WO2019193644A1 - Three-dimensional structure formation method and three-dimensional structure formation device - Google Patents

Three-dimensional structure formation method and three-dimensional structure formation device Download PDF

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Publication number
WO2019193644A1
WO2019193644A1 PCT/JP2018/014234 JP2018014234W WO2019193644A1 WO 2019193644 A1 WO2019193644 A1 WO 2019193644A1 JP 2018014234 W JP2018014234 W JP 2018014234W WO 2019193644 A1 WO2019193644 A1 WO 2019193644A1
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WO
WIPO (PCT)
Prior art keywords
plate
curable resin
hole
unit
forming
Prior art date
Application number
PCT/JP2018/014234
Other languages
French (fr)
Japanese (ja)
Inventor
重義 稲垣
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2020512129A priority Critical patent/JP6987975B2/en
Priority to PCT/JP2018/014234 priority patent/WO2019193644A1/en
Publication of WO2019193644A1 publication Critical patent/WO2019193644A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

Definitions

  • the present invention relates to a three-dimensional structure forming method and a three-dimensional structure forming apparatus for forming a three-dimensional structure with a curable resin.
  • the present specification includes a first forming step of forming a first plate-like structure with a curable resin, and a second plate-like structure having a hole with the curable resin.
  • the curable resin is applied to at least one of the second forming step to be formed, the surface of the first plate-like structure, and the surface of the second plate-like structure where the hole is opened.
  • the first plate-like structure and the coating step so that the opening of the hole portion of the second plate-like structure is closed with the first plate-like structure and the hole portion is sealed.
  • a three-dimensional structure forming method including a laminating step of laminating a second plate-like structure and a curing step of curing the curable resin applied in the applying step.
  • this specification describes the 1st forming apparatus which forms a 1st plate-shaped structure with curable resin, and the 2nd plate-shaped structure which has a hole part with the said curable resin.
  • the curable resin is provided on at least one of a second forming apparatus for forming an object, a surface of the first plate-like structure, and a surface of the second plate-like structure where the hole portion is opened. And the first plate-like structure so that the opening of the hole of the second plate-like structure is closed by the first plate-like structure and the hole is sealed.
  • a three-dimensional structure forming apparatus including a laminating apparatus that laminates the second plate-like structure and a curing apparatus that cures the curable resin applied by the coating apparatus is disclosed.
  • the first plate-like structure and the second plate-like structure are formed so that the opening of the hole of the second plate-like structure is closed by the first plate-like structure and the hole is sealed. And are laminated. Then, a curable resin that is a raw material of the first plate-like structure and the second plate-like structure is applied to the laminated surface of the first plate-like structure and the second plate-like structure, Harden. As a result, the first plate-like structure and the second plate-like structure are integrally bonded with the cured resin, and a three-dimensional structure having a sealed space inside can be appropriately formed. Become.
  • FIG. 3 is a cross-sectional view showing the laminated plate-like structures of the first to third layers.
  • FIG. 5 is a cross-sectional view showing the laminated plate-like structures in the first to fourth layers.
  • FIG. 5 is a cross-sectional view showing the laminated plate-like structures of the first to fifth layers. It is sectional drawing which shows the 1st-layer plate-shaped structure laminated
  • FIG. 1 shows a circuit forming apparatus 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 25, a stacking unit 26, and a control device (see FIG. 2) 27.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 25, and the lamination unit 26 are disposed on the base 28 of the circuit forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60 and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a structure is formed on the upper surface of the base 60.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the 1st modeling unit 22 is a unit which models wiring, and has the 1st printing part 72 and the baking part 74.
  • FIG. The first printing unit 72 has an inkjet head (see FIG. 2) 76 and ejects metal ink in a linear shape.
  • the metal ink is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device (see FIG. 2) 78.
  • the laser irradiation device 78 is a device that irradiates the discharged metal ink with a laser, and the metal ink irradiated with the laser is baked to form a wiring.
  • the firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there.
  • metal wiring is formed by baking metal ink.
  • the second modeling unit 24 is a unit that models a plate-like structure, and includes a second printing unit 84, a discharge unit 85, and a curing unit 86.
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges an ultraviolet curable resin.
  • the ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which bubbles are generated by heating a resin to be discharged from a plurality of nozzles.
  • the discharge unit 85 has a dispense head (see FIG. 2) 89 and discharges a conductive ultraviolet curable resin.
  • the conductive ultraviolet curable resin is obtained by dispersing metal fine particles in a resin that is cured by irradiation with ultraviolet rays. Then, the resin is cured and contracted by the irradiation of ultraviolet rays, whereby the metal fine particles adhere to each other, and the conductive ultraviolet curable resin exhibits conductivity.
  • the dispense head 89 is configured to remove the conductive ultraviolet curable resin from one nozzle having a diameter larger than the diameter of the nozzle of the inkjet head 76. Discharge.
  • the dispense head 89 may be a transfer head that transfers paste with a stamp, for example, and the conductive ultraviolet curable resin may be, for example, a conductive thermosetting resin.
  • the curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the excess resin is scraped off by a roller or a blade. Thus, the thickness of the UV curable resin is made uniform.
  • the irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the discharged ultraviolet curable resin or conductive ultraviolet curable resin with ultraviolet rays. Thereby, the discharged ultraviolet curable resin is cured, a resin layer is formed, the discharged conductive ultraviolet curable resin is cured, and a wiring is formed.
  • the mounting unit 25 is a unit for mounting electronic components, and includes a supply unit 100 and a mounting unit 102.
  • the supply unit 100 has a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components one by one, and supplies the electronic components at the supply position.
  • the supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies electronic components from the tray.
  • the supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114.
  • the mounting head 112 has a suction nozzle, and holds the electronic component by suction using the suction nozzle.
  • the moving device 114 moves the mounting head 112 between the electronic component supply position by the tape feeder 110 and the base 60. Thereby, in the mounting unit 102, the electronic component supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component held by the suction nozzle 118 is mounted on the base 60.
  • the lamination unit 26 is a unit for laminating the plate-like structures modeled in the second modeling unit 24, and has a stock part 120 and a lamination part 122.
  • the stock unit 120 is for stocking a plate-like structure modeled in the second modeling unit 24.
  • the stacked unit 122 includes a holding head (see FIG. 2) 126 and a moving device (see FIG. 2) 128.
  • the holding head 126 has a holding tool, and holds the plate-like structure by the holding tool.
  • the moving device 128 moves the holding head 126 between the stock unit 120 and the base 60. Thereby, in the base 60, a plate-shaped structure is laminated
  • the control device 27 includes a controller 130 and a plurality of drive circuits 132 as shown in FIG.
  • the plurality of drive circuits 132 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the ink jet head 76, the laser irradiation device 78, the ink jet head 88, the dispense head 89, the flattening device 90, the irradiation device 92, and the tape feeder. 110, the mounting head 112, the moving device 114, the holding head 126, and the moving device 128.
  • the controller 130 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 132. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 25, and the stacking unit 26 is controlled by the controller 130.
  • a plurality of plate-like structures are formed by the above-described configuration, and a circuit is formed by stacking the plurality of plate-like structures.
  • the stage 52 is moved below the second modeling unit 24, and the plate-like structure 150 is formed on the base 60 in the second modeling unit 24 as shown in FIG.
  • the plate-like structure 150 is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the base 60 in a thin film shape. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 152 is formed on the base 60.
  • the inkjet head 88 discharges an ultraviolet curable resin in a thin film shape on the thin resin layer 152.
  • the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 152 is formed on the thin film resin layer 152.
  • a thin resin layer 152 is laminated. In this manner, the discharge of the ultraviolet curable resin onto the thin resin layer 152 and the irradiation of the ultraviolet rays are repeated, and the plurality of resin layers 152 are laminated, whereby the plate-like structure 150 is formed. .
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 discharges a metal ink on the upper surface of the plate-shaped structure 150 linearly according to a circuit pattern.
  • the laser irradiation apparatus 78 irradiates a metal ink with a laser. Thereby, the metal ink is baked, and the wiring 156 is formed on the plate-like structure 150 as shown in FIG.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 150 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 150 held by the moving device 128 is stocked in the stock unit 120.
  • the plate-like structure 160 has a hole 162 and is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the base 60 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the base 60 is exposed in a generally rectangular shape.
  • the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 166 is formed on the base 60.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 166. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 166 so that a predetermined portion of the upper surface of the base 60 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 166 is formed on the thin film resin layer 166. A thin resin layer 166 is laminated.
  • the discharge of the ultraviolet curable resin onto the thin resin layer 166 excluding the generally rectangular portion on the upper surface of the base 60 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 166 are laminated.
  • the plate-like structure 160 having the hole 162 is formed.
  • the hole 162 is a through hole that opens to the upper surface and the lower surface of the plate-like structure 160.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 160 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 160 held by the holding head 126 is stocked in the stock unit 120.
  • the stage 52 is moved below the second modeling unit 24.
  • a plate-like structure 170 is formed thereon. Note that, similarly to the plate-like structure 150, the plate-like structure 170 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 discharges a metal ink on the upper surface of the plate-shaped structure 170 linearly according to a circuit pattern.
  • the laser irradiation apparatus 78 irradiates a metal ink with a laser. As a result, the metal ink is baked, and wiring 172 is formed on the plate-like structure 170 as shown in FIG.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 170 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 170 held by the holding head 126 is stocked in the stock unit 120.
  • the plate-like structure 180 has a hole 182 and, like the plate-like structure 160, is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92. Is done.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 180 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 180 held by the holding head 126 is stocked in the stock unit 120.
  • the stage 52 is moved below the second modeling unit 24.
  • a plate-like structure 190 is formed thereon. Similar to the plate-like structure 150, the plate-like structure 190 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 190 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 190 held by the holding head 126 is stocked in the stock unit 120.
  • the plate-like structures 150 stocked in the stock unit 120 are It is held by the holder of the holding head 126 and is moved to the base 60 of the stage 52 by the moving device 128. Thereby, as shown in FIG. 4, the plate-like structure 150 is placed on the base 60.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 150.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 150 except for the end portion of the wiring 156 of the plate-like structure 150.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 160 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128.
  • the plate-like structure 160 is moved onto the plate-like structure 150 so that the hole 162 is located above the end of the wiring 156.
  • the plate-like structure 160 is laminated on the upper surface of the plate-like structure 150 so that the end of the wiring 156 is exposed through the hole 162.
  • the stage 52 is moved below the second modeling unit 24.
