WO2015180381A1 - 一种有机电致发光显示面板及显示装置 - Google Patents

一种有机电致发光显示面板及显示装置 Download PDF

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WO2015180381A1
WO2015180381A1 PCT/CN2014/089161 CN2014089161W WO2015180381A1 WO 2015180381 A1 WO2015180381 A1 WO 2015180381A1 CN 2014089161 W CN2014089161 W CN 2014089161W WO 2015180381 A1 WO2015180381 A1 WO 2015180381A1
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Prior art keywords
display panel
cathode
auxiliary electrode
layer
organic electroluminescence
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PCT/CN2014/089161
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English (en)
French (fr)
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宋泳锡
刘圣烈
崔承镇
金熙哲
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京东方科技集团股份有限公司
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Priority to US14/436,003 priority Critical patent/US10205121B2/en
Publication of WO2015180381A1 publication Critical patent/WO2015180381A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an organic electroluminescence display panel and a display device.
  • OLEDs organic electroluminescent display devices
  • OLED devices can be classified into top emission type OLED devices and bottom emission type OLED devices according to their positions on the light exit side.
  • the top emission type OLED device as shown in FIG. 1 , the first substrate 101 and the second substrate 102 are disposed opposite to each other, and the thin film transistor 103 disposed on the first substrate 101 facing the second substrate 102 is sequentially disposed.
  • the light emitted from the light-emitting layer 107 in the top emission type OLED device sequentially passes through the cathode 108, the package film 109, and the color filter layer 110, and then exits from the side of the second substrate 102, that is, the top of the OLED device.
  • a transparent conductive oxide film such as indium tin oxide (Indium Tin Oxides) may be formed by magnetron sputtering.
  • ITO indium tin oxide
  • the preparation of the cathode by magnetron sputtering causes damage to the light-emitting layer under the cathode, thereby affecting the luminous efficiency of the OLED; therefore, a thin layer of metal is generally formed by vapor deposition.
  • the cathode forms a thinner metal with a higher electrical resistance, especially when applied to larger sized OLED devices, which can result in a large voltage drop, which can damage the OLED device.
  • an embodiment of the present invention provides an organic electroluminescence display panel and a display device.
  • the invention solves the problem that the voltage drop of the conventional organic electroluminescence display panel is large due to the large resistance of the cathode.
  • an embodiment of the present invention provides an organic electroluminescence display panel comprising: a substrate; a top emission type organic electroluminescent structure on the substrate, the organic electroluminescent structure being included in An anode, a light emitting layer and a cathode disposed on the substrate substrate in sequence; and a packaging film coated on the organic electroluminescent structure; wherein the organic electroluminescent display panel further comprises: in the package An auxiliary electrode disposed on the film, the auxiliary electrode being electrically connected to the cathode through a via hole penetrating the package film.
  • the auxiliary electrode is additionally disposed on the package film, and the auxiliary electrode is electrically connected to the cathode through the via hole penetrating the package film, the auxiliary electrode electrically connected to the cathode is thus provided.
  • the equivalent thickness of the cathode can be increased, so that the resistance of the cathode can be reduced, and the problem that the voltage drop due to the large resistance of the cathode is large when the thin metal is used as the cathode can be avoided, thereby avoiding the voltage drop due to the voltage drop. Large and damaging problems with organic electroluminescent display panels.
  • the organic electroluminescent display panel provided by the embodiment of the present invention further includes: a filling layer disposed on the packaging film, the auxiliary electrode being formed on the filling layer; The auxiliary electrode is electrically connected to the cathode through a via hole penetrating the filling layer and the package film.
  • the method further includes: each of the substrate substrate and the cathode and defining the display panel a pixel defining layer of the pixel region; an orthographic projection of the via hole penetrating the filling layer and the package film in a region where the pixel defining layer is located.
  • the pixel defining layer is located between the anode and the light emitting layer, or is located at the cathode and the cathode Between the luminescent layers.
  • the pattern of the light emitting layer is The filling layer and the via hole corresponding to the package film have a hollowed out area.
  • the contact surface of the filling layer and the auxiliary electrode has a plurality of concave and convex structures arranged in an array.
  • the filling layer is a color filter layer including at least three filters of different colors.
  • the contact surface of the color filter layer and the auxiliary electrode has a plurality of concave and convex structures arranged in an array.
  • the concave-convex structure is a spherical defect structure protruding toward the auxiliary electrode.
  • the depths of the spherical defects are the same, and the radius of the bottom surface of each of the spherical defects is the same.
  • a ratio of a depth of the spherical defect to a radius of a bottom surface of the spherical defect is 0.026-0.268:1.
  • the embodiment of the invention further provides a display device comprising the above-mentioned organic electroluminescent display panel provided by the embodiment of the invention.
  • FIG. 1 is a schematic structural view of a conventional organic electroluminescence display device
  • FIG. 5 are schematic structural views of an organic electroluminescence display panel provided by different embodiments of the present invention.
  • FIG. 6 is a schematic structural view of a spherical filter having a color filter layer in an organic electroluminescence display panel according to an embodiment of the present invention
  • FIG. 7a-7j are structural schematic views showing a manufacturing process of the organic electroluminescence display panel shown in FIG. 5, respectively.
