WO2019203236A1 - 光ファイバ - Google Patents
光ファイバ Download PDFInfo
- Publication number
- WO2019203236A1 WO2019203236A1 PCT/JP2019/016342 JP2019016342W WO2019203236A1 WO 2019203236 A1 WO2019203236 A1 WO 2019203236A1 JP 2019016342 W JP2019016342 W JP 2019016342W WO 2019203236 A1 WO2019203236 A1 WO 2019203236A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin layer
- meth
- acrylate
- optical fiber
- resin composition
- Prior art date
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 130
- 239000011347 resin Substances 0.000 claims abstract description 129
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 110
- 239000011342 resin composition Substances 0.000 claims abstract description 54
- 239000002245 particle Substances 0.000 claims abstract description 44
- 229910052809 inorganic oxide Inorganic materials 0.000 claims abstract description 41
- 239000000178 monomer Substances 0.000 claims abstract description 34
- 239000003365 glass fiber Substances 0.000 claims abstract description 24
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000011164 primary particle Substances 0.000 claims description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000003999 initiator Substances 0.000 abstract description 13
- 238000005253 cladding Methods 0.000 abstract description 4
- -1 acryloyl compound Chemical class 0.000 description 29
- 239000002612 dispersion medium Substances 0.000 description 18
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000001165 hydrophobic group Chemical group 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 229960002317 succinimide Drugs 0.000 description 3
- PGMMMHFNKZSYEP-UHFFFAOYSA-N 1,20-Eicosanediol Chemical compound OCCCCCCCCCCCCCCCCCCCCO PGMMMHFNKZSYEP-UHFFFAOYSA-N 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- CCOQPGVQAWPUPE-UHFFFAOYSA-N 4-tert-butylcyclohexan-1-ol Chemical compound CC(C)(C)C1CCC(O)CC1 CCOQPGVQAWPUPE-UHFFFAOYSA-N 0.000 description 2
- 229940091886 4-tert-butylcyclohexanol Drugs 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- GJBXIPOYHVMPQJ-UHFFFAOYSA-N hexadecane-1,16-diol Chemical compound OCCCCCCCCCCCCCCCCO GJBXIPOYHVMPQJ-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- BXSPZNVFEYWSLZ-UHFFFAOYSA-N (3-phenoxyphenyl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 BXSPZNVFEYWSLZ-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- RESPXSHDJQUNTN-UHFFFAOYSA-N 1-piperidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCCC1 RESPXSHDJQUNTN-UHFFFAOYSA-N 0.000 description 1
- WLPAQAXAZQUXBG-UHFFFAOYSA-N 1-pyrrolidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCC1 WLPAQAXAZQUXBG-UHFFFAOYSA-N 0.000 description 1
- GGSRTHRSSCWGGK-UHFFFAOYSA-L 2,2-dibutyl-5-hydroxy-1,3,2-dioxastannepane-4,7-dione Chemical compound CCCC[Sn]1(CCCC)OC(=O)CC(O)C(=O)O1 GGSRTHRSSCWGGK-UHFFFAOYSA-L 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- PRIUALOJYOZZOJ-UHFFFAOYSA-L 2-ethylhexyl 2-[dibutyl-[2-(2-ethylhexoxy)-2-oxoethyl]sulfanylstannyl]sulfanylacetate Chemical compound CCCCC(CC)COC(=O)CS[Sn](CCCC)(CCCC)SCC(=O)OCC(CC)CCCC PRIUALOJYOZZOJ-UHFFFAOYSA-L 0.000 description 1
- HHKAGFTWEFVXET-UHFFFAOYSA-N 2-heptyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCCCCCC(CO)(CO)CO HHKAGFTWEFVXET-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RASDUGQQSMMINZ-UHFFFAOYSA-N 2-methyl-1-piperidin-1-ylprop-2-en-1-one Chemical compound CC(=C)C(=O)N1CCCCC1 RASDUGQQSMMINZ-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SEGKJLWPIPSYSC-UHFFFAOYSA-N 3-ethyloctane-1,8-diol Chemical compound OCCC(CC)CCCCCO SEGKJLWPIPSYSC-UHFFFAOYSA-N 0.000 description 1
- XPFCZYUVICHKDS-UHFFFAOYSA-N 3-methylbutane-1,3-diol Chemical compound CC(C)(O)CCO XPFCZYUVICHKDS-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- FOUPWPPOMJVLGH-UHFFFAOYSA-N C(C=C)(=O)O.CC(C(=O)O)(CO)C Chemical compound C(C=C)(=O)O.CC(C(=O)O)(CO)C FOUPWPPOMJVLGH-UHFFFAOYSA-N 0.000 description 1
- UDFGCAKEVMRBJU-UHFFFAOYSA-N CC(C[PH2]=O)CC(C)(C)C Chemical compound CC(C[PH2]=O)CC(C)(C)C UDFGCAKEVMRBJU-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- MBXULDRFQBQSSK-UHFFFAOYSA-N N'-[3-[methoxy-[(2-methylpropan-2-yl)oxy]silyl]propyl]ethane-1,2-diamine Chemical compound NCCNCCC[SiH](OC(C)(C)C)OC MBXULDRFQBQSSK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ZXZSYHLGFSXNNU-UHFFFAOYSA-N [[methyl(4-trimethoxysilylbutyl)carbamothioyl]trisulfanyl] N-methyl-N-(4-trimethoxysilylbutyl)carbamodithioate Chemical compound CO[Si](CCCCN(C(=S)SSSSC(N(C)CCCC[Si](OC)(OC)OC)=S)C)(OC)OC ZXZSYHLGFSXNNU-UHFFFAOYSA-N 0.000 description 1
