CN112614804B - Heating sucking disc subassembly and chip splicing apparatus - Google Patents
Heating sucking disc subassembly and chip splicing apparatus Download PDFInfo
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- CN112614804B CN112614804B CN202011381251.0A CN202011381251A CN112614804B CN 112614804 B CN112614804 B CN 112614804B CN 202011381251 A CN202011381251 A CN 202011381251A CN 112614804 B CN112614804 B CN 112614804B
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 132
- 238000001179 sorption measurement Methods 0.000 claims abstract description 49
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 238000009434 installation Methods 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 10
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of chip processing devices, in particular to a heating sucker assembly and a chip splicing device. The heating sucker assembly comprises a chassis, a heating piece and an adsorption table; the chassis is provided with a mounting space for mounting the heating element, and the adsorption table is arranged above the heating element; the adsorption table is used for adsorbing a workpiece to be processed, and the heating piece is used for transferring heat to the workpiece to be processed through the adsorption table. The application is provided with the heating element and the adsorption table, the adsorption table is used for adsorbing the workpiece to be processed on the adsorption table to realize the fixing effect of the workpiece to be processed, then the heating element is electrified to heat the resistance wire inside the heating element, and the heat passes through the adsorption table and is transferred to the adhesive connected with other parts to be processed, so that the curing time of the adhesive is shortened, and the working efficiency is improved.
Description
Technical Field
The application relates to the technical field of chip processing devices, in particular to a heating sucker assembly and a chip splicing device.
Background
Most of the existing splicing of chip substrates adopts manual operation and utilizes an adhesive to finish the splicing, however, the existing splicing mode is complex in manual splicing operation and inconvenient in one aspect; on the other hand, the adhesive used requires a longer curing time, which reduces the working efficiency.
Therefore, there is a need for a heating chuck assembly and a chip bonding apparatus that solve the above-mentioned problems to some extent.
Disclosure of Invention
The first object of the present application is to provide a heating chuck assembly, which solves the technical problems of long curing time and low working efficiency when an adhesive is used to a certain extent.
The second object of the present application is to provide a chip splicing apparatus, which solves the technical problem of complex operation caused by manual splicing.
The application provides a heating sucker assembly, which comprises a chassis, a heating piece and an adsorption table;
The chassis is provided with an installation space, the heating element is installed in the chassis, and the adsorption table is arranged above the heating element;
the adsorption table is used for adsorbing a workpiece to be processed, and the heating piece is used for transferring heat to the workpiece to be processed.
In the above technical solution, the heat insulation device further comprises a first heat insulation member, wherein the first heat insulation member is arranged between the bottom wall of the chassis and the heating member;
the side wall of the chassis is provided with a limiting hole, the edge of the first heat insulating piece extends outwards to form a limiting block, and the limiting block is matched with the limiting hole so that the first heat insulating piece is embedded in the installation space.
In the above technical scheme, further, the device further comprises a second heat insulation member, wherein the second heat insulation member is ring-shaped and is arranged between the heating member and the adsorption table.
The application also provides a chip splicing device which is used for splicing the chip onto the base plate and comprises the heating sucker assembly, the first driving assembly and the second driving assembly;
The second driving component is arranged on the first driving component, and the heating sucker component is arranged on the second driving component;
The first driving component can drive the second driving component and the heating sucker component to reciprocate along a first direction and/or a second direction; the second driving assembly can drive the heating sucker assembly to reciprocate along the first direction and/or the second direction;
The base plate is arranged above the heating sucker assembly, the second driving assembly can also drive the heating sucker assembly to reciprocate along a third direction, so that the heating sucker assembly can move towards the base plate and penetrate through the base plate, the heating sucker assembly penetrating through the base plate is used for placing the chip, and the chip is connected with the base plate by using an adhesive;
the heating chuck assembly is used for heating the adhesive to bond the chip to the base plate.
In the above technical solution, further, the first driving assembly includes a first guide rail, a first slider, a second guide rail, a second slider, and a first driving motor;
The first guide rail extends along the first direction, and the second guide rail is arranged on the first sliding block and extends along the second direction; the first sliding block is arranged on the first guide rail in a sliding manner, and the second sliding block is arranged on the second guide rail in a sliding manner; the second driving component is arranged on the second sliding block;
The driving end of the first driving motor is respectively connected with the first sliding block and the second sliding block, so that the second driving assembly and the heating sucker assembly reciprocate along the first direction and/or the second direction.
