WO2020113779A1 - 柔性触控显示模组 - Google Patents

柔性触控显示模组 Download PDF

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Publication number
WO2020113779A1
WO2020113779A1 PCT/CN2019/071598 CN2019071598W WO2020113779A1 WO 2020113779 A1 WO2020113779 A1 WO 2020113779A1 CN 2019071598 W CN2019071598 W CN 2019071598W WO 2020113779 A1 WO2020113779 A1 WO 2020113779A1
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Prior art keywords
layer
display module
touch display
touch
photo
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PCT/CN2019/071598
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English (en)
French (fr)
Inventor
李波
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武汉华星光电半导体显示技术有限公司
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Priority to US16/325,405 priority Critical patent/US11402954B2/en
Publication of WO2020113779A1 publication Critical patent/WO2020113779A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8793—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present application relates to the field of display technology, in particular to a flexible touch display module.
  • AMOLED active matrix organic light-emitting diode display
  • TFT-LCD thin film transistor liquid crystal display
  • AMOLED screens are mainly divided into rigid screens used in the low-end and flexible screens used in the high-end.
  • the rigid screen uses two pieces of glass, TFT devices and OLED light-emitting layers and other key components on the first glass substrate, and then The encapsulated glass is attached to the OLED display panel after all devices are manufactured to protect the display device and enhance the reliability of the product; the flexible screen directly uses PI (polyimide) as the AMOLED display panel, and TFE (thin film encapsulation layer) instead of packaging Glass, this structure can effectively reduce the thickness of the product, and can achieve flexible display, so it is the main direction of current technology development.
  • PI polyimide
  • TFE thin film encapsulation layer
  • plug-in touch screen technology is to attach the touch screen with a thin film substrate to the touch module and the OLED display module by optical adhesive bonding
  • the disadvantage is that the thickness of the product will be significantly increased
  • On-cell technology is to make the touch circuit on the encapsulating glass or TFE packaging layer, which is reduced compared to the external touch screen technology.
  • a layer of film substrate can effectively reduce the thickness of the product and reduce costs, but the technical difficulty is relatively higher.
  • a polarizer needs to be attached on the display module.
  • the existing polarizer includes a four-layer film structure, and the overall thickness is thick, which does not conform to the technical trend of thinning and thinning of products.
  • the existing flexible touch display module due to the need to attach a polarizer above the display module, increases the thickness of the flexible touch display module and further increases the production cost of the flexible touch display module .
  • the existing flexible touch display module requires a polarizer to be attached to the display module, which increases the thickness of the flexible touch display module and further increases the production cost of the flexible touch display module.
  • This application provides a flexible touch display module, which can effectively reduce the thickness of the flexible touch display module, to solve the existing flexible touch display module, due to the need to attach a polarizer above the display module, increase The thickness of the flexible touch display module further increases the technical cost of production of the flexible touch display module.
  • the polarizing film layer includes an adhesive layer, a photo-alignment layer and a protective layer, the photo-alignment layer is disposed on the touch layer, and the adhesive layer is disposed on the touch layer and the photo-alignment Between the layers, so that the photo-alignment layer is adhered to the touch layer, the protective layer is disposed on the photo-alignment layer, and the adhesive layer is a pressure-sensitive optical adhesive or a photosensitive liquid substrate.
  • the material of the photosensitive liquid substrate is polyacrylic acid.
  • the material of the photo-alignment layer is polyvinyl alcohol.
  • the protective layer is organic photoresist or silicon nitride.
  • the touch layer is provided with touch electrodes cured by conductive network members.
  • the thin film encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer that are stacked.
  • the touch layer is disposed on the surface of the second inorganic encapsulation layer.
  • the material of the first inorganic encapsulation layer is one or more of silicon nitride, silicon dioxide, aluminum oxide, titanium dioxide, and zirconium dioxide. More than two combinations.