- YSCDKUPSJMMGGT-UHFFFAOYSA-L [dibutyl-[2-(6-methylheptylsulfanyl)acetyl]oxystannyl] 2-(6-methylheptylsulfanyl)acetate Chemical compound CC(C)CCCCCSCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CSCCCCCC(C)C YSCDKUPSJMMGGT-UHFFFAOYSA-L 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- XVKKIGYVKWTOKG-UHFFFAOYSA-N diphenylphosphoryl(phenyl)methanone Chemical compound C=1C=CC=CC=1P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 XVKKIGYVKWTOKG-UHFFFAOYSA-N 0.000 description 1
- BGAYFWMWLVAVCM-UHFFFAOYSA-N diphenylphosphoryl-(2,4,4-trimethylcyclohexa-1,5-dien-1-yl)methanone Chemical compound C1=CC(C)(C)CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 BGAYFWMWLVAVCM-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229940105570 ornex Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- XLKZJJVNBQCVIX-UHFFFAOYSA-N tetradecane-1,14-diol Chemical compound OCCCCCCCCCCCCCCO XLKZJJVNBQCVIX-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/104—Coating to obtain optical fibres
- C03C25/1065—Multiple coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/24—Coatings containing organic materials
- C03C25/26—Macromolecular compounds or prepolymers
- C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C03C25/285—Acrylic resins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/48—Coating with two or more coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4429—Means specially adapted for strengthening or protecting the cables
- G02B6/443—Protective covering
- G02B6/4432—Protective covering with fibre reinforcements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02395—Glass optical fibre with a protective coating, e.g. two layer polymer coating deposited directly on a silica cladding surface during fibre manufacture
Definitions
- the present disclosure relates to optical fibers.
- This application claims priority based on Japanese Patent Application No. 2018-078261 filed on Apr. 16, 2018, and incorporates all the description content described in the above Japanese application.
- an optical fiber has a coating resin layer for protecting a glass fiber that is an optical transmission body.
- Optical fibers are required to relieve stress between the glass fiber and the coating resin layer and suppress the generation of defects such as voids, especially when used at low temperatures.
- the covering resin layer is composed of, for example, a primary resin layer and a secondary resin layer.
- Patent Document 1 it is studied to prevent the separation between the glass fiber and the primary resin layer at a low temperature by reducing the difference in effective linear expansion coefficient between the primary resin layer and the secondary resin layer.
- patent document 2 using the liquid curable resin composition containing urethane (meth) acrylate and a polymerizable monofunctional monomer, it is hard to produce a residual stress in a cured film, and it is easy to absorb the load from the outside. Formation of layers is being considered.
- An optical fiber includes a glass fiber including a core and a cladding, a primary resin layer that contacts the glass fiber and covers the glass fiber, and a secondary resin layer that covers the primary resin layer, A base resin in which the Young's modulus of the primary resin layer is 0.04 MPa to 1.0 MPa at 23 ° C.
- the secondary resin layer contains a urethane (meth) acrylate oligomer, a monomer, and a photopolymerization initiator; It consists of hardened
- FIG. 1 is a schematic cross-sectional view showing an example of an optical fiber according to the present embodiment.
- an object of the present disclosure is to provide an optical fiber in which the cure shrinkage rate of the secondary resin layer is reduced and generation of voids is sufficiently suppressed.
- An optical fiber according to an aspect of the present disclosure includes a glass fiber including a core and a cladding, a primary resin layer that contacts the glass fiber and covers the glass fiber, and a secondary resin layer that covers the primary resin layer, A base resin in which the Young's modulus of the primary resin layer is 0.04 MPa to 1.0 MPa at 23 ° C.
- the secondary resin layer contains a urethane (meth) acrylate oligomer, a monomer, and a photopolymerization initiator; It consists of hardened
- a secondary resin layer having excellent toughness can be formed by reducing the curing shrinkage rate.
- generation of voids in the optical fiber can be sufficiently suppressed.
- the inorganic oxide particles are a group consisting of silicon dioxide, zirconium dioxide, aluminum oxide, magnesium oxide, titanium oxide, tin oxide, and zinc oxide because of its excellent dispersibility in the resin composition and easy formation of a hard film. It may be at least one selected from more.
