性にさらなる向上が期待できる。また、回路が配置される側と逆側に起伏を設けた金属板を用いることで、金属板の表面積が増大して冷却性能のさらなる向上が期待できる。金属板は、一方の面にのみ凹凸を有していても両面に凹凸を有していてもよい。 The shape of the metal plate is not particularly limited. For example, the surface may or may not have irregularities. Examples of the metal plate having irregularities on its surface include a metal plate having a groove in a portion corresponding to the periphery of the circuit, a metal plate having an undulation on the side opposite to the side where the circuit is arranged, and the like. By using a metal plate that has a groove in the portion corresponding to the periphery of the circuit, the sealing part that seals the periphery of the circuit enters into the groove of the metal plate, and the moisture at the end of the insulating material Occurrence of intrusion and peeling is suppressed, and further improvement in insulation reliability and heat dissipation can be expected. Further, by using the metal plate having the undulations on the side opposite to the side where the circuit is arranged, the surface area of the metal plate is increased, and further improvement in cooling performance can be expected. The metal plate may have unevenness on only one surface or may have unevenness on both surfaces.
（封止材）
　封止材は、回路基板及び回路パッケージの絶縁信頼性を高め、回路基板及び回路パッケージを水分等から保護する役割を果たす。封止材の材質は、トランスファー成形に使用可能なものであれば特に制限されない。例えば、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂、アクリル樹脂等の樹脂が挙げられ、硬化性樹脂が好ましい。封止材に含まれる樹脂は、１種であっても２種以上であってもよい。 (Sealing material)
The encapsulant plays a role of improving insulation reliability of the circuit board and the circuit package and protecting the circuit board and the circuit package from moisture and the like. The material of the sealing material is not particularly limited as long as it can be used for transfer molding. Examples thereof include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, and acrylic resin, and curable resin is preferable. The resin contained in the encapsulant may be one type or two or more types.
　電気絶縁性と接着性の観点からは、封止材は、エポキシ樹脂、シリコーン樹脂、及びウレタン樹脂からなる群より選択される少なくとも１種を含むことが好ましく、エポキシ樹脂を含むことがより好ましい。 From the viewpoint of electrical insulation and adhesiveness, the encapsulant preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, and urethane resin, and more preferably contains epoxy resin.
　封止材は、熱伝導性向上の観点から、樹脂以外の成分を含んでもよい。樹脂以外の成分としては、無機フィラーが挙げられる。無機フィラーは粉末状であっても繊維状であってもよい。 The encapsulant may contain components other than resin from the viewpoint of improving thermal conductivity. Examples of components other than the resin include inorganic fillers. The inorganic filler may be powdery or fibrous.
　金型内での流動性の観点からは、硬化前の封止材は、ＪＩＳ　Ｋ　７１５４－１：２００２に準拠するスパイラルフロー試験における流動力が５ｃｍ以上であることが好ましく、１０ｃｍ以上であることが好ましい。未充填部の発生及び空隙の巻き込みを抑制する観点からは、上記流動力は２００ｃｍ以下であることが好ましく、１００ｃｍ以下であることがより好ましい。 From the viewpoint of fluidity in the mold, the sealing material before curing has a fluidity of 5 cm or more, preferably 10 cm or more, in a spiral flow test according to JIS K 7154-1:2002. Is preferred. From the viewpoint of suppressing the generation of unfilled portions and the entrapment of voids, the fluidity is preferably 200 cm or less, and more preferably 100 cm or less.
　耐熱性の観点からは、硬化後の封止材のガラス転移温度は５０℃以上であることが好ましく、１００℃以上であることがより好ましい。接着信頼性の観点からは、硬化後の封止材のガラス転移温度は４５０℃以下であることが好ましく、３００℃以下であることがより好ましい。
　本開示において、硬化後の封止材のガラス転移温度は、ＪＩＳ　Ｋ７１９７：１９９１に準拠する熱機械分析法により測定される値である。 From the viewpoint of heat resistance, the glass transition temperature of the cured encapsulant is preferably 50° C. or higher, and more preferably 100° C. or higher. From the viewpoint of adhesion reliability, the glass transition temperature of the cured encapsulant is preferably 450° C. or lower, and more preferably 300° C. or lower.
