WO2019013274A1 - 第1物体を第2物体に対して位置決めする装置及び方法 - Google Patents
第1物体を第2物体に対して位置決めする装置及び方法 Download PDFInfo
- Publication number
- WO2019013274A1 WO2019013274A1 PCT/JP2018/026292 JP2018026292W WO2019013274A1 WO 2019013274 A1 WO2019013274 A1 WO 2019013274A1 JP 2018026292 W JP2018026292 W JP 2018026292W WO 2019013274 A1 WO2019013274 A1 WO 2019013274A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- scale
- movable body
- bonding
- specifying means
- camera
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims description 26
- 238000003384 imaging method Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 27
- 238000010586 diagram Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
- H01L2224/75804—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78702—Means for aligning in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78753—Means for optical alignment, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78824—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/81122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/81123—Shape or position of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/81122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/81129—Shape or position of the other item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/81132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/83122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/83123—Shape or position of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/83122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/83129—Shape or position of the other item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/85122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/85123—Shape or position of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/85122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
- H01L2224/85129—Shape or position of the other item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/85132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Definitions
- the present invention relates to an apparatus and method for positioning a first object relative to a second object.
- the bonding apparatus includes a bonding head mounted on an XY table, a bonding arm attached to the bonding head for moving the bonding tool in the vertical direction, and a position detection camera mounted on the bonding head for detecting the bonding position of the substrate. And have.
- the center line of the bonding tool and the optical axis of the position detection camera are spaced apart by a predetermined offset distance. Then, after aligning the optical axis of the position detection camera to the bonding position, the bonding head is often moved by an offset distance to move the center line of the bonding tool to the bonding position to perform bonding.
- an object of the present invention is to improve the positioning accuracy of the 1st object to the 2nd object.
- An apparatus is an apparatus for positioning a first object with respect to a second object, wherein the movable body linearly moves with respect to the second object, and a holding unit attached to the movable body and holding the first object And a position identification means which is attached to the movable body at a predetermined distance from the holding portion along the movement direction of the movable body and which specifies the position of the second object, and is disposed along the movement direction of the movable body
- a first position detection unit for detecting the position of the holding unit based on the scale, a scale having a plurality of graduations along the direction, a first position detection unit corresponding to the holding unit,
- a second position detection unit attached to the movable body at a predetermined distance from the first position detection unit and detecting the scale position of the scale corresponding to the specified second object position
- the first position detection unit is a scale position Move the moving object to the position where it detects Characterized in that it comprises a control unit for the positioning with respect to the second object.
- the first object is a semiconductor die
- the second object is a substrate or other semiconductor die on which the semiconductor die is mounted
- the apparatus defines the first object as a second object It is possible to position in the specified area.
- the position specifying means is a camera that optically specifies the position of the second object
- the control unit is configured such that the specific area of the second object enters the field of view of the position specifying means.
- the movable body is moved to one position, the scale position of the scale at the first position is detected by the second position detecting unit, and the position specifying unit for the specific area is detected based on the image obtained by capturing the specific area of the second object by the position specifying unit.
- the first relative position may be detected, and a correction amount for correcting the position of the movable body when positioning the first object with respect to the second object may be calculated based on the first relative position.
- the apparatus further includes holding position specifying means disposed on the holding surface side of the holding section and specifying a second relative position of the first object with respect to the holding surface, and the control section is based on the second relative position.
- a correction amount may be calculated to correct the position of the moving body when positioning the first object with respect to the second object.
- control unit may calculate the target scale position on the scale based on the correction amount.
- the scale of the scale is read by the first position detection unit disposed on the movable body, and the holding unit is moved to the position where the scale position is detected to position the first object relative to the second object. Positioning process, And wherein the Mukoto.
- the present invention can improve the positioning accuracy of the first object with respect to the second object.
- FIG. 7 is an explanatory view showing the basic operation when the base is thermally expanded in the mounting apparatus shown in FIG. 1, in which (a) is at the first position and (b) is at the scale position of the linear scale detected by the camera encoder head The state which moved the base so that the central line of the bonding head side encoder head may correspond is shown.
- FIG. 4 It is a flowchart which shows operation
- the mounting apparatus 100 for mounting the semiconductor die 15 on the substrate 16 or the like will be described as an example.
- the mounting apparatus 100 of the present embodiment is a predetermined region of the semiconductor die 15 as the first object, the substrate 16 as the second object, or another semiconductor die as the second object (not shown).
- Positioning and mounting The mounting apparatus 100 includes a base 10 that is a movable body, a bonding head 20 that is a holding unit that holds the semiconductor die 15, a camera 25 that is a position specifying unit that specifies the position of the substrate 16, and a first position detection unit.
