WO2019015554A1 - 热交换装置及其热交换方法与气相沉积设备 - Google Patents
热交换装置及其热交换方法与气相沉积设备 Download PDFInfo
- Publication number
- WO2019015554A1 WO2019015554A1 PCT/CN2018/095850 CN2018095850W WO2019015554A1 WO 2019015554 A1 WO2019015554 A1 WO 2019015554A1 CN 2018095850 W CN2018095850 W CN 2018095850W WO 2019015554 A1 WO2019015554 A1 WO 2019015554A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling water
- switch
- outlet pipe
- circulating water
- cooled
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4411—Cooling of the reaction chamber walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
- F28F27/02—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/01—Control of temperature without auxiliary power
- G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
- G05D23/1393—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures characterised by the use of electric means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
- G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
- G05D7/0652—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged in parallel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0022—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for chemical reactors
Definitions
- the present invention relates to the field of semiconductor manufacturing, and in particular to a heat exchange device, a heat exchange method thereof and a vapor deposition apparatus.
- FIG. 1 provides a conventional heat exchange device that exchanges heat with a mainframe through factory cooling water and circulating water.
- the heat exchange device works as follows: after the circulating water flowing out of the water tank 101 is pressurized by the water pump 102, the temperature sensor 104, the pressure sensor 105, and the flow meter 106 sequentially flow into the reaction chamber 107. Thereby, the reaction chamber 107 is cooled, and then the circulating water after the heat is absorbed flows to the heat exchanger 108, and is further exchanged with the cooling water of the factory and then returned to the water tank 101.
- the cooling water of the factory is exchanged with the circulating water through the heat exchanger 108. Specifically, the cooling water of the factory flows from the cooling water inlet pipe 110 into the heat exchanger 108, and The cooling water outlet pipe 111 flows out.
- the temperature sensor 104 is used to measure the temperature of the circulating water
- the pressure sensor 105 is used to measure the pressure of the circulating water
- the flow meter 106 is used to detect the flow rate of the circulating water
- the cooling water inlet pipe 110 is provided with a two-way regulating valve 109 for regulating the flow rate of the cooling water for the factory, and these settings enable intelligent control of the temperature of the reaction chamber 107.
- the inventors have found that once the heat exchange device fails, the circulating water will stop flowing, causing the heat of the reaction chamber 107 to be unable to be transferred, and thus the reaction to be carried out at a high temperature (for example, 1100 ° C). The chamber 107 is damaged.
- the object of the present invention is to provide a heat exchange device, a heat exchange method thereof and a vapor deposition device, so as to solve the problem that the heat exchange device in the prior art cannot work in the event of a failure, and the target object to be cooled cannot be thermally transferred and damaged. problem.
- the present invention provides a heat exchange device for performing a temperature-lowering treatment on a target to be cooled, comprising: a heat exchanger, a cooling water passage, a circulation water passage, and a switch, wherein the cooling water passage is used for cooling Heat exchange between the water and the heat exchanger for temperature control of the object to be cooled, the switch for disconnecting the circulation water path from the object to be cooled, and simultaneously A connection of the cooling water path to the object to be cooled is achieved.
- the cooling waterway includes a cooling water inlet pipe and a cooling water outlet pipe connected to the heat exchanger; the circulating waterway includes a circulating water outlet pipe, a circulating water return pipe, and the heat exchanger and the heat exchanger.
- the circulating water outlet pipe, the object to be cooled, and the circulating water return pipe are connected in series to form a circuit.
- the switch includes a first switch and a second switch, wherein the first switch is disposed between the cooling water inlet pipe and the circulating water outlet pipe and is used for disconnecting a part Connecting the circulating water outlet pipe to the object to be cooled, and simultaneously turning on the cooling water inlet pipe and the object to be cooled; the second switch is disposed at the cooling water outlet pipe and the Between the circulating water return pipes and for disconnecting the cooling water outlet pipe and the heat exchanger, and simultaneously turning on the cooling water outlet pipe and the object to be cooled.
- the first switch and the second switch are both three-way valves.
- the circulating water return pipe includes a first circulating water return pipe and a second circulating water return pipe
- the circulating water outlet pipe includes a first circulating water outlet pipe and a second circulating water outlet pipe
- a first end of the first circulating water outlet pipe is connected to the heat exchanger, a second end of the first circulating water outlet pipe is connected to the first switch; and a first end of the second circulating water outlet pipe
- the first switch is connected to the first switch, the second end of the second circulating water outlet pipe is connected to the object to be cooled; the cooling water inlet pipe is connected to the first switch through a first branch;
- a first end of the first circulating water return pipe is connected to the second switch, a second end of the first circulating water return pipe is connected to the object to be cooled; and the second circulating is out of the water inlet pipe
- the first end is connected to the heat exchanger, and the second end of the second circulating water inlet pipe is connected to the second switch; the cooling water outlet pipe is connected to the second switch through a second branch.
- the three-way valve is a pneumatically controlled three-way valve.
