WO2020073423A1 - 柔性oled显示面板及其制备方法 - Google Patents

柔性oled显示面板及其制备方法 Download PDF

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Publication number
WO2020073423A1
WO2020073423A1 PCT/CN2018/115640 CN2018115640W WO2020073423A1 WO 2020073423 A1 WO2020073423 A1 WO 2020073423A1 CN 2018115640 W CN2018115640 W CN 2018115640W WO 2020073423 A1 WO2020073423 A1 WO 2020073423A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
organic electroluminescent
display panel
flexible
hole
Prior art date
Application number
PCT/CN2018/115640
Other languages
English (en)
French (fr)
Inventor
马伟欣
Original Assignee
武汉华星光电半导体显示技术有限公司
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Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/326,233 priority Critical patent/US11011714B2/en
Publication of WO2020073423A1 publication Critical patent/WO2020073423A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display, in particular to a flexible OLED display panel and a preparation method thereof.
  • screen ratio is the ratio of the screen area to the entire machine area. A higher screen ratio can bring users a better visual experience. Due to the high screen ratio and good display effect, the full-screen display is increasingly loved by consumers, and it has become an inevitable trend for the future development of electronic devices such as mobile phones.
  • the active matrix organic light emitting diode (AMOLED) display panel is a display panel that is more widely used.
  • AMOLED active matrix organic light emitting diode
  • FIG. 1 is a schematic top view of a conventional flexible OLED display panel. Please refer to FIG. 1.
  • the upper part of the display panel 1 is laser-cut to form a notch 10, and the camera 11 and the sensor 12 are placed at the notch 10.
  • the disadvantage of this type of display panel 1 is that the upper portion of the display panel 1 is cut to form a notch 10, so that the display panel 1 presents a special-shaped structure, which is visually unsightly and gives a feeling of not being a whole screen.
  • the technical problem to be solved by the present invention is to provide a flexible OLED display panel and a preparation method thereof, which can make the flexible OLED display panel visually as a whole structure, making it more in line with the visual effect of a full screen.
  • the present invention provides a flexible OLED display panel, which includes a flexible substrate and an organic electroluminescent device layer, the flexible substrate has a through hole at an upper end of the flexible OLED display panel, The through hole penetrates the flexible substrate along the thickness direction of the flexible substrate, a transparent layer is filled in the through hole, the organic electroluminescent device layer covers the flexible substrate and the transparent layer, the A surface of the transparent layer facing the organic electroluminescent device layer is flush with a surface of the flexible substrate facing the organic electroluminescent device layer, and the organic electroluminescent device layer includes a plurality of thin films arranged in an array A plurality of organic electroluminescent devices arranged in a transistor and an array, wherein each of the organic electroluminescent devices is controlled to emit light by a corresponding one of the thin film transistors, and the through hole is a notch.
  • the density of the thin film transistor and the organic electroluminescent device above the transparent layer is smaller than that of the thin film transistor and the organic electroluminescence of the region where the transparent layer is not provided on the flexible substrate Light-emitting device density
  • the present invention also provides a flexible OLED display panel, which includes a flexible substrate and an organic electroluminescent device layer.
  • the flexible substrate has a through hole, so The through hole penetrates the flexible substrate along the thickness direction of the flexible substrate, a transparent layer is filled in the through hole, and the organic electroluminescent device layer covers the flexible substrate and the transparent layer.
  • the surface of the transparent layer facing the organic electroluminescent device layer is flush with the surface of the flexible substrate facing the organic electroluminescent device layer.
  • the organic electroluminescent device layer includes a plurality of thin film transistors arranged in an array and a plurality of organic electroluminescent devices arranged in an array, wherein each of the organic electroluminescent devices is assigned a corresponding The thin film transistor controls light emission.
  • the density of the thin film transistor and the organic electroluminescent device above the transparent layer is smaller than that of the thin film transistor and the organic electroluminescence of the region where the transparent layer is not provided on the flexible substrate The density of the light emitting device.
  • the through hole is a notch.
  • the present invention also provides a method for preparing the above-mentioned flexible OLED display panel, including the following steps: providing a rigid substrate; forming a flexible substrate on the rigid substrate; at the upper end of the flexible substrate, along the Cutting the flexible substrate in the thickness direction of the flexible substrate to form a through hole penetrating the flexible substrate along the thickness direction of the flexible substrate; filling a transparent layer in the through hole; An organic electroluminescent device layer is formed on the transparent layer; the hard substrate is removed to form the flexible OLED display panel.
  • the preparation method further includes the steps of: manufacturing a release film on the hard substrate, and forming the flexible substrate on the release film.
  • a mechanical peeling method is used to remove the hard substrate and the release film.
