WO2020017049A1 - Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble - Google Patents

Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble Download PDF

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Publication number
WO2020017049A1
WO2020017049A1 PCT/JP2018/027383 JP2018027383W WO2020017049A1 WO 2020017049 A1 WO2020017049 A1 WO 2020017049A1 JP 2018027383 W JP2018027383 W JP 2018027383W WO 2020017049 A1 WO2020017049 A1 WO 2020017049A1
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WO
WIPO (PCT)
Prior art keywords
composition
metal
component
metal particles
rosin
Prior art date
Application number
PCT/JP2018/027383
Other languages
English (en)
Japanese (ja)
Inventor
史貴 上野
斉藤　晃一
雅記 竹内
貴耶 山本
秀明 山岸
将太 梅崎
洋子 坂入
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to PCT/JP2018/027383 priority Critical patent/WO2020017049A1/fr
Priority to JP2020530874A priority patent/JPWO2020017064A1/ja
Priority to PCT/JP2018/035436 priority patent/WO2020017064A1/fr
Publication of WO2020017049A1 publication Critical patent/WO2020017049A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to a composition, a bonding material, a sintered body, a bonded body, and a method for manufacturing a bonded body.
  • Lead-containing alloys solders
  • solders have conventionally been used as means for joining a semiconductor element and a support member when manufacturing a semiconductor device.
  • switching to a lead-free solder that does not contain lead or has a reduced lead content has been promoted in consideration of effects on the environment and living bodies.
  • a bonding material that has excellent low-temperature bonding properties and high-temperature connection reliability (sinters at low temperatures and has a high melting point after sintering), it is referred to as a transitional liquid phase sintered metal adhesive.
  • a joining material has been proposed (for example, see Patent Document 1, Non-Patent Document 1, and Non-Patent Document 2).
  • the transitional liquid phase sintering type metal adhesive is generally prepared in a paste form by adding an organic component to a metal component.
  • the handleability (printability, etc.) when using the paste-like joining material is one of the important characteristics together with the joining strength after sintering.
  • One embodiment of the present invention has been made in view of the above circumstances, and has excellent handleability, and a composition capable of forming a sintered body having excellent bonding strength by a transitional liquid phase sintering method, and a composition comprising the composition.
  • An object of the present invention is to provide a bonding material to be contained, a sintered body using the composition, a bonded body, and a method for producing the same.
  • ⁇ 1> Contains a metal component capable of transitional liquid phase sintering and an organic component, wherein the metal component includes metal particles A having a melting point higher than 300 ° C. and metal particles B having a melting point of 300 ° C. or lower.
  • a composition in which the organic component contains rosin, and the content of the rosin is 0.09 g to 0.17 g per 1 m 2 of the total surface area of the metal component.
  • the organic component further includes at least one selected from the group consisting of a resin component, a thixotropic agent, an activator, an antioxidant, and a solvent.
  • ⁇ 3> The composition according to ⁇ 1> or ⁇ 2>, wherein the metal particles A include Cu.
  • the metal particles B include Sn.
  • ⁇ 5> A bonding material containing the composition according to any one of ⁇ 1> to ⁇ 4>.
  • ⁇ 6> A sintered body of the composition according to any one of ⁇ 1> to ⁇ 4>.
  • ⁇ 7> A joined body in which the element and the support member are joined via the sintered body according to ⁇ 6>.
  • composition according to any one of ⁇ 1> to ⁇ 4> is applied to at least one of a position where the element is joined to the support member and a position where the device is joined to the support member.
  • Production of a joined body comprising: a step of forming a composition layer; a step of contacting the support member with the element via the composition layer; and a step of heating and sintering the composition layer.
  • a composition capable of forming a sintered body having excellent handling properties and excellent bonding strength by a transitional liquid phase sintering method, a bonding material containing the composition, and the composition
  • the present invention provides a sintered body, a joined body, and a method for manufacturing the same using the same.
  • the present invention is not limited to the following embodiments.
  • the components including the element steps and the like
  • the numerical ranges indicated by using “to” include the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of the numerical range described in other stages.
  • the upper limit or the lower limit of the numerical range may be replaced with the value shown in the embodiment.
  • the content of each component in the composition when there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the total of the plurality of substances present in the composition Means content.
