WO2019188837A1 - 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 - Google Patents
表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 Download PDFInfo
- Publication number
- WO2019188837A1 WO2019188837A1 PCT/JP2019/012236 JP2019012236W WO2019188837A1 WO 2019188837 A1 WO2019188837 A1 WO 2019188837A1 JP 2019012236 W JP2019012236 W JP 2019012236W WO 2019188837 A1 WO2019188837 A1 WO 2019188837A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- layer
- less
- treated copper
- treated
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Definitions
- the present invention relates to a method for producing a surface-treated copper foil, a copper clad laminate, and a printed wiring board.
- copper foil is widely used in the form of a copper clad laminate laminated with an insulating resin base material.
- the copper foil and the insulating resin base material have a high adhesive force in order to prevent the wiring from peeling off during the production of the printed wiring board. Therefore, in ordinary copper foil for printed wiring board production, roughening treatment is applied to the laminated surface of the copper foil to form irregularities made of fine copper particles, and these irregularities are cut into the interior of the insulating resin substrate by pressing. By improving the anchor effect, the adhesion is improved.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2008-285751 discloses a surface-treated copper foil in which the total amount of Zn and Ni on an adhesive surface bonded to an insulating resin substrate is 40 mg / m 2 or more. According to this copper foil, the surface of the copper foil can be sufficiently covered with a Zn—Ni alloy, so that it is possible to improve adhesion to an insulating resin substrate, chemical resistance, and the like.
- Patent Document 2 Japanese Patent Laid-Open No. 62-142389 discloses a copper foil for a printed circuit having a Ni—Mo layer. According to this copper foil, chemical resistance and heat resistance after circuit formation are disclosed. It is said to be excellent in properties.
- a printed wiring board suitable for high-frequency applications has been developed. It has been demanded.
- Such a high-frequency printed wiring board is desired to reduce transmission loss in order to enable transmission of high-frequency signals without degrading quality.
- a printed wiring board is provided with a copper foil processed into a wiring pattern and an insulating base material, but the transmission loss mainly consists of a conductor loss due to the copper foil and a dielectric loss due to the insulating base material. .
- a copper foil with small irregularities and an insulating base material with a low dielectric loss tangent could be used to reduce the conductor loss due to the copper foil and the dielectric loss due to the insulating base material.
- the above-mentioned anchor effect is weakened, resulting in a decrease in physical adhesion between the copper foil and the substrate, and particularly peel strength (peeling after chemical immersion or soldering process). Decrease in strength is a problem.
- an insulating base material having a low dielectric loss tangent generally has low functional group activity and low chemical adhesion to the copper foil.
- the surface of the insulating substrate that is in contact with the copper foil when the copper foil is removed by etching becomes flat.
- the adhesion between the substrate and the substrate with another insulating substrate laminated on the substrate surface is also reduced.
- a Ni—Mo layer as disclosed in Patent Document 2 is used as a copper foil anti-rust treatment layer, a residue derived from the Ni—Mo layer remains on the surface of the insulating substrate after the copper foil etching, There is a problem in that the adhesion force is further reduced by preventing the resin from adhering to another insulating substrate laminated on the surface of the insulating substrate.
- the present inventors have recently adopted a Zn—Ni—Mo layer having a predetermined composition as a rust-proofing layer, so that the adhesiveness with the resin, chemical resistance and heat resistance are excellent, and etching residues are hardly left. Therefore, when used in the production of printed wiring boards, it is possible to provide a surface-treated copper foil capable of improving the adhesion reliability of both the copper foil-base material and the base material-base material. Obtained knowledge.
- the object of the present invention is to provide excellent adhesion to the resin, chemical resistance and heat resistance, and hardly leave etching residues. Therefore, when used in the production of printed wiring boards, the copper foil-substrate It is another object of the present invention to provide a surface-treated copper foil capable of improving the adhesion reliability of both the substrate and the substrate.
- a copper foil Provided on at least one surface of the copper foil, the Zn adhesion amount is 3 mg / m 2 or more and 100 mg / m 2 or less, the Ni adhesion amount is 5 mg / m 2 or more and 60 mg / m 2 or less, and the Mo adhesion amount is 2.0 mg / m 2.
- the surface-treated copper foil An insulating base provided on the at least one surface of the surface-treated copper foil; A copper clad laminate is provided.
- a method for manufacturing a printed wiring board wherein the printed wiring board is manufactured using the surface-treated copper foil or the copper-clad laminate.
- FIG. 10 is a process flow chart showing an evaluation sample preparation process (processes (a) to (d)) in the evaluation of adhesion between the substrate and the substrate in Examples 1 to 9.
- FIG. 10 is a process flow chart showing an evaluation sample preparation process (processes (a) to (d)) in the evaluation of adhesion between the substrate and the substrate in Examples 1 to 9.
- the “maximum height Sz” is a parameter representing the distance from the highest point to the lowest point on the surface, measured in accordance with ISO25178.
- the maximum height Sz can be calculated by measuring a surface profile of a predetermined measurement area (for example, a region of 22,500 ⁇ m 2 ) on the copper foil surface with a commercially available laser microscope.
- M adhesion amount (M is Zn, Ni or Mo) means the weight of M per unit area (mg in the anticorrosive layer (typically Zn—Ni—Mo layer)). / M 2 ).
- the M adhesion amount is calculated by dissolving a predetermined area on the surface of the copper foil having the antirust treatment layer with an acid, and analyzing the M concentration in the obtained solution based on the ICP emission analysis method. Can do.
- the “electrode surface” of the electrolytic copper foil refers to the surface on the side in contact with the cathode when the electrolytic copper foil was produced.
- the “deposition surface” of the electrolytic copper foil refers to the surface on the side where the electrolytic copper is deposited during the production of the electrolytic copper foil, that is, the surface not in contact with the cathode.
- the surface-treated copper foil of the present invention comprises a copper foil and a Zn—Ni—Mo layer provided on at least one surface of the copper foil. If desired, Zn—Ni—Mo layers may be provided on both sides of the copper foil.
- the Zn—Ni—Mo layer has a Zn deposition amount of 3 mg / m 2 to 100 mg / m 2 , a Ni deposition amount of 5 mg / m 2 to 60 mg / m 2 and a Mo deposition amount of 2.0 mg / m 2 to 40 mg. / M 2 or less.
- Ni / (Zn + Ni + Mo) which is the ratio of the Ni adhesion amount with respect to the total amount of Zn adhesion amount, Ni adhesion amount, and Mo adhesion amount is 0.40 or more and 0.80 or less.
