WO2019003726A1 - 複合部材およびデバイス - Google Patents
複合部材およびデバイス Download PDFInfo
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- WO2019003726A1 WO2019003726A1 PCT/JP2018/019734 JP2018019734W WO2019003726A1 WO 2019003726 A1 WO2019003726 A1 WO 2019003726A1 JP 2018019734 W JP2018019734 W JP 2018019734W WO 2019003726 A1 WO2019003726 A1 WO 2019003726A1
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/04—Charge transferring layer characterised by chemical composition, i.e. conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/057—Ester polymer, e.g. polycarbonate, polyacrylate or polyester
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Definitions
- the present invention relates to a composite member having a conductive layer sandwiched between adhesive layers and a device having the composite member, and more particularly to a device having a composite member and a composite member for controlling a stress acting on the conductive layer.
- a sheet having a conductive layer formed of a conductive wire is used for various applications such as electromagnetic wave shields of various devices, antennas, various sensors, heating elements, and electrodes.
- An electrode is an electrode of various electronic devices, such as a solar cell, an inorganic EL (Inorganic Electro Luminescence) element, and an organic EL (Organic Electro Luminescence) element, for example.
- the above-mentioned sheet is used for a touch panel other than the above-mentioned use.
- a touch panel is used which is used in combination with a display device such as a liquid crystal display device and performs an input operation to the electronic device by touching a screen. Is advancing.
- device development in a form in which the touch panel is bent or rolled is in progress. As a result, the electronic devices can be made compact, and stylish designs can be made, which can be used as appealing points.
- each member constituting the touch panel In order to bend the touch panel, it is necessary for each member constituting the touch panel to have a resistance against bending, such as not breaking, not breaking, and losing performance. About these things, especially about a cover material, a touch panel, and a panel, a bending characteristic is important and examination about each is advanced.
- the laminate is subjected to compressive stress inward according to bending and tensile stress on the outer side, so that the weak member is positioned at an intermediate point where stress is zero.
- the wiring layer of the flexible film is on the neutral surface of the flexible film.
- the wiring layer is further protected by a softness-replenishing film to suppress the generation of defects due to cracks in the wiring layer when bent.
- the neutral plane is a region that is not substantially stressed when the flexible touch screen panel is bent.
- Patent Document 2 discloses a display having a neutral surface on a display element or a thin film sealing layer.
- a layer having a very low modulus of elasticity is intentionally inserted as a stress relaxation layer to generate a plurality of stress intermediate points, and a weak base material is positioned at the stress intermediate point.
- electrically conductive layers such as wiring parts, such as a thin film transistor (TFT) of an organic electroluminescent (EL) (organic electro luminescence) display, and electrode wiring for touch panels, are mentioned, for example.
- the flexible display device of Patent Document 3 includes a flexible outer member disposed on the flexible display panel, and an adhesive member disposed between the flexible display panel and the flexible outer member.
- the elastic modulus of the adhesive member is set such that a neutral plane is formed on each of the flexible display panel and the flexible outer member.
- the elastic modulus of the bonding member is 1/10000 to 1/1000 of the elastic modulus of the flexible display panel and the flexible outer member.
- An object of the present invention is to solve the problems based on the above-mentioned prior art and to provide a composite member and device capable of controlling the stress acting on the conductive layer.
- the present invention comprises at least one conductive layer body comprising an insulating layer, and at least two conductive layers electrically isolated and spaced apart by the insulating layer.
- the adhesive layer is disposed other than between the insulating layer and the conductive layer, and other than between the first conductive layer and the member having a higher elastic modulus than the adhesive layer, and the insulating layer is higher than the adhesive layer.
- the insulating layer preferably has flexibility.
- the insulating layer preferably has a modulus of 10 ⁇ 1 to 30 GPa. It is preferable that the member having a high elastic modulus is formed of a sheet and disposed on the opposite side of the first conductive layer to the insulating layer.
- a first protective layer having a higher elastic modulus than the adhesive layer be stacked on the first conductive layer. It is preferable that the first protective layer is in contact with the first adhesive layer provided on the first conductive layer side.
- td be the thickness from the interface between the first protective layer and the first conductive layer to the interface of the adhesive layer first disposed on the side where the curvature radius of the insulating layer is smaller when the conductive layer is bent in the bending direction.
- the thickness of the protective layer is ts, it is preferable that ts ⁇ td.
- a second protective layer having a thickness of 20 ⁇ m or less is laminated on the second conductive layer provided on the side where the curvature radius of the substrate is small, and the second protective layer It is preferable to be in contact with the second adhesive layer provided on the side of the second conductive layer.
- the second adhesive layer provided on the side where the curvature radius of the substrate is smaller, and when the conductive layer is bent in the bending direction, the curvature radius of the insulating layer is provided on the smaller side It is preferable that the second conductive layer be in contact with the second conductive layer.
- the conductive layer body preferably includes an insulating layer and conductive layers provided on both surfaces of the insulating layer.
- the insulating layer is preferably formed of an insulating substrate.
- the conductive layer is preferably made of metal.
- a barrier layer may be provided between the insulating layer and the conductive layer, or on the conductive layer, and the barrier layer may have an inorganic layer containing at least silicon nitride.
- the barrier layer preferably has a laminated structure of an inorganic layer and an organic layer.
- the stress acting on the conductive layer can be controlled.
- the term "transparent” means that the light transmittance is at least 60% or more, preferably 75% or more, more preferably 80% or more, in the visible light wavelength range of 400 to 800 nm. Preferably it is 85% or more.
- the light transmittance is measured using “plastics—how to determine total light transmittance and total light reflectance” defined in JIS (Japanese Industrial Standard) K 7375: 2008. Further, in the present invention, having flexibility means that it can be bent, and specifically, it means that no cracking occurs even if it is bent with a curvature radius of 1 mm.
- a member 10 (see FIG. 1) having a low elastic modulus comparable to that of a transparent adhesive film (OCA (Optically Clear Adhesive)) has an elastic modulus of polyethylene terephthalate.
- a laminate 12 obtained by laminating a member 11 (see FIG. 1) having a high elastic modulus similar to that of a plastic film such as (PET), cycloolefin polymer (COP) and polyimide (PI)
- PET plastic film
- COP cycloolefin polymer
- PI polyimide
- FIG. 1 shows a total of four layers of members 10 and members 11 alternately stacked
- FIG. 5 shows a total of eight layers of members 10 and members 11 alternately stacked.
- the conductive layer body including the conductive layer sandwiched by the adhesive layer the conductive layer is in contact with the adhesive layer on the inner fold side and the adhesive on the outer fold side It has been found that the bending resistance of the conductive layer can be improved by making the layer not in contact with the layer.
- the conductive layer body in which the conductive layer is provided on each surface of both sides of the substrate sandwiched by the adhesive layer the tensile stress is likely to be applied to the outer fold side and the compressive stress is likely to be applied to the inner fold side. The closer to, the higher the stress.
- the conductive layer is strong in compressive stress and weak in tensile stress
- placing the conductive layer away from the surface of the adhesive layer on the outer fold side and in proximity to the adhesive layer on the inner fold side makes the conductive layer resistant to bending. I found it desirable to improve.
- the conductive layer body is bent in the bending direction, the smaller the curvature radius of the substrate is the inner fold side and the larger the curvature radius of the substrate is the outer fold side is there.
- the composite member has a conductive layer body in which a conductive layer is provided on each surface of both sides of a substrate, and at least two adhesive layers arranged with the conductive layer body interposed therebetween.
- the first conductive layer provided on the surface on the side with the large curvature radius of the substrate is in contact with a member having a higher elastic modulus than the adhesive layer.
- a display is mentioned as a device which has a composite member, if it is composition which has a conductive layer object by which a conductive layer was provided in each field of both sides of a substrate, it will not be limited to a display.
- a display device will be described as an example.
- FIG. 7 is a schematic view showing a display device having a composite member according to an embodiment of the present invention.
- the display device 20 shown in FIG. 7 has a function of detecting a touch of a finger or the like.
- the display device 20 includes the display unit 22, the first adhesive layer 27, the first protective layer 28, the touch sensor unit 30, the second adhesive layer 32, the antireflective layer 33, the cover layer 36, and the controller 37.
- the surface 36a of the cover layer 36 is a touch surface with which a finger or the like contacts.
- it has a plastic film 24, a transparent layer 25 and a plastic film 26 provided between the display unit 22 and the first adhesive layer 27.
- the plastic film 24, the transparent layer 25, and the plastic film 26 are provided in this order from the display unit 22 side.
- the transparent layer 23 is provided between the plastic film 24 and the display unit 22, and the transparent layer 34 is provided between the antireflective layer 33 and the cover layer 36.
- a composite member 21 is obtained by removing the display unit 22 and the transparent layer 23 from the display device 20 illustrated in FIG. 7.
- the display unit 22 includes a display area (not shown) for displaying an image or the like, and is configured of, for example, a liquid crystal display panel or an organic electro luminescence (EL) display panel.
- the display unit 22 may use a vacuum fluorescent display (VFD), a plasma display panel (PDP), a surface electric field display (SED), a field emission display (FED), electronic paper, and the like, in addition to the above-described ones.
- VFD vacuum fluorescent display
- PDP plasma display panel
- SED surface electric field display
- FED field emission display
- the configurations of the transparent layer 23 and the transparent layer 34 are not particularly limited as long as they are both optically transparent and insulative and can exhibit a stable fixing power.
- the transparent layer 23 and the transparent layer 34 for example, optically clear adhesive (OCA, Optical Clear Adhesive) and optically clear resin (OCR, Optical Clear Resin) such as UV (Ultra Violet) curing resin are used. It can be used.
- OCA optically clear Adhesive
- OCR optically clear Resin
- UV (Ultra Violet) curing resin UV (Ultra Violet) curing resin
- MO-3015C product name
- MO-3015G product name
- MO-3015H product name
- MO-3015I product name
- the transparent layer 34 also constitutes an adhesive layer in the same manner as the first adhesive layer 27 and the second adhesive layer 32.
- the touch sensor unit 30 detects contact of a finger or the like on the surface 36 a of the cover layer 36 in the display device 20.
- the touch sensor unit 30 may be a capacitive type or a resistive film type.
- the controller 37 one corresponding to the touch sensor unit 30 is appropriately used. If the touch sensor unit 30 is of the capacitance type, the controller 37 detects the position at which the capacitance has changed. If the touch sensor unit 30 is a resistive film type, the controller 37 detects the position where the resistance has changed.
- the touch sensor unit 30 will be described using a capacitive touch sensor as an example. As shown in FIG. 8, the touch sensor unit 30 is formed on the insulating substrate 40, the detection electrode formed on each surface of one surface of the insulating substrate 40, and the periphery of the detection electrode. And peripheral wiring connected in a conventional manner.
- the detection electrode corresponds to the conductive layer.
- a plurality of first detection electrodes extending in the first direction Y on the surface 40 a (see FIG. 9) of the insulating substrate 40 and arranged in parallel in the second direction X orthogonal to the first direction Y 42 are formed, and a plurality of first peripheral wirings 43 electrically connected to the plurality of first detection electrodes 42 are arranged close to each other.
- a plurality of second detection electrodes 44 extending in the second direction X and arranged in parallel in the first direction Y are formed.
- a plurality of second peripheral wires 45 electrically connected to the plurality of second detection electrodes 44 are arranged in proximity to each other.
- the plurality of first detection electrodes 42 and the plurality of second detection electrodes 44 are detection electrodes.
- the plurality of first detection electrodes 42 and the plurality of second detection electrodes 44 are electrically insulated from each other by the insulating substrate 40 and separated from each other, and are partially overlapped.
- the insulating substrate 40 functions as an insulating layer which electrically insulates at least two conductive layers, and is a form of the insulating layer.
- a region where the plurality of first detection electrodes 42 and the plurality of second detection electrodes 44 overlap in a plan view is a detection region 47.
- the detection area 47 is an area where a touch of a finger or the like can be detected.
- the first detection electrode 42 is formed of, for example, a conductive line 50 formed on the surface 40 a of the insulating substrate 40.
- the conductive lines 50 of the first detection electrode 42 are arranged, for example, in a mesh pattern as shown in FIG.
- the second detection electrode 44 is formed of, for example, a conductive line 50 formed on the back surface 40 b of the insulating substrate 40.
- the conductive lines 50 of the second detection electrode 44 are, for example, arranged in a mesh pattern as shown in FIG.
- Conductive layer 50 is formed on the surface 40 a of the insulating substrate 40, and the conductive line 50 is formed on the back surface 40 b of the second detection electrode 44. It is.
- the conductive layer body 41 is composed of the insulating substrate 40, the conductive line 50 constituting the first detection electrode 42, and the conductive line 50 constituting the second detection electrode 44, and the adhesive layer is not included in the structure. Is preferred.
- the insulating substrate 40 has a higher elastic modulus than the adhesive layer. Further, since the conductive layer body 41 is bent, it is preferable that the insulating substrate 40 have flexibility.
- the first detection electrode 42 corresponds to a second conductive layer
- the second detection electrode 44 corresponds to a first conductive layer.
- the surface 40a side of the insulating substrate 40 having a small radius of curvature is the inward folding side.
- the back surface 40b side of the insulating substrate 40 having a large radius of curvature is the outward fold side. Therefore, the second detection electrode 44 corresponds to the first conductive layer on the outer fold side, and the first detection electrode 42 corresponds to the second conductive layer on the inner fold side.
- the first adhesive layer 27 is disposed on the back surface 40 b side of the insulating substrate 40, and the second adhesive layer 32 is disposed on the surface 40 a side of the insulating substrate 40.
- the first peripheral wiring 43 and the second peripheral wiring 45 are formed of, for example, a conductive line 50.
- the first peripheral wire 43 and the second peripheral wire 45 are not particularly limited to the conductive wire 50, and the conductive wire 50 may be formed of a conductive wire having a different line width and thickness. Good.
- the first peripheral wiring 43 and the second peripheral wiring 45 can be formed of, for example, a strip-shaped conductor.
- the first detection electrode 42 and the plurality of second detection electrodes 44 are formed of the conductive line 50, and the first peripheral wiring 43 and the second peripheral wiring 45 are formed of another one.
- the touch sensor unit 30 is not limited to a capacitive touch sensor, and may be a resistive film touch sensor. Each component of the touch sensor unit 30 will be described later.
- the antireflective layer 33 has a linear polarizer and a ⁇ / 4 plate.
- a polarizer is disposed on the touch sensor unit 30 side, and a ⁇ / 4 plate is disposed on the cover layer 36 side.
- the ⁇ / 4 plate is a plate having a ⁇ / 4 function.
- the ⁇ / 4 plate may be a single-layer ⁇ / 4 plate or a wide band ⁇ / 4 plate in which the ⁇ / 4 plate and the ⁇ / 2 plate are stacked.
- the thickness of the antireflective layer 33 is not particularly limited, and is preferably 1 to 100 ⁇ m, and more preferably 1 to 50 ⁇ m.
- the linear polarizer of the antireflection layer 33 may be a member having a function of converting light into specific linear polarization, and an absorptive polarizer can be mainly used.
- an absorption polarizer an iodine polarizer, a dye polarizer using a dichroic dye, a polyene polarizer, and the like are used.
- iodine type polarizers and dye type polarizers there are coating type polarizers and stretching type polarizers, either of which can be applied, but polarized light produced by adsorbing iodine or a dichroic dye to polyvinyl alcohol and stretching it Preferably a child.
- patent 5048120, patent 5143918, patent 5048120, patent No. 4,691,205, Japanese Patent No. 4,751,481, and Japanese Patent No. 4,751,486 can be mentioned, and known techniques relating to these polarizers can also be preferably used.
- the ⁇ / 4 plate is a plate having a function of converting linearly polarized light of a specific wavelength into circularly polarized light or converting circularly polarized light into linearly polarized light. More specifically, it is a plate showing an in-plane retardation value of ⁇ / 4 (or an odd multiple thereof) at a predetermined wavelength ⁇ nm.
- the in-plane retardation value (Re (550)) at a wavelength of 550 nm of the ⁇ / 4 plate may have an error of about 25 nm centered on the ideal value (137.5 nm), for example, 110 to 160 nm Is preferable, 120 to 150 nm is more preferable, and 130 to 145 nm is more preferable.
- the angle between the absorption axis of the polarizer and the in-plane slow axis of the ⁇ / 4 plate is preferably in the range of 45 ° ⁇ 3 °. In other words, the angle is preferably in the range of 42 ° to 48 °. The angle is preferably in the range of 45 ° ⁇ 2 ° in that the antireflective effect is more excellent. In addition, with the above-mentioned angle, the angle of the absorption axis of a polarizer and the in-plane slow axis of a ⁇ / 4 plate is intended when viewed from the normal direction of the surface of the polarizer.
