WO2019189466A1 - Matériau de résine et carte de câblage imprimée multicouche - Google Patents

Matériau de résine et carte de câblage imprimée multicouche Download PDF

Info

Publication number
WO2019189466A1
WO2019189466A1 PCT/JP2019/013365 JP2019013365W WO2019189466A1 WO 2019189466 A1 WO2019189466 A1 WO 2019189466A1 JP 2019013365 W JP2019013365 W JP 2019013365W WO 2019189466 A1 WO2019189466 A1 WO 2019189466A1
Authority
WO
WIPO (PCT)
Prior art keywords
compound
resin material
skeleton derived
material according
skeleton
Prior art date
Application number
PCT/JP2019/013365
Other languages
English (en)
Japanese (ja)
Inventor
悠子 川原
達史 林
奨 馬場
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to CN201980018755.5A priority Critical patent/CN111836843A/zh
Priority to JP2019518316A priority patent/JP6660513B1/ja
Priority to KR1020207027404A priority patent/KR20200138227A/ko
Publication of WO2019189466A1 publication Critical patent/WO2019189466A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4238—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to a resin material containing an epoxy compound, an inorganic filler, and a curing agent. Moreover, this invention relates to the multilayer printed wiring board using the said resin material.
  • a resin material is used to form an insulating layer for insulating internal layers or to form an insulating layer located in a surface layer portion.
  • a wiring generally made of metal is laminated on the surface of the insulating layer.
  • the resin film in which the said resin material was turned into a film may be used.
  • the resin material and the resin film are used as insulating materials for multilayer printed wiring boards including build-up films.
  • Patent Document 1 discloses a resin composition containing a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group. . Patent Document 1 describes that a cured product of this resin composition can be used as an insulating layer such as a multilayer printed wiring board.
  • a compound having a small polarity may be blended with the resin material (resin composition).
  • the adhesion between the insulating layer and the wiring (metal layer) may not be sufficiently high. For this reason, a metal layer may peel from an insulating layer.
  • roughness may become large and plating peel strength may not become high enough.
  • the electrical characteristics and physical properties of the insulating layer may change.
  • the reaction proceeds quickly, so that it is difficult to control the degree of curing before etching, anchors are not sufficiently formed, and as a result, plating peel strength is increased. May not be high enough.
  • the object of the present invention is to 1) reduce the dielectric loss tangent of the cured product, 2) increase the adhesion between the insulating layer and the metal layer, 3) increase the plating peel strength, and 4) increase the flame retardancy of the cured product, And 5) to provide a resin material capable of keeping the curing temperature low.
  • Another object of the present invention is to provide a multilayer printed wiring board using the resin material.
  • a curing agent comprising at least one component selected from the group consisting of a compound, a cyanate ester compound, an acid anhydride, an active ester compound, a carbodiimide compound, and a benzoxazine compound having no skeleton derived from dimer amine.
  • a resin material having a weight ratio with respect to the total content of the curing agent and 0.05 to 0.75 is provided.
  • the N-alkylbismaleimide compound having a skeleton derived from dimer diamine has a structure represented by the following formula (X), or is derived from the dimer diamine.
  • R1 represents a tetravalent organic group.
  • the said epoxy compound is an epoxy compound which has an aromatic skeleton
  • the said component is a component which has an aromatic skeleton
  • the curing agent includes an active ester compound having two or more aromatic skeletons.
  • the said resin material contains a hardening accelerator.
  • the curing accelerator includes an anionic curing accelerator.
  • the content of the anionic curing accelerator is 50% by weight or more in 100% by weight of the curing accelerator.
  • the anionic curing accelerator is an imidazole compound.
  • the curing accelerator includes a radical curing accelerator and an imidazole compound, or includes a radical curing accelerator and a phosphorus compound.
  • the average particle diameter of the said inorganic filler is 1 micrometer or less.
  • the N-alkylbismaleimide compound having a skeleton derived from dimeramine amine includes an N-alkylbismaleimide compound having a skeleton derived from dimeramine amine, and the molecular weight of the N-alkylbismaleimide compound having the skeleton derived from dimeramine amine is 15000 Is less than.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine includes an N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine, and the molecular weight of the N-alkylbenzoxazine compound having the skeleton derived from dimeramine amine is 15000. Is less than.
  • the said resin material is a resin film.
  • the resin material according to the present invention is suitably used for forming an insulating layer in a multilayer printed wiring board.
  • a circuit board a plurality of insulating layers disposed on a surface of the circuit board, and a plurality of metal layers disposed between the insulating layers, the plurality of insulating layers are provided.
  • a multilayer printed wiring board is provided in which at least one of the layers is a cured product of the resin material described above.
  • the resin material according to the present invention includes an N-alkylbismaleimide compound having a skeleton derived from dimer amine or an N-alkyl benzoxazine compound having a skeleton derived from dimer amine, an epoxy compound, and an inorganic filler.
  • the resin material according to the present invention includes at least one component among a phenol compound, a cyanate ester compound, an acid anhydride, an active ester compound, a carbodiimide compound, and a benzoxazine compound having no skeleton derived from dimer diamine. Contains a curing agent.
  • the epoxy material having a content of the N-alkylbismaleimide compound having a skeleton derived from the dimeramine amine is used.
  • the weight ratio with respect to the total content of the compound and the curing agent is 0.05 or more and 0.75 or less.
  • the epoxy material having a content of the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine is contained.
  • the weight ratio with respect to the total content of the compound and the curing agent is 0.05 or more and 0.75 or less. Since the resin material according to the present invention has the above-described configuration, 1) the dielectric loss tangent of the cured product is reduced, 2) the adhesion between the insulating layer and the metal layer is increased, and 3) the plating peel strength is increased. 4) The flame retardancy of the cured product can be increased, and 5) the effects of 1) -5) can be exhibited, such that the curing temperature can be kept low.
  • FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention.
  • the resin material according to the present invention includes an N-alkylbismaleimide compound having a skeleton derived from dimer diamine or an N-alkyl benzoxazine compound having a skeleton derived from dimer diamine.
  • the resin material according to the present invention includes an epoxy compound.
  • the resin material according to the present invention includes an inorganic filler.
  • the resin material according to the present invention includes at least one component among a phenol compound, a cyanate ester compound, an acid anhydride, an active ester compound, a carbodiimide compound, and a benzoxazine compound having no skeleton derived from dimer diamine. Contains a curing agent.
  • a component of at least one of a phenol compound, a cyanate ester compound, an acid anhydride, an active ester compound, a carbodiimide compound, and a benzoxazine compound having no skeleton derived from dimer diamine” X may be described.
  • the resin material according to the present invention includes an N-alkyl bismaleimide compound having a skeleton derived from dimer amine, an N-alkyl benzoxazine compound having a skeleton derived from dimer amine, an epoxy compound, an inorganic filler, And a curing agent containing component X.
  • the resin material according to the present invention when the resin material contains an N-alkyl bismaleimide compound having a skeleton derived from the dimer amine, the inclusion of the N-alkyl bismaleimide compound having a skeleton derived from the dimer amine
  • the weight ratio of the amount to the total content of the epoxy compound and the curing agent is 0.05 or more and 0.75 or less.
  • the N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine when the resin material contains an N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine, the N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine is contained.
  • the weight ratio of the amount to the total content of the epoxy compound and the curing agent is 0.05 or more and 0.75 or less.
  • the resin material according to the present invention has the above-described configuration, 1) the dielectric loss tangent of the cured product is reduced, 2) the adhesion between the insulating layer and the metal layer is increased, and 3) the plating peel strength is increased. 4) The flame retardancy of the cured product can be increased, and 5) the effects of 1) -5) can be exhibited, such that the curing temperature can be kept low. For example, 2) As the adhesion between the insulating layer and the metal layer, the peel strength between the insulating layer and the metal layer in the temperature range from room temperature to high temperature (for example, 260 ° C.) can be increased.
  • the peel strength between the roughened cured product (insulating layer) and the metal layer laminated by plating on the surface of the insulating layer can be increased.
  • the roughened cured product (insulating layer) fine concave portions are formed on the surface.
  • the resin portion existing in the vicinity of the opening of the recess causes an anchor effect to the metal layer.