- the conventional surface-treated copper foil subjected to rust prevention treatment when used in a printed wiring board, is always excellent in adhesion reliability between the copper foil and the base material and between the base material and the base material. It wasn't.
- a surface-treated copper foil provided with a Zn—Ni layer as disclosed in Patent Document 1 is inferior in heat resistance, and the peel strength after a soldering process or the like is lowered.
- the surface-treated copper foil of the present invention is provided with a Zn—Ni—Mo layer containing Zn, Ni, and Mo in a predetermined adhesion amount and adhesion ratio as a rust prevention treatment layer, thereby improving chemical resistance and heat resistance.
- the surface-treated copper foil of the present invention is excellent not only in the normal state of adhesion with respect to the adhesion between the copper foil and the substrate, but also in the adhesion after the soldering process or after the acid treatment, It becomes possible to exhibit stable and high adhesion.
- the Zn is a basic component that provides rust prevention performance, and is a metal that is inferior in heat resistance, although it has excellent solubility in a copper etching solution.
- the Zn adhesion amount in the Zn—Ni—Mo layer is 3 mg / m 2 or more and 100 mg / m 2 or less, preferably 3 mg / m 2 or more and 80 mg / m 2 or less, more preferably 4 mg / m 2 or more and 50 mg. / M 2 or less, more preferably 5 mg / m 2 or more and 30 mg / m 2 or less.
- the solubility of the Zn—Ni—Mo layer with respect to the copper etchant can be improved and a residue can be effectively prevented while ensuring the desired heat resistance.
- Ni is a metal that is excellent in chemical resistance and heat resistance, but is hardly dissolved in a copper etching solution.
- the amount of Ni deposited on the Zn—Ni—Mo layer is 5 mg / m 2 or more and 60 mg / m 2 or less, preferably 10 mg / m 2 or more and 50 mg / m 2 or less, more preferably 15 mg / m 2 or more and 30 mg. / M 2 or less.
- the chemical resistance and heat resistance of the copper foil are improved while ensuring excellent solubility of the Zn-Ni-Mo layer during etching of the copper foil, and after chemical immersion or soldering It is possible to effectively prevent a decrease in adhesion with the insulating base material after the process.
- the amount of Mo deposited on the Zn—Ni—Mo layer is 2.0 mg / m 2 or more and 40 mg / m 2 or less, preferably 2.0 mg / m 2 or more and 20 mg / m 2 or less, more preferably 2. It is 2 mg / m 2 or more and 10 mg / m 2 or less. Within such a range, Cu diffusion can be effectively prevented while ensuring excellent solubility of the Zn—Ni—Mo layer during copper foil etching. As a result, the heat resistance of the copper foil is improved, and it is possible to effectively prevent a decrease in adhesion with the insulating base material after the soldering process.
- Ni / (Zn + Ni + Mo) which is the ratio of the Ni adhesion amount to the total amount of Zn adhesion amount, Ni adhesion amount and Mo adhesion amount, is 0.40 or more and 0.80 or less, preferably 0.45 or more and 0.75 or less, More preferably, it is 0.50 or more and 0.65 or less. Within such a range, while ensuring good chemical resistance and heat resistance of the copper foil, it also ensures good solubility of the Zn-Ni-Mo layer in the copper etching solution, and residues during the copper foil etching Can be effectively prevented.
- the Zn—Ni—Mo layer may be a layer containing Zn, Ni and Mo (preferably an alloy layer). Further, the Zn adhesion amount in the Zn—Ni—Mo layer may be adjusted as appropriate by providing a Zn layer on the surface of the Zn—Ni—Mo layer.
- the surface-treated copper foil preferably further includes a roughened layer composed of a plurality of roughened particles between the copper foil and the Zn—Ni—Mo layer.
- the thickness of the roughened layer is preferably 0.01 ⁇ m or more and 0.50 ⁇ m or less, and more preferably 0.05 ⁇ m or more and 0.30 ⁇ m or less.
- the maximum height Sz of the surface on the Zn—Ni—Mo layer side is preferably 7.0 ⁇ m or less, more preferably 1.0 ⁇ m or more. 7.0 ⁇ m or less. Within such a range, it becomes more suitable for fine pitch circuit formation and high frequency applications. In particular, such low roughness reduces the skin effect of copper foil, which is a problem in high-frequency signal transmission, and reduces conductor loss due to copper foil, thereby significantly reducing high-frequency signal transmission loss. can do.
- the surface-treated copper foil preferably further includes a chromate layer or a silane coupling agent layer on the surface of the Zn—Ni—Mo layer, and more preferably includes both a chromate layer and a silane coupling agent layer.
- a chromate layer and / or a silane coupling agent layer By further providing a chromate layer and / or a silane coupling agent layer, rust prevention, moisture resistance, and chemical resistance are improved, and in addition to the Zn-Ni-Mo layer, adhesion to an insulating substrate is achieved. Can also be improved.
- the thickness of the surface-treated copper foil is not particularly limited, but is preferably 0.1 ⁇ m or more and 105 ⁇ m or less, and more preferably 0.5 ⁇ m or more and 70 ⁇ m or less.
- the surface-treated copper foil is not limited to one having a Zn—Ni—Mo layer on the surface of a normal copper foil, but one having a Zn—Ni—Mo layer on the copper foil surface of a copper foil with a carrier. Also good.
- This preferable manufacturing method includes preparing a copper foil and subjecting the copper foil to a surface treatment using a solution containing Zn, Ni, and Mo.
- the surface-treated copper foil according to the present invention is not limited to the method described below, and may be manufactured by any method.
- copper foil used for manufacture of surface treatment copper foil use of both electrolytic copper foil and rolled copper foil is possible, More preferably, it is electrolytic copper foil. Further, the copper foil may be a non-roughened copper foil or a pre-roughened copper foil. Although the thickness of copper foil is not specifically limited, 0.1 micrometer or more and 105 micrometers or less are preferable, More preferably, they are 0.5 micrometer or more and 70 micrometers or less.
- the copper foil is prepared in the form of a copper foil with a carrier
- the copper foil is prepared by a wet film formation method such as an electroless copper plating method and an electrolytic copper plating method, a dry film formation method such as sputtering and chemical vapor deposition, or It may be formed by a combination thereof.
- the surface of the copper foil to be roughened preferably has a maximum height Sz measured in accordance with ISO25178 of 2.0 ⁇ m or less, more preferably. Is 1.5 ⁇ m or less, more preferably 1.0 ⁇ m or less. Within the above range, it becomes easy to realize a surface profile in which Sz is desirably low on the surface of the surface-treated copper foil.