- the base 10 is guided by a guide rail 11 extending in the X direction, which is the left and right direction, and linearly moves in the X direction. Further, a linear motor 12 for driving the base 10 in the X direction is attached to the base 10.
- the bonding head 20 and the camera 25 are attached to the base 10.
- the bonding head 20 moves the bonding tool 21, which is a mounting tool for vacuum-sucking the semiconductor die 15 and bonding it to the substrate 16, in the Z direction which is the vertical direction.
- Reference numeral 22 z in FIG. 1 denotes a center line of the bonding head 20 in the Z direction. Further, since the bonding tool 21 is disposed coaxially with the Z-direction center line 22 z of the bonding head 20, the center line 22 z is also a line passing through the center of the bonding tool 21.
- the camera 25 captures an image from above the substrate 16 to obtain an image thereof, and optically identifies the position of the substrate 16. Reference numeral 26 z in FIG.
- the bonding head 20 and the camera 25 are attached to the base 10 with the center line 22z of the bonding head 20 in the Z direction and the optical axis 26z of the camera 25 separated by a predetermined distance ⁇ H in the X direction, which is the moving direction of the base 10. ing.
- the predetermined interval ⁇ H is an offset distance.
- the bonding head encoder head 31 and the camera encoder head 32 are attached to the base 10. As shown in FIG. 1, the bonding head-side encoder head 31 is attached to the base 10 such that the center line 31 a is at the same position as the Z-direction center line 22 z of the bonding head 20. Further, the camera side encoder head 32 is attached to the base 10 so that the center line 32 a is at the same position as the position C of the optical axis 26 z of the camera 25. Therefore, the bonding head encoder head 31 and the camera encoder head 32 are attached to the base 10 at a predetermined interval ⁇ H apart in the X direction which is the moving direction of the base 10.
- a common linear scale 33 extending in the X direction, which is the moving direction of the base 10, is disposed.
- the linear scale 33 has graduations 34 engraved at predetermined intervals.
- the bonding head encoder head 31 and the camera encoder head 32 optically read the scale 34 to detect the position on the linear scale 33. Further, the bonding head encoder head 31 detects the position of the bonding head 20 based on the optically read graduation 34, and the camera encoder head 32 optically detects the graduation 34 corresponding to the specified position of the substrate 16. Detect.
- the bonding stage 13 vacuum-sucks the substrate 16.
- the lower camera 40 is disposed at a position slightly away from the bonding stage 13 as shown in FIG. 1, and images the bonding tool 21 and the semiconductor die 15 attracted to the lower surface of the bonding tool 21 from below.
- the lower camera 40 is a holding position specifying means for specifying the relative position of the semiconductor die 15 with respect to the lower surface of the bonding tool 21.
- the linear motor 12 and the bonding head 20 are connected to the control unit 50, and operate according to an instruction from the control unit 50.
- the bonding head encoder head 31 and the camera encoder head 32 are connected to the control unit 50, and data of the detected graduation position of the linear scale 33 is input to the control unit 50.
- the camera 25 and the lower camera 40 are also connected to the control unit 50, and an image captured by the camera 25 and the lower camera 40 is input to the control unit 50.
- the control unit 50 is a computer that includes a CPU that performs information processing inside, an operation program, and a memory that stores data, and adjusts the position of the base 10 in the X direction.
- the guide rail 11 and the linear scale 33 of the mounting apparatus 100 shown in FIG. 1 are integrally movable in the Y direction by a Y direction drive mechanism (not shown).
- the Y-direction drive mechanism is connected to the control unit 50 and operates in accordance with a command from the control unit 50.
- the Y direction is a horizontal direction orthogonal to the X direction.
- the bonding head encoder head 31 is attached to the base 10 so that the center line 31a is at the same position as the Z center line 22z of the bonding head 20.
- the head 32 is described as being attached to the base 10 so that the center line 32 a is at the same position as the optical axis 26 z of the camera 25, the invention is not limited thereto. If the bonding head encoder head 31 and the camera encoder head 32 are spaced apart from each other by a predetermined distance ⁇ H in the X direction, the bonding head encoder head 31 is disposed in the vicinity of the bonding head 20 and the camera encoder head 32 may be arranged in the vicinity of the camera 25.
- FIG. 2A shows the case where the base 10 is in the first position.
- the first position is a position where the position C of the optical axis 26 z of the camera 25 coincides with the center position S of the bonding area which is a specific area of the substrate 16.
