WO2020103157A1 - 主机 - Google Patents
主机Info
- Publication number
- WO2020103157A1 WO2020103157A1 PCT/CN2018/117298 CN2018117298W WO2020103157A1 WO 2020103157 A1 WO2020103157 A1 WO 2020103157A1 CN 2018117298 W CN2018117298 W CN 2018117298W WO 2020103157 A1 WO2020103157 A1 WO 2020103157A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- chassis
- circuit board
- wall
- connection surface
- Prior art date
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
Definitions
- the present disclosure relates to the field of chassis heat dissipation, and particularly to a host.
- Computing devices often have a host that controls the operation of other devices.
- the host generally includes a chassis and a circuit board disposed in the chassis; the circuit board is provided with a chip, and a plurality of heat sinks are provided on the chip to dissipate heat for the chip.
- the heat sink is combined with the chip on the circuit board and placed in the chassis, and the heat is transferred to the outside world by convection through the fan.
- An embodiment of the present disclosure provides a host, including: a chassis and at least one circuit board disposed inside the chassis; a heat conducting member is provided on an inner wall of the chassis, the chassis and the circuit board adjacent to the inner wall of the chassis The first heat sink is connected through the heat conducting member.
- the heat conducting member includes a first heat conducting plate, and the first heat conducting plate has a heat dissipation surface, and the heat dissipation surface is connected to the inner wall of the chassis.
- a second heat conducting plate is provided on the first heat sink on the circuit board close to the inner wall of the chassis, and the second heat conducting plate has a second connection surface, the The first heat conduction plate has a first connection surface opposite to the heat dissipation surface, and the first connection surface is connected to the second connection surface.
- the first connection surface and the second connection surface are connected by a thermally conductive medium.
- the thermally conductive medium is thermally conductive silica gel.
- the first connection surface is inclined relative to the inner wall of the chassis, and the second connection surface is in contact with the first connection surface.
- the second heat-conducting plate and the first heat sink are connected by welding.
- both the first thermally conductive plate and the second thermally conductive plate are copper plates.
- a plurality of heat dissipation fins are provided on the outer wall of the chassis, and the heat dissipation fins are integrally formed with the chassis.
- the circuit board is further provided with a second heat sink; the first heat sink is connected to one side of the circuit board, and the second heat sink is connected to the circuit board The other side is connected.
- the host provided by the embodiment of the present disclosure connects the inner wall of the chassis with the first heat sink on the circuit board adjacent to the inner wall of the chassis through a heat conducting member; compared with the first heat sink in the prior art that only releases heat to the inside of the chassis, The host provided in this embodiment releases the heat generated by the chip to the inside of the chassis at the same time as the first heat sink, and also transfers the heat to the chassis through the heat conducting member, and then releases the air from the side wall of the chassis to the air outside the chassis, which accelerates the chip The rate at which the generated heat is released into the air outside the chassis.
- the heat dissipation effect is better, avoiding overheating of the circuit board, so as not to affect the work of the host.
- FIG. 1 is a schematic structural diagram of a host provided by this embodiment
- FIG. 2 is a schematic structural diagram of the chassis in FIG. 1.
- FIG. 1 is a schematic structural diagram of a host provided in this embodiment
- FIG. 2 is a schematic structural diagram of the chassis in FIG. 1.
- This embodiment provides a host, including: a chassis 10 and at least one circuit board 20 disposed inside the chassis 10; a heat conducting member is disposed on an inner wall of the chassis 10, and the first heat dissipation on the circuit board 20 adjacent to the inner wall of the chassis 10 is provided on the chassis 10
- the device 201 is connected by a heat conducting member.
- the shape of the chassis 10 may be a rectangular parallelepiped or a rectangular parallelepiped.
- the chassis 10 has a receiving cavity, and the circuit board 20 is disposed in the receiving cavity.
- a plurality of side plates surround the case 10 and the accommodating cavity for accommodating the circuit board 2; a certain side plate and the case 10 may be connected by bolts or snap-fit It can be connected in a detachable manner so that the side plate can be removed from the chassis 10, and then the circuit board 20 can be installed or replaced.
- the position of the circuit board 20 in the accommodating cavity may be various.
- the circuit board 20 in this embodiment may be perpendicular to the first side 102 and parallel to the first side in the accommodating cavity 102 is disposed adjacent to the second side 103, and the corresponding heat conducting member is disposed on the second side 103; or the circuit board 20 is disposed parallel to the first side 102, and at this time, the heat conducting member is disposed on the bottom surface of the accommodating cavity opposite to the first side 102 105 on.