In the present disclosure, the glass transition temperature of the encapsulant after curing is a value measured by a thermomechanical analysis method according to JIS K7197:1991.
　硬化後の封止材の線膨張係数（ＣＴＥ）は、封止材と隣接する部材との密着性を考慮して選択することが好ましい。具体的には、硬化後の封止材の線膨張係数は、隣接する部材の線膨張係数に近い値となるように選択することが好ましい。例えば、５ｐｐｍ～５０ｐｐｍであることが好ましく、５ｐｐｍ～３０ｐｐｍ以下であることがより好ましい。
　本開示において、硬化後の封止材の線膨張係数は、ＪＩＳ　Ｋ　７１９７：２０１２に準拠する熱線膨張率試験により測定される値である。 The coefficient of linear expansion (CTE) of the cured sealing material is preferably selected in consideration of the adhesiveness between the sealing material and the adjacent member. Specifically, the linear expansion coefficient of the cured sealing material is preferably selected to be a value close to the linear expansion coefficient of the adjacent member. For example, it is preferably 5 ppm to 50 ppm, more preferably 5 ppm to 30 ppm or less.
In the present disclosure, the linear expansion coefficient of the cured encapsulant is a value measured by a thermal linear expansion coefficient test according to JIS K 7197:2012.
＜回路基板＞
　本開示の回路基板は、金属板、絶縁材及び回路をこの順に含む積層体と、前記回路の周囲及び前記絶縁材の端部を少なくとも封止する封止部と、を備え、前記回路の前記絶縁材に対向する面と逆側の面の少なくとも一部が露出している、回路基板である。 <Circuit board>
The circuit board of the present disclosure includes a laminated body including a metal plate, an insulating material, and a circuit in this order, and a sealing portion that seals at least the periphery of the circuit and an end portion of the insulating material. A circuit board in which at least a part of the surface opposite to the surface facing the insulating material is exposed.
　上記構成を有する回路基板は、回路の周囲及び前記絶縁材の端部が封止部で封止されているため、絶縁材の端部における水分の侵入、剥離等の発生が抑制され、絶縁信頼性及び放熱性に優れている。上記構成を有する回路基板は、例えば、上述した回路基板の製造方法により製造することができる。回路基板の詳細及び好ましい態様は、上述した回路基板の製造方法により製造される回路基板の詳細及び好ましい態様と同様である。 In the circuit board having the above configuration, since the periphery of the circuit and the end of the insulating material are sealed by the sealing portion, the occurrence of moisture intrusion and peeling at the end of the insulating material is suppressed, and insulation reliability is improved. Excellent heat dissipation and heat dissipation. The circuit board having the above configuration can be manufactured by, for example, the method for manufacturing a circuit board described above. The details and preferable aspects of the circuit board are the same as the details and preferable aspects of the circuit board manufactured by the method for manufacturing the circuit board described above.
　上記構成を有する回路基板は、回路の前記絶縁材に対向する面と逆側の面の少なくとも一部が露出している。本開示において「露出」とは、回路の当該部分が封止材で封止されていない（すなわち、回路パッケージの状態になっていない）状態を意味する。回路の露出している部分に素子を配置し、封止材で封止することで、回路パッケージが製造される。回路パッケージの製造は、例えば、後述する回路パッケージの製造方法に記載した手法で行うことができる。 In the circuit board having the above structure, at least a part of the surface of the circuit opposite to the surface facing the insulating material is exposed. In the present disclosure, “exposed” means a state in which the relevant portion of the circuit is not sealed with a sealing material (that is, not in a circuit package state). A circuit package is manufactured by disposing an element in an exposed portion of the circuit and sealing the element with a sealing material. The circuit package can be manufactured by, for example, the method described in the circuit package manufacturing method described later.