  • each film layer in the drawings do not reflect the true proportion thereof, and the positional relationship of each film layer may also be changed, and some film layers may be omitted. Therefore, the drawings are merely illustrative of exemplary embodiments of the present invention. It is not intended to limit the invention.
  • Fig. 2 schematically shows the structure of an organic electroluminescence display panel according to an embodiment of the present invention.
  • the organic electroluminescent display panel comprises: a substrate substrate 1 and a substrate base a top emission type organic electroluminescence structure 2 on the board 1 and an encapsulation film 3 coated on the organic electroluminescence structure 2; wherein the organic electroluminescence structure 2 includes an anode which is sequentially stacked on the base substrate 1. 4.
  • the auxiliary electrode 8 is additionally disposed on the package film 3, and the auxiliary electrode 8 is electrically connected to the cathode 6 through the via hole A penetrating the package film 3, thus 6
  • the electrically connected auxiliary electrode 8 can increase the equivalent thickness of the cathode 6, so that the resistance of the cathode 6 can be reduced, and the voltage drop due to the large resistance of the cathode 6 when a thin metal is used as the cathode 6 can be avoided.
  • a larger problem can further avoid the problem of damaging the organic electroluminescent display panel due to a large voltage drop.
  • the via A for electrically connecting the auxiliary electrode 8 and the cathode 6 can be formed by patterning the package film 3 by the filling layer 7.
  • the function of the filling layer 7 is similar to that of the photoresist used in the existing patterning process. Specifically, after the filling and developing process is performed on the filling layer 7, the encapsulating film 3 not covering the filling layer 7 is etched to form a via hole A in the encapsulating film 3, and then the filling over the encapsulating film 3 can be removed. Layer 7, an auxiliary electrode 8 is formed on the encapsulation film 3.
  • the filling layer 7 is left over the encapsulating film 3 after the via A is formed in the encapsulating film 3 by the filling layer 7, so that not only the peeling step in the patterning process but also the remaining step can be omitted.
  • the filling layer 7 can also protect the underlying encapsulating film 3 from being damaged when the auxiliary electrode 8 is fabricated.
  • the filling layer 7 may be made of a material such as an organic resin. .
  • the auxiliary layer 8 and the light-emitting layer 5 have the filling layer 7, the encapsulating film 3, and the cathode 6, even if a transparent conductive oxide such as indium tin oxide (Indium Tin Oxides) is used by magnetron sputtering.
  • a transparent conductive oxide such as indium tin oxide (Indium Tin Oxides) is used by magnetron sputtering.
  • the ITO film has good light transmittance, and a thick ITO film can be formed to ensure that the auxiliary electrode 8 has a small electrical resistance, and thus The cathode 6 electrically connected to the auxiliary electrode 8 is ensured to have a small electric resistance, so that the problem of large voltage drop due to the large resistance of the cathode 6 can be avoided, thereby avoiding the problem of damaging the display panel due to a large voltage drop. .
  • the organic electroluminescent display panel may further include: between the substrate substrate 1 and the cathode 6 and used for The pixel defining layer 9 that defines each pixel region of the display panel (the two pixel regions are illustrated in FIG. 2 as an example) is defined.
  • the orthographic projection of the via hole A penetrating the filling layer 7 and the package film 3 in the direction perpendicular to the substrate substrate 1 may be located in the region where the pixel defining layer 9 is located, that is, The via hole A penetrating the filling layer 7 and the package film 3 is not provided in each pixel region of the display panel, and the via hole A penetrating the filling layer 7 and the package film 3 is disposed directly above the pixel defining layer 9.
  • a via hole A penetrating the filling layer 7 and the package film 3 may be disposed directly above all of the pixel defining layers 9; or, a via hole A penetrating the filling layer 7 and the package film 3 may be disposed directly above the portion of the pixel defining layer 9. , not limited here.
  • the pixel defining layer 9 may be located between the anode 4 and the light emitting layer 5, as shown in FIG. 2; or, the pixel defining layer 9 may be located between the cathode 6 and the light emitting layer 5, where Make a limit.
  • the light emitting layer 5 when the pixel defining layer 9 is located between the anode 4 and the light emitting layer 5, that is, when the light emitting layer 5 is located above the pixel defining layer 9, as shown in FIG. 3, the light emitting layer 5 may be in the through filling layer 7.
  • the position corresponding to the via A of the package film 3 is set to have a cutout region, that is, a pattern in which the light-emitting layer 5 is not provided at a position corresponding to the via A passing through the filling layer 7 and the package film 3.
  • the pattern of the light-emitting layer 5 having the hollowed out region can be formed by a patterning process using a mask.
  • the color filter layer can be directly disposed on the side of the base substrate 1 and constitute a filling layer, since the filling layer 7 serves as a color filter layer. Therefore, it is not necessary to affix the second substrate with the color filter layer as in the prior art shown in Fig. 1, thereby avoiding the reduction of the aperture ratio of the display device due to the use of the adhesive.
  • a color filter layer including at least three filters 10 of different colors is used as the filling layer 7.
