WO2020147571A1 - 一种导电浆料及其制备方法、可穿戴电子电路及其diy套件 - Google Patents

一种导电浆料及其制备方法、可穿戴电子电路及其diy套件 Download PDF

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Publication number
WO2020147571A1
WO2020147571A1 PCT/CN2019/130073 CN2019130073W WO2020147571A1 WO 2020147571 A1 WO2020147571 A1 WO 2020147571A1 CN 2019130073 W CN2019130073 W CN 2019130073W WO 2020147571 A1 WO2020147571 A1 WO 2020147571A1
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WIPO (PCT)
Prior art keywords
conductive paste
filler
liquid metal
conductive
wearable electronic
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PCT/CN2019/130073
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English (en)
French (fr)
Inventor
曹宇
刘斌
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北京梦之墨科技有限公司
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Publication of WO2020147571A1 publication Critical patent/WO2020147571A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Definitions

  • This application relates to the technical field of electronic circuits, in particular to a conductive paste and a preparation method thereof, a wearable electronic circuit and a DIY kit thereof.
  • a wearable electronic device is an electronic device that is used while being worn on, for example, a human body (eg, wrist, neck, head, etc.). Because wearable electronic devices can provide various services with great portability, the use of wearable electronic devices is increasing, and the personalized demand for wearable electronic devices is also gradually increasing.
  • Wearable electronic devices need to include electronic circuits to achieve their functions.
  • Traditional electronic circuits use copper wires or aluminum wires, and complex processes such as etching are required during the production process. DIY production cannot be carried out and cannot satisfy users The individual needs of the device.
  • This application provides a conductive paste and a preparation method thereof, a wearable electronic circuit and a DIY kit thereof, which can easily manufacture a wearable electronic circuit, has strong operability, and helps to meet the individual needs of users for wearable electronic devices .
  • this application provides a conductive paste, which adopts the following technical solutions:
  • the conductive paste is composed of a gallium-based liquid metal, a viscosity adjusting filler, and a conductive filler; wherein, by weight percentage, the conductive paste includes 4%-10% viscosity adjusting filler, 4%-10% conductive filler, The balance is gallium-based liquid metal; the viscosity adjusting filler is one or more of iron powder, nickel powder, and iron-nickel powder, and the conductive filler is silver-coated copper powder.
  • the gallium-based liquid metal is gallium simple substance, or gallium indium eutectic alloy, or gallium indium tin eutectic alloy.
  • the viscosity adjusting filler is iron-nickel powder
  • the conductive slurry includes 5% viscosity adjusting filler
  • the viscosity adjusting filler is nickel powder
  • the conductive paste includes 4% viscosity adjusting filler.
  • the particle size of the viscosity adjusting filler is 1 to 5 microns.
  • the conductive paste includes 5% conductive filler.
  • the particle size of the conductive filler is 1 to 5 microns.
  • the present application provides a method for preparing a conductive paste for preparing the conductive paste described in any one of the above, and the preparation method adopts the following technical solutions:
  • the preparation method of the conductive paste includes:
  • the gallium-based liquid metal, the viscosity adjusting filler, and the conductive filler are uniformly mixed to obtain the conductive slurry.
  • the present application provides a wearable electronic circuit, the wearable electronic circuit comprising: a liquid metal circuit on the skin of the human body, the liquid metal circuit is made of any one of the above conductive pastes.
  • the present application provides a DIY kit for wearable electronic circuits.
  • the DIY kit for wearable electronic circuits includes a hand-painted kit, the hand-painted kit includes a brush, and the conductive paste described in any one of the above .
  • the application provides a conductive paste and a preparation method thereof, a wearable electronic circuit and a DIY kit thereof.
  • the conductive paste is composed of a gallium-based liquid metal, a viscosity adjusting filler, and a conductive filler; wherein, the conductive paste is calculated by weight percentage.
  • the slurry includes 4%-10% viscosity adjusting filler, 4%-10% conductive filler, and the balance is gallium-based liquid metal; viscosity adjusting filler is one or more of iron powder, nickel powder, and iron-nickel powder, conductive
  • the filler is silver-coated copper powder.