  • the material of the organic encapsulation layer is an acrylate polymer, the material of the second inorganic encapsulation layer and the material of the first inorganic encapsulation layer the same.
  • the present application also provides a flexible touch display module, including: an array substrate, an OLED light emitting layer, a thin film encapsulation layer, a touch layer, and a polarizing film layer;
  • the polarizing film layer includes an adhesive layer, a photo-alignment layer and a protective layer, the photo-alignment layer is disposed on the touch layer, and the adhesive layer is disposed on the touch layer and the photo-alignment Between the layers, so that the photo alignment layer is adhered to the touch control layer, and the protective layer is disposed on the photo alignment layer.
  • the material of the photo-alignment layer is polyvinyl alcohol.
  • the protective layer is organic photoresist or silicon nitride.
  • the touch layer is provided with touch electrodes cured by conductive network members.
  • the thin film encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer that are stacked.
  • the touch layer is disposed on the surface of the second inorganic encapsulation layer.
  • the material of the first inorganic encapsulation layer is one or more of silicon nitride, silicon dioxide, aluminum oxide, titanium dioxide, and zirconium dioxide. More than two combinations.
  • the material of the organic encapsulation layer is an acrylate polymer, the material of the second inorganic encapsulation layer and the material of the first inorganic encapsulation layer the same.
  • the beneficial effects of the present application are: the flexible touch display module provided by the present application, the touch layer, the light alignment layer and the protective layer are made on the thin film encapsulation layer of the touch display module, avoiding the external polarizer and plug-in type
  • the touch screen further reduces the number of module fittings, and further reduces the overall thickness of the flexible touch display module.
  • FIG. 1 is a schematic structural diagram of a solution 1 of a flexible touch display module of the present application.
  • FIG. 2 is a schematic structural diagram of a second solution of the flexible touch display module of the present application.
  • the present application is directed to the existing flexible touch display module. Since the polarizer needs to be attached on the display module, the thickness of the flexible touch display module is increased, and the technology of the production cost of the flexible touch display module is further increased Problem, this embodiment can solve this defect.
  • FIG. 1 it is a schematic structural diagram of a solution 1 of a flexible touch display module according to an embodiment of the present application.
  • the flexible touch display module according to the present application can be applied to electronic devices requiring display screens such as notebook computers, smart phones, and tablet computers.
  • a flexible touch display module includes: the present application provides a flexible touch display module, including: an array substrate 10, an OLED light emitting layer 20, a thin film encapsulation layer 30, and a touch layer 40 and polarizing film layer 50;
  • the polarizing film layer 50 includes an adhesive layer 51, a photo alignment layer 52, and a protective layer 53, the photo alignment layer 52 is disposed on the touch layer 40, and the adhesive layer 51 is disposed on the touch Between the control layer 40 and the photo-alignment layer 52, the photo-alignment layer 52 is adhered to the touch-control layer 40, and the protective layer 53 is disposed on the photo-alignment layer.
  • the array substrate 10 includes a display area and a non-display area at one end of the display area.
  • the OLED light emitting layer 20 is disposed in the display area of the array substrate 10.
  • the OLED light-emitting layer 20 may include a plurality of organic electroluminescent structures composed of an anode, a cathode, and a light-emitting layer between the anode and the cathode arranged in an array, wherein The electrons and the holes in the anode recombine in the OLED light-emitting layer 20 to excite the organic material of the OLED light-emitting layer 20 to emit light.
  • the thin-film encapsulation layer 30 is disposed on the array substrate 10, and the thin-film encapsulation layer 30 is coated on the outside of the OLED light-emitting layer 20.