  • 4 is an illustration of a filter 10 in which the color filter layer includes three colors of red (R), green (G), and blue (B).
  • the color filter layer may further include four colors of red (R), green (G), blue (B), and yellow (Y) filters; or, the color filter layer may also include other color combinations.
  • the filter is not limited here.
  • a second substrate may be provided on the auxiliary electrode 8 of the organic electroluminescence display device shown in FIG. 4 as needed.
  • the contact faces of the color filter layer and the auxiliary electrode 8 may be disposed to have a plurality of uneven structures arranged in an array.
  • the auxiliary electrode 8 formed on the color filter layer also has a plurality of uneven structures arranged in an array.
  • the color filter layer having a plurality of uneven structures arranged in an array can not only scatter the light emitted from the light-emitting layer 5 at the contact surface of the color filter layer and the auxiliary electrode 8, but also increase The luminous efficiency of the large light-emitting layer 5 can also eliminate the diffuse reflection of light outside the display panel, thereby enhancing the display brightness of the display panel.
  • the uneven structure may be constituted by a plurality of spherical missing structures protruding in the direction of the auxiliary electrode 8.
  • Figure 6 shows only one ball missing.
  • the uneven structure may be a similar structure that can scatter light emitted from the luminescent layer 5 in the direction of the auxiliary electrode 8, such as a tapered structure, and is not limited herein.
  • the shape of each spherical defect can be set to be uniform, as shown in FIG.
  • the depth h of each ball is set to be the same, and the radius r of the bottom surface of each ball is set to be the same.
  • the depth h of the ball defect is the maximum value of the vertical distance from the point on the spherical surface B of the spherical defect to the bottom surface C of the spherical defect.
  • the shape of each ball missing may be set to be inconsistent, and is not limited herein.
  • the ratio of the depth h of the spherical defect to the radius r of the bottom surface C of the spherical defect can be controlled within a range of 0.026-0.268:1, that is, the section E of the ball missing at the point D and The angle between the bottom surface C of the ball missing is controlled within a range of 3°-30°, wherein the point D is any point on the circle formed by the intersection of the bottom surface C of the spherical portion and the spherical surface B.
  • a plurality of uneven structures arranged in an array as described above may be provided on the contact faces of the filling layer 7 and the auxiliary electrode 8 which are not used as the color filter layer to enhance the display brightness of the display panel.
  • the organic electroluminescent display panel provided by the embodiment of the present invention may be an active driving organic electroluminescent display panel, that is, the display panel further includes display of each pixel area for driving the display panel.
  • the organic electroluminescent display panel according to the inventive concept may also be a passively driven organic electroluminescent display panel, that is, no thin film transistor is disposed in the display panel, which is not limited herein.
  • the preparation method may specifically include the following steps:
  • An insulating layer is formed on the base substrate 1 on which the pattern of the thin film transistor 11 is formed, and a via hole is formed in the insulating layer above the drain of the thin film transistor 11, as shown in FIG. 7b;
  • a pattern of a color filter layer is formed on the package film 3, as shown in FIG. 7h;
  • the encapsulation film 3 of the pattern not covering the color filter layer is etched to form a via A extending through the color filter layer and the encapsulation film 3, as shown in FIG. 7j;
  • a method of magnetron sputtering is used to form an ITO film on the substrate 1 having the vias penetrating the color filter layer and the package film 3, as the auxiliary electrode 8, and the auxiliary electrode 8 passes through the via A and the cathode. 6 electrical connection, as shown in Figure 5.
  • an embodiment of the present invention further provides a display device including the above-described organic electroluminescent display panel provided by the above embodiments.
  • the display device can be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the auxiliary electrode is additionally disposed on the package film of the organic electroluminescence display panel, and the auxiliary electrode is electrically connected to the cathode through the via hole penetrating the package film, In this way, the auxiliary electrode electrically connected to the cathode can increase the equivalent thickness of the cathode, thereby reducing the resistance of the cathode and avoiding the use of a thinner metal as a cathode.
