WO2019033839A1 - 一种石墨、铜复合导热材料的制备方法 - Google Patents

一种石墨、铜复合导热材料的制备方法 Download PDF

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WO2019033839A1
WO2019033839A1 PCT/CN2018/090565 CN2018090565W WO2019033839A1 WO 2019033839 A1 WO2019033839 A1 WO 2019033839A1 CN 2018090565 W CN2018090565 W CN 2018090565W WO 2019033839 A1 WO2019033839 A1 WO 2019033839A1
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graphite
copper
composite heat
conductive material
copper composite
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PCT/CN2018/090565
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English (en)
French (fr)
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赖优萍
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苏州格优碳素新材料有限公司
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Publication of WO2019033839A1 publication Critical patent/WO2019033839A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Definitions

  • the present application relates to the field of preparation of heat conductive materials, and in particular to a method for preparing a graphite and copper composite heat conductive material.
  • the existing thermal products used in electronic products have XY axial thermal conductivity of 800-2000W/(m ⁇ K), but Z-axis thermal conductivity is only 15W/(m ⁇ K) or less, and also has XYZ thermal conductivity. They are not very high copper and aluminum products, and their thermal conductivity is only 300-400W/(m ⁇ K). With the development of technology, these two types of products can no longer meet the user's demand for heat dissipation of electronic products.
  • CN106847767A discloses a graphite copper foil composite heat sink comprising a mesh copper foil and a graphite film composited on at least one side of the mesh copper foil by a calendering technique, the mesh copper foil having a porosity of 40-80 %, the pore size is 0.002-2mm.
  • the graphite film is laminated on the mesh copper foil by calendering.
  • CN105018775B discloses a method for preparing a graphite/copper composite material for sliding electrical conduction, which is prepared by mixing copper powder and zirconium powder into a mixed powder-coated graphite block, and performing vacuum high-temperature infiltration in a crucible to obtain a graphite/copper composite material.
  • CN206170766U discloses a graphite copper foil film comprising two graphite substrate layers and a copper foil substrate layer, the graphite substrate layer being disposed on both sides of the copper foil substrate layer, the graphite substrate The layer and the copper foil substrate layer are bonded to each other by a spur treatment.
  • the above method improves the mechanical properties and heat dissipation effect of the copper and graphite composites to a certain extent, but the degree of improvement is still insufficient, and a new method needs to be developed to improve the thermal conductivity of the material in the XYZ direction.
  • the invention provides a preparation method of a graphite and copper composite heat conductive material, wherein the prepared graphite and copper composite heat conductive material have a thermal conductivity of 300 W/MK or more in the Z-axis direction and a thermal conductivity of 800 W/MK or more in the XY axis direction, and
  • the graphite film and copper are tightly combined and are not easy to fall off, and the process is greatly reduced, the production cost is lowered, and the application prospect is good.
  • the application provides a method for preparing a graphite and copper composite heat conductive material, which comprises: electroplating copper on the surface of the artificial graphite film to obtain a graphite and copper composite heat conductive material.
  • the composite of the artificial graphite material and the copper is realized by the method of electroplating.
  • the copper forms a plating layer having a thickness of only 3-10 ⁇ m on the surface of the graphite film, and the combination thereof is more compact. It is difficult to delaminate and fall off; and electroplating reduces production processes and reduces labor and equipment costs; finally, graphite and copper composite thermal conductive materials with a thermal conductivity of 300 W/MK or more in the Z-axis direction and a thermal conductivity of 800 W/MK or more in the XY-axis direction are obtained. .
  • the artificial graphite film is preferably in the form of a roll.
  • the thickness of the electroplated copper post-plating layer is 3-10 ⁇ m, for example, 3 ⁇ m, 4 ⁇ m, 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m or 10 ⁇ m, and a specific point value between the above values, limited to the length
  • the embodiments of the present invention are not exhaustively enumerated.
  • the manner of electroplating is preferably vacuum plating and/or water plating, but is not limited thereto.
  • the operation of electroplating copper on the surface of the artificial graphite film is as follows: firstly, a layer of copper is plated on the surface of the artificial graphite film by vacuum plating, and then copper plating is continued by water plating. Vacuum plating can obtain a fine coating, which can make a good combination of plating and product, but the coating is thin (0.05-0.2 ⁇ m), and then a thicker coating (3-10 ⁇ m) is obtained by water plating. In combination, a copper-plated layer having a good thickness and a certain thickness can be obtained on the surface of the artificial graphite film.