- the lower limit value of Sz is not particularly limited, but is typically 0.1 ⁇ m or more.
- the surface of the copper foil subjected to the roughening treatment may be either an electrode surface or a deposition surface, and is not particularly limited.
- the roughening treatment is performed in a copper sulfate solution containing a copper concentration of 4 g / L or more and 25 g / L or less and a sulfuric acid concentration of 50 g / L or more and 300 g / L or less at a temperature of 20 ° C. or more and 60 ° C. or less and 10 A / dm 2 or more and 100 A.
- the electrolytic deposition is preferably performed at / dm 2 or less, and the electrolytic deposition is preferably performed for 1 second or more and 20 seconds or less.
- the roughening treatment is a known plating process including at least two types of plating processes including a baking plating process for depositing and attaching fine copper grains on the copper foil and a covering plating process for preventing the fine copper grains from falling off. You may carry out according to the method.
- the baking plating step is electrolytic deposition under the above-described roughening treatment conditions.
- the covering plating step is performed at a temperature of 40 ° C. to 60 ° C.
- the electrolytic deposition is preferably performed at 70 A / dm 2 or less, and the electrolytic deposition is preferably performed for 1 second or more and 20 seconds or less.
- the copper foil is subjected to a rust prevention treatment to form a Zn—Ni—Mo layer.
- a rust prevention treatment When performing a roughening treatment on the copper foil, it is preferable to carry out a rust prevention treatment on the copper foil surface on the side where at least the roughening layer is present, and more preferably, a rust prevention treatment is carried out on both sides of the copper foil.
- the rust prevention treatment preferably includes a plating treatment using Zn, Ni and Mo. This plating process may be performed using a plating solution containing Zn, Ni, and Mo.
- Plating treatment is preferably performed using a pyrophosphate bath, and for example, it can be preferably performed using potassium pyrophosphate having a concentration of 50 g / L to 150 g / L.
- the Zn source of the plating solution it is preferable to use zinc pyrophosphate, zinc sulfate or the like, and the Zn concentration in the plating solution is preferably 0.1 g / L or more and 10 g / L or less, more preferably 1 g / L or more and 5 g / L. It is as follows.
- the Ni source of the plating solution nickel sulfate, nickel chloride, nickel acetate or the like is preferably used.
- the Ni concentration in the plating solution is preferably 0.1 g / L or more and 10 g / L or less, more preferably 1 g / L or more and 5 g. / L or less.
- the Mo source of the plating solution it is preferable to use sodium molybdate, potassium molybdate, ammonium molybdate, etc., and the Mo concentration in the plating solution is preferably 0.1 g / L or more and 10 g / L or less, more preferably 0.00. 5 g / L or more and 5 g / L or less. It is preferable to perform electrolysis at a temperature of 20 ° C. or more and 50 ° C. or less using a plating solution within the above range at 0.1 A / dm 2 or more and 5.0 A / dm 2 or less. It is preferable to do the following.
- Chromate treatment It is preferable to chromate the copper foil that has been rust-proofed to form a chromate layer. Chromate treatment following chromic acid concentration 0.5 g / L or more 8 g / L, pH 1 to 13, is preferably carried out the electrolysis at a current density of 0.1 A / dm 2 or more 10A / dm 2 or less, the electrolysis is 1 sec It is preferable to be performed for 30 seconds or less.
- Silane coupling agent treatment It is preferable that the copper foil is subjected to a silane coupling agent treatment to form a silane coupling agent layer.
- the silane coupling agent layer can be formed by appropriately diluting and applying a silane coupling agent and drying.
- silane coupling agents include epoxy-functional silane coupling agents such as 4-glycidylbutyltrimethoxysilane and 3-glycidoxypropyltrimethoxysilane, or 3-aminopropyltriethoxysilane, N-2 (amino Amino functions such as ethyl) 3-aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) butoxy) propyl-3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane Silane coupling agents, or mercapto-functional silane coupling agents such as 3-mercaptopropyltrimethoxysilane, or olefin-functional silane coupling agents such as vinyltrimethoxysilane and vinylphenyltrimethoxysilane, or 3-methacryloxypropyl Trime Acrylic-functional silane coupling agent such as Kishishiran, and imid
- the surface-treated copper foil of the present invention is preferably used for the production of a copper-clad laminate for printed wiring boards. That is, according to the preferable aspect of this invention, the copper clad laminated board provided with the said surface treatment copper foil and the insulation base material provided in the at least one surface of this surface treatment copper foil is provided.
- the surface-treated copper foil may be provided on one side of the insulating base material or may be provided on both sides.
- the dielectric loss tangent of the insulating base material is preferably 0.004 or less at a frequency of 10 GHz, and more preferably 0.003 or less.
- the insulating base material preferably contains an insulating resin.
- the insulating substrate is preferably a prepreg and / or a resin sheet.
- the prepreg is a general term for composite materials in which a base material such as a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, and paper is impregnated with a synthetic resin.
- the insulating resin impregnated in the prepreg include epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin and the like.
- insulating resin which comprises a resin sheet
- an epoxy resin, a polyimide resin, a polyester resin, etc. are mentioned.
- the insulating base material may contain filler particles made of various inorganic particles such as silica and alumina from the viewpoint of improving the insulating properties.
- the thickness of an insulating base material is not specifically limited, 1 to 1000 micrometers is preferable, More preferably, it is 2 to 400 micrometers, More preferably, it is 3 to 200 micrometers.
- the insulating substrate may be composed of a plurality of layers.
- An insulating base material such as a prepreg and / or a resin sheet may be provided on the surface-treated copper foil in advance through a primer resin layer applied to the surface of the copper foil.
- the surface-treated copper foil or copper clad laminate of the present invention is preferably used for production of a printed wiring board. That is, according to a preferred aspect of the present invention, a printed wiring board is produced using the surface-treated copper foil or the copper clad laminate described above, or the surface treatment described above. A printed wiring board obtained using a copper foil or the above copper-clad laminate is provided. By using the surface-treated copper foil or copper clad laminate of the present invention, as described above, a printed wiring board having excellent adhesion reliability both between the copper foil and the substrate and between the substrate and the substrate is provided. Can do.
- the printed wiring board according to this aspect includes a layer configuration in which an insulating base material and a copper layer are laminated in this order.
- the insulating substrate is as described above with respect to the copper-clad laminate.
- a known layer structure can be adopted for the printed wiring board.