  • gallium-based liquid metal has a low melting point and is easy to melt into a liquid state.
  • the viscosity adjustment filler makes the conductive paste have a suitable viscosity.
  • the conductive filler makes the conductive paste have better electrical properties.
  • the conductive paste contains only three components: gallium-based liquid metal, viscosity adjusting filler, and conductive filler. It has no other organic solvents, dispersants, coupling agents, surfactants and other components. It has good biocompatibility, so The conductive paste can be directly made into liquid metal circuits by brushing, hand-painting, etc., and applied to wearable electronic circuits. Therefore, the technical solution of the present application can simply make wearable electronic circuits, and has strong operability. Helps meet the personalized needs of users for wearable electronic devices.
  • FIG. 1 is a flowchart of a method for preparing a conductive paste provided by an embodiment of the application
  • FIG. 2 is a top view of a wearable electronic circuit provided by an embodiment of the application.
  • Fig. 3 is a schematic cross-sectional view of Fig. 2 along the AA' direction according to an embodiment of the application.
  • any lower limit can be combined with any upper limit to form an unspecified range; and any lower limit can be combined with other lower limits to form an unspecified range, and likewise any upper limit can be combined with any other upper limit to form an unspecified range.
  • each point or single numerical value between the end points of the range is included in the range. Therefore, each point or single value can be used as its own lower limit or upper limit, and any other point or single value can be combined with other lower or upper limits to form an unspecified range.
  • a and/or B includes (A and B) and (A or B).
  • the embodiments of the present application provide a conductive paste, which is composed of a gallium-based liquid metal, a viscosity adjusting filler, and a conductive filler; wherein, by weight percentage, the conductive paste includes 4%-10% of a viscosity adjusting filler , 4%-10% conductive filler, the balance is gallium-based liquid metal; viscosity adjusting filler is one or more of iron powder, nickel powder, and iron-nickel powder, and conductive filler is silver-coated copper powder.
  • the iron-nickel powder mentioned above is made of iron-nickel alloy.
  • iron in terms of weight percentage, iron is 72.8%, carbon is 0.75%, the rest is nickel, and of course there are a small amount of inevitable impurity elements. .
  • the weight percentage of the viscosity adjusting filler in the conductive paste may be 4%, 5%, 6%, 7%, 8%, 9% or 10%.
  • the weight percentage of the conductive filler in the conductive paste may be 4%, 5%, 6%, 7%, 8%, 9% or 10%.
  • FIG. 1 is a flowchart of a method for preparing a conductive paste provided by an embodiment of the application, and the method for preparing a conductive paste includes:
  • Step S1 weigh the gallium-based liquid metal, the viscosity adjusting filler and the conductive filler according to weight percentage;
  • Step S2 through a ball milling or kneading process, the gallium-based liquid metal, the viscosity adjusting filler, and the conductive filler are uniformly mixed to obtain a conductive slurry.
  • the process parameters in the ball milling process are: the rotation speed is 500 rpm, and the ball milling time is 10-30 minutes; the process parameters in the kneading process are the rotation speed of 50-60 rpm, and the kneading time is 2 hours.
  • gallium-based liquid metal has a relatively low melting point and can be melted into a liquid state at room temperature or slightly heated. It is easy to use conductive paste to hand-paint structures such as liquid metal circuits.
  • iron powder, nickel powder, and iron-nickel powder can well adjust the viscosity of the conductive paste, so that the conductive paste is not It will not be able to be painted or painted due to the high viscosity, and will not have too much fluidity due to the low viscosity, and will not be able to adhere to the substrate stably, and the cost is low.
  • adding silver powder, copper powder, silver copper powder, etc. to the conductive paste can also adjust the viscosity of the conductive paste, but silver powder, copper powder, silver copper powder and other compounds are prone to generate large particles, increasing the graininess of the conductive paste. And reduce the uniformity of the performance of the conductive paste, and the cost is higher.
  • silver-coated copper powder has good conductivity and low cost, which increases the conductivity of the conductive paste while ensuring the comprehensive performance of the conductive paste.