  • the voltage drop of the cathode is large, the voltage drop is large, and the problem that the organic electroluminescence display panel is damaged due to a large voltage drop and the display device is damaged can be avoided.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开了一种有机电致发光显示面板，包括：衬底基板；位于所述衬底基板上的顶发射型的有机电致发光结构，所述有机电致发光结构包括在所述衬底基板上依次层叠设置的阳极、发光层和阴极；以及包覆于所述有机电致发光结构上的封装薄膜；其中，所述有机电致发光显示面板还包括：在所述封装薄膜上设置的辅助电极；所述辅助电极通过贯穿所述封装薄膜的过孔与所述阴极电性连接。由于在封装薄膜上增加设置辅助电极，且辅助电极通过贯穿封装薄膜的过孔与阴极电性连接，这样，与阴极电性连接的辅助电极可以增大阴极的等效厚度，从而可以减小阴极的电阻，可以避免采用较薄的金属作为阴极时由于阴极的电阻较大而导致的电压降较大的问题，进而可以避免由于电压降较大而损坏有机电致发光显示面板的问题。

Description

一种有机电致发光显示面板及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种有机电致发光显示面板及显示装置。
背景技术
在现有的平板显示器件中，有机电致发光显示器件(Organic Electroluminesecent Display，OLED)凭借其低功耗、高色饱和度、广视角等特点，已经逐渐成为显示领域的主流。
OLED器件按照其出光侧的位置不同可以分为顶发射型OLED器件和底发射型OLED器件。在顶发射型OLED器件中，如图1所示，一般包括：相对而置的第一基板101和第二基板102，第一基板101面向第二基板102的一侧依次设置的薄膜晶体管103、绝缘层104、阳极105、像素限定层106、发光层107、阴极108和封装薄膜109，以及第二基板102面向第一基板101的一侧设置的彩色滤光层110。顶发射型OLED器件中的发光层107发出的光依次经过阴极108、封装薄膜109和彩色滤光层110后，从第二基板102一侧即OLED器件的顶部出射。
在上述顶发射型OLED器件中，为了使发光层发出的光能够透过阴极从OLED的顶部出射，可以采用磁控溅射的方式形成一层透明导电氧化物薄膜例如氧化铟锡(Indium Tin Oxides，ITO)作为阴极，但采用磁控溅射的方式制备阴极会对阴极下方的发光层造成损坏，从而影响OLED的发光效率；因此，一般采用气相沉积的方式形成一层厚度较薄的金属作为阴极，然而，形成的厚度较薄的金属的电阻较大，尤其是应用于较大尺寸的OLED器件时，会导致较大的电压降，进而会损坏OLED器件。
因此，如何避免由于阴极的电阻较大而导致的电压降较大的问题，是本领域技术人员亟需解决的技术问题。
发明内容
有鉴于此，本发明实施例提供了一种有机电致发光显示面板及显示装置， 用以解决现有的有机电致发光显示面板由于阴极的电阻较大而导致的电压降较大的问题。
因此，本发明实施例提供了一种有机电致发光显示面板，包括：衬底基板；位于所述衬底基板上的顶发射型的有机电致发光结构，所述有机电致发光结构包括在所述衬底基板上依次层叠设置的阳极、发光层和阴极；以及包覆于所述有机电致发光结构上的封装薄膜；其中，所述有机电致发光显示面板还包括：在所述封装薄膜上设置的辅助电极，所述辅助电极通过贯穿所述封装薄膜的过孔与所述阴极电性连接。
本发明实施例提供的上述有机电致发光显示面板，由于在封装薄膜上增加设置辅助电极，且辅助电极通过贯穿封装薄膜的过孔与阴极电性连接，这样，与阴极电性连接的辅助电极可以增大阴极的等效厚度，从而可以减小阴极的电阻，可以避免采用较薄的金属作为阴极时由于阴极的电阻较大而导致的电压降较大的问题，进而可以避免由于电压降较大而损坏有机电致发光显示面板的问题。
在一种可能的实现方式中，在本发明实施例提供的上述的有机电致发光显示面板还包括：在所述封装薄膜上设置的填充层，所述辅助电极形成在所述填充层上；其中，所述辅助电极通过贯穿所述填充层和封装薄膜的过孔与所述阴极电性连接。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，还包括：位于所述衬底基板和所述阴极之间且用于限定所述显示面板的各像素区域的像素限定层；贯穿所述填充层和封装薄膜的过孔在所述衬底基板的正投影位于所述像素限定层所在区域内。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，所述像素限定层位于所述阳极与所述发光层之间，或位于所述阴极与所述发光层之间。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，所述发光层位于所述像素限定层之上时，所述发光层的图形在与贯穿所述填充层和封装薄膜的过孔对应的位置具有镂空区域。
在一种可能的实现方式中，在本发明实施例提供的有机电致发光显示面板中，所述填充层与所述辅助电极的接触面具有呈阵列排布的多个凹凸结构。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，所述填充层为包括至少三种颜色不同的滤光片的彩色滤光层。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，所述彩色滤光层与所述辅助电极的接触面具有呈阵列排布的多个凹凸结构。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，所述凹凸结构为凸向所述辅助电极方向的球缺结构。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，各所述球缺的深度相同，且各所述球缺的底面的半径相同。