- the pneumatic three-way valve has a conveying passage for allowing passage of compressed gas, and the conveying passage is provided with a pressure gauge and a pressure alarm for measuring the pressure of the compressed gas.
- the pressure alarm is used to alarm when the pressure value of the compressed gas is lower than a set value.
- the first switch comprises a first normally closed electromagnetic valve and a first normally open electromagnetic valve
- the second switch comprises a second normally closed electromagnetic valve and a second normally open electromagnetic valve.
- the cooling water inlet pipe is connected to the circulating water outlet pipe through a first branch, and the first normally open electromagnetic valve is disposed on the first branch, the circulating water outlet pipe Providing the first normally closed electromagnetic valve; the cooling water outlet pipe is connected to the circulating water return pipe through a second branch, and the second normally open electromagnetic valve is disposed on the second branch The second normally closed electromagnetic valve is disposed on the circulating water return pipe.
- the cooling water inlet pipe is connected to the circulating water outlet pipe through a first branch, and the first normally closed electromagnetic valve is disposed on the first branch, and the circulating water outlet pipe is Providing the first normally open electromagnetic valve; the cooling water outlet pipe is connected to the circulating water return pipe through a second branch, and the second normally closed solenoid valve is disposed on the second branch
- the circulating water return pipe is provided with the second normally open electromagnetic valve.
- the heat exchange device further includes a controller for controlling energization and de-energization of the first and second normally closed solenoid valves and the first and second normally open solenoid valves.
- the circulating water path is provided with one or more of a temperature sensor, a pressure sensor, and a flow meter.
- the object to be cooled is a process cavity.
- the present invention also provides a heat exchange method of the heat exchange device, comprising:
- the cooling water is sequentially discharged through the circulating water return pipe and the cooling water outlet pipe to exchange heat between the cooling water and the object to be cooled.
- the first switch and the second switch are both three-way valves
- the method for connecting the cooling water inlet pipe and the cooling water outlet pipe to the object to be cooled includes:
- the first switch comprises a first normally closed electromagnetic valve and a first normally open electromagnetic valve
- the second switch comprises a second normally closed electromagnetic valve and a second normally open electromagnetic valve
- the first and second normally open solenoid valves are closed to open the object to be cooled and the cooling water inlet pipe and the cooling water outlet pipe;
- the first and second normally closed solenoid valves are opened to open the connection of the target coolant and the circulating water passage and the heat exchanger.
- the present invention also provides a vapor deposition apparatus including the heat exchange apparatus for temperature control of the vapor deposition apparatus.
- the heat exchange device package includes a heat exchanger, a cooling water passage, a circulation water passage, and a switcher, and the cooling water passage is The heat exchanger performs heat exchange on the circulating water path, and the circulating water path performs temperature control on the object to be cooled, and the switch is configured to disconnect the circulating water path from the object to be cooled, At the same time, the connection of the cooling water path to the object to be cooled is achieved.
- the switch disconnects the circulation waterway from the object to be cooled, and simultaneously realizes the connection between the cooling waterway and the object to be cooled, so that Cooling water is supplied to the object to be cooled by the cooling water channel to cool down, thereby ensuring that the object to be cooled, especially the chemical/physical vapor deposition reaction chamber, can be effectively cooled under any circumstances, thereby ensuring normal production. get on.
- Figure 1 is a schematic view showing the structure of a conventional heat exchange device connected to a reaction chamber
- FIG. 2 is a schematic structural view of a heat exchange device according to Embodiment 1 of the present invention after being connected to a reaction chamber;
- FIG. 3 is a schematic structural view of the heat exchange device shown in FIG. 2 in a fault state
- 4a is a schematic diagram of switching of the first switch and the second switch when the heat exchange device shown in FIG. 2 operates in a normal state;
- 4b is a schematic diagram of switching of the first switch and the second switch when the heat exchange device shown in FIG. 2 operates in a fault state;
- FIG. 5 is a schematic structural view of a heat exchange device according to Embodiment 2 of the present invention after being connected to a reaction chamber;
- Fig. 6 is a structural schematic view showing the heat exchange device shown in Fig. 5 in a fault state.
- 112-air passage 201-first switch; 202-second switch; 203-starting execution unit; 204-solenoid valve; 205-pressure regulating valve; 206-pressure gauge; 207-pressure alarm;
- the structure and operation of the heat exchange device of the present invention will be described in detail by using a heat exchange device to the reaction chamber of the chemical vapor deposition apparatus, but the present invention includes, but is not limited to, a target to be cooled.
- the material is the reaction chamber of the chemical vapor deposition apparatus.
- the heat exchange device 100 includes a heat exchanger 108, a water tank 101, and cooling water.
- the cooling water inlet pipe 110 and the cooling water outlet pipe 111 are both connected to the heat exchanger 108, and the cooling water enters the heat exchanger 108 through the cooling water inlet pipe 110, and the heat-exchanged cooling water passes through the cooling water outlet pipe 111 again. Flow out.
- the heat exchanger 108, the water tank 101, the circulating water outlet pipe 30, the reaction chamber 107, and the circulating water return pipe 40 are sequentially connected in series to form a circuit.
