WO2019144563A1 - 显示装置及其制造方法、显示面板 - Google Patents

显示装置及其制造方法、显示面板 Download PDF

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Publication number
WO2019144563A1
WO2019144563A1 PCT/CN2018/092108 CN2018092108W WO2019144563A1 WO 2019144563 A1 WO2019144563 A1 WO 2019144563A1 CN 2018092108 W CN2018092108 W CN 2018092108W WO 2019144563 A1 WO2019144563 A1 WO 2019144563A1
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Prior art keywords
substrate
conductive pattern
display panel
display device
circuit board
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PCT/CN2018/092108
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English (en)
French (fr)
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陈继峯
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武汉华星光电半导体显示技术有限公司
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Priority to US16/109,803 priority Critical patent/US10797126B2/en
Publication of WO2019144563A1 publication Critical patent/WO2019144563A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a circuit arrangement of a display device, and more particularly to a display device, a method for manufacturing the same, and a display panel.
  • the display panel 10 includes an active area 11 and an upper border area 121 , a lower border area 122 , a left border area 123 , and a right border area 124 respectively disposed around the display area 11 .
  • the four frame areas can be used as the non-display area as the arrangement driving traces 13.
  • One end of the driving line 13 is connected to the TFT (Thin Film Transistor) in the display area 11, and the other end is connected through the non-display area.
  • TFT Thin Film Transistor
  • FIG. 2 is a cross-sectional structural view showing an embodiment of a display device using a narrow bezel design in the prior art.
  • the FPC 21 is bent 180 degrees and connected to the driving trace of the display panel 10, including the driving IC 211.
  • the driving circuit is disposed on the back of the FPC 21, that is, hidden behind the display panel 10.
  • the FPC 21 has a certain degree of rigidity, and the stress generated by the bending may affect the connection with the driving trace 13, and the driving signal may not be transmitted to the display panel 10.
  • the bending zone of the FPC 21 must have a predetermined size, that is, the distance d 1 of the bent outermost edge to the joint area of the display panel 10 must be greater than a certain value, which is undoubtedly disadvantageous for reducing the lower frame area. Size of 122.
  • FIG. 3 is a cross-sectional structural view showing another embodiment of a display device using a narrow bezel design in the prior art.
  • the circuit board 31 is disposed on the back surface of the display panel 10, and the display panel 10 is bent 180 degrees and connected to the circuit board 31.
  • the design can reduce the size of the bending zone d 2 , the effect is very limited, and the driving trace 13 mainly composed of a metal material is easily broken, and the driving signal cannot be transmitted to the display panel 10 as well.
  • the present invention provides a display device, a method of manufacturing the same, and a display panel, which can facilitate a narrow bezel and a frameless design of the display device.
  • a display panel includes a substrate and a driving trace carried on the substrate.
  • the substrate is provided with a through hole, and a back surface of the substrate is provided with a solder pad.
  • One end of the driving trace is located on the front surface of the substrate, and is driven away. The other end of the wire passes through the through hole and is connected to the pad.
  • a display device includes a circuit board and a display panel, the display panel includes a substrate and a driving trace carried on the substrate, the substrate is provided with a through hole, and a back surface of the substrate is provided with a solder pad for driving One end of the trace is located on the front side of the substrate, and the other end of the drive trace is pierced from the through hole and connected to the pad, and the circuit board is connected to the pad of the display panel.
  • TFT Forming a TFT on the second conductive pattern, the TFT being connected to the second conductive pattern;
  • a circuit board is disposed on a side of the substrate facing away from the second conductive pattern, and the circuit board is coupled to the first conductive pattern.
  • the present invention is designed to provide a through hole on a substrate of a display panel, and drive a driving trace of the display panel from the through hole and guide it to the back surface of the substrate, that is, the trace bonding area of the display panel is set on the display
  • the back side of the panel, rather than the non-display area of the display panel, can facilitate the narrow bezel and borderless design of the display device.
  • FIG. 1 is a schematic view showing a layout of a trace of an embodiment of a conventional display panel
  • FIG. 2 is a cross-sectional structural view showing an embodiment of a display device using a narrow bezel design in the prior art
  • FIG. 3 is a cross-sectional structural view showing another embodiment of a display device using a narrow bezel design in the prior art
  • FIG. 4 is a schematic view showing the layout of the front side of the display panel according to an embodiment of the invention.
