WO2020057330A1 - 一种抛光装卸部件模块 - Google Patents

一种抛光装卸部件模块 Download PDF

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Publication number
WO2020057330A1
WO2020057330A1 PCT/CN2019/102950 CN2019102950W WO2020057330A1 WO 2020057330 A1 WO2020057330 A1 WO 2020057330A1 CN 2019102950 W CN2019102950 W CN 2019102950W WO 2020057330 A1 WO2020057330 A1 WO 2020057330A1
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WO
WIPO (PCT)
Prior art keywords
loading
unloading
polishing
module
polishing head
Prior art date
Application number
PCT/CN2019/102950
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English (en)
French (fr)
Inventor
沈凌寒
杨思远
Original Assignee
杭州众硅电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 杭州众硅电子科技有限公司 filed Critical 杭州众硅电子科技有限公司
Priority to SG11202102935QA priority Critical patent/SG11202102935QA/en
Priority to KR1020217011534A priority patent/KR102584030B1/ko
Publication of WO2020057330A1 publication Critical patent/WO2020057330A1/zh
Priority to US17/207,762 priority patent/US20210205952A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Definitions

  • the present invention relates to the field of equipment for manufacturing semiconductor integrated circuit chips, and in particular to a polishing assembly module in a chemical mechanical planarization equipment.
  • Integrated circuits are playing an increasingly important role in all walks of life and are the cornerstone of the modern information society.
  • the feature sizes of integrated circuits continue to be miniaturized, so the high planarization of the surface of semiconductor thin films has an important impact on the high performance, low cost and high yield of the device.
  • Chemical mechanical planarization (Chemical Mechanical Planarization, CMP) equipment is one of the seven key equipment in the field of integrated circuit manufacturing. The principle is to use a comprehensive balance of chemical etching of the polishing liquid and mechanical friction of the polishing pad to finely remove the material on the wafer surface.
  • CMP is first used for planarization, device isolation, and device construction in the front-end process of chip manufacturing, and secondly, metal interconnections in the back-end process of chip manufacturing are also used.
  • CMP is also a key process in the integrated circuit 3D packaging TSV process. Because of its relatively diverse and critical applications, CMP has become a standard process and core equipment in integrated circuit manufacturing.
  • chemical mechanical polishing technology has been developed into a combination of on-line measurement, online endpoint detection, cleaning and other technologies of chemical mechanical polishing technology is the integrated circuit to the miniaturization, multilayering, thinning, flattening process development products. At the same time, it is also a process technology necessary for the wafer to transition from 200mm to 300mm or even larger diameters, improve productivity, reduce manufacturing costs, and globally planarize the substrate.
  • a typical chemical mechanical planarization equipment usually includes multiple polishing units and auxiliary devices such as cleaning, wafer transport, and drying.
  • the polishing unit usually includes a table, a polishing disk, a polishing head, a polishing arm, a dresser, a polishing liquid arm, etc.
  • the polishing disk, a polishing head, a polishing arm, a dresser, and a polishing liquid arm are arranged on the table according to the processing position.
  • the spatial arrangement of the polishing unit and modules such as cleaning and wafer transportation has a great impact on the overall polishing output of the chemical mechanical planarization equipment.
  • the transfer of wafers between the polishing unit and the outside and between the polishing units is usually achieved by loading and unloading tables or similar devices.
  • the four polishing units are arranged side by side. The wafer transfer is completed by the loading and unloading area at the end of the flattening equipment and two linear transport mechanisms arranged along the polishing unit arrangement direction. The other side of the linear transport mechanism is a cleaning area.
  • Each of the above-mentioned linear transport mechanisms provides services for two polishing units, and sets two transfer stations for each polishing unit.
  • the polishing head of the polishing unit can load and unload wafers from one of the transfer stations.
  • this layout has the disadvantage that although each polishing unit is provided with two transfer stations, the polishing unit directly loads and unloads wafers from only one of them during the polishing process, so there is still room for improvement from the perspective of wafer transfer efficiency.
  • the purpose of the present invention is to propose a polishing loading and unloading component module for a chemical mechanical planarization device, which includes a movable loading and unloading module, for the problems of low wafer transfer efficiency and complicated transfer mechanism structure in the existing chemical mechanical planarization equipment.
  • a polishing loading and unloading component module includes one loading and unloading module and two polishing modules, the loading and unloading module is centered, the two polishing modules are located on both sides thereof, and the loading and unloading module includes a loading and unloading module.
  • the loading and unloading module has two loading and unloading positions in a direction perpendicular to the arrangement direction of the two polishing modules, and the loading and unloading station module can move back and forth between the two loading and unloading positions, respectively corresponding to the two polishing modules.
  • One loading and unloading station module may be provided at each of the two loading and unloading positions, corresponding to the two polishing modules, respectively.
  • the loading and unloading module includes a fixing frame, a water tank, a first loading and unloading platform module, a second loading and unloading platform module, a first loading and unloading platform fixing block, a second loading and unloading platform fixing block, a first isolation cover, and a second isolation cover.
  • One loading and unloading station module corresponds to the first loading and unloading position
  • the second loading and unloading station module corresponds to the second loading and unloading position.
  • the water tank, the first loading and unloading platform fixing block, and the second loading and unloading platform fixing block are fixedly installed on the fixing frame, and the two isolation covers are respectively fixed at Corresponding loading and unloading platform fixing platform, the lower part of the loading and unloading module is isolated from the liquid.
  • the first loading and unloading module and the second loading and unloading module are respectively fixed to the first loading and unloading platform fixing block and the second loading and unloading platform fixing block, corresponding to the first loading and unloading. Position and second loading and unloading position.
  • the polishing module includes a fixed platform.
  • the polishing pad, the polishing head, the polishing shaft, and the polishing pad are located on the fixed platform.
  • the polishing shaft can drive the polishing head to rotate to the loading and unloading position.
  • the loading and unloading module when the loading and unloading module can be moved back and forth between the two loading and unloading positions includes a fixed frame, a water tank, a linear motion module, a loading and unloading platform module, a loading and unloading platform fixing block, and an isolation cover, and the water tank and the linear motion module are fixed.
  • the loading and unloading platform fixing block is fixed on the sliding block of the linear motion module
  • the loading and unloading platform module is fixed on the loading and unloading platform fixing block
  • an isolation cover is fixed at the lower part of the loading and unloading platform fixing block to isolate the lower part of the loading and unloading platform from liquid, and move linearly.
  • the module can move the loading and unloading station module back and forth between two loading and unloading positions, that is, the first loading and unloading positions.
  • a first nozzle module and a second nozzle module are respectively provided at two loading and unloading positions of the loading and unloading module, and the first nozzle module and the second nozzle module are both fixed on a fixed platform.
  • the first nozzle module and the second nozzle module are respectively disposed at the edges of the first loading position and the second loading position.