- the angle between the in-plane slow axis of the ⁇ / 4 plate and the in-plane slow axis of the ⁇ / 2 plate is 60 °
- the ⁇ / 2 plate side on the incident side of linearly polarized light, and the in-plane slow axis of the ⁇ / 2 plate at an angle of 15 ° or 75 ° with respect to the plane of polarization of the incident linearly polarized light. It is preferred to use.
- angles refer to the absorption axis of the polarizer, the in-plane slow axis of the ⁇ / 4 plate, and the absorption axis of the polarizer and the ⁇ / 2 plate when viewed from the normal direction of the surface of the polarizer.
- the respective angles with the in-plane slow axis are intended.
- the cover layer 36 plays a role of protecting the touch sensor unit 30 from the external environment.
- the cover layer 36 is preferably transparent, and a plastic film, a plastic plate or the like is used.
- the thickness of the cover layer 36 is desirably selected according to each application, but is preferably 1 to 200 ⁇ m, more preferably 5 to 150 ⁇ m, and still more preferably 30 to 100 ⁇ m.
- the cover layer 36 is bent in the bending direction M (see FIG. 7) so that the cover layer 36 is inside, bending of the cover layer 36 to the opposite side due to compressive stress is suppressed if the thickness of the cover layer 36 is 1 ⁇ m or more. Is less likely to occur.
- the raw materials of the above-mentioned plastic film and plastic plate include, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyethylene (PE), polypropylene (PP), polystyrene, and EVA (vinyl acetate copolymer) Polyolefins such as polymerized polyethylene); vinyl resins; others, polycarbonate (PC), polyamide, polyimide, (meth) acrylic resin, triacetyl cellulose (TAC), cycloolefin resin (COP) and the like.
- polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyethylene (PE), polypropylene (PP), polystyrene, and EVA (vinyl acetate copolymer)
- Polyolefins such as polymerized polyethylene
- vinyl resins others, polycarbonate (PC), polyamide, polyimide, (meth) acrylic resin, triacet
- the stress can be relaxed and the acting tensile stress can be reduced by laminating a plurality of layers, and therefore, between the display portion 22 and the first adhesive layer 27
- a plastic film 24, a transparent layer 25 and a plastic film 26 are provided.
- the stress which acts on the touch sensor part 30 can be adjusted also by these.
- the plastic film 24 and the plastic film 26 are made of, for example, at least one of polyimide (PI), polyamide (PA), polyethylene terephthalate (PET), triacetyl cellulose (TAC), and cycloolefin copolymer (COC). Is preferred.
- the plastic film 24 and the plastic film 26 preferably have an elastic modulus of 10 ⁇ 1 to 30 GPa.
- the elastic modulus is a tensile elastic modulus.
- the elastic modulus can be measured by a dynamic elastic modulus measuring device or a microhardness tester (Picodenter).
- the transparent layer 25 has the same configuration as the first adhesive layer 27 described above.
- the transparent layer 25 also constitutes an adhesive layer in the same manner as the first adhesive layer 27 and the second adhesive layer 32.
- the adhesion of the interface with each member in contact with the transparent layer or the adhesive layer is preferably high from the viewpoint of suppressing peeling.
- the adhesion of the interface with each member in contact with the adhesive layer is preferably 0.1 N / mm or more, more preferably 0.4 N / mm or more, and most preferably 0.7 N / mm or more.
- the first adhesive layer 27 and the second adhesive layer 32 are disposed, for example, with the touch sensor unit 30 interposed therebetween.
- a first protective layer 28 is provided between the touch sensor unit 30 and the first adhesive layer 27.
- the adhesion layer should just be a structure which has at least one.
- the first adhesive layer 27 bonds the plastic film 26 and the first protective layer 28 and functions as a stress relieving layer.
- the first adhesive layer 27 is disposed on the side where the radius of curvature of the insulating substrate 40 is large, that is, the outer folding side.
- the second adhesive layer 32 bonds the touch sensor unit 30 and the antireflective layer 33, and functions as a stress relaxation layer.
- the second adhesive layer 32 is disposed on the side where the radius of curvature of the insulating substrate 40 is small when the conductive layer body 41 is bent in the bending direction M, that is, on the inner folding side, and the first detection electrode They are in contact with the 42 conductive lines 50 (see FIG. 9).
- the arrangement position of the adhesive layer Is not particularly limited.
- the adhesive layer is disposed on the side opposite to the insulating layer of the first conductive layer like the first adhesive layer 27 or the conductive layer body 41 is bent in the bending direction like the second adhesive layer 32 In this case, it is disposed on the opposite side of the insulating layer of the second conductive layer provided on the side where the radius of curvature of the insulating layer is small. Therefore, the first adhesive layer 27 and the second adhesive layer 32 are not limited to being disposed with the touch sensor unit 30 interposed therebetween.
- At least one adhesive layer is not formed between the insulating substrate 40 and the first detection electrode 42. That is, the adhesive layer is not formed between the surface 40 a of the insulating substrate 40 and the conductive line 50 of the first detection electrode 42. Furthermore, no adhesive layer is formed between the insulating substrate 40 and the second adhesive layer 32.
- the elastic modulus of the first adhesive layer 27 and the second adhesive layer 32 is preferably 10 ⁇ 6 to 10 ⁇ 2 GPa.
- MO-3015C product name
- MO-3015G product name
- MO-3015H product name
- MO-3015I product name
- the elastic modulus is a tensile elastic modulus.
- the elastic modulus can be measured by a dynamic elastic modulus measuring device or a microhardness tester (picodenter) as described above.
- the first protective layer 28 has a configuration in which the first adhesive layer 27 and the second detection electrode 44 which is a conductive layer are not in direct contact with each other in order to reduce the tensile stress acting on the touch sensor unit 30. It is.
- the first protective layer 28 is stacked on a second detection electrode 44 provided on the back surface 40 b of the insulating substrate 40 of the conductive layer body 41.
- the first protective layer 28 is in contact with the first adhesive layer 27.
- the first protective layer 28 is a member having a higher elastic modulus than the first adhesive layer 27 and the second adhesive layer 32 described above, and the elastic modulus is, for example, 10 ⁇ 1 to 30 GPa.
- the elastic modulus is a tensile elastic modulus. Also in this case, the elastic modulus can be measured by a dynamic elastic modulus measuring device or a microhardness tester (picodenter) as described above.
- the film thickness of the first protective layer 28 is preferably thin because the absolute value of the stress applied to the member is increased if the total film thickness is too thick.
- the film thickness of the first protective layer 28 is too thin, the above-described effect of reducing the tensile stress is reduced.
- the interface between the first protective layer 28 and the first conductive layer that is, the interface 28 a (see FIG. 9) between the first protective layer 28 and the conductive line 50 of the second detection electrode 44, a conductive layer When the electrode 41 is bent in the bending direction M (see FIG.
- the interface between the first adhesive layer 32 and the anti-reflection layer 33 is provided up to the interface of the first adhesive layer disposed on the side of the insulating substrate
- the thickness up to 32a (see FIG. 9) is td (see FIG. 9).
- the thickness of the first protective layer 28 is ts (see FIG. 9).
- the thickness ts (see FIG. 9) of the first protective layer 28 is preferably 1/20 or more, more preferably 1/10 or more of the thickness td described above.
- the first protective layer 28 in contact with the first adhesive layer 27, if the first protective layer 28 has the same thickness as the thickness of the conductive layer on the outer folding side to the adhesive layer on the inner folding side, That is, if it is about the same as the above-mentioned thickness td, the force such as the tensile force applied to the second detection electrode 44 can be sufficiently reduced. From this, it is preferable that the thickness ts (see FIG. 9) of the first protective layer 28 be ts ⁇ td.
- the thickness td described above can be obtained as follows. First, in the composite member 21, a cross-sectional electron microscope image including the first adhesive layer 27, the first protective layer 28, the conductive layer body 41, and the antireflection layer 33 is acquired using a scanning electron microscope. Next, from the cross-sectional electron microscopic image, the interface 28a (see FIG. 9) with the conductive wire 50 of the second detection electrode 44 and the interface 32a (see FIG. 9) with the second adhesive layer 32 and the antireflective layer 33 Identify. Next, the distance between the interface 28a described above and the interface 32a described above is measured to determine the thickness td described above.
- a base material or an adhesive having a modulus of 10 ⁇ 1 to 30 GPa may be disposed.
- the elastic modulus is a tensile elastic modulus. Also in this case, the elastic modulus can be measured by a dynamic elastic modulus measuring device or a microhardness tester (picodenter) as described above.
- the composite member 21 By setting the composite member 21 to the above-described configuration, the stress acting on the conductive wire 50 of the conductive layer body 41 can be adjusted, and the tensile stress acting on the conductive wire 50 can be reduced. Thereby, damage such as breakage of the conductive wire 50 can be suppressed, and sufficient bending resistance can be obtained. Therefore, even if the display device 20 is repeatedly bent in the bending direction M so that the surface 36a of the cover layer 36 is inside, it is possible to suppress a decrease in touch sensitivity for detecting contact with a finger or the like.
- the composite member 21 preferably has a small total film thickness because the absolute value of the stress applied to the member increases when the total film thickness is large. 500 micrometers or less are preferable and, as for the total film thickness of the composite member 21, 300 micrometers or less are still more preferable.
- the second protective layer 31 is provided between the touch sensor unit 30 and the second adhesive layer 32.
- the second protective layer 31 is disposed on the surface 40a side of the insulating substrate 40 (see FIG. 9) having a small radius of curvature when the conductive layer body 41 (see FIG. 9) is bent in the bending direction M (see FIG. 9). It is The second protective layer 31 is in contact with the second adhesive layer 32.
- the same components as those of the display device 20 shown in FIG. 7 will be assigned the same reference numerals and detailed explanations thereof will be omitted.
- the composite member 21 is obtained by removing the display portion 22 and the transparent layer 23.
- the second protective layer 31 is for increasing the strength of the first detection electrode 42 and the second detection electrode 44 of the touch sensor unit 30 as described above.
- the second protective layer 31 can have the same configuration as the first protective layer 28. Further, the second protective layer 31 desirably has a high elastic modulus, and preferably 0.1 GPa or more.
- the second protective layer 31 preferably has a crosslinked structure as a material, and the second protective layer 31 is preferably formed of an acrylic resin or a urethane resin.
- the second protective layer 31 preferably has a thickness of 20 ⁇ m or less because the absolute value of the stress applied to the first detection electrode 42 and the second detection electrode 44 of the touch sensor unit 30 increases if the film thickness is large. .
- the film thickness of the second protective layer 31 can be determined by measuring the thickness of the second protective layer 31 itself before the composite member 21 is manufactured, or can be measured from the cross-sectional electron microscopic image as described above. it can.
- the display device 20a shown in FIG. 11 can obtain the same effects as the display device 20 shown in FIG. 7 other than the above.
- FIG. 12 is a schematic cross-sectional view showing another first example of the touch sensor unit used for the display device
- FIG. 13 is a schematic cross-sectional view showing another second example of the touch sensor unit used for the display device.
- FIG. 14 is a schematic cross-sectional view showing another third example of the touch sensor unit used for the display device.
- the same components as those of the display device 20 shown in FIG. 7 and the touch sensor unit 30 shown in FIG. 9 are denoted by the same reference numerals, and the detailed description thereof is omitted.
- the touch sensor unit 30 a shown in FIG. 12 uses an insulating layer 48 instead of the insulating substrate 40, and the insulating layer 48 uses the first detection electrode 42 and the second detection electrode And the detection electrode 44 of the second embodiment is electrically isolated and spaced apart.
- the second detection electrode 44 is formed on the first protective layer 28.
- the first detection electrode 42 is different in that it is formed on the surface 48 a of the insulating layer 48.
- the first protective layer 28 is formed of, for example, a sheet, and can be formed of the same as the above-described insulating substrate 40.
- a second adhesive layer 32 covering the first detection electrode 42 is provided on the surface 48 a of the insulating layer 48.
- the touch sensor unit 30a illustrated in FIG. 12 can obtain the same effect as the touch sensor unit 30 illustrated in FIG.
- the second protective layer 31 can be provided similarly to the display device 20a illustrated in FIG.
- the second protective layer 31 covering the first detection electrode 42 is provided on the surface 48 a of the insulating layer 48.
- the touch sensor unit 30b illustrated in FIG. 13 can obtain the same effect as the touch sensor unit 30 illustrated in FIG.
- the first detection electrode 42 and the second detection electrode 44 bend the conductive layer body 41 in the bending direction M. The case is placed on the inward side.
- the touch sensor unit 30c illustrated in FIG. 14 uses the insulating layer 48 in the same manner as the touch sensor unit 30b illustrated in FIG.
- the second detection electrode 44 is provided on the back surface 48 b of the insulating layer 48
- the first protective layer 28 covering the second detection electrode 44 is provided on the back surface 48 b of the insulating layer 48.
- the first detection electrode 42 is provided on the second protective layer 31.
- the second protective layer 31 is made of, for example, a sheet, and can be made the same as the above-described insulating substrate 40. For example, the same substrate as the above-described insulating substrate 40 can be used.
- the touch sensor unit 30c illustrated in FIG. 14 can obtain the same effect as the touch sensor unit 30 illustrated in FIG.
- the first detection electrode 42 and the second detection electrode 44 are disposed on the outer fold side when the conductive layer body 41 is bent in the bending direction M.
- a conductive layer body comprising an insulating layer, and at least two conductive layers electrically isolated from and spaced apart from each other by the insulating layer, at least one adhesive layer, and at least two.
- a member having a higher elastic modulus than the adhesive layer the conductive layer being in contact with the first conductive layer provided on the side having the large curvature radius of the insulating layer when the conductive layer body is bent in the bending direction;
- the two adhesive layers are disposed except between the insulating layer and the conductive layer and other than between the first conductive layer and the member having a higher elastic modulus than the adhesive layer, and the insulating layer has a higher elastic modulus than the adhesive layer If it is a configuration, the device is not limited to the display device 20, 20a having the touch sensor unit 30, 30a, 30b, 30c described above.
- the device may be a device having a wiring substrate in which a wiring is formed as a conductive layer on both surfaces of the substrate, or a device having a thin film transistor in which an electronic element is formed as a conductive layer on both surfaces of the substrate.
- the display device 20 having the configuration shown in FIG. 7 and the display device 20 a having the configuration shown in FIG. 11 are both disposed on the side having a large radius of curvature when the display portion 22 is bent in the bending direction M. Is preferably arranged on the side with the larger radius of curvature. Further, it is preferable that both the display device 20 configured as shown in FIG. 7 and the display device 20 a configured as shown in FIG. When the bending direction is predetermined, it is not preferable to use it in a direction other than the bending direction.
- FIG. 15 is a schematic perspective view showing a first example of a display device having a composite member according to an embodiment of the present invention
- FIG. 16 is a first example of a display device having a composite member according to an embodiment of the present invention. It is a schematic perspective view which shows use condition.
- FIGS. 15 and 16 the same components as in FIG. 7 will be assigned the same reference numerals and detailed explanations thereof will be omitted.
- the display device 20 having the configuration shown in FIG. 7 and the display device 20a having the configuration shown in FIG. 11 can be configured to be folded, for example, like the display device 60 shown in FIG.
- the display device 60 has the same configuration as the display device 20 although not shown in detail.
- the display area 60 d of the display device 60 corresponds to the surface 36 a of the cover layer 36 described above.
- the display device 60 is divided into a central portion 60a, a first side 60b, and a second side 60c.
- the display device 60 has a double-opening structure.
- FIG. 15 shows a state in which the first side 60b and the second side 60c are folded close to the central portion 60a. In this case, at the end 60e, the display area 60d is bent so as to be inside.
- the display device 60 Since the display device 60 has bending resistance as in the display device 20 described above, the touch sensitivity of the touch sensor unit 30 is reduced even if the first side 60 b and the second side 60 c are repeatedly opened and closed. There is no In the display device 60, when using the entire display region 60d, as shown in FIG. 16, the first side 60b and the second side 60c are opened. In addition, it can also be used in the state which one of the 1st side part 60b and the 2nd side part 60c opened.
- FIG. 17 is a schematic perspective view showing a second example of a display device having a composite member according to an embodiment of the present invention
- FIG. 18 is a second example of a display device having a composite member according to an embodiment of the present invention. It is a schematic perspective view which shows use condition.
- FIGS. 17 and 18 the same components as in FIG. 7 will be assigned the same reference numerals and detailed explanations thereof will be omitted.
- the display device 20 having the configuration shown in FIG. 7 and the display device 20a having the configuration shown in FIG. 11 can be configured to be folded, for example, like the display device 62 shown in FIG.
- the display device 62 has the same configuration as the display device 20 although not shown in detail.