  • copper powder, silver powder, etc. are also often used as conductive fillers, the inventor found that copper powder easily reacts with gallium to form a copper gallium compound, which makes the conductive paste poorly conductive. In order to ensure conductivity, a large amount of copper powder needs to be added. The conductive paste is easy to solidify, while the cost of silver powder is too high.
  • the conductive paste in the embodiments of the present application is easy to melt into a liquid state, has a suitable viscosity, and has good electrical properties (conductivity above 5 ⁇ 10 6 S/m), and the conductive paste
  • the slurry only contains the three components of gallium-based liquid metal, viscosity adjusting filler, and conductive filler. It has no other organic solvents, dispersants, coupling agents, surfactants and other components. It has good biocompatibility. Therefore, the conductive The slurry can be directly made into liquid metal circuits by brushing, hand-painting, etc., and applied to wearable electronic circuits. Therefore, the technical solution of the present application can simply make wearable electronic circuits, has strong operability, and helps satisfy Personalized needs of users for wearable electronic devices.
  • the gallium-based liquid metal is gallium simple substance (melting point 29.8°C), or gallium indium eutectic alloy (melting point 15.5°C), or gallium indium tin eutectic alloy (melting point 11°C).
  • the viscosity adjusting filler is nickel powder
  • a small amount of nickel powder can be added to adjust the viscosity of the conductive paste, but it is difficult to accurately control the viscosity of the conductive paste, and in the process of preparing the conductive paste, nickel
  • the powder is prone to alloying reaction with gallium-based liquid metal to obtain a partially alloyed product.
  • the partially alloyed product will spontaneously continue the alloying reaction at room temperature, causing the viscosity of the conductive paste to gradually increase, which is not conducive to the conductive paste. Long-term use of materials and stable performance.
  • the viscosity adjusting filler is iron powder
  • the iron powder is easily oxidized during storage, and it is difficult to prepare conductive slurry.
  • the viscosity adjusting filler is iron-nickel powder
  • the viscosity of the conductive paste increases slowly, which is easy to accurately control, and because the nickel content in the iron-nickel powder is small, in the process of preparing the conductive paste, iron It is difficult for nickel powder to react with gallium-based liquid metal.
  • the conductive paste can maintain suitable viscosity and stable performance for a long time.
  • the embodiments of the present application provide several optional methods for selecting viscosity adjusting fillers and the corresponding weight percentages.
  • the viscosity adjusting filler is iron-nickel powder
  • the conductive paste includes 5% viscosity adjusting filler.
  • the viscosity adjusting filler is nickel powder
  • the conductive paste includes 4% viscosity adjusting filler.
  • the conductive paste includes 5% conductive filler.
  • the particle size of the viscosity-adjusting filler is selected to be 1 to 5 microns, such as 2 microns, so that the conductive paste is more delicate and less grainy, and the user experience is good when making liquid metal circuits on human skin. And the viscosity adjusting filler is easy to prepare and has low cost.
  • the particle size of the conductive filler is selected to be 1 to 5 microns, such as 2 microns, so that the conductive paste is more delicate and less grainy.
  • the conductive filler is easy to prepare and the cost is low.
  • FIG. 2 is a top view of the wearable electronic circuit provided by an embodiment of the application
  • FIG. 3 is a diagram provided by an embodiment of the application. 2
  • a schematic cross-sectional view along the AA' direction, the wearable electronic circuit includes: a liquid metal circuit 1 located on the human skin, and the liquid metal circuit 1 is made of any of the conductive pastes described above.
  • the wearable electronic circuit includes: a liquid metal circuit 1, the liquid metal circuit 1 is located on the skin; a power supply 2 and at least one component 3, the power supply 2 and at least one component 3 are connected to the liquid metal The circuit 1 is connected, the power supply 2, the liquid metal circuit 1 and at least one component 3 form a closed loop; the encapsulation layer 4 covers the liquid metal circuit 1, the power supply 2 and the at least one component 3.