  • the particle size of each component in the composition when there are a plurality of types of particles corresponding to each component in the composition, unless otherwise specified, a mixture of the plurality of types of particles present in the composition Means the value of
  • the term "layer" includes, when observing a region where the layer exists, in addition to a case where the layer is formed over the entire region and a case where the layer is formed only on a part of the region. included.
  • composition of the present disclosure includes a metal component capable of transitional liquid phase sintering and an organic component, wherein the metal component has metal particles A having a melting point higher than 300 ° C. and metal particles having a melting point of 300 ° C. or lower.
  • the organic component contains rosin, and the content of the rosin per 1 m 2 of surface area of the entire metal component is 0.09 g to 0.17 g.
  • the composition used as the transitional liquid phase sintering type metal adhesive generally contains rosin as a flux component for removing a surface oxide film of a metal component. If the rosin content is too small, the surface oxide film of the metal component may not be sufficiently removed, and sufficient bonding strength may not be obtained. On the other hand, if the content of rosin is too large, the viscosity of the composition may increase and the handling properties such as printability may be impaired.
  • the composition of the present disclosure defines the amount of rosin contained in the composition within a specific range based on the surface area of the metal component contained in the composition. This achieves excellent handleability of the composition and sufficient bonding strength after sintering.
  • the composition of the present disclosure contains a metal component capable of transitional liquid phase sintering.
  • “Transitional liquid phase sintering” in the present disclosure is also referred to as “Transient Liquid Phase Sintering (TLPS)” and is a liquid obtained by heating a metal interface having a relatively low melting point (low melting point metal) among particles having different melting points.
  • TLPS Transient Liquid Phase Sintering
  • This refers to a phenomenon in which the formation of a metal compound (alloying) by both metals proceeds due to phase transition and reaction diffusion of a metal having a relatively high melting point (high melting point metal) into the liquid phase.
  • a metal component capable of transitional liquid phase sintering a combination of metals having different melting points (combination of a low melting point metal and a high melting point metal) capable of transitional liquid phase sintering is given.
  • the combination of metals capable of transitional liquid phase sintering is not particularly limited.
  • a combination of a low-melting metal and a high-melting metal is Sn and Cu, a combination of In and Au, and a combination of Sn and Co, respectively.
  • Sn and Ni There are certain combinations and combinations of Sn and Ni.
  • the combination of metals capable of transitional liquid phase sintering may be a combination of two metals or a combination of three or more metals.
  • Metal components capable of transitional liquid phase sintering include metal particles A having a melting point higher than 300 ° C and metal particles B having a melting point of 300 ° C or lower.
  • the melting point of the metal particles A is preferably 500 ° C. or higher, more preferably 800 ° C. or higher.
  • the melting point of the metal particles B having a melting point of 300 ° C. or less is preferably 250 ° C. or less.
  • the metal component capable of transitional liquid phase sintering may include Cu (melting point: 1085 ° C.) as metal particles A and Sn (melting point: 231.9 ° C.) as metal particles B. May be included.
  • the metal component containing Cu and Sn produces a copper-tin metal compound (Cu 6 Sn 5 ) by sintering. Since this generation reaction proceeds at around 250 ° C., sintering by general equipment such as a reflow furnace is possible.
  • the metal component includes the metal particles A and the metal particles B is not particularly limited.
  • the metal particles A and the metal particles B may each be a single metal state, or one or both of the metal particles A and the metal particles B may be in an alloy state. Further, the metal particles A and the metal particles B may contain the same kind of metal element.
  • the metal particles A may include Cu
  • the metal particles B may include an alloy containing Su.
  • An example in which Sn is in an alloy state includes an alloy (SAC) composed of Su, Ag, and Cu.
  • the composition of the SAC is not particularly limited, and examples thereof include Sn-3.0Ag-0.5Cu.
  • an alloy represented by Sn-AX-BY indicates that the alloy containing Sn contains A mass% of the element X and B mass% of the element Y in the alloy containing Sn.
  • the melting point (liquid phase transition temperature) of the alloy represented by Sn-3.0Ag-0.5Cu is about 217 ° C.
  • the ratio of the metal particles A to the metal particles B in the metal component is not particularly limited.
  • the ratio of the metal particles A in the metal component is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 67% by mass or more of the entire metal component.
  • the metal particles A and the metal particles B contained in the metal component may each be composed of only one kind of metal, or may be composed of two or more kinds of metals.