- the circuit board 20 may also be disposed parallel to the first side 102, and the heat conducting member may be disposed on the side wall of the side panel facing the receiving cavity.
- circuit board 20 there may be various connection methods between the circuit board 20 and the chassis 10, as long as the circuit board 20 can be prevented from moving inside the chassis 10; for example, the circuit board 20 can be connected to the chassis 10 by bolting Inside; or the circuit board 20 is connected to the chassis 10 by snapping.
- the heat conducting member may include a first heat conducting plate 101, and the first heat conducting plate 101 has a heat dissipation surface The heat dissipation surface is connected to the inner wall of the chassis 10; the heat in the first heat sink 201 is transferred to the chassis 10 through the heat conducting member.
- the first heat-conducting plate 101 may be connected to the inner wall of the cabinet 10 by welding, clamping, or bolting, or the heat dissipation surface of the first heat-conducting plate 101 may be connected to the inner wall of the cabinet 10 by adhesive glue;
- the board 101 is connected to the inner wall of the chassis 10 by welding, clamping, or bolting, it is necessary to ensure that the heat dissipation surface on the first heat-conducting plate 101 is close to the inner wall of the chassis 10 to ensure that the heat in the first heat-conducting plate 101 can be quickly Is transferred to the chassis 10;
- thermally conductive silicone is preferably used to further increase the heat transfer rate between the first heat-conducting plate 101 and the chassis 10.
- first heat sinks 201 there may be a plurality of first heat sinks 201 disposed on the surface of the circuit board 20 adjacent to the inner wall of the chassis 10; for example, when a plurality of chips are arranged on the circuit board 20 at intervals, the corresponding A plurality of first heat sinks 201 are provided at the upper interval, and each first heat sink 201 corresponds to a chip.
- a plurality of first heat conduction plates 101 may be provided on the inner wall of the chassis 10 at intervals.
- a heat conduction plate 101 is connected to a first heat sink 201; or only one first heat conduction plate 101 is provided on the inner wall of the chassis 10, and a plurality of first heat sinks 201 are all connected to the first heat conduction plate 101.
- the number of the first heat sinks 201 provided on the circuit board 20 may be one.
- a first thermal conductive plate 101 may be provided on the inner wall of the chassis 10, and of course, the inner wall of the chassis 10
- a plurality of first heat-conducting plates 101 are arranged at intervals, and the plurality of first heat-conducting plates 101 are all connected to the first heat sink 201.
- the structure of the first heat sink 201 can be various, as long as the heat generated by the chip on the circuit board 20 can be transferred to the heat conducting member and the air; for example: the first heat sink 201 includes multiple parallel A heat sink is provided, one end of the heat sink is connected to the circuit board 20, and the other end of the heat sink is connected to the heat conducting member; of course, the first heat sink 201 may also include a heat sink, one side of the heat sink is connected to the circuit board 20, the heat sink The other side opposite to the side is connected to the heat conducting member; a plurality of heat dissipation holes are arranged at intervals on the heat dissipation plate to increase the contact area between the heat dissipation plate and the air; specifically, the cross section of the heat dissipation hole can be round, rectangular, or regular six sides Shape or other regular shapes, or the cross-section of the heat dissipation holes is other irregular shapes.
- the host provided in this embodiment may further include a fan.
- an air outlet is opened on the side wall of the chassis 10, and the fan is provided in the air outlet. It is transported to the outside of the cabinet 10 to cool the inside of the cabinet 10.
- the working process of the host is: when the host works, the chips on the circuit board 20 generate heat, and the heat is transferred to the first radiator 201, and the first radiator 201 releases a part of the heat into the air inside the chassis 10 At the same time, the first heat sink 201 transfers part of the heat to the chassis 10 through the heat conducting member, and then releases the heat to the air outside the chassis 10 through the chassis 10 to cool the chips on the circuit board 20.
- the host provided in this embodiment connects the inner wall of the chassis 10 to the first heat sink 201 on the circuit board 20 adjacent to the inner wall of the chassis 10 through a heat conducting member; and the first heat sink 201 in the prior art only releases heat to the chassis 10 Compared to the inside, the host provided in this embodiment not only releases the heat generated by the chip to the inside of the chassis 10 while the first heat sink 201 also transfers the heat to the side wall of the chassis 10 through the heat conducting member, and then is released by the side wall of the chassis 10 Into the air outside the chassis 10, the rate at which the heat generated by the chip is released into the air outside the chassis 10 is accelerated, the heat dissipation effect is better, and the circuit board 20 is prevented from overheating, so as not to affect the work of the host.
