WO2019075951A1 - 显示基板及其制作方法 - Google Patents
显示基板及其制作方法 Download PDFInfo
- Publication number
- WO2019075951A1 WO2019075951A1 PCT/CN2018/073976 CN2018073976W WO2019075951A1 WO 2019075951 A1 WO2019075951 A1 WO 2019075951A1 CN 2018073976 W CN2018073976 W CN 2018073976W WO 2019075951 A1 WO2019075951 A1 WO 2019075951A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sub
- driving circuit
- driving
- display panel
- signal
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 title claims description 19
- 239000003086 colorant Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 239000010409 thin film Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 3
- 230000001568 sexual effect Effects 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the present invention relates to a micro organic light emitting display device, and more particularly to a display panel of a micro organic light emitting diode and a method of fabricating the same.
- OLED Organic Light-Emitting Diode
- semiconductor-based LEDs are increasingly found in lighting and display applications.
- semiconductor-based LEDs exist in large area outdoor displays, indoor and outdoor lighting.
- Micro Organic Light-Emitting Diode (Micro-LED) has gradually been applied to consumer electronics, such as smart watches.
- the present invention provides a display panel which is relatively easy to route.
- a display panel is provided with a plurality of pixel units arranged in a matrix, wherein each pixel unit includes a plurality of sub-pixel units of different colors, and the display panel includes at least one of the adjacent two in the corresponding display area.
- the signal wire transmits an image driving signal to the sub-pixel unit for driving the sub-pixel unit for image display.
- the pixel unit being electrically connected to the signal wire;
- Each of the pixel units includes a plurality of sub-pixel units of different colors
- the driving circuit includes a plurality of sub-driving circuits, each of the sub-pixels being connected to the sub-driving circuit by at least one signal wire, the sub-driving circuit Transmitting an image driving signal to the sub-pixel unit through the signal wire for driving the sub-pixel unit to perform image display.
- the pixel unit used for image display in the display panel is electrically connected only to the driving circuit by using one kind of signal wire, the receiving of the switching signal and the graphic driving signal can be completed, thereby performing image display, thereby The pixel unit wiring is greatly reduced, and more layout space is provided for the pixel unit, thereby improving the resolution of the display panel.
- FIG. 1 is a schematic diagram showing the planar structure of a display panel according to an embodiment of the invention.
- FIG. 2 is an enlarged schematic structural view of a portion of the driving circuit and the pixel unit shown in FIG. 1.
- FIG. 2 is an enlarged schematic structural view of a portion of the driving circuit and the pixel unit shown in FIG. 1.
- FIG. 3 is a schematic side view showing the structure of a sub-driving circuit as shown in FIG. 2.
- FIGS. 1-3 are views of a method for manufacturing the display panel shown in FIGS. 1-3.
- FIG. 1 is a schematic diagram of a planar structure of a display panel 100 according to an embodiment of the invention.
- the display panel 100 displays a display area 10a and a non-display area 10b, wherein the display area 10a includes a plurality of pixel units 101 arranged in a matrix along a first direction X and a second direction Y which are perpendicular to each other.
- Each of the pixel units 101 includes sub-pixels 101R, 101G, and 101B having three colors, that is, sub-pixels 101R, 101G, and 101B including three colors of red, green, and blue (RGB).
- sub-pixels 101R, 101G, and 101B including three colors of red, green, and blue (RGB).
- a driving circuit 102 is disposed between two rows of pixel units extending along the first direction X.
- the driving circuit 102 is electrically connected to the plurality of pixel units 101 through a plurality of signal wires 103. Specifically, the plurality of signal lines 103 are respectively passed through the three color sub-pixels 101R, 101G, and 101B in each of the pixel units 102. Electrically connected to the driving circuit 102
- the control circuit 104 is disposed in the non-display area 10b, and is electrically connected to the driving circuit 102 for outputting the switching signal and the image signal to the driving circuit 102.