  • the metal particle A or the metal particle B is composed of two or more kinds of metals, even if the metal particle is a combination (mixture) of metal particles containing each of the two or more kinds of metals, the two or more kinds of metals are the same metal. It may be contained in the particles or a combination thereof.
  • the configuration of metal particles containing two or more metals in the same metal particle is not particularly limited.
  • it may be a metal particle composed of an alloy of two or more metals or a metal particle composed of a simple substance of two or more metals.
  • Metal particles composed of a simple substance of two or more metals can be obtained, for example, by forming a layer containing the other metal on the surface of the metal particle containing one metal by plating, vapor deposition, or the like.
  • the same metal particles are applied to the surface of a metal particle containing one metal by applying particles containing the other metal in a dry manner using a force mainly composed of an impact force in a high-speed airflow to combine the two.
  • Metal particles containing two or more metals therein can also be obtained.
  • the average particle size of the metal particles is not particularly limited.
  • the average particle size of the metal particles is preferably 0.5 ⁇ m to 80 ⁇ m, more preferably 1 ⁇ m to 50 ⁇ m, and still more preferably 1 ⁇ m to 30 ⁇ m.
  • the average particle size of the metal particles refers to a volume average particle size measured by a laser diffraction type particle size distribution analyzer (for example, LS ⁇ 13 ⁇ 320 type laser scattering diffraction particle size distribution analyzer, Beckman Coulter, Inc.). Specifically, metal particles are added to 125 g of a solvent (terpineol) in a range of 0.01% by mass to 0.3% by mass to prepare a dispersion. About 100 ml of this dispersion is poured into a cell and measured at 25 ° C. The particle size distribution is measured with the refractive index of the solvent being 1.48.
  • a laser diffraction type particle size distribution analyzer for example, LS ⁇ 13 ⁇ 320 type laser scattering diffraction particle size distribution analyzer, Beckman Coulter, Inc.
  • the relationship between the sizes of the metal particles A and the metal particles B is not particularly limited. From the viewpoint of filling the voids between the metal particles A with the molten metal particles B during sintering, for example, the value of the average particle diameter of the metal particles A / the average particle diameter of the metal particles B is preferably greater than 1. More preferably, it is more than 2, more preferably more than 5. The upper limit of the value of the average particle size of the metal particles A / the average particle size of the metal particles B is not particularly limited, but may be, for example, 10 or less.
  • the content of the metal component in the composition is not particularly limited.
  • the ratio by mass of the metal component to the entire composition is preferably 80% by mass or more, more preferably 85% by mass or more, and even more preferably 88% by mass or more.
  • the ratio by mass of the metal component to the entire composition may be 98% by mass or less.
  • compositions of the present disclosure contain an organic component.
  • the organic component contains at least rosin, and may further contain a resin component, an activator, a solvent, and the like.
  • effects such as improvement of printability when the composition of the present disclosure is used as a paste can be obtained.
  • the content of the organic component in the composition is not particularly limited.
  • the proportion by mass of the organic component in the entire composition is preferably less than 20% by mass, more preferably less than 15% by mass, and even more preferably less than 12% by mass.
  • the ratio by mass of the organic component to the whole composition may be more than 2% by mass. If the proportion based on the mass of the organic component is more than 2% by mass, printability tends to be hardly impaired when the composition of the present disclosure is used as a paste.
  • Rosin acts as a flux component.
  • the flux component means an organic component capable of exerting a flux action (an action of removing an oxide film), and its type is not particularly limited. Rosin may be used alone or in combination of two or more.
  • perrosin examples include dehydroabietic acid, dihydroabietic acid, neoabietic acid, dihydropimaric acid, pimaric acid, isopimaric acid, tetrahydroabietic acid, and parastolic acid.
  • the content of rosin is 0.09 g to 0.17 g, preferably 0.117 g to 0.156 g, per 1 m 2 of the total surface area of the metal components contained in the composition.
  • the surface area of the entire metal component contained in the composition can be obtained based on the specific surface area (surface area per unit mass) measured by the BET method according to JIS-Z-8830: 2013.
  • the surface area of the entire metal component is a value obtained by summing the surface areas of the plurality of types of metal particles.
  • the surface area X of the entire metal component composed of 1 gram of the metal particles M1 having the specific surface area S1, 2 grams of the metal particles M2 having the specific surface area S2, and 3 grams of the metal particles M3 having the specific surface area S3 is represented by the following equation.