- the center position D of the semiconductor die 15 coincide with each other, and the center position D of the semiconductor die 15 absorbed by the bonding tool 21 is described as being on the center line 22z of the bonding head 20 in the Z direction.
- the position C (x, y) of the optical axis 26z of the camera 25 coincides with the center position S (x, y) of the bonding area.
- the center line 32 a of the camera encoder head 32 is at the position of the Nth scale of the linear scale 33.
- Data in which the center line 32 a of the camera encoder head 32 is at the position of the Nth scale of the linear scale 33 is input to the control unit 50 from the camera encoder head 32.
- the control unit 50 moves the base 10 in the X direction by the linear motor 12 shown in FIG.
- the control unit 50 detects data of the scale of the linear scale 33 by the bonding head encoder head 31.
- the control unit 50 moves the base 10 in the X direction until the scale of the linear scale 33 detected by the bonding head encoder head 31 reaches the Nth scale position.
- the center line 22z of the bonding head 20 and the center position D of the semiconductor die 15 are The scale of the linear scale 33 is the Nth scale position, that is, the center position S of the bonding area.
- the mounting apparatus 100 of the present embodiment can make the center position D of the semiconductor die 15 coincide with the center position S of the bonding area.
- a linear scale 33 'and a scale 34' indicated by broken lines show a state in which the linear scale 33 is thermally expanded.
- the scale position detected by the camera encoder head 32 at the first position is N ′.
- the control unit 50 moves the base 10 in the X direction until the scale of the linear scale 33 detected by the bonding head encoder head 31 reaches the N'th scale position.
- the center position D of the semiconductor die 15 can be aligned with the N'th scale position of the scale of the linear scale 33, that is, the center position S of the bonding area.
- FIGS. 3A and 3B show the case where the base 10 thermally expands in the X direction.
- the position C (x, y) of the optical axis 26z of the camera 25 coincides with the center position S (x, y) of the bonding area.
- the center line 32 a of the camera encoder head 32 is at the position of the Nth scale of the linear scale 33.
- the center line 22 z of the bonding head 20 is at a position separated from the optical axis 26 z of the camera 25 by ⁇ H ′ in the X direction.
- the control unit 50 moves the base 10 in the X direction until the scale of the linear scale 33 detected by the bonding head encoder head 31 reaches the Nth scale position, as described with reference to FIG. 2B. . Then, the center position D of the semiconductor die 15 is such that the scale of the linear scale 33 is the Nth scale position, that is, the center position S of the bonding area.
- the mounting apparatus 100 of this embodiment does not perform calibration of the predetermined distance ⁇ H which is the offset distance, and the central position D of the semiconductor die 15 is set to the central position of the bonding area. It can be adjusted to S.
- the first position is a position where the position C (x, y) of the optical axis 26 z of the camera 25 coincides with the center position S (x, y) of the bonding area, and the center position of the bonding tool 21.
- BH and the center position D of the semiconductor die 15 coincide with each other and the center position D of the semiconductor die 15 absorbed by the bonding tool 21 is described as being on the center line 22z of the bonding head 20,
- the first position the position C of the optical axis 26z of the camera 25 and the center position S of the bonding area are shifted, and the center position D of the semiconductor die 15 and the center position BH of the bonding tool 21 attracted by the bonding tool 21.
- step S101 of FIG. 4 the control unit 50 moves the bonding head 20 upward to a wafer holder or an intermediate stage (not shown), and causes the bonding tool 21 to adsorb the semiconductor die 15 to pick up the semiconductor die 15.
- the semiconductor die 15 is held by the bonding tool 21 (holding step).
- step S102 in FIG. 4 the control unit 50 moves the bonding head 20 onto the lower camera 40, and acquires images of the bonding tool 21 and the semiconductor die 15 by the lower camera 40.
- the images of the bonding tool 21 and the semiconductor die 15 are captured as indicated by solid lines in FIG. 5B.
- the center position BH (x, y) of the bonding tool 21 and the center position D (x, y) of the semiconductor die 15 are offset by the position difference ⁇ BH (x, y) ing.
- reference numerals 22x and 22y denote a center line in the X direction of the bonding head 20 and a center line in the Y direction. Therefore, the intersection of the center line 22 x and the center line 22 y is the center position BH (x, y) of the bonding tool 21. Since the lower camera 40 picks up the bonding tool 21 from the lower side, in the field of view 41, the field of view 27 of the camera 25 which picks up the substrate 16 from above as shown in FIG. It is opposite to the direction of the X axis.