  • the roughness of the roughened cured product (insulating layer) is too large, it is possible to suppress the resin contributing to the anchor effect from becoming too thin, The plating peel strength can be increased. Further, in the resin material according to the present invention, it is possible to prevent the anchor from being formed due to the roughness of the roughened cured product (insulating layer) being too small, so that the plating peel strength can be increased. it can.
  • the resin material according to the present invention has the above-described configuration, the embedding property with respect to the uneven surface can be improved.
  • the resin material according to the present invention may be a resin composition or a resin film.
  • the resin composition has fluidity.
  • the resin composition may be in the form of a paste.
  • the paste form includes liquid.
  • the resin material according to the present invention is preferably a resin film because it is excellent in handleability.
  • the flexibility of the resin film can be increased.
  • the resin film (resin material) according to the present invention the resin film is hardly cracked or cracked when the resin film is handled. That is, when the resin material according to the present invention is a resin film, in addition to the effects 1) -5) described above, 6) the flexibility of the resin film can be increased.
  • the resin material according to the present invention is preferably a thermosetting material.
  • the resin film is preferably a thermosetting resin film.
  • the resin material according to the present invention includes an N-alkylbismaleimide compound having a skeleton derived from dimer diamine or an N-alkyl benzoxazine compound having a skeleton derived from dimer diamine.
  • the resin material according to the present invention may contain only the N-alkyl bismaleimide compound, may contain only the N-alkyl benzoxazine compound, the N-alkyl bismaleimide compound and the N-alkyl. Both of them may be contained together with a benzoxazine compound.
  • the resin material according to the present invention preferably contains an N-alkylbismaleimide compound having a skeleton derived from dimer diamine.
  • the N-alkylbismaleimide compound having a skeleton derived from dimer diamine has a maleimide group.
  • the etching performance can be enhanced by using an N-alkylbismaleimide compound having a skeleton derived from the dimer diamine.
  • the curing temperature can be kept low by using an N-alkylbismaleimide compound having a skeleton derived from the dimer diamine.
  • the N-alkylbismaleimide compound having a skeleton derived from the dimer diamine may be in an oligomer state.
  • the N-alkylbismaleimide compound having a skeleton derived from dimer diamine may have a molecular weight distribution.
  • the N-alkyl bismaleimide compound having a skeleton derived from the above dimer diamine only one kind may be used or two or more kinds may be used in combination.
  • the skeleton derived from dimer diamine exists as a partial skeleton.
  • the N-alkylbismaleimide compound having a skeleton derived from dimer diamine preferably has a structure in which an aliphatic skeleton is bonded to a nitrogen atom in the maleimide group.
  • the N-alkylbismaleimide compound having a skeleton derived from dimer diamine according to the present invention may be a citraconimide compound.
  • the citraconimide compound is a compound in which a methyl group is bonded to one of carbon atoms constituting a double bond between carbon atoms in a maleimide group. Since the citraconic imide compound is slightly less reactive than the maleimide compound, the storage stability can be improved.
  • the N-alkylbismaleimide compound having a skeleton derived from dimer diamine preferably has a skeleton derived from a reaction product of tetracarboxylic dianhydride and dimer diamine.
  • the reaction product of the tetracarboxylic dianhydride and the dimer diamine is preferably a compound in which both ends are amino groups.
  • the N-alkylbismaleimide compound having a skeleton derived from dimeramine amine is obtained by, for example, obtaining a reaction product of tetracarboxylic dianhydride and dimeramine amine (preferably a compound having both amino groups at the ends), It can be obtained by reacting the reaction product with maleic anhydride.
  • tetracarboxylic dianhydride examples include pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, and 3,3 ′, 4,4′-biphenylsulfonetetra.
  • dimer diamine examples include Versamine 551 (trade name, manufactured by BASF Japan, 3,4-bis (1-aminoheptyl) -6-hexyl-5- (1-octenyl) cyclohexene), Versamine 552. (Trade name, manufactured by Cognics Japan, hydrogenated product of Versamine 551), PRIAMINE 1075, PRIAMINE 1074, and PRIAMINE 1071 (trade names, all manufactured by Croda Japan).
  • dimer diamine may have unsaturated hydrocarbon as a partial skeleton, and does not need to have it.
  • N-alkylbismaleimide compounds having a skeleton derived from dimer diamine examples include Designers Molecules Inc. Examples thereof include “BMI-1500”, “BMI-1700”, and “BMI-3000” manufactured by the company.
  • the N-alkylbismaleimide compound having a skeleton derived from dimeramine amine preferably has a structure represented by the following formula (X).
  • R1 represents a tetravalent organic group.
  • R1 in the above formula (X) examples include a group having an aromatic ring and a group having a biphenyl ether skeleton.
  • the group having an aromatic ring examples include a group having a skeleton derived from pyromellitic acid anhydride.
  • the group having a biphenyl ether skeleton examples include a group having a skeleton derived from 4,4′-oxydiphthalic anhydride.
  • the N-alkylbismaleimide compound having a skeleton derived from the dimeramine amine may have one, two, or two or more structures represented by the above formula (X). It may be.
  • the weight ratio of the content of the N-alkylbismaleimide compound having a skeleton derived from the dimer amine to the total content of the epoxy compound and the curing agent is expressed as “weight ratio (having a skeleton derived from dimer amine). N-alkylbismaleimide compound content / total content of epoxy compound and curing agent).
  • the weight ratio (content of N-alkyl bismaleimide compound having a skeleton derived from dimer diamine / curing with epoxy compound and curing) Total content with the agent) is 0.05 or more and 0.75 or less.
  • the weight ratio (content of N-alkylbismaleimide compound having a skeleton derived from dimer diamine / total content of epoxy compound and curing agent) is preferably 0.15 or more, preferably 0.5 or less. is there.
  • the weight ratio is not less than the above lower limit and not more than the above upper limit, the above-described effects 1) -5) of the present invention and 1) -6) can be more effectively exhibited.
  • the content of the N-alkylbismaleimide compound having a skeleton derived from dimer diamine is preferably 5% by weight or more, more preferably 10% by weight in 100% by weight of the resin material excluding the inorganic filler and the solvent. % Or more, more preferably 15% by weight or more.
  • the content of the N-alkylbismaleimide compound having a skeleton derived from dimer diamine is preferably 65% by weight or less, more preferably 60% by weight in 100% by weight of the resin material excluding the inorganic filler and the solvent. % Or less, more preferably 55% by weight or less, particularly preferably 50% by weight or less.
  • the dielectric loss tangent is lowered, adhesion between the insulating layer and the metal layer, plating peel strength, etching performance, and resin.
  • the flexibility of the film can be further increased.
  • the flame retardancy is further increased, the linear expansion coefficient is further suppressed, and the plating peel strength is further increased. be able to.
  • the molecular weight of the N-alkylbismaleimide compound having a skeleton derived from dimerized amine is preferably 500 or more, more preferably 600 or more, preferably less than 15000, more preferably less than 11000, and still more preferably less than 8000.
  • the molecular weight is not less than the above lower limit and not more than the above upper limit, the adhesion between the insulating layer and the metal layer can be further increased, and the melt viscosity is lowered, and the resin material (resin film) is embedded in the circuit board. Can increase the sex.
  • the molecular weight of the N-alkylbismaleimide compound having a skeleton derived from the dimeramine amine is determined when the N-alkylbismaleimide compound is not a polymer and when the structural formula of the N-alkylbismaleimide compound can be specified. It means the molecular weight that can be calculated from the structural formula.
  • the molecular weight of the N-alkylbismaleimide compound having a skeleton derived from dimeramine amine is calculated in terms of polystyrene measured by gel permeation chromatography (GPC) when the N-alkylbismaleimide compound is a polymer. The weight average molecular weight is shown.
  • the resin material according to the present invention preferably contains an N-alkylbenzoxazine compound having a skeleton derived from the dimer diamine.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine is a compound in which the maleimide skeleton of the N-alkylbismaleimide compound having a skeleton derived from dimeramine amine is substituted with a benzoxazine skeleton. preferable.
  • the dielectric loss tangent can be lowered, and the adhesion between the insulating layer and the metal layer and the plating peel strength can be increased.
  • the etching performance can be enhanced by using an N-alkylbenzoxazine compound having a skeleton derived from the dimer diamine.
  • the curing temperature can be kept low.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine may be in an oligomer state.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine may have a molecular weight distribution.
  • the N-alkylbenzoxazine compound having a skeleton derived from the dimer diamine only one type may be used or two or more types may be used in combination.