  • the power supply 2, the liquid metal circuit 1 and at least one component 3 form a closed loop, so that the wearable electronic circuit has corresponding functions, and the encapsulation layer 4 is used to effectively encapsulate the liquid metal circuit 1, the power supply 2 and at least one component 3 , Help improve the structural stability of wearable electronic circuits.
  • the wearable electronic circuit can be located in any possible position of the user's hands, arms, face, legs, feet, etc., and those skilled in the art can make selections according to actual needs.
  • the wearable electronic circuit When making the wearable electronic circuit, first determine the wearing position of the wearable electronic circuit, and then use conductive paste to make the liquid metal circuit 1 on the skin corresponding to the wearing position, attach the power supply 2 and at least one component 3, and then form The encapsulation layer 4 encapsulates the liquid metal circuit 1, the power supply 2 and at least one component 3 to complete the manufacture of a wearable electronic circuit.
  • an isolation layer can be formed on the skin corresponding to the wearing position.
  • the isolation layer is biocompatible and can adhere to liquid metal.
  • the arrangement of the isolation layer can ensure that when liquid metal circuits are made on human skin, the liquid metal will not directly contact the human skin, and will not cause harm to the human skin, and the safety is higher.
  • the isolation layer can be a single-layer structure or a multi-layer structure. For example, when the isolation layer is a double-layer structure, the bottom layer (the one that contacts the skin) is a film with good biocompatibility, and the top layer (the one that contacts the liquid metal) Layer) is a film layer that can adhere liquid metal and encapsulation layer.