  • the vacuum plating plating layer has a thickness of 0.05-0.2 ⁇ m, preferably 0.1 ⁇ m, and may be, for example, 0.05 ⁇ m, 0.07 ⁇ m, 0.09 ⁇ m, 0.1 ⁇ m, 0.12 ⁇ m, 0.14 ⁇ m, 0.16 ⁇ m, 0.18 ⁇ m. Or 0.2 ⁇ m, and the specific point values between the above values, limited to the length and for the sake of brevity, the embodiments of the present invention are not exhaustively enumerated.
  • the water plating plating layer has a thickness of 3-10 ⁇ m, preferably 3-5 um, and may be, for example, 3 um, 4 um, 5 um, 6 um, 7 um, 8 um, 9 um or 10 um, and specific between the above values. Point values, limited by space and for the sake of brevity, the embodiments of the present invention are not exhaustively enumerated.
  • the obtained graphite and copper composite heat conductive material is baked; the baking temperature is 80-120 ° C, for example, 80 ° C, 85 ° C, 90 ° C, 95 ° C, 100 ° C, 105 ° C, 110 ° C, 115 ° C or 120 ° C, and the specific values between the above values, limited by the space and for the sake of brevity, the embodiments of the present invention are not exhaustive.
  • the obtained graphite and copper composite heat conductive material is in the form of a roll; the rolled graphite and copper composite heat conductive material has a length of ⁇ 200 m, and may be, for example, 200 m, 210 m, 230 m, 250 m, 280 m, 300 m, 350 m,
  • the specific values of 400m, 450m or 500m, and the like, and other than 200m are limited, and the embodiments of the present invention are not exhaustively listed for the sake of brevity.
  • the graphite and copper composite heat conductive material obtained by the embodiment of the invention has a roll shape, and the length of the material is ⁇ 200 m. Compared with the combination of sheet graphite and copper foil, the graphite and copper composite heat conductive materials have a roll shape without intermediate spacing loss, which reduces the loss of materials.
  • the obtained rolled graphite or copper composite heat conductive material is packaged.
  • the process for preparing the graphite and copper composite heat conductive material according to the embodiment of the invention comprises the following steps:
  • a smooth and smooth copper plating layer is obtained on the surface of the artificial graphite film, and the thinning layer is 3 ⁇ m, and the prepared graphite and copper composite heat conductive material can have a thermal conductivity of 300 W/MK or more in the Z-axis direction, XY.
  • the thermal conductivity in the axial direction is above 800 W/MK.
  • the close combination of the artificial graphite film and the copper is realized by electroplating, and in the environment of the subsequent electronic product use, the delamination phenomenon does not occur, and the safety of the electronic product is greatly improved.
  • the surface of the original film is cleaned by copper plating, and the surface spot defects are reduced.
  • the graphite film is used to fix the original film during the electroplating process, which can reduce the shrinkage rate during the processing of the original film.
  • the embodiment of the invention realizes the continuous copper plating treatment of the artificial graphite film, reduces the multiple bonding process of the single product in the traditional method, does not require a large amount of manual and machine for lamination, and reduces labor and equipment costs; At the same time, the length of the packaged product is more than 200m, which greatly reduces the wear and tear of the next process (or system manufacturer) and reduces the consumption of the next process by about 10%, which has good economic benefits.
  • a 0.1 ⁇ m copper plating layer is firstly plated on the surface of the artificial graphite film by vacuum plating, and then a 3 ⁇ m copper plating layer is plated by water plating to obtain a graphite and copper composite heat conductive material;
  • the material obtained after the baking in the step (2) is calendered by a calender to obtain a rolled graphite or copper composite heat conductive material having a length of 250 m; and then the rolled graphite or copper composite heat conductive material is packaged.
  • a 5 ⁇ m copper plating layer is plated on the surface of the artificial graphite film by water to obtain a graphite and copper composite heat conductive material;
  • the material obtained after the baking in the step (2) is calendered by a calender to obtain a rolled graphite or copper composite heat conductive material having a length of 300 m; and then the rolled graphite or copper composite heat conductive material is packaged.
  • a 0.15 ⁇ m copper plating layer is firstly vacuum-plated, and then a 4 ⁇ m copper plating layer is plated by water plating to obtain a graphite and copper composite heat conductive material;
  • the material obtained after the baking in the step (2) is calendered by a calender to obtain a rolled graphite or copper composite heat conductive material having a length of 250M.
  • the material obtained after the baking in the step (2) is calendered by a calender to obtain a rolled graphite or copper composite heat conductive material having a length of 250 M; and then the rolled graphite and copper composite heat conductive material is packaged.
  • a 0.1 ⁇ m copper plating layer is firstly vacuum-plated, and then a 3.5 ⁇ m copper plating layer is plated by water plating to obtain a graphite and copper composite heat conductive material.
  • a 0.1 ⁇ m copper plating layer is firstly plated on the surface of the artificial graphite film by vacuum plating, and then a 5 ⁇ m copper plating layer is plated by water plating to obtain a graphite and copper composite heat conductive material;