＜回路パッケージの製造方法（第１実施形態）＞
　第１実施形態の回路パッケージの製造方法は、上述した回路基板の製造方法により製造される回路基板の前記回路の上に素子を配置する工程と、前記素子の周囲を封止材で封止する工程と、を備える。 <Circuit Package Manufacturing Method (First Embodiment)>
The circuit package manufacturing method according to the first embodiment includes a step of disposing an element on the circuit of the circuit board manufactured by the circuit board manufacturing method described above, and sealing the periphery of the element with a sealing material. And a process.
　上記方法において、回路の上に配置された素子の周囲を封止材で封止する方法は、特に制限されない。粉末等の固体状の封止材を用いる場合の方法としては、注型法、押出成形法、圧縮成形法、トランスファー成形法、インサート成形法等が挙げられる。液状の封止材を用いる場合の方法としては、注型法、塗布法、印刷法、埋め込み法等が挙げられる。 In the above method, the method of sealing the periphery of the element arranged on the circuit with a sealing material is not particularly limited. Examples of methods for using a solid encapsulating material such as powder include casting method, extrusion molding method, compression molding method, transfer molding method, and insert molding method. Examples of the method of using the liquid sealing material include a casting method, a coating method, a printing method and an embedding method.
　ある実施態様では、素子の周囲の封止は、回路基板を配置した型の内部に封止材を非加圧で供給する工程を含む方法によって行う。以下、このような方法を「非加圧成形法」ともいう。 In one embodiment, the sealing of the periphery of the element is performed by a method including a step of supplying the sealing material to the inside of the mold in which the circuit board is arranged without applying pressure. Hereinafter, such a method is also referred to as a "non-pressure molding method".
　非加圧成形法では、トランスファー成形法等の封止材を加圧しながら型の内部に供給する方法に比べ、一般に簡便な設備で封止工程を実施することができる。また、封止材中のボイドの生成をより効果的に抑制することができ、信頼性の点で優れている。 In the non-pressure molding method, compared with the method of supplying the sealing material to the inside of the mold while pressurizing the sealing material such as the transfer molding method, generally, the sealing step can be performed with simple equipment. In addition, the generation of voids in the encapsulant can be suppressed more effectively, which is excellent in reliability.
　本開示では、型の内部への封止材の供給が加圧を伴わずに行われるのであれば、型の内部に封止材を供給した後に加圧を行う場合も非加圧成形法に含まれるものとする。 In the present disclosure, if the encapsulant is supplied to the inside of the mold without applying pressure, the non-pressurizing molding method can be used even when the encapsulant is supplied to the inside of the mold and then pressure is applied. Shall be included.
　型の内部への封止材料の供給を非加圧で行う方法は、特に制限されない。例えば、密閉されていない型の内部に封止材を供給することで行ってもよい。型の内部に供給される封止材は、固体であっても液体であってもよい。 The method of supplying the sealing material to the inside of the mold without applying pressure is not particularly limited. For example, it may be performed by supplying a sealing material to the inside of the unsealed mold. The sealing material supplied to the inside of the mold may be solid or liquid.
　素子の周囲の封止を非加圧成形法にて実施する場合、封止材中におけるボイドの生成をより抑制する観点からは、封止材を型の内部に供給した後、型の内部を減圧する工程（減圧工程）を実施することが好ましい。 When performing the sealing around the element by the non-pressure molding method, from the viewpoint of further suppressing the generation of voids in the sealing material, after supplying the sealing material to the inside of the mold, It is preferable to carry out the step of reducing the pressure (pressure reduction step).
　封止材を型の内部に供給した後に型の内部を減圧することで、例えば、型の内部に供給された封止材が粒子状である場合、粒子間に存在していた空気が溶融した封止材の内部に残存して気泡が形成されるのを抑制することができる。 By depressurizing the inside of the mold after supplying the encapsulant to the inside of the mold, for example, when the encapsulant supplied to the inside of the mold is in the form of particles, the air existing between the particles is melted. It is possible to suppress the formation of bubbles remaining inside the sealing material.