  • the loading and unloading module can be raised and lowered vertically to complete wafer transfer with the polishing head.
  • the present invention further proposes a method for transferring wafers by using the polishing loading and unloading component module, which specifically includes the following steps:
  • the loading and unloading station module stops at the first loading and unloading position, and waits for the first polishing head corresponding to the position carrying the wafer that has completed the first stage polishing;
  • the loading and unloading module rises to pick up the wafer that has been polished in the first stage, descends, and then moves to the second loading and unloading position;
  • the present invention further proposes another method for transferring wafers by using the polishing loading and unloading component module, and specifically includes the following steps:
  • the loading and unloading station module stops at the first loading and unloading position, and waits for the first polishing head corresponding to this position carrying the polished wafer with the first polishing pad;
  • the loading and unloading module can also be stopped at the second loading and unloading position first, and the wafer is transferred from the second loading and unloading position to the first loading and unloading position, and the rest of the wafer transfer steps are the same as above.
  • the present invention further proposes another method for transferring wafers by using the polishing loading and unloading component module, and specifically includes the following steps:
  • the loading and unloading station module stops at the first loading and unloading position, and waits for the first polishing head corresponding to this position carrying the polished wafer;
  • the loading and unloading module can also be stopped at the second loading and unloading position first, and the wafer is transferred from the second loading and unloading position to the first loading and unloading position, and the rest of the wafer transfer steps are the same as above.
  • the present invention also proposes a method for transferring wafers by using the polishing loading and unloading component module, which specifically includes the following steps:
  • the first loading and unloading station module waits at the first loading and unloading position for the first polishing head to rotate the wafer that has completed the first stage polishing from the first polishing head rotation axis to the first loading and unloading position;
  • the first polishing head is turned back to the first polishing pad.
  • the second polishing head is turned back to the second loading and unloading position, the second loading and unloading station module is raised, the second polishing head removes the wafer that has completed the first stage polishing, the first loading and unloading station module is lowered, and the second polishing head is turned back to the second polishing
  • the polishing is performed on the pad, and at the same time, the robot arm places the unpolished wafer on the first loading table module of the first loading position;
  • S5 The first polishing head is rotated to the first loading and unloading position to remove the wafer to be polished and then starts polishing.
  • the second polishing head is rotated to the second loading and unloading position to complete the second stage polishing.
  • the second polishing head is rotated back to the second polishing pad, and the polished wafer is removed by the robot;
  • the second polishing head is rotated back to the second loading and unloading position to start cleaning the second polishing head.
  • the cleaned second polishing head is turned back to the second polishing pad.
  • the first loading and unloading station module is in the first loading and unloading position and waits for the first polishing head to be completed.
  • the wafer polished in the first stage is rotated from the rotation axis of the first polishing head to the first loading and unloading position;
  • the present invention also proposes another method for carrying out wafer transfer by using the polishing loading and unloading component module, which specifically includes the following steps:
  • the first loading and unloading station module waits for the first polishing head to rotate the polished wafer from the polishing head rotation axis to the first loading and unloading position at the first loading and unloading position;
  • the first polishing head (3, 8) is turned back to the polishing area.
  • the manipulator starts to remove the polished wafer on the first loading and unloading table module, and the first polishing head is turned back to the first loading and unloading position to start cleaning the first. Polishing head
  • the second loading and unloading station module may wait for the second polishing head to finish polishing the wafer at the second loading and unloading position, and the rest of the wafer transfer steps are the same as above.
  • the present invention Compared with the existing chemical mechanical planarization equipment technology, the present invention has the following beneficial technical effects:
  • the present invention modulates the loading and unloading part and the polishing part into one polishing loading and unloading integrated module. This layout simplifies the equipment structure, improves the manufacturing efficiency of the equipment, and reduces the space occupied by the equipment.
  • the polishing head is saved and transferred back to the corresponding polishing pad and then back to clean, which saves the transfer time, or the wafer transfer can be saved through the two polishing heads corresponding to the two loading and unloading module. Wafer transfer time significantly improves efficiency.
  • the polishing module can be freely expanded as required. Three or more modules can be spliced to further increase the flexibility of wafer manufacturing, improve manufacturing efficiency, reduce equipment space, and increase output.
  • FIG. 1 is a perspective view of the entire module for polishing, loading and unloading of the present invention
  • FIG. 2 is a schematic structural diagram of a loading and unloading module capable of moving back and forth between two loading and unloading positions
  • FIG. 3 is a schematic structural diagram of a loading and unloading module in which one loading and unloading station module is respectively arranged at two loading and unloading positions;
  • 1 the first loading and unloading position
  • 2 the first polishing head rotating shaft
  • 3 the first polishing head
  • 4 the first polishing pad
  • 5 the first fixed platform
  • 6 the second loading and unloading position
  • 7 the second polishing head rotating shaft
  • 8 second polishing head
  • 9 second polishing pad
  • 10 second fixed platform
  • 11 water tank
  • 12 first isolation cover
  • 13 first nozzle module
  • 14 second loading table fixing block
  • 15 Second loading and unloading module
  • 16 second nozzle module
  • 17 second isolation cover
  • 18 first loading and unloading module
  • 19 first loading and unloading platform fixing block
  • 20 fixing frame
  • 21 linear motion module
  • 22 Loading dock module
  • 23 loading dock fixing block
  • 24 isolation cover.
  • This embodiment provides a polishing assembly component module for a chemical mechanical planarization device.
  • the polishing loading and unloading component module is composed of one loading and unloading module and two polishing modules.
  • the layout is shown in FIG. 1 and includes a first loading and unloading position, a first polishing head rotating shaft 2, a first polishing head 3, a first polishing pad 4, and a second polishing module.
  • a fixed platform 5 a second loading / unloading position 6, a second polishing head rotating shaft 7, a second polishing head 8, a second polishing pad 9, and a second fixed platform 10.
  • the polishing pad, the polishing shaft and other components are fixed on a fixed platform, and the polishing head is fixed on the polishing shaft.
  • the polishing shaft drives the polishing head to rotate to the loading and unloading position. After the operation is completed, the polishing head is rotated to the top of the polishing pad for polishing.
  • the first loading / unloading position corresponds to the first polishing head 3, and the second loading / unloading position 6 corresponds to the second polishing head 8.
  • FIG. 2 The structure of the loading and unloading module capable of moving back and forth between the two loading and unloading stations is shown in FIG. 2, which includes: a first loading and unloading position 1, a second loading and unloading position 6, a water tank 11, a first nozzle module 13, and a linear motion module. 21, the second nozzle module 16, the loading and unloading station module 22, the loading and unloading station fixing block 23, the isolation cover 24, and the fixing frame 20.
  • the water tank 11 and the linear motion module 21 are fixed on a fixed frame 20.