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

本申请涉及一种石墨、铜复合导热材料的制备方法，所述方法为：在人造石墨薄膜表面进行电镀铜，得到石墨、铜复合导热材料。本申请利用电镀的方法实现了人造石墨材料和铜的复合，较相关技术中的"贴合"而言，铜在石墨薄膜表面形成厚度仅为3-10μm的镀层，二者结合更为紧密，难以分层脱落；本申请同时可以减少表面点状不良缺陷和原膜加工过程中的收缩率；得到的石墨、铜复合导热材料具有良好的导热性能，Z轴方向导热系数可达300W/MK以上，XY轴方向导热系数在800W/MK以上。本申请减少了生产工序，大大降低了人工和设备成本，适用于工业化生产，具有良好的经济效益和广阔的应用前景。

Description

一种石墨、铜复合导热材料的制备方法 技术领域
本申请涉及导热材料制备领域，具体涉及一种石墨、铜复合导热材料的制备方法。
背景技术
随着电子产品的发展，用户对电子产品高性能要求，各项电子产品零件的功率越来越高，因而对材料的散热性能提出了更高的要求。现有的电子产品使用的导热产品有X-Y轴向导热性能在800-2000W/(m·K)，但Z轴向导热性能只有15W/(m·K)以下的人造石墨，也有XYZ方向导热系数均不是很高的铜铝产品，其导热系数只有300-400W/(m·K)。随着科技的发展，这两类产品已经不能满足用户对电子产品散热的需求。当前，用户需要的是一种在XYZ方向上都能快速传导热量，同时有助于减少电子产品表面问题，能够保护电子产品、延长电子产品寿命的导热材料。而现在市场上针对上述问题，只是简单的将人造石墨和铜铝产品进行简单的贴合，而贴合的产品普遍存在以下缺点：
(1)现在电子产品越来越薄，结合使用厚度上已经无法满足电子产品的空间需求(现在用户给予的空间基本在50μm-100μm之间)；
(2)现在低性能的导热产品(铜、铝等)和单一XY方向导热高的产品(人造石墨)结合，都是用不干胶进行贴合，在电子产品的使用环境下容易溢胶同时易导致分层脱落；
(3)现在低性能的导热产品(铜、铝等)和单一XY导热高的产品(人造石墨)结合，在生产工艺上因为要互相贴合，浪费材料，同时增加工时，增加产品的生产成本。
CN106847767A公开了一种石墨铜箔复合散热片，包括网状铜箔，以及通过压延成型技术复合在网状铜箔的至少一面上的石墨膜，所述网状铜箔的孔隙率为40-80％，孔径大小为0.002-2mm。采用压延技术将石墨膜复合在网状铜箔上。
CN105018775B公开了一种滑动导电用石墨/铜复合材料的制备方法，用铜粉和锆粉配置成混合粉末包裹石墨块，在坩埚中进行真空高温熔渗，获得石墨/铜复合材料。
CN206170766U公开了一种石墨铜箔膜片，该石墨铜箔膜片包括两个石墨基材层和一个铜箔基材层，石墨基材层设置在铜箔基材层的两侧，石墨基材层与铜箔基材层之间通过冲刺处理相互结合。
上述方法一定程度上提高了铜和石墨复合材料的机械性能和散热效果，但其提升的程度仍然不足，需要开发新的方法以提升材料在XYZ方向上的导热系数。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请提供了一种石墨、铜复合导热材料的制备方法，制备得到的石墨、铜复合导热材料的Z轴方向导热系数可达300W/MK以上，XY轴方向导热系数在800W/MK以上，且石墨薄膜和铜结合紧密，不易脱落，同时大大减少了工序，降低了生产成本，具有良好的应用前景。
