WO2018218849A1 - Rotational eutectic soldering station for chips - Google Patents

Rotational eutectic soldering station for chips Download PDF

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Publication number
WO2018218849A1
WO2018218849A1 PCT/CN2017/106399 CN2017106399W WO2018218849A1 WO 2018218849 A1 WO2018218849 A1 WO 2018218849A1 CN 2017106399 W CN2017106399 W CN 2017106399W WO 2018218849 A1 WO2018218849 A1 WO 2018218849A1
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WO
WIPO (PCT)
Prior art keywords
soldering station
nozzle
soldering
eutectic
rotating
Prior art date
Application number
PCT/CN2017/106399
Other languages
French (fr)
Chinese (zh)
Inventor
代克明
肖华平
Original Assignee
广东瑞谷光网通信股份有限公司
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Filing date
Publication date
Application filed by 广东瑞谷光网通信股份有限公司 filed Critical 广东瑞谷光网通信股份有限公司
Priority to KR1020187029862A priority Critical patent/KR102165651B1/en
Priority to JP2018556482A priority patent/JP6638090B2/en
Publication of WO2018218849A1 publication Critical patent/WO2018218849A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/81149—Aligning involving movement of a part of the bonding apparatus being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table
    • H01L2224/8115—Rotational movements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/81169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/8117—Rotational movements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of LD processing, and more particularly to a chip rotating eutectic soldering station.
  • LD semiconductor laser
  • LD semiconductor laser
  • LD chip manufacturing, die (module) packaging and product application the packaging process and equipment are closer to the market, and the promotion of the industry is more direct.
  • eutectic soldering technology is one of the most critical core technologies in the next-generation flip-chip high-power LD chip packaging process. The quality of eutectic soldering technology will directly affect the luminous efficiency, life and heat dissipation of high-power LD modules. Performance and end product quality.
  • the automatic eutectic welding process has a total of three parts, namely the stem, the gasket and the chip (size *width * height is 1.5*1.0*0.6mm), and the gasket is first welded to the base by eutectic method. Then the chip is soldered to the gasket by eutectic method.
  • the current eutectic soldering station is formed by sequentially welding the gasket and the chip on the tube holder through a production line using a plurality of handling nozzles and a eutectic soldering station. This kind of process is to carry the tube seat to the eutectic soldering station in batches through the strip production line. After the handling nozzle is placed down the tube holder, it must be transported again to the material box. This process has the problems of low processing efficiency and large space occupied by the equipment. .
  • a chip rotating eutectic soldering station comprising a bottom plate, a bottom plate fixed with a nozzle moving platform and a soldering station moving platform, wherein the suction moving platform is provided with a driving rotary nozzle
  • the vertical surface rotates the nozzle rotating motor
  • the soldering station moving platform is provided with a soldering table rotating motor that drives the eutectic soldering station to rotate horizontally
  • the rotating nozzle comprises four vacuum nozzles uniformly arranged in the circumferential direction, at least on the eutectic soldering station.
  • the tube feeding hole of the soldering station is circumferentially arranged, the tube holder is adsorbed on the vacuum nozzle, and the nozzle moves the platform to move the tube holder adsorbed on the vacuum nozzle from the tube feeding hole.
  • the gasket is moved
  • the nozzle is fed from above to the base of the tube holder for eutectic soldering, and then the chip handling nozzle feeds the chip onto the spacer from above to perform eutectic soldering.
  • the vacuum nozzle is withdrawn, and the soldering station rotates the motor.
  • the eutectic soldering station rotates horizontally to turn another empty soldering station to the soldering station.
  • the nozzle moving platform includes a translation rail fixed to the bottom plate, and the sliding rail is horizontally slidably provided with a nozzle rotating motor fixing seat driven by a translation motor, and the nozzle rotating motor is fixed to the nozzle rotating motor. On the fixed seat.
  • the translation rail is provided with a limit cylinder that defines the position of the nozzle rotating motor mount
  • the soldering station moving platform includes an X-direction sliding table driven by an X-direction motor and capable of horizontally sliding X on the bottom plate, and a Y-direction sliding table on the X-direction sliding table.
  • the sliding Y-direction slide table is fixed to the Y-direction slide table.
  • the X-direction slide wheel is provided with an X-direction position sensor capable of detecting the X-direction slide position
  • the Y-direction slide table is provided with a Y-direction position sensor capable of detecting the Y-direction slide position.
  • the eutectic soldering station comprises a soldering station mount fixed on the driving shaft of the soldering station rotating motor, and a strip of medium heat insulating block is installed in the middle of the soldering station mounting seat, and the middle insulating block has two sides.
  • the center is symmetrically provided with a left insulating block and a right insulating block.
  • the middle insulating block and the left insulating block are supported by a left soldering station.
  • the middle insulating block and the right insulating block are supported by a right soldering station.
  • the left and right soldering stations are respectively provided with a left heating piece and a right heating piece, and the left soldering station and the right soldering station are surrounded by a soldering station protection cover, and the soldering station protection cover is respectively provided with a circumferential direction corresponding to the left soldering station and the right soldering station.
  • the tube feed hole and the upper chip feed hole are respectively provided with a left heating piece and a right heating piece, and the left soldering station and the right soldering station are surrounded by a soldering station protection cover, and the soldering station protection cover is respectively provided with a circumferential direction corresponding to the left soldering station and the right soldering station.
  • soldering station mount is also symmetrically fixed with two soldering station protective cover support rods for supporting the soldering station protective cover.
  • a soldering station support sheet is respectively disposed under the left soldering station and the right soldering station.
  • a product positioning rod extending into the side of the tube feed hole is respectively disposed under the left soldering station and the right soldering station.