In the above technical solution, further, the second driving assembly includes a support frame, a sliding portion, a bearing portion, a second driving motor, a screw, a support portion, a moving portion, and a third driving motor, which are disposed on the second slider;
The inner side wall of the supporting frame is provided with a third guide rail extending along the third direction, the sliding part is arranged on the third guide rail in a sliding way, the sliding part is fixedly connected with the moving part, the moving part is sleeved on the lead screw, and the second driving motor can drive the lead screw to rotate so as to enable the moving part and the sliding part to reciprocate along the third direction;
The bearing part is arranged at the top of the sliding part, a fourth guide rail is formed on the bearing part in an extending mode along the first direction, and a fourth sliding block is arranged on the fourth guide rail in a sliding mode; a fifth guide rail is formed on the fourth sliding block in an extending manner along the second direction, the supporting part is arranged on the fifth guide rail in a sliding manner, and the heating sucker assembly is arranged on the supporting part;
The driving end of the third driving motor is respectively connected with the fourth sliding block and the supporting part, so that the fourth sliding block moves back and forth along the first direction and the supporting part moves back and forth along the second direction.
In the above technical scheme, the device further comprises an angle adjusting assembly and an angle adjusting assembly, wherein the angle adjusting assembly comprises a rotating table arranged on the supporting part and a rotating motor connected with the rotating table;
the heating sucker assembly is arranged on the rotating table;
The edge of the supporting part is provided with an annular track, the rotating table is provided with a ninth sliding block towards the side of the supporting part, and the ninth sliding block is matched with the annular track;
The rotating motor drives the rotating table to rotate along the annular track, so that the heating sucker assembly rotates along the annular track.
In the technical scheme, the device further comprises a base, a calibration assembly and a dial, wherein the calibration assembly and the dial are arranged on the base;
The first driving assembly and the second driving assembly are arranged on the base, and the calibration assembly is arranged above the angle adjusting assembly in a erecting mode; the dial is arranged on the bearing part through a connecting piece, the dial and the adsorption table are positioned on the same plane, and the dial is used for determining a coordinate system of the first driving assembly;
The calibration assembly comprises a microscope, a seventh guide rail and a seventh sliding block;
the seventh guide rail is arranged at two sides of the length direction of the first guide rail and extends along the second direction; the seventh sliding block is arranged on the seventh guide rail in a sliding manner and can extend along the third direction; the upper parts of the two seventh sliding blocks are connected through an eighth guide rail, and the microscope is arranged on the eighth guide rail in a sliding way along the first direction through the eighth sliding blocks;
Driving the microscope to move in the first direction and/or the second direction so that the microscope is positioned right above the dial plate, and the coordinate system of the calibration assembly is overlapped with the coordinate system of the second driving motor;
When the second driving assembly drives the heating sucker assembly to move along the third party and pass through the base plate, the chip is manually placed, and the position of the chip is adjusted through the microscope and by utilizing the angle adjusting assembly so that a first marking point on the chip is overlapped with a second marking point on the base plate.
In the above technical solution, the vehicle further includes an auxiliary driving assembly, where the auxiliary driving assembly is arranged at intervals from the first driving assembly along the second direction;
the auxiliary driving assembly comprises a sixth guide rail and a sixth sliding block arranged on the sixth guide rail; and two ends of the second guide rail are respectively arranged on the first guide rail and the sixth guide rail.
In the above technical solution, further, a protrusion is formed on the adsorption table and extends along the third direction, and a through hole is formed on the base plate;
The protrusion is capable of passing through the through hole when the second driving assembly drives the heating chuck assembly to move in the third direction.
Compared with the prior art, the application has the beneficial effects that:
The application provides a heating sucker assembly, which comprises a chassis, a heating piece and an adsorption table; the chassis is provided with an installation space, the heating element is installed in the installation space, and the adsorption table is arranged above the heating element; the adsorption table is used for adsorbing a workpiece to be processed, and the heating piece is used for transferring heat to the workpiece to be processed.
