WO2019202741A1 - Matériau d'étanchéité, composant électronique, carte de circuit électronique et procédé de fabrication de matériau d'étanchéité - Google Patents

Matériau d'étanchéité, composant électronique, carte de circuit électronique et procédé de fabrication de matériau d'étanchéité Download PDF

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Publication number
WO2019202741A1
WO2019202741A1 PCT/JP2018/016360 JP2018016360W WO2019202741A1 WO 2019202741 A1 WO2019202741 A1 WO 2019202741A1 JP 2018016360 W JP2018016360 W JP 2018016360W WO 2019202741 A1 WO2019202741 A1 WO 2019202741A1
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WIPO (PCT)
Prior art keywords
sealing material
metal particles
resin composition
compound
resin
Prior art date
Application number
PCT/JP2018/016360
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English (en)
Japanese (ja)
Inventor
竹内　一雅
稲垣　孝
里奈 伊豆
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日立化成株式会社
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Priority to PCT/JP2018/016360 priority Critical patent/WO2019202741A1/fr
Priority to JP2020514895A priority patent/JP7070672B2/ja
Publication of WO2019202741A1 publication Critical patent/WO2019202741A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a sealing material, an electronic component, an electronic circuit board, and a method for manufacturing the sealing material.
  • Electronic devices are equipped with electromagnetic shields that shield electromagnetic waves generated inside and outside the electronic devices.
  • the electromagnetic shield prevents problems such as noise, electromagnetic interference, malfunction, and leakage or disappearance of electromagnetic information. Since the electromagnetic shielding property is caused by electric conductivity, the conventional electromagnetic shielding includes a metal foil having electric conductivity and an adhesive layer overlapping the metal foil.
  • An electromagnetic shield including a shield layer made of a mixture of iron powder and an organic binder instead of metal foil is also known. (See Patent Document 1 below.)
  • a sealing material is a mixture of a resin composition such as an epoxy resin and a filler such as a silica filler, and has insulating properties resulting from the resin composition.
  • the insulating property of the sealing material may be required in order to suppress an electrical short circuit in the electronic device.
  • the electrical conductivity of the electromagnetic shield and the insulating property of the sealing material are mutually incompatible physical properties. Therefore, when both shielding of the electromagnetic wave and protection of the element by the sealing material are required, a complicated process for covering the element with both the electromagnetic shielding and the sealing material is required, and the manufacturing cost of the electronic device is increased. To do. Further, the metal foil or shield layer provided in the electromagnetic shield is easily damaged by processing such as molding.
  • the present invention has been made in view of the above circumstances, and includes a sealing material having electromagnetic shielding properties and insulating properties, an electronic component including the sealing material, an electronic circuit board including the sealing material, and manufacturing of the sealing material. It aims to provide a method.
  • the sealing material which concerns on 1 side of this invention is a sealing material provided with a some metal particle and resin composition, Comprising: Resistance per unit length in at least one part of the surface of a sealing material is 0.00. 1 k ⁇ / mm or more and 20 k ⁇ / mm or less, and the resistance per unit length in the sealing material is 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less.
  • the metal particles may be covered with a metal phosphate derived from the metal particles.
  • the metal particles may contain iron.
  • the resin composition may contain a thermosetting resin.
  • the resin composition may be a cured product.
  • the content of the metal particles in the sealing material may be 90% by mass or more and less than 100% by mass.
  • the metal particles may protrude from the resin composition on the surface of the sealing material.
  • the metal particles and the resin composition may be exposed on the surface of the sealing material.
  • the electronic component which concerns on 1 side of this invention is equipped with said sealing material and the element covered with the sealing material.
  • An electronic circuit board includes a substrate, an element installed on the surface of the substrate, and a sealing material that covers the element, and the sealing material is the above-described sealing material.
  • the method for manufacturing a sealing material includes a first heating step for curing a resin composition by heating a compound including a plurality of metal particles and a resin composition, and a first heating step.
  • the second heating for adjusting the resistance per unit length to 0.1 k ⁇ / mm to 20 k ⁇ / mm by reducing the resistance per unit length on at least a part of the surface of the compound by further heating the passed compound A process.
  • the compound may be heated at 140 ° C. or higher and 180 ° C. or lower.
  • the metal particles may be covered with a metal phosphate derived from the metal particles.
  • the metal particles may contain iron.
  • the resin composition may contain a thermosetting resin.
  • the content of metal particles in the compound may be 90% by mass or more and less than 100% by mass.
  • a sealing material having electromagnetic shielding properties and insulation, an electronic component including the sealing material, an electronic circuit board including the sealing material, and a method for manufacturing the sealing material.
  • FIG. 1 is a schematic perspective view of a sealing material according to an embodiment of the present invention
  • FIG. 2 is an enlarged view of a part (region II) of the cross section of the sealing material shown in FIG. (A) in FIG. 3 is a schematic cross-sectional view of an electronic component according to an embodiment of the present invention
  • FIG. 3 is an electronic component according to another embodiment of the present invention. It is typical sectional drawing.
  • FIG. 4 is a schematic cross-sectional view of an electronic circuit board according to an embodiment of the present invention.
  • X, Y, and Z shown in each figure mean three coordinate axes orthogonal to each other.
  • the directions indicated by the XYZ coordinate axes in each figure are common to each figure.
  • the sealing material 2 includes a plurality (a large number) of metal particles 4 and a resin composition 6.
  • the resin composition 6 may exist between the plurality of metal particles 4, and the plurality of metal particles 4 may be bound to each other via the resin composition 6.
  • the plurality of metal particles 4 may be dispersed in the resin composition 6.
  • the plurality of metal particles 4 may be referred to as “metal powder”.
  • the sealing material 2 shown in FIG. 1A is a rectangular parallelepiped, but the shape of the sealing material 2 is not limited to a rectangular parallelepiped.
  • the shape and dimensions of the sealing material 2 may be appropriately changed according to the shape of the object to be sealed (elements described later) or the use of the sealing material 2.
  • the resistance per unit length L-s in a part or the whole of the surface 2s of the sealing material 2 is 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less.
  • the resistance per unit length in a part or the whole of the outer surface (2s) of the sealing material 2 may be 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less.
  • the resistance per unit length in a part or the whole of the exposed surface (2s) of the sealing material 2 may be 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less.
  • the resistance per unit length Ls in a part or the whole of the surface 2s of the sealing material 2 may be expressed as “Rs”.
  • the surface 2s of the sealing material 2 (part or the whole of the surface 2s) can have excellent electromagnetic shielding properties.
  • the content of the metal particles in the encapsulant 2 increases, the content of the resin composition in the encapsulant 2 decreases, Rs decreases, and the electromagnetic shielding property improves.