  • FIG. 5 is a schematic view showing the layout of the rear side of the display panel according to an embodiment of the invention.
  • FIG. 6 is a cross-sectional structural view of a display device according to an embodiment of the present invention.
  • FIG. 7 is a schematic view showing the layout of the rear side of the display panel according to another embodiment of the present invention.
  • FIG. 8 is a flow chart showing a method of manufacturing a display device according to an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of a scene for manufacturing a display device based on the method shown in FIG.
  • FIG. 4 is a schematic view showing the layout of the front side of the display panel according to an embodiment of the present invention
  • FIG. 5 is a schematic view showing the layout of the rear side of the display panel according to an embodiment of the invention.
  • the front surface of the display panel 40 is divided into a display area 41 (an area defined by a broken line in the figure) and a non-display area 42 disposed around the display area 41.
  • TFTs are disposed in the display area 41.
  • Structures such as light-emitting elements are disposed on the front surface of the substrate 43 of the display panel 40, and receive driving signals through the driving traces 44 carried on the substrate 43 for display.
  • the substrate 43 is provided with a plurality of through holes 431.
  • the through holes 431 can be disposed around the display area 41.
  • the back surface of the substrate 43 is provided with a solder pad 432 for driving one end of the trace 44. It is located on the front side of the substrate 43 and is connected to the elements in the display area 41, and the other end thereof is passed out from the corresponding through hole 431 and connected to the bonding pad 432. That is, the drive trace 44 is passed out through the via 431 and guided to the back surface of the substrate 43.
  • the circuit board 61 is disposed on the back surface of the display panel 40 (substrate 43) and connected to the bonding pad 432. Since the solder pad 432 is located on the back surface of the display panel 40, that is, the trace bonding area is disposed on the back surface of the display panel 40 instead of the non-display area 42, and the driving traces 44 are directly arranged from the through hole 431 to the display panel 40. On the back side, the non-display area 42 does not need to reserve an arrangement space for the drive traces 44, so that the narrow frame and the borderless design of the display device 60 can be facilitated.
  • the bonding of the circuit board 61 and the driving traces 44 is located on the back surface of the substrate 43 .
  • the circuit board 61 is originally disposed on the back surface of the substrate 43 . Therefore, it is not necessary to bend the circuit board 61 or the substrate 43 again, which is advantageous for avoiding the generation of the driving traces 44 . fracture.
  • the size of the solder pad 432 can be designed to be large enough, and the distance between the adjacent pads 432 can also be increased, so that the driving circuit and the pad can be avoided due to shrinkage or expansion of the substrate 43. 432 creates the problem of joint misalignment.
  • the display device 60 of the present embodiment may be a flexible AMOLED (Active-Matrix Organic Light Emitting Diode) display device.
  • the display panel 40 is a flexible display
  • the substrate 43 may be It is a bendable flexible substrate made of PI (Polyimide, polyimide) material.
  • FIG. 7 is a schematic diagram of a rear trace layout of a display panel according to another embodiment of the present invention.
  • the display panel 40 further includes a strain sensing element 433 disposed on the back surface of the substrate 43 , and the strain sensing element 433 is used for detecting the driving.
  • the force deformation parameter of the wire 44 is used for detecting the driving.
  • the strain sensing element 433 may be a conductive trace formed by a serpentine route formed by a patterning process, and two solder pads 432 are respectively connected at two ends thereof.
  • the material of the conductive trace can be metal.
  • the length of the conductive trace changes, and the resistance thereof also changes.
  • the display panel 40 can be known in time. The deformation of the force at this time.
  • the present invention also provides a method of manufacturing a display device according to an embodiment.
  • the manufacturing method of the display device includes steps S81 to S88.
  • the substrate substrate 90 may be a light transmissive substrate such as a glass substrate, a plastic substrate, or a flexible substrate.
  • a full surface metal layer covering the substrate substrate 90 may be formed by a PVD (Physical Vapor Deposition) process, and the material of the metal layer may be molybdenum (Mo), titanium (Ti), or aluminum (Al).
  • a metal such as silver (Ag) is formed by etching a metal layer by a patterning process to form a first conductive pattern 91.
  • S83 forming a substrate covering the first conductive pattern on the substrate substrate, and the substrate is provided with a through hole exposing the first conductive pattern.
  • a layer of PI may be coated on the substrate substrate 90 by a CVD (Chemical Vapor Deposition) process, and then dried to obtain the substrate 92.