  • a method for filling a transparent layer in the through hole includes the following steps: coating a photoresist layer on the flexible substrate, the photoresist layer filling the through hole and covering the flexible Substrate; remove the photoresist layer on the flexible substrate, and leave the photoresist layer filling the through hole, and the photoresist layer filling the through hole becomes the transparent layer.
  • the thickness of the photoresist layer filling the through hole is thinned so that the surface The surface of the flexible substrate is flush.
  • the advantage of the present invention is that the transparent layer is used to fill the through holes where the flexible substrate is formed, so that the flexible OLED display panel is visually an integrated structure, making it more in line with the visual effect of a full screen.
  • FIG. 1 is a schematic top view of an existing flexible OLED display panel
  • FIG. 2 is a schematic top view of an embodiment of the flexible OLED display panel of the present invention.
  • FIG. 3 is a schematic cross-sectional view taken along line A-A in FIG. 2;
  • 4A-4G are process flow diagrams of an embodiment of a method for preparing a flexible OLED display panel of the present invention.
  • 5A-5H are process flow diagrams of another embodiment of the method for preparing a flexible OLED display panel of the present invention.
  • FIG. 2 is a schematic structural plan view of an embodiment of a flexible OLED display panel of the present invention
  • FIG. 3 is a schematic cross-sectional view taken along line A-A in FIG. 2.
  • the flexible OLED display panel 2 of the present invention includes a flexible substrate 20 and an organic electroluminescent device layer 30.
  • the organic electroluminescent device layer 30 covers the flexible substrate 20.
  • the flexible substrate 20 is made of light-transmitting material.
  • the flexible substrate 20 may be made of polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (cyclic olefin copolymer (COC), metal chromate base material-cycloolefin copolymer (metallocene-based cyclic olefin copolymer (mCOC) or other suitable materials.
  • the flexible substrate 20 is made of polyimide (PI).
  • the flexible substrate 20 has a through hole 21.
  • the through hole 21 is also covered by the organic electroluminescent device layer 30, then in the top view of FIG. 2, the through hole 21 It is not exposed. Therefore, the through hole 21 is schematically depicted by a dotted line in FIG. 2.
  • the through hole 21 penetrates the flexible substrate 20 along the thickness direction of the flexible substrate 20. In this embodiment, the through hole 21 is provided at the upper end of the flexible substrate 20, but does not penetrate the upper end. In other embodiments, the through hole 21 penetrates the upper end of the flexible substrate 20 to form a notch 10 similar to that shown in FIG. 1.
  • a transparent layer 22 is filled in the through hole 21.
  • the transparent layer 22 includes but is not limited to an organic layer, for example, a photoresist layer.
  • the organic electroluminescent device layer 30 covers the flexible substrate 20 and the transparent layer 22.
  • the surface of the transparent layer 22 facing the organic electroluminescent device layer 30 is flush with the surface of the flexible substrate 21 facing the organic electroluminescent device layer 30.
  • the flexible OLED display panel 2 is assembled with other components to form a display device, functional components such as a camera and a sensor of the display device are provided at positions corresponding to the transparent layer 22, thereby avoiding the flexible substrate 20 from blocking the functional components .
  • functional components such as a camera and a sensor of the display device are provided at positions corresponding to the transparent layer 22, thereby avoiding the flexible substrate 20 from blocking the functional components .
  • the transparent layer 22 due to the filling of the transparent layer 22, there is no defect in the flexible OLED display panel 2 at the through hole 21, which makes the flexible OLED display panel 2 of the present invention do not form a profile similar to that shown in FIG. From a visual point of view, the arrangement of the flexible OLED display panel 2 of the present invention is more reasonable, and it is more in line with the visual effect of a full screen than the "bangs screen" shown in FIG.
  • the organic electroluminescent device layer 30 includes a plurality of thin film transistors 31 arranged in an array and a plurality of organic electroluminescent devices 32 arranged in an array, wherein each of the organic electroluminescent devices 32 is divided by a corresponding one
  • the thin film transistor 31 controls light emission.
  • the structures of the thin film transistor 31 and the organic electroluminescent device 32 are conventional designs in the art, and will not be described in detail. Wherein, the density of the thin film transistor 31 and the organic electroluminescent device 32 above the transparent layer 22 is smaller than that of the thin film transistor 31 and the Density of electromechanical light emitting device 32. That is, in the area above the transparent layer 22, the thin film transistor 31 and the organic electroluminescent device 32 are sparsely arranged, thereby preventing the thin film transistor 31 and the organic electroluminescent device 32 from blocking the function of the display device Components.
  • the invention also provides a preparation method of the flexible OLED display panel.
  • 4A-4G are process flow diagrams of an embodiment of a method for manufacturing a flexible OLED display panel of the present invention.