- the display area 62 c of the display device 62 corresponds to the surface 36 a of the cover layer 36 described above.
- the display device 62 is divided into a first side 62a and a second side 62b.
- the display device 62 is a half-opened structure.
- FIG. 17 shows a state in which the first side 62a and the second side 62b are put together and folded. In this case, the end 62 d is bent so that the display area 62 c is inside.
- the display device 62 is resistant to bending as in the case of the display device 20 described above, and therefore the touch sensitivity of the touch sensor unit 30 does not decrease.
- the display device 62 when using the display area 62c, as shown in FIG. 18, the first side 62a and the second side 62b are opened.
- FIG. 19 is a schematic perspective view showing a third example of the display device having the composite member according to the embodiment of the present invention.
- the display device 20 having the configuration shown in FIG. 7 and the display device 20a having the configuration shown in FIG. 11 can be wound around the core 65, for example, as the display device 64 shown in FIG.
- the display device 64 has the same configuration as the display device 20 although not shown in detail.
- the display area 64 a of the display device 64 corresponds to the surface 36 a of the cover layer 36 described above.
- the display device 64 is wound around the core 65 so that the display area 64a is inside.
- the display device 64 has bending resistance as in the display device 20 described above, and thus the touch sensitivity of the touch sensor unit 30 does not decrease. In the display device 64, the display device 64 is pulled out when using the display area 64a.
- the touch sensor unit 30 will be described below.
- the type of the insulating substrate 40 is not particularly limited as long as it can electrically insulate the first detection electrode 42 and the second detection electrode 44 from each other and can be spaced apart.
- As the insulating substrate 40 a transparent substrate is preferable, and a plastic film is more preferable.
- the material constituting the insulating substrate 40 include TAC (triacetyl cellulose), PET (polyethylene terephthalate), PI (polyimide), COP (polycycloolefin), COC (polycycloolefin copolymer), polycarbonate, (Meth) acrylic resin, PEN (polyethylene naphthalate), PE (polyethylene), PP (polypropylene), polystyrene, polyvinyl chloride or polyvinylidene chloride is preferred, and TAC, PET, PI, COP or COC is more preferred, PET or COP is more preferred.
- "(meth) acryl represents both or any of acrylic and methacryl.
- the melting point of the plastic film is preferably about 290 ° C. or less.
- the total light transmittance of the insulating substrate 40 is preferably 85 to 100%.
- the thickness of the insulating substrate 40 is not particularly limited, and can generally be selected arbitrarily in the range of 25 to 500 ⁇ m. Among them, the thickness of the insulating substrate 40 is preferably 25 to 80 ⁇ m, more preferably 25 to 60 ⁇ m, and still more preferably 25 to 40 ⁇ m because the thinner insulating substrate 40 is suitable for bending.
- the insulating substrate 40 it is preferable to have a primer layer containing a polymer on the surface thereof.
- the adhesion of the conductive portion is further improved by forming the conductive portion on the undercoat layer.
- the method for forming the undercoat layer is not particularly limited, and examples thereof include a method in which a composition for forming an undercoat layer containing a polymer is applied on the insulating substrate 40 and heat treatment is performed as necessary.
- the composition for forming a subbing layer may contain a solvent, if necessary.
- the type of solvent is not particularly limited, and known solvents are exemplified.
- fine-particles of a polymer as a composition for undercoat layer forming containing a polymer.
- the thickness of the undercoat layer is not particularly limited, and is preferably 0.02 to 0.3 ⁇ m, and more preferably 0.03 to 0.2 ⁇ m in that the adhesion of the conductive portion is more excellent.
- the insulating substrate 40 has an elastic modulus higher than that of the adhesive layer, and preferably has an elastic modulus of 10 ⁇ 1 to 30 GPa.
- the elastic modulus is a tensile elastic modulus.
- the elastic modulus can be measured by a dynamic elastic modulus measuring device or a microhardness tester (Picodenter).
- the insulating substrate 40 is one mode of the insulating layer which electrically insulates the conductive layer as described above.
- the insulating layer is not limited to a sheet such as a substrate such as the insulating substrate 40, and may be in the form of a film or layer such as a coated film. Even in the case of a film or layer such as a coated film, like the insulating substrate 40, the first detection electrode 42 and the second detection electrode 44 can be electrically insulated and spaced apart.
- the line width w of the conductive wire 50 is not particularly limited, and is preferably 30 ⁇ m or less, more preferably 15 ⁇ m or less, still more preferably 10 ⁇ m or less, particularly preferably 9 ⁇ m or less, most preferably 7 ⁇ m or less, and preferably 0.5 ⁇ m or more .0 ⁇ m or more is more preferable. If it is the above-mentioned range, a low resistance electrode can be formed comparatively easily.
- the line width of the conductive wire is preferably 500 ⁇ m or less, more preferably 50 ⁇ m or less, and still more preferably 30 ⁇ m or less. If it is the above-mentioned range, a low resistance touch panel electrode can be formed comparatively easily.
- the thickness t of the conductive wire 50 is not particularly limited, and is preferably 0.001 mm to 0.2 mm, more preferably 30 ⁇ m or less, still more preferably 20 ⁇ m or less, and 0.01 to 9 ⁇ m. Particularly preferred is 0.05 to 5 ⁇ m. If it is the above-mentioned range, it is a low resistance electrode and can form an electrode excellent in endurance comparatively easily.
- a cross-sectional electron microscopic image of the conductive wire 50 is acquired using a scanning electron microscope.
- the width w and thickness t of the conductive wire 50 are determined from the cross-sectional electron microscope image.
- the pattern consisting of the conductive lines 50 is not limited to a mesh, and may be a triangle such as equilateral triangle, isosceles triangle, and right triangle, square, rectangle, rhombus, parallelogram, quadrilateral such as trapezoidal, (positive) hexagon, It may be a geometric figure combining a (positive) n-gon such as (positive) octagon, a circle, an ellipse, and a star.
- intersecting conductive wire 50 is intended.
- the opening is an opening area surrounded by the conductive line 50.
- the length of one side of the opening is preferably 800 ⁇ m or less, more preferably 600 ⁇ m or less, still more preferably 400 ⁇ m or less, preferably 5 ⁇ m or more, more preferably 30 ⁇ m or more, and still more preferably 80 ⁇ m or more.
- the aperture ratio is preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more.
- the aperture ratio corresponds to the ratio of the transparent portion of the surface 40 a of the insulating substrate 40 excluding the conductive wire 50 to the entire surface 40 a.
- the configuration of the conductive wire 50 is not particularly limited as long as it has conductivity and functions as a conductive layer.
- the conductive wire 50 is preferably formed of a metal or an alloy.
- the conductive layer 50 is preferably silver, aluminum, molybdenum, copper, titanium, gold or tungsten. Among them, silver is more preferable because the conductivity of the conductive wire is excellent.
- carbon conductive materials such as carbon nanotubes (CNT) and carbon nano pads (CNB), conductive oxides such as ITO (Indium Tin Oxide), and SnO 2 are used for the conductive wires 50. Can.
- the conductive wire 50 can obtain sufficient bending resistance even when using a carbon conductive material other than metal and a conductive oxide.
- the conductive wire 50 preferably contains a binder from the viewpoint of the adhesion between the conductive wire 50 and the insulating substrate 40.
- the binder is preferably a resin because the adhesion between the conductive wire 50 and the insulating substrate 40 is more excellent, and more specifically, (meth) acrylic resin, styrene resin, vinyl resin, polyolefin resin, At least one resin selected from the group consisting of polyester resins, polyurethane resins, polyamide resins, polycarbonate resins, polydiene resins, epoxy resins, silicone resins, cellulose polymers, and chitosan polymers, or And copolymers made of monomers constituting these resins.
- the method for producing the conductive wire 50 is not particularly limited, and a known method can be adopted. For example, there is a method in which a photoresist film on a metal foil formed on the surface of the insulating substrate 40 is exposed and developed to form a resist pattern, and the metal foil exposed from the resist pattern is etched. Moreover, the method of printing the paste containing a metal microparticle or metal nanowire on each surface of the both surfaces of the insulated substrate 40, and performing metal plating to a paste is mentioned. Furthermore, methods using silver halide other than the above-mentioned methods may be mentioned. More specifically, the method described in paragraphs 0056 to 0114 of JP-A-2014-209332 can be mentioned. From the viewpoint of excellent bending, a silver thin wire is used for the conductive wire 50, and a mode including a mesh pattern made of silver thin wire can be mentioned.
- Each touch sensor unit 30 described above can be configured to have a barrier layer (not shown) having a moisture shielding ability. By providing the touch sensor unit 30 with the barrier layer, it is possible to maintain the moisture shielding ability without increasing the total film thickness of the composite member.
- the barrier layer has at least one inorganic layer, and a laminated structure of an organic layer and an inorganic layer is preferable.
- the barrier layer may be one in which two or more organic layers and two or more inorganic layers are alternately stacked.
- the number of layers constituting the barrier layer is not particularly limited, and typically, 2 to 30 layers are preferable, and 3 to 20 layers are more preferable.
- barrier layer examples include, from the substrate, organic layer and inorganic layer; inorganic layer, organic layer and inorganic layer; organic layer, inorganic layer and organic layer; organic layer, inorganic layer, organic layer and inorganic layer; A barrier layer having a structure including an inorganic layer, an organic layer, an inorganic layer, an organic layer, and an inorganic layer; or an organic layer, an inorganic layer, an organic layer, an inorganic layer, and an organic layer in this order may be mentioned.
- the layer closest to the substrate in the barrier layer is preferably formed directly on the substrate surface. If, for example, a pressure-sensitive adhesive layer is present between the barrier layer and the substrate, the pressure-sensitive adhesive layer absorbs moisture, so the durability decreases and the bending resistance also decreases due to the increase in the film thickness. For this reason, it is preferable not to provide an adhesive layer between the barrier layer and the substrate.
- the barrier layer may include other constituent layers other than the organic layer and the inorganic layer.
- the thickness of the barrier layer is preferably 0.5 ⁇ m to 15 ⁇ m, and more preferably 1 ⁇ m to 10 ⁇ m.
- the barrier layer may include a so-called graded material layer in which the composition of the barrier layer continuously changes in the organic region and the inorganic region in the thickness direction.
- a graded material layer may be included between the particular organic layer and the inorganic layer formed directly on the surface of this organic layer.
- the graded material layer an article by Kim et al., "Journal of Vacuum Science and Technology A Vol. 23 p971-977 (2005 American Vacuum Society)" Journal of Vacuum Science and Technology A, Vol. 23, pp. 971-97 (2005) Materials described in US Patent Application Publication No. 2004-46497, or a continuous layer in which the organic region and the inorganic region do not have an interface, and the like.
- the organic layer and the organic region are described as an “organic layer”
- the inorganic layer and the inorganic region are described as an “inorganic layer”.
- the inorganic layer contains a metal compound.
- the inorganic layer may be a layer mainly contributing to the barrier properties of the composite film.
- the amount of the metal compound in the inorganic layer may be 90% by mass or more, preferably 95% by mass or more, and more preferably 99% by mass or more, based on the total mass of the inorganic layer. It is further preferable that the content is at least% by mass.
- the inorganic layer may consist essentially of a metal compound.
- the metal compounds include metal oxides, metal nitrides, metal carbides, metal oxynitrides or metal oxide carbides.
- metal compounds oxides, nitrides, carbides, oxynitrides, oxide carbides, etc. containing one or more metals selected from Si, Al, In, Sn, Zn, Ti, Cu, Ce, and Ta Can be preferably used.
- oxides, nitrides or oxynitrides of metals selected from Si, Al, In, Sn, Zn, and Ti are preferable, and oxides, nitrides or oxynitrides of Si or Al are particularly preferable.
- the above-mentioned metal compounds may contain other elements as secondary components. For example, hydrogen may be contained. In addition, it may be a nitride having a hydroxyl group or the like.
- a layer containing Si is particularly preferable. It is because it has higher transparency and better barrier properties. Among them, a layer containing silicon nitride is particularly preferable.
- the barrier layer includes at least one layer containing silicon nitride as an inorganic layer. In the layer containing silicon nitride, the amount of silicon nitride is preferably 60% by mass or more, more preferably 70% by mass or more, and more preferably 80% by mass or more based on the total mass of the layer containing silicon nitride. It is more preferably present, and particularly preferably 90% by mass or more.
- the metal compounds constituting the plurality of inorganic layers may be the same or different, and are preferably the same. That is, when the barrier layer includes a plurality of inorganic layers, it is preferable that all of the plurality of inorganic layers be a layer containing silicon nitride.
- the inorganic layer may contain hydrogen, for example, based on the fact that metal oxides, nitrides or oxynitrides contain hydrogen, but the hydrogen concentration in forward Rutherford scattering is preferably 30% or less .
- the smoothness of the inorganic layer is preferably such that the average roughness (Ra value) in a 1 ⁇ m square is less than 3 nm, and more preferably 1 nm or less.
- the inorganic layer may be formed by any method as long as it can form a thin film.
- the formation method of the inorganic layer include physical vapor deposition (PVD) such as vapor deposition, sputtering, ion plating, etc., various chemical vapors such as thermal CVD, optical CVD, plasma CVD, etc.
- PVD physical vapor deposition
- a liquid phase growth method such as a phase growth method (CVD), a plating method, or a sol-gel method may, for example, be mentioned.
- the barrier layer includes a plurality of inorganic layers, the method of forming the plurality of inorganic layers may be the same or different, but is preferably the same.
- the inorganic layer is preferably formed directly on the surface of the substrate or the organic layer described later.
- the thickness of the inorganic layer is not particularly limited, and it is usually in the range of 5 to 500 nm, preferably 10 to 200 nm, and more preferably 15 to 50 nm per layer.
- the barrier layer comprises at least one organic layer.
- the organic layer is preferably in direct contact with at least one inorganic layer.
- the organic layer can be preferably formed by curing of a polymerizable composition containing a polymerizable compound.
- the above-mentioned polymerizable compound is preferably a compound having an ethylenically unsaturated bond at an end or a side chain, and / or a compound having an epoxy or an oxetane at an end or a side chain.
- compounds having an ethylenically unsaturated bond at the terminal or side chain are particularly preferable.
- compounds having an ethylenically unsaturated bond at the terminal or side chain include (meth) acrylate compounds, acrylamide compounds, styrenic compounds, maleic anhydride and the like, with (meth) acrylate compounds being preferred, In particular, acrylate compounds are preferable.
- (meth) acrylate compound As the (meth) acrylate compound, (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate and the like are preferable.
- styrene compound styrene, ⁇ -methylstyrene, 4-methylstyrene, divinylbenzene, 4-hydroxystyrene, 4-carboxystyrene and the like are preferable.
- the compounds described in paragraphs 0024 to 0036 of JP 2013-43382 A or paragraphs 0036 to 0048 of JP 2013-43384 A can be used as the (meth) acrylate compound.
- skeleton such as a compound of the formula represented by Formula (2) of WO2013 / 047524, can also be used.
- the polymerizable composition for organic layer formation may contain a polymerization initiator.
- a polymerization initiator When a polymerization initiator is used, its content is preferably 0.1 mol% or more of the total amount of compounds involved in polymerization, and more preferably 0.5 to 5 mol%. By setting it as such composition, the polymerization reaction via active ingredient production reaction can be controlled appropriately.
- Examples of the photopolymerization initiator are Irgacure series (for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 819, etc.) commercially available from BASF.
- Irgacure series for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 819, etc.
- Darocure for example, Darocure TPO, Darocure 1173, etc.
- Quantacure PDO for example, Ezacure series (for example, Ezacure TZM, Ezacure TZT, Ezacure KTO 46, etc
- the polymerizable composition for forming an organic layer may contain a silane coupling agent.
- a silane coupling agent an epoxy group, a vinyl group, an amino group, a halogen group, a mercapto group, a (meth) acryloyl group, and a hydrolyzable reactive group such as a methoxy group, an ethoxy group and an acetoxy group bonded to silicon. It is preferable to have a substituent having one or more reactive groups selected from as a substituent bonded to the same silicon. It is particularly preferable that the silane coupling agent has a (meth) acryloyl group.
- silane coupling agent examples include a silane coupling agent represented by the general formula (1) described in WO2013 / 146069, a silane coupling agent represented by the general formula (I) described in WO2013 / 027786, etc. Can be mentioned.
- the proportion of the silane coupling agent in the solid content of the polymerizable composition is preferably 0.1 to 30% by mass, and more preferably 1 to 20% by mass.
- the above-mentioned polymerizable composition is first made into a layer.
- the polymerizable composition may be coated on a support such as a substrate or an inorganic layer.
- the coating method may be dip coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating, slide coating, or the hopper described in US Pat. No. 2,681,294.