- the cooling water inlet pipe 110 and the cooling water outlet pipe 111 constitute a cooling water passage
- the circulating water outlet pipe 30 and the circulating water return pipe 40 constitute a circulating water passage.
- the first switch 201 and the second switch 202 are both three-way valves, the three-way valve is controlled by the pneumatic execution unit 203 to implement a switching action, and the pneumatic execution unit 203 can be provided by an external device.
- the compressed gas controls the first switch 201 and the second switch 202. That is, the three-way valve may be an air-controlled three-way valve, and the first switch 201 and the second switch 202 may be driven by the same pneumatic actuator unit 203, and the first switch 201 and the second switch 202 form a double.
- the pneumatic actuator unit 203 has an intake line, and the intake line is provided with a solenoid valve 204 for controlling the opening and closing of the intake line.
- a pressure regulating valve 205 may be disposed in the intake line, and the pressure regulating valve 205 is configured to adjust a pressure of the compressed gas so that a pressure of the compressed gas meets a requirement, and the setting makes the pressure of the compressed gas Adjustable to make the control of the three-way valve more flexible.
- a pressure gauge 206 is also preferably disposed in the intake line to detect the pressure of the compressed gas in real time and can be used in conjunction with the pressure regulating valve 205 to accurately control the pressure of the compressed gas.
- a pressure alarm 207 may also be disposed in the intake line, and when the pressure of the compressed gas is lower than a set value, the pressure alarm 207 issues an alarm to prompt the relevant operator, such that the heat exchange The operation of device 100 is more user friendly.
- the first switch 201 connects the water tank 101 and the reaction chamber 107 through the circulating water outlet pipe 30 while The second switch 202 connects the heat exchanger 108 to the reaction chamber 107 through the circulating water return pipe 40.
- the factory cooling water flows into the heat exchanger 108 from the cooling water inlet pipe 110 and exchanges heat with the circulating water entering the heat exchanger 108.
- the temperature stability of the plant cooling water is lower than the stability of the circulating water temperature.
- the heat-exchanged cooling water flows out of the heat exchanger 108 and flows out through the cooling water outlet pipe 111, and the heat-exchanged circulating water flows into the water tank 101 and then flows into the reaction chamber through the circulating water outlet pipe 30 again. 107 for heat exchange. Further, the circulating water flowing into the reaction chamber 107 and subjected to heat exchange is returned to the heat exchanger 108 through the circulating water return pipe 40, so that the circulating reaction water of the reaction chamber 107 can be cyclically cooled.
- FIG. 3 is a schematic structural view of the heat exchange device 100 shown in FIG. 2 in a fault state, as shown in FIG. 3, and in conjunction with FIG. 4b, when the heat exchanger 100 is operating in a fault state: the first switch The device 201 disconnects the water tank 101 from the reaction chamber 107 and simultaneously turns on the cooling water inlet pipe 110 and the reaction chamber 107; at the same time, the second switch 202 shuts off the heat exchanger 108 and the reaction chamber 107.
- the factory cooling water can directly flow into the reaction chamber 107 through the cooling water inlet pipe 110 and the circulating water outlet pipe 30, and The cooling water after heat exchange with the reaction chamber 107 flows out through the reaction chamber 107, and then flows out through the circulating water return pipe 40 and the cooling water outlet pipe 111, thereby cooling the reaction chamber 107 by the factory cooling water. purpose.
- the circulating water outlet pipe 30 includes a first circulating water outlet pipe 301 and a second circulating water outlet pipe 302.
- One end of the first circulating water outlet pipe 301 is connected to the water tank 101, and the other end is connected to the water supply tank 101.
- the first switch 201 one end of the second circulating water outlet pipe 302 is connected to the first switch 201, and the other end is connected to the reaction chamber 107.
- the first switch 201 disconnects the first circulating water outlet pipe 301 from the water tank 101, and the second circulating water outlet pipe 302 is The cooling water inlet pipe 110 is turned on. Specifically, the cooling water inlet pipe 110 is connected to the second circulating water outlet pipe 302 through the first branch.
- the circulating water return pipe 40 includes a first circulating water return pipe 401 and a second circulating water return pipe 402. One end of the second circulating water return pipe 402 is connected to the heat exchanger 108, and the other end is connected.
- the second switch 202 is connected, and one end of the first circulating water return pipe 401 is connected to the second switch 202, and the other end is connected to the reaction chamber 107.
- the first circulating water return pipe 401 is The cooling water outlet pipe 111 is turned on. Specifically, the cooling water outlet pipe 111 is connected to the first circulating water return pipe 401 through the second branch.
- the factory cooling water flows in from the cooling water inlet pipe 110 through the first branch and the second circulating water outlet pipe 302. Flowing to the reaction chamber 107, cooling the reaction chamber 107; thereafter, the cooling water flowing out of the reaction chamber 107 passes through the first circulating water return pipe 401, the second branch The road and the cooling water outlet pipe 111 flow out, thereby achieving a cooling of the reaction chamber 107.