  • Rs is less than the lower limit
  • the content of the resin composition in the sealing material 2 is too small, and it is difficult for the inside of the sealing material 2 to have sufficient insulation.
  • Rs is less than the above lower limit value
  • the content of the resin composition in the sealing material 2 is too small, and the plurality of metal particles 4 are hardly bonded via the resin composition 6, and the sealing is performed.
  • the durability (for example, light resistance, heat resistance, moisture resistance, dust resistance and mechanical strength) of the material 2 is impaired.
  • Rs is 8 k ⁇ / mm. It may be 20 k ⁇ / mm or less, or 10 k ⁇ / mm or more and 12 k ⁇ / mm or less.
  • R-s may be measured by the following two-terminal measurement method. Two terminals are brought into contact with two arbitrary points on the surface 2 s of the sealing material 2. A voltage is applied between the two terminals, and the resistance R between any two points is measured with a tester. Rs is calculated by dividing R by the distance L between the two points. That is, R ⁇ s is equal to R / L.
  • the unit length L-s is 1 mm, but the distance L between the two points at which the resistance R is measured may be longer than 1 mm or shorter than 1 mm. The distance L between the two points at which the resistance R is measured may be equal to the unit length Ls (ie 1 mm).
  • the voltage applied between arbitrary two points may be several V or more and 10 V or less, for example.
  • the average value of Rs measured at a plurality of locations on the surface 2s of the sealing material 2 may be 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less.
  • the number of samples used for calculating the average value of Rs may be, for example, 2 or more and 50 or less.
  • Rs may be measured at room temperature.
  • the room temperature may be, for example, 1 ° C. or higher and 30 ° C. or lower, or 15 ° C. or higher and 25 ° C. or lower.
  • the resistance per unit length Li in the inside 2i of the sealing material 2 is 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less.
  • the resistance per unit length Li in a part or the whole of the cross section of the sealing material 2 in the direction perpendicular to the surface 2s of the sealing material 2 is 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less. is there.
  • the inside 2 i of the sealing material 2 is a portion surrounded by the surface 2 s (outer surface) of the sealing material 2.
  • the resistance per unit length Li in the inside 2i of the sealing material 2 may be expressed as “Ri”.
  • the inside 2 i of the sealing material 2 can have excellent insulating properties.
  • the content of the resin composition in the sealing material 2 increases, the content of the metal particles in the sealing material 2 decreases, Ri increases, and the insulation of the inside 2i of the sealing material 2 improves. To do.
  • the metal particles 4 tend to be firmly bonded to each other, and the durability of the encapsulant 2 (for example, light resistance, heat resistance, moisture resistance, dust resistance). And mechanical strength).
  • Ri is 0.3 G ⁇ / mm or more from the viewpoint of easily improving the insulation of the inside 2i of the sealing material 2, the durability of the whole sealing material 2, and the electromagnetic shielding properties of the surface 2s of the sealing material 2. It may be 0.8 G ⁇ / mm or less, 0.2 G ⁇ / mm or more and 5 T ⁇ / mm or less, or 0.2 T ⁇ / mm or more and 10 T ⁇ / mm or less.
  • Ri may be measured by the following two-terminal measurement method.
  • the sealing material 2 In a direction perpendicular to the surface 2 s of the sealing material 2, the sealing material 2 is cut to expose the inside of the sealing material 2 to the cross section.
  • Two terminals are brought into contact with two arbitrary points on the cross section of the sealing material 2.
  • a voltage is applied between the two terminals, and the resistance R 'between any two points is measured with an insulation resistance meter.
  • R ⁇ i is calculated. That is, R ⁇ i is equal to R ′ / L ′.
  • the unit length Li is 1 mm, but the distance L ′ between the two points at which the resistance R ′ is measured may be longer than 1 mm or shorter than 1 mm.
  • the distance L ′ between the two points at which the resistance R ′ is measured may be equal to the unit length Li (ie 1 mm).
  • the voltage applied between two arbitrary points may be 1 V or more and 100 V or less, for example.
  • the average value of Ri measured at a plurality of locations in the inside 2i (cross section) of the sealing material 2 may be 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less.
  • the number of samples used for calculating the average value of Ri (the number of Ri measurement points) may be, for example, 2 or more and 50 or less. Ri may be measured at room temperature.
  • metal particles 4 may be covered with a metal phosphate derived from the metal particles 4. That is, some or all of the metal particles 4 may be covered with the phosphate coating. Part or the whole of the surface of each metal particle 4 may be covered with a metal phosphate derived from the metal particle 4. That is, a part or the whole of the surface of each metal particle 4 may be covered with the phosphate coating.
  • the “metal phosphate” may be a metal salt of inorganic phosphoric acid (H 3 PO 4 ).
  • the metal particles 4 include iron
  • the metal particles 4 may be covered with one or both of iron (II) phosphate and iron (III) phosphate.
  • the metal particles 4 when the metal particles 4 contain iron, the metal particles 4 may be covered with one or both of Fe 3 (PO 4 ) 2 and FePO 4 . Since the phosphate has insulating properties, the metal particles 4 are covered with the phosphate, so that the phosphate is likely to intervene between the two metal particles 4 in contact with each other, and electrical conduction between the metal particles 4 is suppressed. It is easy to be done. As a result, the insulating property of the inside 2i of the sealing material 2 is easily improved. Moreover, the corrosion resistance of the metal particle 4 improves because the metal particle 4 is covered with the phosphate.
  • the phosphate covering the metal particles 4 may be formed by a phosphate treatment (chemical conversion treatment) of the metal particles 4.
  • the metal particles 4 that have undergone pretreatment such as degreasing, water washing, and rust removal may be immersed in an aqueous solution (treatment solution) of phosphate.
  • treatment solution aqueous solution
  • the phosphate contained in the treatment liquid may be at least one selected from the group consisting of zinc phosphate, iron phosphate, manganese phosphate, and calcium phosphate.
  • a phosphate containing at least one selected from the group consisting of zinc, manganese, iron and calcium derived from the treatment liquid may cover the surface of the metal particles 4.
  • the metal particles 4 may protrude from the resin composition 6 on the surface 2 s of the sealing material 2. On the surface 2s of the sealing material 2, the metal particles 4 and the resin composition 6 may be exposed. On the surface 2s of the sealing material 2, the metal particles 4 and the resin composition 6 may be mixed.
  • the surface of the sealing material 2 according to the present embodiment does not have to have a metal foil that a conventional electromagnetic shield has. Even if the metal foil is not present on the surface of the encapsulant 2, the surface 2s itself of the encapsulant 2 has an electromagnetic shielding property, so that the encapsulant 2 is only insulative and durable. It can have electromagnetic shielding properties.