  • the thin film encapsulation layer 30 includes a first inorganic encapsulation layer 31, a first organic encapsulation layer 32 and a second inorganic encapsulation layer 33 which are stacked;
  • the material of the first inorganic encapsulation layer 31 is silicon nitride and dioxide Silicon, aluminum oxide, titanium dioxide, zirconium dioxide, etc., or a combination of any two or more;
  • the material of the organic encapsulation layer 32 is an acrylate polymer, and the material of the second inorganic encapsulation layer 33
  • the material of the first inorganic encapsulation layer is the same; the thickness of the second inorganic encapsulation layer 33 is the same as the thickness of the first inorganic encapsulation layer 31.
  • the touch control layer 40 is disposed on the surface of the second inorganic encapsulation layer 33.
  • the touch control layer 40 is provided with touch electrodes cured by conductive network members.
  • the number of the touch electrodes can be set according to actual needs, and this application is not specifically limited.
  • the polarizing film layer 50 is disposed on the touch layer 40.
  • the arrangement of the polarizing film layer 50 is to reduce the ambient light reflected by the OLED display and reduce the display contrast and visibility.
  • the polarizing film layer 50 includes: an adhesive layer 51, a photo-alignment layer 52, and a protective layer 53.
  • the light alignment layer 52 is disposed on the surface of the touch control layer 40.
  • the main function of the light alignment layer 52 is to convert natural light passing through the light alignment layer 52 into linearly polarized light;
  • the previously linearly polarized light is in a vertical state, so that reflected light cannot be transmitted through the light alignment layer 52, thereby reducing the influence of ambient light and improving contrast;
  • the material of the light alignment layer 52 is polyvinyl alcohol.
  • the adhesive layer 51 is disposed between the touch layer 40 and the photo-alignment layer 52 so that the touch electrodes on the touch layer 40 are adhered to the photo-alignment layer 52.
  • the size of the adhesive layer 51 is slightly smaller than the size of the photo-alignment layer 52, that is, the projection of the adhesive layer 51 on the photo-alignment layer 52 is completely within the photo-alignment layer 52.
  • the adhesive layer 51 is preferably a pressure-sensitive optical adhesive.
  • the protective layer 53 is located on the surface of the photo-alignment layer 52, and the protective layer is organic photoresist or silicon nitride; the role of the protective layer 53 is mainly to protect the touch layer 40 and the photo-alignment layer 52 Avoid contact with external water vapor.
  • an array substrate 10 is first provided.
  • the array substrate 10 includes a display area and a non-display area at one end of the display area.
  • the OLED light emitting layer 20 is deposited in the display area of the array substrate 10, and the thin film encapsulation layer 30 is deposited on the surface of the array substrate 10.
  • the thin-film encapsulation layer 30 completely covers the OLED light-emitting layer 20; the thin-film encapsulation layer 30 includes a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 that are stacked.
  • a touch-sensitive circuit is formed on the surface of the second inorganic encapsulation layer 33 to form the touch layer 40, and the touch layer 40 includes a plurality of touch electrodes;
  • the polarizing film layer 50, the polarizing film layer 50 includes: an adhesive layer 51, a photo-alignment layer 52 and a protective layer 53; wherein, the adhesive layer 51 is a pressure-sensitive optical adhesive, the adhesive layer 51 can be The photo-alignment layer 52 and the touch-control layer 40 are bonded together; the protective layer 53 is disposed on the surface of the photo-alignment layer 52 to protect the touch-control layer 40 and the photo-alignment layer 52 Free from external moisture and oxygen.
  • an optical glue 60 is used to bond a protective cover 70 to the surface of the protective layer 53 to obtain the flexible touch display module of the first solution of the present application.
  • the flexible touch display module of solution 1 of the present application uses pressure-sensitive optical adhesive to bond the light alignment layer 52 and the touch layer 40 together, without the need for external polarizers and external touch screens, which is greatly reduced The number of times the module is attached effectively reduces the overall thickness of the touch display module.
  • FIG. 2 it is a schematic structural view of the second solution of the flexible touch display module of the present application, which differs from the first solution of the flexible touch display module of the present application only in that the material of the adhesive layer 51 is different;
  • the bonding layer 51 is a photosensitive liquid substrate, preferably polyacrylic acid, and the adhesive layer 51 presses the photo-alignment layer 52 that has been stretched and aligned with the touch layer 40 on the AMOLED display screen.