- the extrusion coating method (it is also called the die coating method) to be used is illustrated, Among these, the extrusion coating method can be employ
- the extrusion coating method When applying the polymerizable composition for forming an organic layer on the surface of the inorganic layer, it is preferable to use the extrusion coating method.
- the applied polymerizable composition may then be dried.
- the polymerizable composition may be cured using light (for example, ultraviolet light), an electron beam, or a heat ray, and is preferably photocured.
- light for example, ultraviolet light
- an electron beam or a heat ray
- a temperature of 25 ° C. or higher eg, 30 to 130 ° C.
- the light to be irradiated may be ultraviolet light based on a high pressure mercury lamp or a low pressure mercury lamp.
- the radiation energy is preferably 0.1 J / cm 2 or more, 0.5 J / cm 2 or more is more preferable.
- the polymerizable compound is subject to polymerization inhibition caused by oxygen in the air, it is preferable to lower the oxygen concentration or oxygen partial pressure at the time of polymerization.
- the oxygen concentration is preferably 2% or less and more preferably 0.5% or less.
- the total pressure is preferably 1000 Pa or less, more preferably 100 Pa or less. Further, it is particularly preferable to conduct ultraviolet polymerization by irradiating energy of 0.5 J / cm 2 or more under a reduced pressure condition of 100 Pa or less.
- the polymerization rate of the polymerizable compound in the polymerizable composition after curing is preferably 20% or more, more preferably 30% or more, and particularly preferably 50% or more.
- the term "polymerization ratio" as used herein means the ratio of reacted polymerizable groups among all the polymerizable groups (for example, acryloyl group and methacryloyl group) in the monomer mixture.
- the polymerization rate can be quantified using an infrared absorption method.
- the organic layer is preferably smooth and high in film hardness.
- the smoothness of the organic layer is preferably less than 3 nm, and more preferably less than 1 nm, in terms of the average roughness (Ra value) of 1 ⁇ m square.
- the surface of the organic layer is required to be free of foreign matter such as particles and projections. Therefore, the film formation of the organic layer is preferably performed in a clean room.
- the degree of cleanness is preferably a class 10000 or less, more preferably a class 1000 or less, defined by the U.S. Federal Standard Fed. Std. 209D.
- the hardness of the organic layer is preferably high. It is known that when the hardness of the organic layer is high, the inorganic layer is formed smoothly, and as a result, the barrier property is improved.
- the hardness of the organic layer can be expressed as microhardness based on the nanoindentation method.
- the microhardness of the organic layer is preferably 100 N / mm or more, more preferably 150 N / mm or more.
- the thickness of the organic layer is not particularly limited, and is preferably 50 nm to 5000 nm, more preferably 100 nm to 3500 nm, from the viewpoint of brittleness and light transmittance.
- the lamination of the organic layer and the inorganic layer can be performed by sequentially and repeatedly forming the organic layer and the inorganic layer depending on the layer configuration.
- the barrier layer is provided on the surface on the cover layer side of the substrate, the arrival of moisture to the display portion can be suppressed. Therefore, it is preferable to provide the barrier layer on the surface on the cover layer side of the substrate.
- the barrier layer may be provided on both the front surface and the back surface of the substrate.
- the barrier layer may be provided on the first detection electrode or the second detection electrode so as to cover the conductive wire, as well as on the substrate. Accordingly, the arrival of water to the display portion can be suppressed, the arrival of water to the conductive line can be suppressed, and the corrosion of the conductive line can be prevented. Also in the case of providing the barrier layer on the detection electrode, the barrier layer may be provided on the detection electrode disposed on the cover layer side of the substrate.
- the barrier layer When the barrier layer is provided on the detection electrode, it is preferable to separately provide a protective film for protecting the surface of the barrier layer, since the barrier layer may be scratched and damaged during the manufacturing process of the touch sensor unit.
- the protective film acrylic resin, urethane resin, polycarbonate or the like is used. Among them, polycarbonate is preferable as the protective film.
- a barrier layer is provided after the Specifically, it is preferable to perform a dehydration step on the substrate on which the first detection electrode and the second detection electrode are formed before providing the barrier layer.
- a substrate which hardly absorbs moisture is preferable, and, for example, COP and COC are preferable.
- the present invention is basically configured as described above. As mentioned above, although the composite member and device of the present invention were explained in detail, the present invention is not limited to the above-mentioned embodiment, and various improvement or change may be made in the range which does not deviate from the main point of the present invention.
- the resistance of each conductive layer formed on both sides of the obtained composite member was measured before and after bending, and the increase in resistance of the conductive layer before and after bending was examined.
- the inward folding side is the upper side of the columns of Tables 1 and 2 below, and indicates the conductive layer closer to the cover layer.
- the outer folding side refers to the conductive layer on the opposite side, which is the lower side of the columns of Tables 1 and 2 below. Resistance measured the resistance value between wiring using the digital multimeter.
- the obtained composite member was treated by an autoclave under the conditions of a temperature of 40 ° C. and a pressure of 0.5 MPa for 20 minutes.
- the bending radius of the composite member after processing is set to 2 mm and the bending is 100,000 It was carried out.
- the bending direction M was set so that the surface of the cover layer was inward when the composite member was bent.
- the resistance of the composite member after 100,000 bending tests was measured to determine the increase in resistance.
- the amount of increase in resistance is referred to as "delta (delta)".
- the rise in resistance was evaluated according to the following evaluation criteria. The evaluation results are shown in Tables 1 and 2.
- ⁇ Production method of transparent conductive film> (Preparation of silver halide emulsion) An amount corresponding to 90% each of the following solutions 2 and 3 is added simultaneously to the following solution 1 kept at a temperature of 38 ° C. and pH (potential of hydrogen) 4.5 for 20 minutes while stirring: 0.16 ⁇ m A core particle was formed. Subsequently, the following solutions 4 and 5 were added over 8 minutes, and the remaining 10% of the solutions 2 and 3 below were further added over 2 minutes to grow to 0.21 ⁇ m. Further, 0.15 g of potassium iodide was added and aged for 5 minutes to complete particle formation.
- the emulsion after washing with water and desalting is adjusted to pH 6.4 and pAg 7.5, and 3.9 g of gelatin, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate and 10 mg of chloroauric acid are added.
- Chemical sensitization is performed at 55 ° C. to obtain optimum sensitivity, and 100 mg of 1,3,3a, 7-tetraazaindene as a stabilizer and 100 mg of Proxel (trade name, manufactured by ICI Co., Ltd.) as an antiseptic. added.
- the emulsion finally obtained contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide, and the average particle diameter is 0.22 ⁇ m, fluctuation
- the silver iodochlorobromide cubic grain emulsion had a coefficient of 9%.
- composition for photosensitive layer formation 1,3,3a, 7-tetraazaindene 1.2 ⁇ 10 -4 mol / mol Ag, hydroquinone 1.2 ⁇ 10 -2 mol / mol Ag, citric acid 3.0 ⁇ 10 -4 mol / Mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g / mol Ag, adding a slight amount of a hardener, and using citric acid to adjust the pH of the coating solution 5. Adjusted to 6.
- EPOXY RESIN DY 022 (trade name: Nagase ChemteX Co., Ltd.) was added as a crosslinking agent.
- the addition amount of the crosslinking agent was adjusted so that the amount of the crosslinking agent in the photosensitive layer described later was 0.09 g / m 2 .
- the composition for photosensitive layer formation was prepared as mentioned above.
- the polymer represented by (P-1) described above was synthesized with reference to Patents 3305459 and 3754745.
- a PET (polyethylene terephthalate) film having a thickness of 40 ⁇ m was prepared as a substrate.
- the above-mentioned polymer latex was applied to provide a primer layer having a thickness of 0.05 ⁇ m.
- an antihalation layer comprising a mixture of the above-mentioned polymer latex and gelatin, and a dye which has an optical density of about 1.0 and is decolorized by alkali of the developer is provided.
- the mixing mass ratio of polymer to gelatin was 2/1, and the content of polymer was 0.65 g / m 2 .
- the above-mentioned composition for forming a photosensitive layer is applied on the above-mentioned antihalation layer, and further, the above-mentioned polymer latex, gelatin and EPOCROS K-2020E (trade name: manufactured by Nippon Shokubai Co., Ltd., oxazoline based crosslinking reactive polymer) Solid content mass ratio (polymer / gelatin / Epocross K-2020 E / Snowtex C) with latex (crosslinkable group: oxazoline group), Snowtex C (registered trademark, trade name: Nissan Chemical Industries, Ltd., colloidal silica)
- the composition mixed according to (registered trademark) 1/1 / 0.3 / 2 was applied so that the amount of gelatin would be 0.08 g / m 2 , to obtain a supporting substrate on which photosensitive layers were formed on both sides. .
- a support base on which photosensitive layers are formed on both sides is referred to as film A.
- the photosensitive layer formed had a silver
- Exposure and development process As exposure masks for forming the conductive lines 50, exposure masks each having a mesh pattern as shown in FIG. 10 described above were prepared. Exposure masks of mesh pattern were disposed on both sides of the film A described above, and exposure was repeated at predetermined pattern intervals using parallel light with a high pressure mercury lamp as a light source. As the mesh pattern, one having a side length of 150 ⁇ m and a line width of 4 ⁇ m was used. After exposure, development was carried out using the following developer, and development was carried out using a fixing solution (trade name: N3X-R for CN16X, manufactured by Fuji Film Co., Ltd.). Further, the substrate was rinsed with pure water and dried to obtain a support base on which pattern portions made of silver fine wires and a gelatin layer were formed on both sides. The gelatin layer was formed between silver fine wires. The obtained film is referred to as film B.
- composition of developer The following compounds are contained in 1 liter (L) of the developer. Hydroquinone: 0.037 mol / L N-methylaminophenol: 0.016 mol / L Sodium metaborate: 0.140 mol / L Sodium hydroxide: 0.360 mol / L Sodium bromide: 0.031 mol / L Potassium metabisulfite: 0.187 mol / L
- Film B was immersed for 120 seconds in an aqueous solution (concentration of proteolytic enzyme: 0.5% by mass, solution temperature: 40 ° C.) of a proteolytic enzyme (Nagase ChemteX Co., Ltd. Bioplase AL-15FG) .
- the film B was taken out of the aqueous solution, immersed in warm water (liquid temperature: 50 ° C.) for 120 seconds, and washed.
- the film after gelatin decomposition treatment is referred to as film C.
- Example 1 In Example 1, a cover layer (PET (polyethylene terephthalate) film having a thickness of 40 ⁇ m), an adhesive layer (MO-3015G (product name) manufactured by Lintec Corporation), a ⁇ / 4 layer, a polarizer layer, and an adhesive layer (MO-3015C (product name) manufactured by Lintec Co., Ltd.) and the transparent conductive film constituting the touch sensor unit were laminated and laminated. Below the touch sensor portion, a PET (polyethylene terephthalate) film having a thickness of 10 ⁇ m was provided via an adhesive layer having a thickness of 1 ⁇ m.
- PET polyethylene terephthalate
- an adhesive layer (MO-3015C (product name) made by Lintec Corporation), a polyimide film (film thickness 30 ⁇ m), and an adhesive layer (MO-3015C (product made by Lintec Corporation) ) And a polyimide film (film thickness 125 ⁇ m) in this order and laminated to form a composite member.
- the thickness of the above-mentioned adhesive layer was 25 ⁇ m in all cases.
- the above-mentioned adhesive layer having a thickness of 1 ⁇ m is formed using an acrylic adhesive.
- the above-mentioned adhesive layer with a thickness of 1 ⁇ m corresponds to a member having a higher elastic modulus than the adhesive layer.
- Example 2 shows a polyethylene-terephthalate film
- PI shows a polyimide film.
- Example 2 The second embodiment is different from the first embodiment in that an adhesive layer having a thickness of 1 ⁇ m and a PET film having a thickness of 10 ⁇ m are provided, and a protective layer having a thickness of 0.8 ⁇ m is provided.
- the configuration is the same as that of the first embodiment.
- the above-mentioned protective layer having a thickness of 0.8 ⁇ m is produced by coating XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, exposing it to UV (Ultra Violet) and curing it.
- the protective layer corresponds to a member having a higher elastic modulus than the adhesive layer.
- Example 3 is different from Example 1 in that the adhesive layer with a thickness of 1 ⁇ m and the PET film with a thickness of 10 ⁇ m are replaced by a protective layer with a thickness of 5 ⁇ m. The same configuration as 1 was used.
- the above-mentioned protective layer having a thickness of 5 ⁇ m is produced by applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, exposing it to UV and curing it.
- Example 4 embodiment is different from the first embodiment in that an adhesive layer having a thickness of 1 ⁇ m and a PET film having a thickness of 10 ⁇ m are replaced by a protective layer having a thickness of 15 ⁇ m. The same configuration as 1 was used.
- the above-mentioned protective layer having a thickness of 15 ⁇ m is produced by applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, exposing it to UV and curing it.
- Example 5 Example 5 was replaced with an adhesive layer having a thickness of 1 ⁇ m and a PET film having a thickness of 10 ⁇ m as compared with Example 1, and a protective layer having a thickness of 15 ⁇ m was provided, and an adhesive layer (manufactured by Lintec Corporation The structure was the same as that of Example 1 except that a protective layer having a thickness of 15 ⁇ m was provided between MO-3015C (product name) and the transparent conductive film.
- the two protective layers each having a thickness of 15 ⁇ m are formed by screen printing XSR-5N manufactured by Arakawa Chemical Industries, Ltd., UV exposure and curing.
- the protective layer on the outer fold side corresponds to a member having a higher elastic modulus than the adhesive layer.
- Example 6 differs from Example 1 in that the adhesive layer of 1 ⁇ m in thickness and the PET film of 10 ⁇ m in thickness are replaced with a protective layer of 40 ⁇ m in thickness, and the other example is different. The same configuration as 1 was used.
- the above-mentioned protective layer having a thickness of 40 ⁇ m is produced by repeating the process of applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, UV exposure and curing three times.
- Example 7 is different from Example 1 in that the adhesive layer with a thickness of 1 ⁇ m and the PET film with a thickness of 10 ⁇ m are replaced with a protective layer with a thickness of 100 ⁇ m. The same configuration as 1 was used.
- the above-mentioned protective layer having a thickness of 100 ⁇ m is prepared by applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, repeating the steps of UV exposure and curing six times.
- Example 8 The eighth embodiment differs from the fourth embodiment in the configuration of the touch sensor unit, and the other configuration is the same as the fourth embodiment.
- the barrier layer was provided on the surface on the cover layer side of the substrate of the touch sensor unit.
- the barrier layer was produced as follows.
- a composition was prepared by mixing in a mass ratio of 14.1: 3.5: 1.
- a composition for forming an organic layer was prepared by mixing 18.6 g of this composition, 1.4 g of an ultraviolet polymerization initiator (ESACURE KTO 46, manufactured by Lambertity Co., Ltd.), and 180 g of 2-butanone.
- the composition for organic layer formation was apply
- the application of the composition for forming an organic layer was performed using a wire bar so that the thickness of the coating film was 20 ⁇ m.
- the composition for forming an organic layer was applied, it was dried by standing at room temperature.
- the composition for forming an organic layer is cured by irradiating ultraviolet rays of a high pressure mercury lamp in a chamber with an oxygen concentration of 0.1% using a nitrogen substitution method (total irradiation amount: approximately 1 J / cm 2 ). Then, an organic layer with a thickness of 4000 nm ⁇ 50 nm was formed on the surface of the substrate.
- a silicon nitride film with a thickness of 30 nm was formed as an inorganic layer.
- the formation of the inorganic layer was performed using a general CCP (capacitively coupled plasma method) -CVD (Chemical Vapor Deposition) apparatus.
- source gas silane gas (standard cubic centimeter per minute) flow, ammonia gas (flow rate 370 sccm), hydrogen gas (flow rate 590 sccm) and nitrogen gas (flow rate 240 sccm) were used. Used a high frequency power supply with a frequency of 13.56 MHz, and the plasma excitation power was 2.5 kW.
- Example 9 The ninth embodiment differs from the eighth embodiment in the configuration of the touch sensor unit, and the other configuration is the same as the eighth embodiment.
- barrier layers were provided on both sides of the substrate of the touch sensor unit.
- the barrier layer of Example 9 has the same configuration as the barrier layer of Example 8 described above, and is manufactured by the same manufacturing method as the barrier layer of Example 8 except that barrier layers are provided on both sides of the substrate.
- Example 10 The tenth embodiment is different from the eighth embodiment in the configuration of the touch sensor unit, and the other configuration is the same as the eighth embodiment.
- the barrier layer was provided on the conductive line of each surface of both surfaces of the touch sensor unit.