  • the content of rosin contained in the composition is measured, for example, by separating a metal component and an organic component contained in the composition using a solvent or the like, and performing a quantitative analysis on the separated organic component by gas chromatography. can do.
  • the composition of the present disclosure may contain a resin component as an organic component.
  • a resin component as an organic component.
  • the resin component contained in the composition may be a thermoplastic resin, a thermosetting resin, or a combination thereof.
  • the resin component may be in the state of a monomer having a functional group capable of causing a polymerization reaction by heating or in the state of a polymer that has already been polymerized.
  • thermosetting resin examples include a resin having a functional group such as an epoxy group, an acryloyl group, a methacryloyl group, a hydroxy group, a vinyl group, a carboxy group, an amino group, a maleimide group, an acid anhydride group, a thiol group, and a thionyl group.
  • a resin having a functional group such as an epoxy group, an acryloyl group, a methacryloyl group, a hydroxy group, a vinyl group, a carboxy group, an amino group, a maleimide group, an acid anhydride group, a thiol group, and a thionyl group.
  • thermosetting resin examples include an epoxy resin, an oxazine resin, a bismaleimide resin, a phenol resin, an unsaturated polyester resin, and a silicone resin. Of these, epoxy resins are preferred.
  • epoxy resin for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, naphthalene type epoxy resin, biphenol type epoxy resin, Biphenyl novolak type epoxy resins and cycloaliphatic epoxy resins are exemplified.
  • the resin component may be used alone or in combination of two or more.
  • the ratio of the resin component to the entire organic component is not particularly limited. For example, it may be 0.1% by mass to 50% by mass of the whole organic component.
  • the composition of the present disclosure may contain a flux component other than rosin as an organic component.
  • a flux component other than rosin include an activator, a thixotropic agent, and an antioxidant.
  • One type of flux component may be used alone, or two or more types may be used in combination.
  • the activator include aminodecanoic acid, pentane-1,5-dicarboxylic acid, triethanolamine, diphenylacetic acid, sebacic acid, phthalic acid, benzoic acid, dibromosalicylic acid, anisic acid, iodosalicylic acid, picolinic acid and the like.
  • Can be Specific examples of the thixotropic agent include 12-hydroxystearic acid, 12-hydroxystearic acid triglyceride, ethylenebisstearic acid amide, hexamethylenebisoleic acid amide, N, N'-distearyladipic acid amide and the like.
  • Specific examples of the antioxidant include a hindered phenol-based antioxidant, a phosphorus-based antioxidant, and a hydroxylamine-based antioxidant.
  • the total ratio of the rosin and the flux component other than rosin to the entire organic component is not particularly limited. For example, it may be 0.1% by mass to 50% by mass of the whole organic component.
  • the composition of the present disclosure may contain a solvent as an organic component.
  • the solvent is preferably a polar solvent, and from the viewpoint of preventing drying of the composition in the step of applying the composition, it is preferably a solvent having a boiling point of 200 ° C or higher. It is more preferable that the solvent has a boiling point of 300 ° C. or less in order to suppress generation of voids during sintering.
  • solvents examples include terpineol, stearyl alcohol, tripropylene glycol methyl ether, diethylene glycol, diethylene glycol monoethyl ether (ethoxyethoxyethanol), diethylene glycol monohexyl ether, diethylene glycol monomethyl ether, dipropylene glycol-n-propyl ether, Alcohols such as dipropylene glycol-n-butyl ether, tripropylene glycol-n-butyl ether, 1,3-butanediol, 1,4-butanediol, propylene glycol phenyl ether, 2- (2-butoxyethoxy) ethanol; Tributylate, 4-methyl-1,3-dioxolan-2-one, ⁇ -butyrolactone, diethylene glycol Esters such as ethyl ether acetate, dipropylene glycol methyl ether acetate, diethylene glycol monobutyl ether acetate and glycerin tria
  • the proportion of the solvent in the whole organic component is not particularly limited. For example, it may be 0.1% by mass to 50% by mass of the whole organic component.
  • the method for producing the composition of the present disclosure is not particularly limited. For example, it can be obtained by mixing components constituting the composition of the present disclosure, and further performing a treatment such as stirring, melting, and dispersion.