在一种可能的实现方式中，在本发明实施例提供的上述有机电致发光显示面板中，所述球缺的深度与所述球缺的底面的半径的比为0.026-0.268∶1。
本发明实施例还提供了一种显示装置，包括本发明实施例提供的上述有机电致发光显示面板。
附图说明
图1为现有的有机电致发光显示器件的结构示意图；
图2-图5分别为本发明的不同实施例提供的有机电致发光显示面板的结构示意图；
图6为本发明的一个实施例提供的有机电致发光显示面板中的彩色滤光层具有的球缺的结构示意图；
图7a-图7j分别为如图5所示的有机电致发光显示面板的制作过程的结构示意图。
具体实施方式
下面结合附图，对本发明实施例提供的有机电致发光显示面板及显示装置的具体实施方式进行详细地说明。
附图中各膜层的形状和厚度不反映其真实比例，并且，各膜层的位置关系也可以变化，有的膜层可以省略，因此，附图只是示意说明本发明的示例性实施例，并非用于限制本发明。
图2示意地示出了根据本发明的一个实施例的有机电致发光显示面板的结构。如图2所示，所述有机电致发光显示面板包括：衬底基板1、位于衬底基 板1上的顶发射型的有机电致发光结构2以及包覆于有机电致发光结构2上的封装薄膜3；其中，有机电致发光结构2包括在衬底基板1上依次层叠设置的阳极4、发光层5和阴极6；还包括：在封装薄膜3上设置的辅助电极8；辅助电极8通过贯穿封装薄膜3的过孔A与阴极6电性连接。
本发明实施例提供的上述有机电致发光显示面板，由于在封装薄膜3上增加设置辅助电极8，且辅助电极8通过贯穿封装薄膜3的过孔A与阴极6电性连接，这样，与阴极6电性连接的辅助电极8可以增大阴极6的等效厚度，从而可以减小阴极6的电阻，可以避免采用较薄的金属作为阴极6时由于阴极6的电阻较大而导致的电压降较大的问题，进而可以避免由于电压降较大而损坏有机电致发光显示面板的问题。
如图2所示，实现辅助电极8与阴极6电性连接的过孔A可通过利用填充层7对封装薄膜3进行构图工艺形成。其中，填充层7的作用与现有的构图工艺中使用的光刻胶的作用相类似。具体地，在对填充层7进行曝光和显影处理后，对未覆盖填充层7的封装薄膜3进行刻蚀处理，在封装薄膜3中形成过孔A，之后，可以去除封装薄膜3上方的填充层7，在封装薄膜3上制作辅助电极8。
图2示出了通过填充层7在封装薄膜3中形成过孔A之后，将填充层7保留在封装薄膜3上方的实施例，这样，不仅可以省去构图工艺中的剥离步骤，而且保留的填充层7还可以保护下方的封装薄膜3在制作辅助电极8时不被损坏。填充层7可选用有机树脂等材料。。
根据上述实施例的构造，辅助电极8与发光层5之间具有填充层7、封装薄膜3和阴极6，即使采用磁控溅射的方式利用透明导电氧化物例如氧化铟锡(Indium Tin Oxides，ITO)等制备辅助电极8，发光层5也不会受到影响；同时，ITO薄膜具有很好的透光性，可以制作较厚的ITO薄膜，以保证辅助电极8具有较小的电阻，进而可以保证与辅助电极8电性连接的阴极6具有较小的电阻，从而可以避免由于阴极6电阻较大而导致的电压降较大的问题，进而可以避免由于电压降较大而损坏显示面板的问题。
根据一个实施例，为了避免显示面板的各像素区域之间发生混光的现象，如图2所示，有机电致发光显示面板还可以包括：位于衬底基板1和阴极6之间且用于限定显示面板的各像素区域(图2以示出3个像素区域为例进行说明)的像素限定层9。
通过贯穿填充层7和封装薄膜3的过孔A，外部环境中的氧气或水分可能会污染各像素区域的发光层5，从而影响显示面板的正常显示。为了避免上述问题的出现，如图2所示，可以使贯穿填充层7和封装薄膜3的过孔A在垂直于衬底基板1的方向上的正投影位于像素限定层9所在区域内，即在显示面板的各像素区域内不设置贯穿填充层7和封装薄膜3的过孔A，而将贯穿填充层7和封装薄膜3的过孔A设置在像素限定层9的正上方。
可以在所有像素限定层9的正上方设置贯穿填充层7和封装薄膜3的过孔A；或者，也可以在部分像素限定层9的正上方设置贯穿填充层7和封装薄膜3的过孔A，在此不做限定。
具体地，如图2所示，像素限定层9可以位于阳极4与发光层5之间，如图2所示；或者，像素限定层9可以位于阴极6与发光层5之间，在此不做限定。
根据一个实施例，在像素限定层9位于阳极4与发光层5之间，即发光层5位于像素限定层9之上时，如图3所示，可以将发光层5在与贯穿填充层7和封装薄膜3的过孔A对应的位置设置为具有镂空区域，即在与贯穿填充层7和封装薄膜3的过孔A对应的位置不设置发光层5的图形。根据这种结构，可以避免通过贯穿填充层7和封装薄膜3的过孔A外部环境中的氧气或水分污染发光层5。具体地，具有镂空区域的发光层5的图形可以利用掩膜板采用构图工艺形成。
在现有的如图1所示结构的有机电致发光显示器件中，需要使用粘合剂将第一基板101与第二基板102进行对盒处理，显示器件的尺寸越大，需要使用的粘合剂就会越多，这样，粘合剂所占用的面积就会越大，从而影响显示器件的开口率。基于此，在根据本发明的一个实施例的有机电致发光显示面板中，可以将彩色滤光层直接设置在衬底基板1一侧，并构成填充层，由于填充层7作为彩色滤光层，故不需要像图1所示的现有技术中一样粘贴带有彩色滤光层的第二基板，从而避免了由于使用粘合剂而减小显示器件的开口率。
具体地，如图4所示，用包括至少三种颜色不同的滤光片10的彩色滤光层作为填充层7。图4是以彩色滤光层包括红色(R)、绿色(G)和蓝色(B)三种颜色的滤光片10为例进行说明的。当然，彩色滤光层还可以包括红色(R)、绿色(G)、蓝色(B)和黄色(Y)四种颜色的滤光片；或者，彩色滤光层还可以包括其他颜色组合的滤光片，在此不做限定。