  • the dispense head 89 discharges the conductive ultraviolet curable resin 196 to the edge part of the wiring 156 through the hole 162 of the plate-shaped structure 160.
  • the irradiation device 92 irradiates the entire upper surface of the plate-like structure 160 with ultraviolet rays.
  • the ultraviolet rays irradiated by the irradiation device 92 pass through the plate-like structure 160, and the ultraviolet curable resin discharged to the upper surface of the plate-like structure 150 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 150 and the plate-like structure 160 are brought into close contact with each other. That is, the ultraviolet curable resin which is a raw material of the plate-like structure 150 and the plate-like structure 160 functions as an adhesive that bonds the plate-like structure 150 and the plate-like structure 160, and the plate-like structure 150 and the plate The structure 160 is integrally bonded with the cured resin.
  • the conductive ultraviolet curable resin 196 exerts conductivity when the conductive ultraviolet curable resin 196 discharged to the end of the wiring 156 is also irradiated with ultraviolet rays.
  • the stage 52 is moved below the mounting unit 25.
  • an electronic component (see FIG. 11) 200 is supplied from the tape feeder 110, and the electronic component 200 is held by the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 200 held by the mounting head 112 is formed in the plate-like structure 150 in the hole 162 of the plate-like structure 160 as shown in FIG. Mounted on top.
  • the electronic component 200 is mounted so that the electrode 202 of the electronic component 200 is in close contact with the conductive ultraviolet curable resin 196 discharged to the end of the wiring 156. Thereby, the electronic component 200 is electrically connected to the wiring 156 while being accommodated in the hole 162 of the plate-like structure 160.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 160.
  • FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 160 except for the holes 162 of the plate-like structure 160.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 170 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128. Accordingly, as shown in FIG. 12, the plate-like structure 170 is stacked on the upper surface of the plate-like structure 160, and the opening on the upper surface of the hole 162 of the plate-like structure 160 is closed by the plate-like structure 170. Can be removed. That is, the hole 162 of the plate-like structure 160 is closed by the plate-like structure 150 at the opening on the lower surface and is blocked by the plate-like structure 170 at the opening on the upper surface, so that the hole 162 is sealed. Space.
  • the stage 52 is moved below the second modeling unit 24.
  • the irradiation apparatus 92 irradiates the whole upper surface of the plate-shaped structure 170 with an ultraviolet-ray.
  • the ultraviolet rays irradiated by the irradiation device 92 pass through the plate-like structure 170, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 160 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 160 and the plate-like structure 170 are in close contact with each other, and the plate-like structure 160 and the plate-like structure 170 are integrally formed by the cured resin. Glued.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 170.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 180 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128.
  • the plate-like structure 180 is moved onto the plate-like structure 170 so that the hole 182 is located above the end of the wiring 172.
  • the plate-like structure 180 is laminated on the upper surface of the plate-like structure 170 so that the end of the wiring 172 is exposed through the hole 182.
  • the stage 52 is moved below the second modeling unit 24.
  • the dispense head 89 discharges the conductive ultraviolet curable resin 196 to the edge part of the wiring 172 through the hole part 182 of the plate-shaped structure 180.
  • the irradiation device 92 irradiates the entire upper surface of the plate-like structure 180 with ultraviolet rays.
  • the ultraviolet rays irradiated by the irradiation device 92 are transmitted through the plate-like structure 180, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 170 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 170 and the plate-like structure 180 are in close contact with each other, and the plate-like structure 170 and the plate-like structure 180 are integrally formed by the cured resin.
  • Glued the conductive ultraviolet curable resin 196 discharged to the end of the wiring 172 is also irradiated with ultraviolet rays, so that the conductive ultraviolet curable resin 196 exhibits conductivity.
  • the stage 52 is moved below the mounting unit 25.
  • an electronic component (see FIG. 13) 210 is supplied from the tape feeder 110, and the electronic component 210 is held by the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 210 held by the mounting head 112 is placed in the hole 182 of the plate-like structure 180 in the plate-like structure 170 as shown in FIG. Mounted on top.
  • the electronic component 210 is mounted so that the electrode 212 of the electronic component 210 is in close contact with the conductive ultraviolet curable resin 196 discharged to the end of the wiring 172.
  • the electronic component 210 is electrically connected to the wiring 172 while being accommodated in the hole 182 of the plate-like structure 180.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 180.
  • FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 180 except for the holes 182 of the plate-like structure 180.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 190 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128.
  • the plate-like structure 190 is laminated on the upper surface of the plate-like structure 180, and the opening on the upper surface of the hole 182 of the plate-like structure 180 is closed by the plate-like structure 190.
  • the stage 52 is moved below the second modeling unit 24.
  • the irradiation apparatus 92 irradiates the whole surface of the upper surface of the plate-shaped structure 190 with an ultraviolet-ray.
  • the ultraviolet rays irradiated by the irradiation device 92 are transmitted through the plate-like structure 190, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 180 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 180 and the plate-like structure 190 are in close contact, and the plate-like structure 180 and the plate-like structure 190 are integrally formed by the cured resin. Glued.
  • five plate-like structures 150, 160, 170, 180, 190 are formed. Then, these five plate-like structures 150, 160, 170, 180, and 190 are laminated and bonded together by an ultraviolet curable resin that is a raw material of each plate-like structure 150, 160, 170, 180, and 190. Is done. Accordingly, the five plate-like structures 150, 160, 170, 180, and 190 are suitably bonded in a stacked state.
  • the upper and lower openings of the hole 162 of the plate-like structure 160 are the plate-like structure 150 and the plate-like structure. It is blocked by 170.
  • the upper and lower openings of the hole 182 of the plate-like structure 180 are closed by the plate-like structure 170 and the plate-like structure 190.
  • a space sealed by the hole 162 and the hole 182 is formed inside the five plate-like structures 150, 160, 170, 180, and 190 that are integrally bonded in a stacked state.
  • the multilayer circuit 220 is formed by arranging the electronic components 200 and 210 in the sealed space.
  • the controller 130 of the control device 27 includes a first forming unit 230, a second forming unit 232, a coating unit 234, a stacking unit 236, a storage unit 237, and a curing unit 238.
  • the first forming unit 230 is a functional unit for forming the plate-like structures 150, 170, and 190.
  • the second forming part 232 is a functional part for forming the plate-like structures 160 and 180.
  • the application unit 234 is a functional unit for applying an ultraviolet curable resin used as an adhesive to the plate-like structure 150 or the like.
  • the stacked unit 236 is a functional unit for stacking the plate-like structures 150, 160, and 170 so that the openings of the holes 162 of the plate-like structure 160 are closed by the plate-like structures 150 and 170.
  • the laminated portion 236 is a functional unit for laminating the plate-like structures 170, 180, and 190 so that the openings of the hole portions 182 of the plate-like structure 180 are closed by the plate-like structures 170, 190. is there.
  • the accommodating portion 237 is a functional portion for accommodating the electronic components 200 and 210 in the hole portions 162 and 182.
  • the curing unit 238 is a functional unit for curing by irradiating the ultraviolet curable resin applied as an adhesive with ultraviolet rays.
  • the circuit forming apparatus 10 is an example of a three-dimensional structure forming apparatus.
  • the second modeling unit 24 is an example of a first forming device and a second forming device.
  • the stacking unit 26 is an example of a stacking apparatus.
  • the inkjet head 88 is an example of a coating apparatus.
  • the irradiation device 92 is an example of a curing device.
  • the plate-like structures 150, 170, 190 are an example of a first plate-like structure.
  • the plate-like structures 160 and 180 are an example of a second plate-like structure.
  • the holes 162 and 182 are an example of holes.
  • the electronic components 200 and 210 are examples of components.
  • the process executed by the first forming unit 230 is an example of a first forming process.
  • the process executed by the second forming unit 232 is an example of a second forming process.
  • the process executed by the application unit 234 is an example of an application process.
  • the process executed by the stacking unit 236 is an example of a stacking process.
  • the process executed by the storage unit 237 is an example of a storage process.
  • the process executed by the curing unit 238 is an example of a curing process.
  • the plate-like structures 160 and 180 are formed with the holes 162 and 182 that open on the upper surface and the lower surface, but as shown in FIG. You may form in the plate-shaped structure 252.
  • FIG. the plate-like structure 260 is laminated on the upper surface of the plate-like structure 252 so as to close the opening of the recess 250, whereby the recess 250 is sealed.
  • a sealed space can also be formed by closing the opening of the recess 250.
  • the plate-like structure 252 and the plate-like structure 260 are bonded with an ultraviolet curable resin.
  • the electronic components 200 and 210 are accommodated in the sealed space formed of the plate-shaped structure 150 grade
  • the circuit 220 is formed using the above-described method, but the circuit 220 is not limited thereto, and various three-dimensional structures can be formed.
  • Circuit forming device (three-dimensional structure forming device) 24: Second modeling unit (first forming device) (second forming device) 26: Laminating unit (stacking device) 88: Inkjet head (coating device) 92: Irradiation Device (curing device) 150: Plate-like structure (first plate-like structure) 160: Plate-like structure (second plate-like structure) 162: Hole 170: Plate-like structure (first plate) 180: plate-like structure (second plate-like structure) 182: hole 190: plate-like structure (first plate-like structure) 200: electronic component (component) 210: electronic component ( Parts) 230: First forming part (first forming process) 232: Second forming part (second forming process) 234: Application part (application process) 236: Laminating part (lamination process) 237: Housing part (accommodating) Degree) 238: cured portion (curing step)

Abstract

Provided is a method for forming a three-dimensional structure, the method comprising: a first formation step for forming a first plate-shaped structure using a curable resin; a second formation step for forming a second plate-shaped structure having a hole using a curable resin; a coating step for coating a curable resin on at least one surface of a surface of the first plate-shaped structure and a surface of the second plate-shaped structure on which a hole is open; a lamination step for laminating the first plate-shaped structure and the second plate-shaped structure such that an opening of the hole of the second plate-shaped structure is closed by the first plate-shaped structure and the hole is sealed; and a curing step for curing the curable resin that is coated in the coating step.

Description

３次元構造物形成方法、および３次元構造物形成装置Three-dimensional structure forming method and three-dimensional structure forming apparatus
　本発明は、硬化性樹脂により３次元構造物を形成する３次元構造物形成方法、および３次元構造物形成装置に関する。 The present invention relates to a three-dimensional structure forming method and a three-dimensional structure forming apparatus for forming a three-dimensional structure with a curable resin.