- step S103 of FIG. 4 the control unit 50 moves the base 10 to a first position where the alignment mark 17 of the substrate 16 falls within the field of view 27 of the camera 25 shown in FIG. Moving process). Then, as shown in step S104 of FIG. 4, at the first position, the control unit 50 detects the scale position of the linear scale 33 by the camera encoder head 32. As shown in FIG. 5A, since the center line 32a of the camera encoder head 32 is at the Nth graduation position of the linear scale 33 at the first position, the controller 50 includes the camera encoder head 32. The data having the center line 32a of the camera encoder head 32 at the position of the Nth scale of the linear scale 33 is input (position detection step).
- the control unit 50 causes the camera 25 to acquire an image of a bonding area including the alignment mark 17.
- 26x and 26y are center lines of the field of view 27 orthogonal to the optical axis 26z, and the intersection point of the X direction center line 26x and the Y direction center line 26y is the position C of the optical axis 26z of the camera 25 It becomes x, y).
- the center of the line connecting the two alignment marks 17 is the center position S (x, y) of the bonding area.
- the control unit 50 processes the image shown in FIG.
- step S106 of FIG. 4 the control unit 50 moves the base 10 in the X direction by the linear motor 12 shown in FIG. At this time, the control unit 50 detects data of the scale of the linear scale 33 by the bonding head encoder head 31. Then, the control unit 50 moves the base 10 in the X direction until the scale of the linear scale 33 detected by the bonding head encoder head 31 reaches the Nth scale position. As shown in FIG. 6A, when the scale of the linear scale 33 detected by the bonding head encoder head 31 reaches the Nth scale position, the center of the bonding tool 21 located at the same position as the center line 22z of the bonding head 20. The position BH (x, y) moves the scale of the linear scale 33 to the N-th scale position, that is, the position C (x, y) where the optical axis 26z of the camera 25 was previously located.
- FIG. 6B shows the center position BH (x, y) of the bonding tool 21, the center position S (x, y) of the bonding region, and the center position D (x, y) of the semiconductor die 15 in this state. It is the figure seen from the direction.
- the center position D (x, y) of the semiconductor die 15 in FIG. 6 (b) is a position that is horizontally reversed from FIG. 5 (b) when viewed from above in FIG. 6 (b). While it is a figure, it is because FIG.5 (b) becomes a figure seen from the downward direction.
- the central position BH (x, y) of the bonding tool 21 is at the position C (x, y) where the optical axis 26 z of the camera 25 was previously positioned, and the semiconductor
- the center position D (x, y) of the die 15 is separated from the center position BH (x, y) of the bonding tool 21 by the positional difference ⁇ BH (x, y) in the lower left direction.
- the central position S (x, y) of the bonding area is separated from the central position BH (x, y) of the bonding tool 21 by the positional difference ⁇ C (x, y) in the lower left direction.
- the central position D (x, y) of the semiconductor die 15 is a positional difference ( ⁇ C (x, y) ⁇ BH (x, y)) on the upper right with respect to the central position S (x, y) of the bonding region. It is in a distant position.
- the position of the center line 22z of the bonding head 20 is moved toward the left in the X direction by (.DELTA.C (x)-. DELTA.BH (x)), and toward the lower side in the Y direction (.DELTA.C (y)-. DELTA.BH (y) ),
- the center position D (x, y) of the semiconductor die 15 coincides with the center position S (x, y) of the bonding area.
- the control unit 50 moves the position of the base 10 by the linear motor 12 toward the left in the X direction by ( ⁇ C (x) ⁇ BH (x)), as shown in step S107 of FIG.
- the direction drive mechanism moves the position of the base 10 downward in the Y direction by ( ⁇ C (y) ⁇ BH (y)).
- the control unit 50 determines the position difference ⁇ C (x, y) between the center position S (x, y) of the bonding area and the position C (x, y) of the optical axis 26z and the center position BH of the bonding tool 21.
- the base 10 is moved by a distance according to the positional difference ⁇ BH (x, y) between (x, y) and the center position D (x, y) of the semiconductor die 15 (positioning process).
- control unit 50 proceeds to step S 108 in FIG. 4 and lowers the bonding tool 21 by the bonding head 20 to bond the semiconductor die 15 onto the substrate 16.
- the mounting apparatus 100 of this embodiment performs bonding by aligning the center position D of the semiconductor die 15 with the center position S of the bonding area without performing the calibration of the predetermined distance ⁇ H which is the offset distance. Can.
- the lower camera 40 detects the positional difference ⁇ BH (x, y) between the central position BH (x, y) of the bonding tool 21 and the central position D (x, y) of the semiconductor die 15 Indicates the operation when there is no.