  • the plurality of metal particles 4 may be in direct contact with each other on the surface 2 s of the sealing material 2. On the surface 2s of the sealing material 2, a part of the surface of each metal particle 4 may be in direct contact without interposing the resin composition 6 and the phosphate. On the other hand, in the interior 2 i of the sealing material 2, the resin composition 6 may be interposed between the plurality of metal particles 4. Since the plurality of metal particles 4 are in direct contact with each other on the surface 2s of the sealing material 2, the resistance Rs of the surface 2s of the sealing material 2 is lower than the resistance Ri of the inside 2i of the sealing material 2, The surface 2s of the sealing material 2 can have high electrical conductivity and electromagnetic shielding properties.
  • the shape and structure of the surface 2s of the sealing material 2 described above may be observed and specified by, for example, a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • the metal particles 4 that reflect electrons appear to be bright, while the resin composition 6 appears to be dark.
  • the causal relationship between the shape and structure of the surface 2s of the sealing material 2 described above and the electrical conductivity and electromagnetic shielding properties of the surface 2s of the sealing material 2 is a hypothesis.
  • the surface 2s of the sealing material 2 having the shape and structure described above is a two-dimensional surface (for example, a plane, a curved surface, or an uneven surface), and the surface 2s of the sealing material 2 is the inside of the sealing material 2.
  • the surface layer covering 2i is not always clearly distinguished from the inside 2i of the sealing material 2. In other words, an interface that clearly defines a surface layer having high electrical conductivity and electromagnetic shielding properties and the inside 2i of the sealing material 2 does not necessarily exist.
  • the resin composition may contain a thermosetting resin.
  • the resin composition may be a cured product.
  • the resin composition may contain an epoxy resin as a thermosetting resin.
  • the resin composition may include an epoxy resin and a phenol resin.
  • the sealing material 2 containing an epoxy resin as a resin composition is excellent in the electromagnetic shielding properties of the surface 2s, the insulating properties of the inside 2i, and the durability of the entire sealing material 2. Details of the resin composition will be described later.
  • the content of the metal particles 4 in the sealing material 2 may be 90% by mass or more and less than 100% by mass, or 97% by mass or more and 99.8% by mass or less with respect to the total mass of the sealing material 2.
  • the resistance Rs of the surface 2s of the sealing material 2 tends to increase.
  • Rs is 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less
  • Ri is 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less. Stop material 2 is easy to be obtained.
  • the content of the resin composition 6 in the sealing material 2 is greater than 0% by mass and 10% by mass or less, or 0.2% by mass to 3% by mass with respect to the total mass of the sealing material 2. Good. As the content of the resin composition 6 increases, the resistance Ri of the inside 2i of the sealing material 2 tends to increase. When the content of the resin composition 6 is within the above range, Rs is 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less, and Ri is 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less. The sealing material 2 is easy to be obtained.
  • the sealing material 2 may further include a filler (filler) in addition to the plurality of metal particles 4 and the resin composition 6.
  • the metal particles 4 and the filler may be dispersed in the resin composition 6.
  • the filler may be, for example, a plurality (large number) of silica particles.
  • the electronic components 10 a and 10 b include the sealing material 2 and an element (device) 3 covered with the sealing material 2. And comprising.
  • the element 3 is not particularly limited, but may be at least one selected from the group consisting of a semiconductor chip, a MEMS (micro electro mechanical system), and a coil, for example.
  • the semiconductor chip is not particularly limited, but may be at least one selected from the group consisting of IC, LSI, system LSI, SRAM, DRAM, and flash memory.
  • the resistance per unit length of the inner surface of the sealing material 2 (the surface in contact with the element 3 in the sealing material 2) is the resistance Ri per unit length Li of the interior 2i of the sealing material 2. May be equal.
  • the electronic component 10 a may include the above-described sealing material 2 and the element 5 embedded in the sealing material 2.
  • the electronic component 10 a may include the element 5 and the sealing material 2 that covers the entire element 5.
  • the element 5 may be a coil
  • the electronic component 10a may be an inductor, a filter (for example, an EMI filter), or a transformer.
  • the electronic component 10 b may include the element 3 and the sealing material 2 that partially covers the element 3.
  • the electronic component 10b is a semiconductor package including an interposer 9 (lead frame), a semiconductor chip 7 installed on the interposer 9, and a sealing material 2 covering the interposer 9 and the semiconductor chip 7.
  • the outer lead which is a part of the interposer 9 may extend outside the sealing material 2.
  • the side surface of the sealing material 2 where the outer lead is located may be electrically insulated from the outer lead.
  • an electronic circuit board 100 As shown in FIG. 4, an electronic circuit board 100 according to this embodiment includes a substrate 11, an element 3 installed on the surface of the substrate 11, and the sealing material 2 that covers the element 3. Good.
  • substrate 11 is not specifically limited, For example, at least 1 type of printed circuit board chosen from the group which consists of a rigid board
  • the resistance per unit length of the inner surface of the sealing material 2 (the surface in contact with the element 3 in the sealing material 2) is the resistance Ri per unit length Li of the interior 2i of the sealing material 2. May be equal.
  • the surface 2s of the sealing material 2 may be electrically insulated from the substrate 11.
  • the resistance per unit length of the surface of the sealing material 2 in contact with the substrate 11 is the unit length of the inside 2i of the sealing material 2. It may be equal to the resistance Ri per Li.
  • the sealing material 2 may cover both the element 3 and the substrate 11.
  • the sealing material 2 may cover the entire surface of the element 3 and the substrate 11.
  • the metal particles may contain, for example, at least one selected from the group consisting of simple metals, alloys, and metal compounds.
  • the metal particles may be made of at least one selected from the group consisting of simple metals, alloys and metal compounds, for example.
  • the alloy may contain at least one selected from the group consisting of a solid solution, a eutectic and an intermetallic compound.
  • the alloy may be, for example, stainless steel (Fe—Cr alloy, Fe—Ni—Cr alloy, etc.).
  • the metal particles may contain one kind of metal element or plural kinds of metal elements.
  • the metal element contained in the metal particles may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element.
  • the compound may include one type of metal particles, and may include a plurality of types of metal particles having different compositions.
  • the metal particles are not limited to the above composition.
  • metal elements contained in the metal particles include iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), and aluminum (Al).
  • the metal particles may further contain an element other than the metal element.
  • the metal particles may include, for example, oxygen (O), beryllium (Be), phosphorus (P), boron (B), or silicon (Si).
  • the metal particles may be magnetic powder.
  • the metal particles may be a soft magnetic alloy or a ferromagnetic alloy.