- the first heat-conducting plate 101 may be directly connected to the first heat sink 201, in which case the first heat-conducting plate 101 may be in contact with the first heat sink 201, or the first heat-conducting plate 101 may be welded. It can be connected to the first heat sink 201 as long as the heat in the first heat sink 201 can be transferred to the first heat-conducting plate 101.
- the first heat-conducting plate 101 can also be indirectly connected to the first heat sink 201; for example, the first heat sink 201 on the circuit board 20 adjacent to the inner wall of the chassis 10 is provided with a second heat conduction
- the first heat conduction plate 101 has a first connection surface opposite to the heat dissipation surface
- the second heat conduction plate 30 has a second connection surface
- the first connection surface is connected to the second connection surface.
- the first heat-conducting plate 101 is connected to the first heat sink 201 through the second heat-conducting plate 30, which increases the contact area between the first heat-conducting plate 101 and the first heat-sink 201 to improve the connection between the first heat-sink 201 and the first heat-conducting plate The rate of heat transfer between 101.
- the first heat-conducting plate 101 may also be indirectly connected to the first heat sink 201 in other ways, for example, between the first heat-conducting plate 101 and the first heat sink 201 through thermally conductive silicone.
- first connection surface of the first heat-conducting plate 101 and the second connection surface of the second heat-conducting plate 30 can be directly connected, for example: the first connection surface is in contact with the second connection surface; The heat in the board 30 can be transferred to the first heat-conducting board 101.
- first connection surface of the first heat conduction plate 101 and the second connection surface of the second heat conduction plate 30 may also be indirectly connected, for example: the first connection surface and the second connection surface are connected by a heat conductive medium .
- the heat transfer medium can accelerate the heat transfer rate between the first connection surface and the second connection surface, so that the heat in the second heat conduction plate 30 can be quickly transferred to the first heat conduction plate 101.
- the thermally conductive medium is thermally conductive silica gel.
- the thermal conductivity of the thermally conductive silica gel is faster, which can further accelerate the heat transfer rate between the first connection surface and the second connection surface.
- the heat conducting medium in the embodiment may also be other materials, as long as the heat transfer rate between the first connection surface and the second connection surface can be accelerated.
- connection methods between the second heat conduction plate 30 and the first heat sink 201 there may be various connection methods between the second heat conduction plate 30 and the first heat sink 201, as long as the heat in the first heat sink 201 can be transferred to the second heat conduction plate 30; for example: the second The heat conduction plate 30 is welded to the first heat sink 201.
- the second heat conduction plate 30 is connected to the first heat sink 201 by welding, the connection strength is high, and the heat transfer rate between the second heat conduction plate 30 and the first heat sink 201 is faster after the connection; of course, the second heat conduction plate 30 can also be integrally formed with the first heat sink 201 by casting; the second heat conducting plate 30 can also be connected to the first heat sink 201 by bolting or snapping; it is worth noting that the second heat conducting plate 30 It can also be connected to the first heat sink 201 by bolting or snapping, and it is necessary to ensure that the second heat conducting plate 30 is close to the first heat sink 201 to speed up between the first heat sink 201 and the second heat conducting plate 30 Heat transfer rate.
- the first connection surface is inclined with respect to the inner wall of the chassis 10, for example, the angle between the first connection surface and the inner wall of the chassis 10 may be 2 ° -10 °.
- the bonding of the second connection surface can also increase the contact area between the first connection surface and the second heat conduction plate 30 to further accelerate the heat transfer rate between the first heat conduction plate 101 and the second heat conduction plate 30.
- the circuit board 20 has a second side 103 perpendicular to the first side 102 and adjacent to the first side 102, and the heat conducting member is disposed on the second side 103.
- a slot 1041 is provided on the third side 104 perpendicular to the first side 102 and adjacent to the second side 103.
- the slot 1041 extends toward the bottom 105 opposite to the first side 102, and one end of the circuit board 20 is provided with The plug portion is inserted into the slot 1041.
- the insertion part is inserted into the slot 1041, and then the circuit board 20 is pushed toward the bottom surface 105 of the accommodating cavity to realize the connection between the circuit board 20 and the chassis 10, and the installation is more convenient.
- first heat-conducting plate 101, the second heat-conducting plate 30 and the first heat sink 201 are all arranged in parallel and are located between the second side 103 and the circuit board 20; the first heat-conducting plate 101 is connected to the second side 103.
- the first connection surface on the first thermally conductive plate 101 extends toward the bottom surface 105 and gradually away from the second side surface 103
- the second connection surface on the corresponding second thermally conductive plate 30 extends toward the bottom surface 105 and gradually approaches the circuit board 20; After the insertion part is inserted into the slot 1041 and the circuit board 20 is pushed toward the bottom surface 105, the first heat conduction plate 101 and the second heat conduction plate 30 can be prevented from contacting, which may cause installation difficulties and facilitate the circuit board 20 installation.