  • the substrate 92 is a flexible structure covering a full thickness of the substrate substrate 90, which completely covers the first conductive pattern 91 at the same time. Then, the present embodiment may form a through hole 921 above a predetermined position of the first conductive pattern 91 by using any one of laser Drilling, Dry Etching, or chemical etching.
  • the present embodiment can be regarded as selective etching, that is, the etching liquid or the etching gas can only react with the PI of the substrate 92, and when the etching completely penetrates the substrate 92 and reaches the first The conductive pattern 91 is stopped.
  • the materials of the second conductive pattern 93 and the first conductive pattern 91 may be the same, and the forming processes of the two may be the same. The difference is that the second conductive pattern 93 is also filled in the through hole 921 to be in contact with the first conductive pattern 91, so that the upper and lower sides of the substrate 92 are electrically connected.
  • the structure and process of the TFT can be referred to the prior art, and the source, the drain and the gate of the TFT are both connected to the second conductive pattern 93.
  • a predetermined position of the structural layer 94 where the TFT is located may be etched to form a via hole, and then a metal deposition and patterning process is performed in the via hole, and a driving line on the front surface of the substrate 92 is guided to the back surface. .
  • the light emitting unit 95 can be formed by an evaporation process.
  • the present embodiment may apply a layer of fluorosilane (Fluoroalkyl Silanes, FAS) as a release film before step S82.
  • the mechanical de-bonding method can be used to easily separate the two. Further, after the two are separated, the first conductive pattern 91 adheres to the substrate 92 without remaining on the substrate substrate 90.
  • the circuit board is disposed on a side of the substrate facing away from the second conductive pattern, and the circuit board is connected to the first conductive pattern.
  • the substrate 92 is flipped by 180°, and on the back surface of the substrate 92, the circuit board 96 is soldered to the first conductive pattern 91, and then the back plate 97, the polarizer 98 and the front cover (Cover Window) 99 are assembled. A display device to be obtained is obtained.