- the content of the inorganic oxide particles may be 5% by mass or more and 60% by mass or less based on the total amount of the resin composition.
- the average primary particle size of the inorganic oxide particles may be 500 nm or less.
- the Young's modulus of the secondary resin layer may be 1300 MPa to 2700 MPa at 23 ° C. ⁇ 2 ° C.
- FIG. 1 is a schematic cross-sectional view showing an example of an optical fiber according to the present embodiment.
- the optical fiber 10 includes a glass fiber 13 including a core 11 and a clad 12, and a covering resin layer 16 including a primary resin layer 14 and a secondary resin layer 15 provided on the outer periphery of the glass fiber 13.
- the clad 12 surrounds the core 11.
- the core 11 and the clad 12 mainly include glass such as quartz glass.
- the core 11 can be made of quartz to which germanium is added, and the clad 12 is made of pure quartz or quartz to which fluorine is added. be able to.
- the outer diameter (D2) of the glass fiber 13 is about 125 ⁇ m, and the diameter (D1) of the core 11 constituting the glass fiber 13 is about 7 to 15 ⁇ m.
- the thickness of the coating resin layer 16 is usually about 55 to 70 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 to 50 ⁇ m.
- the thickness of the primary resin layer 14 is 35 ⁇ m and the thickness of the secondary resin layer 15 is 25 ⁇ m. May be.
- the outer diameter of the optical fiber 10 may be about 235 to 265 ⁇ m.
- the thickness of the coating resin layer 16 may be about 27 to 48 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 to 38 ⁇ m.
- the thickness of the primary resin layer 14 is 25 ⁇ m and the thickness of the secondary resin layer 15 is May be 10 ⁇ m.
- the outer diameter of the optical fiber 10 may be about 180 to 220 ⁇ m.
- the secondary resin layer 15 can be formed by curing a resin composition including a base resin containing a urethane (meth) acrylate oligomer, a monomer, and a photopolymerization initiator, and hydrophobic inorganic oxide particles.
- (meth) acrylate means acrylate or methacrylate corresponding thereto.
- (meth) acrylic acid and the like The same applies to (meth) acrylic acid and the like.
- the inorganic oxide particles according to the present embodiment are spherical particles, and the surface thereof is subjected to a hydrophobic treatment.
- the hydrophobic treatment according to the present embodiment means that a hydrophobic group is introduced on the surface of the inorganic oxide particles.
- Inorganic oxide particles into which a hydrophobic group has been introduced are excellent in dispersibility in the resin composition.
- the hydrophobic group may be a reactive group such as a (meth) acryloyl group, or a non-reactive group such as a hydrocarbon group (for example, an alkyl group) or an aryl group (for example, a phenyl group).
- a reactive group such as a (meth) acryloyl group
- a non-reactive group such as a hydrocarbon group (for example, an alkyl group) or an aryl group (for example, a phenyl group).
- the inorganic oxide particles according to this embodiment are dispersed in a dispersion medium.
- the inorganic oxide particles can be uniformly dispersed in the resin composition, and the storage stability of the resin composition can be improved.
- the dispersion medium is not particularly limited as long as it does not inhibit the curing of the resin composition.
- the dispersion medium may be reactive or non-reactive.
- a monomer such as a (meth) acryloyl compound or an epoxy compound
- examples of the (meth) acryloyl compound include 1,6-hexanediol di (meth) acrylate, EO-modified bisphenol A di (meth) acrylate, polyethylene glycol di (meth) acrylate, PO-modified bisphenol A di (meth) acrylate, Examples include polypropylene glycol di (meth) acrylate and polytetramethylene glycol di (meth) acrylate.
- examples of the (meth) acryloyl compound compounds exemplified by monomers described later may be used.
- a ketone solvent such as methyl ethyl ketone (MEK), an alcohol solvent such as propylene glycol monomethyl ether (PGME), or an ester solvent such as propylene glycol monomethyl ether acetate (PGMEA) may be used.
- MEK methyl ethyl ketone
- PGME propylene glycol monomethyl ether
- PMEA propylene glycol monomethyl ether acetate
- the inorganic oxide particles dispersed in the dispersion medium are present in a dispersed state in the resin layer even after the resin layer is cured.
- a reactive dispersion medium used, the inorganic oxide particles are mixed with the dispersion medium together with the resin composition, and are taken into the resin layer while maintaining the dispersion state.
- a non-reactive dispersion medium used, at least part of the dispersion medium is volatilized away from the resin composition, but the inorganic oxide particles remain in the resin composition in a dispersed state, and the cured resin layer Exist in a dispersed state.
- the inorganic oxide particles present in the resin layer are observed in a state where primary particles are dispersed when observed with an electron microscope.