  • the skeleton derived from dimer diamine exists as a partial skeleton.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine preferably has a structure in which an aliphatic skeleton is bonded to a nitrogen atom in a benzoxazine group.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine is preferably an N-alkylbisbenzoxazine compound having a skeleton derived from dimeramine amine.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimer diamine preferably has a skeleton derived from a reaction product of tetracarboxylic dianhydride and dimer diamine.
  • the reaction product of the tetracarboxylic dianhydride and the dimer diamine is preferably a compound in which both ends are amino groups.
  • the N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine is obtained by, for example, obtaining a reaction product of tetracarboxylic dianhydride and dimeramine amine (preferably a compound having both amino groups at both ends). It can be obtained by reacting the reactant, phenol and paraformaldehyde.
  • the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine preferably has a structure represented by the following formula (X).
  • R1 represents a tetravalent organic group.
  • R1 in the above formula (X) examples include a group having an aromatic ring and a group having a biphenyl ether skeleton.
  • the group having an aromatic ring examples include a group having a skeleton derived from pyromellitic acid anhydride.
  • the group having a biphenyl ether skeleton examples include a group having a skeleton derived from 4,4′-oxydiphthalic anhydride.
  • the N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine may have one, two, or two or more structures represented by the formula (X). It may be.
  • the weight ratio of the content of the N-alkylbenzoxazine compound having a skeleton derived from the dimer diamine to the total content of the epoxy compound and the curing agent is expressed as “weight ratio (having a skeleton derived from the dimer diamine”).
  • N-alkylbenzoxazine compound content / total content of epoxy compound and curing agent When the resin material contains an N-alkylbenzoxazine compound having a skeleton derived from dimer diamine, the weight ratio (content of N-alkyl benzoxazine compound having a skeleton derived from dimer diamine / curing with epoxy compound)
  • the total content with the agent) is 0.05 or more and 0.75 or less.
  • the weight ratio (content of N-alkylbenzoxazine compound having a skeleton derived from dimer diamine / total content of epoxy compound and curing agent) is preferably 0.15 or more, preferably 0.5 or less. is there.
  • the weight ratio is not less than the above lower limit and not more than the above upper limit, the above-described effects 1) -5) of the present invention and 1) -6) can be more effectively exhibited.
  • the content of the N-alkylbenzoxazine compound having a skeleton derived from dimer diamine is preferably 5% by weight or more, more preferably 10% by weight in 100% by weight of the component excluding the inorganic filler and solvent in the resin material. % Or more, more preferably 15% by weight or more.
  • the content of the N-alkylbenzoxazine compound having a skeleton derived from dimer diamine is preferably 65% by weight or less, more preferably 60% by weight in 100% by weight of the resin material excluding the inorganic filler and the solvent. % Or less, more preferably 55% by weight or less, particularly preferably 50% by weight or less.
  • the dielectric loss tangent is lowered, the adhesion between the insulating layer and the metal layer, the plating peel strength, the etching performance and the resin.
  • the flexibility of the film can be further increased.
  • the flame retardancy is further increased, the linear expansion coefficient is further suppressed, and the plating peel strength is further increased. be able to.
  • the molecular weight of the N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine is preferably 500 or more, more preferably 600 or more, preferably less than 15000, more preferably less than 11000, and still more preferably less than 8000.
  • the molecular weight is not less than the above lower limit and not more than the above upper limit, the adhesion between the insulating layer and the metal layer can be further increased, and the melt viscosity is lowered, and the resin material (resin film) is embedded in the circuit board. Can increase the sex.
  • the molecular weight of the N-alkylbenzoxazine compound having a skeleton derived from the dimeramine amine is such that when the N-alkylbenzoxazine compound is not a polymer and when the structural formula of the N-alkylbenzoxazine compound can be specified, It means the molecular weight that can be calculated from the structural formula.
  • the molecular weight of the N-alkylbenzoxazine compound having a skeleton derived from dimeramine amine is calculated in terms of polystyrene measured by gel permeation chromatography (GPC) when the N-alkylbenzoxazine compound is a polymer. The weight average molecular weight is shown.
  • the resin material includes an epoxy compound.
  • a conventionally well-known epoxy compound can be used as said epoxy compound.
  • the epoxy compound refers to an organic compound having at least one epoxy group. As for the said epoxy compound, only 1 type may be used and 2 or more types may be used together.
  • epoxy compounds examples include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, and naphthalene type epoxy compounds.
  • examples thereof include an epoxy compound and an epoxy compound having a triazine nucleus in the skeleton.
  • the epoxy compound preferably contains an epoxy compound having an aromatic skeleton, more preferably contains an epoxy compound having a naphthalene skeleton or a phenyl skeleton, more preferably an epoxy compound having an aromatic skeleton, and a naphthalene skeleton. It is particularly preferable that the epoxy compound has In this case, the dielectric loss tangent can be further reduced, the flame retardancy can be increased, and the linear expansion coefficient can be reduced.
  • the epoxy compound includes an epoxy compound that is liquid at 25 ° C. and an epoxy compound that is solid at 25 ° C. It is preferable.
  • the viscosity of the epoxy compound that is liquid at 25 ° C. at 25 ° C. is preferably 1000 mPa ⁇ s or less, and more preferably 500 mPa ⁇ s or less.
  • VAR-100 manufactured by Rheologicala Instruments
  • the molecular weight of the epoxy compound is more preferably 1000 or less.
  • a resin material with high fluidity can be obtained when the insulating layer is formed even if the component in the resin material is 100% by weight excluding the solvent and the content of the inorganic filler is 50% by weight or more. For this reason, when an uncured resin material or a B-stage product is laminated on the circuit board, the inorganic filler can be uniformly present.
  • the molecular weight of the epoxy compound means a molecular weight that can be calculated from the structural formula when the epoxy compound is not a polymer and when the structural formula of the epoxy compound can be specified. Moreover, when the said epoxy compound is a polymer, a weight average molecular weight is meant.
  • the content of the epoxy compound is preferably 15% by weight or more, more preferably 20% by weight in 100% by weight of the component excluding the solvent in the resin material. % Or more, preferably 50% by weight or less, more preferably 40% by weight or less.
  • the weight ratio of the content of the epoxy compound to the total content of the N-alkyl bismaleimide compound having a skeleton derived from the dimer diamine and the curing agent (content of the epoxy compound / the content of the N-alkyl bismaleimide)
  • the total content of the compound and the curing agent) is preferably 0.2 or more, more preferably 0.25 or more.
  • the total content of the compound and the curing agent is preferably 0.9 or less, more preferably 0.8 or less.
  • the weight ratio content of the epoxy compound / total content of the N-alkylbismaleimide compound and the curing agent
  • the dielectric loss tangent is lowered, and the insulating layer
  • the adhesion with the metal layer, the plating peel strength, the flame retardancy and the flexibility of the resin film can be further enhanced and the roughness can be reduced.
  • the weight ratio of the content of the epoxy compound to the total content of the N-alkylbenzoxazine compound having a skeleton derived from the dimer diamine and the curing agent is preferably 0.2 or more, more preferably 0.25 or more.
  • the weight ratio of the content of the epoxy compound to the total content of the N-alkylbenzoxazine compound having a skeleton derived from the dimer diamine and the curing agent (content of the epoxy compound / the content of the N-alkylbenzoxazine)
  • the total content of the compound and the curing agent is preferably 0.9 or less, more preferably 0.8 or less.
  • the weight ratio content of the epoxy compound / total content of the N-alkylbenzoxazine compound and the curing agent
  • the dielectric loss tangent is lowered, and the insulating layer
  • the adhesion with the metal layer, the plating peel strength, the flame retardancy and the flexibility of the resin film can be further enhanced and the roughness can be reduced.
  • the resin material includes an inorganic filler.
  • the dielectric loss tangent of the cured product can be further reduced.
  • the use of the inorganic filler further reduces the dimensional change due to heat of the cured product.
  • the said inorganic filler only 1 type may be used and 2 or more types may be used together.
  • examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
  • the inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica.
  • silica the thermal expansion coefficient of the cured product is further lowered, and the dielectric loss tangent of the cured product is further reduced.
  • the use of silica effectively reduces the surface roughness of the cured product and effectively increases the adhesive strength between the cured product and the metal layer.
  • the shape of silica is preferably spherical.
  • the inorganic filler is spherical silica from the viewpoint of promoting the curing of the resin, effectively increasing the glass transition temperature of the cured product, and effectively reducing the thermal linear expansion coefficient of the cured product. It is preferable.
  • the average particle size of the inorganic filler is preferably 50 nm or more, more preferably 100 nm or more, further preferably 500 nm or more, preferably 5 ⁇ m or less, more preferably 3 ⁇ m or less, and even more preferably 2 ⁇ m or less.