- one or more of the circulating water return pipe 40 and the circulating water outlet pipe 30 are provided with one or more of a temperature sensor 104, a pressure sensor 105, and a flow meter 106 to monitor the The operation of the heat exchange device 100.
- the pneumatic actuator unit 203 vents the first switch 201 and the second switch 202 through the air passage 112 to control the direction switching of the first switch 201 and the second switch 202.
- FIG. 5 is a schematic structural view of the heat exchange device 200 according to the second embodiment of the present invention after being connected to the reaction chamber 107.
- the heat exchange device 200 includes a heat exchanger 108, a water tank 101, and a cooling water inlet pipe. 110.
- the cooling water inlet pipe 110 and the cooling water outlet pipe 111 are both connected to the heat exchanger 108, and the cooling water enters the heat exchanger 108 through the cooling water inlet pipe 110, and the heat-exchanged cooling water passes through the cooling water outlet pipe 111 again. Flow out.
- the heat exchanger 108, the water tank 101, the circulating water outlet pipe 30, the reaction chamber 107, and the circulating water return pipe 40 are sequentially connected in series to form a circuit.
- first switch 201 of the embodiment includes a normally closed electromagnetic valve 2011 and a normally open electromagnetic valve 2012
- second switch 202 includes a normally closed electromagnetic system.
- Valve 2021 and a normally open solenoid valve 2022 are normally closed electromagnetic systems.
- the normally closed solenoid valves 2011, 2021 and the normally open solenoid valves 2012, 2022 can be controlled by a circuit.
- the normally closed solenoid valves 2021, 2011 are normally energized, and simultaneously
- the normally open solenoid valve 2022, 2012 is normally energized, it is in a closed state; at this time, the cooling water inlet pipe 110 and the reaction chamber 107 are not connected, and the heat exchanger 108 is connected to the reaction chamber 107.
- the cooling water outlet pipe 111 is disconnected from the reaction chamber 107, and the water tank 101 is connected to the reaction chamber 107.
- the heat exchange process of the heat exchange device 200 is the same as that of the first embodiment.
- the heat exchange process of the heat exchange device 100 under normal operating conditions is the same and will not be described here.
- the normally closed solenoid valves 2021, 2011 and the normally open solenoid valves 2012, 2022 are simultaneously powered off, and the normally closed solenoid valves 2021, 2011 are closed while The normally open electromagnetic valve 2012, 2022 is opened; at this time, after the normally closed electromagnetic valve 2011 of the first switch 201 is opened, the first circulating water outlet pipe 301 is disconnected from the water tank 101; After the normally open electromagnetic valve 2012 of the first switch 201 is opened, the cooling water inlet pipe 110 is connected to the second circulating water outlet pipe 302; the normally closed electromagnetic valve 2021 of the second switch 202 After being opened, the second circulating water return pipe 402 is disconnected from the heat exchanger 108; after the normally open electromagnetic valve 2022 of the second switch 202 is opened, the cooling water outlet pipe 111 and the first A circulating water return pipe 301 is connected.
- the heat exchange process of the heat exchange device 200 in the fault state is specifically referred to the heat exchange process of the heat exchange device 100 of the first embodiment in
- the normally closed solenoid valves 2011, 2021 and the normally open solenoid valves 2012, 2022 may also be controlled by an external controller (not shown) that can implement the normally closed solenoid valve 2021. At the same time as the opening of 2011, the normally open solenoid valves 2022, 2012 are closed.
- the controller may be a general logic controller, such as a PLC controller, and those skilled in the art will know how to implement control of the solenoid valve by the controller based on the disclosure of the present application.
- the controller controls the normally closed solenoid valve 2021 and the first switch of the second switch 202
- the normally closed solenoid valve 2011 of the device 201 is simultaneously opened, and simultaneously controls the normally open solenoid valve 2022 of the second switch 202 and the normally open solenoid valve 2012 of the first switch 201 to be closed; at this time, the cooling water inlet pipe 110
- the reaction chamber 107 is not connected, and the heat exchanger 108 is connected to the reaction chamber 107, and the cooling water outlet pipe 111 is disconnected from the reaction chamber 107, and the water tank 101 and the reaction chamber 107 are closed.
- the heat exchange process of the heat exchange device 200 is the same as the heat exchange process of the heat exchange device 100 of the first embodiment under normal operating conditions, and will not be described here.
- the heat exchange device 200 When the heat exchange device 200 is in a fault state: the controller is in a faulty working state, and the power is turned off as the controller fails, the normally closed solenoid valve 2021 and the second switch 202
- the normally closed solenoid valve 2011 of a switch 201 is simultaneously closed, and the normally open solenoid valve 2022 of the second switch 202 and the normally open solenoid valve 2012 of the first switch 201 are simultaneously opened;
- the normally closed electromagnetic valve 2011 of the first switch 201 After the normally closed electromagnetic valve 2011 of the first switch 201 is opened, the first circulating water outlet pipe 301 is disconnected from the water tank 101; after the normally open electromagnetic valve 2012 of the first switch 201 is opened, the facility is opened.