　封止材中のボイドの生成をより抑制する観点からは、上記方法において減圧工程を実施した後に、型の内部を大気圧に近づける工程（昇圧工程）を実施することが好ましい。 From the viewpoint of further suppressing the generation of voids in the encapsulant, it is preferable to carry out the step of bringing the inside of the mold closer to atmospheric pressure (pressure step) after carrying out the depressurization step in the above method.
　減圧工程の後に昇圧工程を実施することで、減圧工程で生成を抑制できなかった気泡が圧力によって潰され、封止材中のボイドの生成をさらに抑制することができる。昇圧工程を実施する方法は、特に制限されない。例えば、内部が減圧された型の開口部を開放して大気圧にする方法であってもよい。 By performing the pressurization process after the depressurization process, the bubbles that could not be suppressed in the depressurization process are crushed by the pressure, and the generation of voids in the encapsulant can be further suppressed. The method for carrying out the pressurizing step is not particularly limited. For example, it may be a method of opening the opening of a mold whose inside is depressurized to atmospheric pressure.
　封止を非加圧成形法にて実施する場合、減圧工程は型の内部に供給された封止材を溶融させる工程（溶融工程）の前に行うことが好ましく、昇圧工程は溶融工程の後に行うことが好ましい。 When the sealing is performed by the non-pressurizing molding method, the depressurizing step is preferably performed before the step (melting step) of melting the sealing material supplied into the mold, and the pressurizing step is performed after the melting step. It is preferable to carry out.
　封止材の材質は特に制限されず、所望の特性、成形方法等に応じて選択できる。例えば、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂、アクリル樹脂等の樹脂が挙げられ、硬化性樹脂が好ましい。封止材に含まれる樹脂は、１種であっても２種以上であってもよい。 The material of the encapsulant is not particularly limited and can be selected according to the desired characteristics, molding method, etc. Examples thereof include resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, and acrylic resin, and curable resin is preferable. The resin contained in the encapsulant may be one type or two or more types.
　電気絶縁性及び隣接する部材に対する接着性の観点からは、封止材は、エポキシ樹脂、シリコーン樹脂、及びウレタン樹脂からなる群より選択される少なくとも１種を含むことが好ましく、エポキシ樹脂を含むことがより好ましい。 From the viewpoint of electrical insulation and adhesiveness to an adjacent member, the encapsulant preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, and urethane resin, and contains epoxy resin. Is more preferable.
　封止材は、熱伝導性向上の観点から樹脂以外の成分を含んでもよい。樹脂以外の成分としては、無機フィラーが挙げられる。無機フィラーは粉末状であっても繊維状であってもよい。また、封止材は、回路基板の製造方法に使用する封止材と同様の物性を満たすものであってもよい。 The encapsulant may contain components other than resin from the viewpoint of improving thermal conductivity. Examples of components other than the resin include inorganic fillers. The inorganic filler may be powdery or fibrous. The encapsulant may have the same physical properties as the encapsulant used in the method of manufacturing the circuit board.
＜回路パッケージの製造方法（第２実施形態）＞
　第２実施形態の回路パッケージの製造方法は、金型の内部に配置された金属板、絶縁材及び回路をこの順に含み、かつ前記回路の上に素子が配置された積層体を前記金型で加圧する工程と、前記金型で前記積層体が加圧された状態で前記金型に封止材を供給する工程と、を備える回路パッケージの製造方法である。 <Circuit Package Manufacturing Method (Second Embodiment)>
In the method for manufacturing a circuit package according to the second embodiment, a laminate including a metal plate, an insulating material, and a circuit arranged inside a mold in this order, and an element arranged on the circuit is formed in the mold. A method of manufacturing a circuit package, comprising: a step of applying pressure; and a step of supplying a sealing material to the mold in a state where the laminate is pressed by the mold.