  • the product positioning rod is fixed on the Z-direction positioning block, and the Z-direction positioning block is fixed on the soldering station mount through the Y-direction positioning block.
  • the present invention is provided with a rotary nozzle capable of rotating in a vertical direction and a eutectic soldering station capable of rotating in a horizontal plane, four vacuum nozzles uniformly arranged in the circumferential direction of the rotary nozzle, and at least two on the eutectic soldering table a soldering station, the rotating nozzle is such that one of the vacuum nozzles is facing the socket feeding hole of one of the soldering stations, and the other empty vacuum nozzle is vertically upward, and the rotating nozzle moves horizontally to the vacuum nozzle
  • the adsorbed tube seat is fed into the soldering station from the side, and the gasket carrying nozzle feeds the gasket from the top onto the base of the tube holder for eutectic soldering, and then the chip carrying nozzle feeds the chip into the gasket from above.
  • the sputum carrying nozzle puts the socket into the vertical upwardly facing vacuum nozzle, and the other conveying mechanism simultaneously transports the finished product of the soldering station, and finally the vacuum nozzle is horizontally exited, and the rotating nozzle is rotated
  • the other tube of the vacuum nozzle that adsorbs the tube holder is fed to the socket of the wafer holder, and the soldering station rotates the motor to drive the eutectic soldering station to rotate horizontally to rotate the other empty soldering station to the soldering position, and repeats, thereby rotating
  • the nozzle and eutectic soldering station can be synchronized Welding and cutting the welding work, improve the processing efficiency, but also with the smaller-inch device occupancy space Area.
  • FIG. 1 is a schematic structural view of an embodiment of the present invention
  • FIG. 2 is a schematic exploded view of an embodiment of the present invention.
  • a chip rotating eutectic soldering station referring to FIG. 1 and FIG. 2, includes a bottom plate 30, a bottom nozzle 30 fixed with a nozzle moving platform and a soldering station moving platform, and a suction rotating nozzle 10 disposed on the nozzle moving platform Rotating the nozzle rotating motor 7 on the vertical surface, the soldering station moving platform is provided with a soldering table rotating motor 23 for driving the eutectic soldering station to rotate horizontally, and the rotating nozzle 10 includes four vacuum nozzles 9 uniformly arranged in the circumferential direction.
  • Two soldering stations 15 and 4 are arranged on the soldering station, and the feeding holes of the soldering station are circumferentially arranged, and the tube holder 8 is adsorbed on the vacuum nozzle 9, and the moving platform of the nozzle moves to absorb the vacuum nozzle 9.
  • the socket 8 is fed into the soldering station 4 from the socket feeding hole, and the gasket carrying nozzle feeds the gasket from the upper side onto the base of the socket 8 for eutectic welding, and then the chip handling nozzle sends the chip from above.
  • the eutectic soldering is performed on the spacer, and finally the vacuum nozzle 9 is withdrawn, and the soldering station rotating motor 23 drives the eutectic soldering station to rotate horizontally to turn the other empty soldering station 15 to the soldering position.
  • the eutectic soldering station is provided with a rotary nozzle 10 that can rotate in a vertical direction and a eutectic that can rotate in a horizontal plane.
  • Soldering station four vacuum nozzles 9 uniformly arranged in the circumferential direction of the rotating nozzle 10, two soldering stations 15 and 4 are arranged on the eutectic soldering table, and the rotating nozzle 10 is used to make one of the vacuum nozzles facing one of the welding nozzles
  • the tube inlet hole of the table, the other empty vacuum nozzle is vertically upward, and the rotary nozzle 10 moves horizontally to feed the adsorbed tube seat 8 on the vacuum nozzle 9 into the soldering station 4 from the side, the pad
  • the sheet handling nozzle feeds the gasket from the top onto the base of the tube holder 8 for eutectic welding, and then the chip handling nozzle feeds the chip from the top onto the gasket for eutectic welding, and the crucible carrying nozzle places the tube holder In the
  • the tube holder feeding hole of the soldering station, the soldering table rotating motor 23 drives the eutectic soldering table to rotate horizontally, and the other empty soldering station 15 is turned to the soldering position, and the rotation is repeated, so that the rotating nozzle 10 and the eutectic soldering station can be rotated. Simultaneously carry out the work of feeding and unloading welding, which improves the processing efficiency. Place occupied area is also smaller.
  • the nozzle moving platform includes a translation rail 13 fixed to the bottom plate, and a horizontal sliding setting on the translation rail 13 There is a nozzle rotating motor mount 12 driven by the translating motor 14, and the nozzle rotating motor 7 is fixed to the nozzle rotating motor mount 12.
  • the translating rail 13 is provided with a limiting cylinder 11 defining the position of the nozzle rotating motor mount 12 .
  • the soldering station moving platform includes the X-direction motor driving 25 capable of being horizontally horizontally on the bottom plate 30.
  • the sliding X-direction slide table 29 and the Y-direction slide table 27 of the Y-direction motor drive 26 that can slide horizontally on the X-direction slide table 29, and the pad-spinning motor 23 are fixed to the Y-direction slide table 27 via the mounting block 24. on.
  • the X-direction slide table 29 is provided with an X-direction position capable of detecting the position of the X-direction slide table 29.
  • the sensor 31 and the Y-direction slide table 27 are provided with a Y-direction position sensor 28 capable of detecting the position of the Y-direction slide table 27.
  • the eutectic soldering station includes a soldering station mount fixed on the driving shaft of the soldering station rotating motor 23.
