CN203367253U - Improved die bonder material distributing system - Google Patents
Improved die bonder material distributing system Download PDFInfo
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- CN203367253U CN203367253U CN 201320460734 CN201320460734U CN203367253U CN 203367253 U CN203367253 U CN 203367253U CN 201320460734 CN201320460734 CN 201320460734 CN 201320460734 U CN201320460734 U CN 201320460734U CN 203367253 U CN203367253 U CN 203367253U
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- rotating disk
- holder
- die bond
- suction nozzle
- arc shape
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Abstract
The utility model relates to an improved die bonder material distributing system used for improving crystal grain conveying speed so as to achieve the purpose of raising productivity. The material distributing system comprises a fixed seat which is fixed on a machine and used for distributing airflow, a rotating disk superposed below the fixed seat and a plurality of material-taking suction nozzles which are arranged on the periphery of the rotating disk in a circle, wherein the fixed seat is provided with a plurality of long-arc ports which are arranged in a circle and are connected with a vacuum negative pressure device; the rotating disk is equipped with holes corresponding to the long-arc ports; and each material-taking suction nozzle respectively communicates with one of the holes. When the rotating disk rotates to make the suction nozzles move, the holes can be aligned to or mismatch the long-arc ports such that each material-taking suction nozzle can absorb or loosen crystal grains for taking and putting and displacement operations. As the rotating disk rotates 360 degrees, each material-taking suction nozzle can absorb crystal grains continuously and then transport the crystal grains to a detection module and a bonding platform downstream for operation. Thus, waste during material distribution process is minimized.
Description
Technical field
The utility model is a kind of material-distributing system be applied on the die bond machine, after the continuous sucking crystal grains of espespecially a kind of energy, is delivered to downstream, to reduce the material-distributing system of sub-material stroke waste.
Background technology
In recent years along with science and technology is fast-developing, various electronic components, semiconductor or diode element volume dwindle day by day, for example: light-emitting diode (LED) emits beam by the crystal grain in support, and the program that crystal grain is fixed on support is referred to as " die bond ", the quality of die bond technology is one of factor affected light-emitting diode quality quality.
Aforementioned crystal grain is to cut from wafer, wafer is generally flat round sheet body, in manufacture process, wafer can first cut into many crystal grain, one by one the absorption of each crystal grain is transported in the terminal group (electrode) that on support, matrix is arranged and is fixed by the die bond machine again, the manufacture process such as finally again each crystal grain on support and terminal group are carried out to routing, encapsulate, cut apart.And now under microminiaturized demand, the wafer manufactured place is more accurate, the crystal particle volume after cutting is also more tiny, and therefore, the die bond machine that development can fast and accurately be located has become the emphasis problem of current industrial circle.
Existing die bond machine at least is provided with one and is getting the raw materials ready between platform and die bond platform in order to draw the sub-material arm of carrying crystal grain in order to the die bond platform, that carries electronic component holder in the platform downstream of getting the raw materials ready in order to the platform of getting the raw materials ready, that carries wafer on board, and the negative pressure device be communicated with the sub-material arm, wherein, this sub-material arm end is provided with the negative pressure suction nozzle of a sucking crystal grains, and described negative pressure suction nozzle is provided with a vacuum pipeline and is connected with negative pressure device.
The die bond machine is when running, this sub-material arm is first drawn single crystal grain from the platform of getting the raw materials ready by the negative pressure suction nozzle, be transferred to again in the support on downstream die bond platform and carry out die bond, after completing the die bond operation, the sub-material arm returns to the platform of getting the raw materials ready again and draws next crystal grain, the sub-material arm can repeat to move around, until each the group terminal on support all carries a crystal grain.
In addition, the sub-material arm is on by the platform of getting the raw materials ready after absorption crystal grain, not be delivered directly to die bond on support, centre also needs through some measuring stations, although above-mentioned material-distributing system is to carry out automated procedures, but the sub-material arm only can singly plow mobile crystal grain in order, that is the sub-material arm returns the process of the platform of getting the raw materials ready from the die bond platform, the die bond machine is not carried out any manufacture process, cause the waste of sub-material arm stroke, such as: the prior aries such as TaiWan, China M295788, TaiWan, China M312008, its work flow obviously lacks efficiency.
In theory, if by a plurality of sub-material arm circular array, each sub-material arm is with the rotation mode displacement, allow again get the raw materials ready platform, die bond platform be arranged on the down either side of sub-material arm rotating distance, just can make each feeding suction nozzle be delivered on support with the continuous sucking crystal grains of swing offset, die bond efficiency can be completed rapidly; But after continuous rotation, can produce the problem that vacuum pipeline reverses knotting due to the vacuum pipeline between each feeding suction nozzle and negative pressure device, therefore still have any problem on the implementation at present.