- the sub-pixels 101R, 101G, and 101B included in the pixel unit 101 are all micro organic light emitting diodes (Micro LEDs).
- FIG. 2 is a schematic enlarged view of the partial driving circuit 102 and the pixel unit 101 as shown in FIG. 1 .
- the driving circuit 102 includes a plurality of sub-driving circuits 1021 that are sequentially arranged along the first direction X.
- Each sub-driver circuit 1021 is electrically connected to a sub-pixel 101R, a sub-pixel 101G or a sub-pixel 101B by a signal telecommunication 103 extending along a second direction Y.
- the sub-driving circuit 1021 is in an on-on state or an off-state under the switching signal output by the control circuit 104, and the image driving signal is transmitted from the sub-driving circuit to the sub-driving circuit when the sub-driving circuit 1021 is turned on.
- the sub-pixel 101R corresponds to the sub-pixel 101R, the sub-pixel 101G or the sub-pixel 101B.
- the sub-drive circuit 1021 for driving the sub-pixels 101R, 101G, and 101B includes a driving structure of two thin film transistors and a capacitor.
- the sub-driving circuit 1021 also has three thin film transistors and The form of a capacitor is not limited to this.
- FIG. 3 is a schematic diagram of the side structure of a sub-driving circuit 1021 as shown in FIG. 2 .
- the display panel 100 includes a substrate 11, a sub-driving circuit 1021, a first insulating layer 13, a signal conductor 103, and a sub-pixel 101B of the pixel unit 101 along a plane parallel to the first direction X and the second direction Y.
- the vertical direction is sequentially stacked on the surface of the substrate 11, that is, the sub-driving circuit 1021, the first insulating layer 13, the signal wires 103, and the sub-pixels 101B in the pixel unit 101 are sequentially stacked in the thickness direction of the substrate 11.
- the first insulating layer 13 partially covers the driving circuit, and the signal wire 103 is electrically connected to the sub driving circuit 1021 through the through hole H of the first insulating layer 13 along the second direction Y.
- the sub-pixel 101B in the pixel unit 101 is disposed on the surface of the signal wire 103 and electrically connected to the signal wire 103.
- the blue sub-pixel 101B in the pixel unit 101 can be understood that the connection structure of other sub-pixels in the pixel unit 101 is similar, for example, the red sub-pixel 101G or the green sub-layer stacked with the sub-driving circuit 1021. Pixel 101G.
- the sub-transistor circuit 1021 includes a first thin film transistor T1 and a second thin film transistor T2, wherein the first thin film transistor T1 functions as a switching transistor for electrically connecting the control circuit 104, and the second thin film transistor T2 serves as a driving transistor. It is used to electrically connect the sub-pixels 101B in the pixel unit 101. It should be noted that the capacitance in the sub-driver circuit 1021 is not shown in FIG.
- the first insulating layer 13 may be made of a silicon nitride (SiNx) and/or silicon oxide (SiOx) material, and the first insulating layer 13 also functions as a planarization layer to facilitate subsequent signal lines 103.
- the first insulating layer 13 can form a through hole H through the cooperation of the mask and the photoresist, and the through hole H exposes the corresponding electrical connection portion of the first thin film transistor T1 and the second thin film transistor T2, so as to be disposed in the insulation.
- the signal line 103 of the layer 13 is electrically connected to the first thin film transistor T1 and the second thin film transistor T2.
- the pixel unit 101 used for image display in the display panel 100 is electrically connected only to the driving circuit 102 by using one type of signal wire 103, the receiving of the switching signal and the graphic driving signal can be completed, thereby performing image processing.
- the display thus greatly reduces the difficulty of wiring the pixel unit 101, and provides more layout space for the pixel unit 101, improves the resolution of the display panel 100, and reduces the cost of the display panel 100.
- FIG. 4 is a flowchart of a method for manufacturing the display panel shown in FIG. 1-3 .