  • a hard substrate 400 is provided.
  • the hard substrate 400 can be made of glass, quartz, wafer, ceramic or other suitable materials.
  • the hard substrate 400 is made of glass.
  • the hard substrate 400 supports the subsequent structure.
  • a flexible substrate 401 is formed on the rigid substrate 400.
  • the flexible substrate 401 may be made of polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (cyclic) olefin copolymer (COC), metal chromate base material-cycloolefin copolymer (metallocene-based cyclic olefin copolymer (mCOC) or other suitable materials.
  • the flexible substrate 401 is made of polyimide (PI).
  • the flexible substrate 401 is cut along the thickness direction of the flexible substrate 401 to form a thickness through the flexible substrate 401 through the flexible substrate 401 ⁇ ⁇ ⁇ 402.
  • the method for cutting the flexible substrate 401 may be laser cutting or mechanical cutting. In this embodiment, the method of cutting the flexible substrate 401 may be laser cutting.
  • a transparent layer 403 is filled in the through hole 402.
  • the transparent layer 403 may be an inorganic material or an organic material.
  • the transparent layer 403 is a photoresist material. Due to the filling of the transparent layer 403, the flexible substrate 401 looks as a whole without defects such as notches.
  • the method for forming the transparent layer 403 includes the following steps: Please refer to FIG. 4D, a photoresist layer 407 is coated on the flexible substrate 401, and the photoresist layer 407 fills the through The hole 402 also covers the flexible substrate 401. Referring to FIG. 4E, the photoresist layer 407 on the flexible substrate 401 is removed, and the photoresist layer filling the through hole 402 is left.
  • the photoresist layer filling the through hole 402 is the transparent layer 403, in which The method for removing the photoresist layer 407 is conventional ashing or etching.
  • the thickness of the photoresist layer filling the through hole 402 is thinned, so that the surface of the photoresist layer filling the through hole 402 and the The surface of the flexible substrate 401 is flush, so that the surface of the transparent layer 403 is flush with the surface of the flexible substrate 401, so that the flexible substrate 401 looks as a whole without defects such as notches.
  • an organic electroluminescent device layer 404 is formed on the flexible substrate 401 and the transparent layer 403.
  • the organic electroluminescent device layer 404 includes a plurality of thin film transistors 405 arranged in an array and a plurality of organic electroluminescent devices 406 arranged in an array. Each of the organic electroluminescent devices 406 is controlled by a corresponding one of the thin film transistors 405 to emit light.
  • the structures of the thin film transistor 405 and the organic electroluminescent device 406 are conventional designs in the art, and will not be described in detail.
  • the density of the thin film transistor 405 and the organic electroluminescent device 406 above the transparent layer 403 is smaller than that of the flexible substrate 401 without the transparent layer
  • the density of the thin film transistor 405 and the organic electroluminescent device 406 in the area of 403 is sparsely arranged, thereby preventing the thin film transistor 405 and the organic electroluminescent device 406 from blocking the function of the display device Components.
  • the hard substrate 400 is removed to form the flexible OLED display panel 2.
  • the method for removing the hard substrate 400 includes but is not limited to laser lift-off or mechanical lift-off.
  • the mechanical peeling method is not applicable.
  • the hard substrate 400 is removed by a laser peeling method.
  • 5A-5H are process flow diagrams of another embodiment of the method for preparing a flexible OLED display panel of the present invention.
  • a hard substrate 500 is provided.
  • the hard substrate 500 can be made of glass, quartz, wafer, ceramic or other suitable materials.
  • the hard substrate 500 is made of glass.
  • the hard substrate 500 supports the subsequent structure.
  • a release film 510 is formed on the hard substrate 500.
  • the manufacturing material of the release film 510 includes but is not limited to a-Si.
  • a flexible substrate 501 is formed on the release film 510.
  • the flexible substrate 501 may be made of polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (cyclic olefin copolymer (COC), metal chromate base material-cycloolefin copolymer (metallocene-based cyclic olefin copolymer (mCOC) or other suitable materials.
  • the flexible substrate 501 is made of polyimide (PI).
  • the release film 510 can weaken the adhesion of the flexible substrate 501, so that it can be smoothly separated from the hard substrate 500 in the subsequent process.
  • the flexible substrate 501 is cut along the thickness direction of the flexible substrate 501 to form a thickness through the flexible substrate 501 through the flexible substrate 501 ⁇ ⁇ ⁇ 502.
  • the method for cutting the flexible substrate 501 may be laser cutting or mechanical cutting.
  • the method of cutting the flexible substrate 501 may be laser cutting.
  • a transparent layer 503 is filled in the through hole 502.
  • the transparent layer 503 may be an inorganic material or an organic material.