  • Metal particles include, for example, Fe-Si alloys, Fe-Si-Al alloys (Sendust), Fe-Ni alloys (Permalloy), Fe-Cu-Ni alloys (Permalloy), Fe-Co alloys (Per Menjur), Fe-Cr-Si alloy (electromagnetic stainless steel), Nd-Fe-B alloy (rare earth magnet), Sm-Co alloy (rare earth magnet), Sm-Fe-N alloy (rare earth magnet) , And at least one magnetic powder selected from the group consisting of Al—Ni—Co alloys (alnico magnets).
  • the metal particles may be a copper alloy such as a Cu—Sn alloy, a Cu—Sn—P alloy, a Cu—Ni alloy, or a Cu—Be alloy.
  • the metal particles may contain one of the above elements and compositions, and may contain two or more of the above elements and compositions.
  • the metal particles may contain iron.
  • the metal particles may consist only of iron. When the metal particles contain iron, it is easy to obtain the sealing material 2 having Rs of 0.1 k ⁇ / mm to 20 k ⁇ / mm and Ri of 0.2 G ⁇ / mm to 10 T ⁇ / mm. .
  • the metal particles are preferably carbonyl iron powder (pure iron powder).
  • Carbonyl iron powder carbonyl iron powder manufactured by BASF Japan Ltd.
  • the metal particles may be amorphous iron powder.
  • the metal particles may be an alloy containing iron (Fe-based alloy).
  • the Fe-based alloy may be, for example, an Fe-Si-Cr-based alloy or an Nd-Fe-B-based alloy.
  • the metal particles may be an Fe amorphous alloy.
  • Commercially available products of Fe amorphous alloy powder include, for example, AW2-08, KUAMET-6B2 (above, product names manufactured by Epson Atmix Co., Ltd.), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49.
  • DAP 410L DAP 430L
  • DAP HYB series above, trade name made by Daido Steel
  • MH45D MH28D
  • MH25D MH20D
  • MH20D above, trade name made by Kobe Steel
  • the metal particles may be an Fe-based alloy containing Fe and Nb.
  • the metal particles may be an Fe-based alloy containing Fe, Nb, Cu, Si, and B.
  • the metal particles may include Fe-based alloy crystals having a crystal grain size of 10 nm or less. When the crystal grain size of the Fe-based alloy contained in the metal particles is 10 nm or less, the metal particles can have excellent magnetic properties (for example, high relative magnetic permeability).
  • the crystal grain size (for example, the average value of the crystal grain size) of the Fe-based alloy contained in the metal particles may be 5 nm or more and 10 nm or less.
  • the means for measuring the crystal grain size of the Fe-based alloy contained in the metal particles is not particularly limited, and may be, for example, a scanning electron microscope (SEM) or a transmission electron microscope (TEM).
  • SEM scanning electron microscope
  • TEM transmission electron microscope
  • the crystal grain size of the Fe-based alloy contained in the metal particles may be specified using Scherrer's formula based on the powder X-ray diffraction method.
  • various properties such as electromagnetic properties or thermal conductivity of the encapsulant 2 can be freely controlled, and the encapsulant 2 can be used for various industrial products. can do.
  • the average particle diameter of the metal particles is not particularly limited, but may be, for example, 1 ⁇ m or more and 300 ⁇ m or less.
  • the smaller the average particle diameter of the metal particles the smaller the specific surface area of the metal particles, the more contacts (electric conduction paths) between the metal particles, and the lower the resistance Rs on the surface of the sealing material.
  • the average particle diameter of the metal particles is larger, the specific surface area of the metal particles is larger, the number of contacts (electric conduction paths) between the metal particles is smaller, and the resistance Ri inside the sealing material tends to be higher.
  • the resin composition is a component that can include a resin, a curing agent, a curing accelerator, and an additive, and may be the remaining component (nonvolatile component) excluding the organic solvent and the metal particles.
  • An additive is a remaining component except resin, a hardening
  • the additive is, for example, a coupling agent or a flame retardant.
  • the resin composition may contain a wax as an additive.
  • a mixture of the above metal particles (metal powder) and an uncured resin composition (resin composition before being heated) is a so-called compound and a raw material for the sealing material.
  • the sealing material is obtained by curing the resin composition in the molded body formed from the compound. You may use the tablet formed from the compound as a starting material of a sealing material.
  • the composition of the resin composition described below may be regarded as an uncured resin composition contained in the compound.
  • the resin composition has a function as a binder (binder) for metal particles, and imparts mechanical strength to the sealing material formed from the compound.
  • a binder binder
  • the resin composition is filled between the metal particles and binds the metal particles to each other.
  • the cured product of the resin composition firmly binds the metal particles to each other, and a sealing material having high mechanical strength is obtained.
  • the resin composition may contain a thermosetting resin.
  • the thermosetting resin may be at least one selected from the group consisting of an epoxy resin, a phenol resin, and a polyamideimide resin, for example.
  • the resin composition may contain both an epoxy resin and a phenol resin, the phenol resin may function as a curing agent for the epoxy resin.
  • the resin composition may include a thermoplastic resin.
  • the thermoplastic resin may be at least one selected from the group consisting of acrylic resin, polyethylene, polypropylene, polystyrene, polyvinyl chloride, and polyethylene terephthalate, for example.
  • the resin composition may include both a thermosetting resin and a thermoplastic resin.
  • the resin composition may include a silicone resin.
  • the resin composition may contain an epoxy resin.
  • Rs is 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less
  • Ri is 0.2 G ⁇ / mm or more and 10 T ⁇ / mm or less, and durability It is easy to obtain an excellent sealing material 2.
  • the epoxy resin may be, for example, a resin having two or more epoxy groups in one molecule.
  • Epoxy resins include, for example, biphenyl type epoxy resins, stilbene type epoxy resins, diphenylmethane type epoxy resins, sulfur atom-containing type epoxy resins, novolac type epoxy resins, dicyclopentadiene type epoxy resins, salicylaldehyde type epoxy resins, naphthols and phenols.
  • Type epoxy resin epoxidized aralkyl type phenol resin, bisphenol type epoxy resin, glycidyl ether type epoxy resin of alcohols, glycidyl ether type epoxy resin of paraxylylene and / or metaxylylene modified phenol resin, terpene modified phenol resin Glycidyl ether type epoxy resin, cyclopentadiene type epoxy resin, glycidyl ether type epoxy resin of polycyclic aromatic ring modified phenolic resin, naphthalene Glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl type or methyl glycidyl type epoxy resin, alicyclic epoxy resin, halogenated phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, hydroquinone type epoxy It may be at least one selected from the group consisting of a resin, a trimethylolpropane type epoxy resin, and a linear aliphatic epoxy resin obtained by oxidizing
  • the crystalline epoxy resin (epoxy resin having high crystallinity) may be at least one selected from the group consisting of hydroquinone type epoxy resins, bisphenol type epoxy resins, thioether type epoxy resins, and biphenyl type epoxy resins, for example.