  • a soldering block 17 is installed in the middle of the soldering station mount 22, and the central insulating block 17 is symmetrically disposed with a left insulating block 21 and a right insulating block 6 on the two sides, the middle insulating block 17 and the left partition
  • the left soldering station 15 is supported on the upper side of the hot block 21, and the right soldering station 4 is supported on the upper insulating block 17 and the right insulating block 6, and the left soldering station 15 and the right soldering station 4 are respectively provided with plus
  • the hot sheet 3, the left soldering station 15 and the right soldering station 4 are surrounded by a soldering station protective cover 1, and the soldering station protective cover 1 is provided with a circumferential tube feeding hole and a top for the left soldering station 15 and the right soldering station 4, respectively. Chip feed hole.
  • soldering station mounting seat 22 is symmetrically fixed with a second soldering for supporting the soldering station protective cover 1.
  • soldering station support piece 16 is disposed under the left soldering station 15 and the right soldering station 4, respectively.
  • a soldering station shield 2 is provided.
  • the chip rotating eutectic soldering station of the present invention with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the left soldering station 15 and the right soldering station 4 are respectively provided with a feeding inlet for the socket.
  • Product positioning lever 18 on the side.
  • the chip rotating eutectic soldering station of the present invention with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the product positioning rod 18 is fixed on the Z-direction positioning block 19, and the Z-direction positioning block 19 passes through Y.
  • the positioning block 20 is fixed to the soldering station mount 22.
  • the present invention has industrial applicability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Disclosed is a rotational eutectic soldering station for chips, the soldering station comprising a base plate (30), wherein a nozzle movable platform and a soldering station movable platform are fixed on the base plate, the nozzle movable platform is provided with a nozzle rotational electric motor (7) for driving a rotational nozzle (10) to rotate on a vertical face, the soldering station movable platform is provided with a soldering station rotational electric motor (23) for driving a eutectic soldering station to rotate horizontally, the rotational nozzle comprises four vacuum nozzles (9) provided uniformly circumferentially, the eutectic soldering station is provided with at least two soldering stations, material feeding holes of a tube base of the soldering stations are provided circumferentially, and the vacuum nozzles absorb the tube base (8). The invention has the advantages of improving machining efficiency and the area occupied by the equipment being small.

Description

芯片旋转共晶焊接台 技术领域  Chip rotating eutectic soldering station
[0001] 本发明涉及 LD加工领域， 尤其是涉及一种芯片旋转共晶焊接台。  [0001] The present invention relates to the field of LD processing, and more particularly to a chip rotating eutectic soldering station.
背景技术  Background technique
[0002] LD (半导体激光器） 具有效率高、 寿命长、 光束质量好、 体积小、 重量轻、 可全固化等诸多优点， 近年得到快速发展， 并成为当今国际上激光领域最令人 关注的研究热点。 在 LD的芯片制造、 管芯 （模组） 封装和产品应用三个方面， 封装工艺和设备更接近于市场， 对产业的推动作用更为直接。 其中， 共晶焊接 技术是下一代倒装大功率 LD芯片封装工艺中最为关健的核心技术之一， 共晶焊 技术的好坏会直接影响到大功率 LD模组的发光效率、 寿命、 散热性能和终端产 品质量。 自动共晶焊工序一共有 3个零件， 分别为管座， 垫片和芯片 (尺寸长 *宽 * 高为 1.5*1.0*0.6mm)， 先将垫片通过共晶的方法焊接在底座上， 然后再将芯片通 过共晶的方法焊接在垫片， 现在的共晶焊台是通过一条生产线利用多个搬运吸 嘴和一个共晶焊台在管座上依次焊接垫片和芯片而成的， 这种工艺是通过条形 生产线将管座分次搬运到共晶焊台上， 搬运吸嘴放下管座后要再次去料盒搬运 ， 这种工艺存在加工效率低， 设备占用场所面积大的问题。  [0002] LD (semiconductor laser) has many advantages such as high efficiency, long life, good beam quality, small size, light weight, and full curing. It has been rapidly developed in recent years and has become the most interesting research in the laser field in the world. hot spot. In the three aspects of LD chip manufacturing, die (module) packaging and product application, the packaging process and equipment are closer to the market, and the promotion of the industry is more direct. Among them, eutectic soldering technology is one of the most critical core technologies in the next-generation flip-chip high-power LD chip packaging process. The quality of eutectic soldering technology will directly affect the luminous efficiency, life and heat dissipation of high-power LD modules. Performance and end product quality. The automatic eutectic welding process has a total of three parts, namely the stem, the gasket and the chip (size *width * height is 1.5*1.0*0.6mm), and the gasket is first welded to the base by eutectic method. Then the chip is soldered to the gasket by eutectic method. The current eutectic soldering station is formed by sequentially welding the gasket and the chip on the tube holder through a production line using a plurality of handling nozzles and a eutectic soldering station. This kind of process is to carry the tube seat to the eutectic soldering station in batches through the strip production line. After the handling nozzle is placed down the tube holder, it must be transported again to the material box. This process has the problems of low processing efficiency and large space occupied by the equipment. .
技术问题  technical problem
[0003] 现有技术中， 共晶焊接存在加工效率低， 设备占用场所面积大的问题。  [0003] In the prior art, eutectic soldering has a problem of low processing efficiency and large area occupied by equipment.