  • the apparatus for mixing, stirring, dispersing, and the like is not particularly limited, and includes a three-roll mill, a planetary mixer, a planetary mixer, a rotation-revolution-type stirring apparatus, a grinder, a twin-screw kneader, A thin shear disperser or the like can be used. Further, these devices may be used in appropriate combination. During the above treatment, heating may be performed as necessary. After the treatment, the maximum particle size of the composition may be adjusted by filtration. Filtration can be performed using a filtration device. Examples of the filter for filtration include a metal mesh, a metal filter, and a nylon mesh.
  • composition of the present disclosure is used, for example, as a joining material for joining an element constituting a semiconductor device, an electronic component, or the like and a support member.
  • applications of the composition of the present disclosure are not limited to these.
  • the bonding material of the present disclosure contains the composition of the present disclosure.
  • the composition of the present disclosure can be used as a bonding material as it is, or may be used as a bonding material by adding other components as necessary.
  • Preferred embodiments of the bonding material of the present disclosure are the same as those of the composition of the present disclosure described above.
  • the sintered body of the present disclosure is obtained by sintering the composition of the present disclosure.
  • the method for sintering the composition of the present disclosure is not particularly limited.
  • the electric resistivity of the sintered body is preferably 1 ⁇ 10 ⁇ 4 ⁇ ⁇ cm or less.
  • the joined body of the present disclosure is one in which the element and the support member are joined via the sintered body of the present disclosure.
  • the support member is not particularly limited, and a material in which the material of the portion where the elements are joined is metal is used. Examples of the metal as the material of the portion where the elements are joined include gold, silver, copper, nickel, and the like. Further, among the above, a plurality of metals may be patterned on the base material to form a support member. Specific examples of the support member include a lead frame, a wired tape carrier, a rigid wiring board, a flexible wiring board, a wired glass substrate, a wired silicon wafer, and a wafer level CSP (Wafer Level Chip Size Package).
  • the elements are not particularly limited, and include active elements such as semiconductor chips, transistors, diodes, light emitting diodes, and thyristors, and passive elements such as capacitors, resistors, resistor arrays, coils, and switches.
  • examples of the joined body of the present disclosure include a semiconductor device and an electronic component.
  • Specific examples of the semiconductor device include a diode, a rectifier, a thyristor, a metal oxide semiconductor (MOS) gate driver, a power switch, a power oxide semiconductor field-effect transistor (IGBT), and an IGBT (insulator transistor).
  • Examples include a power module including a fast recovery diode, a transmitter, an amplifier, and an LED module.
  • the method for manufacturing a joined body according to the present disclosure includes forming a composition layer by applying the composition of the present disclosure to at least one of a portion of the support member where the device is joined and a portion of the device where the device is joined to the support member. Performing, contacting the support member with the element via the composition layer, and heating and sintering the composition layer.
  • the step of applying the composition to form the composition layer may include the step of drying the applied composition.
  • a composition layer is formed by applying the composition of the present disclosure to at least one of a portion of the support member where the element is bonded and a portion of the device where the device is bonded to the support member.
  • the method for applying the composition include a coating method and a printing method.
  • a coating method for applying the composition for example, dipping, spray coating, bar coating, die coating, comma coating, slit coating, and application using an applicator can be used.
  • a printing method for printing the composition for example, a dispenser method, a stencil printing method, an intaglio printing method, a screen printing method, a needle dispenser method, and a jet dispenser method can be used.
  • the composition layer formed by applying the composition is preferably dried from the viewpoint of suppressing the flow of the composition and the generation of voids during heating.
  • a method for drying the composition layer drying by standing at room temperature (for example, 25 ° C.), drying by heating, or drying under reduced pressure can be used.
  • room temperature for example, 25 ° C.
  • heating or vacuum drying hot plate, hot air dryer, hot air heating furnace, nitrogen dryer, infrared dryer, infrared heating furnace, far infrared heating furnace, microwave heating device, laser heating device, electromagnetic heating device , A heater heating device, a steam heating furnace, a hot plate pressing device, or the like.
  • the temperature and time for drying can be appropriately adjusted according to the type and amount of the solvent used. For example, drying at 50 ° C. to 180 ° C.
  • the element and the supporting member are brought into contact with each other, whereby the element and the supporting member are bonded to each other with the composition layer interposed therebetween.
  • the step of drying the applied composition may be performed before or after the step of bringing the support member into contact with the element.