  • the loading / unloading station fixing block 23 is fixed on the linear motion module 21, the loading / unloading station module 22 is fixed on the loading / unloading station fixing block 23, and the isolation cover 17 is fixed at the lower portion of the loading / unloading station fixing block 23 to isolate the lower portion of the loading / unloading platform from liquid.
  • the linear motion module 21 can move the loading and unloading station module 22 back and forth between the first loading position 1 and the second loading position 6, and the first nozzle module 13 and the second nozzle module correspond to the edges of the first loading position 1 and the second loading position 6. 16. Both nozzle modules are fixed on the fixing frame 20.
  • the loading and unloading module of the loading and unloading station module that can move back and forth between two loading and unloading positions to transfer wafers is as follows:
  • the loading and unloading station module 22 stops at the first loading and unloading position 1 and waits for the first polishing head 3 corresponding to the first loading and unloading position 1 to carry the first stage polished wafer to be transferred to the first loading and unloading position 1;
  • the loading and unloading station module 22 rises to pick up the wafer. After receiving the wafer, the loading and unloading module 22 directly moves to the second loading and unloading position 6, and then the first polishing head 3 corresponding to the first loading and unloading position is cleaned on the upper part of the first loading and unloading position. Through the movement of the loading and unloading station module 22, the first polishing head 3 does not need to be turned back above the first polishing pad 4 and then turned back to be cleaned, thereby saving the transmission time and improving the efficiency.
  • the second polishing head 8 is transferred to the second loading and unloading position 6, and then the polished wafers on the loading and unloading station module 22 at the second loading and unloading position 6 are removed, and the robotic arm then removes the wafers to be polished. Loaded on the loading and unloading station module 22 in the second loading and unloading position 6.
  • the loading / unloading station module 22 at the second loading / unloading position 6 is moved under the first polishing head 3 at the first loading / unloading position. Subsequently, the loading and unloading station module 22 rises, the first polishing head 3 corresponding to the first loading and unloading position is completed and transferred to the polishing area for polishing, and polishing of the next wafer is started.
  • the loading and unloading station module 22 in the first loading and unloading position is moved to the second loading and unloading position 6, and at the same time, the second polishing head 8 corresponding to the second loading and unloading position 6 is moved to the upper part of the second loading and unloading position 6, and the loading and unloading module 22 is lifted and sucked.
  • the loading and unloading station module 22 is moved from the second loading and unloading position 6 to the first loading and unloading position, and the second polishing head 8 corresponding to the second loading and unloading position 6 is cleaned on the upper part of the second loading and unloading position 6.
  • the robot removes the polished wafer on the loading and unloading station module 22 at the first loading and unloading position, loads the wafer to be polished, and then the loading and unloading module 22 stops at the first loading and unloading position and waits.
  • the first polishing head 3 corresponding to the first loading and unloading position unloads the polished wafer and starts the cycle again.
  • FIG. 3 The structural diagram of the loading and unloading module with one loading and unloading station module at each of the two loading and unloading positions is shown in FIG. 3, including: the first loading and unloading position 1, the second loading and unloading position 6, the water tank 11, the first isolation cover 12, and the first nozzle module. 13, the second loading / unloading station fixing block 14, the second loading / unloading station module 15, the second nozzle module 16, the second isolation cover 17, the first loading / unloading module 18, the first loading / unloading station fixing block 19, and the fixing frame 20.
  • the first loading and unloading station module 18 corresponds to the first loading and unloading position 1
  • the second loading and unloading station module 15 corresponds to the second loading and unloading position 6.
  • the water tank 11 and the first loading / unloading platform fixing block 19 and the second loading / unloading platform fixing block 14 are fixed on the fixing frame 20.
  • the isolation cover is fixed on the loading and unloading fixing platform to isolate the lower part of the loading and unloading platform from liquid.
  • the loading and unloading station module is fixed on the loading and unloading station fixing block, and the nozzle module is corresponding to the edge of the loading and unloading position.
  • the nozzle modules are all fixed on the fixing frame 20.
  • the first loading and unloading station module 18 waits at the first loading and unloading position 1 for the first polishing head 3 to rotate the wafer that has completed the first stage polishing from the first polishing head rotating shaft 2 to the first loading and unloading position 1.
  • the first polishing head 3 is turned back above the first polishing pad 4, and the robot starts to remove the wafers that have completed the first stage polishing on the first loading and unloading table module 18, and put them into the second loading and unloading at the second loading and unloading position 6.
  • the table module 15, the first polishing head 3 is turned back to the first loading and unloading position 1 to start cleaning the first polishing head 3.
  • the first polishing head 3 is turned back on the first polishing pad 4.
  • the second polishing head 8 is turned back to the second loading and unloading position 6, the second loading and unloading station module 15 is raised, and the second polishing head 8 removes the wafers that have been polished in the first stage.
  • the robot arm places the unpolished wafers.
  • wafer transfer through two polishing heads corresponding to the two loading and unloading station modules saves wafer transfer time and improves efficiency.
  • the second polishing head 8 is turned back over the second polishing pad 9 to start polishing, and the first polishing head 3 is rotated to the first loading and unloading position 1 to remove the unpolished wafer and then start polishing.
  • the second polishing head 8 is polished, it is rotated to the second loading and unloading position 6 to place the wafer that has completed the second stage polishing on the second loading and unloading station module 15, and the second polishing head 8 is rotated back to the second polishing pad 9.
  • the robot removes the polished wafer, the second polishing head 8 is rotated back to the second loading and unloading position 6 to clean the second polishing head 8, and the cleaned second polishing head 8 is turned back to the second polishing pad 9.
  • the first loading and unloading station module 18 waits for the wafer on the first polishing head 3 to start cycling in the first loading and unloading position 1.
  • the wafer loading component structure of the present invention has the advantage that by modularizing the loading and unloading part and the polishing part, it can be spliced into the layout shown in FIG. 1.
  • This layout simplifies the equipment structure, improves the manufacturing efficiency of the equipment, and reduces the space occupied by the equipment. And it can be expanded freely as needed, and it can be spliced by 3 or more modules with the layout shown in Figure 1, which further improves the flexibility of wafer manufacturing, improves manufacturing efficiency, reduces equipment space, and increases output.
