WO2019203377A1 - 레이저 스캐닝 장비의 자동 위치 보정 장치 - Google Patents
레이저 스캐닝 장비의 자동 위치 보정 장치 Download PDFInfo
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- WO2019203377A1 WO2019203377A1 PCT/KR2018/004662 KR2018004662W WO2019203377A1 WO 2019203377 A1 WO2019203377 A1 WO 2019203377A1 KR 2018004662 W KR2018004662 W KR 2018004662W WO 2019203377 A1 WO2019203377 A1 WO 2019203377A1
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- WIPO (PCT)
- Prior art keywords
- laser beam
- mirror
- laser
- scanning equipment
- correction device
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Definitions
- the present invention relates to an automatic position correcting apparatus for laser scanning equipment, wherein the complex offset or gain generated in the laser, scanner, and optics by the influence of instruments, heat, and noise in the laser scanning equipment.
- An automatic position correcting apparatus for laser scanning equipment using a position measuring module for detecting a minimum laser beam irradiation position to improve drift.
- laser scanning equipment is used for a variety of purposes, in particular marking, labeling, cutting, drilling, sintering or welding.
- a micromachining system for processing a material or marking a surface of the material by using a laser beam is widely used.
- the control precision of the laser scanner is highly required.
- the laser beam scanner is provided with an X-axis scanner and a Y-axis scanner when it is necessary to deflect the laser beam emitted from the laser oscillator in the X-axis and Y-axis directions, thereby driving the X-axis scanner and the Y-axis scanner, respectively.
- X-axis driver and Y-axis driver are provided for the purpose, and the X-axis scanner and Y-axis scanner are offset and gain due to the distortion of the laser beam, the optical element and the mirror of the laser beam scanner. There is a problem that a drift of gain occurs.
- the reflection mirror reflecting the laser beam constituting the laser beam scanner at a predetermined angle and a scanner motor (galvano motor) which rotates the reflection mirror to adjust the angle of the reflection mirror.
- the variation of the reflection mirror due to the change of the resistance is one of the main factors affecting the current flowing in the coil of the micro motor, the value of which changes as the temperature changes, thereby controlling the exact angle of the reflection mirror of the laser beam scanner. This causes an error in the control accuracy of the laser beam scanner.
- the resistance value may be compensated according to the temperature change, but the compensation of the actual resistance value is an error from the compensation method or the measurement of the resistance change rate.
- the 'laser head' of Korean Patent Laid-Open Publication No. 2005-0106664 maintains the temperature of the laser beam scanner motor appropriately rather than using a method of compensating the resistance variation rate according to temperature. A method was proposed.
- the scanner block 20 is fixedly installed in the casing 11 of the laser head 10, and the scanner block 20 has an X-axis scanner 21 and a Y-axis scanner ( 22) body is fixedly installed.
- the laser head 10 is a system for irradiating a laser beam emitted from a laser oscillator in a predetermined direction, and performs a laser machining operation on a surface to be processed moved by an X-Y stage.
- reference numeral 13 denotes a hole in which the laser beam is incident
- 14 denotes a reflection mirror in which the incident laser beam is reflected
- 15 denotes a hole on a path from which the laser beam passing through the scanner block 20 goes from the laser head to the work object.
- this conventional technique controls the temperature of the laser beam scanner motor, which is affected by laser irradiation by the temperature inside the laser beam scanner, to be kept constant so that the temperature of the laser beam scanner motor can be controlled quickly, precisely and reliably.
- the reflection mirror control accuracy of the laser beam scanner is increased, thereby increasing the reliability of processing in the micro or nano unit and increasing the life of the components constituting the laser beam scanner.
- it is intended to keep the temperature inside the simple laser beam scanner stable, and such improvement alone is limited to improve the distortion of the complex offset or gain caused by the influence of the instrument, heat and noise. Due to laser There are some limitations to ensure the precision required for the ball.
- the present invention devised to solve the problems of the prior art as described above is a complex offset or gain distortion caused by the influence of the instrument, heat and noise among the environmental elements of the laser beam scanner while using a minimum position measurement module.
- the purpose is to improve.