- the printed wiring board include a single-sided or double-sided printed wiring board in which a circuit is formed on a laminated body obtained by bonding the surface-treated copper foil of the present invention to one side or both sides of a prepreg, and a multilayer in which these are multilayered.
- a printed wiring board etc. are mentioned.
- Other specific examples include a flexible printed wiring board, a COF, a TAB tape, and the like that form a circuit by forming the surface-treated copper foil of the present invention on a resin film.
- a resin-coated copper foil (RCC) obtained by applying the above-described insulating resin to the surface-treated copper foil of the present invention is formed, and the insulating resin is used as an insulating adhesive layer on the above-described printed wiring board.
- the surface-treated copper foil is used as a whole or part of the wiring layer, and the build-up wiring board and the surface-treated copper foil on which the circuit is formed by the modified semi-additive (MSAP) method, subtractive method, etc. are removed.
- MSAP modified semi-additive
- Examples thereof include a build-up wiring board in which a circuit is formed by a semi-additive (SAP) method, and a direct build-up on wafer in which the lamination of a copper foil with resin and circuit formation are alternately repeated on a semiconductor integrated circuit.
- SAP semi-additive
- the electrolytic copper foil is immersed in a copper sulfate solution having a copper concentration of 10 g / L and a sulfuric acid concentration of 100 g / L, and is subjected to a roughening treatment under the conditions of a liquid temperature of 30 ° C. and a current density of 40 A / dm 2. A roughened layer was formed.
- ⁇ Condition B (two-step plating)>
- the electrolytic copper foil was immersed in a copper sulfate solution having a copper concentration of 4 g / L and a sulfuric acid concentration of 200 g / L, and a first-stage roughening treatment was performed under the conditions of a liquid temperature of 30 ° C. and a current density of 30 A / dm 2 .
- a roughening treatment at the second stage it is immersed in a copper sulfate solution having a copper concentration of 69 g / L and a sulfuric acid concentration of 240 g / L, and is subjected to covering plating under conditions of a liquid temperature of 50 ° C. and a current density of 10 A / dm 2.
- a roughening layer was formed on the deposition surface side of the copper foil.
- the electrolytic copper foil after the above roughening treatment is subjected to a rust prevention treatment in one stage (Examples 1 to 7) or two stages (Examples 8 and 9) to form a roughened layer of the electrolytic copper foil.
- a Zn—Ni—Mo layer was formed on the formed surface.
- the first stage treatment includes pyrroline containing zinc pyrophosphate (Zn source), nickel sulfate (Ni source) and sodium molybdate (Mo source) at the Zn, Ni and Mo concentrations shown in Table 1.
- the electrolytic copper foil was immersed in a pyrophosphoric acid bath having a potassium acid concentration of 100 g / L, and Zn—Ni—Mo was electrodeposited at a liquid temperature of 40 ° C. and a current density and treatment time shown in Table 1.
- the electrolytic copper foil subjected to the first stage treatment is immersed in a pyrophosphoric acid bath containing zinc pyrophosphate (Zn source) at a Zn concentration shown in Table 1 and having a potassium pyrophosphate concentration of 145 g / L.
- Zn zinc pyrophosphate
- Chromate treatment was performed on both surfaces of the electrolytic copper foil subjected to the above rust prevention treatment to form a chromate layer on the Zn-Ni-Mo layer. This chromate treatment was performed under the conditions of a chromic acid concentration of 1 g / L, pH 11, a liquid temperature of 25 ° C., and a current density of 1 A / dm 2 .
- Silane Coupling Agent Treatment The copper foil on which the chromate layer was formed was washed with water, and then immediately treated with a silane coupling agent to form a silane coupling agent layer on the chromate layer on the roughened surface.
- a silane coupling agent treatment pure water is used as a solvent, a solution having a 3-aminopropyltrimethoxysilane concentration of 3 g / L is used, and this solution is sprayed onto the roughened surface by showering to perform an adsorption treatment. went. After the adsorption of the silane coupling agent, the water was finally evaporated by an electric heater to obtain a surface-treated copper foil having a thickness of 18 ⁇ m.
- Etching is performed on the both surfaces of the first copper-clad laminate 114 at a bath temperature of 50 ° C. using a cupric chloride etchant having an acid concentration of 3 mol / L, and the surface-treated copper foil 112 existing on both surfaces is dissolved and removed.
- an insulating base 110 ′ having the surface of the roughened surface of the surface-treated copper foil 112 transferred onto the surface was obtained (FIG. 1B).
- This etching was performed by performing the operation of passing the first copper-clad laminate 114 in an etching tank having a length of about 50 cm in 23 seconds (speed: 1.3 m / min) twice in total.
- an evaluation sample 120 was produced (FIG. 1D). Two test pieces having a size of 5 cm ⁇ 10 cm were cut out from the sample 120 for evaluation. These test pieces were put into a PCT (Pressure Cooker Test) tester and allowed to absorb moisture for 50 minutes under the conditions of 2 atm, 121 ° C. and 100% RH. The test piece after moisture absorption was taken out from the PCT tester, wiped off the water, and then solder dipped within 10 minutes after taking out.