- the manufacturing method of the display panel includes the following steps:
- the substrate 11 is provided, and pretreatment is performed on the substrate 11, such as cleaning (clean), PI (polyimide) layer fabrication, and the like.
- pretreatment is performed on the substrate 11, such as cleaning (clean), PI (polyimide) layer fabrication, and the like.
- the material of the substrate 11 can be made of glass or plastic.
- step 402 the driving circuit 102 is disposed on the surface of the substrate 11 side, that is, the plurality of sub driving circuits 1021 are arranged side by side in the first direction on the substrate 11.
- the sub-driving circuit 1021 includes a first thin film transistor T1 and a second thin film transistor T2.
- the first thin film transistor T1 and the second thin film transistor T2 may be a bottom gate N-type thin film transistor or a top gate P-type thin film transistor.
- the first thin film transistor T1 functions as a switching transistor
- the second thin film transistor T2 functions as a driving transistor.
- the substrate 11 provided with the drive circuit 102 is cured, cleaned, or the like.
- a first insulating layer 13 is disposed on the driving circuit 102, and the first insulating layer 13 covers the driving circuit 102.
- the first insulating layer 13 may be formed by a CVD process using silicon nitride (SiNx) and/or silicon oxide (SiOx) materials, and the first insulating layer 13 is also used as a planarization layer to facilitate subsequent components. setting.
- Step 404 patterning the first insulating layer 13 to form a via hole H.
- the through hole H corresponds to a position corresponding to the drains of the first thin film transistor T1 and the second thin film transistor T2 of the sub driving circuit 1021 in the driving circuit 102.
- Step 405 a signal wire 103 is disposed on the surface of the first insulating layer 13, and the signal wire 103 is electrically connected to the driving circuit 102 through the through hole H.
- the signal wires 103 are electrically connected to the drains of the first thin film transistor T1 and the second thin film transistor T2 through the via holes H1, respectively.
- the source (not labeled) and the gate (not labeled) of the first thin film transistor T1 and the second thin film transistor T2 are electrically connected to the driving circuit 102 that provides the image driving image driving signal.