问题的解决方案  Problem solution
技术解决方案  Technical solution
[0004] 本发明通过以下技术措施实现的， 一种芯片旋转共晶焊接台， 包括底板， 底板 上固定有吸嘴移动平台和焊台移动平台， 吸嘴移动平台上设置有一驱动旋转吸 嘴在竖直面旋转吸嘴旋转电机， 焊台移动平台上设置有一驱动共晶焊台水平旋 转的焊台旋转电机， 旋转吸嘴包括周向均匀设置的四个真空吸嘴， 共晶焊台上 至少设置有二个焊台， 焊台的管座进料孔周向设置， 真空吸嘴上吸附有管座， 吸嘴移动平台平动将真空吸嘴上吸附的管座从管座进料孔送入焊台内， 垫片搬 运吸嘴从上方将垫片送入管座的底座上进行共晶焊接， 然后芯片搬运吸嘴从上 方将芯片送入垫片上进行共晶焊接， 最后真空吸嘴退出， 焊台旋转电机驱动共 晶焊台水平旋转使另一个空焊台转到焊接位。 [0004] The present invention is achieved by the following technical measures, a chip rotating eutectic soldering station, comprising a bottom plate, a bottom plate fixed with a nozzle moving platform and a soldering station moving platform, wherein the suction moving platform is provided with a driving rotary nozzle The vertical surface rotates the nozzle rotating motor, and the soldering station moving platform is provided with a soldering table rotating motor that drives the eutectic soldering station to rotate horizontally, and the rotating nozzle comprises four vacuum nozzles uniformly arranged in the circumferential direction, at least on the eutectic soldering station. There are two soldering stations, the tube feeding hole of the soldering station is circumferentially arranged, the tube holder is adsorbed on the vacuum nozzle, and the nozzle moves the platform to move the tube holder adsorbed on the vacuum nozzle from the tube feeding hole. Into the soldering station, the gasket is moved The nozzle is fed from above to the base of the tube holder for eutectic soldering, and then the chip handling nozzle feeds the chip onto the spacer from above to perform eutectic soldering. Finally, the vacuum nozzle is withdrawn, and the soldering station rotates the motor. The eutectic soldering station rotates horizontally to turn another empty soldering station to the soldering station.
[0005] 作为一种优选方式， 吸嘴移动平台包括固定在底板的平移轨道， 平移轨道上水 平滑动设置有由平移电机驱动的吸嘴旋转电机固定座， 吸嘴旋转电机固定在吸 嘴旋转电机固定座上。  [0005] As a preferred mode, the nozzle moving platform includes a translation rail fixed to the bottom plate, and the sliding rail is horizontally slidably provided with a nozzle rotating motor fixing seat driven by a translation motor, and the nozzle rotating motor is fixed to the nozzle rotating motor. On the fixed seat.
[0006] 作为一种优选方式， 平移轨道设置有限定吸嘴旋转电机固定座位置的限位气缸  [0006] As a preferred manner, the translation rail is provided with a limit cylinder that defines the position of the nozzle rotating motor mount
[0007] 作为一种优选方式， 焊台移动平台包括由 X向电机驱动的能在底板上 X向水平 滑动的 X向滑台以及由 Y向电机驱动的能在 X向滑台上 Y向水平滑动的 Y向滑台， 焊台旋转电机固定在 Y向滑台上。 [0007] As a preferred manner, the soldering station moving platform includes an X-direction sliding table driven by an X-direction motor and capable of horizontally sliding X on the bottom plate, and a Y-direction sliding table on the X-direction sliding table. The sliding Y-direction slide table is fixed to the Y-direction slide table.
[0008] 作为一种优选方式， X向滑台上设置有能检测 X向滑台位置的 X向位置传感器， Y向滑台上设置有能检测 Y向滑台位置的 Y向位置传感器。  [0008] As a preferred embodiment, the X-direction slide wheel is provided with an X-direction position sensor capable of detecting the X-direction slide position, and the Y-direction slide table is provided with a Y-direction position sensor capable of detecting the Y-direction slide position.
[0009] 作为一种优选方式， 共晶焊台包括固定在焊台旋转电机驱动轴上的焊台安装座 ， 焊台安装座的中间安装有一条形中隔热块， 中隔热块二侧中心对称设置有左 隔热块和右隔热块,中隔热块和左隔热块上方支撑设置有左焊台， 中隔热块和右 隔热块上方支撑设置有右焊台， 左焊台和右焊台内分别设置有左加热片和右热 片， 左焊台和右焊台由一焊台防护盖包围， 焊台防护盖对应左焊台和右焊台分 别设置有周向的管座进料孔以及上方的芯片进料孔。  [0009] As a preferred mode, the eutectic soldering station comprises a soldering station mount fixed on the driving shaft of the soldering station rotating motor, and a strip of medium heat insulating block is installed in the middle of the soldering station mounting seat, and the middle insulating block has two sides. The center is symmetrically provided with a left insulating block and a right insulating block. The middle insulating block and the left insulating block are supported by a left soldering station. The middle insulating block and the right insulating block are supported by a right soldering station. The left and right soldering stations are respectively provided with a left heating piece and a right heating piece, and the left soldering station and the right soldering station are surrounded by a soldering station protection cover, and the soldering station protection cover is respectively provided with a circumferential direction corresponding to the left soldering station and the right soldering station. The tube feed hole and the upper chip feed hole.
[0010] 作为一种优选方式， 焊台安装座上还对称固定有用于支撑焊台防护盖的二焊台 防护盖支撑杆。  [0010] As a preferred manner, the soldering station mount is also symmetrically fixed with two soldering station protective cover support rods for supporting the soldering station protective cover.
[0011] 作为一种优选方式， 左焊台和右焊台下方分别设置有焊台支撑片。  [0011] As a preferred mode, a soldering station support sheet is respectively disposed under the left soldering station and the right soldering station.
[0012] 作为一种优选方式， 左焊台和右焊台下方分别设置有伸入管座进料孔边的产品 定位杆。  [0012] As a preferred mode, a product positioning rod extending into the side of the tube feed hole is respectively disposed under the left soldering station and the right soldering station.
[0013] 作为一种优选方式， 产品定位杆固定在 Z向定位块上， Z向定位块通过 Y向定位 块固定在焊台安装座上。  [0013] As a preferred mode, the product positioning rod is fixed on the Z-direction positioning block, and the Z-direction positioning block is fixed on the soldering station mount through the Y-direction positioning block.