  • the first conductive pattern 91 corresponds to a portion of the driving trace 44 shown in FIG. 5 located on the back surface of the substrate 43
  • the through hole 921 corresponds to the through hole 431 shown in FIGS. 5 and 6
  • the second conductive pattern 93 corresponds to the drive trace 44 shown in FIG. 4 through which the through hole 431 and the portion connecting the display region 41 are formed. Since the manufacturing method of the present embodiment can produce a display device having the same structure as that of the display device 60 described above, the above advantageous effects are also obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开一种显示装置及其制造方法、显示面板。所述显示面板包括基板以及承载于所述基板上的驱动走线，所述基板开设有通孔，且所述基板的背面设置有焊垫，所述驱动走线的一端位于所述基板的正面，所述驱动走线的另一端从所述通孔穿出并与所述焊垫连接。

Description

显示装置及其制造方法、显示面板 【技术领域】
本发明涉及显示技术领域，具体涉及显示装置的线路排布，尤其涉及一种显示装置及其制造方法、显示面板。
【背景技术】
图1是现有显示面板一实施例的走线布局示意图。如图1所示，显示面板10包括显示区(Active Area)11和分设于显示区11四周的上边框区121、下边框区122、左边框区123及右边框区124。这四个边框区作为非显示区可用作排布驱动走线13，驱动走线13的一端连接显示区11内的TFT(Thin Film Transistor，薄膜晶体管)等器件，另一端经由非显示区并最终连接至下边框区122内的走线焊接区，对走线焊接区内的焊垫(Pad)14施加驱动信号，显示面板10即可实现显示。
为了实现更高的屏占比和提升产品的外观质感，对采用上述显示面板10的显示装置进行窄边框(Borderless)及无边框(Bezel Free)设计已成为业界趋势。为了迎合这一趋势，部分驱动走线13可藏布于显示区11后方，但这却很难满足高解析度(High PPI，High Pixels Per Inch)的设计要求。于此，业界还提供了以下两种窄边框设计。
图2是现有技术中采用窄边框设计的显示装置一实施例的剖面结构示意图。结合图1和图2所示，对于采用FPC(Flexible Printed Circuit，柔性电路板)设计的显示装置20，FPC 21弯折180°后与显示面板10的驱动走线连接，包括驱动IC 211在内的驱动电路设置于FPC 21的背面，即隐藏于显示面板10的后方。但是，FPC 21具有一定程度的刚性，其弯折产生的应力可能影响与驱动走线13的连接，容易导致驱动信号无法传送至显示面板10。为了避免该情形发生，FPC 21的弯折区必须具有预定尺寸，即其弯折的最外缘至显示面板10的接合区的距离d 1必须大于一定值，而这无疑不利于减少下边框区122的尺寸。
图3是现有技术中采用窄边框设计的显示装置另一实施例的剖面结构示意图。结合图1和图3所示，对于采用柔性显示面板(Flexible Display)10设计的显示装置30，电路板31设置于显示面板10的背面，显示面板10弯折180°后 与电路板31连接。此种设计虽然可以降低弯折区d 2的尺寸，但其作用十分有限，并且容易造成以金属材质为主的驱动走线13断裂，同样会导致驱动信号无法传送至显示面板10。
由此可见，现有的窄边框及无边框设计仍需改善。
【发明内容】
有鉴于此，本发明提供一种显示装置及其制造方法、显示面板，能够有利于显示装置的窄边框及无边框设计。
本发明一实施例的显示面板，包括基板以及承载于基板上的驱动走线，所述基板开设有通孔，且基板的背面设置有焊垫，驱动走线的一端位于基板的正面，驱动走线的另一端从通孔穿出并与焊垫连接。
本发明一实施例的显示装置，包括电路板及显示面板，所述显示面板包括基板以及承载于基板上的驱动走线，所述基板开设有通孔，且基板的背面设置有焊垫，驱动走线的一端位于基板的正面，驱动走线的另一端从通孔穿出并与焊垫连接，所述电路板与所述显示面板的焊垫连接。
本发明一实施例的显示装置的制造方法，包括：
提供一衬底基材；
在所述衬底基材上形成第一导电图案；
在所述衬底基材上形成覆盖所述第一导电图案的基板，所述基板开设有暴露所述第一导电图案的通孔；
在所述基板上形成第二导电图案，所述第二导电图案填充所述通孔并与所述第一导电图案连接；
在第二导电图案上形成TFT，所述TFT与所述第二导电图案连接；