Specifically, considering that the to-be-machined piece and other parts are often required to be bonded together by using an adhesive, in order to shorten the curing time of the adhesive and improve the working efficiency, the application is provided with the heating piece and the adsorption table, the to-be-machined piece is firstly adsorbed on the adsorption table by using the adsorption table to realize the fixing effect of the to-be-machined piece, then the heating piece is electrified to enable the resistance wire in the heating piece to generate heat, and the heat passes through the adsorption table and is transmitted to the to-be-machined piece and then is transmitted to the adhesive connected with the to-be-machined piece and other parts, so that the curing time of the adhesive is shortened, and the splicing efficiency of the to-be-machined piece and the other parts is improved.
The application also provides a chip splicing device which is used for splicing the chip onto the base plate; the heating sucker assembly comprises the heating sucker assembly, a first driving assembly and a second driving assembly;
The second driving component is arranged on the first driving component, and the heating sucker component is arranged on the second driving component;
The first driving component can drive the second driving component and the heating sucker component to reciprocate along a first direction and/or a second direction; the second driving assembly can drive the heating sucker assembly to reciprocate along the first direction and/or the second direction;
The base plate is arranged above the heating sucker assembly, the second driving assembly can also drive the heating sucker assembly to reciprocate along a third direction, so that the heating sucker assembly can move towards the base plate and penetrate through the base plate, the heating sucker assembly penetrating through the base plate is used for placing the chip, and the chip is connected with the base plate by using an adhesive;
the heating chuck assembly is used for heating the adhesive to bond the chip to the base plate.
Specifically, the first driving assembly is used for driving the chip to perform large-stroke movement, the second driving assembly is used for adjusting the chip to perform small-stroke movement, the base plate is arranged above the heating sucker assembly, and in the actual use process, step 100: driving the second driving assembly and the heating sucker assembly to reciprocate along the first direction and/or the second direction by using the first driving assembly, so that the heating sucker assembly is positioned below the through hole of the base plate; step 200: driving the heating chuck assembly to pass through the through hole in a third direction by using the second driving assembly; step 300: placing a chip on the adsorption table, smearing an adhesive on a base plate, and driving the heating sucker assembly and the chip to move downwards along the third direction by using the second driving assembly again so that the chip is adhered on the base plate; step 400: heating the adhesive by using a heating element to accelerate the curing time of the adhesive; the whole operation process is simple and directional, and the working efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of a heating chuck assembly provided in a first embodiment of the present application;
FIG. 2 is a schematic view of the overall structure of a heating chuck assembly according to a first embodiment of the present application;
Fig. 3 is a schematic overall structure of a chip splicing device according to a second embodiment of the present application;
fig. 4 is a schematic structural diagram of a first driving component and an auxiliary driving component in the chip splicing device according to the second embodiment of the present application;
Fig. 5 is a schematic structural diagram of a second driving assembly and an angle adjusting assembly in a chip splicing device according to a second embodiment of the present application under a first viewing angle;
fig. 6 is a schematic structural diagram of a second driving assembly and an angle adjusting assembly in a chip splicing device according to a second embodiment of the present application;
Fig. 7 is an exploded view of a heating chuck assembly in a chip bonding apparatus according to a second embodiment of the present application.
In the figure: 100-chassis; 101-installation space; 102-heating element; 103-an adsorption stage; 104-a first insulation; 105-limiting holes; 106-limiting blocks; 107-base plate; 108-a first drive assembly; 109-a second drive assembly; 110-a first direction; 111-second direction; 112-third direction; 113-a first rail; 114-a first slider; 115-a second rail; 116-a second slider; 117-a support frame; 118-a slide; 119-a support; 120-an angle adjustment assembly; 121-a motion part; 122-a calibration component; 123-a base; 124-dial; 125-microscope; 126-seventh rail; 127-seventh slider; 128-eighth rail; 129-auxiliary drive assembly; 130-sixth rail; 131-sixth slider; 132-protrusions; 133-a second insulation; 134-eighth slider; 135-screw rod; 136-a second drive motor; 137-heating the chuck assembly.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the application are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Example 1
Referring to fig. 1 and 2, the present application provides a heating chuck assembly 137, which includes a chassis 100, a heating member 102, and an adsorption stage 103; the chassis 100 is formed with an installation space 101, and preferably, the chassis 100 has a cylindrical structure; preferably, the installation space 101 is also of cylindrical structure. The installation space 101 is used for installing the heating element 102, preferably, the heating element 102 is a heating disc, and a resistance wire is arranged in the heating disc and is connected with a power supply, so that the resistance wire is electrified to generate heat. The adsorption table 103 is disposed above the heating element 102, the adsorption table 103 is used for adsorbing a workpiece to be processed, the adsorption table 103 has various forms, the material of the adsorption table 103 may be a magnet for adsorbing the workpiece to be processed, and considering that the workpiece to be processed is a chip in the present application, preferably, the adsorption table 103 adsorbs the chip in a vacuum adsorption manner, for example, a vacuum chuck is formed on the adsorption table 103, so as to realize vacuum adsorption on the chip.