- Step 406 the pixel unit 101 is disposed on the surface of the signal wire 103, and the pixel unit 101 is electrically connected to the signal wire for receiving the image driving signal.
- the driving circuit is located at an intermediate position of the display area 10a and is located between two adjacent rows of pixel units.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
一种显示面板及其制作方法。显示面板的显示区(10a)设置有多个呈矩阵排列的像素单元(101),其中,每个像素单元包括多个不同颜色的子像素单元(101R,101G,101B),显示装置在对应显示区中包括至少一个设置于相邻两行像素单元之间的驱动电路(102),驱动电路包括多个子驱动电路(1021),每个子像素通过一条信号导线(103)与子驱动电路连接,子驱动电路通过信号导线传输图像驱动信号至子像素单元,用于驱动子像素单元进行图像显示。
Description
本发明要求2017年10月20日递交的发明名称为“显示基板及其制作方法”的申请号201710998694.6的在先申请优先权,上述在先申请的内容以引入的方式并入本文本中。
本发明涉及微型有机发光显示装置,尤其涉及微型有机发光二极管的显示面板以及制作方法。
随着有机发光二极管(Organic Light-Emitting Diode,OLED)技术持续发展,在照明和显示应用中越来越多地发现了基于半导体的LED。例如,在大面积室外显示器、室内和室外照明中存在基于半导体的LED。微型有机发光二极管(Micro Organic Light-Emitting Diode,Micro-LED)在近年也开始逐渐应用到消费性电子领域,例如智能手表等。
但是,随着用户对显示装置图像显示效果要求的提高,也即是显示装置中显示面板的分辨率的提高产生了较大的需求,导致显示面板用于提供扫描信号与图像信号的数据线急剧增加,进而增加了显示面板布线难度。
发明内容
为解决显示布线较为困难的问题,本发明提供一种布线较为容易的显示面板。
进一步,提供前述显示面板的制作方法。
一种显示面板,显示区内设有多个呈矩阵排列的像素单元,其中,每个像素单元包括多个不同颜色的子像素单元,显示面板在对应显示区中包括至少一个设置于相邻两行所述像素单元之间的驱动电路,所述驱动电路包括多个子驱动电路,每个所述子像素至少通过一条信号导线与所述子驱动电路连接,所述子驱动电路所述通过所述信号导线传输图像驱动信号至所述子像素单元,用于 驱动所述子像素单元进行图像显示。
一种显示面板的制作方法,
提供基板;
在所述基板一侧设置驱动电路;
于所述电路表面形成第一绝缘层,所述第一绝缘层覆盖所述驱动电路;
图案化所述第一绝缘层,形成通孔,部分所述驱动电路自所述通孔显露出;
在所述第一绝缘层表面形成信号导线,所述信号导线通过所述通孔与所述驱动电路电性连接;以及
于所述信号导线表面设置像素单元,所述像素单元与所述信号导线电性连接;
其中,每个所述像素单元包括多个不同颜色的子像素单元,所述驱动电路包括多个子驱动电路,每个子像素至少通过一条信号导线与所述子驱动电路连接,所述子驱动电路所述通过所述信号导线传输图像驱动信号至所述子像素单元,用于驱动所述子像素单元进行图像显示。
相较于现有技术,由于显示面板中用作图像显示的像素单元仅采用一种信号导线与驱动电路电性连接,即可完成开关信号与图形驱动信号的接收,从而进行图像显示,从而较大程度减少了像素单元布线难度,并且为像素单元提供更多的布局空间,提高显示面板的分辨率。
为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明一实施例中显示面板的平面结构示意图。
图2为如图1所示部分驱动电路与像素单元的放大结构示意图。
图3为如图2所述一个子驱动电路侧面结构示意图。
图4为图1-3所示显示面板的制作方法流程图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参阅图1,其为本发明一实施例显示面板100的平面结构示意图。
如图1所示,显示面板100显示区10a与非显示区10b,其中,显示区10a内包括分别沿着相互垂直的第一方向X与第二方向Y呈矩阵排列的多个像素单元101。
每个像素单元101包括有三种颜色的子像素101R、101G、101B,也即是包括有红绿蓝(RGB)三种颜色的子像素101R、101G、101B。
同时,在显示区10a中间位置,沿着第一方向X延伸排列的两行像素单元之间设置有驱动电路102。
驱动电路102通过多条信号导线103与多个像素单元101电性连接,具体地,通过每个像素单元102中的三种颜色的子像素101R、101G、101B分别通过所述多条信号线103与驱动电路102电性连接