- the first connection surface of the first heat conduction plate 101 and / or the second connection surface of the second heat conduction plate 30 may be coated with thermal silica gel, and then the The insertion part is inserted in the slot 1041 and pushes the circuit board 20 inwards.
- the first connection surface and the second connection surface are gradually attached; when the circuit board 20 faces the bottom surface
- the first connection surface and the second connection surface are connected by thermally conductive silicone.
- the first heat-conducting plate 101 and the second heat-conducting plate 30 may both be copper plates; the first heat-conducting plate 101 and the second heat-conducting plate 30 made of copper accelerate the heat in the first heat-conducting plate 101 and the second The transfer rate on the heat conductive plate 30.
- the first heat conduction plate 101 and the second heat conduction plate 30 may also be composed of aluminum or its alloy; or the first heat conduction plate 101 and the second heat conduction plate 30 may be composed of other heat conduction materials.
- a plurality of heat dissipation fins 106 are provided on the outer wall of the chassis 10, and the heat dissipation fins 106 are integrally formed with the chassis 10.
- the plurality of heat dissipation fins 106 provided on the outer wall of the chassis 10 can increase the contact area between the outer wall of the chassis 10 and the outside air to accelerate the heat transfer rate between the chassis 10 and the outside air.
- the heat dissipation fins 106 may be disposed on the side wall of the chassis 10 having heat conduction members on the inner wall, so that the heat on the heat conduction members can be quickly released into the air through the heat dissipation fins 106; of course, the heat dissipation fins 106 can also be uniform It is provided on all outer walls of the chassis 10; in a achievable manner, the distribution density of the heat dissipation fins 106 on the side wall of the cabinet 10 with heat conducting parts on the inner wall is greater than the heat dissipation fins on the side wall of the chassis 10 without heat conducting parts on the inner wall Distribution density of the sheet 106.
- a second heat sink 202 is further provided on the circuit board 20; the first heat sink 201 is connected to one side of the circuit board 20, and the second heat sink 202 is connected to the other side of the circuit board 20.
- the first heat sink 201 and the second heat sink 202 are respectively disposed on both sides of the circuit board 20, which can further improve the cooling effect of the circuit board 20.
- the structures of the second heat sink 202 and the first heat sink 201 may be the same, which will not be repeated here.
- the host provided in this embodiment connects the inner wall of the chassis 10 to the first heat sink 201 on the circuit board 20 adjacent to the inner wall of the chassis 10 through a heat conducting member; and the first heat sink 201 in the prior art only releases heat to the chassis 10 Compared to the inside, the host provided in this embodiment not only releases the heat generated by the chip to the inside of the chassis 10 while the first heat sink 201 also transfers the heat to the side wall of the chassis 10 through the heat conducting member, and then is released by the side wall of the chassis 10 Into the air outside the chassis 10, the rate at which the heat generated by the chip is released into the air outside the chassis 10 is accelerated, the heat dissipation effect is better, and the circuit board 20 is prevented from overheating, so as not to affect the work of the host.
- first, second, etc. may be used in this disclosure to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
- the first element can be called the second element, and likewise, the second element can be called the first element, as long as all occurrences of the "first element” are consistently renamed and all occurrences of The “second component” can be renamed consistently.
- the first element and the second element are both elements, but they may not be the same element.