Specifically, in view of the fact that it is often necessary to bond a workpiece to be machined with other components by using an adhesive, in order to shorten the curing time of the adhesive and improve the working efficiency, the application is provided with the heating element 102 and the adsorption table 103, wherein the workpiece to be machined is firstly adsorbed on the adsorption table 103 by using the adsorption table 103, the fixing effect of the workpiece to be machined is realized, then the heating element 102 is electrified to heat the resistance wire inside the heating element, and the heat is transmitted to the adhesive connected with the other components through the adsorption table 103, so that the curing time of the adhesive is shortened, and the working efficiency is improved.
More specifically, the heating element 102 and the adsorption stage 103 are detachably connected, that is, when the heating element 102 is not needed, the heating element 102 can be detached from the chassis 100; in addition, the adsorption stage 103 may be made in a variety of exchangeable configurations, i.e. a large size of the adsorption stage 103 may be selected when adsorbing larger workpieces to be processed.
In this embodiment, when the heating member 102 is energized and generates heat, in order to prevent the chassis 100 from being deformed due to excessive heat or to prevent the structure for supporting the chassis 100 from being deformed due to excessive heat, the heating chuck assembly 137 further includes a first heat insulating member 104, and the first heat insulating member 104 is disposed in the installation space 101 and between the bottom wall of the chassis 100 and the heating member 102, that is, the heat is prevented from being transferred toward the chassis 100 side by the first heat insulating member 104, thereby preventing the thermal deformation of the chassis 100.
Specifically, considering that the heat insulating member may be displaced due to vibration or other factors, in order to prevent the heat insulating member from being displaced and losing the heat insulating effect, in this embodiment, a limiting hole 105 is formed in a side wall of the chassis 100, a limiting block 106 is formed by extending an edge of the first heat insulating member 104 outwards, and the limiting block 106 is adapted to the limiting hole 105, so that the first heat insulating member 104 is embedded in the installation space 101, and further, a fixing effect on the first heat insulating member 104 is achieved, and displacement is prevented.
In this embodiment, in order to prevent the occurrence of a safety accident by directly replacing the suction table 103 when the suction table 103 is to be replaced if the suction table 103 is to be replaced during the working process of generating heat by energizing the heating member 102 and transferring the heat to the workpiece to be machined, the heating chuck assembly 137 further includes a second heat insulating member 133, which is in a ring shape and is disposed between the heating member 102 and the suction table 103, that is, the second heating member 102 does not affect the heating of the workpiece to be machined, on the one hand, and on the other hand, the position of the suction table 103 corresponding to the second heat insulating member 133 is not heated, that is, if the suction table 103 is to be replaced, the position of the suction table 103 corresponding to the second heat insulating member 133 can be touched, so that the replacement of the suction table 103 is realized, and the occurrence of the safety accident is avoided, which is safer.
Example two
The second embodiment is an improvement on the basis of the above embodiment, and the technical content disclosed in the above embodiment is not repeated, and the content disclosed in the above embodiment also belongs to the content disclosed in the second embodiment.
Referring to fig. 2 to 7, in the case of complex operation in the prior art using manual chip bonding to the substrate 107, the present application provides a chip bonding apparatus for bonding a chip to the substrate 107 in this embodiment; the chip splicing device comprises the heating sucker assembly 137, the first driving assembly 108 and the second driving assembly 109; the second driving assembly 109 is disposed on the first driving assembly 108, and the heating chuck assembly 137 is disposed on the second driving assembly 109;
The first drive assembly 108 is capable of driving the second drive assembly 109 and the heating chuck assembly 137 to reciprocate in a first direction 110 and/or a second direction 111; the second drive assembly 109 is capable of driving the heated chuck assembly 137 to reciprocate in the first direction 110 and/or the second direction 111; the second drive assembly 109 is further capable of driving the heated chuck assembly 137 to reciprocate in a third direction 112 to enable the heated chuck assembly 137 to move toward the substrate 107 and through the substrate 107, the heated chuck assembly 137 through the substrate 107 for placement of the chip, the chip and the substrate 107 being connected with an adhesive; the heated chuck assembly 137 is used to heat the adhesive to bond the chip to the substrate 107.