Therefore, reverse the problem of knotting for solving above-mentioned vacuum pipeline, make the sub-material arm can be with the rotation mode displacement to improve the die bond operating efficiency, inventor of the present utility model accumulates research and the practical experience of association area for many years, the spy creates a kind of material-distributing system that can promote production capacity, to improve existing material-distributing system feeding continuously, cause the problem of stroke waste.
The utility model content
The purpose of this utility model is to provide a kind of die bond machine material-distributing system of improvement, the speed of carrying in order to improve crystal grain, allow after each feeding suction nozzle energy continuous adsorption crystal grain on the detection module that is delivered to downstream and die bond platform and carry out operation, reduce the waste of sub-material stroke, reach the purpose that increases production capacity, promotes economic benefit.
For reaching above-mentioned purpose, the utility model provides a kind of die bond machine material-distributing system of improvement, after being used for the sucking crystal grains on the wafer carrying platform of die bond machine upstream extremity is transferred to the detection module detection, the electronic component holder be transplanted on again on downstream die bond platform is carried out the die bond operation, and this material-distributing system comprises:
One is fixed on the holder of board top, these holder central authorities are provided with an axis hole, holder is provided with a plurality of annular array on every side and is communicated with to distribute respectively the circular interface of air-flow with vacuum negative pressure device, each interface forms a long arc shape port in the expansion of holder bottom respectively, and each long arc shape port is that annular space is arranged.
One power transmission shaft, this power transmission shaft is located in the axis hole of holder, and this power transmission shaft axle center is perpendicular to the ground and can relatively with holder rotate.
One rotating disk, this rotating disk diameter is greater than the diameter of holder, this rotating disk is superimposed on below, holder bottom surface and is hubbed on the power transmission shaft bottom, can hard to bear power transmission shaft drive carry out 360 degree rotations, described rotating disk is provided with the perforation corresponding with the long arc shape port of quantity and position, described penetration hole diameter is less than the distance between two adjacent long arc shape ports, while making the rotating disk rotation, each a plurality of perforation respectively with the intermittent contraposition of long arc shape port and dislocation, and each perforated bottom connects a connecting pipe and extends to the rotating disk edge; And
A plurality of feeding suction nozzles, each feeding suction nozzle is connected with aforementioned communicating pipe respectively, a plurality of feeding suction nozzle circular array at the rotating disk edge along with rotating disk rotates, and can be with respect to the upper and lower displacement of rotating disk; In the perforation displacement stroke of described rotating disk during with the contraposition of long arc shape port, the negative pressure that vacuum negative pressure device produces sequentially from the interface of holder, perforation that the long arc shape port is communicated to rotating disk, communicating pipe, again to the feeding suction nozzle, make this feeding suction nozzle can draw the crystal grain simultaneous displacement on the wafer carrying platform; Rotating disk continues to rotate while misplacing with perforation to the long arc shape port, and the feeding suction nozzle loses absorption affinity allows crystal grain break away from, and while making crystal grain be moved to the support contraposition of detected downstream module and die bond platform, can carry out detection or the die bond operation of crystal grain.
Below further illustrate the execution mode of each element:
During enforcement, each communicating pipe interlude connect one can Chalk-dust filtering impurity air cleaner, when avoiding powder feeding suction nozzle with negative-pressure adsorption crystal grain, dust impurity enters in pipeline or vacuum negative pressure device and piles up from the feeding suction nozzle, affects the precision of material-distributing system running.
During enforcement, the wafer carrying platform of described die bond machine, detection module, die bond platform respectively corresponding in feeding suction nozzle swing offset stroke under; When rotating disk rotates, each feeding suction nozzle just can be drawn the crystal grain on the wafer carrying platform one by one, moves on detection module and is tested, or crystal grain is transferred on the die bond platform and carries out the die bond operation simultaneously.
During enforcement, the radius that the radius of rotating disk is greater than holder is twice at least, and making perforation is more than the twice of feeding suction nozzle displacement in the distance moved with the contraposition of long arc shape port.That is on holder between two adjacent long arc shape ports the distance can amplify several times at the rotating disk edge, allow each detection module have sufficient space be arranged in feeding suction nozzle swing offset stroke under.