  • the transparent layer 503 is a photoresist material. Due to the filling of the transparent layer 503, the flexible substrate 501 looks as a whole without defects such as notches.
  • the method for forming the transparent layer 503 includes the following steps: Please refer to FIG. 5E, a photoresist layer 507 is coated on the flexible substrate 501, and the photoresist layer 507 fills the through The hole 502 also covers the flexible substrate 501. Referring to FIG. 5F, the photoresist layer 507 on the flexible substrate 501 is removed, and the photoresist layer filling the through hole 502 is left. The photoresist layer filling the through hole 502 is the transparent layer 503, in which The method for removing the photoresist layer 507 is conventional ashing or etching.
  • the thickness of the photoresist layer filling the through hole 502 is thinned, so that the surface of the photoresist layer filling the through hole 502 and the The surface of the flexible substrate 501 is flush, so that the surface of the transparent layer 403 is flush with the surface of the flexible substrate 501, so that the flexible substrate 501 looks as a whole without defects such as notches.
  • an organic electroluminescent device layer 504 is formed on the flexible substrate 501 and the transparent layer 503.
  • the organic electroluminescent device layer 504 includes a plurality of thin film transistors 505 arranged in an array and a plurality of organic electroluminescent devices 506 arranged in an array. Each of the organic electroluminescent devices 506 is controlled by a corresponding one of the thin film transistors 505 to emit light.
  • the structures of the thin film transistor 505 and the organic electroluminescent device 506 are conventional designs in the art, and will not be described in detail.
  • the density of the thin film transistor 505 and the organic electroluminescent device 506 above the transparent layer 503 is smaller than that of the flexible substrate 501 without the transparent layer
  • the density of the thin film transistor 505 and the organic electroluminescent device 506 in the area of 503 is sparsely arranged, thereby preventing the thin film transistor 505 and the organic electroluminescent device 506 from blocking the function of the display device Components.