- An object of the present invention is an automatic position correction device for laser scanning equipment, comprising: a laser beam source for transmitting a laser beam in a first direction perpendicular to an X-Y plane in which a processing surface of a workpiece is located; A first mirror for irradiating a laser beam from the laser beam source in a predetermined angle range in a planar direction of a second direction maintaining a predetermined angle with respect to the first direction; A second mirror for irradiating the laser beam reflected from the first mirror onto a machining surface having a rectangular shape; A first motor and a second motor for rotating the first mirror and the second mirror, respectively; One or more positions disposed at actual irradiation positions of the laser beam determined by four independent position parameters and four independent position parameters of the machining surface on which the laser beam is to be irradiated to the workpiece.
- a measurement module And a correction unit generating a signal for driving any one or more of the first motor and the second motor to correct any one or more of the position parameter and the offset or gain misalignment of the actual position. It is achieved by an automatic position correction device for laser scanning equipment.
- the automatic position correction device for laser scanning equipment of the present invention is a combination of offsets or gains generated by the influence of the mechanism, heat and noise generated in the laser beam scanner, which is an environmental element of the laser beam scanner. There is an effect to improve the drift while using a minimum position measuring module.
- FIG. 1 is an overall configuration diagram of a laser head including a temperature control device according to the prior art
- FIG. 2 is a basic explanatory diagram of an automatic position correction device for laser scanning equipment of the present invention for explaining the occurrence of offset and gain distortion;
- FIG 3 is an explanatory diagram for the offset and gain of the offset and gain of the automatic position correction device of the laser scanning device according to the present invention.
- FIG. 4 is a configuration diagram for the correction of the automatic position correction device of the laser scanning apparatus according to the present invention.
- FIG 5 is an exemplary view of the position measurement module of the present invention.
- the automatic position correction device of the laser scanning device of the present invention is the machining surface of the object to be processed, such as marking (marking), labeling (cutting), cutting (drilling), sintering or welding is located
- the laser beam is irradiated from the laser beam source 100 in a first direction perpendicular to the XY plane 310, and the distortion d1 of the laser beam itself is generated.
- the laser beam irradiated from the laser beam source 100 generates an optical distortion d2 by an optical lens such as the condenser lens 110, and then the laser beam that has passed through the condenser lens 110 is predetermined with respect to the first direction.
- the laser beam is distorted from the first mirror 210 in a predetermined angular range in the plane direction of the second direction maintaining the angle (d3), and then the laser beam reflected from the first mirror 210 is processed in the XY plane.
- the distortion d4 is also generated in the second mirror 220 irradiated by the predetermined area 310 and the position measurement module 400 of the processed surface of the surface.
- the first mirror 210 reflects the laser beam from the laser beam source 100 in the upright state in the horizontal direction or the horizontal direction slightly inclined in the horizontal direction, but the predetermined angle by the rotation axis of the first mirror 210.
- the reflection line that is, the irradiation line of the second mirror 220 located on the central axis of rotation of the second mirror 220
- the second mirror 220 is formed along the axis of rotation
- the laser beam on the irradiation line is reflected vertically downward to form a processing area, that is, an irradiation area on the surface of the object.
- a first motor (not shown) which rotates the first mirror 210 and the second mirror 220 to irradiate a laser beam in a predetermined angle range to the first mirror 210 and the second mirror 220;
- a second motor (not shown) is provided.
- the laser beam sent from the laser beam source 100 is divided into four pieces of P1 (x1, y1), P2 (x2, y2), P3 (x3, y3) and P4 (x4, y4) with respect to the processing surface of the workpiece.
- a rectangular laser beam irradiation area is formed having vertex coordinates as independent position parameters.
- the position measuring module is disposed at any one or more of four independent position parameters in order to detect the laser beam irradiation position using the minimum position measuring module.
- FIG. 3 is an explanatory diagram for the offset and gain of the offset and gain of the automatic position correction device for laser scanning equipment according to the present invention.
- P1 x1, y1
- P2 x2, y2
- P3 x3, y3
- P4 x4, y4
- One or more of the position measuring modules of the actual irradiation position of the laser beam determined by four independent position parameters and four independent position parameters of the machining surface on which the laser beam is to be irradiated to the object to detect such offset and gain distortion
- At least one position measuring module 400 is disposed between the second mirror 220 and the processing surface.
- the arrangement of the two position measuring modules 400 to measure the points P1 and P1 'and the measurement of P4 and P4', respectively, is not limited to this arrangement as an example for explaining the present invention. .