- the control unit 50 moves the base 10 in step S106 of FIG. 7 and then, as shown in step S110 of FIG. 7, the central position S (x, y) of the bonding area.
- the base 10 is moved by a distance corresponding to the positional difference ⁇ C (x, y) between the position C (x, y) of the optical axis 26z and the position C (x, y) of the optical axis 26z.
- control unit 50 moves the position of the base 10 leftward in the X direction by ( ⁇ C (x)) by the linear motor 12 and moves the position of the base 10 downward in the Y direction by the Y direction drive mechanism not shown. And move by (.DELTA.C (y)).
- this operation also aligns the center position D of the semiconductor die 15 with the center position S of the bonding area without performing calibration of the predetermined distance ⁇ H which is the offset distance. It can be carried out.
- Steps S201 to S205 shown in FIG. 8 are the same as steps S101 to S105 in FIG.
- step S206 in FIG. 8 the scale position of the linear scale 33 is set to a position difference .DELTA.C (x, y) between the center position S (x, y) of the bonding area and the position C (x, y) of the optical axis 26z. )
- the position difference ⁇ BH (x, y) between the center position BH (x, y) of the bonding tool 21 and the center position D (x, y) of the semiconductor die 15 to calculate the target graduation position N 2
- step S207 in FIG. 8 the base 10 is moved so that the center line 31a of the bonding head-side encoder head 31 comes to the target graduation position N2.
- FIG. 9 shows a state in which the center position D (x, y) of the semiconductor die 15 coincides with the center position S (x, y) of the bonding area.
- the center position BH (x, y) of the bonding tool 21 is the position C (x, y) at which the optical axis 26 z of the camera 25 is located first.
- Center position D (x, y) of the semiconductor die 15 is located at the upper right relative to the center position S (x, y) of the bonding area (.DELTA.C (x, y)-.DELTA. BH (x, y)) It becomes a position apart.
- the central position BH (x, y) of the bonding tool 21 is changed from the position C (x, y) where the optical axis 26 z of the camera 25 was previously located to the lower left position ( ⁇ C (x, y)- ⁇ BH). If the position is separated by (x, y), the center position D (x, y) of the semiconductor die 15 coincides with the center position S (x, y) of the bonding area.
- the control unit 50 corresponds the scale position N of the linear scale 33 at the position C (x, y) where the optical axis 26 z of the camera 25 was previously located to ( ⁇ C (x) ⁇ BH (x)).
- a target graduation position N2 corrected by the graduations is calculated.
- the position where the position of the center line 31a of the bonding head side encoder head 31 is the target scale position N2 that is, the scale position of the linear scale 33 detected by the bonding head side encoder head 31 is the target scale
- the base 10 is moved to the position where the position N2 is reached (positioning step).
- the central position D (x) of the semiconductor die 15 can be made to coincide with the central position S (x) of the bonding area.
- the scale difference between the scale position N of the linear scale 33 and the target scale position N2 at the position C (x, y) at which the optical axis 26z of the camera 25 was located is the correction amount of the position of the base 10. .
- the control unit 50 simultaneously moves the base 10 downward in the Y direction by ( ⁇ C (y) ⁇ BH (y)). Thereby, the center position D (x, y) of the semiconductor die 15 can be made to coincide with the center position S (x, y) of the bonding region.
- the mounting apparatus 100 of this embodiment performs bonding by aligning the center position D of the semiconductor die 15 with the center position S of the bonding area without performing the calibration of the predetermined distance ⁇ H which is the offset distance. Therefore, the bonding accuracy can be improved without calibration of the predetermined distance ⁇ H which is the offset distance. Also, since no offset distance calibration is required, bonding productivity can be improved.
- the present invention is applicable not only to a flip chip bonding apparatus or a die bonding apparatus but to various apparatuses.
- the present invention can be applied to a wire bonding apparatus, an industrial robot, and a transfer apparatus.