  • the wearable electronic circuit can be used as cultural creative products, beauty products, personalized devices, teaching aids, monitoring circuits, alarm circuits, etc. It is an electronic enthusiast, digital DIY enthusiast, popular science educator, fashion pursuer, electronic researcher, etc. Of the gospel.
  • an embodiment of the present application provides a DIY kit for a wearable electronic circuit.
  • the DIY kit for a wearable electronic circuit includes a hand-painted kit, the hand-painted kit includes a brush, and the conductive paste described above.
  • the hand-painted kit may also include a liquid metal writing pen, and/or a seal that can transfer liquid metal.
  • the DIY kit may also include one or more of an attachment kit, a packaging kit, a painting kit, and a modification kit; wherein, the attachment kit includes an attachment tool, a power supply, and at least one component; the packaging kit includes a packaging material Containers and packaging tools; the smear kit includes a container with isolation materials and smear tools. If there are multiple isolation materials, there should also be multiple smear tools; the modification kit includes a liquid metal eraser pen, the liquid metal eraser pen The excess liquid metal circuit can be erased.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种导电浆料及其制备方法、可穿戴电子电路及其DIY套件，该导电浆料由镓基液态金属、粘度调节填料、以及导电填料组成；其中，按重量百分比计，该导电浆料包括4％～10％粘度调节填料，4％～10％导电填料，余量为镓基液态金属；该粘度调节填料为铁粉、镍粉、铁镍粉中的一种或几种，该导电填料为银包铜粉。该导电浆料有助于满足用户对可穿戴电子装置的个性化需求。

Description

一种导电浆料及其制备方法、可穿戴电子电路及其DIY套件
本申请要求于2019年01月18日提交中国专利局、申请号为201910052236.2、发明名称为“一种导电浆料及其制备方法、可穿戴电子电路及其DIY套件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子电路技术领域，尤其涉及一种导电浆料及其制备方法、可穿戴电子电路及其DIY套件。
背景技术
可穿戴电子装置是在被穿戴在例如人体(例如，腕部、颈部、头部等)上的同时被使用的电子装置。因为可穿戴电子装置可以提供具有很大便携性的各种服务，所以可穿戴电子装置的使用正在增加，且对可穿戴电子装置的个性化需求也逐渐增加。
可穿戴电子装置需要包括电子电路才可实现其功能，传统的电子电路中采用铜导线或者铝导线，其制作过程中需要进行刻蚀等复杂工艺，无法进行DIY制作，无法满足用户对可穿戴电子装置的个性化需求。
申请内容
本申请提供一种导电浆料及其制备方法、可穿戴电子电路及其DIY套件，可以简单地制作可穿戴电子电路，可操作性强，有助于满足用户对可穿戴电子装置的个性化需求。
第一方面，本申请提供一种导电浆料，采用如下技术方案：
所述导电浆料由镓基液态金属、粘度调节填料、以及导电填料组成；其中，按重量百分比计，所述导电浆料包括4％～10％粘度调节填料， 4％～10％导电填料，余量为镓基液态金属；所述粘度调节填料为铁粉、镍粉、铁镍粉中的一种或几种，所述导电填料为银包铜粉。