- the barrier layer of Example 10 has the same configuration as the barrier layer of Example 8 described above, and is manufactured by the same manufacturing method as the barrier layer of Example 8 except that the barrier layer is provided on the conductive line of each surface of both surfaces. did.
- Example 11 The eleventh embodiment is different from the eighth embodiment in the configuration of the touch sensor unit, and the other configuration is the same as the eighth embodiment. In Example 11, only a silicon nitride film with a thickness of 30 nm was provided as a barrier layer on the conductive line on each surface of both surfaces of the touch sensor portion. The silicon nitride film of Example 11 was produced by the same method as in Example 8 described above.
- Example 12 The twelfth embodiment is different from the eighth embodiment in the configuration of the touch sensor unit, and the other configuration is the same as the eighth embodiment.
- the barrier layer was provided on the conductive line of the surface on the cover layer side of the substrate of the touch sensor unit.
- the barrier layer of Example 12 has the same configuration as the barrier layer of Example 8 described above, and the barrier layer is provided on the conductive line on the surface on the cover layer side in the same manner as the barrier layer of Example 8. Made.
- Comparative example 1 In Comparative Example 1, an adhesive layer having a thickness of 1 ⁇ m and a PET film having a thickness of 10 ⁇ m are not provided as compared with Example 1, that is, a member having a higher elastic modulus than the adhesive layer is not provided. The configuration is the same as that of the first embodiment except for the difference.
- Comparative example 2 Comparative Example 2 is different from Example 1 in that an adhesive layer having a thickness of 1 ⁇ m and a PET film having a thickness of 10 ⁇ m are not provided, and a substrate of the touch sensor portion is a gas barrier film. The configuration is the same as that of the first embodiment except for the above. Similar to Comparative Example 1, Comparative Example 2 is not provided with a member having a higher elastic modulus than the adhesive layer.
- the second embodiment will be described below.
- resistance increase and peeling of the conductive layer were evaluated for the following Examples 20 to 31 and Comparative Example 10.
- the increase in resistance and peeling will be described. Since the increase in resistance of the conductive layer is the same as the increase in resistance of the first embodiment described above including the evaluation, the detailed description thereof is omitted.
- the rise in resistance was evaluated only on the outer folding side.
- Example 20 In Example 20, a cover layer (PET (polyethylene terephthalate) film having a thickness of 40 ⁇ m), an adhesive layer (MO-3015G (product name) manufactured by Lintec Corporation), a ⁇ / 4 layer, a polarizer layer, and an adhesive layer (MO-3015C (product name) manufactured by Lintec Co., Ltd.) and the touch sensor unit were laminated and laminated. Below the touch sensor portion, a PET (polyethylene terephthalate) film having a thickness of 10 ⁇ m was provided via an adhesive layer having a thickness of 1 ⁇ m.
- PET polyethylene terephthalate
- PET polyethylene terephthalate
- an adhesive layer MO-3015C (product name) made by Lintec Corporation
- a polyimide film film thickness 30 ⁇ m
- an adhesive layer MO-3015C (product made by Lintec Corporation)
- a polyimide film film thickness 125 ⁇ m
- the thickness of the above-mentioned adhesive layer was 25 ⁇ m in all cases.
- the above-mentioned adhesive layer having a thickness of 1 ⁇ m is formed using an acrylic adhesive.
- the above-mentioned adhesive layer with a thickness of 1 ⁇ m corresponds to a member having a higher elastic modulus than the adhesive layer.
- Tables 3 and 4 numerical values in parentheses indicate film thicknesses.
- "PET” shows a polyethylene-terephthalate film
- PI shows a polyimide film.
- the touch sensor unit has a single-sided two-layer electrode configuration. Both of the two conductive layers are arranged on the outer fold side.
- the touch sensor unit having the single-sided two-layer conductive layer was manufactured as follows.
- the touch sensor unit first applies XSR-5N manufactured by Arakawa Chemical Industry Co., Ltd. to a thickness of 2 ⁇ m on a 40 ⁇ m thick COP (cycloolefin polymer) substrate, and cures it by UV (Ultra Violet) exposure, A first coated film was formed.
- the first stacked film was patterned into a pattern of a conductive layer by photolithography to form a first conductive layer. Furthermore, the first conductive layer was covered, XSR-5N manufactured by Arakawa Chemical Industries, Ltd. was applied to a thickness of 3 ⁇ m, and cured by UV exposure to form a second coated film. A second stacked film in which a 0.05 ⁇ m thick Mo film, a 0.3 ⁇ m thick Al film, and a 0.05 ⁇ m thick Mo film are sequentially stacked on the second coated film using a sputtering method It formed. The second stacked film was patterned into a pattern of a conductive layer by photolithography to form a second conductive layer.
- An opening was formed in the first coating film by using a photolithography method as a portion for electrically connecting the first conductive layer and the external wiring.
- a photolithography method as a portion for electrically connecting the first conductive layer and the external wiring.
- two conductive layers arranged on the outer fold side are referred to as “one-sided two-layer electrode (out-fold side electrode)", and two conductive layers are provided.
- a layer was described as “one-sided two-layer electrode (inner-folding-side electrode)" in which all were disposed on the inner-folding side.
- Example 21 is different from Example 20 in that the adhesive layer with a thickness of 1 ⁇ m and the PET film with a thickness of 10 ⁇ m are replaced by a protective layer with a thickness of 2 ⁇ m. It has the same configuration as 20.
- the above-mentioned protective layer having a thickness of 2 ⁇ m is produced by applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, exposing it to UV (Ultra Violet) and curing it.
- the protective layer corresponds to a member having a higher elastic modulus than the adhesive layer.
- Example 22 is different from Example 20 in that the adhesive layer with a thickness of 1 ⁇ m and the PET film with a thickness of 10 ⁇ m are replaced by a protective layer with a thickness of 15 ⁇ m. It has the same configuration as 20.
- the above-mentioned protective layer having a thickness of 15 ⁇ m is produced by applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, exposing it to UV (Ultra Violet) and curing it.
- Example 23 differs from Example 20 in that the adhesive layer of 1 ⁇ m in thickness and the PET film of 10 ⁇ m in thickness are replaced with a protective layer of 25 ⁇ m in thickness, and the other example is different. It has the same configuration as 20.
- the above-mentioned protective layer having a thickness of 25 ⁇ m is produced by applying XSR-5N manufactured by Arakawa Chemical Industries, Ltd. by screen printing, exposing it to UV (Ultra Violet) and curing it.
- Example 24 differs from Example 20 in that the adhesive layer with a thickness of 1 ⁇ m and the PET film with a thickness of 10 ⁇ m are not provided, and both of the two conductive layers of the touch sensor portion are folded inward.
- Example 24 corresponds to a member in which the COP base material of the touch sensor portion has a higher elastic modulus than the adhesive layer.
- Example 25 The twenty-fifth embodiment has an adhesive layer with a thickness of 1 ⁇ m and a PET film with a thickness of 10 ⁇ m, which are not provided with a thickness of 10 ⁇ m, and two conductive layers of the touch sensor portion on the inner folding side.
- the configuration is the same as that of the embodiment 20 except that the configuration is the same as that of the embodiment 20, and that a protective layer with a thickness of 15 ⁇ m is provided on the inward folding side of the touch sensor portion.
- Example 25 corresponds to a member in which the COP base material of the touch sensor portion has a higher elastic modulus than the adhesive layer.
- Example 26 differs from Example 22 in that a barrier layer is provided on the surface of the touch sensor portion on the cover layer side of the COP base material, and the other structure is the same as Example 22.
- the barrier layer had the same structure as the barrier layer of Example 8 of the first embodiment described above, and was manufactured by the same manufacturing method as the barrier layer of Example 8.
- Example 27 The twenty-seventh embodiment differs from the twenty-second embodiment in that a barrier layer is provided on the conductive layer on the protective layer side of the touch sensor unit, and the other configuration is the same as the twenty-second embodiment.
- the barrier layer had the same structure as the barrier layer of Example 8 of the first embodiment described above, and was manufactured by the same manufacturing method as the barrier layer of Example 8.
- Example 28 differs from Example 22 in that a barrier layer is provided on the surface on the cover layer side of the COP base material of the touch sensor portion and on the conductive layer on the protective layer side, and the other points are the same.
- the configuration is the same as in Example 22.
- the barrier layer had the same structure as the barrier layer of Example 8 of the first embodiment described above, and was manufactured by the same manufacturing method as the barrier layer of Example 8.