  • the hard substrate 500 is removed to form the flexible OLED display panel 2.
  • the method of removing the hard substrate 500 is mechanical peeling.
  • the flexible OLED panel is cut after the hard substrate is peeled off by the laser peeling process to form the notch 10 (see FIG. 1).
  • the laser peeling process does not affect the exposed edges of the notch 10.
  • the hard substrate 500 is removed by a stripping process. If the hard substrate 500 is removed by laser stripping, the energy of the laser will affect the through hole 502 The exposed edges of the LEDs affect the flexible OLED display panel.
  • a release film 510 is provided between the hard substrate 500 and the flexible substrate 501, and the release film 510 weakens the hard substrate 500 and the flexible substrate 501 Therefore, the mechanical substrate can be used to remove the hard substrate 500 and the release film 510 to prevent the laser energy from affecting the exposed edge of the through hole 502.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性OLED显示面板(2)及其制备方法，其在形成柔性基板(20)的通孔(21)处采用透明层(22)填充，使得所述柔性OLED显示面板(2)从视觉上为一个整体结构，使其更符合全面屏的视觉效果。

Description

柔性OLED显示面板及其制备方法 技术领域
本发明涉及显示领域，尤其涉及一种柔性OLED显示面板及其制备方法。
 背景技术
目前全屏化手机普及程度越来越高，高屏占比的屏幕越来越受欢迎。所谓屏占比就是屏幕面积与整机面积的比例，较高的屏占比能够给用户带来更好的视觉体验。全面显示屏由于具有高屏占比，显示效果好，因此全面显示屏显示受到消费者越来越多的喜爱，成为了手机等电子设备未来发展的必然趋势。
有源矩阵有机发光二极体 (Active-matrix organic light emitting diode，AMOLED) 显示面板是一种应用较为广泛的显示面板。在目前的有源矩阵有机发光二极体显示面板的全面屏设计中，通常需要采用激光切割工艺中将显示面板的上部进行切割，形成一槽口（Notch），形成所谓的“刘海屏”。
 技术问题
图1是现有的柔性OLED显示面板的俯视示意图，请参阅图1，显示面板1的上部经过激光切割后形成一槽口10，在所述槽口10处放置摄像头11及传感器12等器件。该种显示面板1的缺点在于，所述显示面板1的上部被切割形成槽口10，使得所述显示面板1呈现异形结构，在视觉上不美观，给人一种不是整块屏幕的感觉。
 技术解决方案
本发明所要解决的技术问题是，提供一种柔性OLED显示面板及其制备方法，其能够使得所述柔性OLED显示面板从视觉上为一个整体结构，使其更符合全面屏的视觉效果。
为了解决上述问题，本发明提供了一种柔性OLED显示面板，其包括一柔性基板及一有机电致发光器件层，在所述柔性OLED显示面板的一上端部，所述柔性基板具有一通孔，所述通孔沿所述柔性基板的厚度方向贯穿所述柔性基板，一透明层填充在所述通孔内，所述有机电致发光器件层覆盖所述柔性基板及所述透明层，所述透明层朝向所述有机电致发光器件层的一表面与所述柔性基板朝向所述有机电致发光器件层的一表面平齐，所述有机电致发光器件层包括阵列排布的多个薄膜晶体管和阵列排布的多个有机电致发光器件，其中每个所述有机电致发光器件被对应的一个所述薄膜晶体管控制发光，所述通孔为一槽口。
在一实施例中，所述透明层上方的所述薄膜晶体管及所述有机电致发光器件的密度小于所述柔性基板未设置所述透明层的区域的所述薄膜晶体管及所述有机电致发光器件的密度
为了解决上述问题，本发明还提供了一种柔性OLED显示面板，包括一柔性基板及一有机电致发光器件层，在所述柔性OLED显示面板的上端部，所述柔性基板具有一通孔，所述通孔沿所述柔性基板的厚度方向贯穿所述柔性基板，一透明层填充在所述通孔内，所述有机电致发光器件层覆盖所述柔性基板及所述透明层。
在一实施例中，所述透明层朝向所述有机电致发光器件层的表面与所述柔性基板朝向所述有机电致发光器件层的表面平齐。
在一实施例中，所述有机电致发光器件层包括阵列排布的多个薄膜晶体管和阵列排布的多个有机电致发光器件，其中每个所述有机电致发光器件被对应的一个所述薄膜晶体管控制发光。