  • ultraviolet light is used to complete curing, and then the protective layer 53 is formed on the photo-alignment layer 52, and the material of the protective layer 53 is organic photoresist or silicon nitride.
  • This solution avoids the pressure-sensitive optical adhesive bonding process in solution one, and can achieve complete adhesion of the light alignment layer 52 and the touch control layer 40 on the AMOLED display screen, enhancing product reliability.
  • the beneficial effects of the present application are: the flexible touch display module provided by the present application, the touch layer, the light alignment layer and the protective layer are made on the thin film encapsulation layer of the touch display module, avoiding the external polarizer and plug-in type
  • the touch screen further reduces the number of module fittings, and further reduces the overall thickness of the flexible touch display module.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polarising Elements (AREA)

Abstract

一种柔性触控显示模组，包括：阵列基板、OLED发光层、薄膜封装层、触控层以及偏光膜层；其中，所述偏光膜层包括粘合层、光取向层以及保护层，所述光取向层设置于所述触控层上，所述粘合层设置于所述触控层与所述光取向层之间，以使所述光取向层粘合于所述触控层上，所述保护层设置于所述光取向层上。

Description

柔性触控显示模组 技术领域
本申请涉及显示技术领域，尤其涉及一种柔性触控显示模组。
 背景技术
目前因AMOLED（主动矩阵有机发光二极体显示屏）显示技术相对于TFT-LCD（薄膜晶体管液晶显示屏）显示技术具有能耗低、色彩对比度高、视角广等优点而被市场和消费者认同，同时也因其可以实现轻薄化和柔性设计，也为整机设计方案带来更多创新空间。目前AMOLED屏幕主要分为用于中低端的刚性屏和用于高端的柔性屏，刚性屏采用两片玻璃，TFT器件和OLED发光层等关键元器件制作在第一层玻璃基板上，然后在完成全部器件制作的OLED显示面板上贴合封装玻璃将显示器件保护起来，增强产品可靠度；柔性屏直接采用PI（聚酰亚胺）作为AMOLED的显示面板，采用TFE（薄膜封装层）代替封装玻璃，这种结构可以有效降低产品厚度，而且可以实现柔性显示，因而是当前技术发展的主要方向。搭配这两种显示技术的触摸屏技术分别是外挂式和on-cell触摸屏技术：外挂式触摸屏技术是将带有薄膜基板的触摸屏通过光学胶贴合的方式将触控模组和OLED显示模组贴合到一起，该技术难度和成本都相对较低，缺点是会明显增加产品厚度；On-cell技术是将触控线路制作到封装玻璃或者TFE封装层上，相比于外挂式触摸屏技术减少了一层薄膜基材，可以有效减薄产品厚度和降低成本，但技术难度相对高一些。以上无论哪种方案，为了确保显示屏的显示效果，都需要在显示模组上方贴合偏光片。现有的偏光片包含四层膜结构，整体厚度较厚，不符合产品轻薄化的技术趋势。