　近年、下記特許文献に記載されている技術を利用して、硬化性樹脂により３次元構造物を形成する装置などが開発されている。 In recent years, an apparatus for forming a three-dimensional structure with a curable resin has been developed using the technology described in the following patent documents.
特開２０１５－１０４８９０号公報JP2015-104890A
　硬化性樹脂により適切に３次元構造物を形成することを課題とする。 It is an object to appropriately form a three-dimensional structure with a curable resin.
　上記課題を解決するために、本明細書は、硬化性樹脂により第１の板状構造物を形成する第１形成工程と、前記硬化性樹脂により穴部を有する第２の板状構造物を形成する第２形成工程と、前記第１の板状構造物の面と、前記第２の板状構造物の前記穴部が開口する面との少なくとも一方の面に、前記硬化性樹脂を塗布する塗布工程と、前記第２の板状構造物の前記穴部の開口を前記第１の板状構造物により塞ぎ、前記穴部を密閉するように、前記第１の板状構造物と前記第２の板状構造物とを積層させる積層工程と、前記塗布工程において塗布された前記硬化性樹脂を硬化させる硬化工程とを含む３次元構造物形成方法を開示する。 In order to solve the above problems, the present specification includes a first forming step of forming a first plate-like structure with a curable resin, and a second plate-like structure having a hole with the curable resin. The curable resin is applied to at least one of the second forming step to be formed, the surface of the first plate-like structure, and the surface of the second plate-like structure where the hole is opened. The first plate-like structure and the coating step so that the opening of the hole portion of the second plate-like structure is closed with the first plate-like structure and the hole portion is sealed. Disclosed is a three-dimensional structure forming method including a laminating step of laminating a second plate-like structure and a curing step of curing the curable resin applied in the applying step.
　また、上記課題を解決するために、本明細書は、硬化性樹脂により第１の板状構造物を形成する第１形成装置と、前記硬化性樹脂により穴部を有する第２の板状構造物を形成する第２形成装置と、前記第１の板状構造物の面と、前記第２の板状構造物の前記穴部が開口する面との少なくとも一方の面に、前記硬化性樹脂を塗布する塗布装置と、前記第２の板状構造物の前記穴部の開口を前記第１の板状構造物により塞ぎ、前記穴部を密閉するように、前記第１の板状構造物と前記第２の板状構造物とを積層させる積層装置と、前記塗布装置により塗布された前記硬化性樹脂を硬化させる硬化装置とを含む３次元構造物形成装置を開示する。 Moreover, in order to solve the said subject, this specification describes the 1st forming apparatus which forms a 1st plate-shaped structure with curable resin, and the 2nd plate-shaped structure which has a hole part with the said curable resin. The curable resin is provided on at least one of a second forming apparatus for forming an object, a surface of the first plate-like structure, and a surface of the second plate-like structure where the hole portion is opened. And the first plate-like structure so that the opening of the hole of the second plate-like structure is closed by the first plate-like structure and the hole is sealed. A three-dimensional structure forming apparatus including a laminating apparatus that laminates the second plate-like structure and a curing apparatus that cures the curable resin applied by the coating apparatus is disclosed.
　本開示では、第２の板状構造物の穴部の開口を第１の板状構造物により塞ぎ、穴部を密閉するように、第１の板状構造物と第２の板状構造物とを積層させる。そして、第１の板状構造物と第２の板状構造物との積層面に、第１の板状構造物と第２の板状構造物との原料である硬化性樹脂を塗布し、硬化させる。これにより、第１の板状構造物と第２の板状構造物とが、硬化した樹脂によって一体的に接着し、内部に密閉空間を有する３次元構造物を適切に形成することが可能となる。 In the present disclosure, the first plate-like structure and the second plate-like structure are formed so that the opening of the hole of the second plate-like structure is closed by the first plate-like structure and the hole is sealed. And are laminated. Then, a curable resin that is a raw material of the first plate-like structure and the second plate-like structure is applied to the laminated surface of the first plate-like structure and the second plate-like structure, Harden. As a result, the first plate-like structure and the second plate-like structure are integrally bonded with the cured resin, and a three-dimensional structure having a sealed space inside can be appropriately formed. Become.
回路形成装置を示す図である。It is a figure which shows a circuit formation apparatus. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. １層目の板状構造体を示す断面図である。It is sectional drawing which shows the plate-shaped structure of the 1st layer. 配線が形成された１層目の板状構造体を示す断面図である。It is sectional drawing which shows the plate-shaped structure of the 1st layer in which wiring was formed. ２層目の板状構造体を示す断面図である。It is sectional drawing which shows the plate-shaped structure of the 2nd layer. ３層目の板状構造体を示す断面図である。It is sectional drawing which shows the plate-shaped structure of a 3rd layer. 配線が形成された３層目の板状構造体を示す断面図である。It is sectional drawing which shows the plate-shaped structure of the 3rd layer in which wiring was formed. ４層目の板状構造体を示す断面図である。It is sectional drawing which shows the 4th-layer plate-shaped structure. ５層目の板状構造体を示す断面図である。It is sectional drawing which shows the plate-shaped structure of the 5th layer. 積層された１層目の板状構造体と２層目の板状構造体を示す断面図である。It is sectional drawing which shows the laminated | stacked 1st-layer plate-shaped structure and 2nd-layer plate-shaped structure. 積層された１層目の板状構造体と２層目の板状構造体を示す断面図である。It is sectional drawing which shows the laminated | stacked 1st-layer plate-shaped structure and 2nd-layer plate-shaped structure. 積層された１～３層目の板状構造体を示す断面図である。FIG. 3 is a cross-sectional view showing the laminated plate-like structures of the first to third layers. 積層された１～４層目の板状構造体を示す断面図である。FIG. 5 is a cross-sectional view showing the laminated plate-like structures in the first to fourth layers. 積層された１～５層目の板状構造体を示す断面図である。FIG. 5 is a cross-sectional view showing the laminated plate-like structures of the first to fifth layers. 変形例として積層された１層目の板状構造体と２層目の板状構造体を示す断面図である。It is sectional drawing which shows the 1st-layer plate-shaped structure laminated | stacked as a modification, and the 2nd-layer plate-shaped structure.
　図１に回路形成装置１０を示す。回路形成装置１０は、搬送装置２０と、第１造形ユニット２２と、第２造形ユニット２４と、装着ユニット２５と、積層ユニット２６と、制御装置（図２参照）２７を備える。それら搬送装置２０と第１造形ユニット２２と第２造形ユニット２４と装着ユニット２５と、積層ユニット２６とは、回路形成装置１０のベース２８の上に配置されている。ベース２８は、概して長方形状をなしており、以下の説明では、ベース２８の長手方向をＸ軸方向、ベース２８の短手方向をＹ軸方向、Ｘ軸方向及びＹ軸方向の両方に直交する方向をＺ軸方向と称して説明する。 FIG. 1 shows a circuit forming apparatus 10. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 25, a stacking unit 26, and a control device (see FIG. 2) 27. The conveying device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 25, and the lamination unit 26 are disposed on the base 28 of the circuit forming device 10. The base 28 has a generally rectangular shape. In the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.
　搬送装置２０は、Ｘ軸スライド機構３０と、Ｙ軸スライド機構３２とを備えている。そのＸ軸スライド機構３０は、Ｘ軸スライドレール３４とＸ軸スライダ３６とを有している。Ｘ軸スライドレール３４は、Ｘ軸方向に延びるように、ベース２８の上に配設されている。Ｘ軸スライダ３６は、Ｘ軸スライドレール３４によって、Ｘ軸方向にスライド可能に保持されている。さらに、Ｘ軸スライド機構３０は、電磁モータ（図２参照）３８を有しており、電磁モータ３８の駆動により、Ｘ軸スライダ３６がＸ軸方向の任意の位置に移動する。また、Ｙ軸スライド機構３２は、Ｙ軸スライドレール５０とステージ５２とを有している。Ｙ軸スライドレール５０は、Ｙ軸方向に延びるように、ベース２８の上に配設されており、Ｘ軸方向に移動可能とされている。そして、Ｙ軸スライドレール５０の一端部が、Ｘ軸スライダ３６に連結されている。そのＹ軸スライドレール５０には、ステージ５２が、Ｙ軸方向にスライド可能に保持されている。さらに、Ｙ軸スライド機構３２は、電磁モータ（図２参照）５６を有しており、電磁モータ５６の駆動により、ステージ５２がＹ軸方向の任意の位置に移動する。これにより、ステージ５２は、Ｘ軸スライド機構３０及びＹ軸スライド機構３２の駆動により、ベース２８上の任意の位置に移動する。 The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. The Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
　ステージ５２は、基台６０と昇降装置６４とを有している。基台６０は、平板状に形成され、基台６０の上面において構造体が造形される。また、昇降装置６４は、基台６０の下方に配設されており、基台６０を昇降させる。 The stage 52 has a base 60 and a lifting device 64. The base 60 is formed in a flat plate shape, and a structure is formed on the upper surface of the base 60. The lifting device 64 is disposed below the base 60 and lifts the base 60.
　第１造形ユニット２２は、配線を造形するユニットであり、第１印刷部７２と、焼成部７４とを有している。第１印刷部７２は、インクジェットヘッド（図２参照）７６を有しており、金属インクを線状に吐出する。金属インクは、金属の微粒子が溶剤中に分散されたものである。なお、インクジェットヘッド７６は、例えば、圧電素子を用いたピエゾ方式によって複数のノズルから金属インクを吐出する。 The 1st modeling unit 22 is a unit which models wiring, and has the 1st printing part 72 and the baking part 74. FIG. The first printing unit 72 has an inkjet head (see FIG. 2) 76 and ejects metal ink in a linear shape. The metal ink is obtained by dispersing metal fine particles in a solvent. The inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
　焼成部７４は、レーザ照射装置（図２参照）７８を有している。レーザ照射装置７８は、吐出された金属インクにレーザを照射する装置であり、レーザが照射された金属インクは焼成し、配線が形成される。なお、金属インクの焼成とは、エネルギーを付与することによって、溶媒の気化や金属微粒子保護膜の分解等が行われ、金属微粒子が接触または融着をすることで、導電率が高くなる現象である。そして、金属インクが焼成することで、金属製の配線が形成される。 The firing unit 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates the discharged metal ink with a laser, and the metal ink irradiated with the laser is baked to form a wiring. The firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there. And metal wiring is formed by baking metal ink.