  • the displacement movement of the loading and unloading table module 15 and the cleaning part are separately placed, and the robot is used to transfer the wafer, so that the processes between multiple polishing modules can be operated in parallel, which greatly improves the manufacturing efficiency of the equipment.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

一种抛光装卸部件模块，包含一个装卸模块和两个抛光模块，装卸模块居中，两个抛光模块位于其两侧，装卸模块在与两个抛光模块排列方向相垂直的方向上有两个装卸位置（1，6），分别对应两个抛光模块，装卸模块可在两个装卸位置之间来回移动。两个装卸位置上也可以分别设置一个装卸台模块（8，15），分别对应两个抛光模块。通过将装卸部分和抛光部分进行模块化，拼接成一个抛光装卸整体模块，这种布局简化了设备结构，提高了设备的制造效率，并且缩小设备的占地空间，而且通过装卸台模块的移动或者通过两个抛光头对应两个装卸台模块，省却了抛光头转回对应抛光垫上方后再转回来清洗，可以节省传输时间，显著提高了效率。

Description

一种抛光装卸部件模块 技术领域
本发明涉及半导体集成电路芯片制造的设备领域，具体涉及一种化学机械平坦化设备中的抛光装卸部件模块。
背景技术
集成电路在各行各业中发挥着越来越非常重要的作用，是现代信息社会的基石。随着半导体行业的飞速发展,集成电路特征尺寸不断趋于微细化,因此半导体薄膜表面的高平坦化对器件的高性能、低成本、高成品率有着重要的影响。
化学机械平坦化(Chemical Mechanical Planarization,CMP)设备是集成电路制造领域的七大关键设备之一。其原理是利用抛光液化学刻蚀和抛光垫机械摩擦的综合平衡作用，对晶圆表面材料进行精细去除。在集成电路制造中，CMP首先被用于芯片制造前道工艺的平坦化、器件隔离、器件构造，其次在芯片制造后道工艺的金属互连也需使用。同时，CMP在集成电路3D封装TSV工艺中也是关键的工艺手段。正是因为具有相对多样且关键的应用，CMP已经成为集成电路制造中的标准工艺和核心装备。
目前，化学机械抛光技术已经发展成集在线量测、在线终点检测、清洗等技术于一体的化学机械抛光技术是集成电路向微细化、多层化、薄型化、平坦化工艺发展的产物。同时也是晶圆由200mm向300mm乃至更大直径过渡、提高生产率、降低制造成本、衬底全局平坦化所必需的工艺技术。
一个典型的化学机械平坦化设备通常包括多个抛光单元以及清洗、晶圆运输、干燥等辅助装置。抛光单元通常包括工作台、抛光盘、抛光头、抛光臂、修整器、抛光液臂等，抛光盘、抛光头、抛光臂、修整器、抛光液臂按照工艺加工位置布置在工作台上。实际的晶圆加工过程中发现，抛光单元与清洗、晶圆运输等模块的空间布置对于化学机械平坦化设备整体的抛光产出有极大的影响。晶圆在抛光单元与外部以及在抛光单元之间的传输通常依靠装卸台或起类似作用的装置来实现。关于装卸台与抛光单元的空间布局，有的采用装卸台与三个抛光单元为正方形布局的形式。由于一个装卸台需要给三个抛光单元提供装卸服务，因此这种技术布局的缺点是工艺过程复杂。另有采用将四个抛光单元并排排列，晶圆传输由位于平坦化设备端部的装卸区和沿抛光单元排列方向设置的两个线性运输机构完成，线性运输机构的另一侧为清洗区。上述每一个线性运输机构为两个抛光单元提供服务，并为每个抛光单元设置两个传输工位，抛光单元的抛光头可以从其中一个传输工位装卸晶圆。但这种布局的缺点是每个抛光单元虽然设置两个传输工位，但抛光过程中抛光单元只从其中一个直接装卸晶圆，因此从晶圆传输效率的角度分析还有需要改进的余地。
发明的公开
本发明目的在于针对现有化学机械平坦化设备中存在的晶圆传输效率低、传输机构结构复杂的问题提出一种化学机械平坦化设备用的一种包含可移动装卸模块的抛光装卸部件模块，通过将装卸部分和抛光部分进行模块化，可以简化设备结构，提高设备的制造效率，缩小设备的占地空间。
本发明的目的可以通过以下技术方案来实现：
一种抛光装卸部件模块，包含一个装卸模块和两个抛光模块，装卸模块居中，两个抛光模块位于其两侧，装卸模块包含装卸台模块。所述装卸模块在与两个抛光模块排列方向相垂直的方向上有两个装卸位置，装卸台模块可在所述两个装卸位置之间来回移动，分别对应于所述两个抛光模块。
上述两个装卸位置上还可以分别设置一个装卸台模块，分别对应所述两个抛光模块。此时，装卸模块包含固定架、水槽、第一装卸台模块、第二装卸台模块、第一装卸台固定块、第二装卸台固定块、第一隔离罩、第二隔离罩，所述第一装卸台模块对应第一装卸位置，第二装卸台模块对应第二装卸位置，水槽和第一装卸台固定块、第二装卸台固定块固定安装在固定架上，两个隔离罩分别固定在对应的装卸台固定台上，使装卸台模块下部与液体隔离，第一装卸台模块、第二装卸台模块分别固定在第一装卸台固定块和第二装卸台固定块上，对应第一装卸位置和第二装卸位置。
上述抛光模块包含固定平台，抛光垫、抛光头、抛光转轴、抛光垫位于固定平台上，抛光转轴可带动抛光头旋转至装卸位置。
上述装卸台模块可在所述两个装卸位置之间来回移动时的装卸模块包含固定架、水槽、直线运动模块、装卸台模块、装卸台固定块、隔离罩，所述水槽和直线运动模块固定在固定架上，装卸台固定块固定在直线运动模块的滑动块上，装卸台模块固定在装卸台固定块上，并且装卸台固定块下部固定有隔离罩使装卸台下部与液体隔离，直线运动模块可以使装卸台模块在两个装卸位置即第一装卸位置和第二装卸位置之间来回移动。
装卸模块的两个装卸位置上分别设置有第一喷嘴模块和第二喷嘴模块，第一喷嘴模块和第二喷嘴模块都固定在固定台上。
第一喷嘴模块和第二喷嘴模块分别设置在第一装卸位置和第二装卸位置的边缘。