  • a sintered body is formed by heating the composition layer.
  • the sintering of the composition layer may be performed by a heat treatment or a heat and pressure treatment.
  • heating treatment hot plate, hot air dryer, hot air heating furnace, nitrogen dryer, infrared dryer, infrared heating furnace, far infrared heating furnace, microwave heating device, laser heating device, electromagnetic heating device, heater heating An apparatus, a steam heating furnace, or the like can be used.
  • a hot plate press device or the like may be used, or the above-described heating treatment may be performed while applying pressure.
  • the heating temperature in the sintering of the composition layer can be selected according to the type and content of the components contained in the composition.
  • the melting point is preferably equal to or higher than the melting point of the metal particles B.
  • the temperature is preferably 180 ° C. or higher, more preferably 190 ° C. or higher, and further preferably 220 ° C. or higher.
  • the upper limit of the heating temperature is not particularly limited, but may be, for example, 300 ° C. or lower.
  • the heating time in the sintering of the composition layer can be selected according to the type and content of the components contained in the composition. For example, the duration is preferably from 5 seconds to 10 hours, more preferably from 1 minute to 30 minutes, even more preferably from 3 minutes to 10 minutes.
  • the sintering of the composition layer is preferably performed in an atmosphere having a low oxygen concentration.
  • the low oxygen concentration atmosphere refers to a state in which the oxygen concentration is 1000 ppm or less, and preferably 500 ppm or less.
  • Each component shown in Table 1 was mixed in an amount (unit: g) shown in Table 1 to prepare a composition. Details of the components shown in Table 1 are as follows.
  • Metal component 1 Cu particles having an average particle size of 3 ⁇ m
  • Metal component 2 Cu particles having an average particle size of 25 ⁇ m
  • Metal component 3 SAC particles having an average particle size of 3 ⁇ m (Sn96.5 mass%, Ag 3.0 mass%, Cu 0.5 mass %)
  • Metal component 4 SAC particles having an average particle diameter of 25 ⁇ m (Sn96.5% by mass, Ag 3.0% by mass, Cu 0.5% by mass)
  • Organic component 1 Epoxy resin (bisphenol A type epoxy resin)
  • Organic component 2 Rosin (dehydroabietic acid)
  • Organic component 3 Thixo agent (hydroxystearic acid)
  • Organic component 4 Activator (triethanolamine)
  • Organic component 5 Antioxidant (hindered phenolic antioxidant, trade name “Irganox 1010” of BASF)
  • Organic component 6 solvent (diethylene glycol monohexyl ether)
  • the prepared composition was applied to a copper lead frame using sharp tweezers to form a composition layer.
  • An Si chip having a size of 2 mm ⁇ 2 mm and a gold-plated surface was placed on the composition layer, and lightly pressed with tweezers to obtain a sample of the composition before sintering.
  • After the sample before sintering was dried on a hot plate at 100 ° C. for 30 minutes, it was set on a conveyor of a nitrogen reflow apparatus (Tamura Seisakusho Co., Ltd .: 1 zone 50 cm, 7 zone configuration, under a nitrogen stream), and the oxygen concentration was 200 ppm. It was conveyed at a speed of 0.3 m / min below.
  • the sample was heated at 250 ° C. or more for 1 minute or more to obtain a sintered sample of the composition.
  • a universal bond tester 4000 series, manufactured by DAGE
  • the Si chip was pressed horizontally at a measurement speed of 500 ⁇ m / s and a measurement height of 100 ⁇ m, and the die-share of a sintered sample of the composition was performed.
  • the strength was measured.
  • the average of the results of the nine measurements was taken as the die shear strength. If the die shear strength is less than 20 MPa, it can be said that the adhesion is poor.
  • Thermal conductivity A sintered product of the composition prepared in the same manner as in the die shear strength measurement was polished with a polishing paper to a size of 12 mm in diameter and 0.5 mm in thickness to prepare a test piece for measuring thermal conductivity. Then, using a Xe flash method thermal conductivity measuring device (Nano Flash, LFA447, manufactured by NETZCCH), the lamp voltage was 247.0 V, the pulse width was 0.06 mm, and the diffusion model was tested from the following formula A under the conditions of the Cowan model. The thermal conductivity ⁇ (W / (m ⁇ K)) of the piece was measured.