形成与所述TFT连接的发光单元；
将所述衬底基材和所述基板分离；
将电路板设置于所述基板背向所述第二导电图案的一侧，并将所述电路板与所述第一导电图案连接。
有益效果：本发明设计在显示面板的基板上开设通孔，将显示面板的驱动走线从所述通孔穿出并引导至基板的背面，即，将显示面板的走线焊接区设置于显示面板的背面，而非设置于显示面板的非显示区，因此能够有利于显示装 置的窄边框及无边框设计。
【附图说明】
图1是现有显示面板一实施例的走线布局示意图；
图2是现有技术中采用窄边框设计的显示装置一实施例的剖面结构示意图；
图3是现有技术中采用窄边框设计的显示装置另一实施例的剖面结构示意图；
图4是本发明一实施例的显示面板的正面走线布局示意图；
图5是本发明一实施例的显示面板的背面走线布局示意图；
图6是本发明一实施例的显示装置的剖面结构示意图；
图7是本发明另一实施例的显示面板的背面走线布局示意图；
图8是本发明一实施例的显示装置的制造方法的流程示意图；
图9是基于图8所示的方法制造显示装置的场景示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明所提供的各个示例性的实施例的技术方案进行清楚、完整地描述。在不冲突的情况下，下述各个实施例以及实施例中的特征可以相互组合。并且，本发明全文所采用的方向性术语，例如“上”、“下”等，均是为了更好的描述各个实施例的技术方案，并非用于限制本发明的保护范围。
图4是本发明一实施例的显示面板的正面走线布局示意图，图5是本发明一实施例的显示面板的背面走线布局示意图。如图4和图5所示，所述显示面板40的正面分为显示区41(图中虚线所限定区域)和围绕所述显示区41设置的非显示区42，显示区41内设置有TFT、发光元件等结构，这些结构设置于显示面板40的基板43的正面，并通过承载于基板43上的驱动走线44接收驱动信号以实现显示。
其中，在非显示区42内，所述基板43开设有多个通孔431，这些通孔431可以围绕显示区41四周设置，该基板43的背面设置有焊垫432，驱动走线44的一端位于基板43的正面且与显示区41内的元件连接，其另一端从相应的通孔431穿出并与焊垫432连接。也就是说，驱动走线44从通孔431穿出并引导 至基板43的背面。
结合图6所示，当所述显示面板40与电路板61组装形成显示装置60时，电路板61设置于显示面板40(基板43)的背面，并与焊垫432连接。由于焊垫432位于显示面板40的背面，即走线焊接区设置于显示面板40的背面，而非设置于非显示区42，同时，驱动走线44直接从通孔431排布至显示面板40的背面，非显示区42无需为这些驱动走线44预留排布空间，因此能够有利于显示装置60的窄边框及无边框设计。并且，电路板61与驱动走线44的接合位于基板43的背面，电路板61原本就设置于基板43的背面，因此无需再弯折电路板61或者基板43，有利于避免驱动走线44产生断裂。另外，由于基板43背面的区域范围大，焊垫432的尺寸可以设计的足够大，相邻焊垫432之间的距离也可以增大，能够避免因基板43收缩或膨胀导致驱动电路与焊垫432产生接合错位的问题。
本实施例的显示装置60可以为柔性AMOLED(Active-matrix organic light emitting diode，有源矩阵发光二极管)显示装置，对应地，所述显示面板40为柔性显示屏(Flexible display)，其基板43可以为采用PI(Polyimide，聚酰亚胺)材料制成的可弯折的柔性基板。
图7是本发明另一实施例的显示面板的背面走线布局示意图。结合图6和图7所示，在柔性显示装置60的结构设计中，显示面板40还包括设置于基板43背面的应变传感元件(Strain Sensor)433，该应变传感元件433用于检测驱动走线44的受力变形参数。
具体地，所述应变传感元件433可以为采用图形化工艺形成的呈蛇形(Serpentine Route)排布的导电走线，其两端分别连接两个所述焊垫432。导电走线的材质可以为金属，在受应力作用时其长度会发生改变，进而其电阻也会发生变化，于此，只要测量导电走线的电阻值变化，即可及时地得知显示面板40此时的受力变形情况。
本发明还提供一实施例的显示装置的制造方法。请参阅图8和图9所示，所述显示装置的制造方法包括步骤S81～S88。
S81：提供一衬底基材。
衬底基材90可以为玻璃基体、塑料基体或可挠式基体等透光基板。
S82：在所述衬底基材上形成第一导电图案。
本实施例可以采用PVD(Physical Vapor Deposition，物理气象沉积)工艺形 成覆盖衬底基材90的一整面金属层，该金属层的材质可以为钼(Mo)、钛(Ti)、铝(Al)、银(Ag)等金属，再通过图案化工艺形成对金属层进行刻蚀，即可形成第一导电图案91。
S83：在衬底基材上形成覆盖第一导电图案的基板，基板开设有暴露第一导电图案的通孔。
本实施例可以采用CVD(Chemical Vapor Deposition，化学气相沉积)工艺在衬底基材90上涂布一层PI，然后进行烘干即可得到所述基板92。该基板92为覆盖衬底基材90的一整面厚度均匀的柔性结构，其同时完全覆盖所述第一导电图案91。然后，本实施例可以使用激光钻孔(Laser Drilling)、干式蚀刻(Dry Etching)或化学蚀刻等任一种工艺，在第一导电图案91的预定位置的上方形成通孔921。
在使用蚀刻工艺形成通孔921的应用场景中，本实施例可视为选择性蚀刻，即蚀刻液或蚀刻气体只能与基板92的PI进行反应，当蚀刻完全穿透基板92并到达第一导电图案91时即停止。