装卸台模块可在垂直方向上升和下降，与抛光头完成晶圆移转。
对于装卸台模块可在所述两个装卸位置之间来回移动的装卸部件模块，本发明还进一步提出一种利用上述抛光装卸部件模块进行晶圆传输的方法，具体包含以下步骤：
S1：装卸台模块停止在第一装卸位置，等待该位置对应的携带已完成第一阶段抛光的晶圆的第一抛光头；
S2：第一抛光头转移到第一装卸位置后，装卸台模块上升接取晶圆，下降然后移动到第二装卸位置；
S3：第一抛光头在第一装卸位置上部进行清洗，移动到第二装卸位置的装卸台模块的晶圆被第二抛光头吸取，开始第二阶段的抛光，第二抛光头转移到第二抛光垫上后，机械手将装卸台模块装载上新的待抛光晶圆；
S4：当第一装卸位置对应的第一抛光头清洗完成时，在第二装卸位置上的装卸台模块移动至第一装卸位置的第一抛光头下方，随后装卸台模块上升，第一装卸位置对应的第一抛光头完成对待抛光晶圆吸附并转移至抛光区域抛光；
S5：第一装卸位置的装卸台模块下降然后移动至第二装卸位置，与此同时第二装卸位置对应的第二抛光头运动转移到第二装卸位置上部，装卸台模块上升，吸取已完成第二阶段抛光的晶圆，吸取完毕后，装卸台模块下降然后由第二装卸位置移动至第一装卸位置；
S6：第二装卸位置对应的第二抛光头在第二装卸位置上部进行清洗，与此同时，机械手将在第一装卸位置上的装卸台模块上的已完成第二阶段抛光的晶圆取走，然后等待第一抛光头上的完成第一阶段抛光的晶圆；
S7：第一抛光头转移到第一装卸位置后，装卸台模块上升接取完成第一阶段抛光的晶圆，下降然后移动到第二装卸位置；
S8：重复以上步骤，直至全部晶圆抛光完毕。
对于装卸台模块可在所述两个装卸位置之间来回移动的装卸部件模块，本发明还进一步提出另一种利用上述抛光装卸部件模块进行晶圆传输的方法，具体还包含以下步骤：
S1：装卸台模块停止在第一装卸位置，等待该位置对应的携带已完成第一抛光垫抛光晶圆的第一抛光头；
S2：第一抛光头转移到第一装卸位置后，装卸台模块上升接取晶圆，下降然后移动到第二装卸位置；
S3：第一抛光头在第一装卸位置上部进行清洗，机械手将位于第二装卸位置的装卸台模块上的晶圆取走，并给装卸台模块装载上新的晶圆；
S4：当第一装卸位置对应的第一抛光头清洗完成时，在第二装卸位置上的装卸台模块移动至第一装卸位置的第一抛光头下方，随后装卸台模块上升，第一装卸位置对应的第一抛光头完成对待抛光晶圆的吸附并转移至抛光区域抛光；
S5：重复以上步骤，直至全部晶圆抛光完毕。
同理，装卸台模块也可以先停止在第二装卸位置，由第二装卸位置传送晶圆至第一装卸位置，其余晶圆传输步骤同上。
对于装卸台模块可在所述两个装卸位置之间来回移动的装卸部件模块，本发明还进一步提出另一种利用上述抛光装卸部件模块进行晶圆传输的方法，具体还包含以下步骤：
S1：装卸台模块停止在第一装卸位置，等待该位置对应的携带已完成抛光晶圆的第一抛光头；
S2：第一抛光头转移到第一装卸位置后，装卸台模块上升接取晶圆，第一抛光头转移至抛光区域；
S3：机械手将位于装卸台模块上的晶圆取走后，第一抛光头转回到第一装卸位置，开始清洗第一抛光头；
S4：清洗完毕后，第一抛光头转回抛光区域，机械手给装卸台模块装载上新的晶圆；
S5：随后装卸台模块上升，第一抛光头转移到第一装卸位置，完成对待抛光的晶圆吸附后装卸模块下降，第一抛光头转移至抛光区域抛光，装卸台模块下降；
S6：重复以上步骤，直至全部晶圆抛光完毕。
同理，装卸台模块也可以先停止在第二装卸位置，由第二装卸位置传送晶圆至第一装卸位置，其余晶圆传输步骤同上。
同样，对于两个装卸位置上还可以分别设置一个装卸台模块的装卸部件模块，本发明也提出一种利用上述抛光装卸部件模块进行晶圆传输的方法，具体包含以下步骤：
S1：第一装卸台模块在第一装卸位置等待第一抛光头将完成第一阶段抛光的晶圆由第一抛光头转轴旋转至第一装卸位置；
S2：抛光好的晶圆由第一抛光头转轴旋转至第一装卸位置后，第一装卸台模块上升,装载好已经完成第一阶段抛光的晶圆；
S3：然后第一抛光头转回到第一抛光垫上方，第一装卸台模块下降，机械手开始取走第一装卸台模块上的已经完成第一阶段抛光的晶圆放到第二装卸位置上的第二装卸台模块，第一抛光头转回到第一装卸位置开始清洗第一抛光头；
S4：清洗完毕后，第一抛光头转回第一抛光垫上。第二抛光头转回到第二装卸位置，第二装卸台模块上升，第二抛光头取走完成第一阶段抛光的晶圆，第一装卸台模块下降，第二抛光头转回第二抛光垫上进行抛光，与此同时，机械手将未抛光的晶圆放置在第一装卸位置的第一装卸台模块上；
S5：第一抛光头旋转至第一装卸位置取走待抛光的晶圆然后开始抛光，当第二抛光头抛光完成后，第二抛光头旋转至第二装卸位置将完成第二阶段抛光的晶圆放置在第二装卸台模块上，第二抛光头旋转回第二抛光垫，机械手取走抛光好的晶圆；
S6：第二抛光头旋转回第二装卸位置开始清洗第二抛光头，清洗完毕的第二抛光头转回第二抛光垫上，第一装卸台模块在第一装卸位置等待第一抛光头将完成第一阶段抛光的晶圆由第一抛光头转轴旋转至第一装卸位置；
S7：重复步骤2至6，直至全部晶圆抛光完毕。
对于两个装卸位置上分别设置一个装卸台模块的装卸部件模块的情况下，本发明还提出另一种利用上述抛光装卸部件模块进行晶圆传输的方法，具体包含以下步骤：
S1：第一装卸台模块在第一装卸位置等待第一抛光头将完成抛光的晶圆由抛光头转轴旋转至第一装卸位置；
S2：第一抛光头转移到第一装卸位置后，第一装卸台模块上升，装载好晶圆；
S3：第一抛光头(3，8)转回到抛光区域，机械手开始取走第一装卸台模块上的已经抛光完毕的晶圆，第一抛光头转回到第一装卸位置开始清洗第一抛光头；
S4：清洗完毕后，第一抛光头转回抛光区域，机械手将第一装卸台模块装载上新的待抛光晶圆；
S5：随后装卸台模块上升，第一抛光头转移到第一装卸位置，完成对待抛光的晶圆吸附并转移至抛光区域抛光，第一装卸台模块下降；
S6：重复以上步骤，直至全部晶圆抛光完毕。
同理，可以是第二装卸台模块在第二装卸位置等待第二抛光头完成抛光的晶圆，其余晶圆传输步骤同上。
与现有化学机械平坦化设备技术相比，本发明具有以下有益技术效果：