- the actual irradiation position of the laser beam determined by the four independent position parameters is detected by the position measuring module 400, which uses an image sensor or a photo diode, which is a precise light sensor, as the imaging sensor 440.
- the offset and gain of the irradiation area irradiated with the actual laser beam are calculated as follows.
- the offset skew is calculated by the difference between the actual position of the laser beam corresponding to one position parameter P1 and P1 ', and the gain skew is the irradiation area 310 of the laser beam determined by four independent position parameters.
- the x-axis gain and the y-axis gain are calculated based on the ratio of the length of the x-axis and the y-axis and the length of the x-axis and the y-axis of the laser beam actual irradiation area 320, and the laser beam irradiation area 310 and the laser beam
- the calculation method of the offset and gain using the vertex coordinates representing the actual irradiation area 320 is calculated as the reference point P1 'point as follows.
- the offset value is calculated using the offset x1 and the offset y1 when only one position measuring module 400 is used, and the average value of the offset x1 and the offset x2 is x when two position measuring modules 400 are used. It is used as the direction offset and the average value of the offset y1 and the offset y2 is used as the y direction offset.
- the average of the offsets or gains by the diagonals existing between the two or more position measurement modules 400 is used.
- the second motor attached to the first motor or the second mirror 220 attached to the first mirror 210 so as to correspond to the laser beam irradiation area 310 in a normal operating state.
- the offset or the gain misalignment is corrected.
- This process is repeatedly performed during the operation of the laser scanner equipment, thereby increasing the accuracy and reproducibility of the laser processing by correcting any misalignment of one or more of offset or gain in real time in the laser scanner equipment. .
- the automatic position correction device for laser scanner equipment of the present invention includes a first motor and a second mirror 220 attached to the position measurement module 400, the correction unit 500, and the first mirror 210. It is configured to include a second motor attached to the).
- the position measuring module 400 acquires an image by capturing the actual laser beam irradiation area 320 using an image sensor or a photodiode, which is a precise optical sensor, and a laser beam should be irradiated to the processing object from the acquired image.
- the laser beam irradiation position is detected by the at least one position measuring module 400 at the actual irradiation position of the laser beam determined by the four independent position parameters and the four independent position parameters of the machining surface, and is corrected by the correction unit 500. Either one or more of the offset or gain skew should be derived.
- the first motor attached to the first mirror 210 and the second motor attached to the second mirror 220 are arranged so that the offset and gain distortion derived from the corrector 500 coincide with the vertex coordinates of the normal operating state.
- the detection of the position measuring module 400 and the generation of the correction signal of the correction unit 500 are performed in real time at a time interval that maintains within the processing tolerance of the processing target of the laser scanning equipment, which occurs in a short term.
- the amount of distortion is relatively small, but when the accumulation accumulates over a long term over time, the accuracy of laser processing is significantly lowered due to the accumulation of distortion several times to several tens of times compared to the distortion generated in a short term. Since is generated, by performing in real time at a time interval to maintain the machining tolerance of the object to be processed so that the offset and gain distortion can be maintained within the distortion range generated in a short time.
- the position measuring module 400 of the present invention has a laser beam generated from the laser beam source 100 and is incident on the laser beam passing through the laser scanning equipment.
- the optical filter unit 410 for blocking the light, the optical modified optical unit 420, the optical modified optical unit 420 to enlarge, reduce, change the shape and change the wavelength of the laser beam transmitted by the optical filter unit 410
- the light output converter 430 reduces the output of the transmitted laser beam, and the optical sensor unit 440 recognizes the laser beam that has passed through the light output converter 430.
- the optical sensor unit 440 preferably uses an optical sensor such as an image sensor, a photodiode, and the like, and the optical modification optical unit 420 and the light output converter 430 may be disposed to be interchanged with each other. It is possible.