Preferably, a protrusion 132 is formed on the adsorption stage 103 and extends along the third direction 112, and a through hole is formed on the base 107; the protrusions 132 are able to pass through the through holes when the second driving assembly 109 drives the heating chuck assembly 137 to move in the third direction 112.
Specifically, the first driving assembly 108 is configured to drive the chip to perform a large-stroke movement, the second driving assembly 109 is configured to adjust the chip to perform a small-stroke movement, the base 107 is set above the heating chuck assembly 137, and in an actual use process, step 100: driving the second driving assembly 109 and the heating chuck assembly 137 to reciprocate in the first direction 110 and/or the second direction 111 by the first driving assembly 108 such that the heating chuck assembly 137 is positioned below the through hole; step 200: driving the heating chuck assembly 137 through the through-hole in a third direction 112 with the second driving assembly 109; step 300: placing a chip on the adsorption stage 103, coating an adhesive on a base plate 107, and driving the heating chuck assembly 137 and the chip to move downwards along the third direction 112 again by using the second driving assembly 109 so that the chip is adhered on the base plate 107; step 400: heating the adhesive by using a heating element 102 to accelerate the curing time of the adhesive; the whole operation process is simple and convenient, and the working efficiency is improved.
In this embodiment, the first drive assembly 108 includes a first rail 113, a first slider 114, a second rail 115, a second slider 116, and a first drive motor;
The first guide rail 113 extends along the first direction 110, and the second guide rail 115 is disposed on the first slider 114 and extends along the second direction 111; the first slider 114 is sleeved on the first guide rail 113, and the second slider 116 is sleeved on the second guide rail 115; the second driving assembly 109 is disposed on the second slider 116;
the driving end of the first driving motor is connected to the first slider 114 and the second slider 116, respectively, so that the second driving assembly 109 and the heating chuck assembly 137 reciprocate in the first direction 110 and/or the second direction 111.
Specifically, in order to ensure that the second driving assembly 109 can stably move, the chip splicing device further includes an auxiliary driving assembly 129, where the auxiliary driving assembly 129 is arranged at intervals from the first driving assembly 108 along the second direction 111, that is, the first driving assembly 108 and the auxiliary driving assembly 129 are arranged in parallel; specifically, the auxiliary driving assembly 129 includes a sixth guide rail 130 and a sixth slider 131 disposed on the sixth guide rail 130; the two ends of the second guide rail 115 are respectively disposed on the first slider 114 and the sixth slider 131, so that the second guide rail 115 can move along the first direction 110 under the action of the first guide rail 113 and the sixth guide rail 130, and the sixth guide rail 130 plays a role of assisting the first guide rail 113.
In this embodiment, after the large stroke movement of the second driving assembly 109 is achieved by the first driving assembly 108, a small stroke movement is required by the second driving assembly 109, specifically, first, the heating chuck assembly 137 is required to pass through the through hole, specifically, the second driving assembly 109 includes a support frame 117, a sliding portion 118, a bearing portion, a second driving motor 136, a screw rod 135, a support portion 119 and a third driving motor, which are disposed on the second slider 116;
The inner side wall of the supporting frame 117 is provided with a third guide rail extending along the third direction 112, the sliding part 118 is arranged on the third guide rail, the sliding part 118 is fixedly connected with the moving part 121, the moving part 121 is sleeved on the screw rod 135, the driving end of the second driving motor 136 is connected with one end of the screw rod 135 through a belt, the second driving motor 136 can drive the screw rod 135 to rotate, so that the moving part 121 and the sliding part 118 reciprocate along the third direction 112, namely, at the moment, the heating sucker assembly 137 can move upwards along the third direction 112, and the heating sucker assembly 137 passes through the through hole on the base plate 107, and the chip is manually placed on the heating sucker assembly 137 passing through the through hole.