当然，根据需要，也可以在图4所示的有机电致发光显示器件的辅助电极8上方上设置第二基板。
根据本发明的一个实施例，如图5所示，可以将彩色滤光层与辅助电极8的接触面设置为具有呈阵列排布的多个凹凸结构。相应地，形成在彩色滤光层上的辅助电极8也具有呈阵列排布的多个凹凸结构。如图5所示的箭头所示，具有呈阵列排布的多个凹凸结构的彩色滤光层不仅可以使发光层5发出的光在彩色滤光层与辅助电极8的接触面发生散射，增大发光层5的发光效率，还可以消除显示面板外部的光的漫反射，从而可以增强显示面板的显示亮度。
具体地，如图6所示，凹凸结构可以由凸向辅助电极8方向的多个球缺结构构成。图6仅示出一个球缺。或者，凹凸结构还可以为凸向辅助电极8方向的可以使发光层5发出的光发生散射的其他类似结构，例如锥形结构等，在此不做限定。
较佳地，为了使整个显示面板的显示亮度较为均匀，在根据本发明的一个实施例的有机电致发光显示面板中，可以将各球缺的形状设置为一致，如图6所示，将各球缺的深度h设置为相同，且将各球缺的底面的半径r设置为相同。其中，球缺的深度h为球缺的球面B上的点到球缺的底面C上的垂直距离的最大值。当然，也可以将各球缺的形状设置为不一致，在此不做限定。
另外，如图6所示，可以将球缺的深度h与球缺的底面C的半径r的比控制在0.026-0.268∶1的范围内，即，将球缺在点D处的切面E与球缺的底面C之间的夹角控制在3°-30°范围内，其中，点D为球缺的底面C与球面B相交而成的圆上的任意一点。根据上述构造，可以保证发光层发出的光在彩色滤光层与辅助电极8的接触面发生散射的效果较佳。
当然，也可以在不作为彩色滤光层的填充层7与辅助电极8的接触面上设置如上所述的呈阵列排布的多个凹凸结构，以增强显示面板的显示亮度。
此外，如图2-图5所示，本发明实施例提供的有机电致发光显示面板可以为有源驱动有机电致发光显示面板，即显示面板还包括用于驱动显示面板的各像素区域显示的薄膜晶体管11，其中，薄膜晶体管11的漏极与有机电致发光结构2中的阳极4电性连接。或者，根据本发明构思的有机电致发光显示面板也可以为无源驱动有机电致发光显示面板，即在显示面板中不设置薄膜晶体管，在此不做限定。
下面以一个具体的实例对本发明实施例提供的上述有机电致发光显示面板的制备方法的具体实现方式进行详细的说明。
以如图5所示的有机电致发光显示面板为例，其制备方法具体可以包括以下步骤：
1、在衬底基板1上形成薄膜晶体管11的图形，如图7a所示；
2、在形成有薄膜晶体管11的图形的衬底基板1上形成绝缘层，并在薄膜晶体管11的漏极上方的绝缘层中形成过孔，如图7b所示；
3、在具有过孔的绝缘层的上方形成阳极4的图形，如图7c所示；
4、在形成有阳极4的图形的衬底基板1上形成像素限定层9的图形，如图7d所示；
5、在形成有像素限定层9的图形的衬底基板1上形成发光层5的图形，如图7e所示；
6、在形成有发光层5的图形的衬底基板1上形成阴极6，如图7f所示；
7、在阴极6上形成封装薄膜3，如图7g所示；
8、在封装薄膜3上形成彩色滤光层的图形，如图7h所示；
9、对彩色滤光层的图形进行压花处理，形成具有呈阵列排布的多个凹凸结构，如图7i所示；
10、对未覆盖彩色滤光层的图形的封装薄膜3进行刻蚀处理，形成贯穿彩色滤光层和封装薄膜3的过孔A，如图7j所示；
11、采用磁控溅射的方式在具有贯穿彩色滤光层和封装薄膜3的过孔A的衬底基板1上形成一层ITO薄膜，作为辅助电极8，辅助电极8通过过孔A与阴极6电性连接，如图5所示。
基于同一发明构思，本发明实施例还提供了一种显示装置，包括上述实施例提供的上述有机电致发光显示面板。该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
根据本发明实施例提供的有机电致发光显示面板及显示装置，由于在有机电致发光显示面板的封装薄膜上增加设置辅助电极，且辅助电极通过贯穿封装薄膜的过孔与阴极电性连接，这样，与阴极电性连接的辅助电极可以增大阴极的等效厚度，从而可以减小阴极的电阻，可以避免采用较薄的金属作为阴极 时由于阴极的电阻较大而导致的电压降较大的问题，进而可以避免由于电压降较大而损坏有机电致发光显示面板，进而损坏显示装置的问题。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (20)

  1. 一种有机电致发光显示面板，包括：
    衬底基板；
    位于所述衬底基板上的顶发射型的有机电致发光结构，所述有机电致发光结构包括在所述衬底基板上依次层叠设置的阳极、发光层和阴极；以及
    包覆于所述有机电致发光结构上的封装薄膜；
    其中，所述有机电致发光显示面板还包括在所述封装薄膜上设置的辅助电极，所述辅助电极通过贯穿所述封装薄膜的过孔与所述阴极电性连接。
  2. 如权利要求1所述的有机电致发光显示面板，还包括：在所述封装薄膜上设置的填充层，所述辅助电极形成在所述填充层上；
    其中，所述辅助电极通过贯穿所述填充层和封装薄膜的过孔与所述阴极电性连接。
  3. 如权利要求2所述的有机电致发光显示面板，其特征在于，还包括：位于所述衬底基板和所述阴极之间且用于限定所述显示面板的各像素区域的像素限定层；
    贯穿所述填充层和封装薄膜的过孔在垂直于所述衬底基板的方向上的正投影位于所述像素限定层所在区域内。
  4. 如权利要求3所述的有机电致发光显示面板，其中，所述像素限定层位于所述阳极与所述发光层之间，或位于所述阴极与所述发光层之间。
  5. 如权利要求4所述的有机电致发光显示面板，其特征在于，所述发光层位于所述像素限定层之上时，所述发光层的图形在与贯穿所述填充层和封装薄膜的过孔对应的位置具有镂空区域。
  6. 如权利要求2所述的有机电致发光显示面板，其特征在于，所述填充层与所述辅助电极的接触面具有呈阵列排布的多个凹凸结构。