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Abstract
Description
Claims (8)
- 레이저 스캐닝 장비용 자동 위치 보정 장치에 있어서,가공 대상물의 가공표면이 위치하는 X-Y 평면에 대해 수직인 제1 방향으로 레이저 빔을 송출하는 레이저 빔 소스;상기 제1 방향에 대해 소정 각도를 유지하는 제2 방향의 평면 방향의 소정 각도 범위로 상기 레이저 빔 소스로부터의 레이저 빔을 조사시키는 제1 미러;상기 제1 미러로부터 반사된 상기 레이저 빔을 직사각형 형상의 가공표면에 조사시키는 제2 미러;상기 제1 미러와 상기 제2 미러를 각각 회전시키는 제1 모터 및 제2 모터;상기 가공 대상물에 레이저 빔이 조사되어야 하는 상기 가공표면의 네 개의 독립적인 위치 파라미터 및 네 개의 독립적인 위치 파라미터에 의해 결정된 레이저 빔의 실제 조사 위치에 배치되어 레이저 빔 조사위치를 검출하는 한 개 이상의 위치 측정 모듈; 및상기 위치 파라미터 및 실제 위치의 오프셋 또는 게인 틀어짐을 중 어느 하나 이상을 보정하기 위하여 제1 모터 또는 제2 모터중 어느 하나 이상을 구동하기 위한 신호를 발생시키는 보정부;로 구성되는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제1항에 있어서,한 개 이상의 상기 위치 측정 모듈은 상기 제2 미러와 상기 가공표면 사이에 배치되는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제2항에 있어서,상기 위치 측정 모듈은 광 필터부, 광 변형 광학부, 광 출력 변환부을 통과한 레이저 빔이 광 센서부에 조사되어 상기 제2 미러를 통과한 레이저 빔의 입사가 직접 이루어지는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제3항에 있어서,상기 광 센서부는 이미지 센서 또는 포토 다이오드중 어느 하나인 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제1항에 있어서,상기 오프셋 틀어짐은 한 개의 위치 측정 모듈을 이용하여 연산하는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제1항에 있어서,상기 오프셋 및 게인 틀어짐을 측정할 경우에 두 개 이상의 위치 측정 모듈을 이용하여 평균값을 도출해서 연산하는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제1항에 있어서,상기 게인 틀어짐은 네 개의 독립적인 위치 파라미터중 대각선으로 배치된 상기 위치 측정 모듈에 의해 측정되어 연산되는 상기 레이저 빔 조사 영역의 x축 및 y축의 길이와 상기 레이저 빔 실제 조사 영역의 x축 및 y축 길이의 비율에 의하여 x축 게인과 y축 게인 틀어짐을 연산하는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
- 제1항에 있어서,두 개의 상기 위치 측정 모듈의 검출 및 상기 보정부의 보정신호 발생은 상기 가공 대상물의 가공 허용 오차내를 유지하는 시간간격으로 실시간으로 수행되는 것을 특징으로 하는 레이저 스캐닝 장비용 자동 위치 보정 장치.
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CN113649361A (zh) * | 2021-08-18 | 2021-11-16 | 沈阳工业大学 | 一种基于热通量的激光清洗质量在线检测***及方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0724589A (ja) * | 1993-07-12 | 1995-01-27 | Sanyo Mach Works Ltd | レーザロボットの自動アライメント調整方法及び装置 |
KR19990039804A (ko) * | 1997-11-14 | 1999-06-05 | 윤종용 | 레이저 시각 센서장치 |
KR20080025334A (ko) * | 2006-09-14 | 2008-03-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 레이저 광 조사장치 및 레이저 광 조사방법 |
KR101026356B1 (ko) * | 2010-10-01 | 2011-04-05 | 이석준 | 레이저 스캐닝 장치 |
JP4795886B2 (ja) * | 2006-07-27 | 2011-10-19 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
-
2018
- 2018-04-21 KR KR1020180046421A patent/KR20190122515A/ko not_active Application Discontinuation
- 2018-04-23 WO PCT/KR2018/004662 patent/WO2019203377A1/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0724589A (ja) * | 1993-07-12 | 1995-01-27 | Sanyo Mach Works Ltd | レーザロボットの自動アライメント調整方法及び装置 |
KR19990039804A (ko) * | 1997-11-14 | 1999-06-05 | 윤종용 | 레이저 시각 센서장치 |
JP4795886B2 (ja) * | 2006-07-27 | 2011-10-19 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
KR20080025334A (ko) * | 2006-09-14 | 2008-03-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 레이저 광 조사장치 및 레이저 광 조사방법 |
KR101026356B1 (ko) * | 2010-10-01 | 2011-04-05 | 이석준 | 레이저 스캐닝 장치 |
Cited By (1)
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CN113649361A (zh) * | 2021-08-18 | 2021-11-16 | 沈阳工业大学 | 一种基于热通量的激光清洗质量在线检测***及方法 |
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