- Example 29 is different from Example 24 in that a barrier layer is provided on the surface of the touch sensor portion on the protective layer side of the COP base material, and the other configuration is the same as Example 24.
- the barrier layer had the same structure as the barrier layer of Example 8 of the first embodiment described above, and was manufactured by the same manufacturing method as the barrier layer of Example 8.
- Example 30 differs from Example 24 in that a barrier layer is provided on the conductive layer on the cover layer side of the touch sensor unit, and the other configuration is the same as Example 24.
- the barrier layer had the same structure as the barrier layer of Example 8 of the first embodiment described above, and was manufactured by the same manufacturing method as the barrier layer of Example 8.
- Example 31 differs from Example 24 in that a barrier layer is provided on the surface on the protective layer side of the COP base material of the touch sensor portion and on the conductive layer on the cover side, except for the points other than that. It has the same configuration as 24.
- the barrier layer had the same structure as the barrier layer of Example 8 of the first embodiment described above, and was manufactured by the same manufacturing method as the barrier layer of Example 8.
- Comparative example 10 In Comparative Example 10, an adhesive layer having a thickness of 1 ⁇ m and a PET film having a thickness of 10 ⁇ m are not provided as compared with Example 20, that is, a member having a higher elastic modulus than the adhesive layer is not provided.
- the configuration is the same as that of Example 20 except the points that are different.
- the degree of increase in resistance on the outer folding side was smaller than that in Comparative Example 10. Further, in the configuration with the protective layer of Examples 21 to 23, the thinner the protective layer, the smaller the degree of the increase in resistance, and the favorable result was also obtained for the peeling. As described above, in the composite member of the present invention, the stress acting on the conductive layer is controlled to reduce the tensile stress, thereby suppressing the increase in the resistance of the conductive layer on the outer fold side.
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Abstract
Description
上述の用途以外に、上述のシートはタッチパネルに用いられる。タブレット型コンピュータおよびスマートフォン等の携帯情報機器を始めとした各種の電子機器において、液晶表示装置等の表示装置と組み合わせて用いられ、画面に接触することにより電子機器への入力操作を行うタッチパネルの普及が進んでいる。
更には、タッチパネルを折り曲げる形態、または丸める形態のデバイス開発が進んでいる。これにより、電子機器のコンパクト化を実現でき、かつスタイリッシュなデザインが可能になり、これらを訴求点とすることができる。
また、特許文献2には、表示素子または薄膜封止層上に中立面を有するディスプレイが示されている。
特許文献3のフレキシブル表示装置は、フレキシブルディスプレイパネル上に配置されたフレキシブルな外側部材と、フレキシブルディスプレイパネルとフレキシブルな外側部材との間に配置された接着部材とを有する。フレキシブルディスプレイパネルとフレキシブルな外側部材のそれぞれに中立面が形成されるように接着部材の弾性率が設定されている。接着部材の弾性率は、フレキシブルディスプレイパネルとフレキシブルな外側部材との弾性率の1/10000~1/1000である。
絶縁層は、可撓性を有することが好ましい。また、絶縁層は、弾性率が10-1~30GPaであることが好ましい。
弾性率が高い部材は、シート体で構成されており、かつ第1導電層の絶縁層とは逆側に配置されることが好ましい。
第1保護層は、第1導電層側に設けられた第1粘着層と接していることが好ましい。
第1保護層と第1導電層との界面から、導電層体を曲げ方向に曲げた場合に絶縁層の曲率半径が小さい側に初めて配置される粘着層の界面までの厚みをtdとし、第1保護層の厚みをtsとするとき、ts≦tdであることが好ましい。
導電層体を曲げ方向に曲げた場合に基板の曲率半径が小さい側に設けられた第2粘着層と、導電層体を曲げ方向に曲げた場合に絶縁層の曲率半径が小さい側に設けられた第2導電層とが接していることが好ましい。
導電層体は、絶縁層と、絶縁層の両面の各面に設けられた導電層とを有することが好ましい。この場合、絶縁層は、絶縁基板で構成されていることが好ましい。
また、導電層は、金属で構成されていることが好ましい。
絶縁層と導電層の間、または導電層上に、バリア層を有し、バリア層は、少なくとも窒化ケイ素を含む無機層を有する構成でもよい。バリア層は、無機層と有機層との積層構造であることが好ましい。
本発明は、上述の複合部材を有することを特徴とするデバイスを提供するものである。
なお、以下に説明する図は、本発明を説明するための例示的なものであり、以下に示す図に本発明が限定されない。
なお、以下において数値範囲を示す「~」とは両側に記載された数値を含む。例えば、εが数値α1~数値β1とは、εの範囲は数値α1と数値β1を含む範囲であり、数学記号で示せばα1≦ε≦β1である。
「具体的な数値で表された角度」、「平行」、および「直交」等の角度は、特に記載がなければ、該当する技術分野で一般的に許容される誤差範囲を含む。
「透明」とは、光透過率が、波長400~800nmの可視光波長域において、少なくとも60%以上のことであり、好ましくは75%以上であり、より好ましくは80%以上であり、更により好ましくは85%以上のことである。光透過率は、JIS(日本工業規格) K 7375:2008に規定される「プラスチック--全光線透過率および全光線反射率の求め方」を用いて測定される。
また、本発明において可撓性を有するとは、折り曲げることができることを意味し、具体的には、曲率半径1mmで折り曲げても割れを生じないことを指す。
なお、図3および図5において図1と同じ構成物には同じ符号を付し、その詳細な説明を省略する。また、図4および図6において図2と同じ構成物には同じ符号を付し、その詳細な説明を省略する。図3は部材10と部材11とを交互に合計4層積層したものであり、図5は部材10と部材11とを交互に合計8層積層したものである。
以下、複合部材を有するデバイスとして、表示装置を例にして説明する。
図7は本発明の実施形態の複合部材を有する表示装置を示す模式図である。
更に、表示部22と第1粘着層27との間に設けられたプラスチックフィルム24と透明層25とプラスチックフィルム26とを有する。表示部22側からプラスチックフィルム24と透明層25とプラスチックフィルム26との順で設けられている。また、プラスチックフィルム24と表示部22との間に透明層23が設けられ、反射防止層33とカバー層36との間に透明層34が設けられている。
図7に示す表示装置20から、表示部22と透明層23を除いたものが複合部材21である。
コントローラ37は、タッチセンサー部30に応じたものが適宜用いられる。タッチセンサー部30が静電容量式であれば、静電容量が変化した位置がコントローラ37で検出される。タッチセンサー部30が抵抗膜式であれば、抵抗が変化した位置がコントローラ37で検出される。
タッチセンサー部30は、図8に示されるように、絶縁基板40と、1つの絶縁基板40の両面の各面にそれぞれ形成される検出電極と、検出電極の周辺に形成され、検出電極と電気的に接続された周辺配線とを有する。検出電極が導電層に相当する。
絶縁基板40の表面40a(図9参照)上にそれぞれ第1の方向Yに沿って延び、かつ第1の方向Yに直交する第2の方向Xに並列配置された複数の第1の検出電極42が形成され、複数の第1の検出電極42に電気的に接続された複数の第1の周辺配線43が互いに近接して配列されている。同様に、絶縁基板40の裏面40b(図9参照)上には、それぞれ第2の方向Xに沿って延び、かつ第1の方向Yに並列配置された複数の第2の検出電極44が形成され、複数の第2の検出電極44に電気的に接続された複数の第2の周辺配線45が互いに近接して配列されている。複数の第1の検出電極42と複数の第2の検出電極44とが検出電極である。複数の第1の検出電極42と複数の第2の検出電極44とは、絶縁基板40により電気的に絶縁され、かつ離間して、一部を重ねて配置されている。絶縁基板40は、少なくとも2つの導電層を電気的に絶縁する絶縁層として機能するものであり、絶縁層の一形態である。
タッチセンサー部30では、絶縁基板40において、複数の第1の検出電極42と複数の第2の検出電極44とが平面視で重なって配置される領域が検知領域47である。検知領域47は指等の接触の検出が可能な領域である。
絶縁基板40の表面40aに第1の検出電極42を構成する導電線50が形成され、裏面40bに第2の検出電極44を構成する導電線50が形成された状態のものが導電層体41である。導電層体41は、絶縁基板40と、第1の検出電極42を構成する導電線50と、第2の検出電極44を構成する導電線50とからなり、粘着層が構成に含まれないことが好ましい。絶縁基板40は粘着層よりも弾性率が高い。また、導電層体41は曲げられるため、絶縁基板40は可撓性を有することが好ましい。なお、第1の検出電極42が第2導電層に相当し、第2の検出電極44が第1導電層に相当する。
第1粘着層27は絶縁基板40の裏面40b側に配置され、第2粘着層32は絶縁基板40の表面40a側に配置されている。
タッチセンサー部30は静電容量式のタッチセンサーに限定されず、抵抗膜式タッチセンサーでもよい。タッチセンサー部30の各構成部材については、後に説明する。
反射防止層33の厚みは、特に限定されず、1~100μmが好ましく、1~50μmがより好ましい。
吸収型偏光子としては、ヨウ素系偏光子、二色性染料を利用した染料系偏光子、およびポリエン系偏光子等が用いられる。ヨウ素系偏光子および染料系偏光子には、塗布型偏光子と延伸型偏光子があり、いずれも適用できるが、ポリビニルアルコールにヨウ素または二色性染料を吸着させ、延伸して作製される偏光子が好ましい。
また、基材上にポリビニルアルコール層を形成した積層フィルムの状態で延伸および染色を施すことで偏光子を得る方法として、特許第5048120号公報、特許第5143918号公報、特許第5048120号公報、特許第4691205号公報、特許第4751481号公報、および特許第4751486号公報を挙げることができ、これらの偏光子に関する公知の技術も好ましく利用することができる。
λ/4板の波長550nmでの面内レタデーション値(Re(550))は、理想値(137.5nm)を中心として、25nm程度の誤差があってもよく、例えば、110~160nmであることが好ましく、120~150nmであることがより好ましく、130~145nmであることが更に好ましい。
なお、上述の角度とは、偏光子の表面の法線方向から視認した際の、偏光子の吸収軸とλ/4板の面内遅相軸とのなす角度を意図する。
λ/4板として上述した広帯域λ/4板を用いた場合には、λ/4板の面内遅相軸とλ/2板の面内遅相軸とのなす角が60°となるように貼り合わせ、λ/2板側を直線偏光の入射側に配置して、且つλ/2板の面内遅相軸を入射直線偏光の偏光面に対して15°または75°に交差して使用することが好ましい。
なお、上述の角度とは、偏光子の表面の法線方向から視認した際の、偏光子の吸収軸とλ/4板の面内遅相軸、偏光子の吸収軸とλ/2板の面内遅相軸とのなす角度をそれぞれ意図する。
上述のプラスチックフィルムおよびプラスチック板の原料としては、例えば、ポリエチレンテレフタレート(PET)、およびポリエチレンナフタレート(PEN)等のポリエステル類;ポリエチレン(PE)、ポリプロピレン(PP)、ポリスチレン、およびEVA(酢酸ビニル共重合ポリエチレン)等のポリオレフィン類;ビニル系樹脂;その他、ポリカーボネート(PC)、ポリアミド、ポリイミド、(メタ)アクリル樹脂、トリアセチルセルロース(TAC)、およびシクロオレフィン系樹脂(COP)等が挙げられる。
プラスチックフィルム24およびプラスチックフィルム26は、例えば、ポリイミド(PI)、ポリアミド(PA)、ポリエチレンテレフタレート(PET)、トリアセチルセルロース(TAC)、およびシクロオレフィンコポリマー(COC)のうち、少なくとも1つで構成されることが好ましい。また、プラスチックフィルム24およびプラスチックフィルム26は、弾性率が10-1~30GPaであることが好ましい。弾性率とは、引張弾性率のことである。
弾性率は、動的弾性率測定装置または微小硬度試験機(ピコデンター)により測定することができる。
透明層または粘着層と接する各部材との界面の密着力は、剥離を抑制する観点から高い方が好ましい。粘着層と接する各部材との界面の密着力は0.1N/mm以上であることが好ましく、更に好ましくは0.4N/mm以上、最も好ましくは0.7N/mm以上である。
第1粘着層27は、プラスチックフィルム26と第1保護層28とを接着するものであり、かつ応力緩和層として機能するものである。また、第1粘着層27は、導電層体41を曲げ方向Mに曲げた場合に絶縁基板40の曲率半径が大きい側、すなわち、外折り側に配置されるものである。
第2粘着層32は、タッチセンサー部30と反射防止層33とを接着するものであり、かつ応力緩和層として機能するものである。また、第2粘着層32は、導電層体41を曲げ方向Mに曲げた場合に絶縁基板40の曲率半径が小さい側、すなわち、内折り側に配置されるものであり、第1の検出電極42の導電線50と接している(図9参照)。
上述のことから、少なくとも1つの粘着層は、絶縁基板40と、第1の検出電極42との間に形成されない。すなわち、絶縁基板40の表面40aと、第1の検出電極42の導電線50との間に粘着層は形成されない。さらには、絶縁基板40と、第2粘着層32との間にも粘着層は形成されない。
第1保護層28は、上述の第1粘着層27および第2粘着層32より弾性率が高い部材であり、例えば、弾性率は10-1~30GPaである。弾性率とは、引張弾性率のことである。この場合も、弾性率は、上述のように動的弾性率測定装置または微小硬度試験機(ピコデンター)により測定することができる。
ここで、第1保護層28と第1導電層との界面、すなわち、第1保護層28と、第2の検出電極44の導電線50との界面28a(図9参照)から、導電層体41を曲げ方向M(図9参照)に曲げた場合に絶縁基板40の曲率半径が小さい側に初めて配置される粘着層の界面まで、すなわち、第2粘着層32と反射防止層33との界面32a(図9参照)までの厚みをtd(図9参照)とする。また、第1保護層28の厚みをts(図9参照)とする。
第1保護層28の厚みts(図9参照)は、上述の厚みtdの1/20以上であることが好ましく、より好ましくは1/10以上である。
特に、第1保護層28が第1粘着層27と接している構成の場合、第1保護層28が、外折り側の導電層から内折り側の粘着層間の厚みと同じ程度であれば、すなわち、上述の厚みtdと同程度であれば、第2の検出電極44にかかる引張力等の力を十分小さくすることができる。このことから、第1保護層28の厚みts(図9参照)は、ts≦tdであることが好ましい。
なお、第1保護層28に代えて、10-1~30GPaの弾性率を有する基材または接着材等を配置してもよい。弾性率とは、引張弾性率のことである。この場合も、弾性率は、上述のように動的弾性率測定装置または微小硬度試験機(ピコデンター)により測定することができる。
なお、複合部材21は、総膜厚が厚いと部材にかかる応力の絶対値が増大するため、総膜厚は薄い方が好ましい。複合部材21の総膜厚は、500μm以下が好ましく、300μm以下が更に好ましい。
なお、図11に示す表示装置20aにおいて、図7に示す表示装置20と同一構成物には同一符号を付して、その詳細な説明は省略する。図11に示す表示装置20aでも、表示部22と透明層23を除いたものが複合部材21である。
第2保護層31は、膜厚が厚いとタッチセンサー部30の第1の検出電極42および第2の検出電極44にかかる応力の絶対値が増大するため、厚みが20μm以下であることが好ましい。
第2保護層31の膜厚は、複合部材21を作製する前の第2保護層31自体の厚みを測定することにより求めることもできるし、前述のように断面電子顕微鏡像より測定することもできる。
図11に示す表示装置20aは、上述のこと以外に、図7に示す表示装置20と同様の効果を得ることができる。
なお、図7に示す表示装置20および図9に示すタッチセンサー部30と同一構成物には同一符号を付して、その詳細な説明は省略する。
また、絶縁層48の表面48aに、第1の検出電極42を覆う第2粘着層32が設けられている。
図12に示すタッチセンサー部30aは、図9に示すタッチセンサー部30と同様の効果を得ることができる。
なお、図12に示すタッチセンサー部30aと図13に示すタッチセンサー部30bは、いずれも第1の検出電極42と第2の検出電極44とが、導電層体41を曲げ方向Mに曲げた場合の内折り側に配置されている。
第1の検出電極42は第2保護層31上に設けられている。第2保護層31は、例えば、シート体で構成されるものであり、上述の絶縁基板40と同じもので構成することができる。例えば、上述の絶縁基板40と同じもので構成することができる。
図14に示すタッチセンサー部30cは、図9に示すタッチセンサー部30と同様の効果を得ることができる。
なお、図14に示すタッチセンサー部30cは、第1の検出電極42と第2の検出電極44とが、導電層体41を曲げ方向Mに曲げた場合の外折り側に配置されている。
図7に示す構成の表示装置20および図11に示す構成の表示装置20aは、いずれも表示部22を曲げ方向Mに曲げたとき、曲率半径が大きい側に配置されているが、表示部22は曲率半径が大きい側に配置することが好ましい。また、図7に示す構成の表示装置20および図11に示す構成の表示装置20aは、いずれも、上述の曲げ方向Mのように、予め定められた方向に曲げて使用されることが好ましい。曲げる方向が予め定められている場合には、曲げる方向以外の方向に曲げて使用することは好ましくない。
図15は本発明の実施形態の複合部材を有する表示装置の第1の例を示す模式的斜視図であり、図16は本発明の実施形態の複合部材を有する表示装置の第1の例の使用状態を示す模式的斜視図である。なお、図15および図16において、図7と同一構成物には同一符号を付して、その詳細な説明は省略する。
表示装置60では、表示領域60d全域を利用する場合には、図16に示すように、第1側部60bと、第2側部60cとを開いた状態とする。なお、第1側部60bと第2側部60cとのうち、いずれか一方を開いた状態で使用することもできる。
表示装置62では、表示領域62cを利用する場合には、図18に示すように、第1側部62aと第2側部62bとを開いた状態とする。
図7に示す構成の表示装置20および図11に示す構成の表示装置20aは、例えば、図19に示す表示装置64のように、巻芯65に巻き取ることができる。表示装置64は、詳細に示していないが表示装置20と同じ構成である。表示装置64の表示領域64aが上述のカバー層36の表面36aに相当する。表示装置64は、表示領域64aが内側になるように巻芯65に巻き取られている。表示装置64は、上述の表示装置20と同じく、折り曲げ耐性があるため、タッチセンサー部30のタッチ感度が低下することがない。表示装置64では、表示領域64aを利用する場合には表示装置64を引き出す。
