WO2019059602A3 - 발광 다이오드 패키지 - Google Patents
발광 다이오드 패키지 Download PDFInfo
- Publication number
- WO2019059602A3 WO2019059602A3 PCT/KR2018/010940 KR2018010940W WO2019059602A3 WO 2019059602 A3 WO2019059602 A3 WO 2019059602A3 KR 2018010940 W KR2018010940 W KR 2018010940W WO 2019059602 A3 WO2019059602 A3 WO 2019059602A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- emitting diode
- diode package
- hole
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
발광 다이오드 패키지는 그 일부가 제거되어 형성된 관통홀을 가지는 기판, 상기 기판 상에 제공되며 제1 체결 부재와 전기적으로 연결된 제1 단자 및 제2 체결 부재와 전기적으로 연결된 제2 단자, 상기 기판 상에 제공되며, 상기 제1 및 제2 단자와 연결된 발광 다이오드 칩, 상기 제1 및 제2 체결 부재 중 적어도 하나와 결합되며 상기 관통홀 내에 제공된 코어, 및 상기 관통 홀 내에 제공되며 상기 관통 홀의 내주면을 커버하는 단자 절연부를 포함한다.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010022604.1A CN111192953B (zh) | 2017-09-19 | 2018-09-17 | 发光二极管封装件 |
CN201880040215.2A CN110770922B (zh) | 2017-09-19 | 2018-09-17 | 发光二极管封装件 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170120164A KR102506588B1 (ko) | 2017-09-19 | 2017-09-19 | 발광 다이오드 패키지 |
KR10-2017-0120164 | 2017-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2019059602A2 WO2019059602A2 (ko) | 2019-03-28 |
WO2019059602A3 true WO2019059602A3 (ko) | 2019-05-09 |
Family
ID=65810684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2018/010940 WO2019059602A2 (ko) | 2017-09-19 | 2018-09-17 | 발광 다이오드 패키지 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102506588B1 (ko) |
CN (2) | CN111192953B (ko) |
WO (1) | WO2019059602A2 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110111049A (ko) * | 2010-04-02 | 2011-10-10 | 주식회사 아이에스티 | 발광 다이오드 패키지 및 그 제조방법 |
KR20110126456A (ko) * | 2010-05-17 | 2011-11-23 | 삼성엘이디 주식회사 | 발광다이오드 모듈 |
KR20130127838A (ko) * | 2012-05-15 | 2013-11-25 | 삼성전자주식회사 | 발광소자 패키지 |
KR20150077208A (ko) * | 2013-12-27 | 2015-07-07 | 서울바이오시스 주식회사 | 반도체 소자 패키지, 이를 포함하는 발광 다이오드 패키지 및 광학 모듈 |
KR20170030057A (ko) * | 2015-09-08 | 2017-03-16 | 서울바이오시스 주식회사 | 발광 다이오드 패키지 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3566189B2 (ja) * | 2000-08-10 | 2004-09-15 | 大東金属株式会社 | 外装板の取付金具 |
KR20120039590A (ko) * | 2012-03-08 | 2012-04-25 | 장일호 | 고출력 백색광 엘이디 패키지 모듈 및 그 제조방법 |
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2017
- 2017-09-19 KR KR1020170120164A patent/KR102506588B1/ko active IP Right Grant
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2018
- 2018-09-17 CN CN202010022604.1A patent/CN111192953B/zh active Active
- 2018-09-17 WO PCT/KR2018/010940 patent/WO2019059602A2/ko active Application Filing
- 2018-09-17 CN CN201880040215.2A patent/CN110770922B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110111049A (ko) * | 2010-04-02 | 2011-10-10 | 주식회사 아이에스티 | 발광 다이오드 패키지 및 그 제조방법 |
KR20110126456A (ko) * | 2010-05-17 | 2011-11-23 | 삼성엘이디 주식회사 | 발광다이오드 모듈 |
KR20130127838A (ko) * | 2012-05-15 | 2013-11-25 | 삼성전자주식회사 | 발광소자 패키지 |
KR20150077208A (ko) * | 2013-12-27 | 2015-07-07 | 서울바이오시스 주식회사 | 반도체 소자 패키지, 이를 포함하는 발광 다이오드 패키지 및 광학 모듈 |
KR20170030057A (ko) * | 2015-09-08 | 2017-03-16 | 서울바이오시스 주식회사 | 발광 다이오드 패키지 |
Also Published As
Publication number | Publication date |
---|---|
KR102506588B1 (ko) | 2023-03-07 |
WO2019059602A2 (ko) | 2019-03-28 |
KR20190031902A (ko) | 2019-03-27 |
CN111192953B (zh) | 2023-11-03 |
CN111192953A (zh) | 2020-05-22 |
CN110770922A (zh) | 2020-02-07 |
CN110770922B (zh) | 2023-11-03 |
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