可选地，所述镓基液态金属为镓单质，或者镓铟共晶合金，或者镓铟锡共晶合金。
可选地，所述粘度调节填料为铁镍粉，所述导电浆料包括5％粘度调节填料。
可选地，所述粘度调节填料为镍粉，所述导电浆料包括4％粘度调节填料。
可选地，所述粘度调节填料的粒径为1～5微米。
可选地，所述导电浆料包括5％导电填料。
可选地，所述导电填料的粒径为1～5微米。
第二方面，本申请提供一种导电浆料的制备方法，用于制作以上任一项所述的导电浆料，所述制备方法采用如下技术方案：
所述导电浆料的制备方法包括：
按重量百分比称取镓基液态金属、粘度调节填料以及导电填料；
通过球磨或者捏合工艺，将所述镓基液态金属、所述粘度调节填料、以及所述导电填料混合均匀，得到所述导电浆料。
第三方面，本申请提供一种可穿戴电子电路，所述可穿戴电子电路包括：位于人体皮肤上的液态金属线路，所述液态金属线路由以上任一项所述的导电浆料制成。
第四方面，本申请提供一种可穿戴电子电路的DIY套件，所述可穿戴电子电路的DIY套件包括：手绘套件，所述手绘套件包括毛刷，以及以上任一项所述的导电浆料。
本申请提供了一种导电浆料及其制备方法、可穿戴电子电路及其DIY套件，该导电浆料由镓基液态金属、粘度调节填料、以及导电填料组成；其中，按重量百分比计，导电浆料包括4％～10％粘度调节填料，4％～10％导电填料，余量为镓基液态金属；粘度调节填料为铁粉、镍粉、铁镍粉中的一种或几种，导电填料为银包铜粉。一方面镓基液态金属具有较低的熔点，易于熔化呈液态，另一方面粘度调节填料使导电浆料具有合适的粘度，再一方面导电填料使导电浆料具有较好的电学性能，再一方面该导电浆料 仅含有镓基液态金属、粘度调节填料以及导电填料这三种组分，无其他有机溶剂、分散剂、耦合剂、表面活性剂等组分，生物相容性较好，因此，该导电浆料可以通过刷涂、手绘等方式直接制作成液态金属线路，应用于可穿戴电子电路中，因此，本申请的技术方案能够简单地制作可穿戴电子电路，可操作性强，有助于满足用户对可穿戴电子装置的个性化需求。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的导电浆料的制备方法的流程图；
图2为本申请实施例提供的可穿戴电子电路的俯视图；
图3为本申请实施例提供的图2沿AA’方向的截面示意图。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，在不冲突的情况下本申请实施例中的各技术特征均可以相互结合。
需要说明的是，为了简便，本文仅明确地公开了一些数值范围。然而，任意下限可以与任何上限组合形成未明确记载的范围；以及任意下限可以与其它下限组合形成未明确记载的范围，同样任意上限可以与任意其它上限组合形成未明确记载的范围。此外，尽管未明确记载，但是范围端点间的每个点或单个数值都包含在该范围内。因而，每个点或单个数值都可以作为自身的下限或上限，与任意其它点或单个数值组合或与其它下限或上 限组合形成未明确记载的范围。
在本文的描述中，需要说明的是，除非另有说明，“一种或几种”中“几种”的含义是两种及两种以上；“至少一个”的含义是一个及一个以上。
需要说明的是，本文中，“和/或”用于表示所说明的情况的一者或两者均可能发生，例如A和/或B包括(A和B)和(A或B)。
本申请实施例提供了一种导电浆料，该导电浆料由镓基液态金属、粘度调节填料、以及导电填料组成；其中，按重量百分比计，导电浆料包括4％～10％粘度调节填料，4％～10％导电填料，余量为镓基液态金属；粘度调节填料为铁粉、镍粉、铁镍粉中的一种或几种，导电填料为银包铜粉。
以上所述的铁镍粉是铁镍合金制成的粉，例如，该铁镍合金中，按重量百分比计，铁72.8％，碳0.75％，其余为镍，当然还有少量不可避免的杂质元素。
若导电浆料中粘度调节填料的含量高于上述范围，将会使得导电浆料的粘度过大，而无法刷涂或手绘，较难形成液态金属线路等结构，若导电浆料中粘度调节填料的含量低于上述范围，将会使得导电浆料的流动性过大，无法在基材上稳定附着，也较难形成液态金属线路等结构。可选地，该导电浆料中粘度调节填料的重量百分比可以为4％、5％、6％、7％、8％、9％或者10％。
若导电浆料中导电填料的含量高于上述范围，将会使得导电浆料的粘度过大，且成本过高，若导电填料的含量低于上述范围，将会使得导电浆料的导电性能较差。可选地，该导电浆料中导电填料的重量百分比可以为4％、5％、6％、7％、8％、9％或者10％。
如图1所示，图1为本申请实施例提供的导电浆料的制备方法的流程图，导电浆料的制备方法包括：