<絶縁基板>
絶縁基板40は、第1の検出電極42および第2の検出電極44を電気的に絶縁し、かつ離間して配置することができれば、その種類は特に限定されない。絶縁基板40としては、透明基材が好ましく、プラスチックフィルムがより好ましい。
絶縁基板40を構成する材料の具体例としては、TAC(トリアセチルセルロース)、PET(ポリエチレンテレフタレート)、PI(ポリイミド)、COP(ポリシクロオレフィン)、COC(ポリシクロオレフィン共重合体)、ポリカーボネート、(メタ)アクリル樹脂、PEN(ポリエチレンナフタレート)、PE(ポリエチレン)、PP(ポリプロピレン)、ポリスチレン、ポリ塩化ビニル、またはポリ塩化ビニリデンが好ましく、TAC、PET、PI、COP、またはCOCがより好ましく、PET、またはCOPが更に好ましい。なお、「(メタ)アクリル」はアクリルおよびメタクリルの双方、またはいずれかを表す。
プラスチックフィルムとしては融点が約290℃以下であることが好ましい。
絶縁基板40の全光線透過率は、85~100%であることが好ましい。
絶縁基板40の厚みは特に制限されず、通常、25~500μmの範囲で任意に選択することができる。なかでも、絶縁基板40の厚みが薄い方が曲げに適するため、絶縁基板40の厚みは25~80μmが好ましく、25~60μmがより好ましく、25~40μmが更に好ましい。
下塗り層の形成方法は特に制限されず、例えば、高分子を含む下塗り層形成用組成物を絶縁基板40上に塗布して、必要に応じて加熱処理を施す方法が挙げられる。下塗り層形成用組成物には、必要に応じて、溶剤が含まれていてもよい。溶剤の種類は特に制限されず、公知の溶剤が例示される。また、高分子を含む下塗り層形成用組成物として、高分子の微粒子を含むラテックスを使用してもよい。
下塗り層の厚みは特に制限されず、導電部の密着性がより優れる点で、0.02~0.3μmが好ましく、0.03~0.2μmがより好ましい。
また、絶縁基板40は、上述のように導電層を電気的に絶縁する絶縁層の一形態である。絶縁層としては、絶縁基板40のような基板等のシート状のものに限定されず、塗布膜のような膜または層のような形態でもよい。塗布膜のような膜または層の場合でも、絶縁基板40と同様に、第1の検出電極42および第2の検出電極44を電気的に絶縁し、かつ離間して配置することができる。
導電線50の線幅wは特に限定されず、30μm以下が好ましく、15μm以下がより好ましく、10μm以下が更に好ましく、9μm以下が特に好ましく、7μm以下が最も好ましく、0.5μm以上が好ましく、1.0μm以上がより好ましい。上述の範囲であれば、低抵抗の電極を比較的容易に形成できる。
導電線が引き出し配線として適用される場合には、導電線の線幅は500μm以下が好ましく、50μm以下がより好ましく、30μm以下が更に好ましい。上述の範囲であれば、低抵抗のタッチパネル電極を比較的容易に形成できる。
導電線50の幅wおよび厚みtの測定は、まず、走査電子顕微鏡を用いて、導電線50の断面電子顕微鏡像を取得する。次に、断面電子顕微鏡像から導電線50の幅wおよび厚みtを求める。
開口部の一辺の長さは、800μm以下が好ましく、600μm以下がより好ましく、400μm以下が更に好ましく、5μm以上が好ましく、30μm以上がより好ましく、80μm以上が更に好ましい。
可視光透過率の点から、開口率は85%以上であることが好ましく、90%以上であることがより好ましく、95%以上であることが更に好ましい。開口率とは、絶縁基板40の表面40aにおいて導電線50を除いた透過性部分が表面40a全体に占める割合に相当する。
導電線50の中には、導電線50と絶縁基板40との密着性の観点から、バインダーが含まれていることが好ましい。
バインダーとしては、導電線50と絶縁基板40との密着性がより優れる理由から、樹脂が好ましく、より具体的には、(メタ)アクリル系樹脂、スチレン系樹脂、ビニル系樹脂、ポリオレフィン系樹脂、ポリエステル系樹脂、ポリウレタン系樹脂、ポリアミド系樹脂、ポリカーボネート系樹脂、ポリジエン系樹脂、エポキシ系樹脂、シリコーン系樹脂、セルロース系重合体およびキトサン系重合体からなる群から選ばれる少なくともいずれかの樹脂、または、これらの樹脂を構成する単量体からなる共重合体等が挙げられる。
更に、上述の方法以外にハロゲン化銀を使用した方法が挙げられる。より具体的には、特開2014-209332号公報の段落0056~0114に記載の方法が挙げられる。
曲げに優れる観点から、導電線50に銀細線を用い、銀細線からなるメッシュパターンを含む態様が挙げられる。
バリア層は、少なくとも1層の無機層を有するものであり、有機層と無機層との積層構造が好ましい。バリア層は、2層以上の有機層と2層以上の無機層とが交互に積層しているものであってもよい。バリア層を構成する層数に関しては特に制限はなく、典型的には2層~30層が好ましく、3層~20層がさらに好ましい。
また、バリア層は、有機層および無機層以外の他の構成層を含んでいてもよい。
バリア層の厚みは0.5μm~15μmであることが好ましく、1μm~10μmであることがより好ましい。
無機層は、金属化合物を含む。無機層は複合フィルムのバリア性に主に寄与する層であればよい。
無機層における金属化合物の量は、無機層の総質量に対し、90質量%以上であればよく、95質量%以上であることが好ましく、99質量%以上であることがより好ましく、99.9質量%以上であることがさらに好ましい。無機層は実質的に金属化合物からなっていてもよい。
バリア層は、少なくとも1層の窒化ケイ素を含む層を無機層として含む。窒化ケイ素を含む層において、窒化ケイ素の量は、窒化ケイ素を含む層の総質量に対し、60質量%以上であることが好ましく、70質量%以上であることがより好ましく、80質量%以上であることがさらに好ましく、90質量%以上であることが特に好ましい。
複数の無機層を含む場合、複数の無機層を構成する金属化合物は同一であっても異なっていてもよく、同一であることが好ましい。すなわち、バリア層が複数の無機層を含む場合、複数の無機層はいずれも窒化ケイ素を含む層であることが好ましい。
無機層の平滑性は、1μm角の平均粗さ(Ra値)が3nm未満であることが好ましく、1nm以下がより好ましい。
無機層は基板または後述の有機層の表面に直接形成されることが好ましい。
バリア層は、少なくとも1層の有機層を含む。バリア層において、有機層は少なくとも1層の無機層と直接接していることが好ましい。
有機層は、好ましくは、重合性化合物を含む重合性組成物の硬化により形成することができる。
上述の重合性化合物は、エチレン性不飽和結合を末端または側鎖に有する化合物、および/または、エポキシまたはオキセタンを末端または側鎖に有する化合物であることが好ましい。重合性化合物としては、エチレン性不飽和結合を末端または側鎖に有する化合物が特に好ましい。エチレン性不飽和結合を末端または側鎖に有する化合物の例としては、(メタ)アクリレート系化合物、アクリルアミド系化合物、スチレン系化合物、無水マレイン酸等が挙げられ、(メタ)アクリレート系化合物が好ましく、特にアクリレート系化合物が好ましい。
スチレン系化合物としては、スチレン、α-メチルスチレン、4-メチルスチレン、ジビニルベンゼン、4-ヒドロキシスチレン、4-カルボキシスチレン等が好ましい。
(メタ)アクリレート系化合物として具体的には、例えば、特開2013-43382号公報の段落0024~0036または特開2013-43384号公報の段落0036~0048に記載の化合物を用いることができる。また、WO2013/047524に記載の式(2)で表される式の化合物等のフルオレン骨格を有する多官能アクリルモノマーを用いることもできる。
有機層形成のための重合性組成物は、重合開始剤を含んでいてもよい。重合開始剤を用いる場合、その含量は、重合に関与する化合物の合計量の0.1モル%以上であることが好ましく、0.5~5モル%であることがより好ましい。このような組成とすることにより、活性成分生成反応を経由する重合反応を適切に制御することができる。光重合開始剤の例としてはBASF社から市販されているイルガキュア(Irgacure)シリーズ(例えば、イルガキュア651、イルガキュア754、イルガキュア184、イルガキュア2959、イルガキュア907、イルガキュア369、イルガキュア379、イルガキュア819等)、ダロキュア(Darocure)シリーズ(例えば、ダロキュアTPO、ダロキュア1173等)、クオンタキュア(Quantacure)PDO、ランベルティ(Lamberti)社から市販されているエザキュア(Ezacure)シリーズ(例えば、エザキュアTZM、エザキュアTZT、エザキュアKTO46等)等が挙げられる。
有機層形成のための重合性組成物は、シランカップリング剤を含んでいてもよい。シランカップリング剤としては、ケイ素に結合するメトキシ基、エトキシ基、アセトキシ基等の加水分解可能な反応性基とともに、エポキシ基、ビニル基、アミノ基、ハロゲン基、メルカプト基、(メタ)アクリロイル基から選択される1つ以上の反応性基を有する置換基を同じケイ素に結合する置換基として有するものが好ましい。シランカップリング剤は、(メタ)アクリロイル基を有していることが特に好ましい。シランカップリング剤の具体例としては、WO2013/146069に記載の一般式(1)で表されるシランカップリング剤およびWO2013/027786に記載の一般式(I)で表されるシランカップリング剤等が挙げられる。
シランカップリング剤の、重合性組成物の固形分(揮発分が揮発した後の残分)中に占める割合は、0.1~30質量%が好ましく、1~20質量%がより好ましい。
有機層の作製のため、上述の重合性組成物は、先ず、層状とされる。層状にするためには、通常、基板または無機層等の支持体の上に、重合性組成物を塗布すればよい。塗布方法としては、ディップコート法、エアーナイフコート法、カーテンコート法、ローラーコート法、ワイヤーバーコート法、グラビアコート法、スライドコート法、或いは、米国特許第2681294号明細書に記載のホッパ-を使用するエクストルージョンコート法(ダイコート法とも呼ばれる)が例示され、この中でもエクストルージョンコート法が好ましく採用できる。
無機層の表面に有機層形成のための重合性組成物を塗布する際は、エクストルージョンコート法を用いて行なうことが好ましい。
塗布された重合性組成物は、次いで、乾燥してもよい。
有機層の硬度は高いことが好ましい。有機層の硬度が高いと無機層が平滑に成膜され、その結果としてバリア性が向上することがわかっている。有機層の硬度はナノインデンテーション法に基づく微小硬度として表すことができる。有機層の微小硬度は100N/mm以上であることが好ましく、150N/mm以上であることがより好ましい。
有機層と無機層の積層は、層構成に応じて有機層と無機層を順次繰り返し成膜することにより行うことができる。
バリア層は、基板のカバー層側の面に設けられていれば、表示部への水分の到達を抑制することができる。このため、バリア層は基板のカバー層側の面に設けることが好ましい。なお、バリア層は、基板の表面および裏面の両面に設けてもよい。
バリア層は、基板に設ける以外にも、導電線を覆うようにして第1の検出電極または第2の検出電極の上に設けてもよい。これにより、表示部への水分の到達を抑制し、かつ導電線への水分の到達を抑制することができ、導電線の腐食も防止することができる。検出電極の上にバリア層を設ける場合も、バリア層は、基板のカバー層側に配置された検出電極の上に設けられていればよい。
バリア層を基板の両面、または基板の両面側に設ける場合、基板がバリア層で覆われる構成となるため、第1の検出電極および第2の検出電極、ならびに基板から十分に水分を追い出した状態にした後、バリア層を設けることが好ましい。具体的には、バリア層を設ける前に、第1の検出電極および第2の検出電極が形成された基板に対して脱水工程を行うことが好ましい。なお、バリア層を設けると水分が出にくくなるので、基板としては、水分を吸いにくいものが好ましく、例えば、COPおよびCOCが好ましい。
<第1実施例>
第1実施例では、実施例1~12ならびに比較例1および比較例2の複合部材を作製し、曲げによる導電層の抵抗の上昇の程度を調べた。以下、抵抗上昇試験について説明する。
得られた複合部材について、曲げる前後で、両面に形成された各導電層の抵抗を測定し、曲げる前後の導電層の抵抗上昇を調べた。なお、下記表1および表2において、内折り側とは下記表1および表2の欄の上側であり、カバー層に近い方の導電層を指す。また、外折り側とはその反対側の導電層を指し、下記表1および表2の欄の下側である。
抵抗は、配線間の抵抗値を、デジタルマルチメーターを用いて測定した。
曲げは、得られた複合部材を、オートクレーブにより温度40℃、圧力0.5MPaの条件で20分処理した。次いで、処理後の複合部材に対し、折り曲げ試験機(面状体無負荷U字伸縮試験機(DLDMLH-FS)(ユアサシステム株式会社製))を用いて、折り曲げ半径を2mmとして折り曲げを10万回実施した。
曲げ試験では、複合部材を曲げた際にカバー層の表面が内側になるように曲げ方向Mを設定した。
10万回の曲げ試験後の複合部材について、抵抗を測定して抵抗上昇を求めた。抵抗上昇量を「Δ(デルタ)」とする。抵抗上昇を下記評価基準にて評価した。評価結果を表1および表2に示す。
「A」:ほぼ変化なし Δ<300Ω
「B」:中程度の変化 300Ω≦Δ≦1000Ω
「C」:中程度の変化 1000Ω<Δ 断線せず
「D」:断線
上述の評価が「D」となる断線とは、抵抗値が50MΩ以上、または装置の計測範囲以上のことを指す。断線の具体的な物理状態としては、例えば、配線が途中で破断し、物理的につながっていないような状態を指す。
<透明導電フィルムの作製方法>
(ハロゲン化銀乳剤の調製)
温度38℃、pH(potential of hydrogen)4.5に保たれた下記1液に、下記2液および3液の各々90%に相当する量を攪拌しながら同時に20分間にわたって加え、0.16μmの核粒子を形成した。続いて下記の4液および5液を8分間にわたって加え、更に、下記の2液および3液の残りの10%の量を2分間にわたって加え、0.21μmまで成長させた。更に、ヨウ化カリウム0.15gを加え、5分間熟成し粒子形成を終了した。
水:750mL
ゼラチン:9g
塩化ナトリウム:3g
1,3-ジメチルイミダゾリジン-2-チオン:20mg
ベンゼンチオスルホン酸ナトリウム:10mg
クエン酸:0.7g
2液:
水:300mL
硝酸銀:150g
3液:
水:300mL
塩化ナトリウム:38g
臭化カリウム:32g
ヘキサクロロイリジウム(III)酸カリウム
(0.005%KCl 20%水溶液):8mL
ヘキサクロロロジウム酸アンモニウム
(0.001%NaCl 20%水溶液):10mL
4液:
水:100mL
硝酸銀:50g
5液:
水:100mL
塩化ナトリウム:13g
臭化カリウム:11g
黄血塩:5mg
上述の乳剤に1,3,3a,7-テトラアザインデン1.2×10-4モル/モルAg、ハイドロキノン1.2×10-2モル/モルAg、クエン酸3.0×10-4モル/モルAg、2,4-ジクロロ-6-ヒドロキシ-1,3,5-トリアジンナトリウム塩0.90g/モルAg、微量の硬膜剤を添加し、クエン酸を用いて塗布液pHを5.6に調整した。
上述の塗布液に、含有するゼラチンに対して、(P-1)で表されるポリマーとジアルキルフェニルPEO硫酸エステルからなる分散剤を含有するポリマーラテックス(分散剤/ポリマーの質量比が2.0/100=0.02)とをポリマー/ゼラチン(質量比)=0.5/1になるように添加した。
以上のようにして感光性層形成用組成物を調製した。
なお、上述の(P-1)で表されるポリマーは、特許第3305459号および特許第3754745号を参照して合成した。
厚みが40μmのPET(ポリエチレンテレフタレート)フィルムを基板として用意した。基板の両面に、上述のポリマーラテックスを塗布して、厚み0.05μmの下塗り層を設けた。
次に、下塗り層上に、上述のポリマーラテックスとゼラチン、および光学濃度が約1.0で現像液のアルカリにより脱色する染料の混合物から成るアンチハレーション層を設けた。なお、ポリマーとゼラチンとの混合質量比(ポリマー/ゼラチン)は2/1であり、ポリマーの含有量は0.65g/m2であった。
上述のアンチハレーション層の上に、上述の感光性層形成用組成物を塗布し、更に上述のポリマーラテックスとゼラチンとエポクロスK-2020E(商品名:日本触媒株式会社製、オキサゾリン系架橋反応性ポリマーラテックス(架橋性基:オキサゾリン基))、スノーテックスC(登録商標、商品名:日産化学工業株式会社製、コロイダルシリカ)とを固形分質量比(ポリマー/ゼラチン/エポクロスK-2020E/スノーテックスC(登録商標))1/1/0.3/2で混合した組成物をゼラチン量が0.08g/m2となるように塗布し、両面に感光性層が形成された支持基体を得た。両面に感光性層が形成された支持基体をフィルムAとする。形成された感光性層は、銀量6.2g/m2、ゼラチン量1.0g/m2であった。
導電線50形成の露光マスクとして、上述の図10に示すようなメッシュパターンを有する露光マスクをそれぞれ用意した。上述のフィルムAの両面に、メッシュパターンの露光マスクを配置し、高圧水銀ランプを光源とした平行光を用いて露光を、予め定められたパターン間隔で繰り返し行った。メッシュパターンには、格子の一辺の長さを150μm、線幅を4μmに設定したものを用いた。
露光後、下記の現像液で現像し、更に定着液(商品名:CN16X用N3X-R、富士フィルム株式会社製)を用いて現像処理を行った。更に、純水でリンスし、乾燥することで、両面に銀細線からなるパターン部と、ゼラチン層とが形成された支持基体を得た。ゼラチン層は銀細線間に形成されていた。得られたフィルムをフィルムBとする。
現像液1リットル(L)中に、以下の化合物が含まれる。
ハイドロキノン:0.037mol/L
N-メチルアミノフェノール:0.016mol/L
メタホウ酸ナトリウム:0.140mol/L
水酸化ナトリウム:0.360mol/L
臭化ナトリウム:0.031mol/L
メタ重亜硫酸カリウム:0.187mol/L
フィルムBに対して、タンパク質分解酵素(ナガセケムテックス株式会社製ビオプラーゼAL-15FG)の水溶液(タンパク質分解酵素の濃度:0.5質量%、液温:40℃)への浸漬を120秒間行った。フィルムBを水溶液から取り出し、温水(液温:50℃)に120秒間浸漬し、洗浄した。ゼラチン分解処理後のフィルムをフィルムCとする。
上述のフィルムCに対して、金属製ローラからなるカレンダ装置を用いて、30kNの圧力でカレンダ処理を行った。このとき、線粗さRa=0.2μm、Sm=1.9μm(株式会社キーエンス製形状解析レーザ顕微鏡VK-X110にて測定(JIS-B-0601-1994))の粗面形状を有するPET(ポリエチレンテレフタレート)フィルム2枚を、これらの粗面が上述のフィルムCの表面および裏面と向き合うように共に搬送して、上述のフィルムCの表面および裏面に粗面形状を転写形成した。
上述のカレンダ処理後、温度150℃の過熱蒸気槽を120秒間かけて通過させて、加熱処理を行った。加熱処理後のフィルムが透明導電フィルムである。
(実施例1)
実施例1は、カバー層(厚みが40μmのPET(ポリエチレンテレフタレート)フィルム)と、粘着層(リンテック株式会社製MO-3015G(品名))と、λ/4層と、偏光子層と、粘着層(リンテック株式会社製MO-3015C(品名))と、タッチセンサー部を構成する透明導電フィルムとを貼り合せて積層した。タッチセンサー部の下方に、厚みが1μmの接着剤層を介して、厚みが10μmのPET(ポリエチレンテレフタレート)フィルムを設けた。厚みが10μmのPET(ポリエチレンテレフタレート)フィルムの下方に粘着層(リンテック株式会社製MO-3015C(品名))と、ポリイミドフィルム(膜厚30μm)と、粘着層(リンテック株式会社製MO-3015C(品名))と、ポリイミドフィルム(膜厚125μm)との順で貼り合せて積層して、複合部材を形成した。上述の粘着層の厚みは、いずれも25μmとした。上述の厚みが1μmの接着剤層は、アクリル系接着剤を用いて形成したものである。上述の厚みが1μmの接着剤層が、粘着層よりも弾性率が高い部材に相当する。
なお、下記表1および表2において、括弧内の数値は膜厚を示す。また、下記表1および表2において、「PET」はポリエチレンテレフタレートフィルムを示し、「PI」はポリイミドフィルムを示す。
(実施例2)
実施例2は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが0.8μmの保護層を設けた点が異なり、それ以外は、実施例1と同じ構成とした。
上述の厚みが0.8μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV(Ultra Violet)露光し硬化して作製したものである。なお、実施例2~実施例4および実施例6~12では、いずれも保護層が、粘着層よりも弾性率が高い部材に相当する。
実施例3は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが5μmの保護層を設けた点が異なり、それ以外は、実施例1と同じ構成とした。
上述の厚みが5μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV露光し硬化して作製したものである。
(実施例4)
実施例4は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが15μmの保護層を設けた点が異なり、それ以外は、実施例1と同じ構成とした。
上述の厚みが15μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV露光し硬化して作製したものである。
実施例5は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが15μmの保護層を設けた点、および粘着層(リンテック株式会社製MO-3015C(品名))と、透明導電フィルムとの間に厚みが15μmの保護層を設けた点が異なり、それ以外は、実施例1と同じ構成とした。