　また、第２造形ユニット２４は、板状の構造体を造形するユニットであり、第２印刷部８４と、吐出部８５と、硬化部８６とを有している。第２印刷部８４は、インクジェットヘッド（図２参照）８８を有しており、インクジェットヘッド８８は紫外線硬化樹脂を吐出する。紫外線硬化樹脂は、紫外線の照射により硬化する樹脂である。なお、インクジェットヘッド８８は、例えば、圧電素子を用いたピエゾ方式でもよく、樹脂を加熱して気泡を発生させ複数のノズルから吐出するサーマル方式でもよい。 The second modeling unit 24 is a unit that models a plate-like structure, and includes a second printing unit 84, a discharge unit 85, and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges an ultraviolet curable resin. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which bubbles are generated by heating a resin to be discharged from a plurality of nozzles.
　吐出部８５は、ディスペンスヘッド（図２参照）８９を有しており、導電性紫外線硬化樹脂を吐出する。導電性紫外線硬化樹脂は、紫外線の照射により硬化する樹脂に、金属微粒子が分散されたものである。そして、紫外線の照射により樹脂が硬化し、収縮することで、金属微粒子が密着し、導電性紫外線硬化樹脂が導電性を発揮する。なお、導電性紫外線硬化樹脂の粘度は、金属インクと比較して、比較的高いため、ディスペンスヘッド８９は、インクジェットヘッド７６のノズルの径より大きな径の１個のノズルから導電性紫外線硬化樹脂を吐出する。なお、ディスペンスヘッド８９は、例えば、スタンプにてペースト転写する転写ヘッドでもよく、導電性紫外線硬化樹脂は、例えば、導電性熱硬化性樹脂でもよい。 The discharge unit 85 has a dispense head (see FIG. 2) 89 and discharges a conductive ultraviolet curable resin. The conductive ultraviolet curable resin is obtained by dispersing metal fine particles in a resin that is cured by irradiation with ultraviolet rays. Then, the resin is cured and contracted by the irradiation of ultraviolet rays, whereby the metal fine particles adhere to each other, and the conductive ultraviolet curable resin exhibits conductivity. In addition, since the viscosity of the conductive ultraviolet curable resin is relatively higher than that of the metal ink, the dispense head 89 is configured to remove the conductive ultraviolet curable resin from one nozzle having a diameter larger than the diameter of the nozzle of the inkjet head 76. Discharge. The dispense head 89 may be a transfer head that transfers paste with a stamp, for example, and the conductive ultraviolet curable resin may be, for example, a conductive thermosetting resin.
　硬化部８６は、平坦化装置（図２参照）９０と照射装置（図２参照）９２とを有している。平坦化装置９０は、インクジェットヘッド８８によって吐出された紫外線硬化樹脂の上面を平坦化するものであり、例えば、紫外線硬化樹脂の表面を均しながら余剰分の樹脂を、ローラもしくはブレードによって掻き取ることで、紫外線硬化樹脂の厚みを均一させる。また、照射装置９２は、光源として水銀ランプもしくはＬＥＤを備えており、吐出された紫外線硬化樹脂、若しくは、導電性紫外線硬化樹脂に紫外線を照射する。これにより、吐出された紫外線硬化樹脂が硬化し、樹脂層が形成され、吐出された導電性紫外線硬化樹脂が硬化し、配線が形成される。 The curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the excess resin is scraped off by a roller or a blade. Thus, the thickness of the UV curable resin is made uniform. The irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the discharged ultraviolet curable resin or conductive ultraviolet curable resin with ultraviolet rays. Thereby, the discharged ultraviolet curable resin is cured, a resin layer is formed, the discharged conductive ultraviolet curable resin is cured, and a wiring is formed.
　また、装着ユニット２５は、電子部品を装着するユニットであり、供給部１００と、装着部１０２とを有している。供給部１００は、テーピング化された電子部品を１つずつ送り出すテープフィーダ（図２参照）１１０を複数有しており、供給位置において、電子部品を供給する。なお、供給部１００は、テープフィーダ１１０に限らず、トレイから電子部品をピックアップして供給するトレイ型の供給装置でもよい。また、供給部１００は、テープ型とトレイ型との両方、あるいはそれ以外の供給装置を備えた構成でもよい。 The mounting unit 25 is a unit for mounting electronic components, and includes a supply unit 100 and a mounting unit 102. The supply unit 100 has a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components one by one, and supplies the electronic components at the supply position. The supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies electronic components from the tray. The supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
　装着部１０２は、装着ヘッド（図２参照）１１２と、移動装置（図２参照）１１４とを有している。装着ヘッド１１２は、吸着ノズルを有し、吸着ノズルにより電子部品を吸着保持する。また、移動装置１１４は、テープフィーダ１１０による電子部品の供給位置と、基台６０との間で、装着ヘッド１１２を移動させる。これにより、装着部１０２では、テープフィーダ１１０から供給された電子部品が、吸着ノズル１１８により保持され、その吸着ノズル１１８によって保持された電子部品が、基台６０において装着される。 The mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114. The mounting head 112 has a suction nozzle, and holds the electronic component by suction using the suction nozzle. In addition, the moving device 114 moves the mounting head 112 between the electronic component supply position by the tape feeder 110 and the base 60. Thereby, in the mounting unit 102, the electronic component supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component held by the suction nozzle 118 is mounted on the base 60.
　また、積層ユニット２６は、第２造形ユニット２４において造形された板状の構造体を積層するユニットであり、ストック部１２０と、積層部１２２とを有している。ストック部１２０は、第２造形ユニット２４において造形された板状の構造体をストックするためのものである。また、積層部１２２は、保持ヘッド（図２参照）１２６と、移動装置（図２参照）１２８とを有している。保持ヘッド１２６は、保持具を有し、保持具により板状の構造体を保持する。そして、移動装置１２８は、ストック部１２０と、基台６０との間で、保持ヘッド１２６を移動させる。これにより、基台６０において、板状の構造体が積層される。 Further, the lamination unit 26 is a unit for laminating the plate-like structures modeled in the second modeling unit 24, and has a stock part 120 and a lamination part 122. The stock unit 120 is for stocking a plate-like structure modeled in the second modeling unit 24. In addition, the stacked unit 122 includes a holding head (see FIG. 2) 126 and a moving device (see FIG. 2) 128. The holding head 126 has a holding tool, and holds the plate-like structure by the holding tool. The moving device 128 moves the holding head 126 between the stock unit 120 and the base 60. Thereby, in the base 60, a plate-shaped structure is laminated | stacked.
　また、制御装置２７は、図２に示すように、コントローラ１３０と、複数の駆動回路１３２とを備えている。複数の駆動回路１３２は、上記電磁モータ３８，５６、保持装置６２、昇降装置６４、インクジェットヘッド７６、レーザ照射装置７８、インクジェットヘッド８８、ディスペンスヘッド８９、平坦化装置９０、照射装置９２、テープフィーダ１１０、装着ヘッド１１２、移動装置１１４、保持ヘッド１２６、移動装置１２８に接続されている。コントローラ１３０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１３２に接続されている。これにより、搬送装置２０、第１造形ユニット２２、第２造形ユニット２４、装着ユニット２５、積層ユニット２６の作動が、コントローラ１３０によって制御される。 The control device 27 includes a controller 130 and a plurality of drive circuits 132 as shown in FIG. The plurality of drive circuits 132 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the ink jet head 76, the laser irradiation device 78, the ink jet head 88, the dispense head 89, the flattening device 90, the irradiation device 92, and the tape feeder. 110, the mounting head 112, the moving device 114, the holding head 126, and the moving device 128. The controller 130 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 132. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 25, and the stacking unit 26 is controlled by the controller 130.
　回路形成装置１０では、上述した構成によって、複数の板状の構造体が形成され、それら複数の板状の構造体が積層されることで、回路が形成される。具体的には、ステージ５２が、第２造形ユニット２４の下方に移動され、第２造形ユニット２４において、図３に示すように、基台６０の上に板状構造体１５０が形成される。板状構造体１５０は、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより形成される。 In the circuit forming apparatus 10, a plurality of plate-like structures are formed by the above-described configuration, and a circuit is formed by stacking the plurality of plate-like structures. Specifically, the stage 52 is moved below the second modeling unit 24, and the plate-like structure 150 is formed on the base 60 in the second modeling unit 24 as shown in FIG. The plate-like structure 150 is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin.
　詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、基台６０の上面に紫外線硬化樹脂を薄膜状に吐出する。続いて、紫外線硬化樹脂が薄膜状に吐出されると、硬化部８６において、紫外線硬化樹脂の膜厚が均一となるように、紫外線硬化樹脂が平坦化装置９０によって平坦化される。そして、照射装置９２が、その薄膜状の紫外線硬化樹脂に紫外線を照射する。これにより、基台６０の上に薄膜状の樹脂層１５２が形成される。 Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the base 60 in a thin film shape. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 152 is formed on the base 60.
　続いて、インクジェットヘッド８８が、その薄膜状の樹脂層１５２の上に紫外線硬化樹脂を薄膜状に吐出する。そして、平坦化装置９０によって薄膜状の紫外線硬化樹脂が平坦化され、照射装置９２が、その薄膜状に吐出された紫外線硬化樹脂に紫外線を照射することで、薄膜状の樹脂層１５２の上に薄膜状の樹脂層１５２が積層される。このように、薄膜状の樹脂層１５２の上への紫外線硬化樹脂の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１５２が積層されることで、板状構造体１５０が形成される。 Subsequently, the inkjet head 88 discharges an ultraviolet curable resin in a thin film shape on the thin resin layer 152. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 152 is formed on the thin film resin layer 152. A thin resin layer 152 is laminated. In this manner, the discharge of the ultraviolet curable resin onto the thin resin layer 152 and the irradiation of the ultraviolet rays are repeated, and the plurality of resin layers 152 are laminated, whereby the plate-like structure 150 is formed. .
　上述した手順により板状構造体１５０が形成されると、ステージ５２が第１造形ユニット２２の下方に移動される。そして、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、板状構造体１５０の上面に金属インクを、回路パターンに応じて線状に吐出する。そして、第１造形ユニット２２の焼成部７４において、レーザ照射装置７８が、金属インクにレーザを照射する。これにより、金属インクが焼成し、図４に示すように、板状構造体１５０の上に配線１５６が形成される。 When the plate-like structure 150 is formed by the above-described procedure, the stage 52 is moved below the first modeling unit 22. And in the 1st printing part 72 of the 1st modeling unit 22, the inkjet head 76 discharges a metal ink on the upper surface of the plate-shaped structure 150 linearly according to a circuit pattern. And in the baking part 74 of the 1st modeling unit 22, the laser irradiation apparatus 78 irradiates a metal ink with a laser. Thereby, the metal ink is baked, and the wiring 156 is formed on the plate-like structure 150 as shown in FIG.