1，本发明通过将装卸部分和抛光部分进行模块化，拼接成一个抛光装卸整体模块，这种布局简化了设备结构，提高了设备的制造效率，并且缩小设备的占地空间。
2，通过装卸台模块的移动，就省却抛光头转回对应抛光垫上方后再转回来清洗，节省了传输时间，或者通过两个抛光头对应两个装卸台模块进行晶圆的传递，可以节省晶圆传输时间，显著提高了效率。
3，通过装卸台模块的位移运动以及清洗部分单独放置，再配合机械手传输晶圆，使 得多个抛光模块之间工序实现并联运行，大幅度提高设备的制造效率。
4，抛光装卸整体模块可以根据需要进行自由扩展，可以由三个以及更多的该模块进行拼接，进一步提高晶圆制造的柔性，提高制造效率，缩小设备的空间，增加产量。
附图的简要说明
下文将参考附图进一步描述本发明的实施例，在附图中：
图1为本发明抛光装卸整体模块的立体效果图；
图2为装卸台模块可在两个装卸位置之间来回移动的装卸模块的结构示意图；
图3为两个装卸位置上分别设置一个装卸台模块的装卸模块的结构示意图；
图中使用的附图标记的含义：
1：第一装卸位置，2：第一抛光头转轴，3：第一抛光头，4：第一抛光垫，5：第一固定平台，6：第二装卸位置，7：第二抛光头转轴，8：第二抛光头，9：第二抛光垫，10：第二固定平台，11：水槽，12：第一隔离罩，13：第一喷嘴模块，14：第二装卸台固定块，15：第二装卸台模块，16：第二喷嘴模块，17：第二隔离罩，18：第一装卸台模块，19：第一装卸台固定块，20：固定架，21：直线运动模块，22：装卸台模块，23：装卸台固定块，24：隔离罩。
实现本发明的最佳方式
下面结合附图和具体实施例对本发明进行详细说明。本实施例以本发明技术方案为前提进行实施，给出了详细的实施方式和具体的操作过程，但本发明的保护范围不限于下述的实施例。
本实施例提供了一种化学机械平坦化设备用的抛光装卸部件模块。本抛光装卸部件模块由1个装卸模块和2个抛光模块组成，布局如图1所示，包含第一装卸位置，第一抛光头转轴2，第一抛光头3，第一抛光垫4，第一固定平台5，第二装卸位置6，第二抛光头转轴7，第二抛光头8，第二抛光垫9，第二固定平台10。
抛光垫，抛光转轴及其他部件组成固定在固定平台上，抛光头固定在抛光转轴上。抛光转轴带动抛光头旋转至装卸位置，完成动作后，旋转至抛光垫上方进行抛光。第一装卸位置对应第一抛光头3，第二装卸位置6对应第二抛光头8。
装卸台模块可在两个装卸位置之间来回移动的装卸模块的结构如图2所示，包含：第一装卸位置1，第二装卸位置6，水槽11，第一喷嘴模块13，直线运动模块21，第二喷嘴模块16，装卸台模块22，装卸台固定块23，隔离罩24，固定架20。水槽11和直线运动模块21固定在固定架20上。装卸台固定块23固定在直线运动模块21上，装卸台模块22固定在装卸台固定块23上，并且装卸台固定块23下部固定有隔离罩17使装卸台下部与液体隔离。直线运动模块21可以使装卸台模块22在第一装卸位置1与第二装卸位置6来回移动，在第一装卸位置1与第二装卸位置6边缘对应有第一喷嘴模块13和第二喷嘴模块16。两个喷嘴模块都固定在固定架20上。
装卸台模块可在两个装卸位置之间来回移动的装卸模块进行传输晶圆的过程如下：
首先，装卸台模块22停止在第一装卸位置1，等待第一装卸位置1对应的携带已完成第 一阶段抛光晶圆的第一抛光头3转移到第一装卸位置1；
装卸台模块22上升接取晶圆，接取晶圆后装卸台模块22直接移动到第二装卸位置6，然后第一装卸位置对应的第一抛光头3在第一装卸位置上部进行清洗。通过装卸台模块22的移动，这样第一抛光头3就不需要转回第一抛光垫4上方后再转回来清洗，因此节省了传输时间,提高了效率。
与此同时，第二抛光头8转移到第二装卸位置6，然后将在第二装卸位置6上的装卸台模块22上的已经抛光好的晶圆取走，机械手再将待抛光的晶圆装载在第二装卸位置6上的装卸台模块22上。
当第一装卸位置对应的抛光头已经清洗完成时，在第二装卸位置6上的装卸台模块22移动至第一装卸位置的第一抛光头3下。随后装卸台模块22上升，第一装卸位置对应的第一抛光头3完成吸附并转移至抛光区域抛光，开始下一片晶圆的抛光。
然后第一装卸位置的装卸台模块22移动至第二装卸位置6，与此同时第二装卸位置6对应的第二抛光头8运动转移到第二装卸位置6上部，装卸台模块22上升，吸取已经抛光完毕的晶圆，吸取完毕后，装卸台模块22由第二装卸位置6移动至第一装卸位置，第二装卸位置6对应的第二抛光头8在第二装卸位置6上部进行清洗。这样的好处是第二抛光头8就不需要转回第二抛光垫9上方后再转回来清洗，因此节省了传输时间,提高了效率。
与此同时，机械手将在第一装卸位置上的装卸台模块22上的已经抛光好的晶圆取走，并装载上待抛光的晶圆，然后装卸台模块22停止在第一装卸位置上等待第一装卸位置对应的第一抛光头3卸载抛光好的晶圆，再次开始循环。
两个装卸位置上分别设置一个装卸台模块的装卸模块的结构示意图如图3所示，包括：第一装卸位置1，第二装卸位置6，水槽11，第一隔离罩12，第一喷嘴模块13，第二装卸台固定块14，第二装卸台模块15，第二喷嘴模块16，第二隔离罩17，第一装卸台模块18，第一装卸台固定块19，固定架20组成。其中第一装卸台模块18对应第一装卸位置1，第二装卸台模块15对应第二装卸位6。水槽11和第一装卸台固定块19，第二装卸台固定块14固定在固定架20上。隔离罩固定在装卸固定台上使装卸台下部与液体隔离。装卸台模块固定在装卸台固定块上，在装卸位置边缘对应有喷嘴模块。喷嘴模块都固定在固定架20上。
现对利用两个装卸位置上分别设置一个装卸台模块的装卸模块进行晶圆传输的过程给予详细说明：
开始时，第一装卸台模块18在第一装卸位置1等待第一抛光头3将完成第一阶段抛光的晶圆由第一抛光头转轴2旋转至第一装卸位置1。
随后，抛光好的晶圆由第一抛光头转轴2旋转至第一装卸位置1时，第一装卸台模块18上升,装载好已经抛光的晶圆。
然后第一抛光头3转回到第一抛光垫4上方，机械手开始取走第一装卸台模块18上的已经完成第一阶段抛光的晶圆，放到第二装卸位置6上的第二装卸台模块15，第一抛光头3转回到第一装卸位置1开始清洗第一抛光头3。