  • the average particle size of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the roughness can be reduced, and the adhesion between the insulating layer and the metal layer and the plating peel strength can be further enhanced.
  • a median diameter (d50) value of 50% is employed as the average particle diameter of the inorganic filler.
  • the average particle size can be measured using a laser diffraction / scattering particle size distribution measuring apparatus.
  • the inorganic filler is preferably spherical and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased.
  • the aspect ratio of the inorganic filler is preferably 2 or less, more preferably 1.5 or less.
  • the inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent.
  • the surface treatment of the inorganic filler By the surface treatment of the inorganic filler, the surface roughness of the roughened cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased. Further, since the inorganic filler is surface-treated, it is possible to form finer wiring on the surface of the cured product, and to further improve the inter-wiring insulation reliability and interlayer insulation reliability to the cured product. Can be granted.
  • Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
  • Examples of the silane coupling agent include methacryl silane, acrylic silane, amino silane, imidazole silane, vinyl silane, and epoxy silane.
  • the content of the inorganic filler is preferably 50% by weight or more, more preferably 60% by weight or more, still more preferably 65% by weight or more, particularly preferably 68% by weight. % Or more, preferably 90% by weight or less, more preferably 85% by weight or less, still more preferably 80% by weight or less, and particularly preferably 75% by weight or less.
  • the content of the inorganic filler is not less than the above lower limit, the dielectric loss tangent is effectively lowered. Etching performance can be improved as content of the said inorganic filler is below the said upper limit.
  • the content of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the surface roughness of the surface of the cured product can be further reduced, and finer wiring can be formed on the surface of the cured product. Can do. Furthermore, with this amount of inorganic filler, it is possible to improve the smear removability as well as lowering the coefficient of thermal expansion of the cured product.
  • the resin material comprises a curing agent containing at least one component of a phenol compound, a cyanate ester compound, an acid anhydride, an active ester compound, a carbodiimide compound, and a benzoxazine compound having no skeleton derived from dimer diamine. Including. That is, the resin material includes a curing agent containing component X.
  • the benzoxazine compound preferably does not have a skeleton derived from a diamine compound other than dimer diamine.
  • curing agent only 1 type may be used and 2 or more types may be used together.
  • Component X includes a phenol compound (phenol curing agent), a cyanate ester compound (cyanate ester curing agent), an acid anhydride, an active ester compound, a carbodiimide compound (carbodiimide curing agent), and a benzo having no skeleton derived from dimer diamine. It is at least one component of the oxazine compound (benzoxazine curing agent). That is, the resin material includes a curing agent containing component X. As for the said component X, only 1 type may be used and 2 or more types may be used together.
  • the component X is preferably a component having an aromatic skeleton, and more preferably contains at least a phenol compound.
  • the epoxy compound is an epoxy compound having an aromatic skeleton, and the component X has an aromatic skeleton. Preferably it is a component.
  • phenol compound examples include novolak type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol, dicyclopentadiene type phenol and the like.
  • phenol compounds examples include novolak-type phenols (“TD-2091” manufactured by DIC), biphenyl novolac-type phenols (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), and aralkyl-type phenol compounds (“MEH manufactured by Meiwa Kasei Co., Ltd.). -7800 "), and phenols having an aminotriazine skeleton (" LA1356 “and” LA3018-50P "manufactured by DIC).
  • cyanate ester compound examples include novolac-type cyanate ester resins, bisphenol-type cyanate ester resins, and prepolymers in which these are partially trimerized.
  • novolak-type cyanate ester resin a phenol novolak-type cyanate ester resin, an alkylphenol-type cyanate ester resin, etc. are mentioned.
  • the bisphenol type cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, and tetramethylbisphenol F type cyanate ester resin.
  • cyanate ester compounds Commercially available products of the above-mentioned cyanate ester compounds include phenol novolac type cyanate ester resins (Lonza Japan “PT-30” and “PT-60”), and prepolymers (Lonza Japan) in which bisphenol type cyanate ester resins are trimmed. "BA-230S”, “BA-3000S”, “BTP-1000S” and “BTP-6020S”) manufactured by the company.
  • Examples of the acid anhydride include tetrahydrophthalic acid anhydride and alkylstyrene-maleic anhydride copolymer.
  • Examples of commercially available acid anhydrides include “Ricacid TDA-100” manufactured by Shin Nippon Chemical Co., Ltd.
  • the active ester compound refers to a compound containing at least one ester bond in the structure and having an aliphatic chain, an aliphatic ring or an aromatic ring bonded to both sides of the ester bond.
  • the active ester compound is obtained, for example, by a condensation reaction between a carboxylic acid compound or thiocarboxylic acid compound and a hydroxy compound or thiol compound.
  • Examples of the active ester compound include a compound represented by the following formula (1).
  • X1 represents a group containing an aliphatic chain, a group containing an aliphatic ring or a group containing an aromatic ring
  • X2 represents a group containing an aromatic ring.
  • the group containing an aromatic ring include a benzene ring which may have a substituent and a naphthalene ring which may have a substituent.
  • a hydrocarbon group is mentioned as said substituent. The carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.
  • a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, a benzene ring which may have a substituent and a substitution
  • the combination with the naphthalene ring which may have a group is mentioned.
  • examples of the combination of X1 and X2 include a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.
  • the active ester compound is not particularly limited. From the viewpoint of further increasing the flame retardancy and reducing the linear expansion coefficient, the active ester is preferably an active ester compound having two or more aromatic skeletons. Therefore, the curing agent preferably contains an active ester compound having two or more aromatic skeletons. From the viewpoint of reducing the dielectric loss tangent of the cured product and increasing the thermal dimensional stability of the cured product, it is more preferable to have a naphthalene ring in the main chain skeleton of the active ester.
  • Examples of commercially available active ester compounds include “HPC-8000-65T”, “EXB9416-70BK”, “EXB8100-65T”, and “HPC-8150-60T” manufactured by DIC.
  • the carbodiimide compound has a structural unit represented by the following formula (2).
  • the right end and the left end are binding sites with other groups.
  • the said carbodiimide compound only 1 type may be used and 2 or more types may be used together.
  • X is an alkylene group, a group having a substituent bonded to an alkylene group, a cycloalkylene group, a group having a substituent bonded to a cycloalkylene group, an arylene group, or a substituent bonded to an arylene group.
  • X may be the same and may differ.
  • At least one X is an alkylene group, a group having a substituent bonded to the alkylene group, a cycloalkylene group, or a group having a substituent bonded to a cycloalkylene group.
  • carbodiimide compounds include “Carbodilite V-02B”, “Carbodilite V-03”, “Carbodilite V-04K”, “Carbodilite V-07”, “Carbodilite V-09”, “Carbodilite” manufactured by Nisshinbo Chemical Co., Ltd. 10M-SP ”,“ Carbodilite 10M-SP (modified) ”,“ STABAXOL P ”,“ STABAXOL P400 ”, and“ HIKAZIL 510 ”manufactured by Rhein Chemie.
  • benzoxazine compound having no skeleton derived from the dimeramine amine examples include Pd-type benzoxazine and Fa-type benzoxazine.
  • Examples of commercially available benzoxazine compounds having no skeleton derived from dimer diamine include “Pd type” manufactured by Shikoku Kasei Kogyo Co., Ltd.
  • the content of the component X with respect to 100 parts by weight of the epoxy compound is preferably 50 parts by weight or more, more preferably 85 parts by weight or more, preferably 150 parts by weight or less, more preferably 120 parts by weight or less.
  • the content of the component X is not less than the above lower limit and not more than the above upper limit, the curability is further improved, and the dimensional change of the cured product due to heat and the remaining unreacted components can be further suppressed.
  • the total content of the epoxy compound and the component X is preferably 40% by weight or more, more preferably 60% by weight or more, preferably It is 90 weight% or less, More preferably, it is 85 weight% or less.
  • the total content of the epoxy compound and the component X is not less than the above lower limit and not more than the above upper limit, an even better cured product can be obtained, and the dimensional change due to heat of the cured product can be further suppressed.
  • the resin material may contain a curing agent different from the curing agent containing the component X.
  • a curing agent different from the curing agent containing the component X include an amine compound (amine curing agent), a thiol compound (thiol curing agent), a phosphine compound, dicyandiamide, and a maleimide compound (maleimide curing agent).
  • the resin material preferably contains a curing accelerator.
  • the curing rate is further increased.