发明的有益效果  Advantageous effects of the invention
有益效果 [0014] 本发明设置有能竖直方向旋转的旋转吸嘴以及能在水平面旋转的共晶焊台， 旋 转吸嘴周向均匀设置的四个真空吸嘴， 共晶焊台上设置有至少二个焊台， 旋转 吸嘴使其中一个真空吸嘴的正对其中一个焊台的管座进料孔， 此吋另一个空的 真空吸嘴竖直朝上， 旋转吸嘴水平移动将真空吸嘴上的吸附的管座从侧面送入 焊台内， 垫片搬运吸嘴从上方将垫片送入管座的底座上进行共晶焊接， 然后芯 片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接， 此吋搬运吸嘴将管座放入 竖直朝上的真空吸嘴内， 另一搬运机构同吋将焊台的成品搬幵， 最后真空吸嘴 水平退出， 旋转旋转吸嘴使另一个吸附有管座的真空吸嘴的正对焊台的管座进 料孔， 焊台旋转电机驱动共晶焊台水平旋转使另一个空焊台转到焊接位， 反复 进行， 从而旋转吸嘴和共晶焊台可同步进行上料焊接和下料焊接的工作， 提高 了加工效率， 同吋设备占用场所面积也更小。 Beneficial effect [0014] The present invention is provided with a rotary nozzle capable of rotating in a vertical direction and a eutectic soldering station capable of rotating in a horizontal plane, four vacuum nozzles uniformly arranged in the circumferential direction of the rotary nozzle, and at least two on the eutectic soldering table a soldering station, the rotating nozzle is such that one of the vacuum nozzles is facing the socket feeding hole of one of the soldering stations, and the other empty vacuum nozzle is vertically upward, and the rotating nozzle moves horizontally to the vacuum nozzle The adsorbed tube seat is fed into the soldering station from the side, and the gasket carrying nozzle feeds the gasket from the top onto the base of the tube holder for eutectic soldering, and then the chip carrying nozzle feeds the chip into the gasket from above. For eutectic welding, the sputum carrying nozzle puts the socket into the vertical upwardly facing vacuum nozzle, and the other conveying mechanism simultaneously transports the finished product of the soldering station, and finally the vacuum nozzle is horizontally exited, and the rotating nozzle is rotated The other tube of the vacuum nozzle that adsorbs the tube holder is fed to the socket of the wafer holder, and the soldering station rotates the motor to drive the eutectic soldering station to rotate horizontally to rotate the other empty soldering station to the soldering position, and repeats, thereby rotating The nozzle and eutectic soldering station can be synchronized Welding and cutting the welding work, improve the processing efficiency, but also with the smaller-inch device occupancy space Area.
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0015] 图 1为本发明实施例的结构示意图；  1 is a schematic structural view of an embodiment of the present invention;
[0016] 图 2为本发明实施例的分解结构示意图。 2 is a schematic exploded view of an embodiment of the present invention.
本发明的实施方式 Embodiments of the invention
[0017] 下面结合实施例并对照附图对本发明作进一步详细说明。 [0017] The present invention will be further described in detail below with reference to the embodiments and with reference to the accompanying drawings.
[0018] 一种芯片旋转共晶焊接台， 参考图 1和图 2， 包括底板 30， 底板 30上固定有吸嘴 移动平台和焊台移动平台， 吸嘴移动平台上设置有一驱动旋转吸嘴 10在竖直面 旋转吸嘴旋转电机 7， 焊台移动平台上设置有一驱动共晶焊台水平旋转的焊台旋 转电机 23， 旋转吸嘴 10包括周向均匀设置的四个真空吸嘴 9， 共晶焊台上设置有 二个焊台15、 4， 焊台的管座进料孔周向设置， 真空吸嘴 9上吸附有管座 8， 吸嘴 移动平台平动将真空吸嘴 9上吸附的管座 8从管座进料孔送入焊台 4内， 垫片搬运 吸嘴从上方将垫片送入管座 8的底座上进行共晶焊接， 然后芯片搬运吸嘴从上方 将芯片送入垫片上进行共晶焊接， 最后真空吸嘴 9退出， 焊台旋转电机 23驱动共 晶焊台水平旋转使另一个空焊台 15转到焊接位。 [0018] A chip rotating eutectic soldering station, referring to FIG. 1 and FIG. 2, includes a bottom plate 30, a bottom nozzle 30 fixed with a nozzle moving platform and a soldering station moving platform, and a suction rotating nozzle 10 disposed on the nozzle moving platform Rotating the nozzle rotating motor 7 on the vertical surface, the soldering station moving platform is provided with a soldering table rotating motor 23 for driving the eutectic soldering station to rotate horizontally, and the rotating nozzle 10 includes four vacuum nozzles 9 uniformly arranged in the circumferential direction. Two soldering stations 15 and 4 are arranged on the soldering station, and the feeding holes of the soldering station are circumferentially arranged, and the tube holder 8 is adsorbed on the vacuum nozzle 9, and the moving platform of the nozzle moves to absorb the vacuum nozzle 9. The socket 8 is fed into the soldering station 4 from the socket feeding hole, and the gasket carrying nozzle feeds the gasket from the upper side onto the base of the socket 8 for eutectic welding, and then the chip handling nozzle sends the chip from above. The eutectic soldering is performed on the spacer, and finally the vacuum nozzle 9 is withdrawn, and the soldering station rotating motor 23 drives the eutectic soldering station to rotate horizontally to turn the other empty soldering station 15 to the soldering position.