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Abstract
本公开实施例涉及一种主机包括：机箱以及设置在机箱内部的至少一个电路板；机箱内壁上设置有导热件，机箱与邻近机箱内壁的电路板上的第一散热器通过导热件连接；第一散热器将芯片产生的热量释放到机箱内部的同时，还通过导热件将热量传递至机箱，进而由机箱侧壁释放到机箱外部的空气中，加快了将芯片产生的热量释放到机箱外部空气中的速率，散热效果较好，避免了电路板过热，以免影响主机工作。
Description
本公开涉及机箱散热领域，尤其涉及一种主机。
计算设备中常具有控制其他设备工作的主机，主机一般包括机箱以及设置在机箱内的电路板；电路板上设置有芯片，芯片上设置有多个散热片，用于为芯片散热。在常规的散热方案中，散热片与电路板上的芯片结合后放置在机箱内，并通过风扇以对流的方式将热量传到外界。
然而，当电路板上的芯片数量较多时，芯片运行时产生的热量也较多，仅通过风扇对流来对散热片和电路板进行散热的方式的效果不佳，容易造成电路板过热，进而影响主机工作。
上述背景技术内容仅用于帮助理解本公开，而并不代表承认或认可所提及的任何内容属于相对于本公开的公知常识的一部分。
发明内容
本公开实施例提供一种主机，包括：机箱以及设置在所述机箱内部的至少一个电路板；所述机箱内壁上设置有导热件，所述机箱与邻近所述机箱内壁的所述电路板上的第一散热器通过所述导热件连接。
如上所述的主机，优选地，所述导热件包括第一导热板，所述第一导热板上具有散热面，所述散热面与所述机箱内壁的连接。
如上所述的主机，优选地，靠近所述机箱内壁的所述电路板上的所述第一散热器上设置有第二导热板，所述第二导热板上具有第二连接面，所述第一导热板上具有与所述散热面相对设置的第一连接面，所述第一连接面与所 述第二连接面连接。
如上所述的主机，优选地，所述第一连接面与所述第二连接面之间通过导热介质连接。
如上所述的主机，优选地，所述导热介质为导热硅胶。
如上所述的主机，优选地，所述第一连接面相对于所述机箱的内壁倾斜设置，所述第二连接面与所述第一连接面贴合。
如上所述的主机，优选地，所述第二导热板与所述第一散热器通过焊接的方式连接。
如上所述的主机，优选地，所述第一导热板和第二导热板均为铜板。
如上所述的主机，优选地，所述机箱的外壁上设置有多个散热翅片，且所述散热翅片与所述机箱一体成型。
如上所述的主机，优选地，所述电路板上还设置有第二散热器；所述第一散热器与所述电路板的一个侧面连接，所述第二散热器与所述电路板的另一侧面连接。
本公开实施例提供的主机，通过使机箱的内壁与邻近机箱内壁的电路板上的第一散热器通过导热件连接；与现有技术中第一散热器只将热量释放到机箱内部相比，本实施例提供的主机在第一散热器将芯片产生的热量释放到机箱内部的同时，还通过导热件将热量传递至机箱，进而由机箱侧壁释放到机箱外部的空气中，加快了将芯片产生的热量释放到机箱外部空气中的速率，散热效果较好，避免了电路板过热，以免影响主机工作。
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件示为类似的元件，附图不构成比例限制，并且其中：
图1为本实施例提供的主机的结构示意图；
图2为图1中机箱的结构示意图。
附图标记说明：
10、机箱；
101、第一导热板；
102、第一侧面；
103、第二侧面；
104、第三侧面；
1041、插槽；
105、底面；
106、散热翅片；
20、电路板；
201、第一散热器；
202、第二散热器；
30、第二导热板。
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非用来限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。
图1为本实施例提供的主机的结构示意图；图2为图1中机箱的结构示意图。
请参照图1和图2。本实施例提供一种主机，包括：机箱10以及设置在机箱10内部的至少一个电路板20；机箱10内壁上设置有导热件，机箱10 与邻近机箱10内壁的电路板20上的第一散热器201通过导热件连接。
本实施例中，机箱10的形状可以为长方体或正方体。机箱10具有容纳腔，电路板20设置在容纳腔内。为了便于描述，以机箱10呈长方体状为例，多个侧板围设成机箱10以及用于容纳电路板2的容纳腔；其某一侧板与机箱10之间可以通过螺栓连接或者卡接等可拆卸的方式连接，以便于将侧板由机箱10上拆卸下来，进而安装或者更换电路板20。
具体地，电路板20在容纳腔中的位置可以有多种，例如，如图1所示，本实施例中的电路板20可以垂直于第一侧面102且平行于容纳腔中与第一侧面102相邻的第二侧面103设置，相应的导热件设置在第二侧面103上；或者电路板20平行于第一侧面102设置，此时导热件设置在容纳腔与第一侧面102相对的底面105上。当然在其他的实现方式中，电路板20还可以与第一侧面102平行设置，并且导热件可以设置在侧板朝向容纳腔的侧壁上。