步骤S1、按重量百分比称取镓基液态金属、粘度调节填料以及导电填料；
步骤S2、通过球磨或者捏合工艺，将镓基液态金属、粘度调节填料、以及导电填料混合均匀，得到导电浆料。
示例性地，球磨工艺中的工艺参数为：转速500转/分，球磨时间10-30分钟；捏合工艺中的工艺参数为转速50-60转/分，捏合时间2小时。
需要说明的是，该导电浆料中具体选择以上各具体组分的原因如下：
选择镓基液态金属的原因在于：镓基液态金属具有较低的熔点，室温下或者稍微加热即可熔化呈液态，易于使用导电浆料手绘制作液态金属线路等结构。
选择铁粉、镍粉、铁镍粉中的一种或几种作为粘度调节填料的原因如下：铁粉、镍粉、铁镍粉可以很好地调节导电浆料的粘度，使导电浆料不会因粘度过大而无法刷涂或手绘，也不会因粘度过小流动性过大，无法在基材上稳定附着，且成本较低。虽然在导电浆料中添加银粉、铜粉、银铜粉等也可以调节导电浆料的粘度，但是银粉、铜粉、银铜粉等容易生成大颗粒的化合物，增加导电浆料的颗粒感，以及降低导电浆料的性能的均一性，且成本较高。
选择银包铜粉作为导电填料的原因如下：银包铜粉具有较好的导电性，且成本较低，增加导电浆料的导电性的同时，保证了导电浆料的综合性能较好。虽然铜粉、银粉等也常作为导电填料，但发明人发现铜粉容易与镓反应生成铜镓化合物，使得导电浆料的导电性差，若为了保证导电性则需要添加大量的铜粉，会使得导电浆料易固化，而银粉则成本过高。
由以上所述可知，本申请实施例中的导电浆料易于熔化呈液态，且具有合适的粘度，且具有较好的电学性能(电导率在5×10 6S/m以上)，另外该导电浆料仅含有镓基液态金属、粘度调节填料以及导电填料这三种组分，无其他有机溶剂、分散剂、耦合剂、表面活性剂等组分，生物相容性较好，因此，该导电浆料可以通过刷涂、手绘等方式直接制作成液态金属线路，应用于可穿戴电子电路中，因此，本申请的技术方案能够简单地制作可穿戴电子电路，可操作性强，有助于满足用户对可穿戴电子装置的个性化需求。
可选地，本申请实施例中，镓基液态金属为镓单质(熔点29.8℃)，或者镓铟共晶合金(熔点15.5℃)，或者镓铟锡共晶合金(熔点11℃)。
发明人发现，当粘度调节填料为镍粉时，少量添加镍粉即可调节导电浆料的粘度，但较难对导电浆料的粘度进行精确控制，且在制备导电浆料 的过程中，镍粉易于和镓基液态金属发生合金化反应，得到部分合金化的产物，该部分合金化的产物会在室温下自发继续进行合金化反应，而使得导电浆料的粘度逐渐增加，不利于导电浆料的长期使用以及性能稳定。
当粘度调节填料为铁粉时，铁粉在存储过程中容易被氧化，较难制备导电浆料。
当粘度调节填料为铁镍粉时，添加铁镍粉后，导电浆料的粘度增加较为缓慢，易于精确控制，且由于铁镍粉中镍含量较少，在制备导电浆料的过程中，铁镍粉较难和镓基液态金属发生合金化反应，导电浆料可以长时间保持合适的粘度以及性能稳定。
基于以上考虑，本申请实施例提供几种可选的粘度调节填料的选择方式，以及对应的重量百分比。在一个例子中，粘度调节填料为铁镍粉，导电浆料包括5％粘度调节填料。在又一个例子中，粘度调节填料为镍粉，导电浆料包括4％粘度调节填料。
进一步地，在以上所述的两个例子中，导电浆料包括5％导电填料。
另外，粘度调节填料的粒径越小，其比表面积越大，其与镓基液态金属之间的接触面积越大，二者越容易混合，且对导电浆料的粘度的调节效果越明显，但粒径过小的粘度调节填料较难制备，成本较高。
本申请实施例中选择粘度调节填料的粒径为1～5微米，如2微米，以使得导电浆料较细腻，颗粒感较少，在人体皮肤等制作液态金属线路时，用户的体验好，且粘度调节填料易于制备、成本较低。
基于同样的考虑，本申请实施例中选择导电填料的粒径为1～5微米，如2微米，以使得导电浆料较细腻，颗粒感较少，在人体皮肤等制作液态金属线路时，用户的体验好，且导电填料易于制备、成本较低。
此外，本申请实施例提供了一种可穿戴电子电路，如图2和图3所示，图2为本申请实施例提供的可穿戴电子电路的俯视图，图3为本申请实施例提供的图2沿AA’方向的截面示意图，可穿戴电子电路包括：位于人体皮肤上的液态金属线路1，液态金属线路1由以上任一项所述的导电浆料制成。
具体地，如图2和图3所示，可穿戴电子电路包括：液态金属线路1，液态金属线路1位于皮肤上；电源2和至少一个元件3，电源2和至少一 个元件3均与液态金属线路1连接，电源2、液态金属线路1和至少一个元件3构成一个闭合回路；封装层4，封装层4覆盖于液态金属线路1、电源2和至少一个元件3上。
其中，电源2、液态金属线路1和至少一个元件3构成一个闭合回路，使可穿戴电子电路具有相应的功能，封装层4用于有效对液态金属线路1、电源2和至少一个元件3进行封装，有助于提高可穿戴电子电路的结构稳定性。