在一实施例中，所述透明层上方的所述薄膜晶体管及所述有机电致发光器件的密度小于所述柔性基板未设置所述透明层的区域的所述薄膜晶体管及所述有机电致发光器件的密度。
在一实施例中，所述通孔为一槽口。
本发明还提供一种上述的柔性OLED显示面板的制备方法，包括如下步骤：提供一硬质基板；在所述硬质基板上形成一柔性基板；在所述柔性基板的上端部，沿所述柔性基板的厚度方向对所述柔性基板进行切割，形成一沿所述柔性基板的厚度方向贯穿所述柔性基板的通孔；在所述通孔内填充一透明层；在所述柔性基板及所述透明层上形成一有机电致发光器件层；去除所述硬质基板，形成所述柔性OLED显示面板。
在一实施例中，所述制备方法还包括如下步骤：在所述硬质基板上制作一离型膜，在所述离型膜上形成所述柔性基板。
在一实施例中，在去除所述硬质基板的步骤中，采用机械剥离的方法去除所述硬质基板及所述离型膜。
在一实施例中，在所述通孔内填充一透明层的方法包括如下步骤：在所述柔性基板上涂布一光阻层，所述光阻层填充所述通孔并覆盖所述柔性基板；去除所述柔性基板上的光阻层，并保留填充所述通孔的光阻层，填充所述通孔的光阻层成为所述透明层。
在一实施例中，在去除所述性基板上的光阻层的步骤中，减薄填充所述通孔的光阻层的厚度，以使填充所述通孔的光阻层的表面与所述柔性基板的表面平齐。
 有益效果
本发明的优点在于，在形成柔性基板的通孔处采用透明层填充，使得所述柔性OLED显示面板从视觉上为一个整体结构，使其更符合全面屏的视觉效果。
 附图说明
图1是现有的柔性OLED显示面板的俯视示意图；
图2是本发明柔性OLED显示面板的一实施例的俯视结构示意图；
图3是图2中沿A-A向的截面示意图；
图4A~图4G是本发明柔性OLED显示面板的制备方法的一实施例的工艺流程图；
图5A~图5H是本发明柔性OLED显示面板的制备方法的另一实施例的工艺流程图。
 本发明的实施方式
下面结合附图对本发明提供的柔性OLED显示面板及其制备方法的具体实施方式做详细说明。
图2是本发明柔性OLED显示面板的一实施例的俯视结构示意图，图3是图2中沿A-A向的截面示意图。请参阅图2及图3，本发明柔性OLED显示面板2包括一柔性基板20及一有机电致发光器件层30。所述有机电致发光器件层30覆盖所述柔性基板20。
所述柔性基板20由透光材料制成。例如，所述柔性基板20可以由聚酰亚胺(PI)、聚碳酸酯(polycarbonate,PC)、聚酯(polyester,PET)、环烯共聚物(cyclic olefin copolymer,COC)、金属铬合物基材－环烯共聚物(metallocene-based cyclic olefin copolymer,mCOC)或其他适当材质制成，在本实施例中，所述柔性基板20由聚酰亚胺（PI）制成。在所述柔性OLED显示面板2的上端部，所述柔性基板20具有一通孔21。由于所述柔性基板20被所述有机电致发光器件层30覆盖，则所述通孔21也被所述有机电致发光器件层30覆盖，那么在图2的俯视图中，所述通孔21并未裸露，因此，在图2中采用虚线示意性地绘示所述通孔21。所述通孔21沿所述柔性基板20的厚度方向贯穿所述柔性基板20。在本实施例中，所述通孔21设置在所述柔性基板20的上端部，但是并未贯穿所述上端部。在其他实施例中，所述通孔21贯穿所述柔性基板20的上端部，形成类似图1所示的槽口10。
一透明层22填充在所述通孔21内。其中，所述透明层22包括但不限于有机层，例如，光阻层。所述有机电致发光器件层30覆盖所述柔性基板20及所述透明层22。优选地，所述透明层22朝向所述有机电致发光器件层30的表面与所述柔性基板21朝向所述有机电致发光器件层30的表面平齐。
后续若要将柔性OLED显示面板2与其他构件组装形成显示装置，则显示装置的摄像头及传感器等功能组件设置在所述透明层22对应的位置，从而避免柔性基板20对所述功能组件的遮挡。同时由于所述透明层22的填充，在所述通孔21处，所述柔性OLED显示面板2并不存在缺失，这使得本发明的柔性OLED显示面板2不会形成类似图1所示的异形结构，从视觉上看，本发明的柔性OLED显示面板2的设置更加合理，相较于图1所示的“刘海屏”更符合全面屏的视觉效果。
所述有机电致发光器件层30包括阵列排布的多个薄膜晶体管31和阵列排布的多个有机电致发光器件32，其中每个所述有机电致发光器件32被对应的一个所述薄膜晶体管31控制发光。所述薄膜晶体管31及所述有机电致发光器件32的结构为本领域常规设计，不再赘述。其中，所述透明层22上方的所述薄膜晶体管31及所述有机电致发光器件32的密度小于所述柔性基板21未设置所述透明层22的区域的所述薄膜晶体管31及所述有机电致发光器件32的密度。即在所述透明层22上方区域，所述薄膜晶体管31及所述有机电致发光器件32布置稀疏，从而避免所述薄膜晶体管31及所述有机电致发光器件32遮挡所述显示装置的功能组件。
本发明还提供一种上述柔性OLED显示面板的制备方法。图4A~图4G是本发明柔性OLED显示面板的制备方法的一实施例的工艺流程图。
请参阅图4A，提供一硬质基板400。所述硬质基板400可由玻璃、石英、晶圆、陶瓷或其他适当材质制成。例如，在本实施例中，所述硬质基板400由玻璃制成。所述硬质基板400对后续结构起到支撑作用。