　上記方法では、金型に封止材を供給する工程において、積層体を構成する回路の周囲及び絶縁材の端部の封止と、回路上に配置された素子の周囲の封止を一括して行う。このため、第１実施形態の方法よりも回路パッケージの生産性により優れている。 In the above method, in the step of supplying the sealing material to the mold, the sealing of the periphery of the circuit forming the laminated body and the end of the insulating material and the sealing of the periphery of the element arranged on the circuit are collectively performed. Do it. Therefore, the productivity of the circuit package is superior to that of the method of the first embodiment.
　上記方法では、図２に示すような積層体１０の上面の全体を加圧する上金型Ａの代わりに、積層体１０の素子が配置されていない部分（例えば、積層体１０の上面の周囲）のみを加圧し、素子が配置されている部分は加圧しないような形状の上金型Ａを備える金型を使用する。このような金型を用いることで、回路上に素子が配置されていても、金型の加圧による素子の損傷を回避しつつ、絶縁信頼性に優れる回路パッケージが得られる。 In the above method, instead of the upper mold A that presses the entire upper surface of the laminated body 10 as shown in FIG. 2, a portion where the elements of the laminated body 10 are not arranged (for example, around the upper surface of the laminated body 10). A mold including an upper mold A having a shape in which only the pressure is applied and the portion where the element is arranged is not pressed is used. By using such a mold, it is possible to obtain a circuit package having excellent insulation reliability while avoiding damage to the device due to pressurization of the mold even when the device is arranged on the circuit.
　上記方法で使用する金属板、絶縁材、回路、素子、封止材その他の材料としては、上述した回路基板の製造方法に使用する各材料を用いることができ、それらの好ましい態様も参照することができる。 As the metal plate, insulating material, circuit, element, sealing material and other materials used in the above method, each material used in the above-described method for manufacturing a circuit board can be used, and also refer to preferred embodiments thereof. You can
　本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。 All documents, patent applications, and technical standards mentioned herein are to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference, Incorporated herein by reference.

Claims (9)

  1. 　金型の内部に配置された金属板、絶縁材及び回路をこの順に含む積層体を前記金型で加圧する工程と、前記金型で前記積層体が加圧された状態で前記金型に封止材を供給する工程と、を備える回路基板の製造方法。 A step of pressurizing a laminated body including a metal plate, an insulating material, and a circuit arranged inside the die in this order with the die; and sealing the laminated body with the die pressed with the die. A method of manufacturing a circuit board, comprising the step of supplying a stop material.
  2. 　前記封止材は、前記回路の周囲及び前記絶縁材の端部を少なくとも封止するように供給される、請求項１に記載の回路基板の製造方法。 The method for manufacturing a circuit board according to claim 1, wherein the sealing material is supplied so as to seal at least the periphery of the circuit and the end portion of the insulating material.
  3. 　前記回路は、支持部材上に前記回路が配置され、前記回路の間の空隙が樹脂で充填された状態の回路シートを用いて、前記回路が前記絶縁材に対向するように前記金型内に配置される、請求項１又は請求項２に記載の回路基板の製造方法。 The circuit includes a circuit sheet in which the circuit is arranged on a support member and a space between the circuits is filled with resin, and the circuit is placed in the mold so as to face the insulating material. The method for manufacturing a circuit board according to claim 1, wherein the circuit board is arranged.
  4. 　前記回路の厚さは３５０μｍ以上である、請求項１～請求項３のいずれか１項に記載の回路基板の製造方法。 The method for manufacturing a circuit board according to any one of claims 1 to 3, wherein the circuit has a thickness of 350 μm or more.