为达到上述目的，本申请采用以下技术方案：
本申请提供了一种石墨、铜复合导热材料的制备方法，所述方法为：在人造石墨薄膜表面进行电镀铜，得到石墨、铜复合导热材料。
本申请利用电镀的方法实现了人造石墨材料和铜的复合，较相关技术中的 “贴合”而言，铜在石墨薄膜表面形成厚度仅为3-10μm的镀层，二者结合更为紧密，难以分层脱落；且电镀减少了生产工序，降低人工和设备成本；最终得到了Z轴方向导热系数可达300W/MK以上，XY轴方向导热系数在800W/MK以上的石墨、铜复合导热材料。
根据本发明实施例，所述人造石墨薄膜优选为卷状。
根据本发明实施例，所述电镀铜后镀层的厚度为3-10μm，例如可以是3μm、4μm、5μm、6μm、7μm、8μm、9μm或10μm，以及上述数值之间的具体点值，限于篇幅及出于简明的考虑，本发明实施例不再穷尽列举。
根据本发明实施例，所述电镀的方式优选为真空镀和/或水镀，但非仅限于此。
优选地，本发明实施例在人造石墨薄膜表面进行电镀铜的操作为：先利用真空镀在人造石墨薄膜表面镀一层铜，然后利用水镀继续镀铜。真空镀能够获得细密的镀层，可以使镀层和产品很好的结合，但是镀层较薄(0.05-0.2μm)，然后再通过水镀获得较厚的镀层(3-10μm)，两种电镀的方式相结合，能够在人造石墨薄膜表面获得质量好，同时具有一定厚度的镀铜层。
根据本发明实施例，所述真空镀的镀层厚度为0.05-0.2μm，优选为0.1μm，例如可以是0.05μm、0.07μm、0.09μm、0.1μm、0.12μm、0.14μm、0.16μm、0.18μm或0.2μm，以及上述数值之间的具体点值，限于篇幅及出于简明的考虑，本发明实施例不再穷尽列举。
根据本发明实施例，所述水镀的镀层厚度为3-10μm，优选为3-5um，例如可以是3um、4um、5um、6um、7um、8um、9um或10um，以及上述数值之间的具体点值，限于篇幅及出于简明的考虑，本发明实施例不再穷尽列举。
根据本发明实施例，所述电镀铜结束后，对得到的石墨、铜复合导热材料 进行烘烤；所述烘烤的温度为80-120℃，例如可以是80℃、85℃、90℃、95℃、100℃、105℃、110℃、115℃或120℃，以及上述数值之间的具体点值，限于篇幅及出于简明的考虑，本发明实施例不再穷尽列举。
根据本发明实施例，得到的石墨、铜复合导热材料为卷状；所述卷状石墨、铜复合导热材料的长度≥200m，例如可以是200m、210m、230m、250m、280m、300m、350m、400m、450m或500m等，以及其他大于200m的具体数值，限于篇幅及出于简明的考虑，本发明实施例不再穷尽列举。
本发明实施例得到的石墨、铜复合导热材料为卷状，且材料的长度≥200m。相比片材石墨和铜箔带胶复合，石墨、铜复合导热材料为卷状没有中间的间距耗损，降低了材料的损耗。
根据本发明实施例，对得到的卷状石墨、铜复合导热材料进行包装。
优选地，本发明实施例所述制备石墨、铜复合导热材料的工艺包括以下步骤：
(1)在人造石墨薄膜表面进行电镀铜，得到石墨、铜复合导热材料；
(2)将步骤(1)得到的石墨、铜复合导热材料在80-120℃下进行烘烤；
(3)对步骤(2)烘烤后得到的材料进行压延，得到长度≥200m的卷状石墨、铜复合导热材料，对所述卷状石墨、铜复合导热材料进行包装。相关技术相比，本发明实施例至少具有以下有益效果：