- PCT Pressure Cooker Test
- This solder dip was performed by performing the operation of immersing the test piece in a solder bath at 288 ° C. for 20 seconds for a total of 20 times. After solder dipping, the presence or absence of blisters in the test piece (that is, a bubble-like gap caused by peeling between the base materials inside the laminate) was visually confirmed, and blistering occurred in at least one of the two test pieces. It was determined that there was a bulge. Moreover, the generated swelling was considered to be caused by the residue of the rust preventive layer remaining after the etching of the copper foil. The results were as shown in Table 2.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
前記銅箔の少なくとも一方の面に設けられ、Zn付着量が3mg/m2以上100mg/m2以下、Ni付着量が5mg/m2以上60mg/m2以下及びMo付着量が2.0mg/m2以上40mg/m2以下であり、かつ、前記Zn付着量、前記Ni付着量及び前記Mo付着量の合計量に対する前記Ni付着量の比率であるNi/(Zn+Ni+Mo)が0.40以上0.80以下である、Zn-Ni-Mo層と、
を備えた、表面処理銅箔が提供される。
前記表面処理銅箔の前記少なくとも一方の面に設けられる絶縁基材と、
を備えた、銅張積層板が提供される。
本発明を特定するために用いられる用語ないしパラメータの定義を以下に示す。
本発明の表面処理銅箔は、銅箔と、この銅箔の少なくとも一方の面に設けられるZn-Ni-Mo層とを備える。所望により、Zn-Ni-Mo層は銅箔の両面に設けられてもよい。Zn-Ni-Mo層は、Zn付着量が3mg/m2以上100mg/m2以下、Ni付着量が5mg/m2以上60mg/m2以下及びMo付着量が2.0mg/m2以上40mg/m2以下である。そして、Zn付着量、Ni付着量及びMo付着量の合計量に対するNi付着量の比率であるNi/(Zn+Ni+Mo)が0.40以上0.80以下である。このように防錆処理層として所定組成のZn-Ni-Mo層を採用することで、樹脂との密着性、耐薬品性及び耐熱性に優れ、かつ、エッチング残渣が残りにくく、それ故プリント配線板の製造において銅箔-基材間及び基材-基材間の両方の密着信頼性を向上することが可能となる。
本発明による表面処理銅箔の好ましい製造方法の一例を説明する。この好ましい製造方法は、銅箔を用意し、この銅箔に対してZn、Ni及びMoを含む溶液を用いて表面処理を行うことを含む。もっとも、本発明による表面処理銅箔は以下に説明する方法に限らず、あらゆる方法によって製造されたものであってよい。
表面処理銅箔の製造に使用する銅箔としては電解銅箔及び圧延銅箔の双方の使用が可能であり、より好ましくは電解銅箔である。また、銅箔は無粗化の銅箔であってもよいし、予備的粗化を施したものであってもよい。銅箔の厚さは特に限定されないが、0.1μm以上105μm以下が好ましく、より好ましくは0.5μm以上70μm以下である。銅箔がキャリア付銅箔の形態で準備される場合には、銅箔は、無電解銅めっき法及び電解銅めっき法等の湿式成膜法、スパッタリング及び化学蒸着等の乾式成膜法、又はそれらの組合せにより形成したものであってよい。
こうして上記低いSzが付与された銅箔の表面に対して粗化処理を施すのが好ましい。粗化処理を施す銅箔の表面は電極面及び析出面のどちらであってもよく、特に限定されない。粗化処理は、銅濃度4g/L以上25g/L以下、及び硫酸濃度50g/L以上300g/L以下を含む硫酸銅溶液中、20℃以上60℃以下の温度で、10A/dm2以上100A/dm2以下にて電解析出を行うのが好ましく、この電解析出は1秒間以上20秒間以下行われるのが好ましい。粗化処理は、銅箔の上に微細銅粒を析出付着させる焼けめっき工程と、この微細銅粒の脱落を防止するための被せめっき工程とを含む少なくとも2種類のめっき工程を経る公知のめっき手法に従って行ってもよい。この場合、焼けめっき工程は、上述の粗化処理条件にて電解析出を行うのが好ましい。また、被せめっき工程は、銅濃度60g/L以上80g/L以下、及び硫酸濃度100g/L以上300g/L以下を含む硫酸銅溶液中、40℃以上60℃以下の温度で、1A/dm2以上70A/dm2以下にて電解析出を行うのが好ましく、この電解析出は1秒間以上20秒間以下行われるのが好ましい。
銅箔に対して防錆処理を行ってZn-Ni-Mo層を形成する。銅箔に粗化処理を行う場合は、少なくとも粗化層が存在する側の銅箔表面に対して防錆処理を行うのが好ましく、より好ましくは銅箔の両面に対して防錆処理を行う。防錆処理はZn、Ni及びMoを用いためっき処理を含むのが好ましい。このめっき処理はZn、Ni及びMoを含むめっき液を用いて行えばよい。めっき処理はピロリン酸浴により行うのが好ましく、例えば濃度が50g/L以上150g/L以下のピロリン酸カリウムを用いて好ましく行うことができる。めっき液のZn源としてはピロリン酸亜鉛、硫酸亜鉛等を用いるのが好ましく、めっき液中のZn濃度は好ましくは0.1g/L以上10g/L以下、より好ましくは1g/L以上5g/L以下である。めっき液のNi源としては硫酸ニッケル、塩化ニッケル、酢酸ニッケル等を用いるのが好ましく、めっき液中のNi濃度は好ましくは0.1g/L以上10g/L以下、より好ましくは1g/L以上5g/L以下である。めっき液のMo源としてはモリブデン酸ナトリウム、モリブデン酸カリウム、モリブデン酸アンモニウム等を用いるのが好ましく、めっき液中のMo濃度は好ましくは0.1g/L以上10g/L以下、より好ましくは0.5g/L以上5g/L以下である。上記範囲内のめっき液を用いて20℃以上50℃以下の温度で、0.1A/dm2以上5.0A/dm2以下にて電解を行うのが好ましく、この電解は1秒間以上30秒間以下行われるのが好ましい。
防錆処理が施された銅箔にクロメート処理を行い、クロメート層を形成するのが好ましい。クロメート処理はクロム酸濃度0.5g/L以上8g/L以下、pH1以上13以下、電流密度0.1A/dm2以上10A/dm2以下にて電解を行うのが好ましく、この電解は1秒間以上30秒間以下行われるのが好ましい。
銅箔にシランカップリング剤処理を施し、シランカップリング剤層を形成するのが好ましい。シランカップリング剤層は、シランカップリング剤を適宜希釈して塗布し、乾燥させることにより形成することができる。シランカップリング剤の例としては、4-グリシジルブチルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン等のエポキシ官能性シランカップリング剤、又は3-アミノプロピルトリエトキシシラン、N-2(アミノエチル)3-アミノプロピルトリメトキシシラン、N-3-(4-(3-アミノプロポキシ)ブトキシ)プロピル-3-アミノプロピルトリメトキシシラン、N-フェニル-3-アミノプロピルトリメトキシシラン等のアミノ官能性シランカップリング剤、又は3-メルカプトプロピルトリメトキシシラン等のメルカプト官能性シランカップリング剤又はビニルトリメトキシシラン、ビニルフェニルトリメトキシシラン等のオレフィン官能性シランカップリング剤、又は3-メタクリロキシプロピルトリメトキシシラン等のアクリル官能性シランカップリング剤、又はイミダゾールシラン等のイミダゾール官能性シランカップリング剤、又はトリアジンシラン等のトリアジン官能性シランカップリング剤等が挙げられる。