　そして、板状構造体１５０の上に配線１５６が形成されると、ステージ５２が積層ユニット２６の下方に移動される。積層ユニット２６では、保持ヘッド１２６によって、基台６０の上の板状構造体１５０が保持される。そして、保持ヘッド１２６が、移動装置１２８によってストック部１２０に移動され、移動装置１２８により保持された板状構造体１５０が、ストック部１２０にストックされる。 Then, when the wiring 156 is formed on the plate-like structure 150, the stage 52 is moved below the stacked unit 26. In the laminated unit 26, the plate-like structure 150 on the base 60 is held by the holding head 126. The holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 150 held by the moving device 128 is stocked in the stock unit 120.
　また、板状構造体１５０がストック部１２０にストックされると、ステージ５２が、第２造形ユニット２４の下方に移動され、第２造形ユニット２４において、図５に示すように、基台６０の上に板状構造体１６０が形成される。板状構造体１６０は穴部１６２を有しており、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより形成される。 Further, when the plate-like structure 150 is stocked in the stock portion 120, the stage 52 is moved below the second modeling unit 24. In the second modeling unit 24, as shown in FIG. A plate-like structure 160 is formed thereon. The plate-like structure 160 has a hole 162 and is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin. The
　詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、基台６０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、基台６０の上面の所定の部分が概して矩形に露出するように、紫外線硬化樹脂を吐出する。続いて、紫外線硬化樹脂が薄膜状に吐出されると、硬化部８６において、紫外線硬化樹脂の膜厚が均一となるように、紫外線硬化樹脂が平坦化装置９０によって平坦化される。そして、照射装置９２が、その薄膜状の紫外線硬化樹脂に紫外線を照射する。これにより、基台６０の上に薄膜状の樹脂層１６６が形成される。 Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the base 60 in a thin film shape. At this time, the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the base 60 is exposed in a generally rectangular shape. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 166 is formed on the base 60.
　続いて、インクジェットヘッド８８が、その薄膜状の樹脂層１６６の上の部分にのみ紫外線硬化樹脂を薄膜状に吐出する。つまり、インクジェットヘッド８８は、基台６０の上面の所定の部分が概して矩形に露出するように、薄膜状の樹脂層１６６の上に紫外線硬化樹脂を薄膜状に吐出する。そして、平坦化装置９０によって薄膜状の紫外線硬化樹脂が平坦化され、照射装置９２が、その薄膜状に吐出された紫外線硬化樹脂に紫外線を照射することで、薄膜状の樹脂層１６６の上に薄膜状の樹脂層１６６が積層される。このように、基台６０の上面の概して矩形の部分を除いた薄膜状の樹脂層１６６の上への紫外線硬化樹脂の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１６６が積層されることで、穴部１６２を有する板状構造体１６０が形成される。なお、穴部１６２は、板状構造体１６０の上面と下面とに開口する貫通穴とされている。 Subsequently, the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 166. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 166 so that a predetermined portion of the upper surface of the base 60 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 166 is formed on the thin film resin layer 166. A thin resin layer 166 is laminated. In this manner, the discharge of the ultraviolet curable resin onto the thin resin layer 166 excluding the generally rectangular portion on the upper surface of the base 60 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 166 are laminated. Thus, the plate-like structure 160 having the hole 162 is formed. The hole 162 is a through hole that opens to the upper surface and the lower surface of the plate-like structure 160.
　そして、板状構造体１６０が形成されると、ステージ５２が積層ユニット２６の下方に移動される。積層ユニット２６では、保持ヘッド１２６によって、基台６０の上の板状構造体１６０が保持される。そして、保持ヘッド１２６が、移動装置１２８によってストック部１２０に移動され、保持ヘッド１２６により保持された板状構造体１６０が、ストック部１２０にストックされる。 Then, when the plate-like structure 160 is formed, the stage 52 is moved below the laminated unit 26. In the laminated unit 26, the plate-like structure 160 on the base 60 is held by the holding head 126. Then, the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 160 held by the holding head 126 is stocked in the stock unit 120.
　また、板状構造体１６０がストック部１２０にストックされると、ステージ５２が、第２造形ユニット２４の下方に移動され、第２造形ユニット２４において、図６に示すように、基台６０の上に板状構造体１７０が形成される。なお、板状構造体１７０は、板状構造体１５０と同様に、インクジェットヘッド８８による紫外線硬化樹脂の吐出と、照射装置９２による紫外線の照射とが繰り返されることで、形成される。 Further, when the plate-like structure 160 is stocked in the stock unit 120, the stage 52 is moved below the second modeling unit 24. In the second modeling unit 24, as shown in FIG. A plate-like structure 170 is formed thereon. Note that, similarly to the plate-like structure 150, the plate-like structure 170 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92.
　次に、板状構造体１７０が形成されると、ステージ５２が第１造形ユニット２２の下方に移動される。そして、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、板状構造体１７０の上面に金属インクを、回路パターンに応じて線状に吐出する。そして、第１造形ユニット２２の焼成部７４において、レーザ照射装置７８が、金属インクにレーザを照射する。これにより、金属インクが焼成し、図７に示すように、板状構造体１７０の上に配線１７２が形成される。 Next, when the plate-like structure 170 is formed, the stage 52 is moved below the first modeling unit 22. And in the 1st printing part 72 of the 1st modeling unit 22, the inkjet head 76 discharges a metal ink on the upper surface of the plate-shaped structure 170 linearly according to a circuit pattern. And in the baking part 74 of the 1st modeling unit 22, the laser irradiation apparatus 78 irradiates a metal ink with a laser. As a result, the metal ink is baked, and wiring 172 is formed on the plate-like structure 170 as shown in FIG.
　そして、板状構造体１７０の上に配線１７２が形成されると、ステージ５２が積層ユニット２６の下方に移動される。積層ユニット２６では、保持ヘッド１２６によって、基台６０の上の板状構造体１７０が保持される。そして、保持ヘッド１２６が、移動装置１２８によってストック部１２０に移動され、保持ヘッド１２６により保持された板状構造体１７０が、ストック部１２０にストックされる。 Then, when the wiring 172 is formed on the plate-like structure 170, the stage 52 is moved below the stacked unit 26. In the laminated unit 26, the plate-like structure 170 on the base 60 is held by the holding head 126. Then, the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 170 held by the holding head 126 is stocked in the stock unit 120.
　また、板状構造体１７０がストック部１２０にストックされると、ステージ５２が、第２造形ユニット２４の下方に移動され、第２造形ユニット２４において、図８に示すように、基台６０の上に板状構造体１８０が形成される。板状構造体１８０は穴部１８２を有しており、板状構造体１６０と同様に、インクジェットヘッド８８による紫外線硬化樹脂の吐出と、照射装置９２による紫外線の照射とが繰り返されることで、形成される。 Further, when the plate-like structure 170 is stocked in the stock unit 120, the stage 52 is moved below the second modeling unit 24, and in the second modeling unit 24, as shown in FIG. A plate-like structure 180 is formed thereon. The plate-like structure 180 has a hole 182 and, like the plate-like structure 160, is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92. Is done.
　そして、板状構造体１８０が形成されると、ステージ５２が積層ユニット２６の下方に移動される。積層ユニット２６では、保持ヘッド１２６によって、基台６０の上の板状構造体１８０が保持される。そして、保持ヘッド１２６が、移動装置１２８によってストック部１２０に移動され、保持ヘッド１２６により保持された板状構造体１８０が、ストック部１２０にストックされる。 Then, when the plate-like structure 180 is formed, the stage 52 is moved below the stacked unit 26. In the laminated unit 26, the plate-like structure 180 on the base 60 is held by the holding head 126. Then, the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 180 held by the holding head 126 is stocked in the stock unit 120.
　また、板状構造体１８０がストック部１２０にストックされると、ステージ５２が、第２造形ユニット２４の下方に移動され、第２造形ユニット２４において、図９に示すように、基台６０の上に板状構造体１９０が形成される。板状構造体１９０は、板状構造体１５０と同様に、インクジェットヘッド８８による紫外線硬化樹脂の吐出と、照射装置９２による紫外線の照射とが繰り返されることで、形成される。 Further, when the plate-like structure 180 is stocked in the stock portion 120, the stage 52 is moved below the second modeling unit 24. In the second modeling unit 24, as shown in FIG. A plate-like structure 190 is formed thereon. Similar to the plate-like structure 150, the plate-like structure 190 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92.
　そして、板状構造体１９０が形成されると、ステージ５２が積層ユニット２６の下方に移動される。積層ユニット２６では、保持ヘッド１２６によって、基台６０の上の板状構造体１９０が保持される。そして、保持ヘッド１２６が、移動装置１２８によってストック部１２０に移動され、保持ヘッド１２６により保持された板状構造体１９０が、ストック部１２０にストックされる。 Then, when the plate-like structure 190 is formed, the stage 52 is moved below the stacked unit 26. In the laminated unit 26, the plate-like structure 190 on the base 60 is held by the holding head 126. Then, the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 190 held by the holding head 126 is stocked in the stock unit 120.
　このように、５枚の板状構造体１５０，１６０，１７０，１８０，１９０がストック部１２０にストックされると、積層ユニット２６において、ストック部１２０にストックされている板状構造体１５０が、保持ヘッド１２６の保持具により保持され、移動装置１２８によって、ステージ５２の基台６０に移動される。これにより、図４に示すように、基台６０の上に板状構造体１５０が載置される。 In this way, when the five plate- like structures 150, 160, 170, 180, 190 are stocked in the stock unit 120, in the stacked unit 26, the plate-like structures 150 stocked in the stock unit 120 are It is held by the holder of the holding head 126 and is moved to the base 60 of the stage 52 by the moving device 128. Thereby, as shown in FIG. 4, the plate-like structure 150 is placed on the base 60.
　次に、基台６０の上に板状構造体１５０が載置されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、板状構造体１５０の上面に紫外線硬化樹脂を吐出する。この際、インクジェットヘッド８８は、板状構造体１５０の配線１５６の端部を除いて、板状構造体１５０の上面に紫外線硬化樹脂を吐出する。 Next, when the plate-like structure 150 is placed on the base 60, the stage 52 is moved below the second modeling unit 24. And in the 2nd printing part 84 of the 2nd modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 150. FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 150 except for the end portion of the wiring 156 of the plate-like structure 150.