本实施例中，电路板20与机箱10之间的连接方式可以有多种，只要能够避免电路板20在机箱10内部移动即可；例如：电路板20可以通过螺栓连接的方式连接在机箱10的内部；或者电路板20通过卡接的方式与机箱10连接。
本实施例中导热件可以有多种，只要能够将第一散热器201上的热量传递至机箱10即可，例如：导热件可以包括第一导热板101，第一导热板101上具有散热面，散热面与机箱10的内壁连接；通过导热件将第一散热器201中的热量传递至机箱10。具体地，第一导热板101可以通过焊接、卡接或者螺栓连接的方式与机箱10的内壁连接，或者第一导热板101的散热面通过粘结胶与机箱10的内壁连接；当第一导热板101通过焊接、卡接或者螺栓连接的方式与机箱10的内壁连接时，需保证第一导热板101上的散热面贴紧机箱10的内壁，以保证第一导热板101中的热量可以快速的传递至机箱10；当第一导热板101的散热面通过粘结胶与机箱10的内壁连接时，优选采用导热硅胶，以进一步提高第一导热板101与机箱10之间的热量传递速率。
本实施例中，设置在电路板20邻近机箱10内壁的面上的第一散热器201可以为多个；例如：当电路板20上间隔的设置有多个芯片时，相应的在电路板20上间隔的设置有多个第一散热器201，每一第一散热器201与一个芯片对应，此时，可以在机箱10的内壁上间隔的设置有多个第一导热板101，每一第一导热板101与一个第一散热器201连接；或者在机箱10的内壁上只设置一个第一导热板101，多个第一散热器201均与该第一导热板101连接。在其他的实现方式中，设置在电路板20上的第一散热器201的数量可以为一个，此时可以在机箱10的内壁上设置一个第一导热板101，当然还可在机箱10的内壁上间隔的设置多个第一导热板101，多个第一导热板101均与第一散热器201连接。
本实施例中，第一散热器201的结构可以有多种，只要能够将电路板20上的芯片产生的热量传递至导热件以及空气中即可；例如：第一散热器201包括多个平行设置散热片，散热片的一端与电路板20连接，散热片的另一端与导热件连接；当然第一散热器201还可以包括散热板，散热板的一个侧面与电路板20连接，散热板中与该侧面相对的另一侧面与导热件连接；散热板上间隔的设置多个散热孔，以增加散热板与空气的接触面积；具体地，散热孔的截面可以呈圆形、矩形、正六边形等规则形状，或者散热孔的截面呈其他的不规则形状。
值得注意的是，本实施例提供的主机还可以包括风扇，相应的在机箱10的侧壁上开设有出风口，风扇设置在出风口内，风扇工作时可以将机箱10内部温度较高的空气输送至机箱10的外部，以对机箱10内进行冷却。
本实施例提供的主机的工作过程为：当主机工作时，电路板20上的芯片产生热量，热量传递至第一散热器201，第一散热器201将一部分热量释放到机箱10内部的空气中，与此同时，第一散热器201通过导热件将一部分热量传递至机箱10上，进而通过机箱10将热量释放到机箱10外部的空气中，以实现对电路板20上芯片的冷却。
本实施例提供的主机，通过使机箱10的内壁与邻近机箱10内壁的电路板20上的第一散热器201通过导热件连接；与现有技术中第一散热器201只将热量释放到机箱10内部相比，本实施例提供的主机在第一散热器201将芯片产生的热量释放到机箱10内部的同时，还通过导热件将热量传递至机箱10侧壁，进而由机箱10侧壁释放到机箱10外部的空气中，加快了将芯片产生的热量释放到机箱10外部空气中的速率，散热效果较好，避免了电路板20过热，以免影响主机工作。
在一种可实现的方式中，第一导热板101可以直接与第一散热器201连接，此时第一导热板101可以与第一散热器201抵接，或者第一导热板101通过焊接的方式与第一散热器201连接，只要保证第一散热器201中的热量可以传递至第一导热板101即可。
在另一种可实现的方式中，第一导热板101还可以间接的与第一散热器201连接；例如：邻近机箱10内壁的电路板20上的第一散热器201上设置有第二导热板30，第一导热板101上具有与散热面相对设置的第一连接面，第二导热板30上具有第二连接面，第一连接面与第二连接面连接。第一导热板101通过第二导热板30与第一散热器201连接，增大了第一导热板101与第一散热器201的接触面积，以提高由第一散热器201和第一导热板101之间的热量传递速率。
当然，本实施中第一导热板101还可以通过其他的方式与第一散热器201间接连接，例如：在第一导热板101与第一散热器201之间通过导热硅胶连接。
本实施例中第一导热板101的第一连接面与第二导热板30的第二连接面之间可以直接连接，例如：第一连接面与第二连接面抵接；以使第二导热板30中的热量可以传递至第一导热板101。
当然本实施例中第一导热板101的第一连接面与第二导热板30的第二连接面之间还可以间接连接，例如：第一连接面与第二连接面之间通过导热介 质连接。通过导热介质可以加快第一连接面与第二连接面之间的热量传递速率，以使第二导热板30中的热量可以快速的传递至第一导热板101。
进一步地，导热介质为导热硅胶。导热硅胶的导热速率较快，可以进一步加快第一连接面与第二连接面之间的热量传递速率。当然，实施例中导热介质还可以为其他材质，只要能够加快第一连接面与第二连接面之间的热量传递速率即可。