本発明の表面処理銅箔はプリント配線板用銅張積層板の作製に用いられるのが好ましい。すなわち、本発明の好ましい態様によれば、上記表面処理銅箔と、この表面処理銅箔の少なくとも一方の面に設けられる絶縁基材とを備えた銅張積層板が提供される。表面処理銅箔は絶縁基材の片面に設けられてもよいし、両面に設けられてもよい。絶縁基材の誘電正接は、周波数10GHzにおいて0.004以下であるのが好ましく、より好ましくは0.003以下である。こうすることで、プリント配線板に用いられた場合に絶縁基材に起因する誘電損失を低減することができ、それ故高周波用途に適したプリント配線板を作製することが可能となる。絶縁基材は、好ましくは絶縁性樹脂を含む。絶縁基材はプリプレグ及び/又は樹脂シートであるのが好ましい。プリプレグとは、合成樹脂板、ガラス板、ガラス織布、ガラス不織布、紙等の基材に合成樹脂を含浸させた複合材料の総称である。プリプレグに含浸される絶縁性樹脂の好ましい例としては、エポキシ樹脂、シアネート樹脂、ビスマレイミドトリアジン樹脂(BT樹脂)、ポリフェニレンエーテル樹脂、フェノール樹脂等が挙げられる。また、樹脂シートを構成する絶縁性樹脂の例としては、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂等が挙げられる。また、絶縁基材には絶縁性を向上する等の観点からシリカ、アルミナ等の各種無機粒子からなるフィラー粒子等が含有されていてもよい。絶縁基材の厚さは特に限定されないが、1μm以上1000μm以下が好ましく、より好ましくは2μm以上400μm以下であり、さらに好ましくは3μm以上200μm以下である。絶縁基材は複数の層で構成されていてよい。プリプレグ及び/又は樹脂シート等の絶縁基材は予め銅箔表面に塗布されるプライマー樹脂層を介して表面処理銅箔に設けられていてもよい。
本発明の表面処理銅箔の作製及び評価を以下のようにして行った。
銅電解液として以下に示される組成の硫酸酸性硫酸銅溶液を用い、陰極にチタン製の回転電極を用い、陽極にはDSA(寸法安定性陽極)を用いて、溶液温度45℃、電流密度55A/dm2で電解し、厚さ18μmの電解銅箔を得た。この電解銅箔の析出面及び電極面の最大高さSzをISO25178に準拠してレーザー顕微鏡(株式会社キーエンス製、VK-X100)を用いて測定したところ、析出面のSzが0.5μm、電極面のSzが1.2μmであった。この測定は、電解銅箔の析出面及び電極面について、それぞれ面積22500μm2の領域(150μm×150μm)の表面プロファイルを測定することにより行い、測定面積フィルターは使用しなかった。
<硫酸酸性硫酸銅溶液の組成>
‐ 銅濃度:80g/L
‐ 硫酸濃度:260g/L
‐ ビス(3-スルホプロピル)ジスルフィド濃度:30mg/L
‐ ジアリルジメチルアンモニウムクロライド重合体濃度:50mg/L
‐ 塩素濃度:40mg/L
上記得られた電解銅箔の析出面側に対して、以下に示される条件A(1段階めっき、例1~3及び5~9)又は条件B(2段階めっき、例4)による粗化処理を行った。
銅濃度10g/L、硫酸濃度100g/Lの硫酸銅溶液に電解銅箔を浸漬し、液温30℃、電流密度40A/dm2の条件で粗化処理を行い、電解銅箔の析出面側に粗化層を形成した。
銅濃度4g/L、硫酸濃度200g/Lの硫酸銅溶液に電解銅箔を浸漬し、液温30℃、電流密度30A/dm2の条件で1段階目の粗化処理を行った。その後、2段階目の粗化処理として、銅濃度69g/L、硫酸濃度240g/Lの硫酸銅溶液に浸漬し、液温50℃、電流密度10A/dm2の条件で被せめっきを行い、電解銅箔の析出面側に粗化層を形成した。
上記粗化処理後の電解銅箔に対して1段階(例1~7)又は2段階(例8及び9)の防錆処理を行い、電解銅箔の粗化層を形成した表面にZn-Ni-Mo層を形成した。具体的には、1段階目の処理は、表1に示されるZn、Ni及びMo濃度でピロリン酸亜鉛(Zn源)、硫酸ニッケル(Ni源)及びモリブデン酸ナトリウム(Mo源)を含む、ピロリン酸カリウム濃度100g/Lのピロリン酸浴に電解銅箔を浸漬させ、液温40℃、表1に示される電流密度及び処理時間でZn-Ni-Moを電着させることにより行った。2段階目の処理は、表1に示されるZn濃度でピロリン酸亜鉛(Zn源)を含む、ピロリン酸カリウム濃度145g/Lのピロリン酸浴に、1段階目の処理を経た電解銅箔を浸漬させ、液温30℃、表1に示される電流密度及び処理時間でZnを電着させることにより行った。このとき、Zn濃度、Ni濃度、Mo濃度、電流密度及び処理時間を表1に示されるように適宜変えることで、Zn-Ni-Mo層中のZn付着量、Ni付着量、Mo付着量及びNi/(Zn+Ni+Mo)が異なる様々なサンプルを作製した。
上記防錆処理を行った電解銅箔の両面に対して、クロメート処理を行い、Zn-Ni-Mo層の上にクロメート層を形成した。このクロメート処理は、クロム酸濃度1g/L、pH11、液温25℃及び電流密度1A/dm2の条件で行った。
上記クロメート層が形成された銅箔を水洗し、その後直ちにシランカップリング剤処理を行い、粗化処理面のクロメート層上にシランカップリング剤層を形成した。このシランカップリング剤処理は、純水を溶媒とし、3-アミノプロピルトリメトキシシラン濃度が3g/Lの溶液を用い、この溶液をシャワーリングにて粗化処理面に吹き付けて吸着処理することにより行った。シランカップリング剤の吸着後、最終的に電熱器により水分を蒸発させ、厚さ18μmの表面処理銅箔を得た。
作製された表面処理銅箔について、以下に示される測定及び評価を行った。
レーザー顕微鏡(株式会社キーエンス製、VK-X100)を用いて、ISO25178に準拠して表面処理銅箔におけるZn-Ni-Mo層側の表面(すなわちシランカップリング剤層の表面)の最大高さSzを測定した。なお、このZn-Ni-Mo層側の表面のSzは粗化層表面のSzが概ね反映されたものである。この測定は表面処理銅箔の最表面における面積22500μm2の領域(150μm×150μm)の表面プロファイルを測定することにより行い、測定面積フィルターは使用しなかった。結果は表2に示されるとおりであった。
表面処理銅箔のZn-Ni-Mo層側の表面における面積25cm2(5cm×5cm)の領域を酸で溶解し、得られた溶解液中のZn、Ni及びMoの各濃度をICP発光分析法により分析して、Zn付着量、Ni付着量及びMo付着量を測定した。得られた測定結果から、Zn付着量、Ni付着量及びMo付着量の合計量に対するNi付着量の比率であるNi/(Zn+Ni+Mo)を算出した。結果は表2に示されるとおりであった。
様々な状態(例えば常態、熱負荷後及び薬品浸漬後)の表面処理銅箔について、絶縁基材との密着性を評価するために、常態剥離強度、はんだフロー後剥離強度、及び酸処理後剥離強度(耐塩酸劣化率)の測定を以下のとおり行った。結果は表2に示されるとおりであった。
絶縁基材として、ポリフェニレンエーテルとトリアリルイソシアヌレートとビスマレイミド樹脂とを主成分とするプリプレグ(厚さ100μm)2枚を用意して、積み重ねた。この積み重ねたプリプレグに、作製した表面処理銅箔をその粗化処理面がプリプレグと当接するように積層し、32kgf/cm2、205℃で120分間のプレスを行って銅張積層板を作製した。次に、この銅張積層板にエッチング法により回路形成を行い、3mm幅の直線回路を備えた試験基板を作製した。こうして得られた直線回路を、JIS C 5016-1994のA法(90°剥離)に準拠して絶縁基材から引き剥がして常態剥離強度(kgf/cm)を測定した。結果は表2に示されるとおりであった。
剥離強度の測定に先立ち、直線回路を備えた試験基板を288℃のはんだ浴に300秒間フローティングしたこと以外は、上述した常態剥離強度と同様の手順により、はんだフロー後剥離強度(kgf/cm)を測定した。結果は表2に示されるとおりであった。
回路幅を0.4mmとしたこと以外は、上述した常態剥離強度と同様の手順により、酸処理前剥離強度(kgf/cm)を測定した。また、(i)回路幅を0.4mmとしたこと、及び(ii)剥離強度の測定に先立ち、直線回路を備えた試験基板を、4mol/Lの塩酸に60℃で90分間浸漬させたこと以外は、上述した常態剥離強度と同様の手順により、酸処理後剥離強度(kgf/cm)を測定した。こうして得られた酸処理前後における剥離強度から耐塩酸劣化率(%)を算出した。