控制电路104设置于非显示区10b,电性连接所述驱动电路102,用于输出开关信号与图像信号至驱动电路102。
本实施例中,像素单元101中包括的子像素101R、101G、101B均为微型有机发光二极管(Micro LED)。
具体地,请参阅图2,其为如图1所示部分驱动电路102与像素单元101的放大结构示意图。
驱动电路102包括多个子驱动电路1021,所述多个子驱动电路1021沿着第一方向X依次排列设置。
每一个子驱动电路1021通过一条沿着的第二方向Y延伸设置一条信号电信103与一个子像素101R、子像素101G或者子像素101B电性连接。
子驱动电路1021在控制电路104输出的所述开关信号下处于开启导通状态或者关闭截至状态,当所述子驱动电路1021开启导通时,所述图像驱动信 号自所述子驱动电路传输至对应的所述子像素101R、子像素101G或者子像素101B。
本实施例中,用于驱动子像素101R、101G、101B的子驱动电路1021包括两个薄膜晶体管与一个电容的驱动架构,当然,可变更地,子驱动电路1021还有采用三个薄膜晶体管与一个电容的形式,并不以此为限。
请参阅图3,其为如图2所述一个子驱动电路1021侧面结构示意图。
如图3所示,显示面板100包括基底11、子驱动电路1021、第一绝缘层13、信号导线103以及像素单元101中的子像素101B沿着与第一方向X、第二方向Y所在平面垂直的方向依次层叠设置于所述基底11的表面,也即是子驱动电路1021、第一绝缘层13、信号导线103以及像素单元101中的子像素101B沿着基底11厚度方向依次层叠设置。其中,第一绝缘层13部分覆盖所述驱动电路,所述信号导线103沿着第二方向Y穿过所述第一绝缘层13的通孔H与子驱动电路1021电性连接。所述像素单元101中的子像素101B设置于所述信号导线103表面,并且与信号导线103电性连接。本实施例中,所述像素单元101中的蓝色子像素101B,可以理解,像素单元101中的其他子像素的连接结构类似,例如与子驱动电路1021层叠设置的红色子像素101G或者绿色子像素101G。
其中,子驱动电路1021包括第一薄膜晶体管T1与第二薄膜晶体管T2,其中,第一薄膜晶体管T1作为开关晶体管,用于电性电性连接控制电路104,第二薄膜晶体管T2作为驱动晶体管,用于电性连接像素单元101中的子像素101B。需要说的是,子驱动电路1021中的电容在图3中并未示出。
第一绝缘层13可以采用氮化硅(SiNx)和/或者氧化硅(SiOx)材料制成,且所述第一绝缘层13还用作平坦化层(Planarization Layer),以便于后续信号导线103与像素单元101的设置。第一绝缘层13可以通过掩膜板与光阻的配合形成通孔H,通孔H将第一薄膜晶体管T1与第二薄膜晶体管T2对应的电性连接部分显露出,以便于设置于在绝缘层13的信号导线103与第一薄膜晶体管T1与第二薄膜晶体管T2电性连接。
相较于现有技术,由于显示面板100中用作图像显示的像素单元101仅采用一种信号导线103与驱动电路102电性连接,即可完成开关信号与图形驱动信号的接收,从而进行图像显示,从而较大程度减少了像素单元101布线难度, 并且为像素单元101提供更多的布局空间,提高显示面板100的分辨率,同时降低显示面板100的成本。
请参阅图4,其为图1-3所示显示面板的制作方法流程图。
如图4所示,显示面板的制作方法包括步骤:
步骤401,提供基板11,并且针对基板11进行预处理,例如清洗(Clean)、PI(polyimide)层制作等。所述基板11材质可以为玻璃或者塑胶材质。
步骤402,在所述基板11一侧的表面设置驱动电路102,也即是在基板11沿着第一方向并列设置所述多个子驱动电路1021。
其中,子驱动电路1021包括第一薄膜晶体管T1与第二薄膜晶体管T2。第一薄膜晶体管T1与第二薄膜晶体管T2可以为底栅极N型薄膜晶体管,也可以为顶栅极P型薄膜晶体管。其中,第一薄膜晶体管T1作为开关晶体管,第二薄膜晶体管T2作为驱动晶体管。
另外,针对设置有驱动电路102的基板11固化、清洗(Clean)等处理。
步骤403,在所述驱动电路102上设置第一绝缘层13,所述第一绝缘层13覆盖所述驱动电路102。第一绝缘层13可以采用氮化硅(SiNx)和/或者氧化硅(SiOx)材料通过CVD制程形成,且所述第一绝缘层13还用作平坦化层(Planarization Layer),便于后续其他元件的设置。
步骤404,图案化所述第一绝缘层13,形成通孔H。其中,通孔H对应驱动电路102中子驱动电路1021第一薄膜晶体管T1以及第二薄膜晶体管T2漏极对应的位置。
步骤405,在所述第一绝缘层13表面设置信号导线103,所述信号导线103通过所述通孔H与所述驱动电路102电性连接。具体地,信号导线103通过通孔H1分别与第一薄膜晶体管T1与第二薄膜晶体管T2的漏极电性连接。当然,第一薄膜晶体管T1与第二薄膜晶体管T2的源极(未标示)与栅极(未标示)则与提供图像驱图像驱动信号的驱动电路102电性连接。
步骤406,将像素单元101设置于所述信号导线103表面,并且所述像素单元101与所述信号导线电性连接,用于接收所述图像驱动信号。
其中,需要说明的是,所述驱动电路位于显示区10a中间位置,且位于相邻两行像素单元之间。
以上所述的实施方式,并不构成对该技术方案保护范围的限定。任何在上 述实施方式的精神和原则之内所作的修改、等同替换和改进等,均应包含在该技术方案的保护范围之内。