(1)本发明实施例在人造石墨薄膜表面得到平整光滑的镀铜层，该镀层最薄为3μm，制备得到的石墨、铜复合导热材料的Z轴方向导热系数可达300W/MK以上，XY轴方向导热系数在800W/MK以上。
(2)本发明实施例通过电镀实现了人造石墨薄膜和铜的紧密结合，在后续电子产品使用环境下，不会产生分层脱落现象，大大提高电子产品的安全性。
(3)本发明实施例采用镀铜处理使得原膜表面清洁，可以减少表面点状不良，电镀过程中采用石墨治具固定原膜，可以减少原膜加工过程中的收缩率。
(4)本发明实施例实现了连续对人造石墨薄膜的镀铜处理，减少了传统方法中单一产品的多次贴合工序，不需要大量的人工和机器进行贴合，降低人工和设备成本；同时得到的卷装产品长度200m以上，大大降低下道工序(或者***制造商)的耗损，减少下道工序耗损约10％，具有良好的经济效益。
具体实施方式
为便于理解本发明实施例，本发明实施例列举实施例如下。本领域技术人员应该明了，所述实施例仅仅是帮助理解本发明实施例，不应视为对本发明实施例的具体限制。
实施例1
(1)在人造石墨薄膜表面先利用真空镀镀一层0.1μm的铜镀层，然后利用水镀再镀一层3μm的铜镀层，得到石墨、铜复合导热材料；
(2)将步骤(1)得到的石墨、铜复合导热材料在85℃下进行烘烤；
(3)利用压延机对步骤(2)烘烤后得到的材料进行压延，得到长度为250m的卷状石墨、铜复合导热材料；然后对所述卷状石墨、铜复合导热材料进行包装。
实施例2
(1)在人造石墨薄膜表面利用水镀镀一层5μm的铜镀层，得到石墨、铜复合导热材料；
(2)将步骤(1)得到的石墨、铜复合导热材料在100℃下进行烘烤；
(3)利用压延机对步骤(2)烘烤后得到的材料进行压延，得到长度为300m的卷状石墨、铜复合导热材料；然后对所述卷状石墨、铜复合导热材料进行包 装。
实施例3
(1)在人造石墨薄膜表面先利用真空镀镀一层0.15μm的铜镀层，然后利用水镀再镀一层4μm的铜镀层，得到石墨、铜复合导热材料；
(2)将步骤(1)得到的石墨、铜复合导热材料在120℃下进行烘烤；
(3)利用压延机对步骤(2)烘烤后得到的材料进行压延，得到长度为250M的卷状石墨、铜复合导热材料。
实施例4
(1)在人造石墨薄膜表面利用真空镀镀一层0.1μm的铜镀层，然后利用水镀再镀一层7μm的铜镀层，得到石墨、铜复合导热材料；
(2)将步骤(1)得到的石墨、铜复合导热材料在90℃下进行烘烤；
(3)利用压延机对步骤(2)烘烤后得到的材料进行压延，得到长度为250M的卷状石墨、铜复合导热材料；然后对所述卷状石墨、铜复合导热材料进行包装。
实施例5
在人造石墨薄膜表面先利用真空镀镀一层0.1μm的铜镀层，然后利用水镀再镀一层3.5μm的铜镀层，得到石墨、铜复合导热材料。
实施例6
(1)在人造石墨薄膜表面先利用真空镀镀一层0.1μm的铜镀层，然后利用水镀再镀一层5μm的铜镀层，得到石墨、铜复合导热材料；
(2)将步骤(1)得到的石墨、铜复合导热材料在110℃下进行烘烤；
(3)利用压延机对步骤(2)烘烤后得到的材料进行压延，得到长度为280M的卷状石墨、铜复合导热材料。
申请人声明，本申请通过上述实施例来说明本申请的详细工艺设备和工艺流程，但本申请并不局限于上述详细工艺设备和工艺流程，即不意味着本申请必须依赖上述详细工艺设备和工艺流程才能实施。所属技术领域的技术人员应该明了，对本申请的任何改进，对本申请产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本申请的保护范围和公开范围之内。