銅箔のエッチング除去を経て作製された多層積層体における基材-基材間の密着性を以下のとおり評価した。まず、ポリフェニレンエーテルとトリアリルイソシアヌレートとビスマレイミド樹脂とを主成分とするプリプレグ(厚さ100μm)2枚を積み重ねた絶縁基材110の両面に、表面処理銅箔112をその粗化処理面が絶縁基材110と当接するように積層し、32kgf/cm2、205℃で120分間プレスして第1銅張積層板114を得た(図1(a))。この第1銅張積層板114の両面に対して、酸濃度3mol/Lの塩化第二銅エッチング液を用いて浴温50℃でエッチングを行い、両面に存在する表面処理銅箔112を溶解除去して、表面処理銅箔112の粗化処理面の形状が表面に転写された絶縁基材110’を得た(図1(b))。このエッチングは、第1銅張積層板114が長さ約50cmのエッチング槽内を23秒で通過する(速度1.3m/分)操作を計2回実施することにより行った。次いで、エッチング処理後の絶縁基材110’に対して、純水洗浄、希塩酸(濃度10体積%)洗浄、及び純水洗浄を順に行った。洗浄後の絶縁基材110’を80℃のクリーンオーブン内で20分間乾燥させた。乾燥した絶縁基材110’の両面に上述の厚さ100μmのプリプレグ116及び表面処理銅箔112を順に積層し、32kgf/cm2、205℃で120分間プレスして第2銅張積層板118とした(図1(c))。この第2銅張積層板118の両面に対して、酸濃度3mol/Lの塩化第二銅エッチング液を用いて浴温50℃でエッチングを行い、両面に存在する表面処理銅箔112を溶解除去して、評価用サンプル120を作製した(図1(d))。この評価用サンプル120から5cm×10cmのサイズの2枚の試験片を切り出した。これらの試験片をPCT(Pressure Cooker Test)試験機に投入し、2気圧、121℃、100%RHの条件で50分間吸湿させた。吸湿後の試験片をPCT試験機より取り出し、水分を拭き取った後、取り出しから10分以内にはんだディップを行った。このはんだディップは288℃のはんだ浴に試験片を20秒間浸漬させる操作を計20回実施することにより行った。はんだディップ後、試験片におけるフクレ(すなわち積層体内部における基材間の剥離がもたらす気泡状の隙間)の有無を目視にて確認し、2枚の試験片のうち少なくとも1枚にフクレが発生している場合にフクレ有りと判定した。また、発生したフクレは銅箔のエッチング後に残存する防錆処理層の残渣に起因するものと考えられた。結果は表2に示されるとおりであった。
Claims (7)
- 銅箔と、
前記銅箔の少なくとも一方の面に設けられ、Zn付着量が3mg/m2以上100mg/m2以下、Ni付着量が5mg/m2以上60mg/m2以下及びMo付着量が2.0mg/m2以上40mg/m2以下であり、かつ、前記Zn付着量、前記Ni付着量及び前記Mo付着量の合計量に対する前記Ni付着量の比率であるNi/(Zn+Ni+Mo)が0.40以上0.80以下である、Zn-Ni-Mo層と、
を備えた、表面処理銅箔。 - 前記銅箔と前記Zn-Ni-Mo層との間に、複数の粗化粒子で構成される粗化層をさらに備えた、請求項1に記載の表面処理銅箔。
- ISO25178に準拠して測定される、前記表面処理銅箔の前記Zn-Ni-Mo層側の表面の最大高さSzが7.0μm以下である、請求項1又は2に記載の表面処理銅箔。
- 前記Zn-Ni-Mo層の表面にクロメート層及び/又はシランカップリング剤層をさらに備えた、請求項1~3のいずれか一項に記載の表面処理銅箔。
- 請求項1~4のいずれか一項に記載の表面処理銅箔と、
前記表面処理銅箔の前記少なくとも一方の面に設けられる絶縁基材と、
を備えた、銅張積層板。 - 前記絶縁基材の誘電正接が、周波数10GHzにおいて0.004以下である、請求項5に記載の銅張積層板。
- 請求項1~4のいずれか一項に記載の表面処理銅箔又は請求項5若しくは6に記載の銅張積層板を用いてプリント配線板を製造することを特徴とする、プリント配線板の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980020875.9A CN111902570B (zh) | 2018-03-27 | 2019-03-22 | 表面处理铜箔、覆铜层叠板及印刷电路板的制造方法 |
KR1020207022790A KR102382750B1 (ko) | 2018-03-27 | 2019-03-22 | 표면 처리 구리박, 동장 적층판 및 프린트 배선판의 제조 방법 |
JP2020509989A JP6975845B2 (ja) | 2018-03-27 | 2019-03-22 | 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018059562 | 2018-03-27 | ||
JP2018-059562 | 2018-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019188837A1 true WO2019188837A1 (ja) | 2019-10-03 |
Family
ID=68061792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/012236 WO2019188837A1 (ja) | 2018-03-27 | 2019-03-22 | 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6975845B2 (ja) |
KR (1) | KR102382750B1 (ja) |
CN (1) | CN111902570B (ja) |
TW (1) | TWI691623B (ja) |
WO (1) | WO2019188837A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021166513A1 (ja) * | 2020-02-21 | 2021-08-26 | 三井金属鉱業株式会社 | 表面処理金属箔及び金属張積層板 |
US20210267052A1 (en) * | 2018-07-18 | 2021-08-26 | Showa Denko Materials Co., Ltd. | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115928162A (zh) * | 2022-12-13 | 2023-04-07 | 国网辽宁省电力有限公司锦州供电公司 | 一种用于架空输电线路杆塔合金电镀液及其电镀方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005353918A (ja) * | 2004-06-11 | 2005-12-22 | Hitachi Cable Ltd | プリント配線板用銅箔及びその製造方法 |
WO2010074053A1 (ja) * | 2008-12-26 | 2010-07-01 | 日鉱金属株式会社 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
JP2016084533A (ja) * | 2014-10-22 | 2016-05-19 | Jx金属株式会社 | 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器の製造方法、及び、プリント配線板の製造方法 |
JP2017066528A (ja) * | 2015-09-30 | 2017-04-06 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 微細回路基板用表面処理銅箔及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142389A (ja) | 1985-12-17 | 1987-06-25 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
JPH0453180A (ja) * | 1990-06-18 | 1992-02-20 | Mitsubishi Gas Chem Co Inc | 高周波用銅張基板の製造法 |