- the cooling water inlet pipe 110 is connected to the second circulating water outlet pipe 302; after the normally closed electromagnetic valve 2021 of the second exchanger 202 is opened, the second circulating water return pipe 402 and the heat exchanger are 108 is disconnected; after the normally open electromagnetic valve 2022 of the second switch 202 is opened, the cooling water outlet pipe 111 is connected to the first circulating water return pipe 301; similarly, the heat exchange device
- the heat exchange device For the heat exchange process in the fault state of 200, refer to the heat exchange device of the first embodiment. 100 in the heat exchange process at the time of a fault condition, ceasing to be described later herein.
- FIG. 5 a schematic diagram of a heat exchange device 200 provided in Embodiment 3 after being connected to a reaction chamber 107, the heat exchange device 200 includes a heat exchanger 108, a water tank 101, a cooling water inlet pipe 110, and a cooling water outlet pipe 111. a circulating water outlet pipe 30, a circulating water return pipe 40, a first switch 201, and a second switch 202.
- the cooling water inlet pipe 110 and the cooling water outlet pipe 111 are both connected to the heat exchanger 108, and the cooling water enters the heat exchanger 108 through the cooling water inlet pipe 110, and the heat-exchanged cooling water passes through the cooling water outlet pipe 111 again. Flow out.
- the heat exchanger 108, the water tank 101, the circulating water outlet pipe 30, the reaction chamber 107, and the circulating water return pipe 40 are sequentially connected in series to form a circuit.
- the first switch 201 of the embodiment includes a normally closed solenoid valve 2012 and a normally open solenoid valve 2011, and the second switch 202 includes a normally closed electromagnetic system.
- the heat exchange device 200 when the heat exchange device 200 is in a normal working state: the four solenoid valves are not energized, that is, the normally closed solenoid valves 2012, 2022 are closed, and the normally open solenoid valves 2011, 2021 are opened;
- the controller issues a command to energize the normally closed solenoid valves 2012, 2022, the normally open solenoid valves 2011, 2021, and the normally closed solenoid valves 2012, 2022 are opened, and the other Refer to Example 2 for the working state and principle of the structure to achieve cooling circuit switching.
- the embodiment further provides a chemical vapor deposition apparatus including a heat exchange device and a chemical vapor deposition device, the chemical vapor deposition device including a reaction chamber, the reaction chamber Used to carry out chemical vapor deposition. Since the chemical vapor deposition apparatus of the present embodiment includes the heat exchange apparatus of the present embodiment, the advantageous effects brought about by the heat exchange apparatus of the chemical vapor deposition apparatus are referred to the above embodiments.
- the heat exchange device in the heat exchange device, the heat exchange method thereof and the vapor deposition device provided by the present invention, includes a heat exchanger, a water tank, a cooling water inlet pipe, a cooling water outlet pipe, and a circulating water outlet pipe.
- a circulating water return pipe a first switcher and a second switch
- the cooling water inlet pipe and the cooling water outlet pipe are connected to the heat exchanger, and the heat exchanger, the water tank, the circulating water outlet pipe, and the a cooling target (ie, a reaction chamber of the vapor deposition apparatus) and a circulating water return pipe are sequentially connected in series to form a circuit
- the first switch is disposed between the cooling water inlet pipe and the circulating water outlet pipe, and the cooling is performed
- the second switch is disposed between the water outlet pipe and the circulating water outlet pipe.
- the first switch turns on the connection between the water tank and the object to be cooled, and disconnects between the cooling water inlet pipe and the object to be cooled Connecting; the second switch connects the connection of the cooling water outlet pipe and the heat exchanger, and disconnects the cooling water outlet pipe from the object to be cooled, thereby passing the target to be cooled.
- the water tank and the heat exchanger connected in series are provided with circulating water for cooling the target to be cooled.
- the first switch disconnects the water tank from the object to be cooled, and simultaneously turns on the cooling water inlet pipe and the object to be cooled Interconnection; the second switch disconnects the connection between the cooling water outlet pipe and the heat exchanger, and simultaneously connects the cooling water outlet pipe to the object to be cooled, so that it can pass and be cooled
- the cooling water inlet pipe and the cooling water outlet pipe connected in series with the target object are cooled by providing cooling water for the object to be cooled, thereby ensuring that the target object to be cooled, especially the vapor deposition reaction chamber, can be effectively obtained under any circumstances.
- the cooling ensures the normal production.
- the vapor deposition apparatus may be a chemical vapor deposition apparatus or a physical vapor deposition apparatus.