  • the crosslinked structure in the cured product becomes uniform, the number of unreacted functional groups is reduced, and as a result, the crosslinking density is increased. If the curing of the resin material does not proceed sufficiently, the dielectric loss tangent increases and the linear expansion coefficient may increase.
  • the curing accelerator By using the curing accelerator, the effect of the resin material can be sufficiently advanced.
  • the said hardening accelerator is not specifically limited, A conventionally well-known hardening accelerator can be used. As for the said hardening accelerator, only 1 type may be used and 2 or more types may be used together.
  • curing accelerator examples include anionic curing accelerators such as imidazole compounds, cationic curing accelerators such as amine compounds, and curing accelerators other than anionic and cationic curing accelerators such as phosphorus compounds and organometallic compounds. And radical curing accelerators such as peroxides.
  • imidazole compound examples include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ' -Methyly Midazolyl- (1 ′)]
  • amine compound examples include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine, 4,4-dimethylaminopyridine, and the like.
  • Examples of the phosphorus compound include a triphenylphosphine compound.
  • organometallic compound examples include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III).
  • peroxide examples include dicumyl peroxide and perhexyl 25B.
  • the curing accelerator preferably contains the anionic curing accelerator, and more preferably contains the imidazole compound.
  • the content of the anionic curing accelerator is preferably 50% by weight or more, more preferably 70% by weight or more, and still more preferably 80% in 100% by weight of the curing accelerator. % By weight or more, most preferably 100% by weight (total amount).
  • the curing accelerator preferably contains at least one of an anionic curing accelerator and a radical curing accelerator.
  • the anionic curing accelerator is preferably an imidazole compound.
  • the curing accelerator may contain the radical curing accelerator and the imidazole compound.
  • the radical curing accelerator is preferably a radical curing accelerator whose reaction temperature in the presence of the radical curing accelerator is higher than the curing temperature before etching and lower than the main curing temperature after etching. In the case of using a radical curing accelerator, the above effect is more effectively exhibited by using perhexyl 25B as the radical curing accelerator.
  • the said hardening accelerator contains a radical hardening accelerator and an imidazole compound, or contains a radical hardening accelerator and a phosphorus compound. In this case, curing of the resin material can be favorably progressed, and an even better cured product can be obtained.
  • the curing accelerator may contain a radical curing accelerator and at least one compound among dimethylaminopyridine, an imidazole compound, and a phosphorus compound.
  • the content of the curing accelerator is not particularly limited.
  • the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and preferably 5% by weight or less, in 100% by weight of the component excluding the inorganic filler and solvent in the resin material. More preferably, it is 3% by weight or less.
  • the content of the curing accelerator is not less than the above lower limit and not more than the above upper limit, the resin material is efficiently cured. If content of the said hardening accelerator is a more preferable range, the storage stability of a resin material will become still higher and a much better hardened
  • the resin material preferably contains a thermoplastic resin.
  • the thermoplastic resin include polyvinyl acetal resin, polyimide resin, and phenoxy resin.
  • the said thermoplastic resin only 1 type may be used and 2 or more types may be used together.
  • the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring.
  • the phenoxy resin By using the phenoxy resin, deterioration of the embedding property of the resin film with respect to the holes or irregularities of the circuit board and non-uniformity of the inorganic filler are suppressed.
  • the melt viscosity can be adjusted by using the phenoxy resin, the dispersibility of the inorganic filler is improved, and the resin composition or the B-staged product is difficult to wet and spread in an unintended region during the curing process.
  • the phenoxy resin contained in the resin material is not particularly limited.
  • a conventionally known phenoxy resin can be used as the phenoxy resin.
  • As for the said phenoxy resin only 1 type may be used and 2 or more types may be used together.
  • phenoxy resins examples include phenoxy resins having a skeleton such as a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a biphenyl skeleton, a novolac skeleton, a naphthalene skeleton, and an imide skeleton.
  • phenoxy resins examples include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40” manufactured by Mitsubishi Chemical Corporation, “ 4275 “,” YX6954BH30 “,” YX8100BH30 “, and the like.
  • the thermoplastic resin is preferably a polyimide resin (polyimide compound) from the viewpoint of improving handling properties, plating peel strength at low roughness, and adhesion between the insulating layer and the metal layer.
  • the polyimide compound is preferably a polyimide compound obtained by a method of reacting tetracarboxylic dianhydride and dimer diamine.
  • the thermoplastic resin, the polyimide resin, and the phenoxy resin preferably have a weight average molecular weight of 5000 or more, more preferably 10,000 or more, and preferably 100,000 or less. Preferably it is 50000 or less.
  • the weight average molecular weight of the thermoplastic resin, the polyimide resin, and the phenoxy resin indicates a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
  • the content of the thermoplastic resin in 100% by weight of the component excluding the inorganic filler and the solvent in the resin material Is preferably 1% by weight or more, more preferably 2% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less.
  • the content of the thermoplastic resin is not less than the above lower limit and not more than the above upper limit, the embedding property of the resin material in the holes or irregularities of the circuit board becomes good.
  • the content of the thermoplastic resin is not less than the above lower limit, the resin film can be formed more easily, and a better insulating layer can be obtained.
  • the thermal expansion coefficient of the cured product is further reduced.
  • the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.
  • the resin material does not contain or contains a solvent.
  • the solvent By using the solvent, the viscosity of the resin material can be controlled within a suitable range, and the coatability of the resin material can be improved.
  • the said solvent may be used in order to obtain the slurry containing the said inorganic filler. As for the said solvent, only 1 type may be used and 2 or more types may be used together.
  • Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples thereof include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone and naphtha which is a mixture.
  • the boiling point of the solvent is preferably 200 ° C. or lower, more preferably 180 ° C. or lower.
  • the content of the solvent in the resin composition is not particularly limited. The content of the solvent can be appropriately changed in consideration of the coating property of the resin composition.
  • the content of the solvent is preferably 1% by weight or more, more preferably 2% by weight or more, preferably 10% by weight or less in 100% by weight of the B stage film. More preferably, it is 5% by weight or less.
  • the above resin materials are leveling agents, flame retardants, coupling agents, coloring agents, antioxidants, UV degradation inhibitors, antifoaming agents.
  • a thermosetting resin other than an agent, a thickener, a thixotropic agent, and an epoxy compound may be included.
  • Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
  • Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.
  • thermosetting resins examples include polyphenylene ether resins, divinyl benzyl ether resins, polyarylate resins, diallyl phthalate resins, benzoxazine resins, benzoxazole resins, bismaleimide resins, and acrylate resins.
  • a resin film (B-staged product / B-stage film) is obtained by molding the resin composition described above into a film.
  • the resin material is preferably a resin film.
  • the resin film is preferably a B stage film.
  • the resin material is preferably a thermosetting material.
  • Examples of a method for forming a resin composition into a film to obtain a resin film include the following methods.
  • An extrusion molding method in which a resin composition is melt-kneaded and extruded using an extruder, and then molded into a film shape by a T die or a circular die.
  • a casting molding method in which a resin composition containing a solvent is cast to form a film.
  • Other known film forming methods The extrusion molding method or the casting molding method is preferable because it can cope with the reduction in thickness.
  • the film includes a sheet.
  • a resin film that is a B-stage film can be obtained by forming the resin composition into a film and drying it by heating, for example, at 50 ° C. to 150 ° C. for 1 to 10 minutes so that curing by heat does not proceed excessively. it can.
  • the film-like resin composition that can be obtained by the drying process as described above is referred to as a B-stage film.
  • the B-stage film is in a semi-cured state.
  • the semi-cured product is not completely cured and curing can proceed further.
  • the resin film may not be a prepreg.
  • migration does not occur along the glass cloth or the like.
  • laminating or precuring the resin film the surface is not uneven due to the glass cloth.
  • the said resin film can be used with the form of a laminated film provided with metal foil or a base material, and the resin film laminated
  • the metal foil is preferably a copper foil.
  • Examples of the substrate of the laminated film include polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide resin film.