  • crystalline epoxy resins include, for example, Epicron 860, Epicron 1050, Epicron 1055, Epicron 2050, Epicron 3050, Epicron 4050, Epicron 7050, Epicron HM-091, Epicron HM-101, Epicron N-730A, Epicron N -740, Epicron N-770, Epicron N-775, Epicron N-865, Epicron HP-4032D, Epicron HP-7200L, Epicron HP-7200, Epicron HP-7200H, Epicron HP-7200HH, Epicron HP-7200HHH, Epicron HP -4700, Epicron HP-4710, Epicron HP-4770, Epicron HP-5000, Epicron HP-6000, and N500P-2 (above, IC Co., Ltd.
  • the resin composition may contain one kind of epoxy resin among the above.
  • the resin composition may contain a plurality of types of epoxy resins among the above.
  • Curing agents are classified into a curing agent that cures an epoxy resin in a range from low temperature to room temperature, and a heat curing type curing agent that cures an epoxy resin with heating.
  • the curing agent that cures the epoxy resin in the range from low temperature to room temperature include aliphatic polyamines, polyaminoamides, and polymercaptans.
  • the thermosetting curing agent include aromatic polyamines, acid anhydrides, phenol novolac resins, and dicyandiamide (DICY).
  • the curing agent is preferably a thermosetting curing agent, more preferably a phenol resin, and even more preferably a phenol novolac resin.
  • a phenol novolac resin as a curing agent, a cured product of an epoxy resin having a high glass transition point is easily obtained. As a result, the heat resistance and mechanical strength of the sealing material are easily improved.
  • phenol resin examples include aralkyl type phenol resin, dicyclopentadiene type phenol resin, salicylaldehyde type phenol resin, novolac type phenol resin, copolymer type phenol resin of benzaldehyde type phenol and aralkyl type phenol, paraxylylene and / or metaxylylene modified.
  • phenolic resin From the group consisting of phenolic resin, melamine modified phenolic resin, terpene modified phenolic resin, dicyclopentadiene type naphthol resin, cyclopentadiene modified phenolic resin, polycyclic aromatic ring modified phenolic resin, biphenyl type phenolic resin, and triphenylmethane type phenolic resin It may be at least one selected.
  • the phenol resin may be a copolymer composed of two or more of the above.
  • Tamorol 758 manufactured by Arakawa Chemical Industries, Ltd. or HP-850N manufactured by Hitachi Chemical Co., Ltd. may be used.
  • the phenol novolac resin may be, for example, a resin obtained by condensation or cocondensation of phenols and / or naphthols and aldehydes under an acidic catalyst.
  • the phenols constituting the phenol novolac resin may be at least one selected from the group consisting of phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol and aminophenol, for example.
  • the naphthols constituting the phenol novolac resin may be at least one selected from the group consisting of ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, for example.
  • the aldehyde constituting the phenol novolac resin may be at least one selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde, for example.
  • the curing agent may be, for example, a compound having two phenolic hydroxyl groups in one molecule.
  • the compound having two phenolic hydroxyl groups in one molecule may be at least one selected from the group consisting of resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol.
  • the resin composition may contain one kind of phenol resin among the above.
  • the resin composition may include a plurality of types of phenol resins among the above.
  • the resin composition may contain a kind of curing agent among the above.
  • the resin composition may contain plural kinds of curing agents among the above.
  • Tamorol 758 manufactured by Arakawa Chemical Industries, Ltd. or HP-850N manufactured by Hitachi Chemical Co., Ltd. may be used.
  • the ratio of the active group (phenolic OH group) in the curing agent that reacts with the epoxy group in the epoxy resin is preferably 0.5 to 1.5 equivalent, more preferably 1 equivalent to 1 equivalent of the epoxy group in the epoxy resin. May be 0.9 to 1.4 equivalents, more preferably 1.0 to 1.2 equivalents.
  • the ratio of the active group in the curing agent is less than 0.5 equivalent, the amount of OH per unit weight of the epoxy resin after curing decreases, and the curing rate of the resin composition (epoxy resin) decreases.
  • curing agent is less than 0.5 equivalent, the glass transition temperature of the hardened
  • the curing accelerator is not limited as long as it is a composition that reacts with the epoxy resin to accelerate the curing of the epoxy resin.
  • the curing accelerator may be, for example, an alkyl group-substituted imidazole or an imidazole such as benzimidazole.
  • the resin composition may include a kind of curing accelerator.
  • the resin composition may include a plurality of types of curing accelerators. When the resin composition contains a curing accelerator, the moldability and releasability of the compound can be easily improved, but the resin composition contains a curing accelerator, so that the sealing material manufactured using the compound is used. This improves the mechanical strength of the material and improves the storage stability of the compound in a high temperature and high humidity environment.
  • Examples of commercially available imidazole curing accelerators include 2MZ-H, C11Z, C17Z, 1,2DMZ, 2E4MZ, 2PZ-PW, 2P4MZ, 1B2MZ, 1B2PZ, 2MZ-CN, C11Z-CN, 2E4MZ-CN, 2PZ. At least one selected from the group consisting of —CN, C11Z-CNS, 2P4MHZ, TPZ, and SFZ (trade names manufactured by Shikoku Kasei Kogyo Co., Ltd.) may be used. Among these, imidazole-type curing accelerators having a long-chain alkyl group are preferable, and C11Z-CN (1-cyanoethyl-2-undecylimidazole) is preferable.
  • the blending amount of the curing accelerator is not particularly limited as long as the curing acceleration effect is obtained.
  • the blending amount of the curing accelerator is preferably 0.1 to 30 parts by mass with respect to 100 parts by mass of the epoxy resin. Preferably, it may be 1 to 15 parts by mass. It is preferable that content of a hardening accelerator is 0.001 mass part or more and 5 mass parts or less with respect to the sum total of the mass of an epoxy resin and a hardening
  • curing agent for example, phenol resin.
  • the coupling agent improves the adhesion between the resin composition and the metal particles, and improves the flexibility and mechanical strength of the sealing material formed from the compound.
  • the coupling agent may be at least one selected from the group consisting of, for example, a silane compound (silane coupling agent), a titanium compound, an aluminum compound (aluminum chelate), and an aluminum / zirconium compound.