- the object to be cooled may also be a structure in which other equipment needs to be cooled.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (17)
- 一种热交换装置,用于对待冷却目标物进行降温处理,其特征在于,包括热交换器、冷却水路、循环水路、切换器,所述冷却水路用于实现冷却水与所述热交换器的热交换,所述循环水路用于对所述待冷却目标物进行温度控制,所述切换器用于断开所述循环水路与所述待冷却目标物的连接,同时实现所述冷却水路与所述待冷却目标物的连接。
- 如权利要求1所述的热交换装置,其特征在于,所述冷却水路包括与所述热交换器相连接的冷却水进水管、冷却水出水管;所述循环水路包括循环水出水管、循环水回水管,所述热交换器、所述循环水出水管、所述待冷却目标物和所述循环水回水管串联形成回路。
- 如权利要求2所述的热交换装置,其特征在于,所述切换器包括第一切换器和第二切换器,其中,所述第一切换器设置在所述冷却水进水管和所述循环水出水管之间且用于断开一部分所述循环水出水管与所述待冷却目标物的连接,并同时接通所述冷却水进水管和所述待冷却目标物;所述第二切换器设置在所述冷却水出水管和所述循环水回水管之间且用于断开所述冷却水出水管和所述热交换器的连接,并同时接通所述冷却水出水管与所述待冷却目标物。
- 如权利要求3所述的热交换装置,其特征在于,所述第一切换器和所述第二切换器均为三通阀。
- 如权利要求4所述的热交换装置,其特征在于,所述循环水回水管包括第一循环水回水管和第二循环水回水管,所述循环水出水管包括第一循环水出水管和第二循环水出水管;所述第一循环水出水管的第一端连接所述热交换器,所述第一循环水出水管的第二端连接所述第一切换器;所述第二循环水出水管的第一端连接所述第一切换器,所述第二循环水出水管的第二端连接所述待冷却目标物;所 述冷却水进水管通过第一支路连接所述第一切换器;所述第一循环水回水管的第一端连接所述第二切换器,所述第一循环水回水管的第二端连接所述待冷却目标物;所述第二循环出进水管路的第一端连接所述热交换器,所述第二循环出进水管路的第二端连接所述第二切换器;所述冷却水出水管通过第二支路连接所述第二切换器。
- 如权利要求4所述的热交换装置,其特征在于,所述三通阀为气控式三通阀。
- 如权利要求6所述的热交换装置,其特征在于,所述气控式三通阀具有用于允许压缩气体通过的输送通道,所述输送通道中设置有压力表和压力报警器,所述压力表用于测量所述压缩气体的压力值,所述压力报警器用于当所述压缩气体的压力值低于一设定值时报警。
- 如权利要求3所述的热交换装置,其特征在于,所述第一切换器包括第一常闭式电磁阀和第一常开式电磁阀;所述第二切换器包括第二常闭式电磁阀和第二常开式电磁阀。
- 如权利要求8所述的热交换装置,其特征在于,所述冷却水进水管通过第一支路与所述循环水出水管相连,且所述第一支路上设置有所述第一常开式电磁阀,所述循环水出水管上设置有所述第一常闭式电磁阀;所述冷却水出水管通过第二支路与所述循环水回水管相连,且所述第二支路上设置有所述第二常开式电磁阀,所述循环水回水管上设置有所述第二常闭式电磁阀。
- 如权利要求8所述的热交换装置,其特征在于,所述冷却水进水管通过第一支路与所述循环水出水管相连,且所述第一支路上设置有所述第一常闭式电磁阀,所述循环水出水管上设置有所述第一常开式电磁阀;所述冷却水出水管通过第二支路与所述循环水回水管相连,且所述第二支路上设置有所述第二常闭式电磁阀,所述循环水回水管上设置有所述第二常开式电磁阀。
- 如权利要求9或10所述的热交换装置,其特征在于,还包括一控制 器,用于控制所述第一和第二常闭式电磁阀和所述第一和第二常开式电磁阀的通电和断电。
- 如权利要求3所述的热交换装置,其特征在于,所述循环水路设置有温度传感器、压力传感器以及流量计中的一个或多个。
- 如权利要求3所述的热交换装置,其特征在于,所述待冷却目标物为一工艺腔体。
- 一种如权利要求3至13中任一项所述的热交换装置的热交换方法,其特征在于,包括:通过第一切换器断开一部分所述循环水出水管与所述待冷却目标物的连接,并同时接通所述冷却水进水管与所述待冷却目标物,以使冷却水依次通过冷却水进水管、一部分所述循环水出水管流入所述待冷却目标物;以及通过第二切换器断开所述热交换器与所述待冷却目标物的连接,并同时接通所述冷却水出水管与所述待冷却目标物,以使流出所述待冷却目标物的冷却水依次通过循环水回水管、冷却水出水管流出,实现所述冷却水与所述待冷却目标物的热量交换。
- 如权利要求14所述的热交换方法,其特征在于,所述第一切换器和第二切换器均为三通阀,其中,实现所述冷却水进水管、所述冷却水出水管与所述待冷却目标物相连接的方法包括:通过一气动执行单元控制所述第一切换器,以断开所述循环水路与所述待冷却目标物的连接,并同时接通所述冷却水进水管和所述待冷却目标物;以及通过所述气动执行单元控制所述第二切换器,以断开所述热交换器与所述待冷却目标物的连接,并同时接通所述通冷却水出水管和所述待冷却目标物。
- 如权利要求14所述的热交换方法,其特征在于,所述第一切换器包括第一常闭式电磁阀和第一常开式电磁阀;所述第二切换器包括第二常闭式 电磁阀和第二常开式电磁阀,其中,实现冷却水进水管、冷却水出水管与待冷却目标物相连接的方法包括:所述第一和第二常开式电磁阀闭合,以接通所述待冷却目标物和所述冷却水进水管、冷却水出水管;以及所述第一和第二常闭式电磁阀开启,以断开所述目标冷却物和所述循环水路以及所述热交换器的连接。
- 一种气相沉积设备,其特征在于,包括权利要求1-13中任一项所述的热交换装置,所述热交换装置用于对所述气相沉积设备进行温控。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020501474A JP2020527219A (ja) | 2017-07-17 | 2018-07-16 | 熱交換装置及びその熱交換方法並びに蒸着装置 |
KR1020207003765A KR20200026981A (ko) | 2017-07-17 | 2018-07-16 | 열 교환 장치 및 이를 위한 열 교환 방법과 이의 기상 증착 장치 |
US16/632,279 US20200363146A1 (en) | 2017-07-17 | 2018-07-16 | Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof |
SG11202000373YA SG11202000373YA (en) | 2017-07-17 | 2018-07-16 | Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710582127.2A CN109269332A (zh) | 2017-07-17 | 2017-07-17 | 热交换装置及其热交换方法与气相沉积设备 |
CN201710582127.2 | 2017-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019015554A1 true WO2019015554A1 (zh) | 2019-01-24 |
Family
ID=65015033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/095850 WO2019015554A1 (zh) | 2017-07-17 | 2018-07-16 | 热交换装置及其热交换方法与气相沉积设备 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200363146A1 (zh) |
JP (1) | JP2020527219A (zh) |
KR (1) | KR20200026981A (zh) |
CN (1) | CN109269332A (zh) |
SG (1) | SG11202000373YA (zh) |
TW (1) | TWI681518B (zh) |
WO (1) | WO2019015554A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200099688A (ko) * | 2019-02-15 | 2020-08-25 | 이도형 | 진공증착장비 |
TWI769634B (zh) * | 2020-12-22 | 2022-07-01 | 台灣積體電路製造股份有限公司 | 冰水主機之供水控制系統及其操控方法 |
CN113847817A (zh) * | 2021-08-27 | 2021-12-28 | 日月光半导体制造股份有限公司 | 机台降温装置和方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101451913A (zh) * | 2007-11-30 | 2009-06-10 | 中国兵器工业集团第七O研究所 | 多缸柴油机试验室冷却水辅助*** |
CN101694351A (zh) * | 2009-09-07 | 2010-04-14 | 青岛科技大学 | 一种智能工业循环水冷*** |
JP2013052809A (ja) * | 2011-09-05 | 2013-03-21 | Denso Corp | 車両用空調装置 |
CN104596174A (zh) * | 2015-01-26 | 2015-05-06 | 上海威特力热管散热器有限公司 | 用于矿用电力设备的冷却循环装置 |
CN204417655U (zh) * | 2015-01-06 | 2015-06-24 | 江苏东方四通科技股份有限公司 | 晶体生长炉电源用水循环装置 |
CN205245639U (zh) * | 2015-11-09 | 2016-05-18 | 杭州盛忆镐科技有限公司 | 冷却水循环使用处理设备 |
CN106679259A (zh) * | 2015-11-09 | 2017-05-17 | 杭州盛忆镐科技有限公司 | 冷却水循环使用处理设备 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003172570A (ja) * | 2001-12-04 | 2003-06-20 | Choshu Sangyo Kk | ブライン供給装置 |
JP4652371B2 (ja) * | 2007-05-08 | 2011-03-16 | 株式会社Nttファシリティーズ | 空気調和システム及びその運転方法 |
CN101476805B (zh) * | 2008-10-14 | 2010-06-02 | 陕西彩虹电子玻璃有限公司 | 冷却水***的保安应急装置 |
GB2468920A (en) * | 2009-03-27 | 2010-09-29 | Framo Eng As | Subsea cooler for cooling a fluid flowing in a subsea flow line |
CN201875806U (zh) * | 2010-11-22 | 2011-06-22 | 盛水祥 | 板换两用壁挂炉 |
CN102829649A (zh) * | 2011-06-13 | 2012-12-19 | 上海金日冷却设备有限公司 | 一种闭式冷却塔防冻设备 |
JP5673580B2 (ja) * | 2012-02-15 | 2015-02-18 | トヨタ自動車株式会社 | 燃料電池システム |
JP5875408B2 (ja) * | 2012-02-29 | 2016-03-02 | 三菱重工業株式会社 | 燃料噴射ポンプの噴射タイミング調整制御システム |
JP2014194301A (ja) * | 2013-03-29 | 2014-10-09 | Ntt Facilities Inc | 空調システム及びその運転方法 |
JP6479406B2 (ja) * | 2014-10-20 | 2019-03-06 | 三菱重工業株式会社 | 冷却装置および原子力設備 |
CN204300151U (zh) * | 2014-11-18 | 2015-04-29 | 南京贝奇尔机械有限公司 | 一种水电发电机外循环冷却*** |
JP6569096B2 (ja) * | 2015-03-06 | 2019-09-04 | 株式会社片山化学工業研究所 | 開放循環冷却システムおよび運転休止時の熱交換器のチューブ防食方法 |
CN104914891A (zh) * | 2015-06-04 | 2015-09-16 | 北京自动化技术研究院 | 一种温控设备的冷却控制*** |
CN106594516B (zh) * | 2016-11-28 | 2018-10-26 | 哈尔滨工程大学 | 一种lng动力船冷热能交叉利用***及实现方法 |
-
2017
- 2017-07-17 CN CN201710582127.2A patent/CN109269332A/zh active Pending