  • the surface of the base material may be subjected to a release treatment as necessary.
  • the thickness of the resin film is preferably 5 ⁇ m or more, and preferably 200 ⁇ m or less.
  • the thickness of the insulating layer formed with the said resin film is more than the thickness of the conductor layer (metal layer) which forms a circuit.
  • the thickness of the insulating layer is preferably 5 ⁇ m or more, and preferably 200 ⁇ m or less.
  • the resin material is preferably used for forming a mold resin for embedding a semiconductor chip in a semiconductor device.
  • the resin material is suitably used for forming an insulating layer in a printed wiring board.
  • the printed wiring board can be obtained, for example, by heat-pressing the resin material.
  • a metal foil can be laminated on one side or both sides of the resin film.
  • the method for laminating the resin film and the metal foil is not particularly limited, and a known method can be used.
  • the resin film can be laminated on the metal foil using an apparatus such as a parallel plate press or a roll laminator while applying pressure while heating or without heating.
  • the resin material is suitably used for obtaining a copper clad laminate.
  • An example of the copper-clad laminate includes a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil.
  • the thickness of the copper foil of the copper clad laminate is not particularly limited.
  • the thickness of the copper foil is preferably in the range of 1 ⁇ m to 50 ⁇ m.
  • the copper foil in order to increase the adhesive strength between the cured product of the resin material and the copper foil, the copper foil preferably has fine irregularities on the surface.
  • the method for forming the unevenness is not particularly limited. Examples of the method for forming the unevenness include a formation method by treatment using a known chemical solution.
  • the resin material is preferably used for obtaining a multilayer substrate.
  • a multilayer substrate including a circuit substrate and an insulating layer stacked on the circuit substrate can be given.
  • the insulating layer of the multilayer substrate is formed of the resin material.
  • the insulating layer of the multilayer substrate may be formed of the resin film of the laminated film using a laminated film.
  • the insulating layer is preferably laminated on the surface of the circuit board on which the circuit is provided. Part of the insulating layer is preferably embedded between the circuits.
  • the surface of the insulating layer opposite to the surface on which the circuit substrate is laminated is roughened.
  • the roughening treatment method a conventionally known roughening treatment method can be used, and it is not particularly limited.
  • the surface of the insulating layer may be subjected to a swelling treatment before the roughening treatment.
  • the said multilayer substrate is further equipped with the copper plating layer laminated
  • the circuit board, the insulating layer laminated on the surface of the circuit board, and the surface of the insulating layer opposite to the surface on which the circuit board is laminated are laminated.
  • a multilayer substrate provided with copper foil is laminated.
  • the insulating layer is preferably formed by curing the resin film using a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil.
  • the copper foil is etched and is a copper circuit.
  • the multilayer substrate is a multilayer substrate including a circuit board and a plurality of insulating layers stacked on the surface of the circuit board. At least one of the plurality of insulating layers disposed on the circuit board is formed using the resin material. It is preferable that the multilayer substrate further includes a circuit laminated on at least one surface of the insulating layer formed using the resin film.
  • multilayer printed wiring boards are required to have a low dielectric loss tangent and to have high insulation reliability due to an insulating layer.
  • the resin material according to the present invention it is possible to effectively increase the insulation reliability by reducing the dielectric loss tangent and enhancing the adhesion between the insulating layer and the metal layer and the etching performance. Therefore, the resin material according to the present invention is suitably used for forming an insulating layer in a multilayer printed wiring board.
  • the multilayer printed wiring board includes, for example, a circuit board, a plurality of insulating layers arranged on the surface of the circuit board, and a metal layer arranged between the plurality of insulating layers. At least one of the insulating layers is a cured product of the resin material.
  • FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention.
  • a plurality of insulating layers 13 to 16 are laminated on the upper surface 12 a of the circuit board 12.
  • the insulating layers 13 to 16 are cured product layers.
  • a metal layer 17 is formed in a partial region of the upper surface 12 a of the circuit board 12.
  • the metal layer 17 is formed in a part of the upper surface of the insulating layers 13 to 15 other than the insulating layer 16 located on the outer surface opposite to the circuit board 12 side.
  • the metal layer 17 is a circuit.
  • Metal layers 17 are respectively arranged between the circuit board 12 and the insulating layer 13 and between the stacked insulating layers 13 to 16.
  • the lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of via hole connection and through hole connection (not shown).
  • the insulating layers 13 to 16 are formed of a cured product of the resin material.
  • fine holes are formed on the surfaces of the insulating layers 13 to 16.
  • the metal layer 17 reaches the inside of the fine hole.
  • the width direction dimension (L) of the metal layer 17 and the width direction dimension (S) of the part in which the metal layer 17 is not formed can be made small.
  • good insulation reliability is imparted between an upper metal layer and a lower metal layer that are not connected by via-hole connection and through-hole connection (not shown).
  • the resin material is preferably used in order to obtain a cured product that is roughened or desmeared.
  • the cured product includes a precured product that can be further cured.
  • the cured product is preferably roughened.
  • the cured product Prior to the roughening treatment, the cured product is preferably subjected to a swelling treatment.
  • the cured product is preferably subjected to a swelling treatment after preliminary curing and before the roughening treatment, and is further cured after the roughening treatment.
  • the cured product is not necessarily subjected to the swelling treatment.
  • the swelling treatment for example, a method of treating a cured product with an aqueous solution or an organic solvent dispersion of a compound mainly composed of ethylene glycol or the like is used.
  • the swelling liquid used for the swelling treatment generally contains an alkali as a pH adjuster or the like.
  • the swelling liquid preferably contains sodium hydroxide.
  • the swelling treatment is carried out by treating the cured product with a 40 wt% ethylene glycol aqueous solution at a treatment temperature of 30 ° C. to 85 ° C. for 1 minute to 30 minutes.
  • the swelling treatment temperature is preferably in the range of 50 ° C to 85 ° C. When the temperature of the swelling treatment is too low, it takes a long time for the swelling treatment, and the adhesive strength between the cured product and the metal layer tends to be low.
  • a chemical oxidizing agent such as a manganese compound, a chromium compound, or a persulfuric acid compound is used.
  • These chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added.
  • the roughening liquid used for the roughening treatment generally contains an alkali as a pH adjuster or the like.
  • the roughening solution preferably contains sodium hydroxide.
  • Examples of the manganese compound include potassium permanganate and sodium permanganate.
  • Examples of the chromium compound include potassium dichromate and anhydrous potassium chromate.
  • Examples of the persulfate compound include sodium persulfate, potassium persulfate, and ammonium persulfate.
  • the arithmetic average roughness Ra of the surface of the cured product is preferably 10 nm or more, preferably less than 300 nm, more preferably less than 200 nm, and even more preferably less than 150 nm.
  • the adhesive strength between the cured product and the metal layer is increased, and further finer wiring is formed on the surface of the insulating layer. Furthermore, conductor loss can be suppressed and signal loss can be suppressed low.
  • the arithmetic average roughness Ra is measured in accordance with JIS B0601: 1994.
  • Through holes may be formed in a cured product obtained by precuring the resin material.
  • a via or a through hole is formed as a through hole.
  • the via can be formed by irradiation with a laser such as a CO 2 laser.
  • the diameter of the via is not particularly limited, but is about 60 ⁇ m to 80 ⁇ m. Due to the formation of the through hole, a smear, which is a resin residue derived from the resin component contained in the cured product, is often formed at the bottom of the via.
  • the surface of the cured product is preferably desmeared.
  • the desmear process may also serve as a roughening process.
  • a chemical oxidant such as a manganese compound, a chromium compound, or a persulfate compound is used in the same manner as the roughening treatment.
  • chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added.
  • the desmear treatment liquid used for the desmear treatment generally contains an alkali.
  • the desmear treatment liquid preferably contains sodium hydroxide.
  • the surface roughness of the surface of the cured product subjected to the desmear treatment is sufficiently reduced.
  • N-alkylbismaleimide compounds having a skeleton derived from dimer diamine N-alkyl bismaleimide compound 1 (designer Moleculars Inc. “BMI-1500”, number average molecular weight 1500) N-alkyl bismaleimide compound 2 (designer Moleculars Inc. “BMI-1700”, number average molecular weight 1700) N-alkyl bismaleimide compound 3 (designer Moleculars Inc. “BMI-3000”, number average molecular weight 3000) N-alkylbismaleimide compound 4 (“BMI-3000J”, number average molecular weight 5100, manufactured by Designer Molecules Inc.) N-alkylbismaleimide compound 5 (“BMI-3000J” manufactured by Designer Molecules Inc. was dissolved in a toluene solution, and then isopropanol was added to recover the precipitated polymer component (in the table, BMI-3000J treatment). And weight average molecular weight 15000)