S84：在基板上形成第二导电图案，所述第二导电图案填充通孔并与第一导电图案连接。
第二导电图案93和第一导电图案91的材料可以相同，两者的形成工艺可以相同。不同的是，第二导电图案93还填充于通孔921中，以此与第一导电图案91接触，使得基板92的上下实现电性导通。
S85：在第二导电图案上形成TFT，所述TFT与第二导电图案连接。
所述TFT的结构及制程可参阅现有技术，该TFT的源极、漏极和闸极均与第二导电图案93连接。具体地，本实施例可以对TFT所在结构层94的预定位置进行蚀刻以形成通孔，然后在该通孔内进行金属沉积和图案化制程，于此基板92正面的驱动线路被导引至背面。
S86：形成与所述TFT连接的发光单元。
本实施例可以采用蒸镀工艺形成发光单元95。
S87：将所述衬底基材和基板分离。
为了便于衬底基材90和基板92分离，本实施例可以在步骤S82之前涂布一层氟硅烷(Fluoroalkyl Silanes，FAS)作为离形膜。在本步骤中，采用机械取下(Mechanical de-bonding)方式，即可轻易地将两者分离。并且，在两者分离后，第一导电图案91会附着在基板92上，而不会残留于衬底基材90上。
S88：将电路板设置于基板背向第二导电图案的一侧，并将电路板与第一导电图案连接。
将基板92翻转180°，在基板92的背面，电路板96与第一导电图案91进行焊接，然后再组装背板97、偏光片(Polarizer)98及前盖板(Cover Window)99，即可得到所要制得的显示装置。
在本实施例中，第一导电图案91相当于图5所示的驱动走线44位于基板43背面的部分，通孔921相当于图5和图6所示的通孔431，第二导电图案93相当于图4所示的驱动走线44穿设通孔431和连接显示区41的部分。由于本实施例的制造方法能够制得与上述显示装置60相同结构的显示装置，因此也具有上述有益效果。
应理解，以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，例如各实施例之间技术特征的相互结合，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (17)

  1. 一种显示面板，其中，所述显示面板包括基板以及承载于所述基板上的驱动走线，所述基板开设有通孔，且所述基板的背面设置有焊垫，所述驱动走线的一端位于所述基板的正面，所述驱动走线的另一端从所述通孔穿出并与所述焊垫连接。
  2. 根据权利要求1所述的显示面板，其中，所述基板为可弯折的柔性基板。
  3. 根据权利要求2所述的显示面板，其中，所述基板的材质为聚酰亚胺PI。
  4. 根据权利要求2所述的显示面板，其中，所述显示面板还包括应变传感元件，所述应变传感元件设置于所述基板的背面，并用于检测所述驱动走线的受力变形参数。
  5. 根据权利要求4所述的显示面板，其中，所述应变传感元件包括呈蛇形排布的导电走线，其两端分别连接两个所述焊垫。
  6. 一种显示装置，其中，所述显示装置包括电路板以及显示面板，所述显示面板包括基板以及承载于所述基板上的驱动走线，所述基板开设有通孔，且所述基板的背面设置有焊垫，所述驱动走线的一端位于所述基板的正面，所述驱动走线的另一端从所述通孔穿出并与所述焊垫连接，所述电路板与所述显示面板的焊垫连接。
  7. 根据权利要求6所述的显示装置，其中，所述基板为可弯折的柔性基板。
  8. 根据权利要求7所述的显示装置，其中，所述基板的材质为PI。
  9. 根据权利要求7所述的显示装置，其中，所述显示面板还包括应变传感元件，所述应变传感元件设置于所述基板的背面，并用于检测所述驱动走线的受力变形参数。
  10. 根据权利要求9所述的显示装置，其中，所述应变传感元件包括呈蛇形排布的导电走线，其两端分别连接两个所述焊垫。
  11. 根据权利要求6所述的显示装置，其中，所述电路板为柔性电路板FPC。
  12. 根据权利要求6所述的显示装置，其中，所述显示装置为柔性有源矩阵发光二极管AMOLED显示装置。
  13. 一种显示装置的制造方法，其中，所述制造方法包括：
    提供一衬底基材；
    在所述衬底基材上形成第一导电图案；
    在所述衬底基材上形成覆盖所述第一导电图案的基板，所述基板开设有暴露所述第一导电图案的通孔；
    在所述基板上形成第二导电图案，所述第二导电图案填充所述通孔并与所述第一导电图案连接；
    在第二导电图案上形成TFT，所述TFT与所述第二导电图案连接；
    形成与所述TFT连接的发光单元；
    将所述衬底基材和所述基板分离；
    将电路板设置于所述基板背向所述第二导电图案的一侧，并将所述电路板与所述第一导电图案连接。
  14. 根据权利要求13所述的制造方法，其中，在所述衬底基材上形成第一导电图案之前，所述制造方法还包括：
    在所述衬底基材上形成喷涂一层离形材料。
  15. 根据权利要求13所述的制造方法，其中，所述基板为柔性基板，所述电路板为柔性电路板FPC。
  16. 根据权利要求15所述的制造方法，其中，采用PI形成所述基板。
  17. 根据权利要求13所述的制造方法，其中，在所述衬底基材上形成第一导电图案，包括：
    在所述衬底基材上形成呈蛇形排布的导电走线。
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