-
2018
- 2018-07-16 SG SG11202000373YA patent/SG11202000373YA/en unknown
- 2018-07-16 JP JP2020501474A patent/JP2020527219A/ja active Pending
- 2018-07-16 KR KR1020207003765A patent/KR20200026981A/ko not_active Application Discontinuation
- 2018-07-16 US US16/632,279 patent/US20200363146A1/en not_active Abandoned
- 2018-07-16 WO PCT/CN2018/095850 patent/WO2019015554A1/zh active Application Filing
- 2018-07-17 TW TW107124559A patent/TWI681518B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101451913A (zh) * | 2007-11-30 | 2009-06-10 | 中国兵器工业集团第七O研究所 | 多缸柴油机试验室冷却水辅助*** |
CN101694351A (zh) * | 2009-09-07 | 2010-04-14 | 青岛科技大学 | 一种智能工业循环水冷*** |
JP2013052809A (ja) * | 2011-09-05 | 2013-03-21 | Denso Corp | 車両用空調装置 |
CN204417655U (zh) * | 2015-01-06 | 2015-06-24 | 江苏东方四通科技股份有限公司 | 晶体生长炉电源用水循环装置 |
CN104596174A (zh) * | 2015-01-26 | 2015-05-06 | 上海威特力热管散热器有限公司 | 用于矿用电力设备的冷却循环装置 |
CN205245639U (zh) * | 2015-11-09 | 2016-05-18 | 杭州盛忆镐科技有限公司 | 冷却水循环使用处理设备 |
CN106679259A (zh) * | 2015-11-09 | 2017-05-17 | 杭州盛忆镐科技有限公司 | 冷却水循环使用处理设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2020527219A (ja) | 2020-09-03 |
CN109269332A (zh) | 2019-01-25 |
SG11202000373YA (en) | 2020-02-27 |
TWI681518B (zh) | 2020-01-01 |
US20200363146A1 (en) | 2020-11-19 |
TW201909358A (zh) | 2019-03-01 |
KR20200026981A (ko) | 2020-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2019015554A1 (zh) | 热交换装置及其热交换方法与气相沉积设备 | |
KR101109730B1 (ko) | 반도체 공정용 칠러 장치 및 이의 온도제어 방법 | |
CN104675525B (zh) | 一种燃气轮机自动控制冷却水***及其控制方法 | |
TW201104778A (en) | Vacuum system, vacuum control system, and method for controlling a vacuum system | |
CN104990337A (zh) | 循环冷却水***及其方法 | |
WO2018023974A1 (zh) | 一种无菌水调温装置及*** | |
KR101860326B1 (ko) | 판형 열교환기 세척시스템 | |
CN105737666A (zh) | 一种用于超高温瞬时杀菌机的冷却水供水*** | |
CN104848487A (zh) | 智能维护控制***及方法 | |
TW202208865A (zh) | 控制半導體晶圓及/或混合體(semiconductor wafers and/or hybrids)的探針台之溫度的溫度控制裝置、系統,以及方法 | |
CN109647810A (zh) | 一种压缩气体吹扫装置及喷淋*** | |
CN109974320A (zh) | 一种高温去离子水冷却装置 | |
KR20140061046A (ko) | 히트펌프를 이용한 냉각수 열회수 공급시스템 | |
CN109437506B (zh) | 离心脱水干燥一体化***及其快速降温方法 | |
CN209197509U (zh) | 一种避免冷却塔盘管冻裂的余热再利用*** | |
CN109026229B (zh) | 一种高压蒸汽降压降温降噪*** | |
CN113565801B (zh) | 低温压缩机密封保温装置及其控制方法 | |
KR101438182B1 (ko) | 브라인 온도 및 유량 제어용 부가 장치 | |
JP7522073B2 (ja) | サブファブエリア設置装置 | |
JP2016080264A (ja) | 熱回収システム | |
CN216192414U (zh) | 一种皮革加工用一体化多回路蒸汽节能装置 | |
JP6350815B2 (ja) | 熱回収システム | |
CN114109607B (zh) | 热负荷自适应燃机透平冷却空气余热回收***及控制方法 | |
CN220551236U (zh) | 汽动给水泵用密封水*** | |
CN212159056U (zh) | 发动机试验用中冷器温控设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18836167 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2020501474 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20207003765 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18836167 Country of ref document: EP Kind code of ref document: A1 |