清洗完毕后，第一抛光头3转回第一抛光垫4上。第二抛光头8转回到第二装卸位置6，第二装卸台模块15上升，第二抛光头8取走完成第一阶段抛光的晶圆，与此同时，机械手将未抛光的晶圆放置在第一装卸位置1的第一装卸台模块18上，通过两个抛光头对应两个装卸台模块进行晶圆的传递节省了晶圆传输时间,提高了效率。
随后，第二抛光头8转回到第二抛光垫9上方开始抛光，第一抛光头3旋转至第一装卸位置1取走未抛光的晶圆然后开始抛光。当第二抛光头8抛光完成后，旋转至第二装卸位置6，将完成第二阶段抛光的晶圆放置在第二装卸台模块15上，第二抛光头8旋转回第二抛光垫9。机械手取走抛光好的晶圆，第二抛光头8旋转回第二装卸位置6开始清洗第二抛光头8，清洗完毕的第二抛光头8转回第二抛光垫9上。第一装卸台模块18在第一装卸位置1等待第一抛光头3上的晶圆开始循环。
本发明的晶圆装载部件结构的优点：通过将装卸部分和抛光部分进行模块化，可以拼接成图1所示布局。此布局简化了设备结构，提高设备的制造效率，缩小设备的占地空间。并且可以根据需要进行自由扩展，可以由3个以及更多的图1所示布局的模块进行拼接，进一步提高晶圆制造的柔性，提高制造效率，缩小设备的空间，增加产量。并且通过装卸台模块15的位移运动以及清洗部分单独放置，再配合机械手传输晶圆，使得多个抛光模块之间工序实现并联运行，大幅度提高设备的制造效率。
以上详细描述了本发明的较佳具体实施例。应当理解，本领域的普通技术人员无需创造性劳动就可以根据本发明的构思作出诸多修改和变化。因此，凡本技术领域中技术人员依本发明的构思在现有技术的基础上通过逻辑分析、推理或者有限的实验可以得到的技术方案，皆应在由权利要求书所确定的保护范围内。

Claims (14)

  1. 一种抛光装卸部件模块，其特征在于，包含一个装卸模块和两个抛光模块，装卸模块居中，两个抛光模块位于其两侧，装卸模块包含装卸台模块，所述装卸模块上在与两个抛光模块排列方向相垂直的方向上有两个装卸位置，所述装卸台模块可在所述两个装卸位置之间来回移动，分别对应于所述两个抛光模块。
  2. 根据权利要求1所述的抛光装卸部件模块，其特征在于所述两个装卸位置上分别设置一个装卸台模块，分别对应所述两个抛光模块。
  3. 根据权利要求2所述的抛光装卸部件模块，其特征在于所述装卸模块包含固定架(20)、水槽(11)、第一装卸台模块(18)、第二装卸台模块(15)、第一装卸台固定块(19)、第二装卸台固定块(14)、第一隔离罩(12)、第二隔离罩(17)，所述第一装卸台模块(18)对应第一装卸位置(1)，第二装卸台模块(15)对应第二装卸位置(6)，水槽(11)和第一装卸台固定块(19)、第二装卸台固定块(14)固定安装在固定架(20)上，两个隔离罩分别固定在对应的装卸台固定台上，使装卸台模块下部与液体隔离，第一装卸台模块(18)、第二装卸台模块(15)分别固定在第一装卸台固定块(19)和第二装卸台固定块(14)上，对应第一装卸位置(1)和第二装卸位置(6)。
  4. 根据权利要求1或2所述的抛光装卸部件模块，其特征在于所述抛光模块包含固定平台，抛光垫、抛光头、抛光转轴、抛光垫位于固定平台上，抛光转轴带动抛光头旋转至装卸位置。
  5. 根据权利要求1所述的抛光装卸部件模块，其特征在于所述装卸模块包含固定架(20)、水槽(11)、直线运动模块(21)、装卸台模块(22)、装卸台固定块(23)、隔离罩(24)，所述水槽(11)和直线运动模块(21)固定在固定架(20)上，装卸台固定块(23)固定在直线运动模块(21)的滑动块上，装卸台模块(22)固定在装卸台固定块(23)上，并且装卸台固定块(23)下部固定有隔离罩(24)使装卸台模块下部与液体隔离，直线运动模块(21)可以使装卸台模块(22)在两个装卸位置即第一装卸位置(1)和第二装卸位置(6)之间来回移动。
  6. 根据权利要求1或2所述的抛光装卸部件模块，其特征在于所述装卸模块的第一装卸位置(1)和第二装卸位置(6)上分别设置有第一喷嘴模块(13)和第二喷嘴模块(16)，第一喷嘴模块(13)和第二喷嘴模块(16)都固定在固定架(20)上。
  7. 根据权利要求6所述的抛光装卸部件模块，其特征在于所述第一喷嘴模块(13)和第二喷嘴模块(16)分别设置在第一装卸位置(1)和第二装卸位置(6)的边缘。
  8. 根据权利要求1或2所述的抛光装卸部件模块，其特征在于所述装卸台模块可在垂直方向上升和下降，与抛光头完成晶圆移转。
  9. 一种根据权利要求1所述的抛光装卸部件模块进行晶圆传输的方法，其特征在于包含以下步骤：
    S1：装卸台模块(22)停止在第一装卸位置(1)，等待该位置对应的携带已完成第一阶段抛光的晶圆的第一抛光头(3)；
    S2：第一抛光头(3)转移到第一装卸位置(1)后，装卸台模块(22)上升接取晶圆， 下降然后移动到第二装卸位置(6)；
    S3：第一抛光头(3)在第一装卸位置(1)上部进行清洗，移动到第二装卸位置(6)的装卸台模块的晶圆被第二抛光头(8)吸取，开始第二阶段的抛光，第二抛光头(8)转移到第二抛光垫(9)上后，机械手将装卸台模块(22)装载上新的待抛光晶圆；
    S4：当第一装卸位置(1)对应的第一抛光头(3)清洗完成时，在第二装卸位置(6)上的装卸台模块移动至第一装卸位置(1)的第一抛光头(3)下方，随后装卸台模块上升，第一装卸位置(1)对应的第一抛光头(3)完成对待抛光晶圆吸附并转移至抛光区域抛光；
    S5：第一装卸位置(1)的装卸台模块下降然后移动至第二装卸位置(6)，与此同时第二装卸位置(6)对应的第二抛光头(8)运动转移到第二装卸位置(6)上部，装卸台模块上升，吸取已完成第二阶段抛光完毕的晶圆，吸取完毕后，装卸台模块下降然后由第二装卸位置(6)移动至第一装卸位置(1)；
    S6：第二装卸位置(6)对应的第二抛光头(8)在第二装卸位置(6)上部进行清洗，与此同时，机械手将在第一装卸位置(1)上的装卸台模块上的已完成第二阶段抛光的晶圆取走，然后等待第一抛光头(3)上的完成第一阶段抛光的晶圆；