　続いて、板状構造体１５０の上面に紫外線硬化樹脂が吐出されると、ステージ５２が積層ユニット２６の下方に移動される。そして、積層ユニット２６において、ストック部１２０にストックされている板状構造体１６０が、保持ヘッド１２６の保持具により保持され、移動装置１２８によって、ステージ５２の基台６０に移動される。この際、図１０に示すように、板状構造体１６０は、穴部１６２が配線１５６の端部の上方に位置するように、板状構造体１５０の上に移動される。これにより、板状構造体１６０は、穴部１６２を介して配線１５６の端部が露出するように、板状構造体１５０の上面に積層される。 Subsequently, when the ultraviolet curable resin is discharged onto the upper surface of the plate-like structure 150, the stage 52 is moved below the laminated unit 26. In the stacked unit 26, the plate-like structure 160 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128. At this time, as shown in FIG. 10, the plate-like structure 160 is moved onto the plate-like structure 150 so that the hole 162 is located above the end of the wiring 156. Thereby, the plate-like structure 160 is laminated on the upper surface of the plate-like structure 150 so that the end of the wiring 156 is exposed through the hole 162.
　板状構造体１６０が板状構造体１５０の上面に積層されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の吐出部８５において、ディスペンスヘッド８９が、板状構造体１６０の穴部１６２を介して、配線１５６の端部に、導電性紫外線硬化樹脂１９６を吐出する。続いて、第２造形ユニット２４の硬化部８６において、照射装置９２が板状構造体１６０の上面の全域に紫外線を照射する。この際、照射装置９２により照射された紫外線は、板状構造体１６０を透過し、板状構造体１５０の上面に吐出された紫外線硬化樹脂が硬化する。これにより、板状構造体１５０と板状構造体１６０とを密着させた状態で、紫外線硬化樹脂が硬化する。つまり、板状構造体１５０及び板状構造体１６０の原料である紫外線硬化樹脂が、板状構造体１５０と板状構造体１６０とを接着させる接着剤として機能し、板状構造体１５０と板状構造体１６０とが、硬化した樹脂によって一体的に接着される。また、配線１５６の端部に吐出された導電性紫外線硬化樹脂１９６にも、紫外線が照射されることで、導電性紫外線硬化樹脂１９６が導電性を発揮する。 When the plate-like structure 160 is stacked on the upper surface of the plate-like structure 150, the stage 52 is moved below the second modeling unit 24. And in the discharge part 85 of the 2nd modeling unit 24, the dispense head 89 discharges the conductive ultraviolet curable resin 196 to the edge part of the wiring 156 through the hole 162 of the plate-shaped structure 160. FIG. Subsequently, in the curing unit 86 of the second modeling unit 24, the irradiation device 92 irradiates the entire upper surface of the plate-like structure 160 with ultraviolet rays. At this time, the ultraviolet rays irradiated by the irradiation device 92 pass through the plate-like structure 160, and the ultraviolet curable resin discharged to the upper surface of the plate-like structure 150 is cured. Thereby, the ultraviolet curable resin is cured in a state where the plate-like structure 150 and the plate-like structure 160 are brought into close contact with each other. That is, the ultraviolet curable resin which is a raw material of the plate-like structure 150 and the plate-like structure 160 functions as an adhesive that bonds the plate-like structure 150 and the plate-like structure 160, and the plate-like structure 150 and the plate The structure 160 is integrally bonded with the cured resin. In addition, the conductive ultraviolet curable resin 196 exerts conductivity when the conductive ultraviolet curable resin 196 discharged to the end of the wiring 156 is also irradiated with ultraviolet rays.
　次に、ステージ５２が装着ユニット２５の下方に移動される。装着ユニット２５では、テープフィーダ１１０により電子部品（図１１参照）２００が供給され、その電子部品２００が装着ヘッド１１２によって、保持される。そして、装着ヘッド１１２が、移動装置１１４によって移動され、装着ヘッド１１２により保持された電子部品２００が、図１１に示すように、板状構造体１６０の穴部１６２において、板状構造体１５０の上面に装着される。この際、電子部品２００の電極２０２が、配線１５６の端部に吐出された導電性紫外線硬化樹脂１９６に密着するように、電子部品２００が装着される。これにより、電子部品２００は、板状構造体１６０の穴部１６２に収容された状態で、配線１５６と電気的に接続される。 Next, the stage 52 is moved below the mounting unit 25. In the mounting unit 25, an electronic component (see FIG. 11) 200 is supplied from the tape feeder 110, and the electronic component 200 is held by the mounting head 112. Then, the mounting head 112 is moved by the moving device 114, and the electronic component 200 held by the mounting head 112 is formed in the plate-like structure 150 in the hole 162 of the plate-like structure 160 as shown in FIG. Mounted on top. At this time, the electronic component 200 is mounted so that the electrode 202 of the electronic component 200 is in close contact with the conductive ultraviolet curable resin 196 discharged to the end of the wiring 156. Thereby, the electronic component 200 is electrically connected to the wiring 156 while being accommodated in the hole 162 of the plate-like structure 160.
　電子部品２００が板状構造体１６０の穴部１６２に収容されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、板状構造体１６０の上面に紫外線硬化樹脂を吐出する。この際、インクジェットヘッド８８は、板状構造体１６０の穴部１６２を除いて、板状構造体１６０の上面に紫外線硬化樹脂を吐出する。 When the electronic component 200 is accommodated in the hole 162 of the plate-like structure 160, the stage 52 is moved below the second modeling unit 24. And in the 2nd printing part 84 of the 2nd modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 160. FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 160 except for the holes 162 of the plate-like structure 160.
　続いて、板状構造体１６０の上面に紫外線硬化樹脂が吐出されると、ステージ５２が積層ユニット２６の下方に移動される。そして、積層ユニット２６において、ストック部１２０にストックされている板状構造体１７０が、保持ヘッド１２６の保持具により保持され、移動装置１２８によって、ステージ５２の基台６０に移動される。これにより、図１２に示すように、板状構造体１７０は、板状構造体１６０の上面に積層され、板状構造体１６０の穴部１６２の上面の開口が、板状構造体１７０により塞がれる。つまり、板状構造体１６０の穴部１６２は、下面の開口において板状構造体１５０により塞がれ、上面の開口において板状構造体１７０により塞がれることで、穴部１６２は、密閉された空間とされる。 Subsequently, when the ultraviolet curable resin is discharged onto the upper surface of the plate-like structure 160, the stage 52 is moved below the laminated unit 26. In the stacked unit 26, the plate-like structure 170 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128. Accordingly, as shown in FIG. 12, the plate-like structure 170 is stacked on the upper surface of the plate-like structure 160, and the opening on the upper surface of the hole 162 of the plate-like structure 160 is closed by the plate-like structure 170. Can be removed. That is, the hole 162 of the plate-like structure 160 is closed by the plate-like structure 150 at the opening on the lower surface and is blocked by the plate-like structure 170 at the opening on the upper surface, so that the hole 162 is sealed. Space.
　板状構造体１７０が板状構造体１６０の上面に積層されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の硬化部８６において、照射装置９２が板状構造体１７０の上面の全域に紫外線を照射する。この際、照射装置９２により照射された紫外線は、板状構造体１７０を透過し、板状構造体１６０の上面に吐出された紫外線硬化樹脂が硬化する。これにより、板状構造体１６０と板状構造体１７０とを密着させた状態で、紫外線硬化樹脂が硬化し、板状構造体１６０と板状構造体１７０とが、硬化した樹脂によって一体的に接着される。 When the plate-like structure 170 is stacked on the upper surface of the plate-like structure 160, the stage 52 is moved below the second modeling unit 24. And in the hardening part 86 of the 2nd modeling unit 24, the irradiation apparatus 92 irradiates the whole upper surface of the plate-shaped structure 170 with an ultraviolet-ray. At this time, the ultraviolet rays irradiated by the irradiation device 92 pass through the plate-like structure 170, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 160 is cured. Thereby, the ultraviolet curable resin is cured in a state where the plate-like structure 160 and the plate-like structure 170 are in close contact with each other, and the plate-like structure 160 and the plate-like structure 170 are integrally formed by the cured resin. Glued.
　次に、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、板状構造体１７０の上面に紫外線硬化樹脂を吐出する。この際、インクジェットヘッド８８は、板状構造体１７０の配線１７２の端部を除いて、板状構造体１７０の上面に紫外線硬化樹脂を吐出する。 Next, the stage 52 is moved below the second modeling unit 24. And in the 2nd printing part 84 of the 2nd modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 170. FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 170 except for the end portion of the wiring 172 of the plate-like structure 170.
　続いて、板状構造体１７０の上面に紫外線硬化樹脂が吐出されると、ステージ５２が積層ユニット２６の下方に移動される。そして、積層ユニット２６において、ストック部１２０にストックされている板状構造体１８０が、保持ヘッド１２６の保持具により保持され、移動装置１２８によって、ステージ５２の基台６０に移動される。この際、図１３に示すように、板状構造体１８０は、穴部１８２が配線１７２の端部の上方に位置するように、板状構造体１７０の上に移動される。これにより、板状構造体１８０は、穴部１８２を介して配線１７２の端部が露出するように、板状構造体１７０の上面に積層される。 Subsequently, when the ultraviolet curable resin is discharged onto the upper surface of the plate-like structure 170, the stage 52 is moved below the laminated unit 26. In the stacked unit 26, the plate-like structure 180 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128. At this time, as shown in FIG. 13, the plate-like structure 180 is moved onto the plate-like structure 170 so that the hole 182 is located above the end of the wiring 172. As a result, the plate-like structure 180 is laminated on the upper surface of the plate-like structure 170 so that the end of the wiring 172 is exposed through the hole 182.