- the inorganic oxide particles include silicon dioxide (silica), zirconium dioxide (zirconia), aluminum oxide (alumina), magnesium oxide (magnesia) because of its excellent dispersibility in the resin composition and easy formation of a hard film.
- Hydrophobic silica particles are used as the inorganic oxide particles according to the present embodiment from the viewpoints of excellent inexpensiveness, easy surface treatment, ultraviolet transparency, and easy provision of appropriate hardness to the resin layer. More preferably, it is used.
- the average primary particle size of the inorganic oxide particles may be 500 nm or less, preferably 200 nm or less, more preferably 100 nm or less, and even more preferably 50 nm or less.
- the average primary particle size of the inorganic oxide particles is preferably 5 nm or more, and more preferably 10 nm or more.
- the average primary particle size can be measured by, for example, image analysis of an electron micrograph, a light scattering method, a BET method, or the like.
- the dispersion medium in which the primary particles of the inorganic oxide are dispersed appears to be transparent when the primary particles have a small particle size. When the primary particles have a relatively large particle size (40 nm or more), the dispersion medium in which the primary particles are dispersed appears cloudy, but no sediment is observed.
- the content of the inorganic oxide particles is 1% by mass to 60% by mass based on the total amount of the resin composition, more preferably 5% by mass to 60% by mass, and further more preferably 8% by mass to 60% by mass. preferable.
- the content of the inorganic oxide particles is 1% by mass or more, curing shrinkage is easily reduced. It becomes easy to form the secondary resin layer which has the outstanding toughness as content of an inorganic oxide particle is 60 mass% or less.
- the resin composition according to the present embodiment contains a urethane (meth) acrylate oligomer.
- a urethane (meth) acrylate oligomer an oligomer obtained by reacting a polyol compound, a polyisocyanate compound and a hydroxyl group-containing (meth) acrylate compound can be used.
- polystyrene resin examples include polytetramethylene glycol, polypropylene glycol, and bisphenol A / ethylene oxide addition diol.
- the number average molecular weight of the polyol compound may be 400 to 1000.
- polyisocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and dicyclohexylmethane 4,4'-diisocyanate.
- Examples of the hydroxyl group-containing (meth) acrylate compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 1,6-hexanediol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, Examples include 2-hydroxypropyl (meth) acrylate and tripropylene glycol mono (meth) acrylate.
- An organotin compound is generally used as a catalyst for synthesizing a urethane (meth) acrylate oligomer.
- the organic tin compound include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin malate, dibutyltin bis (2-ethylhexyl mercaptoacetate), dibutyltin bis (isooctyl mercaptoacetate) and dibutyltin oxide. From the viewpoint of easy availability or catalyst performance, it is preferable to use dibutyltin dilaurate or dibutyltin diacetate as the catalyst.
- a lower alcohol having 5 or less carbon atoms may be used during the synthesis of the urethane (meth) acrylate oligomer.
- the lower alcohol include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, Examples include 2-methyl-1-butanol, 3-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-2-butanol and 2,2-dimethyl-1-propanol.
- a monofunctional monomer having one polymerizable group or a polyfunctional monomer having two or more polymerizable groups can be used. Two or more kinds of monomers may be mixed and used.
- Examples of the monofunctional monomer include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, s-butyl (meth) acrylate, tert-butyl (meth) acrylate, Isobutyl (meth) acrylate, n-pentyl (meth) acrylate, isopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, isoamyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (Meth) acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate,
- isobornyl (meth) acrylate or 4-tert-butylcyclohexanol (meth) acrylate is preferable, and isobornyl (meth) acrylate is more preferable. preferable.
- polyfunctional monomer examples include ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, Di (meth) acrylates of alkylene oxide adducts of bisphenol A, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate hydroxypivalate, 1,4-butanediol di (meth) acrylate, 1,6 -Hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, 1,14-tetradecanediol (Meth) acrylate, 1,16-hexadecaned
- Tripropylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and trimethylolpropane tri (meth) acrylate are used as polyfunctional monomers from the viewpoint of forming a coating film having a desired Young's modulus. May be. Among them, tripropylene glycol di (meth) acrylate is preferable as the polyfunctional monomer.
- the resin composition preferably contains the monomer in an amount of 18% by mass to 50% by mass based on the total amount of the base resin, more preferably 20% by mass to 46% by mass, and more preferably 20% by mass to 40% by mass. % Or less, and more preferably 20% by mass or more and 30% by mass or less.
- the photopolymerization initiator can be appropriately selected from known radical photopolymerization initiators.
- the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 2, 4,4-trimethylpentylphosphine oxide, 2,4,4-trimethylbenzoyldiphenylphosphine oxide, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one (Omnirad 907, IGM) Resins), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO, IGM Resins) and bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (Omnirad 819, IGM) Resins Co., Ltd.) and the like.
- the resin composition may further contain an epoxy (meth) acrylate oligomer.
- an epoxy (meth) acrylate oligomer an oligomer obtained by reacting a compound having a (meth) acryloyl group with an epoxy resin having two or more glycidyl groups can be used.