综上所述，现有的柔性触控显示模组，由于需要在显示模组上方贴合偏光片，增加了柔性触控显示模组的厚度，进一步增加了柔性触控显示模组的生产成本。
 技术问题
现有的柔性触控显示模组，由于需要在显示模组上方贴合偏光片，增加了柔性触控显示模组的厚度，进一步增加了柔性触控显示模组的生产成本。
 技术解决方案
本申请提供一种柔性触控显示模组，能够有效降低了柔性触控显示模组的厚度，以解决现有的柔性触控显示模组，由于需要在显示模组上方贴合偏光片，增加了柔性触控显示模组的厚度，进一步增加了柔性触控显示模组的生产成本技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种柔性触控显示模组，包括：阵列基板、OLED发光层、薄膜封装层、触控层以及偏光膜层；
其中，所述偏光膜层包括粘合层、光取向层以及保护层，所述光取向层设置于所述触控层上，所述粘合层设置于所述触控层与所述光取向层之间，以使所述光取向层粘合于所述触控层上，所述保护层设置于所述光取向层上，所述粘合层为压敏光学胶或光敏液态基底。
在本申请实施例所提供的柔性触控显示模组中，所述光敏液态基底的材质为聚丙烯酸。
在本申请实施例所提供的柔性触控显示模组中，所述光取向层的材质为聚乙烯醇。
在本申请实施例所提供的柔性触控显示模组中，所述保护层为有机光阻或氮化硅。
在本申请实施例所提供的柔性触控显示模组中，所述触控层上设置有经过导电网络构件固化而成的触控电极。
在本申请实施例所提供的柔性触控显示模组中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
在本申请实施例所提供的柔性触控显示模组中，所述触控层设置于所述第二无机封装层的表面上。
在本申请实施例所提供的柔性触控显示模组中，所述第一无机封装层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
在本申请实施例所提供的柔性触控显示模组中，所述有机封装层的材质为烯酸酯类聚合物，所述第二无机封装层的材质与所述第一无机封装层的材质相同。
本申请还提供一种柔性触控显示模组，包括：阵列基板、OLED发光层、薄膜封装层、触控层以及偏光膜层；
其中，所述偏光膜层包括粘合层、光取向层以及保护层，所述光取向层设置于所述触控层上，所述粘合层设置于所述触控层与所述光取向层之间，以使所述光取向层粘合于所述触控层上，所述保护层设置于所述光取向层上。
在本申请实施例所提供的柔性触控显示模组中，所述光取向层的材质为聚乙烯醇。
在本申请实施例所提供的柔性触控显示模组中，所述保护层为有机光阻或氮化硅。
在本申请实施例所提供的柔性触控显示模组中，所述触控层上设置有经过导电网络构件固化而成的触控电极。
在本申请实施例所提供的柔性触控显示模组中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
在本申请实施例所提供的柔性触控显示模组中，所述触控层设置于所述第二无机封装层的表面上。
在本申请实施例所提供的柔性触控显示模组中，所述第一无机封装层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
在本申请实施例所提供的柔性触控显示模组中，所述有机封装层的材质为烯酸酯类聚合物，所述第二无机封装层的材质与所述第一无机封装层的材质相同。
 有益效果
本申请的有益效果为：本申请提供的柔性触控显示模组，在触控显示模组的薄膜封装层上制作触控层、光取向层以及保护层，避免了外贴偏光片和外挂式触摸屏，进一步减少了模组贴合次数，更进一步降低了柔性触控显示模组的整体厚度。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请柔性触控显示模组方案一结构示意图。
图2为本申请柔性触控显示模组方案二结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的柔性触控显示模组，由于需要在显示模组上方贴合偏光片，增加了柔性触控显示模组的厚度，进一步增加了柔性触控显示模组的生产成本的技术问题，本实施例能够解决该缺陷。
如图1所示是根据本申请实施例的柔性触控显示模组方案一的结构示意图。需要说明的是，根据本申请的柔性触控显示模组可应用于笔记本电脑、智能手机、平板电脑等需要使用显示屏的电子设备中。