  7. 如权利要求2所述的有机电致发光显示面板，其特征在于，所述填充层为包括至少三种颜色不同的滤光片的彩色滤光层。
  8. 如权利要求3所述的有机电致发光显示面板，其特征在于，所述填充层为包括至少三种颜色不同的滤光片的彩色滤光层。
  9. 如权利要求4所述的有机电致发光显示面板，其特征在于，所述填充层为包括至少三种颜色不同的滤光片的彩色滤光层。
  10. 如权利要求5所述的有机电致发光显示面板，其特征在于，所述填充层为包括至少三种颜色不同的滤光片的彩色滤光层。
  11. 如权利要求7所述的有机电致发光显示面板，其特征在于，所述彩色滤光层与所述辅助电极的接触面具有呈阵列排布的多个凹凸结构。
  12. 如权利要求11所述的有机电致发光显示面板，其特征在于，所述凹凸结构由凸向所述辅助电极方向的球缺结构构成。
  13. 如权利要求12所述的有机电致发光显示面板，其特征在于，各所述球缺的深度相同，且各所述球缺的底面的半径相同。
  14. 如权利要求13所述的有机电致发光显示面板，其特征在于，所述球缺的深度与所述球缺的底面的半径的比为0.026-0.268∶1。
  15. 如权利要求2所述的有机电致发光显示面板，其特征在于，所述阴极通过汽相沉积的方式形成。
  16. 如权利要求2所述的有机电致发光显示面板，其特征在于，所述辅助电极通过磁控溅射的方式形成。
  17. 如权利要求2所述的有机电致发光显示面板，其特征在于，所述辅助电极与所述阴极的材料相同。
  18. 如权利要求2所述的有机电致发光显示面板，其特征在于，所述填充层的材料为有机树脂。
  19. 如权利要求2所述的有机电致发光显示面板，其特征在于，还包括位于辅助电极上方的第二基板。
  20. 一种显示装置，其特征在于，包括：如权利要求1-19任一项所述的有机电致发光显示面板。
PCT/CN2014/089161 2014-05-30 2014-10-22 一种有机电致发光显示面板及显示装置 WO2015180381A1 (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107579093A (zh) * 2016-07-04 2018-01-12 三星显示有限公司 有机发光显示装置
CN110867470A (zh) * 2019-11-21 2020-03-06 武汉天马微电子有限公司 一种显示面板、制备方法及显示装置
WO2020143158A1 (en) 2019-01-10 2020-07-16 Boe Technology Group Co., Ltd. Display substrate, manufacturing method thereof, and display panel

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104022139B (zh) 2014-05-30 2016-03-30 京东方科技集团股份有限公司 一种有机电致发光显示面板及显示装置
CN104659063A (zh) * 2014-12-30 2015-05-27 京东方科技集团股份有限公司 显示基板及其制造方法、显示面板和掩膜板
CN105097842A (zh) 2015-08-11 2015-11-25 京东方科技集团股份有限公司 有源矩阵有机发光二极管阵列基板及制作方法和显示装置
CN105870352B (zh) * 2016-04-05 2019-01-01 广东聚华印刷显示技术有限公司 一种显示面板的薄膜封装结构及其制备方法
CN105914226A (zh) * 2016-05-30 2016-08-31 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置及掩模板
CN105870159B (zh) * 2016-06-07 2018-07-17 京东方科技集团股份有限公司 一种有机发光二极管显示面板、显示装置及制作方法
CN106252525B (zh) * 2016-08-26 2018-03-27 京东方科技集团股份有限公司 Oled器件及制作方法、显示面板以及显示装置
KR102656795B1 (ko) * 2016-11-30 2024-04-11 엘지디스플레이 주식회사 유기발광 표시장치와 그의 제조방법
CN106783881A (zh) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板及其制造方法
KR102663231B1 (ko) * 2016-12-30 2024-05-02 엘지디스플레이 주식회사 유기발광 표시장치
CN107256878A (zh) 2017-06-09 2017-10-17 京东方科技集团股份有限公司 一种有机电致发光显示面板及其制备方法
CN107342372A (zh) * 2017-08-30 2017-11-10 京东方科技集团股份有限公司 顶发射有机电致发光二极管显示器件及其制造方法
CN109671738B (zh) * 2017-10-13 2021-02-05 京东方科技集团股份有限公司 阵列基板、显示面板及其制作方法和显示装置
CN107808897A (zh) * 2017-11-30 2018-03-16 京东方科技集团股份有限公司 一种有机发光二极管显示基板及其制作方法、显示装置
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CN110911583B (zh) * 2019-11-28 2022-07-01 京东方科技集团股份有限公司 有机发光显示盖板及制作方法、显示装置
CN111477664B (zh) * 2020-04-26 2023-11-24 合肥鑫晟光电科技有限公司 一种显示面板及其制作方法、显示装置