[0019] 本共晶焊接台设置有能竖直方向旋转的旋转吸嘴 10以及能在水平面旋转的共晶 焊台， 旋转吸嘴 10周向均匀设置的四个真空吸嘴 9， 共晶焊台上设置有二个焊台 15、 4， 旋转吸嘴 10使其中一个真空吸嘴的正对其中一个焊台的管座进料孔， 此 吋另一个空的真空吸嘴竖直朝上， 旋转吸嘴 10水平移动将真空吸嘴 9上的吸附的 管座 8从侧面送入焊台 4内， 垫片搬运吸嘴从上方将垫片送入管座 8的底座上进行 共晶焊接， 然后芯片搬运吸嘴从上方将芯片送入垫片上进行共晶焊接， 此吋搬 运吸嘴将管座放入竖直朝上的真空吸嘴内， 另一搬运机构同吋将焊台 15的成品 搬幵， 最后真空吸嘴 9水平退出， 旋转旋转吸嘴 10使另一个吸附有管座的真空吸 嘴的正对焊台的管座进料孔， 焊台旋转电机 23驱动共晶焊台水平旋转使另一个 空焊台 15转到焊接位， 反复进行， 从而旋转吸嘴 10和共晶焊台可同步进行上料 焊接和下料焊接的工作， 提高了加工效率， 同吋设备占用场所面积也更小。 [0019] The eutectic soldering station is provided with a rotary nozzle 10 that can rotate in a vertical direction and a eutectic that can rotate in a horizontal plane. Soldering station, four vacuum nozzles 9 uniformly arranged in the circumferential direction of the rotating nozzle 10, two soldering stations 15 and 4 are arranged on the eutectic soldering table, and the rotating nozzle 10 is used to make one of the vacuum nozzles facing one of the welding nozzles The tube inlet hole of the table, the other empty vacuum nozzle is vertically upward, and the rotary nozzle 10 moves horizontally to feed the adsorbed tube seat 8 on the vacuum nozzle 9 into the soldering station 4 from the side, the pad The sheet handling nozzle feeds the gasket from the top onto the base of the tube holder 8 for eutectic welding, and then the chip handling nozzle feeds the chip from the top onto the gasket for eutectic welding, and the crucible carrying nozzle places the tube holder In the vacuum nozzle that is vertically upward, the other transport mechanism simultaneously transports the finished product of the soldering station 15, and finally the vacuum nozzle 9 is horizontally withdrawn, and the rotary nozzle 10 is rotated to make another vacuum nozzle that adsorbs the stem. The tube holder feeding hole of the soldering station, the soldering table rotating motor 23 drives the eutectic soldering table to rotate horizontally, and the other empty soldering station 15 is turned to the soldering position, and the rotation is repeated, so that the rotating nozzle 10 and the eutectic soldering station can be rotated. Simultaneously carry out the work of feeding and unloading welding, which improves the processing efficiency. Place occupied area is also smaller.
[0020] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 吸嘴移动平台包括固定在底板的平移轨道 13， 平移轨道 13上水平滑动设置 有由平移电机 14驱动的吸嘴旋转电机固定座 12， 吸嘴旋转电机 7固定在吸嘴旋转 电机固定座 12上。 [0020] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, based on the foregoing technical solutions, specifically, the nozzle moving platform includes a translation rail 13 fixed to the bottom plate, and a horizontal sliding setting on the translation rail 13 There is a nozzle rotating motor mount 12 driven by the translating motor 14, and the nozzle rotating motor 7 is fixed to the nozzle rotating motor mount 12.
[0021] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 平移轨道 13—设置有限定吸嘴旋转电机固定座 12位置的限位气缸 11。  [0021] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the translating rail 13 is provided with a limiting cylinder 11 defining the position of the nozzle rotating motor mount 12 .
[0022] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 焊台移动平台包括由 X向电机驱动 25的能在底板 30上 X向水平滑动的 X向滑 台 29以及由 Y向电机驱动 26的能在 X向滑台 29上 Y向水平滑动的 Y向滑台 27， 焊台 旋转电机 23通过安装块 24固定在 Y向滑台 27上。  [0022] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the soldering station moving platform includes the X-direction motor driving 25 capable of being horizontally horizontally on the bottom plate 30. The sliding X-direction slide table 29 and the Y-direction slide table 27 of the Y-direction motor drive 26 that can slide horizontally on the X-direction slide table 29, and the pad-spinning motor 23 are fixed to the Y-direction slide table 27 via the mounting block 24. on.
[0023] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， X向滑台 29上设置有能检测 X向滑台 29位置的 X向位置传感器 31， Y向滑台 27 上设置有能检测 Y向滑台 27位置的 Y向位置传感器 28。  [0023] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, specifically on the basis of the foregoing technical solution, the X-direction slide table 29 is provided with an X-direction position capable of detecting the position of the X-direction slide table 29. The sensor 31 and the Y-direction slide table 27 are provided with a Y-direction position sensor 28 capable of detecting the position of the Y-direction slide table 27.
[0024] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 共晶焊台包括固定在焊台旋转电机 23驱动轴上的焊台安装座 22， 焊台安装 座 22的中间安装有一条形中隔热块 17， 中隔热块 17二侧中心对称设置有左隔热 块 21和右隔热块 6,中隔热块 17和左隔热块 21上方支撑设置有左焊台 15， 中隔热 块 17和右隔热块 6上方支撑设置有右焊台 4， 左焊台 15和右焊台 4内分别设置有加 热片 3， 左焊台 15和右焊台 4由一焊台防护盖 1包围， 焊台防护盖 1对应左焊台 15 和右焊台 4分别设置有周向的管座进料孔以及上方的芯片进料孔。 [0024] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, based on the foregoing technical solution, specifically, the eutectic soldering station includes a soldering station mount fixed on the driving shaft of the soldering station rotating motor 23. 22, a soldering block 17 is installed in the middle of the soldering station mount 22, and the central insulating block 17 is symmetrically disposed with a left insulating block 21 and a right insulating block 6 on the two sides, the middle insulating block 17 and the left partition The left soldering station 15 is supported on the upper side of the hot block 21, and the right soldering station 4 is supported on the upper insulating block 17 and the right insulating block 6, and the left soldering station 15 and the right soldering station 4 are respectively provided with plus The hot sheet 3, the left soldering station 15 and the right soldering station 4 are surrounded by a soldering station protective cover 1, and the soldering station protective cover 1 is provided with a circumferential tube feeding hole and a top for the left soldering station 15 and the right soldering station 4, respectively. Chip feed hole.