请参阅图4B，在所述硬质基板400上形成一柔性基板401。所述柔性基板401可以由聚酰亚胺(PI)、聚碳酸酯(polycarbonate,PC)、聚酯(polyester,PET)、环烯共聚物(cyclic olefin copolymer,COC)、金属铬合物基材－环烯共聚物(metallocene-based cyclic olefin copolymer,mCOC)或其他适当材质制成，在本实施例中，所述柔性基板401由聚酰亚胺（PI）制成。
请参阅图4C，在所述柔性基板401的上端部，沿所述柔性基板401的厚度方向对所述柔性基板401进行切割，形成一沿所述柔性基板401的厚度方向贯穿所述柔性基板401的通孔402。其中，对所述柔性基板401进行切割的方法可为激光切割或者机械切割。在本实施例中，对所述柔性基板401进行切割的方法可为激光切割。
请参阅图4D及图4E，在所述通孔402内填充一透明层403。所述透明层403可以为无机材料，也可以为有机材料。例如，在本实施例中，所述透明层403为光阻材料。由于所述透明层403的填充，使得所述柔性基板401看上去为一个整体，不存在缺口等缺陷。
其中，在本实施例中，形成所述透明层403的方法包括如下步骤：请参阅图4D，在所述柔性基板401上涂布一光阻层407，所述光阻层407填充所述通孔402并覆盖所述柔性基板401。请参阅图4E，去除所述柔性基板401上的光阻层407，并保留填充所述通孔402的光阻层，填充所述通孔402的光阻层即为所述透明层403，其中，去除所述光阻层407的方法为常规的灰化或刻蚀等方法。进一步，在去除所述柔性基板401上的光阻层的步骤中，减薄填充所述通孔402的光阻层的厚度，以使填充所述通孔402的光阻层的表面与所述柔性基板401的表面平齐，进而使得所述透明层403的表面与所述柔性基板401的表面平齐，使所述柔性基板401看上去为一个整体，不存在缺口等缺陷。
请参阅图4F，在所述柔性基板401及所述透明层403上形成一有机电致发光器件层404。其中，所述有机电致发光器件层404包括阵列排布的多个薄膜晶体管405和阵列排布的多个有机电致发光器件406。每个所述有机电致发光器件406被对应的一个所述薄膜晶体管405控制发光。所述薄膜晶体管405及所述有机电致发光器件406的结构为本领域常规设计，不再赘述。其中，所述透明层403上方（如图中虚线框A所围示的区域）的所述薄膜晶体管405及所述有机电致发光器件406的密度小于所述柔性基板401未设置所述透明层403的区域（如图中虚线框B所围示的区域）的所述薄膜晶体管405及所述有机电致发光器件406的密度。即在所述透明层403上方区域，所述薄膜晶体管405及所述有机电致发光器件406布置稀疏，从而避免所述薄膜晶体管405及所述有机电致发光器件406遮挡所述显示装置的功能组件。
请参阅图4G，去除所述硬质基板400，形成所述柔性OLED显示面板2。其中，去除所述硬质基板400的方法包括但不限于激光剥离或者机械剥离。在本实施例中，由于所述硬质基板400与所述柔性基板401粘着力较强，机械剥离的方法不适用，本实施例采用激光剥离的方法去除所述硬质基板400。
图5A~图5H是本发明柔性OLED显示面板的制备方法的另一实施例的工艺流程图。
请参阅图5A，提供一硬质基板500。所述硬质基板500可由玻璃、石英、晶圆、陶瓷或其他适当材质制成。例如，在本实施例中，所述硬质基板500由玻璃制成。所述硬质基板500对后续结构起到支撑作用。
请参阅图5B，在所述硬质基板500上形成一离型膜510。所述离型膜510的制作材料包括但不限于a-Si。
请参阅图5C，在所述离型膜510上形成一柔性基板501。所述柔性基板501可以由聚酰亚胺(PI)、聚碳酸酯(polycarbonate,PC)、聚酯(polyester,PET)、环烯共聚物(cyclic olefin copolymer,COC)、金属铬合物基材－环烯共聚物(metallocene-based cyclic olefin copolymer,mCOC)或其他适当材质制成，在本实施例中，所述柔性基板501由聚酰亚胺（PI）制成。所述离型膜510能够减弱所述柔性基板501的附着力，进而使其在后续工艺中能够与硬质基板500顺利分离。
请参阅图5D，在所述柔性基板501的上端部，沿所述柔性基板501的厚度方向对所述柔性基板501进行切割，形成一沿所述柔性基板501的厚度方向贯穿所述柔性基板501的通孔502。其中，对所述柔性基板501进行切割的方法可为激光切割或者机械切割。在本实施例中，对所述柔性基板501进行切割的方法可为激光切割。
请参阅图5E及图5F，在所述通孔502内填充一透明层503。所述透明层503可以为无机材料，也可以为有机材料。例如，在本实施例中，所述透明层503为光阻材料。由于所述透明层503的填充，使得所述柔性基板501看上去为一个整体，不存在缺口等缺陷。
其中，在本实施例中，形成所述透明层503的方法包括如下步骤：请参阅图5E，在所述柔性基板501上涂布一光阻层507，所述光阻层507填充所述通孔502并覆盖所述柔性基板501。请参阅图5F，去除所述柔性基板501上的光阻层507，并保留填充所述通孔502的光阻层，填充所述通孔502的光阻层即为所述透明层503，其中，去除所述光阻层507的方法为常规的灰化或刻蚀等方法。进一步，在去除所述柔性基板501上的光阻层的步骤中，减薄填充所述通孔502的光阻层的厚度，以使填充所述通孔502的光阻层的表面与所述柔性基板501的表面平齐，进而使得所述透明层403的表面与所述柔性基板501的表面平齐，使所述柔性基板501看上去为一个整体，不存在缺口等缺陷。