  • N-alkylbenzoxazine compounds having a skeleton derived from dimer diamine N-alkylbenzoxazine compound (synthesized according to Synthesis Example 1 below)
  • N-phenylmaleimide compound (“BMI-2300” manufactured by Daiwa Kasei Kogyo Co., Ltd.) N-phenylmaleimide compound (“BMI-4000” manufactured by Daiwa Kasei Kogyo Co., Ltd.)
  • Silica-containing slurry (silica 75 wt%: “SC4050-HOA” manufactured by Admatechs, average particle size 1.0 ⁇ m, aminosilane treatment, cyclohexanone 25 wt%)
  • Component X Cyanate ester compound-containing liquid (Lonza Japan “BA-3000S”, solid content 75% by weight) Liquid containing active ester compound 1 (“EXB-9416-70BK” manufactured by DIC, solid content: 70% by weight) Liquid containing active ester compound 2 (“HPC-8000L” manufactured by DIC, solid content 65% by weight) Liquid containing active ester compound 3 (“HPC-8150” manufactured by DIC, solid content: 62% by weight) Phenol compound-containing liquid (DIC's “LA-1356”, solid content 60% by weight) Carbodiimide compound-containing liquid (Nisshinbo Chemical "V-03", solid content 50 wt%)
  • DMAP Dimethylaminopyridine
  • DMAP Dimethylaminopyridine
  • 2-Phenyl-4-methylimidazole 2P4MZ
  • 2-Ethyl-4-methylimidazole 2E4MZ” manufactured by Shikoku Chemicals
  • Park Mill D manufactured by NOF Corporation
  • Polyimide compound (polyimide resin) (A polyimide compound-containing solution (nonvolatile content: 26.8% by weight) which is a reaction product of tetracarboxylic dianhydride and dimer diamine is synthesized according to Synthesis Example 2 below) Phenoxy resin (Mitsubishi Chemical "YX6954BH30")
  • the molecular weight of the polyimide compound synthesized in Synthesis Example 2 was determined as follows.
  • GPC gel permeation chromatography
  • Examples 1 to 15 and Comparative Examples 1 to 3 The components shown in the following Tables 1 to 3 were blended in the blending amounts shown in the following Tables 1 to 3, and stirred at room temperature until a uniform solution was obtained, to obtain a resin material.
  • the resin film (B-stage film) side of the laminated film is placed on the copper-clad laminate. And laminated to obtain a laminated structure.
  • the laminating conditions were such that the pressure was reduced to 30 hPa or less by reducing the pressure for 30 seconds, and then pressing was performed at 100 ° C. and a pressure of 0.4 MPa for 30 seconds.
  • Copper foil pasting process The shiny surface of the copper foil (thickness 35 ⁇ m, manufactured by Mitsui Kinzoku Co., Ltd.) was subjected to Cz treatment (“Cz8101” manufactured by MEC), and the copper foil surface was etched by about 1 ⁇ m. An etched copper foil was bonded to the laminated structure from which the PET film was peeled to obtain a substrate with a copper foil. The obtained substrate with copper foil was heat-treated at 190 ° C. for 90 minutes in a gear oven to obtain an evaluation sample.
  • a double-sided copper-clad laminate (thickness 0.2 mm, “MCL-E-679FGR” manufactured by Hitachi Chemical Co., Ltd.) was prepared. Using a “batch type vacuum laminator MVLP-500-IIA” manufactured by Meiki Seisakusho, the resin film (B stage film) side of the laminated film is laminated on the copper-clad laminate on both sides of this double-sided copper-clad laminate. Lamination was performed to obtain a laminated structure. The laminating conditions were such that the pressure was reduced to 30 hPa or less by reducing the pressure for 30 seconds, and then pressing was performed at 100 ° C. and a pressure of 0.4 MPa for 30 seconds.
  • Lamination process The obtained resin film having a thickness of 40 ⁇ m was further pasted twice on both surfaces of the laminated structure, and a laminated sample in which a resin film having a total thickness of 120 ⁇ m was laminated on one side of the double-sided copper-clad laminate was produced.
  • Curing process The obtained laminated sample was heat-treated at 190 ° C. for 90 minutes in a gear oven to obtain an evaluation sample.
  • the obtained evaluation sample was cut into a length of 135 mm and a width of 13 mm. Next, the cut out evaluation sample was fixed with a clamp, and a resin film was burned by holding a flame of a gas burner under the evaluation sample. The time until the flame burned on the resin film disappeared was measured.
  • the laminating conditions were such that the pressure was reduced to 30 hPa or less by reducing the pressure for 30 seconds, and then pressing was performed at 100 ° C. and a pressure of 0.4 MPa for 30 seconds. Then, it heated at 180 degreeC for 30 minute (s), and the resin film was semi-hardened. Thus, the laminated body by which the semi-cured material of the resin film was laminated
  • Ra is less than 50 nm ⁇ : Ra is 50 nm or more and less than 200 nm X: Ra is 200 nm or more
  • Electroless plating treatment (4) The surface of the roughened cured product obtained by the evaluation of the surface roughness was treated with a 60 ° C. alkali cleaner (“Cleaner Securigant 902” manufactured by Atotech Japan) for 5 minutes and degreased and washed. After washing, the cured product was treated with a 25 ° C. pre-dip solution (“Pre-Dip Neogant B” manufactured by Atotech Japan) for 2 minutes. Thereafter, the cured product was treated with an activator solution at 40 ° C. (“Activator Neo Gantt 834” manufactured by Atotech Japan) for 5 minutes to attach a palladium catalyst. Next, the cured product was treated with a reducing solution at 30 ° C. (“Reducer Neogant WA” manufactured by Atotech Japan) for 5 minutes.
  • a 60 ° C. alkali cleaner (“Cleaner Securigant 902” manufactured by Atotech Japan) for 5 minutes and degreased and washed. After washing, the cured
  • the cured product is placed in a chemical copper solution (“Basic Print Gantt MSK-DK”, “Copper Print Gantt MSK”, “Stabilizer Print Gantt MSK”, and “Reducer Cu” manufactured by Atotech Japan Co.) was carried out until the plating thickness reached about 0.5 ⁇ m.
  • a chemical copper solution (“Basic Print Gantt MSK-DK”, “Copper Print Gantt MSK”, “Stabilizer Print Gantt MSK”, and “Reducer Cu” manufactured by Atotech Japan Co.) was carried out until the plating thickness reached about 0.5 ⁇ m.
  • annealing was performed at a temperature of 120 ° C. for 30 minutes in order to remove the remaining hydrogen gas.
  • all processes up to the electroless plating process were performed while setting the treatment liquid to 2 L on a beaker scale and swinging the cured product.
  • Electroplating treatment Next, electrolytic plating was performed on the cured product that had been subjected to electroless plating until the plating thickness reached 25 ⁇ m.
  • a copper sulfate solution (“copper sulfate pentahydrate” manufactured by Wako Pure Chemical Industries, Ltd., “sulfuric acid” manufactured by Wako Pure Chemical Industries, Ltd., “basic leveler kaparaside HL” manufactured by Atotech Japan Co., Ltd., “ using the correction agent Cupracid GS "), plating thickness passing a current of 0.6 a / cm 2 was carried out electrolytic plating until approximately 25 [mu] m.
  • the cured product was heated at 190 ° C. for 90 minutes to further cure the cured product.
  • stacked on the upper surface was obtained.
  • a strip-shaped cut having a width of 0.5 cm was made on the surface of the copper plating layer of the cured product obtained by laminating the obtained copper plating layer on the upper surface.
  • ⁇ The number of occurrences of cracks or cracks is less than 3 times during 10 times.
  • ⁇ The number of occurrences of cracks or cracks in 10 times is 3 times or more and less than 6 times.
  • X The number of times that cracks or cracks occurred in 10 times is 6 times or more
  • the resin film side of the obtained laminated film is overlaid on the evaluation substrate, and a “batch type vacuum laminator MVLP-500-IIA” manufactured by Meiki Seisakusho Co., Ltd. is used for 20 seconds at a laminating pressure of 0.4 MPa, and a pressing pressure of 0.8 MPa. For 20 seconds at a laminating and pressing temperature of 90 ° C. After cooling at room temperature, the PET film was peeled off. Thus, the evaluation sample by which the resin film was laminated
  • the void was observed in the hollow using the optical microscope.
  • the embedding property with respect to the uneven surface was determined according to the following criteria.
  • compositions and results are shown in Tables 1 to 3 below.
  • content of each component is described as a pure amount (part by weight of solid content).
  • Multilayer printed wiring board 12 ... Circuit board 12a ... Upper surface 13-16 ... Insulating layer 17 ... metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne un matériau de résine qui peut 1) réduire la tangente de perte diélectrique d'un produit durci, 2) augmenter l'adhérence entre une couche d'isolation et une couche métallique, 3) augmenter la résistance au pelage plaqué, 4) augmenter l'ininflammabilité du produit durci et 5) maintenir la température de durcissement basse. Le matériau de résine selon l'invention contient un composé N-alkyle bismaléimide ayant un squelette dérivé de diamines dimères ou un composé N-alkyle benzoxazine ayant un squelette dérivé de diamines dimères, un composé époxy, un matériau de charge inorganique et un agent de durcissement contenant un composant spécifique, le rapport en poids de la teneur du composé N-alkyle bismaléimide ayant un squelette dérivé de diamines dimères ou du composé N-alkyle benzoxazine ayant un squelette dérivé de diamines dimères à la teneur totale du composé époxy et de l'agent de durcissement est de 0,05 à 0,75. <u /> <u />
PCT/JP2019/013365 2018-03-28 2019-03-27 Matériau de résine et carte de câblage imprimée multicouche WO2019189466A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980018755.5A CN111836843A (zh) 2018-03-28 2019-03-27 树脂材料及多层印刷布线板
JP2019518316A JP6660513B1 (ja) 2018-03-28 2019-03-27 樹脂材料及び多層プリント配線板
KR1020207027404A KR20200138227A (ko) 2018-03-28 2019-03-27 수지 재료 및 다층 프린트 배선판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018062912 2018-03-28
JP2018-062912 2018-03-28