Rely on above-mentioned structure, when the drive unit drives power transmission shaft on the die bond machine rotates, power transmission shaft can rotate with respect to holder by the driven rotary dish, makes the perforation of rotating disk and the contraposition of long arc shape port or the dislocation of holder, to control the keying of leading to feeding suction nozzle negative pressure.Moreover, owing to being separately positioned on each communicating pipe between each feeding suction nozzle and corresponding perforation, its two ends all are positioned on rotating disk and, along with the rotating disk rotation, therefore can solve vacuum pipeline and can produce when rotated the problem of reversing knotting.
In described perforation displacement stroke with the contraposition of long arc shape port the time, correspondence can be drawn the crystal grain on the die bond platform at the feeding suction nozzle above the wafer carrying platform, with rotation mode, be moved on the support of the detection module of downstream and die bond platform again, simultaneously, all the other feeding suction nozzles are subject to rotating disk to drive one by one swing offset to wafer carrying platform top sucking crystal grains, and when rotating disk continues to rotate to long arc shape port and perforation dislocation, the feeding suction nozzle just loses absorption affinity allows crystal grain break away to be detected or the die bond operation, reaches the purpose of continuous sub-material.
Compared to prior art, the utility model can allow each feeding suction nozzle 360 degree rotate, with the detection module that is delivered to downstream after continuous adsorption crystal grain with the die bond platform is detected or the die bond operation, reduce the waste of sub-material stroke, reach the purpose that increases production capacity, promotes economic benefit.
The accompanying drawing explanation
Fig. 1 is setting position schematic diagram of the present utility model;
Fig. 2 is material-distributing system enlarged diagram of the present utility model;
Fig. 3 is material-distributing system perspective exploded view of the present utility model;
Fig. 4 is that holder of the present utility model is looked up three-dimensional partial cutaway schematic;
Fig. 5 is material-distributing system generalized section of the present utility model;
Fig. 6 is rotating disk perforation of the present utility model and holder long arc shape port contraposition schematic diagram;
Fig. 7 be in rotating disk of the present utility model perforation displacement stroke with holder long arc shape port contraposition schematic diagram;
Fig. 8 be in rotating disk of the present utility model perforation displacement stroke with holder long arc shape port dislocation schematic diagram.
Description of reference numerals: 100-wafer carrying platform; The 200-detection module; 300-die bond platform; The 400-material-distributing system; 10-crystal grain; The 20-holder; The 21-axis hole; The 22-interface; 23-long arc shape port; The 30-power transmission shaft; The 40-rotating disk; The 41-perforation; 42-communicating pipe; The 43-air cleaner; 50-feeding suction nozzle; The 60-vacuum negative pressure device.
Embodiment
Following foundation technological means of the present utility model, list and be suitable for execution mode of the present utility model, and coordinate accompanying drawing explanation as rear:
As shown in Figures 1 to 4, the die bond machine material-distributing system 400 of the utility model improvement, after being transferred to detection module 200 detections for crystal grain 10 absorptions on the wafer carrying platform 100 by die bond machine upstream extremity, the electronic component holder be transplanted on again on downstream die bond platform 300 is carried out the die bond operation, and this material-distributing system 400 comprises holder 20, a power transmission shaft 30, a rotating disk 40 and an a plurality of feeding suction nozzle 50 that is fixed on board top.
These holder 20 central authorities are provided with an axis hole 21, holder 20 is provided with a plurality of annular array on every side and is communicated with to distribute respectively the circular interface 22 of air-flow with vacuum negative pressure device 60, each interface 22 forms a long arc shape port 23 in holder 20 bottom expansions respectively, and each long arc shape port 23 is arranged for annular space.
This power transmission shaft 30 is located in the axis hole 21 of holder 20, and its axle center is perpendicular to the ground and can rotation relative to holder 20.
As shown in Fig. 1, Fig. 3 to Fig. 5, these rotating disk 40 diameters are greater than the diameter of holder 20, are superimposed on holder 20 belows, bottom surface and are hubbed on power transmission shaft 30 bottoms, can hard to bear power transmission shaft 30 drives carry out 360 degree rotations.Described rotating disk 40 is provided with the perforation 41 corresponding with long arc shape port 23 of quantity and position, described perforation 41 diameters are less than the distance between two adjacent long arc shape ports 23, a plurality of perforation 41 and the intermittent contraposition of long arc shape port 23 and dislocation while making rotating disk 40 rotation, and each 41 bottoms connection a connecting pipe 42 of boring a hole extends to rotating disk 40 edges.