请参阅图5G，在所述柔性基板501及所述透明层503上形成一有机电致发光器件层504。其中，所述有机电致发光器件层504包括阵列排布的多个薄膜晶体管505和阵列排布的多个有机电致发光器件506。每个所述有机电致发光器件506被对应的一个所述薄膜晶体管505控制发光。所述薄膜晶体管505及所述有机电致发光器件506的结构为本领域常规设计，不再赘述。其中，所述透明层503上方（如图中虚线框A所围示的区域）的所述薄膜晶体管505及所述有机电致发光器件506的密度小于所述柔性基板501未设置所述透明层503的区域（如图中虚线框B所围示的区域）的所述薄膜晶体管505及所述有机电致发光器件506的密度。即在所述透明层503上方区域，所述薄膜晶体管505及所述有机电致发光器件506布置稀疏，从而避免所述薄膜晶体管505及所述有机电致发光器件506遮挡所述显示装置的功能组件。
请参阅图5H，去除所述硬质基板500，形成所述柔性OLED显示面板2。其中，在本实施例中，去除所述硬质基板500的方法为机械剥离。在现有技术中，在采用激光剥离工艺剥离硬质基板后再对柔性OLED面板进行切割，形成槽口10（请参阅图1），激光剥离工艺不会对槽口10裸露的边缘造成影响。而在本发明的制备方法中，在形成通孔502后再采用剥离工艺去除硬质基板500，若采用激光剥离的方法去除所述硬质基板500，则激光的能量会对所述通孔502的裸露的边缘造成影响，从而破坏所述柔性OLED显示面板。因此，在本实施例中，在所述硬质基板500与所述柔性基板501之间设置有离型膜510，所述离型膜510减弱了所述硬质基板500与所述柔性基板501之间附着力，因此，可以采用机械剥离的方法去除所述硬质基板500及离型膜510，从而避免激光能量对所述通孔502的裸露的边缘造成影响。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (12)

  1. 一种柔性OLED显示面板，其包括一柔性基板及一有机电致发光器件层，在所述柔性OLED显示面板的一上端部，所述柔性基板具有一通孔，所述通孔沿所述柔性基板的厚度方向贯穿所述柔性基板，一透明层填充在所述通孔内，所述有机电致发光器件层覆盖所述柔性基板及所述透明层，所述透明层朝向所述有机电致发光器件层的一表面与所述柔性基板朝向所述有机电致发光器件层的一表面平齐，所述有机电致发光器件层包括阵列排布的多个薄膜晶体管和阵列排布的多个有机电致发光器件，其中每个所述有机电致发光器件被对应的一个所述薄膜晶体管控制发光，所述通孔为一槽口。
  2. 根据权利要求1所述的柔性OLED显示面板，其中所述透明层上方的所述薄膜晶体管及所述有机电致发光器件的密度小于所述柔性基板未设置所述透明层的区域的所述薄膜晶体管及所述有机电致发光器件的密度。
  3. 一种柔性OLED显示面板，其包括一柔性基板及一有机电致发光器件层，在所述柔性OLED显示面板的一上端部，所述柔性基板具有一通孔，所述通孔沿所述柔性基板的厚度方向贯穿所述柔性基板，一透明层填充在所述通孔内，所述有机电致发光器件层覆盖所述柔性基板及所述透明层。
  4. 根据权利要求3所述的柔性OLED显示面板，其中所述透明层朝向所述有机电致发光器件层的一表面与所述柔性基板朝向所述有机电致发光器件层的一表面平齐。
  5. 根据权利要求4所述的柔性OLED显示面板，其中所述有机电致发光器件层包括阵列排布的多个薄膜晶体管和阵列排布的多个有机电致发光器件，其中每个所述有机电致发光器件被对应的一个所述薄膜晶体管控制发光。
  6. 根据权利要求4所述的柔性OLED显示面板，其中所述透明层上方的所述薄膜晶体管及所述有机电致发光器件的密度小于所述柔性基板未设置所述透明层的区域的所述薄膜晶体管及所述有机电致发光器件的密度。
  7. 根据权利要求3所述的柔性OLED显示面板，其中所述通孔为一槽口。
  8. 一种权利要求3所述的柔性OLED显示面板的制备方法，其包括如下步骤：提供一硬质基板；在所述硬质基板上形成一柔性基板；在所述柔性基板的一上端部，沿所述柔性基板的厚度方向对所述柔性基板进行切割，形成一沿所述柔性基板的厚度方向贯穿所述柔性基板的一通孔；在所述通孔内填充一透明层；在所述柔性基板及所述透明层上形成一有机电致发光器件层；以及去除所述硬质基板，形成所述柔性OLED显示面板。
  9. 根据权利要求8所述的柔性OLED显示面板的制备方法，其中所述制备方法还包括如下步骤：在所述硬质基板上制作一离型膜，在所述离型膜上形成所述柔性基板。
  10. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中在去除所述硬质基板的步骤中，采用机械剥离的方法去除所述硬质基板及所述离型膜。
  11. 根据权利要求8所述的柔性OLED显示面板的制备方法，其中在所述通孔内填充一透明层的方法包括如下步骤：在所述柔性基板上涂布一光阻层，所述光阻层填充所述通孔并覆盖所述柔性基板；去除所述柔性基板上的所述光阻层，并保留填充所述通孔的所述光阻层，填充所述通孔的所述光阻层成为所述透明层。
  12. 根据权利要求11所述的柔性OLED显示面板的制备方法，其中在去除所述柔性基板上的所述光阻层的步骤中，减薄填充所述通孔的所述光阻层的厚度，以使填充所述通孔的所述光阻层的一表面与所述柔性基板的一表面平齐。
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