Claims (10)
- 一种显示面板,显示区内设多个呈矩阵排列的像素单元,每个所述像素单元包括多个不同颜色的子像素单元,其中,所述显示面板在所述显示区中包括至少一个设置于相邻两行所述像素单元之间的驱动电路,所述驱动电路包括多个子驱动电路,每个所述子像素通过一条信号导线与所述子驱动电路连接,所述子驱动电路所述通过所述信号导线传输图像驱动信号至所述子像素单元,用于驱动所述子像素单元进行图像显示。
- 根据权利要求1所述的显示面板,其中,所述多个子驱动电路沿着第一方向并列设置,所述信号导线沿着第二方向设置并且电性连接所述子驱动电路与对应的子像素单元,所述第一方向垂直于所述第二方向。
- 根据权利要求2所述的显示面板,其中,所述显示面板在非显示区设置有控制电路,所述控制电路电性连接所述驱动电路中的所述多个子驱动电路,所述控制电路同时输出开关信号与图像驱动信号至所述驱动电路,所述开关信号用于控制所述多个子驱动电路的开启导通时序,并且当所述子驱动电路开启导通时,所述图像驱动信号自所述子驱动电路传输至对应的所述像素单元。
- 根据权利要求1所述的显示面板,其中,所述显示面板包括基底,所述驱动电路、第一绝缘层、信号导线以及像素单元依次层叠设置于所述基底表面,所述第一绝缘层部分覆盖所述驱动电路,所述信号导线沿着第二方向穿过所述第一绝缘层与所述驱动电路电性连接,所述像素单元设置于所述信号导线表面并与所述信号导线电性连接。
- 根据权利要求4所述的显示面板,其中,所述子驱动电路均位于基底表面的同一层设置,所述子驱动电路包括至少两个薄膜晶体管。
- 根据权利要求1所述的显示面板,其中,所述子像素单元均为微型有机发光二极管。
- 一种显示面板的制作方法,其中,包括:提供基板;在所述基板一侧设置驱动电路;于所述驱动电路表面形成第一绝缘层,所述第一绝缘层覆盖所述驱动电路;图案化所述第一绝缘层,形成通孔,部分所述驱动电路自所述通孔显露出;在所述第一绝缘层表面形成信号导线,所述信号导线通过所述通孔与所述驱动电路电性连接;以及于所述信号导线表面设置像素单元,所述像素单元与所述信号导线电性连接;其中,每个所述像素单元包括多个不同颜色的子像素单元,所述驱动电路包括多个子驱动电路,每个子像素通过一条信号导线与所述子驱动电路连接,所述子驱动电路所述通过所述信号导线传输图像驱动信号至所述子像素单元,用于驱动所述子像素单元进行图像显示。
- 根据权利要求7所述的显示面板的制作方法,其中,所述多个子驱动电路沿着第一方向并列设置,所述信号导线沿着第二方向设置并且电性连接所述子驱动电路与对应的子像素单元,所述第一方向垂直于所述第二方向。
- 根据权利要求8所述的显示面板的制作方法,其中,所述子驱动电路均位于基底表面的同一层设置,所述子驱动电路包括至少两个薄膜晶体管。
- 根据权利要求9所述的显示面板的制作方法,其中,所述子像素单元均为微型有机发光二极管。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/087,555 US10896933B2 (en) | 2017-10-20 | 2018-01-24 | Display substrate and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710998694.6A CN107768409B (zh) | 2017-10-20 | 2017-10-20 | 显示基板及其制作方法 |
CN201710998694.6 | 2017-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019075951A1 true WO2019075951A1 (zh) | 2019-04-25 |
Family
ID=61269242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/073976 WO2019075951A1 (zh) | 2017-10-20 | 2018-01-24 | 显示基板及其制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10896933B2 (zh) |
CN (1) | CN107768409B (zh) |
WO (1) | WO2019075951A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110752240B (zh) * | 2019-10-31 | 2022-03-01 | Oppo广东移动通信有限公司 | 显示装置及电子设备 |
JP2021150599A (ja) * | 2020-03-23 | 2021-09-27 | 株式会社ジャパンディスプレイ | 表示装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060038848A (ko) * | 2004-11-01 | 2006-05-04 | 주식회사 대우일렉트로닉스 | 유기 el 디스플레이 장치의 화소구조 |
US20120175647A1 (en) * | 2007-10-23 | 2012-07-12 | Sony Corporation | Display device and electronic apparatus |