  • the silane coupling agent may be at least one selected from the group consisting of epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, acid anhydride silane and vinyl silane, for example. In particular, aminophenyl silane coupling agents are preferred.
  • the compound may include one type of coupling agent among the above, and may include a plurality of types of coupling agents among the above.
  • the compound may contain a flame retardant because of the environmental safety, recyclability, moldability and low cost of the compound.
  • the flame retardant is, for example, at least one selected from the group consisting of brominated flame retardants, bulb flame retardants, hydrated metal compound flame retardants, silicone flame retardants, nitrogen-containing compounds, hindered amine compounds, organometallic compounds, and aromatic engineering plastics. It may be.
  • the compound may include one type of flame retardant among the above, and may include a plurality of types of flame retardant among the above.
  • the resin composition may contain a wax.
  • the wax increases the fluidity of the compound in molding of the compound (for example, transfer molding) and functions as a release agent.
  • the wax may be at least one of fatty acids such as higher fatty acids and fatty acid esters.
  • the wax is, for example, fatty acids such as montanic acid, stearic acid, 12-oxystearic acid, lauric acid, or esters thereof; zinc stearate, calcium stearate, barium steaenoate, aluminum stearate, magnesium stearate, calcium laurate, Fatty acid salts such as zinc linoleate, calcium ricinoleate and zinc 2-ethylhexoate; stearic acid amide, oleic acid amide, erucic acid amide, behenic acid amide, palmitic acid amide, lauric acid amide, hydroxystearic acid amide, methylenebisstearin Acid amide, ethylenebisstearic acid amide, ethylene bislauric acid amide, distearyl adipic acid amide, ethylene bisoleic acid amide, dioleyl adipic acid amide, N-steer Fatty acid amides such as rustearic acid amide, N-o
  • Compound production method A compound is obtained by mixing metal particles (metal powder) and a resin composition (resin composition before being heated) while heating.
  • the metal particles and the resin composition may be kneaded with a kneader or a stirrer while heating.
  • metal particles a resin such as an epoxy resin, a curing agent such as a phenol resin, a curing accelerator, and a coupling agent may be kneaded in a tank.
  • the resin, the curing agent, and the curing accelerator may be charged into the tank to knead the raw materials in the tank.
  • a curing accelerator may be put in the tank, and the raw materials in the tank may be further kneaded.
  • a mixed powder (resin mixed powder) of a resin, a curing agent, and a curing accelerator is prepared, and then a metal mixed powder is prepared by kneading metal particles and a coupling agent, followed by metal mixing. You may knead
  • the kneading time by the kneader depends on the volume of the tank and the production amount of the compound, but is preferably 5 minutes or longer, more preferably 10 minutes or longer, and further preferably 20 minutes or longer. Further, the kneading time by the kneader is preferably 120 minutes or less, more preferably 60 minutes or less, and further preferably 40 minutes or less. When the kneading time is less than 5 minutes, the kneading is insufficient, the moldability of the compound is impaired, and the degree of cure of the compound varies.
  • the heating temperature is not limited because it depends on the composition of the resin composition.
  • the heating temperature is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and further preferably 80 ° C. or higher.
  • the heating temperature is preferably 150 ° C. or lower, more preferably 120 ° C. or lower, and further preferably 110 ° C. or lower.
  • the compound is completed by the above kneading.
  • the content of the metal particles in the compound may be adjusted to 90% by mass to less than 100% by mass, or 97% by mass to 99.8% by mass with respect to the total mass of the compound.
  • the content of the resin composition in the compound may be adjusted to be greater than 0% by mass and 10% by mass or less, or 0.2% by mass to 3% by mass with respect to the total mass of the compound.
  • a tablet may be formed by filling a compound in a predetermined mold and molding it by pressing.
  • the shape and dimensions of the tablet are not particularly limited.
  • the tablet diameter may be 5 mm or more
  • the tablet height (length) may be 5 mm or more.
  • the molding pressure of the tablet is, for example, preferably 500 MPa or more, more preferably 1000 MPa or more, and further preferably 2000 MPa or more.
  • the manufacturing method of each of the sealing material, the electronic component, and the electronic circuit board according to the present embodiment includes a first heating step and a second heating step.
  • the resin composition is cured by heating the above compound containing a plurality of metal particles (metal powder) and a resin composition (uncured resin composition).
  • the compound may be heated while being pressed with a mold. That is, in the first heating step, the compound may be heated while being molded.
  • a compound (molded body) covering the element (sealed object) may be heated.
  • a compound (molded body) covering an element installed on the surface of the board may be heated.
  • the compound (molded body) may be heated at 130 ° C. or higher and 200 ° C. or lower.
  • the time during which the compound (molded body) is heated at the above temperature in the first heating step may be 2 minutes or longer and 30 minutes or shorter.
  • the compound may be heated in an inert gas such as nitrogen.
  • compound transfer molding may be performed.
  • the compound In transfer molding, the compound may be pressurized at 500 MPa to 2500 MPa. The higher the molding pressure, the easier it is to obtain a sealing material with excellent mechanical strength.
  • the molding pressure is preferably 1400 MPa or more and 2000 MPa or less.
  • the density of the molded body formed by transfer molding is preferably 75% or more and 86% or less, and more preferably 80% or more and 86% or less, with respect to the true density of the compound. When the density of the molded body is 75% or more and 86% or less, a sealing material excellent in mechanical strength is easily obtained.
  • the first heating step and the second heating step may be performed collectively.
  • the resistance Rs per unit length Ls in part or the entire surface of the compound (molded body) is reduced.
  • the resistance Rs is adjusted to 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less.
  • the compound (molded body) may be heated in the atmosphere.
  • the compound (molded body) may be heated at 140 ° C. or higher and 180 ° C. or lower.
  • the time during which the compound or molded body is heated at the above temperature in the second heating step is not particularly limited, but may be 30 hours or longer and 150 hours or shorter.
  • the compound (molded body) may be heated at 150 ° C. for 150 hours
  • the compound (molded body) may be heated at 160 ° C. for 60 hours
  • the sealing material, the electronic component, and the electronic circuit board according to this embodiment are obtained.
  • the element (sealing object) is sealed with an electromagnetic shielding property by simply heating the compound covering the element (sealing object) twice in the first heating step and the second heating step. Can be covered.
  • an element (sealed object) with a conventional electromagnetic shield (metal foil) and a conventional sealing material
  • a process of heating and curing a compound covering the element to form a sealing material, and an adhesive The process of sticking metal foil on the surface of a sealing material through is required. Further, the metal foil is easily damaged along with handling.
  • the manufacturing method of the sealing material, the electronic component, and the electronic circuit board according to this embodiment is simpler than the conventional method using the sealing material and the electromagnetic shield. And the productivity of electronic circuit boards is excellent.