JP2002329959A (ja) * | 2001-04-27 | 2002-11-15 | Hitachi Chem Co Ltd | プリント配線板およびその製造方法 |
JP2008179127A (ja) * | 2007-01-15 | 2008-08-07 | Ls Cable Ltd | 銅箔積層構造体及び銅箔の表面処理方法 |
JP5129642B2 (ja) | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
JP5634103B2 (ja) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
JP6111017B2 (ja) * | 2012-02-03 | 2017-04-05 | Jx金属株式会社 | プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品 |
US20190263995A1 (en) * | 2016-07-25 | 2019-08-29 | Nitto Denko Corporation | Low-dielectric porous polymer film and film for millimeter-wave antenna |
-
2019
- 2019-03-22 KR KR1020207022790A patent/KR102382750B1/ko active IP Right Grant
- 2019-03-22 CN CN201980020875.9A patent/CN111902570B/zh active Active
- 2019-03-22 JP JP2020509989A patent/JP6975845B2/ja active Active
- 2019-03-22 WO PCT/JP2019/012236 patent/WO2019188837A1/ja active Application Filing
- 2019-03-27 TW TW108110578A patent/TWI691623B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005353918A (ja) * | 2004-06-11 | 2005-12-22 | Hitachi Cable Ltd | プリント配線板用銅箔及びその製造方法 |
WO2010074053A1 (ja) * | 2008-12-26 | 2010-07-01 | 日鉱金属株式会社 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
JP2016084533A (ja) * | 2014-10-22 | 2016-05-19 | Jx金属株式会社 | 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器の製造方法、及び、プリント配線板の製造方法 |
JP2017066528A (ja) * | 2015-09-30 | 2017-04-06 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 微細回路基板用表面処理銅箔及びその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210267052A1 (en) * | 2018-07-18 | 2021-08-26 | Showa Denko Materials Co., Ltd. | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate |
WO2021166513A1 (ja) * | 2020-02-21 | 2021-08-26 | 三井金属鉱業株式会社 | 表面処理金属箔及び金属張積層板 |
Also Published As
Publication number | Publication date |
---|---|
JP6975845B2 (ja) | 2021-12-01 |
CN111902570B (zh) | 2022-11-08 |
KR102382750B1 (ko) | 2022-04-08 |
CN111902570A (zh) | 2020-11-06 |
TW201942422A (zh) | 2019-11-01 |
KR20200105705A (ko) | 2020-09-08 |
JPWO2019188837A1 (ja) | 2020-12-10 |
TWI691623B (zh) | 2020-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107923047B (zh) | 粗糙化处理铜箔、覆铜层叠板及印刷电路板 | |
TWI719567B (zh) | 粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 | |
US10244635B2 (en) | Production method for copper-clad laminate plate | |
WO2017179416A1 (ja) | 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法 | |
JP6352449B2 (ja) | キャリア付極薄銅箔及びその製造方法 | |
CN112204171B (zh) | 粗化处理铜箔、贴铜叠层板和印刷电路板 | |
US10280501B2 (en) | Roughened copper foil, copper clad laminate, and printed circuit board | |
WO2019188837A1 (ja) | 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 | |
CN115413301A (zh) | 粗糙化处理铜箔、覆铜层叠板及印刷电路板 | |
TWI626873B (zh) | 印刷配線板之製造方法 | |
JP7177956B2 (ja) | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 | |
JP7259093B2 (ja) | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 | |
KR20010102562A (ko) | 표면처리 동박과 그 표면처리 동박의 제조방법 및 그표면처리 동박을 사용한 동 클래드 적층판 | |
TWI805902B (zh) | 表面處理銅箔、覆銅積層板及印刷線路板 | |
WO2022255421A1 (ja) | 粗化処理銅箔、銅張積層板及びプリント配線板 | |
WO2022209989A1 (ja) | 粗化処理銅箔、銅張積層板及びプリント配線板 | |
KR20230161954A (ko) | 조화 처리 구리박, 동장 적층판 및 프린트 배선판 | |
CN116964252A (zh) | 带载体铜箔、覆铜层叠板及印刷电路板 | |
TW202135605A (zh) | 表面處理金屬箔及貼金屬層積板 | |
CN111757607A (zh) | 表面处理铜箔、覆铜层叠板及印制布线板 | |
JP2011210984A (ja) | 耐加熱変色性及びエッチング性に優れたプリント配線板用銅箔及び積層体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19778020 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2020509989 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20207022790 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19778020 Country of ref document: EP Kind code of ref document: A1 |