  • a stainless steel metal mask (30 cm ⁇ 30 cm, line width 1.0 mm, line interval 0.2 mm, number of lines 5) was placed on the substrate, and fixed to the substrate with an adhesive tape so as not to shift. 20 g of the composition was taken out, uniformly applied to the upper part of the metal mask, and the groove was filled with the composition using a squeegee made of polypropylene. Thereafter, the metal mask was removed to obtain a printed material. The above process was repeated five times without washing the metal mask, and it was visually confirmed that the lines of each printed matter were not connected and the corners of the lines were not crushed. Thereafter, the printed matter was heated at 200 ° C. for 1 minute in the atmosphere, and it was confirmed that there was no connection between the lines.
  • Continuous printing time in Table 1 means that when a printing press is filled with 200 g of the composition and printing is continuously performed by the above method, the connection between the lines of the printed material, the corners of the lines are crushed, and after heating. Means the time (h) until at least one of the connections between the lines occurs.
  • a sintered sample of the composition was prepared in the same manner as in the measurement of the die shear strength.
  • a sintered sample of the composition was set in a thermal shock tester (Type 6015, manufactured by Life Tech Co., Ltd.), and a cooling / heating cycle test in which cooling and heating were repeated was performed. Specifically, first, cool at room temperature (25 ° C.) at a rate of ⁇ 10 ° C./min and maintain at ⁇ 65 ° C. for 30 minutes, then heat at a rate of + 10 ° C./min and maintain at 175 ° C. for 30 minutes. Thereafter, an operation of cooling to room temperature (25 ° C.) at a rate of ⁇ 10 ° C. per minute was defined as one cycle.
  • the compositions of Examples 1 and 2 in which the amount of rosin (Y / X) per 1 m 2 of the surface area of the entire metal component was in the range of 0.09 g to 0.17 g, was obtained by the continuous printing time. The evaluation was excellent and the handleability was excellent. Further, the die shear strength after sintering was large and the bonding strength was excellent.
  • the composition of Comparative Example 1 in which the amount of rosin per 1 m 2 of the total surface area of the metal component (Y / X) was less than 0.09 g had the same continuous printing time as that of the example, but the die shear strength after sintering. was smaller than the example, and the result of the reliability test was inferior to the example.

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Abstract

L'invention concerne une composition contenant : un composant métallique qui peut subir un frittage en phase liquide transitoire; et un composant organique. Le composant métallique contient : des particules métalliques A ayant un point de fusion plus élevé que 300°C; et des particules métalliques B ayant un point de fusion ne dépassant pas 300°C. Le composant organique contient de la colophane, et la teneur en colophane par 1m2 de la surface de l'ensemble du composant métallique se situe dans la plage de 0,09 g à 0,17g inclus.
PCT/JP2018/027383 2018-07-20 2018-07-20 Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble WO2020017049A1 (fr)

Priority Applications (3)

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PCT/JP2018/027383 WO2020017049A1 (fr) 2018-07-20 2018-07-20 Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble
JP2020530874A JPWO2020017064A1 (ja) 2018-07-20 2018-09-25 組成物、接合材料、焼結体、接合体及び接合体の製造方法
PCT/JP2018/035436 WO2020017064A1 (fr) 2018-07-20 2018-09-25 Composition, matériau de liaison, compact fritté, ensemble et procédé de production d'ensemble

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356630A (ja) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2012216855A (ja) * 2010-11-19 2012-11-08 Murata Mfg Co Ltd 接続対象物の接続方法および電子装置の製造方法
JP2014054663A (ja) * 2012-09-13 2014-03-27 Tamura Seisakusho Co Ltd フラックス組成物、ソルダーペースト組成物及びプリント配線基板
JP2015098052A (ja) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉
WO2016039056A1 (fr) * 2014-09-09 2016-03-17 株式会社村田製作所 Composition métallique et matériau de liaison

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356630A (ja) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2012216855A (ja) * 2010-11-19 2012-11-08 Murata Mfg Co Ltd 接続対象物の接続方法および電子装置の製造方法
JP2014054663A (ja) * 2012-09-13 2014-03-27 Tamura Seisakusho Co Ltd フラックス組成物、ソルダーペースト組成物及びプリント配線基板
JP2015098052A (ja) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉
WO2016039056A1 (fr) * 2014-09-09 2016-03-17 株式会社村田製作所 Composition métallique et matériau de liaison

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