CN103489894A (zh) * | 2013-10-09 | 2014-01-01 | 合肥京东方光电科技有限公司 | 有源矩阵有机电致发光显示器件、显示装置及其制作方法 |
CN103778886A (zh) * | 2012-10-19 | 2014-05-07 | 株式会社日本显示器 | 显示装置 |
CN103943059A (zh) * | 2013-03-21 | 2014-07-23 | 上海天马微电子有限公司 | 一种有机电致发光显示器及驱动方法 |
CN104036726A (zh) * | 2014-05-30 | 2014-09-10 | 京东方科技集团股份有限公司 | 像素电路及其驱动方法、oled显示面板和装置 |
CN105489162A (zh) * | 2016-02-19 | 2016-04-13 | 友达光电股份有限公司 | 一种显示面板的信号驱动电路 |
CN106157877A (zh) * | 2015-03-31 | 2016-11-23 | 上海和辉光电有限公司 | 像素结构和显示装置 |
CN106601772A (zh) * | 2016-12-13 | 2017-04-26 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示面板、装置及制备方法 |
WO2017074103A1 (en) * | 2015-10-30 | 2017-05-04 | LG Display Co.,Ltd. | Electro-luminescence display apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8803857B2 (en) * | 2011-02-10 | 2014-08-12 | Ronald S. Cok | Chiplet display device with serial control |
US9177520B2 (en) * | 2011-08-11 | 2015-11-03 | Sharp Kabushiki Kaisha | Display device |
US8803929B2 (en) * | 2012-03-07 | 2014-08-12 | Eastman Kodak Company | Display pixels with alternating colors |
US10580832B2 (en) * | 2013-01-18 | 2020-03-03 | Universal Display Corporation | High resolution low power consumption OLED display with extended lifetime |
US20170287987A9 (en) * | 2013-01-18 | 2017-10-05 | Universal Display Corporation | High resolution low power consumption oled display with extended lifetime |
CN103487961B (zh) * | 2013-10-22 | 2016-01-06 | 合肥京东方光电科技有限公司 | 显示面板检测方法 |
CN103943032B (zh) * | 2014-04-01 | 2016-03-02 | 京东方科技集团股份有限公司 | 一种阵列基板及显示装置 |
CN104966482B (zh) * | 2015-07-27 | 2018-04-20 | 京东方科技集团股份有限公司 | 数据驱动电路及其驱动方法、数据驱动***和显示装置 |
US11170718B2 (en) * | 2017-05-12 | 2021-11-09 | Boe Technology Group Co., Ltd. | Display panel, display device and compensating method |
-
2017
- 2017-10-20 CN CN201710998694.6A patent/CN107768409B/zh active Active
-
2018
- 2018-01-24 US US16/087,555 patent/US10896933B2/en active Active
- 2018-01-24 WO PCT/CN2018/073976 patent/WO2019075951A1/zh active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060038848A (ko) * | 2004-11-01 | 2006-05-04 | 주식회사 대우일렉트로닉스 | 유기 el 디스플레이 장치의 화소구조 |
US20120175647A1 (en) * | 2007-10-23 | 2012-07-12 | Sony Corporation | Display device and electronic apparatus |
CN103778886A (zh) * | 2012-10-19 | 2014-05-07 | 株式会社日本显示器 | 显示装置 |