  • a metal film electromagnetic shield
  • the metal target and the sealing material Due to the relative positional relationship, it is difficult to cover the surface of the sealing material with a metal film without unevenness. That is, sputtering is an anisotropic processing method.
  • heat having no anisotropy is used, it is possible to uniformly impart electromagnetic shielding properties to the entire surface of the compound (molded body).
  • the shape and structure of the surface 2s of the sealing material 2 as shown in FIG. 2 are formed.
  • Thermosetting resins such as epoxy resins tend to expand due to oxidation, but in the elemental analysis on the surface 2s of the sealing material 2 obtained in the second heating step, an amount of oxygen sufficient to support the oxidation was not detected. . That is, there is a high possibility that the decrease in the resistance Rs on the surface of the compound (molded body) is not caused by the oxidation of the resin composition in the second heating step.
  • the shape and structure of the surface 2s of the sealing material 2 as shown in FIG. 2 is formed in the second heating step, and the resistance of a part or the whole of the surface of the compound (molded body) decreases. is there. The following is a hypothesis.
  • the second heating step not the oxidation and decomposition of the resin composition, but the curing and shrinkage of the resin composition locally proceeds on the surface of the compound (molded product). That is, a phenomenon such as so-called “film reduction” occurs on the surface of the compound (molded body).
  • film reduction occurs on the surface of the compound (molded body).
  • the metal particles 4 and the resin composition 6 are easily exposed on the surface 2 s of the sealing material 2, and the metal particles 4 are likely to protrude from the resin composition 6.
  • the resin composition interposed between the metal particles 4 contracts, the metal particles 4 are easily brought into direct contact with each other, and the contacts (electric conduction paths) between the metal particles 4 are increased.
  • the insulating phosphate is detached from the surface of the metal particles 4 as the resin composition covering the metal particles 4 contracts, resulting in a compound (molded product).
  • the electrical insulation between the metal particles 4 on the surface of the metal is broken.
  • the phosphate covering the metal particles 4 on the surface of the compound (molded body) chemically acts on the resin composition, the resin composition becomes unstable, and a part of the resin composition is decomposed. There is also a possibility. Due to the above factors, the resistance of a part or the whole of the surface of the compound (molded body) is lowered.
  • the technical scope of the present invention is not limited by the above hypothesis.
  • the electronic component or the electronic circuit board according to the present embodiment includes an element 3, a conventional sealing material (a sealing material that does not have electromagnetic shielding properties) that covers a part or the whole of the element 3, and a conventional sealing And a sealing material 2 (sealing material having electromagnetic shielding properties) according to the present embodiment covering the material.
  • a conventional sealing material a sealing material that does not have electromagnetic shielding properties
  • a sealing material 2 sealing material having electromagnetic shielding properties
  • the surface of the sealing material 2 having a resistance Rs of 0.1 k ⁇ / mm or more and 20 k ⁇ / mm or less by polishing the surface of the molded body by ion milling after forming a molded body by molding of the compound and heat curing 2s may be formed.
  • the surface of the sealing material 2 having a resistance Rs of not less than 0.1 k ⁇ / mm and not more than 20 k ⁇ / mm by forming a molded body by molding of the compound and heat curing, and then performing a desmear treatment on the surface of the molded body 2s may be formed.
  • a part of the element in the sealing material is removed by cutting and polishing the surface of the sealing material. May be exposed.
  • the element exposed from the sealing material may be electrically connected to another element or the substrate.
  • the element exposed from the sealing material may be fixed to the surface of the substrate together with the sealing material.
  • Example 1 [Preparation of sealing material]
  • a mixture of iron amorphous alloy powder and carbonyl iron powder (pure iron powder) was used.
  • the ratio of the mass of the iron amorphous alloy powder to the mass (100 parts by mass) of the entire metal powder of Example 1 was 80 parts by mass.
  • the ratio of the mass of the carbonyl iron powder to the mass (100 parts by mass) of the entire metal powder of Example 1 was 20 parts by mass.
  • As the iron amorphous alloy powder KUAMET 9A4-II manufactured by Epson Atmix Co., Ltd. was used.
  • carbonyl iron powder SQ-I manufactured by BASF Japan Ltd. was used. SQ-I is pure iron powder that has been subjected to phosphoric acid treatment.
  • SQ used in Comparative Example 2 is another pure iron powder manufactured by BASF Japan Ltd., and is pure iron powder that has not been subjected to phosphoric acid treatment. That is, a film made of phosphate (iron phosphate) is not formed on the surface of each particle (particle made of pure iron) constituting “SQ”.
  • the mass (unit: g) of the entire metal powder used for preparing the compound powder was the same as in Example 1.
  • the resin composition prepared in Example 1 is a mixture of 100.0 g epoxy resin, 39.7 g phenol novolac resin, 3.0 g curing accelerator, 10.5 g silane coupling agent, and 15 g wax.
  • As the epoxy resin NC3000H (epoxy equivalent: 290) manufactured by Nippon Kayaku Co., Ltd. was used.
  • As the phenol novolac resin HP-850N (hydroxyl equivalent: 108) manufactured by Hitachi Chemical Co., Ltd. was used.
  • As a curing accelerator C11Z-CN of Shikoku Kasei Kogyo Co., Ltd. was used.
  • silane coupling agent KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd. was used.
  • Rico Wax E manufactured by Clariant Chemicals Co., Ltd. was used.
  • a rod-shaped molded body was produced from a tablet-like compound by transfer molding using a predetermined mold. In transfer molding, the compound was pressurized at 6.9 MPa for 10 minutes while being heated at 170 ° C. Transfer molding corresponds to the first heating step.
  • the size of the rod-shaped molded body was (vertical width 10 mm) ⁇ (horizontal width 3 mm) ⁇ (height: 30 mm).
  • a plate-like molded body was also produced from the tablet-like compound by the same transfer molding as described above except that another mold was used.
  • the dimension of the plate-shaped molded body was (vertical width 100 mm) ⁇ (horizontal width 100 mm) ⁇ (thickness 1 mm).
  • each of the two types of molded bodies that had undergone transfer molding was heated at 150 ° C. for 150 hours in a thermostatic bath filled with air.
  • Example 1 bar-shaped sealing material and plate-shaped sealing material
  • the rod-shaped sealing material was cut with a diamond cutter in a direction perpendicular to the surface of the rod-shaped sealing material.
  • the resistance between two points was measured by the two-terminal measurement method, and the average value of the resistance was calculated.
  • the distance between the two points was 5 mm.
  • the voltage applied between the two points was 100V. All measurements were performed at room temperature.