Because there may be an error between the first mark point on the chip and the second mark point on the base 107 (normally, the first mark point on the chip needs to be overlapped with the second mark point on the base 107 to meet the requirement of splicing the chip), in order to reduce the error, in this embodiment, the supporting portion is disposed at the top of the sliding portion 118, and a fourth guide rail is formed on the supporting portion and extends along the first direction 110, and is sleeved with a fourth slider; a fifth guide rail is formed on the fourth slider and extends along the second direction 111, the support portion 119 is disposed on the fifth guide rail, and the heating chuck assembly 137 is disposed on the support portion 119; the driving end of the third driving motor is respectively connected with the fourth slider and the supporting portion 119, so that the fourth slider reciprocates along the first direction 110 and the supporting portion 119 reciprocates along the second direction 111, that is, the third driving motor is used to enable the chip to move along the first direction 110 and/or the second direction 111, so that the first mark point coincides with the second mark point on the base plate 107 to a certain extent, the requirement of splicing the chip is met, the splicing is more accurate, and the working efficiency is improved.
In this embodiment, in order to further improve the splicing accuracy of the chips and thus improve the working efficiency, the chip splicing apparatus further includes an angle adjusting assembly 120, the angle adjusting assembly 120 including a rotating table provided on the supporting portion 119 and a rotating motor connected to the rotating table; the heating chuck assembly 137 is disposed on the turntable.
The edge of the supporting part 119 is provided with an annular track, the rotating table is provided with a ninth sliding block towards the side of the supporting part 119, and the ninth sliding block is matched with the annular track;
The rotating motor drives the rotating table to rotate along the circular orbit, so that the heating sucker component 137 rotates along the circular orbit, and in combination, the rotating motor can drive the chip above the base plate 107 to rotate, so that the movement direction of the chip is further increased, and the first marking point of the chip is more accurately overlapped with the second marking point of the base plate 107.
In this embodiment, to further improve the reliability and intelligence of the chip bonding apparatus so that the chip is bonded to the substrate 107 more accurately, the chip bonding apparatus further includes a base 123, a calibration assembly 122 disposed on the base 123, and a dial 124;
the first driving assembly 108 and the second driving assembly 109 are disposed on the base 123, and the calibration assembly 122 is disposed above the angle adjustment assembly 120; the dial 124 is disposed on the supporting portion through a connecting piece, and the dial 124 and the adsorption table 103 are located on the same plane, and the dial 124 is used for determining a coordinate system of the first driving assembly 108;
The calibration assembly 122 includes a microscope 125, a seventh rail 126, and a seventh slider 127;
The seventh guide rail 126 is disposed at both sides of the first guide rail 113 in the length direction and extends along the second direction 111; the seventh slider 127 is slidably disposed on the seventh guide rail 126 and can extend along the third direction 112; the upper parts of the two seventh sliders 127 are connected by an eighth guide rail 128, and the microscope 125 is slidably disposed on the eighth guide rail 128 along the first direction 110 by an eighth slider 134;
The microscope 125 is driven to move in the first direction 110 and/or the second direction 111 such that the microscope 125 is positioned directly above the scale 124 such that the coordinate system of the calibration assembly 122 coincides with the coordinate system of the second drive motor 136 (the dots of both coordinate systems coincide).
When the second drive assembly 109 drives the heated chuck assembly 137 along the third party and through the base plate 107, the chip is manually placed and the position of the chip is adjusted by the microscope 125 and with the angle adjustment assembly 120 so that a first mark point on the chip coincides with a second mark point on the base plate 107.
The actual use process is as follows: step 90 is further included before step 100, step 90: the chip splicing device is initialized, specifically, the coordinate system of the first driving component 108 is determined by using the dial 124, the coordinate system of the calibration component 122 is overlapped with the coordinate system of the second driving motor 136 by using the microscope 125 (more specifically, the dial 124 is provided with a cross-shaped mark, the microscope 125 is provided with a cross-shaped trace cursor, when the cross-shaped trace cursor on the microscope 125 is overlapped with the cross-shaped mark on the dial 124, the two coordinates are indicated to be overlapped), and the chip splicing device is initialized at this time; in addition, the second mark points are marked on the substrate 107, and the first mark points are marked on the chip (the marking of the first mark points and the second mark points is a conventional manner in the art, and will not be described here.
The step 300 further includes a calibration step, which specifically includes: when the first mark point and the second mark point are not overlapped, the microscope 125 can observe the first mark point and the second mark point, calculate the deviation of the two mark points, then drive the chip to move along the first direction 110 and/or the second direction 111 by using the third driving motor, drive the chip to rotate by using the rotating motor so as to enable the first mark point to overlap with the second mark point, and drive the heating chuck assembly 137 and the chip to move downwards along the third direction 112 again by using the second driving assembly 109 after overlapping, so that the chip is adhered on the base plate 107.