CN103943059A (zh) * | 2013-03-21 | 2014-07-23 | 上海天马微电子有限公司 | 一种有机电致发光显示器及驱动方法 |
CN103489894A (zh) * | 2013-10-09 | 2014-01-01 | 合肥京东方光电科技有限公司 | 有源矩阵有机电致发光显示器件、显示装置及其制作方法 |
CN104036726A (zh) * | 2014-05-30 | 2014-09-10 | 京东方科技集团股份有限公司 | 像素电路及其驱动方法、oled显示面板和装置 |
CN106157877A (zh) * | 2015-03-31 | 2016-11-23 | 上海和辉光电有限公司 | 像素结构和显示装置 |
WO2017074103A1 (en) * | 2015-10-30 | 2017-05-04 | LG Display Co.,Ltd. | Electro-luminescence display apparatus |
CN105489162A (zh) * | 2016-02-19 | 2016-04-13 | 友达光电股份有限公司 | 一种显示面板的信号驱动电路 |
CN106601772A (zh) * | 2016-12-13 | 2017-04-26 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示面板、装置及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107768409B (zh) | 2021-05-28 |
CN107768409A (zh) | 2018-03-06 |
US10896933B2 (en) | 2021-01-19 |
US20200295094A1 (en) | 2020-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10068888B2 (en) | Making semiconductor devices with alignment bonding and substrate removal | |
CN109786421B (zh) | 一种显示装置、显示背板及制作方法 | |
WO2019223567A1 (zh) | 显示基板、显示装置以及显示基板的制作方法 | |
WO2020001032A1 (zh) | 包括像素岛的装置及其制备方法以及显示装置 | |
CN104425556B (zh) | 发光装置、发光装置的制造方法以及电子设备 | |
TWI660498B (zh) | 有機發光顯示裝置及其製造方法 | |
US20170110521A1 (en) | Transparent display apparatus | |
KR20200076581A (ko) | 디스플레이 모듈 및 디스플레이 모듈의 제조 방법 | |
US10916605B2 (en) | Display substrate, method of manufacturing the same, and display device | |
US20160172562A1 (en) | Method for forming Circuit-on-Wire | |
US10497682B2 (en) | Backplane LED integration and functionalization structures | |
TWI424411B (zh) | 電致發光裝置 | |
WO2016202071A1 (zh) | 触控面板及其制备方法、显示装置 | |
JP6014340B2 (ja) | 表示装置 | |
WO2016122125A1 (en) | Display device using semiconductor light emitting devices and method for manufacturing the same | |
TWI684270B (zh) | 透明顯示面板及其製造方法 | |
WO2021051729A1 (zh) | 有机发光二极管显示面板及有机发光二极管显示装置 | |
US9299725B2 (en) | Fabrication process using circuit-on-wire | |
WO2019075951A1 (zh) | 显示基板及其制作方法 | |
KR20180025425A (ko) | 반도체 장치 및 그 제조 방법 | |
JP4673304B2 (ja) | 表示装置、表示装置の製造方法 | |
WO2019237786A1 (zh) | 双面显示面板及其制备方法、双面显示装置 | |
CN110047896A (zh) | 显示基板及其制造方法、显示装置 | |
WO2022110015A1 (zh) | 显示基板、显示面板、显示装置 | |
KR20180023155A (ko) | 유기발광 표시장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18868209 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18868209 Country of ref document: EP Kind code of ref document: A1 |