本实施例中第二导热板30与第一散热器201之间的连接方式可以有多种，只要能够使第一散热器201中的热量传递至第二导热板30即可；例如：第二导热板30与第一散热器201焊接。第二导热板30通过焊接的方式与第一散热器201连接，连接强度较高，并且连接后第二导热板30与第一散热器201之间的热量传递速率较快；当然第二导热板30还可以通过铸造的方式与第一散热器201一体成型；第二导热板30还可以通过螺栓连接或者卡接的方式与第一散热器201连接；值得注意的是，在第二导热板30还可以通过螺栓连接或者卡接的方式与第一散热器201连接时，需保证第二导热板30需贴紧第一散热器201，以加快第一散热器201与第二导热板30之间的热量传递速率。
本实施例中，第一连接面相对于机箱10的内壁倾斜设置，例如第一连接面与机箱10的内壁之间的夹角可以为2°-10°，如此设置，不但便于第一连接面与第二连接面的贴合，而且可以增大第一连接面与第二导热板30之间的接触面积，以进一步加快第一导热板101与第二导热板30之间的热量传递速率。
在一个可实现的方式中，电路板20上具有垂直于第一侧面102且与第一侧面102相邻的第二侧面103，导热件设置在第二侧面103上。在与第一侧面102垂直且与第二侧面103相邻的第三侧面104上设置有插槽1041，插槽1041向与第一侧面102相对设置的底面105延伸，电路板20的一端设置有插接部，插接部插设在插槽1041内。安装电路板20时，只需将插接部插设 在插槽1041内，之后向容纳腔的底面105推动电路板20，即可实现电路板20与机箱10之间的连接，安装较为方便。
进一步地，第一导热板101、第二导热板30以及第一散热器201均平行设置，且位于第二侧面103和电路板20之间；第一导热板101与第二侧面103连接。第一导热板101上的第一连接面向底面105延伸且逐渐远离第二侧面103，相应的第二导热板30上的第二连接面，向底面105延伸且逐渐靠近电路板20；如此设置，在将插接部插设在插槽1041后，向底面105推动电路板20的过程中，可以避免第一导热板101与第二导热板30抵接，导致的安装困难，便于电路板20的安装。在上述实现方式中，安装电路板20时，可以先在第一导热板101的第一连接面和/或第二导热板30的第二连接面上涂抹导热硅胶，之后将电路板20上的插接部插设在插槽1041内，并向里推动电路板20，在电路板20向底面105移动的过程中，第一连接面和第二连接面逐渐贴合；当电路板20向底面105移动至极限时，第一连接面和第二连接面通过导热硅胶连接。
在上述实现方式中，第一导热板101和第二导热板30可以均为铜板；由铜构成的第一导热板101和第二导热板30，加快了热量在第一导热板101和第二导热板30上的传递速率。当然，本实施例中第一导热板101和第二导热板30还可以由铝或其合金构成；或者第一导热板101和第二导热板30由其他的导热材质构成。
本实施例中，机箱10的外壁上设置有多个散热翅片106，且散热翅片106与机箱10一体成型。设置在机箱10外壁上的多个散热翅片106，可以增大机箱10外壁与外界空气的接触面积，以加快机箱10与外界空气的热量传递速率。
具体地，散热翅片106可以设置在内壁具有导热件的机箱10侧壁上，以使导热件上的热量可以快速的经散热翅片106释放到空气中；当然散热翅片106还可以均匀的设置在机箱10的所有外壁上；在一种可实现的方式中，内 壁具有导热件的机箱10侧壁上的散热翅片106的分布密度大于内壁不具有导热件的机箱10侧壁上散热翅片106的分布密度。
本实施例中，电路板20上还设置有第二散热器202；第一散热器201与电路板20的一个侧面连接，第二散热器202与电路板20的另一侧面连接。第一散热器201和第二散热器202分别设置在电路板20的两个侧面上，可以进一步提高对电路板20的冷却效果。
具体地，第二散热器202和第一散热器201的结构可以相同，在此不再赘述。
本实施例提供的主机，通过使机箱10的内壁与邻近机箱10内壁的电路板20上的第一散热器201通过导热件连接；与现有技术中第一散热器201只将热量释放到机箱10内部相比，本实施例提供的主机在第一散热器201将芯片产生的热量释放到机箱10内部的同时，还通过导热件将热量传递至机箱10侧壁，进而由机箱10侧壁释放到机箱10外部的空气中，加快了将芯片产生的热量释放到机箱10外部空气中的速率，散热效果较好，避免了电路板20过热，以免影响主机工作。
当用于本公开中时，虽然术语“第一”、“第二”等可能会在本公开中使用以描述各元件，但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如，在不改变描述的含义的情况下，第一元件可以叫做第二元件，并且同样第，第二元件可以叫做第一元件，只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件，但可以不是相同的元件。