In conclusion, the chip and the accurate laminating of the base plate 107 are realized, the chip splicing device can rapidly move to the chip splicing position, and the position of the chip is accurately adjusted, so that the splicing precision, stability and reliability are improved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application. Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
Claims (3)
1. A heating chuck assembly for heating a chip; the heating sucker assembly is characterized by comprising a chassis, a heating piece and an adsorption table;
The chassis is provided with an installation space, the heating element is installed in the installation space, and the adsorption table is arranged above the heating element;
The adsorption table is used for adsorbing a to-be-machined workpiece, and the heating piece is used for transferring heat to the to-be-machined workpiece;
The first heat insulation piece is arranged between the bottom wall of the chassis and the heating piece;
A limiting hole is formed in the side wall of the chassis, a limiting block is formed by extending the edge of the first heat insulation piece outwards, and the limiting block is matched with the limiting hole so that the first heat insulation piece is embedded in the installation space;
The heating sucker assembly further comprises a second heat insulation piece, wherein the second heat insulation piece is annular and is arranged between the heating piece and the adsorption table;
The adsorption table is provided with a bulge in a third direction, and the bulge can pass through a through hole in the base plate spliced with the workpiece to be processed.
2. A chip splicing device for splicing a chip to a base plate; characterized by comprising the heating chuck assembly, the first driving assembly and the second driving assembly according to claim 1;
The second driving component is arranged on the first driving component, and the heating sucker component is arranged on the second driving component;
The first driving component can drive the second driving component and the heating sucker component to reciprocate along a first direction and/or a second direction; the second driving assembly can drive the heating sucker assembly to reciprocate along the first direction and/or the second direction;
The base plate is arranged above the heating sucker assembly, the second driving assembly can also drive the heating sucker assembly to reciprocate along a third direction, so that the heating sucker assembly can move towards the base plate and penetrate through the base plate, the heating sucker assembly penetrating through the base plate is used for placing the chip, and the chip is connected with the base plate by using an adhesive;
The first driving assembly comprises a first guide rail, a first sliding block, a second guide rail, a second sliding block and a first driving motor;
The first guide rail extends along the first direction, and the second guide rail is arranged on the first sliding block and extends along the second direction; the first sliding block is arranged on the first guide rail in a sliding manner, and the second sliding block is arranged on the second guide rail in a sliding manner; the second driving component is arranged on the second sliding block;
The driving end of the first driving motor is respectively connected with the first sliding block and the second sliding block so as to enable the second driving assembly and the heating sucker assembly to reciprocate along the first direction and/or the second direction;
the second driving assembly comprises a supporting frame, a sliding part, a bearing part, a second driving motor, a screw rod, a supporting part, a moving part and a third driving motor which are arranged on the second sliding block;
The inner side wall of the supporting frame is provided with a third guide rail extending along the third direction, the sliding part is arranged on the third guide rail in a sliding way, the sliding part is fixedly connected with the moving part, the moving part is sleeved on the lead screw, and the second driving motor can drive the lead screw to rotate so as to enable the moving part and the sliding part to reciprocate along the third direction;
The bearing part is arranged at the top of the sliding part, a fourth guide rail is formed on the bearing part in an extending mode along the first direction, and a fourth sliding block is arranged on the fourth guide rail in a sliding mode; a fifth guide rail is formed on the fourth sliding block in an extending manner along the second direction, the supporting part is arranged on the fifth guide rail in a sliding manner, and the heating sucker assembly is arranged on the supporting part;
the driving end of the third driving motor is respectively connected with the fourth sliding block and the supporting part so as to enable the fourth sliding block to reciprocate along the first direction and enable the supporting part to reciprocate along the second direction;
the angle adjusting assembly comprises a rotating table arranged on the supporting part and a rotating motor connected with the rotating table;
the heating sucker assembly is arranged on the rotating table;
The edge of the supporting part is provided with an annular track, the rotating table is provided with a ninth sliding block towards the side of the supporting part, and the ninth sliding block is matched with the annular track;
The rotating motor drives the rotating table to rotate along the annular track so as to enable the heating sucker assembly to rotate along the annular track;
The device also comprises a base, a calibration assembly and a dial, wherein the calibration assembly is arranged on the base;
The first driving assembly and the second driving assembly are arranged on the base, and the calibration assembly is arranged above the angle adjusting assembly in a erecting mode; the dial is arranged on the bearing part through a connecting piece, the dial and the adsorption table are positioned on the same plane, and the dial is used for determining a coordinate system of the first driving assembly;
The calibration assembly comprises a microscope, a seventh guide rail and a seventh sliding block;
the seventh guide rail is arranged at two sides of the length direction of the first guide rail and extends along the second direction; the seventh sliding block is arranged on the seventh guide rail in a sliding manner and can extend along the third direction; the upper parts of the two seventh sliding blocks are connected through an eighth guide rail, and the microscope is arranged on the eighth guide rail in a sliding way along the first direction through the eighth sliding blocks;
Driving the microscope to move in the first direction and/or the second direction so that the microscope is positioned right above the dial plate, and the coordinate system of the calibration assembly is overlapped with the coordinate system of the second driving motor;
When the second driving assembly drives the heating sucker assembly to move along the third direction and pass through the base plate, a chip is manually placed on the adsorption table, and the position of the chip is adjusted by the microscope and the angle adjusting assembly so that a first marking point on the chip coincides with a second marking point on the base plate.