- the present invention can be applied to any device, not limited to the object to be transported or mounted, the size of the object, and the technical field of the object.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
以下、第1物体を第2物体に対して位置決めする装置として、半導体ダイ15を基板16等に実装する実装装置100を例に説明する。図1に示すように、本実施形態の実装装置100は、第1物体である半導体ダイ15を第2物体である基板16または図示しない第2物体である他の半導体ダイの予め定められた領域に位置決めして実装するものである。実装装置100は、移動体であるベース10と、半導体ダイ15を保持する保持部であるボンディングヘッド20と、基板16の位置を特定する位置特定手段であるカメラ25と、第1位置検出部であるボンディングヘッド側エンコーダヘッド31と、第2位置検出部であるカメラ側エンコーダヘッド32と、複数の目盛34を有するリニアスケール33と、制御部50と、下カメラ40と、基板16を吸着固定するボンディングステージ13とを備えている。ここで、実装装置100は、例えば半導体ダイ15を反転させた後に基板16に実装するフリップチップボンディング装置でもよいし、半導体ダイ15を反転させずに基板16に実装するダイボンディング装置であってもよい。
次に、図2、図3を参照しながら本実施形態の実装装置100の基本動作について説明する。図2(a)は、ベース10が第1位置にある場合を示す。図2、図3の説明では、第1位置はカメラ25の光軸26zの位置Cが基板16の特定領域であるボンディング領域の中心位置Sと一致する位置であり、ボンディングツール21の中心位置BHと半導体ダイ15の中心位置Dとは一致しており、ボンディングツール21に吸着された半導体ダイ15の中心位置Dはボンディングヘッド20のZ方向の中心線22zの上にあるとして説明する。
図2、図3では、第1位置はカメラ25の光軸26zの位置C(x,y)がボンディング領域の中心位置S(x,y)と一致する位置であり、ボンディングツール21の中心位置BHと半導体ダイ15の中心位置Dとは一致しており、ボンディングツール21に吸着された半導体ダイ15の中心位置Dはボンディングヘッド20の中心線22zの上にあるとして説明したが、実際には、第1位置においてカメラ25の光軸26zの位置Cとボンディング領域の中心位置Sとにはズレが有り、ボンディングツール21に吸着された半導体ダイ15の中心位置Dとボンディングツール21の中心位置BHにもズレがある。そこで、次に図4から図6を参照しながら、実装装置100の実際の動作(電子部品実装方法)について説明する。
Claims (9)
- 第1物体を第2物体に対して位置決めする装置であって、
前記第2物体に対して直線移動する移動体と、
前記移動体に取り付けられて前記第1物体を保持する保持部と、
前記移動体の移動方向に沿って前記保持部と所定の間隔を開けて前記移動体に取り付けられ、前記第2物体の位置を特定する位置特定手段と、
前記移動体の前記移動方向に沿って配置され、前記移動方向に沿って複数の目盛を有するスケールと、
前記保持部に対応して前記移動体に取り付けられ、前記目盛に基づいて前記保持部の位置を検出する第1位置検出部と、
前記位置特定手段に対応して前記第1位置検出部と前記所定の間隔を開けて前記移動体に取り付けられ、特定された前記第2物体の位置に対応する前記スケールの目盛位置を検出する第2位置検出部と、
前記第1位置検出部が前記目盛位置を検出する位置に前記移動体を移動させて前記第1物体を前記第2物体に対して位置決めをする制御部とを備える、
装置。 - 前記第1物体は、半導体ダイであり、
前記第2物体は、前記半導体ダイが実装される、基板又は他の半導体ダイであり、
前記装置は、前記第1物体を前記第2物体の予め定められた領域に位置決めをする装置であることを特徴とする、
請求項1に記載の装置。 - 請求項1に記載の装置であって、
前記位置特定手段は、光学的に前記第2物体の位置を特定するカメラであって、
前記制御部は、
前記位置特定手段を前記第2物体の特定領域が前記位置特定手段の視野に入る第1位置に前記移動体を移動させ、第2位置検出部で前記第1位置における前記スケールの前記目盛位置を検出し、
前記位置特定手段で前記第2物体の前記特定領域を撮像した画像に基づいて前記特定領域に対する前記位置特定手段の第1相対位置を検出し、
前記第1相対位置に基づいて、前記第1物体を前記第2物体に対して位置決めをする際の前記移動体の位置を補正する補正量を算出する、
装置。 - 請求項2に記載の装置であって、
前記位置特定手段は、光学的に前記第2物体の位置を特定するカメラであって、
前記制御部は、
前記位置特定手段を前記第2物体の特定領域が前記位置特定手段の視野に入る第1位置に前記移動体を移動させ、第2位置検出部で前記第1位置における前記スケールの前記目盛位置を検出し、
前記位置特定手段で前記第2物体の前記特定領域を撮像した画像に基づいて前記特定領域に対する前記位置特定手段の第1相対位置を検出し、
前記第1相対位置に基づいて、前記第1物体を前記第2物体に対して位置決めをする際の前記移動体の位置を補正する補正量を算出する、
装置。 - 請求項1から4のいずれか1項に記載の装置であって、
前記保持部の保持面側に配置され、保持面に対する前記第1物体の第2相対位置を特定する保持位置特定手段をさらに含み、
前記制御部は、
前記第2相対位置に基づいて、前記第1物体を前記第2物体に対して位置決めをする際の前記移動体の位置を補正する補正量を算出する、
装置。 - 請求項3に記載の装置であって、
前記制御部は、前記補正量に基づいて、前記スケールにおける目標目盛位置を算出する、
装置。 - 請求項4に記載の装置であって、
前記制御部は、前記補正量に基づいて、前記スケールにおける目標目盛位置を算出する、
装置。 - 請求項5に記載の装置であって、
前記制御部は、前記補正量に基づいて、前記スケールにおける目標目盛位置を算出する、
装置。 - 第1物体を第2物体に対して位置決めする方法であって、
保持部により前記第1物体を保持する工程と、
前記第1物体を保持する前記保持部及び位置特定手段が設けられた移動体を所定の位置に移動させる移動工程と、