参照图1，根据本申请的实施例的柔性触控显示模组包括：本申请提供一种柔性触控显示模组，包括：阵列基板10、OLED发光层20、薄膜封装层30、触控层40以及偏光膜层50；
其中，所述偏光膜层50包括粘合层51、光取向层52以及保护层53，所述光取向层52设置于所述触控层40上，所述粘合层51设置于所述触控层40与所述光取向层52之间，以使所述光取向层52粘合于所述触控层40上，所述保护层53设置于所述光取向层上。
具体地，所述阵列基板10包括显示区域以及位于显示区域一端的非显示区域。
所述OLED发光层20设置于所述阵列基板10的所述显示区域中。在本申请的实施例中，所述OLED发光层20可以包括阵列排布的多个由阳极、阴极以及位于阳极和阴极之间的发光层所组成的有机电致发光结构，其中通过阴极中的电子和阳极中的空穴在所述OLED发光层20中复合，以激发所述OLED发光层20的有机材料实现发光来。
所述薄膜封装层30设置于所述阵列基板10上，并且所述薄膜封装层30包覆在所述OLED发光层20的外侧。其中，所述薄膜封装层30包括层叠设置的第一无机封装层31、第一有机封装层32以及第二无机封装层33；所述第一无机封装层31的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合；所述有机封装层32的材质为烯酸酯类聚合物，所述第二无机封装层33的材质与所述第一无机封装层的材质相同；所述第二无机封装层33的厚度与所述所述第一无机封装层31的厚度相同。
所述触控层40设置于所述第二无机封装层33的表面，所述触控层40上设置有经过导电网络构件固化而成的触控电极。所述触控电极的数量可以根据实际需求而设定，本申请并不作具体限定。
所述偏光膜层50设置于所述触控层40上。所述偏光膜层50的设置，是为了降低环境光被OLED显示器反射而降低显示对比度和可视性。作为本申请的所述偏光膜层50的一实施方式，所述偏光膜层50包括：粘合层51、光取向层52以及保护层53。
所述光取向层52设置于所述触控层40的表面，所述光取向层52的主要作用是将通过所述光取向层52的自然光转变为线偏振光；此时的线偏振光与之前的线偏振光呈垂直状态，这样反射光就不能够从所述光取向层52透过，从而减小环境光的影响，提高对比度；所述光取向层52的材质为聚乙烯醇。
所述粘合层51设置于所述触控层40与所述光取向层52之间，以使所述触控层40上的所述触控电极粘合于所述光取向层52。其中所述粘合层51的尺寸要略小于所述光取向层52的尺寸，即所述粘合层51在所述光取向层52上的投影完全位于所述光取向层52内。在本方案一实施例中，所述粘合层51优选为压敏光学胶。
所述保护层53位于所述光取向层52的表面，所述保护层为有机光阻或氮化硅；所述保护层53的作用主要是保护所述触控层40以及所述光取向层52避免与外界水汽的接触。
当制备本申请实施例的柔性触控显示模组方案一时，首先提供一阵列基板10，所述阵列基板10包括显示区域以及位于所述显示区域一端的非显示区域。
之后，在所述阵列基板10的所述显示区域内沉积所述OLED发光层20，在所述阵列基板10的表面沉积所述薄膜封装层30。所述薄膜封装层30完全覆盖所述OLED发光层20；所述薄膜封装层30包括层叠设置的第一无机封装层31、有机封装层32以及第二无机封装层33。
然后在所述第二无机封装层33的表面制作触控感性电路，形成所述触控层40，所述触控层40包括若干个触控电极；在所述触控层40的表面设置所述偏光膜层50，所述偏光膜层50包括：粘合层51、光取向层52以及保护层53；其中，所述粘合层51为压敏光学胶，所述粘合层51可以将所述光取向层52与所述触控层40粘结在一起；所述保护层53设置于所述光取向层52的表面，起到保护所述触控层40以及所述光取向层52免受外界水分和氧气的腐蚀。
最后，利用一光学胶60将一保护盖板70粘接到所述保护层53的表面，得到本申请方案一的柔性触控显示模组。本申请方案一的柔性触控显示模组通过利用压敏光学胶将所述光取向层52与所述触控层40粘接在一起，不需要再外贴偏光片以及外挂式触摸屏，大大减少了模组贴合次数，有效降低了触控显示模组的整体厚度。