　板状構造体１８０が板状構造体１７０の上面に積層されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の吐出部８５において、ディスペンスヘッド８９が、板状構造体１８０の穴部１８２を介して、配線１７２の端部に、導電性紫外線硬化樹脂１９６を吐出する。続いて、第２造形ユニット２４の硬化部８６において、照射装置９２が板状構造体１８０の上面の全域に紫外線を照射する。この際、照射装置９２により照射された紫外線は、板状構造体１８０を透過し、板状構造体１７０の上面に吐出された紫外線硬化樹脂が硬化する。これにより、板状構造体１７０と板状構造体１８０とを密着させた状態で、紫外線硬化樹脂が硬化し、板状構造体１７０と板状構造体１８０とが、硬化した樹脂によって一体的に接着される。また、配線１７２の端部に吐出された導電性紫外線硬化樹脂１９６にも、紫外線が照射されることで、導電性紫外線硬化樹脂１９６が導電性を発揮する。 When the plate-like structure 180 is stacked on the upper surface of the plate-like structure 170, the stage 52 is moved below the second modeling unit 24. And in the discharge part 85 of the 2nd modeling unit 24, the dispense head 89 discharges the conductive ultraviolet curable resin 196 to the edge part of the wiring 172 through the hole part 182 of the plate-shaped structure 180. FIG. Subsequently, in the curing unit 86 of the second modeling unit 24, the irradiation device 92 irradiates the entire upper surface of the plate-like structure 180 with ultraviolet rays. At this time, the ultraviolet rays irradiated by the irradiation device 92 are transmitted through the plate-like structure 180, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 170 is cured. Thus, the ultraviolet curable resin is cured in a state where the plate-like structure 170 and the plate-like structure 180 are in close contact with each other, and the plate-like structure 170 and the plate-like structure 180 are integrally formed by the cured resin. Glued. In addition, the conductive ultraviolet curable resin 196 discharged to the end of the wiring 172 is also irradiated with ultraviolet rays, so that the conductive ultraviolet curable resin 196 exhibits conductivity.
　次に、ステージ５２が装着ユニット２５の下方に移動される。装着ユニット２５では、テープフィーダ１１０により電子部品（図１３参照）２１０が供給され、その電子部品２１０が装着ヘッド１１２によって、保持される。そして、装着ヘッド１１２が、移動装置１１４によって移動され、装着ヘッド１１２により保持された電子部品２１０が、図１３に示すように、板状構造体１８０の穴部１８２において、板状構造体１７０の上面に装着される。この際、電子部品２１０の電極２１２が、配線１７２の端部に吐出された導電性紫外線硬化樹脂１９６に密着するように、電子部品２１０が装着される。これにより、電子部品２１０は、板状構造体１８０の穴部１８２に収容された状態で、配線１７２と電気的に接続される。 Next, the stage 52 is moved below the mounting unit 25. In the mounting unit 25, an electronic component (see FIG. 13) 210 is supplied from the tape feeder 110, and the electronic component 210 is held by the mounting head 112. Then, the mounting head 112 is moved by the moving device 114, and the electronic component 210 held by the mounting head 112 is placed in the hole 182 of the plate-like structure 180 in the plate-like structure 170 as shown in FIG. Mounted on top. At this time, the electronic component 210 is mounted so that the electrode 212 of the electronic component 210 is in close contact with the conductive ultraviolet curable resin 196 discharged to the end of the wiring 172. As a result, the electronic component 210 is electrically connected to the wiring 172 while being accommodated in the hole 182 of the plate-like structure 180.
　電子部品２１０が板状構造体１８０の穴部１８２に収容されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、板状構造体１８０の上面に紫外線硬化樹脂を吐出する。この際、インクジェットヘッド８８は、板状構造体１８０の穴部１８２を除いて、板状構造体１８０の上面に紫外線硬化樹脂を吐出する。 When the electronic component 210 is accommodated in the hole 182 of the plate-like structure 180, the stage 52 is moved below the second modeling unit 24. And in the 2nd printing part 84 of the 2nd modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 180. FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 180 except for the holes 182 of the plate-like structure 180.
　続いて、板状構造体１８０の上面に紫外線硬化樹脂が吐出されると、ステージ５２が積層ユニット２６の下方に移動される。そして、積層ユニット２６において、ストック部１２０にストックされている板状構造体１９０が、保持ヘッド１２６の保持具により保持され、移動装置１２８によって、ステージ５２の基台６０に移動される。これにより、図１４に示すように、板状構造体１９０は、板状構造体１８０の上面に積層され、板状構造体１８０の穴部１８２の上面の開口が、板状構造体１９０により塞がれる。つまり、板状構造体１８０の穴部１８２は、下面の開口において板状構造体１７０により塞がれ、上面の開口において板状構造体１９０により塞がれることで、穴部１８２は、密閉された空間とされる。 Subsequently, when the ultraviolet curable resin is discharged onto the upper surface of the plate-like structure 180, the stage 52 is moved below the laminated unit 26. In the stacked unit 26, the plate-like structure 190 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128. As a result, as shown in FIG. 14, the plate-like structure 190 is laminated on the upper surface of the plate-like structure 180, and the opening on the upper surface of the hole 182 of the plate-like structure 180 is closed by the plate-like structure 190. Can be removed. That is, the hole 182 of the plate-like structure 180 is closed by the plate-like structure 170 in the opening on the lower surface and is closed by the plate-like structure 190 in the opening on the upper surface, so that the hole 182 is sealed. Space.
　板状構造体１９０が板状構造体１８０の上面に積層されると、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４の硬化部８６において、照射装置９２が板状構造体１９０の上面の全域に紫外線を照射する。この際、照射装置９２により照射された紫外線は、板状構造体１９０を透過し、板状構造体１８０の上面に吐出された紫外線硬化樹脂が硬化する。これにより、板状構造体１８０と板状構造体１９０とを密着させた状態で、紫外線硬化樹脂が硬化し、板状構造体１８０と板状構造体１９０とが、硬化した樹脂によって一体的に接着される。 When the plate-like structure 190 is stacked on the upper surface of the plate-like structure 180, the stage 52 is moved below the second modeling unit 24. And in the hardening part 86 of the 2nd modeling unit 24, the irradiation apparatus 92 irradiates the whole surface of the upper surface of the plate-shaped structure 190 with an ultraviolet-ray. At this time, the ultraviolet rays irradiated by the irradiation device 92 are transmitted through the plate-like structure 190, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 180 is cured. Thus, the ultraviolet curable resin is cured in a state where the plate-like structure 180 and the plate-like structure 190 are in close contact, and the plate-like structure 180 and the plate-like structure 190 are integrally formed by the cured resin. Glued.
　このように、回路形成装置１０では、５枚の板状構造体１５０，１６０，１７０，１８０，１９０が形成される。そして、それら５枚の板状構造体１５０，１６０，１７０，１８０，１９０が積層され、各板状構造体１５０，１６０，１７０，１８０，１９０の原料である紫外線硬化樹脂によって、一体的に接着される。これにより、５枚の板状構造体１５０，１６０，１７０，１８０，１９０が積層された状態で好適に接着される。 Thus, in the circuit forming apparatus 10, five plate- like structures 150, 160, 170, 180, 190 are formed. Then, these five plate- like structures 150, 160, 170, 180, and 190 are laminated and bonded together by an ultraviolet curable resin that is a raw material of each plate- like structure 150, 160, 170, 180, and 190. Is done. Accordingly, the five plate- like structures 150, 160, 170, 180, and 190 are suitably bonded in a stacked state.
　そして、５枚の板状構造体１５０，１６０，１７０，１８０，１９０が積層される際に、板状構造体１６０の穴部１６２の上下の開口は、板状構造体１５０と板状構造体１７０とによって塞がれる。また、板状構造体１８０の穴部１８２の上下の開口は、板状構造体１７０と板状構造体１９０とによって塞がれる。これにより、積層された状態で一体的に接着された５枚の板状構造体１５０，１６０，１７０，１８０，１９０の内部に、穴部１６２及び穴部１８２により密閉された空間が形成される。そして、その密閉された空間に電子部品２００，２１０が配設されることで、多層的な回路２２０が形成される。 When the five plate- like structures 150, 160, 170, 180, and 190 are stacked, the upper and lower openings of the hole 162 of the plate-like structure 160 are the plate-like structure 150 and the plate-like structure. It is blocked by 170. In addition, the upper and lower openings of the hole 182 of the plate-like structure 180 are closed by the plate-like structure 170 and the plate-like structure 190. As a result, a space sealed by the hole 162 and the hole 182 is formed inside the five plate- like structures 150, 160, 170, 180, and 190 that are integrally bonded in a stacked state. . The multilayer circuit 220 is formed by arranging the electronic components 200 and 210 in the sealed space.
　なお、制御装置２７のコントローラ１３０は、図２に示すように、第１形成部２３０と、第２形成部２３２と、塗布部２３４と、積層部２３６と、収容部２３７と、硬化部２３８とを有している。第１形成部２３０は、板状構造体１５０，１７０，１９０を形成するための機能部である。第２形成部２３２は、板状構造体１６０，１８０を形成するための機能部である。塗布部２３４は、接着剤として用いられる紫外線硬化樹脂を、板状構造体１５０等に塗布するための機能部である。積層部２３６は、板状構造体１６０の穴部１６２の開口が板状構造体１５０，１７０により塞がれるように、板状構造体１５０，１６０，１７０を積層するための機能部である。また、積層部２３６は、板状構造体１８０の穴部１８２の開口が板状構造体１７０，１９０により塞がれるように、板状構造体１７０，１８０，１９０を積層するための機能部である。収容部２３７は、穴部１６２，１８２に電子部品２００，２１０を収容するための機能部である。硬化部２３８は、接着剤として塗布された紫外線硬化樹脂に紫外線を照射することで、硬化させるための機能部である。 As shown in FIG. 2, the controller 130 of the control device 27 includes a first forming unit 230, a second forming unit 232, a coating unit 234, a stacking unit 236, a storage unit 237, and a curing unit 238. have. The first forming unit 230 is a functional unit for forming the plate- like structures 150, 170, and 190. The second forming part 232 is a functional part for forming the plate- like structures 160 and 180. The application unit 234 is a functional unit for applying an ultraviolet curable resin used as an adhesive to the plate-like structure 150 or the like. The stacked unit 236 is a functional unit for stacking the plate- like structures 150, 160, and 170 so that the openings of the holes 162 of the plate-like structure 160 are closed by the plate- like structures 150 and 170. The laminated portion 236 is a functional unit for laminating the plate- like structures 170, 180, and 190 so that the openings of the hole portions 182 of the plate-like structure 180 are closed by the plate- like structures 170, 190. is there. The accommodating portion 237 is a functional portion for accommodating the electronic components 200 and 210 in the hole portions 162 and 182. The curing unit 238 is a functional unit for curing by irradiating the ultraviolet curable resin applied as an adhesive with ultraviolet rays.