本公开中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的，除非上下文清楚地表明，否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地，如在本公开中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外，当用于本公开中时，术语“包 括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素，和/或组件的存在，但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。
上述技术描述可参照附图，这些附图形成了本公开的一部分，并且通过描述在附图中示出了依照所描述的实施例的实施方式。虽然这些实施例描述的足够详细以使本领域技术人员能够实现这些实施例，但这些实施例是非限制性的；这样就可以使用其它的实施例，并且在不脱离所描述的实施例的范围的情况下还可以做出变化。比如，流程图中所描述的操作顺序是非限制性的，因此在流程图中阐释并且根据流程图描述的两个或两个以上操作的顺序可以根据若干实施例进行改变。作为另一个例子，在若干实施例中，在流程图中阐释并且根据流程图描述的一个或一个以上操作是可选的，或是可删除的。另外，某些步骤或功能可以添加到所公开的实施例中，或两个以上的步骤顺序被置换。所有这些变化被认为包含在所公开的实施例以及权利要求中。
另外，上述技术描述中使用术语以提供所描述的实施例的透彻理解。然而，并不需要过于详细的细节以实现所描述的实施例。因此，实施例的上述描述是为了阐释和描述而呈现的。上述描述中所呈现的实施例以及根据这些实施例所公开的例子是单独提供的，以添加上下文并有助于理解所描述的实施例。上述说明书不用于做到无遗漏或将所描述的实施例限制到本公开的精确形式。根据上述教导，若干修改、选择适用以及变化是可行的。在某些情况下，没有详细描述为人所熟知的处理步骤以避免不必要地影响所描述的实施例。
Claims (10)
- 一种主机，其特征在于，包括：机箱以及设置在所述机箱内部的至少一个电路板；所述机箱内壁上设置有导热件，所述机箱与邻近所述机箱内壁的所述电路板上的第一散热器通过所述导热件连接。
- 根据权利要求1所述的主机，其特征在于，所述导热件包括第一导热板，所述第一导热板上具有散热面，所述散热面与所述机箱内壁的连接。
- 根据权利要求2所述的主机，其特征在于，邻近所述机箱内壁的所述电路板上的所述第一散热器上设置有第二导热板，所述第二导热板上具有第二连接面，所述第一导热板上具有与所述散热面相对设置的第一连接面，所述第一连接面与所述第二连接面连接。
- 根据权利要求3所述的主机，其特征在于，所述第一连接面与所述第二连接面之间通过导热介质连接。
- 根据权利要求4所述的主机，其特征在于，所述导热介质为导热硅胶。
- 根据权利要求3所述的主机，其特征在于，所述第一连接面相对于所述机箱的内壁倾斜设置，所述第二连接面与所述第一连接面贴合。
- 根据权利要求3所述的主机，其特征在于，所述第二导热板与所述第一散热器通过焊接的方式连接。
- 根据权利要求3所述的主机，其特征在于，所述第一导热板和所述第二导热板均为铜板。
- 根据权利要求1-8任一项所述的主机，其特征在于，所述机箱的外壁上设置有多个散热翅片，且所述散热翅片与所述机箱一体成型。
- 根据权利要求1-8任一项所述的主机，其特征在于，所述电路板上还设置有第二散热器；所述第一散热器与所述电路板的一个侧面连接，所述第二散热器与所述电路板的另一侧面连接。
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| CN201854514U (zh) * | 2010-11-01 | 2011-06-01 | 国营第三八八厂 | 一种具有电磁屏蔽和散热功能的高频地波雷达机箱 |
| CN206547244U (zh) * | 2016-12-28 | 2017-10-10 | 江西科技学院 | 电子机箱 |
| CN207623920U (zh) * | 2018-01-12 | 2018-07-17 | 无锡巨日电子科技有限公司 | 高效散热全封闭式机箱组件 |
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2018
- 2018-11-23 WO PCT/CN2018/117298 patent/WO2020103157A1/zh active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201854514U (zh) * | 2010-11-01 | 2011-06-01 | 国营第三八八厂 | 一种具有电磁屏蔽和散热功能的高频地波雷达机箱 |
| CN206547244U (zh) * | 2016-12-28 | 2017-10-10 | 江西科技学院 | 电子机箱 |
| CN207623920U (zh) * | 2018-01-12 | 2018-07-17 | 无锡巨日电子科技有限公司 | 高效散热全封闭式机箱组件 |
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