前記移動体の移動方向に沿って前記保持部と所定の間隔を開けて前記移動体に取り付けられた前記位置特定手段により、前記第2物体の位置を特定する位置特定工程と、
前記位置特定手段に対応して第1位置検出部と前記所定の間隔を開けて前記移動体に取り付けられた第2位置検出部によって、特定された前記第2物体の位置に対応するスケールの目盛位置を検出する位置検出工程と、
前記移動体に配置された第1位置検出部により前記スケールの目盛を読み取って、前記目盛位置を検出する位置に前記保持部を移動させて前記第1物体を前記第2物体に対して位置決めをする位置決め工程と、
を含む、方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020207003992A KR102362976B1 (ko) | 2017-07-12 | 2018-07-12 | 제1 물체를 제2 물체에 대하여 위치 결정하는 장치 및 방법 |
US16/632,870 US11139193B2 (en) | 2017-07-12 | 2018-07-12 | Device and method for positioning first object in relation to second object |
CN201880058440.9A CN111066130B (zh) | 2017-07-12 | 2018-07-12 | 相对于第二物体来定位第一物体的装置和方法 |
SG11202001940PA SG11202001940PA (en) | 2017-07-12 | 2018-07-12 | Device and method for positioning first object in relation to second object |
JP2019529776A JP6787612B2 (ja) | 2017-07-12 | 2018-07-12 | 第1物体を第2物体に対して位置決めする装置及び方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-136065 | 2017-07-12 | ||
JP2017136065 | 2017-07-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019013274A1 true WO2019013274A1 (ja) | 2019-01-17 |
Family
ID=65002091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/026292 WO2019013274A1 (ja) | 2017-07-12 | 2018-07-12 | 第1物体を第2物体に対して位置決めする装置及び方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11139193B2 (ja) |
JP (1) | JP6787612B2 (ja) |
KR (1) | KR102362976B1 (ja) |
CN (1) | CN111066130B (ja) |
SG (1) | SG11202001940PA (ja) |
TW (1) | TWI684235B (ja) |
WO (1) | WO2019013274A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI743887B (zh) * | 2019-09-19 | 2021-10-21 | 日商捷進科技有限公司 | 晶粒接合裝置及半導體裝置的製造方法 |
EP3935668A4 (en) * | 2019-03-06 | 2022-11-16 | Rohinni, Llc. | MULTI-AXIS MOVEMENT FOR SEMICONDUCTOR DEVICES TRANSFER |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112945092B (zh) * | 2021-01-27 | 2023-03-28 | 深圳市卓兴半导体科技有限公司 | 一种多工位设备的模板定位方法及*** |
KR20230096038A (ko) * | 2021-11-16 | 2023-06-29 | 가부시키가이샤 신가와 | 실장 장치, 실장 방법 및 실장 제어 프로그램 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015170645A1 (ja) * | 2014-05-07 | 2015-11-12 | 株式会社新川 | ボンディング装置およびボンディング方法 |
WO2018062129A1 (ja) * | 2016-09-29 | 2018-04-05 | 株式会社新川 | 半導体装置の製造方法、及び実装装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3333060B2 (ja) * | 1995-04-11 | 2002-10-07 | 東レエンジニアリング株式会社 | チップボンディング方法及びその装置 |
JP2930093B2 (ja) * | 1995-08-18 | 1999-08-03 | 澁谷工業株式会社 | ボンディング方法 |
JP3143826B2 (ja) * | 1996-12-29 | 2001-03-07 | 澁谷工業株式会社 | ディスペンサ付きボンディング装置 |
JP3416091B2 (ja) | 2000-01-21 | 2003-06-16 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP2004146776A (ja) * | 2002-08-29 | 2004-05-20 | Shinko Electric Ind Co Ltd | フリップチップ実装装置及びフリップチップ実装方法 |
JP5365618B2 (ja) * | 2010-12-24 | 2013-12-11 | ソニー株式会社 | 位置調整装置及び位置調整方法 |
JP5996979B2 (ja) * | 2012-09-07 | 2016-09-21 | ヤマハ発動機株式会社 | 電子部品実装装置および実装位置補正データ作成方法 |
JP5828943B1 (ja) * | 2014-08-11 | 2015-12-09 | 株式会社新川 | 電子部品の実装装置 |