  5. 　金属板、絶縁材及び回路をこの順に含む積層体と、
    　前記回路の周囲及び前記絶縁材の端部を少なくとも封止する封止部と、を備え、
    　前記回路の前記絶縁材に対向する面と逆側の面の少なくとも一部が露出している、回路基板。     A laminated body including a metal plate, an insulating material and a circuit in this order,
    A sealing portion that seals at least the periphery of the circuit and the end portion of the insulating material,
    A circuit board in which at least a part of a surface of the circuit opposite to the surface facing the insulating material is exposed.
  6. 　請求項１～請求項４のいずれか１項に記載の回路基板の製造方法により製造される回路基板の前記回路の上に素子を配置する工程と、前記素子の周囲を封止材で封止する工程と、を備える回路パッケージの製造方法。 A step of disposing an element on the circuit of a circuit board manufactured by the method of manufacturing a circuit board according to any one of claims 1 to 4, and a periphery of the element is sealed with a sealing material. And a step of performing.
  7. 　前記素子の周囲の封止は、前記回路基板を配置した型の内部に前記素子の周囲を封止するための封止材を非加圧で供給する工程を含む方法によって行う、請求項６に記載の回路パッケージの製造方法。 The sealing of the periphery of the element is performed by a method including a step of supplying a sealing material for sealing the periphery of the element to the inside of a mold in which the circuit board is arranged without applying pressure. A method for manufacturing the described circuit package.
  8. 　前記素子の周囲の封止は、前記封止材を前記型の内部に供給した後、前記型の内部を減圧する工程を含む、請求項７に記載の回路パッケージの製造方法。 The method for manufacturing a circuit package according to claim 7, wherein sealing the periphery of the element includes a step of supplying the sealing material to the inside of the mold and then depressurizing the inside of the mold.
  9. 　金型の内部に配置された金属板、絶縁材及び回路をこの順に含み、かつ前記回路の上に素子が配置された積層体を前記金型で加圧する工程と、前記金型で前記積層体が加圧された状態で前記金型に封止材を供給する工程と、を備える回路パッケージの製造方法。 A step of pressurizing a laminated body including a metal plate, an insulating material, and a circuit arranged inside a die in this order, and an element arranged on the circuit with the die, and the laminated body with the die And a step of supplying an encapsulant to the mold under pressure, the method for manufacturing a circuit package.
PCT/JP2019/007905 2019-02-28 2019-02-28 Method for manufacturing circuit board, circuit board, and method for manufacturing circuit package WO2020174674A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118464A (en) * 1997-06-17 1999-01-12 Matsushita Electric Ind Co Ltd Manufacture of circuit board
JP2007053146A (en) * 2005-08-16 2007-03-01 Nec Engineering Ltd Sealed printed board and its manufacturing method
JP2008140954A (en) * 2006-12-01 2008-06-19 Matsushita Electric Ind Co Ltd Heat dissipating wiring board, manufacturing method thereof, and light emitting module using it
JP2011213961A (en) * 2010-04-02 2011-10-27 Kaneka Corp Semiconductor package
JP2017022265A (en) * 2015-07-10 2017-01-26 日清紡ケミカル株式会社 Metal circuit board and method for manufacturing the same
JP2018182010A (en) * 2017-04-10 2018-11-15 日立化成株式会社 Method of manufacturing circuit board, circuit sheet and circuit board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118464A (en) * 1997-06-17 1999-01-12 Matsushita Electric Ind Co Ltd Manufacture of circuit board
JP2007053146A (en) * 2005-08-16 2007-03-01 Nec Engineering Ltd Sealed printed board and its manufacturing method
JP2008140954A (en) * 2006-12-01 2008-06-19 Matsushita Electric Ind Co Ltd Heat dissipating wiring board, manufacturing method thereof, and light emitting module using it
JP2011213961A (en) * 2010-04-02 2011-10-27 Kaneka Corp Semiconductor package
JP2017022265A (en) * 2015-07-10 2017-01-26 日清紡ケミカル株式会社 Metal circuit board and method for manufacturing the same
JP2018182010A (en) * 2017-04-10 2018-11-15 日立化成株式会社 Method of manufacturing circuit board, circuit sheet and circuit board

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