Publications (1)

Publication Number Publication Date
WO2019189466A1 true WO2019189466A1 (fr) 2019-10-03

Family

ID=68062124

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/013365 WO2019189466A1 (fr) 2018-03-28 2019-03-27 Matériau de résine et carte de câblage imprimée multicouche

Country Status (5)

Country Link
JP (1) JP6660513B1 (fr)
KR (1) KR20200138227A (fr)
CN (1) CN111836843A (fr)
TW (1) TWI804597B (fr)
WO (1) WO2019189466A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019182932A (ja) * 2018-04-03 2019-10-24 積水化学工業株式会社 硬化性樹脂組成物及び積層体
JP2020084108A (ja) * 2018-11-29 2020-06-04 信越化学工業株式会社 エポキシ樹脂組成物、並びに該樹脂組成物を用いて製造された接着フィルム、プリプレグ、多層プリント配線板、及び半導体装置
JP2020094212A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
WO2020196070A1 (fr) * 2019-03-22 2020-10-01 リンテック株式会社 Feuille de résine
JP2020196789A (ja) * 2019-05-31 2020-12-10 昭和電工マテリアルズ株式会社 接着剤組成物、積層体及び接着シート
JP2021084968A (ja) * 2019-11-28 2021-06-03 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
KR102287525B1 (ko) * 2020-03-19 2021-08-09 (주)호전에이블 내열성 및 신축성이 우수한 연성 인쇄회로기판용 절연 수지 조성물
JP2021123687A (ja) * 2020-02-07 2021-08-30 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2021123689A (ja) * 2020-02-07 2021-08-30 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2021123688A (ja) * 2020-02-07 2021-08-30 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
US20210269641A1 (en) * 2021-03-15 2021-09-02 Chin Yee Chemical Industries Co.,Ltd. Thermosetting resin compositions, flame-retardant resin compositions, liquid packaging material and its use, and film and its use

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014001289A (ja) * 2012-06-18 2014-01-09 Nippon Steel & Sumikin Chemical Co Ltd 半導体封止用樹脂組成物
WO2016114286A1 (fr) * 2015-01-13 2016-07-21 日立化成株式会社 Composition de résine, support avec couche de résine, préimprégné, stratifié, carte de circuit imprimé multicouche, et carte de circuit imprimé pour radar à ondes millimétriques
JP2016196557A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
WO2017027482A1 (fr) * 2015-08-08 2017-02-16 Designer Molecules, Inc. Compositions durcissables anioniques
WO2018062404A1 (fr) * 2016-09-29 2018-04-05 積水化学工業株式会社 Matériau isolant intercouche et carte de circuit imprimé multicouche
JP2019035051A (ja) * 2017-08-21 2019-03-07 味の素株式会社 樹脂組成物
JP2019044180A (ja) * 2017-09-04 2019-03-22 味の素株式会社 樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540984B2 (ja) * 2010-08-11 2014-07-02 味の素株式会社 積層板の製造方法
WO2012105558A1 (fr) * 2011-02-01 2012-08-09 Dic株式会社 Composition de résine thermodurcissable, produit durci de ladite composition et feuille adhésive intermédiaire pour carte de circuits imprimés
CN104093764B (zh) * 2012-01-31 2018-06-08 三菱瓦斯化学株式会社 印刷电路板材料用树脂组合物、以及使用了其的预浸料、树脂片、覆金属箔层叠板和印刷电路板
SG11201509490PA (en) * 2013-06-03 2015-12-30 Mitsubishi Gas Chemical Co Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
JP6756107B2 (ja) * 2015-01-13 2020-09-16 日立化成株式会社 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、高多層用金属張積層板及び高多層印刷配線板
US20180051126A1 (en) * 2015-03-31 2018-02-22 Namics Corporation Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
US10294324B2 (en) * 2015-03-31 2019-05-21 Namics Corporation Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
KR20170023719A (ko) * 2015-08-24 2017-03-06 신에쓰 가가꾸 고교 가부시끼가이샤 열경화성 수지 조성물
CN107849336B (zh) * 2015-09-30 2023-11-10 积水化学工业株式会社 树脂组合物及多层基板
JPWO2017170643A1 (ja) * 2016-03-31 2019-02-07 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、金属張積層板、樹脂基板、プリント配線基板および半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014001289A (ja) * 2012-06-18 2014-01-09 Nippon Steel & Sumikin Chemical Co Ltd 半導体封止用樹脂組成物
WO2016114286A1 (fr) * 2015-01-13 2016-07-21 日立化成株式会社 Composition de résine, support avec couche de résine, préimprégné, stratifié, carte de circuit imprimé multicouche, et carte de circuit imprimé pour radar à ondes millimétriques
JP2016196557A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
WO2017027482A1 (fr) * 2015-08-08 2017-02-16 Designer Molecules, Inc. Compositions durcissables anioniques
WO2018062404A1 (fr) * 2016-09-29 2018-04-05 積水化学工業株式会社 Matériau isolant intercouche et carte de circuit imprimé multicouche
JP2019035051A (ja) * 2017-08-21 2019-03-07 味の素株式会社 樹脂組成物
JP2019044180A (ja) * 2017-09-04 2019-03-22 味の素株式会社 樹脂組成物

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019182932A (ja) * 2018-04-03 2019-10-24 積水化学工業株式会社 硬化性樹脂組成物及び積層体
JP2020084108A (ja) * 2018-11-29 2020-06-04 信越化学工業株式会社 エポキシ樹脂組成物、並びに該樹脂組成物を用いて製造された接着フィルム、プリプレグ、多層プリント配線板、及び半導体装置
JP2020094212A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
WO2020196070A1 (fr) * 2019-03-22 2020-10-01 リンテック株式会社 Feuille de résine
JP2020196789A (ja) * 2019-05-31 2020-12-10 昭和電工マテリアルズ株式会社 接着剤組成物、積層体及び接着シート
JP7434727B2 (ja) 2019-05-31 2024-02-21 株式会社レゾナック 接着剤組成物、積層体及び接着シート
JP2021084968A (ja) * 2019-11-28 2021-06-03 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
JP2021123689A (ja) * 2020-02-07 2021-08-30 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2021123687A (ja) * 2020-02-07 2021-08-30 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2021123688A (ja) * 2020-02-07 2021-08-30 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP7112439B2 (ja) 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP7112438B2 (ja) 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP7112440B2 (ja) 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2022159324A (ja) * 2020-02-07 2022-10-17 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2022159323A (ja) * 2020-02-07 2022-10-17 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
JP2022163079A (ja) * 2020-02-07 2022-10-25 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板
KR102287525B1 (ko) * 2020-03-19 2021-08-09 (주)호전에이블 내열성 및 신축성이 우수한 연성 인쇄회로기판용 절연 수지 조성물
US20210269641A1 (en) * 2021-03-15 2021-09-02 Chin Yee Chemical Industries Co.,Ltd. Thermosetting resin compositions, flame-retardant resin compositions, liquid packaging material and its use, and film and its use
US11987701B2 (en) * 2021-03-15 2024-05-21 Chin Yee Chemical Industries Co., Ltd. Thermosetting resin compositions, liquid packaging material, film, semiconductor package, interlayer insulating film, and flame-retardant resin composition

Also Published As

Publication number Publication date
CN111836843A (zh) 2020-10-27
TWI804597B (zh) 2023-06-11
JPWO2019189466A1 (ja) 2020-04-30
JP6660513B1 (ja) 2020-03-11
KR20200138227A (ko) 2020-12-09
TW201945469A (zh) 2019-12-01

Similar Documents

Publication Publication Date Title
JP6660513B1 (ja) 樹脂材料及び多層プリント配線板
JP6805338B2 (ja) 樹脂材料、積層構造体及び多層プリント配線板
JP7332479B2 (ja) 樹脂材料、積層構造体及び多層プリント配線板
JP2023156362A (ja) 樹脂材料、積層フィルム及び多層プリント配線板
JP2019173009A (ja) 硬化体、樹脂材料及び多層プリント配線板
WO2021182207A1 (fr) Matériau de résine et carte de circuit imprimé multicouche
WO2019240083A1 (fr) Matériau de résine et circuit imprimé multicouche
JP2022161968A (ja) 樹脂材料及び多層プリント配線板
JP2020094089A (ja) 樹脂材料及び多層プリント配線板
JP7437215B2 (ja) 樹脂材料及び多層プリント配線板
JP7112438B2 (ja) 硬化体、ｂステージフィルム及び多層プリント配線板
JP7027382B2 (ja) 樹脂フィルム及び多層プリント配線板
JP7254528B2 (ja) 樹脂材料及び多層プリント配線板
JP7112439B2 (ja) 硬化体、ｂステージフィルム及び多層プリント配線板
JP7411544B2 (ja) 樹脂材料及び多層プリント配線板
JP7112440B2 (ja) 硬化体、ｂステージフィルム及び多層プリント配線板
JP7305326B2 (ja) 樹脂材料及び多層プリント配線板
WO2022234823A1 (fr) Matériau de résine et carte de circuit imprimé multicouche
JP7226954B2 (ja) 樹脂材料及び多層プリント配線板
JP2022134490A (ja) 樹脂材料及び多層プリント配線板
JP2022134491A (ja) 樹脂材料及び多層プリント配線板
JP2021155602A (ja) 樹脂材料及び多層プリント配線板
JP2020036010A (ja) 多層プリント配線板の製造方法、樹脂フィルム及び多層プリント配線板

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2019518316

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19777429

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19777429

Country of ref document: EP

Kind code of ref document: A1