A plurality of feeding suction nozzles 50 are connected with aforementioned communicating pipe 42 respectively, circular array at rotating disk 40 edges along with rotating disk 40 rotation, and can be with respect to the upper and lower displacement of rotating disk 40; After feeding suction nozzle 50 moves down, can or decontrol crystal grain 10 absorption, after top offset, can drive crystal grain 10 along with rotating disk 40 moves.In addition, each communicating pipes 42 interlude connect one can Chalk-dust filtering impurity air cleaner 43, when avoiding powder feeding suction nozzle 50 with negative-pressure adsorption crystal grain 10, dust impurity enters pipeline or the interior accumulation of vacuum negative pressure device 60 from feeding suction nozzle 50, affects the precision of material-distributing system 400 runnings.
As shown in Figure 1 and Figure 2, during enforcement, the wafer carrying platform 100 of described die bond machine, detection module 200, die bond platform 300 respectively corresponding in feeding suction nozzle 50 swing offset strokes under; When rotating disk 40 rotates, each feeding suction nozzle 50 just can be drawn the crystal grain 10 on wafer carrying platform 100 one by one, moves on detection module 200 and is tested, or crystal grain 10 is transferred on die bond platform 300 and carries out fixed operation simultaneously.
As shown in Figure 5, Figure 6, rely on above-mentioned structure, when the drive unit drives power transmission shaft 30 on the die bond machine rotates, power transmission shaft 30 can rotate with respect to holder 20 by driven rotary dish 40, make the perforation 41 of rotating disk 40 and 23 contrapositions of long arc shape port or the dislocation of holder 20, to control the keying of leading to feeding suction nozzle 50 negative pressure.Moreover, owing to being arranged on each communicating pipe 42 between each feeding suction nozzle 50 and corresponding perforation 41, its two ends all are positioned on rotating disk and, with rotating disk 40 driven rotary, have therefore solved existing vacuum pipeline and can produce when rotated the problem of reversing knotting.
As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 7, the radius that the radius of rotating disk 40 is greater than holder 20 is twice at least, 41 distances that move in 23 contrapositions of long arc shape port that make to bore a hole are more than the twice of feeding suction nozzle 50 displacements.That is on holder 20 between two adjacent long arc shape ports 23 the distance can amplify several times at rotating disk 40 edges, allow each detection module 200 have sufficient space be arranged in feeding suction nozzle 50 swing offset strokes under.
In perforation 41 displacement stroke of this rotating disk 40 during with 23 contraposition of long arc shape port, the negative pressure that vacuum negative pressure device 60 produces can be sequentially from the interface 22 of holder 20, perforation 41 that long arc shape port 23 is communicated to rotating disk 40, communicating pipe 42, again to feeding suction nozzle 50, this feeding suction nozzle 50 can be drawn on the support that crystal grain 10 on wafer carrying platform 100 is moved to the detection module 200 of downstream and die bond platform 300.Because of the radius of rotating disk 40 radius much larger than holder 20, therefore 41 displacements of boring a hole with in long arc shape port 23 length ranges, can allow feeding suction nozzle 50 continue absorption crystal grain, and extend distance in rotary moving.
As shown in Fig. 1, Fig. 8, when rotating disk 40 perforation 41 continue rotation extremely with 23 dislocation of long arc shape port, feeding suction nozzle 50 just loses absorption affinity allows crystal grain 10 disengagings be detected or the die bond operation, simultaneously, all the other feeding suction nozzles 50 are subject to rotating disk 40 to drive swing offset one by one, to wafer carrying platform 100 top sucking crystal grains 10, to reach the purpose of continuous sub-material.
Yet, shown in above implementation and accompanying drawing, illustrate preferred embodiment of the present utility model, not with this, limit to the utility model.The person therefore such as be similar to structure of the present utility model, device, feature etc. or duplicate mutually, all should belong to of the present utility model and found in purpose and claim.