如图2所示为本申请柔性触控显示模组方案二结构示意图，其与本申请柔性触控显示模组方案一的不同之处仅在于粘合层51的材质不同；其中，所述粘合层51为一层光敏液态基底，优选为聚丙烯酸，所述粘合层51将完成拉伸取向的所述光取向层52与AMOLED显示屏上的所述触控层40压合到一起，并同时利用紫外光完成固化，然后在所述光取向层52上方制作所述保护层53，所述保护层53的材质为有机光阻或者氮化硅。
本方案避免了方案一中的压敏光学胶贴合工艺，可以实现所述光取向层52与所述AMOLED显示屏上的所述触控层40的完全粘合，增强产品可靠性。
本申请的有益效果为：本申请提供的柔性触控显示模组，在触控显示模组的薄膜封装层上制作触控层、光取向层以及保护层，避免了外贴偏光片和外挂式触摸屏，进一步减少了模组贴合次数，更进一步降低了柔性触控显示模组的整体厚度。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种柔性触控显示模组，其中，包括：
    阵列基板；
    OLED发光层，设置在所述阵列基板表面；
    薄膜封装层，设置在所述OLED发光层表面；
    触控层，设置于所述薄膜封装层上；
    偏光膜层，设置于所述触控层上；
    其中，所述偏光膜层包括粘合层、光取向层以及保护层，所述光取向层设置于所述触控层上，所述粘合层设置于所述触控层与所述光取向层之间，以使所述光取向层粘合于所述触控层上，所述保护层设置于所述光取向层上，所述粘合层为压敏光学胶或光敏液态基底。
  2. 根据权利要求1所述的柔性触控显示模组，其中，所述光敏液态基底的材质为聚丙烯酸。
  3. 根据权利要求1所述的柔性触控显示模组，其中，所述光取向层的材质为聚乙烯醇。
  4. 根据权利要求1所述的柔性触控显示模组，其中，所述保护层为有机光阻或氮化硅。
  5. 据权利要求1所述的柔性触控显示模组，其中，所述触控层上设置有经过导电网络构件固化而成的触控电极。
  6. 根据权利要求1所述的柔性触控显示模组，其中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
  7. 根据权利要求6所述的柔性触控显示模组，其中，所述触控层设置于所述第二无机封装层的表面上。
  8. 根据权利要求6所述的柔性触控显示模组，其中，所述第一无机封装层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
  9. 根据权利要求6所述的柔性触控显示模组，其中，所述有机封装层的材质为烯酸酯类聚合物，所述第二无机封装层的材质与所述第一无机封装层的材质相同。
  10. 一种柔性触控显示模组，其中，包括：
    阵列基板；
    OLED发光层，设置在所述阵列基板表面；
    薄膜封装层，设置在所述OLED发光层表面；
    触控层，设置于所述薄膜封装层上；
    偏光膜层，设置于所述触控层上；
    其中，所述偏光膜层包括粘合层、光取向层以及保护层，所述光取向层设置于所述触控层上，所述粘合层设置于所述触控层与所述光取向层之间，以使所述光取向层粘合于所述触控层上，所述保护层设置于所述光取向层上。
  11. 根据权利要求10所述的柔性触控显示模组，其中，所述光取向层的材质为聚乙烯醇。
  12. 根据权利要求10所述的柔性触控显示模组，其中，所述保护层为有机光阻或氮化硅。
  13. 据权利要求10所述的柔性触控显示模组，其中，所述触控层上设置有经过导电网络构件固化而成的触控电极。
  14. 根据权利要求10所述的柔性触控显示模组，其中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
  15. 根据权利要求14所述的柔性触控显示模组，其中，所述触控层设置于所述第二无机封装层的表面上。
  16. 根据权利要求14所述的柔性触控显示模组，其中，所述第一无机封装层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
  17. 根据权利要求14所述的柔性触控显示模组，其中，所述有机封装层的材质为烯酸酯类聚合物，所述第二无机封装层的材质与所述第一无机封装层的材质相同。
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