该可穿戴电子电路可以位于用户的手部、胳膊、脸部、腿部、脚部等任何可能的位置，本领域技术人员可以根据实际需要进行选择。
制作该可穿戴电子电路时，先确定可穿戴电子电路的穿戴位置，然后在穿戴位置对应的皮肤上，使用导电浆料制作液态金属线路1，并贴附电源2和至少一个元件3，然后形成封装层4，对液态金属线路1、电源2和至少一个元件3进行封装，即可完成可穿戴电子电路的制作。
使用导电浆料制作液态金属线路1之前，可以在穿戴位置对应的皮肤上，形成隔离层，隔离层具有生物相容性，且可粘附液态金属。隔离层的设置可以使得在人体皮肤上制作液态金属线路时，液态金属不会直接接触人体皮肤，不会对人体皮肤造成伤害，安全性更高。该隔离层可以为单层结构也可以为多层结构，例如该隔离层为双层结构时，底层(接触皮肤的一层)为生物相容性好的膜层，顶层(接触液态金属的一层)为可粘附液态金属以及封装层的膜层。
该可穿戴电子电路可以作为文化创意产品、美妆产品、个性装置、教学教具、监测电路、报警电路等，是电子爱好者、数码DIY爱好者，科普教育者、时尚追求者、电子研发人员等的福音。
此外，本申请实施例提供了一种可穿戴电子电路的DIY套件，可穿戴电子电路的DIY套件包括：手绘套件，手绘套件包括毛刷，以及以上任一项所述的导电浆料。
手绘套件还可以包括液态金属书写笔，和/或，可转印液态金属的***。
该DIY套件还可以包括贴附套件、封装套件、涂抹套件和修改套件中的一个或多个；其中，贴附套件包括贴附工具、电源和至少一个元件；封装套件包括盛放有封装材料的容器和封装工具；涂抹套件包括盛放有隔离 材料的容器和涂抹工具，若隔离材料为多种时，涂抹工具也应该有多个；修改套件包括液态金属擦除笔，该液态金属擦除笔可以将多余的液态金属线路擦除。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (16)

  1. 一种导电浆料，其特征在于，由镓基液态金属、粘度调节填料、以及导电填料组成；其中，按重量百分比计，所述导电浆料包括4％～10％粘度调节填料，4％～10％导电填料，余量为镓基液态金属；所述粘度调节填料为铁粉、镍粉、铁镍粉中的一种或几种，所述导电填料为银包铜粉。
  2. 根据权利要求1所述的导电浆料，其特征在于，所述镓基液态金属为镓单质，或者镓铟共晶合金，或者镓铟锡共晶合金。
  3. 根据权利要求1所述的导电浆料，其特征在于，所述粘度调节填料为铁镍粉，所述导电浆料包括5％粘度调节填料。
  4. 根据权利要求1所述的导电浆料，其特征在于，所述粘度调节填料为镍粉，所述导电浆料包括4％粘度调节填料。
  5. 根据权利要求3或4所述的导电浆料，其特征在于，所述导电浆料包括5％导电填料。
  6. 根据权利要求1所述的导电浆料，其特征在于，所述粘度调节填料的粒径为1～5微米。
  7. 根据权利要求6所述的导电浆料，其特征在于，所述粘度调节填料的粒径为2微米。
  8. 根据权利要求1所述的导电浆料，其特征在于，所述导电填料的粒径为1～5微米。
  9. 根据权利要求1所述的导电浆料，其特征在于，所述导电填料的粒径为2微米。
  10. 一种导电浆料的制备方法，用于制备如权利要求1～9任一项所述的导电浆料，其特征在于，所述制备方法包括：
    按重量百分比称取镓基液态金属、粘度调节填料以及导电填料；
    通过球磨或者捏合工艺，将所述镓基液态金属、所述粘度调节填料、以及所述导电填料混合均匀，得到所述导电浆料。
  11. 一种可穿戴电子电路，其特征在于，包括：
    位于人体皮肤上的液态金属线路，所述液态金属线路由如权利要求1～9任一项所述的导电浆料制成。
  12. 根据权利要求11所述的可穿戴电子电路，其特征在于，所述可穿戴电子电路还包括电源和至少一个元件，所述电源和至少一个元件均与所述液态金属线路连接，所述电源、液态金属线路和至少一个元件构成一个闭合回路。
  13. 根据权利要求12所述的可穿戴电子电路，其特征在于，所述可穿戴电子电路还包括封装层，所述封装层覆盖于所述液态金属线路、所述电源和至少一个元件上。
  14. 一种可穿戴电子电路的DIY套件，其特征在于，包括：手绘套件，所述手绘套件包括毛刷，以及如权利要求1～9任一项所述的导电浆料。
  15. 根据权利要求14所述的可穿戴电子电路的DIY套件，其特征在于，所述手绘套件还包括液态金属书写笔；和/或，
    所述手绘套件还包括***。
  16. 根据权利要求14所述的可穿戴电子电路的DIY套件，其特征在 于，所述DIY套件还包括贴附套件、封装套件、涂抹套件或修改套件中的至少一个。
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