CN111785760B (zh) * 2020-07-20 2023-09-29 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示装置
KR20220064014A (ko) * 2020-11-11 2022-05-18 엘지디스플레이 주식회사 발광 소자 및 터치 전극을 포함하는 디스플레이 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002343579A (ja) * 2001-05-11 2002-11-29 Sony Corp 有機ｅｌ素子および画像表示装置
CN1645979A (zh) * 2003-11-28 2005-07-27 三星电子株式会社 有机发光显示器及其制造方法
CN1812119A (zh) * 2004-12-14 2006-08-02 三星Sdi株式会社 具有辅助电极线的有机发光显示器及其制造方法
CN103311265A (zh) * 2012-03-08 2013-09-18 群康科技(深圳)有限公司 有机发光二极管显示面板及其制造方法
CN104022139A (zh) * 2014-05-30 2014-09-03 京东方科技集团股份有限公司 一种有机电致发光显示面板及显示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717181B2 (en) * 2001-02-22 2004-04-06 Semiconductor Energy Laboratory Co., Ltd. Luminescent device having thin film transistor
KR100825317B1 (ko) * 2001-12-31 2008-04-28 엘지디스플레이 주식회사 유기전계발광소자
KR100606772B1 (ko) * 2004-12-02 2006-08-01 엘지전자 주식회사 유기 ｅｌ 소자의 제조방법
JP5423325B2 (ja) * 2009-11-10 2014-02-19 ソニー株式会社 発光素子及びその製造方法
JP2013196919A (ja) * 2012-03-21 2013-09-30 Sony Corp 有機ｅｌ表示装置、有機ｅｌ表示装置の製造方法およびカラーフィルタ基板
KR101407590B1 (ko) * 2012-11-19 2014-06-13 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
CN202930382U (zh) * 2012-12-12 2013-05-08 京东方科技集团股份有限公司 阵列基板及显示装置
JP2015069700A (ja) * 2013-09-26 2015-04-13 株式会社ジャパンディスプレイ 表示装置
US9905797B2 (en) 2013-10-25 2018-02-27 Boe Technology Group Co., Ltd. OLED display device and fabrication method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002343579A (ja) * 2001-05-11 2002-11-29 Sony Corp 有機ｅｌ素子および画像表示装置
CN1645979A (zh) * 2003-11-28 2005-07-27 三星电子株式会社 有机发光显示器及其制造方法
CN1812119A (zh) * 2004-12-14 2006-08-02 三星Sdi株式会社 具有辅助电极线的有机发光显示器及其制造方法
CN103311265A (zh) * 2012-03-08 2013-09-18 群康科技(深圳)有限公司 有机发光二极管显示面板及其制造方法
CN104022139A (zh) * 2014-05-30 2014-09-03 京东方科技集团股份有限公司 一种有机电致发光显示面板及显示装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107579093A (zh) * 2016-07-04 2018-01-12 三星显示有限公司 有机发光显示装置
CN107579093B (zh) * 2016-07-04 2023-05-26 三星显示有限公司 有机发光显示装置
WO2020143158A1 (en) 2019-01-10 2020-07-16 Boe Technology Group Co., Ltd. Display substrate, manufacturing method thereof, and display panel
EP3915149A4 (en) * 2019-01-10 2022-12-14 BOE Technology Group Co., Ltd. DISPLAY SUBSTRATE, METHOD OF MAKING IT, AND DISPLAY PANEL
US11637266B2 (en) 2019-01-10 2023-04-25 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate, manufacturing method thereof, and display panel
CN110867470A (zh) * 2019-11-21 2020-03-06 武汉天马微电子有限公司 一种显示面板、制备方法及显示装置

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