3. The chip bonding apparatus according to claim 2, further comprising an auxiliary driving assembly arranged at intervals from the first driving assembly along the second direction;
The auxiliary driving assembly comprises a sixth guide rail and a sixth sliding block which is arranged on the sixth guide rail in a sliding manner; and two ends of the second guide rail are respectively arranged on the first sliding block and the sixth sliding block.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011381251.0A CN112614804B (en) | 2020-11-30 | 2020-11-30 | Heating sucking disc subassembly and chip splicing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011381251.0A CN112614804B (en) | 2020-11-30 | 2020-11-30 | Heating sucking disc subassembly and chip splicing apparatus |
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| CN112614804A CN112614804A (en) | 2021-04-06 |
| CN112614804B true CN112614804B (en) | 2024-06-25 |
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| CN116598247B (en) * | 2023-07-18 | 2023-09-12 | 深圳新控半导体技术有限公司 | Self-adjusting pasting platform for chip pasting and control method thereof |
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| CN205572330U (en) * | 2016-04-15 | 2016-09-14 | 深圳市固诺泰科技有限公司 | A separator bonds |
| CN211830620U (en) * | 2020-05-11 | 2020-10-30 | 成都骏创科技有限公司 | High-temperature-resistant electrostatic adsorption device for assembling electronic screen |
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| JP4136224B2 (en) * | 1999-09-30 | 2008-08-20 | 富士通株式会社 | Manufacturing method of circuit mounting support plate |
| JP4346469B2 (en) * | 2004-02-24 | 2009-10-21 | 三井金属鉱業株式会社 | Film bonding apparatus and film carrier tape for mounting electronic components |
| JP4691365B2 (en) * | 2005-02-04 | 2011-06-01 | 株式会社巴川製紙所 | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device |
| CN101419922B (en) * | 2008-11-28 | 2010-06-02 | 江苏康众数字医疗设备有限公司 | Multi-module splicing method and device for planar device integration |
| KR101534270B1 (en) * | 2015-02-23 | 2015-07-07 | 주식회사 엠피에스 | Dispensing apparatus for manufacturing camera module |
| CN107424951B (en) * | 2017-06-02 | 2023-08-18 | 广东瑞谷光网通信股份有限公司 | Chip rotary eutectic welding table |
| CN107564971B (en) * | 2017-07-27 | 2019-11-26 | 中国电子科技集团公司第十一研究所 | A kind of electric leading-out structure of alignment splicing detector component |
| CN107498500A (en) * | 2017-09-14 | 2017-12-22 | 京东方科技集团股份有限公司 | One kind disassembles tool |
| CN208058953U (en) * | 2018-04-18 | 2018-11-06 | 佛山市顺德区美的电热电器制造有限公司 | Heating component and heating utensil |
| US11769735B2 (en) * | 2019-02-12 | 2023-09-26 | Intel Corporation | Chiplet first architecture for die tiling applications |
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| CN205572330U (en) * | 2016-04-15 | 2016-09-14 | 深圳市固诺泰科技有限公司 | A separator bonds |
| CN211830620U (en) * | 2020-05-11 | 2020-10-30 | 成都骏创科技有限公司 | High-temperature-resistant electrostatic adsorption device for assembling electronic screen |
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