    S7：第一抛光头(3)转移到第一装卸位置(1)后，装卸台模块上升接取完成第一阶段抛光的晶圆，下降然后移动到第二装卸位置(6)；
    S8：重复以上步骤，直至全部晶圆抛光完毕。
  10. 一种根据权利要求1所述的抛光装卸部件模块进行晶圆传输的方法，其特征在于包含以下步骤：
    S1：装卸台模块(22)停止在第一装卸位置(1)，等待该位置对应的携带已完成第一抛光垫抛光晶圆的第一抛光头(3)；
    S2：第一抛光头(3)转移到第一装卸位置(1)后，装卸台模块(22)上升接取晶圆，下降然后移动到第二装卸位置(6)；
    S3：第一抛光头(3)在第一装卸位置(1)上部进行清洗，机械手将位于第二装卸位置(6)的装卸台模块(22)上的晶圆取走，并给装卸台模块(22)装载上新的晶圆；
    S4：当第一装卸位置(1)对应的第一抛光头(3)清洗完成时，在第二装卸位置(6)上的装卸台模块(22)移动至第一装卸位置(1)的第一抛光头(3)下方，随后装卸台模块(22)上升，第一装卸位置(1)对应的第一抛光头(3)完成对待抛光晶圆的吸附并转移至抛光区域抛光，装卸台模块(22)下降；
    S5：重复以上步骤，直至全部晶圆抛光完毕。
  11. 一种根据权利要求1所述的抛光装卸部件模块进行晶圆传输的方法，其特征在于包含以下步骤：
    S1：装卸台模块(22)停止在第二装卸位置(6)，等待该位置对应的携带已完成第二抛光垫抛光晶圆的第二抛光头(8)；
    S2：第二抛光头(8)转移到第二装卸位置(6)后，装卸台模块(22)上升接取晶圆，下降然后移动到第一装卸位置(1)；
    S3：第二抛光头(8)在第二装卸位置(6)上部进行清洗，机械手将位于第一装卸位置(1)的装卸台模块(22)上的晶圆取走，并给装卸台模块(22)装载上新的晶圆；
    S4：当第二装卸位置(6)对应的第二抛光头(8)清洗完成时，在第一装卸位置(1) 上的装卸台模块(22)移动至第二装卸位置(6)的第二抛光头(8)下方，随后装卸台模块(22)上升，第二装卸位置(6)对应的第二抛光头(8)完成对待抛光晶圆的吸附并转移至抛光区域抛光，装卸台模块(22)下降；
    S5：重复以上步骤，直至全部晶圆抛光完毕。
  12. 一种根据权利要求1所述的抛光装卸部件模块进行晶圆的传输的方法，其特征在于包含以下步骤：
    S1：装卸台模块(22)停止在装卸位置(1，6)，等待该位置对应的携带已完成抛光晶圆的抛光头(3,8)；
    S2：抛光头(3，8)转移到装卸位置(1，6)后，装卸台模块(22)上升接取晶圆，抛光头(3，8)转移至抛光区域；
    S3：机械手将位于装卸台模块(22)上的晶圆取走后，抛光头(3，8)转回到装卸位置(1，6)，开始清洗抛光头(3，8)；
    S4：清洗完毕后，抛光头(3，8)转回抛光区域，机械手给装卸台模块(22)装载上新的晶圆；
    S5：随后装卸台模块(22)上升，抛光头(3，8)转移到装卸位置(1，6)，完成对待抛光的晶圆吸附后装卸台模块(22)下降，抛光头(3，8)转移至抛光区域抛光；
    S6：重复以上步骤，直至全部晶圆抛光完毕。
  13. 一种根据权利要求2所述的抛光装卸部件模块进行晶圆传输的方法，其特征在于包含以下步骤：
    S1：第一装卸台模块(18)在第一装卸位置(1)等待第一抛光头(3)将完成第一阶段抛光的晶圆由第一抛光头转轴(2)旋转至第一装卸位置(1)；
    S2：抛光好的晶圆由第一抛光头转轴(2)旋转至第一装卸位置(1)后，第一装卸台模块(18)上升，装载好已经完成第一阶段抛光的晶圆；
    S3：第一抛光头(3)转回到第一抛光垫上方，第一装卸台模块(18)下降，机械手开始取走第一装卸台模块上的已经完成第一阶段抛光的晶圆放到第二装卸位置上的第二装卸台模块(15)，第一抛光头(3)转回到第一装卸位置(1)开始清洗第一抛光头(3)；
    S4：清洗完毕后，第一抛光头(3)转回第一抛光垫上，第二抛光头(8)转回到第二装卸位置(6)，第二装卸台模块(15)上升，第二抛光头(8)取走完成第一阶段抛光的晶圆，第一装卸台模块(18)下降，第二抛光头(8)转回第二抛光垫上进行抛光，与此同时机械手将未抛光的晶圆放置在第一装卸位置的第一装卸台模块(18)上；
    S5：第一抛光头(3)旋转至第一装卸位置(1)取走待抛光的晶圆然后开始抛光，当第二抛光头(8)抛光完成后，第二抛光头旋转至第二装卸位置(6)将完成第二阶段抛光的晶圆放置在第二装卸台模块(15)上，第二抛光头(8)旋转回第二抛光垫(9)，机械手取走抛光好的晶圆；
    S6：第二抛光头(8)旋转回第二装卸位置(6)开始清洗第二抛光头(8)，清洗完毕的第二抛光头(8)转回第二抛光垫9上，第一装卸台模块(18)在第一装卸位置等待第一抛光头将完成第一阶段抛光的晶圆由第一抛光头转轴旋转至第一装卸位置；
    S7：重复以上步骤,直至全部晶圆抛光完毕。
  14. 一种根据权利要求2所述的抛光装卸部件模块进行晶圆传输的方法，其特征在于包含 以下步骤：
    S1：装卸台模块(18，15)在装卸位置(1，6)等待抛光头(3，8)将完成抛光的晶圆由抛光头转轴旋转至装卸位置(1，6)；
    S2：抛光头(3，8)转移到装卸位置(1，6)后，装卸台模块(18，15)上升，装载好晶圆；
    S3：抛光头(3，8)转回到抛光区域，机械手开始取走装卸台模块(18，15)上的已经抛光完毕的晶圆，抛光头(3，8)转回到装卸位置(1，6)开始清洗抛光头(3，8)；
    S4：清洗完毕后，抛光头(3，8)转回抛光区域，机械手将装卸台模块(18，15)装载上新的待抛光晶圆；
    S5：随后装卸台模块(18，15)上升，抛光头(3，8)转移到装卸位置(1，6)，完成对待抛光的晶圆吸附并转移至抛光区域抛光，装卸台模块(18,15)下降；
    S6：重复以上步骤，直至全部晶圆抛光完毕。
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