[0025] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 焊台安装座 22上还对称固定有用于支撑焊台防护盖 1的二焊台防护盖支撑杆 5。 [0025] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the soldering station mounting seat 22 is symmetrically fixed with a second soldering for supporting the soldering station protective cover 1. The table cover support rod 5.
[0026] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 左焊台 15和右焊台 4下方分别设置有焊台支撑片 16， 上方设置有焊台防护框 2。  [0026] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, a soldering station support piece 16 is disposed under the left soldering station 15 and the right soldering station 4, respectively. A soldering station shield 2 is provided.
[0027] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 左焊台 15和右焊台 4下方分别设置有伸入管座进料孔边的产品定位杆 18。  [0027] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the left soldering station 15 and the right soldering station 4 are respectively provided with a feeding inlet for the socket. Product positioning lever 18 on the side.
[0028] 本发明的芯片旋转共晶焊接台， 参考图 1和图 2， 在前面技术方案的基础上具体 是， 产品定位杆 18固定在 Z向定位块 19上， Z向定位块 19通过 Y向定位块 20固定在 焊台安装座 22上。  [0028] The chip rotating eutectic soldering station of the present invention, with reference to FIG. 1 and FIG. 2, on the basis of the foregoing technical solutions, specifically, the product positioning rod 18 is fixed on the Z-direction positioning block 19, and the Z-direction positioning block 19 passes through Y. The positioning block 20 is fixed to the soldering station mount 22.
[0029] 以上是对本发明芯片旋转共晶焊接台进行了阐述， 用于帮助理解本发明， 但本 发明的实施方式并不受上述实施例的限制， 任何未背离本发明原理下所作的改 变、 修饰、 替代、 组合、 简化， 均应为等效的置换方式， 都包含在本发明的保 护范围之内。  [0029] The above is a description of the chip rotating eutectic soldering station of the present invention to help understand the present invention, but the embodiments of the present invention are not limited by the above embodiments, and any changes that do not depart from the principles of the present invention, Modifications, substitutions, combinations, simplifications, and equivalent substitutions are all included in the scope of the present invention.
工业实用性  Industrial applicability
[0030] 本发明具有工业实用性。  [0030] The present invention has industrial applicability.

Claims

权利要求书 Claim
一种芯片旋转共晶焊接台， 其特征在于： 包括底板， 所述底板上固定 有吸嘴移动平台和焊台移动平台， 所述吸嘴移动平台上设置有一驱动 旋转吸嘴在竖直面旋转吸嘴旋转电机， 所述焊台移动平台上设置有一 驱动共晶焊台水平旋转的焊台旋转电机， 所述旋转吸嘴包括周向均匀 设置的四个真空吸嘴， 所述共晶焊台上至少设置有二个焊台， 所述焊 台的管座进料孔周向设置， 所述真空吸嘴上吸附有管座， 所述吸嘴移 动平台平动将真空吸嘴上吸附的管座从管座进料孔送入焊台内， 垫片 搬运吸嘴从上方将垫片送入管座的底座上进行共晶焊接， 然后芯片搬 运吸嘴从上方将芯片送入垫片上进行共晶焊接， 最后真空吸嘴退出， 焊台旋转电机驱动共晶焊台水平旋转使另一个空焊台转到焊接位。 根据权利要求 1所述芯片旋转共晶焊接台， 其特征在于： 所述吸嘴移 动平台包括固定在底板的平移轨道， 所述平移轨道上水平滑动设置有 由平移电机驱动的吸嘴旋转电机固定座， 所述吸嘴旋转电机固定在吸 嘴旋转电机固定座上。 A chip rotating eutectic soldering station, comprising: a bottom plate on which a nozzle moving platform and a soldering station moving platform are fixed, wherein the nozzle moving platform is provided with a driving rotary nozzle rotating on a vertical surface a nozzle rotating motor, wherein the soldering station moving platform is provided with a soldering table rotating motor for driving horizontal rotation of the eutectic soldering station, wherein the rotating nozzle comprises four vacuum nozzles uniformly arranged in a circumferential direction, and the eutectic soldering station At least two soldering stations are disposed on the bottom of the soldering station, the tube feeding hole is circumferentially disposed, the tube is adsorbed on the vacuum nozzle, and the nozzle moves the platform to move the tube adsorbed on the vacuum nozzle The seat is fed into the soldering station from the socket feeding hole, and the gasket conveying nozzle feeds the gasket from the upper side onto the base of the tube base for eutectic welding, and then the chip carrying nozzle feeds the chip onto the gasket from above. The eutectic soldering, and finally the vacuum nozzle exits, the soldering station rotating motor drives the eutectic soldering station horizontally to rotate the other empty soldering station to the soldering station. The chip rotating eutectic soldering station according to claim 1, wherein: the nozzle moving platform comprises a translation rail fixed to the bottom plate, and the sliding rail is horizontally slid and fixed by a nozzle rotating motor driven by a translation motor. The nozzle rotating motor is fixed on the nozzle rotating motor fixing seat.