- the resin composition may further contain a silane coupling agent, a photoacid generator, a leveling agent, an antifoaming agent, an antioxidant, and the like.
- silane coupling agent is not particularly limited as long as it does not hinder the curing of the resin composition.
- silane coupling agents include tetramethyl silicate, tetraethyl silicate, mercaptopropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxy-ethoxy) silane, ⁇ - (3,4-epoxycyclohexyl).
- -Ethyltrimethoxysilane dimethoxydimethylsilane, diethoxydimethylsilane, 3-acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -methacryloxypropyl Trimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethyldimethoxysilane, N-phenyl- ⁇ - Minopropyltrimethoxysilane, ⁇ -chloropropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltrimethoxysilane, bis- [3- (triethoxysilyl) propy
- an onium salt having a structure of A + B ⁇ may be used.
- the photoacid generator include sulfonium salts such as UVACURE 1590 (manufactured by Daicel Cytec), CPI-100P, 110P (manufactured by Sun Apro), 210S (manufactured by San Apro), Omnicat 250 (manufactured by IGM Resins), WPI-113 ( And iodonium salts such as Rp-2074 (manufactured by Rhodia Japan).
- the Young's modulus of the secondary resin layer 15 is preferably 1300 MPa or more at 23 ° C. ⁇ 2 ° C., more preferably 1300 MPa or more and 2700 MPa or less, and further preferably 1300 MPa or more and 2500 MPa or less.
- the Young's modulus of the secondary resin layer is 1300 MPa or more, the side pressure characteristics of the optical fiber are easily improved, and when it is 2700 MPa or less, the secondary resin layer can be imparted with appropriate toughness, so that the secondary resin layer is cracked. It becomes difficult.
- the glass transition temperature (Tg) of the secondary resin layer may be 60 ° C. or higher and 120 ° C. or lower, preferably 65 ° C. or higher and 115 ° C. or lower, more preferably 70 ° C. or higher and 110 ° C. or lower, and 75 More preferably, the temperature is from 100 ° C to 100 ° C.
- the cure shrinkage when forming the secondary resin layer is preferably 2.0 to 8.0%, more preferably 2.0 to 7.5%, and 2.5 to 7.0%. More preferably.
- the difference between the secondary curing shrinkage and the primary curing shrinkage is preferably within 3%.
- the method for measuring the curing shrinkage rate is not particularly limited, and for example, it can be measured by the following method. First, a Teflon (registered trademark) ring (inside diameter 1 cm) is placed on a glass plate, 1 mL of the resin composition is put therein, and ultraviolet rays of 4000 mJ / cm 2 are irradiated to cure the resin composition. Next, the curing shrinkage is determined from the height of the resin surface before and after curing.
- the Young's modulus of the primary resin layer 14 is 0.04 MPa to 1.0 MPa at 23 ° C. ⁇ 2 ° C., 0.05 MPa to 0.9 MPa, or 0 It may be from 0.05 MPa to 0.8 MPa.
- the primary resin layer 14 can be formed by curing a resin composition containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator, and a silane coupling agent. That is, the primary resin layer 14 can include a cured product of a resin composition containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator, and a silane coupling agent.
- the content of the urethane (meth) acrylate oligomer in the resin composition is preferably 35% by mass or more and 90% by mass or less, and 50% by mass or more and 85% by mass or less based on the total amount of the resin composition. Is more preferable, and 60% by mass or more and 80% by mass or less is more preferable.
- urethane (meth) acrylate oligomer an oligomer obtained by reacting a polyol compound, a polyisocyanate compound, a hydroxyl group-containing (meth) acrylate compound and an alcohol may be used.
- the Young's modulus of the primary resin layer 14 may be adjusted to a target range depending on the blending ratio of the hydroxyl group-containing (meth) acrylate compound and alcohol used when the urethane (meth) acrylate oligomer is synthesized.
- the blending ratio of the alcohol increases, the number of oligomers having (meth) acryloyl groups that are reactive groups at both ends decreases, so that the Young's modulus can be easily reduced.
- the number average molecular weight of the polyol compound is preferably 1000 to 8000, more preferably 1200 to 6500, still more preferably 1500 to 6000.
- the urethane (meth) acrylate oligomer, monomer, photopolymerization initiator and silane coupling agent may be appropriately selected from the compounds exemplified for the base resin.
- the resin composition forming the primary resin layer has a composition different from that of the base resin forming the secondary resin layer.
- Resin composition for secondary resin layer (Oligomer)
- a urethane acrylate oligomer (UA) obtained by reacting a polypropylene glycol having a molecular weight of 600, 2,4-tolylene diisocyanate and hydroxyethyl acrylate, and an epoxy acrylate oligomer (EA) were prepared.