  • Megal “MODEL 6018” manufactured by Kyoritsu Electric Instruments Co., Ltd. was used.
  • the average resistance R INTERNAL (unit: ⁇ ) between two points in the cross section (inside) of the sealing material is shown in Table 1 below.
  • the average resistance Ri per unit length (unit: ⁇ / mm) in the cross section (inside) of the sealing material is shown in Table 1 below.
  • the electric field shield value SE (unit: dB) was determined by the Kansai Electronics Industry Promotion Center (KEC) method using the plate-shaped sealing material.
  • the electric field shield value SE is defined by the following formula A.
  • SE 20 ⁇ log 10 (E 0 / E 1 ) (A)
  • E 0 is the electric field strength (unit: V / m) when there is no plate-like sealing material.
  • E 1 is the electric field strength (unit: V / m) measured through the plate-shaped sealing material.
  • a network analyzer 37247C manufactured by Anritsu Corporation was used for the measurement of E 0 and E 1 .
  • the frequency of the electromagnetic wave used for the measurement was 1 MHz.
  • a magnetic shield value SM (unit: dB) was determined using a plate-shaped sealing material.
  • the magnetic field shield value SM is defined by the following formula B.
  • SM 20 ⁇ log 10 (H 0 / H 1 ) (B)
  • H 0 is the magnetic field strength (unit: A / m) when there is no plate-like sealing material.
  • E 1 is the intensity (unit: A / m) of the magnetic field measured through the plate-shaped sealing material.
  • a network analyzer “37247C” manufactured by Anritsu Corporation was used for the measurement of H 0 and H 1 . The larger the SM, the better the sealing material is for electromagnetic shielding.
  • R SURFACE of the plate-shaped sealing material was measured by the above method, and Rs was calculated.
  • the plate-shaped sealing material R SURFACE is substantially the same as the rod-shaped sealing material R SURFACE
  • the plate-shaped sealing material R-s is also substantially the same as the rod-shaped sealing material R-s. there were.
  • the plate-shaped sealing material was cut in the thickness direction, and R INTERNAL of the plate-shaped sealing material was measured by the above-described method to calculate Ri .
  • R INTERNAL of the plate-shaped sealing material is substantially the same as R INTERNAL of the rod-shaped sealing material
  • Ri of the plate-shaped sealing material is also substantially the same as Ri of the rod-shaped sealing material. there were.
  • Example 2 and 3 Comparative Examples 1 to 3
  • the ratio of the mass of the Fe amorphous alloy powder to the mass (100 parts by mass) of the entire metal powder of Example 2 was 60 parts by mass.
  • the ratio of the mass of the carbonyl iron powder which occupies for the mass (100 mass parts) of the whole metal powder of Example 2 was 40 mass parts.
  • the ratio of the mass of the Fe amorphous alloy powder to the mass (100 parts by mass) of the entire metal powder of Example 3 was 50 parts by mass.
  • the ratio of the mass of the carbonyl iron powder to the mass (100 parts by mass) of the entire metal powder of Example 3 was 50 parts by mass. In Example 3, it was adjusted M METAL / M RESIN to 100/5.
  • Comparative Example 1 only Fe amorphous alloy powder (9A4-II) was used as the metal powder.
  • Comparative Example 2 SQ having no phosphate coating was used as carbonyl iron powder instead of SQ-I.
  • the ratio of the mass of the Fe amorphous alloy powder to the mass (100 parts by mass) of the entire metal powder of Comparative Example 2 was 60 parts by mass.
  • the ratio of the mass of the carbonyl iron powder which occupies for the mass (100 mass parts) of the whole metal powder of the comparative example 2 was 40 mass parts.
  • the sealing material according to the present invention is used as, for example, a sealing material for an EMI filter.
  • SYMBOLS 2 Sealing material, 2s ... Surface of sealing material, 2i ... Inside (cross section) of sealing material, 3, 5 ... Element, 4 ... Metal particle, 6 ... Resin composition, 7 ... Semiconductor chip, 9 ... Inter Poser, 10a, 10b ... electronic components, 11 ... substrate, 100 ... electronic circuit board, Ls ... unit length on the surface of the sealing material, Li ... unit length on the inside (cross section) of the surface of the sealing material Well.

Abstract

L'invention concerne un matériau d'étanchéité (2) ayant des propriétés de blindage électromagnétique et des propriétés d'isolation. Le matériau d'étanchéité (2) comprend une pluralité de particules métalliques (4) et une composition de résine (6). La résistance par unité de longueur L-s dans au moins une partie de la surface 2s du matériau d'étanchéité (2) est de 0,1-20 kΩ/mm, et la résistance par unité de longueur L-i à l'intérieur 2i du matériau d'étanchéité (2) est de 0,2 GΩ/mm à 10 TΩ/mm
PCT/JP2018/016360 2018-04-20 2018-04-20 Matériau d'étanchéité, composant électronique, carte de circuit électronique et procédé de fabrication de matériau d'étanchéité WO2019202741A1 (fr)

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JP2020514895A JP7070672B2 (ja) 2018-04-20 2018-04-20 封止材、電子部品、電子回路基板、及び封止材の製造方法

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KR20220141598A (ko) * 2021-04-13 2022-10-20 한국과학기술연구원 이차전지 파우치용 다층 필름 및 이의 제조방법
WO2023079940A1 (fr) * 2021-11-08 2023-05-11 株式会社レゾナック Corps de conditionnement pour matériau d'étanchéité et procédé de conditionnement pour matériau d'étanchéité

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JPH01283900A (ja) * 1988-05-10 1989-11-15 Murata Mfg Co Ltd 外装成形用複合材料及び外装電子部品
JP2017188647A (ja) * 2016-03-31 2017-10-12 Tdk株式会社 複合磁性封止材料を用いた電子回路パッケージ

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Publication number Priority date Publication date Assignee Title
JPH01283900A (ja) * 1988-05-10 1989-11-15 Murata Mfg Co Ltd 外装成形用複合材料及び外装電子部品
JP2017188647A (ja) * 2016-03-31 2017-10-12 Tdk株式会社 複合磁性封止材料を用いた電子回路パッケージ

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KR20220141598A (ko) * 2021-04-13 2022-10-20 한국과학기술연구원 이차전지 파우치용 다층 필름 및 이의 제조방법
KR102643890B1 (ko) * 2021-04-13 2024-03-08 한국과학기술연구원 이차전지 파우치용 다층 필름 및 이의 제조방법
WO2023079940A1 (fr) * 2021-11-08 2023-05-11 株式会社レゾナック Corps de conditionnement pour matériau d'étanchéité et procédé de conditionnement pour matériau d'étanchéité

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