上述の厚みが15μmの2つの保護層は、いずれも荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV露光し硬化して作製したものである。なお、実施例5では、外折り側の保護層が、粘着層よりも弾性率が高い部材に相当する。
(実施例6)
実施例6は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが40μmの保護層を設けた点が異なり、それ以外は、実施例1と同じ構成とした。
上述の厚みが40μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV露光し硬化する工程を3回繰り返すことにより作製したものである。
(実施例7)
実施例7は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが100μmの保護層を設けた点が異なり、それ以外は、実施例1と同じ構成とした。
上述の厚みが100μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV露光し硬化する工程を6回繰り返すことにより作製したものである。
実施例8は、実施例4に比して、タッチセンサー部の構成が異なり、それ以外は、実施例4と同じ構成とした。
実施例8では、タッチセンサー部の基板の、カバー層側の面にバリア層を設けた。バリア層は、以下のようにして作製した。
TMPTA(トリメチロールプロパントリアクリレート;ダイセルセルテック株式会社製)、シランカップリング剤(KBM-5103、信越化学株式会社製)および重合性酸性化合物(KARAMER PM-21、日本化薬株式会社製)を、質量比14.1:3.5:1で混合してなる組成物を調製した。
この組成物18.6gと、紫外線重合開始剤(ランベルティ株式会社製、ESACURE KTO46)1.4gと、2-ブタノン180gとを混合して、有機層形成用組成物を調製した。
次いで、窒素置換法を用いて酸素濃度を0.1%としたチャンバー内で高圧水銀ランプの紫外線を照射(積算照射量約1J/cm2)することにより、有機層形成用組成物を硬化させ、基板の表面に厚み4000nm±50nmの有機層を形成した。
無機層(窒化ケイ素膜)の形成は、一般的なCCP(容量結合プラズマ方式)-CVD(Chemical Vapor Deposition)装置を用いて行った。原料ガスは、シランガス(流量160sccm(standard cubic centimeter per minute)、アンモニアガス(流量370sccm)、水素ガス(流量590sccm)、および窒素ガス(流量240sccm)を用いた。成膜圧力は40Paとした。電源は周波数13.56MHzの高周波電源を用い、プラズマ励起電力を2.5kWとした。
実施例9は、実施例8に比して、タッチセンサー部の構成が異なり、それ以外は、実施例8と同じ構成とした。
実施例9では、タッチセンサー部の基板の両面にバリア層を設けた。実施例9のバリア層は、上述の実施例8のバリア層と同じ構成であり、かつ基板の両面にバリア層を設けた以外は実施例8のバリア層と同じ作製方法で作製した。
(実施例10)
実施例10は、実施例8に比して、タッチセンサー部の構成が異なり、それ以外は、実施例8と同じ構成とした。
実施例10では、タッチセンサー部の両面の各面の導電線上にバリア層を設けた。実施例10のバリア層は、上述の実施例8のバリア層と同じ構成であり、かつ両面の各面の導電線上にバリア層を設けた以外は実施例8のバリア層と同じ作製方法で作製した。
(実施例11)
実施例11は、実施例8に比して、タッチセンサー部の構成が異なり、それ以外は、実施例8と同じ構成とした。
実施例11では、タッチセンサー部の両面の各面の導電線上にバリア層として、厚み30nmの窒化ケイ素膜だけを設けた。実施例11の窒化ケイ素膜は、上述の実施例8と同じ作製方法で作製した。
(実施例12)
実施例12は、実施例8に比して、タッチセンサー部の構成が異なり、それ以外は、実施例8と同じ構成とした。
実施例12では、タッチセンサー部の基板の、カバー層側の面の導電線上にバリア層を設けた。実施例12のバリア層は、上述の実施例8のバリア層と同じ構成であり、かつカバー層側の面の導電線上にバリア層を設けた以外は実施例8のバリア層と同じ作製方法で作製した。
比較例1は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムが設けられていない点、すなわち、粘着層よりも弾性率が高い部材が設けられていない点が異なり、それ以外は、実施例1と同じ構成とした。
(比較例2)
比較例2は、実施例1に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムが設けられていない点、およびタッチセンサー部の基板がガスバリアフィルムである点が異なり、それ以外は、実施例1と同じ構成とした。比較例2は、比較例1と同じく粘着層よりも弾性率が高い部材が設けられていない。
<第2実施例>
第2実施例では、以下に示す実施例20~31および比較例10について、導電層の抵抗上昇および剥がれを評価した。以下、抵抗上昇および剥がれについて説明する。
導電層の抵抗上昇は、評価を含め上述の第1実施例の抵抗上昇と同じであるため、その詳細な説明は省略する。なお、抵抗上昇は、外折り側だけを評価した。
剥がれについては、実施例20~31および比較例10の各複合部材を、オートクレーブにより温度40℃、圧力0.5MPaの条件で20分処理した。次いで、処理後の各複合部材に対し、折り曲げ試験機(面状体無負荷U字伸縮試験機(DLDMLH-FS)(ユアサシステム株式会社製)を用いて、折り曲げ半径を2mmとして折り曲げを10万回実施した。折り曲げを10万回実施した後の各複合部材の状態を目視により観察し、剥がれについて下記評価基準にて評価した。評価結果を下記表3および表4に示す。
剥がれの評価基準
「A」:剥がれなし
「B」:わずかに剥がれあり
「C」:剥がれあり
(実施例20)
実施例20は、カバー層(厚みが40μmのPET(ポリエチレンテレフタレート)フィルム)と、粘着層(リンテック株式会社製MO-3015G(品名))と、λ/4層と、偏光子層と、粘着層(リンテック株式会社製MO-3015C(品名))と、タッチセンサー部とを貼り合せて積層した。タッチセンサー部の下方に、厚みが1μmの接着剤層を介して、厚みが10μmのPET(ポリエチレンテレフタレート)フィルムを設けた。厚みが10μmのPET(ポリエチレンテレフタレート)フィルムの下方に粘着層(リンテック株式会社製MO-3015C(品名))と、ポリイミドフィルム(膜厚30μm)と、粘着層(リンテック株式会社製MO-3015C(品名))と、ポリイミドフィルム(膜厚125μm)との順で貼り合せて積層して、複合部材を形成した。上述の粘着層の厚みは、いずれも25μmとした。上述の厚みが1μmの接着剤層は、アクリル系接着剤を用いて形成したものである。上述の厚みが1μmの接着剤層が、粘着層よりも弾性率が高い部材に相当する。
なお、下記表3および表4において、括弧内の数値は膜厚を示す。また、下記表3および表4において、「PET」はポリエチレンテレフタレートフィルムを示し、「PI」はポリイミドフィルムを示す。
タッチセンサー部は、まず、厚さ40μmのCOP(シクロオレフィンポリマー)基材上に荒川化学工業株式会社製XSR-5Nを2μmの厚さに塗布し、UV(Ultra Violet)露光により硬化させて、第1塗布膜を形成した。第1塗布膜上に、厚さ0.05μmのMo膜、厚さ0.3μmのAl膜、および厚さ0.05μmのMo膜の順に積層された第1積層膜を、スパッタ法を用いて形成した。第1積層膜をフォトリソグラフィ法を用いて導電層のパターンにパターニングして、1層目の導電層を形成した。
さらに、1層目の導電層を覆って、荒川化学工業株式会社製XSR-5Nを3μmの厚さに塗布し、UV露光により硬化させて、第2塗布膜を形成した。第2塗布膜上に、厚さ0.05μmのMo膜、厚さ0.3μmのAl膜、および厚さ0.05μmのMo膜の順に積層された第2積層膜を、スパッタ法を用いて形成した。第2積層膜をフォトリソグラフィ法を用いて導電層のパターンにパターニングして、2層目の導電層を形成した。なお、1層目の導電層と外部配線との電気的接続をとる部分として、この後、第1塗布膜に、フォトリソグラフィ法を用いて開口部を形成した。
なお、タッチセンサー部に関し、下記表3および表4では、2つの導電層を、いずれも外折り側に配置したものを「片面2層電極(外折り側電極)」と表記し、2つの導電層を、いずれも内折り側に配置したものを「片面2層電極(内折り側電極)」と表記した。
実施例21は、実施例20に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが2μmの保護層を設けた点が異なり、それ以外は、実施例20と同じ構成とした。
上述の厚みが2μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV(Ultra Violet)露光し硬化して作製したものである。なお、実施例21~実施例23では、いずれも保護層が、粘着層よりも弾性率が高い部材に相当する。
(実施例22)
実施例22は、実施例20に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが15μmの保護層を設けた点が異なり、それ以外は、実施例20と同じ構成とした。
上述の厚みが15μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV(Ultra Violet)露光し硬化して作製したものである。
実施例23は、実施例20に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムに代えて、厚みが25μmの保護層を設けた点が異なり、それ以外は、実施例20と同じ構成とした。
上述の厚みが25μmの保護層は、荒川化学工業株式会社製XSR-5Nをスクリーン印刷で塗布し、UV(Ultra Violet)露光し硬化して作製したものである。
(実施例24)
実施例24は、実施例20に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムが設けられていない点、タッチセンサー部の2つの導電層を、いずれも内折り側に配置した構成である点が異なり、それ以外は、実施例20と同じ構成とした。
実施例24は、タッチセンサー部のCOP基材が粘着層よりも弾性率が高い部材に相当する。
(実施例25)
実施例25は、実施例20に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムが設けられていない点、タッチセンサー部の2つの導電層を、いずれも内折り側に配置した構成である点、タッチセンサー部の内折り側に厚さ15μmの保護層を設けた点が異なり、それ以外は、実施例20と同じ構成とした。
実施例25は、タッチセンサー部のCOP基材が粘着層よりも弾性率が高い部材に相当する。
実施例26は、実施例22に比して、タッチセンサー部のCOP基材のカバー層側の面にバリア層を設けた点が異なり、それ以外は、実施例22と同じ構成とした。バリア層は、上述の第1実施例の実施例8のバリア層と同じ構成であり、かつ実施例8のバリア層と同じ作製方法で作製した。
(実施例27)
実施例27は、実施例22に比して、タッチセンサー部の保護層側の導電層上にバリア層を設けた点が異なり、それ以外は、実施例22と同じ構成とした。バリア層は、上述の第1実施例の実施例8のバリア層と同じ構成であり、かつ実施例8のバリア層と同じ作製方法で作製した。
(実施例28)
実施例28は、実施例22に比して、タッチセンサー部のCOP基材のカバー層側の面と、保護層側の導電層上にバリア層を設けた点が異なり、それ以外は、実施例22と同じ構成とした。バリア層は、上述の第1実施例の実施例8のバリア層と同じ構成であり、かつ実施例8のバリア層と同じ作製方法で作製した。
実施例29は、実施例24に比して、タッチセンサー部のCOP基材の保護層側の面にバリア層を設けた点が異なり、それ以外は、実施例24と同じ構成とした。バリア層は、上述の第1実施例の実施例8のバリア層と同じ構成であり、かつ実施例8のバリア層と同じ作製方法で作製した。
(実施例30)
実施例30は、実施例24に比して、タッチセンサー部のカバー層側の導電層上にバリア層を設けた点が異なり、それ以外は、実施例24と同じ構成とした。バリア層は、上述の第1実施例の実施例8のバリア層と同じ構成であり、かつ実施例8のバリア層と同じ作製方法で作製した。
(実施例31)
実施例31は、実施例24に比して、タッチセンサー部のCOP基材の保護層側の面と、カバー側の導電層上にバリア層を設けた点が異なり、それ以外は、実施例24と同じ構成とした。バリア層は、上述の第1実施例の実施例8のバリア層と同じ構成であり、かつ実施例8のバリア層と同じ作製方法で作製した。
比較例10は、実施例20に比して、厚みが1μmの接着剤層および厚みが10μmのPETフィルムが設けられていない点、すなわち、粘着層よりも弾性率が高い部材が設けられていない点が異なり、それ以外は、実施例20と同じ構成とした。
10a、11a、Ds 応力
11 部材
12 積層体
20、20a 表示装置
21 複合部材
22 表示部
23、25、27 透明層
24、26 プラスチックフィルム
27 第1粘着層
28 第1保護層
30、30a、30b、30c タッチセンサー部
31 第2保護層
32 第2粘着層
33 反射防止層
34 透明層
36 カバー層
36a 表面
37 コントローラ
40 絶縁基板
40a、48a 表面
40b、48b 裏面
41 導電層体
42 第1の検出電極
43 第1の周辺配線
44 第2の検出電極
45 第2の周辺配線
47 検知領域
48 絶縁層
50 導電線
60、62、64 表示装置
60a 中央部
60b、62a 第1側部
60c、62b 第2側部
60d、62c、64a 表示領域
60e、62d 端部
M 曲げ方向
X 第2の方向
Y 第1の方向
t、ts 厚み
td 距離
w 線幅
Claims (15)
- 絶縁層と、前記絶縁層により電気的に絶縁され、かつ離間して配置された、少なくとも2つの導電層と、を備える導電層体と、
少なくとも1つの粘着層と、
前記少なくとも2つの導電層のうち前記導電層体を曲げ方向に曲げた場合に前記絶縁層の曲率半径が大きい側に設けられた第1導電層と接する、前記粘着層よりも弾性率が高い部材とを有し、
前記粘着層は、前記絶縁層と前記導電層との間以外、および前記第1導電層と前記粘着層よりも弾性率が高い前記部材との間以外に配置され、
前記絶縁層は、前記粘着層よりも弾性率が高いことを特徴とする複合部材。 - 前記絶縁層は、可撓性を有する請求項1に記載の複合部材。
- 前記絶縁層は、弾性率が10-1~30GPaである請求項1または2に記載の複合部材。
- 前記粘着層よりも弾性率が高い前記部材は、シート体で構成されており、かつ前記第1導電層の前記絶縁層とは逆側に配置される請求項1~3のいずれか1項に記載の複合部材。
- 前記第1導電層に、前記粘着層より弾性率の高い第1保護層が積層されている請求項1~4のいずれか1項に記載の複合部材。
- 前記第1保護層は、前記第1導電層側に設けられた第1粘着層と接している請求項5に記載の複合部材。
- 前記第1保護層と前記第1導電層との界面から、前記導電層体を前記曲げ方向に曲げた場合に前記絶縁層の曲率半径が小さい側に初めて配置される粘着層の界面までの厚みをtdとし、前記第1保護層の厚みをtsとするとき、ts≦tdである請求項5または6に記載の複合部材。
- 前記導電層体を前記曲げ方向に曲げた場合に前記基板の曲率半径が小さい側に設けられた第2導電層に、厚みが20μm以下の第2保護層が積層されており、前記第2保護層は、前記第2導電層側に設けられた第2粘着層と接している請求項1~7のいずれか1項に記載の複合部材。
- 前記導電層体を前記曲げ方向に曲げた場合に前記基板の曲率半径が小さい側に設けられた第2粘着層と、前記導電層体を前記曲げ方向に曲げた場合に前記絶縁層の曲率半径が小さい側に設けられた第2導電層とが接している請求項1~7のいずれか1項に記載の複合部材。
- 前記導電層体は、前記絶縁層と、前記絶縁層の両面の各面に設けられた前記導電層とを有する請求項1~9のいずれか1項に記載の複合部材。
- 前記絶縁層は、絶縁基板で構成されている請求項10に記載の複合部材。
- 前記導電層は、金属で構成されている請求項1~11のいずれか1項に記載の複合部材。
- 前記絶縁層と前記導電層の間、または前記導電層上に、バリア層を有し、前記バリア層は、少なくとも窒化ケイ素を含む無機層を有する請求項1~12のいずれか1項に記載の複合部材。
- 前記バリア層は、前記無機層と有機層との積層構造である請求項13に記載の複合部材。
- 請求項1~14のいずれか1項に記載の複合部材を有することを特徴とするデバイス。
Priority Applications (4)
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JP2019526692A JP6937829B2 (ja) | 2017-06-26 | 2018-05-23 | 複合部材およびデバイス |
CN201880032787.6A CN110650842B (zh) | 2017-06-26 | 2018-05-23 | 复合部件及器件 |
KR1020197033701A KR20190139965A (ko) | 2017-06-26 | 2018-05-23 | 복합 부재 및 디바이스 |
US16/670,355 US20200064973A1 (en) | 2017-06-26 | 2019-10-31 | Composite member and device |
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US16/670,355 Continuation US20200064973A1 (en) | 2017-06-26 | 2019-10-31 | Composite member and device |
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WO2019003726A1 true WO2019003726A1 (ja) | 2019-01-03 |
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PCT/JP2018/019734 WO2019003726A1 (ja) | 2017-06-26 | 2018-05-23 | 複合部材およびデバイス |
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US (1) | US20200064973A1 (ja) |
JP (1) | JP6937829B2 (ja) |
KR (1) | KR20190139965A (ja) |
CN (1) | CN110650842B (ja) |
WO (1) | WO2019003726A1 (ja) |
Cited By (2)
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JP2021138088A (ja) * | 2020-03-06 | 2021-09-16 | 日本航空電子工業株式会社 | 電気接続部材、電気接続部材を生産する方法及び配線構造 |
US20230101087A1 (en) * | 2019-08-19 | 2023-03-30 | Boe Technology Group Co., Ltd | Foldable display screen, manufacturing method thereof and display device |
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KR102436547B1 (ko) * | 2017-09-29 | 2022-08-29 | 삼성디스플레이 주식회사 | 전자 장치 |
CN108054191B (zh) * | 2018-01-11 | 2020-02-07 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
KR102547124B1 (ko) | 2018-03-30 | 2023-06-26 | 삼성디스플레이 주식회사 | 표시장치 |
US11442585B2 (en) * | 2020-10-05 | 2022-09-13 | Tpk Touch Solutions (Xiamen) Inc. | Touch display module, electronic apparatus, and touch position detection method |
KR20220148986A (ko) * | 2021-04-29 | 2022-11-08 | 삼성디스플레이 주식회사 | 전자 장치 및 이를 포함하는 인터페이스 장치 |
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Also Published As
Publication number | Publication date |
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KR20190139965A (ko) | 2019-12-18 |
CN110650842A (zh) | 2020-01-03 |
JPWO2019003726A1 (ja) | 2020-04-02 |
US20200064973A1 (en) | 2020-02-27 |
JP6937829B2 (ja) | 2021-09-22 |
CN110650842B (zh) | 2022-05-27 |
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