　また、上記実施例において、回路形成装置１０は、３次元構造物形成装置の一例である。第２造形ユニット２４は、第１形成装置及び、第２形成装置の一例である。積層ユニット２６は、積層装置の一例である。インクジェットヘッド８８は、塗布装置の一例である。照射装置９２は、硬化装置の一例である。板状構造体１５０，１７０，１９０は、第１の板状構造物の一例である。板状構造体１６０，１８０は、第２の板状構造物の一例である。穴部１６２，１８２は、穴部の一例である。電子部品２００，２１０は、部品の一例である。第１形成部２３０により実行される工程は、第１形成工程の一例である。第２形成部２３２により実行される工程は、第２形成工程の一例である。塗布部２３４により実行される工程は、塗布工程の一例である。積層部２３６により実行される工程は、積層工程の一例である。収容部２３７により実行される工程は、収容工程の一例である。硬化部２３８により実行される工程は、硬化工程の一例である。 In the above embodiment, the circuit forming apparatus 10 is an example of a three-dimensional structure forming apparatus. The second modeling unit 24 is an example of a first forming device and a second forming device. The stacking unit 26 is an example of a stacking apparatus. The inkjet head 88 is an example of a coating apparatus. The irradiation device 92 is an example of a curing device. The plate- like structures 150, 170, 190 are an example of a first plate-like structure. The plate- like structures 160 and 180 are an example of a second plate-like structure. The holes 162 and 182 are an example of holes. The electronic components 200 and 210 are examples of components. The process executed by the first forming unit 230 is an example of a first forming process. The process executed by the second forming unit 232 is an example of a second forming process. The process executed by the application unit 234 is an example of an application process. The process executed by the stacking unit 236 is an example of a stacking process. The process executed by the storage unit 237 is an example of a storage process. The process executed by the curing unit 238 is an example of a curing process.
　なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。例えば、上記実施例では、板状構造体１６０，１８０に、上面及び下面に開口する穴部１６２，１８２が形成されているが、図１５に示すように、上面のみに開口する凹部２５０を、板状構造体２５２に形成してもよい。この際、板状構造体２５２の上面に、凹部２５０の開口を塞ぐように、板状構造体２６０が積層されることで、凹部２５０が密閉される。このように、凹部２５０の開口を塞ぐことでも、密閉された空間を形成することができる。なお、板状構造体２５２と板状構造体２６０とは、紫外線硬化樹脂により接着される。 In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above embodiment, the plate- like structures 160 and 180 are formed with the holes 162 and 182 that open on the upper surface and the lower surface, but as shown in FIG. You may form in the plate-shaped structure 252. FIG. At this time, the plate-like structure 260 is laminated on the upper surface of the plate-like structure 252 so as to close the opening of the recess 250, whereby the recess 250 is sealed. Thus, a sealed space can also be formed by closing the opening of the recess 250. Note that the plate-like structure 252 and the plate-like structure 260 are bonded with an ultraviolet curable resin.
　また、上記実施例では、板状構造体１５０等により形成された密閉空間に、電子部品２００，２１０が収容されているが、電子部品２００，２１０に限られず、種々のものを収容することが可能である。例えば、密閉空間に、液体，ゲル等を収容することで、その収容物を制振材として機能させることが可能である。また、密閉空間に、何も収容せずに、密閉空間を、単なる空間とすることも可能である。 Moreover, in the said Example, although the electronic components 200 and 210 are accommodated in the sealed space formed of the plate-shaped structure 150 grade | etc., It is not restricted to the electronic components 200 and 210, Various things can be accommodated. Is possible. For example, by accommodating a liquid, gel, or the like in a sealed space, it is possible to cause the stored item to function as a damping material. Further, it is possible to make the sealed space a simple space without accommodating anything in the sealed space.
　また、上記実施例では、上記手法を用いて回路２２０が形成されているが、回路２２０に限定されず、種々の３次元の構造物を形成することが可能である。 In the above-described embodiment, the circuit 220 is formed using the above-described method, but the circuit 220 is not limited thereto, and various three-dimensional structures can be formed.
　１０：回路形成装置（３次元構造物形成装置）　　２４：第２造形ユニット（第１形成装置）（第２形成装置）　　２６：積層ユニット（積層装置）　　８８：インクジェットヘッド（塗布装置）　　９２：照射装置（硬化装置）　　１５０：板状構造体（第１の板状構造物）　　１６０：板状構造体（第２の板状構造物）　　１６２：穴部　　１７０：板状構造体（第１の板状構造物）　　１８０：板状構造体（第２の板状構造物）　　１８２：穴部　　１９０：板状構造体（第１の板状構造物）　　２００：電子部品（部品）　　２１０：電子部品（部品）　　２３０：第１形成部（第１形成工程）　　２３２：第２形成部（第２形成工程）　　２３４：塗布部（塗布工程）　　２３６：積層部（積層工程）　　２３７：収容部（収容工程）　　２３８：硬化部（硬化工程） 10: Circuit forming device (three-dimensional structure forming device) 24: Second modeling unit (first forming device) (second forming device) 26: Laminating unit (stacking device) 88: Inkjet head (coating device) 92: Irradiation Device (curing device) 150: Plate-like structure (first plate-like structure) 160: Plate-like structure (second plate-like structure) 162: Hole 170: Plate-like structure (first plate) 180: plate-like structure (second plate-like structure) 182: hole 190: plate-like structure (first plate-like structure) 200: electronic component (component) 210: electronic component ( Parts) 230: First forming part (first forming process) 232: Second forming part (second forming process) 234: Application part (application process) 236: Laminating part (lamination process) 237: Housing part (accommodating) Degree) 238: cured portion (curing step)

Claims (6)

  1. 　硬化性樹脂により第１の板状構造物を形成する第１形成工程と、
    　前記硬化性樹脂により穴部を有する第２の板状構造物を形成する第２形成工程と、
    　前記第１の板状構造物の面と、前記第２の板状構造物の前記穴部が開口する面との少なくとも一方の面に、前記硬化性樹脂を塗布する塗布工程と、
    　前記第２の板状構造物の前記穴部の開口を前記第１の板状構造物により塞ぎ、前記穴部を密閉するように、前記第１の板状構造物と前記第２の板状構造物とを積層させる積層工程と、
    　前記塗布工程において塗布された前記硬化性樹脂を硬化させる硬化工程と
    　を含む３次元構造物形成方法。     A first forming step of forming a first plate-like structure with a curable resin;
    A second forming step of forming a second plate-like structure having a hole with the curable resin;
    An application step of applying the curable resin to at least one of the surface of the first plate-like structure and the surface of the second plate-like structure where the hole portion opens;
    The first plate-like structure and the second plate-like shape are formed so that the opening of the hole of the second plate-like structure is closed with the first plate-like structure and the hole is sealed. A laminating step of laminating the structure;
    And a curing step of curing the curable resin applied in the application step.
  2. 　前記３次元構造物形成方法が、
    　前記積層工程において前記穴部が密閉される前に、前記穴部に部品を収容する収容工程を含み、
    　前記積層工程が、
    　前記収容工程において前記穴部に前記部品が収容された後に、前記第１の板状構造物と前記第２の板状構造物とを積層する請求項１に記載の３次元構造物形成方法。     The three-dimensional structure forming method includes:
    Before the hole is hermetically sealed in the laminating step, including an accommodating step of accommodating a component in the hole,
    The laminating step
    2. The three-dimensional structure forming method according to claim 1, wherein the first plate-like structure and the second plate-like structure are stacked after the component is housed in the hole in the housing step.
  3. 　前記３次元構造物形成方法が、
    　前記積層工程において前記穴部が密閉される前に、前記穴部に制振材を収容する収容工程を含み、
    　前記積層工程が、
    　前記収容工程において前記穴部に前記制振材が収容された後に、前記第１の板状構造物と前記第２の板状構造物とを積層する請求項１に記載の３次元構造物形成方法。     The three-dimensional structure forming method includes:
    Before the hole is sealed in the laminating step, including a housing step of housing a damping material in the hole,
    The laminating step
    2. The three-dimensional structure formation according to claim 1, wherein the first plate-like structure and the second plate-like structure are stacked after the damping material is received in the hole in the accommodation step. Method.
  4. 　前記硬化性樹脂が、紫外線の照射により硬化する紫外線硬化樹脂である請求項１ないし請求項３のいずれか１項に記載の３次元構造物形成方法。 The method for forming a three-dimensional structure according to any one of claims 1 to 3, wherein the curable resin is an ultraviolet curable resin that is cured by irradiation with ultraviolet rays.
  5. 　前記第１形成工程と前記第２形成工程との各々は、
    　薄膜状に印刷された前記硬化性樹脂を硬化させることで形成される樹脂層を、複数、積層させることで、前記板状構造物を形成する請求項１ないし請求項４のいずれか１項に記載の３次元構造物形成方法。     Each of the first forming step and the second forming step includes:
    The said plate-shaped structure is formed in any one of Claim 1 thru | or 4 by laminating | stacking the resin layer formed by hardening | curing the said curable resin printed in thin film form. The three-dimensional structure formation method as described.
  6. 　硬化性樹脂により第１の板状構造物を形成する第１形成装置と、
    　前記硬化性樹脂により穴部を有する第２の板状構造物を形成する第２形成装置と、
    　前記第１の板状構造物の面と、前記第２の板状構造物の前記穴部が開口する面との少なくとも一方の面に、前記硬化性樹脂を塗布する塗布装置と、
    　前記第２の板状構造物の前記穴部の開口を前記第１の板状構造物により塞ぎ、前記穴部を密閉するように、前記第１の板状構造物と前記第２の板状構造物とを積層させる積層装置と、
    　前記塗布装置により塗布された前記硬化性樹脂を硬化させる硬化装置と
    　を含む３次元構造物形成装置。     A first forming device for forming a first plate-like structure with a curable resin;
    A second forming apparatus for forming a second plate-like structure having a hole with the curable resin;
    An applicator that applies the curable resin to at least one of the surface of the first plate-like structure and the surface of the second plate-like structure where the hole portion is opened;
    The first plate-like structure and the second plate-like shape are formed so that the opening of the hole portion of the second plate-like structure is closed by the first plate-like structure and the hole portion is sealed. A laminating apparatus for laminating the structure;
    A three-dimensional structure forming apparatus comprising: a curing device that cures the curable resin applied by the coating device.
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JPWO2021181561A1 (en) * 2020-03-11 2021-09-16
JPWO2021214813A1 (en) * 2020-04-20 2021-10-28
JP7411452B2 (en) 2020-03-05 2024-01-11 株式会社Fuji Circuit formation method

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