- Photopolymerization initiator As a photopolymerization initiator, 1-hydroxycyclohexyl phenyl ketone and 2,4,6-trimethylbenzoyldiphenylphosphine oxide were prepared.
- inorganic oxide particles As inorganic oxide particles, hydrophobic silica particles dispersed in MEK, having methacryloyl groups, and having an average primary particle size of 10 to 15 nm were prepared.
- the base resin was prepared by mixing the oligomer, monomer and photopolymerization initiator. Next, after mixing the base resin and the silica particles, most of MEK as a dispersion medium was removed under reduced pressure to prepare a resin composition for the secondary resin layer, respectively. Note that. The content of MEK remaining in the resin composition was 5% by mass or less.
- the numerical value of the monomer is the content based on the total amount of the base resin
- the numerical value of the oligomer is the content based on the total amount of the monomer, oligomer and silica particles
- the numerical value of a silica particle is content based on the total amount of a resin composition.
- Resin composition for primary resin layer (Oligomer)
- Urethane acrylate oligomers a1, a2 and a3 obtained by reacting polypropylene glycol having a molecular weight of 4000, isophorone diisocyanate, hydroxyethyl acrylate and methanol were prepared.
- urethane acrylate oligomers a1, a2 and a3 the ratio of the oligomer having an acryloyl group at both ends and the oligomer having an acryloyl group at one end is adjusted by changing the blending ratio of hydroxyethyl acrylate and methanol. .
- (Resin composition) 75 parts by mass of urethane acrylate oligomer a1, a2 or a3, 12 parts by mass of nonylphenoxypolyethylene glycol acrylate, 6 parts by mass of N-vinylcaprolactam, 2 parts by mass of 1,6-hexanediol diacrylate, 2,4,6-trimethyl
- a resin composition for the primary resin layer was prepared by mixing 1 part by mass of benzoyldiphenylphosphine oxide and 1 part by mass of 3-mercaptopropyltrimethoxysilane.
- a primary resin layer having a thickness of 35 ⁇ m is formed on the outer periphery of a glass fiber having a diameter of 125 ⁇ m composed of a core and a clad using a resin composition for a primary resin layer, and a resin composition for a secondary resin layer is further formed on the outer periphery.
- the secondary resin layer was formed using the optical fibers of Examples and Comparative Examples. The linear velocity was 1500 m / min.
- the Young's modulus of the primary resin layer was measured by the Pullout Modulus (POM) method at 23 ° C. Two locations of the optical fiber are fixed with two chuck devices, the coating resin layer (primary resin layer and secondary resin layer) portion between the two chuck devices is removed, and then one chuck device is fixed and the other The chuck device was gently moved in the opposite direction of the fixed chuck device.
- POM Pullout Modulus
- the length of the portion of the optical fiber sandwiched between the chuck devices to be moved is L
- the amount of movement of the chuck is Z
- the outer diameter of the primary resin layer is Dp
- the outer diameter of the glass fiber is Df
- the Poisson's ratio of the primary resin layer is n
- the Young's modulus of the secondary resin layer is tensile under an environment of 23 ⁇ 2 ° C. and 50 ⁇ 10% RH using a pipe-shaped coating resin layer (length: 50 mm or more) obtained by extracting the glass fiber from the optical fiber. The test (distance between marked lines: 25 mm) was performed, and the value was obtained from the 2.5% secant value.
- the glass transition temperature of the secondary resin layer is measured by using a pipe-shaped coating resin layer obtained by pulling out the glass fiber from the optical fiber, using “RSA 3” of TA Instruments, and using the tension mode (between the marked lines).
- the dynamic viscoelasticity of the coated resin layer was measured under the conditions of a distance of 10 mm), a frequency of 11 Hz, a heating rate of 5 ° C./min, and a temperature range of 30 to 150 ° C.
- the measured peak top temperature of tan ⁇ was defined as the glass transition temperature (Tg) of the secondary resin layer.