JP6470088B2 (ja) * | 2015-04-02 | 2019-02-13 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
-
2018
- 2018-07-10 TW TW107123830A patent/TWI684235B/zh active
- 2018-07-12 SG SG11202001940PA patent/SG11202001940PA/en unknown
- 2018-07-12 CN CN201880058440.9A patent/CN111066130B/zh active Active
- 2018-07-12 KR KR1020207003992A patent/KR102362976B1/ko active IP Right Grant
- 2018-07-12 JP JP2019529776A patent/JP6787612B2/ja active Active
- 2018-07-12 WO PCT/JP2018/026292 patent/WO2019013274A1/ja active Application Filing
- 2018-07-12 US US16/632,870 patent/US11139193B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015170645A1 (ja) * | 2014-05-07 | 2015-11-12 | 株式会社新川 | ボンディング装置およびボンディング方法 |
WO2018062129A1 (ja) * | 2016-09-29 | 2018-04-05 | 株式会社新川 | 半導体装置の製造方法、及び実装装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3935668A4 (en) * | 2019-03-06 | 2022-11-16 | Rohinni, Llc. | MULTI-AXIS MOVEMENT FOR SEMICONDUCTOR DEVICES TRANSFER |
TWI743887B (zh) * | 2019-09-19 | 2021-10-21 | 日商捷進科技有限公司 | 晶粒接合裝置及半導體裝置的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201909327A (zh) | 2019-03-01 |
KR102362976B1 (ko) | 2022-02-15 |
TWI684235B (zh) | 2020-02-01 |
SG11202001940PA (en) | 2020-04-29 |
US11139193B2 (en) | 2021-10-05 |
JP6787612B2 (ja) | 2020-11-18 |
US20200251369A1 (en) | 2020-08-06 |
CN111066130B (zh) | 2023-05-02 |
JPWO2019013274A1 (ja) | 2020-04-16 |
CN111066130A (zh) | 2020-04-24 |
KR20200021539A (ko) | 2020-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6787612B2 (ja) | 第1物体を第2物体に対して位置決めする装置及び方法 | |
KR100336017B1 (ko) | 본딩방법 및 그 장치 | |
US9374936B2 (en) | Workpiece mounting apparatus | |
KR101426583B1 (ko) | 다이 본더 및 반도체 제조 방법 | |
KR101968807B1 (ko) | 얼라인먼트 방법 및 얼라인먼트 장치 | |
KR20130012928A (ko) | 전자 부품 반송 장치 및 전자 부품 반송 방법 | |
US20220199448A1 (en) | Bonding apparatus and method for correcting movement amount of bonding head | |
JP7072264B2 (ja) | 対象物に対して移動体を直線移動させる装置および方法 | |
JP4648964B2 (ja) | マーク認識システム、マーク認識方法および表面実装機 | |
JP5986741B2 (ja) | 部品搭載方法及び装置及びプログラム | |
JPWO2014155658A1 (ja) | 生産設備 | |
WO2014119434A1 (ja) | 実装方法および実装装置 | |
JP2011181675A (ja) | 回路部品の実装装置 | |
JP2844409B2 (ja) | 半導***置決め方法 | |
JP2001102397A (ja) | チップ実装装置及びそれにおけるキャリブレーション方法 | |
JP2008004626A (ja) | 電子部品実装方法 | |
CN108986167B (zh) | 置晶设备的校正方法及使用该方法的置晶设备 | |
WO2023188500A1 (ja) | 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法 | |
WO2022168275A1 (ja) | ボンディング装置及びボンディング方法 | |
JP2002141362A (ja) | 電子部品の実装装置 | |
JP4802909B2 (ja) | 位置合わせ方法および位置合わせ装置 | |
JP2006216573A (ja) | ボンディング装置におけるキャリブレーション方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18832778 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019529776 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20207003992 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18832778 Country of ref document: EP Kind code of ref document: A1 |