Claims (4)
1. the die bond machine material-distributing system of an improvement, after being used for the sucking crystal grains on the wafer carrying platform of die bond machine upstream extremity is transferred to the detection module detection, the electronic component holder be transplanted on again on downstream die bond platform is carried out the die bond operation, it is characterized in that, this material-distributing system comprises:
One is fixed on the holder of board top, these holder central authorities are provided with an axis hole, holder is provided with a plurality of annular array on every side and is communicated with to distribute respectively the circular interface of air-flow with vacuum negative pressure device, each interface forms a long arc shape port in the expansion of holder bottom respectively, and each long arc shape port is that annular space is arranged;
One power transmission shaft, this power transmission shaft is located in the axis hole of holder, and this power transmission shaft axle center is perpendicular to the ground and can relatively with holder rotate;
One rotating disk, this rotating disk diameter is greater than the diameter of holder, this rotating disk is superimposed on below, holder bottom surface and is hubbed on the power transmission shaft bottom, can hard to bear power transmission shaft drive carry out 360 degree rotations, described rotating disk is provided with the perforation corresponding with the long arc shape port of quantity and position, described penetration hole diameter is less than the distance between two adjacent long arc shape ports, the intermittent contraposition of a plurality of perforation and long arc shape port and dislocation while making the rotating disk rotation, and each perforated bottom connection a connecting pipe extends to the rotating disk edge; And
A plurality of feeding suction nozzles, each feeding suction nozzle is connected with aforementioned communicating pipe respectively, a plurality of feeding suction nozzle circular array at the rotating disk edge along with rotating disk rotates, and can be with respect to the upper and lower displacement of rotating disk;
In the perforation displacement stroke of described rotating disk during with the contraposition of long arc shape port, the negative pressure that vacuum negative pressure device produces sequentially from the interface of holder, perforation that the long arc shape port is communicated to rotating disk, communicating pipe, again to the feeding suction nozzle, make this feeding suction nozzle can draw the crystal grain simultaneous displacement on the wafer carrying platform; Rotating disk continues to rotate while misplacing with perforation to the long arc shape port, and the feeding suction nozzle loses absorption affinity allows crystal grain break away from detection or the die bond operation of carrying out crystal grain.
2. the die bond machine material-distributing system of improveing as claimed in claim 1, is characterized in that, each communicating pipe interlude connection one air cleaner for Chalk-dust filtering impurity.
3. the die bond machine material-distributing system of improvement as claimed in claim 1, is characterized in that, the wafer carrying platform of described die bond machine, detection module, die bond platform respectively corresponding in feeding suction nozzle swing offset stroke under.
4. the die bond machine material-distributing system of improvement as claimed in claim 1, is characterized in that, the radius that the radius of rotating disk is greater than holder is twice at least, and making the distance that perforation is moved in the contraposition of long arc shape port is more than the twice of feeding suction nozzle displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320460734 CN203367253U (en) | 2013-07-30 | 2013-07-30 | Improved die bonder material distributing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320460734 CN203367253U (en) | 2013-07-30 | 2013-07-30 | Improved die bonder material distributing system |
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| Publication Number | Publication Date |
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| CN203367253U true CN203367253U (en) | 2013-12-25 |
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| CN 201320460734 Expired - Fee Related CN203367253U (en) | 2013-07-30 | 2013-07-30 | Improved die bonder material distributing system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107792663A (en) * | 2016-08-29 | 2018-03-13 | 上野精机株式会社 | Electronic component carrying device |
| WO2018218849A1 (en) * | 2017-06-02 | 2018-12-06 | 广东瑞谷光网通信股份有限公司 | Rotational eutectic soldering station for chips |
| CN109502249A (en) * | 2018-12-07 | 2019-03-22 | 东莞市东鸿自动化科技有限公司 | A kind of connecting mechanism for rotating and move material device |
| CN110335840A (en) * | 2019-07-16 | 2019-10-15 | 安徽三优光电科技有限公司 | A kind of semiconductor production die bond structure |
| CN113363177A (en) * | 2020-03-04 | 2021-09-07 | 均华精密工业股份有限公司 | High-yield die bonding device |
| CN115249758A (en) * | 2022-09-22 | 2022-10-28 | 深圳市卓兴半导体科技有限公司 | Pixel die bonder |
-
2013
- 2013-07-30 CN CN 201320460734 patent/CN203367253U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107792663A (en) * | 2016-08-29 | 2018-03-13 | 上野精机株式会社 | Electronic component carrying device |
| CN107792663B (en) * | 2016-08-29 | 2020-04-21 | 上野精机株式会社 | Electronic component conveying device |
| WO2018218849A1 (en) * | 2017-06-02 | 2018-12-06 | 广东瑞谷光网通信股份有限公司 | Rotational eutectic soldering station for chips |
| CN109502249A (en) * | 2018-12-07 | 2019-03-22 | 东莞市东鸿自动化科技有限公司 | A kind of connecting mechanism for rotating and move material device |
| CN109502249B (en) * | 2018-12-07 | 2024-05-10 | 东莞市东鸿自动化科技有限公司 | Rotary connecting mechanism and material moving device |
| CN110335840A (en) * | 2019-07-16 | 2019-10-15 | 安徽三优光电科技有限公司 | A kind of semiconductor production die bond structure |
| CN113363177A (en) * | 2020-03-04 | 2021-09-07 | 均华精密工业股份有限公司 | High-yield die bonding device |
| CN115249758A (en) * | 2022-09-22 | 2022-10-28 | 深圳市卓兴半导体科技有限公司 | Pixel die bonder |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20170730 |