根据权利要求 2所述芯片旋转共晶焊接台， 其特征在于： 所述平移轨 道设置有限定吸嘴旋转电机固定座位置的限位气缸。 A chip rotating eutectic soldering station according to claim 2, wherein: said translating track is provided with a limit cylinder defining a position of the nozzle rotating motor mount.
根据权利要求 1所述芯片旋转共晶焊接台， 其特征在于： 所述焊台移 动平台包括由 X向电机驱动的能在底板上 X向水平滑动的 X向滑台以 及由 Y向电机驱动的能在 X向滑台上 Y向水平滑动的 Y向滑台， 所述焊 台旋转电机固定在 Y向滑台上。 A chip rotating eutectic soldering station according to claim 1, wherein: said soldering station moving platform comprises an X-direction sliding table driven by an X-direction motor and capable of horizontally sliding X on the bottom plate and driven by a Y-direction motor. A Y-direction slide that can slide horizontally on the X-direction slide table, and the soldering table rotating motor is fixed to the Y-direction slide table.
根据权利要求 4所述芯片旋转共晶焊接台， 其特征在于： 所述 X向滑 台上设置有能检测 X向滑台位置的 X向位置传感器， 所述 Y向滑台上 设置有能检测 Y向滑台位置的 Y向位置传感器。 The chip rotating eutectic soldering station according to claim 4, wherein: the X-direction slide is provided with an X-direction position sensor capable of detecting the position of the X-direction slide, and the Y-direction slide is provided with a detectable Y-direction position sensor for Y-slide position.
根据权利要求 1所述芯片旋转共晶焊接台， 其特征在于： 所述共晶焊 台包括固定在焊台旋转电机驱动轴上的焊台安装座， 所述焊台安装座 的中间安装有一条形中隔热块， 所述中隔热块二侧中心对称设置有左 隔热块和右隔热块,所述中隔热块和左隔热块上方支撑设置有左焊台 ， 所述中隔热块和右隔热块上方支撑设置有右焊台， 所述左焊台和右 焊台内分别设置有左加热片和右热片， 所述左焊台和右焊台由一焊台 防护盖包围， 所述焊台防护盖对应左焊台和右焊台分别设置有周向的 管座进料孔以及上方的芯片进料孔。 The chip rotating eutectic soldering station according to claim 1, wherein: the eutectic soldering station comprises a soldering station mount fixed on a driving shaft of the soldering station rotating motor, and a soldering station mount has a middle portion mounted thereon In the shape of the heat insulating block, the center of the middle insulating block is symmetrically disposed with a left insulating block and a right insulating block, and the middle insulating block and the left insulating block are supported with a left soldering station a right soldering station is disposed above the middle insulating block and the right insulating block, and a left heating piece and a right heating piece are respectively disposed in the left soldering station and the right soldering station, and the left soldering station and the right soldering station are respectively disposed Surrounded by a soldering station protective cover, the soldering station protective cover is respectively provided with a circumferential tube feeding hole and an upper chip feeding hole corresponding to the left soldering station and the right soldering station.
[权利要求 7] 根据权利要求 6所述芯片旋转共晶焊接台， 其特征在于： 所述焊台安 装座上还对称固定有用于支撑焊台防护盖的二焊台防护盖支撑杆。 [Claim 7] The chip rotating eutectic soldering station according to claim 6, wherein: the soldering station mounting seat is symmetrically fixed with two soldering station protective cover supporting rods for supporting the soldering station protective cover.
[权利要求 8] 根据权利要求 6所述芯片旋转共晶焊接台， 其特征在于： 所述左焊台 和右焊台下方分别设置有焊台支撑片。 [Claim 8] The chip rotating eutectic soldering station according to claim 6, wherein a soldering station supporting sheet is respectively disposed under the left soldering station and the right soldering station.
[权利要求 9] 根据权利要求 6所述芯片旋转共晶焊接台， 其特征在于： 所述左焊台 和右焊台下方分别设置有伸入管座进料孔边的产品定位杆。 [Claim 9] The chip rotating eutectic soldering station according to claim 6, wherein: the product positioning rods extending into the inlet holes of the tube holder are respectively disposed under the left soldering station and the right soldering station.
[权利要求 10] 根据权利要求 9所述芯片旋转共晶焊接台， 其特征在于： 所述产品定 位杆固定在 Z向定位块上， 所述 Z向定位块通过 Y向定位块固定在焊台 安装座上。 [Claim 10] The chip rotating eutectic soldering station according to claim 9, wherein: the product positioning rod is fixed on the Z-direction positioning block, and the Z-direction positioning block is fixed on the soldering station by the Y-direction positioning block. On the mount.
PCT/CN2017/106399 2017-06-02 2017-10-17 Rotational eutectic soldering station for chips WO2018218849A1 (en)

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CN116013805A (en) * 2022-04-02 2023-04-25 佑光智能半导体科技(深圳)有限公司 Eutectic machine
CN116013805B (en) * 2022-04-02 2023-11-21 佑光智能半导体科技(深圳)有限公司 Eutectic machine
CN114799389B (en) * 2022-04-26 2023-12-22 浙江雅晶电子有限公司 TO tube seat eutectic welding machine
CN114799389A (en) * 2022-04-26 2022-07-29 浙江雅晶电子有限公司 TO tube seat eutectic bonding machine
CN115831828A (en) * 2023-02-15 2023-03-21 山东睿芯半导体科技有限公司 Curing and packaging equipment for chip

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CN107424951A (en) 2017-12-01
KR20190002451A (en) 2019-01-08
JP2019521504A (en) 2019-07-25
JP6638090B2 (en) 2020-01-29
CN107424951B (en) 2023-08-18
KR102165651B1 (en) 2020-10-14

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