Claims (10)

  1. 一种石墨、铜复合导热材料的制备方法，其中所述方法为：在人造石墨薄膜表面进行电镀铜，得到石墨、铜复合导热材料。
  2. 如权利要求1所述的方法，其中，所述人造石墨薄膜为卷状。
  3. 如权利要求1或2所述的方法，其中，所述电镀铜后镀层的厚度为3-10μm。
  4. 如权利要求1-3任一项所述的方法，其中，所述电镀的方式为真空镀和/或水镀。
  5. 如权利要求1-4任一项所述的方法，其中，所述在人造石墨薄膜表面进行电镀铜的操作为：先利用真空镀在人造石墨薄膜表面镀一层铜，然后利用水镀继续镀铜；
    优选地，所述真空镀的镀层厚度为0.05-0.2μm，优选为0.1μm；
    优选地，所述水镀的镀层厚度为3-10μm，优选为3-5um。
  6. 如权利要求1-5任一项所述的方法，其中，所述电镀铜结束后，对得到的石墨、铜复合导热材料进行烘烤；
    优选地，所述烘烤的温度为80-120℃。
  7. 如权利要求1-6任一项所述的方法，其中，所述烘烤后，对石墨、铜复合导热材料进行压延。
  8. 如权利要求1-7任一项所述的方法，其中，得到的石墨、铜复合导热材料为卷状；
    优选地，所述卷状石墨、铜复合导热材料的长度≥200m。
  9. 如权利要求1-8任一项所述的方法，其中，对所述卷状石墨、铜复合导热材料进行包装。
  10. 如权利要求1-9任一项所述的方法，其中，所述方法包括以下步骤：
    (1)在人造石墨薄膜表面进行电镀铜，得到石墨、铜复合导热材料；
    (2)对步骤(1)得到的石墨、铜复合导热材料在80-120℃下进行烘烤；
    (3)对步骤(2)烘烤后得到的材料进行压延，得到长度≥200m的卷状石墨、铜复合导热材料，对所述卷状石墨、铜复合导热材料进行包装。
PCT/CN2018/090565 2017-08-14 2018-06-11 一种石墨、铜复合导热材料的制备方法 WO2019033839A1 (zh)

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CN108823615A (zh) * 2018-05-23 2018-11-16 嘉兴中易碳素科技有限公司 高导热纳米铜—石墨膜复合材料的制备方法
CN108705167B (zh) * 2018-05-28 2019-10-01 武汉理工大学 石墨烯薄膜金属焊接点的制备方法
CN109338302A (zh) * 2018-08-23 2019-02-15 广东思泉新材料股份有限公司 一种合成石墨无胶粘复合材料的制备方法

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