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Abstract
Description
本出願は、2018年4月16日出願の日本出願第2018-078261号に基づく優先権を主張し、前記日本出願に記載された全ての記載内容を援用するものである。
光ファイバにおけるボイドの発生要因の一つとして、プライマリ樹脂層を形成する樹脂組成物と、セカンダリ樹脂層を形成する樹脂組成物との硬化収縮率の差が大きいことが考えられる。そこで、本開示では、セカンダリ樹脂層の硬化収縮率を低減し、ボイドの発生を十分に抑制した光ファイバを提供することを目的とする。
本開示によれば、セカンダリ樹脂層の硬化収縮率を低減して、ボイドの発生を十分に抑制した光ファイバを提供することができる。
最初に、本開示の実施形態の内容を列記して説明する。本開示の一態様に係る光ファイバは、コア及びクラッドを含むガラスファイバと、ガラスファイバに接して該ガラスファイバを被覆するプライマリ樹脂層と、プライマリ樹脂層を被覆するセカンダリ樹脂層と、を備え、プライマリ樹脂層のヤング率が、23℃±2℃で0.04MPa以上1.0MPa以下であり、セカンダリ樹脂層が、ウレタン(メタ)アクリレートオリゴマー、モノマー及び光重合開始剤を含有するベース樹脂と、疎水性の無機酸化物粒子とを含む樹脂組成物の硬化物からなり、無機酸化物粒子の含有量が、樹脂組成物の総量を基準として1質量%以上60質量%以下である。
本開示の実施形態に係る樹脂組成物及び光ファイバの具体例を、必要により図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されず、請求の範囲によって示され、請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。以下の説明では、図面の説明において同一の要素には同一の符号を付し、重複する説明を省略する。
図1は、本実施形態に係る光ファイバの一例を示す概略断面図である。光ファイバ10は、コア11及びクラッド12を含むガラスファイバ13と、ガラスファイバ13の外周に設けられたプライマリ樹脂層14及びセカンダリ樹脂層15を含む被覆樹脂層16とを備えている。
なお、被覆樹脂層16の厚さは、27~48μm程度であってもよい。その場合は、プライマリ樹脂層14及びセカンダリ樹脂層15の各層の厚さは、10~38μm程度であってもよく、例えば、プライマリ樹脂層14の厚さが25μmで、セカンダリ樹脂層15の厚さが10μmであってもよい。光ファイバ10の外径は、180~220μm程度であってもよい。
セカンダリ樹脂層15は、ウレタン(メタ)アクリレートオリゴマー、モノマー及び光重合開始剤を含有するベース樹脂と、疎水性の無機酸化物粒子とを含む樹脂組成物を硬化させて形成することができる。
本実施形態に係る無機酸化物粒子は、球状の粒子であり、その表面が疎水処理されている。本実施形態に係る疎水処理とは、無機酸化物粒子の表面に疎水性の基が導入されていることをいう。疎水性の基が導入された無機酸化物粒子は、樹脂組成物中の分散性に優れている。疎水性の基は、(メタ)アクリロイル基等の反応性基、又は、炭化水素基(例えば、アルキル基)、アリール基(例えば、フェニル基)等の非反応性基であってもよい。無機酸化物粒子が反応性基を有する場合、ヤング率が高い樹脂層を形成し易くなる。
本実施形態に係る樹脂組成物は、ウレタン(メタ)アクリレートオリゴマーを含有する。ウレタン(メタ)アクリレートオリゴマーとしては、ポリオール化合物、ポリイソシアネート化合物及び水酸基含有(メタ)アクリレート化合物を反応させて得られるオリゴマーを用いることができる。
硬化収縮率=(T0-TD)/T0×100
光ファイバにボイドが発生することを抑制することから、プライマリ樹脂層14のヤング率は、23℃±2℃で0.04MPa以上1.0MPa以下であり、0.05MPa以上0.9MPa以下又は0.05MPa以上0.8MPa以下であってもよい。
(オリゴマー)
オリゴマーとして、分子量600のポリプロピレングリコール、2,4-トリレンジイソシアネート及びヒドロキシエチルアクリレートを反応させることにより得られたウレタンアクリレートオリゴマー(UA)、並びにエポキシアクリレートオリゴマー(EA)を準備した。
モノマーとして、イソボルニルアクリレート(大阪有機化学工業株式会社の商品名「IBXA」)、トリプロピレングリコールジアクリレート(ダイセル・オルネクス株式会社の商品名「TPGDA」)及び2-フェノキシエチルアクリレート(共栄化学株式会社の商品名「ライトアクリレートPO-A」)を準備した。
光重合開始剤として、1-ヒドロキシシクロヘキシルフェニルケトン及び2,4,6-トリメチルベンゾイルジフェニルホスフィンオキシドを準備した。
無機酸化物粒子として、MEKに分散され、メタクリロイル基を有し、平均一次粒径が10~15nmである疎水性シリカ粒子を準備した。
まず、上記オリゴマー、モノマー及び光重合開始剤を混合して、ベース樹脂を調製した。次いで、ベース樹脂とシリカ粒子とを混合した後、分散媒であるMEKの大部分を減圧除去して、セカンダリ樹脂層用の樹脂組成物をそれぞれ作製した。なお。樹脂組成物中に残存しているMEKの含有量は、5質量%以下であった。
ガラス板の上にテフロンリング(内径:1cm)を置き、その中に樹脂組成物を1mL入れて、4000mJ/cm2の紫外線を照射して硬化させた。硬化前後の樹脂表面の高さから、硬化収縮率を求めた。
(オリゴマー)
分子量4000のポリプロピレングリコール、イソホロンジイソシアネート、ヒドロキシエチルアクリレート及びメタノールを反応させて得られるウレタンアクリレートオリゴマーa1、a2及びa3を準備した。ウレタンアクリレートオリゴマーa1、a2及びa3では、ヒドロキシエチルアクリレート及びメタノールの配合割合を変更することで、アクリロイル基を両末端に有するオリゴマーと、アクリロイル基を片末端に有するオリゴマーとの割合を調整している。
ウレタンアクリレートオリゴマーa1、a2又はa3を75質量部用い、ノニルフェノキシポリエチレングリコールアクリレート12質量部、N-ビニルカプロラクタム6質量部、1,6-ヘキサンジオールジアクリレート2質量部、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキシド1質量部、及び3-メルカプトプロピルトリメトキシシラン1質量部を混合して、プライマリ樹脂層用の樹脂組成物をそれぞれ作製した。
コア及びクラッドから構成される直径125μmのガラスファイバの外周に、プライマリ樹脂層用の樹脂組成物を用いて厚さ35μmのプライマリ樹脂層を形成し、更にその外周にセカンダリ樹脂層用の樹脂組成物を用いてセカンダリ樹脂層を形成して、実施例及び比較例の光ファイバを作製した。線速は1500m/分とした。
プライマリ樹脂層のヤング率は、23℃でのPullout Modulus(POM)法により測定した。光ファイバの2箇所を2つのチャック装置で固定し、2つのチャック装置の間の被覆樹脂層(プライマリ樹脂層及びセカンダリ樹脂層)部分を除去し、次いで、一方のチャック装置を固定し、他方のチャック装置を固定したチャック装置の反対方向に緩やかに移動させた。光ファイバにおける移動させるチャック装置に挟まれている部分の長さをL、チャックの移動量をZ、プライマリ樹脂層の外径をDp、ガラスファイバの外径をDf、プライマリ樹脂層のポアソン比をn、チャック装置の移動時の荷重をWとした場合、下記式からプライマリ樹脂層のヤング率を求めた。
ヤング率(MPa)=((1+n)W/πLZ)×ln(Dp/Df)
セカンダリ樹脂層のヤング率は、光ファイバからガラスファイバを抜き取って得られるパイプ状の被覆樹脂層(長さ:50mm以上)を用いて、23±2℃、50±10%RHの環境下で引張試験(標線間距離:25mm)を行い、2.5%割線値から求めた。
セカンダリ樹脂層のガラス転移温度の測定は、光ファイバからガラスファイバを抜き取って得られるパイプ状の被覆樹脂層を用い、TAインスツルメント社の「RSA 3」を用いて、引張りモード(標線間距離:10mm)、周波数11Hz、昇温速度5℃/分、温度範囲30~150℃の条件で、被覆樹脂層の動的粘弾性を測定した。測定されたtanδのピークトップ温度をセカンダリ樹脂層のガラス転移温度(Tg)とした。
10mの光ファイバを85℃で湿度85%の条件下で120日間保管した後、-40℃に16時間置いて、直径10μm以上のボイドの有無を顕微鏡で観察した。光ファイバ1m当たりのボイドの数が1個未満の場合を「A」、ボイドの数が1~2個の場合を「B」、ボイドの数が2個を超える場合を「C」と評価した。結果を表1~3に示す。
Claims (7)
- コア及びクラッドを含むガラスファイバと、前記ガラスファイバに接して該ガラスファイバを被覆するプライマリ樹脂層と、前記プライマリ樹脂層を被覆するセカンダリ樹脂層と、を備える光ファイバであって、
前記プライマリ樹脂層のヤング率が、23℃±2℃で0.04MPa以上1.0MPa以下であり、
前記セカンダリ樹脂層が、ウレタン(メタ)アクリレートオリゴマー、モノマー及び光重合開始剤を含有するベース樹脂と、疎水性の無機酸化物粒子とを含む樹脂組成物の硬化物からなり、前記無機酸化物粒子の含有量が、前記樹脂組成物の総量を基準として1質量%以上60質量%以下である、光ファイバ。 - 前記無機酸化物粒子が、二酸化ケイ素、二酸化ジルコニウム、酸化アルミニウム、酸化マグネシウム、酸化チタン、酸化スズ及び酸化亜鉛からなる群より選ばれる少なくとも1種である、請求項1に記載の光ファイバ。
- 前記無機酸化物粒子の含有量が、前記樹脂組成物の総量を基準として5質量%以上60質量%以下である、請求項1又は請求項2に記載の光ファイバ。
- 前記無機酸化物粒子の平均一次粒径が、500nm以下である、請求項1から請求項3のいずれか一項に記載の光ファイバ。
- 前記セカンダリ樹脂層のヤング率が、23℃±2℃で1300MPa以上2700MPa以下である、請求項1から請求項4のいずれか一項に記載の光ファイバ。
- 前記セカンダリ樹脂層のガラス転移温度が、60℃以上120℃以下である、請求項1から請求項5のいずれか一項に記載の光ファイバ。
- 前記樹脂組成物が、前記モノマーを前記ベース樹脂の総量を基準として、18質量%以上50質量%以下含有する、請求項1から請求項6のいずれか一項に記載の光ファイバ。
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